TW201334234A - Compression resin sealing formation method and device for semiconductor chip and strips for preventing resin burrs - Google Patents
Compression resin sealing formation method and device for semiconductor chip and strips for preventing resin burrs Download PDFInfo
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- TW201334234A TW201334234A TW102100216A TW102100216A TW201334234A TW 201334234 A TW201334234 A TW 201334234A TW 102100216 A TW102100216 A TW 102100216A TW 102100216 A TW102100216 A TW 102100216A TW 201334234 A TW201334234 A TW 201334234A
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H—ELECTRICITY
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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Abstract
Description
本發明係關於一種採用透明樹脂材料對安裝於半導體基板上的所需數量的LED晶片(半導體晶片)進行密封成形者，尤其係關於一種以能夠有效率地防止樹脂毛邊附著在該基板的LED晶片安裝面中的既定部位之方式改善的LED晶片的壓縮樹脂密封成形方法、用於實施該方法的裝置、以及用於實施該方法的樹脂毛邊防止用帶材。 The present invention relates to a sealing molding of a required number of LED chips (semiconductor wafers) mounted on a semiconductor substrate using a transparent resin material, and more particularly to an LED chip capable of efficiently preventing resin burrs from adhering to the substrate. A method of forming a compressed resin seal of an LED wafer in which a predetermined portion of the mounting surface is improved, a device for carrying out the method, and a resin burr preventing strip for carrying out the method.
習知提出有如下之半導體晶片(LED晶片)的壓縮樹脂密封成形方法(例如，參照專利文獻1)：在半導體基板的表面安裝LED晶片並在該基板的背面(非LED晶片的安裝面)側黏貼樹脂毛邊防止用帶材，並且在該狀態下將該基板的LED晶片浸漬於供給到樹脂成形用腔室內的透明熔融樹脂材料中，進而以既定壓力壓縮該腔室內的透明樹脂材料，藉此將LED晶片密封成形於在該腔室內成形的透明樹脂成形體內。 A compression resin sealing molding method of a semiconductor wafer (LED wafer) is proposed (for example, refer to Patent Document 1): an LED chip is mounted on a surface of a semiconductor substrate and is on the back surface of the substrate (mounting surface of the non-LED wafer) In this state, the LED wafer of the substrate is immersed in the transparent molten resin material supplied into the resin molding chamber, and the transparent resin material in the chamber is compressed at a predetermined pressure. The LED wafer is hermetically formed in a transparent resin molded body formed in the chamber.
亦即，專利文獻1揭示了以下的技術內容。首先，如圖13(1)所示，準備在半導體基板50的表面50a安裝有LED晶片60並且在該基板的背面(非LED晶片60的安裝面)50b側的整個表面黏貼有樹脂毛邊防止用帶材70的樹脂密封前基板51。 That is, Patent Document 1 discloses the following technical contents. First, as shown in Fig. 13 (1), the LED wafer 60 is mounted on the surface 50a of the semiconductor substrate 50, and the resin burr prevention is adhered to the entire surface of the back surface of the substrate (the mounting surface of the non-LED wafer 60) 50b. The resin of the tape 70 seals the front substrate 51.
接下來，如在同一圖式中所示，在使該樹脂密封前基板的表面50a側朝下的狀態下，將樹脂密封前基板50a搬送到壓縮樹脂密封成形裝 置80的上模81和下模82之間，並且往設置在該下模的上面的樹脂成形用腔室81a內供給透明樹脂材料(例如，具有透明性的液狀的樹脂材料)90。 Next, as shown in the same figure, the resin-sealed front substrate 50a is transferred to a compression resin sealing molding in a state where the surface 50a side of the resin-sealed front substrate is faced downward. A transparent resin material (for example, a liquid resin material having transparency) 90 is supplied into the resin molding chamber 81a provided on the upper surface of the lower mold between the upper mold 81 and the lower mold 82.
接下來，如圖13(2)所示，關閉上模81和下模82，將樹脂密封前基板50的LED晶片60浸漬在下模腔室81a內的透明樹脂材料(具有流動性的樹脂材料)90中。並且以既定的合模壓力閉合上模81和下模82，而以既定壓力壓縮下模腔室81a內的透明熔融樹脂材料90，藉此，對應下模腔室81a的形狀而將該LED晶片60密封成形在透明樹脂成形體(晶狀體(lens))91內(例如，進行熱固化)。 Next, as shown in Fig. 13 (2), the upper mold 81 and the lower mold 82 are closed, and the LED resin wafer 60 of the resin-sealed front substrate 50 is immersed in a transparent resin material (having a fluid resin material) in the lower mold chamber 81a. 90. And the upper mold 81 and the lower mold 82 are closed at a predetermined mold clamping pressure, and the transparent molten resin material 90 in the lower mold chamber 81a is compressed at a predetermined pressure, whereby the LED wafer is corresponding to the shape of the lower mold chamber 81a. 60 is hermetically formed in a transparent resin molded body (lens) 91 (for example, thermally cured).
接下來，如圖13(3)所示，打開上模81和下模82，取出樹脂密封後基板52，並從該樹脂密封後基板去除樹脂毛邊防止用帶材70，並且以各LED晶片60為單位進行切割分離，藉此能夠成形各LED晶片60的樹脂密封成形品61。 Next, as shown in Fig. 13 (3), the upper mold 81 and the lower mold 82 are opened, the resin-sealed substrate 52 is taken out, and the resin burr preventing strip 70 is removed from the resin-sealed substrate, and each LED wafer 60 is removed. The resin-sealed molded article 61 of each of the LED wafers 60 can be formed by performing dicing and separation for each unit.
因此，根據如此之LED晶片60的壓縮樹脂密封成形方法，與下模腔室81a的形狀對應的形狀的透明樹脂成形體(晶狀體)91附著在半導體基板的表面50a側並一體化。而且，由於在該基板的背面(LED晶片60的非安裝面)50b側黏貼有樹脂毛邊防止用帶材70，因此在對該基板上的各LED晶片60進行樹脂密封成形時，能夠有效率地防止透明熔融樹脂材料90的一部分浸入該基板的背面50b側而在該背面50b附著樹脂毛邊(固化樹脂)。 Therefore, according to the compression resin sealing molding method of the LED wafer 60, the transparent resin molded body (crystal) 91 having a shape corresponding to the shape of the lower mold chamber 81a adheres to the surface 50a side of the semiconductor substrate and is integrated. Further, since the resin burr preventing strip 70 is adhered to the back surface of the substrate (the non-mounting surface of the LED wafer 60) 50b, it is possible to efficiently perform the resin sealing molding on each of the LED wafers 60 on the substrate. A part of the transparent molten resin material 90 is prevented from entering the back surface 50b side of the substrate, and a resin burr (cured resin) is adhered to the back surface 50b.
然而，由於在使半導體基板的表面50a側浸漬於下模腔室81a內的透明熔融樹脂材料或透明樹脂材料(具有流動性的樹脂材料)90中的狀態下進行樹脂密封成形，因此使該基板的表面50a側的幾乎整面與透 明熔融樹脂材料90接觸。 However, since the resin sealing is performed in a state in which the surface 50a side of the semiconductor substrate is immersed in the transparent molten resin material or the transparent resin material (the resin material having fluidity) 90 in the lower mold cavity 81a, the substrate is made Almost the entire surface of the surface 50a side The molten resin material 90 is in contact.
因此，例如在具有在半導體基板的表面50a側開設有焊接點(pad)等的電連接部位或固接件的插通用孔部等的構造的半導體基板中，必然會有樹脂毛邊附著在該等部位或孔部內。 Therefore, for example, in a semiconductor substrate having a structure in which an electrical connection portion such as a pad or the like, or a general-purpose hole portion of a fixing member is formed on the surface 50a side of the semiconductor substrate, resin burrs are inevitably attached thereto. Inside the part or hole.
因此，在使用具有這種構造的半導體基板並對LED晶片進行樹脂密封成形時，事實上存在有無法採用壓縮樹脂密封成形方法的問題。 Therefore, when a semiconductor substrate having such a structure is used and the LED wafer is subjected to resin sealing molding, there is actually a problem that a compression resin sealing molding method cannot be employed.
專利文獻1：日本特開2008-207450號公報(參照圖1、圖2及圖3等) Patent Document 1: Japanese Laid-Open Patent Publication No. 2008-207450 (see FIGS. 1, 2, and 3, etc.)
本發明的目的在於提供一種能夠對具有在半導體基板的表面(LED晶片的安裝面)側開設焊接點等電連接部位或固接件的插通用孔部等的樹脂不可接觸區域的構造的半導體基板，進行樹脂密封成形的壓縮樹脂密封成形方法、以及用於實施該方法的樹脂毛邊防止用帶材。 It is an object of the present invention to provide a semiconductor substrate having a structure in which a resin non-contact region such as an electrical connection portion such as a solder joint or an insertion hole portion of a fixing member is formed on a surface (a mounting surface of an LED chip) of a semiconductor substrate. A compression resin sealing molding method for performing resin sealing molding, and a resin burr preventing strip for carrying out the method.
本發明的特徵在於，包含：準備樹脂密封前基板1的步驟，該樹脂密封前基板1的構造係在半導體基板的表面安裝有LED晶片(半導體晶片)2，並且在所述半導體基板的表面(LED晶片安裝面)側具有樹脂不可接觸區域B；準備樹脂密封成形用的上下兩模6、7，該樹脂密封成形用的上下兩模6、7係在對應所述半導體基板的樹脂不可接觸區域B的各部位的樹脂成形用下模腔室7c內的各部位，配設有樹脂毛邊防止用構件10；往下模腔室7c內的透明樹脂材料填充步驟，係將透明樹脂材料R往除了所述樹脂毛邊防止用構件10的各部位之外的所述下模腔室7c內填充；樹脂密封前基板1的搬入步驟，係將所述樹脂密封前基板1在其表面側朝下的狀 態下，搬入至樹脂密封成形用的上下兩模6、7之間；樹脂密封前基板1的放置步驟，係在已搬入至所述上下兩模6、7之間的所述樹脂密封前基板1的表面側成為朝下的狀態下，將其放置於所述下模腔室7c的既定位置；樹脂密封前基板1的樹脂不可接觸區域覆蓋步驟，係在所述樹脂密封前基板1的放置步驟時，使突出於所述下模腔室7c內的各樹脂毛邊防止用構件10與所述樹脂密封前基板1的樹脂不可接觸區域B的各部位接合；LED晶片2的往透明樹脂材料R中的浸漬步驟，係將放置於所述下模腔室7c的所述半導體基板的表面側嵌入所述下模腔室7c內，並且使所述半導體基板表面的LED晶片2浸漬於所述下模腔室7c內的透明樹脂材料R中；以及壓縮樹脂密封成形步驟，係壓縮所述下模腔室7c內的透明樹脂材料R，並對所述半導體基板表面的LED晶片2以對應於所述下模腔室7c的形狀的方式進行樹脂密封成形。 The present invention is characterized in that it includes a step of preparing a resin-sealed front substrate 1 having a structure in which an LED wafer (semiconductor wafer) 2 is mounted on a surface of a semiconductor substrate, and on a surface of the semiconductor substrate ( The LED wafer mounting surface) has a resin inaccessible region B; the upper and lower molds 6 and 7 for resin sealing molding are prepared, and the upper and lower molds 6 and 7 for resin sealing molding are in a resin inaccessible region corresponding to the semiconductor substrate. The resin burr preventing member 10 is disposed in each portion of the lower mold cavity 7c for resin molding in each part of B; the transparent resin material filling step in the lower mold cavity 7c is performed by removing the transparent resin material R The lower mold cavity 7c other than the respective portions of the resin burr preventing member 10 is filled; the resin sealing front substrate 1 is carried in the step of sealing the front substrate 1 toward the surface side thereof In the state of being placed between the upper and lower molds 6 and 7 for resin sealing molding; the step of placing the resin-sealed front substrate 1 is performed before the resin-sealed front substrate that has been carried between the upper and lower molds 6, 7 The surface side of 1 is placed in a downward state, and is placed at a predetermined position of the lower mold chamber 7c; the resin non-contact area covering step of the resin sealing front substrate 1 is placed before the resin sealing front substrate 1 In the step, each of the resin burr preventing members 10 protruding in the lower mold cavity 7c is joined to each portion of the resin non-contact region B of the resin-sealed front substrate 1; the transparent resin material R of the LED wafer 2 The impregnation step of embedding the surface side of the semiconductor substrate placed in the lower mold chamber 7c into the lower mold chamber 7c, and immersing the LED wafer 2 on the surface of the semiconductor substrate under the a transparent resin material R in the cavity 7c; and a compression resin sealing forming step of compressing the transparent resin material R in the lower mold cavity 7c, and corresponding to the LED wafer 2 on the surface of the semiconductor substrate Describe the shape of the cavity chamber 7c Molding resin sealing manner.
本發明的特徵在於，包含：樹脂密封前基板準備步驟，係準備樹脂密封前基板1，所述樹脂密封前基板1的構造係在半導體基板的表面安裝有LED晶片(半導體晶片)2，並且在所述半導體基板的表面側具有樹脂不可接觸區域B；樹脂毛邊防止用帶材準備步驟，係準備具有與所述半導體基板的樹脂不可接觸區域B的各部位對應的樹脂附著防止部20b的樹脂毛邊防止用帶材20；帶材黏貼基板形成步驟，係在所述樹脂密封前基板1的既定位置黏貼所述樹脂毛邊防止用帶材20，並且在所述樹脂密封前基板1的除了樹脂成形區域A之外的樹脂不可接觸區域B黏貼所述樹脂毛邊防止用帶材20的樹脂附著防止部20b，形成帶材黏貼基板(1、20)；壓縮樹脂成形裝置準備步驟，係準備具備有用於對所述帶材黏貼基板(1、20)上 的LED晶片2進行樹脂密封成形的上下兩模6、7的壓縮樹脂成形裝置5；往下模腔室7c內的透明樹脂材料填充步驟，係往所述壓縮樹脂成形裝置5的下模腔室7c內填充透明樹脂材料R；帶材黏貼基板(1、20)的搬入步驟，係將所述帶材黏貼基板(1、20)在其表面側朝下的狀態下，搬入至所述壓縮樹脂成形裝置5的上下兩模之間；帶材黏貼基板的放置步驟，係在已搬入至所述上下兩模之間的所述帶材黏貼基板(1、20)的表面側成為朝下的狀態下，將其放置於所述下模腔室7c的既定位置；LED晶片2的往透明樹脂材料R中的浸漬步驟，係將放置於所述下模腔室7c的所述帶材黏貼基板(1、20)的表面側嵌入所述下模腔室7c內，並且使所述帶材黏貼基板(1、20)上的LED晶片2浸漬於所述下模腔室7c內的透明樹脂材料R中；壓縮樹脂密封成形步驟，係壓縮所述下模腔室7c內的透明樹脂材料R，並對所述帶材黏貼基板(1、20)上的LED晶片2以對應於所述下模腔室7c的形狀之方式進行樹脂密封成形；樹脂密封後基板的搬出步驟，係將經過所述壓縮樹脂密封成形步驟的樹脂密封後基板21從上下兩模取出並往外部搬出；以及帶材剝離步驟，係將所述樹脂毛邊防止用帶材20從所述樹脂密封後基板21剝離。 The present invention is characterized in that it comprises a resin sealing front substrate preparing step of preparing a resin sealing front substrate 1 having a structure in which an LED wafer (semiconductor wafer) 2 is mounted on a surface of the semiconductor substrate, and The surface of the semiconductor substrate has a resin-non-contacting region B; a resin burr-preventing tape preparing step, and a resin burr having a resin adhesion preventing portion 20b corresponding to each portion of the resin-non-contactable region B of the semiconductor substrate is prepared. a strip-preventing substrate forming step of adhering the resin burr preventing strip 20 at a predetermined position of the resin-sealed front substrate 1 and a resin-molding region of the substrate 1 before the resin sealing The resin non-contact region B other than A is adhered to the resin adhesion preventing portion 20b of the resin burr preventing strip 20 to form a tape adhering substrate (1, 20); and the compressed resin molding device preparing step is prepared for use in the pair The tape is adhered to the substrate (1, 20) The LED wafer 2 is subjected to resin sealing forming of the upper and lower molds 6, 7 of the compressed resin molding device 5; the step of filling the transparent resin material into the lower mold chamber 7c, to the lower mold chamber of the compressed resin molding device 5 7c is filled with a transparent resin material R; the loading step of the tape-adhering substrates (1, 20) is carried out by loading the tape-attached substrates (1, 20) with the surface side thereof facing downward, into the compressed resin Between the upper and lower molds of the molding apparatus 5; the step of placing the strip-adhesive substrate is performed on the surface side of the strip-adhesive substrate (1, 20) that has been carried between the upper and lower molds. And placing it in a predetermined position of the lower mold cavity 7c; the step of immersing the LED wafer 2 into the transparent resin material R is to adhere the tape to the substrate of the lower mold cavity 7c ( The surface side of 1, 20) is embedded in the lower mold cavity 7c, and the LED wafer 2 on the tape adhered to the substrate (1, 20) is immersed in the transparent resin material R in the lower mold cavity 7c. a compression resin sealing forming step of compressing the transparent resin material R in the lower mold chamber 7c, and The LED chip 2 on the tape bonding substrate (1, 20) is resin-sealed in such a manner as to correspond to the shape of the lower mold cavity 7c; the resin-sealed substrate is carried out by the compression resin. The resin-sealed substrate 21 in the molding step is taken out from the upper and lower molds and carried out to the outside, and the strip peeling step is performed by peeling the resin burr preventing strip 20 from the resin-sealed substrate 21.
本發明的樹脂毛邊防止用帶材20，係黏貼於樹脂密封前基板1而使用，所述樹脂密封前基板1的構造，係在半導體基板的LED晶片2的安裝面，具有所述LED晶片2的樹脂成形區域A、及樹脂不可接觸所述LED晶片2的安裝面的樹脂不可接觸區域B；其特徵在於，在與所述LED晶片2的樹脂成形區域A對應的部位形成樹脂接著用的孔部20a，並且在與樹脂不可接觸所述LED晶片2的安裝面的樹脂不可接觸區域B對應的部位 形成有樹脂附著防止部20b。 The resin burr preventing strip 20 of the present invention is used by adhering to the resin-sealed front substrate 1 having a structure in which the structure of the front substrate 1 is attached to the mounting surface of the LED wafer 2 of the semiconductor substrate, and the LED wafer 2 is provided. The resin-molded region A and the resin-non-contactable region B in which the resin is not in contact with the mounting surface of the LED wafer 2; the resin-receiving hole is formed in a portion corresponding to the resin-molded region A of the LED wafer 2 a portion 20a, and a portion corresponding to the resin non-contact region B where the resin is not in contact with the mounting surface of the LED chip 2 A resin adhesion preventing portion 20b is formed.
根據本發明，在對安裝於基板的半導體晶片進行壓縮樹脂密封成形時，能夠有效率且確實地防止樹脂毛邊附著在樹脂不可接觸區域的各部位。 According to the present invention, when the semiconductor wafer mounted on the substrate is subjected to compression resin sealing molding, it is possible to efficiently and surely prevent the resin burrs from adhering to the respective portions of the resin inaccessible region.
因此，能夠使用壓縮樹脂密封成形方法，對在安裝有半導體晶片的基板的表面側開設焊接點等電連接部位或固接件的插通用孔部等的具有樹脂不可接觸區域的構造的半導體基板等的基板，進行密封成形。因此發揮了能夠高效地生產使用這種基板的半導體晶片的樹脂密封成形品的優異而實用的效果。 Therefore, a semiconductor substrate having a structure having a resin inaccessible region, such as an electrical connection portion such as a solder joint or an insertion hole portion of a fixing member, can be formed on the surface side of the substrate on which the semiconductor wafer is mounted, using a compression resin sealing molding method. The substrate is sealed and formed. Therefore, an excellent and practical effect of being able to efficiently produce a resin-sealed molded article of a semiconductor wafer using such a substrate is exhibited.
根據本發明，能夠藉由使樹脂毛邊防止用構件按壓狀地緊貼於基板的樹脂不可接觸區域的各部位並更確實地覆蓋該各部位，而更加確實地防止樹脂毛邊附著在該樹脂不可接觸區域。 According to the present invention, the resin burr preventing member can be pressed against the respective portions of the resin non-contactable region of the substrate and more reliably cover the respective portions, thereby more reliably preventing the resin burr from adhering to the resin. region.
根據本發明，能夠藉由使樹脂毛邊防止用構件個別地且按壓狀地緊貼於基板的樹脂不可接觸區域的各部位，而更加確實地防止樹脂毛邊附著在該樹脂不可接觸區域。 According to the present invention, it is possible to more reliably prevent the resin burr from adhering to the resin inaccessible region by adhering the resin burr preventing member to each portion of the resin non-contact region of the substrate individually and in a pressed manner.
尤其是，由於能夠分別地對樹脂不可接觸區域的各部位按壓樹脂毛邊防止用構件並確實地覆蓋該各部位，因此即使是例如在該各部位具有厚度不均的情形，亦能在該各部位獲得對應各自的厚度的均等的按壓作用。 In particular, since the resin burr preventing member can be pressed and the respective portions can be reliably covered in each of the resin inaccessible regions, even in the case where the portions have thickness unevenness, for example, An equal pressing action corresponding to the respective thicknesses is obtained.
因此，能夠防止由於對樹脂不可接觸區域的各部位施加過大的按壓力而損壞該各部位、或相反地由於無法在該各部位獲得所需的按壓作用而導致樹脂毛邊附著在該各部位等的弊端產生。 Therefore, it is possible to prevent the respective portions from being damaged by applying an excessive pressing force to the respective portions of the resin inaccessible region, or conversely, the resin burrs are attached to the respective portions due to the inability to obtain a desired pressing action at the respective portions. The drawbacks arise.
根據本發明，在對安裝於基板的半導體晶片進行壓縮樹脂密封成形時，能夠有效率且確實地防止樹脂毛邊附著在樹脂不可接觸區域的各部位。 According to the present invention, when the semiconductor wafer mounted on the substrate is subjected to compression resin sealing molding, it is possible to efficiently and surely prevent the resin burrs from adhering to the respective portions of the resin inaccessible region.
因此，能夠使用壓縮樹脂密封成形方法，對在安裝有半導體晶片的基板的表面側開設焊接點等電連接部位或固接件的插通用孔部等的具有樹脂不可接觸區域的構造的基板，進行密封成形。因此能夠發揮高效地生產使用這種基板的半導體晶片的樹脂密封成形品的優異而實用的效果。 Therefore, it is possible to form a substrate having a structure having a resin-non-contactable region such as an electrical connection portion such as a solder joint or an insertion hole portion of a fixing member on the surface side of the substrate on which the semiconductor wafer is mounted, using a compression resin sealing molding method. Sealed and formed. Therefore, it is possible to exhibit an excellent and practical effect of efficiently producing a resin-sealed molded article of a semiconductor wafer using such a substrate.
根據本發明，能夠更加確實地防止樹脂毛邊附著在基板的樹脂不可接觸區域。尤其是，由於能夠分別地對樹脂不可接觸區域的各部位按壓樹脂毛邊防止用構件並確實地覆蓋該各部位，因此即使是例如在該各部位具有厚度不均的情形，亦能夠在該各部位獲得對應各自的厚度的均等的按壓作用。 According to the present invention, it is possible to more reliably prevent the resin burrs from adhering to the resin inaccessible region of the substrate. In particular, since the resin burr preventing member can be pressed and the respective portions can be surely covered in each of the resin non-contact regions, even in the case where the thickness is uneven, for example, in each of the portions An equal pressing action corresponding to the respective thicknesses is obtained.
因此，能夠防止由於對樹脂不可接觸區域的各部位施加過大的按壓力而損壞該各部位、或相反地由於無法在該各部位獲得所需的按壓作用而導致樹脂毛邊附著在該各部位等的弊端產生。 Therefore, it is possible to prevent the respective portions from being damaged by applying an excessive pressing force to the respective portions of the resin inaccessible region, or conversely, the resin burrs are attached to the respective portions due to the inability to obtain a desired pressing action at the respective portions. The drawbacks arise.
根據本發明，藉由將樹脂毛邊防止用構件以同時緊貼於基板的樹脂不可接觸區域的整體部位之方式配設，能夠謀求整體模具構造的簡化、及裝置製造成本的降低。 According to the present invention, the resin burr preventing member is disposed so as to be in close contact with the entire portion of the resin non-contact region of the substrate, thereby simplifying the overall mold structure and reducing the manufacturing cost of the device.
尤其是，由於能夠使其同時與基板的樹脂不可接觸區域的整體部位緊貼，因此能夠同時地且均勻地按壓該整體部位。 In particular, since the entire portion of the resin inaccessible region of the substrate can be brought into close contact with each other, the entire portion can be simultaneously and uniformly pressed.
因此，例如在半導體基板的樹脂不可接觸區域的整體部位的 厚度沒有不均的情形下，亦能夠良好地實施本發明。 Therefore, for example, in the entire portion of the resin inaccessible region of the semiconductor substrate The present invention can also be suitably carried out in the case where the thickness is not uneven.
根據本發明，將樹脂毛邊防止用構件個別地配設在基板的各個製品構成單位(最小分割單位)的每一個，藉此能夠謀求整體模具構造的簡化、及裝置製造成本的降低。 According to the present invention, the resin burrs preventing members are individually disposed in each of the product constituent units (minimum division units) of the substrate, whereby the simplification of the overall mold structure and the reduction in the manufacturing cost of the apparatus can be achieved.
亦即，由於能夠使其緊貼於每個製品構成單位中的樹脂不可接觸區域的各部位，因此能夠均等地按壓該各部位。 In other words, since the respective portions of the resin inaccessible region in each of the product constituent units can be brought into close contact with each other, the respective portions can be uniformly pressed.
因此，例如在每個製品構成單位中的樹脂不可接觸區域的各部位沒有厚度不均的情形下，亦能夠良好地實施本發明。 Therefore, for example, in the case where there is no thickness unevenness in each portion of the resin inaccessible region in each product constituent unit, the present invention can be favorably carried out.
根據本發明，在對安裝於基板的半導體晶片進行壓縮樹脂密封成形時，能夠有效率且確實地防止樹脂毛邊附著在樹脂不可接觸區域的各部位。 According to the present invention, when the semiconductor wafer mounted on the substrate is subjected to compression resin sealing molding, it is possible to efficiently and surely prevent the resin burrs from adhering to the respective portions of the resin inaccessible region.
因此，由於能夠使用壓縮樹脂密封成形方法，對在安裝有半導體晶片的基板的表面側開設焊接點等電連接部位或固接件的插通用孔部等的具有樹脂不可接觸區域的構造的基板，進行密封成形，因此能夠發揮高效地生產使用這種基板的半導體晶片的樹脂密封成形品的優異而實用的效果。 Therefore, a substrate having a structure of a resin-non-contactable region such as an electrical connection portion such as a solder joint or an insertion hole portion of the fastener can be formed on the surface side of the substrate on which the semiconductor wafer is mounted, by using a compression resin sealing molding method. Since the sealing molding is performed, it is possible to exhibit an excellent and practical effect of efficiently producing a resin-sealed molded article of a semiconductor wafer using such a substrate.
根據本發明，藉由在基板的半導體晶片的安裝面黏貼並使用樹脂毛邊防止用帶材，在對安裝於基板的半導體晶片進行壓縮樹脂密封成形時，能夠有效率地且確實地防止樹脂毛邊附著在樹脂不可接觸區域的各部位。 According to the present invention, the resin burr preventing strip is adhered to the mounting surface of the semiconductor wafer of the substrate, and when the semiconductor wafer mounted on the substrate is subjected to compression resin sealing molding, the resin burr can be efficiently and surely prevented from adhering. At various parts of the area where the resin is not accessible.
因此，由於能夠使用壓縮樹脂密封成形方法，對在安裝有半導體晶片的基板的表面側開設焊接點等電連接部位或固接件的插通用孔部 等的具有樹脂不可接觸區域的構造的基板，進行密封成形，因此能夠發揮高效地生產使用這種基板的半導體晶片的樹脂密封成形品的優異而實用的效果。 Therefore, since the compression resin sealing molding method can be used, an electrical connection portion such as a solder joint or an insertion hole portion of the fixing member is formed on the surface side of the substrate on which the semiconductor wafer is mounted. Since the substrate having the structure of the resin-non-contactable region is subjected to the sealing and molding, it is possible to exhibit an excellent and practical effect of efficiently producing a resin-sealed molded article of a semiconductor wafer using such a substrate.
A‧‧‧樹脂成形區域 A‧‧‧Resin forming area
B‧‧‧樹脂不可接觸區域 B‧‧‧Resistible area of resin
R‧‧‧透明樹脂材料 R‧‧‧Transparent resin material
1‧‧‧樹脂密封前基板 1‧‧‧ resin sealed front substrate
1a‧‧‧製品構成單位(最小分割單位) 1a‧‧‧Product constituent units (minimum division unit)
2‧‧‧LED晶片 2‧‧‧LED chip
3‧‧‧電連接部位 3‧‧‧Electrical connection
4‧‧‧插通用孔部 4‧‧‧Insert universal hole
5‧‧‧壓縮樹脂密封成形裝置 5‧‧‧Compressed resin sealing forming device
6‧‧‧樹脂成形用上模 6‧‧‧Upper mold for resin molding
7‧‧‧樹脂成形用下模 7‧‧‧Resin forming mold
7a‧‧‧框體 7a‧‧‧ frame
7b‧‧‧樹脂加壓構件 7b‧‧‧Resin pressure member
7c‧‧‧下模腔室 7c‧‧‧ lower mold chamber
7d‧‧‧晶狀體成形部 7d‧‧‧Lens formation
8‧‧‧可動板 8‧‧‧ movable plate
9‧‧‧彈性構件 9‧‧‧Flexible components
10‧‧‧樹脂毛邊防止用構件 10‧‧‧Resin edging prevention member
10a‧‧‧上端部 10a‧‧‧Upper end
10b‧‧‧下端部 10b‧‧‧Bottom
11‧‧‧彈性構件 11‧‧‧Flexible components
12‧‧‧樹脂密封後基板 12‧‧‧Resin sealed substrate
12a‧‧‧透明樹脂成形體(晶狀體) 12a‧‧‧Transparent resin molded body (lens)
20‧‧‧樹脂毛邊防止用帶材 20‧‧‧Resin edging prevention strip
20a‧‧‧樹脂接著用孔部 20a‧‧‧ resin followed by holes
20b‧‧‧樹脂附著防止部 20b‧‧‧Resin adhesion prevention department
21‧‧‧樹脂密封後基板 21‧‧‧Resin sealed substrate
21a‧‧‧透明樹脂成形體(晶狀體) 21a‧‧‧Transparent resin molded body (lens)
圖1：係例示本發明方法所使用的樹脂密封前基板；圖1(1)係概略地表示該基板的整體構造的局部省略俯視圖，圖1(2)係放大表示該基板主要部分的概略俯視圖。 Fig. 1 is a view showing a resin-sealed front substrate used in the method of the present invention; Fig. 1 (1) schematically shows a partially omitted plan view of the entire structure of the substrate, and Fig. 1 (2) is an enlarged plan view showing a main portion of the substrate. .
圖2：係例示用於實施本發明方法的壓縮樹脂密封成形裝置的主要部分；圖2(1)係表示在該裝置的下模腔室部放置樹脂密封前基板的狀態的概略縱剖面圖，圖2(2)係放大表示該裝置主要部分的概略縱剖面圖。 Fig. 2 is a view showing a main portion of a compression resin sealing and molding apparatus for carrying out the method of the present invention; and Fig. 2 (1) is a schematic longitudinal cross-sectional view showing a state in which a resin-sealed front substrate is placed in a lower mold chamber portion of the apparatus, Fig. 2 (2) is an enlarged schematic longitudinal sectional view showing the main part of the apparatus.
圖3：圖3(1)係本發明方法中的透明樹脂材料填充步驟的說明圖，圖3(2)係樹脂密封前基板的搬入步驟的說明圖。 Fig. 3 is an explanatory view showing a step of filling a transparent resin material in the method of the present invention, and Fig. 3 (2) is an explanatory view showing a step of carrying in a substrate before resin sealing.
圖4：圖4(1)係本發明方法中的樹脂密封前基板的放置步驟、以及該基板中的樹脂不可接觸區域的覆蓋步驟的說明圖，圖4(2)係LED晶片的往透明樹脂材料中的浸漬步驟、以及壓縮樹脂密封成形步驟的說明圖。 Figure 4: Figure 4 (1) is an explanatory view of a step of placing a resin-sealed front substrate in the method of the present invention, and a step of covering a resin-non-contactable region in the substrate, and Figure 4 (2) is a transparent resin of the LED wafer An illustration of the impregnation step in the material and the compression resin sealing forming step.
圖5：圖5(1)係與圖4(2)對應的說明圖，其主要部分的放大圖，圖5(2)係表示樹脂密封後基板(成形品)的概略縱剖面圖。 Fig. 5 (1) is an explanatory view corresponding to Fig. 4 (2), an enlarged view of a main portion thereof, and Fig. 5 (2) is a schematic longitudinal sectional view showing a resin-sealed substrate (molded article).
圖6：係表示用於實施本發明方法的其他的壓縮樹脂密封成形裝置的主要部分的概略縱剖面圖。 Fig. 6 is a schematic longitudinal cross-sectional view showing the main part of another compression resin sealing and molding apparatus for carrying out the method of the present invention.
圖7：係例示本發明方法所使用的樹脂密封前基板；圖7(1)係概略地表示該基板的整體構造的局部省略俯視圖，圖7(2)係放大表示該基板 的主要部分的概略俯視圖。 Fig. 7 is a view showing a resin-sealed front substrate used in the method of the present invention; Fig. 7 (1) schematically shows a partially omitted plan view of the entire structure of the substrate, and Fig. 7 (2) shows the substrate in an enlarged manner. A rough top view of the main part.
圖8：係例示用於實施本發明方法的樹脂毛邊防止用帶材；圖8(1)係該帶材的概略俯視圖，圖8(2)係放大表示該帶材的主要部分的概略俯視圖。 Fig. 8 is a schematic plan view showing a resin burr preventing strip for carrying out the method of the present invention; Fig. 8 (1) is a schematic plan view of the strip, and Fig. 8 (2) is an enlarged plan view showing a main portion of the strip.
圖9：圖9(1)係表示與圖7及圖8對應的樹脂密封前基板、及樹脂毛邊防止用帶材的主要部分的概略縱剖面圖，圖9(2)係表示將該基板與該帶材黏貼成一體的帶材黏貼基板的主要部分的概略縱剖面圖，圖9(3)係表示在用於實施本發明方法的壓縮樹脂密封成形裝置中的下模腔室部，放置有帶材黏貼基板的狀態的概略縱剖面圖。 Fig. 9 (1) is a schematic longitudinal cross-sectional view showing a main portion of a resin-sealed front substrate and a resin burr preventing strip corresponding to Figs. 7 and 8, and Fig. 9 (2) shows the substrate and A schematic longitudinal cross-sectional view of a main portion of the strip-adhesive substrate to which the strip is adhered, and FIG. 9 (3) shows a lower mold chamber portion in a compression-resin sealing and molding apparatus for carrying out the method of the present invention. A schematic longitudinal cross-sectional view of a state in which a tape is pasted to a substrate.
圖10：圖10(1)係本發明方法中的透明樹脂材料填充步驟的說明圖，圖10(2)係帶材黏貼基板的搬入步驟的說明圖。 Fig. 10 is an explanatory view showing a step of filling a transparent resin material in the method of the present invention, and Fig. 10 (2) is an explanatory view showing a step of carrying in a strip-bonding substrate.
圖11：圖11(1)係本發明方法中的帶材黏貼基板放置步驟的說明圖，圖11(2)係LED晶片的往透明樹脂材料中的浸漬步驟、以及壓縮樹脂密封成形步驟的說明圖。 Figure 11 is an explanatory view showing a step of placing a tape-adhering substrate in the method of the present invention, and Figure 11 (2) is a step of immersing the LED wafer in a transparent resin material, and a description of a step of forming a compression-resin sealing process Figure.
圖12：圖12(1)係與圖11(2)對應的說明圖，且放大表示壓縮樹脂成形裝置的主要部分。圖12(2)係表示樹脂密封後基板(成形品)的概略縱剖面圖，圖12(3)係表示與圖12(2)對應的樹脂密封後基板的概略縱剖面圖，表示剝離樹脂毛邊防止用帶材的狀態。 Fig. 12 is an explanatory view corresponding to Fig. 11 (2), and is an enlarged view showing a main part of the compression resin molding apparatus. Fig. 12 (2) is a schematic longitudinal cross-sectional view showing a resin-sealed substrate (molded article), and Fig. 12 (3) is a schematic longitudinal cross-sectional view showing a resin-sealed substrate corresponding to Fig. 12 (2), showing peeling resin burrs Prevent the condition of the strip.
圖13：係習知的壓縮樹脂密封成形方法的說明圖；圖13(1)係表示壓縮樹脂密封成形裝置與樹脂密封前基板的主要部分的概略縱剖面圖，圖13(2)係表示關閉該裝置的模具的狀態的概略縱剖面圖，圖13(3)係表示樹脂密封後基板(成形品)的概略縱剖面圖。 Fig. 13 is an explanatory view showing a conventional compression resin sealing molding method; Fig. 13 (1) is a schematic longitudinal cross-sectional view showing a main portion of a compression resin sealing molding apparatus and a resin sealing front substrate, and Fig. 13 (2) is a closed view. A schematic longitudinal cross-sectional view of the state of the mold of the apparatus, and Fig. 13 (3) is a schematic longitudinal cross-sectional view of the resin-sealed substrate (molded article).
以下，說明在圖1至圖12中所示的本發明的實施例1~3。【實施例1】在圖1中，例示本發明方法所使用的樹脂密封前基板1。在該樹脂密封前基板1形成有作為製品而切斷分離成各個的多個製品構成單位(最小分割單位)1a。此外，在樹脂密封前基板1中的各製品構成單位1a的表面安裝有所需數量(圖例中為3個)的LED晶片(半導體晶片)2，該LED晶片安裝部位被設定成用於對LED晶片2進行樹脂密封成形的樹脂成形區域A。進一步地，在該各製品構成單位1a的表面開設有焊接點等電連接部位3或固接件的插通用孔部4等，因此，有必要設定成在樹脂成形時透明樹脂材料的一部分不會附著於該等部位而形成樹脂毛邊。因此，該等部位被設定成用於在樹脂成形時防止透明樹脂材料接觸的所謂的樹脂不可接觸區域B。 Hereinafter, Embodiments 1 to 3 of the present invention shown in Figs. 1 to 12 will be described. [Embodiment 1] In Fig. 1, a resin-sealed front substrate 1 used in the method of the present invention is exemplified. In the resin-sealed front substrate 1, a plurality of product constituent units (minimum division units) 1a which are cut and separated into individual products are formed. Further, a desired number (three in the drawing) of an LED wafer (semiconductor wafer) 2 is mounted on the surface of each of the product constituent units 1a in the resin-sealed front substrate 1, and the LED chip mounting portion is set for the pair of LEDs. The wafer 2 is subjected to resin molding forming of the resin molding region A. Further, the surface of each of the product constituent units 1a is provided with an electrical connection portion 3 such as a solder joint or an insertion hole portion 4 of the fixing member. Therefore, it is necessary to set a part of the transparent resin material during resin molding. Adhered to these parts to form a resin burr. Therefore, the portions are set as so-called resin inaccessible regions B for preventing contact of the transparent resin material at the time of resin molding.
在圖2中，例示用以實施本發明方法而所使用的壓縮樹脂密封成形裝置5的主要部分。在該成形裝置5對設有樹脂成形用的上模6與下模7。此外，在該上模6，設置有例如利用減壓的吸引作用等的樹脂密封前基板1的吸附支持手段(未圖示)。此外，該上模6與下模7的兩模具以使其可透過適當的模具開閉機構(未圖示)進行開閉之方式設置。此外，下模7配置在透過適當的上下移動機構(未圖示)而裝設成可上下移動的可動板8的上部。此外，下模7係由框體7a、及嵌於該框體中的樹脂加壓構件7b構成；該框體7a與樹脂加壓構件7b兩者嵌合的上方的嵌合凹部，構成有成為透明樹脂材料R的供給部、且成為樹脂成形部的下模腔室7c。進一步地，該框體7a以藉由裝設於下模7與可動板8之間的彈性構件9的 彈性按壓力而向上移動之方式設置。此外，在構成下模腔室7c的底面的樹脂加壓構件7b的上面的既定位置，設置有用於對安裝於樹脂密封前基板1的LED晶片2進行樹脂密封的晶狀體成形部7d。此外，嵌裝於框體7a中的樹脂加壓構件7b，固接在可動板8的上面，因此以與可動板8成為一體並上下移動之方式設置。 In Fig. 2, the main part of the compression resin sealing and forming apparatus 5 used to carry out the method of the present invention is exemplified. The upper mold 6 and the lower mold 7 for resin molding are provided in the pair of molding apparatuses 5. In addition, the upper mold 6 is provided with an adsorption supporting means (not shown) for sealing the front substrate 1 with a resin such as a suction action by a reduced pressure. Further, the upper mold 6 and the lower mold 7 are provided so as to be openable and closable by an appropriate mold opening and closing mechanism (not shown). Further, the lower mold 7 is disposed at an upper portion of the movable panel 8 that is mounted to be movable up and down by an appropriate vertical movement mechanism (not shown). Further, the lower mold 7 is composed of a frame body 7a and a resin pressurizing member 7b fitted in the frame body, and the upper fitting recessed portion in which the frame body 7a and the resin pressurizing member 7b are fitted is formed. The supply portion of the transparent resin material R serves as the lower mold chamber 7c of the resin molded portion. Further, the frame 7a is made of an elastic member 9 that is disposed between the lower die 7 and the movable plate 8. The elastic force is set by moving upwards according to the pressure. Further, a lens molding portion 7d for resin-sealing the LED wafer 2 attached to the resin-sealed front substrate 1 is provided at a predetermined position on the upper surface of the resin pressing member 7b constituting the bottom surface of the lower mold chamber 7c. Further, since the resin pressing member 7b fitted in the casing 7a is fixed to the upper surface of the movable plate 8, it is provided integrally with the movable plate 8 and moved up and down.
另外，在往下模腔室7c內填充透明樹脂材料R，並且如圖2(1)所示，在隔著樹脂密封前基板1使上模6與下模7的兩模具面間接合的合模時的狀態下，藉由使樹脂加壓構件7b(可動板8)往上移動，構成可對該下模腔室內的透明樹脂材料R施加既定的樹脂壓力的所謂的壓縮成形的樹脂成形模具構造。 Further, the transparent mold material R is filled in the lower mold chamber 7c, and as shown in Fig. 2 (1), the upper mold 6 and the lower mold 7 are joined together by the resin sealing front substrate 1 therebetween. In the state of the mold, the resin pressing member 7b (movable plate 8) is moved upward to form a so-called compression-molded resin molding die which can apply a predetermined resin pressure to the transparent resin material R in the lower cavity. structure.
此外，在與放置於下模腔室7c的既定位置(在圖例中，為框體7a的上面部)的樹脂密封前基板1的樹脂不可接觸區域B的部位相對應的下模7的位置，配設有按壓狀地緊貼於該樹脂不可接觸區域B的部位的樹脂毛邊防止用構件10。 Further, at the position of the lower mold 7 corresponding to the portion of the resin non-contact region B of the resin-sealed front substrate 1 at a predetermined position (in the illustrated example, the upper surface portion of the frame 7a) placed in the lower mold chamber 7c, The resin burr preventing member 10 is placed in a portion that is pressed against the resin inaccessible region B in a pressed manner.
該樹脂毛邊防止用構件10，以嵌於樹脂加壓構件7b及可動板8中並且能夠相對於樹脂加壓構件7b及可動板8上下移動、並且藉由安裝於該可動板8的彈性構件11的彈性按壓力而往上移動之方式設置。 The resin burr preventing member 10 is fitted into the resin pressing member 7b and the movable plate 8 and is movable up and down with respect to the resin pressing member 7b and the movable plate 8, and is attached to the elastic member 11 of the movable plate 8 The elasticity is set by moving upwards by pressure.
此外，樹脂毛邊防止用構件10，如圖1(1)所示，成為與樹脂密封前基板1的各樹脂不可接觸區域B的部位相對應的形狀的板狀體並個別地形成。 In addition, as shown in Fig. 1 (1), the resin burr preventing member 10 is formed into a plate-like body having a shape corresponding to a portion of the resin-unsuitable region B of the resin-sealed front substrate 1, and is formed separately.
進一步地，該等樹脂毛邊防止用構件10，如圖2(1)所示，藉由彈性構件11的彈性按壓力，分別往上移動，並且其上端部10a突出於 下模腔室7c內。亦即，此時，各樹脂毛邊防止用構件10，由於成為個別地配設於樹脂不可接觸區域B的各部位的構成，因此該各樹脂毛邊防止用構件10的各個，成為能夠獨立地上下移動的狀態。 Further, the resin burr preventing members 10 are respectively moved upward by the elastic pressing force of the elastic member 11 as shown in Fig. 2 (1), and the upper end portion 10a thereof protrudes from Inside the lower mold chamber 7c. In other words, each of the resin burrs preventing members 10 is configured to be individually disposed in each of the resin inaccessible regions B. Therefore, each of the resin burrs preventing members 10 can be vertically moved up and down. status.
此外，未突出有各樹脂毛邊防止用構件的上端部10a的下模腔室7c內的各部位，與樹脂密封前基板1的LED晶片2的安裝位置相對應，因此，該等部位成為用於對該LED晶片2進行樹脂密封成形的樹脂成形區域A。 Further, each portion in the lower mold chamber 7c in which the upper end portion 10a of each resin burr preventing member is not protruded corresponds to the mounting position of the LED wafer 2 of the resin-sealed front substrate 1, and therefore, these portions are used for The LED wafer 2 is subjected to a resin molding region A which is resin-sealed.
另外，在圖1所示的樹脂密封前基板1，形成有多個製品構成單位(最小分割單位)1a，但在圖例中，係表示設定6處的樹脂成形區域A及樹脂不可接觸區域B的情形。 Further, in the resin-sealed front substrate 1 shown in FIG. 1, a plurality of product constituent units (minimum division units) 1a are formed, but in the drawings, the resin-molded region A and the resin-inaccessible region B at six locations are set. situation.
此外，在圖2所示的下模7，表示與該樹脂密封前基板1的形狀、構造相對應，配設有6處的樹脂成形部(樹脂成形區域A)，並進一步地在6處的樹脂不可接觸區域B的部位配設樹脂毛邊防止用構件10的情形。 In addition, the lower mold 7 shown in FIG. 2 corresponds to the shape and structure of the resin-sealed front substrate 1, and six resin molded portions (resin forming regions A) are disposed, and further at six places. The resin burr preventing member 10 is disposed in the portion where the resin is not in contact with the region B.
然而，根據設定於樹脂密封前基板1的製品構成單位1a的數量、與該樹脂密封前基板的構造，而決定的樹脂成形區域A及樹脂不可接觸區域B的數量，而且對應該等而決定的樹脂毛邊防止用構件10的數量或形狀及配置的態樣等，係可對應所使用的樹脂密封前基板的形狀、構造而適宜地變更並實施。 However, the number of the resin forming regions A and the resin inaccessible regions B determined in accordance with the number of the product constituent units 1a set in the resin-sealed front substrate 1 and the structure of the resin-pre-sealed substrate is determined in accordance with the requirements. The number, shape, and arrangement of the resin burr preventing members 10 can be appropriately changed and implemented in accordance with the shape and structure of the resin-sealed front substrate to be used.
此外，往與各樹脂成形區域A對應的各樹脂成形部供給所需量的透明樹脂材料R，但作為該透明樹脂材料的供給態樣，例如亦可採用眾知的噴霧器(dispenser)將所需量的透明樹脂材料R依次供給到各樹脂成形 部內，或者亦可採用構成為能夠將所需量的透明樹脂材料R同時供給到各樹脂成形部內的各個之專用噴霧器或其他適當的樹脂材料供給手段(未圖示)。 In addition, a required amount of the transparent resin material R is supplied to each resin molding portion corresponding to each of the resin molding regions A. However, as a supply form of the transparent resin material, for example, a known dispenser may be used. A quantity of transparent resin material R is sequentially supplied to each resin to form In the inside, a dedicated atomizer or other suitable resin material supply means (not shown) that can supply the required amount of the transparent resin material R to each of the resin molded portions can be used.
以下，針對在不使樹脂毛邊附著在設在樹脂密封前基板1的樹脂不可接觸區域B的各部位，並利用透明樹脂材料R對該樹脂密封前基板1上的LED晶片2進行樹脂密封成形的步驟及作用進行說明。 In the following, the LED wafer 2 on the resin-sealed front substrate 1 is resin-sealed by the transparent resin material R so that the resin burrs are not adhered to the respective portions of the resin-non-contactable region B provided in the resin-sealed front substrate 1. The steps and functions are explained.
首先，如圖1及圖2所示，準備樹脂密封前基板1，該樹脂密封前基板1的構造係在半導體基板的表面安裝有LED晶片2，並且在半導體基板的表面側具有樹脂不可接觸區域B；進一步地，準備樹脂密封成形用之上下兩模6、7，該上下兩模6、7係在與該半導體基板的樹脂不可接觸區域B的各部位對應的樹脂成形用下模腔室7c內的各部位配設有樹脂毛邊防止用構件10。另外，將該上下兩模6、7預熱至所需的樹脂成形溫度。 First, as shown in FIGS. 1 and 2, a resin-sealed front substrate 1 having a structure in which an LED wafer 2 is mounted on a surface of a semiconductor substrate and a resin inaccessible region on a surface side of the semiconductor substrate is prepared. Further, the upper and lower molds 6 and 7 for resin sealing molding are prepared, and the upper and lower molds 6 and 7 are the lower mold chamber 7c for resin molding corresponding to each portion of the resin non-contact region B of the semiconductor substrate. The resin burr preventing member 10 is disposed in each part. Further, the upper and lower molds 6, 7 are preheated to a desired resin molding temperature.
接下來，如圖3(1)所示，進行透明樹脂材料的填充步驟，係在除了樹脂毛邊防止用構件10的各部位以外的下模腔室7c內，亦即在各樹脂成形區域A內填充所需量的透明樹脂材料R。另外，該透明樹脂材料的填充步驟，為了謀求各樹脂成形區域A內的樹脂成形條件的均一化，較佳為設定成往各樹脂成形區域A內同時供給已加熱的所需量的透明樹脂材料(例如，具有流動性的樹脂材料)。 Next, as shown in Fig. 3 (1), the step of filling the transparent resin material is carried out in the lower mold chamber 7c except for the respective portions of the resin burr preventing member 10, that is, in each of the resin forming regions A. A required amount of the transparent resin material R is filled. In addition, in order to uniformize the resin molding conditions in each resin molding region A, it is preferable to supply the transparent resin material required to be heated in the respective resin molding regions A at the same time. (for example, a resin material having fluidity).
接下來，如圖3(2)所示，進行樹脂密封前基板1的搬入步驟，係將樹脂密封前基板1在使其表面側朝下的狀態下，搬入至樹脂密封成形用的上下兩模6、7之間。 Then, as shown in Fig. 3 (2), the step of carrying the resin-sealed front substrate 1 is carried out, and the resin-sealed front substrate 1 is carried into the upper and lower molds for resin sealing molding with the surface side thereof facing downward. Between 6,7.
接下來，如圖4(1)所示，進行樹脂密封前基板1的放置 步驟，係在已搬入至上下兩模6、7之間的樹脂密封前基板1的表面側成為朝下的狀態下，將其放置在下模腔室7c的既定位置。此外，在該樹脂密封前基板1的放置步驟時，進行使突出於下模腔室7c內的各樹脂毛邊防止用構件10的上端部10a接合於樹脂密封前基板1的樹脂不可接觸區域B的各部位之該樹脂不可接觸區域B的覆蓋步驟。 Next, as shown in FIG. 4 (1), the placement of the substrate 1 before resin sealing is performed. In the state in which the surface side of the resin-sealed front substrate 1 that has been carried between the upper and lower molds 6 and 7 is placed downward, the step is placed at a predetermined position of the lower mold chamber 7c. In addition, in the step of placing the resin-sealed front substrate 1, the upper end portion 10a of each resin burr preventing member 10 protruding in the lower mold chamber 7c is bonded to the resin non-contact region B of the resin-sealed front substrate 1 The covering step of the resin in each portion is not contactable with the region B.
接下來，如圖4(2)所示，進行LED晶片2的往透明樹脂材料R中的浸漬步驟，係透過可動板8將樹脂加壓構件7b上推，藉此將放置於下模腔室7c的樹脂密封前基板1的表面側嵌入於該下模腔室7c內，且使該樹脂密封前基板表面的LED晶片2浸漬於下模腔室7c內的透明樹脂材料(具有流動性的樹脂材料)R中。 Next, as shown in FIG. 4 (2), the immersing step of the LED wafer 2 into the transparent resin material R is performed, and the resin pressing member 7b is pushed up through the movable plate 8, thereby being placed in the lower mold chamber. The surface side of the resin-sealed front substrate 1 of 7c is embedded in the lower mold cavity 7c, and the LED wafer 2 on the surface of the resin-sealed front substrate is immersed in a transparent resin material in the lower mold cavity 7c (having a fluid resin) Material) R.
進一步地，進行壓縮樹脂密封成形步驟，係藉由該樹脂加壓構件7b，壓縮下模腔室7c內的透明樹脂材料R，而對半導體基板表面的LED晶片2以對應於下模腔室7c的形狀之方式進行樹脂密封成形。 Further, a compression resin sealing forming step is performed by compressing the transparent resin material R in the lower mold chamber 7c by the resin pressing member 7b, and the LED wafer 2 on the surface of the semiconductor substrate corresponding to the lower mold chamber 7c The shape of the shape is resin-sealed.
接下來，進行透過可動板8使樹脂加壓構件7b及下模7下降，並且打開上下兩模6、7，從該上下兩模間將樹脂密封後基板12往外部搬出的步驟。 Then, the resin pressing member 7b and the lower mold 7 are lowered by the movable plate 8, and the upper and lower molds 6 and 7 are opened, and the resin-sealed substrate 12 is carried out from the upper and lower molds.
如以上所述，能夠不使樹脂毛邊附著在設置於樹脂密封前基板1的樹脂不可接觸區域B的各部位，並利用透明樹脂材料R對該樹脂密封前基板1上的各LED晶片2進行樹脂密封成形。 As described above, the resin burrs can be adhered to the respective portions of the resin non-contact region B provided in the resin-sealed front substrate 1 and the LED wafer 2 on the resin-sealed front substrate 1 can be resin-coated with the transparent resin material R. Sealed and formed.
而且，如圖5所示，能夠分別將樹脂密封後基板12上的各LED晶片2密封於與下模腔室的晶狀體成形部7d的形狀對應的形狀的透明樹脂成形體(晶狀體)12a內(例如，能夠使其熱固化)。 Further, as shown in FIG. 5, each of the LED chips 2 on the resin-sealed substrate 12 can be sealed in a transparent resin molded body (crystal) 12a having a shape corresponding to the shape of the lens-molded portion 7d of the lower mold chamber ( For example, it can be thermally cured).
根據實施例1，在對安裝於半導體基板的LED晶片2進行壓縮樹脂密封成形時，能夠有效率且確實地防止樹脂毛邊附著在樹脂不可接觸區域B的各部位。 According to the first embodiment, when the LED wafer 2 mounted on the semiconductor substrate is subjected to compression resin sealing molding, it is possible to efficiently and surely prevent the resin burrs from adhering to the respective portions of the resin inaccessible region B.
因此，由於能夠採用壓縮樹脂密封成形方法對具有樹脂不可接觸區域B的構造的半導體基板進行密封成形，因此發揮了能夠高效地生產使用這種半導體基板的LED晶片的樹脂密封成形品之優異的實用效果。 Therefore, since the semiconductor substrate having the structure of the resin inaccessible region B can be sealed by the compression resin sealing molding method, the resin sealing molded article of the LED wafer using the semiconductor substrate can be efficiently produced. effect.
另外，如圖2所示，各樹脂毛邊防止用構件10以藉由彈性構件11的彈性而往上方上推之方式設置。因此，在樹脂密封前基板1的放置步驟時，不僅能夠進行使下模腔室7c內的各樹脂毛邊防止用構件10接合於樹脂密封前基板1的樹脂不可接觸區域B的各部位之樹脂密封前基板1的樹脂不可接觸區域覆蓋步驟，至少在該樹脂不可接觸區域覆蓋步驟時，能夠進行使樹脂毛邊防止用構件10按壓狀地緊貼於樹脂不可接觸區域B的各部位之樹脂毛邊防止用構件10的彈性按壓步驟。 Moreover, as shown in FIG. 2, each resin burr preventing member 10 is provided so as to be pushed upward by the elasticity of the elastic member 11. Therefore, in the step of placing the substrate 1 before the resin sealing, not only the resin sealing of each portion of the resin burr preventing member 10 in the lower mold cavity 7c bonded to the resin non-contact region B of the resin sealing front substrate 1 can be performed. In the resin non-contact area covering step of the front substrate 1, at least in the resin non-contact area covering step, the resin burr preventing member 10 can be pressed against the resin burr prevention area B in a pressed manner. The elastic pressing step of the member 10.
在進行該樹脂毛邊防止用構件10的彈性按壓步驟時，由於能夠使樹脂毛邊防止用構件10按壓狀地緊貼於半導體基板的樹脂不可接觸區域B的各部位，因此能夠更加確實地防止樹脂毛邊附著在該樹脂不可接觸區域B。 In the elastic pressing step of the resin burr preventing member 10, the resin burr preventing member 10 can be pressed against the respective portions of the resin non-contact region B of the semiconductor substrate in a pressed manner, so that resin burrs can be more reliably prevented. Adhered to the resin inaccessible area B.
此外，如圖2所示，各樹脂毛邊防止用構件10以藉由彈性構件11的彈性個別地往上方上推之方式設置。因此，至少在樹脂密封前基板1的樹脂不可接觸區域覆蓋步驟時，能夠進行使樹脂毛邊防止用構件10個別地且按壓狀地緊貼於樹脂密封前基板1的樹脂不可接觸區域B的各部位之樹脂毛邊防止用構件10的彈性按壓步驟。 Moreover, as shown in FIG. 2, each resin burr prevention member 10 is provided so that it may push up individually by the elasticity of the elastic member 11. Therefore, at least in the resin non-contact area covering step of the resin-sealed front substrate 1, the resin burr preventing member 10 can be individually and pressed against the respective portions of the resin non-contact region B of the resin-sealed front substrate 1 The elastic pressing step of the resin burr preventing member 10.
在進行如此之樹脂毛邊防止用構件10的彈性按壓步驟時，由於能夠個別地按壓樹脂毛邊防止用構件10並緊貼於樹脂不可接觸區域B的各部位，因此即使在例如半導體基板的樹脂不可接觸區域B的各部位存在厚度不均的情形下，亦能夠均等地按壓該各部位。 When the resin burr preventing member 10 is subjected to the elastic pressing step of the resin burr preventing member 10, the resin burr preventing member 10 can be individually pressed and adhered to each portion of the resin uncontactable region B, so that the resin of the semiconductor substrate is not contacted, for example. When there is uneven thickness in each part of the region B, the respective portions can be uniformly pressed.
因此，能夠防止由於對樹脂不可接觸區域B的各部位施加過大的按壓力而損傷該各部位、或相反地由於在樹脂不可接觸區域B的各部位無法獲得所需之按壓力而導致樹脂毛邊附著在該各部位等的弊端。 Therefore, it is possible to prevent the respective portions from being damaged by applying an excessive pressing force to the respective portions of the resin inaccessible region B, or conversely, the resin burrs are attached due to the inability to obtain the required pressing force at the respective portions of the resin inaccessible region B. The disadvantages of these parts and the like.
接下來，說明圖6所示之本發明的實施例2。【實施例2】在實施例1中，將各樹脂毛邊防止用構件10以藉由彈性構件11的彈性而往上方上推之方式設置，進一步地，藉由彈性構件11的彈性將各樹脂毛邊防止用構件10以個別地往上方上推之方式設置，但在實施例2中，如圖6所示，將覆蓋且按壓狀地緊貼樹脂密封前基板1的樹脂不可接觸區域B的各部位的樹脂毛邊防止用構件10，以同時緊貼於樹脂不可接觸區域B的整體部位之方式配設而構成。 Next, a second embodiment of the present invention shown in Fig. 6 will be described. [Embodiment 2] In the first embodiment, each of the resin burr prevention members 10 is provided to be pushed upward by the elasticity of the elastic member 11, and further, each resin is burred by the elasticity of the elastic member 11. The preventing member 10 is provided to be pushed up upwards individually. However, in the second embodiment, as shown in FIG. 6, the portions of the resin inaccessible region B which are covered and pressed against the resin sealing front substrate 1 are closely adhered. The resin burr preventing member 10 is disposed so as to be in close contact with the entire portion of the resin inaccessible region B.
另外，其他之構成、作用，實質上係與前一實施例相同。因此，針對與前一實施例實質上相同的構成構件標記相同的符號，並避免說明之重複。 In addition, the other configurations and operations are substantially the same as in the previous embodiment. Therefore, the same constituent elements as those of the previous embodiment are denoted by the same reference numerals, and the repetition of the description is avoided.
亦即，圖6所示之各樹脂毛邊防止用構件10的下端部10b，在樹脂加壓構件7b的下面側連結成一體，進一步地，在該下端部10b與可動板8之間裝設有彈性構件11。因此，該樹脂毛邊防止用構件10以能夠藉由彈性構件11的彈性而往上方上推之方式設置。因此，該樹脂毛邊防止用構件的各上端部10a，以能夠同時覆蓋、且同時按壓狀地緊貼於樹脂密封前 基板1的樹脂不可接觸區域B的整體部位之方式構成。根據如此之構成，能夠謀求整體的模具構造的簡化、及裝置製造的成本降低。 In other words, the lower end portion 10b of each of the resin burr preventing members 10 shown in Fig. 6 is integrally coupled to the lower surface side of the resin pressing member 7b, and further, between the lower end portion 10b and the movable plate 8, Elastic member 11. Therefore, the resin burr preventing member 10 is provided so as to be able to push upward by the elasticity of the elastic member 11. Therefore, each of the upper end portions 10a of the resin burr preventing member can be simultaneously covered and pressed against the resin before being sealed. The resin of the substrate 1 is not configured to contact the entire portion of the region B. According to such a configuration, it is possible to simplify the overall mold structure and reduce the cost of manufacturing the device.
此外，由於能夠同時緊貼於半導體基板的樹脂不可接觸區域B的整體部位，因此能夠對該各部位同時且均等地進行按壓。因此，例如在半導體基板的樹脂不可接觸區域B的各部位的厚度沒有不均的情形下，亦能夠良好地實施本發明。 Further, since the resin can be in close contact with the entire portion of the resin substrate in contact with the region B, it is possible to simultaneously and uniformly press the respective portions. Therefore, for example, in the case where the thickness of each portion of the resin inaccessible region B of the semiconductor substrate is not uneven, the present invention can be favorably implemented.
另外，亦可取代圖6所示之實施例2之構成，採用如下之構成(未圖示)：將覆蓋且按壓狀地緊貼於樹脂密封前基板1的樹脂不可接觸區域B的各部位的樹脂毛邊防止用構件10，個別地配設在樹脂密封前基板1中的各個製品構成單位(最小分割單位)1a的每一個。即使在此情形，亦能夠謀求整體模具構造的簡化、及裝置製造的成本降低。 Further, in place of the configuration of the second embodiment shown in FIG. 6, a configuration (not shown) may be employed in which the portions of the resin-non-contactable region B of the resin-sealed front substrate 1 are adhered and pressed in close contact with each other. Each of the resin burrs preventing members 10 is individually disposed in each of the product constituent units (minimum division units) 1a in the resin-sealed front substrate 1. Even in this case, simplification of the overall mold structure and cost reduction of the device manufacturing can be achieved.
此外，由於能夠個別地按壓並緊貼於半導體基板的每個製品構成單位1a的樹脂不可接觸區域B的各部位，因此能夠對該各部位均等地進行按壓。因此，例如在每個製品構成單位1a中的樹脂不可接觸區域B的各部位沒有厚度不均的情形下，亦能夠良好地實施本發明。 Further, since each of the products of the semiconductor substrate can be individually pressed and adhered to each of the resin non-contact regions B of the unit 1a, the respective portions can be uniformly pressed. Therefore, for example, in the case where the respective portions of the resin inaccessible region B in each of the product constituent units 1a are not uneven in thickness, the present invention can be favorably carried out.
在前述各實施例中，樹脂材料可採用具有透明性、半透明性及不透明性的樹脂材料。此外，在前述各實施例中，作為樹脂材料，可使用固體狀或液體狀的樹脂材料。此外，作為固體狀之樹脂材料，例如可以使用粉末狀、顆粒狀或樹脂片(tablet)等。此外，在前述各實施例中，作為樹脂材料，可採用熱固性之樹脂材料、或熱塑性之樹脂材料。另外，作為熱固性之樹脂材料，可例舉矽樹脂材料、環氧樹脂樹脂材料。此外，在上述各實施例中，可以對顆粒狀的熱固性樹脂材料進行加熱並熔融化，且將LED 晶片2浸漬在該已加熱熔融的樹脂材料(具有流動性的樹脂材料)中之方式進行壓縮樹脂密封成形。 In the foregoing embodiments, the resin material may be a resin material having transparency, translucency, and opacity. Further, in each of the above embodiments, a solid or liquid resin material can be used as the resin material. Further, as the solid resin material, for example, a powder, a pellet, a resin, or the like can be used. Further, in each of the foregoing embodiments, as the resin material, a thermosetting resin material or a thermoplastic resin material may be employed. Further, as the thermosetting resin material, a enamel resin material or an epoxy resin material can be exemplified. Further, in each of the above embodiments, the particulate thermosetting resin material may be heated and melted, and the LED may be The wafer 2 is subjected to compression resin sealing molding so as to be immersed in the heat-melted resin material (a resin material having fluidity).
此外，在上述各實施例中，可以對液狀的熱固性樹脂材料(例如，具有透明性的矽樹脂材料)進行加熱，且將LED晶片2浸漬在該已加熱的樹脂材料(具有流動性的樹脂材料)中之方式進行壓縮樹脂密封成形。 Further, in each of the above embodiments, the liquid thermosetting resin material (for example, a resin material having transparency) may be heated, and the LED wafer 2 may be immersed in the heated resin material (resin having fluidity) The method of the material) is subjected to compression resin sealing molding.
作為半導體晶片，除了所述LED晶片之外，還可例舉出IC、電晶體、二極體等。此外，亦可使用引線框架、印刷電路板、陶瓷基板等取代半導體基板。 As the semiconductor wafer, in addition to the LED chip, an IC, a transistor, a diode, or the like can be exemplified. Further, a lead frame, a printed circuit board, a ceramic substrate, or the like may be used instead of the semiconductor substrate.
【實施例3】接下來說明本發明的實施例3。另外，在本實施例中的構造、作用，係與實施例1、2實質上相同。因此，針對與實施例1、2實質上相同的構成構件標記相同的符號。 [Embodiment 3] Next, Embodiment 3 of the present invention will be described. Further, the structures and operations in the present embodiment are substantially the same as those in the first and second embodiments. Therefore, the same constituent elements as those of the first and second embodiments are denoted by the same reference numerals.
在圖7中，例示本發明方法所使用的樹脂密封前基板1。在該樹脂密封前基板1形成有作為製品而切割分離成各個之多個製品構成單位(最小分割單位)1a。此外，在樹脂密封前基板1的各製品構成單位1a的表面安裝有所需數量(在圖例中為3個)的LED晶片2，該LED晶片安裝部位設定為用於對LED晶片2進行樹脂密封成形的樹脂成形區域A。進一步地，在該各製品構成單位1a的表面開設有焊接點等電連接部位3或固接件的插通用孔部4等，因此在該等部位中，有必要考慮在樹脂成形時透明樹脂材料的一部分沒有附著於該等部位並形成樹脂毛邊。因此，將該等部位設定成用於在樹脂成形時防止透明樹脂材料接觸的所謂的樹脂不可接觸區域B。 In Fig. 7, a resin-sealed front substrate 1 used in the method of the present invention is exemplified. In the resin-sealed front substrate 1, a plurality of product constituent units (minimum division units) 1a which are cut and separated into individual products are formed. Further, a desired number (three in the illustrated example) of the LED chip 2 is mounted on the surface of each of the product constituent units 1a of the resin-sealed front substrate 1, and the LED chip mounting portion is set for resin sealing of the LED wafer 2. Formed resin forming area A. Further, in the surface of each of the product constituent units 1a, the electrical connection portion 3 such as a solder joint or the interposing hole portion 4 of the fixing member is opened, and therefore it is necessary to consider the transparent resin material at the time of resin molding. A portion of the material is not attached to the portions and forms a resin burr. Therefore, these portions are set as so-called resin non-contact regions B for preventing contact of the transparent resin material at the time of resin molding.
在圖8，表示用於實施本發明方法的樹脂毛邊防止用帶材 20。在該樹脂毛邊防止用帶材20，在與樹脂密封前基板1的LED晶片2的樹脂成形區域A對應的部位，形成有樹脂接著用孔部20a，並且在與該樹脂密封前基板1的樹脂不可接觸LED晶片2的安裝面的樹脂不可接觸區域B對應的部位，形成有樹脂附著防止部20b。 Fig. 8 shows a resin burr preventing strip for carrying out the method of the present invention. 20. In the resin burr preventing strip 20, a resin-receiving hole portion 20a is formed at a portion corresponding to the resin-molded region A of the LED wafer 2 of the resin-sealed front substrate 1, and the resin of the front substrate 1 is sealed with the resin. The resin adhesion preventing portion 20b is formed in a portion where the resin non-contact region B of the mounting surface of the LED wafer 2 is not accessible.
圖9(1)，係表示樹脂密封前基板1與樹脂毛邊防止用帶材20的主要部分，此外，在圖9(2)，係表示將該帶材20黏貼於該基板1的表面(LED晶片2的安裝面)側並一體化，而構成帶材黏貼基板(1、20)的狀態。此外，在圖9(3)，例示為了實施本發明方法而使用的壓縮樹脂密封成形裝置5的主要部分。 Fig. 9 (1) shows a main portion of the resin-sealed front substrate 1 and the resin burr preventing strip 20, and Fig. 9 (2) shows that the strip 20 is adhered to the surface of the substrate 1 (LED) The mounting surface of the wafer 2 is integrated and integrated to form a state in which the tape is adhered to the substrates (1, 20). Further, in Fig. 9 (3), the main part of the compression resin sealing and molding apparatus 5 used for carrying out the method of the present invention is exemplified.
在該壓縮樹脂密封成形裝置5中，樹脂成形用的上模6與下模7相對向設置。此外，在該上模6，設置有例如利用減壓的吸引作用等的樹脂密封前基板1的吸附支持手段(未圖示)。此外，該上模6與下模7之兩模具，以能夠透過適當的模具開閉機構(未圖示)而開閉之方式設置。此外，下模7配置在透過適當的上下移動機構(未圖示)而裝設成可上下移動之可動板8的上部。此外，下模7由框體7a與嵌裝於該框體的樹脂加壓構件7b構成，該框體7a與樹脂加壓構件7b之兩者嵌合的上方的嵌合凹部，構成有由透明樹脂材料R的供給部且由樹脂成形部所構成的下模腔室7c。進一步地，該框體7a以藉由裝設於下模7與可動板8之間的彈性構件9的彈性按壓力而向上移動之方式設置。此外，在構成下模腔室7c的底面的樹脂加壓構件7b的上面的既定位置，設置有用於對安裝於樹脂密封前基板1的LED晶片2進行樹脂密封的晶狀體成形部7d。此外，嵌裝於框體7a的樹脂加壓構件7b，固接在可動板8的上面，且因此以與可動板8成為一 體而上下移動之方式設置。 In the compression resin sealing and molding apparatus 5, the upper mold 6 for resin molding is disposed opposite to the lower mold 7. In addition, the upper mold 6 is provided with an adsorption supporting means (not shown) for sealing the front substrate 1 with a resin such as a suction action by a reduced pressure. Further, the two molds of the upper mold 6 and the lower mold 7 are provided to be opened and closed by an appropriate mold opening and closing mechanism (not shown). Further, the lower mold 7 is disposed at an upper portion of the movable plate 8 that is vertically movable by an appropriate vertical movement mechanism (not shown). Further, the lower mold 7 is composed of a frame body 7a and a resin pressurizing member 7b fitted to the frame body, and the upper fitting recessed portion in which the frame body 7a and the resin pressurizing member 7b are fitted is formed to be transparent. A supply chamber of the resin material R and a lower mold chamber 7c composed of a resin molded portion. Further, the frame body 7a is provided to be moved upward by the elastic pressing force of the elastic member 9 provided between the lower mold 7 and the movable plate 8. Further, a lens molding portion 7d for resin-sealing the LED wafer 2 attached to the resin-sealed front substrate 1 is provided at a predetermined position on the upper surface of the resin pressing member 7b constituting the bottom surface of the lower mold chamber 7c. Further, the resin pressing member 7b fitted to the frame body 7a is fixed to the upper surface of the movable panel 8, and thus becomes a unit with the movable panel 8. Set up by moving up and down.
另外，在往下模腔室7c內填充透明樹脂材料R，並且如圖9(3)所示，構成有：在隔著樹脂密封前基板1使上模6與下模7的兩模具面間接合的合模時的狀態下，藉由使樹脂加壓構件7b(可動板8)往上移動，可對該下模腔室內的透明樹脂材料R施加既定的樹脂壓力之所謂的壓縮成形的樹脂成形模具構造。 Further, the transparent mold material R is filled in the lower mold chamber 7c, and as shown in Fig. 9 (3), the two mold faces of the upper mold 6 and the lower mold 7 are indirectly formed by sealing the front substrate 1 via the resin. In the state of the mold clamping, the resin pressing member 7b (movable plate 8) is moved upward to apply a so-called compression-molded resin to the transparent resin material R in the lower cavity. Forming mold construction.
另外，在圖7所示之樹脂密封前基板1，形成有多個製品構成單位(最小分割單位)1a，但可適當地改變該等數量而實施。 In addition, a plurality of product constituent units (minimum division units) 1a are formed in the resin-sealed front substrate 1 shown in Fig. 7, but these numbers can be appropriately changed.
此外，在圖8所示的設定於樹脂毛邊防止用帶材20的樹脂接著用孔部20a及樹脂附著防止部20b的形狀、構造及配置的態樣等，可對應樹脂密封前基板1的形狀、構造及配置的態樣等，做適當地改變而實施。 In addition, the shape, structure, and arrangement of the resin-receiving hole portion 20a and the resin adhesion preventing portion 20b which are set in the resin burr preventing strip 20 shown in Fig. 8 can correspond to the shape of the resin-sealed front substrate 1. The structure, structure, and configuration are implemented as appropriate.
以下，針對在不使樹脂毛邊附著於設置在樹脂密封前基板1的樹脂不可接觸區域B的各部位，並以透明樹脂材料R對該樹脂密封前基板1上的LED晶片2進行樹脂密封成形的步驟及作用進行說明。 In the following, the LED wafer 2 on the resin-sealed front substrate 1 is resin-sealed by the transparent resin material R without attaching the resin burrs to the respective portions of the resin-non-contactable region B provided in the resin-sealed front substrate 1. The steps and functions are explained.
首先，如圖9(1)所示，準備樹脂密封前基板1，該樹脂密封前基板1係在半導體基板的表面安裝有LED晶片2，並且具有在該半導體基板的表面(LED晶片2的安裝面)側開設有焊接點等電連接部位3或固接件的插通用孔部4等的樹脂不可接觸區域B。此外，準備樹脂毛邊防止用帶材20，該樹脂毛邊防止用帶材20係具有與該半導體基板的樹脂不可接觸區域B的各部位對應的樹脂附著防止部20b。此外，如圖9(2)所示，在該樹脂密封前基板1的既定位置黏貼樹脂毛邊防止用帶材20，並且在該樹脂密封前基板1的除了樹脂成形區域A之外的樹脂不可接觸區域B黏貼 樹脂毛邊防止用帶材20的樹脂附著防止部20b，從而準備帶材黏貼基板(1、20)。 First, as shown in Fig. 9 (1), a resin-sealed front substrate 1 on which a LED wafer 2 is mounted on a surface of a semiconductor substrate and has a surface on which the LED chip 2 is mounted is prepared. The surface of the electrical contact portion 3 such as a solder joint or the resin non-contact region B such as the interposing hole portion 4 of the fixing member is provided sideways. In addition, the resin burr preventing strip 20 having the resin adhesion preventing portion 20b corresponding to each portion of the resin non-contact region B of the semiconductor substrate is prepared. Further, as shown in Fig. 9 (2), the resin burr preventing strip 20 is adhered to a predetermined position of the resin-sealed front substrate 1, and the resin other than the resin-formed region A of the substrate 1 before the resin sealing is not contacted. Area B pasting The resin burr is prevented from adhering to the resin adhesion preventing portion 20b of the tape 20, and the tape bonding substrates (1, 20) are prepared.
進一步地，準備壓縮樹脂成形裝置5(參照圖9(3))，該壓縮樹脂成形裝置5係具備用於對該帶材黏貼基板(1、20)上的LED晶片2進行樹脂密封成形的上下兩模6、7。另外，將該上下兩模6、7預熱至所需的樹脂成形溫度。接下來，如圖10(1)所示，進行往下模腔室7c內的透明樹脂材料填充步驟，係往壓縮樹脂成形裝置5的下模腔室7c內填充透明樹脂材料R。 Further, a compressed resin molding apparatus 5 (see FIG. 9 (3)) is provided, and the compression resin molding apparatus 5 is provided with a resin sealing forming for the LED wafer 2 on the tape bonding substrates (1, 20). Two modes 6, 7. Further, the upper and lower molds 6, 7 are preheated to a desired resin molding temperature. Next, as shown in Fig. 10 (1), a step of filling the transparent resin material into the lower mold chamber 7c is performed, and the transparent resin material R is filled into the lower mold chamber 7c of the compressed resin molding apparatus 5.
接下來，如圖10(2)所示，進行帶材黏貼基板(1、20)的搬入步驟，係將帶材黏貼基板(1、20)在其表面側朝下的狀態下，搬入至壓縮樹脂成形裝置5的上下兩模6、7之間。 Next, as shown in Fig. 10 (2), the loading step of the tape-adhering substrates (1, 20) is carried out, and the tape-attached substrates (1, 20) are carried into the compressed state with the surface side thereof facing downward. The upper and lower molds 6 and 7 of the resin molding apparatus 5 are interposed.
接下來，如圖11(1)所示，進行帶材黏貼基板的放置步驟，係在已搬入至上下兩模6、7之間的帶材黏貼基板(1、20)的表面側成為朝下的狀態下，將其放置在下模腔室7c的既定位置。 Next, as shown in Fig. 11 (1), the step of placing the tape-adhering substrate is performed downward on the surface side of the tape-adhering substrates (1, 20) that have been carried between the upper and lower molds 6, 7 In the state of this, it is placed at a predetermined position of the lower mold chamber 7c.
接下來，如圖11(2)所示，進行LED晶片2的往透明樹脂材料R中的浸漬步驟，係藉由透過可動板8將下模的樹脂加壓構件7b上推，而將放置於下模腔室7c的帶材黏貼基板(1、20)的表面側嵌入下模腔室7c內，並且使帶材黏貼基板(1、20)上的LED晶片2浸漬於下模腔室7c內的透明樹脂材料R中。進一步地，進行壓縮樹脂密封成形步驟，係藉由透過該樹脂加壓構件7b壓縮下模腔室7c內的透明樹脂材料R，且對應於下模腔室7c的形狀而對帶材黏貼基板(1、20)上的LED晶片2進行樹脂密封成形。 Next, as shown in Fig. 11 (2), the step of immersing the LED wafer 2 into the transparent resin material R is carried out by pushing the resin pressing member 7b of the lower mold through the movable plate 8 to be placed thereon. The surface side of the strip-adhesive substrates (1, 20) of the lower mold chamber 7c is embedded in the lower mold chamber 7c, and the LED wafer 2 on the strip-adhesive substrates (1, 20) is immersed in the lower mold chamber 7c. In the transparent resin material R. Further, the compression resin sealing forming step is performed by compressing the transparent resin material R in the lower mold cavity 7c through the resin pressing member 7b, and adhering the substrate to the tape corresponding to the shape of the lower mold cavity 7c ( The LED wafer 2 on the 1, 20) is subjected to resin sealing molding.
接下來，進行樹脂密封後基板21的搬出步驟，係透過可動板8使樹脂加壓構件7b及下模7下降，並且打開上下兩模6、7，而從該上下兩模6、7取出已經過壓縮樹脂密封成形步驟的樹脂密封後基板21並往外部進行搬送。 Next, the step of carrying out the resin-sealed substrate 21 is performed, and the resin pressing member 7b and the lower mold 7 are lowered by the movable plate 8, and the upper and lower molds 6, 7 are opened, and the upper and lower molds 6, 7 are taken out. The resin 21 after the resin sealing process is sealed and the substrate 21 is transported to the outside.
接下來，進行帶材剝離步驟，係將樹脂毛邊防止用帶材20(樹脂附著防止部20b)從樹脂密封後基板21剝離(參照圖12(2))。 Next, the stripping step of the resin burr preventing strip 20 (resin adhesion preventing portion 20b) is peeled off from the resin-sealed substrate 21 (see FIG. 12 (2)).
如以上所述，能夠不使樹脂毛邊附著在設置於樹脂密封前基板1的樹脂不可接觸區域B的各部位，並以透明樹脂材料R對該樹脂密封前基板1上的各LED晶片2進行樹脂密封成形。 As described above, it is possible to prevent the resin burrs from adhering to the respective portions of the resin non-contact region B provided in the resin-sealed front substrate 1 and to resin the LED chips 2 on the resin-sealed front substrate 1 with the transparent resin material R. Sealed and formed.
而且，如圖12(3)所示，能夠使安裝在樹脂密封後基板21的各LED晶片2分別密封於與下模腔室的晶狀體成形部7d的形狀對應的形狀的透明樹脂成形體(晶狀體)21a內。 Further, as shown in Fig. 12 (3), each of the LED chips 2 attached to the resin-sealed substrate 21 can be sealed to a transparent resin molded body having a shape corresponding to the shape of the lens-molded portion 7d of the lower mold chamber (crystal) ) within 21a.
在本實施例的情形，在對安裝於半導體基板的LED晶片2進行壓縮樹脂密封成形時，能夠有效率且確實地防止樹脂毛邊附著在設定於該LED晶片2的安裝面的樹脂不可接觸區域B的各部位。 In the case of the present embodiment, when the LED wafer 2 mounted on the semiconductor substrate is subjected to compression resin sealing molding, it is possible to efficiently and surely prevent the resin burrs from adhering to the resin inaccessible region B set on the mounting surface of the LED wafer 2. Various parts.
因此，即使是在半導體基板的LED晶片2的安裝面具有樹脂不可接觸區域B的構造的樹脂密封前基板1，亦能夠採用壓縮樹脂密封成形方法，分別對該各LED晶片2進行密封成形，因此發揮了能夠高效率地生產採用這種半導體基板的LED晶片的樹脂密封成形品之優異的實用效果。 Therefore, even in the resin-sealed front substrate 1 having the structure in which the resin non-contact region B is mounted on the mounting surface of the LED chip 2 of the semiconductor substrate, the LED resin 2 can be sealed and formed by a compression resin sealing molding method. Excellent practical effects of a resin-sealed molded article in which an LED wafer using such a semiconductor substrate can be efficiently produced are exhibited.
在上述實施例3中，樹脂材料可採用具有透明性、半透明性及不透明性的樹脂材料。 In the above-described Embodiment 3, the resin material may be a resin material having transparency, translucency, and opacity.
此外，在上述實施例3中，作為樹脂材料，可採用固體狀或液體狀的樹脂材料。此外，作為固體狀之樹脂材料，例如可採用粉末狀、顆粒狀或樹脂片等。 Further, in the above-described third embodiment, as the resin material, a solid or liquid resin material may be employed. Further, as the solid resin material, for example, a powder form, a pellet form, a resin sheet or the like can be used.
此外，在上述實施例3中，作為樹脂材料，可採用熱固性樹脂材料或熱塑性樹脂材料。另外，作為熱固性樹脂材料，可例舉矽樹脂材料、環氧樹脂材料等。 Further, in the above-described Embodiment 3, as the resin material, a thermosetting resin material or a thermoplastic resin material may be employed. Moreover, as a thermosetting resin material, a bismuth resin material, an epoxy resin material, etc. are mentioned.
此外，在上述實施例3中，可對顆粒狀之熱固性樹脂材料進行加熱並熔融化，且在該已加熱熔融的樹脂材料(具有流動性的樹脂材料)中浸漬LED晶片2而進行壓縮樹脂密封成形。 Further, in the above-described Embodiment 3, the particulate thermosetting resin material may be heated and melted, and the LED wafer 2 is immersed in the heat-melted resin material (the resin material having fluidity) to perform compression resin sealing. Forming.
此外，在上述實施例3中，可對液狀之熱固性樹脂材料(例如，具有透明性的矽樹脂材料)進行加熱，且在該已加熱的樹脂材料(具有流動性的樹脂材料)中浸漬LED晶片2而進行壓縮樹脂密封成形。 Further, in the above-described Embodiment 3, a liquid thermosetting resin material (for example, a resin material having transparency) may be heated, and the LED is immersed in the heated resin material (resin material having fluidity) The wafer 2 is subjected to compression resin sealing molding.
作為半導體晶片，除前述LED晶片之外，還可例舉出IC、電晶體或二極體等。此外，亦可以使用引線框架、印刷電路基板或陶瓷基板等來取代半導體基板。 As the semiconductor wafer, in addition to the aforementioned LED chip, an IC, a transistor, a diode, or the like can be exemplified. Further, a lead frame, a printed circuit board, a ceramic substrate, or the like may be used instead of the semiconductor substrate.
A‧‧‧樹脂成形區域 A‧‧‧Resin forming area
B‧‧‧樹脂不可接觸區域 B‧‧‧Resistible area of resin
R‧‧‧透明樹脂材料 R‧‧‧Transparent resin material
1‧‧‧樹脂密封前基板 1‧‧‧ resin sealed front substrate
1a‧‧‧製品構成單位(最小分割單位) 1a‧‧‧Product constituent units (minimum division unit)
2‧‧‧LED晶片 2‧‧‧LED chip
3‧‧‧電連接部位 3‧‧‧Electrical connection
4‧‧‧插通用孔部 4‧‧‧Insert universal hole
5‧‧‧壓縮樹脂密封成形裝置 5‧‧‧Compressed resin sealing forming device
6‧‧‧樹脂成形用上模 6‧‧‧Upper mold for resin molding
7‧‧‧樹脂成形用下模 7‧‧‧Resin forming mold
7a‧‧‧框體 7a‧‧‧ frame
7b‧‧‧樹脂加壓構件 7b‧‧‧Resin pressure member
7c‧‧‧下模腔室 7c‧‧‧ lower mold chamber
7d‧‧‧晶狀體成形部 7d‧‧‧Lens formation
8‧‧‧可動板 8‧‧‧ movable plate
9‧‧‧彈性構件 9‧‧‧Flexible components
10‧‧‧樹脂毛邊防止用構件 10‧‧‧Resin edging prevention member
10a‧‧‧上端部 10a‧‧‧Upper end
11‧‧‧彈性構件 11‧‧‧Flexible components
Claims (9)
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| JP2012020663A JP5723800B2 (en) | 2012-02-02 | 2012-02-02 | Compressed resin sealing molding method and apparatus for semiconductor chip |
| JP2012020668A JP6087507B2 (en) | 2012-02-02 | 2012-02-02 | Compressed resin sealing molding method of semiconductor chip and production method of semiconductor chip sealed with resin |
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| TW201334234A true TW201334234A (en) | 2013-08-16 |
| TWI527273B TWI527273B (en) | 2016-03-21 |
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| CN (1) | CN103247739B (en) |
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| TWI624346B (en) * | 2014-12-24 | 2018-05-21 | Towa Corp | Resin molding device and resin molding method |
| CN116504702A (en) * | 2023-06-26 | 2023-07-28 | 山东联高智能科技有限公司 | Semiconductor element processing equipment |
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| JP4388654B2 (en) * | 2000-02-01 | 2009-12-24 | アピックヤマダ株式会社 | Resin sealing device and resin sealing method |
| JP2002151531A (en) * | 2000-11-15 | 2002-05-24 | Matsushita Electric Ind Co Ltd | Method for manufacturing semiconductor device |
| JP5325933B2 (en) * | 2004-08-26 | 2013-10-23 | アピックヤマダ株式会社 | Resin mold |
| JP4834407B2 (en) * | 2006-01-17 | 2011-12-14 | アピックヤマダ株式会社 | Resin molding method and resin molding apparatus |
| JP2008041846A (en) | 2006-08-04 | 2008-02-21 | Towa Corp | Flip-chip resin injection molding method, and metal mold |
| US7709853B2 (en) | 2007-02-12 | 2010-05-04 | Cree, Inc. | Packaged semiconductor light emitting devices having multiple optical elements |
| JP2008207450A (en) * | 2007-02-27 | 2008-09-11 | Towa Corp | Compression molding method of light-emitting element |
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| TWI624346B (en) * | 2014-12-24 | 2018-05-21 | Towa Corp | Resin molding device and resin molding method |
| TWI647085B (en) * | 2014-12-24 | 2019-01-11 | Ｔｏｗａ股份有限公司 | Resin molding device and resin molding method |
| CN116504702A (en) * | 2023-06-26 | 2023-07-28 | 山东联高智能科技有限公司 | Semiconductor element processing equipment |
| CN116504702B (en) * | 2023-06-26 | 2023-09-05 | 山东联高智能科技有限公司 | Semiconductor element processing equipment |
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| TWI527273B (en) | 2016-03-21 |
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| KR20130089588A (en) | 2013-08-12 |
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