JP6087507B2 - Compressed resin sealing molding method of semiconductor chip and production method of semiconductor chip sealed with resin - Google Patents

Description

The present invention relates to a method for sealing and molding a required number of semiconductor chips such as LED chips mounted on a substrate with a transparent resin material, and in particular, a cured resin adheres to a predetermined portion of a semiconductor chip mounting surface of the substrate. Compressed resin sealing molding method of semiconductor chip improved so that it can be efficiently prevented, and resin sealing for producing a resin-sealed semiconductor chip from a resin-sealed substrate generated by this method The present invention relates to a method for producing a manufactured semiconductor chip .

The LED chip is mounted on the surface of the substrate, and the resin adhesion preventing tape is adhered to the back surface (non-LED chip mounting surface) side of the substrate, and in this state, the LED chip of the substrate is supplied into the resin molding cavity. The semiconductor chip is immersed in the transparent molten resin material, and further, the transparent resin material in the cavity is compressed at a predetermined pressure, so that the LED chip is sealed and molded in the transparent resin molded body formed in the cavity. A compression resin sealing molding method of (LED chip) has been proposed (see, for example, Patent Document 1).

That is, Patent Document 1 discloses the following technical matters.
First, as shown in FIG. 7 (1) of the present application document, the LED chip 60 is mounted on the front surface 50a of the substrate 50, and the entire surface on the back surface (non-mounted surface of the LED chip 60) 50b side of the substrate is used for preventing resin adhesion . A pre-resin substrate 51 with a tape 70 attached thereto is prepared.
Next, as shown in the same figure, while transporting between the upper mold 81 and the lower mold 82 in the compression resin sealing molding apparatus 80 with the surface 50a side of the substrate before resin sealing facing downward, A transparent resin material (for example, a liquid resin material having transparency) 90 is supplied into a resin molding cavity 81a provided on the upper surface of the lower mold.
Next, as shown in FIG. 7 (2), the upper die 81 and the lower die 82 are closed, and the LED chip 60 of the substrate 50 before resin sealing is made of a transparent resin material (with fluidity) in the lower die cavity 81a. Resin material, referred to as “flowable resin” where appropriate . Then, the upper die 81 and the lower die 82 are closed at a predetermined clamping pressure, and the transparent molten resin material 90 in the lower die cavity 81a is compressed at a predetermined pressure, whereby the LED chip 60 is Corresponding to the shape of 81a, sealing molding is performed in the transparent resin molded body (lens) 91 (for example, thermosetting).
Next, as shown in FIG. 7 (3), the upper die 81 and the lower die 82 are opened to take out the resin-sealed substrate 52, and the resin adhesion preventing tape 70 is removed from the resin- sealed substrate. By cutting and separating each LED chip 60 unit, the resin-sealed molded product 61 of each LED chip 60 can be formed.

Therefore, according to such a compression resin sealing molding method of the LED chip 60, the transparent resin molded body (lens) 91 having a shape corresponding to the shape of the lower mold cavity 81a is attached and integrated on the surface 50a side of the substrate. become. And since the resin adhesion preventing tape 70 is adhered to the back surface (non-attached surface of the LED chip 60) 50b side of the substrate, when the LED chips 60 on the substrate are resin-sealed, the substrate It is possible to efficiently prevent a part of the transparent molten resin material 90 from entering the back surface 50b side and adhering the cured resin to the back surface 50b.

However, since the resin sealing molding is performed with the surface 50a side of the substrate immersed in the transparent molten resin material 90 in the lower mold cavity 81a, almost the entire surface of the substrate 50a side is transparent molten resin material 90. Will be in contact with.
For this reason, for example, in a substrate having a structure in which an electrical connection portion such as a pad or a hole for inserting a fastener is opened on the surface 50a side of the substrate, it is inevitably hardened in these portions and holes. Resin will adhere.
Therefore, there is a problem that the compression resin sealing molding method cannot be used in practice for resin sealing molding of LED chips using a substrate having this type of structure.

JP 2008-207450 A (refer to FIG. 1, FIG. 2, FIG. 3, etc.)

The present invention resin-molds a substrate having a structure having a resin non-contact area in which an electrical connection portion such as a pad or a hole for inserting a fastener is opened on the surface (semiconductor chip mounting surface) side of the substrate. It is an object of the present invention to provide a method for producing a resin-encapsulated semiconductor chip, and a method for producing a resin-encapsulated semiconductor chip from a resin-encapsulated substrate generated by this method . To do.

The present invention includes a step of mounting the semiconductor chip 2 on the surface of the substrate and preparing the pre-resin-sealing substrate 1 having a structure having a resin non-contact area B on the surface side of the substrate;
Preparing a resin adhesion preventing tape 10 having a resin adhesion preventing portion 10b corresponding to each part of the resin non-contact area B on the substrate;
The resin adhesion preventing tape 10 is adhered to a predetermined position of the substrate 1 before resin sealing, and the resin adhesion preventing area B except the resin molding area A of the substrate 1 before resin sealing is used. A step of preparing a tape adhering substrate (1 · 10) by adhering the resin adhesion preventing portion 10b of the tape 10;
Preparing a compression resin molding apparatus 5 having upper and lower molds 6 and 7 for resin-sealing molding of the semiconductor chip 2 on the tape-bonding substrate (1 and 10);
A transparent resin material filling step into the lower mold cavity 7c for filling the transparent resin material R into the lower mold cavity 7c of the compression resin molding apparatus 5;
A step of carrying in the tape adhering substrate (1 · 10) for bringing the tape adhering substrate (1 · 10) between the upper and lower molds of the compression resin molding apparatus 5 with the surface side facing downward;
A step of setting the tape attaching substrate to be set at a predetermined position of the lower die cavity 7c with the surface side of the tape attaching substrate (1 · 10) carried between the upper and lower molds facing downward;
The surface side of the tape adhering substrate (1 · 10) set in the lower die cavity 7c is inserted into the lower die cavity 7c and the semiconductor chip 2 on the tape adhering substrate (1 · 10) is attached to the lower die cavity 7c. A step of immersing the semiconductor chip 2 in the transparent resin material R to be immersed in the transparent resin material R in the lower mold cavity 7c;
Compressed resin seal for compressing the transparent resin material R in the lower mold cavity 7c and resin-sealing the semiconductor chip 2 on the tape adhering substrate (1 · 10) in accordance with the shape of the lower mold cavity 7c Stop molding process;
Taking out the resin-sealed substrate 11 that has undergone the compression resin sealing molding step from the upper and lower molds and carrying it out to the outside,
A tape peeling step of peeling the resin adhesion preventing tape 10 from the resin-sealed substrate 11.

The present invention is applied to the pre-resin-sealing substrate 1 having a structure having a resin molding area A of the semiconductor chip 2 and a resin non-contact area B to the semiconductor chip 2 mounting surface on the mounting surface of the semiconductor chip 2 on the substrate. A resin adhesion preventing tape 10 to be worn and used,
A hole 10a for resin bonding is formed in a part corresponding to the resin molding area A of the semiconductor chip 2, and a resin adhesion preventing part 10b is provided in a part corresponding to the resin non-contact area B to the semiconductor chip 2 mounting surface. It is characterized by being formed.

According to the present invention, when the semiconductor chip 2 mounted on the substrate is molded by compression resin sealing, it is possible to efficiently and surely prevent the cured resin from adhering to each part of the resin non-contact area B.
For this reason, a substrate having a structure having a resin non-contact area B in which an electrical connection portion 3 such as a pad, an insertion hole 4 for a fastening device, and the like are opened on the surface side of the substrate on which the semiconductor chip 2 is mounted is compressed with resin Since it is possible to perform sealing molding using a stop molding method, there is an excellent practical effect that a resin-sealed molded product of a semiconductor chip using this type of substrate can be produced with high efficiency. .

According to the present invention, when the semiconductor chip 2 mounted on the substrate is molded by compression resin sealing, the resin contact-impossible area B is obtained by sticking and using the resin adhesion preventing tape on the mounting surface of the semiconductor chip on the substrate. It is possible to efficiently and surely prevent the cured resin from adhering to each of the parts.
For this reason, a substrate having a structure having a resin non-contact area B in which an electrical connection portion 3 such as a pad, an insertion hole 4 for a fastening device, and the like are opened on the surface side of the substrate on which the semiconductor chip 2 is mounted is compressed with resin Since it is possible to perform sealing molding using a stop molding method, there is an excellent practical effect that a resin-sealed molded product of a semiconductor chip using this type of substrate can be produced with high efficiency. .

FIG. 1 illustrates a substrate before resin sealing used in the method of the present invention. FIG. 1 (1) is a partially omitted plan view schematically showing the entire structure of the substrate, and FIG. 1 (2) is a diagram of the substrate. It is a schematic plan view which expands and shows a principal part. FIG. 2 illustrates a resin adhesion preventing tape for carrying out the method of the present invention. FIG. 2 (1) is a schematic plan view of the tape, and FIG. 2 (2) is an enlarged view of the main part of the tape. It is a schematic plan view shown. Fig. 3 (1) is a schematic longitudinal sectional view showing the main parts of the pre-resin sealing substrate and the resin adhesion preventing tape corresponding to Figs. 1 and 2, and Fig. 3 (2) is a schematic view of the substrate and the tape. Fig. 3 (3) is a schematic longitudinal sectional view showing the main part of the tape-bonding substrate that is integrated by wearing, and Fig. 3 (3) shows the tape-bonding substrate in the lower mold cavity in the compression resin sealing molding apparatus for carrying out the method of the present invention. It is a schematic longitudinal cross-sectional view which shows the state which set. FIG. 4 (1) is an explanatory view of the transparent resin material filling step in the method of the present invention, and FIG. FIG. 5 (1) is an explanatory view of the tape-bonding substrate setting step in the method of the present invention, and FIG. 5 (2) is an explanatory view of the step of immersing the LED chip in the transparent resin material and the compression resin sealing molding step. is there. FIG. 6 (1) is an explanatory view corresponding to FIG. 5 (2), and shows an enlarged main part of the compression resin molding apparatus. 6 (2) is a schematic longitudinal sectional view showing a resin-seal-molded substrate (molded article), 6 (3) the resin deposited in schematic vertical sectional view showing the corresponding resin-seal-molded substrate in FIG. 6 (2) The state where the prevention tape is peeled off is shown. FIG. 7 is an explanatory view of a conventional compression resin sealing molding method. FIG. 7 (1) is a schematic longitudinal sectional view showing a main part of the compression resin sealing molding apparatus and the substrate before resin sealing, and FIG. FIG. 7 (3) is a schematic longitudinal sectional view showing a resin-sealed substrate (molded product) in a state where the mold of the apparatus is closed.

  The embodiment of the present invention shown in FIGS. 1 to 6 will be described below.

In FIG. 1, the board | substrate 1 before resin sealing used for this invention method is illustrated.
On the substrate 1 before resin sealing, a large number of product structural units (minimum division units) 1a that are individually cut and separated as products are formed.
In addition, a required number (three in the example) of LED chips 2 are mounted on the surface of each product structural unit 1a on the substrate 1 before resin sealing, and the LED chip mounting portion is resin-sealed. It is set as a resin molding area A for stationary molding.
Furthermore, an electrical connection part 3 such as a pad and an insertion hole 4 for a fastening tool are provided on the surface of each product structural unit 1a, and a part of the transparent resin material is formed in these parts during resin molding. Therefore, it is necessary to consider so as not to adhere to form a cured resin .
Accordingly, these portions are set as a so-called non-resinable area B for preventing the transparent resin material from contacting during resin molding.

FIG. 2 shows a resin adhesion preventing tape 10 for carrying out the method of the present invention.
The resin adhesion prevention tape 10 is formed with a resin bonding hole 10a in a portion corresponding to the resin molding area A of the LED chip 2 on the substrate 1 before resin sealing, and the LED on the substrate 1 before resin sealing. A resin adhesion preventing portion 10b is formed at a portion corresponding to the resin contact impossible area B to the mounting surface of the chip 2.

Fig. 3 (1) shows the main parts of the substrate 1 before resin sealing and the tape 10 for preventing resin adhesion , and Fig. 3 (2) shows the surface of the substrate 1 (the mounting surface of the LED chip 2). The state where the tape 10 is adhered and integrated on the side to form a tape-adhering substrate (1 · 10) is shown.
FIG. 3 (3) illustrates the main part of the compression resin sealing molding apparatus 5 used for carrying out the method of the present invention.

The compression resin sealing molding apparatus 5 is provided with an upper mold 6 and a lower mold 7 for resin molding.
Further, the upper die 6 is provided with suction support means (not shown) for the pre-resin-sealing substrate 1 using, for example, a suction action by decompression.
Further, both the upper mold 6 and the lower mold 7 are provided so as to be opened / closed via an appropriate mold opening / closing mechanism (not shown).
Further, the lower mold 7 is disposed on an upper part of a movable plate 8 that is installed so as to be movable up and down via an appropriate vertical movement mechanism (not shown).
The lower mold 7 is composed of a frame body 7a and a resin pressure member 7b fitted to the frame body, and an upper fitting in which both the frame body 7a and the resin pressure member 7b are fitted. The joint recess constitutes a lower mold cavity 7c that serves as a supply part of the transparent resin material R and serves as a resin molding part.
Further, the frame body 7 a is provided so as to be moved upward by the elastic pressing force of the elastic member 9 provided between the lower mold 7 and the movable plate 8.
Further, a lens molding portion 7d for resin-sealing the LED chip 2 mounted on the substrate 1 before resin sealing is provided at a predetermined position on the upper surface of the resin pressure member 7b constituting the bottom surface of the lower mold cavity 7c. .

Further, the resin pressure member 7b fitted to the frame 7a is fixed to the upper surface of the movable plate 8, and thus is provided so as to move up and down integrally with the movable plate 8.
The lower mold cavity 7c is filled with the transparent resin material R and, as shown in FIG. 3 (3), between the mold surfaces of the upper mold 6 and the lower mold 7 through the substrate 1 before resin sealing. A predetermined resin pressure can be applied to the transparent resin material R in the lower mold cavity by moving the resin pressure member 7b (movable plate 8) upward in the bonded state of mold clamping. A so-called resin mold structure by compression molding is formed.

  In addition, although many product structural units (minimum division | segmentation unit) 1a are formed in the board | substrate 1 before resin sealing shown in FIG. 1, these numbers can be changed and implemented suitably.

Further, the shape, structure and arrangement of the resin bonding hole 10a and the resin adhesion preventing portion 10b set in the resin adhesion preventing tape 10 shown in FIG. It is possible to implement by appropriately changing in accordance with the arrangement mode and the like.

Thereafter, the LED chip 2 on the pre-resin-sealing substrate 1 is resin-sealed with a transparent resin material R without adhering the cured resin to each part of the resin non-contact area B provided on the pre-resin-sealing substrate 1. The molding process and operation will be described.

First, as shown in FIG. 3 (1), the LED chip 2 is mounted on the surface of the substrate, and an electrical connection part 3 such as a pad or a fastening device is provided on the surface of the substrate (the mounting surface of the LED chip 2). A pre-resin-sealing substrate 1 having a structure having a resin non-contact area B in which the insertion hole 4 is opened is prepared.
In addition, a resin adhesion preventing tape 10 having a resin adhesion preventing portion 10b corresponding to each part of the resin non-contact area B on the substrate is prepared.
Further, as shown in FIG. 3 (2), a resin adhesion preventing tape 10 is adhered to a predetermined position of the substrate 1 before resin sealing, and the resin molding area A of the substrate 1 before resin sealing is excluded. A resin adhesion preventing portion 10b of the resin adhesion preventing tape 10 is adhered to the resin non-contact area B to prepare a tape adhesion substrate (1 · 10).
Further, a compression resin molding apparatus 5 (see FIG. 3 (3)) having both upper and lower molds 6 and 7 for resin sealing molding of the LED chip 2 on the tape attaching substrate (1 and 10) is prepared. .
The upper and lower molds 6 and 7 are previously heated to a required resin molding temperature.

  Next, as shown in FIG. 4A, a transparent resin material filling step into the lower mold cavity 7c for filling the transparent resin material R into the lower mold cavity 7c of the compression resin molding apparatus 5 is performed.

  Next, as shown in FIG. 4 (2), the tape affixing board (1 · 10) is carried between the upper and lower molds 6 and 7 of the compression resin molding apparatus 5 with the surface side facing downward. Carrying in the incoming substrate (1 · 10).

  Next, as shown in FIG. 5 (1), in the state where the surface side of the tape adhering substrate (1 · 10) carried between the upper and lower molds 6 and 7 is faced down, it is placed at a predetermined position of the lower mold cavity 7c. The setting process of the tape sticking board | substrate to set is performed.

Next, as shown in FIG. 5 (2), by pushing up the lower mold resin pressing member 7b through the movable plate 8, the tape adhering substrate (1 · 10) set in the lower mold cavity 7c is formed. The transparent resin material of the LED chip 2 in which the surface side is inserted into the lower mold cavity 7c and the LED chip 2 on the tape adhering substrate (1 · 10) is immersed in the transparent resin material R in the lower mold cavity 7c. An immersion process in R is performed.
Further, by compressing the transparent resin material R in the lower mold cavity 7c by the resin pressure member 7b, the LED chip 2 on the tape adhering substrate (1 · 10) corresponds to the shape of the lower mold cavity 7c. A compression resin sealing molding process for resin sealing molding is performed.

  Next, the resin pressurizing member 7b and the lower mold 7 are lowered through the movable plate 8, and the upper and lower molds 6 and 7 are opened, and the resin-sealed substrates 11 that have undergone the compression resin sealing molding process are moved to the upper and lower molds. A step of carrying out the resin-sealed substrate taken out from the molds 6 and 7 and carried out is performed.

Next, the tape peeling step of peeling the resin adhesion preventing tape 10 (resin adhesion preventing part 10b) from the resin-seal-molded substrate 11 (see FIG. 6 (2)).

As described above, each LED chip 2 on the substrate 1 before resin sealing is attached to the transparent resin material R without attaching a cured resin to each part of the resin non-contact area B provided on the substrate 1 before resin sealing. Resin sealing molding can be performed.
As shown in FIG. 6 (3), each LED chip 2 mounted on the resin-sealed substrate 11 has a transparent resin molding (lens) 11a having a shape corresponding to the shape of the lens molding portion 7d of the lower mold cavity. Each can be sealed.

In the case of this embodiment, when the LED chip 2 mounted on the substrate is compression-resin-molded, it is efficient that the cured resin adheres to each part of the resin non-contact area B set on the mounting surface of the LED chip 2. Good and reliable prevention is possible.
For this reason, even if it is the board | substrate 1 before resin sealing of the structure which has the resin contact improper area B in the mounting surface of the LED chip 2 in a board | substrate, each of this LED chip 2 is sealed using the compression resin sealing molding method. Since it becomes possible to mold, there is an excellent practical effect that a resin-sealed molded product of an LED chip using this type of substrate can be produced with high efficiency.

  In each of the embodiments described above, a resin material having transparency, translucency, and opacity can be adopted as the resin material.

  In each of the above-described embodiments, a solid or liquid resin material can be used as the resin material. As the solid resin material, for example, powder, granule, resin tablet and the like can be used.

In each of the embodiments described above, a thermosetting resin material or a thermoplastic resin material can be employed as the resin material.
Note that examples of the thermosetting resin material include a silicone resin material and an epoxy resin material.

Further, in each of the above-described embodiments, the granular thermosetting resin material is heated and melted, and the LED chip 2 is immersed in the heat-melted resin material ( flowable resin ) to compress and mold the resin. can do.
In each of the above embodiments, a liquid thermosetting resin material (for example, a transparent silicone resin material) is heated, and the LED chip 2 is immersed in the heated resin material ( flowable resin ). Compression resin sealing molding can be performed.

Examples of the semiconductor chip include an IC, a transistor, and a diode in addition to the LED chip.
Further, as the substrate, a semiconductor substrate, a lead frame, a printed circuit board, a ceramic substrate, or the like may be used.

A Resin molding area B Resin non-contact area R Transparent resin material 1 Substrate before resin sealing 1a Product configuration unit (minimum division unit)
2 LED chip 3 Electrical connection portion 4 Insertion hole 5 Compression resin sealing molding device 6 Resin molding upper mold 7 Resin molding lower mold 7a Frame body 7b Resin pressure member 7c Lower mold cavity 7d Lens molding section 8 Movable Plate 9 Elastic member
10 Resin adhesion prevention tape
10a Hole for resin bonding
10b Resin adhesion prevention part
11 Resin sealed substrate
11a Transparent resin molding (lens)

Claims (2)

The flowable resin is cured while the semiconductor chip is immersed in the flowable resin filled in the lower mold cavity provided in the lower mold of the semiconductor chip mounted on the mounting surface of the product structural unit provided on the substrate. It is a compression resin sealing molding method used when resin sealing with a cured resin produced by
Preparing the substrate before resin sealing having a structure in which the semiconductor chip is mounted on the mounting surface and having a resin molding area and a resin non-contactable area excluding the resin molding area;
Preparing a resin adhesion preventing tape having a resin adhesion preventing portion corresponding to each part of the resin non-contact area on the substrate and a resin bonding hole corresponding to the resin molding area;
The resin adhesion preventing tape is adhered to a predetermined position of the substrate before resin sealing, and the resin adhesion preventing portion of the resin adhesion preventing tape is adhered to the resin non-contact area of the substrate before resin sealing. And a process of preparing a tape attaching substrate by wearing,
Preparing a compression resin molding apparatus having upper and lower molds for resin sealing molding of the semiconductor chip on the tape adhering substrate;
A resin material filling step into the lower mold cavity for filling the lower mold cavity of the compression resin molding apparatus with a resin material;
A tape attaching substrate carrying-in step for carrying the tape attaching substrate between the upper and lower molds of the compression resin molding apparatus with the mounting surface facing downward;
A step of setting the tape attaching substrate to be set at a predetermined position corresponding to the lower die cavity with the mounting surface side of the tape attaching substrate carried in between the upper and lower molds facing downward;
Producing the flowable resin from the resin material;
The mounting surface side of the tape sticking substrate set at a predetermined position corresponding to the lower die cavity is fitted into the lower die cavity, and the semiconductor chip on the tape sticking substrate is placed in the lower die cavity. a step of immersing in the fluid resin,
By the cured resin produced by curing by compressing the fluid resin in the lower die cavity, for molding a resin sealing the semiconductor chip on the tape applying substrate corresponding to the shape of the lower cavity Compression resin sealing molding process;
The step of carrying out the resin-sealed substrate that takes out the resin-sealed substrate that has undergone the compression resin sealing molding step from between the upper and lower molds and carries it out to the outside;
A tape peeling step of peeling the resin adhesion prevention tape from the resin-sealed substrate,
In the step of setting the tape sticking substrate, the tape sticking substrate is set so that the hole for resin bonding and the resin adhesion preventing portion are included in the lower mold cavity when viewed in plan,
In the compression resin sealing molding process, corresponding to the resin non-contact area where the mounting surface is exposed corresponding to the resin adhesion preventing portion on the mounting surface of the tape adhesive substrate, and the hole for resin bonding And forming the resin molding area to which the cured resin adheres in the lower mold cavity ,
In the mounting surface in the product structural unit, the resin molding area and the resin contact impossible area are set,
In the product structural unit, the resin non-contact area is set inside and outside the resin molding area in plan view,
Wherein in the product configuration unit, the resin contact Call area is characterized by functioning as insertion holes of the electrically connected portion and fastening instrument, compression molding resin to seal a semiconductor chip. The flowable resin is cured while the semiconductor chip is immersed in the flowable resin filled in the lower mold cavity provided in the lower mold of the semiconductor chip mounted on the mounting surface of the product structural unit provided on the substrate. and a resin sealing produces a seal-molded substrate by a cured resin produced by, for producing the semiconductor chip resin-sealed from the resin-seal-molded substrate, a method of producing a resin encapsulated semiconductor chips Because
Preparing the substrate before resin sealing having a structure in which the semiconductor chip is mounted on the mounting surface and having a resin molding area and a resin non-contactable area excluding the resin molding area;
Preparing a resin adhesion preventing tape having a resin adhesion preventing portion corresponding to each part of the resin non-contact area on the substrate and a resin bonding hole corresponding to the resin molding area;
The resin adhesion preventing tape is adhered to a predetermined position of the substrate before resin sealing, and the resin adhesion preventing portion of the resin adhesion preventing tape is adhered to the resin non-contact area of the substrate before resin sealing. And a process of preparing a tape attaching substrate by wearing,
Preparing a compression resin molding apparatus having upper and lower molds for resin sealing molding of the semiconductor chip on the tape adhering substrate;
A resin material filling step into the lower mold cavity for filling the lower mold cavity of the compression resin molding apparatus with a resin material;
A tape attaching substrate carrying-in step for carrying the tape attaching substrate between the upper and lower molds of the compression resin molding apparatus with the mounting surface facing downward;
A step of setting the tape attaching substrate to be set at a predetermined position corresponding to the lower die cavity with the mounting surface side of the tape attaching substrate carried in between the upper and lower molds facing downward;
Producing the flowable resin from the resin material;
The mounting surface side of the tape sticking substrate set at a predetermined position corresponding to the lower die cavity is fitted into the lower die cavity, and the semiconductor chip on the tape sticking substrate is placed in the lower die cavity. a step of immersing in the fluid resin,
By the cured resin produced by curing by compressing the fluid resin in the lower die cavity, for molding a resin sealing the semiconductor chip on the tape applying substrate corresponding to the shape of the lower cavity Compression resin sealing molding process;
The step of carrying out the resin-sealed substrate that takes out the resin-sealed substrate that has undergone the compression resin sealing molding step from between the upper and lower molds and carries it out to the outside;
A tape peeling step of peeling the resin adhesion preventing tape from the resin-sealed substrate ;
Cutting and separating the resin-sealed substrate into the product constituent units ,
In the step of setting the tape sticking substrate, the tape sticking substrate is set so that the hole for resin bonding and the resin adhesion preventing portion are included in the lower mold cavity when viewed in plan,
In the compression resin sealing molding process, corresponding to the resin non-contact area where the mounting surface is exposed corresponding to the resin adhesion preventing portion on the mounting surface of the tape adhesive substrate, and the hole for resin bonding And forming the resin molding area to which the cured resin adheres in the lower mold cavity ,
In the mounting surface in the product structural unit, the resin molding area and the resin contact impossible area are set,
In the product structural unit, the resin non-contact area is set inside and outside the resin molding area in plan view,
The method for producing a resin-encapsulated semiconductor chip , wherein the resin non-contact area functions as an electrical connection site and an insertion hole for a fastener in the product structural unit .

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