TW201312644A - System for grinding/polishing hard and brittle materials, and grinding/polishing method - Google Patents

Abstract

Provided is a system for grinding/polishing hard and brittle materials, said system being provided with a grinding function for making cross-sectional dimensions of a subject to be processed composed of hard and brittle materials within a tolerance range, and a polishing function for removing microcracks of a surface layer of the subject that has been ground, and reducing surface roughness to be small. Also provided is a method for grinding/polishing the hard and brittle materials. The grinding/polishing system is provided with: a grinding apparatus (1), which grinds a surface layer portion of a subject (W) to be processed that is composed of hard and brittle materials, removes impurities and strain in the columnar axis direction from the surface layer portion of the subject, and makes a cross-section have desired dimensions; a polishing apparatus (2), which polishes recesses and projections of the surface layer portion of the subject which has been ground, removes microcracks of the surface layer portion of the subject, and reduces the surface roughness to be small; and a control means, which performs arithmetic processing on the basis of initially set items, and measurement signals obtained from the grinding apparatus and the polishing apparatus, and outputs operation signals to the grinding apparatus and the polishing apparatus.

Description

Grinding and grinding of hard and brittle materials, grinding and polishing methods

The present invention relates to a grinding process and a grinding process for a workpiece using a hard brittle material for manufacturing a wafer by slicing. In particular, the grinding and polishing system and the grinding and polishing method for hard and brittle materials which remove deformation or micro-cracks of the surface layer portion of the workpiece.

In the surface layer portion of the ingot for manufacturing the wafer material, impurities or deformation due to melting and heating occur, and the surface layer portion of the block formed by cutting the ingot is deformed by the cutting and microcracking occurs. . Therefore, when the wafer is processed into a wafer of the final product in the second step, there may be defects in the product caused by cracks or nicks. In order to solve the above problems, it is necessary to remove the deformation of the surface layer portion of the block to adjust the outer dimensions of the wafer to the grinding process within the specification, and to remove the microcrack and the surface roughness of the surface portion of the ingot or the block. The miniaturization is necessary to reduce the grinding process of the crack or the notch when the ingot or the block is processed.

A wafer used for a semiconductor substrate or the like is obtained by the following steps A, B, and C.

Step A: a step of forming an ingot into a raw material, and forming an ingot by a pulling method (CZ method), a Bernoulli method, a hydrothermal breeding method, or the like.

Step B: The above-mentioned ingot is required to be cut into a moderate size by a band saw or a wire saw or the like, and corresponds to a step of adjusting the shape to form a block.

Step C: The step of cutting the aforementioned block to obtain a wafer.

A method of manufacturing a prismatic column is described by taking a silicon wafer as an example. In the production of the crucible, the molten raw material is flowed into the forming mold, and the surface layer portion (6 surfaces) of the ingot formed into a cubic shape is cut by a band saw or a wire saw, and then the cross section is cut into a square shape and at right angles to each other. The side surface of the intersection of the four side portions and the four corner portions thereof is formed with a microscopic plane (the chamfered portion), and the crystal structure is composed of a polycrystalline crystal, and is formed into a cylindrical shape by a lift method (CZ method) or Bernoulli method. After the top and the tail of the crucible are cut, the side surface portion of the crucible surface portion parallel to the column axis and forming a right angle with each other and the position (edge) intersecting the four side portions are minute arc faces of a part of the cylindrical surface portion. There are two types of lumps in which a crystal structure having four corners is formed by a single crystal.

In the surface layer of the above-mentioned block, deformation or micro-cracking occurs during the cutting process. Therefore, in the second step, in order to slice the wafer, the defective product may be broken or notched. . Therefore, it is necessary to apply a polishing process before the slicing process to remove the microcracks and to refine the surface roughness.

The size of the above-mentioned corner-shaped block has a square of 125 mm*125 mm (called 5 inches), a square of 156 mm*156 mm (called 6 inches), and a square of 210 mm*210 mm (called 8 inches). The length in the column axis direction is arbitrarily set between 150 and 600 mm.

In addition, other shapes as a block have a cylindrical shape. As an example of manufacturing a wafer from a cylindrical block, a method of manufacturing a sapphire wafer from a sapphire ingot (ingot) is described. The sapphire ingot has adhesion, irregularities, deformation, and the like of impurities such as molten slag which occur when heated and melted in the surface layer portion. When the adhesion, unevenness, and deformation of these impurities are removed and the outer diameter is ground to a desired size, micro-cracks occur in the surface layer portion. Therefore, similarly to the above-described block, in order to reduce the incidence of defective products due to cracking or chipping in the secondary step, a grinding process is performed to perform the removal of the microcracks and the surface roughness before the slicing process. The need for miniaturization.

The size of the sapphire ingot composed of the single crystal described above is generally 2 to 6 inches (51 to 154 mm) in diameter and 50 to 300 mm in length.

Further, as an example of manufacturing a wafer from a block of a different shape, a method of manufacturing a crystal wafer by Crystal Lambert will be described. Crystal Blue Burt is obtained by growing crystals by hydrothermal growth or the like to obtain artificial crystals, and then grinding the surface (Lambert processing) in order to clarify the axial direction of the artificial crystal. Thereafter, the step of forming the block by bonding the artificial crystals processed by the Lambert to the frequency characteristics at a predetermined angle and laminating the cut artificial crystals (for example, 50 to 70 sheets) with wax or the like to form a block body A crystal wafer can be obtained in order to modulate the shape of the block into a step of modulating the size of the wafer to be removed, and removing the wax or the like. The crystal blue Bert is shown in Fig. 20, and there are cases where both end faces are not horizontal.

In the surface layer of Crystal Lambert, there are micro-cracks that occur when artificial crystals are ground. In the same manner as in the case of slicing the above-mentioned clam block or sapphire ingot, in order to reduce the incidence of defective products due to cracking or chipping during slicing, a grinding process is performed to perform the microcrack before the slicing process. It is necessary to remove the miniaturization of the surface roughness.

The prior art description of the deformation or microcracks of the surface layer portions is removed to reduce the incidence of defective products due to cracking or chipping which occurs in the wafer processing.

The surface processing of a polycrystalline germanium block formed by cutting a cube-shaped polycrystalline germanium into a prismatic column is disclosed in Japanese Patent No. 3,649,393. It is described that the tantalum piece is sliced and the side surface of the block is mechanically mixed with the abrasive grain by a resin brush before being used as a tantalum wafer, and the fine unevenness is flattened so that the surface roughness becomes R μ 8 μm. the following.

However, there is no description about the deformation or micro-cracking of the surface layer which occurs when the crucible is cut.

Japanese Patent No. 4,133,935 discloses a ruthenium ingot which is cut into a predetermined length by using a band saw. The enamel surface layer portion is ground into a cylindrical shape by a cylindrical grinding device to remove the undulation, and the band surface portion of the enamel body is band saw. The ridge block having a quadrangular prism shape in which the four side surface portions are formed is cut and removed, and the surface roughness before flattening the side surface portions of the dam pieces is X μm (in the embodiment, Ry 10 to 20 μm). The amount of polishing is 5*X μm or more (in the embodiment, the polishing amount is 100 μm), and the surface roughness is refined (in the embodiment, Ry 3 to 4 μm), and the removal of microcracks can be achieved. The processing reduces the rate of failure of cracking when the wafer is formed by a factor of six or more.

Japanese Laid-Open Patent Publication No. 2005-255463 discloses that a single crystal sapphire ingot is sliced to obtain a desired outer diameter wafer, and the outer peripheral portion of the single crystal sapphire ingot is ground into a cylindrical shape by a cylindrical grinding device. Modulation of the diameter size. Since the grinding process is performed on the outer peripheral portion of the single crystal sapphire ingot, and the outer peripheral portion of the single crystal sapphire ingot is chemically ground to remove the processing distortion before the single crystal sapphire ingot is sliced. Or micro cracks.

The cutting method of the hard and brittle material for the wafer is as described above using a band saw or a wire saw, and it is desirable to use a wire saw cut by a plurality of wires.

In the prior art, the cutting method of the wire saw is a method in which the abrasive grains are blown to the cutting portion by the jet pressure of the pressurized water, and the free abrasive grains are cut by the contact of the wire. However, in recent years, the wire is fixed in the wire. The wire saw can greatly shorten the cutting time.

In order to compare the cutting ability of the new wire saw with the conventional wire saw, the inventors cut the polycrystalline ruthenium ingot into five columns in the vertical direction and five columns in the horizontal direction as shown in Fig. 15 = 25 pieces, and a section (referential) 6 inch angle (one side size: 156.0mm), length 300mm block. The time required for the cutting is 8Hr or more in the conventional wire saw, but the new wire saw can be finished at about 3Hr, and it is confirmed that the cutting time can be greatly shortened.

The reason why the cutting time can be shortened is presumed as follows. In other words, in the conventional wire-saw type of the free-abrasive type, when the wire is rotated at a high speed during the cutting process, the abrasive grains are scattered and the cutting efficiency is lowered. Since the new wire sawing abrasive grain is fixed to the wire, the abrasive grains which are not accompanied by the rotation of the wire are scattered, and the cutting can be efficiently performed.

However, in the case where the polycrystalline tantalum ingot is cut by the above-mentioned new wire saw, the block block of the four corners of the four corners shown in Fig. 15 and the three strips of the four sheets of A*4=12=12 are cut off. The center of the side surface of the front side of the bismuth ingot (on the side of the block system of A, and the surface of the block system of B) is cut as shown in Fig. 16 in the state of being expanded outward. In the case where the single crystal bismuth ingots are independently cut as shown in Fig. 17, the center of the side portion of the single crystal lumps shown in Fig. 18 is cut in the state of being expanded outward, and the cross-sectional dimension thereof is no longer specified. New problems within. Therefore, the deformation of the side of the block is required to remove and limit the grinding device within the specified dimensional tolerances.

Further, the slab formed by the bismuth ingot is cut during the cutting process, and has a surface roughness of Ry10 to 20 μm (JISR0601:1994) and a depth of 80 from the surface layer at the surface portion of the side surface portion and the corner portion. Micro-cracks of ~100 μm occur. When such a block is processed into a thickness of 10 μm to 100 μm before and after the wafer is formed into a wafer, the surface roughness and microcracks of the block may cause cracks and chipping in the wafer. Therefore, a polishing apparatus which removes microcracks before the slicing process and has a surface roughness of several μm or less is required.

Further, a grinding and polishing system and a grinding and polishing method which are performed efficiently by the steps of the grinding device and the polishing device are required.

The present invention solves the above-mentioned problems and provides a grinding device or a section which is formed by cutting a side surface portion and a corner portion of a block (for example, a block) formed by cutting a bar to a square column shape, and processing the cross-sectional size into a desired size. The shape of a substantially circular ingot and the shape of a cylindrical ingot (for example, a single crystal sapphire ingot) are deformed by melt heating or impurity removal at the outer periphery of the ingot, and the cross-sectional dimension is processed into a desired shape. The size of the grinding device, the grinding device for grinding the side portion and the corner portion of the block of a different shape (for example, Crystal Lambert), the removal of the microcrack of the surface portion of the workpiece to be finished, and the surface roughness A grinding and polishing system of a hard and brittle material, a grinding and polishing method, and a grinding and polishing system for grinding a hard and brittle material having a column shape that improves the processing efficiency by controlling the grinding device and the polishing device, and grinding The grinding process is for the purpose.

In order to achieve the above object, a grinding and polishing system for a hard and brittle material according to a first aspect of the present invention is, for example, shown in Figs. 1, 2, and 5, and a grinding and polishing system for a hard and brittle material is used for slicing. Grinding and polishing of a columnar workpiece formed of a hard brittle material of a wafer, characterized in that the surface layer portion of the workpiece (W) is ground at a constant cutting amount, and the workpiece (W) is processed. Grinding device (1) of measuring means (18) for measuring the size of the workpiece (W) by removing the impurities in the surface portion and the deformation of the column axis and making the cross-sectional dimension into the desired size of the grinding device (1) a polishing apparatus (2) that finishes the surface layer portion of the workpiece (W) to be ground by a predetermined pressing force, removes micro-cracks in the surface layer portion of the workpiece (W), and refines the surface roughness. a grinding device (2) having a measuring means (18) for measuring the size of the workpiece (W); calculating a size of the workpiece (W) measured by the measuring means (18), according to the calculation As a result, the actuation signal of the aforementioned grinding device (1) and the operation of the aforementioned polishing device (2) are output. Signal control means.

According to the first aspect, it is possible to set a cutting amount (which is an academic term: "scheduled cutting") for cutting a workpiece, and to cut the shape of the workpiece, and to shape the shape and grind the cross-sectional size into a desired size. By setting a certain amount of cutting force (the academic term: "constant cutting") to the workpiece to grind the surface portion of the workpiece, it is possible to machine the cross-sectional dimension and the cross-sectional shape to the desired tolerance. Moreover, the grinding and polishing system of the hard and brittle material which can remove the micro-cracks of the surface layer portion and refine the surface roughness can be surely obtained. In addition, the size of the workpiece is measured by a measuring device provided in the grinding device or the grinding device, and the measurement result is calculated by a control means and outputted as an actuation signal of the grinding device or the grinding device, so that the size based on the measurement can be performed. The correct grinding and grinding process.

In the grinding and polishing system according to the second aspect of the present invention, for example, as shown in FIG. 21, at least one or more grinding and polishing apparatuses having the following means are provided: measuring means for measuring the size of the workpiece; The surface layer portion of (W) is ground at a constant cutting amount, and the impurities in the surface layer portion of the workpiece and the deformation in the column axis direction are removed, and the cross-sectional dimension is a grinding device of the desired size (14); a polishing means (20) for polishing the surface layer portion of the workpiece with a constant pressing force, removing micro-cracks in the surface layer portion of the workpiece, and miniaturizing the surface roughness; and calculating the workpiece to be measured by the above-mentioned measuring means The size is used to output an actuation signal of the grinding device and a control means for the actuation signal of the polishing device based on the result of the calculation.

In the grinding and polishing system according to the second aspect of the present invention, as shown in Figs. 1 and 2, for example, the surface layer portion of the workpiece (W) is fixed. The cutting amount is ground, the impurities in the surface layer portion of the workpiece (W) and the deformation in the column axis direction are removed, and the cross-sectional size is a desired size grinding device (1) and the size of the workpiece (W) is measured. In the grinding device (1) of the measuring device (18), the surface layer portion of the workpiece (W) that has been subjected to the grinding is polished at a constant pressing force to remove microcracks in the surface portion of the workpiece (W). A polishing apparatus (2) for refining the surface roughness and having at least one of the polishing apparatuses (2) for measuring the size (D) of the workpiece (W).

According to the second and third aspects, it is possible to cut the shape of the workpiece by setting a certain amount of cut (the academic term: "sizing") into the workpiece, and to shape the shape and to cut the cross-sectional size into a desired size. The grinding means and the cutting amount by the pressing force (the academic term: "constant cutting") are used to grind the surface portion of the workpiece, so that the cross-sectional size and the cross-sectional shape can be processed to A grinding and polishing system for hard and brittle materials that can be used to remove minute cracks in the surface layer and to refine the surface roughness. In addition, the size of the workpiece is measured by the measuring means provided in the grinding and polishing apparatus, and the measurement result is calculated by a control means and the actuation signal of the grinding means or the grinding means is output, so that the size based on the measurement can be correctly performed. Grinding and grinding.

According to the third aspect, the grinding and polishing device can be combined with the grinding device or the polishing device in combination with the shape or processing purpose of the workpiece.

The grinding and polishing system according to the fourth aspect of the present invention is the grinding and polishing system according to the first or third aspect, for example, as shown in Figs. 1, 6, 7, and 9, the grinding device (1) A base (11) capable of moving the workpiece (W) in a vertical direction and horizontally placing the column axis thereof, and a workpiece (W) placed on the base (11) The workpiece (W) is retracted in a direction orthogonal to the column axis to press the workpiece (W) to the center of the base (11), and to make the shaft center the workpiece ( W) the direction of the column axis and holding the clamping shaft (13) at both ends of the workpiece (W) and the clamping shaft (13) can rotate the workpiece (W) around its axis The grinding means (12) and the grinding body in which the abrasive grain layer combined with the abrasive grains is fixed to the disk-shaped or annular platen is used as a grinding machine fixed to the rotating disk and detachably coupled to the rotary driving source a grinding means (14) for pressing the abrasive grain layer against the workpiece and rotating the same, and one of the holding means (12) and the grinding means (14) is in the column axis direction of the workpiece (W) At least move quite Moving means (19) from the length of the workpiece (W) of.

The grinding and polishing system according to the fifth aspect of the present invention is the grinding and polishing system according to the first or third aspect, for example, as shown in Figs. 1, 6, 7, 9, and 10, the grinding device is (1) A base (11) capable of moving the workpiece (W) in the vertical direction and horizontally placing the column axis thereof, and a workpiece (W) placed on the base (11) a pusher (34) that is positioned in a direction orthogonal to the column axis of the workpiece (W) to position the workpiece (W) at the center of the base (11) and to make the shaft center The direction of the column axis of the workpiece (W) and holding the clamping shaft (13) at both ends of the workpiece (W) and the clamping shaft (13) can treat the workpiece (W) with its axis The center rotating control means (12), the abrasive body layer in which the abrasive grains are bonded to each other is fixed to the disk-shaped or annular platen, and is fixed to the rotating disk and detachably coupled to the rotary drive a grinding stone of a source, a grinding device (14) that presses the abrasive grain layer against the workpiece and rotates, and one of the holding means (12) and the grinding means (14) is in the workpiece (W) Move at least in the direction of the column axis A moving means (19) corresponding to the distance of the length of the workpiece (W).

According to the fourth and fifth aspects, the workpiece is held by the holding means, moved by the moving means, ground by the grinding means, and the workpiece can be rotated and ground by the holding shaft of the gripping means. The impurities in the surface layer portion of the workpiece and the deformation in the column axis direction are removed. Further, the movement of the grindstone held by the gripping means or the grinding means by the moving means is equivalent to the distance of the length of the workpiece, so that the entire length of the workpiece can be ground.

The grinding and polishing system according to the sixth aspect of the present invention is the grinding and polishing system according to the first or third aspect, for example, as shown in FIG. 2, FIG. 6, FIG. 7, FIG. 9, FIG. A base (11) capable of moving the workpiece (W) in a vertical direction and horizontally placing the column axis thereof, and a workpiece (W) placed on the base (11) The workpiece (W) is retracted in a direction orthogonal to the column axis to press the workpiece (W) to the center of the base (11), and to make the shaft center the workpiece ( W) the direction of the column axis and holding the clamping shaft (13) at both ends of the workpiece (W) and the clamping shaft (13) can rotate the workpiece (W) around its axis a holding means (12), a polishing brush having a rotating disk (22) and having a brush-like material (21) disposed on a disk-shaped surface, and the polishing brush is detachably coupled to the rotating mechanism and a polishing means (20) for pressing and rotating the bristle material (21) to the workpiece (W), and a column of the holding means (12) and the polishing means (20) on the workpiece (W) Move at least in the direction of the axis A moving means (19) corresponding to the distance of the length of the workpiece (W).

According to the sixth aspect, the workpiece is held by the holding means, moved by the moving means, and polished by the polishing means, and the workpiece can be rotated and polished by the holding shaft of the holding means, so that the workpiece can be surely Grinding processing in which micro cracks of the workpiece are removed and the surface roughness is refined. Further, since the workpiece held by the holding means or the polishing means for rotating the polishing means is moved by the distance corresponding to the length of the workpiece, the entire length of the workpiece can be ground.

In the grinding and polishing system according to the second aspect of the present invention, for example, as shown in FIG. 21, the grinding and polishing device (6) includes the workpiece (W). a base (11) that moves in a vertical direction and horizontally mounts its column axis, and has a workpiece placed on the base that is retracted in a direction orthogonal to a column axis of the workpiece to a pressing member (34) positioned at a center of the base plate and a clamping shaft (13) for holding the shaft center in the direction of the column axis of the workpiece and holding the both ends of the workpiece, and the clamping shaft can be a holding means (12) for rotating the workpiece around the axis thereof, and one of the holding means (12) or the grinding means (14) or the polishing means (20) is at least in the column axis direction of the workpiece a moving means (19) for moving a distance corresponding to the length of the workpiece, and the grinding means (14) grinding the abrasive grain layer in which the abrasive grains are bonded to the disk-shaped or annular platen The body is a grindstone fixed to the rotating disk and detachably coupled to the rotary drive source, and the abrasive grain layer is pressed against the foregoing The object to be processed is rotated, and the polishing means (20) has a rotating disk in which a brush material containing abrasive grains is placed on a disk-shaped surface, and the brush material is pressed and rotated toward the workpiece, and is detachably held. The abrasive brush is rotated and the aforementioned abrasive brush is rotated.

In the grinding and polishing system according to the second aspect of the present invention, for example, as shown in FIG. 21, the grinding and polishing apparatus includes the workpiece (W) in a vertical direction. a base (11) that moves and horizontally mounts the column axis thereof, and has a workpiece placed on the base in a direction orthogonal to a column axis of the workpiece to retract the workpiece a pressing device (34) positioned at a center of the base and a clamping shaft (13) for holding the shaft center in the direction of the column axis of the workpiece and holding the both ends of the workpiece, and the clamping shaft can be processed The holding means (12) for rotating the object around the axis thereof causes at least one of the holding means (12), the grinding means (14) or the polishing means (20) to move at least in the column axis direction of the workpiece The means for moving the length of the workpiece (19) The grinding means (14) is a fixed body in which the abrasive grain layer in which the abrasive grains are bonded to each other is fixed to the disk-shaped or annular platen. a rotating stone, a grindstone detachably coupled to the rotary driving source, and pressing the abrasive grain layer on the aforementioned The polishing means (20) has a rotating disk in which a brush material containing abrasive grains is placed on a disk-shaped surface, and the brush material is pressed and rotated toward the workpiece, and the polishing is detachably held. Brush and rotate the aforementioned abrasive brush.

According to the seventh and eighth aspects, the workpiece is held by the holding means, moved by the moving means, and ground by the grinding means, and the workpiece after the grinding is ground by the grinding means, and the holding means can be clamped. Since the shaft rotates and grinds the workpiece, it is possible to surely remove the impurities in the surface layer portion of the workpiece and the deformation in the column axis direction, and surely perform the grinding processing to remove the micro cracks of the workpiece and to refine the surface roughness. . Further, the grinding stone held by the holding means or the grinding means for rotating, and the polishing brush for the rotating polishing means are moved by the distance corresponding to the length of the workpiece, so that the workpiece can be processed Full length grinding.

In the grinding and polishing system of the ninth aspect of the present invention, in the grinding and polishing system of the fourth, fifth, seventh, and eighth aspects, the particle size of the abrasive grains of the grinding means is F90 to F220 (JISR6001) for rough grinding. : 1998) or #240～#500 for precision grinding (JISR6001:1998).

According to the ninth aspect, since the particle size of the abrasive grains of the grinding means is F90 to F220 (JISR6001:1998) for rough grinding or #240 to #500 (JISR6001:1998) for precision grinding, it can be efficiently performed. Rough grinding or precision grinding.

In the grinding and polishing system according to the sixth aspect of the present invention, for example, as shown in Fig. 12, the grinding material (35, 36) of the polishing means is included in the grinding and polishing system. The particle size of the particles is 2 or more types.

In the grinding and polishing system according to the eleventh aspect of the present invention, in the grinding and polishing system of the tenth aspect, the particle size of the abrasive grains of the polishing means is #240 to #500 (JISR6001:1998) or For precision grinding, #800～#1200 (JISR6001:1998).

A grinding and polishing system according to a twelfth aspect of the present invention is the grinding and polishing system of the tenth aspect, for example, as shown in Fig. 12, in which the brush material containing coarse-grained abrasive grains is used in the above-mentioned polishing means (36). The bristles (35) containing fine-grained abrasive grains are disposed around the arrangement of the bristle material (36) containing the coarse-grained abrasive grains.

According to the tenth to twelfth aspects, since the size of the abrasive grains contained in the bristle material (35, 36) of the polishing means is two or more types, it is possible to carry out rough grinding or precision of the workpiece by one polishing apparatus. Grinding processing, reducing the cost of equipment. In particular, a bristle material (36) containing abrasive grains having a coarse particle size is disposed at a portion near the center of rotation of the rotary disk, and a bristle material (35) containing abrasive grains having a fine particle size is disposed on the bristles containing the abrasive grains having a coarse particle size. The circumference of the material (36) configuration is ideal. Further, the particle size of the abrasive grains of the polishing means is preferably #240 to #500 (JISR6001:1998) for rough polishing or #800 to #1200 (JISR6001:1998) for precision polishing. The high-grinding ability of the polishing brush for rough grinding is surely removed from the micro-cracks present in the surface layer portion of the workpiece, and the surface roughness of the surface layer portion which is roughened by the rough grinding process is finely refined by the polishing brush for precision polishing. It is possible to prevent the subsequent step of slicing to make a crack or a gap which occurs when the wafer is formed.

A grinding and polishing system according to a thirteenth aspect of the present invention is the grinding and polishing system of the first aspect or the third aspect, wherein the grinding means of the grinding device and the grinding means of the polishing device are replaceable by Replacing the grinding means and the grinding means allows the grinding device to be a polishing device or the polishing device to be a grinding device.

According to the thirteenth aspect, the grinding means of the grinding device and the polishing means of the polishing apparatus are replaceable, and the grinding means can be replaced by the grinding means or the grinding means can be made into a grinding device by replacing the grinding means with the grinding means. Therefore, by making the grinding means and the specifications of the mounting portion of the polishing means common, the grinding device and the polishing device (excluding the grinding means and the polishing means) can be made to have the same specifications, so that the device body can be manufactured. The original price is low.

A grinding and polishing system according to a fourteenth aspect of the present invention is the grinding and polishing system of the second aspect, wherein the grinding means of the grinding and polishing apparatus and the polishing means are replaceable.

According to the fourteenth aspect, the grinding means is common to the mounting portion of the polishing means, and the grinding means of the grinding device and the polishing means of the polishing apparatus are replaceable. For example, in the case shown in Fig. 21, the polishing means and the grinding means can be replaced to form a polishing apparatus. Further, the grinding means can be replaced by a grinding means and a grinding means. Further, for example, as shown in FIG. 23, in the case of a grinding and polishing apparatus that connects a pair of grinding means and two pairs of polishing means, the grinding means in the center in the left-right direction of the figure can be replaced with a grinding means. After the grinding process at the stage, the grinding process is performed.

In the grinding and polishing system according to the first aspect of the present invention, for example, as shown in FIG. 5, the grinding and polishing system of the first aspect of the present invention includes: carrying the workpiece before the grinding and polishing into the grinding of the hard and brittle material. The loading device (3) of the polishing processing system, and the unloading device (4) for carrying out the grinding and polishing of the workpiece from the grinding and polishing system of the hard and brittle material, and the loading device (3) and the grinding device (1) And a moving arm portion (51) that moves the workpiece between the polishing device (2) and the loading device (4) and a front end attached to the operating arm portion (51) and rotates the workpiece to a predetermined angle The transfer device (5) of the grip portion (52).

In the grinding and polishing system according to the sixth or third aspect of the present invention, for example, as shown in Fig. 22, the grinding and polishing system of the present invention is provided with the workpiece (W) before the grinding and polishing process. The loading device (3) of the grinding and polishing system of the hard and brittle material, and the unloading device (4) for carrying out the grinding and polishing of the workpiece from the grinding and polishing system of the hard and brittle material, and the loading device (3) The grinding device (6), the lapping device (1), the polishing device (2), and the unloading device (4) move the arm portion (51) between the workpiece and the actuator arm portion (51). a transfer device (5) of the grip portion (52) that rotates the workpiece to a predetermined angle at the front end.

According to the fifteenth or sixteenth aspect, the workpiece (W) before the grinding and polishing processing is transferred to the loading device (3), the grinding and polishing device (6), the grinding device (1), and the transfer device (1). Since the polishing device (2) and the unloading device (4) are transferred, the workpiece (W) that has not been ground and polished in the standby device (3) can be ground by the grinding device (1) and the polishing device (2). After the polishing process is completed, the unloading device (4) is easily carried out. Further, since the workpiece (W) can be rotated by the grip portion (52) of the transfer device (5), the side surface processed by the grinding device (1) and the polishing device (2) can be changed and processed.

The grinding and polishing system according to the seventeenth aspect of the present invention is the grinding and polishing system of the first or second aspect, wherein the measuring means provided in the grinding device or the polishing device is provided with the workpiece One of the reference planes formed in the horizontal direction perpendicular to the vertical axis of the column axis and the reference plane formed in the vertical direction perpendicular to the column axis by a known reference interval dimension is used to measure the reference block of the reference plane. The measuring direction is the horizontal direction, and measuring the distance between the reference surface on both sides of the reference block and the grinding and grinding processing portion on both sides of the workpiece, and measuring the direction in the horizontal direction and measuring the reference The reference surface of the upper surface of the block and the measuring device of the height of the grinding and polishing part on the upper surface of the workpiece are formed.

According to a seventeenth aspect, the measuring means has a direction in which a reference plane is formed in a horizontal direction perpendicular to a column axis perpendicular to the column axis of the workpiece, and a reference plane is perpendicular to a vertical direction perpendicular to the column axis. It is known that the reference interval size forms a reference block of the reference plane, the measurement direction is the horizontal direction, and the reference surface of both sides of the reference block and the interval between the grinding and polishing portions on both sides of the workpiece are measured. Measuring the measuring tool, measuring the direction in the horizontal direction, and measuring the measuring surface of the reference surface on the upper surface of the reference block and the height of the grinding and polishing portion on the upper surface of the workpiece, so that the workpiece can be processed The column axis coincides with the axis of the clamping shaft and the workpiece is held by the holding means.

In a grinding and polishing system according to a seventeenth aspect of the present invention, in the grinding and polishing system of the aspect, the control means includes: the grinding means is provided in contact with each of the end portions of the polishing means in the grinding device The reference surface of one of the reference blocks of the holding means of the polishing apparatus is used to calculate a function of processing the cutting amount of each of the grinding device and the polishing device to a base position of 0; and is provided in the grinding device and the polishing device. The measuring device measures the difference between the reference surface on both sides of the reference block and the processing portion on both sides of the workpiece to calculate the function of the processing before and after processing of the processed portion of the workpiece Performing a function of calculating the processing of the workpiece by the grinding device and the polishing device, and setting the initial setting items input before the start of the machining and the measurement of the grinding device and the polishing device respectively The measuring signal outputted by the measuring tool of the means is subjected to arithmetic processing, and the means for the grinding device and the grinding device are An actuation function signals.

According to a ninth aspect of the present invention, in the grinding and polishing system of the second aspect, the control means includes: the grinding means is provided in contact with each of the distal ends of the polishing means in the grinding device; The reference surface of one of the reference blocks of the holding means of the polishing apparatus is used to calculate a function of processing the cutting amount of each of the grinding device and the polishing device to a base position of 0; and is provided in the grinding device and the polishing device. The measuring device measures the difference between the reference surface on both sides of the reference block and the processing portion on both sides of the workpiece to calculate the function of the processing before and after processing of the processed portion of the workpiece Performing a function of calculating the processing of the workpiece by the grinding device and the polishing device, and measuring the output of the initial setting item input before the start of machining and the measuring device of the measuring means The signal is subjected to arithmetic processing, and the function of the actuation signal is outputted to the grinding means and the polishing means.

According to the eighteenth and nineteenth aspects, since the control means is provided with various functions for automating the grinding and polishing system, the grinding and machining of the processed portion of the workpiece can be surely performed and labor-saving.

In a grinding and polishing system according to a twentieth aspect of the present invention, in the grinding and polishing system of the second aspect, the shape of the workpiece is a prismatic shape; and the cross-sectional dimension of the workpiece to be ground and ground is processed. The tolerance was set to ±0.5 mm, and the tolerance of the cross-sectional shape of the corner portion where the side portions of the workpiece 2 intersected each other was set to ±0.1 degrees.

According to the twentieth aspect, for example, in the square columnar block, the cross-sectional dimension of the block has a square of 125 mm*125 mm (called 5 inches) and a square of 156 mm*156 mm (called 6 inches). There are three kinds of squares of 210mm*210mm (referred to as 8 inches), and the required tolerance is ±0.5mm. The tolerance of the cross-sectional shape of the corners where the two side parts of the two blocks are further required is ±0.1 degrees. Grinding and grinding based on tolerances of section dimensions and tolerances of section shapes.

The grinding and polishing system according to the twenty-first aspect of the present invention is the grinding and polishing system according to the 18th or 19th aspect, wherein the shape of the workpiece is a cylindrical shape; and a profile of the workpiece to be ground and ground The tolerance of the dimensions is set to ±0.5mm.

According to the aspect of the twenty-first aspect, for example, in a cylindrical single crystal sapphire ingot, the cross-sectional dimension is 2 to 6 inches (51 to 154 mm) and the required tolerance is ±0.5 mm, so that tolerance based on the sectional size can be performed. Grinding and grinding.

In the grinding and polishing method according to the 22nd aspect of the present invention, the grinding and polishing system of the hard and brittle material according to any one of the above claims 1 to 3 is used; after the grinding by the grinding device, the grinding is performed The device is ground.

According to the twenty-second aspect, the surface layer portion of the workpiece is ground at a constant cutting amount, and the impurities in the surface layer portion of the workpiece and the deformation in the column axis direction are removed, and the cross-sectional size is a desired size. Further, the grinding device having the measuring means for measuring the size of the workpiece and the surface layer portion of the workpiece to be finished by the grinding are ground at a constant pressing force to remove microcracks of the surface portion of the workpiece and roughen the surface The grinding device having the micro-fine grinding device and the grinding device having the measuring means for measuring the size of the workpiece is subjected to grinding and grinding processing, so that the cross-sectional size and the cross-sectional line can be processed to a desired tolerance and a micro-crack can be provided for the surface portion. A grinding and grinding method for removing a hard and brittle material which refines the surface roughness. In addition, the size of the workpiece is measured by a measuring device provided in the grinding device or the grinding device, and the measurement result is calculated by a control means and outputted as an actuation signal of the grinding device or the grinding device, so that the size based on the measurement can be performed. The correct grinding and grinding process.

According to the present invention, the surface layer portion of the workpiece is ground at a constant cutting amount, and the impurities in the surface layer portion of the workpiece and the deformation in the column axis direction are removed, and the cross-sectional size is a desired size. The grinding device for measuring the size of the workpiece and the surface layer portion of the workpiece to be finished by the grinding are polished at a constant pressing force to remove microcracks in the surface portion of the workpiece and to make the surface roughness fine. The grinding device and the grinding device having the measuring means for measuring the size of the workpiece are subjected to grinding and grinding processing, so that the cross-sectional size and the cross-sectional line can be processed to the desired tolerance and the micro-cracks of the surface portion can be surely removed and The surface roughness is fine. Thereby, in the second step, the incidence of defective products caused by cracks and gaps occurring during wafer slicing can be reduced.

The present invention is based on Japanese Patent Application No. 2011-201809, filed on Sep.

In addition, the present invention should be more fully understood from the following detailed description. However, the detailed description and specific examples of the embodiments of the invention are intended for the purpose of illustration. Since the various changes and changes are explained in detail from the above, it is obvious to the practitioner.

The applicant does not intend to offer any of the stated forms of implementation to the public, revealing the changes or substitutions, and the text may not be included in the scope of the patent application as the invention under the equalization theory. portion.

In the description of the specification or the scope of the patent application, the use of the singular and plural referents should be used in the singular and plural terms unless otherwise specified. The use of any singular or exemplified language (such as "the" or "an" or "an" or "an" By.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the respective drawings, the same or corresponding elements are denoted by the same reference numerals, and the description thereof will not be repeated.

A first embodiment of a grinding and polishing system will be described. A grinding and polishing system for a hard and brittle material, which is obtained by grinding and polishing a columnar workpiece composed of a hard and brittle material for forming a wafer by slicing, and is characterized in that: a surface portion of a workpiece (W) is provided Grinding device with a certain amount of cutting, removing the impurities in the surface layer portion of the workpiece (W) and the deformation in the column axis direction, and making the cross-sectional dimension into a desired size (1); a polishing device (2) in which the surface layer portion of (W) is polished at a constant pressing force to remove microcracks in the surface portion of the workpiece (W) and to have a fine surface roughness; based on an initial setting before the start of processing a measurement signal of the grinding device (1), a measurement signal calculation process of the polishing device (2), and an operation signal of the grinding device (1) and the polishing device (2) are output based on the result of the calculation processing. The means of control of the actuation signal.

Here, the hard and brittle material refers to a material having properties such as glass, ceramics, crystal, quartz, etc. which have high hardness and hardness but are weak to impact and brittle.

[grinding device]

Fig. 1 is a view showing a grinding device (1) for grinding a workpiece (W) of a columnar shape according to the present invention. The grinding device (1) includes a holding means (12) for gripping the workpiece (W), and a grinding means A (14) for grinding the side surface portion (F) and the corner portion (C) of the workpiece (W). The reference block (K) of the reference surface, the measuring means (18) for measuring the cross-sectional dimension of the workpiece (W), and the holding means (12) for holding the workpiece (W) to move the workpiece ( W) A moving means (19) for moving between the measuring means (18) and the grinding means A (14).

The moving means (19) moves the holding means (12) for holding the workpiece (W) between the measuring means (18) and the grinding means A (14) to measure the workpiece (W) or will be Machining (W) grinding. However, the holding means (12) for holding the workpiece (W) is fixed, and the measuring means (18) and the grinding means A (14) are moved at the position of the workpiece (W) to carry out the workpiece (W). The measurement and grinding process can also be used.

The workpiece (W) placed on the grinding device (1) is measured by the measuring means (18) before the start of the grinding process. The cross-sectional dimension of the workpiece (W) is the size of the workpiece (W) to be processed as the initial setting item, and the amount of grinding and the amount of polishing and the cross-sectional dimension after grinding and grinding are integrated. In the case of small, the grinding process of the grinding device (1) is stopped by the arithmetic processing of the aforementioned control means. The workpiece (W) can be released from the holding state of the holding means (12) and returned to the remelting step. The workpiece (W) which is dissolved in the remelting step is reshaped into a cylindrical shape in the case of, for example, a single crystal ruthenium or sapphire, and is reshaped into a cubic shape in the case of polycrystallization. .

When the shape of the workpiece (W) is a prismatic shape, the grinding device (1) includes a base that can move the workpiece (W) in the vertical direction and horizontally mount the column axis (11). a workpiece (W) placed on the base (11) is retracted in a direction orthogonal to a column axis of the workpiece (W) to cause the workpiece (W) to be in the base a pressing device (34) positioned at the center of the table (11) (refer to FIG. 7) and a clamping shaft for holding the axis of the object (W) in the direction of the column axis and holding the both ends of the workpiece (W) (13) The holding shaft (13) is a holding means (12) for rotating the workpiece (W) around its axis. The clamping shaft (13) holds the workpiece (W). When the abutment (11) is lowered, the aforementioned clamping shaft (13) holds the workpiece (W) around its axis. The holding means (12) is such that the workpiece (W) can be "intermittently rotated" or "continuously rotated" as shown in FIG.

The gripping means (12) is capable of "intermittently rotating" the workpiece (W) to the position where the workpiece (W) is ground and polished, and the surface is formed in Fig. 1. 2 shows the positioning on both sides in the Y direction, and the holding shaft (13) of the holding means (12) holding the workpiece (W) "intermittently rotates" around its axis.

For the example of the operation and processing sequence of the "intermittent rotation" in the case of a multi-crystal block-shaped grinding and polishing process in which the machined surfaces are all in the shape of a flat surface, the side portion (F) of the first group facing the opposite direction (refer to Fig. 16) is located on both sides of the Y direction shown in Figs. 1 and 2 and is rotated by 90 degrees to machine the side portion (F) of the second group and finish the processing of the side portion (F) of 4, so that the rotation is 45 degrees. The corner portion (C) of the first group (see FIG. 16) is positioned on both sides in the Y direction shown in FIGS. 1 and 2, and is rotated by 90 degrees to process the corner portion of the second group (C). ), the grinding and grinding process is finished.

The gripping means (12) allows the workpiece (W) to be "continuously rotated" to hold a single crystal sapphire ingot, for example, a cylindrical shape having a cross-sectional shape at a position where the workpiece (W) is ground and polished. In the case where the body portion (B) is ground and polished, or the four corner portions (C) of the square columnar single crystal block are ground and ground, as shown in Figs. 3 and 4, the grinding means is disposed on one side (20). Or the polishing means (30), the holding shaft (13) holding the workpiece (W) is subjected to a grinding rotation process by continuously inputting the set rotation speed "continuous rotation".

Further, the clamping shaft (13) provided in the grinding device (1) or the holding device (12) of the polishing device (2) is provided with both end faces of the workpiece (W) and measures the workpiece (W). The size in the longitudinal direction and the function of the control means are memorized, and the measurement result is arithmetically processed and becomes an actuation signal for controlling the moving distance of the moving means (19) to be described later. By the action of the moving means (19) caused by the actuation signal, the clamping shaft (13) of the holding means (12) of the workpiece (W) is held by the measuring means (18) and the grinding means (1) Or moving between the measuring means (18) and the polishing means (2), applying the measurement of the cross-sectional dimension of the workpiece (W) or grinding or grinding. Further, the measuring means (18), the grinding means (1) or the measuring means (18) and the polishing means (2) may be moved between the holding shafts (13).

As shown in Fig. 9, the grinding means A (14) is a grinding type body (15) which is a cup type grindstone fixed to a rotating disk (16) which is an abrasive grain which combines abrasive grains with each other. Layer A (15a) is fixed to a disk-shaped or annular platen (15b). The grinding means A (14) is detachably coupled to the rotary drive source via the rotary shaft (17), and the abrasive grain layer A (15a) is brought into surface contact with the processed portion of the workpiece (W) and is pressed and rotated. Further, the platen (15b) may not be flat, and for example, the position of the abrasive grain layer A (15a) may be convex. Further, the grinding means A (14) may be as shown in Fig. 10, and the abrasive grain layer A (15a) may be fixed to the rotating disk (16). At this time, the means for fixing the abrasive grain layer A (15a) to the rotary disk (16) may be fixed by bolts or the like or integrally formed with the rotary disk (16).

The grinding device (1) is disposed so as to face the pair of grinding means A (14) (grinding stone) so that the abrasive grain layer A (15a) is in contact with both side surfaces of the workpiece (W). The grinding means A (14) is detachably provided to the grinding device (1).

The grinding device (1) includes a measuring means (18) for measuring a cross-sectional dimension of a reference block in which a pair of reference faces are formed in a horizontal direction and a vertical direction perpendicular to the column axis, and a cross-sectional dimension of the workpiece (W). The grinding device (1) is provided such that one of the holding means (12) and the grinding means A (14) moves at least in the column axis direction of the workpiece (W) by a distance corresponding to the length of the workpiece (W) The means of movement (19).

The grinding device (1) has a grinding layer A (15a) integrally formed on the disc-shaped surface by combining the abrasive grains as a grinding means A (14), and the abrasive layer A (15a) is processed as described above. Since the processed portion of the object (W) is in contact with the surface and is pressed and rotated, it can be ground in a certain amount of cutting.

Fig. 3 is a view showing a grinding device (1) for grinding a cylindrical workpiece (W) according to the present invention. The grinding device (1) includes a holding means (12) for gripping the workpiece (W), a grinding means B (24) for grinding the body portion (B) of the workpiece (W), and a reference block for forming the reference surface ( K), measuring means (18) for measuring the cross-sectional dimension of the workpiece (W), and moving the holding means (12) for holding the workpiece (W) to measure the workpiece (W) (18) A moving means (19) for moving between the grinding means B (24).

The moving means (19) fixes the holding means (12) for holding the workpiece (W) in the same manner as described above, and moves the measuring means (18) and the grinding means B (24) at the position of the workpiece (W). It is also possible to perform measurement and grinding of the workpiece (W).

When the workpiece (W) has a cylindrical shape, the gripping means (12) of the grinding device (1) holds the workpiece (W) "continuously rotating" around the axis.

Further, as shown in Fig. 13, the grinding means B (24) is an abrasive grain layer B (25) for bonding abrasive grains to each other on a cylindrical carcass surface to a rotating cylinder (26) having a rotating shaft (27). A roll-type grindstone with a surface fixed. The grinding means B (24) is detachably coupled to the rotating shaft of the rotating cylinder (26) and the rotating drive source, and the abrasive layer B (25) and the workpiece (W) are The parallel line of the axis contacts the processed portion of the workpiece (W) and is pressed and rotated. In addition, it is also possible to use a cup-type grindstone which is cheaper than a roll-type grindstone.

Further, the grinding device (1) is such that the abrasive layer B (25) is parallel to the axis of the workpiece (W) on both sides thereof and has a pair of grinding means B (24) (grinding stone) ideal. The grinding means B (24) is detachably provided to the grinding device (1).

By selecting the grinding means A (14) and the grinding means B (24) of the grinding device (1) as the grinding stone having rigidity, the deformation of the workpiece (W) or the like is cut off to shape the shape and the shape is formed. Dimensional grinding is the ability to perform within the desired tolerances. Therefore, the removal of impurities and external deformation of the surface layer portion of the columnar and cylindrical workpieces (W) can be surely performed.

Further, the grinding stone A (14) of the grinding device (1) and the grinding stone of the grinding device B (24) have a grain size of 1 for the abrasive grains constituting the abrasive grain layer A (15a) and the abrasive grain layer B (25). The particle size of the abrasive grains of the bristle material A (21) and the bristle material B (31) of the polishing means A (20) and the polishing means B (30) fixed to the polishing apparatus (2) is two or more types. Two or more types are also available.

The particle size of the abrasive material A (14) or the grinding tool B (24) composed of the grinding stone of the grinding device (1) is F90 to F220 (JISR6001:1998) for rough grinding or #240～# for precision grinding. 500 (JISR6001:1998), the particle size of the abrasive grains A (20) or the polishing means B (30) composed of the polishing brush of the polishing device (2) is coarsely polished #240 to #500 (JISR6001:1998) ) or precision grinding can also be used #800～#1200 (JISR6001:1998).

The particle size of the abrasive grains of the grinding means A (14) or the grinding means B (24) is set to two groups of F90 to F220 (JISR6001: 1998) for rough grinding or #240 to #500 (JISR6001: 1998) for precision grinding. For the following reasons. In the case where the cross-sectional dimension of the workpiece (W) cut in the previous step or the straight angle of the corner portion (C) of the workpiece (W) is outside the tolerance, in order to make the cross-sectional dimension of the workpiece (W) Or the straight angle of the corner (C) of the workpiece (W) is within the tolerance, and the coarse particles of F90 to F220 are differentiated so that the cutting efficiency can be improved. In order to prevent the occurrence of the above-mentioned debris and to perform grinding processing in a grinding process called a crack of a chip or a position where a chip is easily generated (a corner portion of a polycrystalline block, etc.), the fine powder of #240 to #500 is selected and It is ideal to use.

[grinding device]

Fig. 2 is a view showing a polishing apparatus (2) for grinding a workpiece (W) of a columnar shape according to the present invention. The polishing apparatus (2) includes gripping means (12) for holding the workpiece (W) that has been subjected to the grinding processing, and grinding the side surface portion (F) and the corner portion (C) of the workpiece (W) The polishing means A (20) for removing the cracks and the surface roughness is refined, the reference block (K) for forming the reference surface, and the measuring means (18) for measuring the cross-sectional dimension of the workpiece (W), and the holding means are held. The moving means (19) for moving the holding means (12) of the workpiece (W) to move the workpiece (W) between the measuring means (18) and the grinding means A (20).

The moving means (19) fixes the holding means (12) for holding the workpiece (W) in the same manner as the moving means (19) of the grinding apparatus (1), and the measuring means (18) and the grinding means A ( 20) Moving at the position of the workpiece (W) to perform measurement and grinding of the workpiece (W).

The polishing apparatus (2) includes a base (11) that can move the workpiece (W) in a vertical direction and horizontally mount the column axis, and has a workpiece placed on the base (11). a material (W) that is retracted in a direction orthogonal to a column axis of the workpiece (W) to position the workpiece (W) at a center of the base (11) (refer to the figure) 7) a clamping shaft (13) that holds the shaft center in the direction of the column axis of the workpiece (W) and holds both ends of the workpiece (W), and the aforementioned clamping shaft (13) can process the workpiece (W) A holding means (12) that rotates around its axis. The clamping shaft (13) holds the workpiece (W). When the abutment (11) is lowered, the aforementioned clamping shaft (13) holds the workpiece (W) around its axis. As shown in Fig. 6, the holding means (12) holds the workpiece (W) "intermittently rotated" or "continuously rotated".

The gripping means (12) is capable of "intermittently rotating" the workpiece (W) to the position where the workpiece (W) is ground and polished, and the surface is formed in Fig. 1. 2 shows the positioning on both sides in the Y direction, and the holding shaft (13) of the holding means (12) holding the workpiece (W) "intermittently rotates" around its axis.

For the example of the operation and processing sequence of the "intermittent rotation" in the case of a multi-crystal block-shaped grinding and polishing process in which the machined surfaces are all in the shape of a flat surface, the side portion (F) of the first group facing the opposite direction (refer to Fig. 16) is located on both sides of the Y direction shown in Figs. 1 and 2 and is rotated by 90 degrees to machine the side portion (F) of the second group and finish the processing of the side portion (F) of 4, so that the rotation is 45 degrees. The corner portion (C) of the first group (see FIG. 16) is positioned on both sides in the Y direction shown in FIGS. 1 and 2, and is rotated by 90 degrees to process the corner portion of the second group (C). ), the grinding and grinding process is finished.

The gripping means (12) allows the workpiece (W) to be "continuously rotated" to hold a single crystal sapphire ingot, for example, a cylindrical shape having a cross-sectional shape at a position where the workpiece (W) is ground and polished. In the case where the body portion (B) is ground and polished, or the four corner portions (C) of the square columnar single crystal block are ground and ground, as shown in Figs. 3 and 4, the grinding means is disposed on one side (20). Or the polishing means (30), the holding shaft (13) holding the workpiece (W) is subjected to a grinding rotation process by continuously inputting the set rotation speed "continuous rotation".

Further, the clamping shaft (13) provided in the grinding device (1) or the holding device (12) of the polishing device (2) is provided with both end faces of the workpiece (W) and measures the workpiece (W). The size in the longitudinal direction and the function of the control means are memorized, and the measurement result is arithmetically processed and becomes an actuation signal for controlling the moving distance of the moving means (19) to be described later. By the action of the moving means (19) caused by the actuation signal, the clamping shaft (13) of the holding means (12) of the workpiece (W) is held by the measuring means (18) and the grinding means (1) Or moving between the measuring means (18) and the polishing means (2), applying the measurement of the cross-sectional dimension of the workpiece (W) or grinding or grinding. Further, the measuring means (18), the grinding means (1) or the measuring means (18) and the polishing means (2) may be moved between the holding shafts (13).

As shown in FIGS. 11 and 12, the polishing means A (20) has a rotary disk (22) and a rotary shaft (23) connected to a rotary drive source for rotating the rotary disk (22), and is in the shape of a disk. The surface bundle is provided with an abrasive brush containing abrasive particles A (21). The polishing means A (20) is detachably coupled to the rotary drive source, and the front end portion of the bristle material A (21) is brought into contact with the processed portion of the workpiece (W) to be pressed and rotated.

As the polishing brush used in the polishing means A (20), the bristle material A (21) mixed with the abrasive grains is detachably attached to the rotary disk (22), and is replaced only when the bristle material A (21) is consumed. The brush type A (21) can be used as a segment type abrasive brush. Further, a cup type abrasive brush in which the brush material A (21) is fixedly attached to the rotary disk (22) and replaced with the rotary disk (22) when the brush material A (21) is consumed may be used. In this embodiment, a segment type is used.

The polishing apparatus (2) preferably has one of the front ends of the bristle material A (21) facing the workpiece (W) and the polishing means A (20) (abrasive brush). The polishing means A (20) is detachably provided in the polishing apparatus (2).

Further, the particle size of the abrasive grains of the bristle material A (21) fixed to the polishing means A (20) of the polishing apparatus (2) is two or more, and the bristle material A (35) containing the abrasive grains having a coarse particle size is disposed. In the inner ring portion of the rotating disk (22) near the center of rotation, the bristle material A (36) containing fine-grained abrasive grains may be disposed on the outer disk portion of the rotating disk (22) away from the center of rotation.

In the polishing apparatus A (20) of the polishing apparatus (2), the particle size of the fixed abrasive grains is, for example, two types of precision polishing for the purpose of rough polishing for the purpose of removing micro-cracks and fine-graining the surface roughness. In the conventional polishing apparatus, it is necessary to provide two units for separating the rough polishing from the precision polishing device. As a polishing brush for polishing a workpiece (W) having a columnar shape, a polishing device A (20) having both functions of rough polishing and precision polishing can be provided by one polishing brush, so that one polishing device can be used ( 2) The rough grinding process and the precision grinding process of the workpiece (W) in the shape of a column are performed, and the cost of the equipment can be reduced.

The polishing apparatus (2) includes a measuring means (18) for measuring a cross-sectional dimension of a reference block in which a pair of reference faces are formed in a horizontal direction and a vertical direction perpendicular to the column axis, and a cross-sectional dimension of the workpiece (W). The polishing apparatus (2) is provided such that one of the holding means (12) and the polishing means A (20) moves at least in the column axis direction of the workpiece (W) by a distance corresponding to the length of the workpiece (W) The means of movement (19).

In the polishing apparatus (2), the bristle material A (21) containing the abrasive grains is bundled on the surface of the disk, and the front end portion of the bristle material A (21) is applied to the processed portion of the workpiece (W). It is contacted and pressed to rotate, so it can be ground by a certain amount of cutting force.

Fig. 4 is a view showing a polishing apparatus (2) for grinding a workpiece (W) of a columnar shape according to the present invention. The polishing apparatus (2) includes: gripping means (12) for holding the workpiece (W) subjected to the grinding processing, polishing the body portion (B) of the workpiece (W), and removing the micro crack and the surface The polishing means B (30) for refining the thickness, the reference block (K) for forming the reference surface, the measuring means (18) for measuring the cross-sectional dimension of the workpiece (W), and the workpiece (W) to be held The moving means (19) for moving the holding means (12) to move the workpiece (W) between the measuring means (18) and the grinding means B (30).

The moving means (19) fixes the holding means (12) for holding the workpiece (W) in the same manner as described above, and the measuring means (18) and the polishing means B (30) are positioned at the workpiece (W). Move to perform measurement and grinding of the workpiece (W).

Further, when the workpiece (W) has a cylindrical shape, the holding means (12) of the polishing apparatus (2) holds the workpiece (W) "continuously rotating" around the axis.

In the same manner as the gripping means (12) of the grinding device (1), the holding means (12) of the polishing apparatus (2) can be held "continuously rotated" around the axis of the workpiece (W).

Further, as shown in Fig. 14, the polishing means B (30) is a roll type abrasive brush in which a cylindrical body of a rotating shaft (33) is disposed so that a bristle material B (31) containing abrasive grains is disposed. . By making the polishing means B (30) a roll type abrasive brush, the polishing efficiency can be improved (the polishing time can be shortened). The grinding means B (30) is detachably coupled to the rotary shaft of the rotating cylinder (32) and is coupled to the rotary drive source to cause the abrasive layer B (31) and the workpiece (W). The parallel line of the axis contacts the processed portion of the workpiece (W) and is pressed and rotated. In addition, a segment type or cup type abrasive brush which is cheaper than a roll type polishing brush may be used.

Further, in the polishing apparatus (2), the bristle material B (31) containing the abrasive grains is placed on the surface of the cylindrical surface, and the front end portion of the bristle material B (31) is applied to the processed portion of the workpiece (W). It is contacted and pressed to rotate, so it can be ground by a certain amount of cutting force.

The polishing means A (20) and the polishing means B (30) of the polishing apparatus (2) are selected to have an abrasive brush, and the front end of the bristle material A (21) or the bristle material B (31) at the time of polishing processing. The periphery of the portion is in contact with and rotated in a state of being pressed against the processed surface of the workpiece (W), and has the ability to polish the surface layer portion of the workpiece (W) by 10 to 100 μm. Therefore, in order to remove the microcracks of the workpiece and the columnar workpiece (W), it is possible to surely perform the polishing process to refine the surface roughness.

Further, the particle size of the abrasive grains of the bristle material B (31) fixed to the polishing means B (30) of the polishing apparatus (2) is two or more, and the briquettes B (37) having a coarse particle size of the abrasive grains are At the beginning of the rotating cylinder (32), the bristle material B (38) having a fine particle size of the abrasive grains is pressed against the workpiece (W) at the end of the pressing contact (W). And the side of the separation can also be.

In the roll type polishing brush which grinds the cylindrical workpiece (W), the polishing means B (30) having the functions of both the rough polishing and the precision polishing can be provided by one polishing brush, so that one polishing device can be used. (2) The rough grinding process and the precision grinding process of the workpiece (W) in the shape of a column are performed, and the cost of the equipment can be reduced.

Further, the particle size of the abrasive grains of the polishing means A (20) or the polishing means B (30) is #240 to #500 for coarse polishing (JISR6001:1998) or #800 to #1200 for precision polishing (JISR6001:1998). The two groups are based on the following reasons. The micro-cracks present in the surface layer portion of the workpiece (W) are surely removed by the high polishing ability of the above-mentioned rough polishing brush. In order to refine the surface roughness of the surface layer portion which is roughened by the rough polishing process by the polishing brush for rough polishing, and to eliminate cracks and notches which occur when the wafer is processed into a wafer in a subsequent step, it is used for precision polishing. Abrasive brush grinding is ideal.

Further, the grinding means A (14) and the grinding means A (20) or the grinding means A (20) and the grinding means B (30) are attached by means of the grinding device (1) and the polishing device (2). Since the specifications are common, the main body of the grinding device (1) and the main body of the polishing device (2) can be made to have the same specifications, so that the original price of the device body can be made low.

[Processing by grinding and grinding system]

Fig. 5 shows a grinding device (1) shown in Fig. 1 and a polishing device (2) shown in Fig. 2, and a grinding device (1) shown in Fig. 3, which is shown in Fig. 4. One of the polishing device (2), the unprocessed workpiece (W) loading device (3), the processed workpiece (W) carrying device (4), and the loading device (3) a grinding arm unit (51) that moves the workpiece between the grinding device (1), the polishing device (2), and the loading device (4) and a front end that is attached to the operating arm portion (51) and that is processed as described above A configuration diagram in which the object (W) is rotated into a configuration of the transfer device (5) of the grip portion (52) at a predetermined angle. The control means (not shown) includes an initial setting item input before the start of the machining, and a measurement signal outputted by the measuring means provided by the measuring means (18) of the grinding device (1) and the polishing device (2), respectively. The arithmetic processing outputs the function of the actuation signal to the respective means of the grinding device (1) and the polishing device (2), the function of controlling the rotation of the transfer device (5), and the function of holding the workpiece (W). . Further, the control means may have a function of controlling a sequence in which the transfer device (5) is rotated between the carry-in device (3), the grinding device (1), the polishing device (2), and the carry-out device (4).

According to the above configuration, the gripping unit of the transfer device (5) is moved to the loading device (3), the grinding device (1), the polishing device (2), and the unloading device (4) in advance by the input control means. (52) The workpiece (W) is gripped and the arm portion (51) is rotated. Therefore, the grinding and processing of the unprocessed workpiece (W) on standby in the loading device (3) allows the grinding device (1) and the polishing device (2) to be finished by grinding and polishing, and to carry out the removal device (4). Move out automatically.

Further, since the grip portion (52) of the transfer device (5) is rotatable at a predetermined angle, it can be removed by the grinding device (1) and the polishing device (2) for processing the workpiece (W) having a columnar shape. (12) The holding shaft (13) is provided with a "rotary rotation" rotation mechanism, and the workpiece (W) may be "intermittently rotated" by the grip portion (52).

[Grinding and grinding processing]

The example of the initial setting item input before the start of the processing of the control means described in the first aspect includes the following items.

1. Known reference interval size formed by one of the reference blocks (K) to be described later on the reference plane

2, the type of processed object (W) and its shape information (the number of corners of the corner column or cylinder)

3. Grinding amount and grinding amount in the surface layer of the workpiece (W)

4. The final section size and tolerance of the workpiece (W) after grinding and grinding

5. The grinding means A (14) of the grinding device (1) (described later) and the polishing means A (20) of the polishing device (2) (the latter) are processed in the case of processing the workpiece (W) Dimensional size, grain size of abrasive grains, rotational speed, holding means (12) of grinding device (1) and holding means A (14) and holding means (12) of grinding device (2) and grinding means A (20) One of the moving speeds of the movement by the moving means (19) (described later)

6. The grinding device B (24) of the grinding device (1) (described later) in the case of processing the cylindrical workpiece (W), and the polishing means B (30) of the polishing device (2) (described later) Dimensional size, grain size of abrasive grains, rotational speed, holding means (12) of grinding device (1) and grinding means B (24) and holding means (12) of grinding device (2) and grinding means B (30) One of the moving speeds of the movement by the moving means (19) (described later)

7. In the case where the shape of the processed portion of the workpiece (W) is a circular or cylindrical workpiece (W) such as a corner of a single crystal slab or a sapphire ingot of a single crystal sapphire ingot Rotating speed of the holding means (12) of the grinding device (1) and the grinding device (2)

It is necessary to set the moving speed of the workpiece (W) in the grinding and polishing processes to a range in which the grinding marks or the polishing marks do not remain, and the workpiece (W) has a columnar shape such as polycrystalline ruthenium. The side surface portion (F) and the corner portion (C) of the block and the side surface portion (F) of the single crystal raft block are set to be 10 to 40 mm/sec, and the workpiece (W) is cylindrical, for example, single crystal. The corner portion (C) of the body portion of the sapphire ingot and the single crystal block is set to be 10 mm/sec or less.

The setting of the moving speed is affected by the setting conditions of the grain size, the cutting amount, and the rotation speed of the abrasive grains in the grinding process and the polishing process. For example, if the grain size of the abrasive grains is coarse, the slow region of the above range is set, and if the abrasive grains are The granularity specification has to be set as a fast region of the aforementioned range.

The workpiece (W) is deformed by cutting the workpiece (W) by setting a certain amount of cutting (the academic term: "sizing") to the grinding means A (14) or the grinding means B (24). Finishing the shape and grinding the cross-sectional size into a desired size, and setting a certain pressing force on the workpiece (W) in the polishing means A (20) or the polishing means B (30) of the polishing apparatus (2) Since the surface layer portion of the workpiece is polished to a depth of 10 to 100 μm, the cross-sectional dimension and the cross-sectional shape can be processed into desired tolerances, and the micro-cracks in the surface layer portion can be surely removed and the surface roughness can be made fine.

In addition, the cross-sectional dimension measured by the measuring means (18) of the grinding device (1) before the start of the grinding, the cross-sectional size ratio of the workpiece (W) is input as a preliminary setting item, and the control means is input in advance. When the amount of grinding (W) and the amount of grinding and the size of the cross-section after grinding and grinding are small, grinding and/or grinding cannot be performed. Therefore, the workpiece (W) is controlled by the above. The arithmetic processing of the means stops the grinding of the grinding device (1) and places it on the base (11) with the holding means (12). The workpiece (W) can be released from the holding state of the holding means (12) and returned to the remelting step. The workpiece (W) which is dissolved in the remelting step is reshaped into a cylindrical shape in the case of, for example, a single crystal ruthenium or sapphire, and is reshaped into a cubic shape in the case of polycrystallization. .

The measuring means (18) provided in the grinding device (1) or the grinding device (2) is perpendicular to the column axis of the workpiece (W) due to one of the clamping shafts (13) of the holding means (12) One of the horizontal direction is formed by a known reference interval dimension, and the reference plane (J) is formed between the reference plane and the vertical direction perpendicular to the column axis by a known reference interval dimension, and the measurement direction is made. Measuring the distance A of the gap between the reference surface on both sides of the reference block and the grinding and polishing portion on both sides of the workpiece in the horizontal direction, and measuring the direction in the horizontal direction The reference surface of the upper surface of the reference block (K) is measured and the measuring device B (18B) of the height position of the grinding and polishing portion (W) on the upper surface of the workpiece.

Using the above configuration, the measurement means (18) was carried out as follows.

<1> The cross-sectional dimension of the reference block (K) in the horizontal direction perpendicular to the column axis (using the vertical reference surface) is used as an initial setting item before the start of machining, and the reference interval size is previously input as a control means. The reference surface of the reference block (K) is measured by the aforementioned measuring instrument A (18A) and transmitted to the control means. The measurement signal is calculated, and the measurement signal of the measuring instrument A (18A) of the reference size (cross-sectional size) of the reference block (K) is set.

<2> The measurement system for the cross-sectional dimension of the workpiece (W) is the actual size between the processed portions in the horizontal direction perpendicular to the column axis of the cross-sectional dimension of the workpiece (W). (18A) The measurement is sent and the measurement signal is sent to the control means. The measurement signal of the workpiece (W) is calculated based on the measurement signal of the reference dimension of the measuring tool A (18A) set by the above <1>, and the profile of the workpiece (W) can be measured. The actual size of the person.

<3> The setting of the base point position at which the cutting means A (14) or the grinding means B (24) and the polishing means A (20) and the polishing means B (30) are cut into "0" is the grinding means A ( 14) The grinding means B (24) and the polishing means A (20) and the front end of the polishing means B (30) are in contact with the reference surface of the reference block (K), and the signal of the contact position is transmitted to the control means. The processing means is used to calculate the base point position at which the cutting means A (14) or the grinding means B (24) and the polishing means A (20) and the polishing means B (30) are cut at "0".

<4> The setting of the cutting amount of the grinding means A (14) or the grinding means B (24) and the polishing means A (20) and the polishing means B (30) is the above <1> <2> <3> automatic measurement. With the automatic setting, the calculation result of the <1><2><3> is based on the grinding operation and the cross-sectional size after the grinding processing is performed as the initial setting item before the start of the machining, and the grinding means A (14) The cutting amount of the grinding means B (24) and the polishing means A (20) and the polishing means B (30) are automatically set.

In addition, the "cut amount" refers to a difference in the amount of advancement that disregards deformation, particularly in the case where the polishing brush is deformed during processing, and is used in distinction from the "cutting amount" of actual grinding or grinding.

Further, the arithmetic processing for inputting the initial setting item input to the control means and the measurement signal transmitted from the measuring means (18) is transmitted from the control means to the grinding device (1) and the polishing device (2) based on the arithmetic processing. Actuation signal to make up the instructions.

The actuation signal determined by the type of the workpiece (W) and the shape information (the number of corners of the corner post or the cylinder) in the initial setting item, for example, determines the holding of the workpiece (W) by the holding means (12). The actuation signal of "intermittent rotation" or "continuous rotation" of the shaft (13).

There are a base (11), a holding means (12), a grinding means A (14) or a grinding means B (24), a measuring means (18), and a moving means (19) which constitute the grinding device (1) by a control means. Or the base (11), the holding means (12), the polishing means A (20) or the polishing means B (30), the measuring means (18), and the moving means (19) constituting the polishing apparatus (2) are transmitted to the foregoing The signal of each means of action.

In addition, there is an arithmetic processing based on the above-described <1><2><3><4> measurement by the measuring means (18), and the grinding and processing of the workpiece (W) are carried out. Actuation signal for modulation and micro-crack removal and surface roughness adjustment.

In addition, the reference plane in the horizontal direction perpendicular to the column axis of the reference block (K) measured by the measuring tool A (18A) and the direction of the workpiece (W) orthogonal to the column axis direction (in FIG. 1) ～4, FIG. 7 and FIG. 8 show the spacing dimension (cross-sectional dimension) of the processed portions on both sides of the Y-direction). The pressing device (34) is on both sides of the workpiece (W) (in FIGS. 1 to 4, 7 and 8, the Y direction is advanced and retracted, and the workpiece (W) can be set to the center position of the base (11) in the Y direction shown in FIGS. 1 to 4, 7, and 8. The height position of the reference surface of the reference block (K) measured by the measuring tool B (18B) and the vertical direction of the processed portion of the workpiece (W) (the Z direction shown in FIGS. 6 and 8) The base (11) moves up and down, and the column axis of the workpiece (W) can be set to the grinding means A (14) or the grinding means B (24) and the grinding means A (20) and the grinding means B (30). ) is shown in the center position of the Z direction shown in Figs. 6 and 8.

The horizontal direction of the workpiece (W) placed on the base (11) orthogonal to the column axis direction (the Y direction shown in FIGS. 1 to 4, 7, and 8) and the vertical direction (in FIG. 6) Concentricity with the Z direction shown in Fig. 8 allows the gripping shaft (13) of the gripping means (12) to surely grip the center position of both end faces of the workpiece (W). Therefore, when the shape of the workpiece (W) to be ground and polished is cylindrical or arc-shaped, the clamping shaft (13) of the gripping means (12) can be intermittently rotated about its axis. Or "continuous rotation" can be processed.

The measuring means A (18A) and the measuring tool B (18B) of the measuring means (18) are measured by using contact or radiation laser light which directly contacts and measures the position of the measuring. Any of the non-contact types can be used.

Further, the aforementioned control means has the following functions. that is,

1. The arithmetic processing applies the grinding means A (14) or the grinding means B (24) and the grinding means A (20) to one of the reference blocks (K) provided in the grinding device and the holding means of the polishing device. The front end of each of the grinding means B (30) is in contact with each other, and the cutting amount of each of the grinding device and the grinding device is a function of a base point position of 0

2. Measuring the reference surface on both sides of the reference block (K) and the two sides of the workpiece (W) by measuring the measuring tool A (18A) provided in the measuring device of the grinding device and the grinding device. The difference between the parts, the processing of the processed part of the workpiece (W) before and after processing

3. Performing to position the workpiece (W) placed on the base of the grinding device (1) and the polishing device (2) from the horizontal direction by the pressing device (34) to be positioned on the workpiece ( After the center position in the horizontal direction orthogonal to the column axis, W) is performed by the measuring device B (18B) provided by the measuring means (18) of the grinding device (1) and the polishing device (2), respectively. Measuring the upper and lower positions of the base plate (11) so that the clamping shafts (13) respectively disposed on the grinding device (1) and the holding device (12) of the polishing device (2) are processed. The function of the centering of the opposite ends of the object (W) and the axis of the workpiece (W)

4. The initial setting items input before the start of the machining and the measuring tools A (18A) and the measuring tools B (18B) respectively provided in the measuring means (18) of the grinding device (1) and the grinding device (2) The output measurement signal calculation process and the function of outputting the actuation signal to each of the above-mentioned grinding device (1) and the aforementioned polishing device (2)

Since the control means is provided with various functions for automating the grinding and polishing system, the grinding and machining of the processed portion of the workpiece (W) can be carried out reliably and can be saved.

In addition, the tolerance of the cross-sectional dimension of the workpiece subjected to the grinding and polishing processing of the workpiece of the corner-shaped workpiece of the grinding process and the grinding process is ±0.5 mm, and the two side portions (F) of the workpiece are intersected with each other. The tolerance of the cross-sectional shape of the portion (C) is preferably ±0.1 degrees.

For example, in a square columnar block, the section size of the block has a square of 125 mm*125 mm (called: 5 inches), a square of 156 mm*156 mm (called 6 inches), and a square of 210 mm*210 mm (named) : 8 inches), the required tolerance is ±0.5mm, and the tolerance of the cross-sectional shape of the corner portion (C) where the two side portions (F) of the two blocks are further required is ±0.1 degrees, so it can be performed. Grinding and grinding based on tolerances of section dimensions and tolerances of section shapes.

Further, the tolerance of the cross-sectional dimension of the workpiece subjected to the grinding and polishing of the cylindrical workpiece (W) subjected to the grinding and grinding is ±0.5 mm.

For example, in a cylindrical single crystal sapphire ingot, the cross-sectional dimension is 2 to 6 inches (51 to 154 mm) and the required tolerance is ±0.5 mm, so that the grinding and grinding processing based on the tolerance of the cross-sectional dimension can be performed.

The grinding and polishing system described so far is subjected to grinding processing by the grinding means A (14), and then grinding is performed by the polishing means A (20) to perform grinding and polishing of the hard and brittle material.

The particle size of the abrasive grains using the grinding means A (14) or the grinding means B (24) of the grinding device (1) is a grindstone for coarse grinding and a particle size of the abrasive grains composed of F90 to F220 (JISR6001: 1998). #240～#500(JISR6001:1998) The grinding stone for precision grinding, the grinding grain of the grinding device A (20) or the polishing device B (30) having the polishing device (2) has a particle size of #240～#500 (JIS R6001:1998) The abrasive brush for grinding and grinding, and the abrasive grain having the particle size of coarse grinding for #800～#1200 (JISR6001:1998), grinding device A (14) or grinding means B (24) After the cutting amount is 20 μm to 700 μm and the surface roughness is Ry 2.0 to 10.0 μm (JISB0601: 1994), the cutting amount is 75 μm or more by the polishing means A (20) or the polishing means B (30), and the surface is made. Grinding processing and polishing processing may be performed with a thickness of Ry 1.1 μm (JISB0601:1994) or less.

Further, the processing steps of forming a workpiece (W) having a columnar shape of the side surface portion (F) and the corner portion (C) of the processing portion for the grinding processing and the polishing processing may be performed in any of the following procedures.

1. Grinding of the side part (F), grinding of the corner (C), rough grinding of the side part (F), and precision grinding of the side part (F)

2. Grinding of the side part (F), rough grinding of the side part (F), precision grinding of the side part (F), and grinding of the corner (C)

3. Rough grinding of the side part (F), precision grinding of the side part (F), grinding of the corner (C), rough grinding of the side part (F), and precision grinding of the side part (F)

Further, the processing steps of the workpiece (W) formed by the cylindrical body portion (B) in the shape of the processing portion of the grinding processing and the polishing processing may be performed in any of the following procedures.

1. Grinding, rough grinding, precision grinding

2, rough grinding processing, precision grinding processing, rough grinding processing, precision grinding processing

After the initial setting item is set as described above for the control means (not shown), the machining start switch is turned ON, and the grinding process and the grinding process are started. The workpiece (W) conveyed to the loading device (3) is gripped by the grip portion (52) of the transfer device (5). As shown in Fig. 6, the workpiece (W) is placed on the base (11) of the grinding device (1) which is initially processed. Measuring the upper surface of the workpiece (W) by the measuring means (18), moving the base vertically so that the vertical position of the column axis of the workpiece (W) and the clamping shaft (13) of the holding means (12) The vertical positions of the shaft cores are the same. As shown in Fig. 7, the pressing tool (34) advances from both sides (Y direction) in the horizontal direction and positions the workpiece (W) at the center thereof. Next, one of the gripping shafts (13) of the gripping means (12) advances in the X direction shown in Fig. 1 and is held by the gripping shaft (13) (13). The abutment (11) is shrunk downward.

The holding means (12) shown in Fig. 6 is moved between the grinding means A (14) (14) by the movement means (19). The front end of the abrasive grain layer A (15a) of the grinding means A (14) (14) contacts the reference surface provided in the vertical direction of the reference block (K) of the holding means (12), so that the grinding means A (14) ( 14) The position of the base point at which the amount of cut of the abrasive grain layer A (15a) is 0 is recorded in the control means.

In the above, the workpiece (W) is a common workpiece (W) or a cylindrical workpiece (W), and the polycrystalline crucible is used as the workpiece (W). In the grinding device (1) to which the grinding device A (14) for the corner column is attached, and the polishing device (2) to which the polishing device A (20) for the column is attached, the loading device (3) and the carrying device are disposed. (4) The equipment of the transfer device (5) is taken as an example to explain the details of its operation.

The holding means (12) is moved by the moving means (19) to the measuring means (18), as shown in Fig. 8 (Y direction), facing the first group on both sides of the polycrystalline block (W) The cross-sectional dimension of the side portion (F) is measured by the gauge A (18A). The measurement result is sent to the control means.

The measurement result transmitted to the control means is calculated into the actual size in the control means, and the cutting amount of the grinding means A (14) is automatically set based on the actual size and the "section size after the grinding process" which is previously input and set.

Measuring the cross-sectional size and the cutting amount of the grinding means A (14), the both side faces (F) (F) of the first group of the polycrystalline block (W) set by the moving means (19) are moved to the grinding means A (14) Move between (14) and grind. The cross-sectional dimension between the two side faces (F) (F) is confirmed to be within the tolerance by the measuring tool A (18A) (18A). After the grinding of the both side faces (F) (F) of the first group is completed, the gripping shaft (13) (13) of the gripping means (12) is rotated by 90 degrees by the rotating mechanism, and the both sides of the second group (F) (F) Grinding is performed in the same manner as the both side faces (F) (F) of the first group. After confirming that the section size is within the tolerance, the grinding of the 4 side portions (F) is finished.

The multi-crystal block (W) after the grinding of the four side portions (F) is returned to the start of the operation shown in FIG. 6 while being held by the gripping shaft (13) (13) of the gripping means (12). At the position, the gripping state of the clamp shaft (13) (13) is released and placed on the base (11). The polycrystalline block (W) is a moving arm portion (51) of the transfer device (5) that is rotated back and held by the grip portion (52) and placed on the corner portion (C) of the next processing step. The base (11) of the grinding device (1) for processing. The grinding of the four corners (C) is performed in the same manner as the grinding device (1) in which the side surface portion (F) is ground.

The polycrystalline crucible (W) after the grinding of the four corners (C) is returned to the state shown in Fig. 6 in the same manner as described above with the holding shaft (13) (13) of the gripping means (12). At the start position of the display, the gripping state of the clamp shaft (13) (13) is released and placed on the base (11). The polycrystalline block (W) is a moving arm portion (51) of the transfer device (5) that is rotated back and held by the grip portion (52) and placed on the base of the grinding device (2) which is the next processing step. Taiwan (11). The side surface portion (F) is polished in the same manner as the above-described grinding device (1). Thereby, all the grinding and grinding processes are finished.

All of the above-mentioned polycrystalline crucibles (W) which are placed on the base (11) of the polishing apparatus (2), which are finished by the grinding and polishing processes, are rotated by the moving arm portion (51) of the transfer device (5). The handle is held by the grip unit (52) and transferred to the carry-out device (4).

Next, for the present invention, the grinding means A (14) or the grinding means B (24) will be ground to cut the cross-sectional dimension into the tolerance of the above-mentioned processing size and use the grinding means A (20) or the grinding means B (30). The polycrystalline germanium block (W) or the single crystal germanium block (W) or the single crystal sapphire ingot (W) which is obtained by removing the microcracks of the surface layer portion and refining the surface roughness is processed by a wire saw to form a wafer. The description of the examples. In an embodiment, the incidence of defective articles caused by cracks and nicks of the wafer can be reduced.

[Example 1]

As shown in Fig. 15, the workpiece (W) processed in the first embodiment is a four-side portion (F) and a right-angled shape which are cut from a single ingot by a new wire saw which is a fixed abrasive type. 4 corners (C) consist of a quadrangular columnar polycrystalline block (W). As shown in Fig. 15, the polycrystalline germanium block (W) was cut into 5 columns * 5 columns = 25 bars. Take out the crystallized block A (W) at its 4 corners and prepare. As shown in Fig. 16, the polycrystalline germanium block A (W) is expanded in the side surface portion (F).

The grinding means A (14) of the grinding device (1) is a cup-type grinding stone shown in Figs. 9 and 10. From Table 3, as the particle size of the abrasive grains forming the abrasive grain layer A (15a), a diamond abrasive grain equivalent to F100 (JISR6001: 1998) having a high grinding ability was selected. The outer dimension of the abrasive grain layer A (15a) was 250 mm in diameter and 8 mm in width.

The initial setting items shown in Tables 1 and 2 above will be input to the control means before the start of processing. The polycrystalline crucible (W) of the above-mentioned square columnar shape of the workpiece (W) is placed on the base (11) of the grinding device (1), and the machining start switch of the grinding device (1) is turned ON.

The pressing device (34) (34) of the grinding device (1) is moved to the inside in the Y direction shown in Figs. 1 and 7, and the above-mentioned square prism-shaped polycrystalline block (W) placed on the base (11) ) The column axis is set at the center of the Y direction. Next, both ends of the polycrystalline germanium block (W) are held by the action of the clamping shafts (13) (13) of the holding means (12). The moving means (19) moves in the X direction shown in Fig. 1 to move the reference block (K) provided on the clamping shaft (13) (13) toward the measuring tool A (18A). The cross-sectional dimension of the reference block (K) is measured and its output signal is sent to the control means. The output signal of the cross-sectional dimension of the measurement reference block (K) is recorded as a control means corresponding to the cross-sectional dimension (100 mm) of the reference surface input before the start of machining.

By the second action of the moving means (19), the polycrystalline block (W) held by the clamping shaft (13) of the holding means (12) is moved toward the measuring tool A (18A). The measuring tool A (18A) has the distance between the two side portions (F) of the pair of the polycrystalline germanium blocks (W) as shown in Fig. 8 (Y direction) at the longitudinal direction 3 * the horizontal 3 The distance between (9 points) and the 2 side portions (F) of the other group was measured at a total of 18 places in the vertical 3 places * 3 places (9 places). As a result, the distance between the both side faces (F) was 156.9 to 157.6 mm (average 157.1 mm). Further, the surface roughness was Ry 21 to 27 μm (average 24 μm), and the length was 499.6 mm.

The average cross-sectional dimension of the above-mentioned polycrystalline germanium block A (W) prepared as the workpiece (W) is +1.1 mm with respect to the square of 156 mm * 156 mm of 6 inches. Therefore, there is a need to cut one side = 0.55 mm, so that the amount of cut is 0.7 mm. The rotation speed was converted to 2700 min ^-1 at a reference peripheral speed of 30 to 40 m/sec. The grinding means A (14) passes the polycrystalline compact (W) through the side surface portion (F) at a speed of 20 mm/sec, and then the holding shaft (13) of the gripping means (12) is rotated by 90 degrees. The other two side surface portions (F) are ground in the same manner as described above, and the grinding of the four side surface portions (F) is finished.

After the grinding of the fourth side portion (F) is completed, the clamping shaft (13) of the holding means (12) holding the polycrystalline block A (W) is rotated by 45 degrees to make the corner of the first group The part (C) is the position of the grinding means A (14) opposite to both sides.

In the grinding process of the corner portion (C), the grain size of the abrasive grains of the grinding means A (14) and the moving speed of the polycrystalline block A (W) are ground under the same conditions as those of the side surface portion (F). A crack called a chip is found at the joint position with the side portion (F). In response to the above problem, the grain size of the abrasive grains of the grinding means A (14) was changed to a grinding stone which was reduced to #500 (JISR6001:1998), and the moving speed of the polycrystalline block A (W) was changed to 30 mm/ Sec to grind. As a result, although the amount of grinding is small, it is possible to form the C-face which does not have the occurrence of the aforementioned debris.

Therefore, the grinding of the other two corner portions (C) of the holding shaft (13) of the holding means (12) by 90 degrees also causes the grinding grain size of the grinding means A (14) to be #500 (JISR6001:1998). In the same manner as described above, the grinding of the four corner portions (C) is performed. As a result, the total length of the two side portions (F) of the four side portions (F) is 18 to 156.6 mm (average 156.2 mm), and the amount of cutting of the four side portions (F) (= The result of the measurement of /2 was 390 to 480 μm (average 430 μm), and the surface roughness was Ry 5 to 8 μm (average 7 μm).

As a result of confirming the "maximum amount of cutting and the amount of cutting" in the grinding process of the grindstone used in the present embodiment, the maximum cutting amount was 700 μm, and the cutting amount at that time was 1.0 mm. The one-side cutting amount (550 μm) of the grinding process in the present embodiment is within the range of the maximum cutting amount (700 μm), so that the amount of grinding stone cutting can be set to 0.55 mm once.

According to the above-mentioned results, the "cutting amount = 70% or more of the cutting amount" in the first grinding process can be set as a reference, and the grinding stone used in the present embodiment can be used for the grinding. When the single-side cutting amount is 1.0 mm or more, for example, a grinding process of 1.1 mm is performed, and the second grinding process (cut amount: 1.0 mm, cutting amount: 700 μm) is performed, and the second grinding process is performed (cut amount: 0.57). Mm, cutting amount 400μm).

The polycrystalline niobium block A (W) after the above-mentioned grinding processing (before the polishing processing) was cut and the inside was observed, and micro cracks were formed at a depth of 70 to 90 μm from the surface. Further, as a reference, the polycrystalline tantalum block A (W) after the above-mentioned grinding process (before the polishing process) is processed into a wafer shape having a thickness of 200 μm using a wire saw, and the incidence of cracks, notches, and the like is 3.8%.

The polishing means A (20) of the polishing apparatus (2) used in the second processing is a brush material A (35) for rough polishing and a brush material A for precision polishing as shown in Figs. 11 and 12. The mounting base is bundled with individual metal tubes and is capable of being attached to the same rotating disc (22).

The bristle material A (35) for rough grinding of the polishing brush was selected from the diamond abrasive grains of #240 (JISR6001:1998) shown in Table 4 for the particle size of the abrasive grains. Nine pieces of rough-grinding bristle material A (35) whose bundled base was bundled with a metal tube to a thickness of 23 mm was prepared. The rough brushing material A (35) is equally disposed on the circumference of the rotating disk (22) having a center diameter of 210 mm and is detachably attached. The brush material A (36) for precision polishing was selected from the diamond abrasive grains of #800 (JISR6001:1998) shown in Table 4 for the particle size of the abrasive grains. 24 pieces of the rough-grinding bristle material A (35) whose bundled base was bundled with a metal tube to a thickness of 23 mm. The brush material A (36) for precision polishing was equally disposed on the circumference of the rotating disk (22) having a center diameter of 280 mm and was detachably attached.

The processing conditions of the polishing means A (20) are 0.5 mm in the amount of cut, and the rotational speed is converted to 1400 min ^{-1 from} the reference peripheral speed of the polishing process of 10 to 20 m/sec to grind the polycrystalline block A (W). The moving speed is 20mm/sec. The rough grinding process of the four side portions (F) is performed simultaneously with the precision grinding process, and the polishing process is completed in one step.

As a result of the completion of the above-mentioned polishing process, the total size of 18 points between the two side surface portions (F) of the four side surface portions (F) is 155.9 to 156.4 mm (average: 156.1 mm). Further, the amount of cut was 91 to 97 μm (average: 95 μm), and the surface roughness was Ry 0.9 to 1.1 μm (average: 1.0 μm).

With respect to the result of confirming the "maximum amount of cutting and cutting amount of the brush material A (21) which can be cut without bending in the polishing process of the polishing brush used in the present embodiment, the maximum cutting amount is 174 μm, and the amount of cut at that time is 1.0mm. Since the one-side cutting amount (100 μm) of the polishing process in the present embodiment is within the range of the maximum cutting amount (174 μm), the amount of the stone cutting can be set to 0.5 mm, and the polishing process is completed once.

In addition, regarding the relationship between the "cutting amount and the amount of cutting" in the polishing process, the "cutting amount = 15% to 25% of the cutting amount" of one time is set as a reference based on the above result.

The results of the grinding, rough polishing, and precision polishing processing of the polycrystalline germanium block A (W) of the first embodiment described above are summarized and shown in Table 5.

The polycrystalline crucible A (W) after the above-mentioned grinding and polishing was processed into a wafer having a thickness of 200 μm using a wire saw, and the incidence of cracking, chipping, and the like was 1.2%. With respect to the above-described 3-4% after the grinding process, as shown in Table 5, the grinding rate was reduced by an average of: 95 μm, and the surface roughness was 1.0 μm.

[Example 2]

As shown in Fig. 17 and Fig. 18, the workpiece (W) used in the second embodiment is a single crystal crucible (W) formed by cutting a cylindrical single crystal ingot produced by a lift-up method. The lower end portion of the above-mentioned single crystal ruthenium ingot was cut and removed, and a length of 300 mm (in the height direction of FIG. 18) was prepared, and 25 pieces of ingots which were cut in the range of 299.0 to 301.0 mm were actually measured. The ingot is vertically set as shown in Fig. 17 to the fixed jig in an arrangement of 5 columns * 5 columns.

The above-mentioned 25 single crystal ruthenium ingots were cut into four straight side portions (F) at a substantially right angle by using a new wire saw of the same fixed abrasive method as in the above-mentioned Example 1. ). Further, a part of the body portion of each of the single crystal ruthenium ingots was left as a circular arc width so that the four corner portions (C) of about 25 mm remained. One piece of the single crystal block (W) is arbitrarily taken out as a workpiece (W).

The shape of the single crystal block (W) is a quadrangular columnar shape composed of four side portions (F) and four arcuate portions (C) as shown in Fig. 18 . In the same manner as in the first embodiment, the total amount of the measurement between the opposite side surface portions (F) was 18, and the result was 125.4 to 126.0 mm (average: 125.7 mm), the length was 300.8 mm, and the surface roughness was Ry22. ~28 μm (average 25 μm).

The specifications of the grinding means A (14) and the grinding means A (20) are as shown in the above Table 2, except that the grain size of the abrasive grains of the cup-type grindstone to be used in the grinding means A (14) is changed from Table 3 to Other than F180, it is the same as that of the above-described first embodiment. The reason why the particle size of the abrasive grains of the cup-type grindstone used in the grinding means A (14) is changed to F180 is as follows. The average cross-sectional dimension of the single-crystal block (W) for grinding and grinding is +0.7 mm for the square of 125 mm*125 mm of 5 inches, and the one-side cutting amount is 0.35 mm, which is rarely cut. . Therefore, it is made to be F180 (JISR6001:1998) having a finer particle size than F100 shown in the above-mentioned Embodiment 1 and shown in Table 3.

In the grinding processing system, the prepared single crystal block (W) is held by the clamping shaft (13) (13) so that the two side portions (F) pass between the grinding means A (14) opposite to the opposite sides, and The polycrystalline germanium block (W) of the first embodiment described above was similarly finished by the grinding of the four side surface portions (F).

Next, as shown in Table 1, the single crystal block (W) is continuously rotated and the single crystal block is rotated by inputting the rotational speed (87 min ^-1 ) of the clamp shaft (13) (13) set in advance by the control means. (W) The grinding of the four corners (C) was completed by the grinding means A (14) at a low speed of 2 mm/sec.

As a result, the total length of the two side surface portions (F) of the four side surface portions (F) is 185.3 to 126.1 mm (average 125.7 mm), and the amount of cutting of the four side portions (F) (= The measured value / 2 is a result of 283 to 350 μm (average 316 μm), and the surface roughness of the four side portions (F) and the four corner portions (C) is Ry4 to 6 μm (average 5 μm).

The second grinding process is such that the single-crystal block (W) is continuously rotated by the holding means (12) and passed by the moving means (19) at a low speed of 2 mm/sec, and the brush material A (35) for rough grinding is precision. The polishing brush A (36) is formed by integrating the rotating disk (22) with one of the polishing means A (20) formed by the polishing brush to complete the polishing of the four corner portions (C). Thereafter, the polishing process of the four side surface portions (F) was carried out by the polishing means A (20) at a moving speed of 20 mm/sec by a moving means (19) in the same manner as in the above-described first embodiment. As described above, all the grinding and grinding processes are finished.

The total of 18 places between the two side surface portions (F) of the four side surface portions (F) where the polishing processing is completed is 124.7 to 125.4 mm (average 125.2 mm), and the cutting amount of the four side portions (F) (=calculated by the measured value/2) is 86 to 100 μm (average 93 μm), and the surface roughness Ry of the four side portions (F) and the four corner portions (C) is 0.8 to 1.0 μm (average 0.9 μm).

The processing results of the grinding and polishing processes of the single crystal crucible (W) of the second embodiment described above are summarized and shown in Table 6.

The polycrystalline germanium block (W) after the above-mentioned grinding and polishing process was processed into a wafer shape having a thickness of 200 μm by wire sawing, and was similar to the polycrystalline germanium block (W) of the first embodiment. When the amount of cut is 86 to 100 μm and the surface roughness is an average of 1.1 μm, the incidence of cracking, chipping, or the like can be reduced to 1.0% or less.

[Example 3]

The workpiece (W) used in the third embodiment is a single crystal sapphire ingot (W) shown in Fig. 19. The cross-sectional dimension is 4 inches (diameter: 100 ± 0.5 mm) and is manufactured by a pull-up method. In the body portion (B) of the single crystal sapphire ingot (W), impurities which are generated by melt heating or the like at the time of production adhere to each other to form irregularities. The top and the tail were cut off, and the length (in the height direction of Fig. 19) was cut to a nominal length of 200 mm, and the actually measured length was used in the range of 199.0 to 201.0 mm.

The specifications of the grinding means B (24) of the grinding device (1) and the grinding means B (30) of the grinding device (2) are shown in Table 7 below.

The grinding means B (24) of the grinding device (1) is a roller type grinding stone shown in Fig. 13. From Table 3, as the particle size of the abrasive grains forming the abrasive grain layer A (15a), a diamond abrasive grain equivalent to F100 (JISR6001: 1998) having a high grinding ability was selected. The outer dimension of the abrasive layer B (25) is 200 mm* and the length is 100 mm. The cutting amount was set to 1.5 mm, and the rotation speed (converted from the reference circumferential speed of the grinding process: 15 to 30 m/sec) was set to 2200 min ^-1 to rotate the above-mentioned roll type grindstone. The single crystal sapphire ingot (W) of the workpiece (W) is opposed to the rotation direction of the roll type grindstone by the holding shaft (13) of the holding means (12) holding the both ends of the column axis core The direction is continuously rotated at a rotational speed of 153 min ^-1 (as shown in Table 1, the reference circumferential speed of the cylindrical workpiece (W) is 0.5 to 1.1 mm/sec).

Next, the single crystal sapphire ingot (W) is rotated and moved by the moving means (19) to move the column axis direction of the single crystal sapphire ingot (W) at a low speed of 2 mm/sec, so that the grinding by the rotation is performed. Means B (24), the grinding process of the body part (B) is finished.

The diameter dimension of the body portion (B) of the single crystal sapphire ingot (W) which was subjected to the above-mentioned grinding process was measured at six places along the column axis of the body portion (B). The holding shaft (13) holding the holding means (12) of the single crystal sapphire ingot (W) was rotated by 90 degrees, and the diameter was measured in the same manner as described above, and the total diameter of 12 places was measured. As a result, it is 100.3 to 101.1 mm (average: 100.7 mm). Further, the surface roughness was Ry 5 to 7 μm (average: 6 μm). Further, the grinding process of the single crystal sapphire ingot (W) contains the removal of impurities adhering to the body portion (B), and the measurement of the amount of cutting is not performed.

In the polishing apparatus B (30) of the polishing apparatus (2) used for the second processing, the bristle material B (37) for rough grinding is disposed on one end side of the rotating cylinder (32) as shown in Fig. 14, and the other end is provided. On the other side, a brush type B (38) for precision polishing is used for a rotary cylinder (32) having a length of 400 mm, and a roller type abrasive brush integrally formed by both the rough polishing and the precision polishing is used.

The particle size of the abrasive grains used in the polishing means B (30) is the bristle material B (37) for coarse grinding, and the particle size of the abrasive grains is selected from the diamond abrasive grains of #240 (JISR6001:1998) shown in Table 4. Fixed. The bristle material B (38) for precision polishing was selected from the diamond abrasive particles of #800 (JISR6001:1998) shown in Table 4 for the particle size of the abrasive grains.

Further, the outer dimensions (diameter of the front side) of the bristle material B (37) for rough grinding and the bristle material B (38) for precision polishing are ψ150 mm* (the direction of the core of the rotating cylinder (32)) The length is 200mm.

The cutting amount was set to 0.5 mm, and the rotation speed (converted from the reference circumferential speed of the polishing process: 10 to 20 m/sec) was set to 2000 min ^-1 to rotate the above-described roll type polishing brush. The single crystal sapphire ingot (W) of the workpiece (W) is opposed to the rotation direction of the roll type grindstone by the holding shaft (13) of the holding means (12) holding the both ends of the column axis core The direction is continuously rotated at a rotational speed of 153 min ^-1 (as shown in Table 1, the reference circumferential speed of the cylindrical workpiece (W) is 0.5 to 1.1 mm/sec).

Next, the single crystal sapphire ingot (W) is rotated and moved by the moving means (19) to move the column axis direction of the single crystal sapphire ingot (W) at a low speed of 2 mm/sec, so that the grinding by the rotation is performed. Means B (30) ends the grinding process of the body portion (B).

The diameter of the body portion (B) of the single crystal sapphire ingot (W) which was subjected to the above-mentioned polishing process was measured at six places along the column axis of the body portion (B). The holding shaft (13) holding the holding means (12) of the single crystal sapphire ingot (W) was rotated by 90 degrees, and the diameter was measured in the same manner as described above, and the total diameter of 12 places was measured. As a result, it is 100.2 to 100.9 mm (average: 100.6 mm). Further, the amount of cut was 94 to 102 μm (average: 98 μm), and the surface roughness was Ry 0.8 to 1.2 μm (average: 1.0 μm).

The results of the grinding and polishing processes of the single-crystal block (W) of the second embodiment described above are summarized and shown in Table 7.

The single crystal sapphire ingot (W) after the above-mentioned grinding and polishing process is processed into a wafer shape having a thickness of 200 μm using a wire saw, and the polycrystalline germanium block (W) of the first embodiment and the second embodiment. In the same manner, the single crystal lumps (W) can be reduced by a grinding amount of 94 to 102 μm to a surface roughness of 1.0 μm, and the incidence of cracks, notches, and the like can be reduced to 1.0% or less.

(change example)

As shown in Fig. 20, the crystal blue Bert is not horizontal when the surface of the workpiece (W) held by the holding means (12) is attached to the front end of the holding means (12) and the front end of the workpiece (W). The shape of the holding auxiliary member (not shown) may hold the workpiece (W) through the holding assisting member.

The present invention is directed to the invention of grinding and polishing of a single crystal slab, a single crystal slab, and a single crystal sapphire ingot, but is not limited thereto. For example, it is used for crystal wafers for electronic components such as germanium wafers and crystal vibrators for various semiconductor substrates such as crystal-based solar cell panels, quartz wafers for electronic components or optical substrates, and LED substrates. Sapphire wafers, GaAs wafers, GaP wafers, GaN wafers, SiC single crystal wafers for power components, LiTaO ₃ wafers for SAW filters, LiNbO ₃ wafers, for ultra-high-speed semiconductor components It is also applicable to the grinding and polishing of ingots and blocks in the manufacture of wafers of hard and brittle materials such as InP wafers. The material of the workpiece is not limited to the above, and other hard and brittle materials are used, and the shape is not only a columnar shape and a columnar shape, but also a columnar body including a complicated shape (heteromorphic shape) such as crystal bluebert ( The entire columnar body of Fig. 20) is targeted.

According to the grinding device or the grinding method of the present invention, even if the cross-sectional dimension and the straight angle of the block of the workpiece (W) formed by the wire saw or the like formed of the hard and brittle material are cut out, the straight angle is outside the tolerance. By making the grinding means A (14) or the grinding means B (24) a grinding function of the grindstone, the impurities and deformation of the surface layer of the workpiece (W) can be removed and the cross-sectional dimension is ±0.5 mm. Within tolerances. Further, the straight angle at which the corner portion (C) where the side surface portion (F) of the workpiece (W) is formed into a corner column shape can be within a tolerance of ±0.1 degrees. Further, by using the polishing means A (20) or the polishing means B (30) in the subsequent steps as the polishing brush, the microcracks of the surface layer of the workpiece (W) which has been subjected to the grinding process can be removed to make the surface The thickness was Ry 1.1 μm (JISB0601: 1994). Therefore, in the sub-step, when the workpiece (W) is sliced into a wafer having a thickness of several hundred μm using a wire saw or the like, the occurrence of defective products due to cracks and nicks occurring during the slicing process can be reduced. rate.

Further, the grinding means A (14) and the grinding means A (20) or the grinding means A (20) and the grinding means B (30) are attached by means of the grinding device (1) and the polishing device (2). Since the specifications are common, the main body of the grinding device (1) and the main body of the polishing device (2) can be made to have the same specifications, so that the original price of the device body can be made low. Further, the gripping shaft (13) of the gripping means (12) for holding the workpiece (W) attached to the grinding device (1) and the polishing device (2) can be "intermittently rotated" or "continuously rotated". Therefore, it is possible to facilitate the grinding and polishing of the workpiece (W) having a rectangular columnar shape or a cylindrical shape.

Further, a transfer device (5) that mounts and processes the workpiece (W) on each of the loading device (3), the grinding device (1), the polishing device (2), and the loading device (4) is provided. The steps of the transfer device (5), the grinding device (1) and the grinding device (2) are automated by control means. Therefore, the grinding and polishing of the processed portion of the workpiece can be carried out reliably and can be saved.

The grinding machine is provided with a grinding device that cuts the surface layer portion of the workpiece with a constant amount of cutting, removes impurities in the surface layer portion of the workpiece and the column axis direction, and has a desired cross-sectional dimension. The grinding and polishing system of the grinding and polishing device (6) of the polishing means for polishing the surface layer portion of the workpiece with a certain pressing force and removing the micro-cracks of the surface portion of the workpiece and miniaturizing the surface roughness is the second Description of the embodiments. Here, only the difference from the first embodiment will be described.

Fig. 21 is a view showing a grinding and polishing apparatus (6) for grinding and grinding a workpiece (W) of a columnar shape according to the present invention. The grinding and polishing device (6) includes a holding means (12) for gripping the workpiece (W), and a grinding means A (14) for grinding the side surface portion (F) and the corner portion (C) of the workpiece (W), The polishing means A (20) for polishing the side surface portion (F) and the corner portion (C) of the workpiece (W) after the completion of the grinding process, the reference block (K) for forming the reference surface, and the workpiece to be processed ( a measuring means (18) for the cross-sectional dimension of W), and a holding means (12) for holding the workpiece (W) to move the workpiece (W) to the measuring means (18) and the grinding means A (14) ) Moving means of moving between (19).

The moving means (19) moves the holding means (12) for holding the workpiece (W) between the measuring means (18) and the grinding means A (14) and the grinding means A (20) to measure the processed The object (W) or the workpiece (W) is ground and polished. However, the holding means (12) for holding the workpiece (W) is fixed, and the measuring means (18) and the grinding means A (14) and the grinding means A (20) are moved at the position of the workpiece (W) to carry out The measurement of the workpiece (W), the grinding process, and the grinding process are also possible.

In the grinding means A (14), a cup type grindstone is used in the same manner as in the first embodiment. Further, in the polishing means A (20), a segment type abrasive brush is used in the same manner as in the first embodiment.

Fig. 22 is a view showing a grinding and polishing apparatus (6) for grinding and grinding a cylindrical workpiece (W) according to the present invention. The grinding and polishing device (6) includes a holding means (12) for gripping the workpiece (W), and a grinding means B (24) for grinding the body portion (B) of the workpiece (W), and after the grinding processing is completed The polishing means B (30) for polishing the body portion (B) of the workpiece (W), the reference block (K) for forming the reference surface, and the measuring means for measuring the cross-sectional dimension of the workpiece (W) (18) And a moving means (19) for moving the holding means (12) of the workpiece (W) to move the workpiece (W) between the measuring means (18) and the grinding means B (24).

In the same manner as described above, the moving means (19) fixes the holding means (12) for holding the workpiece (W), and the measuring means (18) and the grinding means B (24) and the grinding means B (30) are The position of the workpiece (W) is moved to perform the measurement of the workpiece (W), the grinding process, and the grinding process.

In the grinding means B (24), a roll type grindstone is used in the same manner as in the first embodiment. Further, in the polishing means B (30), a roll type polishing brush is used in the same manner as in the first embodiment. In addition, it is also possible to use a cup-type grindstone which is lower than a roll-type grindstone or a cup-type or segment-type grindstone which is lower than a roll-type grindstone.

The grinding and polishing device (6) for performing the grinding and polishing of the workpiece (W) in the shape of a column and the workpiece (W) in the cylindrical shape is performed by the workpiece to be fixed to the holding means (12) (W) ) The transfer from the left to the right in the figure is performed in the order of grinding and grinding.

Further, at least a plurality of the grinding means A (14) and the polishing means A (20) may be connected. For example, in Fig. 23, a pair of grinding means A (14) is used to connect two pairs of polishing means A (20). In this case, the abrasive grains included in the bristle material A (21) disposed on the polishing means A (20) on the left side of the same figure have a coarse particle size and are contained in the polishing means A disposed on the right side of the same figure. (20) The abrasive grains of the brush material A (21) have a fine particle size, and can be subjected to two-stage grinding processing after the grinding method A (14). In addition, when the unevenness due to the grinding process is too large and the processing ability of the polishing means A (20) is difficult to smooth the unevenness, etc., it is possible to increase the polishing ability, and it is possible to include all the polishing means A (20). The abrasive grains of the brush material A (21) have substantially the same particle size.

Further, although not shown, the grinding means B (20) and the polishing means B (30) can be at least similar to the grinding and polishing apparatus (6) for performing the grinding and polishing of the cylindrical workpiece (W). A plurality of connections.

By making the grinding means A (14) detachable from the grinding and polishing device (6) common to the specifications of the mounting means of the polishing means A (20) or the grinding means B (24) and the polishing means B (30), These replacements. Therefore, in the case of the grinding and polishing apparatus (6) shown in FIG. 21 and FIG. 22, for example, the polishing means and the grinding means can be replaced to provide two pairs of polishing means A (20) or polishing means B (30). Grinding device (2). Further, the grinding means and the grinding means can be replaced to form a grinding device (1) having two pairs of grinding means A (14) or grinding means B (24). The processing time can be shortened by making the particle size of the abrasive grains constituting the respective abrasive grains or the particle size of the abrasive grains contained in the respective bristle materials substantially the same. Further, by making the particle size of the abrasive grains disposed on the left side of the same figure thick and the particle size of the abrasive grains disposed on the right side of the same figure to be fine, the two-stage grinding process or the polishing process can be performed. Further, for example, in the case of the grinding and polishing apparatus (6) shown in Fig. 23, the polishing means and the polishing means can be replaced to form a polishing apparatus (3) having three pairs of polishing means A (20) or polishing means B (30). ). Further, the grinding means and the grinding means can be replaced to form a grinding device (1) having three pairs of grinding means A (14) or grinding means B (24). Alternatively, by replacing the polishing means A (20) or the polishing means B (30) in the center in the left-right direction with the grinding means A (14) or the grinding means B (24), it is possible to perform the two-stage grinding process. Grinding is performed.

Figure 24 is a grinding device (1) shown in Figure 1, a polishing device (2) shown in Figure 2, a grinding and polishing device (6) shown in Figure 21, and a grinding and polishing device (6) shown in Figure 22, The unloading device (W) loading device (3), the processed workpiece (W) carrying device (4), and the loading device (3), the grinding device (1), and the polishing device ( 2) a moving arm portion (51) that moves the workpiece between the unloading device (4) and a handle that is attached to the front end of the operating arm portion (51) and rotates the workpiece (W) to a predetermined angle A configuration diagram of the configuration of the transfer device (5) of the portion (52). The control means (not shown) includes an initial setting item input before the start of machining, and a measuring means (18) provided in each of the grinding device (1), the polishing device (2), and the grinding and polishing device (6). The measuring signal output processing of the measuring tool output and the function of outputting the actuation signal to the respective grinding device (1) and the grinding device (2) and the grinding and polishing device (6), and controlling the rotation of the transfer device (5) Actuate and control the function of the workpiece (W).

The combination of the grinding device (1) and the polishing device (2) and the grinding and polishing device (6) can be appropriately selected in accordance with the shape of the workpiece (W) and the required machining accuracy. For example, in Fig. 24(A), two grinding/polishing devices (6) shown in Fig. 21 are arranged, and in the processing system of the workpieces of the angular column shape (W), the grinding polishing device (6) is used for one side. Processing of part (F) and processing of corner (C). As an example in which the surface roughness of the corner portion (C) is not high, the grinding and polishing device (6) shown in Fig. 21 and the grinding device (1) shown in Fig. 1 are respectively arranged in Fig. 24(B). One of the pieces is subjected to the grinding of the side portion (F) by the grinding and polishing device (6), and then the grinding portion (C) is ground by the grinding device (1). In addition, as for the processing of the corner portion (C), the grinding and polishing device (6) necessary for transferring the workpiece (W) at the same speed cannot be processed as required, as shown in Fig. 24(C). It is to be noted that the grinding and polishing device (6) shown in Fig. 21 and the grinding device (1) shown in Fig. 1 and the polishing device (2) shown in Fig. 2 are respectively disposed one by one, and the grinding device (6) is used. After the processing of the side surface portion (F), the corner portion (C) is processed by the grinding processing by the grinding device (1) and the polishing processing by the polishing device (2).

The operation method (the holding method, the measuring method, the "intermittent rotation" or the "continuous rotation", the processing method, etc.) of the workpiece (W) by the grinding and polishing device (6), and the grinding device (1) The same as the polishing apparatus (2), the specific operation and operation method are as described above.

1. . . Grinding device

2. . . Grinding device

3. . . Carrying in device

4. . . Carry out device

5. . . Transfer device

6. . . Grinding and grinding device

11. . . Abutment

12. . . Holding means

13. . . Clamping shaft

14. . . Grinding means A

15. . . Grinding body A

15a. . . Abrasive layer A

15b. . . Platen

16. . . Rotating disk

17. . . Rotary axis

18. . . Measuring method

18A. . . Measuring tool A

18B. . . Measuring tool B

19. . . Mobile means

20. . . Grinding means A

twenty one. . . Brush material A

twenty two. . . Rotating disk

twenty three. . . Rotary axis

twenty four. . . Grinding means B

25. . . Abrasive layer B

26. . . Rotating cylinder

27. . . Rotary axis

30. . . Grinding means B

31. . . Brush material B

32. . . Rotating cylinder

33. . . Rotary axis

34. . . Press

51. . . Acting arm

52. . . Holding department

W. . . Processed object

F. . . Side section

C. . . Corner

B. . . Body

Fig. 1 is a plan view showing a grinding device for processing a workpiece having a prismatic shape according to the present invention.

Fig. 2 is a plan view showing a polishing apparatus for processing a workpiece having a prismatic shape according to the present invention.

Fig. 3 is a plan view showing a grinding device for processing a cylindrical workpiece according to the present invention.

Fig. 4 is a plan view showing a polishing apparatus for processing a cylindrical workpiece according to the present invention.

5 is a view showing a grinding device and a polishing device in which a workpiece having a columnar shape and a columnar shape according to the present invention is disposed, a transfer device for setting a workpiece in each of the above devices, a loading device for loading a workpiece, and a carrying device. A plan view of an embodiment of the first embodiment.

Fig. 6 is a front view showing the arrangement of the holding means and the moving means for placing the workpiece on the base placed at the start position of the grinding device and the polishing device of the present invention.

Fig. 7 is a side view showing a state in which a workpiece is placed on a base of the grinding device and the polishing device of the present invention, and the pressing member of the workpiece is released.

Fig. 8 is a side view showing the arrangement of the measuring instrument for the measuring device by placing the workpiece on the base of the grinding device and the polishing device of the present invention.

Figure 9 is a front elevational view of the cup-type grindstone of the grinding means of the present invention. Fig. 9(A) is a partial cross-sectional view seen from the front, and Fig. 9(B) is an A-A view (bottom view).

Figure 10 is a front elevational view of a cup-type grindstone of the grinding means of the present invention. Fig. 9(A) is a partial cross-sectional view seen from the front, and Fig. 9(B) is an A-A view (bottom view).

Fig. 11 is a front view of a partitioning type abrasive brush of a rotary disk having a coarse particle size of abrasive grains and a finely divided brush material of abrasive grains in one of the polishing means of the present invention.

Figure 12 is a bottom view of Figure 11.

Fig. 13 is a perspective view showing a drum type grindstone which is a grinding means for grinding a cylindrical workpiece according to the present invention.

Fig. 14 is a perspective view showing a drum type abrasive brush which is a polishing means for polishing a cylindrical workpiece according to the present invention.

Fig. 15 is a perspective view showing a polycrystalline ruthenium ingot cut by a wire saw to form a block (A) (B) (C).

Figure 16 is a perspective view of the polycrystalline germanium block (A) (B) (C) formed in Figure 15.

Fig. 17 is an explanatory view showing a state in which a single crystal bismuth ingot is cut by a wire saw as seen from a plane.

Figure 18 is a perspective view of the single crystal block formed in Figure 17.

Fig. 19 is a perspective view showing a single crystal sapphire ingot which is cut into a cylindrical shape by cutting the top and the tail.

Figure 20 is an explanatory view for explaining the shape of the crystal Lambert.

Fig. 21 is a plan view showing a grinding and polishing apparatus for processing a workpiece having a prismatic shape according to the present invention.

Fig. 22 is a plan view showing a grinding and polishing apparatus for processing a cylindrical workpiece according to the present invention.

Fig. 23 is a plan view showing a modified example of the grinding and polishing apparatus for processing a workpiece having a prismatic shape according to the present invention.

Fig. 24 is a view showing a grinding device and a polishing device in which a workpiece having a columnar column shape and a column shape is processed according to the present invention, a transfer device for setting a workpiece in each of the above devices, a loading device for loading a workpiece, and a carrying device; A plan view of an embodiment of the second embodiment.

1. . . Grinding device

2. . . Grinding device

3. . . Carrying in device

4. . . Carry out device

5. . . Transfer device

51. . . Acting arm

Claims (22)

A grinding and polishing system for hard and brittle materials, which is a columnar workpiece formed of a hard and brittle material for manufacturing a wafer by slicing, and is characterized in that: a grinding device is provided, and a surface portion of the workpiece is to be processed. Grinding with a certain amount of cutting to remove the deformation of the surface portion of the workpiece and the deformation of the column axis direction and make the cross-sectional dimension the desired size, and have a measuring means for measuring the size of the workpiece; the grinding device will Finishing the surface portion of the workpiece to be ground by a predetermined pressing force to remove micro-cracks in the surface layer portion of the workpiece and miniaturizing the surface roughness, and having a measuring means for measuring the size of the workpiece; The control means calculates the size of the workpiece to be measured by the measuring means, and outputs an actuation signal of the grinding device and an actuation signal of the polishing device based on the result of the calculation. A grinding and polishing system for hard and brittle materials, which is a columnar workpiece made of a hard and brittle material for manufacturing a wafer by slicing, and characterized in that at least one or more of the following methods are used for the grinding Grinding device: measuring means for measuring the size of the workpiece; grinding means, grinding the surface layer portion of the workpiece with a certain amount of cutting to remove the deformation of the surface portion of the workpiece and the deformation of the column axis direction, And making the cross-sectional dimension a desired size; and polishing means polishing the surface layer portion of the workpiece to be finished by a predetermined pressing force to remove micro-cracks in the surface layer portion of the workpiece and to make the surface roughness fine; The control means calculates the size of the workpiece to be measured by the measuring means, and outputs an actuation signal of the grinding device and an actuation signal of the polishing device based on the result of the calculation. A grinding and polishing system for hard and brittle materials, which is a columnar workpiece made of a hard and brittle material for manufacturing a wafer by slicing, and characterized in that the surface layer portion of the workpiece is fixed. The grinding device for cutting the amount of the surface of the workpiece to remove the deformation of the surface portion of the workpiece and the deformation of the column axis direction, and having a cross-sectional dimension of a desired size, and having a measuring means for measuring the size of the workpiece, will end the foregoing Grinding the surface layer portion of the workpiece to be ground at a certain pressing force to remove microcracks in the surface portion of the workpiece and to make the surface roughness fine, and having a measuring means for measuring the size of the workpiece At least one of the devices. A grinding and polishing system for a hard and brittle material according to the first or third aspect of the invention, wherein the grinding device comprises: a base for moving the workpiece in a vertical direction and horizontally placing the column axis; and the holding means And having a workpiece placed on the base in a direction orthogonal to a column axis of the workpiece, and the workpiece is positioned at a center of the base and the axis is The direction of the column axis of the workpiece, holding the clamping shaft at both ends of the workpiece, and the clamping shaft can rotate the workpiece around the axis thereof; the grinding means is a grinding machine that combines the abrasive grains with each other. a grinding body in which a granular layer is fixed to a disk-shaped or annular platen is used as a grinding stone fixed to a rotating disk and detachably coupled to a rotary driving source, and the abrasive grain layer is pressed against the workpiece And rotating, wherein the moving means moves at least one of the holding means and the grinding means in the column axis direction of the workpiece to correspond to the length of the workpiece. A grinding and polishing system for a hard and brittle material according to the first or third aspect of the invention, wherein the grinding device comprises: a base for moving the workpiece in a vertical direction and horizontally placing the column axis; and the holding means And having a workpiece placed on the base in a direction orthogonal to a column axis of the workpiece, and the workpiece is positioned at a center of the base and the axis is The direction of the column axis of the workpiece, holding the clamping shaft at both ends of the workpiece, and the clamping shaft can rotate the workpiece around the axis thereof; the grinding means is a grinding machine that combines the abrasive grains with each other. a grinding body in which a granular layer is fixed to a disk-shaped or annular platen is used as a grinding stone fixed to a rotating disk and detachably coupled to a rotary driving source, and the abrasive grain layer is pressed against the workpiece And rotating, wherein the moving means moves at least one of the holding means and the grinding means in the column axis direction of the workpiece to correspond to the length of the workpiece. A grinding and polishing system for a hard and brittle material according to the first or third aspect of the invention, wherein the polishing apparatus includes a base that can move the workpiece in a vertical direction and horizontally mount the column axis; and the holding means And having a workpiece placed on the base in a direction orthogonal to a column axis of the workpiece, and the workpiece is positioned at a center of the base and the axis is a direction of the column axis of the workpiece, holding the clamping shaft at both ends of the workpiece, and the clamping shaft rotates the workpiece around the axis thereof; the grinding means has a rotating disk and is in the shape of a disk a polishing brush including a brush material containing abrasive grains, wherein the polishing brush is detachably coupled to the rotating mechanism, and the brush material is pressed against the workpiece and rotated; and the moving means causes the holding means and the grinding One of the means moves at least a distance corresponding to the length of the workpiece in the column axis direction of the workpiece. A grinding and polishing system for a hard and brittle material according to the second aspect of the invention, wherein the grinding and polishing apparatus includes: a base that can move the workpiece in a vertical direction and horizontally mount the column axis; and the holding means has The workpiece placed on the base is retracted in a direction orthogonal to the column axis of the workpiece, so that the workpiece is positioned at the center of the base and the shaft is processed. a direction of the column axis of the object, holding the clamping shaft at both ends of the workpiece, and the clamping shaft rotates the workpiece around the axis thereof; and the moving means enables the holding means or the grinding means or the grinding means One of the workpieces is moved at least in the direction of the column axis of the workpiece to correspond to the length of the workpiece; and the grinding means is to fix the abrasive grain layer in which the abrasive grains are bonded to each other in a disk shape or an annular shape. The grinding body made of the platen is fixed to the grinding stone of the rotating disk, and the grinding stone is detachably coupled to the rotary driving source, and the abrasive grain layer is pressed against the workpiece and rotated; the polishing means has a disk shape Table The surface bundle is provided with a bristle material containing abrasive grains, and a rotating disk that presses the bristle material against the workpiece and rotates, and includes a polishing brush that is detachably held and the polishing brush is rotatable. A grinding and polishing system for a hard and brittle material according to the second aspect of the invention, wherein the grinding and polishing apparatus includes a base that can move the workpiece in a vertical direction and horizontally mount the column axis; and the holding means Having a workpiece placed on the base in a direction orthogonal to a column axis of the workpiece, and the workpiece is positioned at a center of the base and the axis is a direction of the column axis of the workpiece, holding the clamping shaft at both ends of the workpiece, and the clamping shaft rotates the workpiece around the axis thereof; and moving the means to the aforementioned holding means or grinding means or grinding One of the means moves at least a distance corresponding to the length of the workpiece in the column axis direction of the workpiece; and the grinding means fixes the abrasive grain layer in which the abrasive grains are bonded to each other in a disk shape or a ring shape. The grounding body made of the platen is a grindstone fixed to the rotating disk and detachably coupled to the rotary drive source, and the abrasive grain layer is pressed against the workpiece to rotate, and the polishing means has a disk shape. surface The bristle material containing the abrasive grains, the rotating disk which presses the said bristle material to the said workpiece, and it rotates, and the grinding|polishing brush hold|maintained, and the said grinding|polishing brush can rotate. The grinding and polishing system for hard and brittle materials according to any one of claims 4, 5, 7, and 8, wherein the particle size of the abrasive grains of the grinding means is F90 to F220 during rough grinding. JISR6001:1998) or precision grinding time is #240～#500 (JISR6001:1998). The grinding and polishing system for a hard and brittle material according to any one of the items of the present invention, wherein the bristle material of the polishing means contains the abrasive grain size of two or more types. The grinding and polishing system for hard and brittle materials according to claim 10, wherein the particle size of the abrasive grains of the polishing means is #240 to #500 (JISR6001:1998) or precision polishing when used for rough grinding It is #800～#1200 (JISR6001:1998). The grinding and polishing system for hard and brittle materials according to claim 10, wherein in the grinding means, the bristle material containing the abrasive grains having a coarse particle size is disposed in a portion near the rotation center of the rotating disk, and the fine particle size is contained. The bristle material of the abrasive grains is disposed around the arrangement of the bristle material containing the coarse-grained abrasive grains. The grinding and polishing system for hard and brittle materials according to claim 1 or 3, wherein the grinding means of the grinding device and the grinding means of the polishing device are replaceable, and the grinding means and the grinding means are replaced. The grinding device is made into a polishing device or the polishing device is used as a grinding device. A grinding and polishing system for a hard and brittle material according to the second aspect of the invention, wherein the grinding means of the grinding and polishing apparatus and the grinding means are replaceable. A grinding and polishing system for a hard and brittle material according to the first aspect of the invention, comprising: a loading device that carries the workpiece before the grinding and polishing into the grinding and polishing system of the hard and brittle material; and the loading device that ends the grinding and polishing The processed workpiece is carried out from the grinding and polishing system of the hard and brittle material; the transfer device has an arm portion that moves the workpiece between the loading device, the grinding device, the polishing device, and the unloading device, and is attached to the workpiece The front end of the actuator arm portion rotates the workpiece to a grip portion of a predetermined angle. A grinding and polishing system for a hard and brittle material according to the second or third aspect of the patent application, comprising: a loading device that carries a workpiece before grinding and polishing into a grinding and polishing system of the hard and brittle material; and the loading device ends The workpiece to be ground and polished is carried out from the grinding and polishing system of the hard and brittle material; and the transfer device has the workpiece being moved between the loading device, the grinding and polishing device, the grinding device, the polishing device, and the unloading device. The actuator arm portion and the grip portion that is attached to the front end of the actuator arm portion to rotate the workpiece to a predetermined angle. The grinding and polishing system for hard and brittle materials according to claim 1 or 2, wherein the measuring means provided in the grinding device or the polishing device comprises: a reference block having a column axis perpendicular to the workpiece; One of the pair of reference planes formed in the horizontal direction across the known reference spacing dimension and one of the reference planes formed by a known reference spacing dimension in a vertical direction perpendicular to the column axis; the measuring tool is such that the measuring direction is the aforementioned In the horizontal direction, measuring the interval between the reference surface on both sides of the reference block and the grinding and polishing portion on both sides of the workpiece; the measuring tool, so that the measuring direction is the horizontal direction, and measuring the reference surface on the reference block The height position of the grinding and polishing part on the upper surface of the workpiece; The grinding and polishing system for a hard and brittle material according to the seventeenth aspect of the invention, wherein the control means includes: a reference for the grinding means to be in contact with each of the grinding means and the holding means of the grinding device and the polishing means One of the blocks is used to calculate a function of processing the cutting amount of each of the grinding device and the polishing device to a base position of 0; and measuring the amount of the measuring device provided by the grinding device and the polishing device Measuring the difference between the reference surface on both sides of the reference block and the processed portion on both sides of the workpiece to calculate the function of processing the processed portion of the workpiece before and after processing; performing the grinding device The polishing device performs the function of calculating the processing of the workpiece to the center of the workpiece, and outputs the initial setting item input before the start of the machining and the measuring device provided by the measuring device and the measuring device of the polishing device. The measurement signal is subjected to arithmetic processing, and an actuation signal is outputted to each of the grinding device and the polishing device. can. The grinding and polishing system for a hard and brittle material according to the second aspect of the invention, wherein the control means includes: a reference for providing the grinding means in contact with each of the polishing means at a tip end of the grinding device and the polishing means One of the blocks is used to calculate a function of processing the cutting amount of each of the grinding device and the polishing device to a base position of 0; and measuring the amount of the measuring device provided by the grinding device and the polishing device Measuring the difference between the reference surface on both sides of the reference block and the processed portion on both sides of the workpiece to calculate the function of processing the processed portion of the workpiece before and after processing; performing the grinding device The polishing device performs a function of calculating the processing of the workpiece to the center of the workpiece; and calculating an initial setting item input before the start of the machining and the measurement signal output by the measuring device of the measuring means, and The grinding means and the aforementioned grinding means output the function of the actuation signal. The grinding and polishing system for hard and brittle materials according to claim 18 or 19, wherein the shape of the workpiece is a prismatic shape; and the tolerance of the cross-sectional dimension of the workpiece to be ground and ground is ±0.5 mm. The tolerance of the cross-sectional shape of the corner portion where the side portions of the workpiece 2 intersect each other is set to ±0.1 degrees. The grinding and polishing system for hard and brittle materials according to claim 18 or 19, wherein the shape of the workpiece is cylindrical; the tolerance of the cross-sectional dimension of the workpiece to be ground and ground is ±0.5 mm. . A grinding and polishing method for hard and brittle materials: a grinding and polishing system using a hard and brittle material according to any one of claims 1 to 3; after grinding with the grinding device, grinding with the grinding device .