TW201339376A - 電鍍用底漆組成物、鍍敷物之製造方法及鍍敷物 - Google Patents

電鍍用底漆組成物、鍍敷物之製造方法及鍍敷物 Download PDF

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Publication number
TW201339376A
TW201339376A TW102101451A TW102101451A TW201339376A TW 201339376 A TW201339376 A TW 201339376A TW 102101451 A TW102101451 A TW 102101451A TW 102101451 A TW102101451 A TW 102101451A TW 201339376 A TW201339376 A TW 201339376A
Authority
TW
Taiwan
Prior art keywords
manufactured
plating
substrate
layer
electroplating
Prior art date
Application number
TW102101451A
Other languages
English (en)
Chinese (zh)
Inventor
Atsushi Ogawa
Tomoaki Ikeda
Takafumi Fujita
Tetsuya Hosomi
Original Assignee
Sunarrow Ltd
Nagase & Co Ltd
Nagase Chemtex Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sunarrow Ltd, Nagase & Co Ltd, Nagase Chemtex Corp filed Critical Sunarrow Ltd
Publication of TW201339376A publication Critical patent/TW201339376A/zh

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Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54Electroplating of non-metallic surfaces
    • C25D5/56Electroplating of non-metallic surfaces of plastics
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24Electrically-conducting paints

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Metallurgy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW102101451A 2012-01-19 2013-01-15 電鍍用底漆組成物、鍍敷物之製造方法及鍍敷物 TW201339376A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012009423A JP2013147707A (ja) 2012-01-19 2012-01-19 電解メッキ用プライマー組成物、メッキ物の製造方法及びメッキ物

Publications (1)

Publication Number Publication Date
TW201339376A true TW201339376A (zh) 2013-10-01

Family

ID=48799139

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102101451A TW201339376A (zh) 2012-01-19 2013-01-15 電鍍用底漆組成物、鍍敷物之製造方法及鍍敷物

Country Status (3)

Country Link
JP (1) JP2013147707A (https=)
TW (1) TW201339376A (https=)
WO (1) WO2013108713A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6346183B2 (ja) * 2013-08-02 2018-06-20 株式会社トクヤマ 光学物品用光硬化性プライマー組成物の硬化体を含むフォトクロミック積層体及び該積層体の製造方法
JP6607832B2 (ja) * 2016-08-05 2019-11-20 信越ポリマー株式会社 導電性高分子分散液及びその製造方法、並びに導電性フィルム及びその製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2575672B2 (ja) * 1986-11-14 1997-01-29 清蔵 宮田 非導電性物質のメツキ法
EP0440957B1 (de) * 1990-02-08 1996-03-27 Bayer Ag Neue Polythiophen-Dispersionen, ihre Herstellung und ihre Verwendung
DE4227836C2 (de) * 1992-08-20 1997-09-25 Atotech Deutschland Gmbh Verfahren zur Metallisierung von Nichtleitern
JPH0681190A (ja) * 1992-09-02 1994-03-22 Bridgestone Corp 絶縁体のめっき方法
JP4010657B2 (ja) * 1997-07-18 2007-11-21 富士フイルム株式会社 金属化材料の製造方法
US7118690B2 (en) * 2000-11-22 2006-10-10 H. C. Starck Gmbh Dispersible polymer powders
DE10058116A1 (de) * 2000-11-22 2002-05-23 Bayer Ag Polythiophene
JP5181231B2 (ja) * 2007-01-12 2013-04-10 アキレス株式会社 めっき物及びその製造方法
WO2009112573A2 (de) * 2008-03-13 2009-09-17 Basf Se Verfahren und dispersion zum aufbringen einer metallschicht auf einem substrat sowie metallisierbare thermoplastische formmasse
JP2011153372A (ja) * 2010-01-04 2011-08-11 Daiso Co Ltd 金属多層積層電気絶縁体とその製造方法

Also Published As

Publication number Publication date
WO2013108713A1 (ja) 2013-07-25
JP2013147707A (ja) 2013-08-01

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