TW201337471A - Mask unit, substrate processing apparatus, method for manufacturing mask unit and substrate processing method - Google Patents

Abstract

A substrate processing apparatus that forms a pattern of a mask held along a cylindrical surface on a photoresponse layer formed on a front surface of a substrate includes: a mask holding portion that includes a mask holding surface, which holds the mask along the cylindrical surface, and is rotatable around a predetermined axis; a revolving holding portion that includes a substrate holding surface, which comes in contact with and holds the substrate, and is revolvable around an axis substantially parallel to the predetermined axis; and a gap forming portion that forms a gap having a predetermined size between the mask holding surface and the substrate holding surface.

Description

Photomask unit, substrate processing apparatus, photomask unit manufacturing method, and substrate processing method

The present invention relates to a photomask unit, a substrate processing apparatus, a photomask unit manufacturing method, and a substrate processing method.

This application is based on the Japanese Special Request 2012-059070, which was filed on March 15, 2012, and the Japanese Patent Application No. 2012-084820, which was applied for on April 3, 2012, and the Japanese Special Purpose 2012, which was applied for on April 5, 2012. Priority is claimed on -086539 and its contents are incorporated herein.

In a large-screen display device such as a liquid crystal display device, a transparent material such as ITO (Indium Tin Oxides) or a semiconductor material such as Si is deposited on a flat glass substrate, and a metal material is deposited thereon, and a photoresist is applied. On the other hand, the circuit pattern is transferred, and the photoresist is developed after the transfer, and then etched, thereby forming a circuit pattern or the like. However, as the display element is enlarged, the glass substrate is increased in size, so that substrate transfer becomes difficult. Therefore, it has been proposed to form a display element on a flexible substrate (for example, a film member such as polyimide, PET, or metal foil, etc.), which is called a roll to roll method (hereinafter, abbreviated as The technique of "roller method" (for example, refer to Patent Document 1).

Further, Patent Document 2 proposes a technique in which a long sheet (substrate) which is close to the outer peripheral portion of the rotatable cylindrical mask and which is disposed to be wound around the transport roller and which is disturbed by the transfer is proposed. Thereby, the pattern of the reticle is continuously exposed on the substrate.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] International Publication No. 2008/129819

[Patent Document 2] Japanese Unexamined Publication No. Sho 60-019037

In order to expose the pattern of the photomask to the substrate with high precision, it is necessary to set the distance between the photomask and the substrate to an appropriate value. However, when the amount of the pitch deviates from an appropriate value, a predetermined pattern line width may not be obtained.

It is an object of the present invention to provide a substrate processing apparatus that can expose a pattern of a photomask to a substrate with high precision.

Further, when the photomask is in the form of a cylinder, it is difficult to form a precise pattern directly on the circumferential surface of the cylindrical base material, which is a cause of cost increase. In particular, when a pattern is formed on the inner circumferential surface of the cylindrical reticle, there is a fear that the cost is greatly increased and the pattern accuracy is lowered.

It is also an object of the present invention to provide a photomask unit, a substrate processing apparatus, a photomask unit manufacturing method, and a substrate processing method which are capable of suppressing an increase in cost and contributing to improvement in pattern accuracy.

Further, when the holding member for holding the mask pattern is different from the linear expansion coefficient of the supporting member that supports the holding member at a predetermined position with respect to the substrate, the holding member is applied by thermal expansion and contraction accompanying temperature change. The stress is such that it adversely affects the case where the holding member is formed of a relatively weak material such as glass. Further, when a stress is applied to the holding member, there is a possibility that the reticle pattern is also affected, and the transfer accuracy of the opposing substrate is also affected.

It is also an object of the present invention to provide a mask unit and a substrate processing apparatus which can suppress stress applied to a holding member that holds a mask pattern even when temperature fluctuation occurs.

A substrate processing apparatus according to an aspect of the present invention is a photo-sensing layer formed on a surface of a substrate by a pattern of a photomask held along a cylindrical surface, and a photomask holding portion provided along the cylinder Holding the reticle holding surface of the reticle and rotating around a predetermined axis; surrounding the holding portion, having a substrate holding surface contacting the holding substrate, and being wraparound about an axis substantially parallel to a predetermined axis; and a spacing forming portion, It forms a quantitative distance between the reticle holding surface and the substrate holding surface.

A reticle unit according to an aspect of the present invention includes a reticle holding portion that holds a reticle formed of a glass material as a holding target, and holds a reticle along the cylindrical surface on the circumferential surface, and is capable of being wound around The axis rotates and is formed of a glass material.

A substrate processing apparatus according to an aspect of the present invention includes the photomask unit of the above aspect and a substrate holding portion that holds a substrate on which a pattern of the photomask is formed.

A method of manufacturing a reticle unit according to an aspect of the present invention comprises the steps of: having a reticle holding portion that is rotatable about a predetermined axis along a circumferential surface of a cylindrical surface and formed of a glass material, and the glass material is made of the glass material The formed photomask is held on the circumferential surface.

A substrate processing method according to an aspect of the present invention includes the step of forming a pattern of a photomask on a substrate using a photomask unit manufactured by the photomask unit manufacturing method of the above aspect.

The reticle unit of one aspect of the present invention is mounted on a predetermined processing device, and is cylindrical or cylindrically rotatable about a predetermined axis by a rotational driving force; and has a cylindrical or cylindrical pattern. a retaining member that has a fixed radius along the distance axis and has a predetermined size of the circumferential surface retaining reticle pattern in the direction of the axis; a support member, and a pattern retaining member Physically coupled, and supporting the pattern holding member at a predetermined position of the processing device; and an expansion and contraction permitting portion that is connected in a physical manner of the support member and the pattern holding member to allow expansion and contraction of the axis direction of the pattern holding member The pattern holding member and the support member.

A substrate processing apparatus according to an aspect of the present invention includes the photomask unit of the above aspect and a substrate holding unit that holds the substrate of the transfer mask pattern.

In a substrate processing method according to an aspect of the present invention, a cylindrical mask is scanned and exposed to a surface of a substrate conveyed in a longitudinal direction, and the cylindrical mask is fixed along a predetermined center line. a peripheral surface of the radius is provided with a pattern for the electronic component and is rotatable; and the substrate processing method includes the step of holding the substrate contact in a surrounding driving portion surrounded by an axis disposed in parallel with the predetermined center line a substrate holding portion that moves, and the substrate is conveyed along the longitudinal direction; and an annular installation portion that is provided on both ends of the center line in a direction from the center line at a predetermined radius The cylinder cover is rotated around the center line while the peripheral surface of the substrate and the outer circumferential surface of the cylindrical mask are set at a predetermined short distance between the peripheral driving portion and the substrate holding portion.

According to an aspect of the invention, the pattern of the reticle can be exposed to the substrate with high precision.

Further, according to the aspect of the present invention, high-precision transfer exposure can be realized on the substrate by using a cylindrical mask pattern without causing an increase in cost.

Moreover, according to the aspect of the present invention, even when temperature fluctuation occurs, it is possible to suppress stress applied to the holding member holding the mask pattern, and it is possible to perform high-precision processing using the mask pattern.

10‧‧‧Lighting Department

11‧‧‧Substrate supply department

12‧‧‧Substrate recycling department

20‧‧‧Photomask Holder

21‧‧‧Inner tube

21a‧‧‧ Opening

22‧‧‧Main body (pattern holding member)

22a‧‧‧Photomask retaining surface (outer peripheral surface, peripheral surface)

23, 23A, 23B‧‧‧ Holder (annular part)

23a‧‧‧Binder (2nd expansion allowance)

23b‧‧‧Holding the outer perimeter

23c, 55‧‧‧ slot

24, 28‧‧‧ leaf springs (flexible absorption parts, elastic members)

24A, 24B‧‧‧ spacers

25‧‧‧Rotating body (pitch forming portion, supporting member)

25a‧‧‧Ink cylinder setting department

25b‧‧‧Bevel

26, 35, 42‧‧‧ air bearings

27‧‧‧Support table

30, DR5‧‧‧ impression cylinder body (substrate holding part, surrounding holding part, rotating cylinder)

30a‧‧‧ Hollow

31‧‧‧ substrate holding surface

32‧‧‧Rotary support

33‧‧‧ drive

34, 86‧‧‧ rotating shaft

36‧‧‧Terminal tube

37‧‧‧Fixed rod

39A‧‧‧Supply Department

39B‧‧‧Exporting Department

40‧‧‧Measurement Department

41‧‧‧ shifting department

43, 46‧‧‧ rails

44, 47‧‧‧ Drive Department

48‧‧‧ Displacement platform (2nd adjustment department)

50‧‧‧Measurement Department (Detection Department)

51A, 51B‧‧‧support members

52A, 52B‧‧ Guidance Department

53A, 53B‧‧‧ Air Cylinder (Energy Division)

54‧‧‧support wall

56‧‧‧Pedding Department

61‧‧‧Shift ring

61a‧‧‧Slope of the shifting ring

62‧‧‧Adjustment screw section (load assignment section)

62a‧‧‧Axis

62b‧‧‧The head of the rotating body

70‧‧‧ Sealing part (fixed part)

71, 72‧‧‧ Department

80‧‧‧Substrate support mechanism

81‧‧‧Belt (ring belt)

81a‧‧‧Support surface (substrate retention surface)

81b‧‧‧back

82‧‧‧With transport department

82a, 82b‧‧‧Transport roller

82e‧‧‧Driver (surround drive)

83‧‧‧Guide platform (fluid support)

83a‧‧‧Guide

84‧‧‧ Wheeling institutions

85‧‧‧Photomask drive roller (rotary part)

87‧‧‧ bearing

88‧‧‧ Lifting device (moving department)

89‧‧‧The supply department of the guiding platform

90‧‧‧Substrate transport department

100, 200, 300‧‧‧ substrate processing equipment

AX1‧‧‧Rotation axis (established axis)

AX2‧‧‧Rotation axis (2nd axis)

AX3‧‧‧ axis

M‧‧‧Photo Mask

MT‧‧‧ drive unit (1st adjustment unit)

Ma‧‧‧Photomask separation area

S, P‧‧‧ substrate

SM1, SM2, 31B‧‧‧ shims (correction section)

B‧‧‧Base section

R‧‧·guide roller

FM‧‧‧ indicator mark (indicator)

MM‧‧‧mask mark

MU, MU2‧‧‧ reticle unit

VC‧‧‧Sucking Department (fixed part)

SU‧‧‧Substrate holding unit

CONT‧‧‧Control Department

CONT2‧‧‧Upper control device

AL1, AL2, AM1, AM2‧‧‧ alignment microscope

X, Y, Z, θY‧‧ Direction

DX‧‧‧The distance between the axis of rotation AX1 and the axis of rotation AX2

The approximate middle position of the Cx‧‧ ‧ gap

R1‧‧‧ radius of the impression cylinder setting section

R2‧‧‧ radius of the substrate holding surface

R11‧‧‧The radius of the mask retaining surface

G‧‧‧ spacing

Mt‧‧‧The thickness of the mask

St‧‧‧ thickness of the substrate

Ta‧‧‧Contact range

Thickness of t1‧‧‧SM1

Thickness of t2‧‧‧SM2

Abutment surface of tf‧‧‧ shims SM1, SM2

FLX‧‧‧Flexing structure

T‧‧‧ Tangential direction

SYS‧‧‧ component manufacturing system

U1, U2, U3, U4, U5...Un‧‧‧Processing device

FR1‧‧‧ supply roller

FR2‧‧‧Recycling roller

DR1, DR3, DR4, DR6, DR7, DR8‧‧‧ drive roller

DR2‧‧‧ impression roller

EPC, EPC1, EPC2‧‧‧ edge position controller

Gp1‧‧‧ Coating Agency

Gp2‧‧‧Drying mechanism

HA1‧‧‧heating chamber

HA2‧‧‧Cooling chamber

DL‧‧‧relaxation

IU‧‧‧Lighting Agency

BT1, BT2, BT3‧‧‧ treatment tank

Fig. 1 is a front cross-sectional view showing the main part of a substrate processing apparatus according to a first embodiment.

2 is a cross-sectional perspective view of the substrate processing apparatus.

Fig. 3 is a detailed view of the main part of the end portion of the reticle holding portion.

Fig. 4 is a perspective view showing a leaf spring provided in the reticle holding portion.

Fig. 5 is an enlarged cross-sectional view showing the mask holding portion of the second embodiment.

Fig. 6 is a schematic cross-sectional view showing a substrate processing apparatus according to a second embodiment.

Fig. 7 is a perspective view showing the appearance of a substrate processing apparatus according to a third embodiment.

Fig. 8 is a partially enlarged view of the substrate processing apparatus.

Fig. 9 is a front cross-sectional view showing the main part of a substrate processing apparatus according to a fourth embodiment.

Fig. 10A is a partially enlarged view showing the end portion of the shims.

Fig. 10B is a partially enlarged view showing the end portion of the shims.

Fig. 10C is a partially enlarged view showing the end portion of the shims.

Figure 11 is a partial enlarged view of the abutting portion of the rotating body and the impression cylinder body.

Fig. 12 is a front cross-sectional view showing the main part of a substrate processing apparatus according to a fifth embodiment.

Fig. 13 is a schematic configuration diagram of a substrate processing apparatus according to a sixth embodiment.

Fig. 14 is a front cross-sectional view showing the main part of the substrate processing apparatus.

Fig. 15 is a schematic configuration diagram of a modification of the substrate processing apparatus.

Fig. 16 is a front cross-sectional view showing the main part of a substrate processing apparatus according to a seventh embodiment.

Figure 17 is a front view of a reticle unit constituting the substrate processing apparatus

Figure 18 is a partial enlarged view of the end of the reticle unit.

Fig. 19 is a view showing the configuration of a component manufacturing system.

Fig. 20 is a front cross-sectional view showing the main part of a modification of the substrate processing apparatus.

Fig. 21 is a front cross-sectional view showing the main part of a substrate processing apparatus according to an eighth embodiment.

Figure 22 is a cross-sectional perspective view of the substrate processing apparatus.

Figure 23 is a detailed view of the main part of the end portion of the reticle unit.

Fig. 24 is a perspective view showing a leaf spring provided in the reticle unit.

Fig. 25 is a view showing the details of the leaf spring.

Fig. 26 is a view showing a modification of the expansion/contraction permitting portion.

Fig. 27 is a view showing an example in which the peripheral speed of the outer peripheral surface of the mask is aligned with the peripheral speed of the outer peripheral surface of the substrate at the same speed.

(First embodiment)

Hereinafter, a first embodiment of a substrate processing apparatus according to the present invention will be described with reference to Figs. 1 to 4 .

1 is a front cross-sectional view showing a main portion of a substrate processing apparatus 100, and FIG. 2 is a cross-sectional perspective view showing a substrate processing apparatus.

The substrate processing apparatus 100 exposes a pattern of a flexible mask M to a strip-shaped substrate (for example, a strip-shaped film member) S, and the illumination unit 10 and the mask holding unit 20. The impression cylinder body (substrate holding portion, surrounding holding portion) 30 and the control portion CONT are configured as a main body. In the present embodiment, the vertical direction is the Z direction, and the direction parallel to the rotation axes of the mask holding portion 20 and the substrate supporting portion 30 is set to the Y direction, and is orthogonal to the Z direction and the Y direction. The direction is set to the X direction.

The illuminating unit 10 is configured to illuminate the illuminating area of the reticle M that is wound around the reticle holding unit 20, and to emit the illuminating light for the exposure in a straight tube type in the same manner as the fluorescent lamp. Alternatively, the illumination light is introduced from both ends of the cylindrical quartz rod, and the diffusion member is provided on the back side, and is housed in the inner space of the inner cylinder 21 supporting the mask holding portion 20.

The mask holding portion 20 includes a cylindrical holding portion main body 22, a holder 23 that is provided at each end portion of the holding portion main body 22 in the longitudinal direction, and a holder 23 that is attached to each holder via a leaf spring (elastic expansion/absorption unit) 24. A rotating body (pitch forming portion) 25 on the 23rd. The holding portion main body 22, the holder 23, the leaf spring 24, and the rotating body 25 are provided in an integrated state, and are respectively formed with through holes that communicate with the inner tube 21 in the direction of the rotation axis AX1.

The inner cylinder 21 is formed of a cylindrical ceramic material or metal having a slit-like opening 21a through which the illumination light from the illumination unit 10 passes, such as a cylindrical quartz that transmits illumination light. The holder main body 22 is formed with a mask holding surface 22a that holds the mask M along a cylindrical surface having a predetermined radius on the outer peripheral surface thereof. The holder 23 is formed of a metal material in an annular shape, and as shown in FIG. 3, the adhesive 23a which exhibits elastic adhesion properties after curing is adhered to the outer peripheral surface of the end portion of the holder main body 22. As a material for forming the holder 23, it is preferable to have the same coefficient of linear expansion as that of the holder main body 22. However, when the coefficient of linear expansion is poor, the holder 23 having a large coefficient of linear expansion is kept from the outer peripheral side. The holder body 22 is constructed so as not to exert a large load on the holder body 22 due to the difference in thermal expansion between the holder body 22 and the holder 23.

The rotor 25 has an impression cylinder installation portion 25a projecting around the rotation axis AX1 on the outer peripheral side, and the impression cylinder installation portion 25a is brought into contact with the outer circumferential surface of the impression cylinder body 30 (frictionally engaged), thereby rotating the body. 25 rotates about the axis AX1.

The outer diameter of the impression cylinder setting portion 25a is formed to be larger than the outer diameter formed on the outer surface of the mask M held on the mask holding surface 22a of the holder main body 22. Specifically, the outer diameter of the impression cylinder setting portion 25a is formed to be maintained at the impression cylinder body 30 when the impression cylinder installation portion 25a abuts against the outer circumferential surface of the impression cylinder body 30. As shown in FIG. 3, the upper substrate S and the mask M are formed at a predetermined distance G.

Further, the rotor 25 is rotatably supported in a non-contact manner with respect to the inner cylinder 21 via the air bearing 26 via the air bearing 26 in a non-contact manner. Therefore, the holding portion body 22, the holder 23, the leaf spring 24, and the rotating body 25 integrally rotate around the rotation axis line AX1.

The leaf spring 24 is a stretcher that absorbs the rotation axis AX1 of the holding portion main body 22, and is formed into a ring shape (annular shape) by, for example, a steel material as shown in Fig. 4 . As shown in FIG. 3, the leaf spring 24 is fixed to the rotating body 25 by a gap of a predetermined amount in the Y direction via a spacer 24A. Similarly, the leaf spring 24 is provided with a predetermined amount of clearance in the Y direction via the spacer 24B. It is set on the holder 23. The spacers 24A are disposed at substantially the same distance from the rotation axis AX1, and are disposed at equal intervals around the rotation axis AX1. The spacer 24B is disposed at a position spaced apart from the rotation axis AX1 by a distance from the spacer 24A, and is disposed at equal intervals in such a manner that the position around the rotation axis AX1 is between the spacers 24A.

Therefore, the holder 23 (holding body 22) connected via the leaf spring 24 The rotor 25 is configured to be integrally rotated in a direction of the rotation axis AX1 with a high degree of rigidity. In the direction of the rotation axis AX1, since the leaf spring 24 is easily elastically deformed, it is a combination of lower rigidity. Relative movement (inching).

The inner cylinder 21 is placed on the support base 27 which is provided in the direction in which the base portions B provided from the Y direction are spaced apart from each other via the leaf spring 28. The spring constant of the leaf spring 28 is based on the self-weight of the reticle holding portion 20 and the load applied to the impression cylinder body 30 via the rotator 25, that is, the impression cylinder setting portion 25a of the rotator 25 on the outer circumference of the impression cylinder body 30. Set by the frictional force when turning up. The illumination unit 10 is disposed in the inner space of the inner tube 21, and a slit-shaped opening portion 21a elongated in the Y direction is formed at a position opposite to the illumination light emission direction of the illumination unit 10 to allow illumination light to pass. (Refer to Figure 1 and Figure 2).

The impression cylinder body 30 is formed in a cylindrical shape that is rotated (surrounded) about a rotation axis AX2 that is parallel to the Y-axis and that is set on the -Z side of the rotation axis AX1. As shown in FIG. 2, a hollow portion 30a is provided inside and The setting of the moment of inertia is reduced. The outer peripheral surface of the impression cylinder body 30 is a substrate holding surface 31 that contacts the holding substrate S. The holding surface 31 is preferably a mirror-polished metal surface. However, in order to increase the frictional force with the substrate S and suppress the sliding, the rubber sheet and the resin sheet which are thinner in thickness may be coated over the entire circumference. By.

On both end faces of the impression cylinder body 30 in the Y direction, the rotation support portion 32 having a smaller diameter than the impression cylinder body 30 and coaxially protruding is rotatably supported by the base portion B around the rotation axis AX2. Further, in the present embodiment, the drive unit 33 that rotates the impression cylinder body 30 in synchronization with the mask holding unit 20 by rotationally driving the impression cylinder body 30 is provided.

The substrate S is formed to have flexibility. Here, the term "flexibility" refers to a property in which the substrate can be deflected without being broken or broken even if a force of a self-weight is applied to the substrate. Moreover, the property of being bent by the force of the degree of self-weight is also included in the flexibility. Further, the flexibility described above varies depending on the material, size, thickness, or environment such as temperature or humidity of the substrate. Further, as the substrate S, one strip-shaped substrate may be used, or a plurality of unit substrates may be connected to each other to form a strip shape.

As the substrate S, for example, a resin film or a foil such as stainless steel can be used. For example, the resin film may be a polyethylene resin, a polypropylene resin, a polyester resin, an ethylene-ethylene copolymer resin, a polyvinyl chloride resin, a cellulose resin, a polyamide resin, a polyimide resin, a polycarbonate resin, or a poly Materials such as styrene resin and vinyl acetate resin. The substrate S preferably has a small coefficient of thermal expansion to ensure that it does not change even if subjected to a thermal size of, for example, about 200 °C. For example, an inorganic filler may be mixed in the resin film to reduce the coefficient of thermal expansion. Examples of the inorganic filler include titanium oxide, zinc oxide, aluminum oxide, and cerium oxide. The dimension of the substrate S in the width direction (short side direction) is, for example, about 1 m to 2 m, and the dimension in the longitudinal direction (longitudinal direction) is formed to be, for example, 10 m or more. Of course, this size is only an example and is not limited thereto. For example, the dimension of the substrate S in the Y direction may be 1 m or less or 50 cm or less, or may be 2 m or more. Further, the dimension of the substrate S in the X direction may be 10 m or less.

Next, the operation of the substrate processing apparatus 100 having the above configuration will be described.

The mask holding portion 20 supported by the inner tube 21 and holding the mask M via the air bearing 26 applies the weight of the mask holding portion 20 to the impression cylinder body 30 via the impression cylinder setting portion 25a of the rotor 25. In the state of the load corresponding to the difference in the capacity of the +Z side (upper side) corresponding to the spring constant of the leaf spring 28, it abuts. Thereby, between the mask holding surface 22a and the substrate holding surface 31, that is, between the mask M and the substrate S, a predetermined distance corresponding to the outer diameter of the impression cylinder mounting portion 25a is formed. Further, when the load applied to the impression cylinder body 30 by the impression cylinder setting portion 25a is adjusted, it is replaced with a leaf spring 28 having a corresponding spring constant, or in the inner cylinder 21 and the support base 27. The leaf spring 28 may be provided in a state in which the spacer is inserted in advance, and may be replaced with a spacer corresponding to the load applied to the impression cylinder body 30 by the impression cylinder setting portion 25a.

Then, the impression cylinder body 30 is rotated about the rotation axis AX2 by the driving of the driving device 33, and the illumination light is irradiated from the illumination unit 10, and the holder M is transmitted through the opening portion 21a to move the mask M from the inner circumference side. illumination. With the rotation of the impression cylinder body 30, the substrate S wound around the substrate holding surface 31 of the impression cylinder body 30 is conveyed at a predetermined speed, and is brought into contact with the pressure via the impression cylinder installation portion 25a. The rotor 25 on the outer peripheral surface of the cylinder body 30 rotates. Thereby, the mask M held by the mask holding portion 20 and the substrate S move in synchronization with each other in a state of maintaining a predetermined proximity gap G. Next, the pattern image of the mask M illuminated by the illumination light is successively projected onto the projection area of the substrate S.

In this case, the peripheral speed at the position (diameter) at which the impression cylinder installation portion 25a is in contact with the substrate holding surface 31 is the same, and the mask holding portion is made to match the relative movement speed of the mask M and the substrate S as much as possible. 20 and the impression cylinder body 30 are based on the position (diameter) of the outer peripheral surface of the mask M and the position (diameter) of the outer peripheral surface of the substrate S, the thickness Mt of the mask M, and the thickness St of the substrate S, and the holding portion body 22 The ratio of the radius r11 on the mask holding surface 22a, the radius r2 on the substrate holding surface 31 of the impression cylinder body 30, and the like are adjusted.

Therefore, it is necessary to prevent the radius of the portion where the outer circumferential surface of the substrate holding surface 25a of the impression cylinder body 30 abuts and the radius of the portion of the holding substrate S as shown in FIG. The ground makes it different. Specifically, the position (diameter) in the Z direction in which the outer circumferential surface of the impression cylinder installation portion 25a abuts against the outer circumferential surface of the impression cylinder body 30 is set between the outer circumferential surface of the mask M and the outer circumferential surface of the substrate S. The middle periphery of the pitch G. Therefore, the radius of the outer circumferential surface portion of the impression cylinder body 30 that abuts against the outer circumferential surface of the impression cylinder installation portion 25a may be increased by about St+G/2 with respect to the radius r2. Therefore, for example, when the thickness St of the substrate S is 200 μm and the pitch G is 100 μm, the radius of the outer peripheral portion of the impression cylinder body 30 that abuts the outer peripheral surface of the impression cylinder setting portion 25a is only relative to The radius r2 can be increased by about 250 μm.

When the exposure processing described above is continuously performed, thermal expansion may occur in the holder main body 22 illuminated by the illumination light. The thermal expansion in the radial direction (circumferential direction) of the holding portion main body 22 is formed by a metal material and the linear expansion coefficient is larger than the linear expansion coefficient of the holding portion main body 22 by the holder 23 holding the holding portion main body 22 from the outer peripheral side. The retaining portion body 22 is not constrained, so that excessive stress is applied to the retaining portion body 22. Further, at this time, although the holding portion main body 22 and the holder 23 are thermally expanded in the direction in which they are separated, since the adhesive 23a has the elastic adhesive property, the holding member 23 can be prevented from being slack in the holding portion main body 22.

In the case where the linear expansion coefficient of the holder 23 is smaller than the linear expansion coefficient of the holding portion main body 22, it is preferable to adopt the configuration in which the holder 23 holds the holding portion main body 22 from the inner peripheral side, but even from the outer peripheral side The structure to be held can be elastically deformed by the above-mentioned adhesive 23a, and the stress applied to the holding portion main body 22 at the time of thermal expansion can be alleviated.

Further, in the thermal expansion of the direction of the rotation axis AX1 of the holding portion main body 22, the plate spring 24 is fixed at a portion fixed by the spacer 24A, and the portion fixed by the spacer 24B is elastic along the direction toward the rotating body 25. Deformation. Thus, the thermal expansion of the holding portion main body 22 is absorbed as the elastic deformation of the leaf spring 24, so that the holding portion 22 can be prevented from generating a large stress in the direction of the rotation axis AX1.

As described above, in the present embodiment, the rotating body 25 that is in contact with the outer circumferential surface of the impression cylinder body 30 by the impression cylinder installation portion 25a is rotated by the impression cylinder body 30, and is light-receivable. The exposure process is performed while the cover M and the substrate S are maintained at a predetermined distance. Therefore, in the present embodiment, it is possible to prevent variations in the image width of the pattern caused by the variation in the amount of distance between the mask M and the substrate S. The value of the pitch G can be changed according to the minimum size of the pattern (the pattern on the mask M) to be exposed on the substrate S, or the angular characteristic (the number of openings) of the illumination light from the illumination unit 10, etc., but the range is good, but It is in the range of several tens of μm to several hundred μm.

Further, in the present embodiment, the adhesive 23a having the elastic adhesive property is interposed between the holding portion main body 22 and the holder 23 in the radial direction, in the direction of the rotation axis AX1. The plate spring 24 is elastically deformed to alleviate the stress generated by the thermal expansion in the holding portion body 22, so that the deformation of the holding portion body 22 caused by the stress can be reduced, and the pattern formation of the opposing substrate S can be suppressed from being adversely affected. The case (deterioration of transfer loyalty, etc.).

In the case of the present embodiment, the rotor 25 is made of a metal material. However, if the thermal expansion of the material itself is large, the diameter (full circumference) of the impression cylinder setting portion 25a changes, so that it is preferable. It is set to a low thermal expansion metal (nickel steel, etc.) or a ceramic material set to a low thermal expansion rate.

(Second embodiment)

Next, a second embodiment of the substrate processing apparatus 100 will be described with reference to Figs. 5 and 6 . In the above-described first embodiment, the pitch forming portion is formed between the mask holding surface 22a and the substrate holding surface 31, and the rotating body 25 including the impression cylinder mounting portion 25a is exemplified. However, in the present embodiment, A case where a driving device that adjusts the position of the mask holding portion 20 with respect to the impression cylinder body 30 will be described. In the present embodiment, the rotation axes AX1 and AX2 are arranged on the same XY plane (the mask holding unit 20 and the impression cylinder body 30 are arranged side by side in the horizontal direction).

In the drawings, the same components as those in the first embodiment shown in FIGS. 1 to 4 are denoted by the same reference numerals, and their description is omitted.

FIG. 5 is an enlarged cross-sectional view of the mask holding portion 20.

The mask holding portion 20 includes a holding portion main body 22 and a holder 23A having a through hole having an axis of rotation AX1 as an axis and holding the holding portion body 22 from the inner peripheral side of the end portion on the +Y side via the adhesive 23a; the holder 23B a rotating shaft 34 having an axis of rotation AX1 as an axis and holding the holding portion body 22 from the inner peripheral side of the end portion on the -Y side via the adhesive 23a; and a terminal barrel 36 having a through hole having an axis of rotation AX1 as an axis, Further, the holder 23A is rotatably supported around the rotation axis line AX1 from the outer circumferential side via the air bearing 35. The mask holding portion 20 is rotationally driven independently of the impression cylinder body 30 by a driving device MT connected to the rotating shaft 34.

In the internal space of the holding portion main body 22, a fixing rod 37 extending in the Y direction is inserted through the through hole of the terminal barrel 36 and the holder 23A, and one end portion is fixed to the terminal barrel 36 by a fixing plate 38. The illuminating unit 10 is supported by the fixing rod 37, and the temperature adjusting medium is supplied from the supply unit 39A constituting the temperature adjusting device, and is discharged from the discharging unit 39B, thereby circulating the temperature adjusting medium, thereby being efficient. The temperature rise of the illumination unit 10 is suppressed, and the temperature of the internal space of the holder main body 22 is adjusted.

Further, in the substrate processing apparatus 100 of the present embodiment, the measurement unit 40 is provided as the pitch forming portion, and the distance between the mask holding surface 22a and the substrate holding surface 31 is measured, and the displacement portion 41 is provided. The mask holding portion 20 is displaced in the direction in which the holder main body 22 is separated from and adjacent to the impression cylinder body 30 in accordance with the measurement result of the measuring unit 40.

The measuring unit 40 is constituted by a microscope-equipped CCD camera or an optical focal length (height measuring) sensor supported on the fixing rod 37, and the holding portion body 22 on the substrate holding surface 31 of the impression cylinder body 30. The position of the opposite direction (here, the position in the X direction) is measured, and the distance between the mask holding surface 22a and the substrate holding surface 31 is measured, and the measured distance is output to the control unit CONT.

The shifting portion 41 is constituted by the driving portion 44, the driving portion 47, and the above-described control portion CONT that independently drives the driving portions 44, 47, wherein the driving portion 44 holds the rotating shaft 34 via the air bearing 42, and extends in the X direction. The disposed guide rail 43 drives the holder 23A in the X direction; the drive portion 47 holds the terminal barrel 36, and drives the terminal barrel 36 in the X direction along the guide rail 46 extending in the X direction.

As shown in FIG. 6, a plurality of measuring sections 50 are provided on the upstream side of the substrate S in the direction in which the substrate S is transported. The measuring sections 50 have the same configuration as the measuring section 40, and the alignment marks of the substrate S are measured. (alignment mark) (not shown). In the measurement unit 50 of the present embodiment, three measurement units are disposed at intervals in the transport direction of the substrate S, and three portions are disposed in the width direction of the substrate S in each portion (see FIG. 7). And output the measurement results to Control unit CONT.

In the substrate processing apparatus 100 having the above configuration, the control unit CONT controls the driving of the driving units 44 and 47 to be the same driving, based on the distance between the mask holding surface 22a and the substrate holding surface 31 measured by the measuring unit 40. The amount of the gap is adjusted by moving the mask holding portion 20 in a direction in which it is separated from and close to the impression cylinder body 30. Further, the control unit CONT can finely adjust the relative inclination of the rotation axis AX1 and the rotation axis AX2 by changing the driving amounts of the driving portions 44 and 47.

Further, based on the alignment mark position of the substrate S measured by the measuring unit 50, the control unit CONT measures the surface deformation or the like of the exposure region on the substrate S before the exposure processing in advance, and reflects it in the above-described pitch amount adjustment, or The relative tilt of the rotation axis AX1 and the rotation axis AX2 is adjusted.

As described above, in the present embodiment, in addition to the actions and effects similar to those of the above-described first embodiment, the mask holding portion 20 can be moved between the mask holding surface 22a and the substrate holding surface 31. The amount of pitch is adjusted to an arbitrary value. Therefore, in the present embodiment, even when the distance between the axis of the rotation axis AX1 and the rotation axis AX2 changes due to environmental changes such as temperature changes, or the diameter of the holder main body 22 or the impression cylinder body 30 fluctuates. When the thicknesses of the mask M and the substrate S are changed by a manufacturing lot or the like, the amount of the distance between the mask holding surface 22a and the substrate holding surface 31 can be easily adjusted to a predetermined amount. The pattern of the mask M can be exposed to the substrate S with high precision.

(Third embodiment)

Next, a third embodiment of the substrate processing apparatus 100 will be described with reference to Figs. 7 and 8 . In the second embodiment, the driving of the driving units 44 and 47 is controlled to move the mask holding unit 20, thereby adjusting the distance between the mask holding surface 22a and the substrate holding surface 31, that is, The distance between the outer peripheral surface of the mask M and the outer peripheral surface of the substrate S is G. However, in the present embodiment, the spacer portion is provided between the mask holding portion 20 and the impression cylinder body 30, and the pad portion is adjusted. Bit The example in which the distance between the mask holding surface 22a and the substrate holding surface 31 is adjusted will be described.

In the drawings, the same components as those in the second embodiment shown in FIG. 5 and FIG. 6 are denoted by the same reference numerals, and their description is omitted.

The terminal barrel 36 of the holder portion 22 shown in Fig. 7 provided at the end portion on the +Y side is supported by the support member 51A. The support member 51A is movably supported in a non-contact manner on the guide portion 52A that is extended in the X direction and provided on the base portion B. Further, the support member 51A is pressurized by energizing the -X side with a predetermined capacity by an air cylinder (energizing portion) 53A provided on the +X side. Similarly, the rotating shaft 34 on the -Y side of the holding portion main body 22 is supported by the supporting member 51B via the air bearing 42. The support member 51B is movably supported in a non-contact manner on the guide portion 52B that is extended in the X direction and provided on the base portion B. Further, the support member 51B is pressurized by energizing the -X side with a predetermined capacity by an air cylinder (energizing portion) 53B provided on the +X side.

The base portion B is provided at an interval in the Y direction, and is provided on the -X side of the region closer to the support guide portions 52A and 52B so as to protrude more toward the +Z side than the guide portions 52A and 52B and support the impression cylinder body. 30 support wall 54. A groove portion 55 extending in the Z direction is formed between each of the support members 51A and 51B and the support wall 54.

As shown in FIG. 8, the width of the groove portion 55 in the X direction is formed to gradually increase toward the +Z direction, and is formed to have a slight taper with respect to the YZ surface. More specifically, the side surface on the +X side of the support wall 54 (the side surface forming the -X side of the groove portion 55) is formed in parallel with the YZ plane, and the side surface on the -X side of the support members 51A, 51B (forming the groove portion 55) The side surface of the +X side is formed to be inclined with respect to a plane parallel to the YZ plane so as to gradually increase in distance from the side surface of the +X side of the support wall 54 in the +Z direction. In the groove portion 55, the pad portion 56 is movably inserted in the Z direction.

As shown in FIG. 7 , a driving device (first adjustment unit) MT that is connected to the rotating shaft 34 and rotates the mask holding portion 20 (that is, the mask M) via the rotating shaft 34 is provided in the Y The displacement platform (second adjustment unit) 48 that moves in the direction. The control unit CONT can move the mask holding portion 20, the mask M, and the driving device MT integrally in the Y direction by controlling the movement of the displacement stage 48.

In the substrate processing apparatus 100 having the above-described configuration, the inclined (tapered) surface of the supporting members 51A and 51B pressed in the −X direction by the air cylinders 53A and 53B abuts against the pad portion inserted into the groove portion 55. 56, the movement is restricted, thereby defining the position of the support members 51A, 51B in the X direction. The position at which the inclined surfaces of the support members 51A and 51B abut against the pad portion 56 fluctuates due to the position of the pad portion 56 in the Z direction. Therefore, by adjusting the position of the pad portion 56 in the Z direction, it is possible to define the position in the X direction in which the movement of the support members 51A and 51B is restricted and positioned.

In other words, in the present embodiment, by adjusting the position of the pad portion 56 in the Z direction, the positions of the mask holding portion 20 and the mask M supported by the support members 51A and 51B in the X direction can be adjusted. The amount of distance between the mask holding surface 22a and the substrate holding surface 31 (the distance G between the mask M and the substrate S) is adjusted. Further, the position of the pad portion 56 in which the support members 51A and 51B are moved in the Z direction may be different between the support member 51A and the support member 51B, and the light may be minutely adjusted in a plane parallel to the XY plane. The rotation axis AX1 of the cover holding portion 20 is inclined with respect to the Y axis.

In addition, the movement of the pad portion 56 in the Z direction in the present embodiment may be performed by a driving device such as a motor based on the measurement result of the measuring unit 50 under the control of the control unit CONT.

On the other hand, based on the position of the alignment mark of the substrate S measured by the measuring portion (detecting portion) 50, the control portion CONT is controlled based on the relative positional relationship between the mask M and the direction of the substrate S about the rotation axis AX1 (circumferential direction). The rotation of the driving device MT is performed to align the direction of the mask M and the substrate S about the rotation axis AX (circumferential direction). Further, the control unit CONT integrally integrates the mask holding unit 20, the mask M, and the driving device MT via the displacement stage 48, based on the relative positional relationship between the measured mask M and the axis of rotation AX1 (Y direction) of the substrate S. The Y direction (the direction of the rotation axis AX1) is moved, whereby the position of the mask M and the rotation axis AX1 of the substrate S is aligned.

As described above, in the present embodiment, in addition to the distance between the mask M and the substrate S, the relative position in the direction around the rotation axis AX1 and the relative position in the direction of the rotation axis AX1 can be easily adjusted.

Further, when adjusting the relative position of the mask M and the substrate S in the direction (circumferential direction) around the rotation axes AX1 and AX2, in addition to the method of controlling the driving of the driving device MT, for example, it may be configured as follows: An electromagnetic brake (generator brake) or the like is provided between the rotating portion such as the holding portion main body 22 or the rotating shaft 34 of the mask holding portion 20 and the fixed portions such as the supporting members 51A and 51B, and the holding portion is stopped by the action of the electromagnetic brake. The rotational force of the body 22 temporarily imparts a load to the load, and the rotational torque is lowered, whereby the relative position (angular position) of the reticle M in the direction around the rotational axis AX1 is adjusted with respect to the substrate S.

(Fourth embodiment)

Next, a fourth embodiment of the substrate processing apparatus 100 will be described with reference to Figs. 9 to 11 . In the above-described first embodiment, the impression cylinder mounting portion 25a of the rotor 25 is in contact with the impression cylinder body 30, and is formed between the mask holding surface 22a and the substrate holding surface 31, that is, In the present embodiment, a configuration in which the gap amount G is appropriately maintained according to the thickness St of the substrate S and the peripheral speeds of the mask M and the substrate S are aligned is described. .

In the drawings, the same components as those in the first embodiment shown in FIGS. 1 to 4 are denoted by the same reference numerals, and their description is omitted.

As shown in Fig. 9, the overall configuration of the present embodiment is the same as that of Fig. 1 described above. However, in the present embodiment, the circumferential surface of the impression cylinder body 30 in the Y direction or the pressure of the rotor 25 is applied. The shim sheets (correction portions) SM1 and SM2 having a predetermined thickness are formed in a ring shape on the outer circumferential surface of the cylinder mounting portion 25a.

As shown in FIG. 3 above, when the radius of the impression cylinder setting portion 25a of the rotating body 25 is r1, the radius of the substrate holding surface 31 of the impression cylinder body 30 is set to r2, and the mask holding surface 22a is used. The radius is set to r11, the thickness of the mask M is set to Mt, the thickness of the substrate S is St, and the predetermined distance between the mask M and the substrate S is G, and the axis of the rotation axis AX1 and the axis of rotation AX2 The distance DX is represented by the following formula (1).

DX=r11+Mt+G+St+r2‧‧‧(1)

Therefore, when the impression cylinder setting portion 25a is rotated on the substrate holding surface 31 of the impression cylinder body 30, the radius r1 of the impression cylinder setting portion 25a can be obtained by the following formula (2).

R1=DX-r2‧‧‧(2)

Therefore, when the values of the mask M, the substrate S, and the pitch G are determined, the radius r1 of the impression cylinder setting portion 25a can be a value obtained by the above equations (1) and (2).

However, for example, regarding the substrate S, there are cases where different thicknesses are used depending on batches and the like. This situation is not only present in the substrate S but also in the case of the mask M.

Therefore, in the present embodiment, the gap between the impression cylinder mounting portion 25a of the rotor 25 and the impression cylinder 30 is provided with a shim as a variation of the thickness of the correction substrate S, the mask M, and the like. Correction department.

In other words, as shown in FIG. 9, a shims (correction portion) SM1 is detachably provided on the outer circumferential surface of the impression cylinder installation portion 25a. Further, a shim (correction portion) SM2 is detachably provided at a position facing the impression cylinder setting portion 25a on the outer circumferential surface of the impression cylinder body 30. The shim sheet SM1 is detachably provided to the outer peripheral surface of the impression cylinder mounting portion 25a, and the shim sheet SM1 may be provided with a magnetic portion, and the mask holding portion 20 (the impression cylinder setting portion 25a) may be provided. The composition of the excitation part.

Specifically, a configuration in which a shims SM1 is formed of a magnetic material, a layer including a magnetic material such as a magnetic powder is formed on the entire surface or a part of the shims SM1, and an embossing cylinder may be formed by a magnet. The outer peripheral surface of the portion 25a is arranged on the impression cylinder A magnet is embedded in the outer peripheral surface of the portion 25a. As the magnet, a permanent magnet or an electromagnet can be disposed.

The shim sheet SM2 is detachably attached to the outer peripheral surface of the impression cylinder body 30, and the shim sheet SM2 is provided with a magnetic portion and the impression cylinder body 30 is provided with an excitation portion in the same manner as the shim sheet SM1. The composition.

The shims SM1 are provided over substantially the entire circumference of the outer peripheral surface of the impression cylinder setting portion 25a. Similarly, the shim SM2 is provided over substantially the entire circumference of the outer peripheral surface of the impression cylinder body 30 (substrate holding surface 31). More specifically, when the shim sheet SM1 is wound around the outer circumferential surface of the impression cylinder setting portion 25a, the gap is formed at the joint portion so as not to overlap the ends of the direction around the rotation axis AX1. A protrusion is formed in the diameter direction. Further, as shown in Fig. 10A, the both end portions in the circumferential direction of the shims SM1 are formed in a manner of a fixed width in a direction extending in a direction obliquely intersecting with respect to the rotation axis AX1, respectively, in the oblique direction of the same angle. .

With this configuration, even when the contact range Ta of the reticle holder 30 and the impression cylinder body 30 are rotated and the contact range Ta of the impression cylinder body 30 is moved, a part of the shims SM1 is always present in the contact range Ta. Therefore, fluctuations in the amount of the gap, vibration, and the like are generated when the reticle holding portion 20 and the impression cylinder body 30 are rotated by the step of the gap. Further, the configuration of the end portion forming the gap is also the same for the shims SM2.

As described above, in order to maintain the distance G between the mask M and the substrate S shown in FIG. 11, the thicknesses of the shim sheets SM1, SM2 are set according to the thickness of the substrate S or the mask M, respectively. In this case, the radius r1 of the impression cylinder setting portion 25a is set to be smaller than the distance from the outer circumferential surface of the impression cylinder body 30 so that the shims SM1 and SM2 can be provided.

Therefore, when the thicknesses of the shim sheets SM1 and SM2 are t1 and t2, respectively, the inter-axis distance DX between the rotation axis AX1 and the rotation axis AX2 is expressed by the following formula (3).

DX=r1+r2+t1+t2=r11+Mt+G+St+r2‧‧‧(3)

According to the formula (3), the total thickness of the shims SM1, SM2 is represented by the following formula (4).

T1+t2=r11+Mt+G+St-r1‧‧‧(4)

Further, for example, when the thickness St of the substrate S is changed to (St + α), the total thickness of the shims SM1, SM2 is set to t1 + t2 + α, even if the thickness of the substrate S is generated. In the case of a change, the gap amount G can also be kept constant.

However, the peripheral speeds of the mask holding portion 20 and the impression cylinder body 30 are the same at positions (distances from the rotation axes AX1 and AX2) on the abutting faces tf of the shim sheets SM1, SM2, and are located at positions separated from the positions. The peripheral speed of the surface of the upper mask M (hereinafter referred to as the mask surface) and the peripheral speed of the surface of the substrate S (hereinafter referred to as the substrate surface) vary depending on the distance between the respective faces from the rotation axes AX1 and AX2. Therefore, the thickness of each of the shim sheets SM1 and SM2 must be set so that the relative peripheral speeds of the mask surface and the substrate surface are the same.

For example, the thickness of the substrate S in which the change is generated is St' (= St + α), and the thicknesses of the shim sheets SM1 and SM2 corresponding to the thickness St' of the substrate S are respectively set to T1 and T2, and the light is set. The angular velocity of the cover holding portion 20 is set to ω1, and the angular velocity of the impression cylinder body 30 is set to ω2. As described above with reference to FIG. 3, the outer peripheral surface of the reticle M and the substrate S are located at the position of the abutting surface tf. When the outer peripheral surfaces, that is, the gaps G are substantially in the middle, the peripheral speeds on the abutting surfaces tf are the same, and the following formula (5) is established.

(r1+T1). Ω1=(r2+T2). Ω2‧‧‧(5)

Further, since the peripheral speed of the mask surface is set to be the same as the peripheral speed of the substrate surface, the following formula (6) is established.

(r11+Mt). Ω1=(r2+St'). Ω2‧‧‧(6)

When the above formulas (5) and (6) are arranged, the following formula (7) is derived.

(r2+T2)/(r1+T1)=(r2+St')/(r11+Mt)‧‧‧(7)

Further, according to the formula (4), the following formula (8) is established.

T1+T2=r11+Mt+G+St'-r1‧‧‧(8)

Therefore, in the present embodiment, by using the thickness satisfying the formulas (7) and (8) When the thicknesses of the substrate S are changed, the shims SM1 and SM2 of T1 and T2 can maintain the distance between the outer peripheral surface of the mask M and the outer peripheral surface of the substrate S while the outer circumference of the mask M is maintained. The surface is corrected in the same manner as the peripheral speed of the outer surface of the substrate S. Further, in the present embodiment, since the shim sheets SM1 and SM2 are respectively magnetically attached to the impression cylinder mounting portion 25a and the impression cylinder body 30, the thickness of the substrate S or the mask M can be easily changed in accordance with the change in thickness. By replacing it, it is possible to improve work efficiency. Further, in the present embodiment, since the gap between the end portions of the shim sheets SM1 and SM2 extends in the direction intersecting the directions of the rotation axes AX1 and AX2, it is possible to prevent the variation in the distance due to the step difference during the rotation or Vibration, so that high-precision exposure processing can be performed.

Further, although the configuration in which the end portions of the shims SM1 and SM2 in the fourth embodiment are formed in the oblique direction is exemplified, the present invention is not limited thereto, and at least a part of the gap between the ends is along the rotation axis. The directions in which the AX1 and AX2 directions intersect may be formed. For example, as shown in FIG. 10B, the gaps may be formed such as a gap along the rotation axes AX1 and AX2 and a gap orthogonal to the rotation axes AX1 and AX2. Repeat the steps.

Further, even when the gap between the end portions is formed along the rotation axes AX1, AX2, as shown in Fig. 10C, the configuration may be such that the position of the gap is different in the direction around the rotation axes AX1, AX2. In the manner, a plurality of shims are arranged in the direction of the rotation axes AX1 and AX2.

Further, in the above-described embodiment, an example has been described in which the thicknesses of the shim sheets SM1 and SM2 are set so that the relative peripheral speeds of the mask surface and the substrate surface are the same. However, for example, the thickness of the substrate S is changed to an allowable range. In addition, the thickness of any one of the shims SM1 and SM2 may be fixed, and only the thickness of the other shims may correspond to the replacement of the shims. Further, in the case where the thickness of the substrate S or the mask M does not largely change, it may be configured to fix the shims of the desired thickness by the adhesive during the adjustment between the initial adjustments.

Further, for example, when the substrate S is stretched in the transport direction in the previous step, The thickness distribution of the shim sheets SM1 and SM2 can also be adjusted to intentionally impart a difference to the peripheral speed of the outer peripheral surface of the mask M and the outer peripheral surface of the substrate S in order to correct the expansion and contraction of the substrate S.

Here, the thickness St of the substrate S in FIG. 11 is set to 100 μm, the pitch G is set to 100 μm, and the radius (r1+t1) of the impression cylinder setting portion 25a including the thickness t1 of the shims SM1 is set. The radius (r2+t2) of the impression cylinder body 30 including the thickness t2 of the shims SM2 is set to 150 mm, and when the peripheral speed V0 on the abutting surface tf is set to 50 mm/s, Under the condition that the abutting surface tf is located at the middle (1/2) of the pitch G, the outer peripheral surface of the mask M and the outer peripheral surface of the substrate S are kept at a pitch G, and both sides become peripheral speeds of 49.983 mm/s, and thus the relative speed. The difference is zero.

Depending on where the position (Z direction) of the abutting surface tf is set within the spacing G, a slight difference in peripheral speed is generated, so that the circumferential dimension of the pattern exposed on the substrate S can be made relative to the mask M. The circumferential dimension of the pattern expands and contracts within a certain range. In the case of the above numerical example, when the dimension in the circumferential direction of the pattern on the mask M is 750 mm, the size of the pattern in the pattern exposed on the substrate S can be stretched by a maximum of about ±500 μm.

The stretching correction of the exposure pattern is also referred to as a relative magnification correction in the scanning exposure direction (the transport direction of the substrate S), and is accurate for the base pattern formed on the resin substrate S having a large physical elasticity. In the case of overlapping exposure, faithful pattern transfer in accordance with the base pattern can be performed by actively utilizing the relative magnification correction.

(Fifth Embodiment)

Next, a fifth embodiment of the substrate processing apparatus 100 will be described with reference to Fig. 12 .

In the fourth embodiment, the thickness of the shim sheets SM1 and SM2 is adjusted to adjust the thickness of the substrate S or the like. However, in the present embodiment, the rotor 25 is elastically deformed in the radial direction. The configuration in which the thickness of the substrate S or the like is changed will be described.

In the same figure, the same components as those in the fourth embodiment shown in FIG. 9 to FIG. 11 are denoted by the same reference numerals, and their description is omitted.

As shown in FIG. 12, in the substrate processing apparatus 100 of the present embodiment, the impression cylinder setting portion 25a of the rotating body 25 is provided between the holder 23 holding the end portion of the holding portion main body 22 and the rotating body 25. The shifting ring 61 on which the outer peripheral surface is displaced. The shift ring 61 is provided with a projection which is formed on the side opposite to the rotor 25 about the rotation axis line AX1, and has a slope 61a which is gradually enlarged in diameter as being separated from the rotor 25. Further, the rotor 25 is provided with a slope 25b that is fitted to the slope 61a from the outside. Further, the adjustment is performed in the direction of the rotation axis AX1 from the head 62b of the rotor 25 opposite to the shift ring 61, and the shaft portion 62a screwed to the shift ring 61 about the axis parallel to the rotation axis AX1. The screw portion (load applying portion) 62 is provided at a plurality of points at equal angular intervals along a circle parallel to the XZ plane centered on the axis AX1. In the present embodiment, the impression cylinder mounting portion 25a is brought into contact with the substrate holding surface 31 of the impression cylinder body 30, and the mask holding portion 20 and the impression cylinder body 30 are rotated.

In FIG. 12, when the distance between the mask holding surface 22a and the substrate holding surface 31 (the amount of distance G between the mask surface and the substrate surface) is adjusted, for example, the adjusting screw 62 is screwed to the shaft portion 62a to be displaced. The direction in the ring 61 rotates. Since the head portion 62b of the adjusting screw 62 is engaged with the shift ring 61, the shaft portion 62a is elastically deformed so as to expand in the axial direction parallel to the rotation axis AX1 by screwing into the shift ring 61. The elastic restoring force of the shaft portion 62a acts on the rotating body 25 via the head portion 62b as a load in a direction close to the shift ring 61.

Since the rotating body 25 to which the load in the direction close to the shift ring 61 is applied is moved in the direction in which the inclined surface 25b is expanded along the inclined surface 61a of the shift ring 61, the load is closer to the direction of the shift ring 61. The direction of the diameter expansion is converted to elastically deform the impression cylinder setting portion 25a to expand the diameter. By increasing the diameter of the impression cylinder setting portion 25a, the amount of distance between the mask holding surface 22a and the substrate holding surface 31 (the amount of distance G between the mask surface and the substrate surface) can be increased in accordance with the amount of diameter expansion. When the amount of the diameter expansion is too large, the amount of elastic deformation of the shaft portion 62a is reduced by rotating the adjustment screw 62 in the opposite direction, and the direction of the rotor 25 is close to the shift ring 61. The load is reduced, whereby the amount of expansion of the impression cylinder setting portion 25a is reduced.

Thus, in the present embodiment, by adjusting the screw 62, it is possible to The amount of expansion of the impression cylinder setting portion 25a is adjusted by the angle of the load and the inclined surfaces 61a and 25b in the direction close to the shift ring 61, so that the distance between the mask holding surface 22a and the substrate holding surface 31 can be easily made ( The distance G between the mask surface and the substrate surface is adjusted to a desired value.

Further, when the diameter of the impression cylinder setting portion 25a is enlarged by the rotation of the adjusting screw 62, as shown in FIG. 11 above, the abutting surface tf and the outer peripheral surface of the mask M are in the Z direction (diameter direction). There is a change in the interval between the outer peripheral surface of the mask M and the outer peripheral surface of the substrate S. Therefore, it is preferable to determine the diameter of the impression cylinder setting portion 25a in consideration of this. Expand the amount.

Further, the rotation of the adjusting screw 62 described in the fifth embodiment may be configured such that a rotation driving device is additionally provided, and the amount of rotation of the adjusting screw 62 is controlled via the rotation driving device in accordance with the amount of adjustment between the distances. Further, as a method of expanding the diameter of the impression cylinder mounting portion 25a, in addition to the adjustment screw 62, a piezoelectric element such as a piezo element may be used to apply a load in the direction of the rotation axis AX1 to the rotor 25. Composition. Further, in addition to the above-described configuration in which the load in the direction of the rotation axis AX1 is converted into the load in the radial direction, the piezoelectric element may be provided so as to be displaced in the radial direction, and the impression cylinder may be made according to the displacement amount of the piezoelectric element. The installation portion 25a is configured to expand or reduce the diameter.

(Sixth embodiment)

Next, a sixth embodiment of the substrate processing apparatus 100 will be described with reference to Figs. 13 and 14 .

In the above-described first to fifth embodiments, the configuration in which the substrate S in the exposure region is held on the outer circumferential surface 31 of the impression cylinder body 30 has been described. However, in the present embodiment, the endless belt is used. The configuration in which the substrate S is held in a planar shape will be described.

In the drawings, the same components as those of the above-described embodiments shown in FIGS. 1 to 12 are denoted by the same reference numerals, and their description is omitted.

The substrate processing apparatus 100 of the present embodiment includes a substrate supply unit 11 that supplies the substrate S, a substrate collection unit 12 that collects the substrate S, and a substrate transfer unit 90 that transports the substrate S. The substrate supply unit 11 feeds and feeds the substrate S wound up, for example, in a roll shape. In this case, the substrate supply unit 11 is provided with a shaft portion that winds the substrate S or a rotation driving device that rotates the shaft portion. Moreover, it is also possible to provide a cover portion or the like which covers the substrate S wound in a state of, for example, a roll. Further, the substrate supply unit 11 is not limited to a mechanism for feeding the substrate S wound in a roll shape, and may be any mechanism that includes the strip-shaped substrate S sequentially delivered along the longitudinal direction thereof.

The substrate collecting unit 12 winds the substrate S subjected to the exposure processing, for example, in a roll shape, and collects it. Similarly to the substrate supply unit 11, the substrate collection unit 12 is provided with a rotation drive source for winding the shaft portion of the substrate S or rotating the shaft portion, a cover portion covering the recovered substrate S, and the like. In the case where the substrate S is cut into a panel shape in the substrate collecting portion 12, for example, the substrate S may be collected in a state of being overlapped, and the substrate S may be collected in a state different from the state in which the substrate S is wound into a roll. Composition.

The substrate transport unit 90 includes a plurality of guide rollers R (two in FIG. 13) that guide the substrate S supplied from the substrate supply unit 11 and a substrate support mechanism 80 that supports the substrate S. The substrate supporting mechanism 80 is disposed between the guide rollers R.

The substrate support mechanism 80 has a belt portion (annular belt) 81, a belt conveyance portion 82, and a guide platform (fluid support portion) 83. Further, although not shown in the drawings, the substrate supporting mechanism 80 is provided with a cleaning unit for cleaning the belt portion 81 and a static electricity removing portion for removing the static electricity of the belt portion 81.

The belt portion 81 is formed in a ring shape using, for example, a metal material such as stainless steel.

The belt portion 81 supports the substrate S from the back side by a support surface (substrate holding surface) 81a provided on the outer side. A plurality of through holes (not shown) arranged in the circumferential direction are provided on the belt portion 81 over the entire circumference. Each of the through holes is formed between the support surface 81a of the through belt portion 81 and the back surface 81b provided on the back side of the support surface 81a. The plurality of through holes are formed with a plurality of rows in the Y direction. One of the belt portions 81 is disposed to face the back surface of the substrate S.

The tape transport unit 82 has two transport rollers 82a to 82b. On the conveying rollers 82a to 82b The belt portion 81 is wound up. The conveyance roller 82b is disposed on the upstream side (+X side) of the substrate S in the conveyance direction in the exposure region. The conveyance roller 82a is disposed on the downstream side in the conveyance direction of the substrate S in the exposure region. Therefore, the belt portion 81 is configured to move so as to traverse the exposure region in the X direction.

The conveying roller 82a and the conveying roller 82b are arranged to extend in the Y direction, and are arranged to be spaced apart from each other so as to be aligned in the X direction.

The conveyance rollers 82a and 82b adjust the position so as to be moved around the axis AX3 (see FIG. 14) parallel to the Y direction while the belt portion 81 has tension.

The conveying roller 82a serves as a driving roller that drives the belt portion 81. A drive unit (surrounding drive unit) 82e is provided on the transport roller 82a. In the present embodiment, for example, the conveying roller 82a is a driving roller, and the remaining conveying roller 82b is a driven roller. The conveying roller 82a as a driving roller is formed of, for example, a porous material, and is connected to a suction device (not shown). According to this configuration, the belt portion 81 can be attracted to the outer peripheral surface, so that the power can be transmitted to the belt portion 81.

The guide platform 83 is formed in a rectangular plate shape using, for example, a porous material through which a gas can pass. The surface (guide surface) 83a on the +Z side of the guide platform 83 is formed parallel to the XY plane, and is ejected as a gas (fluid) toward the substrate S to function as a gas pressure (fluid pressure) from the -Z side. The function of supporting the planar pad of the substrate S in a non-contact manner. The guide platform 83 guides the substrate S and the belt portion 81 so as to move in the X direction along the guide surface 83a.

The guide platform 83 is disposed between the conveyance roller 82a and the conveyance roller 82b in the X direction. Further, as shown in FIG. 14, the guide platform 83 is disposed at a position overlapping the belt portion 81 in the Y direction. The guide surface 83a of the guide platform 83 is disposed to face the back surface of the belt portion 81. The guide platform 83 is fixed at a position by a fixing mechanism (not shown).

Further, in the present embodiment, the power of the driving unit 82e is transmitted to the reticle driving roller (rotating portion) 85 via the wheel mechanism 84 via the rotating shaft 86 that is integrally rotated. As the wheel train 84, a magnetic gear including a power that can transmit power in a non-contact manner can be used.

Fig. 14 is a cross-sectional view showing the substrate processing apparatus 100 shown in Fig. 13 broken along a plane parallel to the ZY plane.

As shown in FIG. 14, the mask drive roller 85 is provided in two in the Y direction in accordance with the arrangement of the rotor 25. Between the reticle drive rollers 85, the rotary shaft 86 is supported by a pair of bearings 87 disposed at intervals. These bearings 87 are slightly driven in the Z direction by a lifting device (moving portion) 88 composed of a piezoelectric element or the like.

In the substrate processing apparatus 100 having the above configuration, the rotating shaft 86 is moved in the Z direction via the bearing 87 by the lifting and lowering device 88, whereby the holding portion main body 22 is integrally moved in the Z direction via the mask driving roller 85 and the rotating body 25. And relatively moving in the Z direction with respect to the guiding platform 83.

Thereby, the distance G between the mask holding surface 22a of the holding portion main body 22 and the supporting surface 81a of the belt portion 81 can be adjusted. Therefore, the amount G of the distance between the mask M held on the mask holding surface 22a and the substrate S held on the supporting surface 81a is also adjusted to be equal.

When the distance between the mask M and the substrate S is adjusted, the substrate processing apparatus 100 manufactures an organic EL (Electro-Luminescence) element or a display element (electronic element) such as a liquid crystal display element by a roll method. Hereinafter, a procedure of manufacturing a display element using the substrate processing apparatus 100 having the above configuration will be described.

First, a strip-shaped substrate S wound around a roller (not shown) is attached to the substrate supply unit 1. The drive unit 82e is actuated to rotate the transport roller 82a so that the substrate S is fed from the substrate supply unit 11 in this state. On the other hand, the power of the drive unit 82e is transmitted to the rotating shaft 86 via the wheel train mechanism 84. The reticle drive roller 85 is rotated by the rotation of the rotary shaft 86, thereby rotating the rotator 25 abutting against the reticle drive roller 85, whereby the reticle M held on the holder main body 22a is rotated about the rotation axis AX1. . Therefore, the mask M rotates in synchronization (coupling) with the conveyance of the substrate S accompanying the surrounding operation of the belt portion 81. In this state, the pattern image of the mask M illuminated by the illumination light from the illumination unit 10 is successively exposed on the substrate S.

As described above, in the present embodiment, the amount of distance between the mask holding surface 22a of the holding portion main body 22 and the supporting surface 81a of the belt portion 81 can be easily adjusted in accordance with the change in the thickness of the substrate S. Further, in the present embodiment, the adjustment amount of the pitch may be small, and for example, a vacuum bearing type air bearing layer may be formed between the belt portion 81 and the guide surface 83a of the guide platform 83. In the case of the case, the amount of the pitch is adjusted by causing the guide surface 83a constituting the planar spacer to be slightly moved in the Z direction.

In the sixth embodiment, the rotator 25 is abutted against the reticle drive roller 85 to rotate the hood M, and the reticle M is rotated about the rotation axis AX. However, as shown in FIG. 15 , for example, a configuration may be adopted in which the rotor 25 is brought into contact with the belt portion 81 at a position separated from the substrate S to be rotated. M rotates.

In the substrate processing apparatus 100 of the above configuration, the shim sheet SM1 described in the fourth embodiment can be adjusted by providing the thickness corresponding to the thickness of the substrate S on the outer peripheral surface of the impression cylinder setting portion 25a. The distance between the mask holding surface 22a and the guiding surface 83a of the guiding platform 83 (between the mask surface and the substrate surface).

Further, when the amount of pitch adjustment is small, the amount of pitch can be adjusted by adjusting the thickness of the air bearing layer. Specifically, as shown in FIG. 15, the control unit CONT as the fluid pressure adjusting unit controls the supply unit 89 that supplies the air to the guide platform 83, and adjusts the rotor 25 (the impression cylinder setting unit 25a) in the air cushion portion. The air supply amount in the abutting region can adjust the thickness of the air bearing layer to move the rotor 25 in a direction of being separated from and close to the belt portion 81. Thereby, the distance between the belt portion 81 and the rotor 25, that is, the distance between the mask holding surface 22a and the guide surface 83a (between the mask surface and the substrate surface) can be easily changed.

The preferred embodiments of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to the above examples. The shapes, combinations, and the like of the constituent members shown in the above examples are merely examples, and may be designed according to the scope of the present invention. Seek various changes.

For example, in the above-described embodiment, the mask M is held on the outer circumferential surface of the holding portion main body 22. However, the present invention is not limited thereto, and the mask M may be held on the inner circumferential surface of the holding portion main body 22. The composition.

Further, in the above-described embodiment, the configuration of the measuring unit in which the relative positions of the measuring mask M and the substrate S are provided has been described only in the second and third embodiments, but of course, it can be applied to other embodiments.

Further, as the processing device U3 in the component manufacturing system SYS described below, the substrate processing apparatus 100 of the above-described embodiment can be used.

(Seventh embodiment)

Hereinafter, a substrate processing apparatus according to a seventh embodiment of the present invention will be described with reference to Figs. 16 to 20 .

In the following description, the same components are denoted by the same reference numerals, and the description thereof will be simplified or omitted. Further, unless otherwise stated, the description of the components or the like is the same as that of the above embodiment.

In the present embodiment, a description will be given of a case where the mask holding portion and the substrate holding portion are synchronously rotated (rotated) by friction.

16 is a front cross-sectional view of a main portion of the substrate processing apparatus 200, FIG. 17 is a front view of the photomask unit MU constituting the substrate processing apparatus 200, and FIG. 18 is a partially enlarged view of an end portion of the photomask unit MU.

The substrate processing apparatus 200 exposes a pattern of a flexible mask M to a strip-shaped substrate (for example, a strip-shaped film member) S, and the illumination unit 10 and the mask unit MU The substrate holding unit SU, the alignment microscopes AL1 and AL2, and a control unit (not shown) are mainly configured. The mask M is formed of a flexible sheet-like glass material to have a thickness of, for example, about 200 to 500 μm.

In the present embodiment, the vertical direction is the Z direction, and the direction parallel to the rotation axes AX1 and AX2 of the mask unit MU and the substrate holding unit SU is set to the Y direction, and the Z direction and the Y direction are used. The direction in which the orthogonal directions are set to the X direction will be described.

The illuminating unit 10 illuminates the illumination area of the reticle M wound on the reticle holding unit 20 (described below) in the reticle unit MU, and emits light in a straight tube type similarly to the fluorescent lamp. a person who emits illumination light for exposure, or a semiconductor laser that emits illumination light from both ends of a cylindrical quartz rod and is provided with a diffusion member on the back side, or a plurality of semiconductors that emit light of a high-intensity ultraviolet region or The LEDs and the like are arranged in a row and housed in the internal space of the inner cylinder 21 supporting the mask holding portion 20.

The mask unit MU includes a mask holding portion 20 and a rotor 25. The mask holding portion 20 includes a holder main body 22 and a holder 23 . The holding portion main body 22, the holder 23, and the rotating body 25 are provided in an integrated state, and are respectively formed with through holes through which the inner tube 21 is inserted in the direction of the rotation axis (constant axis) AX1.

The holding portion main body 22 is formed of a cylindrical glass material having an axis of rotation (predetermined axis) AX1 as an axis, and has a peripheral surface (circumferential surface) 22a that holds the mask M along a cylindrical surface having a predetermined radius. As shown in Fig. 17, when the mask M is wound, the circumference of the outer peripheral surface 22a is set to be separated by the length of both ends in the direction of the rotation axis AX1 (in the following description, the holder portion 22 and the holding portion are held The region in which the both ends of the mask M are separated in the direction of the rotation axis AX1 (the direction of scanning exposure) 23 is referred to as a mask separation region Ma).

Each of the holders 23 is formed of a metal material in an annular shape, and is provided at both end portions in the longitudinal direction of the holding portion main body 22, and has a holding portion 23a that holds the holding portion main body 22 from the inner peripheral side. As the material for forming the holder 23, it is preferable to have the same coefficient of linear expansion as that of the holder main body 22. The outer peripheral surface 23b of the holder 23 is formed to have a smaller diameter than the outer peripheral surface 22a of the holding portion main body 22.

Moreover, on the outer peripheral surface 23b of each holder 23, in addition to the mask separation area Ma, The groove portion 23c extending in the direction around the rotation axis AX1 is formed in a pairwise manner in the Y direction, and is formed in a configuration in which the circumferential end portions are connected to each other at a position separated from the reticle separation region Ma and The island portion surrounded by the groove portion 23c is formed in a zero shape.

As shown in FIG. 18, each of the groove portions 23c is filled with a sealing portion 70 that seals a gap between the holder 23 and the mask M with a projection amount that is substantially flush with the outer peripheral surface 22a of the mask holding portion 20. As the sealing portion 70, for example, an O-ring can be used. The space sealed by the sealing portion 70, that is, the sealed space surrounded by the holder 23, the mask M, and the sealing portion 70 is suctioned by the suction portion VC. The sealing portion 70 and the suction portion VC constitute a fixing portion that detachably fixes the mask M to the mask holding portion 20.

Further, as shown in FIG. 17, each of the holders 23 is provided with a shaft-shaped engaging portion (positioning pin) 71 located in the mask separation region Ma and a shaft-shaped portion on the -Y side of the mask M. The joint (positioning pin) 72. When the one end edge of the mask M is pressed against the outer peripheral surface, the engagement portion 71 determines the relative position of the mask M with respect to the circumferential direction of the mask holding portion 20, and is approximately the outer surface of the mask M. The height of the same plane is protruding. An index mark (indicator portion) FM which is an index of the relative positional relationship with the mask M is formed on the top surface of the joint portion 71.

The engaging portion 72 determines the relative position of the mask M to the Y direction (width direction) of the mask holding portion 20 when the edge of the Y-Y side of the mask M is pressed against the outer peripheral surface, and The height of the outer surface of the mask M is substantially the same plane. The mask M is positioned relative to the reticle holder 20 by pressing the end edges against both of the tying portions 71, 72. Further, a reticle mark MM is formed on the mask M, and the reticle mark MM is formed, for example, in the vicinity of the end edge of the urging portion 71, and is formed in the vicinity of the edge opposite to the end edge. Two, and respectively in the same position as the merging portion 71, the design has a predetermined positional relationship with the pattern.

The inner cylinder 21 is a cylindrical ceramic material such as a cylindrical quartz that can transmit illumination light or a slit-shaped opening 21a through which illumination light from the illumination unit 10 passes. Or metal or the like is formed.

Returning to Fig. 16, the rotor 25 is physically coupled (joined) to the holder body 22 via the holder 23, and has a pressure which is projected on the outer peripheral side about the rotation axis AX1 and is rotated on the outer peripheral surface of the impression cylinder body 30. The cylinder setting portion 25a. The outer diameter of the impression cylinder setting portion 25a is formed to be larger than the outer diameter formed on the outer surface of the mask M held on the mask holding surface 22a of the holder main body 22. Specifically, when the impression cylinder installation portion 25a is in contact with the outer circumferential surface of the impression cylinder body 30 and the holding portion main body 22 is supported at a predetermined position, the outer diameter of the impression cylinder installation portion 25a is formed to be held in the imprint A value between the substrate S on the drum body 30 and the mask M is formed.

Further, the rotor 25 is rotatably supported in the non-contact manner with respect to the inner cylinder 21 via the air bearing 26 via the air bearing 26 in a non-contact manner. Therefore, the holding portion body 22, the holder 23, and the rotating body 25 integrally rotate around the rotation axis line AX1.

The inner cylinder 21 is placed on the support base 27 which is provided in the direction in which the base portions B provided from the Y direction are spaced apart from each other via the leaf spring 28. The spring constant of the leaf spring 28 is based on the self-weight of the reticle holding portion 20 and the load applied to the impression cylinder body 30 via the rotator 25, that is, the impression cylinder setting portion 25a of the rotator 25 on the outer circumference of the impression cylinder body 30. Set by the frictional force when turning up. The illumination unit 10 is disposed in the internal space of the inner tube 21, and an opening 21a through which the illumination light passes is formed at a position opposite to the illumination light emission direction of the illumination unit 10 (see FIG. 16).

The alignment microscopes AL1 and AL2 detect the relative positional relationship between the mask M and the mask holding portion 20, and are disposed so as to be able to observe the mask mark MM of the mask M and the index mark FM of the joint portion 71. Mark the same Y position of MM and FM.

The substrate holding unit SU includes an impression cylinder body (substrate holding portion) 30.

The impression cylinder body 30 is formed in a cylindrical shape that is rotated parallel to the Y-axis and set on the rotation axis (second axis) AX2 on the -Z side of the rotation axis AX1, and has a hollow portion inside and is used to The way the torque is reduced is set. The outer peripheral surface of the impression cylinder body 30 is a substrate holding surface 31 that contacts the holding substrate S. On both end faces of the impression cylinder body 30 in the Y direction, the rotation support portion 32 having a smaller diameter than the impression cylinder body 30 and coaxially protruding is rotatably supported by the base portion B around the rotation axis AX2. Further, in the present embodiment, the drive unit 33 that rotates the impression cylinder body 30 in synchronization with the mask holding unit 20 by rotationally driving the impression cylinder body 30 is provided.

Next, the assembly procedure of the mask unit MU in the substrate processing apparatus 200 configured as described above will be described.

First, the mask M is formed on a surface of a short strip-shaped ultra-thin glass plate (for example, having a thickness of 200 to 500 μm), for example, by using a light-shielding layer such as chrome to form a fine line having a line width of 20 μm or less. A transmissive planar sheet photomask such as a circuit pattern for a display element of a pattern. The mask M is attached to the substrate so as to have a curvature corresponding to the radius of the outer peripheral surface 22a of the holding portion main body 22, so that it is expanded in the circumferential direction according to the thickness of the mask M and the radius of the outer peripheral surface 22a (outer peripheral surface). Side), or compression (inside the inner peripheral side). Therefore, regarding the circumferential direction, the pattern of the mask M is a pattern in which the size at the time of mounting is enlarged or reduced with respect to the size at the time of formation in accordance with the thickness and curvature described above. Therefore, at the time of pattern formation, a pattern is formed in such a size as to estimate the enlargement or reduction.

The mask M manufactured as described above is used in a state in which it is bent in accordance with the outer peripheral surface 22a of the holder main body 22 and wound (attached) on the outer peripheral surface. When the mask M is wound around the outer peripheral surface 22a, one end edge of the circumferential direction of the mask M is pressed against the outer peripheral surface of the engaging portion 71, and one end edge of the width direction of the mask M is pressed to the joint. The portion 72 is wound in a state in which the mask M is positioned with respect to the mask holding portion 20 (holding portion main body 22). After the reticle M is wound, the suction portion VC is operated to suction the sealed space sealed by the sealing portion 70, whereby the reticle M is suction-held at both end portions in the Y direction. In addition, when an air layer is formed between the mask M and the holding portion main body 22 to cause an interface having a large difference in refractive index, exposure to the substrate S may occur due to interference or multiple reflection. The image quality of the pattern deteriorates, so it is preferably A liquid such as pure water having a refractive index of the same degree as the glass material or an oil used in an oil immersion microscope or the like is interposed between the mask M and the holding portion main body 22 to suppress such a large refractive index difference. produce.

The liquid in this case is preferably one having a sufficient transmittance (for example, 90% or more) in the wavelength band of the illumination light for exposure.

Further, since the liquid gradually evaporates from the peripheral edge portion of the mask M, it is preferable that the peripheral portion of the mask portion M in the outer peripheral surface 22a of the holding portion main body 22 is located in the vicinity of the periphery of the mask M, or that the engaging portion 71 is provided. In the vicinity of 72, for example, a lyophilic groove having a depth of about several μm to several tens of μm (having a width of about 1 μm) is formed in a portion of the outer peripheral surface 22a, and the outer peripheral surface of the self-retaining portion body 22 is provided in advance. Above the 22a, the liquid supply mechanism of the liquid is occasionally dropped through the drop-shaped tubular or needle-shaped nozzle toward the groove.

When the configuration is set, the liquid dropped into the plurality of grooves is captured during the rotation of the holding portion main body 22 at a practical angular velocity (for example, the peripheral speed of the pattern surface of the mask M is about 50 to 200 mm/s). Since it is in the groove, it can penetrate into the outer peripheral surface 22a of the holding part main body 22 and the mask M by capillary phenomenon.

Of course, such a plurality of grooves are disposed on the outer side of the pattern forming region on the mask M and do not disturb the position of the illumination light for exposure.

Regarding the reticle unit MU that adsorbs and holds the mask M, the position information of the pattern is detected in advance before the exposure processing. Specifically, while the mask holding portion 20 is rotated about the rotation axis line AX1, the mask mark MM and the index mark FM are respectively detected by the alignment microscopes AL1, AL2. Thereby, the relative positional relationship of the mask M based on the index mark FM, that is, the relative positional relationship of the patterns is measured. By performing the predetermined calculation using the relative positional relationship, the position formed in the direction of the rotation axis AX1, the position in the Y direction, the rotation in the direction along the outer circumferential surface 22a, and the pattern formed on the mask M can be obtained. The error information of the pattern such as the magnification with respect to the mask holding portion 20.

Next, the operation of the substrate processing apparatus 200 will be described.

The reticle holding portion 20 supported by the inner cylinder 21 and holding the reticle M via the air bearing 26 is provided with the self-weight of the reticle holder 20 to the impression cylinder body 30 in the impression cylinder setting portion 25a of the rotator 25 The spring constant of the leaf spring 28 abuts against the load of the difference in the ability of the +Z side. Thereby, a predetermined distance between the mask holding surface 22a and the substrate holding surface 31, that is, between the mask M and the substrate S, is formed in accordance with the outer diameter of the impression cylinder setting portion 25a. Further, when the load applied to the impression cylinder body 30 by the impression cylinder setting portion 25a is adjusted, it is replaced with a leaf spring 28 having a corresponding spring constant, or is inserted in advance between the inner cylinder 21 and the support base 27. In the state of the spacer, the leaf spring 28 is provided and replaced with a spacer corresponding to the load applied to the impression cylinder body 30 by the impression cylinder setting portion 25a.

Then, the impression cylinder body 30 is rotated about the rotation axis AX2 by the driving of the driving device 33, and the illumination light is irradiated from the illumination unit 10, and the holder M is transmitted through the opening portion 21a to move the mask M from the inner circumference side. illumination. The substrate S held by the substrate holding surface 31 of the impression cylinder body 30 is conveyed along with the rotation of the impression cylinder body 30, and is abutted against the periphery of the impression cylinder body 30 at the impression cylinder installation portion 25a. The rotating body 25 of the surface is rotated, whereby the rotational driving force is transmitted to the holding portion main body 22 via the holder 23, so that the pattern of the mask M held by the holding portion body 22 is spaced apart from the substrate S. Moves synchronously while maintaining a fixed state. Next, the pattern image of the mask M illuminated by the illumination light is successively projected onto the projection area of the substrate S.

Further, when the pattern of the mask M is projected onto the substrate S, it is preferable to adjust the position of the substrate S in the direction around the rotation axis AX2, the position in the Y direction, and the impression cylinder based on the error information of the pattern obtained in advance. The relative rotational speed of the body 30 with respect to the reticle holding portion 20, the relative positional relationship between the rotational axes AX1 and AX2, and the distance between the reticle M and the substrate S.

As described above, in the mask unit MU of the present embodiment, the mask M formed of a glass material is held by the holder main body 22 made of a glass material, so that the image can be easily formed. In this case, it is possible to suppress an increase in cost due to the time when the pattern is directly formed in the holder body 22. Further, in the present embodiment, since the mask M which is not planar with respect to the cylindrical surface is patterned, even a pattern having a finer width, for example, a pattern having a line width of 20 μm or less can be formed with high precision. .

Further, in the present embodiment, when the mask M is attached to the mask holding portion 20, the mask M can be easily attached to the mask holding portion 20 by fitting the mask M to the engaging portions 71 and 72. . Further, in the present embodiment, since the index mark FM is provided in the engagement portion 71, it is not necessary to separately provide a member for index mark, and it is possible to reduce the size and cost of the device. Further, in the present embodiment, the operation of the suction/suction stop by the suction unit VC can be performed, and the mask M can be easily and quickly replaced.

(Component Manufacturing System)

Next, a component manufacturing system including the substrate processing apparatus 200 will be described with reference to Fig. 19 .

Fig. 19 is a view showing the configuration of a part of the component manufacturing system (flexible display production line) SYS. Here, the flexible substrate P (sheet, film, etc.) drawn from the supply roller FR1 is sequentially passed through n processing devices U1, U2, U3, U4, U5. . . An example in which Un is wound up on the recovery roller FR2. The upper control unit CONT2 collectively controls the processing units U1 to Un constituting the production line.

The component manufacturing system SYS of the present embodiment is a so-called roll-to-roll system in which various processes for manufacturing one element are continuously performed on the substrate P, and the substrate P subjected to various processes is used as an element (for example, organic The display panel of the EL display is divided (cut) in units and becomes a plurality of components. The size of the substrate P is, for example, about 10 cm to 2 m in the width direction (the Y direction in the short side), and 10 m or more in the longitudinal direction (the X direction in the long side).

In FIG. 19, the orthogonal coordinate system XYZ system is set such that the surface (or the back surface) of the substrate P is set to be perpendicular to the XZ plane, and the substrate P and the transport direction (longitudinal direction) are set. The width direction of the orthogonal direction is set to the Y direction. Further, the substrate P may be activated by modifying the surface of the substrate by a predetermined pretreatment, or may have a fine partition structure (concave structure) for precise patterning on the surface.

The substrate P wound on the supply roller FR1 is taken out by the nip driving roller DR1 and conveyed to the processing apparatus U1, and the center of the substrate P in the Y direction (width direction) is opposed by the edge position controller EPC1. The manner in which the target position is controlled within the range of ± ten μm to several tens of μm is servo-controlled.

The processing apparatus U1 continuously or selectively applies a photosensitive functional liquid (photoresist, photosensitive decane coupling material, UV curing resin liquid, etc.) to the surface of the substrate P in the transport direction (longitudinal direction) of the substrate P by printing. Coating device. In the processing apparatus U1, there is provided an impression cylinder roller DR2 which is wound around the substrate P, and a coating mechanism Gp1 which is disposed on the impression cylinder roller DR2 and which is used for uniformly coating the surface of the substrate P. a coating roller or the like for the functional liquid; and a drying mechanism Gp2 for rapidly removing the solvent or moisture contained in the photosensitive functional liquid applied to the substrate P;

The processing apparatus U2 is a heating apparatus for heating the substrate P transferred from the processing apparatus U1 to a predetermined temperature (for example, about 10 to 120 ° C) to stabilize the photosensitive functional layer applied to the surface. The processing device U2 is provided with: a plurality of rollers and a pneumatic folding bar for folding back the transport substrate P; the heating chamber portion HA1 for heating the loaded substrate P; and the cooling chamber portion HA2 And the method for lowering the temperature of the heated substrate P in a manner consistent with the ambient temperature of the subsequent step (processing device U3); and driving the roller DR3, which is clamped;

The processing apparatus U3 as the substrate processing apparatus 200 is an exposure apparatus shown in FIGS. 16 to 18 above, and the photosensitive functional layer of the substrate P (substrate S) conveyed from the processing apparatus U2 is irradiated with a circuit for display. The pattern or wiring pattern corresponds to the patterned light of the ultraviolet light. In the processing device U3, there is provided an edge position controller EPC that controls the center of the Y direction (width direction) of the substrate P to a fixed position; the driving roller DR4, which is clamped; DR5 (imprint cylinder body 30) which partially winds the substrate P with a predetermined tension and has a pattern-exposed portion on the uniform cylindrical surface-shaped support substrate P; and two sets of driving rollers DR6, DR7, Or the like to impart a predetermined relaxation (play) DL to the substrate P;

Further, in the processing apparatus U3, a transmissive cylindrical mask M (mask unit MU) and an illumination unit IU (illumination unit 10) are provided in the cylindrical mask M to form a cylindrical light. Illuminating the reticle pattern on the outer peripheral surface of the cover M; and aligning the microscopes AM1, AM2, etc., for one portion of the substrate P supported by the cylindrical shape of the rotating cylinder DR5, in order to make the cylindrical reticle M The image of one portion of the reticle pattern is aligned (aligned) with respect to the substrate P, and an alignment mark or the like previously formed on the substrate P is detected.

The processing apparatus U4 is a wet processing apparatus which performs a wet development process, an electroless plating process, etc. on the photosensitive functional layer of the board|substrate P conveyed by the processing apparatus U3. In the processing device U4, three processing tanks BT1, BT2, and BT3 are provided, which are equal to the Z-direction stratification; a plurality of rollers, which are bent and transported by the substrate P; and a driving roller DR8 that is clamped; Wait.

The processing apparatus U5 is a heating and drying apparatus that warms the substrate P conveyed from the processing apparatus U4 and adjusts the moisture content of the substrate P wetted in the wet process to a predetermined value, and details are omitted. Thereafter, the substrate P after passing through a plurality of processing apparatuses and passing through the processing apparatus Un of the last series of processes is wound up on the recovery roller FR2 via the clamped driving roller DR1. When it is wound up, the relative position of the control drive roller DR1 and the recovery roller FR2 in the Y direction is sequentially corrected by the edge position controller EPC2 so that the center of the substrate P (width direction) or the substrate in the Y direction is made. The end does not produce a deviation in the Y direction.

In the above-described component manufacturing system SYS, since the substrate processing apparatus 200 is used as the processing apparatus U3, the pattern can be easily formed, and the cost increase due to the time when the pattern of the holding portion main body 22 is formed can be suppressed. Therefore, high-precision components can be manufactured at low cost.

Further, the processing apparatus U3 shown in FIG. 19 may be the substrate processing apparatus 100 described in each of the above embodiments of FIGS. 1 to 15.

The preferred embodiments of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to the above examples. The shape, the combination, and the like of the respective constituent members shown in the above examples are merely examples, and various modifications can be made according to design requirements and the like without departing from the gist of the invention.

For example, in the above-described embodiment, the photomask M is wound (attached) to the outer peripheral surface 22a of the holding portion main body 22. However, the present invention is not limited thereto, and as shown in FIG. The inner peripheral surface of the holding portion body 22 is configured. In this case, the illumination unit 10 may be disposed on the outer side of the mask unit MU, and the length of the mask M in the circumferential direction may be set to be less than one-half of the circumference of the inner circumferential surface of the holder main body 22, and The light from the reticle pattern illuminated by the illumination light of the illumination unit 10 is emitted from the side opposite to the incident position of the illumination light of the holder main body 22; or the mirror portion provided on the inner tube 21 is used to make the reticle pattern The light is reflected toward the direction in which the rotation axis AX1 extends and is guided to the outside of the mask unit MU.

Further, in the above-described embodiment, the sealing portion 70 and the suction portion VC are used as the fixing portion for fixing the mask M to the mask holding portion 20, but the configuration is not limited thereto. The configuration in which the mask M is fixed to the mask holding portion 20 by using an adhesive or the holding portion that sandwiches and fixes the mask M to the mask holding portion 20 by a mechanical jig mechanism is used.

Further, the photomask M may be adsorbed on the mask holding portion 20 by an electrostatic adsorption method (Coulomb force).

Even when the mask M is attached to the inner peripheral surface of the holding portion main body 22 as described above, if an air layer is present between the inner circumferential surface of the holding portion main body 22 and the mask M, it is exposed on the substrate S. The image quality of the pattern is also highly likely to be deteriorated. Therefore, it is preferable to form between the inner circumferential surface of the holder main body 22 and the mask M in the same manner as in the above embodiment. A liquid having a refractive index of the same degree as that of the base material (a transparent thin plate such as glass) of the mask M is filled in a layer of a predetermined thickness.

(Eighth embodiment)

Hereinafter, a substrate processing apparatus according to an eighth embodiment of the present invention will be described with reference to Figs. 21 to 24 .

In the following description, the same components are denoted by the same reference numerals, and the description thereof will be simplified or omitted. Further, unless otherwise stated, the description of the components or the like is the same as that of the above embodiment.

21 is a front cross-sectional view showing a main portion of the substrate processing apparatus 300, and FIG. 22 is a cross-sectional perspective view showing the substrate processing apparatus.

The substrate processing apparatus 300 exposes a pattern of a flexible mask M to a strip-shaped substrate (for example, a strip-shaped film member) S, and the illumination unit 10 and the mask unit MU2 The substrate holding unit SU and the control unit CONT are configured as a main body.

In the present embodiment, the vertical direction is the Z direction, and the direction parallel to the rotation axes of the mask unit MU2 and the substrate holding unit SU is referred to as the Y direction, and is orthogonal to the Z direction and the Y direction. The direction is set to the X direction.

The illuminating unit 10 illuminates the illumination area of the reticle M wound on the reticle holding unit 20 (described below) in the reticle unit MU2, and can be used in a straight tube type similarly to the fluorescent lamp. The illumination light for emitting the radiation or the illumination light is introduced from both ends of the cylindrical quartz rod, and the diffusion member is provided on the back side, and is accommodated in the inner cylinder 21 supporting the mask holding portion 20. Inside the interior space.

The mask unit MU2 includes a mask holding portion 20, a leaf spring (elastic member) 24, and a rotor (support member) 25. The mask holding portion 20 includes a cylindrical holding portion main body (pattern holding member) 22 and holders (annular portions) 23 that are respectively provided at both end portions of the holding portion main body 22 in the longitudinal direction. The holding portion body 22, the holder 23, the leaf spring 24, and the rotating body 25 are each The state of the body is set, and a through hole that communicates with the inner cylinder 21 in the AX1 direction of the rotation axis (the predetermined axis) is formed.

The inner cylinder 21 is formed of a cylindrical ceramic material or metal having a slit-like opening 21a through which the illumination light from the illumination unit 10 passes, such as a cylindrical quartz that transmits illumination light. The holder main body 22 is formed with a mask holding surface 22a that holds the mask M along a cylindrical surface having a predetermined radius on the outer peripheral surface thereof. The holder 23 is formed of a metal material in an annular shape, and as shown in FIG. 23, is adhered to the outer peripheral surface of the end portion of the holder main body 22 by the adhesive 23a which exhibits elastic adhesion properties after curing. As a material for forming the holder 23, it is preferable to have the same coefficient of linear expansion as that of the holder main body 22. However, when the coefficient of linear expansion is poor, the holder 23 having a large coefficient of linear expansion is kept from the outer peripheral side. The holder body 22 is constructed so as not to exert a large load on the holder body 22 due to the difference in thermal expansion between the holder body 22 and the holder 23.

The rotor 25 is physically coupled (connected) to the holder body 22 via the leaf spring 24 and the spacers 24A and 24B (see FIGS. 23 and 24), and has an outer peripheral side and an impression cylinder around the rotation axis AX1. The impression cylinder setting portion 25a that rotates on the outer peripheral surface of the body 30. The outer diameter of the impression cylinder setting portion 25a is formed to be larger than the outer diameter formed on the outer surface of the mask M held by the mask holding surface 22a of the holder main body 22. Specifically, when the impression cylinder installation portion 25a is in contact with the outer circumferential surface of the impression cylinder body 30 and the holding portion main body 22 is supported at a predetermined position, the outer diameter of the impression cylinder installation portion 25a is formed to be held at the pressure. A value between the substrate S on the printing cylinder body 30 and the mask M is formed.

Further, the rotor 25 is rotatably supported by the inner peripheral side via the air bearing 26 so as to be rotatable with respect to the inner cylinder 21 about the rotation axis line AX1 in a non-contact manner. Therefore, the holding portion body 22, the holder 23, the leaf spring 24, and the rotating body 25 integrally rotate around the rotation axis line AX1.

The leaf spring 24 is configured to allow the expansion and contraction of the rotation axis AX1 of the holding portion main body 22, and is formed into a ring shape (annular shape) by, for example, a steel material as shown in FIG. As shown in FIG. 23, the leaf spring 24 is fixed to the rotating body 25 with a gap of a predetermined amount in the Y direction via the spacer 24A. same The plate spring 24 is fixed to the holder 23 by a gap of a predetermined amount in the Y direction via the spacer 24B. The spacers 24A are provided at three equal intervals around the rotation axis AX1 at substantially the same distance from the rotation axis AX1. The spacer 24B is disposed at a position spaced apart from the rotation axis AX1 by a distance from the spacer 24A, and is disposed at equal intervals in such a manner that the position around the rotation axis AX1 is between the spacers 24A.

The leaf springs 24 and the spacers 24A and 24B serve as a transmitting portion, and transmit a rotational driving force between the connected holder 23 and the holding portion main body 22 and the rotating body 25, thereby passing the leaf spring 24 and the spacers 24A and 24B. The connected holder 23, the holding portion main body 22, and the rotating body 25 are integrally rotated in the direction around the rotation axis line AX1, and are elastically deformed by the leaf spring 24 as the expansion/contraction permitting portion in the rotation axis AX1 direction. The slight movement of the holder 23, the holding portion body 22 and the rotating body 25 can be achieved.

The annular leaf spring 24 shown in FIG. 24 is configured as shown in FIG. 25 in detail, and three spacers 24A are fixed on one surface of the leaf spring 24 with the rotation axis AX1 as a center at an arrangement of about 120 degrees. On the other surface of the leaf spring 24, three spacers 24B are fixed at an arrangement of about 120 degrees with the rotation axis AX1 as a center and with a spacer of 24A with respect to the front side spacer 24A. Further, the thicknesses of the spacers 24A, 24B are set to be the same, and the dimension in the circumferential direction is set as small as possible.

The three spacers 24A fasten the end faces of the annular rotating body 25 and the leaf springs 24 by screws, and the three spacers 24B fasten the end faces of the annular holders 23 and the leaf springs 24 by screws.

In the present embodiment, the expansion/contraction permitting portion is configured as described above, and as shown in Fig. 26, it is also possible to be elastic in the radial direction R of the ring holder 23 in the Y direction (the direction in which the axis AX1 extends). The metallic flexible structure FLX which is deformed and which is extremely rigid in the tangential direction T of the holder 23 is tightly disposed at three places (120 degrees around the rotation axis AX1) by the flexural structure FLX. The holder 23 and the rotating body 25 are fixed.

If the deflection structure FLX shown in Fig. 26 is one, the rigidity in the diameter direction R is extremely low, but If the axis AX1 is equidistantly arranged at three points around the axis AX1 at 120 degrees, the deformation freedom of the diameter direction R of each of the flexure structures FLX is mutually restrained, so that the holder 23 and the rotor 25 are positive with the rotation axis AX1. The in-plane direction of the XZ is fastened with high rigidity, and is elastically displaceably fastened in the Y direction in which the rotation axis AX1 extends.

The inner cylinder 21 is placed on the support base 27 which is provided in the direction in which the base portions B provided from the Y direction are spaced apart from each other via the leaf spring 28. The spring constant of the leaf spring 28 is based on the self-weight of the reticle holding portion 20 and the load applied to the impression cylinder body 30 via the rotator 25, that is, the impression cylinder setting portion 25a of the rotator 25 on the outer circumference of the impression cylinder body 30. Set by the frictional force when turning up. The illumination unit 10 is disposed in the internal space of the inner tube 21, and an opening 21a through which the illumination light passes is formed at a position opposite to the illumination light emission direction of the illumination unit 10 (see FIGS. 21 and 22).

The substrate holding unit SU includes an impression cylinder body (rotating cylinder) 30.

The impression cylinder body 30 is formed in a cylindrical shape that is rotated in a rotation axis (second axis) AX2 that is parallel to the Y-axis and is set on the -Z side of the rotation axis AX1. As shown in FIG. 22, a hollow portion 30a is provided inside. And set in such a way that the moment of inertia becomes smaller. The outer peripheral surface of the impression cylinder body 30 is a substrate holding surface 31 that contacts the holding substrate S. On both end faces of the impression cylinder body 30 in the Y direction, the rotation support portion 32 having a smaller diameter than the impression cylinder body 30 and coaxially protruding is rotatably supported by the base portion B around the rotation axis AX2. Further, in the present embodiment, the drive unit 33 that rotates the impression cylinder body 30 in synchronization with the mask holding unit 20 by rotationally driving the impression cylinder body 30 is provided.

Next, the operation of the substrate processing apparatus 300 having the above configuration will be described.

The reticle holding portion 20 supported by the inner cylinder 21 and holding the reticle M via the air bearing 26 is provided to the impression cylinder body 30 by the embossing cylinder installation portion 25a of the rotator 25, and the reticle and the slab of the reticle holder 20 are provided. The spring constant of the spring 28 abuts against the load of the difference in the ability of the +Z side. Thereby, a predetermined distance between the mask holding surface 22a and the substrate holding surface 31, that is, between the mask M and the substrate S, is formed in accordance with the outer diameter of the impression cylinder setting portion 25a. Again, in tune When the load applied to the impression cylinder body 30 by the entire impression cylinder setting portion 25a is replaced with a leaf spring 28 having a corresponding spring constant, or a state in which a spacer is inserted in advance between the inner cylinder 21 and the support base 27 The leaf spring 28 is provided to be replaced with a spacer corresponding to the load applied to the impression cylinder body 30 by the impression cylinder setting portion 25a.

Then, the impression cylinder body 30 is rotated about the rotation axis AX2 by the driving of the driving device 33, and the illumination light is irradiated from the illumination unit 10, and the holder M is transmitted through the opening portion 21a to move the mask M from the inner circumference side. illumination. The substrate S held by the substrate holding surface 31 of the impression cylinder body 30 is conveyed along with the rotation of the impression cylinder body 30, and is abutted against the periphery of the impression cylinder body 30 at the impression cylinder installation portion 25a. The rotating body 25 of the surface is rotated, whereby the rotational driving force is transmitted to the holder 23 and the holding portion body 22 via the leaf spring 24 and the spacers 24A and 24B, thereby maintaining the pattern of the mask M on the holding portion body 22. The state in which the distance between the quantitative amounts of the substrate S and the substrate S are kept constant is synchronized. Next, the pattern image of the mask M illuminated by the illumination light is successively projected onto the projection area of the substrate S.

At this time, in the mask holding portion 20 and the impression cylinder body 30, the peripheral speed is made the same at the position (diameter) at which the impression cylinder installation portion 25a abuts on the substrate holding surface 31, and in order to make the mask M The position (diameter) of the outer peripheral surface of the mask M and the position (diameter) of the outer peripheral surface of the substrate S are the same as the thickness of the mask M and the substrate S, and the mask of the holder portion 22, in the same manner as the relative movement speed of the substrate S. The ratio of the diameter of the holding surface 22a and the diameter of the substrate holding surface 31 of the impression cylinder body 30 is adjusted. For example, the thickness of the mask M and the substrate S are the same, and the diameter of the mask holding surface 22a and the substrate holding surface 31 of the impression cylinder body 30 are the same, and the holder body 22 and the impression cylinder body 30 have the same angular velocity. In the case of rotation, the distance from the position where the impression cylinder installation portion 25a abuts on the substrate holding surface 31 to the outer circumferential surface of the mask M and the position where the impression cylinder installation portion 25a and the substrate holding surface 31 abut each other The distance to the outer peripheral surface of the substrate S may be the same. Further, in other cases, it is preferable that the holding portion main body 22 and the impression cylinder body are formed so that the peripheral speed of the outer peripheral surface of the mask M is the same as the peripheral speed of the outer peripheral surface of the substrate S. Each of 30 sets the diameter of the contact position of the impression cylinder setting portion 25a and the substrate holding surface 31.

Therefore, an example in which the peripheral speed of the outer peripheral surface of the mask M is made to coincide with the peripheral speed of the outer peripheral surface of the substrate S will be described with reference to FIG. Fig. 27 is a modification of the method for adjusting the diameter of the shims illustrated in Fig. 11 above, and the same members as those of Fig. 23 are denoted by the same reference numerals. The deformed portion is as follows. As shown in FIG. 27, an annular shims (a metal strip of a predetermined thickness) 31B are wound around a portion of the substrate holding surface 31 that abuts against the impression cylinder setting portion 25a. When viewed in the YZ plane of the figure, the contact position between the outer peripheral surface of the impression cylinder setting portion 25a and the outer peripheral surface of the shim sheet (metal strip of a predetermined thickness) 31B is set as the mask M and the substrate. The position Cx between S is substantially in the middle of G.

The position Cx is set to r11+Mt+G/2 as the position of the radius of the self-rotation axis AX1 of the mask M, and is also set to r2+St+G/2 as the radius of the self-rotation axis AX2 of the impression cylinder body 30. The location.

The shims 31B are selected (prepared) such as to satisfy the thickness of such a condition, and are wound around the outer peripheral surface of the substrate holding surface 31, but in the case where the thickness can be fixed, the substrate holding surface 31 is pressed. The diameter of the portion where the cylinder mounting portion 25a abuts may be processed to be r2+St+G/2. Further, in the case where the shims 31B can be alternately wound, the shims 31B of the optimum thickness can be replaced by the change in the thickness St of the substrate S or the size of the pitch G.

In addition, when the exposure processing is continuously performed, thermal expansion occurs in the holder main body 22 illuminated by the illumination light. Regarding the thermal expansion in the radial direction of the holding portion body 22, since the holder 23 holding the holding portion body 22 from the outer peripheral side is formed of a metal material and has a linear expansion coefficient larger than that of the holding portion body 22, thermal expansion is allowed without being restrained and maintained. The body 22 is such that a large load is applied to the holder body 22. Further, at this time, although the holding portion main body 22 and the holder 23 are thermally expanded in the direction in which they are separated, since the adhesive 23a has the elastic adhesive property, the holding member 23 can be prevented from being slack in the holding portion main body 22.

Furthermore, the linear expansion coefficient of the holder 23 is smaller than the linear expansion of the holder body 22. In the case of the expansion coefficient, it is preferable to select the holder 23 to hold the holding portion main body 22 from the inner peripheral side. However, even if it is configured to be held from the outer peripheral side, it can be elastically deformed by the above-mentioned adhesive 23a to alleviate it. The load applied to the holder body 22 upon thermal expansion.

Further, when the holding portion main body 22 is thermally expanded in the direction of the rotation axis AX1, the leaf spring 24 is fixed at a portion fixed by the spacer 24A, and the portion fixed by the spacer 24B is directed toward the rotating body 25. The direction is elastically deformed. Thus, the thermal expansion of the holding portion main body 22 is allowed by the elastic deformation of the leaf spring 24, so that a large load in the direction of the rotation axis AX1 is not applied to the holding portion main body 22.

As described above, in the present embodiment, the adhesive 23a having the elastic adhesive property is interposed between the holding portion main body 22 and the holder 23 in the radial direction, and the leaf spring 24 is elastically deformed in the direction of the rotation axis AX1. Thereby, thermal expansion due to temperature changes is allowed. Therefore, in the present embodiment, the load applied to the holding portion main body 22 due to thermal expansion is alleviated, so that deformation of the holding portion main body 22 due to the applied load can be suppressed, and patterning of the opposing substrate S can be suppressed. A situation that causes adverse effects.

In the component manufacturing system SYS shown in FIG. 19, since the substrate processing apparatus 300 can be used as the processing apparatus U3, it is possible to reduce the adverse effect on the pattern formation of the counter substrate S due to temperature changes, and thus it is possible to manufacture high precision. A patterned element.

The preferred embodiments of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to the above examples. The shape, the combination, and the like of the respective constituent members shown in the above examples are merely examples, and various modifications can be made according to design requirements and the like without departing from the gist of the invention.

For example, in the above-described embodiment, the photomask M having the patterned sheet is held on the outer peripheral surface of the holding portion main body 22, but the present invention is not limited thereto, and may be the holding portion main body 22 (transparent cylinder). The outer peripheral surface of the material) directly forms a reticle pattern.

Further, it is also possible to prevent the mask M from being held by the outer peripheral surface of the holder main body 22 The inner peripheral surface of the holding portion body 22 is configured. Further, the holder main body 22 may be formed in a columnar shape instead of being cylindrical, and the illumination unit 10 may be configured to illuminate the mask M held by the outer peripheral surface from the outer peripheral side.

Further, in the above-described embodiment, the rotation unit 25 and the impression cylinder body 30 are rotated (rotated by frictional contact) to rotate the holder main body 22 (mask M), but the invention is not limited thereto. Here, the present invention can be applied even in a configuration in which the holding portion main body 22 (the mask M) is independently rotated by a driving device such as a motor.

In this case, the impression cylinder setting portion 25a of the rotary body 25 is omitted, and the rotary bodies 25 on both sides are rotatably pivotally supported by the inner cylinder 21 provided on the body of the exposure device via the air bearing 26, and with the motor The rotor and the like are combined. The rotational driving force of the motor is transmitted to the holding portion main body 22 (mask M) via the rotor 25, the leaf spring 24, and the holder 23.

Even in the case of such a configuration, in the direction of the rotation axis AX1, the plate spring 24 can be elastically deformed, and the thermal expansion of the holder main body 22 (the mask M) due to the temperature change is allowed, thereby alleviating the retention. The portion body 22 generates unnecessary stress, and deformation of the holder portion 22 or the like can be suppressed.

10‧‧‧Lighting Department

20‧‧‧Photomask Holder

21‧‧‧Inner tube

21a‧‧‧ Opening

22‧‧‧Main body (pattern holding member)

22a‧‧‧Photomask retaining surface (outer peripheral surface, peripheral surface)

23‧‧‧Holding (ring)

25‧‧‧Rotating body (pitch forming portion, supporting member)

25a‧‧‧Ink cylinder setting department

26‧‧‧Air bearing

27‧‧‧Support table

28‧‧‧Sheet spring (elastic absorption part, elastic member)

30‧‧‧ Imprint cylinder body (substrate holding part, surrounding holding part, rotating cylinder)

31‧‧‧ substrate holding surface

32‧‧‧Rotary support

33‧‧‧ drive

100‧‧‧Substrate processing unit

AX1‧‧‧Rotation axis (established axis)

AX2‧‧‧Rotation axis (2nd axis)

S‧‧‧Substrate

B‧‧‧Base section

M‧‧‧Photo Mask

MU‧‧‧Photomask unit

SU‧‧‧Substrate holding unit

AL1, AL2‧‧‧ alignment microscope

X, Y, Z‧‧ Direction

Claims (50)

A substrate processing apparatus that forms a photo-sensing layer formed on a surface of a substrate by a pattern of a photomask held along a cylindrical surface, and includes a mask holding portion that holds the light along the cylindrical surface a mask holding surface of the cover and rotatable about a predetermined axis; a surrounding holding portion having a substrate holding surface contacting the substrate and surrounding the axis substantially parallel to the predetermined axis; and a spacing forming portion A predetermined distance is formed between the mask holding surface and the substrate holding surface. The substrate processing apparatus of claim 1, wherein the pitch forming portion includes a rotating body, and the rotating system is disposed around an axis of the one of the reticle holding portion and the surrounding holding portion, and The holding surface of the photomask holding portion and the other of the surrounding holding portions is rotated about the axis of the other. The substrate processing apparatus of claim 2, wherein the rotating body is coupled to the body portion of the reticle holding portion and the surrounding holding portion via a telescopic absorbing portion, the telescopic absorbing portion absorbing the body portion The expansion and contraction of the axis direction. The substrate processing apparatus according to the second or third aspect of the invention, wherein the pitch forming portion includes a correction portion that is at least one of a circumferential surface of the rotating body and the holding surface for rotating the rotating body The distance is set substantially over the entire circumference, and the predetermined distance is corrected according to the thickness of the substrate. The substrate processing apparatus of claim 4, wherein the correction portion has a length of a gap formed in a joint in an end portion in a direction of the axis, and positions of the gap are different from each other in a direction around the axis A plurality of them are arranged along the axis direction. The substrate processing apparatus of claim 4, wherein the correction portion has a length of a gap formed in a joint in an end portion in a direction of the axis, and at least a portion of the gap is along Formed in a direction crossing the axial direction. The substrate processing apparatus according to any one of claims 4 to 6, wherein the portion where the correction portion is disposed and the thickness at the portion are based on the correction amount of the pitch, the mask holding portion, and the surrounding The holding portion is set at a relative peripheral speed. The substrate processing apparatus according to any one of claims 4 to 7, wherein the correction unit is detachably provided to each of the mask holding portion and the surrounding holding portion. The substrate processing apparatus according to claim 8, wherein the correction unit includes a magnetic portion, and the mask holding portion and the surrounding holding portion are provided with an excitation portion. The substrate processing apparatus according to the second or third aspect of the invention, wherein the pitch forming portion includes a load applying portion that applies a load to the rotating body to cause the rotating body to have a diameter direction centering on the axis Elastic deformation. The substrate processing apparatus according to claim 10, wherein the load applying portion applies a load to the rotating body in the axial direction. The substrate processing apparatus according to claim 1, wherein the pitch forming portion includes: a measuring portion that measures a distance between the mask holding surface and the substrate holding surface; and a displacement portion according to the measuring portion As a result of the measurement, at least one of the mask holding portion and the surrounding holding portion is displaced in the first direction in which the mask holding portion and the surrounding holding portion are separated from each other. The substrate processing apparatus according to claim 12, wherein the shifting portion includes a driving portion that drives at least one of the mask holding portion and the surrounding holding portion in the first direction. The substrate processing apparatus of claim 12, wherein the shifting portion includes: an energizing portion that applies at least one of the mask holding portion and the surrounding holding portion to the mask holding portion and the surrounding holding portion The groove portion is disposed in a second direction intersecting the first direction, and is disposed between the mask holding portion and the surrounding holding portion, wherein the width of the first direction is along the second direction Gradually changing; and a pad portion that is movably inserted into the groove portion along the second direction. The substrate processing apparatus according to any one of claims 1 to 14, further comprising: a detecting unit that detects a relative positional relationship between the mask and the substrate; and an adjusting unit that detects the detecting unit according to the detecting unit As a result, the relative positional relationship between the reticle holding portion and the surrounding holding portion is adjusted. The substrate processing apparatus according to claim 15, wherein the adjustment unit includes: a first adjustment unit that adjusts a position of the mask holding unit in a direction around the axis; and a second adjustment unit that adjusts the mask The position of the holding portion in the axial direction. The substrate processing apparatus according to claim 16, wherein the first adjustment unit includes a switching unit that switches rotation of the mask holding unit about the axis and stops the rotation. The substrate processing apparatus according to any one of claims 1 to 17, wherein the reticle holding portion holds a sheet in which the pattern of the reticle is formed. The substrate processing apparatus according to any one of claims 1 to 18, wherein the surrounding holding portion is provided with an endless belt. The substrate processing apparatus of claim 19, wherein the endless belt is formed of a stainless steel material. The substrate processing apparatus of claim 19 or 20, further comprising: a surrounding driving portion that surrounds the surrounding holding portion; and a rotating portion that abuts the reticle holding portion and the surrounding driving The drive of the portion rotates in conjunction with each other to rotate the mask holding portion. The substrate processing apparatus according to claim 21, further comprising a moving portion, wherein the mask holding portion is moved in a direction of being separated from and approaching the substrate via the rotating portion. The substrate processing apparatus according to claim 19 or 20, further comprising: a fluid support portion that supports the surrounding holding portion by a fluid pressure from a surface opposite to the substrate holding surface; and a rotating body Provided to the reticle holding portion about the predetermined axis, and by the fluid The surrounding portion of the support portion is supported to rotate around the predetermined axis about the substrate holding surface. The substrate processing apparatus according to claim 23, further comprising: a fluid pressure adjusting unit that adjusts the fluid pressure in a region where the rotating body rotates, and the reticle holding portion is separated from the substrate via the surrounding holding portion, Move in the direction of approach. A reticle unit comprising a reticle holding portion for holding a reticle formed of a glass material, holding the reticle along a cylindrical surface on a circumferential surface, rotatable about a predetermined axis, and formed of the glass material . The reticle unit of claim 25, wherein the peripheral surface of the reticle holding portion has a peripheral portion that separates both ends of the reticle in the direction of the axis to maintain the circumference of the reticle. The reticle unit of claim 25 or 26, which is provided with a fixing portion for fixing the reticle to the reticle holding portion. The reticle unit of claim 27, wherein the fixing portion is filled with an adhesive between the reticle and the reticle holder. The reticle unit of claim 27, wherein the fixing portion detachably fixes the reticle to the reticle holding portion. The reticle unit of claim 29, wherein the fixing portion includes a nip portion that sandwiches the reticle between the reticle holding portion. The reticle unit of claim 29, wherein the fixing portion includes: a sealing portion that seals a gap between the reticle and the reticle holding portion; and a suction portion that is enclosed by the sealing portion The space is vacuum suctioned. The reticle unit according to any one of claims 25 to 31, wherein the reticle holding portion has an index portion that serves as an index of a relative positional relationship with the reticle. The reticle unit of claim 32, wherein the indicator portion is formed by an index mark of the reticle holding portion. The reticle unit of claim 32, wherein the indicator portion is provided with a tying portion that positions the reticle and the reticle holding portion in a predetermined positional relationship when a portion of the reticle is coupled . The reticle unit of any one of claims 25 to 34, wherein the pattern of the reticle has a line width of 20 μm or less. A substrate processing apparatus comprising: the photomask unit according to any one of claims 25 to 35; and a substrate holding portion that holds a substrate forming a pattern of the photomask. A reticle unit manufacturing method comprising the steps of: maintaining a reticle formed of the glass material with a reticle holder formed by a glass material rotating along a circumferential surface of the cylindrical surface and rotatable about a predetermined axis On the circumference. A substrate processing method comprising the steps of forming a pattern of a photomask on a substrate using a photomask unit manufactured by the photomask unit manufacturing method of claim 37. A reticle unit mounted on a predetermined processing device, which is cylindrical or cylindrically rotatable about a predetermined axis by a rotational driving force; and has a cylindrical or cylindrical pattern holding member along which a circumferential surface holding reticle pattern having a fixed radius from the axis and having a predetermined size in the direction of the axis; a support member physically coupled to the pattern holding member, and supporting the pattern holding member to the processing device And a predetermined position; and an expansion and contraction permitting unit that connects the pattern holding member and the support member so as to allow expansion and contraction of the pattern holding member in the axial direction of the support member and the pattern holding member. The reticle unit of claim 39, wherein the support member includes a transmission portion that transmits the rotational driving force to the pattern holding member via the expansion and contraction permitting portion, the expansion and contraction permitting portion including an elastic member, the elastic member High rigidity in the direction of the rotational driving force, The direction of the axis is less rigid and elastically deformable. The reticle unit of claim 39 or 40, wherein the expansion and contraction permitting portion has an annular portion that supports a circumferential surface of the pattern holding member; between the annular portion and a peripheral surface of the pattern holding member A second expansion and contraction permitting portion that allows expansion and contraction of the pattern holding member in the radial direction is provided. The photomask unit according to claim 41, wherein the second telescopic permitting portion includes an adhesive that is loaded between the annular portion and a peripheral surface of the pattern holding member with a predetermined thickness. The reticle unit of claim 41 or 42, wherein the pattern holding member has an inner circumferential surface having a predetermined radius and a predetermined radius, and the cylindrical dimension of the axial length is a predetermined length The light transmissive material is configured such that the annular portion of the expansion/contraction permitting portion holds the circumferential surface of the pattern holding member, and the pattern retention is selected based on a difference between a linear expansion coefficient of the annular portion and a linear expansion coefficient of the pattern holding member. Any of the outer peripheral surface and the inner peripheral surface of the member. The reticle unit of any one of claims 39 to 43, wherein the pattern holding member holds a sheet in which the pattern of the reticle is formed along the circumferential surface. A substrate processing apparatus comprising the photomask unit according to any one of claims 39 to 44, and a substrate holding unit that holds the substrate on which the photomask pattern is transferred. The substrate processing apparatus of claim 45, wherein the substrate holding unit comprises a rotating barrel rotatable about a second axis substantially parallel to an axis of the mask unit, and the rotation is caused by rotation of the rotating barrel The substrate supported by the outer peripheral surface of the cylinder moves in a direction substantially orthogonal to the second axis. The substrate processing apparatus of claim 46, wherein the communication portion of the support member of the mask unit includes a peripheral surface having a predetermined radius centering on an axis of the pattern holding member, and the communication portion is provided The outer peripheral surface abuts against the outer peripheral surface of the rotating cylinder to rotate the reticle unit. The substrate processing apparatus of claim 47, wherein the outer peripheral surface of the pattern holding member and the rotating cylinder are in a state in which the outer peripheral surface of the transmitting portion abuts against the outer peripheral surface of the rotating cylinder The outer peripheral surface has a configuration in which the distance between the two is quantitative. The substrate processing apparatus of claim 48, wherein a peripheral speed of the mask pattern by rotation of the mask unit substantially coincides with a moving speed of the substrate by rotation of the rotating barrel, The diameter of the abutting portion of the outer peripheral surface of the transmitting portion and the outer peripheral surface of the rotating cylinder is set. A substrate processing method for scanning a cylindrical reticle toward a surface of a substrate conveyed in a longitudinal direction, the cylindrical reticle being disposed along a peripheral surface having a fixed radius from a predetermined center line Having a pattern for electronic components and being rotatable; and the substrate processing method includes the steps of: maintaining the substrate contact in a substrate holding by moving around the surrounding driving portion around an axis disposed parallel to the predetermined center line a portion that transports the substrate along the longitudinal direction, and an annular installation portion that is disposed on both end sides of the center line in a direction of the center line of the cylindrical mask from the center line, and the surrounding drive portion Alternatively, one of the substrate holding portions is in contact with each other, whereby the surface of the substrate and the outer circumferential surface of the cylindrical mask are set at a predetermined close pitch, and the cylindrical mask is rotated about the center line.