TW201333494A - 整合式高速測試模組 - Google Patents
整合式高速測試模組 Download PDFInfo
- Publication number
- TW201333494A TW201333494A TW101103399A TW101103399A TW201333494A TW 201333494 A TW201333494 A TW 201333494A TW 101103399 A TW101103399 A TW 101103399A TW 101103399 A TW101103399 A TW 101103399A TW 201333494 A TW201333494 A TW 201333494A
- Authority
- TW
- Taiwan
- Prior art keywords
- test
- speed
- contact
- substrate
- layer
- Prior art date
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 268
- 239000000758 substrate Substances 0.000 claims abstract description 185
- 239000000523 sample Substances 0.000 claims abstract description 170
- 239000002184 metal Substances 0.000 claims description 119
- 229910052751 metal Inorganic materials 0.000 claims description 119
- 230000005540 biological transmission Effects 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 9
- 239000011159 matrix material Substances 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 10
- 230000008054 signal transmission Effects 0.000 description 9
- 229910000679 solder Inorganic materials 0.000 description 8
- 230000000694 effects Effects 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000009826 distribution Methods 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 238000001514 detection method Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000003848 UV Light-Curing Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000013007 heat curing Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000002372 labelling Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101103399A TW201333494A (zh) | 2012-02-02 | 2012-02-02 | 整合式高速測試模組 |
| US13/450,460 US8884640B2 (en) | 2011-04-28 | 2012-04-18 | Integrated high-speed probe system |
| CN201210116993.XA CN102759701B (zh) | 2011-04-28 | 2012-04-19 | 整合式高速测试模块 |
| KR1020120044689A KR101393175B1 (ko) | 2011-04-28 | 2012-04-27 | 집적 고속 프로브 시스템 |
| US14/506,146 US9519010B2 (en) | 2011-04-28 | 2014-10-03 | Integrated high-speed probe system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101103399A TW201333494A (zh) | 2012-02-02 | 2012-02-02 | 整合式高速測試模組 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201333494A true TW201333494A (zh) | 2013-08-16 |
| TWI448708B TWI448708B (enExample) | 2014-08-11 |
Family
ID=49479489
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101103399A TW201333494A (zh) | 2011-04-28 | 2012-02-02 | 整合式高速測試模組 |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW201333494A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI548880B (zh) * | 2014-05-15 | 2016-09-11 | 漢民科技股份有限公司 | 探針卡之電路板 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7365553B2 (en) * | 2005-12-22 | 2008-04-29 | Touchdown Technologies, Inc. | Probe card assembly |
| TW200813436A (en) * | 2006-09-13 | 2008-03-16 | Microelectonics Technology Inc | High frequency cantilever probe card |
-
2012
- 2012-02-02 TW TW101103399A patent/TW201333494A/zh unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI548880B (zh) * | 2014-05-15 | 2016-09-11 | 漢民科技股份有限公司 | 探針卡之電路板 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI448708B (enExample) | 2014-08-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102759701B (zh) | 整合式高速测试模块 | |
| JP5143921B2 (ja) | 被測定デバイス搭載ボード、及びデバイスインタフェース部 | |
| CN101266262B (zh) | 高速测试卡 | |
| TWI416121B (zh) | 探針卡 | |
| TW201415037A (zh) | 微節距探針卡介面裝置以及微節距探針卡 | |
| JP5572066B2 (ja) | テスト用ボード | |
| TWI385392B (zh) | High-frequency vertical probe device and its application of high-speed test card | |
| JP2005351731A (ja) | テストソケット | |
| CN106443079A (zh) | 整合式高速测试模块 | |
| US6812720B1 (en) | Modularized probe card with coaxial transmitters | |
| TW201812307A (zh) | 測試用電路板及其操作方法 | |
| CN102401846B (zh) | 多电源电路板及其应用探针卡 | |
| TW201333494A (zh) | 整合式高速測試模組 | |
| TWI541519B (zh) | Integrated high speed test module | |
| CN102903650B (zh) | 半导体元件测试装置 | |
| TWI541518B (zh) | A high-speed substrate for transmitting the test signal of the test machine | |
| CN101236215A (zh) | 高频悬臂式探针 | |
| TW201623972A (zh) | 探針卡及其探針模組與訊號探針 | |
| TWI503554B (zh) | 探針卡與其之製作方法 | |
| TWI413777B (zh) | Multi - power circuit board and its application probe card | |
| CN102156205A (zh) | 探针卡及用于该探针卡的印刷电路板 | |
| TWI461698B (zh) | Probe unit and its making method | |
| JP2008045950A (ja) | プローブカード | |
| JP4898628B2 (ja) | 被測定デバイス搭載ボード、及びプローブカード | |
| TW202343000A (zh) | 電連接裝置 |