TW201323496A - 拋光墊用胺基甲酸酯樹脂組成物及聚胺基甲酸酯拋光墊 - Google Patents

拋光墊用胺基甲酸酯樹脂組成物及聚胺基甲酸酯拋光墊 Download PDF

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Publication number
TW201323496A
TW201323496A TW101134971A TW101134971A TW201323496A TW 201323496 A TW201323496 A TW 201323496A TW 101134971 A TW101134971 A TW 101134971A TW 101134971 A TW101134971 A TW 101134971A TW 201323496 A TW201323496 A TW 201323496A
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TW
Taiwan
Prior art keywords
polishing pad
polishing
acid
aerosil
resin composition
Prior art date
Application number
TW101134971A
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English (en)
Chinese (zh)
Inventor
小田善之
須崎弘
Original Assignee
迪愛生股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 迪愛生股份有限公司 filed Critical 迪愛生股份有限公司
Publication of TW201323496A publication Critical patent/TW201323496A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
    • C08G18/12—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step using two or more compounds having active hydrogen in the first polymerisation step
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/30—Low-molecular-weight compounds
    • C08G18/32—Polyhydroxy compounds; Polyamines; Hydroxyamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
TW101134971A 2011-10-19 2012-09-24 拋光墊用胺基甲酸酯樹脂組成物及聚胺基甲酸酯拋光墊 TW201323496A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011229669A JP2013086217A (ja) 2011-10-19 2011-10-19 研磨パッド用ウレタン樹脂組成物、ポリウレタン研磨パッド及びポリウレタン研磨パッドの製造方法

Publications (1)

Publication Number Publication Date
TW201323496A true TW201323496A (zh) 2013-06-16

Family

ID=48102466

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101134971A TW201323496A (zh) 2011-10-19 2012-09-24 拋光墊用胺基甲酸酯樹脂組成物及聚胺基甲酸酯拋光墊

Country Status (4)

Country Link
JP (1) JP2013086217A (https=)
KR (1) KR20130043060A (https=)
CN (1) CN103059551B (https=)
TW (1) TW201323496A (https=)

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JP5821133B2 (ja) * 2012-03-29 2015-11-24 富士紡ホールディングス株式会社 研磨パッド及び研磨パッドの製造方法
JP2015059199A (ja) * 2013-09-20 2015-03-30 Dic株式会社 ウレタン組成物及び研磨材
US20150306731A1 (en) 2014-04-25 2015-10-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
CN104261726B (zh) * 2014-09-18 2016-02-03 蓝思科技股份有限公司 一种光学玻璃双面精加工专用研磨垫及其制备方法
JP6504385B2 (ja) * 2014-12-15 2019-04-24 Dic株式会社 研磨パッド
CN104742031B (zh) * 2015-04-07 2017-11-17 蓝思科技（长沙）有限公司 一种调节研磨垫磨削切削力的组合物、方法及模具
CN104772693B (zh) * 2015-04-20 2017-10-17 蓝思科技（长沙）有限公司 一种用于加工超硬陶瓷的金刚石研磨垫及其制备方法
WO2017175894A1 (ko) * 2016-04-06 2017-10-12 케이피엑스케미칼 주식회사 연마패드 제조 방법
CN109311138B (zh) * 2016-06-16 2021-06-22 Dic株式会社 研磨垫、研磨垫的制造方法和研磨方法
CN106985061A (zh) * 2017-03-21 2017-07-28 安徽禾臣新材料有限公司 一种适用于精打磨的吸附垫
KR101949905B1 (ko) * 2017-08-23 2019-02-19 에스케이씨 주식회사 다공성 폴리우레탄 연마패드 및 이의 제조방법
JP7045334B2 (ja) 2017-09-11 2022-03-31 エスケイシー・ソルミックス・カンパニー・リミテッド 多孔質ポリウレタン研磨パッドおよびその製造方法
KR101949911B1 (ko) * 2017-09-11 2019-02-19 에스케이씨 주식회사 다공성 폴리우레탄 연마패드 및 이의 제조방법
KR102603370B1 (ko) * 2018-11-09 2023-11-16 주식회사 쿠라레 연마층용 폴리우레탄, 연마층, 연마 패드 및 연마층의 개질 방법
JP7331453B2 (ja) * 2019-05-17 2023-08-23 Dic株式会社 多孔体の製造方法
CN114450127B (zh) * 2019-07-12 2024-05-28 Cmc材料有限责任公司 采用多胺及环己烷二甲醇固化剂的抛光垫
CN111534079A (zh) * 2020-05-27 2020-08-14 安徽禾臣新材料有限公司 聚氨脂高抛研磨材料及其制备方法
CN112094493A (zh) * 2020-08-14 2020-12-18 沈阳化工大学 一种纳米改性热塑性聚氨酯弹性体抛光材料及其制备方法
CN114806483A (zh) * 2020-09-30 2022-07-29 九天起宏(江苏)检测有限公司 一种单组分热塑性聚氨酯胶粘剂及其制备方法
EP4286442A4 (en) * 2021-01-29 2024-11-27 Tokuyama Corporation CURABLE COMPOSITION WITH CYCLIC MULTIFUNCTIONAL MONOMER
KR20230112387A (ko) 2022-01-20 2023-07-27 케이피엑스케미칼 주식회사 연마패드용 윈도우의 제조방법 및 이 방법으로 제조된 연마패드용 윈도우
CN114874409A (zh) * 2022-04-26 2022-08-09 江苏利宏科技发展有限公司 一种基于聚醚多元醇的聚氨酯树脂及其制备方法
CN114957965A (zh) * 2022-07-07 2022-08-30 福建长泰万泰矿物制品有限公司 一种高耐热聚氨酯组合物、聚氨酯盘及其制备方法
CN115319649B (zh) * 2022-09-03 2023-08-04 深圳市永霖科技有限公司 一种用于玻璃抛光pu抛光砂纸及其制备方法
CN116444977B (zh) * 2023-06-16 2023-09-05 山东一诺威聚氨酯股份有限公司 聚氨酯弹性体及利用其制备抛光磨块的方法
CN119426743B (zh) * 2025-01-10 2025-04-18 合肥真萍电子科技有限公司 一种晶圆级回流焊设备

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JP2002113662A (ja) * 2000-10-04 2002-04-16 Sinto Brator Co Ltd 回転テーブル及び噴射ノズルの制御方法
JP3826702B2 (ja) * 2000-10-24 2006-09-27 Ｊｓｒ株式会社 研磨パッド用組成物及びこれを用いた研磨パッド
US20040224622A1 (en) * 2003-04-15 2004-11-11 Jsr Corporation Polishing pad and production method thereof
JP2005068168A (ja) * 2003-08-21 2005-03-17 Kanebo Ltd ガラス研磨ポリウレタンパッド用２液型組成物、該組成物を用いたガラス研磨ポリウレタンパッド、及びその製造方法
JP4635054B2 (ja) * 2005-01-24 2011-02-16 ルブリゾル アドバンスド マテリアルズ， インコーポレイテッド ナノ粒子／ポリウレタンコンボジットの水性分散物
US9951054B2 (en) * 2009-04-23 2018-04-24 Cabot Microelectronics Corporation CMP porous pad with particles in a polymeric matrix
JP2012528487A (ja) * 2009-05-27 2012-11-12 ロジャーズ コーポレーション 研磨パッド、それを用いた組成物および、その製造と使用方法
JP4636347B1 (ja) * 2009-06-29 2011-02-23 Ｄｉｃ株式会社 研磨パッド用２液型ウレタン樹脂組成物、ポリウレタン研磨パッド、及びポリウレタン研磨パッドの製造方法
CN101812229B (zh) * 2010-04-02 2012-06-20 宜兴市新光科技有限公司 隔热减震防护膜及其制造方法

Also Published As

Publication number Publication date
CN103059551B (zh) 2017-06-06
CN103059551A (zh) 2013-04-24
JP2013086217A (ja) 2013-05-13
KR20130043060A (ko) 2013-04-29

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