TW200916314A - Surface protective film - Google Patents

Surface protective film Download PDF

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Publication number
TW200916314A
TW200916314A TW097138551A TW97138551A TW200916314A TW 200916314 A TW200916314 A TW 200916314A TW 097138551 A TW097138551 A TW 097138551A TW 97138551 A TW97138551 A TW 97138551A TW 200916314 A TW200916314 A TW 200916314A
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TW
Taiwan
Prior art keywords
acid
resin
conductive polymer
protective film
mass
Prior art date
Application number
TW097138551A
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Chinese (zh)
Inventor
Hiroyuki Mizouchi
Yukie Oohashi
Original Assignee
Jsr Corp
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Publication of TW200916314A publication Critical patent/TW200916314A/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • H01B1/124Intrinsically conductive polymers
    • H01B1/127Intrinsically conductive polymers comprising five-membered aromatic rings in the main chain, e.g. polypyrroles, polythiophenes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/06Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/36Layered products comprising a layer of synthetic resin comprising polyesters

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  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Laminated Bodies (AREA)
  • Polarising Elements (AREA)
  • Surface Treatment Of Optical Elements (AREA)

Abstract

The surface protective film of this invention comprises a substrate and a coating layer with a thickness between 20nm to 50nm on the substrate. The coating layer comprises a composition containing (A) a conductive polymer having a polythiophene structure and an electron-accepting polyacid structure, (B) melamine resin, (C) polyester resin, and (D) polyorganosiloxane. In this invention, the amount of (A) is controlled by the manner that the product (<alpha>) of coating layer thickness and the mass ratio of the conductive polymeric ingredient (A) to the total mass of the conductive polymeric ingredient (A), melamine resin (B), polyester resin (C), and polyorganosiloxane (D) becomes 6nm to 15nm.

Description

200916314 九、發明說明 【發明所屬之技術領域】 本發明有關一種主要於偏光板使用之表面保護薄膜。 【先前技術】 電子機器、光學元件、電化製品等之製品中,作爲防 止刮傷或破損、防止污物或灰塵等之附著、防止灰塵或水 分等侵入內部等之目的,而在製造時、保管時、搬運輸送 等之際,使用有保護各種製品或構件之表面保護薄膜。 於上述用途中使用之表面保護薄膜,一般係以塑膠薄 膜作爲基材,於該基材之一面上設有黏著劑層而構成,介 以此黏著劑層貼附在各種製品或構件等之上。 因此’該表面保護薄膜係在各種製品製造完成之際、 在保管、搬運輸送後使用各種製品或構件之際加以剝離, 但尤其是在電子機器中所使用之表面保護薄膜剝離之際若 引起帶電’則有引起電子電路破壞之虞,故該表面保護薄 膜要求有抗靜電性。 又’就表面保護薄膜而言,若其表面(與黏著劑層相 反側之面)若受到污染’則有成爲污染製品或構件或於製 品中混入異物之情況,故表面亦要求有防污性。再者,就 表面保護薄膜而言,自製品或構件剝離之際大多剝離貼附 在薄膜表面上之黏著膠帶,故亦要求薄膜表面之膠帶剝離 力高。此外’由於在表面保護薄膜上大多有批號等之印 字,故亦要求印字密著力高。 -4- 200916314 至於污染表面保護薄膜表面者,舉例有灰塵或髒污之 附著、作業時之污物等。再者,於偏光板中使用之表面保 護薄膜由於有在貼附有表面保護薄膜之狀態對偏光板進行 裁切之情況,故裁切之際發生之切屑(尤其是黏著劑層之 切屑)亦附著於其表面,而亦有因該切屑產生污染之情 況。 表面保護薄膜之污染原因若大致區別,則可區分爲因 表面保護薄膜表面帶電引起之灰塵附著、因表面保護薄膜 表面濡濕性引起之污物或黏著劑層切屑之附著。因此,表 面保護薄膜之表面若具有抗靜電性且濡濕性低(若撥水性 高),則可謂防污性高。 此種表面保護薄膜提案有例如於專利文獻1〜3中所記 載者。 專利文獻1及2中,提出有賦予抗靜電性之表面保護 薄膜,係在基材上’設有含聚苯胺或聚烯烴等之導電性高 分子之抗靜電層。 又,於專利文獻3中,提出有具有抗靜電性、刮傷防 止性、污染物易洗淨性、印刷適性等之光學用保護薄膜, 係在抗靜電層上,進而設有表面保護層。 [專利文獻1]日本特開2004-223923號公報 [專利文獻2]日本特開2003-246874號公報 [專利文獻3]日本特開2006-142769號公報 【發明內容】 -5- 200916314 (發明欲解決之課題) 於上述專利文獻1及2之表面保護薄膜中所含之導電 性高分子與液狀抗靜電劑不同,有因長期保存而難以引起 揮發或溶出等之優點。 然而,若設有含有導電性高分子之抗靜電層,則薄膜 表面之撥水性降低,而有防污性變的不足之問題。爲解決 此問題,若使用矽氧系界面活性劑或氟系界面活性劑賦予 撥水性,則膠帶剝離力或印字密著性降低。再者,若導電 性高分子之含有比例高,則耐擦傷性降低。 又,製作專利文獻3之保護薄膜中,爲了成爲抗靜電 層及表面保護層之2層構造而有必要進行2次塗佈,成本 變高。 本發明之目的在於提供一種表面保護薄膜,其以單層 塗層而可用以解決上述問題點,且爲低成本且具備同時具 有抗靜電性及抗污性且同時耐擦傷性亦優異之塗覆層,且 膠帶剝離力及印字密著性亦優異。 (用以解決課題之手段) 本發明人等發現藉由組合具有聚烯烴構造及電子接受 性多元酸構造之導電性聚合物成分(A )、三聚氰胺樹脂 (B )、聚酯樹脂(C )以及有機矽氧烷(D )作爲表面保 護薄膜之塗層中所含之成分,可同時達到抗靜電性及防污 性。 本發明人等進而亦發現將上述(A)之導電性聚合物 -6 - 200916314 成分之含量與塗層厚度無關地控制在一定範圍內,可獲得 抗靜電性、耐擦傷性、膠帶剝離性及印字密著性之均衡性 優異之塗層。本發明係基於此等新穎見解而完成者。 亦即,本發明爲一種表面保護膜,其特徵爲具備有基 材及在基材表面上之厚度爲20nm〜500nm之塗層,該塗層 係使用含有具有聚噻吩構造及電子接受性多元酸構造之導 電性聚合物成分、三聚氰胺樹脂、聚酯樹脂、及有機矽氧 烷之組成物所形成,上述導電性聚合物成分相對於上述組 成物中所含之上述導電性聚合物成分、上述三聚氰胺樹 脂、上述聚酯樹脂及上述有機矽氧烷之合計質量之質量比 與上述塗層厚度之乘積爲6nm〜15nm。 用以形成本發明之表面保護薄膜之基材表面塗層之組 成物,不僅含有賦予抗靜電性之導電性聚合物成分 (A ),亦含有賦予撥水性及耐擦傷性之有機矽氧烷 (D ),因此可兼具抗靜電性及防污性。進而於組成物 中,由於含有三聚氰胺樹脂(B)及聚酯樹脂(C),故具 有充分強度以及更高之耐擦傷性且透明性優異。 組成物中導電性聚合物成分(A )之含量,若太少則 無法展現抗靜電效果,若過多則塗覆層強度降低,然依據 本發明,由於將導電性聚合物成分(A)之含量與塗層厚 度無關地控制爲一定範圍,而可充分發揮抗靜電效果及強 度。 本發明亦可爲以下之構成。 (1 )上述組成物中,相對於上述導電性聚合物成分 200916314 (A)、上述三聚氰胺樹脂(B)及上述聚酯樹脂(C)之 合計質量1 〇〇質量份,上述有機矽氧烷(D )之含有比例 爲〇 . 1〜1.0質量份。若爲如此構成,則可獲得具有撥水 性、印字性及膠帶剝離性優異之塗層之表面保護薄膜而較 佳。 (2 )上述組成物中,相對於上述導電性聚合物成分 (A) 100質量份,上述三聚氰胺樹脂(B)與上述聚酯樹 脂(C )之合計質量之比例爲400~ 2000質量份。若爲如 此構成,則可獲得具有耐擦傷性更優異之塗層之表面保護 薄膜而較佳。 (3)上述組成物中,亦可在與上述基材形成有上述 塗層形成之面相反側之面上形成黏著劑層。若成爲如此構 成,即使未另外塗佈黏著劑,藉以黏著劑層,可將表面保 護薄膜黏著於偏光板等之構件表面上而較佳。 (4 )上述組成物中,上述導電性聚合物成分(A )亦 可包含聚伸乙二氧基噻吩與聚苯乙烯磺酸鹽。若爲如此構 成,可獲得具有更高抗靜電性之塗層之表面保護薄膜而較 佳。 (5)上述組成物中,上述聚酯樹脂(C)亦可爲導入 有磺酸金屬鹽基之水分散性聚酯。若爲如此構成,塗層中 聚酯可均一分散,而可獲得透明度高之外觀良好之表面保 護薄膜而較佳。 (發明效果) -8 - 200916314 依據本發明’可以低成本提供具備具有抗靜電性及防 污性且耐擦傷性優異之塗覆層,且膠帶剝離力及印字密著 性亦優異之表面保護薄膜。 【實施方式】 本發明之表面保護薄膜具備有基材,於該基材表面具 有使用包含導電性聚合物成分(A )、三聚氰胺樹脂 (B )、聚醋樹脂(C )以及有機砍氧院(d )之組成物所 形成之厚度爲20nm〜5〇Onm之塗層。 &lt;基材&gt; 作爲本發明之表面保護薄膜之基材,只要具有因應用 途所必要之透明性及耐熱性者,則無特別限制,可舉例爲 例如聚對苯二甲酸乙二酯(PET)、聚萘二甲酸乙二酯等 之聚酯系聚合物;二乙醯基纖維素、三乙醯基纖維素等之 纖維素系聚合物;聚甲基丙烯酸甲酯等之丙烯酸系聚合 物;聚苯乙烯、丙烯丙烯腈·苯乙烯共聚物(AS樹脂) 等之苯乙烯系聚合物;聚竣酸酯系聚合物;降冰片烯系聚 合物;聚乙烯、聚丙烯、乙烯.丙烯共聚物等之聚烯烴系 聚合物;氯乙烯系聚合物;耐綸、芳香族聚醯胺等之醯胺 系聚合物;醯亞胺系聚合物;颯系聚合物;聚醚颯系聚合 物;環氧系聚合物等。該等聚合物可混合兩種以上使用。 基材之厚度依據用途及聚合物種類而定,但通常爲10 〜200//m’較好爲10〜100/zni。若未達則有作爲 200916314 表面保護薄膜無法保有充分強度之情況,又若超過100 # m ’則由於表面保護薄膜變重,故有對於使用該表面保 護薄膜之構件造成負荷之虞。 &lt;塗層&gt; 於基材表面上塗佈包含導電性聚合物成分(A)、三 聚氰胺樹脂(B)、聚酯樹脂(C)及有機矽氧烷(D)之 組成物後,在例如1 0 0〜1 5 0 °C加熱乾燥,藉此形成所得之 塗層。在形成此塗層之前,基材之被塗佈面(形成塗層之 面)亦可進行電暈放電、紫外線照射、電槳處理、濺鏟蝕 刻處理、底塗處理等之易接著處理。以下,包含導電性聚 合物成分(A)、三聚氰胺樹脂(B)、聚酯樹脂(C)及 有機矽氧烷(D )之組成物亦稱爲「塗覆組成物」。 &lt;塗覆組成物&gt; 塗佈在基材表面形成塗層之塗覆組成物通常作爲水溶 性或水分散性組成物而使用。以下,對塗覆組成物中所含 之各成分具體加以說明。 (導電性聚合物成分(A )) 塗覆組成物中所含之導電性聚合物成分(A )爲具有 聚噻吩構造及電子接受性多元酸構造之成分。作爲導電性 聚合物成分,舉例有含有聚噻吩及多元酸之組成物、聚噻 吩與多元酸之共聚物、以及具有聚磺醯化噻吩等之嚷盼構 -10- 200916314 造與酸構造之化合物的聚合物。該等中,最好爲含有聚噻 吩及多元酸之組成物。 至於含有聚噻吩及多元酸之組成物,舉例有具有以下 述式(1)或式(r)表示之構成單位之聚合物與具有含磺 酸離子或羧酸離子之構成單位之聚合物(多元酸)之組成 物。 [化1]200916314 IX. Description of the Invention [Technical Field] The present invention relates to a surface protective film mainly used for a polarizing plate. [Prior Art] Products such as electronic equipment, optical components, and electrochemical products are stored at the time of manufacture for the purpose of preventing scratches or breakage, preventing the adhesion of dirt or dust, and preventing dust or moisture from entering the interior. A surface protection film that protects various products or members is used for transportation, transportation, and the like. The surface protective film used in the above application is generally formed by using a plastic film as a substrate, and an adhesive layer is formed on one surface of the substrate, and the adhesive layer is attached to various products or members. . Therefore, the surface protective film is peeled off when various products or members are used after storage, transportation, transportation, and transportation, but the surface protective film used in the electronic device is electrically charged. 'There is a flaw in the electronic circuit, so the surface protection film requires antistatic properties. In addition, in the case of the surface protective film, if the surface (the side opposite to the adhesive layer) is contaminated, it may become a contaminated product or a member or a foreign matter may be mixed in the product, so the surface is also required to have antifouling properties. . Further, in the case of the surface protective film, since the adhesive tape attached to the surface of the film is peeled off from the peeling of the product or the member, the tape peeling force on the surface of the film is also required to be high. In addition, since there are many printings such as lot numbers on the surface protective film, printing density is also required to be high. -4- 200916314 As for the surface of the surface protection film, for example, dust or dirt is attached, and dirt during work is used. Further, since the surface protective film used in the polarizing plate cuts the polarizing plate in a state in which the surface protective film is attached, the chips (especially the chips of the adhesive layer) which are generated at the time of cutting are also It adheres to its surface and there is also a contamination due to the chips. If the cause of the contamination of the surface protective film is roughly different, it can be distinguished as adhesion of dust due to charging of the surface of the surface protective film, adhesion of dirt due to wettability of the surface of the surface protective film, or adhesion of the adhesive layer. Therefore, if the surface of the surface protective film has antistatic properties and low wettability (if the water repellency is high), it can be said that the antifouling property is high. Such a surface protective film is proposed, for example, in Patent Documents 1 to 3. In Patent Documents 1 and 2, a surface protective film which imparts antistatic properties is proposed, and an antistatic layer containing a conductive high molecular weight such as polyaniline or polyolefin is provided on the substrate. Further, Patent Document 3 proposes an optical protective film having antistatic properties, scratch resistance, easy-to-cleanness of contaminants, printability, and the like, and is provided on an antistatic layer, and further provided with a surface protective layer. [Patent Document 1] Japanese Laid-Open Patent Publication No. 2003-246874 (Patent Document 3) Japanese Laid-Open Patent Publication No. Hei No. Hei. No. 2006-142769. The problem is that the conductive polymer contained in the surface protective film of the above-mentioned Patent Documents 1 and 2 differs from the liquid antistatic agent in that it is difficult to cause volatilization or elution due to long-term storage. However, if an antistatic layer containing a conductive polymer is provided, the water repellency of the surface of the film is lowered, and the antifouling property is insufficient. In order to solve this problem, when a water repellency is imparted by using a rhodium-based surfactant or a fluorine-based surfactant, the tape peeling force or the printing adhesion is lowered. Further, when the content ratio of the conductive polymer is high, the scratch resistance is lowered. Further, in the protective film of Patent Document 3, in order to form a two-layer structure of the antistatic layer and the surface protective layer, it is necessary to apply the coating twice, and the cost becomes high. An object of the present invention is to provide a surface protective film which can be used as a single layer coating to solve the above problems, and which is low in cost and has excellent antistatic property and stain resistance while being excellent in scratch resistance. The layer is also excellent in tape peeling force and printing adhesion. (Means for Solving the Problem) The present inventors have found that a conductive polymer component (A), a melamine resin (B), a polyester resin (C) having a polyolefin structure and an electron-accepting polybasic acid structure are combined. The organic decane (D) is used as a component contained in the coating of the surface protective film to simultaneously achieve antistatic properties and antifouling properties. The present inventors have further found that the content of the conductive polymer -6 - 200916314 component of the above (A) is controlled within a certain range irrespective of the thickness of the coating layer, and antistatic property, scratch resistance, tape peeling property, and A coating with excellent balance of printing adhesion. The present invention has been completed based on these novel findings. That is, the present invention is a surface protective film characterized by comprising a substrate and a coating having a thickness of 20 nm to 500 nm on the surface of the substrate, the coating comprising a polythiophene-containing structure and an electron-accepting polybasic acid. a conductive polymer component having a structure, a melamine resin, a polyester resin, and a composition of an organic siloxane, wherein the conductive polymer component is the conductive polymer component contained in the composition, and the melamine The product of the mass ratio of the total mass of the resin, the above polyester resin and the above organic decane to the thickness of the coating layer is 6 nm to 15 nm. The composition for forming the surface coating of the substrate of the surface protective film of the present invention contains not only the conductive polymer component (A) which imparts antistatic property but also the organic siloxane which imparts water repellency and scratch resistance ( D), therefore, can have both antistatic properties and antifouling properties. Further, since the composition contains the melamine resin (B) and the polyester resin (C), it has sufficient strength and higher scratch resistance and is excellent in transparency. The content of the conductive polymer component (A) in the composition is too small to exhibit an antistatic effect, and if too much, the strength of the coating layer is lowered, and according to the present invention, the content of the conductive polymer component (A) is It is controlled to a certain range regardless of the thickness of the coating, and the antistatic effect and strength can be fully exerted. The present invention may also be constituted as follows. (1) The organic oxirane (1) by mass based on the total mass of the conductive polymer component 200916314 (A), the melamine resin (B), and the polyester resin (C). The content ratio of D) is 〇. 1 to 1.0 parts by mass. According to this configuration, a surface protective film having a coating layer excellent in water repellency, printing property, and tape peeling property can be obtained. (2) In the above composition, the ratio of the total mass of the melamine resin (B) to the polyester resin (C) is 400 to 2000 parts by mass based on 100 parts by mass of the conductive polymer component (A). According to this configuration, it is preferable to obtain a surface protective film having a coating excellent in scratch resistance. (3) In the above composition, an adhesive layer may be formed on a surface opposite to a surface on which the substrate is formed with the coating layer. According to this configuration, even if the adhesive is not additionally applied, the surface protective film can be adhered to the surface of the member such as the polarizing plate by the adhesive layer. (4) In the above composition, the conductive polymer component (A) may further comprise a polyethylene dioxythiophene and a polystyrene sulfonate. If so configured, a surface protective film of a coating having a higher antistatic property can be obtained. (5) In the above composition, the polyester resin (C) may be a water-dispersible polyester into which a sulfonic acid metal salt group is introduced. According to this configuration, the polyester in the coating layer can be uniformly dispersed, and a surface protective film having a high transparency and a good appearance can be obtained. (Effect of the Invention) -8 - 200916314 According to the present invention, it is possible to provide a surface protective film having a coating layer excellent in antistatic property and antifouling property and excellent in scratch resistance, and excellent in tape peeling force and printing adhesion. . [Embodiment] The surface protection film of the present invention comprises a substrate having a conductive polymer component (A), a melamine resin (B), a polyester resin (C), and an organic chopping chamber ( The composition of d) is formed to have a thickness of 20 nm to 5 Å Onm. &lt;Substrate&gt; The substrate of the surface protective film of the present invention is not particularly limited as long as it has transparency and heat resistance necessary for the application, and is, for example, polyethylene terephthalate (PET). Polyester polymer such as polyethylene naphthalate; cellulose polymer such as diethyl hydrazine cellulose or triethylene fluorenyl cellulose; acrylic polymer such as polymethyl methacrylate Polystyrene, acrylonitrile/styrene copolymer (AS resin), etc.; styrenic polymer; polyphthalate polymer; norbornene polymer; polyethylene, polypropylene, ethylene, propylene copolymerization a polyolefin-based polymer such as a material; a vinyl chloride-based polymer; a guanamine-based polymer such as nylon or an aromatic polyamine; a quinone-based polymer; a fluorene-based polymer; a polyether fluorene-based polymer; An epoxy polymer or the like. These polymers may be used in combination of two or more kinds. The thickness of the substrate depends on the use and the type of the polymer, but is usually 10 to 200 / / m', preferably 10 to 100 / zni. If it is not reached, there is a case where the surface protective film cannot maintain sufficient strength as in 200916314, and if it exceeds 100 #m', the surface protective film becomes heavy, so that there is a load on the member using the surface protective film. &lt;Coating&gt; After coating a composition containing the conductive polymer component (A), the melamine resin (B), the polyester resin (C), and the organic decane (D) on the surface of the substrate, for example, 1 0 0 to 1 5 0 ° C was dried by heating, thereby forming the resulting coating. Before the coating is formed, the coated surface of the substrate (the surface on which the coating is formed) may be subjected to an easy subsequent treatment such as corona discharge, ultraviolet ray irradiation, electric paddle treatment, squeegee etching treatment, primer treatment, or the like. Hereinafter, the composition containing the conductive polymer component (A), the melamine resin (B), the polyester resin (C), and the organic siloxane (D) is also referred to as "coating composition". &lt;Coating composition&gt; The coating composition coated on the surface of the substrate to form a coating is usually used as a water-soluble or water-dispersible composition. Hereinafter, each component contained in the coating composition will be specifically described. (Conductive polymer component (A)) The conductive polymer component (A) contained in the coating composition is a component having a polythiophene structure and an electron-accepting polybasic acid structure. Examples of the conductive polymer component include a composition containing a polythiophene and a polybasic acid, a copolymer of a polythiophene and a polybasic acid, and a compound having a polysulfonated thiophene and the like. Polymer. Among these, a composition containing a polythiophene and a polybasic acid is preferred. The composition containing a polythiophene and a polybasic acid is exemplified by a polymer having a constituent unit represented by the following formula (1) or (r) and a polymer having a constituent unit containing a sulfonic acid ion or a carboxylic acid ion (multiple The composition of acid). [Chemical 1]

[式中,R1及R2各獨立表示爲氫原子、碳數1〜20之脂肪 族烴基、脂環族烴基或芳香族烴基、或以-R3-X表示之基 (其中R3爲單鍵、亞甲基或碳數2〜6之伸烷基,X爲羥 基、羧基、羧鹽基、胺基、(經取代)胺基甲醯基、鹵素 原子、磷酸鹽基或環氧乙烷基)]。 -11 - 200916314 U 2 化Wherein R1 and R2 are each independently represented by a hydrogen atom, an aliphatic hydrocarbon group having 1 to 20 carbon atoms, an alicyclic hydrocarbon group or an aromatic hydrocarbon group, or a group represented by -R3-X (wherein R3 is a single bond, sub Methyl or a C 2 to 6 alkylene group, X is a hydroxyl group, a carboxyl group, a carboxylate group, an amine group, a (substituted) aminomethyl fluorenyl group, a halogen atom, a phosphate group or an oxirane group)] . -11 - 200916314 U 2

(Γ) [式中’ R1及R2各獨立表示爲氫原子、碳數1〜2 0之脂肪 族烴基、脂環族烴基或芳香族烴基,或R1及R2亦可互相 結合形成以-OR4- (R4表示亞甲基或碳數2〜4之伸烷基) 表不之基]。 至於上述式(1)或式(1')所表示之聚噻吩,可較好 使用聚噻吩、聚伸乙二氧基噻吩、聚烷基噻吩等。 至於具有含磺酸離子或羧酸離子之構成單位之聚合物 (多元酸),舉例有聚丙烯酸、聚甲基丙烯酸、聚馬來酸 等之聚羧酸;聚苯乙烯磺酸、聚乙烯磺酸等之聚磺酸,其 中最好使用聚苯乙烯磺酸。 至於聚噻吩與多元酸之共聚物,可舉例爲以上述式 (1)或式(Γ)表示之構成單位與含有磺酸離子或羧酸離 子之構成單位之共聚物。 又,具有聚磺酸化噻吩等之噻吩構造與酸構造之化合 物之聚合物,較好舉例有具有於上述式(1)或式(1')中 -19 . 200916314 R1及R2之至少一個爲具有磺酸基之基的構成單位之聚合 物。 導電性聚合物成分中,聚噻吩構造與多元酸之比例’ 較好爲聚噻吩構造:多元酸=1:1~3(質量比)。 此等導電性聚合物成分較好於水或醇等之單獨溶劑或 含兩種以上之水溶性溶劑中,混合成溶解或分散之塗覆組 成物。 (三聚氰胺樹脂(B )) 塗覆組成物中所含之三聚氰胺樹脂(B )係爲了對塗 層賦予充分強度、表面硬度及耐擦傷性所用者。 至於三聚氰胺,較好使用甲基化三聚氰胺樹脂、丁基 化三聚氰胺樹脂等之烷基化三聚氰胺樹脂、或羥甲基型三 聚氰胺樹脂、亞胺型三聚氰胺樹脂等。又,最好使用含有 上述構造之三聚氰胺之三聚氰胺-甲醛樹脂。 至於較佳之市售品,舉例有例如Cymel 3 00、Cymel 301、Cymel 3 03、Cymel 3 50、Cymel 73 6、Cymel 73 8、 Cymel 3 70、Cymel 771、Cymel 325、Cymel 327、Cymel 703、Cymel 701、Cymel 266、Cymel 267、Cymel 2 8 5、 Cymel 232、Cymel 23 5、Cymel 23 8、Cymel 1141、Cymel 272、Cymel 254、Cymel 235、Cymel 202、Cymel 1156' Cymel 1158 (以上爲日本 Cytec Industries Inc (股)製 造)。 本發明所用之三聚氰胺樹脂較好以溶解或分散於水或 -13- 200916314 水性溶劑中而添加。 (聚酯樹脂(C )) 塗覆組成物中所含之聚酯樹脂(C)爲形成塗層之聚 合物成分,形成與基材強度接著之透明性優異之膜。 本發明中,作爲聚酯樹脂,較好使用水分散性聚酯, 藉由於聚合物中導入親水性官能基,可獲得水分散性優異 之聚酯(詳情如後述)。 本發明中,作爲聚酯樹脂,可使用市售者亦可使用以 下列方法合成者。 本發明中所用之聚酯樹脂係使二羧酸類(二羧酸、二 羧酸酯、二羧酸鹵化物等)與二醇類,視需要在觸媒存在 下經加熱聚縮合而合成直鏈狀聚酯,視需要使該直鏈狀聚 酯藉3價以上之羥基羧酸解聚合藉此合成分支聚酯樹脂而 獲得。 此等直鏈狀或分支狀聚酯進而亦可視需要可進行減壓 聚縮合反應,使其高分子量化。 至於二羧酸與二醇化合物聚縮合之觸媒,可使用硫 酸、對-甲苯磺酸等之質子酸、重金屬之氧化物或鹽、 鈦、錫、鉛等之有機金屬化合物等。 至於二羧酸酯與二醇化合物反應之觸媒,可使用鉛、 鋅、錳、鈣、鈷、鎘等之乙酸鹽或碳酸鹽化合物、金屬 鎂、鋅、鉛、銻、鍺等之氧化物。 至於二羧酸鹵化物與二醇化合物反應之觸媒,可使用 -14- 200916314 吡啶、三乙胺等之鹼性觸媒等。 至於二羧酸類,舉例有草酸、丙二酸、二氟丙二酸、 烷基丙二酸、琥珀酸、四氟琥珀酸、烷基琥珀酸、(±)-蘋果酸、介-酒石酸、依康酸、馬來酸、甲基馬來酸、富 馬酸、甲基富馬酸、乙炔二羧酸、戊二酸、六氟戊二酸、 甲基戊二酸、戊烯二酸、己二酸、二硫代己二酸、甲基己 二酸、二甲基己二酸、四甲基己二酸、亞甲基己二酸、己 二烯二酸、半乳糖二酸、庚二酸、辛二酸、全氟辛二酸、 3,3,6,6 -四甲基辛二酸、壬二酸、癸二酸、全氟癸二酸、 十一烷二酸、十二烷二酸、十三烷二酸、十四烷二酸等之 脂肪族羧酸;環烷基二羧酸、六氫苯二甲酸、1,6 -環己烷 二羧酸、1,4-(降冰片烯)二羧酸、雙環烷基二羧酸、金 剛烷二羧酸、螺庚烷二羧酸等之脂環式羧酸;苯二甲酸、 間苯二甲酸、二硫代間苯二甲酸、甲基間苯二甲酸、二甲 基間苯二甲酸、氯間苯二甲酸、二氯間苯二甲酸、對苯二 甲酸、甲基對苯二甲酸、二甲基對苯二甲酸、氯對苯二甲 酸、溴對苯二甲酸、萘二羧酸、氧代芴二羧酸、蒽二羧 酸、聯苯二羧酸、聯苯基二羧酸、二甲基聯苯基二羧酸、 4,4&quot;-對-三苯基二羧酸' 4,4&quot;-對-四苯基二羧酸、聯苄基二 羧酸、偶氮苯二羧酸、均苯二甲酸、伸苯基二乙酸、伸苯 基二丙酸、萘二羧酸 '萘二丙酸、聯苯二乙酸 '聯苯二丙 酸、3,3、[4,4|-(亞甲基-二-對-聯苯基)二丙酸]、4,4,-聯 苄基二乙酸、3,3' (4,4'-聯苄基)二丙酸、氧基二-對-伸 苯基二乙酸等之芳香族二羧酸;以及其等之烷基酯等之酯 -15- 200916314 化合物;羧酸氯化物等之羧酸鹵化物。該等可單獨使用或 組合兩種以上使用。 作爲二羧酸較好的是對苯二甲酸、間苯二甲酸、萘二 甲酸、其等之酸酐等之芳香族二羧酸;己二酸、癸二酸、 壬二酸、琥珀酸、富馬酸、馬來酸、雙環庚烯二甲酸 (himic acid ) 、1,6-環己烷二羧酸、該等之酸酐等之脂肪 族二羧酸;以及該等之二羧酸之低級烷基酯等。 作爲二醇化合物,舉例有例如乙二醇、丙二醇、1,2 -丙二醇、1,3-丙二醇、1,3· 丁二醇、1,4-丁二醇、新戊二 醇、1,5-戊二醇、1,6-己二醇、3-甲基戊二醇、二乙二 醇、1,4 -環己烷二甲醇、3-甲基- I,5 -戊二醇、2 -甲基-1,3-丙二醇、2,2 -二甲基-1,3-丙二醇、2 -丁基-2-乙基-1,3 -丙二 醇、二甲苯二醇、氫化雙酚A、雙酚A或其等之環氧乙烷 或環氧丙烷加成物等。該等可單獨或組合兩種以上使用。 本發明中較好使用之水分散性聚酯可藉由如下例示之 於樹脂中導入磺酸金屬鹽、羧基、醚基、磷酸基等之親水 性官能基之一種以上而獲得。 於分子內導入磺酸鹽基時,宜使例如5 -鈉磺酸間苯二 甲酸、5 -銨磺酸間苯二甲酸、4 -鈉磺酸間苯二甲酸、4 -甲 基錢磺酸間苯二甲酸' 2 -鈉磺酸對苯二甲酸、5 -鉀擴酸間 苯二甲酸、4-鉀磺酸間苯二甲酸、2 -鉀磺酸間苯二甲酸、 鈉磺酸琥珀酸等之磺酸鹼金屬鹽系或磺酸胺鹽系化合物、 含有磺酸鈉鹽之雙酚A -環氧烷加成物、含有磺酸鉀鹽之 氫醌環氧烷加成物等予以共聚合。 -16- 200916314 於分子內導入醚基時,可使用例如二乙二醇 醇、二丙二醇、聚乙二醇、聚丙二醇、聚四亞甲 新戊二醇環氧乙烷加成物、新戊二醇環氧丙烷加 含有醚鍵之二醇。 至於於分子內導入羧基之方法,有在聚酯 後,於常壓、氮氣氛圍下,使由苯偏三甲酸酐、 肝、均苯四甲酸肝、琥拍酸肝、1,8 -萘二甲酸酐 己烷二羧酸酐、環己烷-1,2,3,4-四羧酸-3,4-酐、 無水苯偏三甲酸、5-(2,5-二氧代四氫-3-芴基) 3-環己烯-1,2-二羧酸酐、萘-1,8:4,5-四羧酸二酐 種或2種以上,後附加而賦予酸價之方法;或在 分子量化之前之寡聚物狀態中投入該等酸酐,接 壓下聚縮合而高分子量化,於聚酯中導入酸價之 此情況下,就易於獲得目標酸價而言,以前者方^ 導入羧基製作聚酯樹脂之水分散體時,爲使 粒子安定化,若以鹼性物質對該粒子表面之羧基 基部分或全部予以中和則較佳。 其中,中和可使用之鹼性物質可使用以氨或 爲代表之胺類,或以氫氧化鈉、氫氧化鉀、氫氧 代表之無機鹽類。爲此考慮揮發性問題、或相反 塗層之際殘留於塗層中之問題等,較好對應於用 擇。(Γ) [wherein R1 and R2 are each independently represented by a hydrogen atom, an aliphatic hydrocarbon group having 1 to 20 carbon atoms, an alicyclic hydrocarbon group or an aromatic hydrocarbon group, or R1 and R2 may be bonded to each other to form -OR4- (R4 represents a methylene group or an alkylene group having 2 to 4 carbon atoms). As the polythiophene represented by the above formula (1) or formula (1'), polythiophene, polyethylene oxide thiophene, polyalkylthiophene or the like can be preferably used. As the polymer (polyacid) having a constituent unit containing a sulfonic acid ion or a carboxylic acid ion, polycarboxylic acid, polymethacrylic acid, polymaleic acid or the like polycarboxylic acid; polystyrenesulfonic acid, polyvinylsulfonate; A polysulfonic acid such as an acid, and polystyrenesulfonic acid is preferably used. The copolymer of the polythiophene and the polybasic acid may, for example, be a copolymer of a constituent unit represented by the above formula (1) or formula (Γ) and a constituent unit containing a sulfonic acid ion or a carboxylic acid ion. Further, a polymer having a compound having a thiophene structure such as polysulfonated thiophene and an acid structure is preferably exemplified in the above formula (1) or formula (1') -19. 200916314 R1 and R2 have at least one of A polymer of constituent units of a sulfonic acid group. In the conductive polymer component, the ratio of the polythiophene structure to the polybasic acid is preferably a polythiophene structure: polybasic acid = 1:1 to 3 (mass ratio). These conductive polymer components are preferably mixed into a coating composition which is dissolved or dispersed in a single solvent such as water or alcohol or a water-soluble solvent containing two or more kinds. (melamine resin (B)) The melamine resin (B) contained in the coating composition is used for imparting sufficient strength, surface hardness and scratch resistance to the coating layer. As the melamine, an alkylated melamine resin such as a methylated melamine resin or a butylated melamine resin, or a methylol type melamine resin or an imine type melamine resin is preferably used. Further, it is preferable to use a melamine-formaldehyde resin containing melamine of the above structure. As preferred commercial products, for example, Cymel 3 00, Cymel 301, Cymel 303, Cymel 3 50, Cymel 73 6, Cymel 73 8, Cymel 3 70, Cymel 771, Cymel 325, Cymel 327, Cymel 703, Cymel 701, Cymel 266, Cymel 267, Cymel 2 8 5, Cymel 232, Cymel 23 5, Cymel 23 8, Cymel 1141, Cymel 272, Cymel 254, Cymel 235, Cymel 202, Cymel 1156' Cymel 1158 (above is Cytec Industries, Japan) Inc (share) manufacturing). The melamine resin used in the present invention is preferably added by dissolving or dispersing in water or an aqueous solvent of -13-200916314. (Polyester Resin (C)) The polyester resin (C) contained in the coating composition is a polymer component which forms a coating layer, and forms a film excellent in transparency with respect to the strength of the substrate. In the present invention, a water-dispersible polyester is preferably used as the polyester resin, and a polyester having excellent water dispersibility can be obtained by introducing a hydrophilic functional group into the polymer (details will be described later). In the present invention, as the polyester resin, those which are commercially available or can be synthesized by the following methods can be used. The polyester resin used in the present invention is a polycarboxylic acid (dicarboxylic acid, dicarboxylic acid ester, dicarboxylic acid halide, etc.) and a glycol, which are heated and condensed in the presence of a catalyst as needed to synthesize a linear chain. The polyester is obtained by depolymerizing a linear polyester having a trivalent or higher hydroxycarboxylic acid to synthesize a branched polyester resin, if necessary. Further, these linear or branched polyesters may be subjected to a reduced pressure polycondensation reaction as needed to be polymerized. As the catalyst for polycondensation of the dicarboxylic acid and the diol compound, a protonic acid such as sulfuric acid or p-toluenesulfonic acid, an oxide or a salt of a heavy metal, an organometallic compound such as titanium, tin or lead, or the like can be used. As the catalyst for reacting the dicarboxylic acid ester with the diol compound, an acetate or carbonate compound such as lead, zinc, manganese, calcium, cobalt or cadmium, or an oxide of magnesium metal, zinc, lead, antimony or bismuth can be used. . As the catalyst for reacting the dicarboxylic acid halide with the diol compound, an alkaline catalyst such as -14-200916314 pyridine or triethylamine can be used. As the dicarboxylic acid, for example, oxalic acid, malonic acid, difluoromalonic acid, alkylmalonic acid, succinic acid, tetrafluorosuccinic acid, alkylsuccinic acid, (±)-malic acid, di-tartaric acid, and Kang acid, maleic acid, methyl maleic acid, fumaric acid, methyl fumaric acid, acetylene dicarboxylic acid, glutaric acid, hexafluoroglutaric acid, methyl glutaric acid, glutaconic acid, Diacid, dithioadipate, methyl adipic acid, dimethyl adipate, tetramethyladipate, methylene adipate, hexadiene diacid, galactose diacid, giga Acid, suberic acid, perfluorooctanoic acid, 3,3,6,6-tetramethylsuberic acid, azelaic acid, sebacic acid, perfluorosebacic acid, undecanedioic acid, dodecane An aliphatic carboxylic acid such as a diacid, a tridecanedioic acid or a tetradecanedioic acid; a cycloalkyldicarboxylic acid, a hexahydrophthalic acid, a 1,6-cyclohexanedicarboxylic acid, 1,4-( Norbornene) alicyclic carboxylic acid such as dicarboxylic acid, bicycloalkyl dicarboxylic acid, adamantane dicarboxylic acid or spiroheptane dicarboxylic acid; phthalic acid, isophthalic acid, dithioisophthalene Formic acid, methyl isophthalic acid, dimethyl isophthalic acid, chlorobenzene Formic acid, dichloroisophthalic acid, terephthalic acid, methyl terephthalic acid, dimethyl terephthalic acid, chloroterephthalic acid, bromine terephthalic acid, naphthalene dicarboxylic acid, oxoquinone Carboxylic acid, hydrazine dicarboxylic acid, biphenyl dicarboxylic acid, biphenyl dicarboxylic acid, dimethyl biphenyl dicarboxylic acid, 4, 4 &quot;-p-triphenyl dicarboxylic acid ' 4, 4 &quot;- p-Tetraphenyldicarboxylic acid, bibenzyldicarboxylic acid, azobenzenedicarboxylic acid, homophthalic acid, phenyldiacetic acid, phenyldipropionic acid, naphthalene dicarboxylic acid 'naphthalene dipropionic acid , biphenyl diacetic acid 'biphenyl dipropionic acid, 3,3, [4,4|-(methylene-di-p-biphenyl) dipropionic acid], 4,4,-bibenzyl diacetic acid And an aromatic dicarboxylic acid such as 3,3' (4,4'-bibenzyl)dipropionic acid, oxydi-p-phenylenediacetic acid or the like; and esters such as alkyl esters thereof - 200916314 Compound; carboxylic acid halide of carboxylic acid chloride or the like. These may be used singly or in combination of two or more. Preferred as the dicarboxylic acid are aromatic dicarboxylic acids such as terephthalic acid, isophthalic acid, naphthalene dicarboxylic acid, and the like; adipic acid, sebacic acid, sebacic acid, succinic acid, and rich An aliphatic dicarboxylic acid such as horse acid, maleic acid, hemicarboxylic acid, 1,6-cyclohexanedicarboxylic acid, or the like; and a lower alkane of the dicarboxylic acid Base ester and the like. As the diol compound, for example, ethylene glycol, propylene glycol, 1,2-propylene glycol, 1,3-propanediol, 1,3, butanediol, 1,4-butanediol, neopentyl glycol, 1, 5 are exemplified. - pentanediol, 1,6-hexanediol, 3-methylpentanediol, diethylene glycol, 1,4-cyclohexanedimethanol, 3-methyl-I,5-pentanediol, 2 -methyl-1,3-propanediol, 2,2-dimethyl-1,3-propanediol, 2-butyl-2-ethyl-1,3-propanediol, xylene glycol, hydrogenated bisphenol A, Ethylene oxide or propylene oxide adduct of bisphenol A or the like. These may be used alone or in combination of two or more. The water-dispersible polyester which is preferably used in the present invention can be obtained by introducing one or more kinds of hydrophilic functional groups such as a sulfonic acid metal salt, a carboxyl group, an ether group or a phosphoric acid group into the resin as exemplified below. When introducing a sulfonate group into the molecule, it is preferred to use, for example, 5-sodium sulfonic acid isophthalic acid, 5-ammonium sulfonic acid isophthalic acid, 4-sodium sulfonic acid isophthalic acid, 4-methyl sulfonic acid. Isophthalic acid '2-sodium sulfonic acid terephthalic acid, 5-potassium acid extended isophthalic acid, 4-potassium sulfonic acid isophthalic acid, 2-potassium sulfonic acid isophthalic acid, sodium sulfonic acid succinic acid Or a sulfonic acid alkali metal salt or a sulfonic acid amine salt compound, a bisphenol A-alkylene oxide adduct containing a sodium sulfonate salt, and a hydroquinone alkylene oxide adduct containing a potassium sulfonate. polymerization. -16- 200916314 When introducing an ether group into a molecule, for example, diethylene glycol alcohol, dipropylene glycol, polyethylene glycol, polypropylene glycol, polytetramethylene neopentyl glycol ethylene oxide adduct, neopentyl can be used. Glycol propylene oxide plus a glycol containing an ether linkage. As for the method of introducing a carboxyl group into the molecule, after the polyester, under normal pressure and nitrogen atmosphere, the benzoic acid anhydride, the liver, the pyromellitic acid liver, the sodium sulphate liver, the 1,8-naphthyl dimethyl hydride Anhydride hexane dicarboxylic anhydride, cyclohexane-1,2,3,4-tetracarboxylic acid-3,4-anhydride, anhydrous trimellitic acid, 5-(2,5-dioxotetrahydro-3- a method of imparting an acid value to a 3-cyclohexene-1,2-dicarboxylic anhydride or a naphthalene-1,8:4,5-tetracarboxylic dianhydride or a later addition thereof; or a molecular weight In the oligomer state before the introduction, the acid anhydride is introduced, and the polycondensation is carried out under pressure, and the polymer is quantitatively quantified. In the case where the acid value is introduced into the polyester, the target acid value is easily obtained, and the former is introduced into the carboxyl group. When the aqueous dispersion of the polyester resin is produced, it is preferred to neutralize the carboxyl group on the surface of the particle with a basic substance in order to stabilize the particle. Among them, the basic substance which can be used for the neutralization can be an amine represented by ammonia or an inorganic salt represented by sodium hydroxide, potassium hydroxide or hydrogen. For this reason, it is preferable to consider the volatility problem, or the problem that the coating remains in the coating at the time of the coating, and the like.

本發明中使用之聚酯樹脂之藉由凝膠滲透層 定之換算爲聚苯乙烯之重量平均分子量較好I 、三乙二 基二醇、 成物等之 樹脂聚合 苯二甲酸 、1,2-環 乙二醇雙 -3-甲基-等選擇1 聚酯經高 著藉由減 方法等。 去較佳。 分散的微 等之極性 三乙胺等 化鋰等爲 地於成爲 途適當選 析法所測 | 5,000~ -17- 200916314 150,000’ 更好爲 i〇, 〇〇〇 〜60,000。 又’本發明中使用之聚酯樹脂之玻璃轉移溫度(Tg ) 通常爲0〜100°c,更好爲10〜80°c。 (有機矽氧烷(D )) 塗覆組成物中所含之有機矽氧烷(D)係爲了形成撥 水性優異且耐擦傷性優異之膜所用者。 至於本發明中使用之有機矽氧烷,較好使用於末端具 有羥基、胺基、環氧基或锍基等官能基之矽氧烷化合物, 最好使用以下述式(3 )表示之有機矽氧烷。 [化3] R5 R5The polyester resin used in the present invention is a resin-polymerized phthalic acid, 1,2-, which is converted into a polystyrene by a gel permeation layer, and has a weight average molecular weight of preferably I, triethylene glycol, or the like. Cycloethylene glycol bis-3-methyl- and the like are selected as 1 polyester by high reduction method or the like. Better. The polarity of the dispersed micro-equivalent, such as lithium triethylamine, etc., is measured by the appropriate method of selection. 5,000~ -17- 200916314 150,000' is more preferably i〇, 〇〇〇 ~60,000. Further, the glass transition temperature (Tg) of the polyester resin used in the present invention is usually from 0 to 100 ° C, more preferably from 10 to 80 ° C. (Organic siloxane (D)) The organic siloxane (D) contained in the coating composition is used for forming a film excellent in water repellency and excellent in scratch resistance. As the organic oxirane used in the present invention, a decane compound having a functional group having a hydroxyl group, an amine group, an epoxy group or a thiol group at the terminal is preferably used, and an organic hydrazine represented by the following formula (3) is preferably used. Oxytomane. [Chemical 3] R5 R5

R5 R5 (式中,R5各獨立爲碳數1〜3之烷基,R6各獨立爲亞甲 基或碳數2〜6之伸烷基,R7各獨立爲羥基、胺基、環氧基 或巯基,η爲1〜1〇〇之整數,m爲1〜20之整數)。 至於最好使用之有機矽氧烷,爲上述式(3)中R7爲 羥基之化合物。於末端具有羥基之有機矽氧烷通常與水溶 性或水分散性組成物之塗覆組成物之各成分之相容性優 異。又,R5爲甲基之化合物,就易取得性方面而言爲可較 -18- 200916314 好地使用。 本發明中所用之有機矽氧烷亦可使上述式^ 之有機矽氧烷與其他矽氧烷混合者。其他矽氧烷 可舉例爲甲基三甲氧基矽烷、乙基三甲氧基矽烷 甲氧基矽烷、丁基三甲氧基矽烷等之烷基三烷 類;二甲基二甲氧基矽烷、二乙基二甲氧基矽烷 基二甲氧基矽烷、二乙基二乙氧基矽烷、二甲基 矽烷等之二烷基二烷氧基矽烷類;八甲基環四矽 環矽氧烷類等。 (A、B、C、D之比例) 上述(A) 、 ( B ) 、 (C) 、 (D)之含 下。下述記載中所謂「 (A)〜(D)成夕 「(A) 、 (B) 、 (C)及(D)」。 導電性聚合物成分(A )之含有比例,相對 (D)成分合計質量100質量份’通常爲1·2~75 較好爲1.2〜20質量份。(A )之含有比例若超過 份,則三聚氰胺樹脂(B )以及聚酯樹脂(C )之 不足,而有所得之塗層耐擦傷性降低之情況。 本發明具有之特徵爲’塗覆組成物中之導電 成分(A )之含有量係設定爲滿足使導電性聚 (A)相對於(A)〜(D)成分之合計質量之質 層厚度之乘積(α )成爲6nm~l 5nm之値。α値 時,無法獲得充分之抗靜電性,若超過1 5nm, 〔3 )表示 化合物, 、丙基三 氧基矽烷 、甲基乙 二乙氧基 氧院等之 有比例如 h」意指 於(A)〜 質量份, ! 75質量 含有比例 性聚合物 合物成分 量比與塗 未滿 6nm 則所得之 -19- 200916314 塗層變成耐擦傷性或透明性劣化者。 亦即,本發明中,藉由將導電性聚合物成分(A 含量與塗層厚度無關地控制在一定範圍內,可獲得不 具抗靜電性、防污性,且耐擦傷性、膠帶剝離力、印 著性等特定之均衡性優異之表面保護薄膜。 (B ) 、( C) 、( D )之含有比例較好爲以下範g 三聚氰胺(B)與聚酯樹脂(C)之合計質量相對 電性聚合物成分(A ) 100質量份之比例,若爲400~ 質量份,則可獲得耐擦傷性優異之塗層而較佳。 聚酯樹脂(C )相對於三聚氰胺樹脂(B ) 1 00質 之比例若爲100〜3 00質量份,則可獲得耐擦傷性優異 層而較佳。 有機矽氧烷(D)相對於導電性聚合物成分(A 三聚氰胺樹脂(B)及聚酯樹脂(C)之合計質量100 份之比例,較好爲0 · 1 ~ 1 · 0質量份。(D )之含有比 未達〇 . 1質量份,則有所得塗層之撥水性不充分之情 若超過1 · 〇質量份,則有所得塗層之印字性或膠帶剝 不足之情況。 (溶劑) 本發明中所用之塗覆組成物中,較好爲使(』 (D)成分以及後述之其他成分溶解或分散於水或&amp; 劑中之狀態。此處所謂水性溶劑,意指水溶性有機 者’亦可爲水與水溶性有機溶劑之混合物。至於該水 )之 僅兼 字密 於導 2000 量份 之塗 )' 質量 例若 況, 離性 性溶 溶劑 溶性 -20- 200916314 有機溶劑’最好使用甲醇、乙醇、異丙醇、正丁醇等之醇 類。 塗覆組成物中固體成分濃度,相對於塗覆組成物全體 質量,較好爲1 ~ 1 0質量%,更好爲1〜5質量%。 (其他成分) 本發明中’塗覆組成物中亦可含有印字用油墨所用之 石油樹脂。至於石油樹脂’可舉例有松香樹脂、松香酯樹 脂、丙烯酸樹脂、酯樹脂、纖維素樹脂、酚樹脂、烷基酚 樹脂、醇酸樹脂、蔽烯樹脂、萜稀酣樹脂、香豆酮樹脂、 二甲苯樹脂、醇酸樹脂或馬來酸改性松香樹脂、富馬酸改 性松香樹脂、酣改性松香樹脂等之酸改性物、氫化松香樹 脂、氫化萜烯樹脂等之氫化物等,該等可僅使用一種亦可 多種之混合物,亦可爲天然物、天然物之純化物,亦可爲 以二環戊二烯(DCPD ) 、C5~C9之石油樹脂作爲原料共 聚合之合成物。 該等中,大多含於印字油墨中,較好爲烷基酚樹脂、 松香改性樹脂、或其等之酸改性物,進而由水分散性而 言,較好爲其等之酸改性烷基酚樹脂、酸改性松香樹脂。 石油樹脂之平均分子量爲 1000-500000,較好爲 1000 0~ 100000。平均分子量未滿1000時,石油樹脂之黏 著性變大,易產生表面薄膜之咬扯,若超過500000,則於 塗覆組成物之分散性劣化。石油樹脂之軟化點,較好爲5 〇 °C~2 00°C,更好爲l〇crc~15〇t:。軟化點未滿5(TC時,在 -21 - 200916314 常溫之黏著性變大,變成易產生表面薄膜之咬扯,若超過 20 0 °C,則塗覆組成物塗佈後之乾燥步驟中有產生分離、 損及外觀之情況。 石油樹脂若對於塗覆組成物中固體成分全量以超過5 質量%添加,則由於保護薄膜強度降低,因此較好以對於 塗覆組成物中固體成分全量爲0〜5質量%之量添加。 本發明中,塗覆組成物中,可含有賦予薄膜耐擦傷性 或滑動性之粒子。作爲粒子,舉力爲無機粒子、有機粒 子,作爲無機粒子,舉例有氧化矽、氧化鋁、氧化鋅、氧 化鉀、氧化鈣、氧化鉻、氧化緦、氧化鎢、氧化鎂、氧化 鈦、氧化鉍、氧化鈽、氧化鈷、氧化鐵' 氧化磷、氧化 猛、氧化錫、氧化銦、氧化鍩、氧化銻、碳酸鈣、碳酸 鍾、碳酸鋇、矽酸鈣、鈦酸鈣、硫酸鈣、硫酸鋇等金屬氧 化物、或硫化鉬、硫化銻、硫化鎢、氮化硼、碘化鎳等之 一種或複數種之合成物,以及其含水物、或高嶺土、黏 土、滑石、雲母、膨潤土、水滑石、沸石、葉蠟石、碳 黑、黑鉛等天然或合成礦物粒子。 作爲有機粒子’舉例有聚乙烯、聚丙烯、酮樹脂、苯 乙稀樹脂、降冰片烯樹脂、氟樹脂、聚乙縮醛、醯胺樹 脂、醯胺醯亞胺樹脂、丙烯酸樹脂、酯樹脂、聚颯、丁二 稀樹脂、液晶聚合物等之熱塑性樹脂、環氧樹脂、二甲苯 樹脂、胍樹脂、二烯丙基苯二甲酸酯樹脂、乙烯酯樹脂、 酣樹脂、呋喃樹脂、醯亞胺樹脂、胺基甲酸酯樹脂、馬來 酸樹脂、三聚氰胺樹脂、尿素樹脂等之熱硬化性樹脂、聚 -22- 200916314 纖維素、纖維素衍生物、聚萜烯樹脂等之天然高分子以及 其衍生物中選擇之一種或多種之合成物,亦可爲混合物。 無機粒子及有機粒子可單獨使用或以複合物使用。 該等粒子中,就性能面、成本面観之,較好爲氧化 矽、黏土。粒子之形狀並無特別限制,可使用球狀、板 狀、針狀'中空狀、不定形狀者,較好爲球形者。粒子爲 使其分散性良好’亦可爲藉由陽離子系界面活性劑、陰離 子系界面活性劑、兩性界面活性劑、非離子系界面活性劑 或矽氧、氟等進行表面處理者。 粒子之平均粒徑較好爲0.01〜10// m,且比表面積較 好爲50~5〇Om/g。平均粒徑若未滿〇.〇i#m或比表面積未 滿5 0m2/g,則耐擦傷性、滑動性賦予性劣化,易因二次凝 集而產生問題。又,平均粒徑若超過10以m或比表面積超 過5 00m2/g,則薄膜光學特性劣化。 由展現耐擦傷性及滑動性(滑性)之觀點而言,粒子 之添加量相對於塗覆組成物中固體成分全量較好爲〇.〇1 質量% ~ 5質量%。 塗覆組成物中,可含有賦予水分散安定性、賦予對基 材之濡濕性之各種界面活性劑。 界面活性劑可舉例爲陽離子性界面活性劑、陰離子性 界面活性劑、兩性界面活性劑等之離子性界面活性劑、脂 肪酸等之非離子性界面活性劑、矽氧系界面活性劑、氟系 界面活性劑、矽氧氟系界面活性劑。 塗覆組成物中,除上述成分以外,亦可在不損及本發 -23- 200916314 明效果之程度內,使用離子性液體、或塑膠、橡膠、乳 液、有機溶劑、塗佈材料用之抗氧化劑、抗老化劑、紫外 線吸收劑、難燃劑、染料、顏料、滑劑、防黴劑、可塑 劑、pH調整劑、濕潤劑等。 &lt;黏著劑層&gt; 本發明中,亦可於基材之與形成有塗層之面相反側之 面上形成黏著劑層。於表面保護薄膜中,黏著劑層具有將 薄膜黏著於偏光板等構件表面上之作用。 至於該黏著劑層中所含之黏著劑,較好爲含有(甲 基)丙烯酸烷基酯系樹脂等所構成之黏著性樹脂與磺酸化 聚合物者。包含磺酸化聚合物之黏著劑層具有高的抗靜電 性特徵。黏著劑層可藉由使含有上述黏著性樹脂成分之黏 著劑組成物塗佈於基材上,並乾燥而獲得。以下,對黏著 劑組成物中所含之黏著性樹脂及磺酸化聚合物加以說明。 (黏著性樹脂) 作爲黏著性樹脂而使用之(甲基)丙烯酸烷基酯樹脂 爲以(甲基)丙烯酸烷基酯類作爲主成分,由具有黏著性 之樹脂所構成。 至於(甲基)丙烯酸烷基酯類,可舉例爲例如(甲 基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸 正丙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸正己 酯、(甲基)丙烯酸正辛酯、(甲基)丙烯酸異辛酯、 -24- 200916314 (甲基)丙烯酸2 -乙基己酯、(甲基)丙烯酸正壬酯、 (甲基)丙烯酸異壬酯、(甲基)丙烯酸正癸酯、(甲 基)丙烯酸正十二烷酯、(甲基)丙烯酸月桂基酯、(甲 基)丙烯酸硬脂基酯等,該等中,較好爲烷基之碳數爲 4〜12之(甲基)丙烯酸烷基酯類,更好爲烷基之碳數爲 6~12之(甲基)丙烯酸烷基酯類。上述(甲基)丙烯酸烷 基酯類可單獨使用亦可混合兩種以上使用。 本發明中,作爲黏著性樹脂,可倂用上述(甲基)丙 烯酸烷基酯類及其他聚合性單體。 至於其他聚合性單體,可舉例爲例如(甲基)丙烯 酸、巴豆酸、富馬酸、依康酸等之不飽和羧酸或其鹽類; 馬來酸酐、依康酸酐等之不飽和羧酸酐類;(甲基)丙烯 酸2-經基己醋、(甲基)丙烯酸2-羥基丙酯、(甲基)丙 嫌酸3 -經基丙酯、(甲基)丙烯酸2 -羥基丁酯、(甲基) 丙稀酸3_經基丁酯、(甲基)丙烯酸4-羥基丁酯等之(甲 基)丙嫌酸徑基院基酯類;(甲基)丙烯酸2-甲氧基乙 醋、(甲基)丙嫌酸2_甲氧基丙酯、(甲基)丙烯酸3_甲 氧基丙醋、(甲基)丙烯酸2_甲氧基丁酯、(甲基)丙烯 酸3-甲氧基丁醋、C甲基)丙烯酸4_甲氧基丁酯之(甲 基)丙烯酸烷氧基烷基酯類;(甲基)丙烯腈、氯丙 嫌膳、氨化亞乙煉、(甲基)丙烯酸2-氰基乙酯等之含有 氨基之單體類;(甲基)丙烯醯胺、Ν_甲基(甲基)丙烯 釀胺、Ν,Ν-二甲基(甲基)丙烯醯胺、Ν_羥甲基(甲基) 丙稀釀胺、Ν,Ν-二經甲基(甲基)丙烯醯胺、N—甲氧基甲 -25- 200916314 基(甲基)丙烯醯胺等之含有醯胺基之單體類;乙酸乙烯 酯、丙酸乙烯酯等之乙烯酯類;氯乙烯、偏氯乙烯等之鹵 化乙烯類;苯乙烯、甲基苯乙烯等之芳香族乙烯化合 物;乙烯、丁二烯、異戊間二烯等之不飽和脂肪族烴類等 之單官能性單體,或乙二醇二(甲基)丙烯酸酯、丙二醇 二(甲基)丙烯酸酯、甘油三(甲基)丙烯酸酯、三羥甲 基丙烷三(甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸 酯、亞甲基雙(甲基)丙烯醯胺、伸乙基雙(甲基)丙烯 醯胺、二乙烯基苯等之多官能性單體等。該等中,較好爲 (甲基)丙烯酸、(甲基)丙烯腈等,更好爲丙烯酸、丙 烯腈等。 該等之其他聚合性單體可單獨使用或混合兩種以上使 用。 製造(甲基)丙烯酸烷基酯系樹脂時之(甲基)丙烯 酸烷基酯類之使用量,相對於全部單體,較好爲50〜100 質量%,更好爲90〜1 00質量%。 又,(甲基)丙烯酸烷基酯系樹脂之重量平均分子量 (依據GPC法換算成聚苯乙烯之値,以下同)較好爲 10,〇〇〇以上,更好爲30, 〇〇〇以上。此時,若(甲基)丙 烯酸烷基酯系樹脂之重量平均分子量未滿1 0,000,則也發 生糊殘留等黏著性問題。 又,(甲基)丙烯酸烷基酯系樹脂之玻璃轉移點(以 下稱爲「Tg」)較好爲-8〇~-l〇°C ’更好爲-80〜-3(TC。 -26- 200916314 (磺酸化聚合物) 黏著劑層中所含之磺酸化聚合物可舉例爲例如共1尼= 烯聚合物之磺酸化物,或共軛二烯聚合物之氫化物之磺酸 化物等之磺酸化共軛二烯系聚合物;聚苯乙烯等之芳香族 乙烯系聚合物之磺酸化物、苯乙烯磺酸等之含有磺酸基之 單體之均聚物或共聚物等之磺酸化芳香族乙烯系聚合物 等,該等中,較佳爲磺酸化共軛二烯系聚合物、聚苯乙烯 磺酸,最好爲磺酸化共軛二烯系聚合物。 磺酸化共軛二烯系聚合物可爲使含有共軛二烯系單體 作爲構成單位之聚合物或其氫化物(以下此聚合物及氫化 物統稱爲「共軛二烯系基本聚合物」)經磺酸化所得者。 共軛二烯系基本聚合物中所使用之共軛二烯系單體較好爲 碳數4〜10之化合物,更好爲碳數4-8之化合物,最好爲 碳數4〜10之化合物。 至於共軛二烯系單體可舉例爲例如1,2 -丁二烯、1,3-丁二烯、1,2-丁二烯、1,3-戊二烯、2,3-戊二烯、異戊間二 烯、1,2-己二烯、1,3-己二烯、1,4-己二烯、1,5-己二烯、 2,3 -己二烯、2,4 -己二烯、2,3 -二甲基-1,3 -丁 二烯、2 -乙 基 _1,3· 丁 二烯、1,2-庚二烯、1,3-庚二烯、1,4-庚二烯、 1,5-庚二烯、i,6-庚二烯、2,3-庚二烯、2,5-庚二烯、3,4-庚二烯、3,5 -庚二烯、環戊二烯、二環戊二烯、亞乙基降 冰片烯等,該等中’尤其佳爲U3_丁二烯、異戊間二烯。 此等共軛二烯系單體可單獨使用或可混合兩種以上使 用。又,共軛二烯系基本聚合物中,可與共軛二烯系單體 -27- 200916314 一起倂用作爲(甲基)丙烯酸烷基酯之聚合單體所例示之 其他聚合性單體。 共軛二烯系基本聚合物中,可藉由使共軛二烯系單體 與視需要之其他聚合性單體,在過氧化氫、過氧苯甲醯、 偶氮雙異丁腈等之游離基聚合起始劑或正丁基鋰、萘鈉、 金屬鈉等陰離子聚合起始劑存在下,視需要使用已知溶 劑,通常在-l〇〇~+150°C,較好在〇〜130°C下進行聚合而合 成。 又,作爲共軛二烯系基本聚合物,可使用殘存於共軛 二烯系基本聚合物中之雙鍵部分之一部分或全部經氫化之 氫化物。 此氫化可使用已知之氫化觸媒或已知方法。但,製造 氫化之擴酸化共扼二嫌系聚合物時,氫化或磺酸任一者先 進行均可。 本發明中之共軛二烯系基本聚合物,爲共聚物時,可 爲無規共聚物亦可爲嵌段共聚物,於嵌段共聚物時,可使 用AB型、ΑΒΑ型等,而無特別限制。 至於較佳之共軛二烯系基本聚合物,可舉例爲例如 聚-1,3-丁二烯、聚異戊間二烯、1,3-丁二烯/苯乙烯無規共 聚物、1,3-丁二烯-苯乙烯二元嵌段共聚物、苯乙烯-1,3-丁 二烯-苯乙烯三元嵌段共聚物、1,3-丁二烯-苯乙烯-1,3-丁 二烯三元嵌段共聚物、異戊間二烯/苯乙烯無規共聚物、 異戊間二烯-苯乙烯二元嵌段共聚物、苯乙烯-異戊間二烯-苯乙烯三元嵌段共聚物、異戊間二烯-苯乙烯-異戊間二烯 -28- 200916314 三元嵌段共聚物、該等聚合物之氫化物,此外亦可舉例爲 乙烯/丙烯/共軛二烯Η元無規共聚物等,該等中,更好爲 1,3 -丁二烯-苯乙烯二元嵌段共聚物、苯乙烯--丁二烯_ 苯乙烯三元嵌段共聚物' 1,3-丁二烯-苯乙烯-1,3-丁二烯三 元嵌段共聚物、異戊間二烯-苯乙烯二元嵌段共聚物、苯 乙嫌-異戊間一儲-苯乙嫌三元嵌段共聚物、異戊間二烯-苯 乙烯-異戊間二烯三元嵌段共聚物或該等之氫化物等之具 有共軛二烯單元與芳香族二烯系單元之嵌段共聚物或其氫 化物。 共軛二儲系基本聚合物之重量平均分子量較好爲 1,000以上’更好爲5,000以上,最好爲5,000~400,0〇〇。 此時’共軛二烯系基本聚合物之平均分子量若未滿 1,〇〇〇 ’則磺酸化共軛二烯系聚合物有自黏著劑層表面滲 出’使黏著力經時產生變化之疑慮,另一方面若超過 4〇〇,〇〇〇,則有生產性降低之傾向。 本發明中之磺酸化共軛二烯系聚合物,可藉由使用磺 酸化劑將前述共轭二燦系基本聚合物中共轭二稀系單元中 之雙鍵部分磺酸化而獲得。 此磺酸化反應係使共軛二烯系單元之雙鍵開環成爲單 鍵或使該雙鍵就此保留而以磺酸(鹽)基取代氫原子。 又’使用其他聚合性單體時,除共軛二烯系單元以外,亦 可使例如芳香族乙烯系單元予以磺酸化。 擴酸化共軛二烯系聚合物中磺酸(鹽)基含量,通常 爲0.1〜ό毫莫耳/克’較好爲〇_5~5毫莫耳/克。此時,磺 -29- 200916314 酸(鹽)基含量若未滿0.1毫莫耳/克,有所得黏著劑組成 物之抗靜電能不足之情況’另一方面,超過6毫莫耳/克 時’有損及所得黏著劑層透明性之情況。 聚苯乙烯磺酸脂重量平均分子量較好爲1,〇〇〇以上, 更好爲5,0〇〇以上,最好爲5,000〜4 00, 〇〇〇。此時,重量平 均分子量若未滿1,000’則有聚苯乙烯磺酸自黏著劑層表 面滲出’使黏著力經時產生變化之疑慮,另一方面若超過 400,000 ’則有生產性降低之傾向。 本發明中,磺酸化聚合物可單獨使用或混合兩種以上 使用。 (黏著劑組成物) 本發明中所用之黏著劑組成物可以如下比例含有黏著 性樹脂及磺酸化聚合物。相對於黏著性樹脂與磺酸化聚合 物之合計量,黏著性樹脂之調配比例較好爲40〜99.9質量 %,更好爲5 0〜9 9.5質量%,磺酸化聚合物之調配比例, 較好爲60~0.1質量%,更好爲50〜〇_5質量%。此時,黏著 性樹脂之調配量若未滿40質量。/。’則有難以確保充分抗靜 電能之疑慮’另一方面若超過99.9質量% ’則有難以確保 充分黏著性之疑慮。 本發明中,黏著劑組成物可藉由例如(a )使黏著性 樹脂與磺酸化聚合物混合之方法’ (b )在擴酸化聚合物 存在下,使可獲得黏著性樹脂之單體聚合之方法加以製 造,最好爲(b )之方法。以(b )之方法所得之黏著劑組 -30- 200916314 成物中,較好爲磺酸化聚合物與黏著性聚合物經複合化之 乳液分散於水性介質中之組成物。 上述乳液之平均粒徑,較好爲60〜500 nm,更好爲 90~300nm。此時,若所得乳液之平均粒徑未滿60nm,則 有所得黏著劑組成物之黏度變得過高之虞,另一方面若超 過5 OOnm則有黏著力降低之傾向。 又,黏著劑組成物之固體成分(不揮發份)通常爲 10〜70質量%,較好爲20〜60質量%。此固體成分可藉由追 加水性介質或藉由除去一部分水系介質而調整。 (黏著劑層之形成) 可藉由在基材之形成塗層面之相反側之面上塗佈上述 黏著劑組成物並乾燥而形成黏著劑層。爲了改善基材與黏 著劑層之接著性,亦可在黏著劑組成物塗佈之前,對基材 之黏著劑形成面進行電暈處理等之易接著處理。 乾燥後之黏著劑層厚度可依據表面保護薄膜之用途而 適當調整,但通常爲5~50//m,更好爲10〜30ym。 (實施例) 以下,列舉實施例更具體說明本發明,但本發明並非 限定於該等實施例者。以下記載中,份及%若未特別指明 則爲質量基準。 &lt;實施例1&gt; -31 - 200916314 (1 )塗覆組成物之製作 於室溫下’於螺旋管瓶中,添加固體成分爲16.67份 之 Nagase ChemteX (股)製之商品名「DANATRON P502RG」作爲導電性聚合物成分(a) '固體成分爲 41.67 份之日本 CYTEC Industries (股)製之「Cymel 3 7 0」(甲基化三聚氰胺甲醛樹脂之異丙醇/異丁醇溶液, 固體成分濃度8 8 % )作爲三聚氰胺樹脂(B )、固體成分 爲4 1.67份之東洋紡績(股)製之商品名「Vylonal MD-1480」(飽和共聚合聚酯樹脂水溶液,固體成分濃度25 質量%)作爲聚酯樹脂(C)、以及固體成分爲0.2份之東 麗道康寧(股)製之商品名「BY16-201」(羥基烷基末端 之二甲基系氧烷)作爲有機矽氧烷(D ),以及加入50份 離子交換水及50份異丙醇之混合溶劑79.68份,攪拌30 分鐘,獲得固體成分濃度3.0%之塗覆組成物。 作爲導電性聚合物成分(A )使用之「DANATRON P5〇2RG」組成爲「聚伸乙二氧基噻吩/聚苯乙烯磺酸鹽/聚 酯樹脂:3 · 9質量%、水:9 6 · 1質量%」。(A )中所含之 聚酯樹脂爲乙二醇·對苯二甲酸5鈉磺酸間苯二甲酸聚縮 合物。 (2 )塗層之製作 使由(1 )獲得之塗覆組成物使用桿塗佈機塗佈於厚 度38/zm之聚對苯二甲酸乙二酯薄膜(基材)上,在140 °C乾燥2分鐘,形成40nm厚之塗層而製作本發明之表面 -32- 200916314 保護薄膜。所得之表面保護薄膜之α値爲6.6 5nm。 所得之表面保護薄膜進行下述性能評價試驗,結果示 於表1。 &lt;性能評價試驗&gt; (1)表面固有電阻値(表1中,記載爲「SR」) 在23 tx相對濕度60%之氛圍氣體中’使用高電阻計 (製品名:HIRESTA-UP,型號:MCP-HT45 0 (三菱化學 (股)製)),於施加電壓1 0 0V、3 0秒後測定塗層表面 固有電阻値。此表面固有電阻値若爲1Ε+11(Ω/〇)以 下,則判斷爲具有充分抗靜電性能。 (2 )水接觸角 於塗層表面滴下純水2 μ 1,滴下3秒後測定水接觸 角。測定係使用接觸角計(製品名:接觸角計,型號: CA-X (協和界面科學(股)製)),測定値若爲70。以 上,則判斷爲具有充分撥水性。 (3 )耐擦傷性 使用不織布(產品名:Bencotte,型號:Μ-3 (旭化 成纖維(股)製造),以約50g/cm2之荷重在塗膜表面來 回1 〇次’且以目視觀察表面損傷狀態,並以下列基準評 價對象性: 〇:無損傷 -33- 200916314 △:可確認之損傷在5條以上1 0條以下 X :可確認之損傷在1 〇條以上或塗層有白化 (4 )印字密著性(表1中記載爲「印字性」) 在塗層表面上壓印上壓印油墨(產品名:ΤΑΤ壓印油 墨,型號:速乾多目的型STSG-1紅色(Shachihata (股) 製造),且乾燥2分鐘。 隨後,在印字物上貼合賽璐吩黏著膠帶(註冊商標, 型號:CT-24 ( Nichiban (股)製造)),調濕 2分鐘 後,使用荷重評價試驗機(產品名:小型萬能荷重評價試 驗機,型號:MODEL 1308S,使用荷重單兀產品名:闻機 能數位推拉錶(push-pull gauge),型號:MODEL RX-1 (AIKOH工程(股)製造),在刹離速度〇.5m/分鐘下拉 除剝離賽璐吩黏著膠帶(註冊商品)並觀察印字物之剝 落,並以下列基準評價印字密著性: 〇:印字物沒有剝離 △:印字物有剝離 X :因排斥使印字物無法壓印 (5 )膠帶剝離力 將聚酯膠帶No31B (日東電工(股)製造)貼合在塗 層表面上,以2kg之滾筒來回1次使之密著,在23°Cx相 對濕度60%之氛圍氣體下進行調濕1小時。隨後’使用荷 重評價試驗機(產品名:小型萬能荷重評價試驗機,型 -34- 200916314 號:MODEL 1308S,使用荷重單元產品名:高機能數位推 拉錶’型號:MODEL RX-1 (AIKOH工程(股)製造), 測定剝離速度〇.3m/分鐘之剝離力。若剝離力之測定値在 3 00g/25mm以上,則判斷爲剝離力高。 (6 )霧濁値(霧濁價) 使用Siiga試驗機(股)製之霧濁測定機(製品名: TM雙臂方式自動霧濁電腦,型式:HZ-2 ),依據·!^-K7 1 3 6,測定霧濁値並依據下列基準評價。霧濁値越小者 透明性越優異。 〇:未滿 5 % ; △ : 5 %以上、未滿 10 % ; X : 1 0 %以 上 〈實施例2〜14、比較例1~10&gt; 除了使用表1所示之量(質量份)之(A)〜(D)成 分以外,餘與實施例1同樣,分別製作塗覆組成物。 各塗覆組成物以與實施例1同樣方法塗佈於基材表面 上,形成表1所示厚度之塗層而製作表面保護薄膜,對各 表面保護薄膜進行評價試驗,結果示於表1。表1中,一 倂顯示試驗評價結果及實施例1〜1 4及比較例1〜1 0中所調 配之(A)〜(D)成分之量、塗層厚度及α値。 &lt;比較例1 1〜1 8 &gt; 替代作爲導電性聚合物成分(A )所使用之Nagase -35- 200916314R5 R5 (wherein R5 is independently an alkyl group having 1 to 3 carbon atoms, and R6 is each independently a methylene group or a C 2 to 6 alkyl group, and R 7 is independently a hydroxyl group, an amine group, an epoxy group or The thiol group, η is an integer of 1 to 1 ,, and m is an integer of 1 to 20). As the organosiloxane which is preferably used, a compound wherein R7 is a hydroxyl group in the above formula (3). The organic oxime having a hydroxyl group at the terminal is generally excellent in compatibility with each component of the coating composition of the water-soluble or water-dispersible composition. Further, a compound in which R5 is a methyl group is preferably used in comparison with -18-200916314 in terms of availability. The organic oxirane used in the present invention may also be a mixture of the above organic oxirane of the formula and other oxiranes. Other oxoxanes may, for example, be alkyltrioxanes such as methyltrimethoxydecane, ethyltrimethoxydecanemethoxydecane, butyltrimethoxydecane, etc.; dimethyldimethoxydecane, diethyl Dialkyl dialkoxy decanes such as dimethoxy fluorenyl dimethoxy decane, diethyl diethoxy decane, dimethyl decane, etc.; octamethylcyclotetradecane oxirane . (Proportion of A, B, C, and D) The above (A), (B), (C), and (D) are included. In the following description, "(A) ~ (D) 夕 " (A), (B), (C) and (D)". The content ratio of the conductive polymer component (A) is usually from 1.2 to 20 parts by mass, preferably from 1.2 to 20 parts by mass, based on 100 parts by mass of the total mass of the component (D). If the content of the component (A) exceeds a part, the melamine resin (B) and the polyester resin (C) are insufficient, and the resulting coating may have reduced scratch resistance. The present invention is characterized in that the content of the conductive component (A) in the coating composition is set to satisfy the thickness of the layer of the conductive poly (A) with respect to the total mass of the components (A) to (D). The product (α) becomes 値6nm~l 5nm. When α値, sufficient antistatic property cannot be obtained, and if it exceeds 15 nm, [3] indicates that the compound, propyl trioxydecane, methylethylenedioxyoxygen, etc. have a ratio such as h" means (A) ~ parts by mass, ! The mass ratio of the proportion of the proportion of the polymer composition of 75 masses and the amount of the coating of less than 6 nm are -19-200916314. The coating becomes deteriorated in scratch resistance or transparency. In other words, in the present invention, by controlling the conductive polymer component (the content of A to a certain range regardless of the thickness of the coating layer, it is possible to obtain no antistatic property, antifouling property, scratch resistance, tape peeling force, Surface protection film with excellent balance such as imprintability. The ratio of (B), (C), and (D) is preferably the following. The total mass of melamine (B) and polyester resin (C) is relatively high. When the ratio of the polymer component (A) to 100 parts by mass is 400 parts by mass, a coating excellent in scratch resistance can be obtained. The polyester resin (C) is relatively good with respect to the melamine resin (B). When the ratio is 100 to 300 parts by mass, a layer excellent in scratch resistance can be obtained, and the organic siloxane (D) is preferably used with respect to the conductive polymer component (A melamine resin (B) and polyester resin (C). The ratio of the total mass of 100 parts is preferably from 0 · 1 to 1 · 0 parts by mass. The content of (D) is less than that of less than 1 part by mass, and if the water repellency of the obtained coating is insufficient, 1 · 〇质量份, the printing of the resulting coating or the lack of tape stripping. (Solvent) In the coating composition used in the present invention, it is preferred that the component (D) and other components described later are dissolved or dispersed in water or an agent. A water-soluble organic compound can also be a mixture of water and a water-soluble organic solvent. As for the water, it is only coated with a coating of 2000 parts by mass. 'Quality case, exogenous solvent soluble -20- 200916314 The organic solvent is preferably an alcohol such as methanol, ethanol, isopropanol or n-butanol. The solid content concentration in the coating composition is preferably from 1 to 10% by mass based on the total mass of the coating composition. More preferably, it is 1 to 5% by mass. (Other components) In the present invention, the coating composition may also contain a petroleum resin for printing ink. The petroleum resin may be exemplified by rosin resin, rosin ester resin, acrylic resin, Ester resin, cellulose resin, phenol resin, alkyl phenol resin, alkyd resin, olefin resin, bismuth resin, coumarone resin, xylene resin, alkyd resin or maleic acid modified rosin resin, rich Horse acid modification An acid modified product such as a scented resin or a cerium-modified rosin resin, a hydrogenated rosin resin, a hydrogenated product such as a hydrogenated terpene resin, or the like, which may be used alone or in a mixture of a plurality of kinds, and may be a natural product or a natural product. The purified product may also be a composite polymerized with a petroleum resin of dicyclopentadiene (DCPD) or C5 to C9 as a raw material. Among them, most of them are contained in a printing ink, preferably an alkylphenol resin or a rosin. The modified resin, or an acid-modified product thereof, or the like, is preferably an acid-modified alkylphenol resin or an acid-modified rosin resin in terms of water dispersibility. The average molecular weight of the petroleum resin is from 1,000 to 500,000. Preferably, it is 1000 0~100000. When the average molecular weight is less than 1,000, the adhesiveness of the petroleum resin becomes large, and the bite of the surface film is liable to occur. If it exceeds 500,000, the dispersibility of the coating composition is deteriorated. The softening point of the petroleum resin is preferably 5 〇 ° C to 2 00 ° C, more preferably l 〇 crc 〜 15 〇 t:. When the softening point is less than 5 (TC, the adhesion at room temperature becomes large at -21 to 1631614, and it becomes easy to cause the bite of the surface film. If it exceeds 20 ° C, the drying step after coating the coating composition is In the case where the petroleum resin is added in an amount of more than 5% by mass based on the total amount of the solid content in the coating composition, since the strength of the protective film is lowered, it is preferred that the total amount of the solid component in the coating composition is 0. In the present invention, the coating composition may contain particles which impart scratch resistance or slidability to the film. As the particles, the lifting force is inorganic particles or organic particles, and as the inorganic particles, for example, oxidation is carried out. Bismuth, alumina, zinc oxide, potassium oxide, calcium oxide, chromium oxide, antimony oxide, tungsten oxide, magnesium oxide, titanium oxide, antimony oxide, antimony oxide, cobalt oxide, iron oxide 'phosphorus oxide, oxidized fierce, tin oxide, a metal oxide such as indium oxide, cerium oxide, cerium oxide, calcium carbonate, carbonic acid clock, cerium carbonate, calcium citrate, calcium titanate, calcium sulfate, barium sulfate, or molybdenum sulfide, barium sulfide, tungsten sulfide, a composite of one or more of boron, nickel iodide, etc., and its hydrate, or kaolin, clay, talc, mica, bentonite, hydrotalcite, zeolite, pyrophyllite, carbon black, black lead, etc. Mineral particles. Examples of the organic particles include polyethylene, polypropylene, ketone resin, styrene resin, norbornene resin, fluororesin, polyacetal, guanamine resin, amidoxime resin, acrylic resin, Thermoplastic resin such as ester resin, polyfluorene, butyl diene resin, liquid crystal polymer, epoxy resin, xylene resin, oxime resin, diallyl phthalate resin, vinyl ester resin, oxime resin, furan resin , thermosetting resin such as quinone imine resin, urethane resin, maleic acid resin, melamine resin, urea resin, etc., natural product of poly-22- 200916314 cellulose, cellulose derivative, polyterpene resin, etc. The composition of one or more selected from the group consisting of a polymer and a derivative thereof may also be a mixture. The inorganic particles and the organic particles may be used singly or as a composite. The surface and the cost are preferably cerium oxide and clay. The shape of the particles is not particularly limited, and a spherical shape, a plate shape, a needle shape, a hollow shape, or an indefinite shape may be used, and it is preferably a spherical shape. The dispersibility is good, and it may be a surface treatment by a cationic surfactant, an anionic surfactant, an amphoteric surfactant, a nonionic surfactant, or an oxygen, fluorine, or the like. It is preferably 0.01 to 10/m, and the specific surface area is preferably 50 to 5 Å Om/g. If the average particle diameter is less than 〇.〇i#m or the specific surface area is less than 50 m2/g, the scratch resistance, The slidability imparting property is deteriorated, and it is easy to cause problems due to secondary aggregation. Further, when the average particle diameter exceeds 10 m or the specific surface area exceeds 500 m 2 /g, the optical properties of the film are deteriorated. The scratch resistance and slidability are exhibited. From the viewpoint of the nature, the amount of the particles added is preferably from 质量1% by mass to 5% by mass based on the total amount of the solid content in the coating composition. The coating composition may contain various surfactants which impart water dispersion stability and impart moisture to the substrate. The surfactant may, for example, be a cationic surfactant, an anionic surfactant, an ionic surfactant such as an amphoteric surfactant, a nonionic surfactant such as a fatty acid, a rhodium-based surfactant, or a fluorine-based interface. Active agent, fluorinated fluorine-based surfactant. In the coating composition, in addition to the above components, the ionic liquid, or the anti-plastic, rubber, emulsion, organic solvent, coating material may be used to the extent that the effect of the present invention is not impaired. An oxidizing agent, an anti-aging agent, a UV absorber, a flame retardant, a dye, a pigment, a slip agent, an antifungal agent, a plasticizer, a pH adjuster, a wetting agent, and the like. &lt;Adhesive layer&gt; In the present invention, an adhesive layer may be formed on the surface of the substrate opposite to the surface on which the coating layer is formed. In the surface protective film, the adhesive layer has a function of adhering the film to the surface of a member such as a polarizing plate. The adhesive contained in the adhesive layer is preferably an adhesive resin or a sulfonated polymer composed of a (meth)acrylic acid alkyl ester resin. The adhesive layer comprising a sulfonated polymer has a high antistatic property. The adhesive layer can be obtained by applying an adhesive composition containing the above adhesive resin component to a substrate and drying it. Hereinafter, the adhesive resin and the sulfonated polymer contained in the adhesive composition will be described. (Adhesive resin) The (meth)acrylic acid alkyl ester resin used as the adhesive resin is composed of a resin having adhesiveness as a main component of (meth)acrylic acid alkyl ester. As the alkyl (meth)acrylate, for example, methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, n-butyl (meth)acrylate, ( N-hexyl methacrylate, n-octyl (meth)acrylate, isooctyl (meth)acrylate, -24- 200916314 2-ethylhexyl (meth)acrylate, n-decyl (meth)acrylate, Isodecyl (meth)acrylate, n-decyl (meth)acrylate, n-dodecyl (meth)acrylate, lauryl (meth)acrylate, stearyl (meth)acrylate, etc. In particular, an alkyl (meth)acrylate having an alkyl group having 4 to 12 carbon atoms is preferred, and an alkyl (meth)acrylate having an alkyl group having 6 to 12 carbon atoms is more preferred. The alkyl (meth)acrylates may be used singly or in combination of two or more. In the present invention, the above-mentioned (meth)acrylic acid alkyl esters and other polymerizable monomers can be used as the adhesive resin. As the other polymerizable monomer, for example, an unsaturated carboxylic acid such as (meth)acrylic acid, crotonic acid, fumaric acid or isaconic acid or a salt thereof; an unsaturated carboxylic acid such as maleic anhydride or isocanic anhydride; Anhydrides; 2-methyl methacrylate, 2-hydroxypropyl (meth) acrylate, 3-methyl propyl methacrylate, 2-hydroxybutyl (meth) acrylate (meth)acrylic acid 3_ butyl butyl ester, 4-hydroxybutyl (meth) acrylate, etc. (meth) propylene acid basal ester; 2-methyl methacrylate Ethyl vinegar, (meth) propylene acid 2 methoxy propyl ester, (meth) acrylate 3 methoxy propyl vinegar, (meth) acrylate 2 methoxy butyl acrylate, (meth) acrylate (meth)acrylic acid alkoxyalkyl esters of 3-methoxybutyl vinegar, C methyl methacrylate 4 methoxybutyl acrylate; (meth) acrylonitrile, chloropropene susceptibility, ammoniated yttrium An amino group-containing monomer such as 2-cyanoethyl (meth)acrylate; (meth) acrylamide, Ν-methyl (meth) acrylamide, hydrazine, hydrazine-dimethyl ( Methyl) propylene Amine, hydrazine-hydroxymethyl (meth) acrylamide, hydrazine, hydrazine-di-methyl (meth) acrylamide, N-methoxymethyl-25- 200916314 (meth) acrylamide Monomers containing amidino group; vinyl esters such as vinyl acetate and vinyl propionate; halogenated vinyls such as vinyl chloride and vinylidene chloride; aromatic vinyl compounds such as styrene and methylstyrene a monofunctional monomer such as an unsaturated aliphatic hydrocarbon such as ethylene, butadiene or isoprene, or ethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, or glycerin Tris(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, methylenebis(meth)acrylamide, exoethyl bis(methyl) A polyfunctional monomer such as acrylamide or divinylbenzene. Among these, (meth)acrylic acid, (meth)acrylonitrile, etc. are preferable, and acrylic acid, acrylonitrile, etc. are preferable. These other polymerizable monomers may be used singly or in combination of two or more. The amount of the (meth)acrylic acid alkyl ester used in the production of the alkyl (meth)acrylate resin is preferably from 50 to 100% by mass, more preferably from 90 to 100% by mass, based on the total of the monomers. . Further, the weight average molecular weight of the (meth)acrylic acid alkyl ester-based resin (the same applies to the polystyrene according to the GPC method, the same applies hereinafter) is preferably 10 or more, more preferably 30 or more. . At this time, if the weight average molecular weight of the (meth)acrylic acid alkyl ester-based resin is less than 10,000, adhesion problems such as sticking residue may occur. Further, the glass transition point (hereinafter referred to as "Tg") of the (meth)acrylic acid alkyl ester-based resin is preferably from -8 〇 to -l 〇 ° C 'better than -80 to -3 (TC. -26 - 200916314 (sulfonated polymer) The sulfonated polymer contained in the adhesive layer can be exemplified by, for example, a sulfonate of a total of 1 ny = olefin polymer, or a sulfonate of a hydride of a conjugated diene polymer. a sulfonated conjugated diene polymer; a sulfonate of an aromatic vinyl polymer such as polystyrene; a sulfonate of a sulfonic acid group-containing monomer such as styrene sulfonic acid; The acidified aromatic vinyl polymer or the like is preferably a sulfonated conjugated diene polymer or a polystyrenesulfonic acid, preferably a sulfonated conjugated diene polymer. The olefin polymer can be obtained by sulfonating a polymer containing a conjugated diene monomer as a constituent unit or a hydride thereof (hereinafter, the polymer and the hydride are collectively referred to as a "conjugated diene-based basic polymer"). The conjugated diene monomer used in the conjugated diene base polymer is preferably a combination of carbon numbers 4 to 10. More preferably, it is a compound having a carbon number of 4 to 8, preferably a compound having a carbon number of 4 to 10. As the conjugated diene monomer, for example, 1,2-butadiene, 1,3-butadiene can be exemplified. 1,2-butadiene, 1,3-pentadiene, 2,3-pentadiene, isoprene, 1,2-hexadiene, 1,3-hexadiene, 1,4 -hexadiene, 1,5-hexadiene, 2,3-hexadiene, 2,4-hexadiene, 2,3-dimethyl-1,3-butadiene, 2-ethyl_ 1,3·butadiene, 1,2-heptadiene, 1,3-heptadiene, 1,4-heptadiene, 1,5-heptadiene, i,6-heptadiene, 2, 3-heptadiene, 2,5-heptadiene, 3,4-heptadiene, 3,5-heptadiene, cyclopentadiene, dicyclopentadiene, ethylidene norbornene, etc. In particular, it is preferably U3_butadiene or isoprene. These conjugated diene monomers may be used singly or in combination of two or more. Further, in the conjugated diene base polymer, Other polymerizable monomers exemplified as the polymerizable monomer of the alkyl (meth)acrylate may be used together with the conjugated diene monomer -27-200916314. In the conjugated diene base polymer, Conjugated diene monomer And other polymerizable monomers as needed, in the polymerization polymerization of free radical polymerization initiators such as hydrogen peroxide, benzophenone, azobisisobutyronitrile or n-butyl lithium, sodium naphthalate, sodium metal, etc. In the presence of a starting agent, a known solvent is usually used, and it is usually synthesized by polymerization at -10 Torr to +150 ° C, preferably at 〇 130 ° C. Further, as a conjugated diene-based base polymer, A partially or fully hydrogenated hydride which is one of the double bond moieties remaining in the conjugated diene base polymer may be used. This hydrogenation may use a known hydrogenation catalyst or a known method. However, the hydrogenation of the acidified ruthenium is produced. In the case of a second polymer, either hydrogenation or sulfonic acid may be carried out first. In the case of the copolymer, the conjugated diene-based base polymer may be a random copolymer or a block copolymer, and in the case of a block copolymer, an AB type, a ruthenium type, or the like may be used. Special restrictions. As the preferred conjugated diene base polymer, for example, poly-1,3-butadiene, polyisoprene, 1,3-butadiene/styrene random copolymer, 1, 3-butadiene-styrene diblock copolymer, styrene-1,3-butadiene-styrene ternary block copolymer, 1,3-butadiene-styrene-1,3- Butadiene ternary block copolymer, isoprene/styrene random copolymer, isoprene-styrene diblock copolymer, styrene-isoprene-styrene Metablock copolymer, isoprene-styrene-isoprene-28- 200916314 ternary block copolymer, hydride of these polymers, in addition to ethylene/propylene/conjugate a diene-based random copolymer, etc., among which, more preferably a 1,3-butadiene-styrene diblock copolymer, a styrene-butadiene-styrene ternary block copolymer ' 1,3-butadiene-styrene-1,3-butadiene ternary block copolymer, isoprene-styrene diblock copolymer, benzene-iso-iso-amyl - phenylethyl ternary block copolymer, isoprenoid-styrene-isoprene Or those ternary block copolymer having a hydride, etc. of the conjugated block copolymer or a hydride-based unit of a diene and an aromatic diene unit. The weight average molecular weight of the basic polymer of the conjugated secondary storage system is preferably 1,000 or more and more preferably 5,000 or more, more preferably 5,000 to 400,0 Å. At this time, if the average molecular weight of the conjugated diene base polymer is less than 1, the sulfonated conjugated diene polymer has a tendency to bleed out from the surface of the adhesive layer, causing the adhesion to change over time. On the other hand, if it exceeds 4 〇〇, 〇〇〇, there is a tendency to decrease productivity. The sulfonated conjugated diene polymer in the present invention can be obtained by sulfonating a double bond moiety in a conjugated dibasic unit in the conjugated di-based base polymer by using a sulfonating agent. This sulfonation reaction is such that the double bond of the conjugated diene unit is ring-opened to a single bond or the double bond is retained thereby to replace the hydrogen atom with a sulfonic acid (salt) group. Further, when another polymerizable monomer is used, for example, an aromatic vinyl-based unit may be sulfonated in addition to the conjugated diene unit. The content of the sulfonic acid (salt) group in the acidified conjugated diene polymer is usually 0.1 to ό mmol/g', preferably 〇5 to 5 mmol/g. At this time, if the content of the acid (salt) base of sulfonate -29- 200916314 is less than 0.1 millimoles per gram, the antistatic energy of the obtained adhesive composition is insufficient. On the other hand, when it exceeds 6 millimoles per gram. 'It is detrimental to the transparency of the resulting adhesive layer. The weight average molecular weight of the polystyrene sulfonate is preferably 1, more than 〇〇〇, more preferably 5,0 Å or more, and most preferably 5,000 to 4,000 Å. In this case, if the weight average molecular weight is less than 1,000', the polystyrene sulfonic acid bleeds out from the surface of the adhesive layer, and the adhesion tends to change over time. On the other hand, if it exceeds 400,000 Å, the productivity tends to decrease. In the present invention, the sulfonated polymer may be used singly or in combination of two or more. (Adhesive Composition) The adhesive composition used in the present invention may contain an adhesive resin and a sulfonated polymer in the following proportions. The blending ratio of the adhesive resin is preferably from 40 to 99.9% by mass, more preferably from 50 to 99.5 % by mass, based on the total amount of the adhesive resin and the sulfonated polymer, and the blending ratio of the sulfonated polymer is preferably It is 60 to 0.1% by mass, more preferably 50 to 〇_5% by mass. At this time, the amount of the adhesive resin is less than 40 mass. /. It is difficult to ensure sufficient anti-static energy. On the other hand, if it exceeds 99.9% by mass, it is difficult to ensure sufficient adhesion. In the present invention, the adhesive composition can be obtained by, for example, (a) mixing an adhesive resin with a sulfonated polymer' (b) polymerizing a monomer capable of obtaining an adhesive resin in the presence of an acid-extended polymer. The method is made, preferably the method of (b). In the adhesive group -30-200916314 obtained by the method (b), a composition in which an emulsion in which a sulfonated polymer and an adhesive polymer are composited is dispersed in an aqueous medium is preferred. The average particle diameter of the above emulsion is preferably from 60 to 500 nm, more preferably from 90 to 300 nm. At this time, if the average particle diameter of the obtained emulsion is less than 60 nm, the viscosity of the obtained adhesive composition becomes too high, and on the other hand, if it exceeds 500 nm, the adhesive strength tends to decrease. Further, the solid content (nonvolatile matter) of the adhesive composition is usually 10 to 70% by mass, preferably 20 to 60% by mass. This solid component can be adjusted by chasing the aqueous medium or by removing a portion of the aqueous medium. (Formation of Adhesive Layer) The above-mentioned adhesive composition can be applied on the surface opposite to the side on which the coated surface of the substrate is formed and dried to form an adhesive layer. In order to improve the adhesion between the substrate and the adhesive layer, the adhesive forming surface of the substrate may be subjected to a corona treatment or the like before the application of the adhesive composition. The thickness of the adhesive layer after drying can be appropriately adjusted depending on the use of the surface protective film, but it is usually 5 to 50 / / m, more preferably 10 to 30 μm. (Examples) Hereinafter, the present invention will be specifically described by way of examples, but the present invention is not limited to the examples. In the following description, the parts and % are based on mass unless otherwise specified. &lt;Example 1&gt; -31 - 200916314 (1) Preparation of coating composition The product name "DANATRON P502RG" manufactured by Nagase ChemteX (shares) having a solid content of 16.67 parts was added to a screw bottle at room temperature. As a conductive polymer component (a) 'Cymel 3 70" manufactured by CYTEC Industries Co., Ltd. of Japan, which has a solid content of 41.67 parts (isopropanol/isobutanol solution of methylated melamine formaldehyde resin, solid content concentration) 8 8 % ) As a melamine resin (B ), the product name "Vylonal MD-1480" (a saturated aqueous solution of a polyester resin, a solid content concentration of 25 % by mass) manufactured by Toyobo Co., Ltd. having a solid content of 4.67 parts is used. The polyester resin (C) and the product name "BY16-201" (hydroxyalkyl-terminated dimethyl oxyalkylene) manufactured by Toray Dow Corning Co., Ltd. having a solid content of 0.2 parts are used as the organic decane (D). And 79.68 parts of a mixed solvent of 50 parts of ion-exchanged water and 50 parts of isopropyl alcohol was added, and the mixture was stirred for 30 minutes to obtain a coating composition having a solid concentration of 3.0%. The composition of "DANATRON P5〇2RG" used as the conductive polymer component (A) is "polyethylenedioxythiophene/polystyrene sulfonate/polyester resin: 3 · 9 mass%, water: 9 6 · 1% by mass". The polyester resin contained in (A) is a polyethylene glycol terephthalic acid 5-sodium sulfonic acid isophthalic acid polycondensate. (2) Preparation of Coating The coating composition obtained in (1) was applied to a polyethylene terephthalate film (substrate) having a thickness of 38/zm using a bar coater at 140 ° C. After drying for 2 minutes, a 40 nm thick coating was formed to prepare a surface-32-200916314 protective film of the present invention. The α 値 of the obtained surface protective film was 6.6 5 nm. The obtained surface protective film was subjected to the following performance evaluation test, and the results are shown in Table 1. &lt;Performance evaluation test&gt; (1) Surface specific resistance 値 (described as "SR" in Table 1) In the atmosphere of 23 tx relative humidity of 60%, 'use high resistance meter (product name: HIRESTA-UP, model number) : MCP-HT45 0 (manufactured by Mitsubishi Chemical Corporation), the surface specific resistance 涂层 of the coating layer was measured after applying a voltage of 100 V for 30 seconds. If the surface specific resistance 値 is 1 Ε + 11 (Ω / 〇) or less, it is judged to have sufficient antistatic property. (2) Water contact angle 2 μ of pure water was dropped on the surface of the coating, and the water contact angle was measured after dropping for 3 seconds. The measurement was carried out using a contact angle meter (product name: contact angle meter, model: CA-X (Kyowa Interface Science Co., Ltd.)), and the measurement was 70. Above, it is judged that it has sufficient water repellency. (3) Non-woven fabric using scratch resistance (product name: Bencotte, model: Μ-3 (manufactured by Asahi Kasei Fibers Co., Ltd.), with a load of about 50 g/cm2 on the surface of the coating film 1 turn back and forth] and visually observing the surface damage State, and the objectivity is evaluated by the following criteria: 〇: no damage -33- 200916314 △: identifiable damage is 5 or more and 10 or less X: identifiable damage is above 1 〇 or the coating is whitened (4 ) Printing adhesion (described as "printing" in Table 1) Embossing the imprinted ink on the surface of the coating (product name: ΤΑΤ embossed ink, model: quick-drying multi-purpose STSG-1 red (Shachihata (share) ))), and dried for 2 minutes. Subsequently, the cymbal adhesive tape (registered trademark, model: CT-24 (manufactured by Nichiban)) was attached to the printed matter, and the load evaluation test was performed after conditioning for 2 minutes. Machine (product name: small universal load evaluation test machine, model: MODEL 1308S, use load weight single product name: singular digital push-pull gauge, model: MODEL RX-1 (AIKOH engineering (share) manufacturing) , at a braking speed of 5.5m/min The bell was pulled down to remove the adhesive tape (registered goods) and the peeling of the printed matter was observed, and the printing adhesion was evaluated on the following basis: 〇: the printed matter was not peeled off Δ: the printed matter was peeled off X: the printed matter could not be replaced by the exclusion Embossing (5) Tape peeling force The polyester tape No31B (manufactured by Nitto Denko Co., Ltd.) is attached to the surface of the coating, and is adhered to the 2kg drum one time, at a relative humidity of 60% at 23 ° C. The humidity was adjusted for 1 hour under ambient gas. Then, the load evaluation test machine was used (product name: small universal load evaluation test machine, type -34-200916314: MODEL 1308S, load cell name: high performance digital push-pull table type) : MODEL RX-1 (manufactured by AIKOH Engineering Co., Ltd.), the peeling force of the peeling speed 〇.3 m/min was measured. If the peeling force was measured at 3,000 g/25 mm or more, it was judged that the peeling force was high. (6) Fog Turbid turbidity (haze turbidity) Using a turbidity measuring machine made by Siiga test machine (product name: TM double-arm automatic fogging computer, type: HZ-2), according to ·!^-K7 1 3 6, The haze was measured and evaluated according to the following criteria. The smaller the haze, the better the transparency. 〇: less than 5 %; △: 5 % or more, less than 10%; X: 10% or more <Examples 2 to 14, Comparative Examples 1 to 10> In addition to use The coating composition was prepared in the same manner as in Example 1 except for the components (A) to (D) shown in Table 1. The coating compositions were applied in the same manner as in Example 1. On the surface of the substrate, a coating layer having a thickness shown in Table 1 was formed to prepare a surface protective film, and each surface protective film was subjected to an evaluation test. The results are shown in Table 1. In Table 1, the results of the test evaluation, the amounts of the components (A) to (D), the coating thickness, and α値 which were prepared in Examples 1 to 14 and Comparative Examples 1 to 10 were shown. &lt;Comparative Example 1 1 to 1 8 &gt; Instead of Nagase -35- 200916314 used as the conductive polymer component (A)

ChemteX (股)製之 DANATRON P502RG,使用 16_6 份以 下之抗靜電劑(a2 ) 、( a3 ) 、( a4 )或(a5 )以外,餘 與實施例1同樣分別製作塗覆組成物。各塗覆組成物以與 實施例1同樣方法塗佈於基材表面上,形成表1所示厚度 之塗層而製作表面保護薄膜,對各表面保護薄膜進行評價 試驗’結果示於表1。抗靜電劑(a2 ) 、( a3 ) 、( a4 ) 或(a5 )細節如下。 a2 :四級鉸陽離子系抗靜電劑(商品名:Elgan 264WAX ’日本油脂(股)製,固體成分濃度1〇〇質量 %) a3 :聚丙烯酸系四級銨陽離子系抗靜電劑(商品名: BONDEIP-PAioo ’ K0NISHI (股)製,固體成分濃度 3〇 質量% ) a4 :陰離子系抗靜電劑(商品名:CHEMISTATE 3500,三洋化成工業(股)製,固體成分濃度1〇〇質量 %) a5:聚吡咯系導電性聚合物(商品名:ρργΐ2,九菱 油化工業(股)製,固體成分濃度8質量%) 又’表1中’比較例1 1〜1 8中(A)之欄位中一倂顯 示抗靜電劑種類「( a2 ) 、( a3 ) 、( a4 )或(a5 )」及 其使用量(括弧內數値)。表1中,比較例1 1〜1 8之α欄 位及(A )〜(D )合計欄位中記載有*係表示(a )成分以 (a2) 、(a3) 、(a4)或(a5)置換所算出之値。 亦即’比較例1 1〜1 8中’表!中之(a )〜(D )合計 -36 - 200916314 之欄位的數値記載爲抗靜電劑(a2 ) 、( a3 ) 、( a4 )或 (a5)、與(B)〜(d)之總和。又’本說明書中,所謂 (B)〜(D)意指(b) 、(c)及(D)。 再者’比較例1 1〜1 8中,α欄位數値記載爲抗靜電劑 (a2) 、 (a3) 、 (a4)或(a5)相對於抗靜電劑 (a2 ) 、 ( a3 ) 、 ( a4 )或(a5 )、與(B )〜(D )之合 計量之質量比乘以塗層厚度所算出之値。 &lt;比較例1 9 &gt; 替代作爲有機矽氧烷(D)而使用之東麗道康寧 (股)製之商品名「BY1 6-201」(羥基烷基末端之二甲基 系氧烷)’而使用〇·2份之(d2 )氟樹脂(商品名: DICKGUARD NH-15’大日本油墨化學工業(股)製)以 外’餘與實施例1同樣,製作塗覆組成物。該塗覆組成物 以與實施例1同樣方法塗佈於基材表面上,形成表1所示 厚度之塗層而製作表面保護薄膜,對各表面保護薄膜進行 評價試驗,結果示於表1。 又’表1中,比較例1 9之(D )攔位中,意指使用上 述(d2) ’一倂示出其使用量(括弧內數値)。表1之比 較例1 9中α欄位及(A )〜(D )合計欄位中記載有*係表 示(D )成分以(d2 )置換所算出之値。 亦即,比較例19中’表1中之(a )〜(D )合計欄 位數値記載爲(A ) 、( B) 、( C )及(d2 )之總和。 再者’比較例19中,〇:欄位數値記載爲(a )成分相 -37- 對於(A) 、( B ) 、(C)及(d2)之合計量之質量比乘 以塗層厚度所算出之値。The DANATRON P502RG manufactured by ChemteX Co., Ltd. was prepared in the same manner as in Example 1 except that 16-6 parts of the antistatic agents (a2), (a3), (a4) or (a5) were used. Each of the coating compositions was applied to the surface of the substrate in the same manner as in Example 1 to form a coating layer having a thickness shown in Table 1 to prepare a surface protective film, and each surface protective film was subjected to an evaluation test. The results are shown in Table 1. The details of the antistatic agent (a2), (a3), (a4) or (a5) are as follows. A2: Four-stage hinged cationic antistatic agent (trade name: Elgan 264WAX 'Nippon Oils and Fats Co., Ltd., solid content concentration: 1% by mass) a3 : Polyacrylic acid quaternary ammonium cationic antistatic agent (trade name: BONDEIP-PAioo 'K0NISHI (stock), solid content concentration: 3% by mass) a4 : Anionic antistatic agent (trade name: CHEMISTATE 3500, manufactured by Sanyo Chemical Industry Co., Ltd., solid content concentration: 1% by mass) a5 : Polypyrrole-based conductive polymer (trade name: ρργΐ2, manufactured by Jiuling Oil Chemical Industry Co., Ltd., solid content concentration: 8% by mass) Further, in Table 1, 'Comparative Example 1 1 to 18 (A) One of the digits shows the type of antistatic agent "(a2), (a3), (a4) or (a5)" and its amount of use (inside the number of brackets). In Table 1, in the α field of Comparative Example 1 1 to 18 and the total field of (A) to (D), * indicates that the component (a) is (a2), (a3), (a4) or ( A5) Replace the calculated enthalpy. That is, 'Comparative Example 1 1~1 8' table! The number of the fields in (a) to (D) total -36 - 200916314 is described as antistatic agent (a2), (a3), (a4) or (a5), and (B) to (d). sum. Further, in the present specification, (B) to (D) mean (b), (c), and (D). In the 'Comparative Examples 1 1 to 18, the alpha column number 値 is described as an antistatic agent (a2), (a3), (a4) or (a5) with respect to the antistatic agents (a2) and (a3), The mass ratio of (a4) or (a5) and (B) to (D) is calculated by multiplying the thickness of the coating. &lt;Comparative Example 1 9 &gt; Instead of the product name "BY1 6-201" (hydroxyalkyl-terminated dimethyl oxyalkylene) manufactured by Toray Dow Corning Co., Ltd., which is used as the organic decane (D) In the same manner as in Example 1, except that the (d2) fluororesin (trade name: DICKGUARD NH-15' manufactured by Dainippon Ink Chemicals Co., Ltd.) was used, a coating composition was prepared. The coating composition was applied to the surface of the substrate in the same manner as in Example 1 to form a coating layer having a thickness shown in Table 1, and a surface protective film was prepared. Each surface protective film was subjected to an evaluation test, and the results are shown in Table 1. Further, in Table 1, in the (D) block of Comparative Example 19, it means that the amount of use (the number in parentheses) is shown using the above (d2)'. The ratio of Table 1 is shown in the α field and the total column (A) to (D) in Example 1 and the * indicates that the component (D) is replaced by (d2). That is, in the comparative example 19, the total number of columns (a) to (D) in Table 1 is described as the sum of (A), (B), (C) and (d2). In addition, in Comparative Example 19, 〇: the number of columns is described as (a) component phase - 37 - mass ratio of (A), (B), (C), and (d2) is multiplied by the coating. The thickness calculated by the thickness.

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CO σ&gt; OT 00 G&gt; σ&gt; CO 0 01 co σ&gt; co O) CO 一 Eo CO T— (O 寸· co cd 5 cb co cd co CO ίο cd CO — &lt;q cd CO «J1 &lt;q cd &lt;〇 cd 0 1 CO CSJ CO 0 1 CO CM CO o d CNJ CO CsJ CO o o CM CO CM CO £ &lt;b 5 CO »»-s cd s (0 /-~N 5 cb CSJ (D CO CO (0 £ €0 CO CO 5 CD f /-N 5 (£} V^1 ra CD cd s—✓ LO (C CO CD to (0 卜 co cd CM CO in CO 卜 CO &lt;Λ 〇 »— CSJ CO 寸 T— CM CO 寸 to &lt;〇 卜 00 σ&gt; o ▼— T~ CSi CO 寸 l〇 &lt;D r- 00 05 s m 闺 200916314 &lt;結果及考察&gt; (1 )關於比較例1〜4、1 1、13、15、1 7之表面保護 薄膜,其表面固有電阻値相當大而無法獲得充分抗靜電性 能。此認爲係比較例1〜4中a値爲2以下所致,由此,認 爲若控制(A )成分之量成爲α値爲6以上,則可獲得充 分抗靜電性能。 無法獲得充分抗靜電性能之比較例1 1、1 3、1 5、1 7 與可獲得充分抗靜電性能之比較例1 2、1 4 ' 1 6、1 8之比 較,前者之(D)成分量較多而後者之(D)成分較少。 然而,於實施例8中,雖與比較例11、13、15、17之 (D )成分量相同,但仍可獲得充分抗靜電性能。 實施例8與比較例11、13、15、17僅有使用具有聚 噻吩構造及電子接受性多元酸構造之導電性聚合物成分 (A )及使用其他抗靜電劑此點不同。由此認爲含有具有 聚噻吩構造及電子接受性多元酸構造之導電性聚合物成分 (A)可發揮充分之抗靜電性能。 (2) 比較例12、14、16之表面保護膜水接觸角爲未 滿70°,撥水性並不充分。 比較例12、14、16中,替代(A)成分而使用四級錢 陽離子系抗靜電劑或陰離子系抗靜電劑,認爲此係引起撥 水性降低之原因。 (3) 比較例1、3、5〜8、10、17、18之表面保護膜 耐擦傷性低。 比較例1、3之耐擦傷性低認爲係因爲α値小於6所 -39- 200916314 引起’因此,認爲(B)成分及(C)成分之合計質量相對 於(A)成分若少亦有影響。 比較例5〜8、1 〇之耐擦傷性低認爲係因爲α値大於i 5 所引起。 比較例1 7、1 8之耐擦傷性低認爲係使用聚吡咯系導 電性聚合物替代具有聚噻吩構造及電子接受性多元酸構造 之導電性聚合物成分(A )所引起。 (4) 實施例1〜14之表面保護薄膜之霧濁値低如未滿 5 % ’透明性優異。由此可謂本發明之表面保護薄膜可較好 地用於光學薄膜用途。 (5) 依據本發明,使用含有具有聚噻吩構造及電子 接受性多元酸構造之導電性聚合物成分(A )、三聚氰胺 樹脂(B)、聚酯樹脂(C)、及有機矽氧烷(D)之塗覆 組成物且控制成分(A)之量以使α値成爲6nm~15nm, 可提供具有抗靜電性 '耐擦傷性、膠帶剝離力以及印字密 著性均衡性優異之塗層之表面保護薄膜。 依據本發明,獲得上述塗層中,由於較好儘可能將含 有(A) 、( B ) 、( C ) 、(D)成分且控制成分(A)之 量以使Q:値成爲6nm〜1 5 nm之塗覆組成物對基材進行塗 佈,故不會耗費成本。 &lt;其他實施形態&gt; 本發明並不限定於上述記載以及圖式所說明之實施形 態’例如下述之實施形態亦包含於本發明範圍內。 -40- 200916314 (1 )上述實施例中,作爲導電性聚合物成分(A), 雖使用含有聚伸乙二氧基噻吩與聚苯乙烯磺酸鹽與聚醋之 組成物,但亦可使用聚噻吩與多元酸之共聚物或聚擴酸化 噻吩等。 (2)上述實施例中,雖顯示不具有黏著劑層之表面 保護薄膜,但在基材之與塗層形成面相反側之面上形成黏 著劑層者亦包含於本發明。 -41 -OS Z.91 inch /.95 S9_9 i9.9t 〇CJS 〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇o 〇XX 〇ο osos inch Oooo in o another LO o 5- 8 in § CNJ s LO og in o &lt;〇o CD oo OJ oogo CNJ CO go CO mso 00 mg inch O oo CM CM 〇〇〇〇〇〇〇〇〇〇〇〇 &lt; 〇〇〇〇〇〇〇〇X 〇X 〇X 〇X 〇X 〇X 〇〇〇〇〇〇〇〇〇〇〇&lt; 〇X 〇X 〇XXXX 〇X 〇〇〇〇〇〇XX 〇 ο σ&gt;σ&gt; τ- Ο) CM 05 CM 03 00 σ&gt; ss O) s p- o LO σ&gt; 5 CO Cf&gt; s % o CO σ&gt;σ&gt;σ&gt; r- JO CO σ&gt;tr&gt; CO CSJ CO CO &lt;〇cd T— 00 σ&gt; 〇s ο ιίι ° LU T— ο + Ui CO CO g ιίι pg + LU CNJ g + g LU sg LU CD g UJ CM csi g + UJ CSI g + Ui CO csi o + UJ cq T~~ o LU C£&gt; in UJ S to ιΐι CM CO LO + UJ CO CO in LU 〇&gt; cvj g + UJ g UJ p 1— g + UJ C^J g + Lli T— o LU so + m Csj in + c\iom S UJ o + UJ OJ LO + UJ C&gt;J o + 00 CO + m CSJ o UJ inch 05 o + o 00 g 5 sg § sggo § 〇o 〇o § o § § o LO g 〇l〇sg § § § § gggg § 00 &lt; 〇ο ο sdo CO &lt;D oosooodosoosoo § 00 &lt;£&gt; 〇soo CO &lt;〇ooo 5 o 〇5 sdo &lt;〇oosdo &lt;Ώ oosoooo Si oo CO oopoo Τ Ο o 00 CO oo * S oo ¥ CD CO o T-&quot; * soo * 00 &lt;〇oo * sdo * 00 CO oo * soo * 00 CO oo * 00 CO ο so 00 CO oso' oogo oo &lt;〇osoc〇o ' so 00 CO oso 〇S so write oso write oso CO oso ta oosso 00 (O oso 00 (D oso CO CO oso CO CD 〇so § o pen CSI &lt;〇s csi to 5 jz CO CO CO LO CO CO CO Ιο CO co CO ιο 异 CO LO 5S Csi CO s c&gt;j CO CO gas 55 CD 0 1 σ&gt; CO oo CO LO s 0 1 CO oo 00 lO s CNi to g csi CO CO CO C〇in CO CO CO m CO CO C〇m CO CO CO m CO CO CO in CO CO CO m CO 00 CO LO CO CO CO ιο CO CO CO in CSI CO t&lt; ssr_ 00 CO C&gt;i 0 1 0 1 0 1 0 1 &lt; 〇csj &lt;q CO 00 s 5 C6 CM ε 5 0 1 σ&gt; CO 0 1 σ&gt; S o cn 00 0 1 σ&gt; S ss 00 00 g 0 1 0 1 〇1 0 1 〇1 0 1 o 0 1 0 1 05 ps cd 05 q 00 σ&gt σ&gt; CD Cft σι LO 05 C7&gt; s σ&gt; — CO cp — — CO CO — CO CO cd § cd osc〇05 os CO 〇&gt; CO 05 lO CD CO σ> l〇g cb in s 00 o CO 05 00 CO σ &gt; σ &gt; 00 σ &gt; ? CO σ &gt; OT 00 G &gt; σ &gt; CO 0 01 co σ &gt; co O) CO - Eo CO T - (O inch · co cd 5 cb co cd co CO ίο cd CO — &lt;q cd CO «J1 &lt;q cd &lt;〇cd 0 1 CO CSJ CO 0 1 CO CM CO od CNJ CO CsJ CO oo CM CO CM CO £ &lt;b 5 CO »»-s cd s ( 0 /-~N 5 cb CSJ (D CO CO (0 £ €0 CO CO 5 CD f /-N 5 (£} V^1 ra CD cd s-✓ LO (C CO CD to (0 Bu co cd CM CO in CO 卜CO &lt;Λ 〇»—CSJ CO inch T— CM CO inch to &lt;〇卜00 σ&gt; o ▼— T~ CSi CO inch l〇&lt;D r- 00 05 sm 闺200916314 &lt;Results And investigation> (1) With respect to the surface protective films of Comparative Examples 1 to 4, 1 1, 13, 15, and 17, the surface specific resistance 値 is large and sufficient antistatic property cannot be obtained.In the comparative examples 1 to 4, it is considered that a 値 is 2 or less, and it is considered that if the amount of the component (A) is controlled so that α 値 is 6 or more, sufficient antistatic performance can be obtained. Comparative Example 1 in which sufficient antistatic property could not be obtained 1 , 1 3 , 1 5 , 1 7 Comparative Example 1 in which sufficient antistatic property was obtained 2, 1 4 '1 6 and 18, the former (D) component The amount is larger and the latter has less (D) components. However, in Example 8, although the amounts of the components (D) of Comparative Examples 11, 13, 15, and 17 were the same, sufficient antistatic properties were obtained. The eighth embodiment and the comparative examples 11, 13, 15, and 17 differ only in the use of the conductive polymer component (A) having a polythiophene structure and an electron-accepting polybasic acid structure, and the use of other antistatic agents. Therefore, it is considered that the conductive polymer component (A) having a polythiophene structure and an electron-accepting polybasic acid structure can exhibit sufficient antistatic properties. (2) The water contact angle of the surface protective film of Comparative Examples 12, 14, and 16 was less than 70 °, and the water repellency was not sufficient. In Comparative Examples 12, 14, and 16, a quaternary cation-based antistatic agent or an anionic antistatic agent was used instead of the component (A), and this was considered to cause a decrease in water repellency. (3) The surface protective films of Comparative Examples 1, 3, 5 to 8, 10, 17, and 18 have low scratch resistance. The low scratch resistance of Comparative Examples 1 and 3 is considered to be caused by α値 being less than 6-39-200916314. Therefore, it is considered that the total mass of the (B) component and the (C) component is also small relative to the (A) component. influential. The low scratch resistance of Comparative Examples 5 to 8, 1 is considered to be caused by α値 being larger than i 5 . Comparative Example 1 The low scratch resistance of 7 and 18 was considered to be caused by using a polypyrrole-based conductive polymer instead of the conductive polymer component (A) having a polythiophene structure and an electron-accepting polybasic acid structure. (4) The surface protective film of Examples 1 to 14 had a low haze of less than 5%, and was excellent in transparency. Thus, the surface protective film of the present invention can be preferably used for optical film applications. (5) According to the present invention, a conductive polymer component (A) having a polythiophene structure and an electron-accepting polybasic acid structure, a melamine resin (B), a polyester resin (C), and an organic decane (D) are used. The coating composition and the amount of the component (A) are controlled so that α値 becomes 6 nm to 15 nm, and the surface of the coating having excellent antistatic properties such as scratch resistance, tape peeling force, and printing adhesion can be provided. Protective film. According to the present invention, in the above coating layer, since it is preferable to contain the components (A), (B), (C), and (D) as much as possible and control the amount of the component (A) so that Q: 値 becomes 6 nm 〜1. The 5 nm coating composition coats the substrate and is therefore inexpensive. &lt;Other Embodiments&gt; The present invention is not limited to the above-described embodiments and the embodiments described in the drawings. For example, the following embodiments are also included in the scope of the present invention. -40- 200916314 (1) In the above embodiment, as the conductive polymer component (A), a composition containing poly(ethylenedioxythiophene), polystyrene sulfonate, and polyacetate may be used, but it may be used. A copolymer of a polythiophene and a polybasic acid or a poly(acidified thiophene). (2) In the above embodiment, the surface protective film having no adhesive layer is shown, but the adhesive layer is formed on the surface of the substrate opposite to the coating forming surface. -41 -

Claims (1)

200916314 十、申請專利範圍 1. 一種表面保護薄膜,其特徵爲具有: 基材,及 在上述基材之表面上之厚度爲20nm〜500nm 該塗層係使用含有具有聚噻吩構造及電子接受性 造之導電性聚合物成分、三聚氰胺樹脂、聚酯樹 機矽氧烷之組成物所形成, 其中上述導電性聚合物成分相對於上述組成 有之上述導電性聚合物成分、上述三聚氰胺樹脂 酯樹脂及有機矽氧烷合計質量之質量比與上述塗 層積爲6nm~15nm。 2. 如申請專利範圍第1項之表面保護薄膜, 組成物中,相對於上述導電性聚合物成分、上述 樹脂及上述聚酯樹脂之合計質量100質量份,上 氧烷之含有比例爲0.1〜1.0質量份。 3 ·如申請專利範圍第1或2項之表面保護薄 上述組成物中’相對於上述導電性聚合物成分 份’上述三聚氰胺樹脂與上述聚酯樹脂之合計質 爲400〜2000質量份。 4 ·如申請專利範圍第1或2項之表面保護薄 在與上述基材之形成有上述塗層之面相反側之面 著劑層。 5 ·如申請專利範圍第3項之表面保護薄膜, 上述基材形成有上述塗層之面相反側之面上形 之塗餍, 多元酸構 脂、及有 物中所含 、上述聚 層厚度之 其中上述 三聚氰胺 述有機石夕 膜,其中 100質量 量之比例 膜,其中 上形成黏 其中在與 成黏著劑 -42- 200916314 層。 6. 如申請專利範圍第1、2、5項中任一項之表面保護 薄膜,其中上述組成物中’上述導電性聚合物成分包含聚 伸乙二氧基噻吩與聚苯乙烯磺酸鹽。 7. 如申請專利範圍第3項之表面保護薄膜,其中上述 組成物中,上述導電性聚合物成分包含聚伸乙二氧基噻吩 與聚苯乙烯磺酸鹽。 8 .如申請專利範圍第4項之表面保護薄膜,其中上述 組成物中,上述導電性聚合物成分包含聚伸乙二氧基噻吩 與聚苯乙烯磺酸鹽。 9.如申請專利範圍第1、2、5、7、8項中任一項之表 面保護薄膜,其中上述組成物中,上述聚酯樹脂爲導入有 磺酸金屬鹽基之水分散性聚酯。 1 0 .如申請專利範圍第3項之表面保護薄膜’其中上 述組成物中,上述聚酯樹脂爲導入有磺酸金屬鹽基之水分 散性聚酯。 1 1 .如申請專利範圍第4項之表面保護薄膜’其中上 述組成物中,上述聚酯樹脂爲導入有磺酸金屬鹽基之水分 散性聚酯。 12.如申請專利範圍第6項之表面保護薄膜’其中上 述組成物中,上述聚酯樹脂爲導入有擴酸金屬鹽基之水分 散性聚酯。 -43- 200916314 七 明 說 單 簡 號 符 表 為代 圖件 表元 代之 定圖 指表 :案代 圖本本 表' ' 無 無 八、本案若有化學式時,請揭示最能顯示發明特徵的化學 式:無200916314 X. Patent Application Area 1. A surface protection film characterized by having: a substrate, and a thickness on the surface of the substrate of 20 nm to 500 nm. The coating layer is formed by using a polythiophene structure and electron acceptability. The conductive polymer component, the melamine resin, and the polyester tree oxime composition are formed, wherein the conductive polymer component is the conductive polymer component, the melamine resin ester resin, and the organic component described above. The mass ratio of the total mass of the decane is 6 nm to 15 nm with the above coating. 2. The surface protective film according to the first aspect of the invention, wherein the composition of the conductive polymer component, the total mass of the resin and the polyester resin is 100 parts by mass, and the content of the superoxane is 0.1 to 0.1%. 1.0 parts by mass. 3. The surface protection sheet according to claim 1 or 2, wherein the composition of the melamine resin and the polyester resin is 400 to 2000 parts by mass with respect to the conductive polymer component. 4. The surface protection sheet according to claim 1 or 2, wherein the surface layer is opposite to the surface of the substrate on which the coating layer is formed. 5. The surface protective film according to item 3 of the patent application, wherein the substrate is formed with a coating on the opposite side of the surface of the coating layer, a polybasic acid, and a thickness of the poly layer. Among the above melamines, the organic stone film, wherein 100 parts by mass of the film, on which the adhesive layer is formed in the layer with the adhesive-42-200916314. 6. The surface protection film according to any one of claims 1, wherein the conductive polymer component comprises a polyethylenedioxythiophene and a polystyrene sulfonate. 7. The surface protection film of claim 3, wherein the conductive polymer component comprises a polyethylene dioxythiophene and a polystyrene sulfonate. 8. The surface protection film of claim 4, wherein in the composition, the conductive polymer component comprises a polyethylene dioxythiophene and a polystyrene sulfonate. 9. The surface protection film according to any one of claims 1, 2, 5, 7, and 8, wherein the polyester resin is a water-dispersible polyester into which a metal sulfonate group is introduced. . 10. The surface protective film of claim 3, wherein the polyester resin is a water-dispersible polyester into which a metal sulfonate group is introduced. The surface protective film of claim 4, wherein the polyester resin is a water-dispersible polyester into which a metal sulfonate group is introduced. 12. The surface protective film of claim 6 wherein the polyester resin is a water-dispersible polyester into which an acid-expanding metal salt group is introduced. -43- 200916314 The seven-character single-character list is the map of the generation of the map. The table of the representative figure is the table of the case. ' 'Nothing is not eight. If there is a chemical formula in this case, please reveal the chemical formula that best shows the characteristics of the invention. :no
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US9715045B2 (en) 2013-09-30 2017-07-25 Lg Chem, Ltd. Optical film including functional coating layer and polarizing plate and image display device including same

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