JP6933236B2 - Mask unit and exposure equipment - Google Patents

Description

The present invention relates to a mask unit and an exposure apparatus.
The present application applies to Japanese Patent Application No. 2012-059070 filed on March 15, 2012, Japanese Patent Application No. 2012-084820 filed on April 03, 2012, and April 05, 2012. The priority is claimed based on the filed Japanese Patent Application No. 2012-086539, and the contents thereof are incorporated herein by reference.

In a large screen display element such as a liquid crystal display element, a transparent electrode such as ITO or a semiconductor material such as Si is deposited on a flat glass substrate, a metal material is vapor-deposited, and a photoresist is applied to form a circuit pattern. A circuit pattern or the like is formed by transferring, developing the photoresist after the transfer, and then etching. However, as the screen size of the display element increases, the size of the glass substrate increases, which makes it difficult to convey the substrate. Therefore, it is called a roll-to-roll method (hereinafter, simply referred to as "roll method") in which a display element is formed on a flexible substrate (for example, a film member such as polyimide, PET, or metal foil). A technique has been proposed (see, for example, Patent Document 1).

Further, in Patent Document 2, a flexible long sheet (board) that can be wound around a feed roller and traveled is arranged close to the outer peripheral portion of a rotatable cylindrical mask, and the mask pattern is continuously arranged. A technique for exposing a substrate to a substrate has been proposed.

International Publication No. 2008/129819 Jitsukaisho 60-019037

In order to expose the mask pattern to the substrate with high accuracy, it is necessary to set the gap amount between the mask and the substrate to an appropriate value, but if the gap amount deviates from the appropriate value, a predetermined pattern line width is obtained. It may not be possible.

An object of the present invention is to provide a mask unit and an exposure apparatus capable of exposing a mask pattern to a substrate with high accuracy.

Further, when the mask has a cylindrical shape, it may be difficult to directly form a precise pattern on the peripheral surface of the cylindrical base material, which contributes to an increase in cost. In particular, when a pattern is formed on the inner peripheral surface of the cylindrical mask, the cost increases significantly and there is a concern that the pattern accuracy may decrease.

It is also an object of the present invention to provide a mask unit and an exposure apparatus that can contribute to an improvement in pattern accuracy while suppressing an increase in cost.

Further, when the linear expansion coefficient of the holding member holding the mask pattern and the supporting member supporting the holding member at a predetermined position with respect to the substrate are different, stress is applied to the holding member due to thermal expansion and contraction due to a temperature change. If the holding member is made of a relatively fragile material such as glass, there is a risk of adverse effects. Further, when stress is applied to the holding member, the mask pattern is also affected, which may affect the transfer accuracy to the substrate.

It is also an object of the present invention to provide a mask unit and an exposure apparatus capable of suppressing stress from being applied to a holding member that holds a mask pattern even when a temperature fluctuation occurs.

The mask unit of one aspect according to the present invention is mounted on an exposure apparatus that transfers a mask pattern to a long sheet-like substrate, holds the mask pattern, and can rotate around a first axis in a cylindrical or circular shape. A columnar mask unit, a pattern holding member that holds the mask pattern in a cylindrical shape along a peripheral surface that has a first radius from the first axis, and the pattern with respect to the direction of the first axis. Each of both sides of the holding member has a peripheral surface formed from the first axis with a second radius larger than the first radius, and the peripheral surface is used as the substrate in the exposure apparatus. It is provided with an installation member that sets the mask pattern and the substrate in a predetermined proximity gap by supporting the mask pattern with a part of the supporting substrate supporting portion.

One aspect of the exposure apparatus according to the present invention is an exposure apparatus that exposes a mask pattern on a sheet-shaped substrate, and is a support portion that rotatably supports the mask unit of the above aspect around the first axis. And a substrate holding portion for holding a long sheet-like substrate on which the mask pattern of the sheet mask wound around the mask unit is exposed.

According to the aspect of the present invention, it is possible to expose the mask pattern to the substrate with high accuracy.

Further, according to the aspect of the present invention, high-precision transfer exposure can be realized on a substrate by using a cylindrical mask pattern without increasing the cost.

Further, according to the aspect of the present invention, it is possible to suppress the application of stress to the holding member that holds the mask pattern even when the temperature fluctuates, and it is possible to perform high-precision processing using the mask pattern. ..

The front sectional view of the main part of the substrate processing apparatus which concerns on 1st Embodiment. Cross-sectional perspective view of the substrate processing apparatus. Detailed view of the main part of the end portion of the mask holding portion. The perspective view which shows the leaf spring provided in the mask holding part. An enlarged cross-sectional view of the mask holding portion according to the second embodiment. The schematic sectional view of the substrate processing apparatus which concerns on 2nd Embodiment. The external perspective view of the substrate processing apparatus which concerns on 3rd Embodiment. Partially enlarged view of the board processing device. The front sectional view of the main part of the substrate processing apparatus which concerns on 4th Embodiment. Partially enlarged view showing the end of the shim. Partially enlarged view showing the end of the shim. Partially enlarged view showing the end of the shim. Partially enlarged view of the contact portion between the rolling element and the impression cylinder. The front sectional view of the main part of the substrate processing apparatus which concerns on 5th Embodiment. The schematic block diagram of the substrate processing apparatus which concerns on 6th Embodiment. The front sectional view of the main part of the substrate processing apparatus. The schematic block diagram of the modification of the substrate processing apparatus. The front sectional view of the main part of the substrate processing apparatus which concerns on 7th Embodiment. The front view of the mask unit constituting the substrate processing apparatus. Partially enlarged view at the end of the mask unit. The figure which shows the structure of the device manufacturing system. The front sectional view of the main part of the modification of the substrate processing apparatus. The front sectional view of the main part of the substrate processing apparatus which concerns on 8th Embodiment. Cross-sectional perspective view of the substrate processing apparatus. Detailed view of the main part of the end of the mask unit. The perspective view which shows the leaf spring provided in the mask unit. The figure which shows the detail of the leaf spring. The figure which shows the deformation example of the expansion / contraction allowance part. The figure which shows an example which makes the peripheral speed of the outer peripheral surface of a mask the same as the peripheral speed of the outer peripheral surface of a substrate.

(First Embodiment)
Hereinafter, the first embodiment of the substrate processing apparatus of the present invention will be described with reference to FIGS. 1 to 4.
FIG. 1 is a front sectional view of a main part of the substrate processing apparatus 100, and FIG. 2 is a sectional perspective view of the substrate processing apparatus.

The substrate processing apparatus 100 exposes a strip-shaped substrate (for example, a strip-shaped film member) S to a pattern of a flexible sheet-shaped mask M, and is an illumination unit 10 and a mask holding unit. 20. It is mainly composed of an impression cylinder (board holding portion, circumferential holding portion) 30 and a control unit CONT. In the present embodiment, the vertical direction will be the Z direction, the direction parallel to the rotation axes of the mask holding portion 20 and the substrate support portion 30 will be the Y direction, and the Z direction and the direction orthogonal to the Y direction will be described as the X direction. ..

The illumination unit 10 irradiates the illumination area of the mask M wound around the mask holding unit 20 with the illumination light, and emits the illumination light for exposure radially in a straight tube type like a fluorescent lamp. Those used are those in which illumination light is introduced from both ends of a cylindrical quartz rod and diffusers are provided on the back surface side, and are housed in the internal space of the inner cylinder 21 that supports the mask holding portion 20.

The mask holding portion 20 is attached to the cylindrical holding portion main body 22, the holders 23 provided at both ends of the holding portion main body 22 in the length direction, and the leaf springs (expansion and contraction absorbing portions) 24 to each holder 23. It is provided with a rolling element (gap forming portion) 25. The holding portion main body 22, the holder 23, the leaf spring 24, and the rolling element 25 are provided in an integrated state, and there are through holes in which the inner cylinder 21 is inserted so as to communicate with the rotation axis AX1 direction. Is formed in.

The inner cylinder 21 is made of a cylindrical quartz material or the like capable of transmitting the illumination light, or a cylindrical ceramic material or metal having a slit-shaped opening 21a through which the illumination light from the illumination unit 10 passes. .. The holding portion main body 22 is formed with a mask holding surface 22a on the outer peripheral surface thereof, which holds the mask M along a cylindrical surface having a predetermined radius. The holder 23 is formed of a metal material in an annular shape, and as shown in FIG. 3, is adhered to the outer peripheral surface of the end portion of the holding portion main body 22 by an adhesive 23a that exhibits elastic adhesive performance after curing. The material for forming the holder 23 is preferably one having the same coefficient of linear expansion as that of the holding portion main body 22, but when there is a difference in the coefficient of linear expansion, the difference in thermal expansion between the holding portion main body 22 and the holder 23 is used. The holder 23 having a large coefficient of linear expansion holds the holding portion main body 22 from the outer peripheral side so that a large load is not applied to the holding portion main body 22.

The rolling element 25 has an impression cylinder installation portion 25a projecting around the rotation axis AX1 on the outer peripheral side, and the impression cylinder installation portion 25a is brought into contact (friction engagement) with the outer peripheral surface of the impression cylinder 30. The rolling element 25 rolls around the axis AX1.
The outer diameter of the impression cylinder installation portion 25a is formed to be a predetermined amount larger than the outer diameter formed by the outer diameter of the mask M held on the mask holding surface 22a of the holding portion main body 22. Specifically, the outer diameter of the impression cylinder installation portion 25a is set between the substrate S held by the impression cylinder 30 and the mask M when the impression cylinder installation portion 25a comes into contact with the outer peripheral surface of the impression cylinder 30. , As shown in FIG. 3, a predetermined amount of gap G is formed at a value to be formed.

Further, the rolling element 25 is rotatably supported on the inner peripheral side via an air bearing 26 with respect to the inner cylinder 21 around the rotation axis AX1 in a non-contact manner. Therefore, the holding portion main body 22, the holder 23, the leaf spring 24, and the rolling element 25 rotate integrally around the rotation axis AX1.

The leaf spring 24 absorbs the expansion and contraction of the rotation axis AX1 of the holding portion main body 22, and is formed in a ring shape (annular ring), for example, with a steel material, as shown in FIG. As shown in FIG. 3, the leaf spring 24 is fixed to the rolling element 25 via the spacer 24A with a predetermined amount of gap in the Y direction. Similarly, the leaf spring 24 is fixed to the holder 23 via the spacer 24B with a predetermined amount of gap in the Y direction. Three spacers 24A are provided at positions at substantially the same distance from the rotation axis AX1 at equal intervals around the rotation axis AX1. Three spacers 24B are provided at equal intervals so that the distance from the rotation axis AX1 is larger than that of the spacer 24A and the position around the rotation axis AX1 is between the spacers 24A.

Therefore, the holder 23 (holding portion main body 22) and the rolling element 25 connected via the leaf spring 24 are coupled with high rigidity in the rotation axis AX1 rotation direction and rotate integrally, and the rotation axis AX1 direction. Since the leaf spring 24 is easily elastically deformed, the leaf spring 24 is coupled with low rigidity and is capable of relative movement (fine movement).

The inner cylinder 21 is placed on a support base 27 extending in a direction approaching each other from a base portion B provided at intervals in the Y direction via a leaf spring 28. The spring constant of the leaf spring 28 is the load applied to the impression cylinder 30 via the weight of the mask holding portion 20 and the rolling element 25, that is, the impression cylinder installation portion 25a of the rolling body 25 rolls on the outer peripheral surface of the impression cylinder 30. It is set according to the frictional force at the time. The above-mentioned illumination unit 10 is arranged in the internal space of the inner cylinder 21, and a slit-shaped opening elongated in the Y direction is provided so that the illumination light can pass through the positions of the illumination unit 10 facing each other in the illumination light emission direction. A portion 21a is formed (see FIGS. 1 and 2).

The impression cylinder 30 is formed in a columnar shape that is parallel to the Y-axis and rotates (orbits) around the rotation axis AX2 set on the −Z side of the rotation axis AX1. The hollow portion 30a is provided and is set so that the moment of inertia becomes small. The outer peripheral surface of the impression cylinder 30 is a substrate holding surface 31 that contacts and holds the substrate S. The holding surface 31 is preferably a mirror-polished metal surface, but in order to increase the frictional force with the substrate S and suppress slippage, a thin rubber sheet, a resin sheet, or the like having a uniform thickness is coated on the entire circumference. It may be a thing.
On both end faces of the impression cylinder 30 in the Y direction, a rotation support portion 32 having a diameter smaller than that of the impression cylinder 30 and protruding coaxially is rotatably supported by the base portion B around the rotation axis AX2. Further, in the present embodiment, a drive device 33 is provided which rotates the impression cylinder 30 and the mask holding portion 20 in synchronization by driving the impression cylinder 30 in rotation.

The substrate S is formed to have flexibility. Here, the term "flexibility" refers to a property in which the substrate can be bent without being broken or broken even when a force of about its own weight is applied to the substrate. In addition, flexibility also includes the property of bending by a force of about its own weight. Further, the flexibility varies depending on the material, size, thickness, environment such as temperature and humidity, and the like of the substrate. As the substrate S, one strip-shaped substrate may be used, but a plurality of unit substrates may be connected to form a strip-shaped substrate.

As the substrate S, for example, a foil such as a resin film or stainless steel can be used. For example, the resin film may be made of a material such as polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, vinyl acetate resin, etc. Can be used. The substrate S preferably has a small coefficient of thermal expansion so that its dimensions do not change even when it receives heat of, for example, about 200 ° C. For example, an inorganic filler can be mixed with a resin film to reduce the coefficient of thermal expansion. Examples of the inorganic filler include titanium oxide, zinc oxide, alumina, silicon oxide and the like. The width direction (short direction) of the substrate S is formed to be, for example, about 1 m to 2 m, and the length direction (long direction) is formed to be, for example, 10 m or more. Of course, this dimension is only an example and is not limited to this. For example, the dimension of the substrate S in the Y direction may be 1 m or less, 50 cm or less, or 2 m or more. Further, the dimension of the substrate S in the X direction may be 10 m or less.

Subsequently, the operation of the substrate processing apparatus 100 having the above configuration will be described.
The mask holding portion 20 that is supported by the inner cylinder 21 via the air bearing 26 and holds the mask M has an urging force on the + Z side (upward) according to the weight of the mask holding portion 20 and the spring constant of the leaf spring 28. A load different from the above is applied to the impression cylinder 30 via the impression cylinder installation portion 25a of the rolling element 25, and the load is in contact with the impression cylinder 30. As a result, a predetermined amount of gap is formed between the mask holding surface 22a and the substrate holding surface 31, that is, between the mask M and the substrate S, according to the outer diameter of the impression cylinder installation portion 25a. When adjusting the load applied to the impression cylinder 30 by the impression cylinder installation portion 25a, it is replaced with a leaf spring 28 having a corresponding spring constant, or a spacer is previously provided between the inner cylinder 21 and the support base 27. The leaf spring 28 may be installed in a state of interposing the above, and may be replaced with a spacer corresponding to the load applied to the impression cylinder 30 by the impression cylinder installation portion 25a.

Then, the impression cylinder 30 rotates around the rotation axis AX1 from the drive of the drive device 33, and the illumination light is irradiated from the illumination unit 10, passes through the holding unit main body 22 through the opening 21a, and is masked from the inner peripheral side. Illuminate M. As the impression cylinder 30 rotates, the substrate S wound and held around the substrate holding surface 31 of the impression cylinder 30 is conveyed at a predetermined speed, and the outer peripheral surface of the impression cylinder 30 is conveyed via the impression cylinder installation portion 25a. The rolling element 25 that comes into contact with the vehicle is carried around. As a result, the mask M and the substrate S held by the mask holding unit 20 move synchronously while being maintained in a predetermined amount of proximity gap G. Then, the pattern image of the mask M illuminated by the illumination light is sequentially projected onto the projection region of the substrate S.

At this time, since the mask holding portion 20 and the impression cylinder 30 have the same peripheral speed at the position (diameter) where the impression cylinder installation portion 25a and the substrate holding surface 31 abut, the relative moving speed between the mask M and the substrate S. In order to match as much as possible, the position (diameter) of the outer peripheral surface of the mask M, the position (diameter) of the outer peripheral surface of the substrate S, the thickness Mt of the mask M and the thickness St of the substrate S, and the mask of the holding portion main body 22. It is adjusted according to the ratio of the radius r11 on the holding surface 22a and the radius r2 on the substrate holding surface 31 of the impression cylinder 30.
For that purpose, the radius of the portion of the substrate holding surface 31 of the impression cylinder 30 that the outer peripheral surface of the impression cylinder installation portion 25a abuts and the radius of the portion that holds the substrate S are not made the same as shown in FIG. It is necessary to intentionally make it different. Specifically, the position (diameter) in the Z direction in which the outer peripheral surface of the impression cylinder installation portion 25a and the outer peripheral surface of the impression cylinder 30 abut is the gap G between the outer peripheral surface of the mask M and the outer peripheral surface of the substrate S. It should be set in the middle of. For that purpose, the radius of the outer peripheral surface portion of the impression cylinder 30 that comes into contact with the outer peripheral surface of the impression cylinder installation portion 25a may be increased by about St + G / 2 with respect to the radius r2. Therefore, for example, when the thickness St of the substrate S is 200 μm and the gap G is 100 μm, the radius of the outer peripheral surface portion of the impression cylinder 30 that comes into contact with the outer peripheral surface of the impression cylinder installation portion 25a is about 250 μm larger than the radius r2. Just do it.

When the above exposure process is continuously performed, thermal expansion may occur in the holding portion main body 22 illuminated by the illumination light. Regarding the radial (circumferential) thermal expansion of the holding portion main body 22, the holder 23 that holds the holding portion main body 22 from the outer peripheral side is formed of a metal material, and the linear expansion coefficient is higher than the linear expansion coefficient of the holding portion main body 22. By increasing the size, the holding portion main body 22 is not restrained, so that it is possible to avoid applying excessive stress to the holding portion main body 22. Further, at this time, the holding portion main body 22 and the holder 23 are thermally expanded in the direction in which they are separated from each other. However, since the adhesive 23a has elastic adhesive performance, the holding portion main body 22 is loosened by the holder 23. It is also prevented.

When the linear expansion coefficient of the holder 23 is smaller than the linear expansion coefficient of the holding portion main body 22, it is preferable that the holder 23 holds the holding portion main body 22 from the inner peripheral side, but the holding portion main body 22 is held from the outer peripheral side. Even in such a configuration, the adhesive 23a is elastically deformed, so that the stress applied to the holding portion main body 22 at the time of thermal expansion is relaxed.

Further, with respect to thermal expansion of the holding portion main body 22 in the rotation axis AX1 direction, the portion fixed by the spacer 24B is directed toward the rolling element 25 with the portion fixed by the spacer 24A as the base point. Elastically deforms to. In this way, since the thermal expansion of the holding portion main body 22 is absorbed as the elastic deformation of the leaf spring 24, it is avoided that a large stress is generated in the holding portion main body 22 in the rotation axis AX1 direction.

As described above, in the present embodiment, the rolling element 25 in contact with the outer peripheral surface of the impression cylinder 30 in the impression cylinder installation portion 25a is brought around with the impression cylinder 30, so that the mask M and the substrate S have a gap of a predetermined amount. The exposure process can be performed while maintaining the above. Therefore, in the present embodiment, it is possible to prevent fluctuations in the image width of the pattern caused by fluctuations in the amount of gap between the mask M and the substrate S. The value of the gap G may change in a good range depending on the minimum dimension of the pattern to be exposed on the substrate S (the pattern on the mask M), the angular characteristic (numerical aperture) of the illumination light from the illumination unit 10, and the like. However, it is in the range of several tens of μm to several hundreds of μm.

Further, in the present embodiment, an adhesive 23a having elastic adhesive performance is interposed between the holding portion main body 22 and the holder 23 in the radial direction, and the leaf spring 24 is elastically deformed in the rotation axis AX1 direction. Since the stress generated in the holding portion main body 22 due to thermal expansion is relaxed, the distortion of the holding portion main body 22 due to the stress is reduced, and the pattern formation on the substrate S is adversely affected (deterioration of transfer fidelity). Etc.) can be suppressed.
In the case of the present embodiment, the rolling element 25 is made of a metal material, but if the material itself has a large thermal expansion, the diameter (total circumference) of the impression cylinder installation portion 25a will change, so that the rolling element 25 will have a low thermal expansion. It is preferable to use a metal (Invar, etc.) or a ceramic material having a low coefficient of thermal expansion.

(Second Embodiment)
Next, a second embodiment of the substrate processing apparatus 100 will be described with reference to FIGS. 5 and 6. In the first embodiment, the rolling element 25 including the impression cylinder installation portion 25a is exemplified as the gap forming portion that forms a gap between the mask holding surface 22a and the substrate holding surface 31, but in the present embodiment, the pressure is compressed. A case where a drive device for adjusting the position of the mask holding portion 20 with respect to the body 30 is provided will be described. Further, in the present embodiment, it is assumed that the rotation axes AX1 and AX2 are arranged on the same XY plane (the mask holding portion 20 and the impression cylinder 30 are arranged side by side in the horizontal direction).
In these figures, the same elements as the components of the first embodiment shown in FIGS. 1 to 4 are designated by the same reference numerals, and the description thereof will be omitted.

FIG. 5 is an enlarged cross-sectional view of the mask holding portion 20.
The mask holding portion 20 rotates with the holding portion main body 22 and the holder 23A which has a through hole with the rotation axis AX1 as the axis and holds the holding portion main body 22 from the inner peripheral side of the end portion on the + Y side via the adhesive 23a. It has a rotating shaft 34 with the axis AX1 as the axis, and has a holder 23B for holding the holding portion main body 22 from the inner peripheral side of the end on the −Y side via the adhesive 23a, and a through hole with the rotating axis AX1 as the axis. A terminal cylinder 36 that rotatably supports the holder 23A from the outer peripheral side around the rotation axis AX1 via an air bearing 35 is provided. The mask holding portion 20 is rotationally driven independently of the impression cylinder 30 by the driving device MT connected to the rotating shaft 34.

A fixing rod 37 extending in the Y direction is inserted into the internal space of the holding portion main body 22 through the through hole of the terminal cylinder 36 and the holder 23A, and one end thereof is fixed to the terminal cylinder 36 by the fixing plate 37. Has been done. The illumination unit 10 is supported on the fixed rod 37, and the temperature adjustment medium is supplied from the supply unit 39A constituting the temperature adjustment device, and the temperature adjustment medium circulates by discharging from the discharge unit 39B. The temperature rise of the lighting unit 10 is efficiently suppressed, and the temperature of the internal space of the holding unit main body 22 is adjusted.

Further, the substrate processing apparatus 100 of the present embodiment includes a measuring unit 40 that measures the gap amount between the mask holding surface 22a and the substrate holding surface 31, and a holding unit main body 22 according to the measurement result of the measuring unit 40. A gap forming portion is provided with a displacement portion 41 that displaces the mask holding portion 20 in a direction in which the impression cylinder 30 is separated or approaches.

The measuring unit 40 is composed of a CCD camera with a microscope supported by a fixed rod 37, an optical focus (height measurement) sensor, and the like, and faces the holding unit main body 22 on the substrate holding surface 31 of the impression cylinder 30. The gap amount between the mask holding surface 22a and the substrate holding surface 31 is measured by measuring the distance to be performed (here, the position in the X direction), and the measured gap amount is output to the control unit CONT. Will be done.

The displacement portion 41 holds the rotating shaft 34 via the air bearing 42, and also holds the drive portion 44 that drives the holder 23A in the X direction along the guide 43 extending in the X direction, and the end cylinder 36. At the same time, it is composed of a drive unit 47 that drives the end cylinder 36 in the X direction along a guide 46 extending in the X direction, and the above-mentioned control unit CONT that independently drives the drive units 44 and 47. ..

As shown in FIG. 6, on the upstream side of the exposure region in the transport direction of the substrate S, there are a plurality of measurement units 50 having the same configuration as the measurement unit 40 and measuring the alignment mark (not shown) of the substrate S. It is provided. The measuring units 50 in the present embodiment are arranged at three locations at intervals in the transport direction of the substrate S, and at each location at three locations at intervals in the width direction of the substrate S (see FIG. 7). The measurement result is output to the control unit CONT.

In the substrate processing apparatus 100 having the above configuration, the control unit CONT controls the drive of the drive units 44 and 47 according to the gap amount between the mask holding surface 22a and the substrate holding surface 31 measured by the measurement unit 40, which is the same. By setting the driving amount, the mask holding portion 20 is moved in the direction of separating and approaching the impression cylinder 30, and the gap amount is adjusted. Further, the control unit CONT can finely adjust the relative inclination of the rotation axis AX1 and the rotation axis AX2 by changing the drive amounts of the drive units 44 and 47.

Further, based on the alignment mark position of the substrate S measured by the measuring unit 50, the control unit CONT measures the surface distortion of the exposed area on the substrate S before the exposure process in advance, adjusts the gap amount described above, and rotates the axis AX1. It is reflected in the relative inclination adjustment between and the rotation axis AX2.

As described above, in the present embodiment, in addition to obtaining the same actions and effects as those in the first embodiment, the mask holding portion 20 is moved between the mask holding surface 22a and the substrate holding surface 31. The gap amount of can be adjusted to any value. Therefore, in the present embodiment, when the distance between the axes of the rotating axis AX1 and the rotating axis AX2 changes due to an environmental change such as a temperature change, or when the diameters of the holding portion main body 22 and the impression cylinder 30 change, or when the mask Even when the thickness of M and the substrate S varies depending on the production lot and the like, the gap amount between the mask holding surface 22a and the substrate holding surface 31 can be easily adjusted to a predetermined amount, and the mask M can be easily adjusted. The pattern can be exposed on the substrate S with high accuracy.

(Third Embodiment)
Next, a third embodiment of the substrate processing apparatus 100 will be described with reference to FIGS. 7 and 8. In the second embodiment, by controlling the driving of the driving units 44 and 47 to move the mask holding unit 20, the gap amount between the mask holding surface 22a and the substrate holding surface 31, that is, the outer peripheral surface of the mask M The gap G between the mask and the outer peripheral surface of the substrate S is adjusted. However, in the present embodiment, a nesting portion is provided between the mask holding portion 20 and the impression cylinder 30, and the position of the nesting portion is adjusted. An example of adjusting the gap amount between the mask holding surface 22a and the substrate holding surface 31 will be described.
In these figures, the same elements as the components of the second embodiment shown in FIGS. 5 and 6 are designated by the same reference numerals, and the description thereof will be omitted.

In the holding portion main body 22 shown in FIG. 7, a terminal cylinder 36 provided at an end on the + Y side is supported by a support member 51A. The support member 51A is movably supported on the base portion B by a guide portion 52A extending in the X direction in a non-contact manner. Further, the support member 51A is urged and pressurized to the −X side by a predetermined urging force by an air cylinder (urging portion) 53A provided on the + X side. Similarly, in the holding portion main body 22, the rotation shaft 34 on the −Y side is supported by the support member 51B via the air bearing 42. The support member 51B is movably supported on the base portion B by a guide portion 52B extending in the X direction in a non-contact manner. Further, the support member 51B is urged and pressurized to the −X side by a predetermined urging force by an air cylinder (urging portion) 53B provided on the + X side.

The base portions B are provided at intervals in the Y direction, and project to the −X side of the region where the guide portions 52A and 52B are supported and to the + Z side of the guide portions 52A and 52B to provide the impression cylinder 30. A support wall 54 for supporting is provided. A groove 55 extending in the Z direction is formed between each of the support members 51A and 51B and the support wall 54.

As shown in FIG. 8, the width of the groove portion 55 in the X direction is formed so as to have a slight taper with respect to the YZ surface so as to gradually increase toward the + Z direction. More specifically, the + X-side side surface of the support wall 54 (the -X-side side surface forming the groove 55) is formed parallel to the YZ plane, and the -X-side side surfaces (grooves) of the support members 51A and 51B. The + X-side side surface forming 55) is formed so as to be inclined so that the distance from the + X-side side surface of the support wall 54 gradually increases toward the + Z direction with respect to the surface parallel to the YZ plane. A nesting portion 56 is inserted into the groove portion 55 so as to be movable in the Z direction.

As shown in FIG. 7, the drive device (first adjusting unit) MT connected to the rotating shaft 34 and rotating the mask holding unit 20 (that is, the mask M) via the rotating shaft 34 can move in the Y direction. It is provided in the shift stage (second adjustment unit) 48. By controlling the movement of the shift stage 48, the control unit CONT can integrally move the mask holding unit 20, the mask M, and the drive device MT in the Y direction.

In the substrate processing apparatus 100 having the above configuration, the support members 51A and 51B pressurized in the −X direction by the air cylinders 53A and 53B are brought into contact with the recessed portion 56 inserted into the groove portion 55 with an inclined (tapered) surface. By restricting the movement, the positions of the support members 51A and 51B in the X direction are defined. The position where the inclined surfaces of the support members 51A and 51B abut on the nesting portion 56 varies depending on the position of the nesting portion 56 in the Z direction. Therefore, by adjusting the position of the nesting portion 56 in the Z direction, the movement of the support members 51A and 51B is restricted and the position in the X direction where the support members 51A and 51B are positioned can be defined.

That is, in the present embodiment, by adjusting the position of the nesting portion 56 in the Z direction, the positions of the mask holding portion 20 supported by the support members 51A and 51B and the mask M in the X direction can be adjusted, and as a result, the mask The amount of gap between the holding surface 22a and the substrate holding surface 31 (the gap G between the mask M and the substrate S) can be adjusted. Further, by making the position of the nesting portion 56 that restricts the movement of the support members 51A and 51B in the Z direction different between the support member 51A and the support member 51B, the position of the nesting portion 56 with respect to the Y axis in a plane parallel to the XY plane is obtained. It is also possible to finely adjust the inclination of the rotation axis AX1 of the mask holding portion 20.

The movement of the nesting unit 56 in the Z direction in the present embodiment may be performed by a driving device such as a motor based on the measurement result of the measuring unit 50 under the control of the control unit CONT, for example.

On the other hand, based on the alignment mark position of the substrate S measured by the measuring unit (detecting unit) 50, the control unit CONT responds to the relative positional relationship between the mask M and the substrate S in the rotation axis AX1 rotation direction (circumferential direction). The rotation operation of the drive device MT is controlled to align the mask M and the substrate S in the rotation axis AX rotation direction (circumferential direction). Further, the control unit CONT sets the mask holding unit 20, the mask M, and the drive device MT via the shift stage 48 according to the relative positional relationship between the measured mask M and the substrate S in the rotation axis AX1 direction (Y direction). Is integrally moved in the Y direction (rotation axis AX1 direction) to align the mask M and the substrate S in the rotation axis AX1 direction.

As described above, in the present embodiment, in addition to the gap amount between the mask M and the substrate S described above, the relative position in the rotation axis AX1 direction and the relative position in the rotation axis AX1 direction can be easily adjusted. Become.
When adjusting the relative positions of the rotation axes AX1 and AX2 of the mask M and the substrate S in the circumferential direction (circumferential direction), in addition to the method of controlling the drive of the drive device MT, for example, the mask holding unit 20 is used. An electromagnetic brake (dynamic brake) or the like is installed between a rotating portion such as the holding portion main body 22 or the rotating shaft 34 and the fixed portion such as the support members 51A and 51B, and the holding portion is operated or stopped by the operation / stop of the electromagnetic brake. By temporarily applying a load to the rotational force of the main body 22 to reduce the rotational moment, the relative position (angle position) of the mask M in the rotation axis AX1 rotation direction of the mask M may be adjusted with respect to the substrate S.

(Fourth Embodiment)
Next, a fourth embodiment of the substrate processing apparatus 100 will be described with reference to FIGS. 9 to 11. In the first embodiment, the impression cylinder installation portion 25a of the rolling element 25 comes into contact with the impression cylinder 30, so that between the mask holding surface 22a and the substrate holding surface 31, that is, between the mask M and the substrate S. Although the configuration is such that a predetermined amount of gap is formed, in the present embodiment, a configuration will be described in which the gap amount G is appropriately maintained according to the thickness St of the substrate S and the peripheral speeds of the mask M and the substrate S are matched. do.
In these figures, the same elements as the components of the first embodiment shown in FIGS. 1 to 4 are designated by the same reference numerals, and the description thereof will be omitted.

As shown in FIG. 9, the overall configuration of the present embodiment is the same as that of FIG. 1 above, but in the present embodiment, the outer peripheral surfaces of the impression cylinder 30 on both sides in the Y direction and the impression cylinder installation portion of the rolling element 25 The difference is that shims (correction portions) SM1 and SM2 having a predetermined thickness are provided in an annular shape on the outer peripheral surface of 25a.
As shown in FIG. 3, the radius of the impression cylinder installation portion 25a of the rolling element 25 is r1, the radius of the substrate holding surface 31 of the impression cylinder 30 is r2, the radius of the mask holding surface 22a is r11, and the thickness of the mask M. Let M be, the thickness of the substrate S be St, and the predetermined gap amount between the mask M and the substrate S be G. expressed.
DX = r11 + Mt + G + St + r2 ... (1)
Therefore, when the impression cylinder installation portion 25a rolls on the substrate holding surface 31 of the impression cylinder body 30, the radius r1 of the impression cylinder installation portion 25a is obtained by the following equation (2).
r1 = DX-r2 ... (2)

Therefore, when the values of the mask M, the substrate S, and the gap G are determined, the radius r1 of the impression cylinder installation portion 25a has the values obtained from the above equations (1) and (2).

However, for example, as for the substrate S, those having different thicknesses may be used due to differences in lots and the like. This can occur not only for the substrate S but also for the mask M.
Therefore, in the present embodiment, as a correction unit for correcting a change in the thickness of the substrate S, the mask M, etc., a shim is provided at the contact portion between the impression cylinder installation portion 25a of the rolling element 25 and the impression cylinder 30. It has become.

That is, as shown in FIG. 9, a shim (correction portion) SM1 is detachably provided on the outer peripheral surface of the impression cylinder installation portion 25a. Further, a shim (correction portion) SM2 is detachably provided at a position on the outer peripheral surface of the impression cylinder 30 facing the impression cylinder installation portion 25a. As a means for making the shim SM1 detachable from the outer peripheral surface of the impression cylinder installation portion 25a, the shim SM1 is provided with a magnetic portion, and the mask holding portion 20 (impression cylinder installation portion 25a) is provided with a magnetizing portion. Can be taken.

Specifically, a structure in which the shim SM1 is formed of a magnetic material and a structure in which a layer containing a magnetic material such as magnetic powder is formed on the entire surface or a part of the shim SM1 are adopted, and the outer peripheral surface of the impression cylinder installation portion 25a is magnetized. A structure in which a magnet is embedded in the outer peripheral surface of the impression cylinder installation portion 25a can be adopted. As the magnet, a permanent magnet or an electromagnet can be arranged.

As a means for making the shim SM2 detachable from the outer peripheral surface of the impression cylinder 30, it is possible to adopt a configuration in which the shim SM2 is provided with a magnetic portion and the impression cylinder 30 is provided with a magnetizing portion, as in the case of the shim SM1. can.

The shim SM1 is provided over substantially the entire circumference of the outer peripheral surface of the impression cylinder installation portion 25a. Similarly, the shim SM2 is provided over substantially the entire circumference of the outer peripheral surface of the impression cylinder 30 (board holding surface 31). More specifically, when the shim SM1 is wound around the outer peripheral surface of the impression cylinder installation portion 25a, the ends of the rotation axis AX1 in the circumferential direction are overlapped with each other so as not to form a protrusion in the radial direction. It has a length at which a gap is formed in the portion. Then, as shown in FIG. 10A, both ends of the shim SM1 in the circumferential length direction have the same angle so that a gap extending in a direction diagonally intersecting the rotation axis AX1 is formed with a constant width. It is formed in an oblique direction.
With this configuration, even when the mask holding portion 20 and the impression cylinder 30 rotate and the contact range Ta with the impression cylinder 30 moves, a part of the shim SM1 is always present in the contact range Ta, and a step in the gap is formed. This prevents fluctuations in the gap amount, vibration, and the like when the mask holding portion 20 and the impression cylinder 30 are rotated. The configuration of the end portion forming this gap is the same for the shim SM2.

As described above, the thicknesses of the shims SM1 and SM2 are set according to the thicknesses of the substrate S and the mask M in order to maintain the gap amount G between the mask M and the substrate S shown in FIG. In this case, the radius r1 of the impression cylinder installation portion 25a is set smaller than the distance to the outer peripheral surface of the impression cylinder 30 so that the shims SM1 and SM2 can be installed.
Therefore, assuming that the thicknesses of the shims SM1 and SM2 are t1 and t2, respectively, the inter-axis distance DX between the rotation axis AX1 and the rotation axis AX2 is expressed by the following equation (3).
DX = r1 + r2 + t1 + t2 = r11 + Mt + G + St + r2 ... (3)
The total thickness of the shims SM1 and SM2 from the formula (3) is represented by the following formula (4).
t1 + t2 = r11 + Mt + G + St-r1 ... (4)
Then, for example, when the thickness St of the substrate S changes to (St + α), the total thickness of the shims SM1 and SM2 is set to t1 + t2 + α, so that the gap amount G even if the thickness of the substrate S changes. Can be kept constant.

However, the peripheral speeds of the mask holding portion 20 and the impression cylinder 30 are the same at the positions (distances from the rotation axes AX1 and AX2) of the shims SM1 and SM2 at the contact surface tf, and the masks at positions separated from these positions. The peripheral speed of the surface of M (hereinafter, mask surface) and the peripheral speed of the surface of the substrate S (hereinafter, substrate surface) change according to the distances from the rotation axes AX1 and AX2 of each surface. Therefore, the thickness of each shim SM1 and SM2 needs to be set so that the relative peripheral velocities of the mask surface and the substrate surface are the same.

For example, the changed thickness of the substrate S is St'(= St + α), the thicknesses of the shims SM1 and SM2 corresponding to the thickness St'of the substrate S are T1 and T2, respectively, and the angular velocity of the mask holding portion 20 is ω1 and the pressure. The angular velocity of the body 30 is ω2, and as described above with reference to FIG. 3, the position of the contact surface tf is between the outer peripheral surface of the mask M and the outer peripheral surface of the substrate S, that is, approximately in the middle of the gap G. In the case of, since the peripheral velocities on the contact surface tf are the same, the following equation (5) holds.
(R1 + T1) ・ ω1 = (r2 + T2) ・ ω2… (5)
Further, since the peripheral speed of the mask surface and the peripheral speed of the substrate surface are the same, the following equation (6) holds.
(R11 + Mt) ・ ω1 = (r2 + St') ・ ω2… (6)
By rearranging the above equations (5) and (6), the following equation (7) is derived.
(R2 + T2) / (r1 + T1) = (r2 + St') / (r11 + Mt) ... (7)
Further, from the equation (4), the following equation (8) holds.
T1 + T2 = r11 + Mt + G + St'-r1 ... (8)

Therefore, in the present embodiment, by using the shims SM1 and SM2 having the thicknesses T1 and T2 satisfying the formulas (7) and (8), even if the thickness of the substrate S changes, the outer peripheral surface of the mask M can be used. While maintaining the gap amount with the outer peripheral surface of the substrate S, the peripheral speed of the outer peripheral surface of the mask M and the outer peripheral surface of the substrate S can be corrected to be the same. Further, in the present embodiment, since the shims SM1 and SM2 are magnetized on the impression cylinder installation portion 25a and the impression cylinder 30, respectively, they can be easily replaced according to the thickness change of the substrate S, the mask M, and the like. , Work efficiency can be improved. Further, in the present embodiment, since the gap between the ends of the shims SM1 and SM2 extends in the direction intersecting the directions of the rotation axes AX1 and AX2, gap fluctuation and vibration due to the step occur during rolling. It becomes possible to carry out high-precision exposure processing.

Although the configuration in which the ends of the shims SM1 and SM2 are formed in the oblique direction in the fourth embodiment is illustrated, the present invention is not limited to this, and at least a part of the gap between the ends is the rotation axis AX1. It may be formed along a direction intersecting the AX2 direction. For example, as shown in FIG. 10B, a gap along the rotation axis AX1 and AX2 directions and a direction orthogonal to the rotation axis AX1 and AX2 directions are formed. It may be formed in a stepped shape in which gaps are alternately repeated.

Further, even when the gap between the ends is formed along the directions of the rotation axes AX1 and AX2, as shown in FIG. 10C, the rotation axis AX1 and AX2 so that the positions of the gaps are different in the directions around the rotation axes AX1 and AX2. A plurality of shims may be arranged in the AX2 direction.

Further, in the above embodiment, the thickness of the shims SM1 and SM2 is set so that the relative peripheral velocities of the mask surface and the substrate surface are the same. If it is within the permissible range, the thickness of either one of the shims SM1 and SM2 may be fixed, and only the thickness of the other shim may be supported by shim replacement. Further, when the thickness of the substrate S or the mask M does not change significantly, a shim having a required thickness may be fixed with an adhesive in the gap adjustment at the time of initial adjustment.

Further, for example, when the substrate S expands and contracts in the transport direction in the previous step, the thickness distribution of the shims SM1 and SM2 is adjusted so as to correct the expansion and contraction of the substrate S, and the outer peripheral surface of the mask M and the substrate. The relative peripheral speed of S with respect to the outer peripheral surface may be intentionally different.
Here, the thickness St of the substrate S in FIG. 11 is 100 μm, the gap G is 100 μm, the radius (r1 + t1) of the impression cylinder installation portion 25a including the thickness t1 of the shim SM1 and the radius of the impression cylinder 30 including the thickness t2 of the shim SM2. When both (r2 + t2) are 150 mm and the peripheral velocity V0 on the contact surface tf is 50 mm / S, the outer peripheral surface of the mask M is under the condition that the contact surface tf is located in the middle (1/2) of the gap G. And the outer peripheral surface of the substrate S, while maintaining the gap G, both have a peripheral speed of 49.983 mm / S, and the relative speed difference becomes zero.
Since a slight relative difference in peripheral speed occurs depending on where the position (Z direction) of the contact surface tf is set in the gap G, the dimension in the circumferential direction of the pattern exposed on the substrate S is measured on the mask M. It is possible to expand and contract within a certain range with respect to the circumferential dimension of the pattern. In the case of the above numerical example, assuming that the dimension in the peripheral length direction of the pattern on the mask M is 750 mm, the dimension in the transport direction of the pattern exposed on the substrate S can be expanded and contracted by about ± 500 μm at the maximum.
Such expansion / contraction correction of the exposure pattern is also called relative magnification correction in the scanning exposure direction (conveyance direction of the substrate S), and is applied to the base pattern formed on the resin substrate S having a large physical expansion / contraction. In the case of performing accurate superposition exposure, by positively utilizing the relative magnification correction, it is possible to faithfully transfer the pattern according to the background pattern.

(Fifth Embodiment)
Next, a fifth embodiment of the substrate processing apparatus 100 will be described with reference to FIG.
In the fourth embodiment, the thickness of the shims SM1 and SM2 is adjusted to cope with a change in the thickness of the substrate S or the like, but in the present embodiment, the rolling element 25 is elastically deformed in the radial direction. Therefore, a configuration corresponding to a change in the thickness of the substrate S or the like will be described.
In this figure, the same elements as the components of the fourth embodiment shown in FIGS. 9 to 11 are designated by the same reference numerals, and the description thereof will be omitted.

As shown in FIG. 12, in the substrate processing apparatus 100 of the present embodiment, the outer circumference of the impression cylinder installation portion 25a of the rolling element 25 is located between the holder 23 holding the end portion of the holding portion main body 22 and the rolling element 25. A displacement ring 61 that displaces the surface is provided. The displacement ring 61 is formed on the side facing the rolling element 25 around the rotation axis AX1, and is provided with a protrusion having a slope 61a whose diameter gradually increases as the displacement ring 61 is separated from the rolling element 25. The rolling element 25 is provided with a slope 25b that fits into the slope 61a from the outside. Further, an adjustment including a head portion 62b that engages with the rolling element 25 from the side opposite to the displacement ring 61 in the direction of the rotation axis AX1 and a shaft portion 62a that is screwed around the axis parallel to the displacement ring 61 and the rotation axis AX1. Threaded portions (load applying portions) 62 are provided at a plurality of locations at equal angular intervals along a circle parallel to the XZ plane centered on the axis AX1. In the present embodiment, the mask holding portion 20 and the impression cylinder 30 rotate with each other when the impression cylinder installation portion 25a comes into contact with the substrate holding surface 31 of the impression cylinder 30.

In FIG. 12, when adjusting the gap amount between the mask holding surface 22a and the substrate holding surface 31 (the gap amount G between the mask surface and the substrate surface), for example, the shaft portion 62a is screwed into the displacement ring 61. Rotate the adjusting screw 62 in the direction. Since the head portion 62b of the adjusting screw 62 is engaged with the displacement ring 61, the shaft portion 62a is elastically deformed so as to extend in the axial direction parallel to the rotation axis AX1 by being screwed into the displacement ring 61. The elastic restoring force of the shaft portion 62a acts as a load on the rolling element 25 via the head portion 62b in the direction approaching the displacement ring 61.

Since the rolling element 25 to which the load applied in the direction approaching the displacement ring 61 moves in the direction in which the slope 25b expands in diameter along the slope 61a of the displacement ring 61, the load in the direction approaching the displacement ring 61 is applied. The diameter is expanded in the direction of expansion, and the impression cylinder installation portion 25a is elastically deformed to expand the diameter. By expanding the diameter of the impression cylinder installation portion 25a, the gap amount between the mask holding surface 22a and the substrate holding surface 31 (the gap amount G between the mask surface and the substrate surface) can be increased corresponding to the increased diameter. can. Here, if the amount of diameter expansion is too large, the amount of elastic deformation of the shaft portion 62a is reduced by rotating the adjusting screw 62 described above in the opposite direction, and the displacement ring 61 applied to the rolling element 25 As the load in the approaching direction decreases, the amount of diameter expansion of the impression cylinder installation portion 25a becomes smaller.

As described above, in the present embodiment, by rotating the adjusting screw 62, the amount of diameter expansion of the impression cylinder installation portion 25a is adjusted according to the load in the direction approaching the displacement ring 61 and the angles of the slopes 61a and 25b. Then, the gap amount between the mask holding surface 22a and the substrate holding surface 31 (the gap amount G between the mask surface and the substrate surface) can be easily adjusted to a desired value and formed.
When the diameter of the impression cylinder installation portion 25a is expanded by the rotation of the adjusting screw 62, the distance between the contact surface tf and the outer peripheral surface of the mask M in the Z direction (diameter direction) is as shown in FIG. Therefore, there will be a difference in the relative peripheral speed between the outer peripheral surface of the mask M and the outer peripheral surface of the substrate S. Taking this into consideration, the amount of expansion of the diameter of the impression cylinder installation portion 25a is determined. Is desirable.

Regarding the rotation of the adjusting screw 62 described in the fifth embodiment, a rotation driving device is separately provided, and the rotation amount of the adjusting screw 62 is controlled via the rotation driving device according to the gap amount to be adjusted. You may take it. Further, as a means for expanding the diameter of the impression cylinder installation portion 25a, in addition to the adjustment screw 62 described above, a piezoelectric element such as a piezo element may be used to apply a load in the rotation axis AX1 direction to the rolling element 25. .. Further, in addition to the configuration of converting the load in the rotation axis AX1 direction into the load in the radial direction, a piezoelectric element is provided so as to be displaced in the radial direction, and the impression cylinder installation portion 25a is expanded according to the displacement amount of the piezoelectric element. The diameter may be reduced or the diameter may be reduced.

(Sixth Embodiment)
Next, a sixth embodiment of the substrate processing apparatus 100 will be described with reference to FIGS. 13 and 14.
In the first to fifth embodiments, the substrate S in the exposed region has been described as being held on the outer peripheral surface 31 of the impression cylinder 30, but in the present embodiment, the substrate S is formed by using a belt that circulates in an endless band shape. A configuration for holding the surface in a plane will be described.
In these figures, the same elements as the components of the above-described embodiment shown in FIGS. 1 to 12 are designated by the same reference numerals, and the description thereof will be omitted.

The substrate processing apparatus 100 of the present embodiment includes a substrate supply unit 11 for supplying the substrate S, a substrate recovery unit 12 for collecting the substrate S, and a substrate transport unit 90 for transporting the substrate S. The substrate supply unit 11 sends out and supplies, for example, a roll-shaped substrate S. In this case, the substrate supply unit 11 is provided with a shaft portion around which the substrate S is wound, a rotation drive device for rotating the shaft portion, and the like. In addition, for example, a cover portion for covering the substrate S in a rolled state may be provided. The substrate supply unit 11 is not limited to a mechanism for delivering the roll-shaped substrate S, and may include a mechanism for sequentially delivering the strip-shaped substrate S in the length direction thereof.

The substrate recovery unit 12 collects the exposed substrate S by winding it into, for example, a roll. Similar to the substrate supply unit 11, the substrate recovery unit 12 is provided with a shaft portion for winding the substrate S, a rotation drive source for rotating the shaft portion, a cover portion for covering the recovered substrate S, and the like. When the substrate S is cut into a panel shape in the substrate processing unit 11, the substrate S is collected in a state different from that in a rolled state, for example, the substrates S are collected in a stacked state. It doesn't matter if there is one.

The substrate transport unit 90 has a plurality of guide rollers R (two in FIG. 13) for guiding the substrate S supplied from the substrate supply unit 11, and a substrate support mechanism 80 for supporting the substrate S. The substrate support mechanism 80 is arranged between the guide rollers R.

The substrate support mechanism 80 includes a belt portion (endless belt) 81, a belt transport portion 82, and a guide stage (fluid support portion) 83. Further, although not shown, the substrate support mechanism 80 is provided with a belt cleaning unit for cleaning the belt unit 81, an antistatic unit for removing static electricity from the belt unit 81, and the like.

The belt portion 81 is formed in an endless shape using a metal material such as stainless steel.
The belt portion 81 supports the substrate S from the back surface side by a support surface (substrate holding surface) 81a provided on the outside. The belt portion 81 is provided with a plurality of through holes (not shown) arranged side by side in the circumferential direction over the entire circumference. Each through hole is formed so as to penetrate between the support surface 81a of the belt portion 81 and the back surface 81b provided on the back side of the support surface 81a. The plurality of through holes are formed in a plurality of rows in the Y direction. A part of the belt portion 81 is arranged so as to face the back surface of the substrate S.

The belt transport unit 82 has two transport rollers 82a to 82b. A belt portion 81 is hung around the transport rollers 82a to 82b. The transport roller 82b is arranged on the upstream side (+ X side) of the substrate S in the transport direction with respect to the exposure region. The transport roller 82a is arranged on the downstream side of the substrate S in the transport direction with respect to the exposure region. Therefore, the belt portion 81 is configured to move so as to cross the exposure region in the X direction.

The transfer roller 82a and the transfer roller 82b are arranged so as to extend in the Y direction and are arranged at intervals from each other so as to be arranged in the X direction.
The positions of the transport rollers 82a and 82b are adjusted so as to orbit around the axis AX3 (see FIG. 14) parallel to the Y direction while the belt portion 81 has tension.

The transport roller 82a is a drive roller that drives the belt portion 81. The transport roller 82a is provided with a drive unit (circular drive unit) 82e. In the present embodiment, for example, the transfer roller 82a is a drive roller, and the remaining transfer roller 82b is a driven roller. The transport roller 82a, which is a drive roller, is formed of, for example, a porous material, and is connected to a suction device (not shown). With this configuration, the belt portion 81 can be attracted to the outer peripheral surface, so that power can be transmitted to the belt portion 81.

The guide stage 83 is formed in a rectangular plate shape using, for example, a porous material through which a gas can pass. The + Z side surface (guide surface) 83a of the guide stage 83 is formed parallel to the XY plane, and by ejecting gas (fluid) toward the substrate S, the substrate S is ejected by atmospheric pressure (fluid pressure). It functions as a flat pad that is non-contactly supported from the Z side. The guide stage 83 guides the substrate S and the belt portion 81 so as to move in the X direction along the guide surface 83a.

The guide stage 83 is arranged between the transfer roller 82a and the transfer roller 82b in the X direction. Further, as shown in FIG. 14, the guide stage 83 is arranged at a position overlapping the belt portion 81 in the Y direction. The guide surface 33a of the guide stage 33 is provided so as to face the back surface of the belt portion 31. The position of the guide stage 33 is fixed by a fixing mechanism (not shown).

Further, in the present embodiment, the power of the drive unit 82e is transmitted to the mask drive roller (rotating unit) 85 by the train wheel mechanism 84 via the rotating shaft 86 that rotates integrally. As the train wheel mechanism 84, a mechanism including a magnetic gear capable of transmitting power in a non-contact manner can be used.

FIG. 14 is a cross-sectional view of the substrate processing apparatus 100 shown in FIG. 13 cut along a plane parallel to the ZY plane.
As shown in FIG. 14, two mask drive rollers 85 are provided at intervals in the Y direction according to the arrangement of the rolling elements 25. The rotating shaft 86 is supported between the mask drive rollers 85 by a pair of bearings 87 arranged at intervals. These bearings 87 are minutely driven in the Z direction by an elevating device (moving unit) 88 composed of a piezo element or the like.

In the substrate processing device 100 having the above configuration, the rotating shaft 86 is moved in the Z direction via the bearing 87 by the elevating device 83, so that the holding portion main body 22 moves in the Z direction via the mask drive roller 85 and the rolling element 25. It moves integrally and moves relative to the guide stage 83 in the Z direction.
This makes it possible to adjust the gap amount G between the mask holding surface 22a of the holding portion main body 22 and the support surface 81a of the belt portion 81. Therefore, the gap amount G between the mask M held on the mask holding surface 22a and the substrate S held on the support surface 81a is also adjusted to a predetermined amount.

When the gap amount between the mask M and the substrate S is adjusted, the substrate processing apparatus 100 manufactures display elements (electronic devices) such as an organic EL element and a liquid crystal display element by a roll method. Hereinafter, a process of manufacturing a display element using the substrate processing apparatus 100 having the above configuration will be described.

First, a strip-shaped substrate S wound around a roller (not shown) is attached to the substrate supply unit 11. The drive unit 82e is operated to rotate the transfer roller 82a so that the substrate S is sent out from the substrate supply unit 11 from this state. On the other hand, the power of the drive unit 82e is transmitted to the rotating shaft 86 via the train wheel mechanism 84. The mask drive roller 85 rotates due to the rotation of the rotation shaft 86, and the rolling element 25 in contact with the mask drive roller 85 rotates around the mask M, so that the mask M held by the holding portion main body 22a rotates around the rotation axis AX1. Therefore, the mask M rotates in synchronization (cooperation) with the transfer of the substrate S accompanying the orbital operation of the belt portion 81. In this state, the pattern image of the mask M illuminated by the illumination light from the illumination unit 10 is sequentially exposed to the substrate S.

As described above, also in the present embodiment, the gap amount between the mask holding surface 22a of the holding portion main body 22 and the supporting surface 81a of the belt portion 81 can be easily adjusted in response to the change in the thickness of the substrate S. It will be possible. Further, in the present embodiment, when the adjustment amount of the gap is very small and, for example, a vacuum pressurizing type air bearing layer is formed between the belt portion 81 and the guide surface 83a of the guide stage 83, The gap amount may be adjusted by finely moving the guide surface 83a constituting the flat pad in the Z direction.

In the sixth embodiment, the configuration in which the mask M rotates around the rotation axis AX when the rolling element 25 abuts on the mask drive roller 85 and rotates around the mask drive roller 85 has been described as an example, but the present invention is limited to this. Instead, for example, as shown in FIG. 15, the mask M may be configured to rotate when the rolling element 25 abuts on the belt portion 81 and moves around at a position separated from the substrate S.

In the substrate processing apparatus 100 having this configuration, the shim SM1 described in the fourth embodiment is provided on the outer peripheral surface of the impression cylinder installation portion 25a with a thickness corresponding to the thickness of the substrate S, whereby the mask holding surface 22a and the guide stage are provided. The amount of gap between the guide surface 83a of 83 (between the mask surface and the substrate surface) can be adjusted.
Further, when the gap adjustment amount is small, it is possible to adjust the gap amount by adjusting the thickness of the air bearing layer described above. Specifically, as shown in FIG. 15, a control unit CONT as a fluid pressure adjusting unit controls a supply unit 89 that supplies air to the guide stage 83, and a rolling element 25 (impressor installation unit) in the air pad unit. By adjusting the amount of air supplied in the region where 25a) abuts, the thickness of the air bearing layer can be adjusted to move the rolling element 25 in the direction of separating and approaching the belt portion 81. This makes it possible to easily change the distance between the belt portion 81 and the rolling element 25, that is, the gap amount between the mask holding surface 22a and the guide surface 83a (between the mask surface and the substrate surface).

Although the preferred embodiments according to the present invention have been described above with reference to the accompanying drawings, it goes without saying that the present invention is not limited to the above examples. The various shapes and combinations of the constituent members shown in the above-mentioned examples are examples, and can be variously changed based on design requirements and the like within a range that does not deviate from the gist of the present invention.

For example, in the above embodiment, the mask M is held on the outer peripheral surface of the holding portion main body 22, but the present invention is not limited to this, and the mask M is held on the inner peripheral surface of the holding portion main body 22. May be good.

Further, in the above embodiment, the configuration in which the measuring unit for measuring the relative position between the mask M and the substrate S is provided has been described only in the second and third embodiments, but can be applied to other embodiments as well. Needless to say.

Further, the substrate processing apparatus 100 of the above embodiment can be used as the processing apparatus U3 in the device manufacturing system SYS described later.

(7th Embodiment)
Hereinafter, the substrate processing apparatus according to the seventh embodiment of the present invention will be described with reference to FIGS. 16 to 20.
In the following description, similar components may be designated by the same reference numerals to simplify or omit the description. Further, unless otherwise specified, the components and their explanations shall be the same as those in the above embodiment.
In this embodiment, a case where the mask holding portion and the substrate holding portion rotate synchronously (rotate) due to friction will be described as an example.

16 is a front sectional view of a main part of the substrate processing apparatus 200, FIG. 17 is a front view of the mask unit MU constituting the substrate processing apparatus 200, and FIG. 18 is a partially enlarged view at an end portion of the mask unit MU.

The substrate processing apparatus 200 exposes a strip-shaped substrate (for example, a strip-shaped film member) S to a pattern of a flexible sheet-shaped mask M, and exposes the illumination unit 10 and the mask unit MU. , The substrate holding unit SU, the alignment microscopes AL1 and AL2, and the control unit (not shown) are mainly configured. The mask M is a flexible sheet-like glass material, and is formed to have a thickness of, for example, about 200 to 200 μm.

In the present embodiment, the vertical direction is the Z direction, the direction parallel to the rotation axes AX1 and AX2 of the mask unit MU and the substrate holding unit SU is the Y direction, and the Z direction and the direction orthogonal to the Y direction are the X directions. explain.

The illumination unit 10 irradiates the illumination area of the mask M wound around the mask holding unit 20 (described later) in the mask unit MU with illumination light, and is exposed radially in a straight tube type like a fluorescent lamp. Those that emit illumination light for use, those that introduce illumination light from both ends of a cylindrical quartz rod and have a diffusing member on the back side, or semiconductor lasers and LEDs that emit light in the high-intensity ultraviolet region. A large number of such elements are arranged in a row and housed in the internal space of the inner cylinder 21 that supports the mask holding portion 20.

The mask unit MU includes a mask holding portion 20 and a rolling element 25. The mask holding portion 20 includes a holding portion main body 22 and a holder 23. The holding portion main body 22, the holder 23, and the rolling element 25 are provided in an integrated state, and there is a through hole through which the inner cylinder 21 is inserted so as to communicate with the rotation axis (predetermined axis) in the AX1 direction. It is formed in each.

The holding portion main body 22 is formed of a cylindrical glass material having a rotation axis (predetermined axis) AX1 as an axis, and has an outer peripheral surface (peripheral surface) 22a that holds the mask M along a cylindrical surface having a predetermined radius. I have. As shown in FIG. 17, the peripheral length of the outer peripheral surface 22a is set to a length at which both ends in the direction around the rotation axis AX1 are separated when the mask M is wound (in the following description, the holding portion main body). In the 22 and the holder 23, a region in which both ends of the mask M are separated in the direction around the rotation axis AX1 (direction of scanning exposure) is referred to as a mask separation region Ma).

The holder 23 is formed of a metal material in an annular shape, is provided at both ends of the holding portion main body 22 in the length direction, and has a holding portion 23a for holding the holding portion main body 22 from the inner peripheral side. As the material for forming the holder 23, a material having the same coefficient of linear expansion as that of the holding portion main body 22 is preferable. The outer peripheral surface 23b of the holder 23 is formed to have a smaller diameter than the outer peripheral surface 22a of the holding portion main body 22.
Further, on the outer peripheral surface 23b of each holder 23, groove portions 23c extending in the direction around the rotation axis AX1 except for the mask separation region Ma are formed in pairs so as to be parallel to each other at intervals in the Y direction, and the mask separation region is formed. The ends in the circumferential direction are connected to each other at a position separated from Ma, and are formed in a 0-shaped arrangement so as to form an island portion surrounded by a groove 23c.

As shown in FIG. 18, each groove 23c is loaded with a sealing portion 70 that seals the gap between the holder 23 and the mask M with an amount of protrusion that is substantially flush with the outer peripheral surface 22a of the mask holding portion 20. ing. As the seal portion 70, for example, an O-ring is used. The space sealed by the seal portion 70, that is, the closed space surrounded by the holder 23, the mask M, and the seal portion 70 is sucked under negative pressure by the suction portion VC. The seal portion 70 and the suction portion VC form a fixing portion for detachably fixing the mask M to the mask holding portion 20.

Further, as shown in FIG. 17, each holder 23 has a shaft-shaped engaging portion (positioning pin) 71 located in the mask separation region Ma and a shaft-shaped engaging portion (positioning pin) 71 located on the −Y side of the mask M. A portion (positioning pin) 72 is provided respectively. The engaging portion 71 is for positioning relative to the mask holding portion 20 in the circumferential direction when one end edge of the mask M in the circumferential direction is pressed against the outer peripheral surface, and is the outer peripheral surface of the mask M. It is projected at a height that is almost flush with each other. An index mark (index portion) FM, which is an index of the relative positional relationship with the mask M, is formed on the top surface of the engaging portion 71.

The engaging portion 72 positions the mask M relative to the mask holding portion 20 in the Y direction (width direction) when one end edge of the mask M on the −Y side is pressed against the outer peripheral surface. It is projected at a height that is substantially flush with the outer peripheral surface of the mask M. The position of the mask M relative to the mask holding portion 20 is positioned by pressing the edge against both the engaging portions 71 and 72. The mask M has, for example, one in the vicinity of the edge pressed against the engaging portion 71 and two in the vicinity of the edge opposite to the engaging portion 71, which are the same in design as the engaging portion 71, respectively. A mask mark MM is formed at the position in a predetermined positional relationship with the pattern.

The inner cylinder 21 is made of a cylindrical quartz material or the like capable of transmitting the illumination light, or a cylindrical ceramic material or metal having a slit-shaped opening 21a through which the illumination light from the illumination unit 10 passes. ..

Returning to FIG. 16, the rolling element 25 is physically connected (connected) to the holding portion main body 22 via the holder 23, is projected on the outer peripheral side around the rotation axis AX1, and rolls on the outer peripheral surface of the impression cylinder 30. It has a moving impression cylinder installation portion 25a. The outer diameter of the impression cylinder installation portion 25a is formed to be a predetermined amount larger than the outer diameter formed by the outer diameter of the mask M held on the mask holding surface 22a of the holding portion main body 22. Specifically, the outer diameter of the impression cylinder installation portion 25a is held by the impression cylinder 30 when the impression cylinder installation portion 25a abuts on the outer peripheral surface of the impression cylinder 30 and the holding portion main body 22 is supported at a predetermined position. It is formed at a value at which a predetermined amount of gap is formed between the formed substrate S and the mask M.

Further, the rolling element 25 is rotatably supported on the inner peripheral side via an air bearing 26 with respect to the inner cylinder 21 around the rotation axis AX1 in a non-contact manner. Therefore, the holding portion main body 22, the holder 23, and the rolling element 25 rotate integrally around the rotation axis AX1.

The inner cylinder 21 is placed on a support base 27 extending in a direction approaching each other from a base portion B provided at intervals in the Y direction via a leaf spring 28. The spring constant of the leaf spring 28 is the load applied to the impression cylinder 30 via the weight of the mask holding portion 20 and the rolling element 25, that is, the impression cylinder installation portion 25a of the rolling body 25 rolls on the outer peripheral surface of the impression cylinder 30. It is set according to the frictional force at the time. The above-mentioned illumination unit 10 is arranged in the internal space of the inner cylinder 21, and an opening 21a through which the illumination light passes is formed at a position facing the illumination unit 10 in the illumination light emission direction (FIG. 16). reference).

The alignment microscopes AL1 and AL2 detect the relative positional relationship between the mask M and the mask holding portion 20, and each mark so that the mask mark MM of the mask M and the index mark FM of the engaging portion 71 can be observed. It is arranged at the same Y position as MM and FM.

The substrate holding unit SU includes an impression cylinder (board holding portion) 30.
The impression cylinder 30 is formed in a columnar shape that is parallel to the Y axis and rotates around the rotation axis (second axis) AX2 set on the −Z side of the rotation axis AX1 and has a hollow portion inside. The moment of inertia is set to be small. The outer peripheral surface of the impression cylinder 30 is a substrate holding surface 31 that contacts and holds the substrate S. On both end faces of the impression cylinder 30 in the Y direction, a rotation support portion 32 having a diameter smaller than that of the impression cylinder 30 and protruding coaxially is rotatably supported by the base portion B around the rotation axis AX2. Further, in the present embodiment, a drive device 33 is provided which rotates the impression cylinder 30 and the mask holding portion 20 in synchronization by driving the impression cylinder 30 in rotation.

Subsequently, the procedure for assembling the mask unit MU in the substrate processing apparatus 200 having the above configuration will be described.
First, regarding the mask M, for example, for a display device containing a fine pattern having a line width of 20 μm or less with a light-shielding layer such as chromium on one surface of a strip-shaped ultrathin glass plate (for example, a thickness of 200 to 500 μm) having good flatness. It is created as a transmissive flat sheet mask on which the circuit pattern of the above is formed. Since the mask M is mounted with a curvature corresponding to the radius of the outer peripheral surface 22a of the holding portion main body 22 during substrate processing, the mask M is stretched in the circumferential direction according to the thickness of the mask M and the radius of the outer peripheral surface 22a at the time of mounting ( Outer peripheral surface side) or compressed (inner peripheral surface side). Therefore, the pattern of the mask M in the circumferential direction is a pattern in which the size at the time of mounting is enlarged or reduced according to the above-mentioned thickness and curvature with respect to the size at the time of formation. Therefore, at the time of pattern formation, the pattern is formed with a size that allows for this expansion or contraction.

The mask M created as described above is used in a state of being curved according to the outer peripheral surface 22a of the holding portion main body 22 and wound (pasted) around the outer peripheral surface. When winding the mask M around the outer peripheral surface 22a, one end edge of the mask M in the circumferential direction is pressed against the outer peripheral surface of the engaging portion 71, and one end edge of the mask M in the width direction is pressed against the engaging portion 72. , The mask M is wound around the mask holding portion 20 (holding portion main body 22) in a positioned state. After winding the mask M, the suction unit VC is operated to suck the closed space sealed by the seal unit 70 with negative pressure, so that the mask M is attracted and held at both ends in the Y direction. When an air layer is formed between the mask M and the holding portion main body 22 and an interface having a large difference in refractive index is generated, the image quality of the pattern exposed on the substrate S is improved due to the influence of interference phenomenon, multiple reflection, and the like. Since it may be aggravated, pure water having a refractive index similar to that of the glass material between the mask M and the holding portion main body 22, an oil immersion microscope, or the like is used so as to suppress the occurrence of such a large difference in refractive index. It is preferable to interpose a liquid such as oil used in the above.
In that case, the liquid preferably has a sufficient transmittance (for example, 90% or more) in the wavelength range of the illumination light for exposure.

Further, since such a liquid gradually evaporates from the peripheral edge portion of the mask M, the vicinity of the outer peripheral surface 22a of the holding portion main body 22 where the peripheral edge of the mask M is located, or the engaging portions 71 and 72 are provided. For example, a plurality of hydrangea grooves (width of about 1 mm) having a depth of about several μm to several tens of μm are engraved on a part of the outer peripheral surface 22a in the vicinity of the nozzles, and are directed toward the grooves. Therefore, it is preferable to provide a liquid supply mechanism for occasionally dropping the liquid from above the outer peripheral surface 22a of the holding portion main body 22 via a dropper-shaped or needle-shaped nozzle.
With such a configuration, the liquid dropped in the plurality of grooves is rotated at a practical angular velocity (for example, about 50 to 200 mm / S as the peripheral speed of the pattern surface of the mask M) of the holding portion main body 22. Is trapped in the groove, so that it can be impregnated between the outer peripheral surface 22a of the holding portion main body 22 and the mask M due to the capillary phenomenon.
Of course, such a plurality of grooves are provided at positions outside the pattern forming region on the mask M so as not to disturb the exposure illumination light.

For the mask unit MU on which the mask M is adsorbed and held, the position information of the pattern is detected in advance before the exposure process. Specifically, the mask mark MM and the index mark FM are detected by the alignment microscopes AL1 and AL2 while rotating the mask holding unit 20 around the rotation axis AX1. As a result, the relative positional relationship of the mask M with respect to the index mark FM, that is, the relative positional relationship of the pattern is measured. By performing a predetermined calculation using this relative positional relationship, the pattern formed on the mask M has a position in the direction around the rotation axis AX1, a position in the Y direction, a rotation in the direction along the outer peripheral surface 22a, a magnification, and the like. , The error information of the pattern with respect to the mask holding unit 20 can be obtained.

Next, the operation of the substrate processing apparatus 200 will be described.
The mask holding portion 20 that is supported by the inner cylinder 21 via the air bearing 26 and holds the mask M is the difference between the own weight of the mask holding portion 20 and the urging force toward the + Z side according to the spring constant of the leaf spring 28. The load of the above is applied to the impression cylinder 30 by the impression cylinder installation portion 25a of the rolling element 25 in contact with the impression cylinder 30. As a result, a predetermined amount of gap is formed between the mask holding surface 22a and the substrate holding surface 31, that is, between the mask M and the substrate S, according to the outer diameter of the impression cylinder installation portion 25a. When adjusting the load applied to the impression cylinder 30 by the impression cylinder installation portion 25a, it is replaced with a leaf spring 28 having a corresponding spring constant, or a spacer is previously provided between the inner cylinder 21 and the support base 27. The leaf spring 28 may be installed in a state of interposing the above, and may be replaced with a spacer corresponding to the load applied to the impression cylinder 30 by the impression cylinder installation portion 25a.

Then, the impression cylinder 30 rotates around the rotation axis AX1 from the drive of the drive device 33, and the illumination light is irradiated from the illumination unit 10, passes through the holding unit main body 22 through the opening 21a, and is masked from the inner peripheral side. Illuminate M. As the impression cylinder 30 rotates, the substrate S wound and held around the substrate holding surface 31 of the impression cylinder 30 is conveyed, and the rolling element 25 abuts on the outer peripheral surface of the impression cylinder 30 at the impression cylinder installation portion 25a. The rotational driving force is transmitted to the holding portion main body 22 via the holder 23, and the pattern of the mask M held by the holding portion main body 22 maintains a constant gap between the substrate S and a predetermined amount. Move in sync. Then, the pattern image of the mask M illuminated by the illumination light is sequentially projected onto the projection region of the substrate S.

When the pattern of the mask M is projected onto the substrate S, the position of the substrate S in the direction around the rotation axis AX2, the position in the Y direction, and the mask holding portion of the impression cylinder 30 are based on the error information of the pattern obtained in advance. It is preferable to adjust the rotation speed relative to 20, the relative positional relationship between the rotation axes AX1 and AX2, and the gap amount between the mask M and the substrate S.

As described above, in the mask unit MU of the present embodiment, since the mask M formed of the glass material is held by the holding portion main body 22 formed of the glass material, a pattern can be easily formed and the holding portion main body can be easily formed. It is possible to suppress an increase in cost due to the time and effort required to directly form the pattern on 22. Further, in the present embodiment, since the pattern is formed on the mask M which is a flat surface instead of the cylindrical surface, a pattern having a finer width, for example, a pattern having a line width of 20 μm or less can be formed with high accuracy. ..

Further, in the present embodiment, when the mask M is attached to the mask holding portion 20, the mask M can be easily positioned on the mask holding portion 20 by engaging the mask M with the engaging portions 71 and 72. .. Moreover, in the present embodiment, since the index mark FM is provided in the engaging portion 71, it is not necessary to separately provide a member for the index mark, and the device can be downsized and the price can be reduced. Further, in the present embodiment, the mask M can be easily and quickly replaced by operating the suction / suction stop by the suction unit VC.

(Device manufacturing system)
Next, a device manufacturing system including the above-mentioned substrate processing apparatus 200 will be described with reference to FIG.
FIG. 19 is a diagram showing a partial configuration of a device manufacturing system (flexible display manufacturing line) SYS. Here, the flexible substrate P (sheet, film, etc.) drawn out from the supply roll FR1 sequentially passes through n processing devices U1, U2, U3, U4, U5, ... Un to the recovery roll FR2. An example of how to wind up is shown. The upper control device CONT2 controls each of the processing devices U1 to Un constituting the production line in an integrated manner.

The device manufacturing system SYS of the present embodiment is a so-called roll-to-roll system in which various processes for manufacturing one device are continuously applied to the substrate P. The substrate P that has been subjected to various treatments is divided (diced) for each device (for example, a display panel of an organic EL display) to become a plurality of devices. The dimensions of the substrate P are, for example, about 10 cm to 2 m in the width direction (the short Y direction) and 10 m or more in the length direction (the long X direction).

In FIG. 19, the Cartesian coordinate system XYZ is set so that the front surface (or back surface) of the substrate P is perpendicular to the XZ plane, and the width direction orthogonal to the transport direction (long direction) of the substrate P is set to the Y direction. It shall be done. The substrate P may be one whose surface is modified and activated by a predetermined pretreatment in advance, or one in which a fine partition wall structure (concavo-convex structure) for precision patterning is formed on the surface.

The substrate P wound around the supply roll FR1 is pulled out by the nipped drive roller DR1 and conveyed to the processing device U1, but the center of the substrate P in the Y direction (width direction) is targeted by the edge position controller EPC1. Servo control is performed so that the position falls within the range of ± tens of μm to several tens of μm.

The processing apparatus U1 continuously or continuously applies a photosensitive functional liquid (photoresist, photosensitive silane coupling material, UV curable resin liquid, etc.) to the surface of the substrate P in the transport direction (long direction) of the substrate P by a printing method. It is a coating device that selectively coats. A coating mechanism including an impression roller DR2 around which the substrate P is wound, a coating roller for uniformly applying the photosensitive functional liquid on the surface of the substrate P on the impression roller DR2, and the like in the processing device U1. Gp1, a drying mechanism Gp2 for rapidly removing the solvent or water contained in the photosensitive functional liquid applied to the substrate P, and the like are provided.

The processing device U2 is a heating device for heating the substrate P conveyed from the processing device U1 to a predetermined temperature (for example, about several 10 to 120 ° C.) to stabilize the photosensitive functional layer coated on the surface. Is. In the processing device U2, a plurality of rollers and an air turn bar for folding back and transporting the substrate P, a heating chamber portion HA1 for heating the carried-in substrate P, and the temperature of the heated substrate P are set. A cooling chamber portion HA2, a nipped drive roller DR3, and the like are provided to lower the temperature so as to be uniform with the environmental temperature of the post-process (processing apparatus U3).

The processing device U3 as the substrate processing device 200 is the exposure device shown in FIGS. 16 to 18 above, and displays the photosensitive functional layer of the substrate P (board S) conveyed from the processing device U2. Irradiate the patterning light of ultraviolet rays corresponding to the circuit pattern and wiring pattern for. The edge position controller EPC that controls the center of the substrate P in the Y direction (width direction) to a fixed position, the nipped drive roller DR4, and the substrate P are partially wound in the processing device U3 with a predetermined tension, and the substrate P is partially wound. A rotating drum DR5 (impressor body 30) that supports a portion exposed to a pattern on P in a uniform cylindrical surface, and two sets of drive rollers DR6 for giving a predetermined slack (play) DL to the substrate P. DR7 and the like are provided.

Further, in the processing device U3, a transmissive cylindrical mask M (mask unit MU) and an illumination mechanism IU (illumination) provided in the cylindrical mask M to illuminate a mask pattern formed on the outer peripheral surface of the cylindrical mask M. In order to align the image of a part of the mask pattern of the cylindrical mask M with the part of the substrate P supported in a cylindrical surface shape by the rotary drum DR5 and the part 10), the substrate P is relatively aligned. Alignment microscopes AM1 and AM2 for detecting an alignment mark or the like formed in advance on P are provided.

The processing device U4 is a wet processing device that performs wet development processing, electroless plating treatment, and the like on the photosensitive functional layer of the substrate P conveyed from the processing device U3. In the processing apparatus U4, three processing tanks BT1, BT2, and BT3 layered in the Z direction, a plurality of rollers for bending and transporting the substrate P, a nipped drive roller DR8, and the like are provided.

The processing device U5 is a heating / drying device that warms the substrate P conveyed from the processing device U4 and adjusts the water content of the substrate P moistened by the wet process to a predetermined value, but the details will be omitted. After that, the substrate P that has passed through the final processing apparatus Un of the series of processes through several processing apparatus is wound up on the recovery roll FR2 via the nipped drive roller DR1. Even during the winding, the edge position controller EPC2 is used by the edge position controller EPC2 so that the center of the substrate P in the Y direction (width direction) or the edge of the substrate in the Y direction does not fluctuate in the Y direction. The relative position of the direction is sequentially corrected and controlled.

In the device manufacturing system SYS, since the substrate processing device 200 described above is used as the processing device U3, a pattern can be easily formed, and it takes time and effort as in the case of forming a pattern on the holding unit main body 22. It is possible to suppress the cost increase and to manufacture a high-precision device at low cost.
The processing device U3 shown in FIG. 19 may be the substrate processing device 100 described in each of the above embodiments of FIGS. 1 to 15.

Although the preferred embodiments according to the present invention have been described above with reference to the accompanying drawings, it goes without saying that the present invention is not limited to the above examples. The various shapes and combinations of the constituent members shown in the above-mentioned examples are examples, and can be variously changed based on design requirements and the like within a range that does not deviate from the gist of the present invention.

For example, in the above embodiment, the mask M is wound (pasted) around the outer peripheral surface 22a of the holding portion main body 22, but the present invention is not limited to this, and as shown in FIG. 20, the holding portion main body 22 It may be attached to the inner peripheral surface. In this case, the illumination unit 10 is arranged outside the mask unit MU, the circumferential length of the mask M is set to less than half of the circumferential length of the inner peripheral surface of the holding unit main body 22, and the illumination unit 10 is illuminated by the illumination light. The configuration is such that the light from the mask pattern is emitted from the side opposite to the incident position of the illumination light on the holding unit main body 22, and the direction in which the rotation axis AX1 extends in the reflecting mirror unit installed in the inner cylinder 21. It is possible to adopt a configuration or the like that reflects the light on the outside of the mask unit MU.

Further, in the above embodiment, the seal portion 70 and the suction portion VC are used as the fixing portions for fixing the mask M to the mask holding portion 20, but the present invention is not limited to this, and for example, an adhesive. The mask M may be fixed to the mask holding portion 20 using the above, or the mask M may be fixed to the mask holding portion 20 by a mechanical clamping mechanism.
Further, the mask M may be adsorbed to the mask holding portion 20 by an electrostatic adsorption method (Coulomb force).

As described above, even when the mask M is attached to the inner peripheral surface of the holding portion main body 22, if an air layer is formed between the inner peripheral surface of the holding portion main body 22 and the mask M, the substrate S Since there is a high possibility that the image quality of the pattern exposed to the mask M will deteriorate, the base material (glass, etc.) of the mask M is placed between the inner peripheral surface of the holding portion main body 22 and the mask M in the same manner as in the previous embodiment. It is desirable to fill a layer having a refractive index similar to that of the transparent thin plate) so as to form a layer having a predetermined thickness.

(8th Embodiment)
Hereinafter, the substrate processing apparatus according to the eighth embodiment of the present invention will be described with reference to FIGS. 21 to 24.
In the following description, similar components may be designated by the same reference numerals to simplify or omit the description. Further, unless otherwise specified, the components and their explanations shall be the same as those in the above embodiment.
FIG. 21 is a front sectional view of a main part of the substrate processing apparatus 300, and FIG. 22 is a sectional perspective view of the substrate processing apparatus.

The substrate processing apparatus 300 exposes a strip-shaped substrate (for example, a strip-shaped film member) S to a pattern of a flexible sheet-shaped mask M, and exposes the illumination unit 10 and the mask unit MU2. , The substrate holding unit SU, and the control unit CONT are mainly configured.
In the present embodiment, the vertical direction will be the Z direction, the direction parallel to the rotation axis of the mask unit MU2 and the substrate holding unit SU will be the Y direction, and the Z direction and the direction orthogonal to the Y direction will be described as the X direction.

The illumination unit 10 irradiates the illumination light toward the illumination region of the mask M wound around the mask holding unit 20 (described later) in the mask unit MU2, and is exposed radially in a straight tube type like a fluorescent lamp. The inside of the inner cylinder 21 that emits the illumination light for the purpose, or the one that introduces the illumination light from both ends of the cylindrical quartz rod and has a diffusing member on the back surface side, and supports the mask holding portion 20. It is housed in the space.

The mask unit MU2 includes a mask holding portion 20, a leaf spring (elastic member) 24, and a rolling element (support member) 25. The mask holding portion 20 includes a cylindrical holding portion main body (pattern holding member) 22 and holders (annular portions) 23 provided at both ends of the holding portion main body 22 in the length direction. The holding portion main body 22, the holder 23, the leaf spring 24, and the rolling element 25 are provided in an integrated state, and the inner cylinder 21 is inserted so as to communicate with the rotation axis (predetermined axis) in the AX1 direction. Through holes are formed in each.

The inner cylinder 21 is made of a cylindrical quartz material or the like capable of transmitting the illumination light, or a cylindrical ceramic material or metal having a slit-shaped opening 21a through which the illumination light from the illumination unit 10 passes. .. The holding portion main body 22 is formed with a mask holding surface 22a on the outer peripheral surface thereof, which holds the mask M along a cylindrical surface having a predetermined radius. The holder 23 is formed of a metal material in an annular shape, and as shown in FIG. 23, is adhered to the outer peripheral surface of the end portion of the holding portion main body 22 by an adhesive 23a that exhibits elastic adhesive performance after curing. The material for forming the holder 23 is preferably one having the same coefficient of linear expansion as that of the holding portion main body 22, but when there is a difference in the coefficient of linear expansion, the difference in thermal expansion between the holding portion main body 22 and the holder 23 is used. The holder 23 having a large coefficient of linear expansion holds the holding portion main body 22 from the outer peripheral side so that a large load is not applied to the holding portion main body 22.

The rolling element 25 is physically coupled (connected) to the holding portion main body 22 via a leaf spring 24, spacers 24A, and 24B (see FIGS. 23 and 24), and projects around the rotation axis AX1 on the outer peripheral side. It has an impression cylinder installation portion 25a that rolls on the outer peripheral surface of the impression cylinder 30. The outer diameter of the impression cylinder installation portion 25a is formed to be a predetermined amount larger than the outer diameter formed by the outer diameter of the mask M held on the mask holding surface 22a of the holding portion main body 22. Specifically, the outer diameter of the impression cylinder installation portion 25a is held by the impression cylinder 30 when the impression cylinder installation portion 25a abuts on the outer peripheral surface of the impression cylinder 30 and the holding portion main body 22 is supported at a predetermined position. It is formed at a value at which a predetermined amount of gap is formed between the formed substrate S and the mask M.

Further, the rolling element 25 is rotatably supported on the inner peripheral side via an air bearing 26 with respect to the inner cylinder 21 around the rotation axis AX1 in a non-contact manner. Therefore, the holding portion main body 22, the holder 23, the leaf spring 24, and the rolling element 25 rotate integrally around the rotation axis AX1.

The leaf spring 24 allows expansion and contraction of the rotation axis AX1 of the holding portion main body 22, and is formed in a ring shape (annular ring), for example, with a steel material, as shown in FIG. 24. As shown in FIG. 23, the leaf spring 24 is fixed to the rolling element 25 with a predetermined amount of gap in the Y direction via the spacer 24A. Similarly, the leaf spring 24 is fixed to the holder 23 via the spacer 24B with a predetermined amount of gap in the Y direction. Three spacers 24A are provided at positions at substantially the same distance from the rotation axis AX1 at equal intervals around the rotation axis AX1. Three spacers 24B are provided at equal intervals so that the distance from the rotation axis AX1 is larger than that of the spacer 24A and the position around the rotation axis AX1 is between the spacers 24A.

These leaf springs 24, spacers 24A, and 24B transmit the rotational driving force between the connected holder 23, the holding portion main body 22, and the rolling element 25 as transmission portions, thereby transmitting the leaf springs 24, spacers 24A, and 24B. The holder 23, the holding portion main body 22 and the rolling element 25 connected via the holder 23 are integrally rotated in the rotation axis AX1 direction, and the leaf spring 24 is elastically deformed as an expansion / contraction allowable portion in the rotation axis AX1 direction. As a result, the holder 23, the holding portion main body 22, and the rolling element 25 can be moved relative to each other in a minute amount.

The ring-shaped leaf spring 24 shown in FIG. 24 has a configuration as shown in FIG. 25 in detail, and three spacers 24A are arranged on one surface of the leaf spring 24 about the rotation axis AX1. It is fixed at 120 degrees, and on the other surface of the leaf spring 24, three spacers 24B are arranged at about 120 degrees about the rotation axis AX1 and ± 60 degrees with respect to the spacer 24A on the front side. Fixed in placement. The thicknesses of the spacers 24A and 24B are the same, and the dimensions in the circumferential direction are set as small as possible.
The three spacers 24A fasten the end face of the ring-shaped rolling element 25 and the leaf spring 24 with screws, and the three spacers 24B fasten the end face of the ring-shaped holder 23 with the leaf spring 24 with screws.

In the present embodiment, the expansion / contraction allowable portion is configured by such a structure, but as shown in FIG. 26, elastic deformation occurs in the Y direction (the direction in which the axis AX1 extends) and the radial direction R of the ring-shaped holder 23. It is possible, and a metallic flexure structure FLX with extremely high rigidity is prepared in the tangential direction T of the holder 23, and the holder 23 and the rolling element 25 are placed in three places (rotation axis AX1) by this flexure structure FLX. It may be fastened at 120 degrees as the center).
One of the flexure structures FLX as shown in FIG. 26 has extremely low rigidity in the radial direction, but when they are arranged at three locations at 120 degrees around the axis AX1 at the same distance from the axis AX1, each fracture structure The degree of freedom of deformation in the radial direction R of the body FLX is mutually constrained, and the holder 23 and the rolling element 25 are fastened with high rigidity in the XZ in-plane direction orthogonal to the rotation axis AX1 in the Y direction in which the rotation axis AX1 extends. Is elastically and displaceably fastened.

The inner cylinder 21 is placed on a support base 27 extending in a direction approaching each other from a base portion B provided at intervals in the Y direction via a leaf spring 28. The spring constant of the leaf spring 28 is the load applied to the impression cylinder 30 via the weight of the mask holding portion 20 and the rolling element 25, that is, the impression cylinder installation portion 25a of the rolling body 25 rolls on the outer peripheral surface of the impression cylinder 30. It is set according to the frictional force at the time. The above-mentioned illumination unit 10 is arranged in the internal space of the inner cylinder 21, and an opening 21a through which the illumination light passes is formed at a position facing the illumination unit 10 in the illumination light emission direction (FIG. 21). And FIG. 22).

The substrate holding unit SU includes an impression cylinder (rotary drum) 30.
The impression cylinder 30 is formed in a columnar shape parallel to the Y axis and rotating around the rotation axis (second axis) AX2 set on the −Z side of the rotation axis AX1. A hollow portion 30a is provided inside and is set so that the moment of inertia becomes small. The outer peripheral surface of the impression cylinder 30 is a substrate holding surface 31 that contacts and holds the substrate S. On both end faces of the impression cylinder 30 in the Y direction, a rotation support portion 32 having a diameter smaller than that of the impression cylinder 30 and protruding coaxially is rotatably supported by the base portion B around the rotation axis AX2. Further, in the present embodiment, a drive device 33 is provided which rotates the impression cylinder 30 and the mask holding portion 20 in synchronization by driving the impression cylinder 30 in rotation.

Subsequently, the operation of the substrate processing apparatus 300 having the above configuration will be described.
The mask holding portion 20 that is supported by the inner cylinder 21 via the air bearing 26 and holds the mask M is the difference between the own weight of the mask holding portion 20 and the urging force toward the + Z side according to the spring constant of the leaf spring 28. The load of the above is applied to the impression cylinder 30 by the impression cylinder installation portion 25a of the rolling element 25 in contact with the impression cylinder 30. As a result, a predetermined amount of gap is formed between the mask holding surface 22a and the substrate holding surface 31, that is, between the mask M and the substrate S, according to the outer diameter of the impression cylinder installation portion 25a. When adjusting the load applied to the impression cylinder 30 by the impression cylinder installation portion 25a, it is replaced with a leaf spring 28 having a corresponding spring constant, or a spacer is previously provided between the inner cylinder 21 and the support base 27. The leaf spring 28 may be installed in a state of interposing the above, and may be replaced with a spacer corresponding to the load applied to the impression cylinder 30 by the impression cylinder installation portion 25a.

Then, the impression cylinder 30 rotates around the rotation axis AX1 from the drive of the drive device 33, and the illumination light is irradiated from the illumination unit 10, passes through the holding unit main body 22 through the opening 21a, and is masked from the inner peripheral side. Illuminate M. As the impression cylinder 30 rotates, the substrate S wound and held around the substrate holding surface 31 of the impression cylinder 30 is conveyed, and the rolling element 25 abuts on the outer peripheral surface of the impression cylinder 30 at the impression cylinder installation portion 25a. The rotational driving force is transmitted to the holder 23 and the holding portion main body 22 via the leaf spring 24, the spacers 24A, and 24B, and the pattern of the mask M held by the holding portion main body 22 is a predetermined amount with the substrate S. Move synchronously while maintaining a constant gap. Then, the pattern image of the mask M illuminated by the illumination light is sequentially projected onto the projection region of the substrate S.

At this time, since the mask holding portion 20 and the impression cylinder 30 have the same peripheral speed at the position (diameter) where the impression cylinder installation portion 25a and the substrate holding surface 31 abut, the relative moving speed between the mask M and the substrate S. The position (diameter) of the outer peripheral surface of the mask M and the position (diameter) of the outer peripheral surface of the substrate S are the thicknesses of the mask M and the substrate S and the mask holding surface 22a of the holding portion main body 22. The diameter is adjusted according to the ratio of the diameter of the impression cylinder 30 to the diameter of the impression cylinder 30 on the substrate holding surface 31. For example, the thickness of the mask M and the substrate S are the same, the diameter of the mask holding surface 22a and the diameter of the impression cylinder 30 on the substrate holding surface 31 are the same, and the holding portion main body 22 and the impression cylinder 30 rotate at the same angular speed. In this case, the substrate S is from the distance from the position where the impression cylinder installation portion 25a and the substrate holding surface 31 abut to the position of the outer peripheral surface of the mask M and the position where the impression cylinder installation portion 25a and the substrate holding surface 31 abut. The distance to the position of the outer peripheral surface of the above may be the same. In other cases, the impression cylinder is installed on each of the holding portion main body 22 and the impression cylinder 30 so that the peripheral speed of the outer peripheral surface of the mask M and the peripheral speed of the outer peripheral surface of the substrate S are the same. It is preferable to set the diameter of the contact position between the portion 25a and the substrate holding surface 31.

Therefore, an example in which the peripheral speed of the outer peripheral surface of the mask M and the peripheral speed of the outer peripheral surface of the substrate S are made the same will be described with reference to FIG. 27. FIG. 27 is a modification of the method of adjusting the diameter by the shim described in FIG. 11 above, and the same members as those in FIG. 23 are designated by the same reference numerals. As shown in FIG. 27, the deformed portion is obtained by winding an annular shim (a predetermined thickness metallic belt) 31B around a portion of the substrate holding surface 31 that comes into contact with the impression cylinder installation portion 25a. When viewed in the YZ plane of the above, the contact position between the outer peripheral surface of the impression cylinder installation portion 25a and the outer peripheral surface of the shim (belt of a predetermined thickness metal) 31B is the gap G between the mask M and the substrate S. It is a point to be set at a position Cx approximately in the middle of.

The position Cx is a position set to r11 + Mt + G / 2 as a radius from the rotation axis AX1 of the mask M, and is also a position set to r2 + St + G / 2 as a radius from the rotation axis AX2 of the impression cylinder 30.
A shim 31B having a thickness that satisfies such conditions is selected (prepared) and wound around the outer peripheral surface of the substrate holding surface 31, but if the thickness can be constant, the shim 31B of the substrate holding surface 31 The diameter of the portion that comes into contact with the impression cylinder installation portion 25a may be processed to r2 + St + G / 2. If the shim 31B can be wound interchangeably, it can be replaced with a shim 31B having an optimum thickness according to changes in the thickness St of the substrate S and the dimensions of the gap G.

By the way, when the above exposure processing is continuously performed, thermal expansion occurs in the holding portion main body 22 illuminated by the illumination light. Regarding the radial thermal expansion of the holding portion main body 22, the holder 23 that holds the holding portion main body 22 from the outer peripheral side is formed of a metal material, and the linear expansion coefficient is larger than the linear expansion coefficient of the holding portion main body 22. Since it is allowed and does not restrain the holding portion main body 22, it is possible to avoid applying a large load to the holding portion main body 22. Further, at this time, the holding portion main body 22 and the holder 23 are thermally expanded in the direction in which they are separated from each other. However, since the adhesive 23a has elastic adhesive performance, the holding portion main body 22 is loosened by the holder 23. It is also prevented.

When the coefficient of linear expansion of the holder 23 is smaller than the coefficient of linear expansion of the holding portion main body 22, it is preferable to select a configuration in which the holder 23 holds the holding portion main body 22 from the inner peripheral side, but from the outer peripheral side. Even in the structure of holding, the adhesive 23a is elastically deformed, so that the load applied to the holding portion main body 22 at the time of thermal expansion is relaxed.

Further, when the holding portion main body 22 is thermally expanded in the direction of the rotation axis AX1, the portion fixed by the spacer 24B is the direction toward the rolling element 25 with the portion fixed by the spacer 24A as the base point. Elastically deforms to. In this way, since the thermal expansion of the holding portion main body 22 is allowed by the elastic deformation of the leaf spring 24, it is possible to avoid applying a large load in the rotation axis AX1 direction to the holding portion main body 22.

As described above, in the present embodiment, the adhesive 23a having elastic adhesive performance is interposed between the holding portion main body 22 and the holder 23 in the radial direction, and the leaf spring 24 is elastic in the rotation axis AX1 direction. Due to the deformation, thermal expansion caused by temperature change is allowed. Therefore, in the present embodiment, the load applied to the holding portion main body 22 due to thermal expansion is relaxed, so that the applied load causes distortion or the like in the holding portion main body 22, which adversely affects the pattern formation on the substrate S. Can be suppressed.

In the device manufacturing system SYS shown in FIG. 19, since the above-mentioned substrate processing apparatus 300 can be used as the processing apparatus U3, the adverse effect on the pattern formation on the substrate S due to the temperature change can be reduced, so that the pattern can be produced with high accuracy. It becomes possible to manufacture the formed device.

Although the preferred embodiments according to the present invention have been described above with reference to the accompanying drawings, it goes without saying that the present invention is not limited to the above examples. The various shapes and combinations of the constituent members shown in the above-mentioned examples are examples, and can be variously changed based on design requirements and the like within a range that does not deviate from the gist of the present invention.

For example, in the above embodiment, the mask M of the sheet material having a pattern on the outer peripheral surface of the holding portion main body 22 is held, but the present invention is not limited to this, and the holding portion main body 22 (transparent cylindrical material) is not limited to this. The mask pattern may be formed directly on the outer peripheral surface.
Further, the mask M may be held not on the outer peripheral surface of the holding portion main body 22 but on the inner peripheral surface of the holding portion main body 22. Further, the holding portion main body 22 may be formed into a columnar shape instead of a cylindrical shape, and the illuminating portion 10 may irradiate the mask M held on the outer peripheral surface with illumination light from the outer peripheral side.

Further, in the above embodiment, the holding portion main body 22 (mask M) is configured to rotate when the rolling element 25 and the impression cylinder 30 rotate (rotate due to frictional contact), but the present invention is not limited to this. The present invention can be applied even if the holding portion main body 22 (mask M) is independently rotated by a driving device such as a motor.
In that case, the impression cylinder installation portion 25a of the rolling element 25 is omitted, and the rolling elements 25 on both sides are rotatably supported by the inner cylinder 21 installed in the main body of the exposure apparatus via the air bearing 26, and the motor. It is combined with the rotor etc. of. The rotational driving force of the motor is transmitted to the holding portion main body 22 (mask M) via the rolling element 25, the leaf spring 24, and the holder 23.
Even in the case of such a configuration, in the direction of the rotation axis AX1, the leaf spring 24 is elastically deformed, so that thermal expansion of the holding portion main body 22 (mask M) caused by a temperature change is allowed, and the holding portion main body is allowed. It is possible to alleviate the generation of unnecessary stress in the holding portion 22 and suppress the occurrence of distortion or the like in the holding portion main body 22.

20 ... Mask holding part, 22a ... Mask holding surface (outer peripheral surface, peripheral surface), 24 ... Leaf spring (expansion / contraction absorbing part, elastic member), 25 ... Rolling body (gap forming part, support member), 25a ... Impressor installation Unit, 30 ... Impressor (board holding part, circumferential holding part, rotating drum), 31 ... Board holding surface, 40 ... Measuring part, 41 ... Displacement part, 48 ... Shift stage (second adjusting part), 50 ... Measuring part (Detection part), 53A, 53B ... Air cylinder (Burning part), 55 ... Groove part, 56 ... Inlet part, 62 ... Adjusting screw part (Load applying part), 81 ... Belt part (Endless belt), 81a ... Support Surface (board holding surface), 82e ... Drive unit (circular drive unit), 83 ... Guide stage (fluid support unit), 85 ... Mask drive roller (rotary unit), 88 ... Elevating device (moving unit), 100 ... Substrate processing Device, AX1 ... Rotating axis (predetermined axis), M ... Mask, MT ... Drive device (1st adjustment section), S ... Board, SM1, SM2 ... Sim (correction section), 70 ... Seal section (fixed section), 71, 72 ... Engagement part, 200 ... Board processing device, FM ... Index mark (index part), MM ... Mask mark, MU ... Mask unit, VC ... Suction part (fixed part), 22 ... Holding part body (pattern holding) Member), 23 ... Holder (annular part), 23a ... Adhesive (second stretchable part), 300 ... Board processing device, AX2 ... Rotating axis (second axis), MU2 ... Mask unit, SU ... Board holding unit

Claims (11)

An exposure device that transfers a mask pattern onto a long sheet-like substrate .
A cylindrical or cylindrical mask unit that holds the mask pattern and can rotate around the first axis .
A substrate support portion that supports the substrate and
With
The mask unit is
A pattern holding member that holds the mask pattern in a cylindrical shape along a peripheral surface that has a first radius from the first axis.
Provided in each of opposite sides of said pattern holding member with respect to the direction of said first axis, and a mounting member which have the said circumferential surface formed with the first greater than the radius second radius from the first axis ,
Have,
Wherein the said peripheral surface of the installation member to be supported by part of the substrate support portion, and the mask pattern and the substrate is set to a predetermined gap,
Exposure device . The exposure apparatus according to claim 1.
Before SL substrate support portion, from said first axis and a second axis that is parallel to has an outer peripheral surface of a predetermined radius, the outer peripheral surface in the second while supporting the substrate on a cylindrical surface For a rotating drum that rotates around an axis
The pattern holding member, the peripheral surface of the installation member on the outer peripheral surface of the rotary drum is rotated about said first axis by abutment,
Exposure device . The exposure apparatus according to claim 1 or 2.
The difference value between the first radius and the second radius is set to be smaller than the amount of the predetermined gap.
Exposure device . The exposure apparatus according to any one of claims 1 to 3.
The pattern holding member winds the sheet mask the mask pattern is formed on the bendable glass material on the peripheral surface,
Exposure device . The exposure apparatus according to any one of claims 1 to 4.
The pattern holding member includes an engaging portion for engaging the sheet mask at a predetermined position and a fixing portion for fixing the sheet mask to the pattern holding member.
Exposure device . The exposure apparatus according to claim 5.
The fixing portion is an adhesive loaded between the peripheral surface of the pattern holding member and the sheet mask.
Exposure device . The exposure apparatus according to claim 5.
The fixing portion detachably fixes the sheet mask to the pattern holding member.
Exposure device . The exposure apparatus according to claim 5.
The fixing portion includes a sealing portion that seals a gap between the peripheral surface of the pattern holding member and the sheet mask, and a suction portion that sucks a space surrounded by the sealing portion by negative pressure.
Exposure device . The exposure apparatus according to any one of claims 4 to 8.
The pattern holding member includes an index mark that serves as an index of a relative positional relationship with the sheet mask.
Exposure device . The exposure apparatus according to any one of claims 1 to 9.
The mask pattern includes a pattern having a line width of 20 μm or less.
Exposure device . The exposure apparatus according to any one of請Motomeko 1-10,
A support portion for rotatably supporting the mask unit about the first axis,
Exposure device.

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