JP6070697B2 - Mask unit and substrate processing apparatus - Google Patents

Description

The present invention relates to a mask unit and a substrate processing apparatus.
This application claims priority based on Japanese Patent Application No. 2012-095894 for which it applied on April 19, 2012, and uses the content here.

  In large-screen display elements such as liquid crystal display elements, first, a transparent electrode such as ITO (Indium Tin Oxide) or a semiconductor substance such as Si is deposited on a flat glass substrate, and then a metal material is evaporated to form a photoresist. Is applied to transfer the circuit pattern. Then, after developing the photoresist, a circuit pattern or the like is formed by etching. However, since the glass substrate is enlarged with an increase in the screen size of the display element, it is difficult to carry the substrate. Therefore, a roll-to-roll method (hereinafter simply referred to as “roll method”) in which a display element is formed on a flexible substrate (for example, a film member such as polyimide, PET, metal foil, or an ultrathin glass sheet). A technique called “notation” has been proposed (see, for example, Patent Document 1).

  Further, in Patent Document 2, a flexible long sheet (substrate) that is wound around a feed roller and traveled is disposed in the vicinity of the outer peripheral portion of a rotatable cylindrical mask, and the mask pattern is continuous. In particular, techniques for exposing a substrate have been proposed.

International Publication No. 2008/1229819 Japanese National Kaisho 60-019037

However, the following problems exist in the conventional technology as described above.
In general, when a part of a flexible long sheet is wound around a roller and fed in the long direction, a relatively large tension acts on the sheet in the long direction. Can occur. On the other hand, the dimension in the circumferential direction of the cylindrical mask is substantially constant. Therefore, even if the peripheral speed of the outer peripheral surface (pattern surface) of the cylindrical mask is matched with the peripheral speed at the portion of the sheet wound around the feed roller (or rotating drum), the base already formed on the sheet The pattern layer also extends in the longitudinal direction. Therefore, it becomes difficult to accurately superimpose the pattern on the cylindrical mask on the underlying pattern layer.

  Also, depending on the tension applied to the sheet or the process of forming the underlying pattern layer, the shape of the underlying pattern layer region on the sheet may be distorted nonlinearly, and the mask pattern on the cylindrical mask and the sheet (substrate) Relative alignment becomes even more difficult.

  Further, when a cylindrical mask pattern is exposed to a plurality of types of sheets having different thicknesses, the tension applied to the sheet when it is wound around the rotating drum varies greatly depending on the sheet thickness, Young's modulus, friction coefficient, and the like. Sometimes. Therefore, the extension amount of the sheet also varies depending on the thickness.

  The tensioned sheet is wound around the rotating drum while being exposed, and after the exposure is completed, the contact with the rotating drum is released, and when the tension is released, the sheet tends to return to its original size.

  For this reason, the dimension in the longitudinal direction of the mask pattern forming region exposed and transferred onto the sheet slightly shrinks after the tension is released. However, since the expansion amount (shrinkage amount) differs between sheets having different thicknesses, the dimension of the formation area of the mask pattern transferred onto the sheet varies depending on the sheet thickness. In particular, when manufacturing a display panel for a large display, it is desired that the variation in the area size of the display panel pattern formed on the sheet is as small as possible.

  Further, in the proximity exposure method in which the rotating drum on which the sheet (substrate) is wound and the cylindrical mask are brought close to each other, a projection image adjustment function as in the projection exposure method cannot be obtained. Therefore, it is difficult to easily perform fine adjustment (particularly magnification correction) of the relative positional relationship between the mask pattern and the sheet (substrate).

  An object of an aspect of the present invention is to provide a mask unit and a substrate processing apparatus that can easily adjust the relative positional relationship between a mask pattern and a substrate.

  According to the first aspect of the present invention, the mask pattern is held along the cylindrical surface having a predetermined radius from the first axis, and the mask holding unit rotatable around the first axis, and the mask holding unit are arranged in the first direction. And a support portion that is movably supported in a non-contact or low-friction state in a direction around the first axis and in a first axis direction, and provided on both sides of the mask holding portion in the first axial direction. A mask unit is provided that includes a pair of drive units that are driven by applying thrust in the direction around the axis.

  According to a second aspect of the present invention, there is provided a substrate processing apparatus comprising the mask unit according to the first aspect of the present invention and a substrate holding part for holding a substrate onto which a mask pattern is transferred.

  According to a third aspect of the present invention, there is provided a substrate processing apparatus for transferring a mask pattern onto a photosensitive substrate, the mask holding the mask pattern along a cylindrical surface having a predetermined radius from the first axis. The pattern holding portion is provided on each of both sides of the mask pattern holding portion in the first axis direction, and is supported on the mask pattern holding portion around the first axis. There is provided a substrate processing apparatus including a pair of driving units that apply a driving force in a direction.

  In the aspect of the present invention, the relative positional relationship between the mask pattern and the substrate can be easily adjusted, and the mask pattern can be formed on the substrate with high accuracy.

1 is a schematic external perspective view of a substrate processing apparatus according to an embodiment. It is sectional drawing which fractured | ruptured the mask unit at the plane containing a rotating shaft line. It is the figure which expanded the A section in FIG. It is a figure which shows the structure of the mask holding part of the mask unit in FIG. It is a figure which shows the modification of the structure of a board | substrate holding unit. It is the figure which looked at the structure of FIG. 5 from another direction. It is a figure which shows the structure of a device manufacturing system. It is a schematic front view which shows the substrate processing apparatus of another embodiment which performs image magnification adjustment of a rotating shaft direction. It is a schematic plan view of the substrate processing apparatus shown in FIG. It is a general | schematic external appearance perspective view which shows the substrate processing apparatus of another embodiment which performs image magnification adjustment of a rotating shaft direction.

Hereinafter, embodiments of a mask unit and a substrate processing apparatus of the present invention will be described with reference to FIGS.
FIG. 1 is a schematic external perspective view of a substrate processing apparatus 100 including a rotatable cylindrical mask unit MU and a sheet (substrate) S holding unit SU. FIG. 2 is a cross-sectional view of the cylindrical mask unit MU in FIG. 1 cut along a plane including the rotation axis AX1. FIG. 3 is an enlarged view of portion A in FIG.

  The substrate processing apparatus 100 performs an exposure process on a strip-shaped substrate (for example, a strip-shaped film member) S with a flexible sheet-like mask M pattern. The substrate processing apparatus 100 mainly includes an illumination unit 10 (not shown in FIG. 1, refer to FIG. 2), a mask unit MU, a substrate holding unit SU, and a control unit (not shown).

  In this embodiment, an XYZ axis coordinate system is set as shown in FIG. 1, and the following description will be given using this XYZ axis coordinate system as appropriate. In the XYZ axis coordinate system, for example, the vertical direction is the Z axis direction, the direction parallel to the rotation axes AX1 and AX2 of the mask unit MU and the substrate holding unit SU is the Y axis direction, and is orthogonal to the Z axis direction and the Y axis direction. The direction will be described as the X-axis direction.

  The illumination unit 10 irradiates illumination light toward an illumination region of the mask M wound around a mask holding unit 20 (described later) in the mask unit MU. The illuminating unit 10 is a straight tube type that emits exposure illumination light radially like a fluorescent lamp, or a diffusing member is provided on the back side by introducing illumination light from both ends of a cylindrical quartz rod. Those used are accommodated in the internal space of the inner cylinder 21 that supports the mask holding portion 20.

  The mask unit MU includes a mask holding unit 20 (also referred to as a mask pattern holding unit), an inner cylinder 21, a holder 23, a drive unit MT, and an impression cylinder installation unit 25. The mask holding part 20 and the holder 23 are provided in an integrated state. Further, the mask holding unit 20 and the holder 23 communicate with each other in the direction of the rotation axis AX1, and are formed with through holes through which the inner cylinder 21 is inserted.

  The mask holding unit 20 is formed of a cylindrical transparent substrate (quartz or the like) that can transmit illumination light. A mask holding surface 22 a that holds the mask M along a cylindrical surface having a predetermined radius is formed on the outer peripheral surface of the mask holding unit 20.

  The mask M is preferably one obtained by directly depositing a light-shielding film such as chromium on the mask holding surface 22a. However, as another example, a configuration may be adopted in which an extremely thin glass sheet having a pattern formed of a light-shielding film is tightly wound around the mask holding surface 22a.

The mask holding unit 20 is generally cylindrical with a predetermined thickness. However, as shown in FIG. 1, when the mask M is held, a slit 20S parallel to the axis AX1 is formed in a part around the rotation axis AX1. Specifically, as shown in FIG. 4, a slit 20 </ b> S in which a part of the mask holding unit 20 is removed is provided in the circumferential direction of the mask holding unit 20, for example, with a width of about 1 to several mm. The slot 20S does not necessarily have to be parallel to the rotation axis AX1, and may be inclined. Further, the slit 20S does not need to be linear, and may be a gentle arc shape or a zigzag shape.
Accordingly, since the mask M (mask pattern) is held on the mask holding surface 22a while avoiding the slit 20S, the mask M (mask pattern) is discontinuous with respect to the cylindrical circumferential direction. That is, the peripheral surface of the mask holding part 20 has a circumference that holds the mask M with the two ends in the direction around the rotation axis AX1 being spaced apart.

  Further, the mask holding portion 20 is rotated about the axis of rotation AX1 by an air pad (support portion) 22 (details will be described later) which is a fluid bearing provided at a position facing the inner peripheral surface of the inner cylinder 21, or a high-precision ball bearing. It is supported so as to be movable with respect to the inner cylinder 21 in a stationary state in a non-contact state or a low friction state in the direction and the direction around the rotation axis AX1. The air pad (support portion) 22 includes a fluid bearing.

  The holder 23 is formed in an annular shape with a metal material. As shown in FIG. 3, the holder 23 holds the outer peripheral surface and inner peripheral surface of the end portion of the mask holding unit 20.

  The drive part MT gives the thrust which drives the mask holding | maintenance part 20 (namely, mask M) with respect to the inner cylinder 21 in the rotation axis AX1 direction and the rotation axis AX1 circumference direction. The drive unit MT is provided in pairs on both sides of the mask holding unit 20 in the direction of the rotation axis AX1. Each drive unit MT is configured by, for example, a voice coil motor that applies thrust in two directions of the rotation axis AX1 and the direction around the rotation axis AX1, and includes a magnet generator MG and a coil body CU. . In addition, about the thrust of rotation axis AX1, the direction should just be able to provide only one among a pair of drive parts MT.

  The magnet generator MG is provided on the outer surface of the holder 23 in the Y-axis direction so as to extend in the direction of the rotation axis AX1 over the entire circumference in the direction around the rotation axis AX1. The coil body CU is fixed to the outer peripheral surface of the inner cylinder 21 over the entire circumference, and has a U-shaped cross-sectional shape that sandwiches the magnetomotive body MG in the radial direction about the rotation axis AX1. Energization of the coil body CU is controlled by the drive control unit DC. Note that the magnet generator MG is not necessarily provided over the entire circumference, and a plurality of magnet generators MG may be provided with a predetermined interval in the circumferential direction (for example, a configuration in which three locations are provided at intervals of 120 °).

  The impression cylinder installation portions 25 are provided at both ends of the inner cylinder 21 in the direction of the rotation axis AX1 so as to be rotatable around the rotation axis AX1 via air bearings 26, respectively. The outer diameter of the impression cylinder installation portion 25 is formed to be a predetermined amount larger than the outer diameter formed by the outer surface of the mask M held on the mask holding surface 22 a of the mask holding portion 20. Specifically, the outer diameter of the impression cylinder installation part 25 is held by the impression cylinder 30 when the impression cylinder installation part 25 abuts on the outer peripheral surface of the impression cylinder 30 and the mask holding part 20 is supported at a predetermined position. A predetermined amount of proximity gap is formed between the substrate S and the mask M formed.

  In this embodiment, when the impression body 30 is rotated by a drive source, the ring-shaped impression cylinder installation portion 25 that is in contact with the outer peripheral surface of the impression cylinder 30 rolls around the inner cylinder 21 by friction.

  The inner cylinder 21 is installed at a base portion of the apparatus main body (not shown). The inner cylinder 21 rotatably supports the impression cylinder installation portion 25 via air bearings 26 at both ends in the direction of the rotation axis AX1, and a mask holding portion 20. An air pad 22 is provided on the outer peripheral surface opposite to the inner peripheral surface of the. The air pad 22 is formed of, for example, a porous pad. The air pad 22 is formed on the outer peripheral surface on both sides of the inner cylinder 21 in the direction of the rotation axis AX1 facing the inner peripheral surface of the mask holding unit 20 and on the entire circumference in the direction around the rotation axis AX1. Or, it is provided at a plurality of locations spaced apart in the direction around the rotation axis AX1.

  The mask unit MU including the mask holding unit 20, the inner cylinder 21, the holder 23, the drive unit MT, the impression cylinder installation unit 25, and the illumination unit 10 are converted into an illumination unit by the turning drive unit (moving unit) SC shown in FIG. 1. The illumination light from 10 can turn (revolve) a small amount around the rotation axis AX2 in a state where the posture toward the rotation axis AX2 of the impression body 30 is maintained.

The substrate holding unit SU includes an impression body (substrate holding unit) 30.
The impression body 30 is formed in a columnar shape that is parallel to the Y axis and rotates around a rotation axis (second axis) AX2 set on the −Z axis side of the rotation axis AX1. The outer peripheral surface of the impression body 30 is a substrate holding surface 31 that holds the substrate S in contact therewith. On both end faces of the impression body 30 in the Y-axis direction, rotation support portions 32 having a smaller diameter than the impression body 30 and projecting coaxially are supported on the base portion of the apparatus main body so as to be rotatable around the rotation axis AX2. In the present embodiment, a driving device (motor or the like) 33 for rotating the impression body 30 is provided. The drive device 33 is controlled by the drive control unit DC described above.

  In this embodiment, the impression body 30 is controlled to be rotated at a constant angular speed by the driving device 33 to feed the substrate S at a constant speed, and the cylindrical mask holding portion 20 (holder 23) of the mask holding unit MU is Servo control (follow-up control) is performed on the drive units MT on both sides so that the peripheral speed of the mask pattern surface becomes a rotational speed corresponding to the feed speed of the substrate S.

  In the substrate processing apparatus 100 configured as described above, when the pattern of the mask M is exposed on the substrate S, it is necessary to adjust image shift, image rotation, image magnification, and the like in order to cope with expansion and contraction, distortion, and the like of the substrate S. . Here, since the mask holding unit 20 holds the mask M along the cylindrical surface, the image shift and the image magnification adjustment need to be performed individually in the direction of the rotation axis AX1 and the direction around the rotation axis AX1.

  Hereinafter, each adjustment will be described. Each adjustment amount is a position measurement value such as an alignment mark on the mask M detected using an alignment microscope or the like, or a reading value such as an encoder scale formed in advance on the outer peripheral surface of the mask holding unit 20 or the impression body 30. , And the position measurement values of the alignment marks and the like on the substrate P detected using alignment microscopes AM1 and AM2 described later.

[Image shift]
The image shift in the present embodiment means that the mask pattern held in a cylindrical shape is finely moved in the Y-axis direction in which the rotation axis AX1 extends as a whole with respect to the substrate S, or the cylindrical mask pattern and the pressure The relative position in the rotational circumferential direction with respect to the substrate S wound around the body 30 is finely moved.

  The image shift adjustment in the direction of the rotation axis AX1 is performed by moving the holder 23 and the mask holding unit 20 (mask M) in the direction of the rotation axis AX1 via the magnetic generator MG of the drive unit MT by energization control of the drive control unit DC. This is done by moving the

  Similarly, in the image shift adjustment in the direction around the rotation axis AX1 (rotation circumferential direction), the holder 23 and the mask holding unit 20 (mask M) are placed on each of the pair of drive units MT by the energization control of the drive control unit DC. The same thrust in the direction around the rotation axis AX1 is applied, and the circumferential position of the mask holding portion 20 (pattern surface of the mask M) is set to a predetermined amount with respect to the longitudinal transfer position of the substrate S by the rotation of the impression body 30. This is done only by fine movement.

[Image rotation]
Image rotation in the present embodiment refers to a part of a mask pattern that faces a substrate S held in a cylindrical shape through a predetermined proximity gap, and is slightly rotated (tilted) around the Z axis in the XY plane of FIG. ).
The adjustment of the image rotation is performed when the holder 23 and the mask holding unit 20 (mask M) are rotated in the direction around the rotation axis AX1 through the magnetic generator MG of the drive unit MT by energization control of the drive control unit DC. This is done by making the thrust characteristics different between the pair of drive parts MT. Specifically, when the holder 23 and the mask holding unit 20 (mask M) are rotated in the direction around the rotation axis AX1 with a different thrust (rotational torque) between the pair of drive units MT, the mask M is rotated in the direction around the rotation axis AX1. Since the (mask holding part 20) is separated by the slit 20S shown in FIG. 4, the mask pattern rotates with the mask M slightly twisted. Accordingly, the mask M (mask holding unit 20) is twisted in accordance with the image rotation adjustment amount, and the mask pattern at the exposure position (illumination light irradiation region) is slightly tilted in the XY plane by the amount to be adjusted. , And can be rotated around the rotation axis AX1. Thereby, the image rotation is adjusted.

[Image magnification]
In this embodiment, the image magnification adjustment (magnification adjustment in the scanning exposure direction) around the rotation axis AX1 is performed by energization control of the drive control unit DC via the magnet generator MG of the drive unit MT and the mask holding unit 20 ( It is adjusted by the rotational speed when the mask M) is rotated around the rotation axis AX1. That is, by slightly reducing the rotational speed of the mask M (the peripheral speed of the pattern surface) relative to the feed speed of the substrate S, the mask pattern is enlarged and transferred onto the substrate S at a magnification according to the speed ratio, The rotational speed of the mask M can be slightly increased with respect to the feeding speed of the substrate S. As a result, the mask pattern is reduced and transferred onto the substrate S at a magnification according to the speed ratio.

  On the other hand, image magnification adjustment in the direction of the rotation axis AX1 (magnification adjustment in the non-scanning exposure direction) is difficult when the substrate S is sent in close contact with a part of the outer peripheral surface of the impression body 30 as shown in FIG. However, as shown in FIG. 5, for example, a cylindrical body 30A made of a porous material such as ceramics is provided on the outer peripheral portion of the impression body 30, and the compressed gas Pa is ejected from the inside of the impression cylinder 30 to the outer circumference through the cylindrical body 30A. If a configuration such as a turn bar (air bearing) is used, the magnification in the non-scanning exposure direction can be adjusted.

As shown in FIG. 5, when the substrate S is transported in the state of being wound around the upper half of the Z-axis direction of the cylindrical body 30A such as an air bearing, the substrate S hardly contacts the surface of the cylindrical body 30A. The paper is folded and conveyed with predetermined tensions T1 and T2.
In this case, the state of FIG. 5 is seen in the XY plane in the region As near the vertex in the Z-axis direction of the cylindrical body 30A and the regions Af and Ar in the transport direction of the substrate S with respect to the region As. As shown in FIG. 6, the width in the Y-axis direction of the substrate S changes due to the influences of the tensions T1 and T2, such as the width TD2 in the regions Af and Ar and the width TD1 (TD1> TD2) in the region As.
In other words, in the region As near the apex of the cylindrical body 30A, the width TD1 of the substrate S is the widest, and in the regions Af and Ar deviating from the region As, it is stretched in the longitudinal direction by the longitudinal tensions T1 and T2. However, it shrinks in the short direction.

  Therefore, when the substrate S is supported and supported by the cylindrical body 30A (impression body 30) as shown in FIG. 5, the mask unit MU is swung (revolved) around the rotation axis AX2 by the swivel drive unit SC. By performing exposure transfer not in the region As in FIG. 5 (FIG. 6) but in the region Af or the region Ar, magnification adjustment (corresponding to expansion / contraction) in the non-scanning exposure direction becomes possible.

  Therefore, a correlation between the angular position in the direction around the rotation axis AX2 and the amount of change (shrinkage) of the width of the substrate S is obtained in advance from the region Af to the region Ar, and the rotation adjustment unit SC adjusts the magnification adjustment amount. By rotating the mask unit MU to an angular position around the corresponding rotation axis AX2, the transfer magnification is also adjusted in the direction of the rotation axis AX1 (AX2).

  As described above, when the image shift, the image rotation, the image magnification, and the like are adjusted, the drive unit 33 is driven to synchronize with the rotation of the mask holding unit 20 around the rotation axis AX1 by the drive of the drive unit MT. The impression body 30 is rotated around the rotation axis AX2. And when illumination light is projected from the illumination part 10, it will permeate | transmit the mask holding | maintenance part 20, and the pattern of the mask M will be illuminated from the inner peripheral side by the elongated slit-like illumination light in the direction where axis line AX1 extends. Light from the pattern is applied to the illumination area on the substrate S.

  As described above, in this embodiment, the mask holding unit 20 is supported by the air pad 22 in a non-contact manner, and the mask holding unit 20 is driven by the driving unit MT to transfer the mask pattern to the substrate S. Adjust image shift, image rotation, and image magnification. Therefore, the relative positional relationship between the mask pattern and the substrate S can be adjusted easily and smoothly. In particular, in the present embodiment, the outer peripheral surface of the mask holding unit 20 is set to a circumferential length separated by the slit 20S around a part of the rotation axis AX1 of the mask M, and thus the rotation axis AX1 of the pair of drive units MT. By varying the thrust characteristics in the circumferential direction, image rotation (inclination in the XY plane) can be easily adjusted with high accuracy. In addition, in the present embodiment, the image magnification in the direction of the rotation axis AX1 can be easily adjusted by a simple operation of turning (revolving) the mask unit MU around the rotation axis AX2.

In addition, by supporting the mask holding unit 20 in a non-contact manner with the air pad 22, vibration components in a relatively high frequency range (several Hz or more) of the order of microns generated in the apparatus main body are passed through the inner cylinder 21 through the mask holding unit 20. Can be reduced.
However, if vibration in a relatively high frequency range is negligible from the viewpoint of resolution line width, superposition accuracy specifications, etc., it may be supported by a low friction ball bearing or the like although there is mechanical contact. In that case, it is desirable to attach a thin metal belt material or the like to the portion of the inner peripheral surface of the mask holding portion 20 that can come into contact with the ball of the ball bearing.

(Device manufacturing system)
Next, a device manufacturing system provided with the substrate processing apparatus 100 will be described with reference to FIG.
FIG. 7 is a diagram showing a partial configuration of a device manufacturing system (flexible display manufacturing line) SYS. Here, the flexible substrate P (sheet, film, etc.) drawn out from the supply roll FR1 is sequentially passed through n processing devices U1, U2, U3, U4, U5,... Un to the collection roll FR2. An example of winding up is shown. The host control device CONT performs overall control of the processing devices U1 to Un constituting the production line.

  In FIG. 7, the orthogonal coordinate system XYZ is set so that the front surface (or back surface) of the substrate P is perpendicular to the XZ axis surface, and the width direction orthogonal to the transport direction (long direction) of the substrate P is the Y axis direction. Shall be set to The substrate P may be activated by modifying the surface in advance by a predetermined pretreatment, or may be formed with a fine partition structure (uneven structure) for precise patterning on the surface.

  The substrate P wound around the supply roll FR1 is pulled out by the nipped driving roller DR1 and conveyed to the processing apparatus U1. The center of the substrate P in the Y-axis direction (width direction) is servo-controlled by the edge position controller EPC1 so as to be within a range of about ± 10 μm to several tens μm with respect to the target position.

  The processing apparatus U1 applies a photosensitive functional liquid (photoresist, photosensitive silane coupling material (eg, photosensitive silane coupling material), UV curable resin liquid, etc.) to the surface of the substrate P by a printing method. It is a coating device that applies continuously or selectively in the transport direction (long direction). In the processing apparatus U1, a coating mechanism including a pressure drum DR2 around which the substrate P is wound, and a coating roller for uniformly coating the photosensitive functional liquid on the surface of the substrate P on the pressure drum DR2. Gp1, a drying mechanism Gp2 for rapidly removing a solvent or moisture contained in the photosensitive functional liquid applied to the substrate P, and the like are provided.

  The processing device U2 heats the substrate P conveyed from the processing device U1 to a predetermined temperature (for example, about several tens of degrees Celsius to 120 ° C.) to stably fix the photosensitive functional layer applied on the surface. It is a heating device. In the processing apparatus U2, a plurality of rollers and an air turn bar for returning and conveying the substrate P, a heating chamber HA1 for heating the substrate P that has been carried in, and the temperature of the heated substrate P are as follows: A cooling chamber HA2 and a nipped drive roller DR3 are provided for lowering the temperature so as to match the ambient temperature of the post-process (processing device U3).

  The processing apparatus U3 as the substrate processing apparatus 100 applies ultraviolet patterning light corresponding to the circuit pattern or wiring pattern for display to the photosensitive functional layer of the substrate P (substrate S) conveyed from the processing apparatus U2. An exposure apparatus for irradiation. In the processing apparatus U3, an edge position controller EPC for controlling the center of the substrate P in the Y-axis direction (width direction) to a fixed position, the nipped drive roller DR4, and the substrate P are partially wound with a predetermined tension, A rotary drum DR5 (impression body 30) for supporting a pattern exposed portion on the substrate P in a uniform cylindrical surface, and two sets of driving rollers DR6 for giving a predetermined slack (play) DL to the substrate P , DR7, etc. are provided.

  Further, in the processing apparatus U3, a transmission type cylindrical mask DM (mask unit MU) and an illumination mechanism IU (illumination) provided in the cylindrical mask DM and illuminating a mask pattern formed on the outer peripheral surface of the cylindrical mask DM. Part 10) and a part of the substrate P supported in a cylindrical surface by the rotary drum DR5, in order to relatively align (align) the image of a part of the mask pattern of the cylindrical mask DM and the substrate P. Alignment microscopes AM1 and AM2 for detecting an alignment mark or the like formed in advance on P are provided.

  The processing device U4 is a wet processing device that performs wet development processing, electroless plating processing, and the like on the photosensitive functional layer of the substrate P conveyed from the processing device U3. In the processing apparatus U4, there are provided three processing tanks BT1, BT2, BT3 layered in the Z-axis direction, a plurality of rollers for bending and transporting the substrate P, a nipped drive roller DR8, and the like. .

  The processing apparatus U5 is a heating and drying apparatus that warms the substrate P conveyed from the processing apparatus U4 and adjusts the moisture content of the substrate P wetted by the wet process to a predetermined value, but the details are omitted. After that, the substrate P that has passed through several processing devices and passed through the last processing device Un in the series of processes is wound up on the collection roll FR2 via the nipped drive roller DR1. Also during the winding, the drive roller DR1 and the recovery roll are driven by the edge position controller EPC2 so that the center of the substrate P in the Y-axis direction (width direction) or the substrate end in the Y-axis direction does not vary in the Y-axis direction. The relative position of the FR2 in the Y-axis direction is successively corrected and controlled.

  In the device manufacturing system SYS, the substrate processing apparatus 100 described above is used as the processing apparatus U3. Therefore, the relative positional relationship between the mask pattern and the substrate S can be adjusted easily and smoothly, and a device on which the pattern is formed with high accuracy can be manufactured.

  As described above, the preferred embodiments according to the present invention have been described with reference to the accompanying drawings, but the present invention is not limited to the examples. Various shapes, combinations, and the like of the constituent members shown in the above-described examples are examples, and various modifications can be made based on design requirements and the like without departing from the gist of the present invention.

  For example, in the above-described embodiment, the image magnification (transfer magnification) adjustment in the direction of the rotation axis AX1 (AX2) is configured to use contraction in the width direction of the substrate S caused by the application of tension to the substrate S. However, the present invention is not limited to this. For example, as shown in FIGS. 8 and 9, an expander roller (widening portion) ER that widens (extends) the substrate S by a predetermined amount in the width direction may be used.

  Specifically, as shown in the schematic front view of FIG. 8, a substrate holding portion 31 having a convex cylindrical air pad surface 31A centering on an axis AX3 parallel to the Y-axis direction as a substrate holding surface is provided. As shown in the plan view of FIG. 9, expander rollers (widening portions) ER1 and ER2 that widen the substrate S by a predetermined amount in the width direction are provided on the upstream side and the downstream side of the substrate holding unit 31 in the transport direction of the substrate S. The width of the substrate S is continuously changed on the air pad surface 31A according to the tension applied by the expander rollers ER1 and ER2.

  A slit that has passed through the mask M by moving the mask unit MU by the turning drive unit SC to a position (position in the direction around the axis AX3) corresponding to the degree of widening (magnification) of the substrate S held on the air pad surface 31A. The relative ratio between the length of the Y-shaped exposure area (illumination area of the mask pattern) L in the Y-axis direction and the width of the substrate S in the Y-axis direction can be finely adjusted. Therefore, as a result, the transfer magnification in the direction of the rotation axis AX1 of the pattern formed on the substrate S can be adjusted.

  Further, the contact resistance between the impression body 30 and the substrate S may be reduced. Specifically, for example, as shown in FIG. 5 and FIG. 6, when the substrate S is held by the cylindrical body 30A on the outer periphery of the impression body 30, the substrate S can be widened. An expander roller ER that widens the substrate S by a predetermined amount in the width direction is provided downstream of the body 30 (cylindrical body 30A) in the transport direction of the substrate S. The image magnification with respect to the direction of the rotation axis AX1 (AX2) may be adjusted by moving the mask unit MU to the position).

  Furthermore, the exposure apparatus as the substrate processing apparatus described in each embodiment is a proximity exposure system in which the mask pattern held by the mask unit MU and the substrate S face each other with a certain gap. However, the present invention is not limited to this, and the same applies even to a method in which an image of a mask pattern held in the mask unit MU is projected and exposed onto the substrate S by an equal magnification projection optical system or an enlarged projection optical system. Is possible.

  Moreover, in each embodiment, the drive part MT provided in the both end sides of the mask (mask pattern) holding part 20 of the mask unit MU is configured as a non-contact type rotary motor in which the coil body CU and the magnet generator MG are opposed to each other. However, it is not limited to this. For example, along the circumferential direction of the annular holder 23 to which the magnetomotive body MG is attached, a plurality of magnets are arranged and a constant magnetic pattern (passive side magnetic gear) is provided on the entire circumference, and thrust is made to face the magnetic pattern. A magnetic gear serving as a shaft may be provided. The magnetic gear transmits the rotational force in a non-contact manner. When the magnetic gear on the thrust shaft side is rotated by a normal DC motor, gear motor, or the like, the magnetic gear on the passive side rotates accordingly.

  In the above embodiment, the mask (mask pattern) holding unit 20 of the mask unit MU is formed of a cylindrical transparent base material (quartz or the like), and the mask pattern is included in the illumination light from the illumination unit 10 inside. Although the transmissive cylindrical mask pattern uses the transmitted light for exposure of the substrate S, it may be a reflective cylindrical mask pattern. In that case, since it is not necessary to provide the illumination part 10 inside a cylindrical mask pattern, the mask (mask pattern) holding | maintenance part 20 can be made from a metal dense columnar base material.

  Even if the mask (mask pattern) holding unit 20 is a metal dense columnar base material, the rotation control characteristics (of the mask unit MU (holding unit 20)) can be achieved by providing the drive units MT on both sides in the rotation axis direction. In particular, responsiveness can be improved. Furthermore, if the mask (mask pattern) holding part 20 is made of a metal hollow cylindrical base material and a slit (20S) is provided on a part thereof, the mask unit MU can be reduced in weight and the same as in the previous embodiments. In addition, the mask (mask pattern) holding unit 20 can be slightly twisted.

  In the above-described embodiment, when the holder 23 and the mask holding unit 20 (mask M) are rotated in the direction around the rotation axis AX1 via the magnetic generator MG of the drive unit MT by energization control of the drive control unit DC, The configuration in which the thrust characteristics are made different among the drive units MT is shown. However, a configuration in which the thrust characteristics are uniform between the pair of drive units MT can also be employed.

  DESCRIPTION OF SYMBOLS 20 ... Mask holding part, 22 ... Air pad (support part, fluid bearing), 30 ... Impression body (substrate holding part), 100 ... Substrate processing apparatus, AX1 ... Rotating axis (first axis), AX2 ... Rotating axis (first) 2 axis), DC ... drive control unit, ER expander roller (widening portion), MT ... drive unit, MU ... mask unit, SC ... swivel drive unit (moving unit)

Claims (17)

A substrate processing apparatus for transferring a mask pattern onto a photosensitive substrate,
A support portion for supporting a mask pattern holding portion for holding a mask pattern along an outer peripheral surface having a predetermined radius from the first axis, in a rotatable manner in a direction around the first axis;
A pair of drive units that are provided on both sides of the mask pattern holding unit in the first axial direction, and that apply thrust to the mask pattern holding unit in the direction around the first axis;
The mask pattern is controlled by rotating each of the pair of driving units to rotate the mask pattern holding unit at a predetermined speed around the first axis, and different thrust characteristics between the pair of driving units. A control unit for applying a twisting force to the holding unit;
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 1,
The mask pattern holding part is formed in a hollow cylindrical shape having a predetermined thickness, and has a slit extending in the direction of the first axis so as to be twisted by the force in the twisting direction,
The mask pattern is held on the outer peripheral surface of the mask pattern holding portion while avoiding the slit .
Substrate processing equipment. The substrate processing apparatus according to claim 2,
The slit is formed linearly in a state parallel to or inclined with respect to the first axis, or formed in a gentle arc shape or zigzag shape,
Substrate processing equipment. The substrate processing apparatus according to any one of claims 1 to 3,
At least one drive unit of the pair of drive units is configured to give a thrust in the direction around the first axis and a thrust in the first axis direction to the mask pattern holding unit,
Substrate processing equipment. The substrate processing apparatus according to any one of claims 1 to 4, wherein
The support portion is a fluid bearing that supports the mask pattern holding portion movably in a non-contact state or a low friction state in a direction around the first axis and in a direction of the first axis, or mechanically contacts the support. Having bearings,
Substrate processing equipment. A substrate processing apparatus according to any one of claims 2 to 5,
A cylindrical substrate holding surface having a predetermined radius from a second axis set substantially parallel to the first axis, and the substrate to which the mask pattern is transferred is supported by the substrate holding surface; A substrate holder that is rotatable about the axis of the two;
Substrate processing equipment. The substrate processing apparatus according to claim 6,
The support part includes an inner cylinder that supports an inner peripheral side of the mask pattern holding part and supports the mask pattern holding part so as to be rotatable around a first axis and movable in the direction of the first rotation axis.
Substrate processing equipment. The substrate processing apparatus according to claim 7,
In order to oppose the outer peripheral surface of the mask pattern holding portion and the substrate supported by the substrate holding surface of the substrate holding portion with a predetermined gap, both sides of the inner cylinder along the first axis are An installation unit that is installed on the outer peripheral surface of the substrate holding unit;
Substrate processing equipment. The substrate processing apparatus according to claim 8, comprising:
The installation portion is provided in a ring shape that is rotatable in the direction around the first axis at both end portions along the first axis of the inner cylinder,
The outer diameter of the installation part is set so that the predetermined gap is obtained when the installation part is in contact with the outer peripheral surface of the substrate holding part.
Substrate processing equipment. A rotatable cylindrical mask unit having a mask pattern formed on a cylindrical outer peripheral surface and a part of a flexible long sheet to which the mask pattern is transferred are held in a cylindrical shape and moved in the longitudinal direction. A substrate processing apparatus comprising a rotatable rotating drum,
The cylindrical mask unit includes a hollow cylindrical mask holding portion having the mask pattern formed on an outer peripheral surface, and is rotatable around a first rotation axis while supporting an inner peripheral side of the mask holding portion. An inner cylinder that is movably supported in the direction of the first rotation axis,
On each of both sides along the first rotation axis of the cylindrical mask unit, the outer peripheral surface of the mask holding portion and the long sheet held on the rotary drum face each other with a predetermined gap. An installation section for installing an inner cylinder with respect to the rotating drum;
A pair of drive units provided on both sides of the mask holding unit along the first rotation axis, and applying thrust for rotating the mask holding unit around the first rotation axis with respect to the inner cylinder;
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 10, comprising:
The said inner cylinder is a substrate processing apparatus provided with the support part which supports the said mask holding | maintenance part so that it can move freely in a non-contact state or a low-friction state in the direction around the first rotation axis and the first rotation axis. The substrate processing apparatus according to claim 11,
The support unit is a substrate processing apparatus including a fluid bearing. A substrate processing apparatus according to any one of claims 10 to 12,
The installation portions are provided in both ends of the first rotation axis of the inner cylinder in a ring shape that is rotatable in the direction around the first rotation axis,
The outer diameter of the installation portion is such that the long sheet and the mask held by the rotary drum when the installation portion abuts on the outer peripheral surface of the rotary drum and the mask holding portion is supported at a predetermined position. It is set so that the predetermined gap is formed between the outer peripheral surface of the holding portion ,
Substrate processing equipment. A substrate processing apparatus according to any one of claims 10 to 13,
At least one of the pair of drive units is a substrate processing apparatus that applies a thrust in the first rotation axis direction to the mask holding unit. The substrate processing apparatus according to claim 14, comprising:
A substrate processing apparatus, further comprising: a drive control unit that individually controls the thrust characteristics of the pair of drive units in the direction around the first rotation axis so as to be aligned or different from each other. The substrate processing apparatus according to claim 15, wherein
  The drive control unit applies a twisting direction force to the mask holding unit by changing a thrust characteristic between the pair of drive units;
Substrate processing equipment. The substrate processing apparatus according to claim 16, comprising:
  The mask holding portion has a slit extending in the direction of the first rotation axis so as to be twisted by the force in the twisting direction,
  The slit is formed linearly in a state parallel to or inclined with respect to the first rotation axis, or formed in a gentle arc shape or zigzag shape,
Substrate processing equipment.

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