JP2012098140A - Method for measuring processing position - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for measuring a processing position capable of highly precisely measuring a deviation between an m-th processing position and an n-th processing position.SOLUTION: The method for measuring a processing position includes: performing an m-th process and forming an m-th mark 26 and a reference mark 29 indicating a basic dimension (S2); performing an n-th process and forming an n-th mark 27 (S7); and measuring a relative position between the m-th mark 26 and the n-th mark 27, correcting the relative position between the m-th mark 26 and the n-th mark 27 based on a ratio of a measured basic dimension L1 and the basic dimension L0, and measuring the deviation in the processing positions between the m-th processing position and the n-th processing position (S9).

Description

  The present invention relates to a method for measuring a processing position, and in particular, in a rotary punching process for a multilayer film, the mth (m is a natural number) punching position and the nth (n is a natural number and n> m). The present invention relates to a machining position measuring method capable of accurately measuring a deviation from a punching position.

  A plurality of steps are performed in punching processing of an adhesive film or a prism sheet, laminating a polarizing plate, multiple printing, patterning of a silicon wafer, and the like, and the processing position of each step is accurately positioned. Usually, in the above punching process or the like, for example, a deviation between the m-th machining position and the n-th machining position is measured, and it is inspected that the machining position deviation is within a predetermined standard range. Yes.

As a method for measuring the displacement of the machining position, a method is known in which marks are printed at specified positions for each machining process, these marks are detected by a CCD (Charge Coupled Device) camera or sensor, and the deviation amount is measured. ing.
For example, in the punching technique, fine embossing and pattern patterns formed on flexible optical disks, TAB (Tape Automated Bonding) films, lead frames and the like are punched continuously. At the time of these punching, as a position confirmation mark, mark a circle indicating the permissible punching accuracy range at the end of the product, mark the circle of the punching position mark at the time of punching, and the circle of the position mark will indicate the permissible punching accuracy range There is known a technique for performing pass / fail judgment by being within the circle shown.

(Measuring position measurement method according to the conventional example)
Next, a processing position measuring method according to a conventional example, and a rotary punching method for a multilayer film to which the processing position measuring method is applied will be described with reference to the drawings.
In order to facilitate understanding, the multilayer film, the rotary punching method, and the processing position measurement method will be described in this order.

(Multilayer film)
FIG. 6 is a schematic view for explaining a multilayer film related to the present invention, in which (a) shows a plan view and (b) shows an AA cross-sectional view.
In FIG. 6, the multilayer film 10 related to the present invention has a light release separator 11, a transparent adhesive sheet 12, and a heavy release separator 13, and the transparent adhesive sheet 12 is used for a touch panel or the like. This multilayer film 10 is in a state completed as a product.
The multilayer film supplied to the rotary punching process is in a roll state. In a roll-shaped multilayer film, usually, in the coating process, first, a transparent adhesive resin is applied to the unrolled heavy release separator, then a light release separator is laminated, and then the transparent adhesive resin is applied. It is manufactured by being cured and wound up.
The multilayer film 10 is shipped through the coating process, the slit (multiple stripping) process, the rotary punching process, the sheet cutting process, and the like.

In the multilayer film 10 described above, the light release separator 11 and the heavy release separator 13 have a hamburger structure larger than that of the transparent adhesive sheet 12 and have a three-layer structure, but are not limited thereto. For example, although not shown, the light release separator 11 may be larger than the transparent adhesive sheet 12 and the heavy release separator 13 may have a top hat structure having the same size as the transparent adhesive sheet 12. Moreover, the four-layer structure which laminated | stacked the protective film (not shown) on the lower surface of the heavy peeling separator 13 may be sufficient.
Furthermore, although the multilayer film 10 is configured to include the transparent adhesive sheet 12, the multilayer film 10 is not limited to the transparent adhesive sheet 12, and may be configured to include various sheets.
Moreover, although the multilayer film 10 is made into the substantially rectangular shape, it is not limited to this.

(Rotary punching method)
First, a punching apparatus 201 that performs a rotary punching method will be described.
FIG. 7: has shown the schematic front view for demonstrating the punching apparatus which performs the measuring method of the processing position concerning a prior art example.
In FIG. 7, a punching device 201 includes an ambi roll 21, a resin punch die 222, a product outer punch roller 23, feed rollers 24 and 25, a processing position measuring device 101, a cutting means 7, and the like. . In addition, a pinnacle mold (not shown) or the like is attached to the resin punch roll 222 and the product outer shape roll 23.

FIG. 8 is a schematic flowchart for explaining a punching method according to a conventional example.
Moreover, FIG. 9 has shown the schematic for demonstrating the multilayer film in each process of the punching method concerning a prior art example. In addition, FIG. 9 shows a schematic plan view of a roll-shaped multilayer film 15 of each step described later on the right side, and shows a schematic cross-sectional view of the multilayer film 15 corresponding to the diagram on the right side on the left side.
As shown in FIGS. 7, 8, and 9, first, the roll-shaped multilayer film 15 is wound around the carrier film 14 on the ambi roll 21 at the point P ₁ and attached to the upper surface of the carrier film 14 (FIG. 9 (a) and FIG. 9 (b)). That is, the carrier film 14 is laminated on the lower surface of the multilayer film 15 (step S21).

Next, the multilayer film 15, at point _{P 2,} is punched by the pinnacle-type resin for punching roll 222 (FIG. 9 (c), the reference FIG. 9 (d)). That is, in the multilayer film 15, the pinnacle blade 221 pierces the light release separator 11 and the transparent adhesive sheet 12, and the light release separator 11 and the transparent adhesive sheet 12 are punched into a substantially rectangular shape.
In addition, the multilayer film 15 is formed with the m-th (m is a natural number) mark 26 corresponding to the punching position along with the above-described processing. The m-th mark 26 is formed when a part of the blade 221 is pierced to the top of the light release separator 11, the transparent adhesive sheet 12 and the heavy release separator 13 (that is, by being punched) (step). S22).
The m-th mark 26 has a T-shape, but the shape of the m-th mark 26 is not particularly limited.

Subsequently, the multilayer film 15, at point _{P 3,} the light release separator 11 outside the product is wound (see FIG. 9 (e), the FIG. 9 (f)). That is, the light release separator 11 outside the product (a substantially rectangular outer portion punched out by the blade 221) is removed from the multilayer film 15 (step S23).

Next, the multilayer film 15, at point _{P 4,} a transparent adhesive sheet 12 out of the product is taken up by the resin remover film 16 (see FIG. 9 (g), the FIG. 9 (h)). That is, the transparent adhesive sheet 12 outside the product (a substantially rectangular outer portion punched by the blade 221) is removed from the multilayer film 15 (step S24).

Subsequently, the multilayer film 15, at point P _5, (see FIG. 9 (i), FIG. 9 (j)) to light release separator 11 on the product is taken up by the light release separator removing tape 17 having an adhesive property . That is, the light release separator 11 on the product (on the substantially rectangular portion punched out by the blade 221) is removed from the multilayer film 15 (step S25).

Next, the multilayer film 15, at point _{P 6,} reference light release separator 11 for changing stick is attached to the upper surface of the transparent adhesive sheet 12 (Fig. 9 (k), FIG. 9 (l))). That is, the multi-layer film 15 is laminated with the light release separator 11 for replacement on the upper surface (step S26).

Next, the multilayer film 15, at point _{P 7,} is punched by the pinnacle type PACKAGE for cutting die roll 23 (FIG. 9 (m), see Fig. 9 (n)). That is, the multilayer film 15 has a pinnacle blade 231 pierced into the light-release separator 11 and heavy release separator 13 for replacement, and the light-release separator 11 and heavy release separator 13 for replacement are larger than the transparent adhesive sheet 12. Punched into a nearly rectangular shape.
In addition to the above processing, the multilayer film 15 is formed with an n-th mark 27 (n is a natural number and n> m) and a cutting positioning mark 28 corresponding to the punching position. The n-th mark 27 is formed when a part of the blade 231 is pierced to the top of the light release separator 11, the heavy release separator 13 and the carrier film 14 (that is, by punching) (step S27). ).
The n-th mark 27 is L-shaped, but the shape of the n-th mark 27 is not particularly limited.

Subsequently, the multilayer film 15, at point _{P 8,} the light release separator 11 outside the product is wound (see FIG. 10). That is, the light release separator 11 outside the product (the substantially rectangular outer portion punched out by the blade 231) is removed from the multilayer film 15 (step S28).

Next, the multilayer film 15 and the carrier film 14 leave the ambi roll 21 and are continuously fed out by the feed roller 24.
The multilayer film 15 and the carrier film 14 sent out by the feed roller 24 are in a slack state, the processing position is measured by the processing position measuring device 101, and subsequently sent out intermittently by the feed roller 25, and the cutting means 7. Disconnected by.

(Measuring method of machining position)
First, as shown in FIG. 7, a machining position measuring apparatus 101 that performs a machining position measurement method includes a CCD camera 3, illumination 4, an information processing means 105, a monitor 6, and the like as imaging means. The information processing means 105 is a computer or the like and has an image processing function and the like.
The machining position measuring apparatus 101 detects the m-th mark 26 and the n-th mark 27, measures the relative position between the detected m-th mark 26 and the n-th mark 27, and measures the measured relative Based on the target position, the deviation of the machining position between the mth punching position and the nth punching position is measured.

10A and 10B are schematic views for explaining a machining position measuring method according to a conventional example. FIG. 10A is a plan view, and FIG. 10B is an enlarged view of a main part.
In FIG. 10, the multilayer film 15 fed from the feed roller 24 has the m-th mark 26 and the n-th mark 27 formed on the heavy release separator 13.
In the multilayer film 15, the mth mark 26 and the nth mark 27 are imaged from above by the CCD camera 3 in a state where light is irradiated from below the carrier film 14 by the illumination 4. Image data obtained by imaging is output from the CCD camera 3 to the information processing means 105, and the information processing means 105 measures X1, X2, Y1, and Y2 as shown in FIG.

  Here, the pinnacle die attached to the resin punch die roll 222 and the pinnacle die attached to the product outer die die roll 23 are assumed to have X1 = X2 = The blade 221 and the blade 231 are formed so that X0 and Y1 = Y2 = Y0. That is, the information processing unit 105 calculates X1-X0, X2-X0, Y1-Y0, and Y2-Y0, thereby shifting the machining position between the mth punching position and the nth punching position. Is measured (step S29). Then, the machining position measuring device 101 issues a predetermined alarm or the like and stops the punching device 201 when the measured displacement of the machining position does not fall within the punching accuracy allowable range input in advance.

In addition to the above-described techniques, various techniques related to the present invention have been proposed.
For example, the continuous punching device of Patent Document 1 detects the shortest distance between the circle within the permissible punching accuracy range and the circle of the punching position mark and the longest distance with a CCD camera, so that the displacement amount of the punching position is detected. Measuring.

JP-A-4-183598

However, as in the prior art described above and the technique described in Patent Document 1, the processing position measurement method using a CCD camera has a subtle hue of a mark or material, the distance between the mark and the CCD camera, and the mark capture timing. There is a problem that measurement accuracy is lowered when measuring a machining position with a CCD camera due to the influence of deviation or the like.
In particular, the punching process of the multilayer film 15 described above is greatly affected by the tension of the base material (the multilayer film 15 and the carrier film 14) and the fluttering of the base material during transportation in the imaging region of the CCD camera 3, and therefore the CCD The measurement accuracy when measuring the machining position with the camera 3 was low.

FIG. 11 shows Table 2 showing a comparison result between measured values and measured values in the conventional machining position measuring method.
FIG. 11 shows a comparison result (number of samples = 100) between a measurement value (measurement value by a CCD camera) obtained by a conventional processing position measurement method and an actual measurement value obtained by an optical microscope.
According to this comparison result (Table 2), the maximum error between the measured value and the actually measured value was 84 μm, and this measured value was + 37.5% with respect to the actually measured value.
Further, according to the above comparison result, the average error between the measured value and the actually measured value was 37 μm, and the measured value was + 18.5% with respect to the actually measured value.
That is, in the punching process of the multilayer film 15 described above, the conventional method of measuring the processing position cannot accurately measure the shift of the processing position between the mth punching position and the nth punching position. There was a problem.

  Further, the above-described conventional machining position measurement method has a problem that, for example, it is not possible to perform high-precision measurement that requires an accuracy of about 10 μm.

  The present invention has been proposed in order to solve the above-described problems. In machining a workpiece, the m-th (m is a natural number) machining position, the n-th (n is a natural number, and n The object of the present invention is to provide a machining position measuring method capable of accurately measuring a deviation from the machining position of> m).

  In order to achieve the above object, the machining position measuring method of the present invention performs m-th machining (m is a natural number) on the workpiece, and the m-th mark corresponding to the m-th machining position, and a reference A m-th processing step for forming a reference mark indicating a dimension, and an nth (n is a natural number, and n> m) processing is performed on the workpiece, and an nth processing step corresponding to the nth processing position is performed. Detecting the nth processing step for forming a mark, the mth mark, and the nth mark, measuring the relative position of the mth mark and the nth mark, and Measuring the reference dimension of the reference mark, correcting a relative position between the m-th mark and the n-th mark based on a ratio between the measured reference dimension and the reference dimension; A measuring worker for measuring a shift of a machining position between a machining position and the n-th machining position It is a method having a process.

  According to the processing position measuring method of the present invention, there is an adverse effect when detecting the m-th mark and the n-th mark, that is, an adverse effect such that each mark cannot be detected accurately due to vibration or deformation of the workpiece. It can be effectively eliminated and the displacement of the machining position can be measured with high accuracy.

FIG. 1: has shown the schematic flowchart figure for demonstrating the measuring method of the processing position concerning embodiment of this invention. FIG. 2: has shown the schematic front view for demonstrating the punching apparatus which performs the measuring method of the processing position concerning embodiment of this invention. FIG. 3: has shown the schematic for demonstrating the multilayer film in each process of the measuring method of the processing position concerning embodiment of this invention. 4A and 4B are schematic diagrams for explaining a machining position measuring method according to an embodiment of the present invention, in which FIG. 4A is a plan view and FIG. 4B is an enlarged view of a main part. . FIG. 5 shows Table 1 showing a comparison result between measured values and measured values in the machining position measuring method according to the embodiment of the present invention. FIG. 6 is a schematic view for explaining a multilayer film related to the present invention, in which (a) shows a plan view and (b) shows an AA cross-sectional view. FIG. 7: has shown the schematic front view for demonstrating the punching apparatus which performs the measuring method of the processing position concerning a prior art example. FIG. 8 is a schematic flowchart for explaining a punching method according to a conventional example. FIG. 9 is a schematic view for explaining a multilayer film in each step of the punching method according to the conventional example. 10A and 10B are schematic views for explaining a machining position measuring method according to a conventional example. FIG. 10A is a plan view, and FIG. 10B is an enlarged view of a main part. FIG. 11 shows Table 2 showing a comparison result between measured values and measured values in the conventional machining position measuring method.

[Embodiment of machining position measurement method]
FIG. 1: has shown the schematic flowchart figure for demonstrating the measuring method of the processing position concerning embodiment of this invention.
In FIG. 1, the machining position measurement method of the present embodiment has step S2 instead of step S22 and step S9 instead of step S29, as compared with the above-described conventional machining position measurement method. There are differences.
The other steps S1, S3, S4, S5, S6, S7, and S8 of the present embodiment are substantially the same as steps S21, S23, S24, S25, S26, S27, and S28 of the conventional example described above.
In order to facilitate understanding of the processing position measurement method according to the present embodiment, the multilayer film, the rotary punching method, and the processing position measurement method will be described in this order.

(Multilayer film)
The multilayer film 10 related to the present embodiment is almost the same as that of the above-described conventional example, and includes a light release separator 11, a transparent adhesive sheet 12, and a heavy release separator 13 as shown in FIG. The transparent adhesive sheet 12 is used for a touch panel or the like. This multilayer film 10 is in a state completed as a product.

(Rotary punching method)
Next, a punching apparatus 2 that performs a rotary punching method will be described.
FIG. 2: has shown the schematic front view for demonstrating the punching apparatus which performs the measuring method of the processing position concerning embodiment of this invention.
In FIG. 2, the punching device 2 related to the present embodiment includes a resin punching die roll 22 instead of the resin punching die roll 222 as compared with the above-described conventional punching device 201, and A difference is that a machining position measuring device 1 is provided instead of the machining position measuring device 101. The other configuration of the punching device 2 is almost the same as that of the punching device 201.
Therefore, in FIG. 2, the same components as those in FIG. 7 are denoted by the same reference numerals, and detailed description thereof is omitted.

The resin punching die roll 22 is provided with a pinnacle die (not shown) having a blade 220 or the like. As will be described later, the blade 220 pierces the light release separator 11 and the transparent adhesive sheet 12, and the light release separator 11 and the transparent adhesive sheet 12 are punched into a substantially rectangular shape. In addition to the above processing, the blade 220 forms the mth mark 26 corresponding to the punching position and the reference mark 29 (see FIGS. 3 and 4) indicating the reference dimension L0 on the multilayer film 15. The m-th mark 26 and the reference mark 29 are formed when a part of the blade 220 is pierced to the top of the light release separator 11, the transparent adhesive sheet 12 and the heavy release separator 13 (that is, by being punched). Is done.
The m-th mark 26 has a T-shape, but the shape of the m-th mark 26 is not particularly limited.

Here, it is preferable that the reference mark 29 has a first correction mark 291 and a second correction mark 292 that are formed apart from each other by the reference dimension L0. In this way, the measured reference dimension L1 can be easily obtained by measuring the distance between the first correction mark 291 and the second correction mark 292 facing each other using the CCD camera 3.
In the present embodiment, the reference mark 29 has the first correction mark 291 and the second correction mark 292 formed apart from each other by the reference dimension L0. However, the present invention is not limited to this. For example, a groove-shaped reference mark (not shown) may be used.

  Preferably, both the shortest distance between the mth mark 26 and the first correction mark 291 and the shortest distance between the mth mark 26 and the second correction mark 292 are 2 mm or less. . In this way, since the first correction mark 291 and the second correction mark 292 are formed in the vicinity of the m-th mark 26, the correction coefficient (= the ratio of the measured reference dimension to the reference dimension = L1 / The reliability of L0) can be improved.

  The reference dimension L0 is preferably 0.5 mm to 3.0 mm (0.5 mm or more and 3.0 mm or less). In this way, the first correction mark 291 and the second correction mark 292 that can be easily measured by the CCD camera 3 can be easily formed.

As shown in FIG. 2, the processing position measuring apparatus 1 includes a CCD camera 3, an illumination 4, an information processing means 5, a monitor 6 and the like as imaging means. The information processing means 5 is a computer or the like and has an image processing function and the like.
The machining position measuring apparatus 1 detects the mth mark 26 and the nth mark 27, measures the relative position between the detected mth mark 26 and the nth mark 27, and also uses the reference mark 29 ( In this embodiment, the reference dimension of the first correction mark 291 and the second correction mark 292 is measured (L1 is measured), and the ratio between the measured reference dimension L1 and the reference dimension L0 (= L1 / L0 is also referred to as a correction coefficient.) The relative position between the mth mark 26 and the nth mark 27 is corrected (this correction will be described later), and the mth machining position and the nth mark are corrected. The deviation of the machining position from the machining position is measured.

FIG. 3: has shown the schematic for demonstrating the multilayer film in each process of the measuring method of the processing position concerning embodiment of this invention. In addition, FIG. 3 has shown the schematic top view of the roll-shaped multilayer film 15 of each process mentioned later on the right side, and has shown schematic sectional drawing of the multilayer film 15 corresponding to the figure on the right side on the left side.
As shown in FIGS. 1, 2, and 3, first, the roll-shaped multilayer film 15 is wound around the carrier film 14 on the ambi roll 21 at a point P ₁ and attached to the upper surface of the carrier film 14 (FIG. 3 (a), see FIG. 3 (b)). That is, the carrier film 14 is laminated on the lower surface of the multilayer film 15 (step S1).

Next, the multilayer film 15, at point _{P 2,} is punched by the pinnacle-type resin for punching die roll 22 (see FIG. 3 (c), the FIG. 3 (d)). That is, in the multilayer film 15, the pinnacle blade 220 pierces the light release separator 11 and the transparent adhesive sheet 12, and the light release separator 11 and the transparent adhesive sheet 12 are punched into a substantially rectangular shape.
In addition, the multilayer film 15 is formed with the m-th mark 26 corresponding to the punching position, the first correction mark 291 and the second correction mark 292 along with the above-described processing. The m-th mark 26, the first correction mark 291, and the second correction mark 292 are such that part of the blade 220 pierces to the top of the light release separator 11, the transparent adhesive sheet 12, and the heavy release separator 13. (Ie, by stamping) (step S2).
Note that the first correction mark 291 and the second correction mark 292 have a pair of opposed straight lines, but these shapes are not particularly limited.

Subsequently, the multilayer film 15, at point _{P 3,} the light release separator 11 outside the product is wound (see FIG. 3 (e), the FIG. 3 (f)). That is, the light release separator 11 outside the product (a substantially rectangular outer portion punched out by the blade 220) is removed from the multilayer film 15 (step S3).

Next, the multilayer film 15, at point _{P 4,} a transparent adhesive sheet 12 out of the product is taken up by the resin remover film 16 (see FIG. 3 (g), the FIG. 3 (h)). That is, the transparent adhesive sheet 12 outside the product (a substantially rectangular outer portion punched out by the blade 220) is removed from the multilayer film 15 (step S4).

Subsequently, the multilayer film 15, at point P _5, (see FIG. 3 (i), Fig. 3 (j)) to light release separator 11 on the product is taken up by the light release separator removing tape 17 having an adhesive property . That is, the light release separator 11 on the product (on the substantially rectangular portion punched out by the blade 220) is removed from the multilayer film 15 (step S5).

Next, the multilayer film 15, at point _{P 6,} reference light release separator 11 for changing stick is attached to the upper surface of the transparent adhesive sheet 12 (FIG. 3 (k), FIG. 3 (l))). That is, the multi-layer film 15 is laminated with the light release separator 11 for replacement on the upper surface (step S6).

Next, the multilayer film 15, at point _{P 7,} is punched by the pinnacle type PACKAGE for cutting die roll 23 (see FIG. 3 (m), FIG. 3 (n)). That is, the multilayer film 15 has a pinnacle blade 231 pierced into the light-release separator 11 and heavy release separator 13 for replacement, and the light-release separator 11 and heavy release separator 13 for replacement are larger than the transparent adhesive sheet 12. Punched into a nearly rectangular shape.
In addition, the multilayer film 15 is formed with an nth mark 27 and a cutting positioning mark 28 corresponding to the punching position along with the above processing. The n-th mark 27 is formed when a part of the blade 231 is pierced to the top of the light release separator 11, the heavy release separator 13 and the carrier film 14 (that is, by punching) (step S7). ).

The n-th mark 27 is L-shaped, but the shape of the n-th mark 27 is not particularly limited.
In the present embodiment, the mth mark 26 and the nth mark 27 are formed so as not to overlap each other, but the present invention is not limited to this. For example, although not shown, the mth mark The mark 26 and the nth mark 27 may be formed so as to overlap each other. In this way, the space for forming each mark can be reduced.

Subsequently, the multilayer film 15, at point P _8, the light release separator 11 outside the product is wound (see FIG. 4). That is, the light release separator 11 outside the product (a substantially rectangular outer portion punched by the blade 231) is removed from the multilayer film 15 (step S8).

Next, the multilayer film 15 and the carrier film 14 leave the ambi roll 21 and are continuously fed out by the feed roller 24.
The multilayer film 15 and the carrier film 14 sent out by the feed roller 24 are in a slack state, the processing position is measured by the processing position measuring device 1, and then sent intermittently by the feed roller 25, and the cutting means 7. Disconnected by.

(Measuring method of machining position)
First, as shown in FIG. 2, a machining position measuring apparatus 1 that performs a machining position measuring method includes a CCD camera 3, illumination 4, information processing means 5, a monitor 6, and the like. The information processing means 5 is a computer or the like and has an image processing function and the like.
The machining position measuring apparatus 1 detects the mth mark 26 and the nth mark 27, measures the relative position between the detected mth mark 26 and the nth mark 27, and also uses the reference mark 29 ( In the present embodiment, the reference dimension of the first correction mark 291 and the second correction mark 292) is measured (L1 is measured), and the ratio between the measured reference dimension L1 and a predetermined reference dimension L0. (= L1 / L0, also referred to as a correction coefficient), the relative position between the m-th mark 26 and the n-th mark 27 is corrected (that is, the obtained relative position is divided by the correction coefficient described above). And measuring the deviation of the machining position between the m-th machining position and the n-th machining position.

4A and 4B are schematic diagrams for explaining a machining position measuring method according to an embodiment of the present invention, in which FIG. 4A is a plan view and FIG. 4B is an enlarged view of a main part. .
In FIG. 4, the multilayer film 15 fed from the feed roller 24 has the m-th mark 26 and the n-th mark 27, and the first correction mark 291 and the second correction mark 292 formed on the heavy release separator 13. ing.
The multilayer film 15 is irradiated with light from the lower side of the carrier film 14 by the illumination 4, and the mth mark 26 and the nth mark 27, and the first correction mark 291 and the first correction mark 291 and The second correction mark 292 is imaged. Image data obtained by imaging is output from the CCD camera 3 to the information processing means 5, and the information processing means 5 measures X1, X2, Y1, Y2, and L1, as shown in FIG. 4B. To do.

Here, the pinnacle die attached to the resin punching die roll 22 and the pinnacle die attached to the product outer shape punching die roll 23 are assumed to have X1 = X2 = The blade 220 and the blade 231 are formed so that X0 and Y1 = Y2 = Y0. That is, the information processing means 5 calculates X1-X0, X2-X0, Y1-Y0, and Y2-Y0, thereby shifting the machining position between the mth punching position and the nth punching position. (Difference in processing position based on image data picked up by the CCD camera 3) is measured.
Further, the processing position measuring apparatus 1 measures the reference dimension of the reference mark 29 (in the present embodiment, the first correction mark 291 and the second correction mark 292 described above) (L1 is measured), and the measured reference Based on the ratio between the dimension L1 and the reference dimension L0 (= L1 / L0, also referred to as a correction coefficient), the relative positions of the mth mark 26 and the nth mark 27 are corrected (that is, the obtained relative The target position is divided by the above correction coefficient), and the deviation of the machining position between the m-th machining position and the n-th machining position is measured.
Then, the machining position measuring device 1 issues a predetermined alarm or the like and stops the punching device 2 when the shift of the machining position calculated by the above correction does not fall within the punching accuracy allowable range input in advance.

In other words, the processing position measuring method of the present embodiment is based on the reference measured using the CCD camera 3 with respect to the relative positions of the m-th mark 26 and the n-th mark 27 measured using the CCD camera 3. Based on the ratio of the dimension L1 to the reference dimension L0 (= L1 / L0, also referred to as a correction coefficient), correction is performed (that is, the obtained relative position is divided by the correction coefficient), and the m-th machining position. This is a method for measuring the deviation of the machining position between the machining position and the n-th machining position.
In this way, the m-th mark 26 and the n-th mark 27 are caused to be adversely affected when the m-th mark 26 and the n-th mark 27 are detected, that is, due to vibration or deformation of the multilayer film 15 or the carrier film 14. The adverse effect of being unable to detect with high accuracy can be effectively eliminated, and the deviation of the machining position can be measured with high accuracy.

[Example]
FIG. 5 shows Table 1 showing a comparison result between measured values and measured values in the machining position measuring method according to the embodiment of the present invention.
FIG. 5 shows a comparison result (number of samples = 100) between a measured value (measured value by a CCD camera) by the processing position measuring method of the present embodiment and an actually measured value by an optical microscope.
According to this comparison result (Table 1), the maximum error between the measured value and the actually measured value is 23 μm, and this measured value is + 11.2% with respect to the actually measured value (37.5% of the conventional example is 11.1). Up to 2%.).
Further, according to the above comparison result, the average error between the measured value and the actually measured value is 8 μm, and the measured value is + 5.4% with respect to the actually measured value (5.4% compared to 18.5% of the conventional example). It was possible to improve.
That is, in the punching process of the multilayer film 15 described above, the deviation of the processing position between the mth punching position and the nth punching position could be measured with extremely high accuracy.

  As described above, according to the processing position measuring method of the present embodiment, adverse effects when the m-th mark 26 and the n-th mark 27 are detected using the CCD camera 3, that is, the multilayer film 15 and the carrier are detected. The adverse effect that the m-th mark 26 and the n-th mark 27 cannot be detected accurately due to vibration or deformation of the film 14 can be effectively eliminated, and the displacement of the processing position can be accurately measured.

As mentioned above, although the preferred embodiment etc. were shown and demonstrated about the measuring method of the processing position of the present invention, the measuring method of the processing position concerning the present invention is not limited only to the above-mentioned embodiment etc., and the present invention. It goes without saying that various modifications can be made within the range described above.
For example, although the above-described embodiment is a method for measuring a processing position in a rotary punching process for a multilayer film, the processing is not limited to the rotary punching process, and may be various processes. . Further, the workpiece is not limited to the multilayer film, and may be a workpiece having various laminated structures, for example.

  The machining to which the machining position measuring method of the present invention is applied is limited to m-th machining (m is a natural number) and n-th machining (n is a natural number and n> m), that is, two machinings. For example, three or more processes may be performed.

1, 101 Processing position measuring device 2, 201 Punching device
3 CCD camera
4 lighting
5, 105 Information processing means
6 Monitor 7 Cutting means 10 Multilayer film 11 Light release separator
12 Transparent adhesive sheet
13 Heavy release separator
14 Carrier film 15 Multilayer film 16 Resin removing film 17 Light release separator removing tape 21 Ambiroll
22 Punching roll for resin
23 Punching roll for product outline
24 Feed roller
25 Feed roller
26th m mark
27th mark
28 Cutting positioning mark
29 fiducial mark
220 Blade 221 Blade 222 Plastic punch roll 231 Blade 291 First correction mark 292 Second correction mark

Claims (9)

An m-th processing step of performing an m-th processing (m is a natural number) on the workpiece, and forming an m-th mark corresponding to the m-th processing position and a reference mark indicating a reference dimension;
N-th processing step of performing n-th processing (n is a natural number and n> m) on the workpiece and forming an n-th mark corresponding to the n-th processing position;
Detecting the m-th mark and the n-th mark, measuring the relative position between the m-th mark and the n-th mark, and measuring the reference dimension of the reference mark; Based on the ratio between the measured reference dimension and the reference dimension, the relative position between the m-th mark and the n-th mark is corrected, and the m-th processing position and the n-th processing position are corrected. A measuring method for measuring a machining position, comprising: a measuring step for measuring a deviation of the machining position.   The processing position measuring method according to claim 1, wherein the reference mark has a first correction mark and a second correction mark formed apart from each other by the reference dimension.   3. The processing position measuring method according to claim 1, wherein the m-th mark, the reference mark, and the n-th mark are formed by punching. 4.   The method for measuring a processing position according to claim 1, wherein at least a part of the m-th mark and the n-th mark overlap each other.   The shortest distance between the m-th mark and the first correction mark and the shortest distance between the m-th mark and the second correction mark are both 2 mm or less. The measuring method of the processing position as described in any one of 2-4.   The method for measuring a processing position according to any one of claims 1 to 5, wherein the reference dimension is 0.5 mm to 3.0 mm.   The imaging means is used for the detection of the m-th mark, the detection of the n-th mark, and the measurement of the reference dimension of the reference mark. The processing position measurement method described.   The method for measuring a processing position according to any one of claims 3 to 7, wherein the punching is a rotary punching.   The method for measuring a processing position according to any one of claims 3 to 8, wherein the workpiece is a multilayer film.

Images