TWI389770B - Polygonal columnar members, abrasive devices for polygonal columnar members and grinding methods thereof - Google Patents

Description

Multi-angle columnar member, multi-corner column-shaped grinding device and grinding method thereof

The present invention relates to an edge (hereinafter referred to as an "angular portion") in which each plane (hereinafter referred to as "planar portion") of a workpiece to be polished which is formed of a hard and brittle material and which is formed by a hard and brittle material intersects the two planes. A polishing device for the surface layer.

Conventionally, as a polygonal columnar member of a hard and brittle material to be polished according to the present invention, for example, a square column-shaped block which is obtained by slicing a wire saw to obtain a tantalum wafer is used. The material is a single crystal or a crystal rod composed of multiple crystals is cut by a band saw or a wire saw to form a quadrangular prism shape. However, when the accuracy of the shape dimension is high after the cutting, the surface layer is ground. deal with.

A crucible block composed of a single crystal is formed by a cylindrical surface layer portion of a twin rod formed by a crystal pulling method and formed into a cylindrical shape by a band saw or a wire saw in a column axis direction so that the surfaces thereof are substantially at right angles to each other. After the four flat portions are formed, and the four corner portions of the circular arc surface (R surface) are formed between the two flat portions due to the remaining portion of the cylindrical surface portion, the planar grinding of the four planar portions or the fourth is performed as needed. The cylinder of the corner is ground.

Further, the lumps composed of the polycrystals are cut by a band saw or a wire saw to remove the surface layer portions of the six sides of the crystal slab which are formed into a cubic shape by flowing the molten raw material into the molding die, and then cut into a quadrangular prism shape. A flat portion composed of four faces is formed, and the four corner portions intersecting the two planes are slightly chamfered (C-plane). Further, when the accuracy of the required size of the cut surface is high, the grinding process is performed in the same manner as described above.

The single crystal twin rod and the polycrystalline tantalum which are formed by cutting as described above are processed by wire sawing in a sub-step to produce a tantalum wafer, but due to the flatness and formation of the single crystal block in the former. In the surface layer portion of the quadrangular corner portion of the arc surface (R surface), if there are micro-cracks or minute irregularities, the silicon wafer produced during the slicing process is likely to be cracked or notched. Therefore, Patent Document 1 discloses that In the polishing method, a surface layer portion of 50 to 100 μm or more and 200 μm or less is removed from the surface by using a nylon resin brush mixed with diamond abrasive grains (#800) as a polishing means to remove minute portions existing in the four plane portions and the square corner portion. The unevenness (and micro-cracks) flattened the surface roughness Ry10 to 20 μm before polishing to 3 to 4 μm in order to improve the yield of the wafer.

Further, in the case where the angular portion of the latter is a right-angled shape and a polycrystalline slab having a small C-angular angle is applied, similarly, if a micro-crack or minute irregularities are present in the surface layer portion, it is easy to manufacture a wafer at the time of slicing. In the case of cracks and notches, Patent Document 2 discloses a polishing method in which a rotary brush for rough polishing and finishing polishing is provided as a polishing means for supporting the two flat portions of the block to face upward. The support portion can simultaneously polish the two flat portions of the transferred block from the obliquely upper side, and polish and remove the fine irregularities existing in the four flat portions to planarize the film to improve the yield of the wafer product.

[Patent Literature]

[Patent Document 1] Japanese Patent No. 4133935

[Patent Document 2] Japanese Patent No. 3405411

The ruthenium block produced as described above sometimes has a surface roughness in the surface portion of the plane portion and the corner portion in the process: Ry10~20μm (JISB0601:1994), and then from the surface layer Microcracks with a depth of 80~100μm. When the wire saw is sliced in this state, as described above, since a defective wafer which generates cracks and notches is produced, a polishing apparatus which is inexpensive to manufacture is required. Before the slicing process, the polishing processing time is shortened and (1) the high polishing ability of the depth of 100 μm from the surface layer portion of the above-mentioned crucible block to remove microcracks can be removed, and (2) the surface roughness: Ry10 to 20 μm can be ground. It is a fine grinding ability of several μm or less.

An object of the present invention is to provide a polishing apparatus and a polishing method thereof, which can satisfy the above-mentioned requirements, and can carry out planar portions and corners of a workpiece (a hard and brittle material) which is a workpiece, that is, a polygonal column, which is a workpiece. Grinding processing of the department.

The first invention of the present invention, which is a multi-angle columnar member, is a polishing apparatus for polishing a workpiece (W) having a polygonal columnar shape and an angular portion. The base (4) is capable of placing one of the flat portions or one of the angular portions of each of the flat portions of the workpiece (W) as a processed surface (P) to be polished. The holding means (5) composed of the holding shafts (12A) and (12B) holds the both ends of the workpiece (W) while grinding, and releases the gripping state after the polishing is completed. The parts (6A) and (6B) are attached to the front end and move forward and backward. When the polishing unit (1) is polished, the polishing unit (W) is transferred while the front end of the polishing means (2) is rotated and rotated. The processing surface (P), the polishing means (2) for performing the polishing process, and the height position detecting means (3) detect the addition of the workpiece (W) before the polishing process a height position of the working surface (P), and storing the height position detecting signal in the control means (13); wherein the control means (13) performs the cutting amount of the front end of the grinding means (2) by the height position detecting signal operation Grinding processing. In addition, the term "horizontal upwards" as used herein refers to a machined surface as a reference surface (downward direction).

The above-mentioned "computation processing" means automatically setting the "grain size of the abrasive material of the polishing means (2)" and "the workpiece to be polished in the previous step" by the operator input control means (13) before the start of the polishing. "Cutting conditions", "grinding processing conditions (planar portion or corner portion) of the workpiece (W)", and "grinding means" based on the height position detecting signal of the height position detecting means (3) 2) The amount of cutting of the machined surface (P) of the workpiece (W) at the front end, and the portion (the flat portion or the corner portion) of the workpiece to be polished (W) The "transfer speed of the polishing unit (1)" is automatically set by the input.

Further, in the above-described first aspect of the invention, the polishing apparatus for a polygonal columnar member according to the second aspect of the invention includes the rotating means (14A) and (14B), and the both end faces are selected by the gripping portions (6A), (6B). The workpiece to be polished (W) is set to have a predetermined rotation angle around the axis of the holding shafts (12A) and (12B) and is rotated to the upper surface of the machined surface (P) of the surface to be polished (W) Rotating or rotating any one of the continuous rotations of the rotation speed; and lifting and lowering the base (4); and grinding the workpiece (W) to be polished before the polishing process The number of corners of the polygonal column shape and the polishing processing conditions of the edge portion of the workpiece (W), that is, the pitch rotation or continuous rotation of the rotation means (14A), (14B), are selected. The aforementioned control means (13).

The "pitch rotation" of the aforementioned holding shafts (12A) and (12B) refers to each processing. When the surface (P) is polished to each of the corner portions and the flat portions of the workpiece (W), the polishing pattern is selected, and the rotation means (14A) and (14B) are held before the start of the polishing process (12A). The polishing pattern of (12B) is selected to be set to "pitch rotation", and the "number of corners" of the polygonal column shape of the workpiece (W) is input to the control means (13), whereby the rotation means is arithmetically processed ( 14A), the rotation angle of (14B) is such that the rotating means (14A) is made upward by the next processing surface (P) of the workpiece (W) at the end of the grinding of one processing surface (P), (14B) A grinding type in which the shaft (12A) and (12B) are rotated and stopped, and the shape of the workpiece (W) to be polished is a block composed of polycrystals, and a plurality of flat portions are formed. The case where the cross-sectional shape of the edge portion where the two flat portions meet is an angular polygonal columnar member.

Further, the "continuous rotation" of the holding shafts (12A) and (12B) is a flat portion composed of a single crystal in the shape of a workpiece (W), and is a multi-faceted flat portion and the two The cross-sectional shape of the edge portion of the intersection of the flat portion is an arc shape, and the polishing pattern selected in the case where the corner portion is polished is processed, and the rotation means (14A) and (14B) are held before the start of the polishing process (12A) The rotation type of (12B) is set to "continuous rotation", and the "rotation speed" is input to the control means (13), whereby the workpiece (W) is held by the workpiece (12A), (12B) The shaft center continuously rotates while grinding the respective corner portions. Further, the polishing process of each of the flat portions of the workpiece (W) is performed by "pitch rotation" of the polishing method.

Further, the first or second invention includes the following three or fourth inventions, that is, the polishing means (2) is a wool material containing abrasive grains which are ring-shaped at the bottom of the polishing means. A grinding brush with multiple roots.

In addition, the first or second invention includes the following as the fifth and According to a sixth aspect of the invention, the polishing means (2) is a polishing brush in which a plurality of bases of the polishing tool (10) in which a plurality of abrasive materials including abrasive grains are bundled and placed on a rotating plate.

In addition, the first or second invention includes the following seventh and eighth inventions, that is, the polishing means (2) is a plurality of fibrous elastic bodies containing abrasive grains and entangled with each other. Abrasive brush at the bottom.

Further, the third to eighth inventions include the following as the ninth invention, that is, the plurality of polishing means (2) are connected so that the lower ends of the respective polishing means (2) are substantially horizontal, that is, arranged The lower end of each polishing means (2) is substantially parallel to the machined surface.

Further, any one of the third to eighth inventions is the tenth invention, that is, the polishing means (2) is disposed on at least two different surfaces of the polygonal columnar member.

Further, in any one of the third to eighth inventions, as the eleventh invention, the plurality of polishing means (2) are disposed on each of at least two different surfaces of the polygonal columnar member. The lower end of the polishing means (2) is substantially horizontal, that is, the lower end of each polishing means (2) is substantially parallel with respect to the machined surface.

Further, the ninth or eleventh invention includes the following 12 and the thirteenth invention, that is, the abrasive grain size of the mixed material of the wool material is F180 to #2000 (JIS R6001:1998), and the particle size of two or more types is selected. Different polishing means (2) are used, and the polishing means (2) are connected to be polished in the order of "thickness" to "fine".

Further, the ninth or eleventh invention includes the following 14 and the 15th invention, that is, the abrasive grain size of the wool material is F180 to #2000, and the polishing means having substantially the same particle size is selected and connected thereto. Grinding means.

Further, each of the first, second, third, fourth, fifth, sixth, seventh, eighth, tenth, thirteenth, thirteenth, fourteenth, and eightteenth aspects includes the following as 16, 17, 18, 19, In the 20th and 21st inventions, the receiving member (7) on which the workpiece (W) to be polished is placed on the base (4) is formed to be capable of polishing any of the corner portions of the workpiece (W). The one corner portion is placed horizontally upward, and the notch V (8) which is in contact with the flat portion on the lower side thereof, and the flat portion V (8) is formed on each of the flat portions on which the workpiece (W) is polished. In any of the flat portions, the one flat portion can be placed in a horizontal direction upward, and the notch L at which the lower corner portion (9) can be locked.

In addition, in the polygonal columnar member of the invention according to any one of the first to eighth or sixteenth aspects of the present invention, the second and the thirteenth aspect of the present invention is characterized in that the surface of the workpiece is removed by 100 μm or less. The micro-cracks are present, and the surface roughness Ry (JIS B0601:1994) of the polished surface is set to 3 μm or less.

Further, each of the 22nd and 23rd inventions includes the following as the 24th and 25th inventions, that is, the polygonal columnar member is a block or a ceramic.

Further, in the polishing apparatus for a polygonal columnar member according to the twenty-sixth aspect of the invention, the polishing apparatus for the polygonal columnar member according to the first aspect of the invention is a plurality of the workpieces (W) to be placed on the base (4). At the time when the polishing of each of the processing surfaces (P) in the processing surface is completed, the holding axes (12A) and (12B) of the holding means (5) are retracted to release the holding state of the gripping portions (6A) and (6B). The workpiece (W) to be polished is manually inverted by the operator so that the next processing surface (P) is horizontally upward, and the holding shaft (12A) and (12B) of the holding means (5) are advanced to each other. The portion (6A) reaches the reference end surface position of the workpiece (W) and stops, and the other grip shaft (12B) is further advanced to press the grip portion (12B). The other end surface of the workpiece (W) is subjected to grinding processing on the next processing surface (P) set as described above, and the processing of all the processing surfaces (P) is performed after finishing the grinding of the respective corner portions. Each flat portion is polished and processed.

Further, in the polishing apparatus for a polygonal columnar member according to the twenty-seventh aspect of the invention, in the polishing apparatus for the polygonal columnar member according to the second aspect of the invention, after the grinding of all the corner portions is completed by any one of pitch polishing or continuous polishing The rotation means (14A) and (14B), which are set to have a predetermined rotation angle, are rotated and polished for each plane portion, whereby all the flat portions are polished, and the pitch polishing is performed by the holding means (5). The gripping portions (6A) and (6B) are placed on both end faces of the workpiece (W) of the base (4), and the base (4) is lowered to be separated from the workpiece (W). The rotating means (14A) and (14B) which are set to have a predetermined rotation angle are rotated, and each of the corner portions is ground so that the polishing surface (P) is positioned upward, thereby polishing the workpiece (W). In the polishing of each of the corner portions, the continuous polishing system continuously rotates the rotation means (14A) and (14B) set with the rotation speed while polishing the respective corner portions.

Further, in the polishing apparatus for a polygonal columnar member according to the ninth or eleventh aspect of the invention, the polishing apparatus of the polygonal columnar member according to the ninth or eleventh aspect of the invention is characterized in that the abrasive grain size of the wool material is F180 to #2000, and is selected. Two or more kinds of polishing means (2) having different particle sizes, and the polishing means (2) are connected to be polished in the order of "thickness" to "fineness".

Further, in the polishing apparatus for a polygonal columnar member according to the ninth or eleventh aspect of the present invention, the polishing apparatus of the above-described ninth or eleventh aspect of the present invention has a grinding grain size of F180 to #2000. The polishing means (2) having substantially the same particle size are selected, and the polishing means is connected to perform the polishing.

According to the first invention described above, a) "grinding is completed before the start of the grinding" The standard piece (female workpiece) of the product is placed on the base (4) and the height position of the grinding process at the front end of the polishing means 2 is set, and b) the finished product of the abutment (4) is removed. The standard piece is placed such that the workpiece (W) is placed with its processed surface (P) facing up.

c) the "grain size of the abrasive material of the polishing means (2)", the "cutting condition of the workpiece (W) in the previous step", and the "machined portion of the workpiece (W) (planar portion or After the grinding processing conditions of the edge portion are input to the control means (13), the polishing is started, and the gripping portions (6A) and (6B) of the holding means (5) hold both end faces of the workpiece (W) and are fixed thereto. In the base (4), for example, even if there is an error in the dimensional dimension after the cutting in the step before the workpiece (W), the height position detection by the height position detecting means (3) can be detected. The signal calculation processing means (2) the "cut amount of the processed surface (P) of the workpiece (W) before the polishing means (2), and is automatically set before the polishing processing to perform the optimum polishing processing. After the completion of the polishing process, the gripping portions (6A) and (6B) of the holding means (5) on both end faces of the workpiece (W) are automatically released, so that the worker can manually mount the gripping portions (6A) and (6B). After the workpiece (W) on the base (4) is reversed so that the second processed surface (P) faces upward, the gripping portions (6A) and (6B) of the holding means (5) are actuated to be fixed by the holding and being ground. The both ends of the workpiece (W) are subjected to a grinding process of the next processed surface (P).

The setting of the processed surface (P) of the workpiece (W) in the series of polishing steps is manually performed by an operator, but the cutting amount of the workpiece (W) before the polishing means (2) is cut or Since the predetermined rotational speed is in contact with the machined surface (P) of the workpiece (W) and the grinding process is performed, the automatic control is performed, so that the optimum polishing process can be performed and the productivity can be improved.

According to the second aspect of the invention, the workpiece (W) is held by the means for holding (5) After the gripping portions (6A) and (6B) are held down, the base (4) is lowered and separated from the workpiece (W), and then the rotating means (14A), (14B) are used to The workpiece (W) is rotated at a predetermined angle with the center axis of the holding shaft (12A) and (12B), and the processing surface (P) of the second grinding is set horizontally upward. At this time, the base (4) is raised and the workpiece (W) is placed and fixed again, and the polishing means (2) can be transferred while being rotated, thereby performing polishing processing.

In the above-described series of polishing processes, it is possible to perform the grinding process of each of the angular portions and the flat portions of the workpiece (W) in a sequence of automatic processing on each of the machined surfaces (P) without manual operation by the operator.

Further, when the workpiece (W), that is, the polishing process of each of the corner portions of the block formed of the single crystal, the processed surface (P) is stopped upward and polished according to each surface. In this case, the cross-sectional shape of the joint portion between the corner portion and the flat portion may cause insufficient contact between the tips of the polishing means (2), and the micro-cracks or the surface roughness existing in the joint portion may not be removed, so that the surface roughness is not fine. When the rotating means (14A) and (14B) are continuously rotated to rotate the workpiece (W), that is, the block is rotated at the center of the column axis, the front end of the polishing means (2) can be sufficiently contacted and pressed. The arc surface (R surface) of the edge portion and the joint portion between the corner portion and the flat portion can be uniformly polished, and the micro cracks existing in the joint portion can be easily removed and the surface roughness can be made fine. .

Further, when the workpiece (W) is continuously rotated and the respective corner portions are polished at the same time as described above, the shaft (12A) and the center of the shaft (12B) are rotated about the center of the holding means (5). In order to uniformly grind each of the corner portions, the holding shaft (12A), (12B) is viewed from the end surface side of the workpiece (W). The holding position of the grips (6A) and (6B) of the end is required to adjust the core.

The workpiece (W) is placed on the base (4) with its angular portion facing upward, and the holding shafts (12A) and (12B) of the holding means (5) are respectively advanced to the gripping portion ( 6A), (6B) the holding position viewed from the end face side of the workpiece (W) when the both ends of the workpiece (W) are held, and the horizontal direction is supported by the receiving member provided on the base (4) 7) The notch V(8) is adjusted to the core, but in the up-and-down direction, when the workpiece (W) formed by cutting the twin rod in the current step is an error in the shape outside the block, it is generated. It is equivalent to the offset of the amount of 1/2 of the error amount, so the core adjustment is required.

The method of adjusting the core in the vertical direction is performed by moving the height position detecting means (3) to measure the height (H1) of the edge portion of the workpiece (W) placed on the base (4). Thereafter, the base (4) is lowered to be separated from the workpiece (W), and the rotation means (14A) and (14B) are rotated by 180 degrees to make the edge of the workpiece (W) downward. The height is measured (H2), and the measurement result is stored in the control means (13), and the height corresponding to 1/2 (= (H1 - H2)/2) of the difference is used as the core of the up and down direction. The adjustment amount is processed.

Next, the base (4) is raised so that the lower surface of the workpiece (W) is supported by the notch V (8) provided in the receiving member (7), and the holding shaft (12A) of the holding means (5) is (12B), after the both ends of the workpiece (W) held by the grip portions (6A) and (6B) held by the distal end are retracted, the movement of the base station (4) is equivalent to the upper and lower directions of the arithmetic processing. The amount of the core adjustment amount is such that the holding shafts (12A) and (12B) of the holding means (4) are advanced so that the grip portions (6A) and (6B) of the front end hold the both ends of the workpiece (W). That is, the core adjustment in the up and down direction is completed.

According to the third and fourth inventions, since the wool material has flexibility as compared with the polishing method such as grinding stone, it is possible to suppress damage to the workpiece to be polished by polishing. Since the wool material contains abrasive grains, the grinding force can be sufficiently ensured.

According to the fifth and sixth inventions, the length of the hair material exposed from the bottom of the polishing means (2) can be adjusted by arbitrarily setting the position (up-and-down direction) of the rotating plate on which the polishing tool (10) is implanted. In other words, by keeping the position of the rotating plate downward in accordance with the abrasion of the wool material, the length of the raw material exposed at a constant time can be kept constant.

According to the seventh and eighth inventions, since the elastic bodies containing the abrasive grains and entangled with each other are entangled with each other, the inside of the aggregates contains air, and when the workpiece is processed by the abrasive brush having the plants, The air layer contained therein functions as a cushioning material. Therefore, the damage of the workpiece (W) due to contact with the polishing brush can be reduced.

According to the ninth invention, the polishing means (2) can be appropriately selected and processed depending on the type or purpose of the workpiece (W) to be polished.

According to the tenth aspect of the invention, by providing the polishing means (2) on at least two or more different surfaces of the workpiece (W) to be processed, it is possible to simultaneously perform processing of two or more surfaces.

According to the eleventh aspect of the invention, the polishing means (2) provided on at least two different surfaces of the workpiece (W) can be appropriately selected in accordance with the type or purpose of the workpiece (W) to be processed.

According to the twelfth and thirteenth aspects of the invention, the polishing means (2) having a coarse particle size of the abrasive grains is used to increase the polishing force, thereby increasing the amount of polishing, whereby the surface layer portion of the workpiece (W) can be easily removed. Crack, by grain size For the "fine" polishing means (2), the unevenness of the rough surface due to the grinding process of the "thick" polishing means (2) is removed, and the surface roughness is made fine, thereby eliminating the occurrence of the post-process. Cracks or defects, gaps.

According to the fourteenth and fifteenth aspects of the invention, when the plurality of polishing means (2) are connected, the size of the abrasive grains contained in the wool material implanted in each polishing means (2) is substantially the same, whereby the grinding can be shortened. Grinding time of the workpiece (W).

According to the sixteenth to twenty-firstth invention, in the case where the notch V (8) and (8) of the receiving member (7) of the base (4) are polished, the edge portion of the workpiece (W) is polished. When the edge portion of the workpiece (W) is placed horizontally upward, the flat portion on the lower side of the workpiece (W) can be surely placed and placed on the base (4). In the case of grinding the flat portion of the workpiece (W), the notch L (9) and (9) can be surely placed when the flat portion of the workpiece (W) is placed horizontally upward. The corner portion on the lower side of the workpiece (W) is placed and fixed.

According to the 22nd and 23rd invention, by using the polishing apparatus according to any one of the first to eighth and sixteenth aspects, microcracks of 100 μm from the surface layer can be obtained, and the surface roughness Ry is Multi-angle columnar member of 3 μm or less.

According to the twenty-fourth and twenty-fifthth inventions, the micro-cracks of 100 μm from the surface layer are obtained by using the polishing apparatus according to any one of the first to eighth and sixteenth inventions, and the surface roughness Ry is A polygonal columnar member of 3 μm or less is a very hard and brittle material such as a clam block or a ceramic.

According to the twenty-sixth aspect of the invention, as described in the first aspect of the invention, the setting of the processed surface (P) of the workpiece (W) is manually performed by the operator, but the cutting amount of the polishing means (2) or the actuation thereof is performed. Due to automatic control, In this case, even if the worker alternates, the machining process can be performed without lowering the machining accuracy and the productivity. The polishing process is performed by polishing the respective flat portions after polishing the respective corner portions. The joint portion where the respective corner portions and the flat portion are joined can be polished into a "smooth shape", and the micro cracks and surface irregularities existing in the surface layer portion can be easily removed.

According to the twenty-seventh aspect of the invention, the object to be polished (W) is placed in a state in which the workpiece (W) is held by the gripping portion (6A) (6B) at the tip end of the gripping means (5). By the rotation means centering on the axis of the holding shaft, the processing surface (P) of the workpiece (W) to be polished by the worker in the first invention is set, and the worker can be omitted. In the trouble, the workpiece (W) is continuously rotated by the above-described rotating means, and the polishing means (2) is lowered from above to the workpiece (W), and the tip end of the polishing tool (10) is transferred while being rotated. In addition, the shape of the joint portion where the respective corner portions and the flat portion joined together as the effects of the fifth aspect of the invention can be further polished into a "smooth shape", and the microcracks or the unevenness can be removed more reliably.

According to the 28th and 29th inventions, the "grinding" polishing means (2) having different particle sizes of abrasive grains and the "fine" polishing means (2) are connected to two or more types, and the particle size of the abrasive grains can be " The high grinding ability of the coarse grinding means (2) reliably removes the micro-cracks present in the surface layer portion of the workpiece (W) and is finely ground by the grinding means (2) of the "fine" grain size of the abrasive grains. The ability to grind the surface roughness of the rough surface portion due to the above-described grinding process to a fineness, thereby eliminating defects and notches which are generated in the post-process. Further, as the polishing brush used in the polishing means (2), it is possible to implant a plurality of abrasive materials including the abrasive grains on the bottom of the polishing brush and to bundle the plurality of abrasive materials containing the abrasive grains into the polishing tool (10). Set up A plurality of fibrous elastomers containing abrasive grains and entangled with each other are selected from the plurality of roots of the abrasive brush.

Further, when the polishing tool (10) is implanted in the rotary disk (11) in multiples, as described in the description of Fig. 2 described later, when the polishing tool (10) composed of the mixed abrasive particles is consumed , the grinding tool (10) which only replaces the grinding tool (10) with the new grinding tool (10) can be disassembled and detached from the type of the rotating disk (11), and the grinding tool (10) and the rotating disk ( 11) The polishing tool (10) is fixedly attached to any one of the types (not shown) of the rotary disk (11).

According to the 30th and 31st inventions, the polishing processing time (W) of the workpiece (W) can be shortened by connecting a plurality of polishing means (2) having substantially the same particle size of the abrasive grains. Further, as described above, the polishing brush used in the polishing means (2) is as described in the description of FIG. 2 described later, and when the polishing tool (10) composed of the mixed abrasive particles is consumed, The abrasive tool (10) is exchanged only for the new abrasive tool (10) to be detachable from the rotary disk (11), and the abrasive device is fixedly mounted to the rotary disk in such a manner as to be replaced together with the rotating disk (not shown). Any of the types.

The constitution and details of the polishing apparatus of the polygonal columnar member having two or more series (three series) of polishing means having different polishing thicknesses according to the present invention will be described with reference to the drawings.

1 is a front view showing a polishing apparatus showing a grinding unit 1 stopped at a position before the start of grinding at the right end of the drawing, and a workpiece W which is placed on the base 4 and shown by a two-dot chain line. In the figure, the front end of the shaft 12A of the reference side which is slid by the cylinder driving of the holding means 5 The grip portion 6A and the grip portion 6B at the distal end of the gripping shaft 12B on the driven side are respectively retracted without holding the open state of the workpiece W, and the polishing unit 1 is connected to the left side from the right side of the drawing by three types of "thickness". Each of the polishing means 2 including the polishing brush which is selected and set to have different abrasive grain sizes for "grinding", "intermediate polishing" and "finished polishing" is used in the drawing of the polishing means 2 for "rough polishing" On the right side, there is provided a height position detecting means 3 for detecting the height position of the processed surface P of the workpiece W before the start of the polishing.

The "grinding" used in the above-mentioned three-way polishing means 2 is provided to remove most of the micro-cracks present in the surface layer portion, and the "inter-grinding" is used to remove the cutting by a band saw or a wire saw. The surface unevenness generated and the surface which is thickened by the "rough grinding" are made fine, and "finished polishing" is provided for the final adjustment of the surface roughness. Further, at the stage of the "intermediate polishing", the removal of the surface unevenness and the fine adjustment of the surface roughness, that is, the polishing means 2 may be provided in two.

As described above, after determining the combination of the polishing means 2 having different abrasive grain sizes contained in the polishing tool 10 and the polishing thickness (roughness, medium, and finishing), the "grinding material W" of the polishing tool 10 is The polishing processing portion (the corner portion or the flat portion) is also set to have the same rotation speed", "the polishing processing speed is different depending on the difference between the edge portion and the plane portion", and "the height position detecting means 3" Each processing condition in which the reference height at the start of polishing of the standard piece (mother workpiece) of the finished product is measured and the "cut amount of the processed surface P of the workpiece W to be polished" is measured is set in the control means 13.

After setting the above-described processing conditions, the operator may place any one of the four processing corners of the workpiece W on the above-mentioned holding means 5 The base 4 between the holding portions 6A and 6B is placed horizontally upward and the "setting switch for the polishing portion (the corner portion or the flat portion) and the "polishing start switch" are set to "ON", and the polishing unit 1 is placed. Moving to the left end of the figure, the gripping shaft 12A of the reference side is slid by the activation of the cylinder (not shown) of the holding means 5, and the gripping portion 6A is advanced to the "reference end surface position" in the drawing to position one end surface of the workpiece W. Then, the gripping shaft 12B of the driven side also slides to advance the grip portion 6B and comes into contact with the other end surface of the workpiece W, thereby holding and fixing the workpiece W.

Next, the polishing unit 1 is transferred to the right side of the drawing, and the height position detecting means 3 is activated to detect the height of the processing surface P of the workpiece W to be processed and sent to the control means 13 for arithmetic processing, and the grinding means 2 is automatically set. After the cutting edge of the workpiece W of the workpiece W is cut by the tip end of the polishing tool 10, the polishing unit 1 automatically set by the "setting switch of the polishing portion (edge portion or plane portion)" is further moved to the polishing unit 1 In the figure, the right side is transferred, and each polishing means 2 is polished in the order of "rough grinding", "medium grinding", and "finish polishing".

After the completion of the polishing process, there are two types of the above-described semi-automatic type polishing apparatus according to the first aspect of the invention and the fully automatic type of the second invention. The semi-automatic type of polishing apparatus according to the first aspect of the invention is configured to hold the workpiece W The holding shafts 12A, 12B of the holding means 5 of the both end faces are retracted to automatically release the gripping portions 6A, 6B holding the front end thereof against the workpiece W, and are manually placed on the base 4 by the operator. After the workpiece W is reversed so that the second processed surface P faces upward, the holding shafts 12A, 12B of the holding means 5 are moved forward again, and the grip portions 6A, 6B hold the both ends of the workpiece W, And automatically grinding the next processing surface P; In the fully automatic type of the second aspect of the invention, the workpiece W is lowered by the lifting means (not shown) and the workpiece W is removed by the lifting means 6a, 6B held by the holding means 5. In the fixed state, the workpieces W are rotated by a predetermined angle around the gripping shafts 12A, 12B by the rotating means 14A, 14B, and the processing surface P of the next grinding is set horizontally upward, at which point the abutment 4, when the workpiece W is fixed and placed, the surface of the processed surface P of each of the corner portions and each of the flat portions can be sequentially polished or rotated by the rotating means 14A, 14B. After the continuous rotation and simultaneous polishing of the respective corner portions, the respective surfaces of the processed surfaces P of the respective flat portions are automatically polished.

2(A) and 2(B) show an example of a polishing brush as the polishing means 2. In the polishing brush, the polishing tool 10 is used, and the polishing tool 10 is configured by binding a hair material composed of a synthetic resin such as nylon mixed with abrasive grains. The base of the polishing tool 10 is detachably attached to a rotary disk 11 that is horizontally rotatable and coupled to a rotary drive source, and the lower end of the polishing tool 10 is in contact with the machined surface P that is rotated by the workpiece W to be polished. After the abrasive article 10 is worn, the abrasive article 10 can be detached from the rotary disk 11 and exchanged into a new abrasive article 10. Further, the polishing means 2 is not limited to the one shown in Fig. 2 in which the polishing tool 10 shown in Fig. 2 is used, and the polishing tool 10 in which the abrasive material of the abrasive grains (not shown) is mixed may be directly used. An abrasive brush (not shown) that is mounted and permanently fixed to the rotary disk 11. In this case, after the grinding tool 10 is worn, the polishing tool 10 is replaced with the rotary disk 11.

3 is a perspective view showing a part of the notch of the base 4, and the base 4 can mount any one of the edge portions or the flat portions of the workpiece W as a processing surface horizontally upward, and FIG. 4 shows the vertical display. Plate on the base 4 An explanatory view of a manufacturing process of the shape receiving member 7, wherein the receiving member 7 is formed such that when the edge portion of the workpiece W is polished, the edge portion can be placed horizontally upward. The notch (V) 8 of the lower planar portion is formed in the notch (V) 8 so that any one of the planar portions of the polished workpiece W can be placed so that the planar portion can be placed The notch (L) 9 is locked by the corner portion of the lower side in a horizontally upward manner. Further, although the base 4 shown in FIG. 3 described the processed surface P of the workpiece W to be processed, that is, the edge type and the flat portion, it may be of a special type in which the corner portion and the flat portion are opened.

5(A) and 5(B) are perspective views showing an example in which the shape of the workpiece W is a square column shape, and FIG. 5(A) is an angular portion of the flat portion cut out from the corner material. In Fig. 5(B), the cylindrical material is cut out as a flat surface, and a cylindrical portion of the material is left at the corner portion to form an R surface.

6(A) and 6(B) are cross-sectional views from the side when the workpiece (W) is placed on the base 4, and Fig. 6(A) shows the corners of the workpiece W being polished. At the time of the part, the workpiece W is placed on the receiving member 7 of the base 4 so that the machined surface P faces upward, and FIG. 6(B) shows that the workpiece is polished when the flat portion of the workpiece W is polished. The material W is placed on the receiving member 7 of the base 4 with its processing surface P facing upward.

In the embodiment described below, the workpiece W is a square columnar block, and the four planar portions and the quadrangular corner portions of the workpiece W are polished by the polishing apparatus of the present invention to be removed from the surface layer portion. The micro-crack and the unevenness of the surface thereof are used to refine the surface roughness, and the polishing effect is evaluated. When the crucible is sliced by a wire saw to form a tantalum wafer, the thickness can be reduced. The incidence of defective products caused by cracks, gaps, etc. of the wafer.

Example 1

The specification of the single crystal crucible as the workpiece W to be polished is as follows. A single crystal twin rod manufactured by cutting a cylindrical shape with a band saw or a wire saw is cut into a length (L) of 500 mm over the length thereof. The direction cuts off the four sides of the cylindrical wall surface to form a four-plane portion, and the edge portion where the two flat portions intersect is formed into an R shape such that a portion of the arc wall surface before the cutting is left (about 25 mm). In the square column shape shown in Fig. 5(B), the size is cut into (?) 125 mm × 125 mm, and (L) 500 mm.

A micro-crack having a depth of 80 to 100 μm and a surface roughness of (Ry) 9 to 11 μm are present in the edge portion of the workpiece W and the surface portion of the planar portion before the polishing process, and the wire saw is used for the wire block. The rate of defective products caused by cracks, notches, etc. during slicing is 5 to 6%.

In the polishing apparatus used in the present embodiment, the polishing apparatus described in the first aspect of the invention is used as the crumb of the workpiece (W), and the microcracks and the unevenness are removed, and the surface roughness is miniaturized. The result of the reduction in the rate of defective products caused by cracks, notches, and the like in the formation of the tantalum wafer by the slicing of the tantalum block is as follows.

Table 1 below shows the relationship between the surface roughness (Ry) of the workpiece W to be polished corresponding to the particle size of the abrasive grains of the polishing brush, in order to select the abrasive grain size of the polishing brush used for setting the polishing means 2. Reference materials.

Further, in the following Table 2, it is shown that "the amount of cutting of the tip of the polishing tool 10 from the processing surface P of the workpiece W to be polished is set to "the amount of the grain size of each of the polishing brushes." Reference material for the relationship between the cut sales volume (μm) of the workpiece W to be polished, and the difference between the cutting means and the surface finishing step of the cut surface in the step of cutting the twin rod.

The preparations before the start of the polishing are as follows: a) [Selection setting of the polishing thickness of the polishing means 2] is determined, and then attached to the polishing unit 1, and b) [the reference height of each polishing tool 10 of the polishing means 2 is performed. After setting and automatically setting the control means 13, the machining conditions of c) to e) are manually input to the control means 13.

a) [Selection setting of polishing thickness of polishing means 2]: Refer to Table 1 above to select the particle size of the abrasive grains of the polishing brush for rough polishing: #240, medium polishing: #500, finishing polishing: #800 The three types are connected as the polishing means 2.

b) [Setting of the reference height of each polishing tool 10 of the polishing means 2]: The standard piece (female workpiece) of the finished polishing product is placed on the base 4, and the angular position of the standard piece is measured by the height position detecting means 3. The height position of the portion and the flat portion is used to automatically set the measurement result as the reference height before the start of polishing of each of the polishing tools 10 of the polishing means 2 to the control means 13.

c) [Setting of the rotational speed of the polishing tool 10 of the polishing means 2]: 15 m/sec

d) [Setting of polishing transfer speed of the polishing tool 10 of the polishing means 2]: (fixed polishing of the corner portion) 4 mm/sec, (grinding of the flat portion) 20 mm/sec.

e) [Setting of the amount of cutting of the processing surface P by each of the polishing tools 10 of the polishing means 2]: With reference to the above Table 2, the amount of cutting of each of the polishing brushes set to the processing surface P is determined to be rough polishing (# 240): 0.5 mm, medium grinding (#500): 0.7 mm, finished grinding (#1100): 0.8 mm.

In the present invention, when the edge portion and the flat portion are polished by the polishing means 2 having the same polishing thickness, the edge portion is more likely to be polished than the flat portion. The reason for this is that it depends on the difference in shape of the polishing portion. As described above, it is known that c) the above-mentioned angular portion and the flat portion c) [setting of the rotational speed of the polishing tool 10 of the polishing means 2] (= 15 m/sec) are the same speed, and d) [the polishing means 2 In the setting of the polishing transfer speed of the polishing tool 10, the polishing transfer speed (20 mm/sec) of the flat portion is set to be positive, and the transfer speed (40 mm/sec) of the angular portion is set to be fast, and the polishing can be shortened. Processing time.

When c) [setting of the rotational speed of the polishing tool 10 of the polishing means 2] is set relatively fast, the polishing force can be increased to shorten the polishing processing time, and the rotational speed of the angular portion and the planar portion can be set to be different. The rotation speed allows the surface roughness of the corner portion and the flat portion to be adjusted.

When d) [setting of the polishing transfer speed of the polishing tool 10 of the polishing means 2] is set to be fast, the polishing force can be reduced and the polishing processing time can be shortened.

As described above, the setting of the preparation is completed, and any one of the corners of the workpiece W is placed on the base 4 between the gripping portions 6A, 6B of the holding means 5 so as to be horizontally upward, that is, the control means 13 When the polishing start switch is turned "ON", the grinding process is started, and the holding shafts 12A, 12B are moved forward and backward with the gripping means 5, and the gripping portions 6A, 6B perform the action of holding and releasing the both end faces of the workpiece W. When the polishing process of one of the processed surfaces P set by the workpiece W is completed and the gripping state is released, the operator reverses the next processed surface P to face horizontally, and grinds the square corners to each surface. After that, the four flat portions are sequentially polished according to the respective faces, and the grinding process of the three crotch blocks is completed.

As a result, the grinding time required for the grinding process of a block including the set time of the workpiece W is 24 minutes 34 seconds to 24 minutes 45 seconds. (Average: 24 minutes and 40 seconds), the polishing amount (=depth) on one side is 108 μm to 126 μm (average: 119 μm) for each angular portion, 98 μm to 110 μm (average: 104 μm) for each plane portion, and the maximum depth of micro cracks is 1.6 μm. The surface roughness is an angular portion Ry0.7 to 1.0 (average: Ry0.8) and a flat portion Ry0.8 to 1.1 (average: Ry0.9), which can remove microcracks and irregularities and miniaturize the surface roughness. After the three slabs were sliced by a wire saw and made into a ruthenium wafer, the incidence of defective products due to cracks, gaps, and the like was investigated, and the incidence was reduced to 1.0%.

Further, the portion having the maximum depth (1.6 μm) of the microcracks is the "joining portion of the corner portion and the flat portion" shown in Fig. 7, and the depth of the micro cracks existing in the other corner portions or the flat portion is 0.7. ~1.0μm. From this, it can be judged that it is difficult to perform the polishing process of the "joining portion of the edge portion and the flat portion" as shown by the oblique line portion in Fig. 7 by the means for polishing the respective edge portions and the processed surface P of each flat portion.

Further, in the range where the maximum depth of the crack is 2.3 μm, the influence of the occurrence of defective products caused by cracks, notches, etc. when the wafer is processed into a thickness of several tens of mm is small, and this has been Find out. In the related art, the depth of the microcracks was "3.0 μm or more", and the incidence of the defective product was increased.

Example 2

In the following, the same processing block as the first embodiment is used for the workpiece W, and the polishing apparatus uses the polishing apparatus according to the second aspect of the invention to continuously rotate the rotating means 14A, 14B so that the workpiece W is held by the shaft 12A. When the axis of 12B is rotated centrally and the grinding process of the four corners is performed simultaneously, the rotation means 14A, 14B are rotated by a predetermined angle (in this embodiment "90 degrees"), depending on the surface of the four planes, and the residual state and surface roughness of the microcracks in the block, and the cracks and gaps when the block is sliced to form a wafer. The incidence of defective products is reduced.

As a preparation item before the start of polishing, a) [selection of the polishing thickness of the polishing means 2], b) [setting of the reference height of each polishing tool 10 of the polishing means 2], c) [grinding means 2] Setting of the rotational speed of the polishing tool 10], e) [setting of the cutting amount of the polishing tool 10 to the processing surface P by the polishing means 2] is set in the same manner as the conditions set in the first embodiment, and then d) Setting of the polishing transfer speed of the polishing tool 10 of 2]: (grinding of the corner portion) 2 mm/sec of the rotational polishing, (grinding of the flat portion) 20 mm/sec and the new f) [Rotation conditions of the rotating means 14A, 14B Setting]: (grinding of the corner portion) 105 min -1 of continuous polishing, (grinding of the flat portion), angular rotation, and 90-degree manual input are set to the control means 13.

As described above, the setting of the preparation is completed, and any one of the edge portion or the flat portion of the workpiece W is placed on the base 4 between the grip portions 6A, 6B of the holding means 5 so as to be horizontally upward, and then the control is started. The polishing start switch of the means 13 is cut "ON" to start the polishing process, and the holding shafts 12A, 12B of the holding means 5 advance, and the bases are held while the grip portions 6A, 6B hold the both end faces of the workpiece W to be polished. After the stage 4 is lowered, the rotating means 14A, 14B continuously rotates the workpiece W at a speed of 105 min-1 and simultaneously grinds the four corner portions. After the polishing of the corner portions is completed, the rotating means 14A, 14B rotates the workpiece W by 90 degrees, and the respective flat portions are set to be sequentially polished upward, and the three workpieces are ground in the same manner as in the first embodiment. Piece.

As a result, the polishing time required for the polishing of one of the blocks including the set time of the workpiece W is 27 minutes 46 seconds to 27 minutes 57 seconds (average: 27 minutes 51 seconds), and the amount of grinding on one side ( = depth) is 121 μm to 134 μm (average: 127 μm) for each angular portion, 102 μm to 110 μm (average: 106 μm) for each plane portion, and the maximum depth of microcracks is 0.9 μm, and the surface roughness is an angular portion Ry 0.5 to 0.8 (average : Ry0.7), plane portion Ry0.7~1.0 (average: Ry0.9), which can remove micro-cracks and irregularities and miniaturize the surface roughness, and slice and process the three blocks together with a wire saw. After 矽 wafers, the incidence of defective products due to cracks, gaps, etc., was investigated and the incidence was reduced to 1.8%.

Moreover, the maximum depth of the microcracks existing in the "joining portion between the corner portion and the flat portion shown by the hatched portion in Fig. 7" is 1.6 μm (maximum depth) in the first embodiment, and can be used in this embodiment. Reduced to 0.8μm. In this manner, the workpiece W is continuously rotated by the rotating means 14A, 14B, and the four corner portions are simultaneously polished, whereby the oblique portion shown in Fig. 7 is polished and removed.

Other embodiments

Instead of using the polishing tool 10, a hair material composed of a synthetic resin such as nylon containing abrasive grains may be implanted on the bottom of the polishing means 2. The planting of the aforementioned wool material may be annular, that is, implanted along the periphery of the bottom of the grinding means 2 and substantially parallel.

For example, in the case of polishing or processing of ceramics or the like, the polishing means 2 is in contact with the corner portion of the columnar body of substantially 90°, and the chipping of the polishing tool 2 and the workpiece W is problematic. In the case of a fibrous elastomer composed of a synthetic resin containing abrasive grains, This winding is carried out and the elastomer is implanted at the bottom of the grinding means. In this case, the type of the synthetic resin and the content of the abrasive grains in which the elastic bodies are entangled with each other and the elastic force is not broken when they are in contact with the workpiece can be appropriately selected.

In the case where multi-stage processing of "rough" to "fine" is not required, only one stage of processing can obtain the desired surface (for example, the micro-cracks on the surface of the workpiece W are small and the surface roughness is higher than the requirements. When the value does not have a large difference, that is, only "fine" processing, the particle size of the abrasive grains contained in the hair material (or elastomer) of the two or more polishing means 2 connected to each other may be used, and all the polishing means may be used. Both are roughly the same.

For example, a plurality of grinding means 2 may be provided to simultaneously process different faces such as the upper and adjacent corners. Moreover, in this case, a plurality of polishing means 2 may be connected to the polishing means 2 provided for processing each surface.

As described above, the present embodiment has been described based on the grinding method of the block, but the present invention is not limited to the block, and can be suitably used for all hard and brittle materials such as ceramics.

1‧‧‧grinding unit

2‧‧‧ grinding means

3‧‧‧ Height position detection means

4‧‧‧Abutment

5‧‧‧ Maintaining means

6A‧‧‧ gripping unit (reference position side)

6B‧‧‧ gripping department (slave side)

7‧‧‧Receiving components

8‧‧‧Gap V

9‧‧‧ gap L

10‧‧‧Brazil

11‧‧‧ rotating disk

12A‧‧‧挟 axis (reference position side)

12B‧‧‧ holding shaft (driven side)

13‧‧‧Control means

14A‧‧‧Rotation means (reference position side)

14B‧‧‧Rotating means (driven side)

W‧‧‧Abrased workpiece

P‧‧‧Processing surface

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a front elevational view showing the entire polishing apparatus of the present invention.

Fig. 2 is a view showing an example of a polishing tool in which the polishing brush is used in the polishing method of the present invention, and Fig. 2(A) is a partially cutaway cross-sectional view when viewed from the front, and Fig. 2(B) is a bottom view.

Figure 3 is a partially broken perspective view of a base of the present invention.

Fig. 4 is an explanatory view showing a manufacturing process of a receiving member attached to the base of Fig. 3;

Fig. 5 is a perspective view showing a workpiece according to the present invention in the shape of a square column, wherein Fig. 5(A) shows a workpiece having a sharp C-corner portion, and Fig. 5(B) shows an R portion. The surface is ground.

6 is a cross-sectional view showing a state in which the object to be polished having the R-face shown in FIG. 5(B) is placed on the base of the present invention, and FIG. 6(A) shows the case where the processed surface is an angular portion. Fig. 6(B) shows that the machined surface is a flat portion.

Fig. 7 is an enlarged view showing a joint portion between the corner portion and the flat portion of the workpiece to be polished on the R surface as shown in Fig. 5(B).

1. . . Grinding unit

2. . . Grinding means

3. . . Height position detection

4. . . Abutment

5. . . Holding means

6A. . . Holding part (reference position side)

6B. . . Holding part (slave side)

12A. . . Holding axis (reference position side)

12B. . . Holding shaft (driven side)

13. . . Control means

14A. . . Rotation means (reference position side)

14B. . . Rotating means (driven side)

W. . . Grinded material

Claims (22)

A polishing apparatus for a polygonal columnar member, wherein each of the planar portions and each of the angular portions in which the shape of the workpiece to be polished is a polygonal column is provided, and the base portion is provided with each of the flat portions of the workpiece (W) to be polished. Any one of the planar portion or one of the angular portions is placed horizontally upward as a polished processing surface; and the holding means constituted by the holding shaft holds the workpiece in the polishing process The grip portions that are released from the gripping state after the completion of the polishing are attached to the tip end and are moved forward and backward. When the polishing unit grinds the workpiece, the front end of the polishing means is rotated in contact with the processing surface. a polishing means for performing a polishing process; and a height position detecting means for detecting a height position of the processed surface of the workpiece to be polished before the polishing process, and storing the height position detection signal in the control means; The height position detecting signal is used to process the cutting amount at the front end of the polishing means to perform the grinding process. A polishing apparatus for a polygonal columnar member according to the first aspect of the invention, further comprising: a rotating means for setting a workpiece to be polished by the gripping portion on both end faces to set a predetermined rotation angle around an axis of the grip axis And rotating to a pitch of the processed surface of the surface to be polished upward, or a rotation of the set rotation speed, and rotating, and rotating; and lifting means for raising and lowering the base; Grinding processed polygonal column The number of corners of the shape and the polishing processing condition of the edge portion of the workpiece to be polished, that is, the pitch rotation or the continuous rotation of the rotation means are set to the control means. The polishing apparatus for a polygonal columnar member according to the first aspect of the invention, wherein the polishing means is a polishing brush having a structure in which a plurality of roots are planted in a ring shape at the bottom of the polishing brush. . A polishing apparatus for a polygonal columnar member according to the second aspect of the invention, wherein the polishing means is a polishing brush having a structure in which a plurality of roots are planted in a ring shape at the bottom of the polishing brush. . A polishing apparatus for a polygonal columnar member according to the first aspect of the invention, wherein the polishing means is an abrasive brush having a plurality of bases of a plurality of abrasive materials including abrasive grains, which are implanted on a rotating disk. structure. A polishing apparatus for a polygonal columnar member according to claim 2, wherein the polishing means is an abrasive brush having a plurality of bases of a plurality of abrasive materials including abrasive grains, which are implanted on a rotating disk. structure. The polishing apparatus of the polygonal columnar member according to the first aspect of the invention, wherein the polishing means is an abrasive brush having a plurality of fibrous elastic bodies containing abrasive grains and entangled with each other at a bottom of the polishing brush. structure. The apparatus for polishing a polygonal columnar member according to the second aspect of the invention, wherein the polishing means is an abrasive brush having a plurality of fibrous elastic bodies containing abrasive grains and entangled with each other at a bottom of the polishing brush. structure. A polishing apparatus for a polygonal columnar member according to any one of claims 3 to 8, wherein the plurality of the above-mentioned polishing means are connected horizontally. The polishing apparatus for a polygonal columnar member according to any one of claims 3 to 8, wherein the polishing means is disposed on at least two or more different surfaces of the polygonal columnar member. The polishing apparatus for a polygonal columnar member according to any one of claims 3 to 8, wherein the plurality of polishing means are disposed horizontally on at least two or more different surfaces of the polygonal columnar member. The polishing apparatus for a polygonal columnar member according to claim 9, wherein the abrasive grain size of the wool material is F180~#2000 (JIS R6001:1998), and two or more types of grinding means having different particle sizes are selected. The polishing means is connected to be polished in the order of "thickness" to "fine". The grinding device for a polygonal columnar member according to claim 11, wherein the abrasive grain size of the wool material is F180~#2000 (JIS R6001:1998), and two or more types of grinding means having different particle sizes are selected. The polishing means is connected to be polished in the order of "thickness" to "fine". A polishing apparatus for a polygonal columnar member according to claim 9, wherein the abrasive material having a particle size of F180 to #2000 is mixed, and a polishing means having substantially the same particle size is selected, and the polishing means is connected. A polishing apparatus for a polygonal columnar member according to the eleventh aspect of the invention, wherein the abrasive material having a particle size of F180 to #2000 is mixed, and a polishing means having substantially the same particle size is selected, and the polishing means is connected. Polygonal columnar structure as claimed in any one of claims 1 to 8 In the polishing apparatus according to the aspect of the invention, the receiving member for placing the workpiece to be polished on the base is formed such that when the corner portion of the workpiece is polished, the corner portion can be placed horizontally upward The notch V that is in contact with the flat portion on the lower side, and the notch V is formed so that the flat portion can be placed upward when any one of the planar portions of the planar portion of the workpiece is polished. The corner of the lower side can be locked by the notch L. A polishing method for a polygonal columnar member, which is a polishing apparatus for a polygonal columnar member according to the first aspect of the invention, which grinds each of the plurality of processing faces of the workpiece to be polished placed on the base. At the end of the time, the workpiece to be retracted by the holding means is released, and the workpiece to be polished in the gripping state is released, and the operator manually reverses the second processing surface to the upper side, thereby advancing the holding axis of the holding means. The holding portion reaches the reference end surface position of the workpiece and stops, and the other holding shaft is further advanced to press the holding portion against the other end surface of the workpiece, thereby performing the processing of the next processing surface The polishing process and the process of polishing all the processed surfaces are performed by polishing the respective flat portions after polishing the respective corner portions. A method for polishing a polygonal columnar member, which is a polishing apparatus for a polygonal columnar member according to the second aspect of the present application, after finishing the grinding process of all the corner portions by any one of selecting a pitch grinding or a continuous grinding The above-described rotating means having a predetermined rotation angle is rotated to polish each of the flat portions, thereby performing polishing processing of all the flat portions, and the pitch polishing is carried by the holding portion held by the holding means on the base. When the both ends of the workpiece are in contact with each other, the base is lowered and separated from the workpiece, and the rotating means set with a predetermined rotation angle is rotated for each The edge portion is polished so that the polishing surface is positioned upward, thereby polishing the respective corner portions of the workpiece to be polished. The continuous polishing system continuously rotates the rotation means having the rotation speed while polishing the respective corner portions. A grinding method for a polygonal columnar member, wherein the grinding device of the polygonal columnar member according to the ninth aspect of the patent application is mixed with the abrasive grain size of the above-mentioned wool material is F180~#2000, and two or more kinds of grinding materials having different particle sizes are selected. Means, and the grinding means is connected to be processed in the order of "thickness" to "fineness" of the particle size. A polishing method for a polygonal columnar member, which is a polishing apparatus for a polygonal columnar member according to Item 11 of the above patent application, wherein the abrasive grain size of the above-mentioned wool material is F180~#2000, and two or more types of particle sizes are selected. The polishing means is connected to the polishing means in the order of "thickness" to "fineness" of the particle size. A grinding method for a polygonal columnar member, which is a grinding device for a polygonal columnar member according to item 9 of the above-mentioned patent application, wherein the abrasive grain size of the above-mentioned wool material is F180~#2000, and the grinding means having substantially the same particle size is selected. And the grinding means is connected to perform the grinding. A grinding method for a polygonal columnar member, which is a grinding device for a polygonal columnar member according to Item 11 of the aforementioned patent application, which is mixed with the abrasive grain size of the above-mentioned wool material, F180~#2000, and the grinding means having substantially the same particle size is selected. And the grinding means is connected to perform the grinding.