KR101623667B1 - Copper foil for printed circuit - Google Patents

Abstract

A copper foil for a printed circuit, comprising: a primary particle layer of copper formed on a surface of a copper foil; and a secondary particle layer of a ternary alloy comprising copper, cobalt and nickel formed on the primary particle layer, Wherein an average value of a height histogram by a laser microscope is 1500 or more. Wherein the primary particle layer of the copper has an average particle diameter of 0.25 to 0.45 占 퐉 and the secondary particle layer of a ternary alloy composed of copper, cobalt and nickel has an average particle diameter of 0.35 占 퐉 or less. Copper foil. A secondary particle layer by copper-cobalt-nickel alloy plating is formed on the surface of the copper primary particle of copper on the surface of the copper foil, and the average height of the height histogram by the laser microscope on the surface of the roughened surface is set to 1500 or more, Which is capable of increasing the peel strength and improving the heat resistance of the printed circuit board.

Description

[0001] COPPER FOIL FOR PRINTED CIRCUIT [0002]

The present invention relates to a copper foil for a printed circuit, and more particularly, to a copper foil for a printed circuit, which comprises a copper foil having a primary particle layer of copper formed on the surface thereof and having a secondary particle layer formed thereon by copper-cobalt- To a copper foil for a printed circuit which can increase the peel strength and improve the heat resistance.

The copper foil for a printed circuit of the present invention is particularly suitable, for example, for a fine pattern printed circuit and a flexible printed circuit.

Copper and copper alloy foil (hereinafter referred to as copper foil) has contributed greatly to the development of the electric and electronic industry, and is indispensable as a printed circuit material in particular. The copper foil for a printed circuit is generally manufactured by forming a copper clad laminate by laminating and bonding a substrate such as a synthetic resin board or a film with an adhesive or without using an adhesive under high temperature and high pressure, , A necessary circuit is printed through a resist coating process and an exposure process, and an etching process for removing an unnecessary portion is performed.

Finally, necessary devices are soldered to form various printed circuit boards for electronic devices. The copper foil for a printed circuit board differs in terms of the adhesion side (roughened surface) and the non-adhesion side (glossy side) bonded to the resin substrate.

For example, the demand for roughened surface formed on the copper foil is mainly due to 1) no oxidation discoloration at the time of storage, 2) peeling strength with the substrate is high temperature heating, wet processing, soldering, 3) lamination with the substrate, and no so-called stacking fault after etching.

The roughening treatment of the copper foil plays a large role in determining the adhesion between the copper foil and the substrate. As for the roughening treatment, a copper roughening treatment for electrodepositing copper initially has been adopted. Thereafter, various techniques have been proposed and copper-nickel roughening treatment has been proposed as one representative treatment for the purpose of improving the heat peel strength, hydrochloric acid resistance and oxidation resistance As a method.

The applicant of the present invention proposed a copper-nickel harmonization treatment (see Patent Document 1) and achieved the results. The copper-nickel-treated surface was black, and in particular, the copper-nickel-treated black color was recognized as a commodity symbol in the rolled treated foil for a flexible substrate.

However, copper-nickel roughening treatment is excellent in heat peel strength, oxidation resistance and hydrochloric acid resistance, while etching with an alkaline etching solution, which has become important as a treatment for fine patterning recently, The treatment layer becomes an etching residue.

Therefore, Applicant of the present invention first developed Cu-Co treatment (see Patent Document 2 and Patent Document 3) and Cu-Co-Ni treatment (see Patent Document 4) as a treatment for fine pattern.

These coarsening treatments were good in terms of etching property, alkali etching resistance and hydrochloric acid resistance, but it was found that the heat peel strength when the acrylic adhesive was used was found to be low, and the oxidation resistance was not as good as expected, It was brown to dark brown with no reaching to black.

(1) to have an exothermic peel strength (particularly when an acrylic adhesive is used) comparable to the case of Cu-Ni treatment and hydrochloric acid resistance, and (2) to have an alkali 3) to improve the oxidation resistance (oxidation resistance in an oven at 180 占 폚 for 30 minutes) as in the case of the Cu-Ni treatment; 4) to improve the oxidation resistance ) Cu-Ni treatment, it is further required to be a blackening treatment.

That is, when the circuit is made finer, the circuit tends to be easily peeled off by the hydrochloric acid etching liquid, and prevention is required. When the circuit becomes fine, the circuit is also easily peeled off due to the high temperature at the time of processing such as soldering, and the prevention is also necessary. At the present time when fine patterning is in progress, for example, it is an essential requirement to be able to etch a printed circuit with a circuit width equal to or less than 150 μm pitch with a CuCl ₂ etchant. Alkali etching is also required as the resist is diversified have. The black surface is also important from the viewpoint of production of a copper foil and chip mounting in that it improves alignment accuracy and heat absorption.

In response to this demand, the present applicant has found that by forming a cobalt-plated layer or a cobalt-nickel alloy plating layer on the surface of a copper foil after the roughening treatment by copper-cobalt-nickel alloy plating, And also has the above-described characteristics comparable to those of the Cu-Ni treatment. Further, the copper-clad laminate is excellent in oxidation resistance and does not deteriorate the heat peel strength when an acrylic adhesive is used, (See Patent Document 5).

Preferably, after forming the cobalt-plated layer or the cobalt-nickel alloy plating layer, a rust-preventive treatment typified by a single film treatment of chromium oxide or a mixed coating treatment of chromium oxide and zinc and / or zinc oxide is performed. Thereafter, with the progress of electronic devices progressing, miniaturization and high integration of semiconductor devices are further progressed, and the processing performed in the manufacturing process of these printed circuits becomes higher and further, The lowering of the bonding force between the copper foil and the resin substrate became a problem.

In order to solve such a problem, there has been proposed a method of treating a copper foil for a printed circuit in which a cobalt plated layer or a cobalt-nickel alloy plated layer is formed after the roughening treatment by copper-cobalt-nickel alloy plating on the surface of a copper foil established in Patent Document 5 Thus, an invention for improving heat peelability was carried out.

This is a processing method of a copper foil for a printed circuit which forms a cobalt-nickel alloy plating layer on the surface of the copper foil and then forms a zinc-nickel alloy plating layer after the copper plating treatment by copper-cobalt-nickel alloy plating. As a highly effective invention, it is one of the main products of today's copper foil circuit material.

The inventors of the present invention have proposed various treatments for the treatment of a copper foil for a printed circuit in which a cobalt-nickel alloy plating layer is formed on the surface of a copper foil after roughening treatment by copper-cobalt-nickel alloy plating and further a zinc-nickel alloy plating layer is formed There have been some major advances in the properties of copper foil for printed circuit boards. The initial techniques of coarsening treatment by copper-cobalt-nickel alloy plating are disclosed in Patent Document 6, Patent Document 7, and Patent Document 8.

However, since the shape of the coarsely grained particles formed of the copper-cobalt-nickel alloy plating formed on the surface of the copper foil is the most basic, it is peeled off from the upper or base of the branch and is generally referred to as a powder falling phenomenon .

This powder drop phenomenon is a troublesome problem, and although the roughened layer of the copper-cobalt-nickel alloy plating has a feature of excellent adhesion with the resin layer and excellent heat resistance, as described above, It is easy to drop off, peeling due to "squeezing" during processing, contamination of the roll due to peeling powder, and etching residue due to peeling powder are generated.

Patent Document 1: JP-A-52-145769 Patent Document 2: Japanese Patent Publication No. 63-2158 Patent Document 3: Japanese Patent Application Publication No. 1-112227 Patent Document 4: Japanese Patent Application Publication No. 1-112226 Patent Document 5: Japanese Patent Publication No. Hei 6-54831 Patent Document 6: Japanese Patent Publication No. 2849059 Patent Document 7: JP-A-4-96395 Patent Document 8: JP-A-10-18075

SUMMARY OF THE INVENTION It is an object of the present invention to provide a process for producing a copper foil with a copper foil and a copper foil, And to provide a copper foil for a printed circuit which can increase the peel strength and improve the heat resistance. As the development of electronic devices progresses, miniaturization and high integration of semiconductor devices are further advanced, and demands for more strict processing in the manufacturing process of these printed circuits are given. An object of the present invention is to provide a technology that meets these needs.

The present invention provides the following invention.

1) A printed circuit board in which a primary particle layer of copper is formed on the surface of a copper foil and a secondary particle layer of a ternary alloy (copper-cobalt-nickel alloy) composed of copper, cobalt and nickel is formed on the primary particle layer The copper foil for a printed circuit board according to claim 1, wherein the copper foil has a roughened surface height of 1500 or more.

2) The copper alloy according to 1) above, wherein the primary particle layer of the copper has an average particle diameter of 0.25 - 0.45 탆 and the secondary particle layer of a ternary alloy composed of copper, cobalt and nickel has an average particle diameter of 0.35 탆 or less ≪ / RTI >

3) The copper foil for a printed circuit according to 1) or 2) above, wherein the primary particle layer and the secondary particle layer are electroplating layers.

4) The printed circuit described in any one of 1) to 3) above, wherein the secondary particles are one or a plurality of branch-shaped particles grown on the primary particles or a normal plating layer grown on the primary particles Copper foil.

(5) The copper foil for a printed circuit according to any one of (1) to (4) above, wherein an average value of height of concavities and convexities of the roughened surface by a laser microscope is 1500 or more and 2000 or less.

6) The copper foil for a printed circuit according to any one of 1) to 5) above, wherein the primary particle layer and the secondary particle layer have a fill strength of 0.80 kg / cm or more.

(7) The copper foil for a printed circuit according to any one of (1) to (6) above, wherein the peel strength of the primary particle layer and the secondary particle layer is 0.90 kg / cm or more.

It is also possible to provide a copper foil for a printed circuit in which a cobalt-nickel alloy plating layer and a zinc-nickel alloy plating layer are formed on the cobalt-nickel alloy plating layer on the secondary particle layer by the copper-cobalt-nickel alloy plating .

The cobalt-nickel alloy plating layer may have an adhesion amount of cobalt of 200 to 3000 占 퐂 / dm 2 and a cobalt ratio of 60 to 66 mass%.

A zinc-nickel alloy plating layer in which the total amount of the zinc-nickel alloy plating layer is in the range of 150 to 500 占 퐂 / dm 2 and the nickel amount is not less than 50 占 퐂 / dm 2 and the nickel ratio is in the range of 0.16 to 0.40 .

Further, a rust-preventive treatment layer can be formed on the zinc-nickel alloy plating layer.

 The rust-preventive treatment can be carried out, for example, by forming a single film-coated layer of chromium oxide or a mixed coating layer of chromium oxide and zinc and / or zinc oxide. Further, a silane coupling layer may be formed on the mixed coating layer.

The printed circuit copper foil can be produced by thermocompression bonding a copper clad laminate adhered to a resin substrate without interposing an adhesive.

The present invention aims at suppressing the phenomenon that coarse grains formed in a twig shape are peeled off from the surface of a copper foil and are generally referred to as powder drop in the roughening treatment comprising copper-cobalt-nickel alloy plating, And to improve the heat resistance of the printed circuit board.

In addition, since the particles of the twig or wedge shape that have grown abnormally are reduced and the particle diameter becomes constant, the etching property becomes good and the residue of the coarse grains on the resin substrate interface after the copper foil etching can be eliminated.

As the development of electronic devices progresses, miniaturization and high integration of semiconductor devices are further advanced, and demands for more stringent demands on the processing performed in the manufacturing process of these printed circuits are given. The present invention has the technical effect .

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a conceptual diagram showing a state of dropping powder when a conventional copper foil is subjected to a roughening treatment of copper-cobalt-nickel alloy plating.
Fig. 2 is a conceptual explanatory diagram of a copper foil-treated layer of the present invention in which a primary particle layer is formed on a copper foil in advance, and a secondary particle layer made of copper-cobalt-nickel alloy plating is formed on the primary particle layer.
Fig. 3 is a microphotograph of the surface of a conventional copper foil subjected to a roughening treatment of copper-cobalt-nickel alloy plating.
Fig. 4 is a photomicrograph of a copper foil-treated surface layer of the present invention in which a primary particle layer is formed on a copper foil in advance and a secondary particle layer made of copper-cobalt-nickel alloy plating is formed on the primary particle layer.

The copper foil used in the present invention may be either an electrolytic copper foil or a rolled copper foil. In order to improve the peel strength of the copper foil after lamination, the surface of the copper foil to be adhered to the resin base, that is, the roughened surface, is subjected to a roughening treatment for performing " knot projection " electrodeposition on the surface of the copper foil after degreasing . The electrolytic copper foil has irregularities at the time of manufacture, and the convex portions of the electrolytic copper foil are strengthened by the roughening treatment to further increase the irregularities.

Rolled copper foil and electrolytic copper foil may have slightly different treatments. In the present invention, such a pretreatment and a finishing treatment are also included, and known treatments related to copper-plating are included as necessary to be referred to as " harmonization treatment ".

This roughening treatment is intended to be carried out by copper-cobalt-nickel alloy plating (in the following description, the roughening treatment of the copper-cobalt-nickel alloy plating is carried out in order to clarify the difference between the copper and cobalt- Quot;). As described above, simply forming a copper-cobalt-nickel alloy plating layer on a copper foil causes problems such as powder dropout as described above.

FIG. 3 shows a micrograph of the surface of the copper foil on which the copper-cobalt-nickel alloy plating layer is formed on the copper foil. As shown in Fig. 3, fine particles developed into a twig shape can be seen. In general, the fine particles developed in the shape of the branches shown in Fig. 3 are fabricated at a high current density.

When treated at such a high current density, nucleation of particles in the initial electrodeposition is inhibited, and nuclei of new particles are formed at the tip of the particles, so that the particles are gradually grown into a twig shape gradually.

Therefore, in order to prevent this, when the current density is lowered and electroplating is performed, the sharp rise is eliminated and the particles increase, and the rounded particles grow. Even under such a situation, powder dropout is slightly improved, but sufficient fill strength can not be obtained, which is not sufficient to achieve the object of the present invention.

Fig. 3 is a conceptual diagram of the powder dropout when a copper-cobalt-nickel alloy plating layer as shown in Fig. 3 is formed. The reason for the dropout of the powder is that fine particles are formed in the form of branches on the copper foil as described above. Particles of the branches are easily broken by the external force and fall off from the base. These fine grain-like particles cause peeling due to "squeezing" during processing, contamination of the roll due to peeling powder, and etching residues due to peeling powder.

In the present invention, a primary particle layer of copper is formed on the surface of a copper foil in advance, and then a secondary particle layer made of a ternary alloy made of copper, cobalt and nickel is formed on the primary particle layer. A microscope photograph of the surface on which the primary particles and the secondary particles are formed on the copper foil is shown in Fig. 4 (details will be described later).

Thereby, it is possible to suppress peeling due to "grinding" during processing, fouling of rolls due to peeling powder, etching residue due to peeling powder, that is, phenomenon called powder dropout and uneven treatment, And the heat resistance can be improved.

It is preferable that the average particle diameter of the primary particle layer is 0.25 to 0.45 μm and the average particle diameter of the secondary particle layer made of a ternary alloy composed of copper, cobalt and nickel is 0.35 or less, As a result, it is an optimal condition for preventing dropout.

The lower limit of the average particle diameter of the primary particle layer is preferably 0.27 mu m, more preferably 0.29 mu m, 0.30 mu m, and 0.33 mu m.

The upper limit of the average particle diameter of the primary particle layer is preferably 0.44 mu m, further preferably 0.43 mu m, 0.40 mu m, or 0.39 mu m or less.

The upper limit of the average particle diameter of the secondary particle layer is preferably 0.34 占 퐉, more preferably 0.33 占 퐉, 0.32 占 퐉, 0.31 占 퐉, 0.30 占 퐉, 0.28 占 퐉, and 0.27 占 퐉 or less.

The lower limit of the average particle diameter of the secondary particle layer is not particularly limited, but may be, for example, 0.001 m or more, 0.01 m or more, 0.05 m or more, 0.09 m or more, 0.10 m or more, , Or 0.15 탆 or more.

The primary particle layer and the secondary particle layer are formed by an electroplating layer. The characteristic of the secondary particles is one or a plurality of branch-like particles grown on the primary particles. Or normal plating grown on the primary particles. That is, in the case of using the term "secondary particle layer" in the present specification, a normal plating layer such as coated plating is also included. The secondary particle layer may be a layer having one or more layers formed by coarsely grained grains, a layer having one or more normal plating layers, or a layer having one or more normal plating layers .

The peel strength of the primary particle layer and the secondary particle layer thus formed can be 0.80 kg / cm or more, and further, the peel strength can be 0.90 kg / cm or more.

More importantly, in the copper foil in which the primary particle layer and the secondary particle layer are formed, more importantly, the average value of the unevenness heights of the roughened surface by the laser microscope is set to 1500 or more, preferably 1,600 or more, more preferably 1,700 or more, 1,800 or more, .

The upper limit of the average value of the concavo-convex height of the roughened surface by the laser microscope is not particularly limited, but may be 4500 or less, or 3500 or less, or 3100 or less, or 3000 or less, or 2900 or less, or 2800 or less.

A characteristic feature of the present invention is to form a harmonized treatment layer in which a primary particle layer and a secondary particle layer are formed. The harmonized treatment layer is a layer in which a small secondary particle layer is formed on one large primary particle layer The layered state is in an ideal state. In reality, there are cases where the primary particles and the secondary particles are overlapped with each other in several stages, and complex layers are formed, and it is difficult to estimate the layer height from the particle diameter. As a general tendency, for example, in the case of forming secondary particles having a size equal to or larger than that of the primary particles on the smaller primary particles and forming smaller secondary particles on the larger primary particles, However, it is difficult to specify this combination specifically. Thus, in the present invention, by controlling with a macroscopic index of " average value of concavo-convex height on the roughened surface by laser microscope ", it is possible to obtain stable improvement of peel strength and stable powder The present invention is characterized in that a harmonizing treatment layer having an effect of preventing dropouts is found.

The " blurred surface " in the " average value of the concavo-convex height of the roughened surface by the laser microscope " means the surface on the final product, and includes the surface after the heat resistant layer and the rust preventive layer are formed.

When the average value of the concavo-convex height on the roughened surface by the laser microscope is less than 1,500, the secondary particle layers are stacked in the copper foil in which the primary particle layer and the secondary particle layer are formed, so that the difference in unevenness of the macro- So that the powder separation phenomenon tends to occur.

The measurement of the average value of the concavo-convex height of the roughened surface by the laser microscope was carried out using a laser microscope VK8500 manufactured by Keyens Co., Ltd., and the effective area was 786432 占 퐉 ² (measurement area 100% ), The height of the concavity and convexity is set to the histogram and the average value is obtained.

(Plating conditions of primary particles of copper)

An example of plating conditions of primary particles of copper is as follows.

This plating condition is a preferable example only, and the primary particles of copper have an average particle diameter formed on the copper foil to prevent the powder from falling off. Therefore, if the average particle diameter falls within the range of the present invention, plating conditions other than those shown below do not impose any problem. The present invention includes these.

Liquid composition: copper 10 ~ 20 g / L, sulfuric acid 50 ~ 100 g / L

Solution temperature: 25 ~ 50 ℃

Current density: 1 to 58 A / dm 2

Culm volume: 4 ~ 81 As / d㎡

(Plating conditions of secondary particles)

In the same manner as described above, this plating condition is a preferable example. The secondary particles are formed on the primary particles, and the average particle diameter plays a role of preventing the powder from falling off. Therefore, if the average particle diameter falls within the range of the present invention, plating conditions other than those shown below do not impose any problem. The present invention includes these.

Liquid composition: copper 10 ~ 20 g / L, nickel 5 ~ 15 g / L, cobalt 5 ~ 15 g / L

pH: 2-3

Temperature: 30 ~ 50 ℃

Current density: 24 ~ 50 A / dm2

Culm volume: 34 ~ 48 As / d㎡

(Plating condition for forming the heat resistant layer 1)

The present invention can further form a heat resistant layer on the secondary particle layer. The plating conditions are shown below.

Liquid composition: nickel 5 ~ 20 g / L, cobalt 1 ~ 8 g / L

pH: 2-3

Solution temperature: 40 to 60 ° C

Current density: 5 to 20 A / dm 2

Culm volume: 10 ~ 20 As / d㎡

(Plating conditions for forming the heat resistant layer 2)

The present invention can further form the following heat resistant layer on the secondary particle layer. The plating conditions are shown below.

Liquid composition: 2 to 30 g / L of nickel, 2 to 30 g / L of zinc

pH: 3-4

Temperature: 30 ~ 50 ℃

Current density: 1 to 2 A / dm 2

Culm volume: 1 ~ 2 As / d㎡

(Plating conditions for forming a rust preventive layer)

The present invention can further form the following rust preventive layer. The plating conditions are shown below. In the following, the conditions of the immersion chromate treatment are shown, but electrolytic chromate treatment may also be employed.

Liquid composition: Potassium dichromate 1 ~ 10 g / L, Zinc 0 ~ 5 g / L

pH: 3-4

Temperature: 50 to 60 ° C

Current density: 0 to 2 A / dm 2 (for immersion chromate treatment)

Culm amount: 0 to 2 As / dm 2 (for immersion chromate treatment)

(Kind of weather-resistant layer)

As an example, application of an aqueous solution of diaminosilane can be mentioned.

The copper-cobalt-nickel alloy plating as the secondary particles is formed by electrolytic plating in an amount of 10 to 30 mg / dm 2 of copper-100 to 3000 μg / dm 2 of cobalt-50 to 500 μg / Layer can be formed.

When the Co deposition amount is less than 100 占 퐂 / dm2, the heat resistance is deteriorated and the etching property is also deteriorated. When the Co deposition amount exceeds 3,000 占 퐂 / dm2, it is not preferable when the effect of magnetism must be considered, etching unevenness occurs, and acid resistance and deterioration of chemical resistance can be considered.

When the Ni adhesion amount is less than 50 占 퐂 / dm2, the heat resistance is deteriorated. On the other hand, if the Ni deposition amount exceeds 500 占 퐂 / dm2, the etching property is deteriorated. That is, the etch residue is generated and the etchability is not at a level, but fine patterning becomes difficult. The preferable Co deposition amount is 500 to 2000 占 퐂 / dm2, and the preferable nickel deposition amount is 50 to 300 占 퐂 / dm2.

From the above, it can be said that the adhesion amount of the copper-cobalt-nickel alloy plating is preferably 10 to 30 mg / dm 2 copper-100 to 3000 μg / dm 2 cobalt-50 to 500 μg / dm 2 nickel. The deposition amount of the ternary alloy layer is a preferable condition, and the range exceeding this amount is not denied.

Here, the term "etching unevenness" means that when Co is etched with copper chloride, Co remains unmelted, and the etching residue means that Ni remains unmelted when subjected to alkali etching with ammonium chloride.

Generally, in the case of forming a circuit, an alkaline etching solution and a copper chloride etching solution as described in the following examples are used. It should be understood that the etching solution and the etching conditions are versatile, but are not limited to these conditions and can be arbitrarily selected.

As described above, the present invention can form a cobalt-nickel alloy plating layer on the roughened surface after secondary particles are formed (after the roughening treatment).

In the cobalt-nickel alloy plating layer, the adhesion amount of cobalt is 200 to 3000 占 퐂 / dm2, and the ratio of cobalt is preferably 60 to 66 mass%. This treatment can be regarded as a kind of rust treatment in a broad sense.

This cobalt-nickel alloy plating layer needs to be performed to such an extent as not to substantially lower the peel strength of the copper foil and the substrate. When the cobalt adherence amount is less than 200 / / dm 2, the heat peel strength is lowered, the oxidation resistance and the chemical resistance are deteriorated, and the treated surface becomes red.

When the amount of cobalt adhering is more than 3000 占 퐂 / dm2, it is not preferable when the effect of magnetism is to be considered, etching unevenness occurs, and acid resistance and chemical resistance deteriorate. The preferred cobalt deposition amount is 400 to 2500 占 퐂 / dm2.

If the amount of cobalt adhering is large, soft etching may be caused to cause permeation. In this respect, it can be said that the ratio of cobalt is preferably 60 to 66 mass%.

As will be described later, a direct cause of generation of permeation of soft etching is a heat-resistant anticorrosion layer made of a zinc-nickel alloy plating layer, but since cobalt may also cause occurrence of permeation during soft etching, It is a desirable condition.

On the other hand, when the nickel adhesion amount is small, the heat peel strength is lowered, and the oxidation resistance and the chemical resistance are lowered. In addition, when the nickel adhesion amount is too large, the alkali etching property becomes worse. Therefore, it is preferable to determine the balance in consideration of the balance with the cobalt content.

The present invention can further form a zinc-nickel alloy plating layer on the cobalt-nickel alloy plating. The total amount of the zinc-nickel alloy plating layer is 150 to 500 占 퐂 / dm 2, and the proportion of nickel is 16 to 40% by mass. It has the role of heat-resistant anticorrosion layer. This condition is also a preferable condition, and other known zinc-nickel alloy platings can be used. It will be understood that this zinc-nickel alloy plating is a preferable additional condition in the present invention.

The processing performed in the manufacturing process of the printed circuit becomes higher in temperature and there is a generation of heat during use of the device after it becomes a product. For example, in a so-called two-layered material in which a copper foil is bonded to a resin by thermocompression bonding, heat is applied at 300 占 폚 or more at the time of bonding. Even in such a situation, it is necessary to prevent a decrease in bonding strength between the copper foil and the resin base material, and the zinc-nickel alloy plating is effective.

In the prior art, in a minute circuit including a zinc-nickel alloy plating layer in a two-layered material in which a copper foil is bonded to a resin by thermocompression bonding, discoloration due to penetration into an edge portion of the circuit occurs during soft etching. Nickel has an effect of suppressing penetration of an etching agent (H ₂ SO ₄ : 10 wt%, H ₂ O ₂ : 2 wt% of an etching aqueous solution) used in soft etching.

As described above, the total amount of the zinc-nickel alloy plating layer is set to 150 to 500 占 퐂 / dm2, the lower limit of the nickel content in the alloy layer is set to 16 mass%, the upper limit value is set to 40 mass% When the content of nickel is 50 占 퐂 / dm2 or more, it has a role of a heat-resistant anticorrosion layer and inhibits impregnation of an etchant used in soft etching to prevent weakening of the bonding strength of the circuit due to corrosion .

When the total amount of the zinc-nickel alloy plating layer is less than 150 占 퐂 / dm2, the heat-resistant coating deteriorates and it becomes difficult to take a role as a heat-resistant anticorrosion layer. If the total amount exceeds 500 占 퐂 / dm2, . When the lower limit of the nickel percentage in the alloy layer is less than 16 mass%, the penetration amount during soft etching exceeds 9 占 퐉, which is not preferable. The upper limit of the nickel content of 40% by mass is a technical limit for forming a zinc-nickel alloy plating layer.

As described above, according to the present invention, a cobalt-nickel alloy plating layer, and further a zinc-nickel alloy plating layer can be sequentially formed on a copper-cobalt-nickel alloy plating layer as a secondary particle layer. The total amount of cobalt and nickel deposited on these layers may be adjusted. Cobalt is 300 to 4000 占 퐂 / dm2, and the total amount of nickel is 150 to 1,500 占 퐂 / dm2.

When the total adhesion amount of cobalt is less than 300 占 퐂 / dm2, the heat resistance and chemical resistance are deteriorated. When the total adhesion amount of cobalt is more than 4000 占 퐂 / dm2, etching unevenness may occur. When the total amount of nickel deposited is less than 150 占 퐂 / dm2, heat resistance and chemical resistance are lowered. When the total deposition amount of nickel exceeds 1500 占 퐂 / dm2, an etching residue is formed.

Preferably, the total deposition amount of cobalt is 1500 to 3500 占 퐂 / dm2, and the total deposition amount of nickel is 500 to 1000 占 퐂 / dm2. If the above conditions are met, it is not necessary to be particularly limited to the conditions described in this paragraph.

Thereafter, rust-preventive treatment is carried out if necessary. The rust-preventive treatment preferred in the present invention is a film treatment of chromium oxide alone or a treatment of a mixture of chromium oxide and zinc / zinc oxide. The treatment of the mixture of chromium oxide and zinc / zinc oxide is a treatment of zinc or a rust-preventive layer of a zinc-chromium group mixture composed of zinc oxide and chromium oxide by electroplating using a zinc salt or a plating bath containing zinc oxide and chromate .

As the plating bath, typically at least one of dichromate such as K ₂ Cr ₂ O ₇ , Na ₂ Cr ₂ O ₇ and CrO ₃ , and water soluble zinc salt such as ZnO, ZnSO ₄ .7H ₂ O, A mixed aqueous solution of a species and an alkali hydroxide is used. Typical examples of plating bath composition and electrolysis conditions are as follows.

The thus obtained copper foil has excellent heat resistance peel strength, oxidation resistance and hydrochloric acid resistance. In addition, it is possible to etch a printed circuit CuCl below 150 ㎛ pitch width in the _second etching solution circuit, it is also available in alkaline etching. In addition, it is possible to suppress permeation of the circuit edge portion during soft etching.

For the soft etching solution, an aqueous solution of H ₂ SO ₄ : 10 wt% and H ₂ O ₂ : 2 wt% may be used. The treatment time and temperature can be arbitrarily controlled.

As the alkali etching solution, for example, a solution such as NH ₄ OH: 6 moles / liter, NH ₄ Cl: 5 moles / liter, CuCl ₂ : 2 moles / liter (temperature: 50 ° C) is known.

The copper foil obtained in the previous step has black to gray. Black to gray are meaningful in that they have high positioning accuracy and high heat absorption rate. For example, a printed circuit board including a rigid substrate and a flexible substrate mounts components such as an IC, a resistor, and a capacitor in an automatic process. At this time, a chip is mounted while reading a circuit by a sensor. At this time, positioning on the copper foil-treated surface may be performed through a film such as a capton. The positioning in the formation of the through holes is also the same.

The closer the processing surface is to black, the better the positioning accuracy because of the better absorption of light. Furthermore, when the substrate is manufactured, the copper foil and the film are cured while being heated to adhere to each other. At this time, in the case of heating by using long-wave such as far-infrared ray or infrared ray, the heating efficiency becomes better when the color tone of the processed surface is black.

Finally, if necessary, a silane treatment is performed for applying a silane coupling agent to at least the roughened surface on the anticorrosive layer, with the primary aim of improving the adhesion between the copper foil and the resin substrate.

Examples of the silane coupling agent used in the silane treatment include olefin silane, epoxy silane, acrylic silane, amino silane and mercapto silane. These silane coupling agents can be appropriately selected and used.

The coating method may be spraying by spraying a silane coupling agent solution, coating using a coater, dipping, or flow coating. For example, Japanese Unexamined Patent Publication (Kokoku) No. 60-15654 discloses that the adhesion between a copper foil and a resin substrate is improved by performing a chromate treatment on the roughened surface side of the copper foil and then performing a silane coupling agent treatment. See this for details. Thereafter, if necessary, an annealing treatment may be carried out for the purpose of improving the ductility of the copper foil.

Example

The following is a description based on examples and comparative examples. Note that this embodiment is merely an example, and is not limited to this example. That is, the present invention includes other aspects or modifications included in the present invention. In the following examples and comparative examples, 18 탆 of standard rolled copper foil TPC (tough pitch copper specified in JIS H3100 C1100) was used.

(Example 1 - Example 6)

A primary particle layer (Cu) and a secondary particle layer (copper-cobalt-nickel alloy plating) were formed on the rolled copper foil under the following conditions.

The bath composition and plating conditions were as follows.

[Bath composition and plating conditions]

(A) Formation of primary particle layer (Cu plating)

Liquid composition: copper 15 g / L, sulfuric acid 75 g / L

Solution temperature: 25 ~ 30 ℃

Current density: 1 to 70 A / dm 2

Culm volume: 2 ~ 90 As / d㎡

(B) Formation of secondary particle layer (Cu-Co-Ni alloy plating)

Liquid composition: copper 15 g / L, nickel 8 g / L, cobalt 8 g / L

pH: 2

Solution temperature: 40 ° C

Current density: 10 to 50 A / dm 2

Culm volume: 10 ~ 80 As / d㎡

The conditions of the formation of the primary particle layer (Cu plating) and the formation of the secondary particle layer (Cu-Co-Ni alloy plating) were adjusted so that the average value of the unevenness height of the roughened surface by the laser microscope was 1500 or more. The measurement of the surface area was performed by the laser microscope.

(Comparative Example 1 - Comparative Example 5)

In the comparative examples, the bath composition and the plating conditions were as follows.

[Bath composition and plating conditions]

(A) Formation of primary particle layer (copper plating)

Liquid composition: copper 15 g / L, sulfuric acid 75 g / L

Solution temperature: 25 ~ 35 ℃

Current density: 1 to 70 A / dm 2

Culm volume: 2 ~ 90 As / d㎡

(B) Formation of Secondary Particle Layer (Cu-Co-Ni alloy plating condition)

Liquid composition: copper 15 g / L, nickel 8 g / L, cobalt 8 g / L

pH: 2

Solution temperature: 40 ° C

Current density: 20 to 50 A / dm 2

Culm volume: 30 ~ 80 As / d㎡

The average particle diameter of the primary particles, the average particle diameter of the secondary particles, the average particle diameter of the secondary particles, and the average particle diameter of the primary particles (Cu plating) and the secondary particle layer (Cu-Co-Ni alloy plating) Table 1 shows the results of measuring the average value of the height histograms in a certain region of the powder dropout, the peel strength, the heat resistance, and the roughened surface. The average particle diameter of the primary particles and the secondary particles on the roughened surface was measured at a magnification of 30,000 times using S4700 manufactured by Hitachi High-Technologies Corporation, and the particle diameter was measured. The powder dropout characteristics were evaluated by attaching a transparent mending tape on the roughened surface of the copper foil and removing loose grains from the appearance of discoloration of the tape by the decolorized grains attached to the tape adhering surface when the tape was peeled off. In other words, when the tape has no discoloration or is insignificant, the powder is dropped off OK. When the tape is discolored to gray, the powder is dropped. The state peel strength was obtained by preparing a copper clad laminate by bonding a copper foil roughened surface and an FR4 resin substrate with a hot press and fabricating a 10 mm circuit using a general copper chloride circuit etchant, The state peel strength was measured while pulling in the direction of [theta].

Table 1 shows the same results as Comparative Examples.

An example in which both the current condition and the amount of Clemm are described in the primary particle current condition column in Table 1 means that plating is performed under the conditions described on the left side and then further plating is performed under the conditions described on the right side. For example, in the primary particle current condition field of Example 1, "(65 A / dm 2, 80 As / dm 2) + (20 A / dm 2, 30 As / dm 2) The current density for forming the primary particles was set to 20 A / dm 2, the amount of the culms was set to 30 As / d M < 2 >.

[Table 1]

As can be seen from Table 1, the results of the embodiments of the present invention are as follows.

Example 1 is a case where the current density for forming the primary particles is 65 A / dm 2 and 20 A / dm 2, the amount of Clemm is 80 As / dm 2 and 30 As / dm 2, The current density to be formed is 28 A / dm 2, and the amount of Clemm is 20 As / dm 2.

In addition, although the current density and the amount of Clemm forming the primary particles are two levels, two-stage electroplating is usually required when primary particles are formed. That is, plating conditions for formation of the nuclear particles in the first stage and electroplating for growth of the nuclear particles in the second stage.

The first plating condition is an electroplating condition for forming the nucleation particles in the first step, and the following plating condition is the electroplating condition for growing the nuclear particles in the second step. The following description of the embodiment and the comparative example is also the same, so the description is omitted.

As a result, the average particle diameter of the primary particles was 0.45 mu m, the average particle diameter of the secondary particles was 0.30 mu m, and the average height of the unevenness of the roughened surface by the laser microscope was 2689, there was.

As a result, it was found that when the state peel strength was as high as 0.95 kg / cm and the heat resistance deterioration rate (the peel strength after heating at 180 deg. C for 48 hours after measurement was measured and the difference was regarded as deterioration rate) As shown in Fig.

Example 2 is a case where the current density for forming primary particles is 65 A / dm 2 and 2 A / dm 2, the amount of Clemm is 80 As / dm 2 and 4 As / dm 2, The current density to be formed is 25 A / dm 2, and the amount of Clemm is 15 As / dm 2.

As a result, the average particle diameter of the primary particles was 0.40 mu m, the average particle diameter of the secondary particles was 0.15 mu m, and the average value of the height of the unevenness of the roughened surface by the laser microscope was 1556, there was.

As a result, the state peel strength was as high as 0.89 kg / cm and the heat resistance deterioration rate (the peel strength after heating at 180 캜 for 48 hours after measuring the state peel was measured and the difference was regarded as the deterioration rate) was 30% or less As shown in Fig.

Example 3 is a case where the current density for forming primary particles is 60 A / dm 2 and 10 A / dm 2, the amount of Clemm is 80 As / dm 2 and 20 As / dm 2, The current density to be formed is 25 A / dm 2, and the amount of Clemm is 30 As / dm 2.

As a result, the average particle diameter of the primary particles was 0.30 mu m, the average particle diameter of the secondary particles was 0.25 mu m, and the average value of the height of concavities and convexities by the laser microscope on the roughened surface was 1809, there was.

There was no dropout. The state peel strength was as high as 0.92 kg / cm, and the heat resistance deterioration rate (the peel strength after heating at 180 deg. C for 48 hours after measuring the state peel was measured and the difference was regarded as the deterioration rate) was 30% or less there was.

Example 4 is a case where the current density for forming primary particles is 55 A / dm 2 and 1 A / dm 2, the amount of Clemm is 75 As / dm 2 and 5 As / dm 2, The current density to be formed is 25 A / dm 2, and the amount of Clemm is 30 As / dm 2.

As a result, the average particle diameter of the primary particles was 0.35 mu m, the average particle diameter of the secondary particles was 0.25 mu m, and the average value of the concavity and convexity height by the laser microscope of the roughened surface was 1862, there was.

The peel strength was 0.94 kg / cm, the heat resistance deterioration rate (the peel strength after heating at 180 DEG C for 48 hours after measuring the state peel was measured and the difference was regarded as the deterioration rate) was as small as 30% or less .

Example 5 is a case where the current density for forming primary particles is 50 A / dm 2 and 5 A / dm 2, the amount of Clemm is 70 As / dm 2 and 10 As / dm 2, The current density to be formed is 25 A / dm 2, and the amount of Clemm is 30 As / dm 2.

As a result, the average particle diameter of the primary particles was 0.30 mu m, the average particle diameter of the secondary particles was 0.25 mu m, and the average value of the height of concavities and convexities by the laser microscope on the roughened surface was 1857, there was.

The peel strength was 0.91 kg / cm, the heat resistance deterioration rate (the peel strength after heating at 180 ° C for 48 hours after measuring the state peel was measured and the difference was regarded as the deterioration rate) was as small as 30% or less .

Example 6 is a case where the current density for forming the primary particles is 60 A / dm 2 and 15 A / dm 2, the amount of Clemm is 80 As / dm 2 and 20 As / dm 2, (Normal particle plating) with a current density of 20 A / dm < 2 > and a Coulomb amount of 60 As / dm < 2 & , And a Coulomb amount of 20 As / dm < 2 >.

As a result, the average particle diameter of the primary particles was 0.35 mu m and the secondary particles had a two-stage structure of a coating (normal) plating state (particle diameter of less than 0.1 mu m) and an average particle diameter of 0.15 mu m, The average value of the height of the unevenness of the treated surface was 1752, which satisfied the condition of the present invention.

The peel strength was 0.90 kg / cm, the heat resistance deterioration rate (the peel strength after heating at 180 DEG C for 48 hours after measuring the state peel was measured and the difference was regarded as the deterioration rate) was as small as 30% or less .

On the other hand, the results of the comparative example are as follows.

In Comparative Example 1, the current density for forming primary particles was 63 A / dm 2 and 10 A / dm 2, the amount of Clemm was 80 As / dm 2 and 30 As / dm 2, It is not formed. As a result, the average particle diameter of the primary particles became 0.50 mu m, and the average value of the concavo-convex height by the laser microscope of the roughened surface was 2001, satisfying the conditions of the present invention.

There was no dropping of the powder and the state peel strength was as high as 0.94 kg / cm, which was the embodiment level. However, the heat resistance deterioration rate (peel strength after heating at 180 캜 for 48 hours after measurement of state peel was measured, and the difference was regarded as deterioration rate) was 60%, which was considerably worse. The evaluation as a whole copper foil for a printed circuit was bad.

Comparative Example 2 shows a conventional example in which there is no primary particle diameter but only a secondary particle layer. That is, the current density for forming secondary particles is 50 A / dm 2 and the amount of Clemm is 30 As / dm 2.

As a result, the average particle diameter of the secondary particles became 0.30 mu m, and the average value of the concave-convex height due to the laser microscope of the roughened surface was 294, failing to satisfy the conditions of the present invention.

A large amount of the coarse grains were removed from the powder. When the state peel strength was 0.90 kg / cm, the heat resistance deterioration rate (the peel strength after heating at 180 deg. C for 48 hours after measuring the state peel was measured and the difference was regarded as the deterioration rate) was 30% Level. As described above, since there is a problem that a large amount of powder dropout occurs, the overall evaluation as a whole copper foil for a printed circuit is defective.

In Comparative Example 3, the current density for forming the primary particles was 63 A / dm 2 and 1 A / dm 2, the amount of Clemm was 80 As / dm 2 and 2 As / dm 2, The current density to be formed is 28 A / dm 2, and the amount of Clemm is 73 As / dm 2.

As a result, the average particle diameter of the primary particles was 0.35 mu m, the average particle diameter of the secondary particles was 0.60 mu m, and the average value of the height of the unevenness of the roughened surface by the laser microscope was 1298, I did not. A large amount of powder dropout occurred. The state peel strength was as high as 0.93 kg / cm and the heat resistance deterioration rate (peel strength after heating at 180 deg. C for 48 hours after measurement of the state peel was measured and the difference was regarded as deterioration rate) was 30% A large amount of powder dropout occurred. The evaluation as a whole copper foil for a printed circuit was bad.

In Comparative Example 4, the current density for forming the primary particles was 63 A / dm 2 and 1 A / dm 2, the amount of Clemm was 80 As / dm 2 and 2 As / dm 2, The current density to be formed is 31 A / dm 2, and the amount of Clemm is 40 As / dm 2.

As a result, the average particle diameter of the primary particles was 0.35 mu m, the average particle diameter of the secondary particles was 0.40 mu m, and the average value of the height of concavities and convexities by the laser microscope on the roughened surface was 1227, I did not.

The state peel strength was as high as 0.91 kg / cm and the heat resistance deterioration rate (the peel strength after heating at 180 deg. C for 48 hours after measurement of the state peel was measured and the difference was regarded as the deterioration rate) was 30% A large amount of powder dropout occurred. The evaluation as a whole copper foil for a printed circuit was bad.

In Comparative Example 5, the current density for forming the primary particles was 40 A / dm 2 and 1 A / dm 2, the amount of Clemm was 40 As / dm 2 and 2 As / dm 2, The current density to be formed is 20 A / dm 2, and the amount of Clemm is 20 As / dm 2.

As a result, the average particle diameter of the primary particles was 0.15 mu m, the average particle diameter of the secondary particles was 0.15 mu m, and the average value of the height of the roughened surface of the roughened surface by the laser microscope was 1367, there was.

No dropout occurred. The state peel strength was 0.75 kg / cm, and the heat resistance deterioration rate (the peel strength after heating at 180 deg. C for 48 hours after measuring the state peel was measured and the difference was regarded as the deterioration rate) was 35%.

As can be seen from the comparison between the examples and the comparative examples, after the primary particle layer of copper was formed on the surface of the copper foil (primary foil), a ternary alloy of copper, cobalt and nickel In the measurement analysis using a laser microscope in a certain region of the roughened surface in the case where the secondary particle layer is formed, by setting the average value of the height of the roughened surface of the roughened surface to 1,500 or more, the phenomenon called powder dropout, Can be stably suppressed, and further, the peel strength can be increased and the heat resistance can be improved.

It is also preferable that the average particle diameter of the primary particle layer is 0.25 to 0.45 μm and the average particle diameter of the secondary particle layer made of a ternary alloy composed of copper, cobalt and nickel is 0.35 μm or less Do.

Industrial availability

As described above, when forming a secondary particle layer (roughening treatment) comprising a copper-cobalt-nickel alloy plating, the roughening particles formed in the shape of a twig fall off from the surface of the copper foil, And to provide a copper foil for a printed circuit which can exert an excellent effect of suppressing processing unevenness and which can further increase the peel strength and improve the heat resistance. In addition, since the number of abnormally grown particles is reduced, the particle diameter becomes uniform, and the entire surface is covered, the etching property becomes good, and a highly precise circuit can be formed. Therefore, a printed circuit material for an electronic device useful.

Claims (11)

A copper foil for a printed circuit having a primary particle layer of copper formed on a surface of a copper foil and then forming a secondary particle layer of a ternary alloy comprising copper, cobalt and nickel on the primary particle layer, , And an average value at an effective area of 786432 占 퐉 ² of 1500 or more. The method according to claim 1,
Wherein the primary particle layer of the copper has an average particle diameter of 0.25 to 0.45 占 퐉 and the secondary particle layer of a ternary alloy composed of copper, cobalt and nickel has an average particle diameter of 0.35 占 퐉 or less. 3. The method according to claim 1 or 2,
Wherein the primary particle layer and the secondary particle layer are electroplated layers. 3. The method according to claim 1 or 2,
Wherein the secondary particles are one or a plurality of branch-shaped particles grown on the primary particles or a normal plating layer grown on the primary particles. 3. The method according to claim 1 or 2,
Wherein the average value of the height of the unevenness of the roughened surface by the laser microscope is 1500 or more and 2,000 or less. 3. The method according to claim 1 or 2,
Wherein the primary particle layer and the secondary particle layer have a peak strength of 0.80 kg / cm or more. 3. The method according to claim 1 or 2,
Wherein a peak strength of the primary particle layer and the secondary particle layer is 0.90 kg / cm or more. A copper clad laminate using the copper foil according to claim 1 or 2. A printed wiring board using the copper foil according to claim 1 or 2. A printed circuit board using the copper foil according to claim 1 or 2. An electronic device using the printed wiring board according to claim 9.

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