TWI718730B - Exposure apparatus - Google Patents

Abstract

A substrate processing apparatus that forms a pattern of a mask held along a cylindrical surface on a photoresponse layer formed on a front surface of a substrate includes: a mask holding portion that includes a mask holding surface, which holds the mask along the cylindrical surface, and is rotatable around a predetermined axis; a revolving holding portion that includes a substrate holding surface, which comes in contact with and holds the substrate, and is revolvable around an axis substantially parallel to the predetermined axis; and a gap forming portion that forms a gap having a predetermined size between the mask holding surface and the substrate holding surface.

Description

Exposure device

The present invention relates to a photomask unit, a substrate processing device, a manufacturing method of the photomask unit, and a substrate processing method.

This application is based on Japanese Patent Application No. 2012-059070 filed on March 15, 2012, Japanese Patent Application No. 2012-084820 filed on April 03, 2012, and Japanese Patent Application 2012 filed on April 05, 2012 No. -086539 claims priority and quotes its content in this article.

In large-screen display elements such as liquid crystal display elements, a transparent electrode such as ITO (Indium Tin Oxides) or a semiconductor material such as Si is deposited on a flat glass substrate, and a metal material is deposited and a photoresist is applied. The circuit pattern is transferred, and the photoresist is developed after the transfer, and then etched, thereby forming a circuit pattern and the like. However, as the display element becomes larger and the glass substrate becomes larger, it becomes difficult to transport the substrate. Therefore, it is proposed to form display elements on flexible substrates (for example, film members such as polyimide, PET, metal foil, etc.) called a roll to roll method (hereinafter referred to as abbreviated as “roll to roll”). "Roll method") technology (for example, refer to Patent Document 1).

In addition, Patent Document 2 proposes a technique of arranging a flexible long sheet (substrate) that is wound on a conveying roller and travels close to the outer periphery of a rotatable cylindrical mask. , So as to continuously expose the pattern of the mask on the substrate.

[Prior Technical Literature]

[Patent Literature]

[Patent Document 1] International Publication No. 2008/129819

[Patent Document 2] Japanese Unexamined Publication No. 60-019037

In order to expose the pattern of the mask on the substrate with high accuracy, the distance between the mask and the substrate must be set to an appropriate value. However, when the distance deviates from the appropriate value, the predetermined pattern line width may not be obtained.

The object of the aspect of the present invention is to provide a substrate processing device capable of exposing the pattern of the photomask on the substrate with high precision.

In addition, when the photomask is cylindrical, it may be difficult to directly form a precise pattern on the peripheral surface of the cylindrical base material, which is a cause of increase in cost. Especially when a pattern is formed on the inner peripheral surface of a cylindrical mask, there is a concern that the cost will increase significantly and the accuracy of the pattern will decrease.

The object of the aspect of the present invention is also to provide a photomask unit, a substrate processing apparatus, a photomask unit manufacturing method, and a substrate processing method that can suppress the increase in cost and contribute to the improvement of pattern accuracy.

In addition, when the linear expansion coefficients of the holding member holding the mask pattern and the supporting member supporting the holding member at a predetermined position with respect to the substrate are different, the holding member will be applied to the holding member due to thermal expansion and contraction caused by the temperature change. Stress may cause adverse effects when a relatively weak material such as glass is used to form the holding member. In addition, when stress is applied to the holding member, it may also affect the mask pattern and also affect the accuracy of transfer to the substrate.

The object of the aspect of the present invention is also to provide a In the case, the photomask unit and the substrate processing apparatus that apply stress to the holding member holding the photomask pattern can also be suppressed.

A substrate processing apparatus of one aspect of the present invention is a photo-sensitive layer formed by forming a pattern of a photomask held along a cylindrical surface on the surface of a substrate; The reticle holding surface of the face holding reticle can be rotated around a predetermined axis; the surrounding holding portion is provided with a substrate holding surface contacting and holding the substrate and can be circumscribed around an axis substantially parallel to the predetermined axis; and a spacing forming portion, It forms a predetermined distance between the mask holding surface and the substrate holding surface.

A photomask unit according to one aspect of the present invention is provided with a photomask holding portion which uses a photomask formed of a glass material as a holding object, and holds the photomask on the peripheral surface along the cylindrical surface, and can be wound around a predetermined The axis rotates and is formed of glass material.

A substrate processing apparatus of one aspect of the present invention includes the photomask unit of the above aspect, and a substrate holding portion that retains a substrate forming a pattern of the photomask.

A method of manufacturing a photomask unit of one aspect of the present invention includes the following steps: a photomask holding portion formed of a glass material that has a peripheral surface along a cylindrical surface, can rotate around a predetermined axis, and is made of the glass material The formed mask is held on the peripheral surface.

A substrate processing method of one aspect of the present invention includes the steps of forming a pattern of the photomask on the substrate using the photomask unit manufactured by the photomask unit manufacturing method of the above aspect.

The photomask unit of one aspect of the present invention is a cylindrical or cylindrical one that is installed in a predetermined processing device and can be rotated around a predetermined axis by a rotational driving force; and has: a cylindrical or cylindrical pattern A holding member that holds the photomask pattern along a peripheral surface having a fixed radius from the axis and a predetermined size in the direction of the axis; a supporting member that is physically combined with the pattern holding member and supports the pattern holding member to the processing device The predetermined position; and the expansion and contraction allowable part, which in the physical combination of the supporting member and the pattern holding member, allows the expansion and contraction of the pattern holding member in the axial direction Connect the pattern holding member and the supporting member.

A substrate processing apparatus of one aspect of the present invention includes the photomask unit of the above aspect, and a substrate holding unit for holding a substrate on which the photomask pattern is transferred.

In the substrate processing method of one aspect of the present invention, the cylindrical mask is approached to the surface of the substrate conveyed along the longitudinal direction for scanning exposure, and the cylindrical mask is fixed along a predetermined center line. The outer peripheral surface of the radius is provided with a pattern for electronic components and is rotatable; and the above-mentioned substrate processing method includes the following steps: the above-mentioned substrate is kept in contact with a surrounding driving part surrounded by an axis arranged in parallel with the above-mentioned predetermined centerline A moving substrate holding portion that conveys the substrate along the longitudinal direction; and a ring-shaped setting portion that is set on both ends of the cylindrical mask with a predetermined radius from the center line in the direction of the center line The surface of the substrate and the outer peripheral surface of the cylindrical mask are set in contact with the surrounding driving part or a part of the substrate holding part, whereby the cylindrical mask is rotated around the center line while setting the surface of the substrate and the outer peripheral surface of the cylindrical mask at a predetermined close distance.

According to the aspect of the present invention, the pattern of the mask can be exposed to the substrate with high precision.

In addition, according to the aspect of the present invention, it is possible to use a cylindrical mask pattern on the substrate to achieve high-precision transfer exposure without causing cost increase.

Furthermore, according to the aspect of the present invention, even when there is a temperature fluctuation, it is possible to suppress the application of stress to the holding member holding the photomask pattern, so that high-precision processing using the photomask pattern can be performed.

10: Lighting Department

11: Substrate supply department

12: Substrate Recycling Department

20: Mask holding part

21: inner cylinder

21a: opening

22: Holder body (pattern holding member)

22a: Mask holding surface (outer peripheral surface, peripheral surface)

23, 23A, 23B: retainer (ring part)

23a: Adhesive (2nd expansion and contraction allowable part)

23b: Outer peripheral surface of retainer

23c, 55: Groove

24, 28: Leaf spring (expandable absorption part, elastic member)

24A, 24B: spacer

25: Rotating body (pitch forming part, support member)

25a: Impression cylinder setting part

25b: inclined plane

26, 35, 42: Air bearing

27: Support table

30.DR5: Impression cylinder body (substrate holding part, surrounding holding part, rotating cylinder)

30a: Hollow part

31: substrate holding surface

32: Rotating support part

33: Drive

34, 86: Rotation axis

36: terminal tube

37: fixed rod

39A: Supply Department

39B: Discharge part

40: Measurement Department

41: shift part

43, 46: rail

44, 47: drive unit

48: Displacement platform (Second adjustment part)

50: Measurement Department (Detection Department)

51A, 51B: supporting member

52A, 52B: Guiding part

53A, 53B: Air Cylinder (Energy Department)

54: support wall

56: Pad part

61: shift ring

61a: The slope of the shift ring

62: Adjusting screw part (load applying part)

62a: Shaft

62b: head

70: Sealing part (fixed part)

71, 72: Department of the Department

80: substrate support mechanism

81: Belt part (loop belt)

81a: Support surface (substrate holding surface)

81b: back

82: With conveying department

82a, 82b: Conveying roller

82e: Drive section (surround drive section)

83: Guidance platform (fluid support part)

83a: guide surface

84: Rotation mechanism

85: Mask drive roller (rotating part)

87: Bearing

88: Lifting device (moving part)

89: Guidance Platform Supply Department

90: Board transfer department

100, 200, 300: substrate processing equipment

AX1: Rotation axis (established axis)

AX2: Rotation axis (2nd axis)

AX3: axis

M: Mask

MT: drive unit (first adjustment part)

Ma: Mask separation area

S, P: substrate

SM1, SM2, 31B: shims (correction part)

B: Base part

R: Guide roller

FM: Indicator Mark (Indicator Department)

MM: Mask mark

MU, MU2: mask unit

VC: suction part (fixed part)

SU: substrate holding unit

CONT: Control Department

CONT2: Upper control device

AL1, AL2, AM1, AM2: Align the microscope

X, Y, Z, θY: direction

DX: The distance between the axis of rotation AX1 and the axis of rotation AX2

Cx: roughly the middle of the gap

r1: The radius of the impression cylinder setting part

r2: The radius of the substrate holding surface

r11: The radius of the mask holding surface

G: Spacing

Mt: The thickness of the mask

St: The thickness of the substrate

Ta: contact range

t1: thickness of SM1

t2: thickness of SM2

tf: the contact surface of the shims SM1 and SM2

FLX: Flexural structure

T: Tangent direction

SYS: Component Manufacturing System

U1, U2, U3, U4, U5...Un: Processing device

FR1: Supply roller

FR2: Recovery roller

DR1, DR3, DR4, DR6, DR7, DR8: drive roller

DR2: Impression roller

EPC, EPC1, EPC2: Edge position controller

Gp1: Coating mechanism

Gp2: Drying mechanism

HA1: Heating chamber

HA2: Cooling chamber part

DL: relaxation (clearance)

IU: lighting agency

BT1, BT2, BT3: processing tank

Fig. 1 is a front sectional view of the main part of the substrate processing apparatus of the first embodiment.

Fig. 2 is a cross-sectional perspective view of the substrate processing apparatus.

Fig. 3 is a detailed view of the main part of the end of the mask holder.

Fig. 4 is a perspective view showing the leaf spring provided in the mask holding portion.

Fig. 5 is an enlarged cross-sectional view of the mask holding portion of the second embodiment.

Fig. 6 is a schematic cross-sectional view of the substrate processing apparatus of the second embodiment.

Fig. 7 is a perspective view of the appearance of the substrate processing apparatus of the third embodiment.

Fig. 8 is a partial enlarged view of the substrate processing apparatus.

Fig. 9 is a front sectional view of the main part of the substrate processing apparatus of the fourth embodiment.

Fig. 10A shows a partial enlarged view of the end of the shim.

Fig. 10B shows a partial enlarged view of the end of the shim.

Fig. 10C shows a partial enlarged view of the end of the shim.

Fig. 11 is a partial enlarged view of the abutment portion between the rotating body and the impression cylinder body.

Fig. 12 is a front sectional view of the main part of the substrate processing apparatus of the fifth embodiment.

Fig. 13 is a schematic configuration diagram of a substrate processing apparatus according to a sixth embodiment.

Fig. 14 is a front sectional view of the main part of the substrate processing apparatus.

Fig. 15 is a schematic configuration diagram of a modification of the substrate processing apparatus.

Fig. 16 is a front sectional view of the main part of the substrate processing apparatus of the seventh embodiment.

Figure 17 is a front view of the mask unit constituting the substrate processing apparatus

Figure 18 is a partial enlarged view of the end of the mask unit.

Fig. 19 is a diagram showing the structure of a component manufacturing system.

Fig. 20 is a front sectional view of a main part of a modification of the substrate processing apparatus.

Fig. 21 is a front sectional view of the main part of the substrate processing apparatus of the eighth embodiment.

Fig. 22 is a cross-sectional perspective view of the substrate processing apparatus.

Figure 23 is a detailed view of the main part of the end of the mask unit.

Fig. 24 is a perspective view showing the leaf spring provided in the mask unit.

Figure 25 is a diagram showing the details of the leaf spring.

Fig. 26 is a diagram showing a modification of the expansion and contraction allowable portion.

FIG. 27 is a diagram showing an example of making the peripheral speed of the outer peripheral surface of the mask and the peripheral speed of the outer peripheral surface of the substrate the same speed.

(First Embodiment)

Hereinafter, with reference to FIGS. 1 to 4, the first embodiment of the substrate processing apparatus of the present invention will be described.

FIG. 1 is a front cross-sectional view of the main part of the substrate processing apparatus 100, and FIG. 2 is a cross-sectional perspective view of the substrate processing apparatus.

The substrate processing apparatus 100 exposes the pattern of a flexible sheet-shaped mask M to a strip-shaped substrate (for example, a strip-shaped film member) S, and uses an illuminating part 10 and a mask holding part 20. The impression cylinder body (the substrate holding portion, the surrounding holding portion) 30 and the control portion CONT are constituted as a main body. Furthermore, in this embodiment, the vertical direction is the Z direction, the direction parallel to the rotation axis of the mask holding portion 20 and the substrate holding portion 30 is the Y direction, and the Z direction and the Y direction are orthogonal The direction is set as the X direction for description.

The illuminating part 10 irradiates the illuminating light toward the illuminating area of the mask M wound on the mask holding part 20, and it is possible to use a straight tube type and radially emitting illuminating light for exposure like a fluorescent lamp, Or, the illuminating light is introduced from both ends of the cylindrical quartz rod and the diffuser is provided on the back side, and it is accommodated in the inner space of the inner tube 21 supporting the mask holder 20.

The mask holder 20 includes a cylindrical holder body 22, holders 23 respectively provided at both ends of the holder body 22 in the longitudinal direction, and are attached to each holder through a leaf spring (expansion and contraction absorption portion) 24 23 on the rotating body (spacing forming part) 25. The holder body 22, the holder 23, the leaf spring 24, and the rotating body 25 are arranged in an integrated state, and are formed on the rotation axis AX1. The direction communicates with the through hole through which the inner tube 21 is inserted.

The inner tube 21 is formed of cylindrical quartz or the like through which the illumination light can pass, or a cylindrical ceramic material or metal having a slit-like opening 21a through which the illumination light from the illumination unit 10 passes. The holder main body 22 is formed with a mask holding surface 22a that holds the mask M along a cylindrical surface of a predetermined radius on its outer peripheral surface. The holder 23 is formed of a metal material in an annular shape. As shown in FIG. 3, the adhesive 23 a that exhibits elastic bonding performance after curing is bonded to the outer peripheral surface of the end portion of the holder body 22. The material of the holder 23 is preferably one having the same coefficient of linear expansion as that of the holder body 22, but when there is a difference in the coefficient of linear expansion, the holder 23 with a larger coefficient of linear expansion is held from the outer peripheral side The holding portion main body 22 is constructed so as not to apply a large load to the holding portion main body 22 due to the difference in thermal expansion between the holding portion main body 22 and the holder 23.

The rotating body 25 has an impression cylinder installation portion 25a protruding around the axis of rotation AX1 on the outer peripheral side, and the impression cylinder installation portion 25a is brought into contact with the outer peripheral surface of the impression cylinder body 30 (friction coupling), thereby rotating the body 25 rotates around axis AX1.

The outer diameter of the impression cylinder installation portion 25a is formed to be larger than the outer diameter formed by the surface of the mask M held on the mask holding surface 22a of the holding portion main body 22 by a predetermined amount. Specifically, the outer diameter of the impression cylinder installation portion 25a is formed to a value that is held by the impression cylinder body 30 when the impression cylinder installation portion 25a abuts against the outer peripheral surface of the impression cylinder body 30 A predetermined distance G is formed between the upper substrate S and the mask M as shown in FIG. 3.

In addition, the rotating body 25 is rotatably supported with respect to the inner cylinder 21 about the rotation axis AX1 in a non-contact manner through an air bearing 26 on the inner peripheral side. Therefore, the holder main body 22, the holder 23, the leaf spring 24, and the rotating body 25 integrally rotate about the rotation axis AX1.

The leaf spring 24 absorbs the expansion and contraction of the rotation axis AX1 of the holding part main body 22, and as shown in FIG. As shown in FIG. 3, the leaf spring 24 is fixed to the rotating body 25 by leaving a predetermined amount of gap in the Y direction through a spacer 24A. Similarly, board bullets The spring 24 is fixed to the holder 23 by leaving a predetermined amount of gap in the Y direction through the spacer 24B. The spacers 24A are located at approximately the same distance from the rotation axis AX1, and three spacers 24A are arranged at equal intervals around the rotation axis AX1. The spacer 24B is located at a position where the distance from the rotation axis AX1 is greater than that of the spacer 24A, and three spacers 24B are arranged at equal intervals so that the position around the rotation axis AX1 is between the spacers 24A.

Therefore, the holder 23 (holding portion main body 22) and the rotating body 25 connected through the leaf spring 24 have a structure that is coupled with high rigidity in the direction around the rotation axis AX1 to rotate integrally in the direction of the rotation axis AX1, Since the leaf spring 24 is easily elastically deformed, it becomes a combination of lower rigidity and is relatively movable (micromotion).

The inner cylinder 21 is placed on a support base 27 extending in the direction of approaching each other from the base portion B provided with a gap in the Y direction through the leaf spring 28. The spring constant of the plate spring 28 is based on the weight of the mask holding portion 20 and the load applied to the impression cylinder body 30 through the rotating body 25, that is, the impression cylinder setting portion 25a of the rotating body 25 is on the outer peripheral surface of the impression cylinder body 30. It is set by the friction force at the time of upward rotation. The above-mentioned illuminating part 10 is arranged in the inner space of the inner tube 21, and a slit-like opening 21a elongated in the Y direction is formed at a position opposite to the illuminating light emission direction of the illuminating part 10 to allow the illuminating light to pass through (Refer to Figure 1 and Figure 2).

The impression cylinder body 30 is formed in a cylindrical shape that is rotated (surrounded) around a rotation axis AX2 parallel to the Y axis and set on the -Z side of the rotation axis AX1, as shown in FIG. Set the way to reduce the moment of inertia. The outer peripheral surface of the impression cylinder body 30 is a substrate holding surface 31 that contacts and holds the substrate S. The holding surface 31 is preferably a mirror-polished metal surface, but in order to increase the friction with the substrate S and suppress sliding, it can also be formed by covering the entire circumference with a thin rubber sheet, resin sheet, etc., having a uniform thickness. By.

On both end surfaces of the impression cylinder body 30 in the Y direction, a rotation support portion 32 having a diameter smaller than that of the impression cylinder body 30 and coaxially protruding is rotatably supported by the base portion B around the rotation axis AX2. In addition, in this embodiment, the impression cylinder body 30 and the mask holder 20 are synchronized by rotating the impression cylinder body 30. Ground rotation drive 33.

The substrate S is formed in a flexible manner. Here, the so-called flexibility refers to the property of allowing the substrate to bend without breaking or breaking even if a force of the degree of its own weight is applied to the substrate. In addition, the property of bending by the force of its own weight is also included in flexibility. In addition, the above-mentioned flexibility varies according to the material, size, thickness, or environment such as temperature or humidity of the substrate. In addition, as the substrate S, one strip-shaped substrate may be used, or a plurality of unit substrates may be connected to form a strip-shaped structure.

As the substrate S, for example, a resin film or foil such as stainless steel can be used. For example, the resin film may use polyethylene resin, polypropylene resin, polyester resin, ethylene ethylene copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, poly Styrene resin, vinyl acetate resin and other materials. The substrate S preferably has a smaller thermal expansion coefficient to ensure that the size will not change even if it receives heat at about 200°C. For example, an inorganic filler can be mixed in the resin film to reduce the thermal expansion coefficient. Examples of inorganic fillers include titanium oxide, zinc oxide, aluminum oxide, and silicon oxide. The size of the width direction (short side direction) of the substrate S is formed to be, for example, about 1 m to 2 m, and the size of the length direction (long side direction) is formed to be, for example, 10 m or more. Of course, this size is only an example, and is not limited to this. For example, the dimension in the Y direction of the substrate S may be 1 m or less or 50 cm or less, or may be 2 m or more. Moreover, the dimension of the X direction of the board|substrate S may be 10m or less.

Next, the operation of the substrate processing apparatus 100 configured as described above will be described.

The mask holding portion 20 that is supported by the inner tube 21 through the air bearing 26 and holds the mask M is transmitted through the impression cylinder setting portion 25a of the rotating body 25 to give the impression cylinder body 30 the weight and weight of the mask holding portion 20. It abuts in a state of a load corresponding to the spring constant of the leaf spring 28 by the difference of the empowering force toward the +Z side (upward). Thereby, between the mask holding surface 22a and the substrate holding surface 31, that is, between the mask M and the substrate S, a predetermined amount of distance corresponding to the outer diameter of the impression cylinder installation portion 25a is formed. Furthermore, when adjusting the load applied by the impression cylinder setting portion 25a to the impression cylinder body 30, it is only necessary to replace it with a leaf spring 28 with a corresponding spring constant, or to insert a plate spring 28 between the inner cylinder 21 and the support table 27 in advance. Set the leaf spring 28 in the state of the spacer and What is necessary is just to replace it with the spacer corresponding to the load which the impression cylinder installation part 25a applies to the impression cylinder body 30.

Next, the impression cylinder body 30 is driven by the driving device 33 to rotate around the rotation axis AX2, and the illumination light is irradiated from the illuminating unit 10, and the holder body 22 is transmitted through the opening 21a, and the mask M is applied from the inner peripheral side. illumination. Along with the rotation of the impression cylinder body 30, the substrate S wound on the substrate holding surface 31 of the impression cylinder body 30 and held by it is conveyed at a predetermined speed, and is driven to abut against the press through the impression cylinder installation portion 25a. The rotating body 25 on the outer peripheral surface of the printing cylinder body 30 rotates. Thereby, the mask M and the substrate S held on the mask holding portion 20 move synchronously while maintaining a predetermined amount of proximity gap (proximity gap) G. Secondly, the pattern image of the mask M illuminated by the illuminating light is successively projected onto the projection area of the substrate S.

At this time, in order to make the peripheral speed at the position (diameter) where the impression cylinder setting portion 25a abuts the substrate holding surface 31 the same, and in order to make the relative moving speed of the mask M and the substrate S as consistent as possible, the mask holding portion 20 and the impression cylinder body 30 are based on the position (diameter) of the outer circumferential surface of the mask M and the position (diameter) of the outer circumferential surface of the substrate S, the thickness Mt of the mask M and the thickness St of the substrate S, and the holding part body 22 The ratio of the radius r11 on the mask holding surface 22a and the radius r2 on the substrate holding surface 31 of the impression cylinder body 30 is adjusted.

Therefore, it is necessary not to make the radius of the portion of the substrate holding surface 31 of the impression cylinder body 30 that the outer peripheral surface of the impression cylinder setting portion 25a abuts and the radius of the portion holding the substrate S the same as shown in FIG. 3, but intentionally To make it different. Specifically, the position (diameter) in the Z direction where the outer circumferential surface of the impression cylinder setting portion 25a abuts the outer circumferential surface of the impression cylinder body 30 is set between the outer circumferential surface of the mask M and the outer circumferential surface of the substrate S The center and periphery of the gap G. Therefore, what is necessary is just to increase the radius of the outer peripheral surface part of the impression cylinder body 30 which contacts the outer peripheral surface of the impression cylinder installation part 25a with respect to the radius r2 by about St+G/2. Therefore, for example, when the thickness St of the substrate S is 200 μm and the pitch G is 100 μm, the radius of the outer circumferential surface portion of the impression cylinder body 30 that abuts against the outer circumferential surface of the impression cylinder installation portion 25a should be relative to the radius r2. Just increase by about 250μm.

If the above-mentioned exposure treatment is continuously performed, thermal expansion may occur in the holder main body 22 illuminated by the illumination light. Regarding the thermal expansion in the diameter direction (circumferential direction) of the holding portion main body 22, by making the holder 23 holding the holding portion main body 22 from the outer peripheral side formed of a metal material and having a linear expansion coefficient greater than that of the holding portion main body 22, The holding portion main body 22 is not restrained, so it is possible to avoid applying excessive stress to the holding portion main body 22. In addition, at this time, although the holder main body 22 and the holder 23 are thermally expanded in the separating direction, since the adhesive 23a has elastic bonding performance, the holder 23 can also prevent the holder main body 22 from loosening.

Furthermore, when the linear expansion coefficient of the holder 23 is smaller than the linear expansion coefficient of the holder body 22, it is preferable to adopt a structure in which the holder 23 holds the holder body 22 from the inner peripheral side, but even if it is performed from the outer peripheral side The holding structure can also be elastically deformed by the above-mentioned adhesive 23a, so as to alleviate the stress applied to the holding portion main body 22 during thermal expansion.

In addition, with respect to the thermal expansion in the direction of the rotation axis AX1 of the holder body 22, the leaf spring 24 takes the part fixed by the spacer 24A as the base point, and makes the part fixed by the spacer 24B elastic in the direction toward the rotating body 25 Deformed. In this way, the thermal expansion of the holding portion main body 22 is absorbed as the elastic deformation of the leaf spring 24, so that a large stress in the direction of the rotation axis AX1 can be avoided in the holding portion main body 22.

As described above, in the present embodiment, the rotating body 25 and the impression cylinder body 30 that abut on the outer peripheral surface of the impression cylinder body 30 at the impression cylinder installation portion 25a are driven to rotate, thereby enabling light The exposure process is performed with the cover M and the substrate S maintaining a predetermined distance between them. Therefore, in this embodiment, it is possible to prevent variations in the image width of the pattern caused by variations in the distance between the mask M and the substrate S. The value of the gap G can be changed to a good range according to the minimum size of the pattern to be exposed on the substrate S (the pattern on the mask M), or the angular characteristic (number of openings) of the illumination light from the illumination unit 10, etc., but It is in the range of tens of μm to hundreds of μm.

Moreover, in this embodiment, in the diameter direction, the adhesive with elastic adhesive performance The agent 23a is interposed between the holder body 22 and the holder 23, and is elastically deformed by the leaf spring 24 in the direction of the rotation axis AX1, so as to alleviate the stress generated in the holder body 22 due to thermal expansion, thereby reducing the stress The resulting deformation of the holding portion main body 22 suppresses adverse effects on pattern formation on the substrate S (deterioration of transfer fidelity, etc.).

In the case of this embodiment, the rotating body 25 is made of a metal material, but if the thermal expansion of its own material is also large, the diameter (full circumference) of the impression cylinder installation portion 25a will change, so it is preferable It is set as a low thermal expansion metal (nickel steel, etc.), or set as a ceramic material with a low thermal expansion rate.

(Second Embodiment)

Next, referring to FIGS. 5 and 6, a second embodiment of the substrate processing apparatus 100 will be described. In the first embodiment described above, as the pitch forming portion formed between the mask holding surface 22a and the substrate holding surface 31, the rotating body 25 provided with the impression cylinder installation portion 25a is exemplified, but in this embodiment, A case where a driving device for adjusting the position of the mask holding portion 20 with respect to the impression cylinder body 30 is provided will be described. Moreover, in this embodiment, it demonstrates assuming that the rotation axes AX1 and AX2 are arranged on the same XY plane (the mask holding portion 20 and the impression cylinder body 30 are arranged in a horizontal direction).

In these drawings, the same elements as those of the first embodiment shown in FIGS. 1 to 4 are denoted by the same reference numerals, and the description thereof will be omitted.

FIG. 5 is an enlarged cross-sectional view of the mask holding portion 20. As shown in FIG.

The mask holder 20 includes: a holder body 22; a holder 23A having a through hole with the rotation axis AX1 as the axis and holding the holder body 22 from the inner peripheral side of the end on the +Y side through the adhesive 23a; and the holder 23B , Which has a rotation shaft 34 with the rotation axis AX1 as the axis, and through the adhesive 23a from the end inner peripheral side of the -Y side to hold the retaining portion body 22; and a terminal barrel 36 having a through hole with the rotation axis AX1 as the axis, Furthermore, the holder 23A is rotatably supported by the air bearing 35 around the rotation axis AX1 from the outer peripheral side. The mask holder 20 is driven to rotate independently of the impression cylinder body 30 by a driving device MT connected to the rotating shaft 34.

In the internal space of the holder body 22, a fixing rod 37 extending in the Y direction is inserted through the through holes of the terminal barrel 36 and the holder 23A, and one end is fixed to the terminal barrel 36 by the fixing plate 38. The above-mentioned illuminating unit 10 is supported on the fixed rod 37, and the temperature adjustment medium is supplied from the supply portion 39A constituting the temperature adjustment device, and discharged from the discharge portion 39B, thereby circulating the temperature adjustment medium for efficiency. The temperature rise of the illuminating part 10 is suppressed, and the temperature of the internal space of the holding part main body 22 is adjusted.

In addition, in the substrate processing apparatus 100 of the present embodiment, as the pitch forming section, a measuring section 40 that measures the distance between the mask holding surface 22a and the substrate holding surface 31 is provided; and a displacement section 41, which measures the distance between the mask holding surface 22a and the substrate holding surface 31 According to the measurement result of the measuring unit 40, the mask holder 20 is displaced in the direction in which the holder main body 22 and the impression cylinder body 30 are separated and approached.

The measuring unit 40 is composed of a CCD camera with a microscope or an optical focal length (height measurement) sensor, etc., supported on a fixed rod 37, and is configured to match the holding surface 31 of the impression cylinder body 30 with the holding portion main body 22 The distance to the facing position (here, the position in the X direction) is measured, and the distance between the mask holding surface 22a and the substrate holding surface 31 is measured, and the measured distance is output to the control unit CONT.

The displacement part 41 is composed of a driving part 44, a driving part 47, and the above-mentioned control part CONT which independently drives the driving parts 44 and 47. The driving part 44 holds the rotating shaft 34 through an air bearing 42 and extends along the X direction. The provided guide rail 43 drives the holder 23A in the X direction; the driving portion 47 holds the terminal barrel 36, and the guide rail 46 extending in the X direction drives the terminal barrel 36 in the X direction.

As shown in FIG. 6, a plurality of measuring parts 50 are provided on the upstream side of the conveying direction of the substrate S than the exposure area. The measuring parts 50 have the same structure as the measuring part 40 and measure the alignment marks of the substrate S (alignment mark) (not shown). In the present embodiment, the measuring parts 50 are arranged at three places with intervals in the conveying direction of the substrate S, and three are arranged at intervals in the width direction of the substrate S for each part (refer to FIG. 7), And output the measurement result to the control unit CONT.

In the substrate processing apparatus 100 configured as described above, based on the light measured by the measuring unit 40 The distance between the mask holding surface 22a and the substrate holding surface 31, the control unit CONT controls the driving of the driving units 44, 47 to be the same driving amount, thereby separating the mask holding unit 20 from the impression cylinder body 30 , Move in the approaching direction to adjust the above-mentioned distance. In addition, the control unit CONT may finely adjust the relative inclination of the rotation axis AX1 and the rotation axis AX2 by making the driving amounts of the driving units 44 and 47 different.

Furthermore, based on the alignment mark position of the substrate S measured by the measuring section 50, the control section CONT measures the surface deformation of the exposed area on the substrate S before the exposure processing, etc., and reflects it in the above-mentioned pitch adjustment, or The relative tilt of the rotation axis AX1 and the rotation axis AX2 is adjusted.

In this way, in this embodiment, in addition to the same functions and effects as the first embodiment described above, by moving the mask holding portion 20, the gap between the mask holding surface 22a and the substrate holding surface 31 can also be moved. Adjust the amount of spacing to any value. Therefore, in the present embodiment, even when the distance between the rotation axis AX1 and the rotation axis AX2 changes due to environmental changes such as temperature changes, or the diameter of the holder body 22 or the impression cylinder body 30 changes , Or when the thickness of the mask M and the substrate S varies due to manufacturing batches, etc., the distance between the mask holding surface 22a and the substrate holding surface 31 can be easily adjusted to a predetermined amount, thereby The pattern of the mask M can be exposed to the substrate S with high precision.

(Third Embodiment)

Next, referring to FIGS. 7 and 8, a third embodiment of the substrate processing apparatus 100 will be described. In the above-mentioned second embodiment, it is configured as follows: the driving of the driving parts 44, 47 is controlled to move the mask holding part 20, thereby adjusting the distance between the mask holding surface 22a and the substrate holding surface 31, that is, The distance G between the outer circumferential surface of the mask M and the outer circumferential surface of the substrate S, but in this embodiment, a spacer is provided between the mask holding part 20 and the impression cylinder body 30, and the spacer part is adjusted An example of adjusting the distance between the mask holding surface 22a and the substrate holding surface 31 will be described.

In these drawings, the same elements as those of the second embodiment shown in FIGS. 5 and 6 are denoted by the same reference numerals, and the description thereof will be omitted.

The terminal barrel 36 provided at the end of the +Y side of the holding portion main body 22 shown in FIG. 7 is supported on the supporting member 51A. The support member 51A is movably supported by a guide portion 52A extending in the X direction and provided on the base portion B in a non-contact manner. In addition, the supporting member 51A is pressurized by the air cylinder (energizing part) 53A provided on the +X side by energizing the -X side with a predetermined energizing capacity. Similarly, the rotating shaft 34 on the -Y side of the holding portion main body 22 is supported by the supporting member 51B through the air bearing 42. The support member 51B is movably supported by a guide portion 52B extending in the X direction and provided on the base portion B in a non-contact manner. In addition, the supporting member 51B is pressurized by energizing the -X side with a predetermined energizing capacity by the air cylinder (energizing part) 53B provided on the +X side.

The base part B is provided with an interval in the Y direction, and is located closer to the -X side than the area supporting the guide parts 52A, 52B. It is provided with the guide parts 52A, 52B protruding to the +Z side and supports the impression cylinder body 30 of the support wall 54. A groove 55 extending in the Z direction is formed between each of the supporting members 51A, 51B and the supporting wall 54.

As shown in FIG. 8, the width of the groove portion 55 in the X direction is gradually increased toward the +Z direction, and is formed to have a slight taper with respect to the YZ plane. In more detail, the side surface on the +X side of the support wall 54 (the side surface on the -X side that forms the groove 55) is formed parallel to the YZ plane, and the side surface on the -X side of the support members 51A and 51B (the side surface on the -X side that forms the groove 55) is formed parallel to the YZ plane. The side surface on the +X side) is formed by inclining the surface parallel to the YZ plane in such a way that the distance from the side surface on the +X side of the support wall 54 gradually increases toward the +Z direction. In this groove portion 55, a cushion portion 56 is inserted movably in the Z direction.

As shown in FIG. 7, the driving device (first adjusting portion) MT connected to the rotating shaft 34 and rotating the mask holding portion 20 (ie, the mask M) through the rotating shaft 34 is provided on a movable device in the Y direction. On the displacement platform (the second adjustment part) 48. The control part CONT can move the mask holding part 20, the mask M and the driving device MT integrally in the Y direction by controlling the movement of the displacement platform 48.

In the substrate processing apparatus 100 having the above configuration, the inclined (tapered) surfaces of the supporting members 51A, 51B that are pressurized in the −X direction by the air cylinders 53A, 53B abut against the gasket portion inserted into the groove portion 55 56 to restrict the movement, thereby specifying the position of the support members 51A, 51B in the X direction. Support The position where the inclined surfaces of the members 51A and 51B abut the pad portion 56 varies depending on the position of the pad portion 56 in the Z direction. Therefore, by adjusting the position of the cushion portion 56 in the Z direction, it is possible to specify the position in the X direction that restricts the movement of the support members 51A and 51B and is positioned.

That is, in this embodiment, by adjusting the position of the cushion portion 56 in the Z direction, the position of the mask holding portion 20 and the mask M supported on the support members 51A, 51B can be adjusted. As a result, the position of the mask holder 20 and the mask M can be adjusted. The distance between the mask holding surface 22a and the substrate holding surface 31 (the distance G between the mask M and the substrate S) is adjusted. In addition, it is also possible to adjust the light in a plane parallel to the XY plane by making the position in the Z direction of the spacer 56 that restrict the movement of the supporting members 51A and 51B different between the supporting member 51A and the supporting member 51B. The rotation axis AX1 of the cover holding portion 20 is inclined with respect to the Y axis.

In addition, a configuration may be adopted in which the movement of the pad portion 56 in the Z direction in the present embodiment is performed under the control of the control portion CONT, and based on the measurement result of the measurement portion 50, using a driving device such as a motor.

On the other hand, based on the alignment mark position of the substrate S measured by the measurement unit (detection unit) 50, the control unit CONT controls the relative positional relationship between the mask M and the substrate S in the direction (circumferential direction) around the rotation axis AX1 The driving device MT rotates to perform position alignment of the mask M and the substrate S in the direction (circumferential direction) around the rotation axis AX. In addition, the control unit CONT integrates the mask holder 20, the mask M, and the driving device MT through the displacement platform 48 based on the measured relative positional relationship between the mask M and the rotation axis AX1 direction (Y direction) of the substrate S By moving in the Y direction (the direction of the rotation axis AX1), the mask M and the substrate S are aligned in the direction of the rotation axis AX1.

In this way, in this embodiment, in addition to the distance between the mask M and the substrate S, the relative position in the direction around the rotation axis AX1 and the relative position in the direction of the rotation axis AX1 can also be easily adjusted.

Furthermore, when adjusting the relative position of the photomask M and the substrate S in the directions (circumferential direction) around the rotation axes AX1 and AX2, in addition to the method of controlling the driving of the driving device MT, for example, the following configuration may also be adopted: An electromagnetic brake (generator brake) or the like is provided between the holding part main body 22 or the rotating shaft 34 constituting the mask holding part 20 and the fixed parts such as the supporting members 51A and 51B. The rotational force of the main body 22 temporarily applies a load to reduce the rotational torque, thereby adjusting the relative position (angular position) of the mask M in the direction around the rotation axis AX1 with respect to the substrate S.

(Fourth Embodiment)

Next, referring to FIGS. 9 to 11, a fourth embodiment of the substrate processing apparatus 100 will be described. In the above-mentioned first embodiment, it is configured as follows: the impression cylinder installation portion 25a of the rotating body 25 abuts against the impression cylinder body 30, and is placed between the mask holding surface 22a and the substrate holding surface 31, that is, A predetermined amount of pitch is formed between the mask M and the substrate S. However, in this embodiment, a configuration in which the pitch amount G is appropriately maintained according to the thickness St of the substrate S and the peripheral speeds of the mask M and the substrate S are aligned will be described. .

In these drawings, the same elements as those of the first embodiment shown in FIGS. 1 to 4 are denoted by the same reference numerals, and the description thereof will be omitted.

As shown in Fig. 9, the overall structure of this embodiment is the same as that of Fig. 1, but in this embodiment, the outer peripheral surface of the impression cylinder 30 on both sides of the Y direction, or the pressure of the rotating body 25 The printing cylinder installation portion 25a is different in that shims (correction portions) SM1 and SM2 of a predetermined thickness are annularly provided on the outer peripheral surface of the printing cylinder installation portion 25a.

As shown in Figure 3 above, if the radius of the impression cylinder setting portion 25a of the rotating body 25 is set to r1, the radius of the substrate holding surface 31 of the impression cylinder body 30 is set to r2, and the mask holding surface 22a is The radius is set to r11, the thickness of the mask M is set to Mt, the thickness of the substrate S is set to St, and the predetermined distance between the mask M and the substrate S is set to G, the axis of rotation axis AX1 and rotation axis AX2 The distance DX is represented by the following equation (1).

DX=r11+Mt+G+St+r2. . . (1)

Therefore, when the impression cylinder installation portion 25a rotates on the substrate holding surface 31 of the impression cylinder body 30, the radius r1 of the impression cylinder installation portion 25a can be obtained by the following equation (2).

r1=DX-r2. . . (2)

Therefore, if the values of the photomask M, the substrate S, and the pitch G are determined, the radius r1 of the impression cylinder installation portion 25a can use the value obtained according to the above-mentioned formulas (1) and (2).

However, for the substrate S, for example, there are cases where different thicknesses are used due to different batches. This situation not only exists in the substrate S, but may also occur in the mask M as well.

Therefore, in this embodiment, the configuration is as follows: a shim is provided at the contact portion between the impression cylinder installation portion 25a of the rotating body 25 and the impression cylinder body 30 to correct the change in the thickness of the substrate S or the mask M, etc. The correction department.

That is, as shown in FIG. 9, the shim (correction part) SM1 is detachably installed on the outer peripheral surface of the impression cylinder installation part 25a. In addition, a shim (correction part) SM2 is detachably provided at a position on the outer peripheral surface of the impression cylinder body 30 facing the impression cylinder installation portion 25a. As a method for making the shim SM1 detachable from the outer peripheral surface of the impression cylinder installation portion 25a, the shim SM1 can be provided with a magnetic portion and the mask holding portion 20 (impression cylinder installation portion 25a) can be provided with a magnetic portion. The composition of the excitation section.

Specifically, a configuration in which the shim SM1 is formed of a magnetic material, a layer containing a magnetic material such as magnetic powder is formed on the entire surface or a part of the shim SM1, and an imprint roller made of a magnet can be used. The structure of the outer peripheral surface of the portion 25a, and the structure of embedding a magnet on the outer peripheral surface of the impression cylinder installation portion 25a. As a magnet, a permanent magnet or an electromagnet can be equipped.

As a method for making the shim SM2 freely attachable to and detachable from the outer peripheral surface of the impression cylinder body 30, the shim SM2 can be provided with a magnetic portion and the impression cylinder body 30 can be provided with an excitation portion, similarly to the shim SM1. The composition.

The shimming sheet SM1 is provided over substantially the entire circumference of the outer peripheral surface of the impression cylinder installation portion 25a. Similarly, the shim SM2 is provided over substantially the entire circumference of the outer peripheral surface of the impression cylinder body 30 (substrate holding surface 31). In more detail, when the shim SM1 is wound on the outer peripheral surface of the impression cylinder installation portion 25a, it has a length that forms a gap at the connecting portion so as not to overlap the ends in the direction around the rotation axis AX1. A protrusion is formed in the diameter direction. Moreover, as shown in FIG. 10A, the circumferential direction of the shim SM1 The two ends are formed with a fixed width in a gap extending in a direction obliquely crossing with respect to the rotation axis AX1, and are respectively formed in the same angle of the oblique direction.

With this configuration, even when the mask holder 20 and the impression cylinder body 30 rotate and the contact range Ta with the impression cylinder body 30 moves, a part of the shim SM1 always exists in the contact range Ta. Therefore, it is possible to prevent the variation or vibration of the distance between the mask holding portion 20 and the impression cylinder body 30 due to the difference in the gap. Furthermore, the structure of the end that forms the gap is the same for the shim SM2.

As described above, in order to maintain the distance G between the mask M and the substrate S shown in FIG. 11, the thickness of the shim SM1, SM2 is set according to the thickness of the substrate S or the mask M, respectively. In this case, the radius r1 of the impression cylinder installation portion 25a is set to be smaller than the distance from the outer peripheral surface of the impression cylinder body 30 so that the shim pieces SM1 and SM2 can be installed.

Therefore, assuming that the thicknesses of the shims SM1 and SM2 are respectively t1 and t2, the inter-axial distance DX between the rotation axis AX1 and the rotation axis AX2 is expressed by the following formula (3).

DX=r1+r2+t1+t2=r11+Mt+G+St+r2. . . (3)

According to the formula (3), the total thickness of the shims SM1 and SM2 is expressed by the following formula (4).

t1+t2=r11+Mt+G+St-r1. . . (4)

Furthermore, for example, when the thickness St of the substrate S becomes (St+α), by setting the total thickness of the shim SM1 and SM2 as t1+t2+α, even if the thickness of the substrate S The gap amount G can also be kept constant when changing the situation.

However, the peripheral speeds of the mask holding portion 20 and the impression cylinder body 30 are at the same position (distance from the rotation axis AX1, AX2) on the contact surface tf of the shim SM1, SM2, and are located at a position separated from the position The peripheral velocity of the surface of the upper mask M (hereinafter referred to as the mask surface) and the peripheral velocity of the surface of the substrate S (hereinafter referred to as the substrate surface) vary according to the distance between each surface and the rotation axis AX1 and AX2. Therefore, the thickness of each shim SM1 and SM2 must be such that the relative peripheral speeds of the mask surface and the substrate surface are the same. The formula is set separately.

For example, the thickness of the substrate S that has changed is set to St'(=St+α), and the thicknesses of the shim SM1 and SM2 corresponding to the thickness St' of the substrate S are set to T1, T2, and the light The angular velocity of the mask holding portion 20 is set to ω1, and the angular velocity of the impression cylinder body 30 is set to ω2. As described above with reference to FIG. 3, the position set as the contact surface tf is located between the outer peripheral surface of the mask M and the substrate S In the case between the outer peripheral surfaces, that is, approximately in the middle of the gap G, the peripheral velocity on the abutting surface tf is the same, so the following formula (5) holds.

(r1+T1). ω1=(r2+T2). ω2. . . (5)

In addition, since the peripheral speed of the mask surface and the peripheral speed of the substrate surface are set to be the same, the following equation (6) holds.

(r11+Mt). ω1=(r2+St'). ω2. . . (6)

If the above formulas (5) and (6) are organized, the following formula (7) is derived.

(r2+T2)/(r1+T1)=(r2+St')/(r11+Mt). . . (7)

Furthermore, according to the formula (4), the following formula (8) holds.

T1+T2=r11+Mt+G+St'-r1. . . (8)

Therefore, in this embodiment, by using the shims SM1 and SM2 with the thicknesses T1 and T2 satisfying the formulas (7) and (8), even when the thickness of the substrate S changes, the light can be kept on one side. The distance between the outer peripheral surface of the mask M and the outer peripheral surface of the substrate S is corrected in such a way that the peripheral speeds of the outer peripheral surface of the mask M and the outer peripheral surface of the substrate S are the same. In addition, in this embodiment, since the shim pieces SM1 and SM2 are magnetically attached to the impression cylinder installation portion 25a and the impression cylinder body 30, respectively, they can be easily combined with changes in the thickness of the substrate S, the mask M, etc. Replacement can improve work efficiency. Furthermore, in the present embodiment, since the gap between the ends of the shim SM1 and SM2 extends in a direction intersecting the direction of the rotation axis AX1 and AX2, it is possible to prevent the gap from being changed or caused by a step difference during rotation Vibration, so that high-precision exposure processing can be implemented.

Furthermore, the shim in the fourth embodiment described above is formed in an oblique direction. The structure of the ends of SM1 and SM2 is not limited to this, as long as at least a part of the gap between the ends is formed in a direction intersecting the direction of the rotation axis AX1 and AX2, for example, as shown in FIG. 10B, It may also be formed in a stepped shape in which the gap along the direction of the rotation axis AX1 and AX2 and the gap along the direction orthogonal to the rotation axis AX1 and AX2 alternately repeat.

Moreover, even when the gap between the ends is formed along the direction of the rotation axis AX1 and AX2, as shown in FIG. 10C, it may be configured as follows: the position of the gap is different from the direction around the rotation axis AX1 and AX2 In this way, a plurality of shims are arranged in the direction of the rotation axis AX1 and AX2.

In addition, in the above-mentioned embodiment, the description has been made using an example in which the thickness of the shims SM1 and SM2 is set so that the relative peripheral speed of the mask surface and the substrate surface is the same, but for example, as long as the change in the thickness of the substrate S falls within the allowable range Inside, it can also be set to fix the thickness of any one of the shim pieces SM1 and SM2, and only the thickness of the other shim piece corresponds to when the shim piece is replaced. In addition, when the thickness of the substrate S or the photomask M does not change significantly, the gap adjustment during the initial adjustment can also be used to fix the gap filler with the required thickness by the adhesive.

In addition, for example, when the substrate S is expanded and contracted in the conveying direction in the previous step, the thickness distribution of the shim SM1 and SM2 can also be adjusted to deliberately oppose the outer peripheral surface of the mask M and the outer peripheral surface of the substrate S. The peripheral speed is given a difference in order to correct the expansion and contraction of the substrate S.

Here, the thickness St of the substrate S in FIG. 11 is set to 100 μm, the pitch G is set to 100 μm, and the radius (r1+t1) of the impression cylinder setting portion 25a including the thickness t1 of the shim SM1 is set to When the radius (r2+t2) of the impression cylinder body 30 of the thickness t2 of the shim SM2 is set to 150mm, and the peripheral speed V0 on the contact surface tf is set to 50mm/S, the contact surface tf Under the condition of being located in the middle (1/2) of the gap G, the outer circumferential surface of the mask M and the outer circumferential surface of the substrate S maintain the gap G, and both sides become the peripheral speed of 49.983 mm/S, so that the relative speed difference is zero.

Depending on where the position (Z direction) of the abutting surface tf is set within the pitch G, a slight relative difference in the peripheral speed will occur, so the circumferential size of the pattern exposed on the substrate S can be compared to that on the mask M The circumferential size of the pattern expands and contracts within a certain range. In the case of the above numerical example, if the size in the circumferential direction of the pattern on the mask M is set to 750 mm, the size of the pattern exposed on the substrate S in the conveying direction can be expanded and contracted at a maximum of ±500 μm.

The expansion and contraction correction of this kind of exposure pattern is also referred to as the relative magnification correction in the scanning exposure direction (the conveying direction of the substrate S), which is used to accurately perform the accurate correction of the base pattern formed on the resin substrate S with a large physical expansion and contraction. In the case of overlapping exposure, the relative magnification correction can be actively used to perform a faithful pattern transfer consistent with the base pattern.

(Fifth Embodiment)

Next, referring to FIG. 12, a fifth embodiment of the substrate processing apparatus 100 will be described.

In the above-mentioned fourth embodiment, the thickness of the shims SM1 and SM2 is adjusted to cope with the change in the thickness of the substrate S, etc. However, in this embodiment, the rotation body 25 is elastically deformed in the diameter direction. The structure of the thickness variation of the substrate S etc. shall be explained.

In this figure, the same elements as those of the fourth embodiment shown in FIGS. 9 to 11 are denoted by the same reference numerals, and the description thereof is omitted.

As shown in FIG. 12, in the substrate processing apparatus 100 of the present embodiment, between the holder 23 at the end of the holder main body 22 and the rotating body 25, an impression cylinder setting portion 25a of the rotating body 25 is provided. Displacement ring 61 with displacement of the outer peripheral surface. The displacement ring 61 is provided with a protrusion formed on the side opposite to the rotating body 25 around the rotation axis AX1 and having an inclined surface 61 a whose diameter gradually increases as it separates from the rotating body 25. In addition, the rotating body 25 is provided with an inclined surface 25b fitted to the inclined surface 61a from the outside. In addition, it is provided with a head 62b attached to the rotating body 25 from the side opposite to the displacement ring 61 in the direction of the rotation axis AX1, and a shaft portion 62a screwed to the displacement ring 61 around a shaft parallel to the rotation axis AX1 The screw portion (load applying portion) 62 is provided at a plurality of locations at equal angular intervals along a circle parallel to the XZ plane centered on the axis AX1. In this embodiment, it is configured as follows: the mask holding portion 20 and the impression cylinder body 30 are driven to rotate by the impression cylinder installation portion 25a abutting against the substrate holding surface 31 of the impression cylinder body 30.

In FIG. 12, when adjusting the distance between the mask holding surface 22a and the substrate holding surface 31 (the distance G between the mask surface and the substrate surface), for example, the adjustment screw 62 is screwed into the shaft portion 62a to be displaced The direction in the ring 61 rotates. Since the head 62b of the adjusting screw 62 is attached to the shift ring 61, the shaft portion 62a is elastically deformed by being screwed into the shift ring 61 to expand in an axial direction parallel to the rotation axis AX1. The elastic restoring force of the shaft portion 62a acts on the rotating body 25 as a load in the direction approaching the displacement ring 61 through the head portion 62b.

Since the rotating body 25 applied with a load in the direction close to the displacement ring 61 moves in the direction in which the inclined surface 25b expands along the inclined surface 61a of the displacement ring 61, the load is applied in the direction close to the displacement ring 61 The diameter is changed to the expanding direction, and the impression cylinder installation portion 25a is elastically deformed to expand the diameter. By expanding the diameter of the impression cylinder installation portion 25a, the distance between the mask holding surface 22a and the substrate holding surface 31 (the distance G between the mask surface and the substrate surface) can be increased corresponding to the amount of diameter expansion. Here, when the amount of diameter expansion is too large, by rotating the adjustment screw 62 in the opposite direction, the amount of elastic deformation of the shaft portion 62a is reduced, and the rotating body 25 is given a direction close to the displacement ring 61 The load is reduced, thereby reducing the amount of diameter expansion of the impression cylinder installation portion 25a.

In this way, in the present embodiment, by rotating the adjustment screw 62, the amount of expansion of the impression cylinder installation portion 25a can be adjusted according to the load in the direction approaching the displacement ring 61 and the angle of the inclined surfaces 61a, 25b. The distance between the mask holding surface 22a and the substrate holding surface 31 (the distance G between the mask surface and the substrate surface) can be easily adjusted to a desired value.

Furthermore, when the diameter of the impression cylinder installation portion 25a is enlarged by the rotation of the adjustment screw 62, as shown in FIG. 11 above, the contact surface tf and the outer peripheral surface of the mask M in the Z direction (diameter direction ) Changes, so the relative peripheral velocity between the outer peripheral surface of the mask M and the outer peripheral surface of the substrate S will be different. Therefore, it is desirable to take this into consideration and determine the diameter of the impression cylinder setting portion 25a Expand the amount.

Furthermore, the rotation of the adjustment screw 62 described in the fifth embodiment is also The following structure may be adopted: a rotation driving device is additionally provided, and the rotation amount of the adjustment screw 62 is controlled through the rotation driving device according to the amount of the gap to be adjusted. In addition, as a method of expanding the diameter of the impression cylinder installation portion 25a, in addition to the adjustment screw 62 described above, a piezoelectric element such as a piezo element may be used to apply a load in the direction of the rotation axis AX1 to the rotor 25 constitute. Furthermore, in addition to the above-mentioned configuration of converting the load in the direction of the rotation axis AX1 into a load in the diameter direction, the piezoelectric element can also be arranged to be displaced in the diameter direction, and the impression cylinder can be adjusted according to the displacement of the piezoelectric element The setting part 25a has a configuration in which the diameter is enlarged or reduced.

(Sixth Embodiment)

Next, referring to FIGS. 13 and 14, a sixth embodiment of the substrate processing apparatus 100 will be described.

In the first to fifth embodiments described above, it is assumed that the substrate S in the exposure area is held on the outer peripheral surface 31 of the impression cylinder body 30. However, in this embodiment, an endless belt is used. The configuration in which the belt surrounded by a shape keeps the substrate S in a flat shape will be described.

In these figures, the same elements as the constituent elements of the above-mentioned embodiment shown in FIGS. 1 to 12 are denoted by the same reference numerals, and the description thereof will be omitted.

The substrate processing apparatus 100 of the present embodiment includes a substrate supply section 11 that supplies a substrate S, a substrate recovery section 12 that collects the substrate S, and a substrate transport section 90 that transports the substrate S. The substrate supply unit 11 feeds and supplies the substrate S wound in a roll shape, for example. In this case, the substrate supply portion 11 is provided with a shaft portion for winding the substrate S or a rotation driving device for rotating the shaft portion. Moreover, it may be a structure provided with the cover part etc. which cover the board|substrate S wound in the state of a roll shape, for example. In addition, the substrate supply unit 11 is not limited to a mechanism for sending out the substrate S wound in a roll shape, as long as it includes a mechanism for sequentially sending out the substrate S in a strip shape along its longitudinal direction.

The board|substrate recovery part 12 winds up the board|substrate S which has performed exposure processing into a roll shape, for example, and collect|recovers it. Similar to the substrate supply unit 11, the substrate recovery unit 12 is provided with a shaft portion for winding the substrate S or a rotation drive source for rotating the shaft portion, a cover portion for covering the recovered substrate S, and the like. Furthermore, in the substrate recycling In the case where the substrate S is cut into a panel shape in the portion 12, for example, the substrate S may be recovered in a state of being overlapped, and the substrate S may be recovered in a state different from the state of being wound in a roll shape.

The substrate conveying section 90 has a plurality of guide rollers R (two in FIG. 13) that guide the substrate S supplied from the substrate supply section 11, and a substrate support mechanism 80 that supports the substrate S. The substrate support mechanism 80 is arranged between the guide rollers R.

The substrate support mechanism 80 has a belt portion (endless belt) 81, a belt conveying portion 82, and a guide platform (fluid supporting portion) 83. In addition, in the substrate support mechanism 80, although illustration is omitted, a belt cleaning section for cleaning the belt section 81, a static electricity removing section for removing static electricity from the belt section 81, and the like are provided.

The band 81 is formed in a ring shape using, for example, a metal material such as stainless steel.

The belt portion 81 supports the substrate S from the back side via a support surface (substrate holding surface) 81a provided on the outside. The belt 81 is provided with a plurality of through holes (not shown) arranged in a circumferential direction over a circumference. Each through hole is formed to penetrate between the support surface 81a of the belt portion 81 and the back surface 81b provided on the back surface side of the support surface 81a. The plurality of through holes are formed in a plurality of rows in the Y direction. A part of the belt 81 is arranged to face the back surface of the substrate S.

The belt conveyance part 82 has two conveyance rollers 82a-82b. A belt 81 is wound around the conveyance rollers 82a to 82b. The transport roller 82b is arranged on the upstream side (+X side) in the transport direction of the substrate S than the exposure area. The transport roller 82a is arranged on the downstream side in the transport direction of the substrate S than the exposure area. Therefore, the belt 81 is configured to move so as to cross the exposure area in the X direction.

The conveyance roller 82a and the conveyance roller 82b are arranged to extend in the Y direction, and are arranged with an interval therebetween so as to be aligned in the X direction.

The conveying rollers 82a and 82b adjust their positions by moving around the axis AX3 (refer to FIG. 14) parallel to the Y direction in a state where the belt 81 is under tension.

The conveying roller 82a serves as a driving roller of the driving belt 81. A driving part (surround driving part) 82e is provided on the conveyance roller 82a. In this embodiment, for example, the conveying roller 82a is a driving roller, and the remaining conveying The roller 82b is a driven roller. The conveyance roller 82a as a drive roller is formed of a porous material, for example, and is connected to the suction device which is not shown in figure. With this configuration, the belt portion 81 can be adsorbed to the outer peripheral surface, so that power can be transmitted to the belt portion 81.

The guide platform 83 is formed into a rectangular plate shape using, for example, a porous material through which gas can pass. The +Z side surface (guide surface) 83a of the guide platform 83 is formed parallel to the XY plane, and by ejecting gas (fluid) toward the substrate S, it acts as a gas pressure (fluid pressure) from the -Z side It supports the function of the plane spacer of the substrate S in a non-contact manner. The guide platform 83 guides the substrate S and the belt 81 so as to move in the X direction along the guide surface 83a.

The guide platform 83 is arranged between the transport roller 82a and the transport roller 82b in the X direction. Furthermore, as shown in FIG. 14, the guide platform 83 is arranged at a position overlapping with the belt 81 in the Y direction. The guiding surface 83a of the guiding platform 83 is arranged to face the back of the belt 81. The guiding platform 83 is fixed in position by a fixing mechanism not shown.

Furthermore, in this embodiment, the power train of the driving part 82e is transmitted to the mask driving roller (rotating part) 85 by the wheel train mechanism 84 through the rotating shaft 86 which rotates integrally. As the wheel train mechanism 84, one that includes a magnetic gear that can transmit power in a non-contact manner can be used.

14 is a cross-sectional view of the substrate processing apparatus 100 shown in FIG. 13 broken along a plane parallel to the ZY plane.

As shown in FIG. 14, the mask drive roller 85 is provided with two spaces in the Y direction according to the arrangement of the rotor 25. Between the mask driving rollers 85, the rotating shaft 86 is supported by a pair of bearings 87 with a space provided therebetween. These bearings 87 are micro-driven in the Z direction by a lifting device (moving part) 88 composed of a piezoelectric element or the like.

In the substrate processing apparatus 100 configured as described above, the lifting device 88 moves the rotating shaft 86 in the Z direction through the bearing 87, whereby the holder body 22 is integrally moved in the Z direction through the mask drive roller 85 and the rotating body 25 , And move relative to the guiding platform 83 in the Z direction.

Thereby, the distance G between the mask holding surface 22a of the holding portion main body 22 and the supporting surface 81a of the belt portion 81 can be adjusted. Therefore, the distance G between the mask M held on the mask holding surface 22a and the substrate S held on the support surface 81a is also adjusted to a predetermined amount.

If the distance between the mask M and the substrate S is adjusted, the substrate processing apparatus 100 manufactures display elements (electronic elements) such as organic EL (Electro-Luminescence) elements and liquid crystal display elements by a roller method. Hereinafter, the steps of manufacturing a display element using the substrate processing apparatus 100 having the above-mentioned configuration will be described.

First, a strip-shaped substrate S wound on a roller (not shown) is mounted on the substrate supply unit 1. In this state, the substrate S is sent out from the substrate supply section 11, and the driving section 82e is actuated to rotate the transport roller 82a. On the other hand, the power of the driving portion 82e is transmitted to the rotating shaft 86 through the wheel train mechanism 84. The mask driving roller 85 is rotated by the rotation of the rotating shaft 86, thereby driving the rotating body 25 abutting on the mask driving roller 85 to rotate, whereby the mask M held on the holder body 22a rotates around the rotation axis AX1 . Therefore, the photomask M rotates synchronously (interlocked) with the conveyance of the substrate S accompanying the circling motion of the belt 81. In this state, the pattern image of the mask M illuminated by the illuminating light from the illuminating unit 10 is successively exposed on the substrate S.

In this way, in this embodiment, it is also possible to easily adjust the distance between the mask holding surface 22a of the holding portion main body 22 and the supporting surface 81a of the belt portion 81 in response to changes in the thickness of the substrate S. In addition, in this embodiment, it can also be configured as follows: the adjustment amount of the pitch is small, and, for example, a vacuum-pressurized air bearing layer is formed between the belt portion 81 and the guide surface 83a of the guide platform 83 In this case, the pitch amount is adjusted by finely moving the guide surface 83a constituting the flat gasket in the Z direction.

In addition, in the above-mentioned sixth embodiment, the following configuration is exemplified and explained. That is, when the rotor 25 abuts on the mask drive roller 85 and is driven to rotate, the mask M is rotated about the rotation axis AX, However, it is not limited to this. For example, as shown in FIG. 15, it may be configured as follows: the rotating body 25 abuts against the belt 81 at a position separated from the substrate S and is driven to rotate, thereby making the photomask M rotation.

In the substrate processing apparatus 100 of this structure, the The shim SM1 is provided on the outer peripheral surface of the impression cylinder setting portion 25a with a thickness corresponding to the thickness of the substrate S, and the gap between the mask holding surface 22a and the guide surface 83a of the guide platform 83 can be adjusted (mask surface The distance between the substrate and the surface of the substrate.

In addition, when the amount of pitch adjustment is small, the amount of pitch can also be adjusted by adjusting the thickness of the air bearing layer. Specifically, as shown in FIG. 15, the control unit CONT, which is a fluid pressure adjustment unit, controls the supply unit 89 that supplies air to the guide platform 83, and adjusts the position of the rotating body 25 (impression cylinder setting unit 25a) in the air cushion unit. The air supply amount of the abutting area can be adjusted by adjusting the thickness of the air bearing layer to move the rotating body 25 in the direction of separating and approaching with respect to the belt 81. Thereby, the distance between the belt 81 and the rotating body 25, that is, the distance between the mask holding surface 22a and the guide surface 83a (between the mask surface and the substrate surface) can be easily changed.

Above, the preferred embodiments of the present invention have been described with reference to the accompanying drawings, but of course, the present invention is not limited to the above-mentioned examples. The shapes or combinations of the constituent members shown in the above examples are just an example, and various changes can be made in accordance with design requirements and the like without departing from the spirit of the present invention.

For example, in the above embodiment, the mask M is held on the outer peripheral surface of the holder main body 22, but it is not limited to this, and the photomask M may be held on the inner peripheral surface of the holder main body 22. The composition.

In addition, in the above-mentioned embodiment, the configuration of the measurement unit provided with the relative position of the measurement mask M and the substrate S has been described only in the second and third embodiments, but of course it can also be applied to other embodiments.

In addition, as the processing apparatus U3 in the component manufacturing system SYS described below, the substrate processing apparatus 100 of the above-mentioned embodiment can be used.

(Seventh embodiment)

Hereinafter, a substrate processing apparatus according to a seventh embodiment of the present invention will be described with reference to FIGS. 16 to 20.

In the following description, the same constituent elements may be denoted with the same reference numerals, and the description may be simplified or omitted. In addition, unless otherwise specified, the description of the constituent elements or the like shall be the same as in the above-mentioned embodiment.

In addition, in the present embodiment, a description will be given by exemplifying a configuration in which the mask holding portion and the substrate holding portion are rotated in synchronization (driven rotation) by friction.

16 is a front cross-sectional view of the main part of the substrate processing apparatus 200, FIG. 17 is a front view of the mask unit MU constituting the substrate processing apparatus 200, and FIG. 18 is a partial enlarged view of the end of the mask unit MU.

The substrate processing apparatus 200 is a device that exposes the pattern of a flexible sheet-shaped mask M to a strip-shaped substrate (for example, a strip-shaped film member) S, and uses the illuminating unit 10 and the mask unit MU , The substrate holding unit SU, the alignment microscopes AL1, AL2, and the control unit (not shown) are constituted as main bodies. The mask M is formed of a flexible sheet-like glass material to a thickness of, for example, about 200 to 500 μm.

Furthermore, in this embodiment, the vertical direction is set to the Z direction, the directions parallel to the rotation axes AX1 and AX2 of the mask unit MU and the substrate holding unit SU are set to the Y direction, and the Z direction and Y direction The orthogonal direction will be described as the X direction.

The illuminating part 10 irradiates the illuminating light toward the illuminating area of the mask M wound on the mask holding part 20 (described below) in the mask unit MU, and will radiate in a straight tube type like a fluorescent lamp Illumination light for exposure, or illuminating light is introduced from both ends of a cylindrical quartz rod and a diffuser is provided on the back side, or a semiconductor laser that emits light in a high-brightness ultraviolet region, or The LEDs etc. arranged in a row are housed in the inner space of the inner tube 21 supporting the mask holder 20.

The mask unit MU includes a mask holding portion 20 and a rotating body 25. The mask holder 20 includes a holder body 22 and a holder 23. The holder body 22, the holder 23, and the rotating body 25 are arranged in an integrated state, and are respectively formed to be connected in the direction of the rotation axis (the predetermined axis) AX1 There is a through hole through which the inner cylinder 21 is inserted.

The holding portion main body 22 is formed of a cylindrical glass material with the rotation axis (predetermined axis) AX1 as the axis, and is provided with a cylindrical surface holding the outer peripheral surface (peripheral surface) 22a of the mask M along a predetermined radius. As shown in FIG. 17, when the mask M is wound, the circumference of the outer peripheral surface 22a is set to the length separated from both ends in the direction of the rotation axis AX1 (in the following description, the holder body 22 and the holder The area where the two ends of the mask M are separated in the direction around the rotation axis AX1 (the direction of scanning exposure) in the tool 23 is called the mask separation area Ma).

The holder 23 is formed of a metal material in an annular shape, is respectively provided at both ends of the holding portion body 22 in the longitudinal direction, and has holding portions 23a for holding the holding portion body 22 from the inner peripheral side. As the forming material of the holder 23, one having the same linear expansion coefficient as that of the holder body 22 is preferable. The outer peripheral surface 23b of the holder 23 is formed to have a smaller diameter than the outer peripheral surface 22a of the holder body 22.

In addition, on the outer peripheral surface 23b of each holder 23, grooves 23c extending in the direction around the rotation axis AX1 are formed in pairs except for the mask separation area Ma at intervals in the Y direction, and are formed The configuration is an island formed at a position separated from the mask separation area Ma in the circumferential direction and connected to each other and surrounded by the groove 23c, and becomes a 0-shaped island.

In each groove portion 23c, as shown in FIG. 18, a sealing portion 70 that seals the gap between the holder 23 and the mask M is filled with a protrusion that is substantially the same plane as the outer peripheral surface 22a of the mask holder 20. As the sealing portion 70, for example, an O-ring can be used. The space sealed by the sealing portion 70, that is, the enclosed space surrounded by the holder 23, the mask M, and the sealing portion 70, is suctioned by the suction portion VC under negative pressure. The sealing portion 70 and the suction portion VC constitute a fixing portion that detachably fixes the mask M to the mask holding portion 20.

Furthermore, as shown in FIG. 17, each holder 23 is provided with a shaft-shaped coupling portion (positioning pin) 71 located in the mask separation area Ma, and a shaft-shaped shaft located on the -Y side of the mask M.的系合部(Locating pin)72。 The fastening portion 71 is used when pressing one of the circumferential edges of the mask M to the outer circumferential surface to determine the mask The relative position of M with respect to the circumferential direction of the mask holding portion 20 is projected at a height that is substantially the same plane as the outer circumferential surface of the mask M. An index mark (an index part) FM that serves as an index of the relative positional relationship with the mask M is formed on the top surface of the coupling part 71.

The fastening portion 72 determines the relative position of the mask M with respect to the Y direction (width direction) of the mask holder 20 when pressing one end edge of the -Y side of the mask M to the outer peripheral surface, and The outer peripheral surface of the mask M is projected at a height that is substantially the same plane. The mask M is positioned relative to the mask holding portion 20 by pressing the end edge to both the fastening portions 71 and 72. Furthermore, a mask mark MM is formed on the mask M. For example, the mask mark MM is formed near the end edge pressed to the fastening portion 71, and is formed near the end edge on the opposite side to the end edge. Two, and each has a predetermined positional relationship with the pattern at the same Y position as the fastening portion 71 in design.

The inner tube 21 is formed of cylindrical quartz or the like through which the illumination light can pass, or a cylindrical ceramic material or metal having a slit-like opening 21a through which the illumination light from the illumination unit 10 passes.

Returning to FIG. 16, the rotating body 25 is physically coupled (connected) to the holder body 22 through the holder 23, and has a pressure protruding on the outer peripheral side about the rotation axis AX1 and rotating on the outer peripheral surface of the impression cylinder body 30 Print cylinder installation part 25a. The outer diameter of the impression cylinder installation portion 25a is formed to be larger than the outer diameter formed by the surface of the mask M held on the mask holding surface 22a of the holding portion main body 22 by a predetermined amount. Specifically, when the impression cylinder installation portion 25a abuts against the outer peripheral surface of the impression cylinder body 30 to support the holding portion main body 22 at a predetermined position, the outer diameter of the impression cylinder installation portion 25a is formed to be held in the impression A predetermined amount of distance is formed between the substrate S on the roller body 30 and the mask M.

In addition, the rotating body 25 is rotatably supported in a non-contact manner with respect to the inner cylinder 21 about the rotation axis AX1 through an air bearing 26 on the inner peripheral side. Therefore, the holder main body 22, the holder 23, and the rotor 25 rotate integrally around the rotation axis AX1.

The inner cylinder 21 is placed through the leaf spring 28 with a space left in the Y direction. The base portion B extends on the support stand 27 arranged in the direction of approaching each other. The spring constant of the plate spring 28 is based on the weight of the mask holding portion 20 and the load applied to the impression cylinder body 30 through the rotating body 25, that is, the impression cylinder setting portion 25a of the rotating body 25 is on the outer peripheral surface of the impression cylinder body 30. It is set by the friction force at the time of upward rotation. The above-mentioned illuminating part 10 is arranged in the inner space of the inner tube 21, and an opening 21a through which the illuminating light passes is formed at a position opposite to the emission direction of the illuminating light of the illuminating part 10 (refer to FIG. 16).

The alignment microscopes AL1 and AL2 are used to detect the relative positional relationship between the mask M and the mask holder 20, and are arranged in a way that the mask mark MM of the mask M and the index mark FM of the coupling part 71 can be observed. Mark the same Y position of MM and FM.

The substrate holding unit SU includes an impression cylinder body (substrate holding portion) 30.

The impression cylinder body 30 is formed in a cylindrical shape that rotates around a rotation axis (second axis) AX2 parallel to the Y axis and set on the -Z side of the rotation axis AX1, and has a hollow portion inside and is reduced by the moment of inertia Mode setting. The outer peripheral surface of the impression cylinder body 30 is a substrate holding surface 31 that contacts and holds the substrate S. On both ends of the impression cylinder body 30 in the Y direction, the rotation support portions 32 having a diameter smaller than that of the impression cylinder body 30 and coaxially protruding are supported on the base portion B to be rotatable around the rotation axis AX2. In addition, in this embodiment, a driving device 33 is provided for rotating the impression cylinder body 30 to rotate the impression cylinder body 30 and the mask holder 20 synchronously.

Next, the assembly procedure of the mask unit MU in the substrate processing apparatus 200 having the above-mentioned structure will be described.

First, regarding the photomask M, for example, a short strip-shaped ultra-thin glass plate with good flatness (for example, a thickness of 200 to 500 μm) is formed with a light-shielding layer such as chromium formed with a fine pattern including a line width of 20 μm or less. Transmissive flat sheet masks for circuit patterns and the like for display elements. The mask M is installed with a curvature corresponding to the radius of the outer peripheral surface 22a of the holder body 22 during substrate processing. Therefore, it expands according to the thickness of the mask M and the radius of the outer peripheral surface 22a during installation in the circumferential direction (outer peripheral surface Side), or compressed (inner peripheral surface side). Therefore, with regard to the circumferential direction, the pattern of the mask M becomes the size at the time of installation according to the above thickness and curvature. The pattern is enlarged or reduced relative to the size at the time of formation. Therefore, when the pattern is formed, the pattern is formed with a size that is estimated to include the enlargement or reduction.

The mask M manufactured in the above-mentioned manner is used in a state of being bent imitating the outer peripheral surface 22a of the holding portion main body 22 and wound (attached) on the outer peripheral surface. When the mask M is wound on the outer peripheral surface 22a, one end edge in the circumferential direction of the mask M is pressed to the outer peripheral surface of the fastening portion 71, and one end edge in the width direction of the mask M is pressed to the fastening The portion 72 is wound while the mask M is positioned relative to the mask holding portion 20 (holding portion main body 22). After the mask M is wound, the suction part VC is operated to suction the closed space sealed by the sealing part 70 under negative pressure, whereby the both ends of the mask M in the Y direction are sucked and held. Furthermore, if an air layer is formed between the mask M and the holder body 22 to produce an interface with a large refractive index difference, it may sometimes be exposed to the substrate S due to interference phenomena or multiple reflections. The image quality of the pattern deteriorates, so it is preferable to interpose a liquid such as pure water with the same refractive index as that of the material, or oil used in an oil immersion microscope, between the mask M and the holder body 22, to Suppress the generation of such a large refractive index difference.

In this case, the liquid is preferably one that has sufficient transmittance (for example, 90% or more) in the wavelength band of the illumination light for exposure.

In addition, since this liquid will gradually evaporate from the peripheral edge of the mask M, it is preferable to provide a fastening portion 71, near the periphery of the mask M in the outer peripheral surface 22a of the holder body 22, In the vicinity of 72, for example, a plurality of lyophilic grooves (with a width of about 1 μm) having a depth of several μm to several tens of μm are engraved on a part of the outer circumferential surface 22a, and the outer circumferential surface 22a of the self-holding portion body 22 is preliminarily provided A liquid supply mechanism that occasionally drips liquid from the top through a drop tube or needle-shaped nozzle toward the tank.

If this configuration is set, the liquid dropped into the plurality of grooves is captured during the rotation of the holder body 22 at a practical angular velocity (for example, the peripheral velocity of the pattern surface of the mask M is about 50 to 200 mm/S). In the groove, it can penetrate between the outer peripheral surface 22a of the holder body 22 and the mask M by capillary phenomenon.

Of course, such a plurality of grooves are provided on the outer side of the pattern formation area on the photomask M, so as not to disturb the position of the illuminating light for exposure.

Regarding the mask unit MU holding the mask M, the position information of the pattern is detected in advance before the exposure process. Specifically, while the mask holder 20 is rotated around the rotation axis AX1, the mask mark MM and the index mark FM are respectively detected by the alignment microscopes AL1 and AL2. In this way, the relative positional relationship of the mask M based on the index mark FM, that is, the relative positional relationship of the pattern is measured. By using the relative positional relationship to perform a predetermined calculation, for the pattern formed on the mask M, the position in the direction around the rotation axis AX1, the position in the Y direction, the rotation in the direction along the outer peripheral surface 22a, and Error information of patterns such as magnification with respect to the mask holding portion 20.

Next, the operation of the substrate processing apparatus 200 will be described.

The mask holding portion 20 of the mask M which is supported by the inner tube 21 through the air bearing 26 and holds the mask M in the impression cylinder setting portion 25a of the rotating body 25 gives the impression cylinder body 30 the weight and the same weight of the mask holding portion 20. The leaf spring 28 abuts in a state of a load corresponding to the difference in the force of the +Z side in the spring constant. Thereby, a predetermined amount of distance corresponding to the outer diameter of the impression cylinder installation portion 25a is formed between the mask holding surface 22a and the substrate holding surface 31, that is, between the mask M and the substrate S. Furthermore, when adjusting the load applied by the impression cylinder setting portion 25a to the impression cylinder body 30, it is only necessary to replace it with a leaf spring 28 with a corresponding spring constant, or to insert a plate spring 28 between the inner cylinder 21 and the support table 27 in advance. The plate spring 28 may be installed in the state of the spacer and replaced with a spacer corresponding to the load applied to the impression cylinder body 30 by the impression cylinder installation portion 25a.

Next, the impression cylinder body 30 is driven by the driving device 33 to rotate around the rotation axis AX2, and the illumination light is irradiated from the illuminating unit 10, and the holder body 22 is transmitted through the opening 21a, and the mask M is applied from the inner peripheral side. illumination. Along with the rotation of the impression cylinder body 30, the substrate S wound and held on the substrate holding surface 31 of the impression cylinder body 30 is conveyed, and abuts against the outer periphery of the impression cylinder body 30 at the impression cylinder setting portion 25a The rotating body 25 of the surface is driven to rotate, thereby transmitting the rotational driving force to the holder body 22 through the holder 23, so that the pattern of the mask M held on the holder body 22 will be in contact with the substrate S The distance between the quantifications is kept at a fixed state and moves synchronously. Secondly, the pattern image of the mask M illuminated by the illuminating light is successively projected onto the projection area of the substrate S.

Furthermore, when projecting the pattern of the mask M onto the substrate S, it is preferable to adjust the position of the substrate S in the direction around the axis of rotation AX2, the position in the Y direction, and the impression cylinder based on the error information of the pattern obtained in advance. The relative rotation speed of the body 30 with respect to the mask holding portion 20, the relative positional relationship between the rotation axes AX1 and AX2, and the distance between the mask M and the substrate S.

In this way, in the mask unit MU of the present embodiment, the holder body 22 formed of the glass material holds the mask M formed of the glass material, so that the pattern can be easily formed, and the cost can be suppressed such as directly forming the pattern on The time of the holding part main body 22 may increase the cost. Furthermore, in this embodiment, since the pattern is formed on the mask M which is not a cylindrical surface but a plane, even a pattern with a finer width, such as a pattern with a line width of 20 μm or less, can be formed with high precision.

Furthermore, in this embodiment, when the photomask M is mounted on the photomask holder 20, the photomask M can be easily positioned on the photomask holder 20 by attaching the photomask M to the fastening portions 71 and 72. . Furthermore, in the present embodiment, since the index mark FM is provided in the coupling portion 71, there is no need to separately provide an index mark member, so that the device can be miniaturized and lowered in price. Moreover, in this embodiment, by operating the suction/suction stop by the suction part VC, the mask M can also be replaced easily and quickly.

(Component Manufacturing System)

Next, referring to FIG. 19, a component manufacturing system including the above-mentioned substrate processing apparatus 200 will be described.

FIG. 19 is a diagram showing the structure of a part of the component manufacturing system (flexible display production line) SYS. Here, it means that the flexible substrate P (sheet, film, etc.) drawn out from the supply roll FR1 passes through n processing devices U1, U2, U3, U4, U5...Un in order, and then is wound on the recovery roll FR2.的例。 Examples. The upper control device CONT2 uniformly controls the processing devices U1~Un that constitute the production line.

The component manufacturing system SYS of this embodiment continuously implements the substrate P for manufacturing The so-called roll to roll system of various treatments for one element, the substrate P that has been subjected to various treatments is divided (cut) in units of elements (for example, the display panel of an organic EL display), and becomes plural Elements. The size of the substrate P is, for example, the size in the width direction (the Y direction that becomes the short side) is about 10 cm to 2 m, and the size in the length direction (the X direction that is the long side) is 10 m or more.

In Figure 19, the orthogonal coordinate system XYZ is set as follows: the surface (or back) of the substrate P is set perpendicular to the XZ plane, and the width direction of the substrate P is perpendicular to the conveying direction (long side direction) Set to the Y direction. Furthermore, the substrate P may be modified and activated in advance by a predetermined pretreatment, or may have a fine partition structure (concave-convex structure) formed on the surface for precise patterning.

The substrate P wound on the supply roller FR1 is drawn out by the nipped driving roller DR1 and transported to the processing device U1. The center of the substrate P in the Y direction (width direction) is controlled by the edge position controller EPC1. The target position is controlled by servo in the range of ± tens of μm to tens of μm.

The processing device U1 is to continuously or selectively apply photosensitive functional liquid (photoresist, photosensitive silane coupling material, UV curable resin liquid, etc.) on the surface of the substrate P along the conveying direction (long side direction) of the substrate P by printing. The coating device. In the processing device U1, there are provided: an impression roller DR2, which is wound around the substrate P; a coating mechanism Gp1, which is disposed on the impression roller DR2, and includes a surface for uniformly applying photosensitive on the surface of the substrate P Rollers for coating functional liquids, etc.; and drying mechanism Gp2, which is used to quickly remove the solvent or moisture contained in the photosensitive functional liquid coated on the substrate P; etc.

The processing device U2 is a heating device for heating the substrate P transported from the processing device U1 to a predetermined temperature (for example, a few 10 to 120° C.) to stabilize the photosensitive functional layer coated on the surface. In the processing device U2, there are provided: a plurality of rollers and pneumatic turning rods, which are used for turning back and transporting the substrate P; a heating chamber portion HA1, which is used for heating the transferred substrate P; a cooling chamber portion HA2 , Which is used to make the temperature of the heated substrate P equal to the ambient temperature of the subsequent step (processing device U3) Lower in a consistent manner; and drive roller DR3, which is clamped; etc.

The processing device U3 as the substrate processing device 200 is the exposure device shown in Figs. 16 to 18 above. The circuit for irradiating the photosensitive functional layer of the substrate P (substrate S) conveyed from the processing device U2 and the display Patterned light of ultraviolet rays corresponding to patterns or wiring patterns. In the processing device U3, there is provided: an edge position controller EPC, which controls the center of the substrate P in the Y direction (width direction) at a fixed position; a driving roller DR4, which is clamped; a rotating drum DR5 (impression cylinder body) 30), which partially winds the substrate P with a predetermined tension, and supports the pattern-exposed part of the substrate P in a uniform cylindrical surface; and 2 sets of driving rollers DR6 and DR7, which are used to align the substrate P Give a predetermined relaxation (clearance) DL; etc.

Furthermore, the processing device U3 is provided with: a transmissive cylindrical mask M (mask unit MU); an illuminating mechanism IU (illumination unit 10), which is installed in the cylindrical mask M, and is formed on the cylindrical light The mask pattern on the outer peripheral surface of the mask M is illuminated; and the microscopes AM1 and AM2 are aligned with a part of the substrate P supported by the rotating drum DR5 in a cylindrical shape, in order to make the cylindrical mask M The image of a part of the mask pattern is aligned (aligned) relative to the substrate P, and the alignment mark and the like formed on the substrate P in advance are detected.

The processing device U4 is a wet processing device that performs wet development processing, electroless plating processing, etc., on the photosensitive functional layer of the substrate P conveyed from the processing device U3. In the processing device U4, there are provided: three processing tanks BT1, BT2, BT3, which are equal to the stratification in the Z direction; a plurality of rollers, which bend and transport the substrate P; and a driving roller DR8, which is clamped; Wait.

The processing device U5 is a heating and drying device that warms the substrate P transported from the processing device U4, and adjusts the moisture content of the wetted substrate P in the wet process to a predetermined value, and the details are omitted. After that, the substrate P that has passed through a number of processing devices and passed through the final processing device Un of a series of processes passes through the clamped driving roller DR1 and is wound on the recovery roller FR2. During its winding, the edge position controller EPC2 is also used to sequentially correct and control the relative positions of the drive roller DR1 and the recovery roller FR2 in the Y direction to This prevents the center of the substrate P in the Y direction (width direction) or the substrate end in the Y direction from deviating from the Y direction.

In the above-mentioned component manufacturing system SYS, since the above-mentioned substrate processing apparatus 200 is used as the processing apparatus U3, patterns can be easily formed, and it is possible to suppress the time required for pattern formation in the holder body 22 and increase the cost. , So that high-precision components can be manufactured at low cost.

Furthermore, the processing apparatus U3 shown in FIG. 19 may also be the substrate processing apparatus 100 described in each of the embodiments in FIGS. 1 to 15 above.

Above, the preferred embodiments of the present invention have been described with reference to the accompanying drawings, but of course, the present invention is not limited to the above-mentioned examples. The shapes or combinations of the constituent members shown in the above examples are just an example, and various changes can be made in accordance with design requirements and the like without departing from the spirit of the present invention.

For example, in the above-mentioned embodiment, the mask M is wound (attached) to the outer peripheral surface 22a of the holder body 22, but it is not limited to this. As shown in FIG. 20, it may be attached. The structure of the inner peripheral surface of the main body 22 of the holding part. In this case, the following configuration may be adopted: the illuminating unit 10 is arranged on the outer side of the mask unit MU, and the circumferential length of the mask M is set to be less than half of the circumferential length of the inner circumferential surface of the holder body 22, and The light from the mask pattern illuminated by the illuminating light of the illuminating part 10 is emitted from the side opposite to the incident position of the illuminating light of the holding part body 22; or the reflector part provided on the inner tube 21 makes the light from the mask pattern The light is reflected in the direction in which the rotation axis AX1 extends and is guided to the outside of the mask unit MU.

In addition, in the above-mentioned embodiment, the sealing portion 70 and the suction portion VC are used as the structure of the fixing portion for fixing the mask M to the mask holding portion 20, but it is not limited to this. For example, it may be The mask M is fixed to the mask holding portion 20 using an adhesive, or the mask M is clamped and fixed to the mask holding portion 20 by a mechanical clamp mechanism for fixing.

In addition, the photomask M may be adsorbed on the mask M by electrostatic adsorption (Coulomb force) The structure on the mask holding portion 20.

Even when the photomask M is attached to the inner peripheral surface of the holder body 22 as described above, if an air layer appears between the inner peripheral surface of the holder body 22 and the photomask M, it is exposed to the substrate S The image quality of the pattern is also more likely to be degraded. Therefore, it is more desirable to have a predetermined thickness between the inner peripheral surface of the holder body 22 and the mask M in the same manner as in the above embodiment. The layer method is filled with a liquid having the same refractive index as the base material of the mask M (transparent thin plate such as glass).

(Eighth Embodiment)

Hereinafter, referring to FIGS. 21 to 24, a substrate processing apparatus according to an eighth embodiment of the present invention will be described.

In the following description, the same constituent elements may be denoted with the same reference numerals, and the description may be simplified or omitted. In addition, unless otherwise specified, the description of the constituent elements or the like shall be the same as in the above-mentioned embodiment.

FIG. 21 is a front cross-sectional view of the main part of the substrate processing apparatus 300, and FIG. 22 is a cross-sectional perspective view of the substrate processing apparatus.

The substrate processing apparatus 300 exposes the pattern of the flexible sheet-shaped mask M with respect to the strip-shaped substrate (for example, strip-shaped film member) S, and uses the illuminating unit 10 and the mask unit MU2 , The substrate holding unit SU and the control unit CONT are constituted as a main body.

Furthermore, in this embodiment, the vertical direction is set to the Z direction, the direction parallel to the rotation axis of the mask unit MU2 and the substrate holding unit SU is set to the Y direction, and the direction perpendicular to the Z direction and the Y direction The direction will be described as the X direction.

The illuminating unit 10 irradiates the illuminating light toward the illuminating area of the mask M wound on the mask holding portion 20 (described below) in the mask unit MU2, and can be used as a fluorescent lamp in a straight tube shape and Those that emit illuminating light for exposure radially, or those that introduce illuminating light from both ends of a cylindrical quartz rod and are provided with a diffusion member on the back side, and are accommodated in the inner tube 21 of the support mask holder 20 Inside the internal space.

The mask unit MU2 includes a mask holding portion 20, a leaf spring (elastic member) 24, and Rotating body (support member) 25. The mask holding portion 20 includes a cylindrical holding portion main body (pattern holding member) 22 and holders (annular portions) 23 respectively provided at both ends of the holding portion main body 22 in the longitudinal direction. The holder body 22, the holder 23, the leaf spring 24, and the rotating body 25 are arranged in an integrated state, and are respectively formed to communicate in the direction of the rotation axis (the predetermined axis) AX1 for the inner cylinder 21 to penetrate The through hole.

The inner tube 21 is formed of cylindrical quartz or the like through which the illumination light can pass, or a cylindrical ceramic material or metal having a slit-like opening 21a through which the illumination light from the illumination unit 10 passes. The holder main body 22 is formed with a mask holding surface 22a that holds the mask M along a cylindrical surface of a predetermined radius on its outer peripheral surface. The holder 23 is formed of a metal material in an annular shape. As shown in FIG. 23, it is bonded to the outer peripheral surface of the end portion of the holder body 22 by an adhesive 23a that exhibits elastic bonding performance after curing. The material of the holder 23 is preferably one having the same coefficient of linear expansion as that of the holder body 22, but when there is a difference in the coefficient of linear expansion, the holder 23 with a larger coefficient of linear expansion is held from the outer peripheral side The holding portion main body 22 is constructed so as not to apply a large load to the holding portion main body 22 due to the difference in thermal expansion between the holding portion main body 22 and the holder 23.

The rotating body 25 is physically coupled (connected) to the holder body 22 through the leaf spring 24, spacers 24A, 24B (refer to FIGS. 23 and 24), and has a protrusion protruding on the outer peripheral side around the rotation axis AX1 and on the impression cylinder An impression cylinder setting portion 25a that rotates on the outer peripheral surface of the body 30. The outer diameter of the impression cylinder setting portion 25a is formed to be larger than the outer diameter formed by the surface of the mask M held on the mask holding surface 22a of the holding portion main body 22 by a predetermined amount. Specifically, when the impression cylinder installation portion 25a abuts against the outer peripheral surface of the impression cylinder body 30 to support the holding portion main body 22 at a predetermined position, the outer diameter of the impression cylinder installation portion 25a is formed to be held in the press A predetermined amount of distance is formed between the substrate S on the printing cylinder body 30 and the photomask M.

In addition, the rotating body 25 is rotatably supported with respect to the inner cylinder 21 about the rotation axis AX1 in a non-contact manner through the air bearing 26 on the inner peripheral side. Therefore, the holder main body 22, the holder 23, the leaf spring 24, and the rotating body 25 integrally rotate about the rotation axis AX1.

The leaf spring 24 is one that allows expansion and contraction of the rotation axis AX1 of the holding portion main body 22, and as shown in FIG. 24, it is formed into a ring shape (circular ring shape) from, for example, steel. As shown in FIG. 23, the leaf spring 24 is fixed to the rotating body 25 by leaving a predetermined amount of gap in the Y direction through the spacer 24A. Similarly, the leaf spring 24 is fixed to the holder 23 by leaving a predetermined amount of gap in the Y direction through the spacer 24B. There are three spacers 24A at approximately the same distance from the rotation axis AX1 at equal intervals around the rotation axis AX1. The spacer 24B is located at a position where the distance from the rotation axis AX1 is greater than that of the spacer 24A, and three spacers 24B are arranged at equal intervals so that the position around the rotation axis AX1 is between the spacers 24A.

The leaf springs 24 and the spacers 24A, 24B serve as transmission parts, and the rotational driving force is transmitted between the connected holder 23, the holding part main body 22, and the rotating body 25, so as to pass through the leaf springs 24, the spacers 24A, 24B The connected holder 23, the holder body 22, and the rotating body 25 have a structure that rotates integrally in the direction around the rotation axis AX1, and elastically deforms in the direction of the rotation axis AX1 by the leaf spring 24 as the expansion and contraction allowable portion. The relatively small movement of the holder 23, the holder body 22, and the rotating body 25 can be realized.

The ring-shaped leaf spring 24 shown in FIG. 24 has the structure shown in FIG. 25 in detail. On one surface of the leaf spring 24, three spacers 24A are fixed and arranged at about 120 degrees with the axis of rotation AX1 as the center. On the other surface of the leaf spring 24, three spacers 24B are fixed at approximately 120 degrees with the rotation axis AX1 as the center, and are fixed at ±60 degrees with respect to the spacer 24A on the front side. In addition, the thicknesses of the spacers 24A and 24B are set to be the same, and the dimensions in the circumferential direction are set to be as small as possible.

The three spacers 24A fasten the end surface of the ring-shaped rotating body 25 and the leaf spring 24 by screws, and the three spacers 24B fasten the end surface of the ring-shaped holder 23 and the leaf spring 24 by screws.

In this embodiment, the expansion and contraction allowable portion is constructed with such a structure. In addition, as shown in FIG. 26, it may be prepared to be elastic in the Y direction (the direction in which the axis AX1 extends) and the diameter direction R of the ring-shaped retainer 23. Deformed and extremely rigid metallic flexural structure FLX in the tangential direction T of the holder 23. With the flexural structure FLX, 3 locations (arranged at 120 degrees with the axis of rotation AX1 as the center) The holder 23 and the rotating body 25 are fastened.

If the flexural structure FLX shown in FIG. 26 is one, the rigidity in the radial direction R is extremely low. However, if the flexural structure FLX is arranged equidistantly from the axis AX1 at three locations around the axis AX1 at 120 degrees, each flexure structure FLX The degree of freedom of deformation in the diameter direction R is mutually restricted, so that the holder 23 and the rotating body 25 are fastened with higher rigidity in the XZ plane orthogonal to the rotation axis AX1, and can be elastic in the Y direction extending in the rotation axis AX1 Displacedly fastened.

The inner cylinder 21 is placed on a support base 27 extending in the direction of approaching each other from the base portion B provided with a gap in the Y direction through the leaf spring 28. The spring constant of the plate spring 28 is based on the weight of the mask holding portion 20 and the load applied to the impression cylinder body 30 through the rotating body 25, that is, the impression cylinder setting portion 25a of the rotating body 25 is on the outer peripheral surface of the impression cylinder body 30. It is set by the friction force at the time of upward rotation. The above-mentioned illuminating part 10 is arranged in the inner space of the inner tube 21, and an opening 21a for illuminating light to pass is formed at a position opposite to the emission direction of the illuminating light of the illuminating part 10 (refer to FIGS. 21 and 22).

The substrate holding unit SU includes an impression cylinder body (rotating cylinder) 30.

The impression cylinder body 30 is formed in a cylindrical shape that rotates around a rotation axis (second axis) AX2 parallel to the Y axis and set on the -Z side of the rotation axis AX1. As shown in FIG. 22, a hollow portion 30a is provided inside And set it in such a way that the moment of inertia becomes smaller. The outer peripheral surface of the impression cylinder body 30 is a substrate holding surface 31 that contacts and holds the substrate S. On both end surfaces of the impression cylinder body 30 in the Y direction, the rotation support portion 32 having a diameter smaller than that of the impression cylinder body 30 and coaxially protruding is supported on the base portion B to be rotatable around the rotation axis AX2. In addition, in this embodiment, a driving device 33 is provided for rotating the impression cylinder body 30 to rotate the impression cylinder body 30 and the mask holder 20 synchronously.

Next, the operation of the substrate processing apparatus 300 configured as described above will be described.

The mask holding portion 20 of the mask M which is supported by the inner tube 21 through the air bearing 26 and holds the mask M at the impression cylinder setting portion 25a of the rotating body 25 gives the impression cylinder body 30 its own weight and a through plate of the mask holding portion 20 The spring 28 abuts in a state of a load corresponding to the difference in the force of the +Z side. With this, Yu Guang A predetermined amount of space is formed between the mask holding surface 22a and the substrate holding surface 31, that is, between the mask M and the substrate S, which corresponds to the outer diameter of the impression cylinder installation portion 25a. Furthermore, when adjusting the load applied by the impression cylinder setting portion 25a to the impression cylinder body 30, it is only necessary to replace it with a leaf spring 28 with a corresponding spring constant, or to insert a plate spring 28 between the inner cylinder 21 and the support table 27 in advance. The plate spring 28 may be installed in the state of the spacer and replaced with a spacer corresponding to the load applied to the impression cylinder body 30 by the impression cylinder installation portion 25a.

Next, the impression cylinder body 30 is driven by the driving device 33 to rotate around the rotation axis AX2, and the illumination light is irradiated from the illuminating unit 10, and the holder body 22 is transmitted through the opening 21a, and the mask M is applied from the inner peripheral side. illumination. Along with the rotation of the impression cylinder body 30, the substrate S wound and held on the substrate holding surface 31 of the impression cylinder body 30 is conveyed, and abuts against the outer periphery of the impression cylinder body 30 at the impression cylinder setting portion 25a The rotating body 25 of the surface is driven to rotate, thereby transmitting the rotational driving force to the holder 23 and the holder body 22 through the leaf spring 24 and the spacers 24A, 24B, thereby holding the pattern of the mask M on the holder body 22 It moves synchronously while maintaining the predetermined distance between the substrate S and the substrate S at a fixed amount. Secondly, the pattern image of the mask M illuminated by the illuminating light is successively projected onto the projection area of the substrate S.

At this time, in the mask holding portion 20 and the impression cylinder body 30, in order to make the peripheral speed the same at the position (diameter) where the impression cylinder setting portion 25a and the substrate holding surface 31 abut, and to make the mask M The relative moving speed of the substrate S is the same. The position (diameter) of the outer peripheral surface of the mask M and the position (diameter) of the outer peripheral surface of the substrate S are based on the thickness of the mask M and the substrate S, and the mask of the holder body 22 in advance. The ratio of the diameter of the holding surface 22a to the diameter of the substrate holding surface 31 of the impression cylinder body 30 is adjusted. For example, the thickness of the mask M and the substrate S are the same, and the diameter of the mask holding surface 22a and the diameter of the substrate holding surface 31 of the impression cylinder body 30 are the same, and the holding portion main body 22 and the impression cylinder body 30 have the same angular velocity In the case of rotation, the distance from the position where the impression cylinder setting portion 25a abuts the substrate holding surface 31 to the outer peripheral surface of the mask M, and the position where the impression cylinder setting portion 25a abuts the substrate holding surface 31 The distance to the position of the outer peripheral surface of the substrate S may be the same. In other cases, it is preferable that the peripheral speed of the outer peripheral surface of the mask M is the same as the peripheral speed of the outer peripheral surface of the substrate S, and the holding portion main body 22 and the impression cylinder body 30 For each of them, the diameter of the contact position between the impression cylinder installation portion 25a and the substrate holding surface 31 is set.

Therefore, referring to FIG. 27, an example in which the peripheral speed of the outer peripheral surface of the mask M and the peripheral speed of the outer peripheral surface of the substrate S are the same will be described. FIG. 27 is a modification of the diameter adjustment method of the shims described in FIG. 11 above, and the same components as those in FIG. 23 are marked with the same symbols. The deformed part is as follows: As shown in FIG. 27, a ring-shaped shim (metallic tape of a predetermined thickness) 31B is wound around the portion of the substrate holding surface 31 that is in contact with the impression cylinder installation portion 25a. When viewed in the YZ plane of the figure, the contact position between the outer circumferential surface of the impression cylinder setting portion 25a and the outer circumferential surface of the shim (metallic belt of predetermined thickness) 31B is set as the mask M and the substrate The position between S and G is approximately the middle position Cx.

The position Cx is set to r11+Mt+G/2 as the radius of the self-rotating axis AX1 of the mask M, and is also set to r2+St+G/2 as the radius of the self-rotating axis AX2 of the impression cylinder 30的的位置。 The location.

The shim 31B is selected (prepared) with a thickness that satisfies this condition, and is wound on the outer peripheral surface of the substrate holding surface 31, but when its thickness can be fixed, it is only necessary to press the substrate holding surface 31 and the thickness The diameter of the abutting portion of the printing cylinder setting portion 25a may be processed to be r2+St+G/2. In addition, when the shim 31B can be wound interchangeably, according to the change of the thickness St of the substrate S or the size of the pitch G, the shim 31B of the best thickness can be attached.

In addition, if the above-mentioned exposure processing is continuously performed, thermal expansion occurs in the holding portion main body 22 illuminated by the illumination light. Regarding the thermal expansion in the diameter direction of the holder body 22, since the holder 23 holding the holder body 22 from the outer peripheral side is formed of a metal material and has a coefficient of linear expansion greater than that of the holder body 22, thermal expansion is allowed without restricting the holding The main body 22 can avoid applying a large load to the main body 22 of the holding portion. In addition, at this time, although the holder main body 22 and the holder 23 are thermally expanded in the separating direction, since the adhesive 23a has elastic bonding performance, the holder 23 can also prevent the holder main body 22 from loosening.

Furthermore, when the coefficient of linear expansion of the holder 23 is smaller than the coefficient of linear expansion of the holder body 22, it is preferable to select a structure in which the holder 23 holds the holder body 22 from the inner peripheral side, but even if it is performed from the outer peripheral side The holding structure can also be elastically deformed by the above-mentioned adhesive 23a, so as to alleviate the load applied to the holding portion main body 22 during thermal expansion.

In addition, when the holding portion main body 22 thermally expands along the direction of the rotation axis AX1, the leaf spring 24 takes the part fixed by the spacer 24A as the base point, and makes the part fixed by the spacer 24B along the direction toward the rotating body 25 Elastic deformation in the direction. In this way, due to the elastic deformation of the leaf spring 24, the thermal expansion of the holding portion main body 22 is allowed, so that a large load in the direction of the rotation axis AX1 is prevented from being applied to the holding portion main body 22.

As described above, in this embodiment, in the diameter direction, the adhesive 23a with elastic adhesive performance is interposed between the holder body 22 and the holder 23, and the leaf spring 24 is elastically deformed in the direction of the rotation axis AX1 , Thereby allowing thermal expansion due to temperature changes. Therefore, in the present embodiment, the load applied to the holding portion main body 22 due to thermal expansion is alleviated, so that deformation of the holding portion main body 22 due to the applied load can be suppressed, and the patterning of the opposing substrate S can be suppressed. Circumstances causing adverse effects.

In the device manufacturing system SYS shown in FIG. 19, the above-mentioned substrate processing apparatus 300 can be used as the processing apparatus U3. Therefore, the adverse effect caused by the pattern formation of the counter substrate S due to temperature changes can be reduced, and the manufacturing can be made with high precision. Elements that form patterns.

Above, the preferred embodiments of the present invention have been described with reference to the accompanying drawings, but of course, the present invention is not limited to the above-mentioned examples. The shapes or combinations of the constituent members shown in the above examples are just an example, and various changes can be made in accordance with design requirements and the like without departing from the spirit of the present invention.

For example, in the above-mentioned embodiment, the configuration of the mask M holding the patterned sheet on the outer peripheral surface of the holding portion main body 22 is provided, but it is not limited to this, and the holding portion main body 22 (transparent Cylindrical material) The outer peripheral surface directly forms the structure of the mask pattern.

In addition, it is also possible to provide a configuration in which the mask M is not held on the outer peripheral surface of the holding portion main body 22 but is held on the inner peripheral surface of the holding portion main body 22. Furthermore, the holding part main body 22 may not be cylindrical but a cylindrical shape, and the illuminating part 10 may irradiate the illuminating light to the mask M held on the outer peripheral surface from the outer peripheral side.

In addition, in the above-mentioned embodiment, the rotating body 25 and the impression cylinder body 30 rotate (rotate by frictional contact) to rotate the holder main body 22 (mask M), but it is not limited. Here, the present invention can be applied even if the holding portion main body 22 (mask M) is independently rotated by a driving device such as a motor.

In this case, the impression cylinder setting portion 25a of the rotating body 25 is omitted, and the rotating bodies 25 on both sides are rotatably pivotally supported on the inner cylinder 21 provided on the main body of the exposure apparatus through the air bearing 26, and are connected to the motor. Rotor and other combination. The rotational driving force of the motor is transmitted to the holder main body 22 (mask M) through the rotating body 25, the leaf spring 24, and the holder 23.

Even in the case of such a configuration, in the direction of the rotation axis AX1, the leaf spring 24 can be elastically deformed to allow the thermal expansion of the holder body 22 (mask M) due to temperature changes, thereby alleviating the holding The portion main body 22 generates unnecessary stress, and the deformation and the like of the holding portion main body 22 can be suppressed.

10‧‧‧Lighting Department

20‧‧‧Mask holding part

21‧‧‧Inner cylinder

21a‧‧‧Opening

22‧‧‧Main body of holding part (pattern holding member)

22a‧‧‧Mask holding surface (outer peripheral surface, peripheral surface)

23‧‧‧Retainer (ring part)

25‧‧‧Rotating body (spacing forming part, supporting member)

25a‧‧‧Impression Cylinder Setting Section

26‧‧‧Air bearing

27‧‧‧Support

28‧‧‧Leaf spring (expandable absorption part, elastic member)

30‧‧‧Impression cylinder body (substrate holding part, surrounding holding part, rotating cylinder)

31‧‧‧Substrate holding surface

32‧‧‧Rotating support part

33‧‧‧Drive device

100‧‧‧Substrate processing equipment

AX1‧‧‧Rotation axis (established axis)

AX2‧‧‧Rotation axis (2nd axis)

S‧‧‧Substrate

B‧‧‧Base

M‧‧‧Mask

MU‧‧‧Mask unit

SU‧‧‧Substrate holding unit

AL1, AL2‧‧‧Align the microscope

X, Y, Z‧‧‧direction

Claims (14)

An exposure device that exposes a pattern of a photomask to a long sheet substrate, and is provided with a photomask support mechanism that supports a photomask unit to be rotatable about a first axis, and the photomask unit is formed of a cylindrical The mask holding part is composed of a mask holding part, a fastening part, and a fixing part. The mask holding part has an outer peripheral surface at a fixed radius from the first axis. The fastening part is used to hold the sheet mask along the photomask. The outer peripheral surface of the part is wound at a predetermined position on the outer peripheral surface, and the sheet mask is formed to be exposed to a shape that can be bent into a cylindrical shape with the same radius as the outer peripheral surface. The thickness of the mask pattern of the glass material, the fixing part fixes the sheet mask to the mask holding part; and the substrate holding mechanism, which holds the sheet substrate to be exposed to the mask pattern of the sheet mask , And the sheet substrate is moved in one direction according to the rotation of the mask unit. The exposure apparatus according to item 1, further comprising a distance between the sheet mask wound around the mask holding portion and the sheet substrate held by the substrate holding mechanism at a predetermined distance Formation department. The exposure apparatus according to item 2, wherein the substrate holding mechanism includes a second axis that is approximately parallel to the first axis of the photomask unit as an outer peripheral surface with a fixed radius to make the sheet substrate in a longitudinal direction A part of the rotating drum is bent to support and can rotate around the second axis; the sheet substrate is moved in a direction substantially orthogonal to the second axis by the rotation of the rotating drum. The exposure apparatus according to Item 3, wherein, in the case where the mask pattern formed on the sheet mask is of a transmission type capable of transmitting illumination light for exposure, the mask holding portion forms an inner space The method is configured as a hollow; and further equipped with the internal space arranged in the mask holding portion, and elongated slit-shaped illumination light in the direction of the first axis is directed toward the mask from the inner peripheral side of the mask holding portion The illuminating part irradiated by the pattern, and the end portion side extending from one of the directions of the first axis of the mask unit, and supporting the illuminating part The fixed rod. The exposure apparatus according to Item 4, further comprising a temperature adjustment device that uses a temperature adjustment medium for suppressing the temperature rise of the illuminating part to pass through the fixed rod and circulate. The exposure apparatus according to item 4 or 5, further comprising: the sheet mask that is supported by the fixing rod and measures the outer peripheral surface of the mask holding portion of the mask unit and the sheet mask The measuring part of the distance between the sheet substrates supported on the outer peripheral surface of the rotating cylinder. The exposure apparatus according to item 6, wherein the pitch forming portion has at least one of the mask unit and the rotating cylinder on the outer peripheral surface of the mask holding portion according to the pitch amount measured by the measuring portion Displacement part displaced in the first direction where the outer peripheral surface of the rotating cylinder is separated or approached. The exposure apparatus according to item 7, wherein the displacement portion includes a driving portion that drives at least one of the photomask unit and the rotating drum in the first direction. The exposure apparatus according to any one of items 1 to 5, wherein the fixing portion of the mask unit is configured to fix the sheet mask so as to be detachably attachable to the mask holding portion. The exposure apparatus according to item 9, wherein the fixing portion of the photomask unit includes a sealing portion that seals the gap between the outer peripheral surface of the photomask holding portion and the sheet photomask, and the sealing portion The space enclosed by the part is the suction part for negative pressure suction. The exposure apparatus according to any one of items 1 to 5, wherein the mask holding portion of the mask unit is formed with an index mark that will be an index of the relative positional relationship with the sheet mask. The exposure apparatus according to any one of items 1 to 5, wherein the formation of the coupling portion in the mask unit will be an index of the relative positional relationship with the sheet mask The indicator mark. The exposure apparatus according to any one of items 1 to 5, wherein the mask pattern formed on the sheet mask includes a pattern with a line width of 20 μm or less. The exposure apparatus according to any one of items 1 to 5, wherein the thickness of the glass material constituting the sheet mask is set to 200 to 500 μm.

Images