JP6460188B2 - Mask unit and exposure apparatus - Google Patents

Description

The present invention relates to a mask unit and an exposure apparatus.
This application includes Japanese Patent Application No. 2012-059070 filed on March 15, 2012, Japanese Patent Application No. 2012-084820 filed on April 03, 2012, and April 05, 2012. The priority is claimed based on the Japanese Patent Application No. 2012-086539 filed, and the contents thereof are incorporated herein.

  In a large screen display element such as a liquid crystal display element, a transparent electrode such as ITO or a semiconductor substance such as Si is deposited on a flat glass substrate, a metal material is evaporated, a photoresist is applied, and a circuit pattern is formed. The circuit pattern is formed by transferring, developing the photoresist after the transfer, and then etching. However, since the glass substrate is enlarged with an increase in the screen size of the display element, it is difficult to carry the substrate. Therefore, it is called a roll-to-roll method (hereinafter simply referred to as “roll method”) in which a display element is formed on a flexible substrate (for example, a film member such as polyimide, PET, or metal foil). A technique has been proposed (see, for example, Patent Document 1).

  Further, in Patent Document 2, a flexible long sheet (substrate) that is wound around a feed roller and traveled is disposed in the vicinity of the outer peripheral portion of a rotatable cylindrical mask, and the mask pattern is continuous. In particular, techniques for exposing a substrate have been proposed.

International Publication No. 2008/1229819 Japanese Utility Model Publication No. 60-019037

  In order to expose the mask pattern onto the substrate with high accuracy, the gap amount between the mask and the substrate needs to be an appropriate value. If the gap amount deviates from the appropriate value, a predetermined pattern line width is obtained. It may not be possible.

  The aspect which concerns on this invention aims at providing the mask unit and exposure apparatus which can expose the pattern of a mask to a board | substrate with high precision.

  In addition, when the mask is cylindrical, it may be difficult to form a precise pattern directly on the peripheral surface of the cylindrical base material, which increases the cost. In particular, when a pattern is formed on the inner peripheral surface of a cylindrical mask, the cost is greatly increased and there is a concern about a decrease in pattern accuracy.

  Another object of the aspect of the present invention is to provide a mask unit and an exposure apparatus that can contribute to an improvement in pattern accuracy while suppressing an increase in cost.

  In addition, when the linear expansion coefficients of the holding member that holds the mask pattern and the support member that supports the holding member at a predetermined position with respect to the substrate are different, stress is applied to the holding member due to thermal expansion and contraction due to a temperature change, When the holding member is formed of a relatively fragile material such as glass, there is a possibility that an adverse effect may occur. Further, when stress is applied to the holding member, the mask pattern is also affected, and there is a possibility that the transfer accuracy to the substrate is also affected.

  Another aspect of the present invention is to provide a mask unit and an exposure apparatus that can suppress stress from being applied to a holding member that holds a mask pattern even when temperature fluctuation occurs.

A mask unit according to an aspect of the present invention is a cylindrical or columnar mask unit that is mounted on an exposure apparatus and receives a rotational driving force and can rotate around a predetermined axis, and has a constant radius from the axis. A cylindrical or columnar pattern holding member that holds a mask pattern along a circumferential surface having a predetermined dimension in the direction of the axis, and is physically coupled to the pattern holding member. The pattern holding member and the support so that the pattern holding member is allowed to expand and contract in the axial direction in a physical connection between the support member supported at a predetermined position of the exposure apparatus and the support member and the pattern holding member. An expansion / contraction allowance part for connecting the members.
An exposure apparatus according to an aspect of the present invention includes the mask unit described above and a substrate holding unit that holds a substrate onto which a mask pattern of the mask unit is transferred.

A mask unit according to one aspect of the present invention is a mask unit that is used by being mounted on an exposure apparatus, and includes a cylindrical mask holding portion having an outer peripheral surface having a constant radius from a predetermined axis, and a thin glass material that can be bent. An engagement portion for engaging the sheet mask at a predetermined position when a sheet mask on which a mask pattern to be exposed is formed is wound around an outer peripheral surface of the mask holding portion; And a fixing portion for fixing to.
An exposure apparatus according to an aspect of the present invention includes a support unit that rotatably supports the mask unit described above around the axis, and a length in which a mask pattern of the sheet mask wound around the mask unit is exposed. And a substrate holding part for holding a sheet-like substrate.

A mask unit according to one aspect of the present invention is mounted on an exposure apparatus that transfers a mask pattern onto a long sheet-like substrate, and is cylindrical or circular that can rotate about a first axis while holding the mask pattern. A columnar mask unit, a pattern holding member for holding the mask pattern in a cylindrical surface along a circumferential surface having a first radius from the first axis, and the pattern with respect to the direction of the first axis A peripheral surface provided on each of both sides of the holding member and formed from the first axis with a second radius larger than the first radius, and the peripheral surface is disposed in the exposure apparatus with the substrate. And an installation member that sets the mask pattern and the substrate to a predetermined proximity gap by being supported by a part of the substrate support portion to be supported.
In an exposure apparatus according to an aspect of the present invention, the mask pattern of the sheet mask wound around the mask unit and a support portion that supports the mask unit described above rotatably around the first axis are exposed. And a substrate holding part for holding a long sheet-like substrate.

  According to the aspect of the present invention, the mask pattern can be exposed to the substrate with high accuracy.

  In addition, according to the aspect of the present invention, high-precision transfer exposure can be realized on a substrate using a cylindrical mask pattern without causing an increase in cost.

  Further, according to the aspect of the present invention, it is possible to suppress stress from being applied to the holding member that holds the mask pattern even when temperature variation occurs, and it is possible to perform highly accurate processing using the mask pattern. .

Front sectional drawing of the principal part of the substrate processing apparatus which concerns on 1st Embodiment. Sectional perspective view of the substrate processing apparatus. The principal part detail drawing of the edge part in a mask holding | maintenance part. The perspective view which shows the leaf | plate spring provided in the mask holding | maintenance part. The expanded sectional view of the mask holding | maintenance part which concerns on 2nd Embodiment. The schematic sectional drawing of the substrate processing apparatus which concerns on 2nd Embodiment. The external perspective view of the substrate processing apparatus which concerns on 3rd Embodiment. The elements on larger scale of the same substrate processing apparatus. Front sectional drawing of the principal part of the substrate processing apparatus which concerns on 4th Embodiment. The elements on larger scale which show the edge part of a shim. The elements on larger scale which show the edge part of a shim. The elements on larger scale which show the edge part of a shim. The elements on larger scale of the contact part of a rolling element and an impression body. Front sectional drawing of the principal part of the substrate processing apparatus which concerns on 5th Embodiment. The schematic block diagram of the substrate processing apparatus which concerns on 6th Embodiment. Front sectional drawing of the principal part of the substrate processing apparatus. The schematic block diagram of the modification of the same substrate processing apparatus. Front sectional drawing of the principal part of the substrate processing apparatus which concerns on 7th Embodiment. The front view of the mask unit which comprises the same substrate processing apparatus. The elements on larger scale in the edge part of a mask unit. The figure which shows the structure of a device manufacturing system. Front sectional drawing of the principal part of the modification of the same substrate processing apparatus. Front sectional drawing of the principal part of the substrate processing apparatus which concerns on 8th Embodiment. Sectional perspective view of the substrate processing apparatus. The principal part detail drawing of the edge part in a mask unit. The perspective view which shows the leaf | plate spring provided in the mask unit. The figure which shows the detail of the leaf | plate spring. The figure which shows the modification of an expansion-contraction tolerance part. The figure which shows an example which aligns the peripheral speed of the outer peripheral surface of a mask, and the peripheral speed of the outer peripheral surface of a board | substrate equally.

(First embodiment)
A substrate processing apparatus according to a first embodiment of the present invention will be described below with reference to FIGS.
FIG. 1 is a front sectional view of a main part of the substrate processing apparatus 100, and FIG. 2 is a sectional perspective view of the substrate processing apparatus.

  The substrate processing apparatus 100 performs an exposure process on a strip-shaped substrate (for example, a strip-shaped film member) S with a flexible sheet-like mask M pattern, and includes an illumination unit 10 and a mask holding unit. 20, an impression body (substrate holding unit, rotation holding unit) 30 and a control unit CONT are mainly configured. In the present embodiment, the vertical direction is defined as the Z direction, the direction parallel to the rotation axis of the mask holding unit 20 and the substrate support unit 30 is defined as the Y direction, and the direction perpendicular to the Z direction and the Y direction is defined as the X direction. .

  The illumination unit 10 irradiates illumination light toward the illumination region of the mask M wound around the mask holding unit 20, and emits illumination light for exposure in a radial manner in a straight tube type like a fluorescent lamp. Those having a diffused member provided on the back side by introducing illumination light from both ends of a cylindrical quartz rod are used, and are accommodated in the internal space of the inner cylinder 21 that supports the mask holder 20.

  The mask holding unit 20 is attached to the cylindrical holding unit main body 22, holders 23 provided at both ends in the length direction of the holding unit main body 22, and leaf springs (expansion / absorption absorbing units) 24 to the holders 23. The rolling element (gap formation part) 25 was provided. The holding body 22, the holder 23, the leaf spring 24, and the rolling element 25 are provided in an integrated state, and through holes through which the inner cylinder 21 is inserted are communicated in the direction of the rotation axis AX 1. Is formed.

  The inner cylinder 21 is formed of cylindrical quartz or the like that can transmit illumination light, or a cylindrical ceramic material or metal having a slit-shaped opening 21a through which illumination light from the illumination unit 10 passes. . The holding portion main body 22 has a mask holding surface 22a formed on the outer peripheral surface thereof for holding the mask M along a cylindrical surface having a predetermined radius. The holder 23 is formed of a metal material in an annular shape and, as shown in FIG. 3, is bonded to the outer peripheral surface of the end portion of the holding portion main body 22 by an adhesive 23 a that exhibits elastic bonding performance after curing. As a material for forming the holder 23, a material having the same linear expansion coefficient as that of the holding unit main body 22 is preferable. However, when there is a difference in linear expansion coefficient, a difference in thermal expansion between the holding unit main body 22 and the holder 23 is caused. The holder 23 having a large linear expansion coefficient is configured to hold the holding unit body 22 from the outer peripheral side so that a large load is not applied to the holding unit body 22.

The rolling element 25 has an impression cylinder installation part 25a projecting around the rotation axis AX1 on the outer peripheral side, and by bringing the impression cylinder installation part 25a into contact (friction engagement) with the outer peripheral surface of the impression cylinder 30, The rolling element 25 rolls around the axis AX1.
The outer diameter of the impression cylinder installation portion 25 a is formed to be a predetermined amount larger than the outer diameter formed by the outer surface of the mask M held on the mask holding surface 22 a of the holding portion main body 22. Specifically, the outer diameter of the impression cylinder installation portion 25 a is set between the substrate S and the mask M held by the impression cylinder 30 when the impression cylinder installation portion 25 a comes into contact with the outer peripheral surface of the impression cylinder 30. As shown in FIG. 3, a predetermined amount of gap G is formed.

  Further, the rolling element 25 is supported on the inner peripheral side via the air bearing 26 so as to be rotatable in a non-contact manner around the rotation axis AX1 with respect to the inner cylinder 21. Therefore, the holding part main body 22, the holder 23, the leaf spring 24, and the rolling element 25 rotate integrally around the rotation axis AX1.

  The leaf spring 24 absorbs expansion and contraction of the rotation axis AX1 of the holding portion main body 22, and is formed in a ring shape (annular shape), for example, with steel as shown in FIG. As shown in FIG. 3, the leaf spring 24 is fixed to the rolling element 25 with a predetermined amount of gap in the Y direction via a spacer 24A. Similarly, the leaf spring 24 is fixed to the holder 23 via a spacer 24B with a predetermined amount of gap in the Y direction. Three spacers 24A are provided at equal intervals around the rotation axis AX1 at positions where the distance from the rotation axis AX1 is substantially the same. Three spacers 24B are provided at equal intervals so that the distance from the rotation axis AX1 is larger than the spacer 24A and the positions around the rotation axis AX1 are between the spacers 24A.

  Accordingly, the holder 23 (holding portion main body 22) and the rolling element 25 connected via the leaf spring 24 are coupled with high rigidity in the direction around the rotation axis AX1 and rotate integrally, and in the direction of the rotation axis AX1. Since the leaf spring 24 is easily elastically deformed, it has a structure capable of relative movement (fine movement) with low rigidity.

  The inner cylinder 21 is mounted via a leaf spring 28 on a support base 27 extending in a direction approaching each other from a base portion B provided at an interval in the Y direction. The spring constant of the leaf spring 28 is the load applied to the impression body 30 via the weight of the mask holding part 20 and the rolling element 25, that is, the impression cylinder installation part 25 a of the rolling element 25 rolls on the outer peripheral surface of the impression cylinder 30. It is set according to the friction force. The above-described illumination unit 10 is disposed in the internal space of the inner cylinder 21, and a slit-like opening that is elongated in the Y direction so that the illumination light passes through a position of the illumination unit 10 facing the illumination light emission direction. A portion 21a is formed (see FIGS. 1 and 2).

The impression body 30 is formed in a cylindrical shape that is parallel to the Y axis and rotates (circulates) around the rotation axis AX2 set on the −Z side of the rotation axis AX1, and as shown in FIG. The hollow portion 30a is provided and is set so that the moment of inertia is reduced. The outer peripheral surface of the impression body 30 is a substrate holding surface 31 that holds the substrate S in contact therewith. The holding surface 31 is preferably a mirror-polished metal surface, but in order to increase the frictional force with the substrate S and suppress slippage, the entire circumference is covered with a thin rubber sheet, resin sheet or the like having a uniform thickness. Things can be used.
On both end faces in the Y direction of the impression body 30, a rotation support portion 32 having a smaller diameter than the impression cylinder 30 and protruding coaxially is supported by the base portion B so as to be rotatable around the rotation axis AX <b> 2. In the present embodiment, a driving device 33 that rotates the impression body 30 and the mask holding unit 20 synchronously by rotating the impression body 30 is provided.

  The substrate S is formed so as to have flexibility. Here, the term “flexibility” refers to the property that the substrate can be bent without being broken or broken even if a force of its own weight is applied to the substrate. In addition, flexibility includes a property of bending by a force of about its own weight. The flexibility varies depending on the material, size, thickness, or environment such as temperature and humidity of the substrate. As the substrate S, a single strip-shaped substrate may be used, but a configuration in which a plurality of unit substrates are connected and formed in a strip shape may be used.

  As the substrate S, for example, a foil such as a resin film or stainless steel can be used. For example, the resin film is made of polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, vinyl acetate resin, etc. Can be used. The substrate S preferably has a smaller coefficient of thermal expansion so that the dimensions do not change even when subjected to heat of about 200 ° C., for example. For example, an inorganic filler can be mixed with a resin film to reduce the thermal expansion coefficient. Examples of the inorganic filler include titanium oxide, zinc oxide, alumina, silicon oxide and the like. The dimension in the width direction (short direction) of the substrate S is, for example, about 1 m to 2 m, and the dimension in the length direction (long direction) is, for example, 10 m or more. Of course, this dimension is only an example and is not limited thereto. For example, the dimension in the Y direction of the substrate S may be 1 m or less, 50 cm or less, or 2 m or more. Moreover, the dimension of the X direction of the board | substrate S may be 10 m or less.

Next, the operation of the substrate processing apparatus 100 having the above configuration will be described.
The mask holding portion 20 that is supported by the inner cylinder 21 via the air bearing 26 and holds the mask M is biased to the + Z side (upward) according to the weight of the mask holding portion 20 and the spring constant of the leaf spring 28. The load is applied to the impression body 30 via the impression cylinder installation portion 25a of the rolling element 25. Thus, a predetermined amount of gap is formed between the mask holding surface 22a and the substrate holding surface 31, that is, between the mask M and the substrate S, according to the outer diameter of the impression cylinder installation portion 25a. In addition, when adjusting the load which the impression cylinder installation part 25a gives to the impression cylinder 30, it replaces | exchanges with the leaf | plate spring 28 which has a corresponding spring constant, or it is previously spacer between the inner cylinder 21 and the support stand 27. The leaf spring 28 may be installed in a state where the pressure cylinder is interposed, and the platen 28 may be replaced with a spacer according to the load applied to the impression body 30 by the impression cylinder installation portion 25a.

  Then, the impression body 30 is rotated about the rotation axis AX1 by driving of the driving device 33, and the illumination light is irradiated from the illumination unit 10, transmitted through the holding unit main body 22 through the opening 21a, and masked from the inner peripheral side. Illuminate M. As the impression body 30 rotates, the substrate S wound and held on the substrate holding surface 31 of the impression body 30 is transported at a predetermined speed, and the outer peripheral surface of the impression body 30 via the impression cylinder installation portion 25a. The rolling elements 25 that come into contact with are rotated. As a result, the mask M and the substrate S held by the mask holding unit 20 move synchronously while being maintained in a predetermined amount of proximity gap G. Then, the pattern image of the mask M illuminated by the illumination light is sequentially projected onto the projection area of the substrate S.

At this time, the mask holder 20 and the impression body 30 have the same peripheral speed at the position (diameter) where the impression cylinder installation part 25a and the substrate holding surface 31 come into contact with each other. Are matched as much as possible, the position (diameter) of the outer peripheral surface of the mask M and the position (diameter) of the outer peripheral surface of the substrate S, the thickness Mt of the mask M and the thickness St of the substrate S, and the mask of the holding body 22 Adjustment is made in accordance with the ratio of the radius r11 on the holding surface 22a, the radius r2 on the substrate holding surface 31 of the impression body 30, and the like.
For this purpose, the radius of the portion of the substrate holding surface 31 of the impression body 30 where the outer peripheral surface of the impression cylinder mounting portion 25a abuts and the radius of the portion holding the substrate S are not made the same as in FIG. It must be intentionally different. Specifically, the position (diameter) in the Z direction where the outer peripheral surface of the impression cylinder installation portion 25a and the outer peripheral surface of the impression cylinder 30 abut is the gap G between the outer peripheral surface of the mask M and the outer peripheral surface of the substrate S. To be set around the middle of. For this purpose, the radius of the outer peripheral surface portion of the impression body 30 that is in contact with the outer peripheral surface of the impression cylinder installation portion 25a may be increased by about St + G / 2 with respect to the radius r2. Therefore, for example, when the thickness St of the substrate S is 200 μm and the gap G is 100 μm, the radius of the outer peripheral surface portion of the impression body 30 that contacts the outer peripheral surface of the impression cylinder installation portion 25a is increased by about 250 μm with respect to the radius r2. It ’s fine.

  When the above exposure process is continuously performed, thermal expansion may occur in the holding unit main body 22 illuminated by the illumination light. Regarding the thermal expansion in the radial direction (circumferential direction) of the holding unit main body 22, the holder 23 that holds the holding unit main body 22 from the outer peripheral side is formed of a metal material, and the linear expansion coefficient is larger than the linear expansion coefficient of the holding unit main body 22. By enlarging, the holding part main body 22 is not restrained, and therefore it is possible to avoid applying excessive stress to the holding part main body 22. Further, at this time, the holding portion main body 22 and the holder 23 are thermally expanded in a direction away from each other. However, since the adhesive 23a has elastic bonding performance, the holding of the holding portion main body 22 by the holder 23 is loosened. This is also prevented.

  In addition, when the linear expansion coefficient of the holder 23 is smaller than the linear expansion coefficient of the holding part main body 22, it is preferable to adopt a configuration in which the holder 23 holds the holding part main body 22 from the inner peripheral side. Even if it is the structure to perform, the stress added to the holding | maintenance part main body 22 at the time of thermal expansion is relieve | moderated because the said adhesive agent 23a elastically deforms.

  Further, with respect to thermal expansion in the direction of the rotation axis AX1 of the holding portion main body 22, the location where the leaf spring 24 is fixed by the spacer 24A is the starting point, and the location where the spacer 24B is fixed is directed toward the rolling element 25. It is elastically deformed. As described above, since the thermal expansion of the holding portion main body 22 is absorbed as elastic deformation of the leaf spring 24, it is avoided that a large stress in the direction of the rotation axis AX1 is generated in the holding portion main body 22.

  As described above, in the present embodiment, the rolling element 25 that contacts the outer peripheral surface of the impression cylinder 30 in the impression cylinder installation portion 25a rotates with the impression cylinder 30 so that the mask M and the substrate S have a predetermined amount of gap. The exposure process can be carried out while maintaining the above. Therefore, in the present embodiment, it is possible to prevent a variation in the image width of the pattern caused by a variation in the gap amount between the mask M and the substrate S. The value of the gap G can vary in a favorable range depending on the minimum dimension of the pattern to be exposed on the substrate S (pattern on the mask M), the angle characteristic (numerical aperture) of illumination light from the illumination unit 10, and the like. However, it is in the range of about several tens of micrometers to several hundreds of micrometers.

In the present embodiment, an adhesive 23a having an elastic bonding performance is interposed between the holding portion main body 22 and the holder 23 in the radial direction, and the leaf spring 24 is elastically deformed in the rotation axis AX1 direction. Since the stress generated in the holding unit main body 22 due to thermal expansion is relaxed, the distortion of the holding unit main body 22 due to the stress is reduced, and the pattern formation on the substrate S is adversely affected (degradation of transfer fidelity). Etc.) can be suppressed.
In the case of the present embodiment, the rolling element 25 is made of a metal material. However, if the thermal expansion by the material itself is large, the diameter (overall length) of the impression cylinder installation portion 25a changes, so that the low thermal expansion is achieved. It is preferable to use a metal (such as Invar) or a ceramic material having a low coefficient of thermal expansion.

(Second Embodiment)
Next, a second embodiment of the substrate processing apparatus 100 will be described with reference to FIGS. In the said 1st Embodiment, although the rolling element 25 provided with the impression cylinder installation part 25a was illustrated as a gap formation part which forms a gap between the mask holding surface 22a and the board | substrate holding surface 31, in this embodiment A case where a driving device for adjusting the position of the mask holding unit 20 with respect to the body 30 is provided will be described. In the present embodiment, description will be made assuming that the rotation axes AX1 and AX2 are arranged on the same XY plane (the mask holding unit 20 and the impression body 30 are arranged in the horizontal direction).
In these drawings, the same components as those of the first embodiment shown in FIGS. 1 to 4 are denoted by the same reference numerals, and the description thereof is omitted.

FIG. 5 is an enlarged cross-sectional view of the mask holding unit 20.
The mask holding unit 20 includes a holding unit main body 22, a holder 23 </ b> A that has a through-hole having the rotation axis AX <b> 1 as an axis, and holds the holding unit main body 22 from the inner peripheral side of the + Y side end via an adhesive 23 a, A holder 23B for holding the holding portion main body 22 from the inner peripheral side of the end portion on the −Y side via an adhesive 23a, and a through-hole having the rotation axis AX1 as an axis, with a rotation axis 34 having an axis AX1 as an axis. And a terminal cylinder 36 that rotatably supports the holder 23A from the outer peripheral side around the rotation axis AX1 via the air bearing 35. The mask holding unit 20 is driven to rotate independently of the impression body 30 by a driving device MT connected to the rotating shaft 34.

  A fixing rod 37 extending in the Y direction is inserted into the internal space of the holding unit main body 22 through the terminal cylinder 36 and the through hole of the holder 23 </ b> A, and one end is fixed to the terminal cylinder 36 by the fixing plate 37. Has been. The fixing rod 37 supports the illumination unit 10 and is supplied with a temperature adjustment medium from a supply unit 39A constituting the temperature adjustment device. By discharging from the discharge unit 39B, the temperature adjustment medium circulates. While the temperature rise of the illumination part 10 is suppressed efficiently, the temperature of the internal space of the holding part main body 22 is adjusted.

  Further, the substrate processing apparatus 100 of the present embodiment includes a measuring unit 40 that measures the gap amount between the mask holding surface 22 a and the substrate holding surface 31, and the holding unit main body 22 according to the measurement result of the measuring unit 40. A displacement part 41 for displacing the mask holding part 20 in a direction in which the impression body 30 is separated and approached is provided as a gap forming part.

  The measuring unit 40 includes a CCD camera with a microscope supported by a fixed rod 37, an optical focus (height measurement) sensor, and the like, and faces the holding unit main body 22 on the substrate holding surface 31 of the impression body 30. The distance between the mask holding surface 22a and the substrate holding surface 31 is measured by measuring the position (here, the position in the X direction), and the measured gap amount is output to the control unit CONT. Is done.

  The displacement part 41 holds the rotating shaft 34 via the air bearing 42, and also holds the drive part 44 that drives the holder 23 </ b> A in the X direction along the guide 43 extended in the X direction, and the terminal cylinder 36. In addition, the driving unit 47 is configured to drive the terminal cylinder 36 in the X direction along a guide 46 extending in the X direction, and the control unit CONT that drives the driving units 44 and 47 independently. .

  As shown in FIG. 6, a plurality of measurement units 50 that have the same configuration as the measurement unit 40 and measure alignment marks (not shown) of the substrate S are arranged upstream of the exposure region in the transport direction of the substrate S. Is provided. In the present embodiment, the measurement unit 50 is arranged at three positions with intervals in the transport direction of the substrate S, and three (see FIG. 7) at intervals in the width direction of the substrate S. The measurement result is output to the control unit CONT.

  In the substrate processing apparatus 100 having the above-described configuration, the control unit CONT controls the driving of the driving units 44 and 47 in accordance with the gap amount between the mask holding surface 22a and the substrate holding surface 31 measured by the measuring unit 40. By setting the driving amount, the mask holding unit 20 is moved in the direction of separating and approaching the impression body 30 to adjust the gap amount. Further, the control unit CONT can finely adjust the relative inclination between the rotation axis AX1 and the rotation axis AX2 by changing the drive amounts of the drive units 44 and 47.

  Further, based on the alignment mark position of the substrate S measured by the measurement unit 50, the control unit CONT measures in advance the surface distortion of the exposure area in the substrate S before the exposure processing, and adjusts the gap amount as described above or the rotation axis AX1. And the relative inclination adjustment between the rotation axis AX2 and the rotation axis AX2.

  As described above, in the present embodiment, in addition to obtaining the same operation and effect as in the first embodiment, the mask holding unit 20 is moved to move the mask holding surface 22a and the substrate holding surface 31 between them. The gap amount can be adjusted to an arbitrary value. Accordingly, in the present embodiment, when the distance between the axes of the rotation axis AX1 and the rotation axis AX2 changes due to an environmental change such as a temperature change, or when the diameters of the holding unit main body 22 and the impression cylinder 30 vary, M, even when the thickness of the substrate S varies depending on the production lot or the like, the gap amount between the mask holding surface 22a and the substrate holding surface 31 can be easily adjusted to a predetermined amount. This pattern can be exposed to the substrate S with high accuracy.

(Third embodiment)
Next, a third embodiment of the substrate processing apparatus 100 will be described with reference to FIGS. In the second embodiment, the amount of gap between the mask holding surface 22 a and the substrate holding surface 31, that is, the outer peripheral surface of the mask M, is controlled by controlling the driving of the driving units 44 and 47 to move the mask holding unit 20. In this embodiment, a nesting part is provided between the mask holding part 20 and the impression body 30, and the position of the nesting part is adjusted. An example of adjusting the gap amount between the mask holding surface 22a and the substrate holding surface 31 will be described.
In these drawings, the same components as those of the second embodiment shown in FIGS. 5 and 6 are denoted by the same reference numerals, and the description thereof is omitted.

  In the holding portion main body 22 shown in FIG. 7, a terminal cylinder 36 provided at the end on the + Y side is supported by a support member 51A. The support member 51A is movably supported in a non-contact manner on a guide portion 52A provided on the base portion B so as to extend in the X direction. Further, the support member 51A is biased and pressurized by the air cylinder (biasing portion) 53A provided on the + X side with a predetermined biasing force toward the −X side. Similarly, in the holding part main body 22, the rotation shaft 34 on the −Y side is supported by the support member 51 </ b> B via the air bearing 42. The support member 51B is movably supported in a non-contact manner on a guide portion 52B provided on the base portion B so as to extend in the X direction. Further, the support member 51B is biased and pressurized by the air cylinder (biasing portion) 53B provided on the + X side with a predetermined biasing force to the −X side.

  The base portion B is provided at an interval in the Y direction. The base portion B protrudes more toward the + Z side than the guide portions 52A and 52B on the −X side from the region where the guide portions 52A and 52B are supported, and the impression body 30 is formed. A supporting wall 54 is provided. Between each support member 51A, 51B and the support wall 54, a groove portion 55 extending in the Z direction is formed.

  As shown in FIG. 8, the width in the X direction of the groove portion 55 is formed to have a slight taper with respect to the YZ plane so as to gradually increase toward the + Z direction. More specifically, the side surface on the + X side of the support wall 54 (the side surface on the −X side that forms the groove portion 55) is formed in parallel to the YZ plane, and the side surface on the −X side of the support members 51A and 51B (the groove portion) 55) is formed such that the distance from the side surface on the + X side of the support wall 54 gradually increases toward the + Z direction with respect to the plane parallel to the YZ plane. An insert portion 56 is inserted into the groove portion 55 so as to be movable in the Z direction.

  As shown in FIG. 7, the driving device (first adjustment unit) MT that is connected to the rotation shaft 34 and rotates the mask holding unit 20 (that is, the mask M) via the rotation shaft 34 is movable in the Y direction. A shift stage (second adjustment unit) 48 is provided. The control unit CONT can move the mask holding unit 20, the mask M, and the driving device MT integrally in the Y direction by controlling the movement of the shift stage 48.

  In the substrate processing apparatus 100 having the above-described configuration, the support members 51A and 51B pressurized in the −X direction by the air cylinders 53A and 53B have the inclined (tapered) surfaces in contact with the nested portions 56 inserted into the groove portions 55. By restricting the movement, the positions of the support members 51A and 51B in the X direction are defined. The position where the inclined surfaces of the support members 51A and 51B abut on the telescopic portion 56 varies depending on the position of the telescopic portion 56 in the Z direction. Therefore, by adjusting the position in the Z direction of the nesting part 56, the position in the X direction where the movement of the support members 51A and 51B is restricted and positioned can be defined.

  That is, in this embodiment, by adjusting the position of the nesting part 56 in the Z direction, the positions of the mask holding part 20 and the mask M supported by the support members 51A and 51B in the X direction can be adjusted. As a result, the mask The amount of gap between the holding surface 22a and the substrate holding surface 31 (the gap G between the mask M and the substrate S) can be adjusted. Further, by making the position in the Z direction of the nesting part 56 that restricts the movement of the support members 51A and 51B different between the support member 51A and the support member 51B, the Y axis is parallel to the XY plane. It is also possible to finely adjust the inclination of the rotation axis AX1 of the mask holding unit 20.

  Note that the movement of the telescopic part 56 in the Z direction in the present embodiment may be performed by a driving device such as a motor based on the measurement result of the measurement part 50 under the control of the control part CONT, for example.

  On the other hand, based on the alignment mark position of the substrate S measured by the measurement unit (detection unit) 50, the control unit CONT according to the relative positional relationship between the mask M and the substrate S in the direction around the rotation axis AX1 (circumferential direction). The rotational operation of the driving device MT is controlled to align the mask M and the substrate S in the direction around the rotation axis AX (circumferential direction). In addition, the control unit CONT uses the mask holding unit 20, the mask M, and the driving device MT via the shift stage 48 in accordance with the relative positional relationship between the measured mask M and the substrate S in the direction of the rotation axis AX1 (Y direction). Is moved in the Y direction (rotation axis AX1 direction) to align the mask M and the substrate S in the rotation axis AX1 direction.

Thus, in this embodiment, in addition to the gap amount between the mask M and the substrate S described above, the relative position in the direction around the rotation axis AX1 and the relative position in the direction of the rotation axis AX1 can be easily adjusted. Become.
In addition, when adjusting the relative position of the mask M and the substrate S in the direction (circumferential direction) about the rotation axes AX1 and AX2, in addition to the method of controlling the driving of the driving device MT, for example, the mask holding unit 20 is provided. An electromagnetic brake (power generation brake) or the like is installed between rotating parts such as the holding part main body 22 and the rotating shaft 34 and fixed parts such as the support members 51A and 51B, and the holding part is activated and stopped. The relative position (angular position) in the direction around the rotation axis AX1 of the mask M with respect to the substrate S may be adjusted by temporarily applying a load to the rotational force of the main body 22 to reduce the rotational moment.

(Fourth embodiment)
Next, a fourth embodiment of the substrate processing apparatus 100 will be described with reference to FIGS. 9 to 11. In the first embodiment, the impression cylinder installation portion 25a of the rolling element 25 abuts on the impression cylinder 30, so that the gap between the mask holding surface 22a and the substrate holding surface 31, that is, between the mask M and the substrate S. In this embodiment, the gap amount G is appropriately maintained according to the thickness St of the substrate S, and the peripheral speeds of the mask M and the substrate S are matched with each other. To do.
In these drawings, the same components as those of the first embodiment shown in FIGS. 1 to 4 are denoted by the same reference numerals, and the description thereof is omitted.

As shown in FIG. 9, the overall configuration of this embodiment is the same as that of FIG. 1, but in this embodiment, the outer peripheral surfaces on both sides in the Y direction of the impression body 30 and the impression cylinder installation portion of the rolling element 25. The difference is that shims (correcting portions) SM1 and SM2 having a predetermined thickness are annularly provided on the outer peripheral surface of 25a.
As shown in FIG. 3, the radius of the impression cylinder installation portion 25a of the rolling element 25 is r1, the radius of the substrate holding surface 31 of the impression cylinder 30 is r2, the radius of the mask holding surface 22a is r11, and the thickness of the mask M. When the thickness is Mt, the thickness of the substrate S is St, and the predetermined gap amount between the mask M and the substrate S is G, the inter-axis distance DX between the rotation axis AX1 and the rotation axis AX2 is expressed by the following equation (1). expressed.
DX = r11 + Mt + G + St + r2 (1)
Therefore, when the impression cylinder installation part 25a rolls on the substrate holding surface 31 of the impression cylinder 30, the radius r1 of the impression cylinder installation part 25a is obtained by the following equation (2).
r1 = DX-r2 (2)

  For this reason, when the values of the mask M, the substrate S, and the gap G are determined, the radius r1 of the impression cylinder installation portion 25a having the value obtained from the above formulas (1) and (2) is used.

However, for the substrate S, for example, substrates having different thicknesses may be used due to a difference in lots or the like. This can occur not only for the substrate S but also for the mask M.
Therefore, in the present embodiment, as a correction unit that corrects a change in the thickness of the substrate S, the mask M, and the like, a shim is provided at a contact portion between the impression cylinder installation portion 25a of the rolling element 25 and the impression cylinder 30. It has become.

  That is, as shown in FIG. 9, a shim (correction unit) SM1 is detachably provided on the outer peripheral surface of the impression cylinder installation unit 25a. In addition, a shim (correction unit) SM2 is detachably provided at a position facing the impression cylinder installation part 25a on the outer peripheral surface of the impression cylinder 30. As means for making the shim SM1 detachable from the outer peripheral surface of the impression cylinder installation part 25a, the shim SM1 is provided with a magnetic part, and the mask holding part 20 (impression cylinder installation part 25a) is provided with a magnetizing part. Can be taken.

  Specifically, a configuration in which the shim SM1 is formed of a magnetic material, and a configuration in which a layer containing a magnetic material such as magnetic powder is formed on the entire surface or a part of the shim SM1, and the outer peripheral surface of the impression cylinder installation portion 25a is a magnet. The structure which embeds a magnet in the outer peripheral surface of the impression cylinder installation part 25a can be taken. As the magnet, a permanent magnet or an electromagnet can be provided.

  As a means for making the shim SM2 detachable with respect to the outer peripheral surface of the impression body 30, it is possible to adopt a configuration in which the shim SM2 is provided with a magnetic part and the impression body 30 is provided with a magnetizing part, similar to the shim SM1. it can.

The shim SM1 is provided over substantially the entire circumference of the outer peripheral surface of the impression cylinder installation portion 25a. Similarly, the shim SM2 is provided over substantially the entire circumference of the outer circumferential surface of the impression body 30 (substrate holding surface 31). More specifically, when the shim SM1 is wound around the outer peripheral surface of the impression cylinder installation portion 25a, the end portions in the direction around the rotation axis AX1 are overlapped so as not to form a protrusion in the radial direction. It has a length that forms a gap in the part. Then, as shown in FIG. 10A, both ends of the shim SM1 in the circumferential direction have the same angle so that a gap extending in a direction obliquely intersecting the rotation axis AX1 is formed with a constant width. It is formed in an oblique direction.
With this configuration, even when the mask holding unit 20 and the impression body 30 rotate and the contact range Ta with the impression body 30 moves, a part of the shim SM1 always exists in the contact range Ta, and the gap step Thus, fluctuations in the gap amount, vibrations, and the like are prevented when the mask holding unit 20 and the impression body 30 are rotated together. The configuration of the end that forms the gap is the same for the shim SM2.

As described above, the thicknesses of the shims SM1 and SM2 are set according to the thicknesses of the substrate S and the mask M, respectively, in order to maintain the gap amount G between the mask M and the substrate S shown in FIG. In this case, the radius r1 of the impression cylinder installation portion 25a is set to be smaller than the distance to the outer peripheral surface of the impression cylinder 30 so that the shims SM1 and SM2 can be installed.
Therefore, when the thicknesses of the shims SM1 and SM2 are t1 and t2, respectively, the inter-axis distance DX between the rotation axis AX1 and the rotation axis AX2 is expressed by the following formula (3).
DX = r1 + r2 + t1 + t2 = r11 + Mt + G + St + r2 (3)
The sum of the thicknesses of the shims SM1 and SM2 from the equation (3) is expressed by the following equation (4).
t1 + t2 = r11 + Mt + G + St-r1 (4)
For example, when the thickness St of the substrate S changes to (St + α), the sum of the thicknesses of the shims SM1 and SM2 is set to t1 + t2 + α, so that even when the thickness of the substrate S changes, the gap amount G Can be kept constant.

  However, the peripheral speeds of the mask holding part 20 and the impression cylinder 30 are the same at the positions (distances from the rotation axes AX1 and AX2) on the contact surfaces tf of the shims SM1 and SM2, and the masks are located away from these positions. The peripheral speed of the surface of M (hereinafter referred to as the mask surface) and the peripheral speed of the surface of the substrate S (hereinafter referred to as the substrate surface) vary according to the distance from the rotation axes AX1 and AX2 of each surface. Therefore, it is necessary to set the thicknesses of the respective shims SM1 and SM2 so that the relative peripheral speeds of the mask surface and the substrate surface are the same.

For example, the changed thickness of the substrate S is St ′ (= St + α), the thicknesses of the shims SM1 and SM2 corresponding to the thickness St ′ of the substrate S are T1 and T2, respectively, the angular velocity of the mask holding unit 20 is ω1, The angular velocity of the body 30 is ω2, and the position of the contact surface tf is between the outer peripheral surface of the mask M and the outer peripheral surface of the substrate S, that is, approximately in the middle of the gap G, as described above with reference to FIG. In this case, since the peripheral speed on the contact surface tf is the same, the following formula (5) is established.
(R1 + T1) · ω1 = (r2 + T2) · ω2 (5)
Further, since the peripheral speed of the mask surface and the peripheral speed of the substrate surface are the same, the following equation (6) is established.
(R11 + Mt) · ω1 = (r2 + St ′) · ω2 (6)
By arranging the above equations (5) and (6), the following equation (7) is derived.
(R2 + T2) / (r1 + T1) = (r2 + St ′) / (r11 + Mt) (7)
Furthermore, from the formula (4), the following formula (8) is established.
T1 + T2 = r11 + Mt + G + St′−r1 (8)

  Therefore, in the present embodiment, by using the shims SM1 and SM2 having the thicknesses T1 and T2 satisfying the expressions (7) and (8), the outer peripheral surface of the mask M is changed even when the thickness of the substrate S is changed. While maintaining the gap amount with the outer peripheral surface of the substrate S, the peripheral speeds of the outer peripheral surface of the mask M and the outer peripheral surface of the substrate S can be corrected to be the same. In the present embodiment, the shims SM1 and SM2 are magnetically attached to the impression cylinder installation portion 25a and the impression cylinder 30, respectively, so that the shims SM1 and SM2 can be easily replaced in accordance with the thickness change of the substrate S, the mask M, and the like. The work efficiency can be improved. Furthermore, in the present embodiment, the gap between the ends of the shims SM1, SM2 extends in a direction intersecting the rotation axis AX1, AX2 direction, so that gap fluctuation or vibration due to a step occurs during rolling. Can be prevented, and it becomes possible to perform highly accurate exposure processing.

  In addition, although the structure which forms the edge part of shim SM1 and SM2 in the said 4th Embodiment in the diagonal direction was illustrated, it is not limited to this, At least one part of the clearance gap between edge parts is rotation axis AX1, For example, as shown in FIG. 10B, the gap along the rotation axis AX1, AX2 direction and the direction orthogonal to the rotation axis AX1, AX2 direction may be used. You may form in a staircase shape so that a clearance may alternate.

  Further, even when the gap between the end portions is formed along the directions of the rotation axes AX1 and AX2, as shown in FIG. 10C, the rotation axes AX1 and AX1 are arranged so that the positions of the gaps are different in the directions around the rotation axes AX1 and AX2. A configuration in which a plurality of shims are arranged in the AX2 direction may be employed.

  In the above embodiment, the thickness of the shims SM1 and SM2 is set so that the relative peripheral speeds of the mask surface and the substrate surface are the same. However, for example, the thickness change of the substrate S changes. If it is within the allowable range, the thickness of one of the shims SM1 and SM2 may be fixed, and only the thickness of the other shim may be replaced by shim replacement. In addition, when the thickness of the substrate S or the mask M does not change greatly, a shim having a necessary thickness may be fixed with an adhesive in gap adjustment at the time of initial adjustment.

Further, for example, when the substrate S is stretched in the transport direction in the previous process, the thickness distribution of the shims SM1 and SM2 is adjusted to correct the expansion and contraction of the substrate S and the outer peripheral surface of the mask M and the substrate A difference in the peripheral speed relative to the outer peripheral surface of S may be intentionally made.
Here, the thickness St of the substrate S in FIG. 11 is 100 μm, the gap G is 100 μm, the radius (r1 + t1) of the impression cylinder installation portion 25a including the thickness t1 of the shim SM1, and the radius of the impression cylinder 30 including the thickness t2 of the shim SM2. When (r2 + t2) is 150 mm, and the peripheral speed V0 at the contact surface tf is 50 mm / S, the outer peripheral surface of the mask M under the condition that the contact surface tf is located in the middle (1/2) of the gap G. The outer peripheral surface of the substrate S and the outer peripheral surface of the substrate S both have a peripheral speed of 49.983 mm / S while maintaining the gap G, and the relative speed difference is zero.
Depending on where in the gap G the position of the contact surface tf (Z direction) is set, there is a slight relative difference in the peripheral speed. Therefore, the circumferential dimension of the pattern exposed on the substrate S is set on the mask M. It is possible to expand and contract within a certain range with respect to the circumferential dimension of the pattern. In the case of the above numerical example, if the dimension in the circumferential direction of the pattern on the mask M is 750 mm, the dimension in the transport direction of the pattern exposed on the substrate S can be expanded and contracted by about ± 500 μm at maximum.
Such expansion / contraction correction of the exposure pattern is also referred to as relative magnification correction in the scanning exposure direction (conveyance direction of the substrate S), and is applied to the base pattern formed on the resinous substrate S having a large physical expansion / contraction. When accurate overlay exposure is performed, it is possible to faithfully transfer the pattern in accordance with the base pattern by positively utilizing the relative magnification correction.

(Fifth embodiment)
Next, a fifth embodiment of the substrate processing apparatus 100 will be described with reference to FIG.
In the fourth embodiment, the thickness of the shims SM1 and SM2 is adjusted to correspond to the thickness change of the substrate S and the like. However, in this embodiment, the rolling element 25 is elastically deformed in the radial direction. Thus, the configuration corresponding to the thickness change of the substrate S and the like will be described.
In this figure, the same components as those of the fourth embodiment shown in FIGS. 9 to 11 are denoted by the same reference numerals, and the description thereof is omitted.

  As shown in FIG. 12, in the substrate processing apparatus 100 according to the present embodiment, the outer periphery of the impression cylinder installation portion 25 a of the rolling element 25 between the rolling element 25 and the holder 23 that holds the end of the holding part main body 22. A displacement ring 61 for displacing the surface is provided. The displacement ring 61 is formed around the rotation axis AX1 on the side facing the rolling element 25, and is provided with a protrusion having an inclined surface 61a that gradually increases in diameter as the distance from the rolling element 25 increases. And the rolling element 25 is provided with the slope 25b fitted to the slope 61a from the outside. Further, the adjustment includes a head portion 62b that engages with the rolling element 25 from the opposite side of the displacement ring 61 in the direction of the rotation axis AX1, and a shaft portion 62a that is screwed about an axis parallel to the displacement ring 61 and the rotation axis AX1. Screw portions (load applying portions) 62 are provided at a plurality of positions at equiangular intervals along a circle parallel to the XZ plane centering on the axis AX1. In the present embodiment, the mask holding portion 20 and the pressure drum 30 are rotated together by the pressure drum installation portion 25 a coming into contact with the substrate holding surface 31 of the pressure drum 30.

  In FIG. 12, when adjusting the gap amount between the mask holding surface 22 a and the substrate holding surface 31 (gap amount G between the mask surface and the substrate surface), for example, the shaft portion 62 a is screwed into the displacement ring 61. The adjustment screw 62 is rotated in the direction. Since the head portion 62 b of the adjusting screw 62 is engaged with the displacement ring 61, the shaft portion 62 a is elastically deformed by being screwed into the displacement ring 61 so as to extend in the axial direction parallel to the rotation axis AX <b> 1. The elastic restoring force of the shaft portion 62a acts on the rolling element 25 as a load in the direction approaching the displacement ring 61 via the head portion 62b.

  Since the rolling element 25 to which a load in the direction approaching the displacement ring 61 is applied moves in a direction in which the inclined surface 25b expands along the inclined surface 61a of the displacement ring 61, the load in the direction approaching the displacement ring 61 is increased. It is converted into the diameter increasing direction, and the impression cylinder installation portion 25a is elastically deformed to expand the diameter. By increasing the diameter of the impression cylinder installation portion 25a, the gap amount (gap amount G between the mask surface and the substrate surface) between the mask holding surface 22a and the substrate holding surface 31 can be increased corresponding to the increased diameter. it can. Here, when the amount of diameter expansion is too large, the amount of elastic deformation of the shaft portion 62a is reduced by rotating the adjusting screw 62 in the opposite direction, and the displacement ring 61 applied to the rolling element 25 is reduced. By reducing the load in the approaching direction, the diameter expansion amount of the impression cylinder installation portion 25a is reduced.

As described above, in this embodiment, by rotating the adjustment screw 62, the amount in which the impression cylinder installation portion 25a expands is adjusted according to the load in the direction approaching the displacement ring 61 and the angles of the inclined surfaces 61a and 25b. Thus, the gap amount between the mask holding surface 22a and the substrate holding surface 31 (gap amount G between the mask surface and the substrate surface) can be easily adjusted to a desired value.
When the diameter of the impression cylinder installation portion 25a is enlarged by the rotation of the adjusting screw 62, the distance between the contact surface tf and the outer peripheral surface of the mask M in the Z direction (radial direction) as shown in FIG. Therefore, a difference occurs in the relative peripheral speed between the outer peripheral surface of the mask M and the outer peripheral surface of the substrate S. Therefore, the expansion amount of the diameter of the impression cylinder installation portion 25a is determined in consideration of this. Is desirable.

  For the rotation of the adjustment screw 62 described in the fifth embodiment, a separate rotation drive device is provided, and the rotation amount of the adjustment screw 62 is controlled via the rotation drive device according to the gap amount to be adjusted. May be taken. Further, as means for expanding the diameter of the impression cylinder installation portion 25a, a configuration in which a load in the direction of the rotation axis AX1 is applied to the rolling element 25 using a piezoelectric element such as a piezoelectric element in addition to the adjustment screw 62 described above. . Furthermore, in addition to the configuration for converting the load in the direction of the rotation axis AX1 to the radial load, a piezoelectric element is provided so as to be displaced in the radial direction, and the impression cylinder installation portion 25a is expanded according to the displacement amount of the piezoelectric element. The diameter or the diameter may be reduced.

(Sixth embodiment)
Next, a sixth embodiment of the substrate processing apparatus 100 will be described with reference to FIGS.
In the first to fifth embodiments, the substrate S in the exposure region has been described as being configured to be held on the outer peripheral surface 31 of the impression body 30, but in the present embodiment, the substrate S is formed using a belt that circulates in an endless belt shape. The structure held in a planar shape will be described.
In these drawings, the same components as those of the above-described embodiment shown in FIGS. 1 to 12 are denoted by the same reference numerals, and the description thereof is omitted.

  The substrate processing apparatus 100 of the present embodiment includes a substrate supply unit 11 that supplies a substrate S, a substrate recovery unit 12 that recovers the substrate S, and a substrate transfer unit 90 that transfers the substrate S. The substrate supply unit 11 sends out and supplies the substrate S wound in a roll shape, for example. In this case, the substrate supply unit 11 is provided with a shaft around which the substrate S is wound, a rotation drive device that rotates the shaft, and the like. In addition, for example, a configuration in which a cover portion that covers the substrate S wound in a roll shape or the like may be provided. The substrate supply unit 11 is not limited to a mechanism that sends out the substrate S wound in a roll shape, and may include any mechanism that sequentially sends the belt-like substrate S in the length direction thereof.

  The substrate collection unit 12 collects the substrate S that has been subjected to the exposure process, for example, in a roll shape. Similar to the substrate supply unit 11, the substrate collection unit 12 is provided with a shaft part for winding the substrate S, a rotational drive source for rotating the shaft part, a cover unit for covering the collected substrate S, and the like. In addition, when the substrate S is cut into a panel shape in the substrate processing unit 11, the substrate S is collected in a state different from the rolled state, for example, the substrate S is collected in an overlapped state. It does not matter.

  The substrate transport unit 90 includes a plurality of guide rollers R (two in FIG. 13) that guide the substrate S supplied from the substrate supply unit 11 and a substrate support mechanism 80 that supports the substrate S. The substrate support mechanism 80 is disposed between the guide rollers R.

  The substrate support mechanism 80 includes a belt part (endless belt) 81, a belt transport part 82, and a guide stage (fluid support part) 83. Although not shown, the substrate support mechanism 80 is provided with a belt cleaning unit for cleaning the belt unit 81, a static electricity removing unit for removing static electricity from the belt unit 81, and the like.

The belt portion 81 is formed endlessly using a metal material such as stainless steel.
The belt portion 81 supports the substrate S from the back surface side by a support surface (substrate holding surface) 81a provided outside. The belt portion 81 is provided with a plurality of through holes (not shown) arranged side by side in the circumferential direction. Each through hole is formed to penetrate between the support surface 81a of the belt portion 81 and the back surface 81b provided on the back side of the support surface 81a. The plurality of through holes are formed in a plurality of rows in the Y direction. A part of the belt portion 81 is disposed to face the back surface of the substrate S.

  The belt conveyance unit 82 includes two conveyance rollers 82a to 82b. A belt portion 81 is wound around the transport rollers 82a to 82b. The transport roller 82b is disposed on the upstream side (+ X side) in the transport direction of the substrate S with respect to the exposure region. The transport roller 82a is disposed downstream of the exposure region in the transport direction of the substrate S. For this reason, the belt unit 81 is configured to move so as to cross the exposure region in the X direction.

The conveyance roller 82a and the conveyance roller 82b are arranged to extend in the Y direction and are arranged at intervals from each other so as to be aligned in the X direction.
The positions of the transport rollers 82a and 82b are adjusted so as to move around the axis AX3 (see FIG. 14) parallel to the Y direction in a state where the belt portion 81 has tension.

  The transport roller 82a is a drive roller that drives the belt unit 81. The transport roller 82a is provided with a drive unit (circular drive unit) 82e. In the present embodiment, for example, the transport roller 82a is a driving roller, and the remaining transport roller 82b is a driven roller. The conveyance roller 82a that is a driving roller is made of, for example, a porous material, and is connected to a suction device (not shown). With this configuration, the belt portion 81 can be adsorbed on the outer peripheral surface, so that power can be transmitted to the belt portion 81.

  The guide stage 83 is formed in a rectangular plate shape using, for example, a porous material through which gas can pass. The + Z side surface (guide surface) 83a of the guide stage 83 is formed in parallel to the XY plane, and ejects gas (fluid) toward the substrate S, thereby causing the substrate S to be − by atmospheric pressure (fluid pressure). It functions as a flat pad that is supported without contact from the Z side. The guide stage 83 guides the substrate S and the belt portion 81 so as to move in the X direction along the guide surface 83a.

  The guide stage 83 is disposed between the transport roller 82a and the transport roller 82b in the X direction. Moreover, the guide stage 83 is arrange | positioned in the position which overlaps with the belt part 81 about the Y direction, as shown in FIG. The guide surface 33 a of the guide stage 33 is provided to face the back surface of the belt portion 31. The position of the guide stage 33 is fixed by a fixing mechanism (not shown).

  In the present embodiment, the power of the driving unit 82e is transmitted to the mask driving roller (rotating unit) 85 by the wheel train mechanism 84 via the rotating shaft 86 that rotates integrally. As the gear train mechanism 84, a mechanism including a magnetic gear capable of transmitting power without contact can be used.

FIG. 14 is a cross-sectional view of the substrate processing apparatus 100 shown in FIG. 13 taken along a plane parallel to the ZY plane.
As shown in FIG. 14, two mask drive rollers 85 are provided at intervals in the Y direction according to the arrangement of the rolling elements 25. Between the mask drive rollers 85, the rotation shaft 86 is supported by a pair of bearings 87 arranged with a space therebetween. These bearings 87 are finely driven in the Z direction by an elevating device (moving unit) 88 composed of a piezoelectric element or the like.

In the substrate processing apparatus 100 configured as described above, the holding unit main body 22 is moved in the Z direction via the mask driving roller 85 and the rolling element 25 by moving the rotary shaft 86 in the Z direction via the bearing 87 by the lifting device 83. It moves integrally and moves relative to the guide stage 83 in the Z direction.
Thereby, the gap amount G between the mask holding surface 22a of the holding portion main body 22 and the support surface 81a of the belt portion 81 can be adjusted. Therefore, the gap amount G between the mask M held on the mask holding surface 22a and the substrate S held on the support surface 81a is also adjusted to a predetermined amount.

  When the gap amount between the mask M and the substrate S is adjusted, the substrate processing apparatus 100 manufactures a display element (electronic device) such as an organic EL element or a liquid crystal display element by a roll method. Hereinafter, a process of manufacturing a display element using the substrate processing apparatus 100 having the above configuration will be described.

  First, a belt-like substrate S wound around a roller (not shown) is attached to the substrate supply unit 11. From this state, the driving unit 82e is operated to rotate the transport roller 82a so that the substrate S is sent out from the substrate supply unit 11. On the other hand, the power of the drive part 82e is transmitted to the rotating shaft 86 via the gear train mechanism 84. The mask driving roller 85 is rotated by the rotation of the rotating shaft 86, and the rolling element 25 contacting the mask driving roller 85 is rotated, whereby the mask M held by the holding portion main body 22a rotates around the rotation axis AX1. Therefore, the mask M is rotated in synchronization (cooperation) with the conveyance of the substrate S accompanying the rotation operation of the belt portion 81. In this state, the pattern image of the mask M illuminated with illumination light from the illumination unit 10 is sequentially exposed on the substrate S.

  As described above, also in the present embodiment, the gap amount between the mask holding surface 22a of the holding portion main body 22 and the support surface 81a of the belt portion 81 can be easily adjusted in accordance with the thickness change of the substrate S. It becomes possible. Further, in this embodiment, the gap adjustment amount is minute, and when a vacuum pressurized air bearing layer is formed between the belt portion 81 and the guide surface 83a of the guide stage 83, for example, It is good also as a structure which adjusts the amount of gaps by making the guide surface 83a which comprises a plane pad finely move to a Z direction.

  In the sixth embodiment, the configuration in which the mask M rotates about the rotation axis AX when the rolling element 25 abuts on the mask driving roller 85 and rotates is exemplified. However, the present invention is not limited to this. Instead, for example, as shown in FIG. 15, the mask M may be rotated by the rolling element 25 coming into contact with the belt portion 81 at a position separated from the substrate S.

In the substrate processing apparatus 100 having this configuration, the mask holding surface 22a and the guide stage are provided by providing the shim SM1 described in the fourth embodiment on the outer peripheral surface of the impression cylinder installation portion 25a with a thickness corresponding to the thickness of the substrate S. The gap amount between the guide surface 83a of 83 (between the mask surface and the substrate surface) can be adjusted.
In addition, when the gap adjustment amount is very small, the gap amount can be adjusted by adjusting the thickness of the air bearing layer described above. Specifically, as shown in FIG. 15, the supply unit 89 that supplies air to the guide stage 83 is controlled by the control unit CONT as the fluid pressure adjusting unit, and the rolling element 25 (the impression cylinder installation unit) in the air pad unit. By adjusting the air supply amount in the region where 25a) abuts, the thickness of the air bearing layer can be adjusted, and the rolling element 25 can be moved away from or approaching the belt portion 81. Thereby, the distance between the belt portion 81 and the rolling element 25, that is, the gap amount between the mask holding surface 22a and the guide surface 83a (between the mask surface and the substrate surface) can be easily changed.

  As described above, the preferred embodiments according to the present invention have been described with reference to the accompanying drawings, but the present invention is not limited to the examples. Various shapes, combinations, and the like of the constituent members shown in the above-described examples are examples, and various modifications can be made based on design requirements and the like without departing from the gist of the present invention.

  For example, in the above embodiment, the mask M is held on the outer peripheral surface of the holding portion main body 22, but the present invention is not limited to this, and the mask M is held on the inner peripheral surface of the holding portion main body 22. Also good.

  In the above embodiment, the configuration in which the measurement unit that measures the relative position between the mask M and the substrate S has been described only in the second and third embodiments. However, the present invention can be applied to other embodiments. Needless to say.

  Moreover, the substrate processing apparatus 100 of the said embodiment can be used as processing apparatus U3 in the device manufacturing system SYS mentioned later.

(Seventh embodiment)
Hereinafter, a substrate processing apparatus according to a seventh embodiment of the present invention will be described with reference to FIGS.
In the following description, the same components are denoted by the same reference numerals, and the description thereof may be simplified or omitted. Unless otherwise specified, the components and their descriptions are the same as those in the above embodiment.
In the present embodiment, the case where the mask holding portion and the substrate holding portion are configured to rotate synchronously (follow) by friction will be described as an example.

  16 is a front cross-sectional view of the main part of the substrate processing apparatus 200, FIG. 17 is a front view of the mask unit MU constituting the substrate processing apparatus 200, and FIG. 18 is a partially enlarged view of the end of the mask unit MU.

  The substrate processing apparatus 200 performs an exposure process on a strip-shaped substrate (for example, a strip-shaped film member) S with a flexible sheet-like mask M pattern, and includes an illumination unit 10 and a mask unit MU. The substrate holding unit SU, the alignment microscopes AL1 and AL2, and a control unit (not shown) are mainly configured. The mask M is a flexible sheet-like glass material, and is formed to a thickness of about 200 to 200 μm, for example.

  In this embodiment, the vertical direction is the Z direction, the direction parallel to the rotation axes AX1 and AX2 of the mask unit MU and the substrate holding unit SU is the Y direction, and the direction perpendicular to the Z direction and the Y direction is the X direction. explain.

  The illumination unit 10 irradiates illumination light toward an illumination region of the mask M wound around a mask holding unit 20 (described later) in the mask unit MU, and is exposed in a straight tube type and radially like a fluorescent lamp. Semiconductor lasers or LEDs that emit illumination light for use, those that introduce illumination light from both ends of a cylindrical quartz rod and that have a diffusing member on the back side, or emit light in the ultraviolet region of high brightness Are arranged in a row and are accommodated in the internal space of the inner cylinder 21 that supports the mask holding unit 20.

  The mask unit MU includes a mask holding unit 20 and rolling elements 25. The mask holding unit 20 includes a holding unit main body 22 and a holder 23. The holding body 22, the holder 23, and the rolling element 25 are provided in an integrated state, and a through-hole through which the inner cylinder 21 is inserted is communicated in the direction of the rotation axis (predetermined axis) AX1. Each is formed.

  The holding part main body 22 is formed of a cylindrical glass material having a rotation axis (predetermined axis) AX1 as an axis, and has an outer peripheral surface (peripheral surface) 22a for holding the mask M along a cylindrical surface having a predetermined radius. I have. As shown in FIG. 17, the peripheral length of the outer peripheral surface 22a is set to such a length that both ends in the direction around the rotation axis AX1 are separated when the mask M is wound (in the following description, the holding unit main body). 22 and the holder 23, a region where both ends of the mask M are separated in the direction around the rotation axis AX1 (scanning exposure direction) is referred to as a mask separation region Ma).

The holders 23 are formed of a metal material in an annular shape, and are provided at both ends in the length direction of the holding part main body 22, and have holding parts 23 a that hold the holding part main body 22 from the inner peripheral side. As a material for forming the holder 23, a material having the same linear expansion coefficient as that of the holding portion main body 22 is preferable. The outer peripheral surface 23 b of the holder 23 is formed with a smaller diameter than the outer peripheral surface 22 a of the holding portion main body 22.
Further, on the outer peripheral surface 23b of each holder 23, grooves 23c extending in the direction around the rotation axis AX1 except for the mask separation area Ma are formed in pairs so as to be parallel to each other in the Y direction. End portions in the circumferential direction are connected to each other at a position separated from Ma, and the periphery is formed in an O-shaped arrangement that forms an island portion surrounded by a groove portion 23c.

  As shown in FIG. 18, each groove portion 23 c is loaded with a seal portion 70 that seals the gap between the holder 23 and the mask M with a protruding amount that is substantially flush with the outer peripheral surface 22 a of the mask holding portion 20. ing. As the seal portion 70, for example, an O-ring is used. The space sealed by the seal part 70, that is, the closed space surrounded by the holder 23, the mask M, and the seal part 70 is sucked by negative pressure by the suction part VC. The sealing portion 70 and the suction portion VC constitute a fixing portion that detachably fixes the mask M to the mask holding portion 20.

  Further, as shown in FIG. 17, each holder 23 has an axial engagement portion (positioning pin) 71 positioned in the mask separation area Ma and an axial engagement positioned on the −Y side of the mask M. Each part (positioning pin) 72 is provided. The engaging portion 71 is for relative positioning in the circumferential direction of the mask M with respect to the mask holding portion 20 when one circumferential edge of the mask M is pressed against the outer circumferential surface. And projecting at a height that is substantially flush. On the top surface of the engaging portion 71, an index mark (index portion) FM serving as an index of the relative positional relationship with the mask M is formed.

  The engaging portion 72 is for relative positioning in the Y direction (width direction) of the mask M with respect to the mask holding portion 20 when one end edge on the -Y side of the mask M is pressed against the outer peripheral surface. The height of the mask M is substantially the same as the outer peripheral surface of the mask M. The mask M is positioned relative to the mask holding portion 20 by pressing the edges against both the engaging portions 71 and 72. In the mask M, for example, one in the vicinity of the edge pressed against the engagement portion 71 and two in the vicinity of the edge opposite to the end edge, respectively, are designed in the same manner as the engagement portion 71. A mask mark MM is formed at a position in a predetermined positional relationship with the pattern.

  The inner cylinder 21 is formed of cylindrical quartz or the like that can transmit illumination light, or a cylindrical ceramic material or metal having a slit-shaped opening 21a through which illumination light from the illumination unit 10 passes. .

  Returning to FIG. 16, the rolling element 25 is physically coupled (connected) to the holding portion main body 22 via the holder 23, and is provided on the outer peripheral side so as to project around the rotation axis AX <b> 1 and roll on the outer peripheral surface of the impression body 30. It has a moving impression cylinder installation part 25a. The outer diameter of the impression cylinder installation portion 25 a is formed to be a predetermined amount larger than the outer diameter formed by the outer surface of the mask M held on the mask holding surface 22 a of the holding portion main body 22. Specifically, the outer diameter of the impression cylinder installation part 25a is held by the impression cylinder 30 when the impression cylinder installation part 25a abuts the outer peripheral surface of the impression cylinder 30 and the holding part main body 22 is supported at a predetermined position. A predetermined amount of gap is formed between the formed substrate S and the mask M.

  Further, the rolling element 25 is supported on the inner peripheral side via the air bearing 26 so as to be rotatable in a non-contact manner around the rotation axis AX1 with respect to the inner cylinder 21. Therefore, the holding part main body 22, the holder 23, and the rolling element 25 rotate integrally around the rotation axis AX1.

  The inner cylinder 21 is mounted via a leaf spring 28 on a support base 27 extending in a direction approaching each other from a base portion B provided at an interval in the Y direction. The spring constant of the leaf spring 28 is the load applied to the impression body 30 via the weight of the mask holding part 20 and the rolling element 25, that is, the impression cylinder installation part 25 a of the rolling element 25 rolls on the outer peripheral surface of the impression cylinder 30. It is set according to the friction force. The above-described illumination unit 10 is disposed in the internal space of the inner cylinder 21, and an opening 21a through which illumination light passes is formed at a position facing the illumination unit 10 in the illumination light emission direction (FIG. 16). reference).

  The alignment microscopes AL1 and AL2 are for detecting the relative positional relationship between the mask M and the mask holding portion 20, and are provided so that the mask mark MM of the mask M and the index mark FM of the engaging portion 71 can be observed. It is arranged at the same Y position as MM and FM.

The substrate holding unit SU includes an impression body (substrate holding unit) 30.
The impression body 30 is formed in a columnar shape that is parallel to the Y axis and rotates around a rotation axis (second axis) AX2 set on the −Z side of the rotation axis AX1, and a hollow portion is provided inside. The moment of inertia is set to be small. The outer peripheral surface of the impression body 30 is a substrate holding surface 31 that holds the substrate S in contact therewith. On both end faces in the Y direction of the impression body 30, a rotation support portion 32 having a smaller diameter than the impression cylinder 30 and protruding coaxially is supported by the base portion B so as to be rotatable around the rotation axis AX <b> 2. In the present embodiment, a driving device 33 that rotates the impression body 30 and the mask holding unit 20 synchronously by rotating the impression body 30 is provided.

Next, an assembly procedure of the mask unit MU in the substrate processing apparatus 200 having the above configuration will be described.
First, for the mask M, for example, for a display device that includes a fine pattern with a line width of 20 μm or less with a light-shielding layer of chromium or the like on one surface of a strip-shaped ultrathin glass plate (for example, thickness 200 to 500 μm) with good flatness. It is created as a transmission type planar sheet mask on which the circuit pattern or the like is formed. Since the mask M is mounted with a curvature corresponding to the radius of the outer peripheral surface 22a of the holder main body 22 during substrate processing, the circumferential direction expands according to the thickness of the mask M and the radius of the outer peripheral surface 22a during mounting ( Outer surface side) or compressed (inner surface side). Therefore, with respect to the circumferential direction, the pattern of the mask M is a pattern in which the size at the time of mounting is enlarged or reduced in accordance with the thickness and the curvature. Therefore, at the time of pattern formation, the pattern is formed in a size that allows for this enlargement or reduction.

The mask M created as described above is used in a state in which the mask M is curved along the outer peripheral surface 22a of the holding portion main body 22 and wound (attached) around the outer peripheral surface. When the mask M is wound around the outer peripheral surface 22a, one end edge in the circumferential direction of the mask M is pressed against the outer peripheral surface of the engaging portion 71, and one end edge in the width direction of the mask M is pressed against the engaging portion 72. The mask M is wound around the mask holding unit 20 (holding unit main body 22) while being positioned. After the mask M is wound, the suction part VC is operated and the closed space sealed by the seal part 70 is sucked with negative pressure, whereby the mask M is sucked and held at both ends in the Y direction. In addition, when an air layer is formed between the mask M and the holding unit main body 22 and an interface having a large refractive index difference is generated, the image quality of the pattern exposed on the substrate S is reduced due to an interference phenomenon or multiple reflection. In order to suppress the occurrence of such a large difference in refractive index, pure water having an index of refraction comparable to that of the glass material between the mask M and the holding unit main body 22 or an oil immersion microscope is used. It is preferable to interpose a liquid such as oil used in the above.
In this case, it is desirable that the liquid has a sufficient transmittance (for example, 90% or more) in the wavelength range of the illumination light for exposure.

Further, since such liquid gradually evaporates from the peripheral portion of the mask M, the vicinity of the peripheral surface of the mask M on the outer peripheral surface 22a of the holding portion main body 22 or the engaging portions 71 and 72 are provided. For example, a plurality of lyophilic grooves having a depth of about several μm to several tens of μm (width is about 1 mm) are engraved on a part of the outer peripheral surface 22a and directed toward the grooves. In addition, it is preferable to provide a liquid supply mechanism that drops liquid from above the outer peripheral surface 22a of the holding unit body 22 through a dropper-like or needle-like nozzle.
With such a configuration, the liquid dropped into the plurality of grooves is rotated while the holding unit main body 22 is rotated at a practical angular speed (for example, a peripheral speed of the pattern surface of the mask M of about 50 to 200 mm / S). Since it is trapped in the groove, it can be soaked between the outer peripheral surface 22a of the holding portion main body 22 and the mask M by capillary action.
Of course, such a plurality of grooves are provided outside the pattern formation region on the mask M and at positions that do not disturb the exposure illumination light.

  For the mask unit MU on which the mask M is attracted and held, pattern position information is detected in advance before the exposure process. Specifically, the mask mark MM and the index mark FM are respectively detected by the alignment microscopes AL1 and AL2 while rotating the mask holding unit 20 around the rotation axis AX1. Thereby, the relative positional relationship of the mask M with reference to the index mark FM, that is, the relative positional relationship of the pattern is measured. By performing a predetermined calculation using this relative positional relationship, with respect to the pattern formed on the mask M, the position around the rotation axis AX1, the position in the Y direction, the rotation in the direction along the outer peripheral surface 22a, the magnification, etc. Pattern error information for the mask holding unit 20 is obtained.

Next, the operation of the substrate processing apparatus 200 will be described.
The mask holding portion 20 that is supported by the inner cylinder 21 via the air bearing 26 and holds the mask M is the difference between the weight of the mask holding portion 20 and the biasing force toward + Z according to the spring constant of the leaf spring 28. The pressure drum installation portion 25a of the rolling element 25 is in contact with the pressure drum body 30 in a state where the above load is applied. Thus, a predetermined amount of gap is formed between the mask holding surface 22a and the substrate holding surface 31, that is, between the mask M and the substrate S, according to the outer diameter of the impression cylinder installation portion 25a. In addition, when adjusting the load which the impression cylinder installation part 25a gives to the impression cylinder 30, it replaces | exchanges with the leaf | plate spring 28 which has a corresponding spring constant, or it is previously spacer between the inner cylinder 21 and the support stand 27. The leaf spring 28 may be installed in a state where the pressure cylinder is interposed, and the platen 28 may be replaced with a spacer according to the load applied to the impression body 30 by the impression cylinder installation portion 25a.

  Then, the impression body 30 is rotated about the rotation axis AX1 by driving of the driving device 33, and the illumination light is irradiated from the illumination unit 10, transmitted through the holding unit main body 22 through the opening 21a, and masked from the inner peripheral side. Illuminate M. As the impression body 30 rotates, the substrate S wound around and held on the substrate holding surface 31 of the impression body 30 is transported, and the rolling element 25 abuts on the outer peripheral surface of the impression body 30 in the impression cylinder installation portion 25a. , The rotational driving force is transmitted to the holder main body 22 through the holder 23, and the pattern of the mask M held by the holder main body 22 maintains a predetermined amount of gap with the substrate S in a constant state. Move synchronously. Then, the pattern image of the mask M illuminated by the illumination light is sequentially projected onto the projection area of the substrate S.

  When the pattern of the mask M is projected onto the substrate S, the position around the rotation axis AX2 of the substrate S, the position in the Y direction, the mask holding portion of the impression body 30 based on the error information of the pattern obtained in advance. It is preferable to adjust the relative rotation speed with respect to 20, the relative positional relationship between the rotation axes AX1 and AX2, and the gap amount between the mask M and the substrate S.

  As described above, in the mask unit MU of the present embodiment, the mask M formed of the glass material is held by the holding unit main body 22 formed of the glass material, so that the pattern can be easily formed. Thus, it is possible to suppress an increase in cost due to the time and labor required when the pattern is directly formed on 22. Further, in the present embodiment, since the pattern is formed on the flat mask M instead of the cylindrical surface, even a finer width pattern, for example, a line width pattern of 20 μm or less, can be formed with high accuracy. .

  Furthermore, in the present embodiment, when the mask M is mounted on the mask holding unit 20, the mask M can be easily engaged with the engaging units 71 and 72 so that the mask M can be easily positioned. . In addition, in the present embodiment, since the index mark FM is provided in the engaging portion 71, it is not necessary to separately provide a member for the index mark, and the apparatus can be reduced in size and cost. In the present embodiment, the mask M can be easily and quickly replaced by operating the suction / suction stop by the suction unit VC.

(Device manufacturing system)
Next, a device manufacturing system provided with the substrate processing apparatus 200 will be described with reference to FIG.
FIG. 19 is a diagram showing a partial configuration of a device manufacturing system (flexible display manufacturing line) SYS. Here, the flexible substrate P (sheet, film, etc.) pulled out from the supply roll FR1 passes through n processing devices U1, U2, U3, U4, U5,. An example of winding up is shown. The host control device CONT2 performs overall control of the processing devices U1 to Un constituting the production line.

  The device manufacturing system SYS of this embodiment is a so-called roll-to-roll system in which various processes for manufacturing one device are continuously performed on the substrate P. The substrate P that has been subjected to various processes is divided (diced) into devices (for example, a display panel of an organic EL display) to form a plurality of devices. As for the dimension of the substrate P, for example, the dimension in the width direction (short Y direction) is about 10 cm to 2 m, and the length direction (long X direction) is 10 m or more.

  In FIG. 19, the orthogonal coordinate system XYZ is set so that the front surface (or back surface) of the substrate P is perpendicular to the XZ surface, and the width direction orthogonal to the transport direction (long direction) of the substrate P is set to the Y direction. Shall be. The substrate P may be activated by modifying the surface in advance by a predetermined pretreatment, or may have a fine partition structure (uneven structure) for precise patterning formed on the surface.

  The substrate P wound around the supply roll FR1 is pulled out by the nipped drive roller DR1 and conveyed to the processing device U1, and the center of the substrate P in the Y direction (width direction) is set by the edge position controller EPC1. Servo control is performed so as to be within a range of about ± 10 μm to several tens μm relative to the position.

  The processing device U1 continuously applies a photosensitive functional liquid (photoresist, photosensitive silane coupling material, UV curable resin liquid, etc.) to the surface of the substrate P by a printing method with respect to the transport direction (long direction) of the substrate P or This is a coating apparatus for selectively coating. In the processing apparatus U1, a coating mechanism including a pressure drum DR2 around which the substrate P is wound, and a coating roller for uniformly coating the photosensitive functional liquid on the surface of the substrate P on the pressure drum DR2. Gp1, a drying mechanism Gp2 for rapidly removing a solvent or moisture contained in the photosensitive functional liquid applied to the substrate P, and the like are provided.

  The processing device U2 heats the substrate P conveyed from the processing device U1 to a predetermined temperature (for example, about several tens to 120 ° C.), and stabilizes the photosensitive functional layer applied to the surface. It is. In the processing apparatus U2, a plurality of rollers and an air turn bar for returning and conveying the substrate P, a heating chamber HA1 for heating the substrate P that has been carried in, and the temperature of the heated substrate P are as follows: A cooling chamber HA2 and a nipped drive roller DR3 are provided for lowering the temperature so as to match the ambient temperature of the post-process (processing device U3).

  The processing apparatus U3 as the substrate processing apparatus 200 is the exposure apparatus shown in FIGS. 16 to 18, and displays the photosensitive functional layer of the substrate P (substrate S) transferred from the processing apparatus U2. Irradiation with ultraviolet patterning light corresponding to the circuit pattern or wiring pattern for use. In the processing apparatus U3, an edge position controller EPC that controls the center of the substrate P in the Y direction (width direction) to a fixed position, the nipped drive roller DR4, and the substrate P are partially wound with a predetermined tension, and the substrate A rotating drum DR5 (pressure drum 30) for supporting a pattern exposed portion on P in a uniform cylindrical surface, and two sets of driving rollers DR6 for giving a predetermined slack (play) DL to the substrate P, DR7 etc. are provided.

  Further, in the processing apparatus U3, a transmission type cylindrical mask M (mask unit MU) and an illumination mechanism IU (illumination) that is provided in the cylindrical mask M and illuminates a mask pattern formed on the outer peripheral surface of the cylindrical mask M. Part 10) and a part of the substrate P supported in a cylindrical surface by the rotary drum DR5 in order to relatively align (align) the image of a part of the mask pattern of the cylindrical mask M with the substrate P. Alignment microscopes AM1 and AM2 for detecting an alignment mark or the like formed in advance on P are provided.

  The processing device U4 is a wet processing device that performs wet development processing, electroless plating processing, and the like on the photosensitive functional layer of the substrate P conveyed from the processing device U3. In the processing apparatus U4, there are provided three processing tanks BT1, BT2, and BT3 layered in the Z direction, a plurality of rollers for bending and transporting the substrate P, a nip driving roller DR8, and the like.

  The processing apparatus U5 is a heating and drying apparatus that warms the substrate P conveyed from the processing apparatus U4 and adjusts the moisture content of the substrate P wetted by the wet process to a predetermined value, but the details are omitted. After that, the substrate P that has passed through several processing devices and passed through the last processing device Un in the series of processes is wound up on the collection roll FR2 via the nipped drive roller DR1. Also during the winding, the edge position controller EPC2 controls the Y of the drive roller DR1 and the recovery roll FR2 so that the center in the Y direction (width direction) of the substrate P or the substrate end in the Y direction does not vary in the Y direction. The relative position in the direction is successively corrected and controlled.

In the device manufacturing system SYS described above, since the substrate processing apparatus 200 described above is used as the processing apparatus U3, a pattern can be easily formed, and there is a trouble as in forming a pattern on the holding unit main body 22. Therefore, it is possible to suppress an increase in cost, and it is possible to manufacture a highly accurate device at a low cost.
In addition, the processing apparatus U3 shown in FIG. 19 may be the substrate processing apparatus 100 described in each of the previous embodiments of FIGS.

  As described above, the preferred embodiments according to the present invention have been described with reference to the accompanying drawings, but the present invention is not limited to the examples. Various shapes, combinations, and the like of the constituent members shown in the above-described examples are examples, and various modifications can be made based on design requirements and the like without departing from the gist of the present invention.

  For example, in the above-described embodiment, the mask M is configured to be wound (attached) around the outer peripheral surface 22a of the holding unit main body 22. However, the present invention is not limited to this, and as illustrated in FIG. It is good also as a structure affixed on an internal peripheral surface. In this case, the illumination unit 10 is disposed outside the mask unit MU, and the length of the mask M in the circumferential direction is set to be less than half of the circumferential length of the inner peripheral surface of the holding unit main body 22 and is illuminated with illumination light from the illumination unit 10. The configuration in which the light from the mask pattern is emitted from the side opposite to the incident position of the illumination light in the holding unit main body 22, and the direction in which the rotation axis AX1 extends in the reflecting mirror unit in which the light from the mask pattern is installed in the inner cylinder 21 It is possible to adopt a configuration in which the light is reflected and guided to the outside of the mask unit MU.

Moreover, in the said embodiment, although it was set as the structure which uses the seal | sticker part 70 and the suction part VC as a fixing | fixed part for fixing the mask M to the mask holding | maintenance part 20, it is not limited to this, For example, an adhesive agent The mask M may be fixed to the mask holding unit 20 using the above, or the mask M may be fixed to the mask holding unit 20 using a clamping unit that is clamped and fixed by a mechanical clamping mechanism.
Moreover, the structure which adsorb | sucks the mask M to the mask holding | maintenance part 20 by an electrostatic adsorption system (Coulomb force) may be sufficient.

  As described above, even when the mask M is attached to the inner peripheral surface of the holding unit main body 22, the substrate S is formed when an air layer is formed between the inner peripheral surface of the holding unit main body 22 and the mask M. Since the image quality of the pattern exposed to light is highly likely to deteriorate, the base material of the mask M (glass or the like) is formed between the inner peripheral surface of the holding portion main body 22 and the mask M in the same manner as in the previous embodiment. It is desirable to fill a liquid having a refractive index comparable to that of the transparent thin plate so as to form a layer having a predetermined thickness.

(Eighth embodiment)
The substrate processing apparatus according to the eighth embodiment of the present invention will be described below with reference to FIGS.
In the following description, the same components are denoted by the same reference numerals, and the description thereof may be simplified or omitted. Unless otherwise specified, the components and their descriptions are the same as those in the above embodiment.
FIG. 21 is a front sectional view of the main part of the substrate processing apparatus 300, and FIG. 22 is a sectional perspective view of the substrate processing apparatus.

The substrate processing apparatus 300 performs an exposure process on a strip-shaped substrate (for example, a strip-shaped film member) S with a flexible sheet-like mask M pattern, and includes an illumination unit 10 and a mask unit MU2. The substrate holding unit SU and the control unit CONT are mainly configured.
In the present embodiment, the vertical direction is defined as the Z direction, the direction parallel to the rotation axis of the mask unit MU2 and the substrate holding unit SU is defined as the Y direction, and the direction perpendicular to the Z direction and the Y direction is defined as the X direction.

  The illumination unit 10 irradiates illumination light toward an illumination region of the mask M wound around a mask holding unit 20 (described later) in the mask unit MU2, and is exposed in a straight tube type and radially like a fluorescent lamp. Of the inner cylinder 21 that supports the mask holding part 20 is used, such as one that emits illumination light for use, or one that introduces illumination light from both ends of a cylindrical quartz rod and is provided with a diffusion member on the back side. Contained in space.

  The mask unit MU <b> 2 includes a mask holding unit 20, a leaf spring (elastic member) 24, and a rolling element (support member) 25. The mask holding part 20 includes a cylindrical holding part main body (pattern holding member) 22 and holders (annular parts) 23 provided at both ends in the length direction of the holding part main body 22. The holding body 22, the holder 23, the leaf spring 24, and the rolling element 25 are provided in an integrated state, and are communicated in the direction of the rotation axis (predetermined axis) AX 1 and the inner cylinder 21 is inserted therethrough. Each of the through holes is formed.

  The inner cylinder 21 is formed of cylindrical quartz or the like that can transmit illumination light, or a cylindrical ceramic material or metal having a slit-shaped opening 21a through which illumination light from the illumination unit 10 passes. . The holding portion main body 22 has a mask holding surface 22a formed on the outer peripheral surface thereof for holding the mask M along a cylindrical surface having a predetermined radius. The holder 23 is formed of a metal material in an annular shape, and is bonded to the outer peripheral surface of the end portion of the holding portion main body 22 by an adhesive 23a that exhibits an elastic bonding performance after curing, as shown in FIG. As a material for forming the holder 23, a material having the same linear expansion coefficient as that of the holding unit main body 22 is preferable. However, when there is a difference in linear expansion coefficient, a difference in thermal expansion between the holding unit main body 22 and the holder 23 is caused. The holder 23 having a large linear expansion coefficient is configured to hold the holding unit body 22 from the outer peripheral side so that a large load is not applied to the holding unit body 22.

  The rolling element 25 is physically coupled (connected) to the holding portion main body 22 via a leaf spring 24 and spacers 24A and 24B (see FIGS. 23 and 24), and protrudes around the rotation axis AX1 on the outer peripheral side. And an impression cylinder installation portion 25 a that rolls on the outer peripheral surface of the impression cylinder 30. The outer diameter of the impression cylinder installation portion 25 a is formed to be a predetermined amount larger than the outer diameter formed by the outer surface of the mask M held on the mask holding surface 22 a of the holding portion main body 22. Specifically, the outer diameter of the impression cylinder installation part 25a is held by the impression cylinder 30 when the impression cylinder installation part 25a abuts the outer peripheral surface of the impression cylinder 30 and the holding part main body 22 is supported at a predetermined position. A predetermined amount of gap is formed between the formed substrate S and the mask M.

  Further, the rolling element 25 is supported on the inner peripheral side via the air bearing 26 so as to be rotatable in a non-contact manner around the rotation axis AX1 with respect to the inner cylinder 21. Therefore, the holding part main body 22, the holder 23, the leaf spring 24, and the rolling element 25 rotate integrally around the rotation axis AX1.

  The leaf spring 24 allows expansion and contraction of the rotation axis AX1 of the holding portion main body 22, and is formed in a ring shape (annular shape) of, for example, steel as shown in FIG. As shown in FIG. 23, the leaf spring 24 is fixed to the rolling element 25 via a spacer 24A with a predetermined amount of gap in the Y direction. Similarly, the leaf spring 24 is fixed to the holder 23 via a spacer 24B with a predetermined amount of gap in the Y direction. Three spacers 24A are provided at equal intervals around the rotation axis AX1 at positions where the distance from the rotation axis AX1 is substantially the same. Three spacers 24B are provided at equal intervals so that the distance from the rotation axis AX1 is larger than the spacer 24A and the positions around the rotation axis AX1 are between the spacers 24A.

  These leaf springs 24 and spacers 24A and 24B serve as transmitting portions by transmitting rotational driving force between the connected holder 23, holding portion main body 22 and rolling elements 25, thereby allowing the leaf springs 24 and spacers 24A and 24B to be transmitted. The holder 23, the holding part main body 22 and the rolling element 25 that are connected to each other are integrally rotated in the direction around the rotation axis AX1, and the leaf spring 24 is elastically deformed as an expansion / contraction permission part in the direction of the rotation axis AX1. Thus, the holder 23, the holding unit main body 22, and the rolling element 25 can be relatively moved slightly.

The ring-shaped leaf spring 24 shown in FIG. 24 is configured in detail as shown in FIG. 25, and on one surface of the leaf spring 24, three spacers 24A are arranged about the rotation axis AX1. The spacer 24B is fixed at an arrangement of 120 degrees, and on the other surface of the leaf spring 24, three spacers 24B are arranged at about 120 degrees about the rotation axis AX1, and ± 60 degrees with respect to the spacer 24A on the front side. Fixed in placement. The spacers 24A and 24B have the same thickness, and the circumferential dimension is set as small as possible.
The three spacers 24A fasten the end surface of the ring-shaped rolling element 25 and the leaf spring 24 with screws, and the three spacers 24B fasten the end surface of the ring-shaped holder 23 and the leaf spring 24 with screws.

In this embodiment, the expansion / contraction allowance portion is configured with such a structure. In addition, as shown in FIG. 26, elastic deformation is caused in the Y direction (direction in which the axis AX1 extends) and the radial direction R of the ring-shaped holder 23. A metallic flexure structure FLX having extremely high rigidity is prepared in the tangential direction T of the holder 23, and the holder 23 and the rolling element 25 are provided at three locations (the rotation axis AX1 is defined by the flexure structure FLX). It may be fastened at 120 degrees as the center.
The flexure structure FLX as shown in FIG. 26 has extremely low rigidity in the radial direction R by one, but when arranged at three positions at 120 degrees around the axis AX1 at the same distance from the axis AX1, Degrees of freedom of deformation in the radial direction R of the body FLX are mutually constrained, and the holder 23 and the rolling element 25 are fastened with high rigidity in the XZ in-plane direction orthogonal to the rotational axis AX1, and the Y direction in which the rotational axis AX1 extends It is fastened to be elastically displaceable.

  The inner cylinder 21 is mounted via a leaf spring 28 on a support base 27 extending in a direction approaching each other from a base portion B provided at an interval in the Y direction. The spring constant of the leaf spring 28 is the load applied to the impression body 30 via the weight of the mask holding part 20 and the rolling element 25, that is, the impression cylinder installation part 25 a of the rolling element 25 rolls on the outer peripheral surface of the impression cylinder 30. It is set according to the friction force. The above-described illumination unit 10 is disposed in the internal space of the inner cylinder 21, and an opening 21a through which illumination light passes is formed at a position facing the illumination unit 10 in the illumination light emission direction (FIG. 21). And FIG. 22).

The substrate holding unit SU includes an impression body (rotating drum) 30.
The impression body 30 is formed in a columnar shape that is parallel to the Y axis and rotates around a rotation axis (second axis) AX2 set on the −Z side of the rotation axis AX1, as shown in FIG. A hollow portion 30a is provided inside and is set so as to reduce the moment of inertia. The outer peripheral surface of the impression body 30 is a substrate holding surface 31 that holds the substrate S in contact therewith. On both end faces in the Y direction of the impression body 30, a rotation support portion 32 having a smaller diameter than the impression cylinder 30 and protruding coaxially is supported by the base portion B so as to be rotatable around the rotation axis AX <b> 2. In the present embodiment, a driving device 33 that rotates the impression body 30 and the mask holding unit 20 synchronously by rotating the impression body 30 is provided.

Next, the operation of the substrate processing apparatus 300 having the above configuration will be described.
The mask holding portion 20 that is supported by the inner cylinder 21 via the air bearing 26 and holds the mask M is the difference between the weight of the mask holding portion 20 and the biasing force toward + Z according to the spring constant of the leaf spring 28. The pressure drum installation portion 25a of the rolling element 25 is in contact with the pressure drum body 30 in a state where the above load is applied. Thus, a predetermined amount of gap is formed between the mask holding surface 22a and the substrate holding surface 31, that is, between the mask M and the substrate S, according to the outer diameter of the impression cylinder installation portion 25a. In addition, when adjusting the load which the impression cylinder installation part 25a gives to the impression cylinder 30, it replaces | exchanges with the leaf | plate spring 28 which has a corresponding spring constant, or it is previously spacer between the inner cylinder 21 and the support stand 27. The leaf spring 28 may be installed in a state where the pressure cylinder is interposed, and the platen 28 may be replaced with a spacer according to the load applied to the impression body 30 by the impression cylinder installation portion 25a.

  Then, the impression body 30 is rotated about the rotation axis AX1 by driving of the driving device 33, and the illumination light is irradiated from the illumination unit 10, transmitted through the holding unit main body 22 through the opening 21a, and masked from the inner peripheral side. Illuminate M. As the impression body 30 rotates, the substrate S wound around and held on the substrate holding surface 31 of the impression body 30 is transported, and the rolling element 25 abuts on the outer peripheral surface of the impression body 30 in the impression cylinder installation portion 25a. , The rotational driving force is transmitted to the holder 23 and the holding portion main body 22 via the leaf spring 24 and the spacers 24A and 24B, and the pattern of the mask M held on the holding portion main body 22 is changed from the substrate S to a predetermined amount. Move in a synchronized manner while maintaining a constant gap. Then, the pattern image of the mask M illuminated by the illumination light is sequentially projected onto the projection area of the substrate S.

  At this time, the mask holder 20 and the impression body 30 have the same peripheral speed at the position (diameter) where the impression cylinder installation part 25a and the substrate holding surface 31 come into contact with each other. Are the same as the position (diameter) of the outer peripheral surface of the mask M and the position (diameter) of the outer peripheral surface of the substrate S on the thicknesses of the mask M and the substrate S and the mask holding surface 22a of the holding body 22. The diameter is adjusted in accordance with the ratio of the diameter of the impression body 30 to the substrate holding surface 31. For example, the mask M and the substrate S have the same thickness, the diameter of the mask holding surface 22a and the diameter of the impression body 30 on the substrate holding surface 31 are the same, and the holder main body 22 and the impression body 30 rotate at the same angular velocity. In this case, the distance between the position where the impression cylinder installation part 25a and the substrate holding surface 31 abut to the position of the outer peripheral surface of the mask M, and the position where the impression cylinder installation part 25a and the substrate holding surface 31 abut on the substrate S. The distance to the position of the outer peripheral surface may be the same. In other cases, the pressure drum installation is performed for each of the holding body 22 and the pressure drum 30 so that the peripheral speed of the outer peripheral surface of the mask M and the peripheral speed of the outer peripheral surface of the substrate S are the same. It is preferable to set the diameter of the contact position between the portion 25a and the substrate holding surface 31.

  Therefore, an example in which the peripheral speed of the outer peripheral surface of the mask M and the peripheral speed of the outer peripheral surface of the substrate S are made the same will be described with reference to FIG. FIG. 27 is a modification of the diameter adjusting method using shims described in FIG. 11, and the same members as those in FIG. 23 are denoted by the same reference numerals. As shown in FIG. 27, the deformed portion is formed by winding an annular shim (predetermined thickness metallic belt) 31B around a portion of the substrate holding surface 31 that is in contact with the impression cylinder installation portion 25a. The gap G between the mask M and the substrate S indicates the contact position between the outer peripheral surface of the impression cylinder installation portion 25a and the outer peripheral surface of the shim (predetermined thickness metal belt) 31B. Is set at a position Cx approximately in the middle.

The position Cx is a position set to r11 + Mt + G / 2 as a radius from the rotation axis AX1 of the mask M, and is also a position set to r2 + St + G / 2 as a radius from the rotation axis AX2 of the impression body 30.
The shim 31B having a thickness that satisfies such conditions is selected (prepared) and wound around the outer peripheral surface of the substrate holding surface 31. If the thickness may be constant, the shim 31B What is necessary is just to process the diameter of the part contact | abutted with the impression cylinder installation part 25a into r2 + St + G / 2. In addition, when the shim 31B can be wound in a replaceable manner, the shim 31B can be attached to the optimum thickness according to a change in the thickness St of the substrate S or the dimension of the gap G.

  When the above exposure process is continuously performed, thermal expansion occurs in the holding unit main body 22 illuminated by the illumination light. Regarding the thermal expansion in the radial direction of the holding unit main body 22, the holder 23 that holds the holding unit main body 22 from the outer peripheral side is formed of a metal material, and the linear expansion coefficient is larger than the linear expansion coefficient of the holding unit main body 22, so Since it is allowed and does not restrain holding part main part 22, it can avoid applying a big load to holding part main part 22. Further, at this time, the holding portion main body 22 and the holder 23 are thermally expanded in a direction away from each other. However, since the adhesive 23a has elastic bonding performance, the holding of the holding portion main body 22 by the holder 23 is loosened. This is also prevented.

  In addition, when the linear expansion coefficient of the holder 23 is smaller than the linear expansion coefficient of the holding part main body 22, it is preferable to select a configuration in which the holder 23 holds the holding part main body 22 from the inner peripheral side. Even if it is the structure hold | maintained, the load added to the holding | maintenance part main body 22 at the time of thermal expansion is relieve | moderated because the said adhesive agent 23a elastically deforms.

  Further, when the holding portion main body 22 is thermally expanded in the direction of the rotation axis AX1, the location where the leaf spring 24 is fixed by the spacer 24A is the starting point, and the location where the spacer 24B is fixed faces the rolling element 25. It is elastically deformed. As described above, since the thermal expansion of the holding portion main body 22 is allowed by the elastic deformation of the leaf spring 24, it is possible to avoid applying a large load on the holding portion main body 22 in the direction of the rotation axis AX1.

  As described above, in the present embodiment, the adhesive 23a having elastic adhesive performance is interposed between the holding portion main body 22 and the holder 23 in the radial direction, and the leaf spring 24 is elastic in the direction of the rotation axis AX1. By deforming, thermal expansion caused by temperature change is allowed. Therefore, in the present embodiment, the load applied to the holding unit main body 22 due to thermal expansion is relieved, so that the applied load causes distortion or the like in the holding unit main body 22 and adversely affects pattern formation on the substrate S. This can be suppressed.

  In the device manufacturing system SYS shown in FIG. 19, since the substrate processing apparatus 300 described above can be used as the processing apparatus U3, adverse effects on the pattern formation on the substrate S due to temperature change can be reduced, so that the pattern can be formed with high accuracy. The formed device can be manufactured.

  As described above, the preferred embodiments according to the present invention have been described with reference to the accompanying drawings, but the present invention is not limited to the examples. Various shapes, combinations, and the like of the constituent members shown in the above-described examples are examples, and various modifications can be made based on design requirements and the like without departing from the gist of the present invention.

For example, in the above-described embodiment, the mask M of the sheet material having a pattern is held on the outer peripheral surface of the holding unit main body 22, but is not limited thereto, and the holding unit main body 22 (transparent cylindrical material) The structure which forms a mask pattern directly in an outer peripheral surface may be sufficient.
Further, the mask M may be held not on the outer peripheral surface of the holding unit main body 22 but on the inner peripheral surface of the holding unit main body 22. Furthermore, the structure which makes the holding | maintenance part main body 22 cylindrical instead of cylindrical shape, and the illumination part 10 irradiates illumination light with respect to the mask M hold | maintained on the outer peripheral surface from the outer peripheral side may be sufficient.

Moreover, in the said embodiment, although it was set as the structure by which the holding | maintenance part main body 22 (mask M) rotates because the rolling element 25 and the impression body 30 rotate (rotate by frictional contact), it is not limited to this. The present invention can also be applied to a configuration in which the holding body 22 (mask M) rotates independently by a driving device such as a motor.
In that case, the impression cylinder setting portion 25a of the rolling element 25 is omitted, and the rolling elements 25 on both sides are rotatably supported by an inner cylinder 21 installed in the main body of the exposure apparatus via an air bearing 26 and a motor. Combined with the rotor and the like. The rotational driving force of the motor is transmitted to the holding portion main body 22 (mask M) via the rolling elements 25, the leaf springs 24, and the holder 23.
Even in such a configuration, in the direction of the rotation axis AX1, the plate spring 24 is elastically deformed to allow thermal expansion of the holding unit main body 22 (mask M) caused by temperature change, and the holding unit main body. Generation | occurrence | production of an unnecessary stress in 22 is relieved and it can suppress that a distortion etc. arise in the holding | maintenance part main body 22. FIG.

  DESCRIPTION OF SYMBOLS 20 ... Mask holding | maintenance part, 22a ... Mask holding | maintenance surface (outer peripheral surface, peripheral surface), 24 ... Leaf spring (expansion-absorption absorption part, elastic member), 25 ... Rolling element (gap formation part, support member), 25a ... Impression cylinder installation , 30... Impression body (substrate holding unit, rotation holding unit, rotating drum) 31. Substrate holding surface 40. Measuring unit 41. Displacement unit 48. Shift stage (second adjusting unit) 50. Measuring unit (Detection part), 53A, 53B ... air cylinder (biasing part), 55 ... groove part, 56 ... telescopic part, 62 ... adjustment screw part (load applying part), 81 ... belt part (endless belt), 81a ... support Surface (substrate holding surface), 82e ... drive unit (circulation drive unit), 83 ... guide stage (fluid support unit), 85 ... mask drive roller (rotating unit), 88 ... lifting device (moving unit), 100 ... substrate processing Device, AX1 ... Rotating shaft (Predetermined axis), M ... mask, MT ... drive device (first adjusting unit), S ... substrate, SM1, SM2 ... shim (correction unit), 70 ... seal part (fixing part), 71, 72 ... engagement , 200 ... substrate processing apparatus, FM ... index mark (index part), MM ... mask mark, MU ... mask unit, VC ... suction part (fixing part), 22 ... holding part body (pattern holding member), 23 ... holder (Annular part), 23a ... adhesive (second expansion / contraction allowance), 300 ... substrate processing apparatus, AX2 ... rotation axis (second axis), MU2 ... mask unit, SU ... substrate holding unit

Claims (11)

A cylindrical or columnar mask unit mounted on the exposure apparatus and capable of rotating around the first axis by receiving a rotational driving force,
Which has a constant radius from said first axis, a cylindrical or columnar pattern holding member for holding the mask pattern along the circumferential surface having a predetermined dimension in the direction of the first axis,
A support member physically coupled to the pattern holding member and supporting the pattern holding member at a predetermined position of an exposure apparatus;
Expansion / contraction allowance for connecting the pattern holding member and the support member so that expansion and contraction in the direction of the first axis of the pattern holding member is permitted in physical coupling between the support member and the pattern holding member. And
A mask unit comprising: The mask unit according to claim 1,
The support member includes a transmission unit that transmits the rotational driving force to the pattern holding member via the expansion / contraction permission unit,
The expansion / contraction allowance portion includes an elastic member that is elastically deformable with high rigidity in the direction of the rotational driving force and low rigidity in the direction of the first axis.
Mask unit. The mask unit according to claim 1 or 2, wherein
The expansion / contraction permission portion includes an annular portion that supports a peripheral surface of the pattern holding member,
Between the annular portion and the peripheral surface of the pattern holding member, a second expansion / contraction permission portion that allows expansion and contraction in the radial direction of the pattern holding member is provided.
Mask unit. The mask unit according to claim 3,
The second expansion / contraction allowance portion includes an adhesive loaded at a predetermined thickness between the annular portion and the peripheral surface of the pattern holding member.
Mask unit. The mask unit according to claim 3 or 4, wherein:
The pattern holding member has an outer peripheral surface with a predetermined radius and an inner peripheral surface with a predetermined radius, and is made of a cylindrical light-transmitting material whose dimension in the direction of the first axis is a predetermined length. As the peripheral surface on which the annular portion of the portion holds the pattern holding member, one of the outer peripheral surface and the inner peripheral surface of the pattern holding member is the linear expansion coefficient of the annular portion, and the pattern holding member Selected based on the difference from the linear expansion coefficient of
Mask unit. It is a mask unit as described in any one of Claims 1-5,
The pattern holding member holds the sheet material on which the mask pattern is formed along the peripheral surface.
Mask unit. The mask unit according to any one of claims 1 to 6,
A substrate holding unit for holding a substrate onto which the mask pattern of the mask unit is transferred;
An exposure apparatus comprising: The exposure apparatus according to claim 7, wherein
The substrate holding unit has a rotating drum that supports the substrate on an outer peripheral surface having a constant radius from a second axis substantially parallel to the first axis of the mask unit, and is rotatable around the second axis. Including
Moving the substrate in a direction substantially perpendicular to the second axis by rotation of the rotating drum;
Exposure device. An exposure apparatus according to claim 8, wherein
The mask pattern held by the pattern holding member of the mask unit is a transmissive mask pattern that can transmit illumination light for exposure,
An illumination unit that is disposed in an internal space of the pattern holding member and irradiates the mask pattern with illumination light from an inner peripheral side through a slit-like opening elongated in the direction of the first axis;
A fixed rod that extends from one end side in the direction of the first axis of the mask unit and supports the illumination unit;
Exposure device. An exposure apparatus according to claim 9, wherein
A temperature adjusting device for circulating a temperature adjusting medium for suppressing a temperature rise of the illumination unit through the fixed rod ;
Exposure device. The exposure apparatus according to claim 9 or 10,
A measurement unit that is supported by the fixed rod and that measures a gap amount between the holding surface of the mask pattern of the pattern holding member of the mask unit and the holding surface of the substrate of the rotating drum ;
Exposure device.

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