CN211792262U - Drilling device for circuit board - Google Patents
Drilling device for circuit board Download PDFInfo
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- CN211792262U CN211792262U CN201922043616.8U CN201922043616U CN211792262U CN 211792262 U CN211792262 U CN 211792262U CN 201922043616 U CN201922043616 U CN 201922043616U CN 211792262 U CN211792262 U CN 211792262U
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- circuit board
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- preset
- base station
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Abstract
The application discloses drilling equipment of circuit board. This drilling equipment includes: the device comprises a base station, a calibration film and a drilling assembly, wherein the base station is used for bearing and fixing a circuit board to be processed; the thicknesses of all parts of the calibration film are equal, and the calibration film is used for being attached to the surface of one side, back to the base station, of the circuit board to be processed; the drilling assembly is arranged opposite to the base station and comprises a main drill bit and two sensing devices arranged on two opposite sides of the main drill bit; the two sensing devices are used for detecting the distance from one surface of the calibration film, which is far away from the base station, to the base station so as to determine the actual thickness of the preset drilling position of the circuit board to be processed according to the distance and determine the drilling depth of the preset drilling position of the circuit board according to the actual thickness. Through the scheme, the drilling of the circuit board can be ensured to reach the specified depth accurately.
Description
Technical Field
The application relates to the technical field of printed circuit boards, in particular to a drilling device for a circuit board.
Background
The existing printed circuit board is usually formed after the lamination of a plurality of layers of sub circuit boards, so the thickness of the board in different areas of the formed printed circuit board is possibly different due to the size tolerance superposition of each sub circuit board, and the problem that the formed hole cannot be accurately communicated to the preset position in the printed circuit board usually can be generated when the printed circuit board is punched.
SUMMERY OF THE UTILITY MODEL
The application provides a drilling equipment of circuit board to when solving among the prior art to printed circuit board operation of punching, can produce the unable accurate problem of communicateing the preset position in the printed circuit board in hole that forms usually.
In order to solve the technical problem, the application adopts a technical scheme that: provided is a drilling device of a circuit board, wherein the drilling device comprises:
the base station is used for bearing and fixing the circuit board to be processed;
the thickness of each part of the calibration film is equal, and the calibration film is used for being attached to the surface of one side, back to the base station, of the circuit board to be processed;
the drilling assembly is arranged opposite to the base station and comprises a main drill bit and two induction devices arranged on two opposite sides of the main drill bit;
the two sensing devices are used for detecting the distance between one surface, far away from the base station, of the calibration film and the base station, so that the actual thickness of the preset drilling position of the circuit board to be processed is determined according to the distance, and the drilling depth of the preset drilling position of the circuit board is determined according to the actual thickness.
In one embodiment of the method of the present invention,
the two induction devices are used for detecting the surface of one side of the circuit board to be processed and sending detected image information to the controller; the controller is used for determining the actual thickness and the actual drilling depth of the circuit board to be processed at a preset drilling position according to the image information; and the controller is further used for controlling the main drill to drill the circuit board to be processed at the preset drilling position so that the obtained drilling depth is equal to the actual drilling depth of the preset drilling position.
In one embodiment of the method of the present invention,
and the actual drilling depth T of the preset drilling position is (T/H) H, wherein H represents the actual thickness of the circuit board to be processed at the preset drilling position, H represents the theoretical thickness of the circuit board to be processed at the preset drilling position, and T represents the theoretical drilling depth of the circuit board to be processed at the preset drilling position.
In one embodiment of the method of the present invention,
a plurality of grid lines which are uniformly distributed are arranged on the surface of at least one side of the calibration film; when the calibration film is attached to the surface of one side of the circuit board to be processed, the grid lines are arranged on the surface of one side, back to the circuit board to be processed, of the calibration film.
In one embodiment of the method of the present invention,
the two sensing devices are used for detecting the image information of the grid lines at the preset drilling position, and the controller determines the space coordinates of the circuit board to be processed at the preset drilling position according to the radian change of the grid lines.
In one embodiment of the method of the present invention,
the base station is used for bearing the plane of the circuit board to be processed and is arranged in parallel with the horizontal plane;
the controller determines the space coordinate of the preset drilling position according to the image information, and the actual thickness of the circuit board to be processed at the preset drilling position is obtained by calculating the difference value between the vertical coordinate of the space coordinate of the preset drilling position and the vertical coordinate of the base station.
In one embodiment of the method of the present invention,
the surface of at least one side of the calibration film has adsorbability, so that the calibration film is clung to the surface of the circuit board to be processed, which is opposite to the base station.
In one embodiment of the method of the present invention,
the distance between the two induction devices and the base station is equal;
and the distance between the two induction devices and the axis of the main drill bit is equal.
In one embodiment, the drilling apparatus further comprises a drive assembly comprising a first drive assembly and a second drive assembly;
the first driving assembly is used for driving the drilling assembly to move in a direction close to or far away from the base station;
the second driving assembly is used for driving the drilling assembly to move along a preset track on a bearing surface parallel to the base station
The beneficial effect of this application is: be different from prior art's condition, this application respectively sets up at least one induction system through the relative both sides at main drill bit, detects the actual thickness of the preset position of waiting to process the circuit board that this main drill bit is just right through two at least induction systems to can obtain the actual drilling depth at this preset position drilling according to this actual thickness, and then can use this actual drilling depth to drill to this preset position as drilling depth through main drill bit, thereby can make the drilling to the circuit board can reach appointed degree of depth accurately.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained without inventive work, wherein:
fig. 1 is a schematic structural diagram of an embodiment of a drilling device for a circuit board provided in the present application.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
Referring to fig. 1, fig. 1 is a schematic structural diagram of an embodiment of a drilling apparatus for a circuit board according to the present application.
The drilling apparatus 10 includes a base 100, a calibration film 200, and a drilling assembly 300.
Wherein, one side of the base 100 is provided with a carrying surface for carrying the circuit board to be processed. Here, a positioning mechanism may be disposed on the base 100 to fix the position of the circuit board to be processed. And further, subsequent drilling operation can be conveniently carried out.
The calibration film 200 is used for being attached to a surface of the circuit board to be processed on a side away from the base station 100, wherein the calibration film 200 is used for calibrating a distance between a surface of the circuit board to be processed on a side opposite to the base station 100 and a bearing surface of the base station 100.
Specifically, the calibration film 200 may be made of a light-transmitting material, and the calibration film 200 is a light-transmitting film having the same thickness. By attaching the calibration film 200 to the surface of the circuit board to be processed on the side away from the base 100, the surface of the calibration film 200 on the side opposite to the circuit board to be processed can be made to exhibit the same planar distribution as the surface of the circuit board to be processed on the side away from the base 100.
Wherein, one side that the calibration membrane 200 was treated the processing circuit board back of can set up the many gridlines of evenly arranging, after on pasting the calibration membrane 200 and establishing the processing circuit board of treating, can pass through the change of gridline radian to obtain and treat the height distribution that each region of surface of processing circuit board keep away from base station 100 one side. Therefore, the distance from any position of the surface of the circuit board to be processed on the side away from the base 100 to the carrying surface of the base 100, that is, the actual thickness of the circuit board to be processed at the position can be obtained. The grid lines may include a plurality of first grid lines which are sequentially arranged at equal intervals; and a plurality of second grid lines which are arranged at equal intervals in sequence, wherein the first grid lines and the second grid lines are arranged vertically. That is, the first grid lines and the second grid lines may intersect to form the grid lines, wherein, alternatively, the minimum unit formed by the intersection of the first grid lines and the second grid lines may be a square.
In this embodiment, the drilling assembly 300 may be disposed opposite to the base 100, for example, the drilling assembly 300 may be disposed above the carrying surface of the base 100; when the circuit board to be processed is fixedly disposed on the base 100, the drilling assembly 300 may be located on a side of the circuit board to be processed opposite to the base 100.
In this embodiment, the drilling assembly 300 may include a primary drill bit 310 and two sensing devices 320 disposed on opposite sides of the primary drill bit 310.
Wherein, the axis of the main drill 310 may be perpendicular to the bearing surface of the base platform 100, and the distances between the two sensors 320 and the bearing surface of the base platform 100 are equal; while the spacing between the axes of the two sensing devices 320 and the primary drill bit 310 is also equal.
Therefore, the position of the surface of the side of the preset position of the circuit board to be processed corresponding to the main drill 310, which is opposite to the base 100, can be detected by the two sensing devices 320, and the actual thickness of the circuit board to be processed at the preset position can be obtained. And then according to the obtained thickness and the combination of the theoretical thickness and the theoretical drilling depth of the circuit board to be processed at the preset position, the actual drilling depth of the circuit board to be processed at the preset position can be obtained.
Specifically, in the theoretical design, the thicknesses of all parts of the circuit board to be processed are equal, and at the moment, the theoretical thickness of any position of the circuit board to be processed is equal to the designed thickness of the circuit board to be processed, wherein the theoretical thickness of the circuit board to be processed can be recorded as h, and meanwhile, the theoretical drilling depth of the circuit board to be processed at the preset position can be recorded as t; if the actual thickness of the to-be-processed circuit board at the preset position is detected to be H by the drilling device 10, the actual drilling depth T of the to-be-processed circuit board at the preset position may be equal to (T/H) × H.
Therefore, in this embodiment, the position of the surface of the side of the preset position on the circuit board to be processed, which faces away from the base station 100, can be detected through the two sensing devices 320, so that the actual thickness of the circuit board to be processed at the preset position can be determined, and further, the main drill 310 can drill the preset position with the obtained actual drilling depth, and therefore, it can be ensured that the preset position in the circuit board can be reached by drilling at the preset position.
It should be understood that, in the present embodiment, the two sensing devices 320 determine a distance between a surface of the calibration film 200 opposite to the circuit board to be processed and the bearing surface of the base platform after the calibration film 200 is attached to the circuit board to be processed, that is, a sum of a thickness of the calibration film 200 and a thickness of the circuit board to be processed. Therefore, when the actual thickness of the circuit board to be processed is calculated as H, the thickness of the calibration film 200 is subtracted from the distance between the surface of the calibration film 200 opposite to the circuit board to be processed and the carrying surface of the base platform, which is detected by the sensing device 320.
In this embodiment, specifically, the plane of the base 100 for carrying the circuit board to be processed is arranged parallel to the horizontal plane, so that it can be determined that the carrying surface of the base 100 is located on a plane with the ordinate Z ═ n (where n is a rational number), where the coordinate of any point on the plane can be represented as (x, y, n);
the sensing device 320 may first coordinate the carrying surface of the base 100 to determine the value of n. Then, the surface of the calibration film 200 opposite to the circuit board to be processed is inspected by the sensing device 320, so that any one point of the spatial coordinate value on the surface of the calibration film 200 opposite to the circuit board to be processed can be determined, and (X, Y, Z) can be calculated. Further, by the difference between the ordinate of the spatial coordinate value and the ordinate Z ═ n of the bearing surface of the submount 100 of the calibration film 200, the distance between the surface of the calibration film 200 opposite to the submount 100 and the bearing surface of the submount 100 can be obtained, and the distance can be calculated as Z-n; the actual thickness of any point of the processed circuit board can then be obtained by subtracting the thickness of the calibration film 200 from Z-n.
Further, in this embodiment, the drilling apparatus further includes a driving assembly (not shown in the drawings), wherein the driving assembly may include a first driving assembly and a second driving assembly.
Wherein, the first driving assembly is used for driving the drilling assembly 300 to move towards or away from the base station 100; after the actual thickness detection of the preset position of the circuit board to be processed is completed, the first driving assembly may further drive the main drill 310 to drill the preset position of the circuit board to be processed, and form a hole with an actual hole depth equal to the actual drilling depth described above.
The second driving assembly can drive the drilling assembly 300 to move along a bearing surface parallel to the base 100. Thereby allowing the primary drill bit 310 in the drilling assembly 300 to be positioned anywhere on the circuit board to be processed.
In this embodiment, the surface of one side of the calibration film 200 may have adsorbability, so that the calibration film 200 can be tightly attached to the surface of the circuit board to be processed, the surface of the circuit board being opposite to the base 100; meanwhile, when the actual thickness of the circuit board to be processed is checked and before the preset position of the circuit board to be processed is drilled, the calibration film 200 needs to be torn off from the circuit board to be processed. Thus, it is ensured that the same calibration film 200 can be reused many times.
To sum up, this application provides a drilling equipment of circuit board, respectively sets up at least one induction system through the relative both sides at main drill bit, detects the actual thickness of the preset position of this main drill bit dead against treating processing circuit board through two at least induction systems to can obtain the actual drilling depth at this preset position drilling according to this actual thickness, and then can use this actual drilling depth to drill to this preset position for drilling depth through main drill bit, thereby can make the drilling to the circuit board can reach the specified degree of depth accurately.
The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.
Claims (9)
1. A drilling apparatus for a circuit board, the drilling apparatus comprising:
the base station is used for bearing and fixing the circuit board to be processed;
the thickness of each part of the calibration film is equal, and the calibration film is used for being attached to the surface of one side, back to the base station, of the circuit board to be processed;
the drilling assembly is arranged towards the base station and comprises a main drill bit and two induction devices arranged on two opposite sides of the main drill bit;
the two sensing devices are used for detecting the distance between one surface, far away from the base station, of the calibration film and the base station, so that the actual thickness of the preset drilling position of the circuit board to be processed is determined according to the distance, and the drilling depth of the preset drilling position of the circuit board is determined according to the actual thickness.
2. The drilling device for circuit board according to claim 1,
the two induction devices are used for detecting the surface of one side of the circuit board to be processed and sending detected image information to the controller; the controller is used for determining the actual thickness and the actual drilling depth of the circuit board to be processed at a preset drilling position according to the image information; and the controller is further used for controlling the main drill to drill the circuit board to be processed at the preset drilling position so that the obtained drilling depth is equal to the actual drilling depth of the preset drilling position.
3. Drilling device according to claim 2,
and the actual drilling depth T of the preset drilling position is (T/H) H, wherein H represents the actual thickness of the circuit board to be processed at the preset drilling position, H represents the theoretical thickness of the circuit board to be processed at the preset drilling position, and T represents the theoretical drilling depth of the circuit board to be processed at the preset drilling position.
4. Drilling device for circuit boards according to claim 2,
a plurality of grid lines which are uniformly distributed are arranged on the surface of at least one side of the calibration film; when the calibration film is attached to the surface of one side of the circuit board to be processed, the grid lines are arranged on the surface of one side, back to the circuit board to be processed, of the calibration film.
5. The drilling device according to claim 4,
the two sensing devices are used for detecting the image information of the grid lines at the preset drilling position, and the controller determines the space coordinates of the circuit board to be processed at the preset drilling position according to the radian change of the grid lines.
6. The drilling device of claim 5,
the base station is used for bearing the plane of the circuit board to be processed and is arranged in parallel with the horizontal plane;
the controller determines the space coordinate of the preset drilling position according to the image information, and the actual thickness of the circuit board to be processed at the preset drilling position is obtained by calculating the difference value between the vertical coordinate of the space coordinate of the preset drilling position and the vertical coordinate of the base station.
7. The drilling device according to claim 1,
the surface of at least one side of the calibration film has adsorbability, so that the calibration film is clung to the surface of the circuit board to be processed, which is opposite to the base station.
8. The drilling device according to claim 1,
the distance between the two induction devices and the base station is equal;
and the distance between the two induction devices and the axis of the main drill bit is equal.
9. The drilling apparatus of claim 1, further comprising a drive assembly, the drive assembly comprising a first drive assembly and a second drive assembly;
the first driving assembly is used for driving the drilling assembly to move in a direction close to or far away from the base station;
the second driving assembly is used for driving the drilling assembly to move along a preset track on a bearing surface parallel to the base platform.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922043616.8U CN211792262U (en) | 2019-11-22 | 2019-11-22 | Drilling device for circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922043616.8U CN211792262U (en) | 2019-11-22 | 2019-11-22 | Drilling device for circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN211792262U true CN211792262U (en) | 2020-10-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922043616.8U Active CN211792262U (en) | 2019-11-22 | 2019-11-22 | Drilling device for circuit board |
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| CN (1) | CN211792262U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112536923A (en) * | 2020-11-11 | 2021-03-23 | 东莞市盛雄激光先进装备股份有限公司 | Precision punching equipment and method |
| CN112804825A (en) * | 2021-04-09 | 2021-05-14 | 苏州维嘉科技股份有限公司 | Depth-controlled borehole compensation method and drilling apparatus |
-
2019
- 2019-11-22 CN CN201922043616.8U patent/CN211792262U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112536923A (en) * | 2020-11-11 | 2021-03-23 | 东莞市盛雄激光先进装备股份有限公司 | Precision punching equipment and method |
| CN112804825A (en) * | 2021-04-09 | 2021-05-14 | 苏州维嘉科技股份有限公司 | Depth-controlled borehole compensation method and drilling apparatus |
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