TW201336921A - 基於去二水己糖醇（ｉｓｏｈｅｘｉｄｅｄｉｏｌ）二縮水甘油醚之電絕緣樹脂 - Google Patents
基於去二水己糖醇（ｉｓｏｈｅｘｉｄｅｄｉｏｌ）二縮水甘油醚之電絕緣樹脂 Download PDFInfo
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- TW201336921A TW201336921A TW102105068A TW102105068A TW201336921A TW 201336921 A TW201336921 A TW 201336921A TW 102105068 A TW102105068 A TW 102105068A TW 102105068 A TW102105068 A TW 102105068A TW 201336921 A TW201336921 A TW 201336921A
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- Prior art keywords
- insulating resin
- electrically insulating
- resin according
- diglycidyl ether
- patent application
- Prior art date
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- 229920005989 resin Polymers 0.000 title claims abstract description 52
- 239000011347 resin Substances 0.000 title claims abstract description 52
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 title claims abstract description 40
- 239000004848 polyfunctional curative Substances 0.000 claims abstract description 28
- 239000000945 filler Substances 0.000 claims abstract description 15
- 239000000654 additive Substances 0.000 claims abstract description 6
- KLDXJTOLSGUMSJ-UNTFVMJOSA-N (3s,3ar,6s,6ar)-2,3,3a,5,6,6a-hexahydrofuro[3,2-b]furan-3,6-diol Chemical compound O[C@H]1CO[C@@H]2[C@@H](O)CO[C@@H]21 KLDXJTOLSGUMSJ-UNTFVMJOSA-N 0.000 claims abstract description 5
- 239000000203 mixture Substances 0.000 claims description 16
- 150000008064 anhydrides Chemical class 0.000 claims description 8
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 claims description 7
- 239000002841 Lewis acid Substances 0.000 claims description 6
- 150000007517 lewis acids Chemical class 0.000 claims description 6
- 239000010459 dolomite Substances 0.000 claims description 5
- 229910000514 dolomite Inorganic materials 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- 239000012212 insulator Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 238000004806 packaging method and process Methods 0.000 claims description 4
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 3
- 230000000996 additive effect Effects 0.000 claims description 3
- 229910052796 boron Inorganic materials 0.000 claims description 3
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- 239000010455 vermiculite Substances 0.000 claims description 3
- 229910052902 vermiculite Inorganic materials 0.000 claims description 3
- 235000019354 vermiculite Nutrition 0.000 claims description 3
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 2
- 150000001991 dicarboxylic acids Chemical class 0.000 claims description 2
- 238000010292 electrical insulation Methods 0.000 claims description 2
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 2
- 239000000347 magnesium hydroxide Substances 0.000 claims description 2
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 2
- 239000010453 quartz Substances 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- JEBWAOITKHXCBF-BEAPMJEYSA-N (3s,3ar,6r,6ar)-3,6-bis(oxiran-2-ylmethoxy)-2,3,3a,5,6,6a-hexahydrofuro[3,2-b]furan Chemical compound O([C@@H]1[C@H]2OC[C@H]([C@H]2OC1)OCC1OC1)CC1CO1 JEBWAOITKHXCBF-BEAPMJEYSA-N 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 description 14
- 229920000647 polyepoxide Polymers 0.000 description 14
- 238000001723 curing Methods 0.000 description 9
- 238000009472 formulation Methods 0.000 description 9
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 8
- 238000002474 experimental method Methods 0.000 description 8
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 8
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 6
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 4
- 150000001412 amines Chemical class 0.000 description 4
- 238000005266 casting Methods 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- FBPFZTCFMRRESA-UHFFFAOYSA-N hexane-1,2,3,4,5,6-hexol Chemical class OCC(O)C(O)C(O)C(O)CO FBPFZTCFMRRESA-UHFFFAOYSA-N 0.000 description 4
- 229920000768 polyamine Polymers 0.000 description 4
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 3
- 229910015900 BF3 Inorganic materials 0.000 description 3
- FBPFZTCFMRRESA-ZXXMMSQZSA-N D-iditol Chemical class OC[C@@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-ZXXMMSQZSA-N 0.000 description 3
- SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical compound CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000003085 diluting agent Substances 0.000 description 3
- 238000005470 impregnation Methods 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- FAQYAMRNWDIXMY-UHFFFAOYSA-N trichloroborane Chemical compound ClB(Cl)Cl FAQYAMRNWDIXMY-UHFFFAOYSA-N 0.000 description 3
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- FBPFZTCFMRRESA-KVTDHHQDSA-N D-Mannitol Chemical class OC[C@@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-KVTDHHQDSA-N 0.000 description 2
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical class OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011353 cycloaliphatic epoxy resin Substances 0.000 description 2
- 150000004985 diamines Chemical class 0.000 description 2
- 150000002118 epoxides Chemical class 0.000 description 2
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- SAJGCUXAHBJVRH-VFQQELCFSA-N (2r,3r,4r,5s)-hexane-1,2,3,4,5,6-hexol;hydrate Chemical compound O.OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO SAJGCUXAHBJVRH-VFQQELCFSA-N 0.000 description 1
- JNYAEWCLZODPBN-JGWLITMVSA-N (2r,3r,4s)-2-[(1r)-1,2-dihydroxyethyl]oxolane-3,4-diol Chemical class OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O JNYAEWCLZODPBN-JGWLITMVSA-N 0.000 description 1
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 1
- VMSIYTPWZLSMOH-UHFFFAOYSA-N 2-(dodecoxymethyl)oxirane Chemical compound CCCCCCCCCCCCOCC1CO1 VMSIYTPWZLSMOH-UHFFFAOYSA-N 0.000 description 1
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- CUFXMPWHOWYNSO-UHFFFAOYSA-N 2-[(4-methylphenoxy)methyl]oxirane Chemical compound C1=CC(C)=CC=C1OCC1OC1 CUFXMPWHOWYNSO-UHFFFAOYSA-N 0.000 description 1
- HPILSDOMLLYBQF-UHFFFAOYSA-N 2-[1-(oxiran-2-ylmethoxy)butoxymethyl]oxirane Chemical compound C1OC1COC(CCC)OCC1CO1 HPILSDOMLLYBQF-UHFFFAOYSA-N 0.000 description 1
- HSDVRWZKEDRBAG-UHFFFAOYSA-N 2-[1-(oxiran-2-ylmethoxy)hexoxymethyl]oxirane Chemical compound C1OC1COC(CCCCC)OCC1CO1 HSDVRWZKEDRBAG-UHFFFAOYSA-N 0.000 description 1
- DNIDAYOSPDNUKP-UHFFFAOYSA-N 3-(2-phenylethenyl)benzene-1,2-diamine Chemical compound NC1=CC=CC(C=CC=2C=CC=CC=2)=C1N DNIDAYOSPDNUKP-UHFFFAOYSA-N 0.000 description 1
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 1
- YAXXOCZAXKLLCV-UHFFFAOYSA-N 3-dodecyloxolane-2,5-dione Chemical compound CCCCCCCCCCCCC1CC(=O)OC1=O YAXXOCZAXKLLCV-UHFFFAOYSA-N 0.000 description 1
- IGSBHTZEJMPDSZ-UHFFFAOYSA-N 4-[(4-amino-3-methylcyclohexyl)methyl]-2-methylcyclohexan-1-amine Chemical compound C1CC(N)C(C)CC1CC1CC(C)C(N)CC1 IGSBHTZEJMPDSZ-UHFFFAOYSA-N 0.000 description 1
- YXALYBMHAYZKAP-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethyl 7-oxabicyclo[4.1.0]heptane-4-carboxylate Chemical compound C1CC2OC2CC1C(=O)OCC1CC2OC2CC1 YXALYBMHAYZKAP-UHFFFAOYSA-N 0.000 description 1
- GYHQGJNGNWUDKS-UHFFFAOYSA-N CC1(C(=O)OC(C2(CCCO2)C)=O)CCCO1 Chemical compound CC1(C(=O)OC(C2(CCCO2)C)=O)CCCO1 GYHQGJNGNWUDKS-UHFFFAOYSA-N 0.000 description 1
- YZCKVEUIGOORGS-OUBTZVSYSA-N Deuterium Chemical compound [2H] YZCKVEUIGOORGS-OUBTZVSYSA-N 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- -1 Epoxide compounds Chemical class 0.000 description 1
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- DJUWPHRCMMMSCV-UHFFFAOYSA-N bis(7-oxabicyclo[4.1.0]heptan-4-ylmethyl) hexanedioate Chemical compound C1CC2OC2CC1COC(=O)CCCCC(=O)OCC1CC2OC2CC1 DJUWPHRCMMMSCV-UHFFFAOYSA-N 0.000 description 1
- XUCHXOAWJMEFLF-UHFFFAOYSA-N bisphenol F diglycidyl ether Chemical compound C1OC1COC(C=C1)=CC=C1CC(C=C1)=CC=C1OCC1CO1 XUCHXOAWJMEFLF-UHFFFAOYSA-N 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- DDTBPAQBQHZRDW-UHFFFAOYSA-N cyclododecane Chemical compound C1CCCCCCCCCCC1 DDTBPAQBQHZRDW-UHFFFAOYSA-N 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 229910052805 deuterium Inorganic materials 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000004870 electrical engineering Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000008103 glucose Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 235000010299 hexamethylene tetramine Nutrition 0.000 description 1
- 239000004312 hexamethylene tetramine Substances 0.000 description 1
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 1
- 239000008240 homogeneous mixture Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- UQKAOOAFEFCDGT-UHFFFAOYSA-N n,n-dimethyloctan-1-amine Chemical compound CCCCCCCCN(C)C UQKAOOAFEFCDGT-UHFFFAOYSA-N 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920002098 polyfluorene Polymers 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 230000001235 sensitizing effect Effects 0.000 description 1
- 229960002920 sorbitol Drugs 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0025—Crosslinking or vulcanising agents; including accelerators
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/55—Boron-containing compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/06—Insulating conductors or cables
- H01B13/16—Insulating conductors or cables by passing through or dipping in a liquid bath; by spraying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/06—Insulating conductors or cables
- H01B13/16—Insulating conductors or cables by passing through or dipping in a liquid bath; by spraying
- H01B13/165—Insulating conductors or cables by passing through or dipping in a liquid bath; by spraying by spraying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B19/00—Apparatus or processes specially adapted for manufacturing insulators or insulating bodies
- H01B19/02—Drying; Impregnating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B19/00—Apparatus or processes specially adapted for manufacturing insulators or insulating bodies
- H01B19/04—Treating the surfaces, e.g. applying coatings
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Abstract
一種電絕緣樹脂，包括A）去二水己糖醇（isohexidediol）二縮水甘油醚，B）硬化劑，C）視情況填料，D）進一步視情況添加劑。去二水己糖醇二縮水甘油醚較好為1,4：3,6-去二水山梨醇（isosorbide）二縮水甘油醚、1,4：3,6-去二水甘露糖醇（isomannide）二縮水甘油醚或1,4：3,6-去二水艾杜糖醇（isoidide）二縮水甘油醚。
Description
本發明有關一種基於去二水己糖醇(isohexidediol)二縮水甘油醚之電絕緣樹脂及其等用途。
已知且已經常敘述基於環氧樹脂之電絕緣樹脂。
DE 4 206 733敘述基於雙酚A二縮水甘油醚及雙酚F二縮水甘油醚之電氣封裝化合物。此等封裝化合物包括白雲石作為填料及甲基四氫酞酸酐作為硬化劑。實現固化係於80℃至100℃，後固化在130℃至140℃於2至4小時期間。
DE 4 139 877及EP 545 506敘述環脂族環氧樹脂。此等樹脂為3,4-環氧基環己基羧酸3,4-環氧基環己基甲酯及雙(3,4-環氧基環己基甲基)己二酸酯。使用白雲石作為填料及使用四氫酞酸酐作為硬化劑。
CH 424 256敘述基於環十二烷三環氧化物之可固化澆鑄樹脂混合物，以酞酸酐或4,4’-二胺基-3,3’-二甲基二環己基甲烷作為硬化劑。
基礎環氧樹脂亦可被改質。例如在WO 98/04609中，敘述經聚矽氧改質之環氧樹脂。
使用環氧樹脂於無填料下作為浸漬劑及於有填料下作為澆鑄樹脂。除了白雲石外，亦使用其他無機材料(例如白堊及氧化鋁)作為環氧樹脂的填料，亦與短玻璃纖維組合，如DE 1 570 211敘述。亦使用橡膠粉末作為有機填料，如DE 1 495 072敘述。
將環氧樹脂固化係使用二羧酸酐、二胺及其等衍生物，及亦使用路易斯(Lewis)酸，例如三氯化硼及三氟化硼之錯合物。環氧樹脂之固化尤其敘述於書，例如由A.M. Paquin的「Epoxidverbindungen und Epoxidharze」(Epoxide compounds and epoxy resins),Springer-VerIag,1958或由H. Domininghaus的「Die Kunststoffe und ihre Eigenschaften」(Plastics and their properties),VDI Verlag,1988。
在電機工程領域中，環氧樹脂已證明有價值於許多不同應用。DE 19 809 572敘述澆鑄樹脂變壓器。DE 4 132 982中，敘述環氧樹脂用於靜定子封裝。DE 1 220 500敘述澆鑄樹脂用於製造高壓絕緣器。DE 1 209 650敘述以澆鑄樹脂封裝繞線架頭(winding heads)。DE 1 207 605敘述封裝高壓線圈。而且，環氧樹脂已證明有用於浸漬牽引馬達。(「Isolationssysteme für Traktionsmotoren」(Insulation systems for traction motors)VonRoll,CH-4426 Breitenbach)
由於游離雙酚A含量，基於雙酚A二縮水甘油醚之環氧樹脂有毒物學擔憂。而且，此等樹脂於25℃具有黏度範圍9000至13 000mPa，因此對許多應用有太高黏度。
雖然環脂族環氧樹脂具有低黏度，但其等具有強敏化效應。
US2008/0009599 A1敘述脫水糖類之縮水甘油醚，例如1,4：3,6-去二水山梨醇(isosorbide)、1,4：3,6-去二水甘露糖醇(isomannide)及1,4：3,6-去二水艾杜糖醇(isoidide)，以及從其藉由與脂族或芳香族聚胺固化而獲得之樹脂。
本發明目標係提供不具有上述缺點之電絕緣樹脂調配物。特別是，其等應無毒物學擔憂，且具有低黏度、短凝膠時間、及亦良好固化性質與良好鍵結強度。
目標係由一種電絕緣樹脂完成，包括A)去二水己糖醇(isohexidediol)之二縮水甘油醚，
B)硬化劑，C)視情況填料，D)進一步視情況添加劑。
吾人已驚人地發現去二水己糖醇之二縮水甘油醚係非常有用作為電絕緣應用之環氧樹脂。
獲得去二水己糖醇係從對應己糖醇藉由脫去2分子水而形成酐。較佳者為1,4：3,6-去二水山梨醇、1,4：3,6-去二水甘露糖醇及1,4：3,6-去二水艾杜糖醇之二縮水甘油醚。此等敘述例如於US 3,272,845。
較佳者為1,4：3,6-去二水山梨醇二縮水甘油醚。
1,4：3,6-去二水山梨醇(1,4：3,6-去二水-D-山梨醇)係從葡萄糖製備。1,4：3,6-去二水山梨醇二縮水甘油醚可由各種方法隨後從其製備，如敘述例如於WO 2008/147473。工業可得的1,4：3,6-去二水山梨醇二縮水甘油醚於25℃具有黏度大約870mPa及環氧當量重為166EEW/g。
1,4：3,6-去二水甘露糖醇二縮水甘油醚及1,4：3,6-去二水艾杜糖醇二縮水甘油醚具有與1,4：3,6-去二水山梨醇二縮水甘油醚相似性質。
根據本發明電絕緣樹脂在固化狀態中具有優異黏著性及優異電絕緣性質。樹脂可單獨或與固體絕緣材料(膠帶等)組合使用，以使電氣設備例如馬達、變壓器及發電機絕緣。
1,4：3,6-去二水山梨醇二縮水甘油醚及亦其他去二水己糖醇二縮水甘油醚可被用於各種電絕緣樹脂調配物，且被用於代替例如雙酚A二縮水甘油醚。根據去二水己糖醇二縮水甘油醚之不同環氧當亮與以去二水己糖醇二縮水甘油醚代替的環氧化合物之不同環氧當量，選擇去二水己糖醇二縮水甘油醚用量。
根據本發明電絕緣樹脂包括至少一種硬化劑B)。適合於環氧樹脂之硬化劑為二羧酸或二羧酸酐、二-一級二胺或聚胺、或路易斯酸。
在本發明之一具體實例中，硬化劑B)包括一或多種二羧酸
或二羧酸酐。合適二羧酸或二羧酸酐硬化劑為例如四氫酞酸酐、甲基四氫酞酸酐、六氫酞酸酐及十二基琥珀酸酐。較佳者為四氫酞酸酐及六氫酞酸酐。
一般而言，每環氧當量的去二水己糖醇二縮水甘油醚使用75%至100%、較佳85%至100%酐當量的酐硬化劑。
除了硬化劑B)外，反應加速劑可存在於樹脂中。若使用二羧酸酐作為硬化劑B)，則較佳包含反應加速劑。適合反應加速劑為三級胺，例如苄基二甲胺、三乙胺、三乙醇胺及N-甲基嗎福啉。
在另一具體實例中，硬化劑B)包括二-一級二胺或聚胺。合適硬化劑為例如1,6-己二胺、異佛酮二胺、伸茬二胺、二乙三胺、三乙四胺、四乙五胺、五亞甲基六胺、及聚醚聚胺例如Jeffamine D400。
一般而言，每環氧當量的去二水己糖醇二縮水甘油醚使用75%至100%當量胺量、較佳85%至100%當量胺量作為二-一級二胺或聚胺。
在另一具體實例中，硬化劑B)包括路易斯酸。適合作為硬化劑之路易斯酸為例如三氟化硼或三氯化硼錯合物，特別是胺錯合物。實例為單乙醇胺，氨，及三氟化硼之哌啶、三甲胺、六亞甲基四胺或吡啶錯合物，及三氯化硼之二甲基辛胺或吡啶錯合物。
一般而言，使用1至6重量%、較佳2至5重量%路易斯酸，以電絕緣樹脂總質量為基準。
在本發明特定具體實例中，硬化劑B)包括三氯化硼-胺錯合物。
電絕緣樹脂可含有一或多種填料。合適填料係選自例如由白雲石、白堊、熔融矽石、石英粉、氫氧化鋁、氫氧化鎂及其混合物組成的群組。
填料可呈用量20至70重量%存在，以電絕緣樹脂總質量為基準。
若電絕緣樹脂為澆鑄樹脂，則其較佳包括填料。若電絕緣樹脂為浸漬劑，則其較佳不包括填料。
電絕緣樹脂可含有進一步添加劑D)。除了已提及之反應加速劑外，添加劑為濕潤助劑、流平劑及顏料。
添加劑一般可呈用量0至6重量%存在，以電絕緣樹脂總質量為基準。
電絕緣樹脂可額外包括反應性稀釋劑。適合反應性稀釋劑為二醇或長鏈單醇之二縮水甘油醚，例如丁二醇二縮水甘油醚、己二醇二縮水甘油醚、苯基縮水甘油醚、甲苯酚基縮水甘油醚、癸基縮水甘油醚、十二基縮水甘油醚、聚乙二醇單縮水甘油醚及聚-THF單縮水甘油醚。若此等存在，其等可呈用量高至20重量%存在，以電絕緣樹脂總質量為基準，但造成柔軟模製材料。電絕緣樹脂較佳不含有任何反應性稀釋劑。
藉由目前傳統程序，例如浸漬、浸軋、滴濾、傾倒、真空或真空壓力浸漬，將根據本發明調配物導入電氣機器之線圈。繼之以熱固化，在烘箱中或由電阻加熱線圈或組合此等選擇而固化。
本發明亦有關使用去二水己糖醇二縮水甘油醚(特別是1,4：3,6-去二水山梨醇二縮水甘油醚、1,4：3,6-去二水甘露糖醇二縮水甘油醚及1,4：3,6-去二水艾杜糖醇二縮水甘油醚)於浸漬電氣機器之電絕緣樹脂，於封裝變壓器、電線圈與電動馬達之電絕緣樹脂，及於製造高壓絕緣器之電絕緣樹脂。
本發明亦有關使用上述電絕緣樹脂於浸漬電機器，特別於浸漬高壓電機器。本發明進一步提供使用電絕緣樹脂於封裝變壓器、電線圈、於完全封裝電動馬達及於製造高壓絕緣器。
參考實施例而更詳細敘述本發明。根據DIN及IEC標準進行試驗。
本發明藉由實施例闡明，但不以任何方式限制於實施例。
將53.33 g雙酚A二縮水甘油醚(EEW=190)、46.53 g甲基四氫酞酸酐及0.14 g苄基二甲胺混合並用於進一步實驗。調配物含有100%理論硬化劑用量。凝膠時間於120℃為20’20”及於130℃為11’19”。黏度於25℃為656 mPa.s。
將49.88 g 1,4：3,6-去二水山梨醇二縮水甘油醚(EEW=166)、49.97 g甲基四氫酞酸酐及0.15 g苄基二甲胺混合並用於進一步實驗。調配物含有100%理論硬化劑用量。凝膠時間於120℃為11’01”及於130℃為5’12”。黏度於25℃為421 mPa。
以樹脂浸漬根據IEC 61033之扭桿。其等於130℃固化3小時，鍵結強度係以溫度之函數測定。
其等針對比較例1為589 N(23℃)、69 N(155℃)、42 N(180℃)；針對實施例2，鍵結強度為632 N(23℃)、57 N(155℃)、452 N(180℃)。
將57.14 g雙酚A二縮水甘油醚、42.73 g甲基四氫酞酸酐及0.13 g苄基二甲胺混合並用於進一步實驗。調配物含有85%理論硬化劑用量。凝膠時間於120℃為22’21”及於130℃為12’32”。黏度於25℃為805 mPa。
將53.91 g 1,4：3,6-去二水山梨醇二縮水甘油醚、45.95 g甲基四氫酞酸酐及0.14 g苄基二甲胺混合並用於進一步實驗。調配物含有85%理論硬化劑用量。凝膠時間於120℃為9’28”及於130℃為5’00”。黏度於25℃為523 mPa。
若比較例3於120℃固化3小時，則模製材料具有蕭式(Shore)D硬度76。若固化係於130℃進行，則數值為78，亦
即無改變。
針對實施例4之混合物，兩者固化之對應蕭式D硬度為77。
將52.91 g雙酚A二縮水甘油醚、46.95 g甲基六氫酞酸酐及0.14 g苄基二甲胺混合並用於進一步實驗。調配物含有85%理論硬化劑用量。凝膠時間於120℃為19’11”及於130℃為11”。黏度於25℃為643 mPa。
將49.38 g 1,4：3,6-去二水山梨醇二縮水甘油醚、50.47 g甲基六氫酞酸酐及0.15 g苄基二甲胺混合並用於進一步實驗。調配物含有85%理論硬化劑用量。凝膠時間於120℃為9’22”及於130℃為4’39”。黏度於25℃為408 mPa。
以來自實施例2、4及6之樹脂浸漬尺寸90的靜定子。在滴液相後，使靜定子於160℃固化2小時。隨後將其等鋸開。均顯示充分、無氣泡的銅線圈之浸漬。
在溶解器中，從108.6 g無酞酸酯塑化劑、526.9 g 1,4：3,6-去二水山梨醇二縮水甘油醚、1.0 g熔融矽石、0.1 g商業可得的含聚矽氧防沫劑、342.9 g白堊、20 g黑顏料糊漿及1.4 g苄基二甲胺製備均相混合物。混合物於23℃具有黏度4800 mPa。在添加449.2 g甲基四氫酞酸酐後，均質化混合物，製備各種試樣。崩潰電壓為32 kV/mm(根據IEC 60 243-1連同IEC 60 455-2)。追蹤指數為600(根據IEC 60 112連同IEC 60 455-2)。耐衝擊性為12 kJ/m2(根據ISO 179)。
將916 g1,4：3,6-去二水山梨醇二縮水甘油醚與1 g濕潤添加劑、1 g流平助劑及37 g商業可得的三氯化硼-胺錯合物混合。使用真空壓力方法(0.1巴真空/1小時，繼之6巴壓力/5小時)，以此混合物浸漬70 x 2 x 1 cm Roebel棒，該棒已用7個半重疊(14層)商業可得的雲母/玻璃條帶纏繞。該棒於160℃固化6
小時。切開一個棒。浸漬係均相且在於銅完成。
介電係數損失因子於6 kV為0.0031及於10 kV為0.0036。介電係數損失因子係依溫度而定，且於21℃為0.0031、於90℃為0.0096、於130℃為0.0326及於155℃為0.1498。
Claims (14)
- 一種電絕緣樹脂，包括A)去二水己糖醇(isohexidediol)二縮水甘油醚，B)硬化劑，C)視情況填料，D)進一步視情況添加劑。
- 根據申請專利範圍第1項之電絕緣樹脂，特徵在於該去二水己糖醇二縮水甘油醚為1,4：3,6-去二水山梨醇(isosorbide)二縮水甘油醚、1,4：3,6-去二水甘露糖醇(isomannide)二縮水甘油醚或1,4：3,6-去二水艾杜糖醇(isoidide)二縮水甘油醚。
- 根據申請專利範圍第1項之電絕緣樹脂，特徵在於該硬化劑B)包括一或多種二羧酸或二羧酸酐。
- 根據申請專利範圍第3項之電絕緣樹脂，特徵在於該硬化劑B)包括甲基四氫酞酸酐或甲基六氫酞酸酐。
- 根據申請專利範圍第1至4項之電絕緣樹脂，特徵在於其包括反應加速劑。
- 根據申請專利範圍第1至5項之電絕緣樹脂，特徵在於其包括填料。
- 根據申請專利範圍第6項之電絕緣樹脂，特徵在於該填料係選自由白雲石、白堊、熔融矽石、石英粉、氫氧化鋁、氫氧化鎂及其混合物組成的群組。
- 根據申請專利範圍第1項之電絕緣樹脂，特徵在於該硬化劑B)包括路易斯(Lewis)酸。
- 根據申請專利範圍第8項之電絕緣樹脂，特徵在於該硬化劑B)包括三氯化硼-胺錯合物。
- 根據申請專利範圍第1至9項中任一項之電絕緣樹脂，其用於浸漬電氣機器，於封裝變壓器、線圈與電動馬達，及於製造高壓絕緣器。
- 根據申請專利範圍第10項之電絕緣樹脂，其用於浸漬電氣 機器。
- 根據申請專利範圍第11項之電絕緣樹脂，其用於浸漬高壓電氣機器。
- 一種使用根據申請專利範圍第1至9項中任一項電絕緣樹脂之方法，包括以該電絕緣浸漬電氣機器之步驟。
- 一種使用根據申請專利範圍第1至9項中任一項電絕緣樹脂之方法，包括以該電絕緣樹脂封裝變壓器、電線圈與電動馬達之步驟。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ??102012202161.2 | 2012-02-14 | ||
| DE102012202161A DE102012202161A1 (de) | 2012-02-14 | 2012-02-14 | Elektroisolierharz auf Basis von Isohexiddioldiglycidethern |
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| Publication Number | Publication Date |
|---|---|
| TW201336921A true TW201336921A (zh) | 2013-09-16 |
| TWI612095B TWI612095B (zh) | 2018-01-21 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102105068A TWI612095B (zh) | 2012-02-14 | 2013-02-08 | 基於去二水己糖醇（ｉｓｏｈｅｘｉｄｅｄｉｏｌ）二縮水甘油醚之電絕緣樹脂 |
Country Status (13)
| Country | Link |
|---|---|
| US (1) | US20150010697A1 (zh) |
| EP (1) | EP2815407B1 (zh) |
| KR (1) | KR20140128419A (zh) |
| CN (1) | CN104160454A (zh) |
| BR (1) | BR112014020208A8 (zh) |
| DE (1) | DE102012202161A1 (zh) |
| DK (1) | DK2815407T3 (zh) |
| ES (1) | ES2578613T3 (zh) |
| HU (1) | HUE029963T2 (zh) |
| MY (1) | MY166177A (zh) |
| SI (1) | SI2815407T1 (zh) |
| TW (1) | TWI612095B (zh) |
| WO (1) | WO2013120872A2 (zh) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9605108B2 (en) * | 2014-04-24 | 2017-03-28 | New Jersey Institute Of Technology | Isosorbide-derived epoxy resins and methods of making same |
| FR3040059B1 (fr) * | 2015-08-13 | 2019-05-17 | Roquette Freres | Utilisation d'une composition d'ethers de bis-anhydrohexitol de faible viscosite comme diluant reactif pour compositions reticulables de resines, d'adhesifs, de revetements et de matrices pour composi |
| CN105931772A (zh) * | 2016-04-20 | 2016-09-07 | 南通日芝电力材料有限公司 | 环氧涂布纸生产方法 |
| US11958253B2 (en) * | 2017-12-21 | 2024-04-16 | Elantas Europe S.R.L. | Use of isosorbide |
| DE102020117995A1 (de) | 2020-07-08 | 2022-01-13 | Bayerische Motoren Werke Aktiengesellschaft | Elektrische Maschine für ein Kraftfahrzeug, Verwendung einer solchen elektrischen Maschine sowie Kraftfahrzeug |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1209650B (de) | 1961-02-13 | 1966-01-27 | Ziehl Abegg O H G | Form zum Umgiessen der Wickelkoepfe von Elektromotoren mit Giessharz |
| BE614215A (zh) | 1961-02-22 | |||
| DE1207605B (de) | 1962-08-16 | 1965-12-23 | Telefunken Patent | Verfahren zur Herstellung einer mit Giessharz umgossenen Hochspannungsspule, insbesondere fuer den Zeilentransformator eines Fernsehempfaengers |
| US3272845A (en) | 1963-03-21 | 1966-09-13 | Atlas Chem Ind | Bisglycidyl ethers of isohexides |
| DE1220500B (de) | 1963-12-05 | 1966-07-07 | Licentia Gmbh | Hochspannungsisolator aus Giessharz |
| DE1495072B2 (de) | 1964-09-17 | 1973-01-25 | Anschütz & Co GmbH, 2300 Kiel: | Epoxyd-giessharz-mischung |
| CH448515A (de) | 1965-06-18 | 1967-12-15 | Bbc Brown Boveri & Cie | Giessharz-Mischung |
| US3868613A (en) * | 1971-10-14 | 1975-02-25 | Westinghouse Electric Corp | Solventless epoxy resin composition and an electrical member impregnated therewith |
| GB9010221D0 (en) * | 1990-05-05 | 1990-06-27 | Ciba Geigy Ag | N-glycidyl compounds |
| DE4132982A1 (de) | 1991-10-04 | 1993-04-08 | Grundfos Int | Giessharz fuer statorvergussmittel |
| DE4139877A1 (de) | 1991-11-29 | 1993-06-03 | Siemens Ag | Giessharz |
| DE4206733C2 (de) | 1992-03-04 | 1998-09-03 | Bakelite Ag | Gießharz und seine Verwendung zur Herstellung von Elektrovergußmassen |
| GB9224854D0 (en) * | 1992-11-27 | 1993-01-13 | Ciba Geigy Ag | Moulding process |
| GB9512533D0 (en) * | 1995-06-20 | 1995-08-23 | Ciba Geigy Ag | Curable compositions |
| DE19630319C1 (de) | 1996-07-26 | 1998-04-23 | Siemens Ag | Modifiziertes Epoxysiloxan Kondensat, Verfahren zu dessen Herstellung und dessen Einsatz als Low-Stress-Gießharz für die Elektronik und Elektrotechnik |
| DE29712628U1 (de) * | 1997-07-17 | 1997-10-30 | Akemi Chem Techn Spezialfabrik | Strukturkitt und Strukturpaste |
| US6103157A (en) * | 1997-07-02 | 2000-08-15 | Ciba Specialty Chemicals Corp. | Process for impregnating electrical coils |
| DE19809572C2 (de) | 1998-03-05 | 2000-06-21 | Siemens Ag | Gießharz-Transformator |
| JP4319332B2 (ja) * | 2000-06-29 | 2009-08-26 | 株式会社東芝 | 電気絶縁材料およびその製造方法 |
| US7619056B2 (en) | 2006-06-02 | 2009-11-17 | New Jersey Institute Of Technology | Thermoset epoxy polymers from renewable resources |
| US7677452B2 (en) * | 2006-06-30 | 2010-03-16 | Caterpillar Inc. | Method and system for providing signatures for machines |
| WO2008147473A1 (en) | 2007-05-31 | 2008-12-04 | New Jersey Institute Of Technology | Thermoset epoxy polymers from renewable resources |
| KR20110043738A (ko) * | 2008-09-19 | 2011-04-27 | 에이비비 리써치 리미티드 | 에폭시 수지 조성물 |
-
2012
- 2012-02-14 DE DE102012202161A patent/DE102012202161A1/de not_active Ceased
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2013
- 2013-02-08 TW TW102105068A patent/TWI612095B/zh not_active IP Right Cessation
- 2013-02-13 MY MYPI2014002355A patent/MY166177A/en unknown
- 2013-02-13 HU HUE13703619A patent/HUE029963T2/en unknown
- 2013-02-13 SI SI201330225A patent/SI2815407T1/sl unknown
- 2013-02-13 KR KR20147025263A patent/KR20140128419A/ko not_active Application Discontinuation
- 2013-02-13 ES ES13703619.0T patent/ES2578613T3/es active Active
- 2013-02-13 CN CN201380009442.6A patent/CN104160454A/zh active Pending
- 2013-02-13 EP EP13703619.0A patent/EP2815407B1/de not_active Not-in-force
- 2013-02-13 US US14/378,607 patent/US20150010697A1/en not_active Abandoned
- 2013-02-13 DK DK13703619.0T patent/DK2815407T3/en active
- 2013-02-13 BR BR112014020208A patent/BR112014020208A8/pt not_active IP Right Cessation
- 2013-02-13 WO PCT/EP2013/052824 patent/WO2013120872A2/de active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| CN104160454A (zh) | 2014-11-19 |
| HUE029963T2 (en) | 2017-04-28 |
| BR112014020208A8 (pt) | 2017-07-11 |
| MY166177A (en) | 2018-06-07 |
| DE102012202161A1 (de) | 2013-08-14 |
| WO2013120872A2 (de) | 2013-08-22 |
| SI2815407T1 (sl) | 2016-08-31 |
| KR20140128419A (ko) | 2014-11-05 |
| TWI612095B (zh) | 2018-01-21 |
| EP2815407B1 (de) | 2016-04-20 |
| BR112014020208A2 (zh) | 2017-06-20 |
| WO2013120872A3 (de) | 2014-01-09 |
| ES2578613T3 (es) | 2016-07-28 |
| EP2815407A2 (de) | 2014-12-24 |
| DK2815407T3 (en) | 2016-08-01 |
| US20150010697A1 (en) | 2015-01-08 |
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