JPS63246642A - Method for inspecting circuit flaw of flexible printed wiring board - Google Patents
Method for inspecting circuit flaw of flexible printed wiring boardInfo
- Publication number
- JPS63246642A JPS63246642A JP8000987A JP8000987A JPS63246642A JP S63246642 A JPS63246642 A JP S63246642A JP 8000987 A JP8000987 A JP 8000987A JP 8000987 A JP8000987 A JP 8000987A JP S63246642 A JPS63246642 A JP S63246642A
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- wiring board
- printed wiring
- flexible wiring
- roll
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 11
- 238000007689 inspection Methods 0.000 claims abstract description 19
- 230000003287 optical effect Effects 0.000 claims abstract description 8
- 238000005530 etching Methods 0.000 claims abstract description 6
- 239000013067 intermediate product Substances 0.000 claims abstract description 4
- 230000007547 defect Effects 0.000 claims description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 6
- 239000011889 copper foil Substances 0.000 abstract description 3
- 239000000047 product Substances 0.000 abstract description 3
- 238000000605 extraction Methods 0.000 abstract description 2
- 238000001514 detection method Methods 0.000 abstract 1
- 238000004804 winding Methods 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000002950 deficient Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000011179 visual inspection Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
Landscapes
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はフレキシブル配線板における回路欠陥の検査方
法の改良に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an improvement in a method for inspecting circuit defects in flexible wiring boards.
従来、フレキシブル配線板は第３図に示すように、ベー
スフィルム１１と、通常銅箔をエツチングにより形成し
た回路１１ａから構成されている。しかしながら上記回
路１１ａは製造工程中の種々の要因例えば印刷、焼付時
の異物や取扱のキズなどにより回路欠陥を生ずるが、上
記欠陥としては第４図に示すごとく断線１２、欠け１３
、ピンホール１５、細り１４、短絡１８、残銅１６、突
起１７などが挙げられる。そしてこれらの欠陥は主とし
て拡大鏡を用いた目視検査法および電気的な導通検査法
によって検出している。なお、最近は硬質プリント配線
板には特徴抽出法や比較法を用いた光学式パターン検査
装置が利用されはじめたが、軟質のフレキシブル配線板
に利用されたケースは少なくまた検査を自動化した例は
ほとんどない。Conventionally, as shown in FIG. 3, a flexible wiring board is composed of a base film 11 and a circuit 11a, which is usually formed by etching copper foil. However, circuit defects occur in the circuit 11a due to various factors during the manufacturing process, such as foreign matter during printing and baking, and scratches during handling.
, pinhole 15, narrowing 14, short circuit 18, residual copper 16, protrusion 17, etc. These defects are mainly detected by visual inspection using a magnifying glass and electrical continuity testing. Recently, optical pattern inspection equipment using feature extraction methods and comparison methods has begun to be used for rigid printed wiring boards, but there are few cases where it has been used for soft flexible wiring boards, and there are no examples of automated inspection. rare.
しかしながら上記目視検査法の場合は疲れなどにより欠
陥を見逃し易（、又導通検査法では回路の短絡１８と断
線１２は検出できるが欠け１３、ピンホール１５、細り
１４、残銅１６、突起１７などの欠陥の検出は不可能で
ある。本発明は上記問題点に鑑みてなされたものであり
、回路欠陥を光学式パターン検査装置により自動的に検
出する方法を提供することを目的としたものである。However, in the case of the above-mentioned visual inspection method, it is easy to overlook defects due to fatigue etc. (Also, in the continuity inspection method, short circuits 18 and disconnections 12 in the circuit can be detected, but chips 13, pinholes 15, thinning 14, residual copper 16, protrusions 17, etc.) The present invention was made in view of the above problems, and aims to provide a method for automatically detecting circuit defects using an optical pattern inspection device. be.
上記目的を達成するための手段を実施例に対応する第１
図及び第２図を用いて説明すると、本発明は、エツチン
グ法により回路（３ａ）を形成した多数のフレキシブル
配線板（３）の連続体でかつ中間製品であるロール状フ
レキシブル配線板（１）を用い投光器（４）、受光検査
ヘッド（５）などで構成される光学式パターン検査装置
により上記回路（３ａ）の欠陥を自動的に検出するよう
に構成されている。The first means for achieving the above object corresponds to the embodiment.
To explain with reference to the drawings and FIG. 2, the present invention relates to a rolled flexible wiring board (1) which is a continuum of a large number of flexible wiring boards (3) on which circuits (3a) are formed by an etching method and is an intermediate product. An optical pattern inspection device comprising a light projector (4), a light receiving inspection head (5), etc. is configured to automatically detect defects in the circuit (3a).
以下に本発明の実施例を第１図、第２図により説明する
と、第１図は本発明によるロール状フレキシブル配線板
の一実施例を示す斜視図、第２図は本発明による光学式
検査装置及び検査手段の一実施例を示すシステムブロッ
ク図である。図において、１は、銅箔をエツチング法に
より形成した回路３ａとベースフィルム２からなる多数
のフレキシブル配線板３の連続体で、かつ中間製品であ
るロール状フレキシブル配線板である。７は、被検査体
であるロール状フレキシブル配線板１の自動送り出し部
、８は自動巻取り部である。４はロール状フレキシブル
配線板１の裏面から光を投光する投光器、５は、ロール
状フレキシブル配線板１の表面側において上記投光を受
光する受光検査ヘッド、１０は透過光の製品データを画
像処理する画像処理部、６は回路に欠陥がある場合にこ
れをマークするマーキング部である。又９はシステム全
体を制御する制御部である。Embodiments of the present invention will be explained below with reference to FIGS. 1 and 2. FIG. 1 is a perspective view showing an embodiment of a rolled flexible wiring board according to the present invention, and FIG. 2 is an optical inspection according to the present invention. FIG. 2 is a system block diagram showing one embodiment of an apparatus and inspection means. In the figure, reference numeral 1 denotes a roll-shaped flexible wiring board which is a continuum of a large number of flexible wiring boards 3 consisting of a circuit 3a formed by etching copper foil and a base film 2, and is an intermediate product. Reference numeral 7 indicates an automatic feeding section for the rolled flexible wiring board 1, which is the object to be inspected, and 8 indicates an automatic winding section. 4 is a light projector that emits light from the back side of the rolled flexible wiring board 1; 5 is a light receiving inspection head that receives the projected light on the front side of the rolled flexible wiring board 1; and 10 is an image of product data of transmitted light. The image processing section 6 is a marking section that marks defects in the circuit. Further, 9 is a control section that controls the entire system.
上記構成によりロール状フレキシブル配線板工は自動送
り出し部７から送り出され自動巻取り部８に巻取られる
がこの途中において投光器４と受光検査ヘッドの間を通
過する。この時に透過光による回路の画像が画像処理部
１０に送られ、特徴抽出されたネガ画像と良品のパター
ンデータとが比較される。その結果回路の不良個所が検
出された場合にはその個所がマーキング部６においてマ
ークされる。なお画素サイズは２０ノ皿以上とし、６０
μｍ以上の断線、短絡、突起、ピンホール、欠けなどの
欠陥を検出でさるようにする。With the above configuration, the rolled flexible wiring board material is sent out from the automatic delivery section 7 and wound up by the automatic winding section 8, but on the way, it passes between the light projector 4 and the light receiving inspection head. At this time, an image of the circuit created by transmitted light is sent to the image processing section 10, and the negative image from which features have been extracted is compared with pattern data of a non-defective product. If a defective part of the circuit is detected as a result, that part is marked in the marking section 6. The pixel size must be 20 plates or more, and 60 pixels or more.
Defects such as disconnections, short circuits, protrusions, pinholes, and chips larger than μm can be detected.
上記のようにエツチング法により回路を形成した多数の
フレキシブル配線板の連続体であるロール状フレキシブ
ル配線板を巻取り移動させながら光学式パターン検査装
置により回路欠陥を自動的に検出するようにしたのでフ
レキシブル配線板の回路欠陥検出の精度向上と自動化に
よる効率向上を図ることができその効果は極めて大であ
る。As mentioned above, circuit defects are automatically detected using an optical pattern inspection device while winding and moving a rolled flexible wiring board, which is a continuum of a large number of flexible wiring boards on which circuits are formed using the etching method. It is possible to improve the accuracy and efficiency of detecting circuit defects in flexible wiring boards through automation, and the effects are extremely large.
第１図は本発明によるロール状フレキシブル配線板の一
実施例を示す斜視図、第２図は本発明による光学式検査
装置及び検査手段の一実施例を示すシステムブロック図
、第３図はフレキシブル配線板の斜視図、第４図は回路
欠陥を有するフレキシブル配線板の斜視図である。
符号の説明
１・・・ロール状フレキシブル配線板
２・−・ベースフィルム ３・・・フレキシブル配線
板３ａ・・・回路 ４・・・投光器５・・・
受光検査ヘッド ６・・・マーキング部７・・・自動
送り出し部 ８・・・自動巻取り部９・・・制御部
１０・・・画像処理部１１・・・ベースフィルム
ｌｌａ・・・回路１２・・・断線 １
３・・・欠け１４・・・細り １５・・・
ピンホール１６・・・残銅 １７・・・突起
１８・・・短絡。FIG. 1 is a perspective view showing an embodiment of a rolled flexible wiring board according to the present invention, FIG. 2 is a system block diagram showing an embodiment of an optical inspection device and inspection means according to the present invention, and FIG. 3 is a perspective view showing an embodiment of a rolled flexible wiring board according to the present invention. A perspective view of a wiring board. FIG. 4 is a perspective view of a flexible wiring board having a circuit defect. Explanation of symbols 1...Rolled flexible wiring board 2...Base film 3...Flexible wiring board 3a...Circuit 4...Light emitter 5...
Light receiving inspection head 6...Marking section 7...Automatic feeding section 8...Automatic winding section 9...Control section
10... Image processing section 11... Base film lla... Circuit 12... Disconnection 1
3...Chip 14...Thin 15...
Pinhole 16... Residual copper 17... Protrusion 18... Short circuit.
Claims (1)
シブル配線板の連続体でかつ中間製品であるロール状フ
レキシブル配線板を用い投光器、受光検査ヘッドなどで
構成される光学式パターン検査装置により上記回路の欠
陥を自動的に検出することを特徴とするフレキシブル配
線板の回路欠陥検査方法。1. Defects in the circuits are detected using an optical pattern inspection device consisting of a light projector, a light receiving inspection head, etc., using a roll-shaped flexible wiring board, which is a continuum of a large number of flexible wiring boards and is an intermediate product, on which circuits are formed using an etching method. A circuit defect inspection method for a flexible wiring board, which is characterized by automatically detecting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8000987A JPS63246642A (en) | 1987-04-01 | 1987-04-01 | Method for inspecting circuit flaw of flexible printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8000987A JPS63246642A (en) | 1987-04-01 | 1987-04-01 | Method for inspecting circuit flaw of flexible printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63246642A true JPS63246642A (en) | 1988-10-13 |
Family
ID=13706328
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8000987A Pending JPS63246642A (en) | 1987-04-01 | 1987-04-01 | Method for inspecting circuit flaw of flexible printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63246642A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000007031A1 (en) * | 1998-07-28 | 2000-02-10 | Matsushita Electric Works, Ltd. | Inspection system for inspecting discrete wiring patterns formed on a continuous substrate sheet of a flexible material |
| JP2007093305A (en) * | 2005-09-27 | 2007-04-12 | Matsushita Electric Works Ltd | Metal-foiled laminate sheet inspection device |
| KR100820917B1 (en) * | 2005-12-28 | 2008-04-10 | 스템코 주식회사 | Apparatus and Method for inspecting shape of Flexible Printed Circuit Board |
| CN102095737A (en) * | 2010-12-23 | 2011-06-15 | 东莞市升力智能科技有限公司 | Single-workbench automatic detector of surface defect of flexible printed circuit board |
-
1987
- 1987-04-01 JP JP8000987A patent/JPS63246642A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000007031A1 (en) * | 1998-07-28 | 2000-02-10 | Matsushita Electric Works, Ltd. | Inspection system for inspecting discrete wiring patterns formed on a continuous substrate sheet of a flexible material |
| US6700603B1 (en) | 1998-07-28 | 2004-03-02 | Matsushita Electric Works, Ltd. | Inspection system for inspecting discrete wiring patterns formed on a continuous substrate sheet of a flexible material |
| JP2007093305A (en) * | 2005-09-27 | 2007-04-12 | Matsushita Electric Works Ltd | Metal-foiled laminate sheet inspection device |
| KR100820917B1 (en) * | 2005-12-28 | 2008-04-10 | 스템코 주식회사 | Apparatus and Method for inspecting shape of Flexible Printed Circuit Board |
| CN102095737A (en) * | 2010-12-23 | 2011-06-15 | 东莞市升力智能科技有限公司 | Single-workbench automatic detector of surface defect of flexible printed circuit board |
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