CN103561908B - The grinding of hard brittle material, attrition process system and grinding, Ginding process - Google Patents
The grinding of hard brittle material, attrition process system and grinding, Ginding process Download PDFInfo
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- CN103561908B CN103561908B CN201180071168.6A CN201180071168A CN103561908B CN 103561908 B CN103561908 B CN 103561908B CN 201180071168 A CN201180071168 A CN 201180071168A CN 103561908 B CN103561908 B CN 103561908B
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/005—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents using brushes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The present invention provides the grinding of hard brittle material, attrition process system and grinding, Ginding process, has the micro-crack on the top layer of the machined object after the grinding function being formed as in the margin of tolerance by the sectional dimension of the machined object being made up of hard brittle material and removing grinding and refines the grinding function of surface roughness.Grinding, attrition process system has: the skin section of the machined object (W) being made up of hard brittle material is carried out grinding and removes the impurity of the skin section of this machined object and the axial deformation of post and sectional dimension is formed as desired size grinding attachment (1), the concavo-convex of skin section of the machined object after terminating grinding is ground, the micro-crack removing the skin section of this machined object the lapping device refining surface roughness (2), and carry out calculation process and to grinding attachment and the control unit of lapping device output services signal based on the measurement signal of initial setting item and grinding attachment and lapping device.
Description
Technical field
The present invention relates to add as the grinding of machined object for by the hard brittle material of slice processing manufacture wafer
Work and attrition process.More particularly, it relates to remove the deformation of skin section of machined object, micro-crack hard brittle material grinding,
Attrition process system and grinding, Ginding process.
Background technology
The skin section of raw-material ingot (ingot) manufacturing wafer be attached with the impurity produced because of melted heating or
Being deformed, the skin section at the block cutting off this ingot and formed produces the deformation and micro-crack caused because of this cut-out.Therefore, exist
In operation subsequently, when the wafer of final products is carried out slice processing, produce sometimes and produce because of crackle or gap etc.
Product defects.Accordingly, it would be desirable to carry out the deformation of the skin section for removing above-mentioned piece and the overall dimensions of wafer modulated
Grinding in specification and remove the micro-crack of skin section of above-mentioned ingot or block and refinement surface roughness thus reduces
Crackle when this ingot or block being carried out slice processing or the attrition process of gap.
The wafer that semiconductor substrate etc. are used obtains via the operation of following A, B, C.
Operation A: the material as raw material is shaped, and by crystal pulling method (CZ method), bernoulli method, hydrothermal synthesis method
Deng the operation forming ingot.
Process B: as desired by band saw, wire saw etc. above-mentioned ingot cut into the size of appropriateness, and as required
Adjust shape, be consequently formed the operation of block.
Operation C: above-mentioned piece is cut into slices and obtains the operation of wafer.
In case of manufacturing silicon chip, the manufacture method of prism-shaped silico briquette is illustrated.The manufacture of silico briquette is deposited
At the following two kinds silico briquette, it may be assumed that
In shaping mould, flow into fused raw material, cut off removing the silicon ingot being configured to cubic shaped by band saw or wire saw
Skin section (6 face), formed afterwards and cross section be cut to square and mutually with 4 side side surface part and its 4 sides of right angle intersection
Corner is the silico briquette that the crystal structure of small plane (chamfer machining portion) is made up of polycrystalline；
Cut through crystal pulling method (CZ method), bernoulli method etc. and be formed into the top of silicon ingot and the afterbody of cylindrical shape, with
After form the most rectangular 4 side side surface part parallel with axis of a cylinder, the position intersected in this 4 side side surface part in main body skin section
(rib) upper part remaining above-mentioned cylinder skin section that is small arc surface and form the crystal structure of 4 side corner sections by list
The silico briquette of the brilliant prism-shaped constituted.
In the skin section of above-mentioned silico briquette, above-mentioned both sides all can add in cut-out be deformed man-hour, micro-crack, therefore subsequently
Operation in can produce the faulty goods produced because of crackle or gap etc. when carrying out slice processing to form wafer.Cause
This, need to implement attrition process before slice processing and remove above-mentioned micro-crack and refine surface roughness.
The size of the silico briquette of above-mentioned prism-shaped, exist square (title: 5 inches) that cross section is 125mm × 125mm,
The square (title: 6 inches) of 156mm × 156mm, square (title: 8 inches) the these three kind of 210mm × 210mm,
The axial length of post is freely set between 150～600mm.
It addition, as other shape beyond block, there is also cylindric.As from one of columned piece of manufacture wafer
Example, illustrates the method being manufactured sapphire wafer by Sapphire ingot (ingot bar).Sapphire ingot with sapphire etc. as raw material,
Be formed as cylindric by crystal pulling method (CZ method), bernoulli method etc. and obtain.Sapphire wafer adds by this ingot is carried out section
Work and obtain.Also there is concavo-convex, change in the impurity such as the melted gas that Sapphire ingot produces when its skin section is attached to add heat fusing
Shape.When carrying out this removing and being desired size by outside dimension grinding, produce micro-crack in this skin section.Therefore,
Identical with above-mentioned silico briquette, in order to reduce sending out of the faulty goods produced because of the crackle of wafer, gap in operation subsequently
Raw rate, needs to carry out attrition process before slice processing and remove micro-crack and refine surface roughness.
The diameter that is typically sized to of the above-mentioned Sapphire ingot being made up of monocrystalline is 2～6 inches (51～154mm), length
It is 50～300mm.
It addition, as an example by erose piece of manufacture wafer, manufacture crystal wafer to by crystal polymorph body
Method illustrate.Crystal crystal (1umbered) can be by being made crystalline growth obtain artificial water by hydrothermal synthesis method etc.
After crystalline substance, surface is carried out grinding (crystal pro cessing) axially obtaining with the most above-mentioned synthetic quartz.Subsequently, via carrying out
Operation that the synthetic quartz of crystal pro cessing carries out cutting into slices compared with unfertile land with the angle of regulation according to frequency characteristic, by the bonding such as waxing
The synthetic quartz being sliced (such as 50～70 pieces) each other and form the operation of blocks, the profile of above-mentioned blocks be modulated to
As wafer profile size operation, remove the operation of above-mentioned wax etc. and crystal polymorph sheet can be obtained.Above-mentioned crystal crystal
There is the situation of both ends of the surface not level as shown in figure 20.
There is the micro-crack produced when by synthetic quartz grinding in the skin section at crystal crystal.With to above-mentioned silico briquette,
It is identical that Sapphire ingot carries out slice processing situation, in order to reduce produce because of the crackle of wafer, gap when slice processing lack
Fall into the incidence rate of product, need before slice processing, to carry out attrition process and remove micro-crack and refine surface roughness.
For remove the deformation of these skin section, micro-crack and reduce because producing for forming the slice processing of wafer
Crackle or the prior art of the incidence rate of faulty goods that caused of gap illustrate.
In No. 3649393 publication of patent, formed for cutting out prism-shaped from the polycrystal silicon ingot of cubic shaped
The Surface Machining of polysilicon block is disclosed.Record following technology: before silico briquette slice processing is formed as silicon chip, make
Grind the side surface part of silico briquette with the resin brush etc. being mechanically mixed into abrasive particle, thus reach the side of below 8 μm with surface roughness Ry
Formula makes small concavo-convex planarization.
But, the most it is not documented in the deformation in face, top layer, micro-crack and the removing thereof produced when cutting off silicon ingot.
Following technology is being had: for being cut to the length of regulation with band saw described in No. 4133935 publications of Japanese Patent No.
The silicon ingot of degree size, uses cylinder grinding attachment to be ground to cylindric by main body skin section and remove fluctuating, uses band saw subsequently
Cut off and remove 4 sides of this main body skin section and form the silico briquette of the quadrangular shape with 4 side surface part, when making 4 of this silico briquette
When surface roughness Ry before side surface part planarization is X μm (in an embodiment for Ry10～20 μm), by the amount of grinding of planarization
Be formed as more than 5 × X μm (amount of grinding is 100 μm in an embodiment) and be ground with this, it is possible to refine rough surface
Degree (being formed as Ry3～4 μm in an embodiment), and removes micro-crack, is thus formed this silico briquette is carried out slice processing
Crack defect during silicon chip reduces ratio and is modified more than 6 times.
Following technology has been recorded: in order to monocrystalline sapphire ingot is cut in Japanese Unexamined Patent Publication 2005-255463 publication
Sheet is processed and is obtained the wafer of desired external diameter, uses cylinder grinding attachment the peripheral part grinding of this monocrystalline sapphire ingot to be added
Work is cylindric and carries out the modulation of outside dimension.According to this grinding, the peripheral part at above-mentioned monocrystalline sapphire ingot produces
Machining deformation, micro-crack, therefore before above-mentioned monocrystalline sapphire ingot is carried out slice processing, the periphery to this monocrystalline sapphire ingot
Portion carries out chemical grinding, thus removes above-mentioned machining deformation, micro-crack.
In the cutting-off method of the hard brittle material of wafer, it is preferably used as mentioned above and is carried out by band saw or wire saw
Method, i.e. carried out the wire saw cut off by many steel wires.
In the cutting-off method of conventional wire saw, generally carry out utilizing the injection pressure of press water that abrasive particle is blown to cutting portion
And make steel wire contact rotate and carry out the free abrasive mode cut off, but in recent years, develop abrasive particle of sening as an envoy to and be fixed on the new of steel wire
Wire saw, it is possible to significantly shorten break time.
Invention people are in order to compare confirmation, by polycrystalline by the cut-out ability of above-mentioned new wire saw and conventional wire saw
Silicon ingot is cut to vertical 5 row × horizontal 5 row=meter 25 as shown in figure 15, cross section is (title) 6 inches of angles (size:
156.0mm), the block of a length of 300mm.The time that cut-out is spent, find to use conventional wire saw to need to spend 8Hr
Above, use new wire saw then with about time 3Hr just can terminate, it is possible to significantly shorten this break time.
As the reason that can shorten above-mentioned break time, infer as follows.That is, at the steel wire of conventional free abrasive mode
In saw, adding man-hour when carrying out cut-out, if making steel wire high speed rotating, abrasive particle disperses, cuts off efficiency reduction.And at new wire saw
In, owing to abrasive particle is fixed in steel wire, therefore along with the rotation of steel wire, it is possible to carry out the efficient cut-out dispersed without abrasive particle.
But, when cutting off in the case of polycrystal silicon ingot with above-mentioned new wire saw, it is positioned at 4 of A of the corner shown in Figure 15
Block and 3 × 4=12 the block of B being positioned between A, the side surface part towards outside of the silicon ingot before cut-out (2 in the block of A, B's
1 face in block) central authorities be cut off with the state that bloats towards outside as shown in figure 16.In monocrystal silicon, as shown in figure 17 that
This is by independent trip, and the central authorities of 4 side surface part of monocrystalline silico briquette are cut-off in the way of bloating laterally the most as shown in figure 18,
There is its sectional dimension to fall less than the new problem in given size tolerance.Therefore, it is intended that develop the change of the side removing silico briquette
Shape also falls into the grinding attachment in given size tolerance.
It addition, cut off in the silico briquette formed by silicon ingot, in cutting-off process, the skin section in its side surface part with corner is produced
Raw surface roughness is Ry10～the concavo-convex and degree of depth of 20 μm (JISB0601:1994) left and right is 80～100 than face, top layer
The micro-crack of μm.When such piece of slice processing becomes the thickness about several 10 μm～100 μm form wafer, sometimes because of
The surface roughness of block and micro-crack and crack on wafer, gap.Remove before slice processing therefore, it is intended that develop
Surface roughness is also formed as the lapping device of below a few μm by micro-crack.
Implement the grinding of above-mentioned grinding attachment and each operation of lapping device efficiently additionally, it is desirable that develop, grind and add
Work system and grinding, grinding method.
Summary of the invention
The present invention precisely in order to solve above-mentioned requirements item and and complete, offer is provided and is provided with and cuts by ingot
Break side surface part and the corner of the block (such as silico briquette) formed for quadrangular shape carries out grinding thus sectional dimension is processed into institute
The grinding attachment of desired size or remove the top of shear sectional plane ingot substantially circular in shape and afterbody and be formed as cylinder
The deformation, the impurity that produce because of melted heating of the peripheral part of the ingot (such as, monocrystalline sapphire ingot) of shape thus by sectional dimension
It is ground to the grinding attachment of desired size or is provided with the side of erose piece of grinding (such as crystal crystal) simultaneously
The micro-crack of skin section of the machined object after face and the grinding attachment in corner and the removing above-mentioned grinding of end also refines
The grinding of the hard brittle material of the lapping device of surface roughness, attrition process system and grinding, grinding method, and
Offer has the control unit of the above-mentioned grinding attachment of control and lapping device thus improves the hard fragility of the post shapes of working (machining) efficiency
The grinding of material, attrition process system and grinding, grinding method.
To achieve these goals, the grinding of hard brittle material of the 1st mode of the present invention, attrition process system, such as
As shown in Figure 1, Figure 2 and shown in Fig. 5, to being added of the column being made up of hard brittle material for being manufactured wafer by slice processing
Work thing (W) carries out grinding and grinding, and wherein, above-mentioned grinding, attrition process system possess: grinding attachment (1), this grinding attachment
(1) with the skin section of certain approach grinding machined object (W), impurity and the axis of a cylinder of the skin section of machined object (W) is removed
The deformation in direction, and sectional dimension is formed as desired size, this grinding attachment (1) has measurement machined object (W)
The measuring unit (18) of size；Lapping device (2), after this lapping device (2) terminates grinding with certain grinding by pressure
The skin section of machined object (W), removes the micro-crack of the skin section of machined object (W) and refines surface roughness, this grinding
Device (2) has the measuring unit (18) of the size of measurement machined object (W)；And control unit, this control unit is to by surveying
The size of the machined object (W) that amount unit (18) is measured carries out computing, and exports grinding attachment according to the result of above-mentioned computing
(1) working signal and the working signal of lapping device (2).
According to the 1st mode, set certain approach (scientific terms: belong to " size owing to having relative to machined object
Control incision ") cutting machined object deformation carry out flat form and sectional dimension be ground to the grinding in desired tolerance
Device and as pressure produced by the approach (scientific terms: belong to " Stress control incision certain relative to machined object setting
For) and lapping device that the skin section of machined object is ground, therefore provide and sectional dimension can be added with cross sectional shape
Work is interior to desired tolerance and can remove the micro-crack of skin section, the hard brittle material of refinement surface roughness definitely
Grinding, attrition process system.Further, since the measuring unit being used in grinding attachment or lapping device setting measures machined object
Size, control unit this measurement result carried out computing and export the working signal of grinding attachment or lapping device, therefore
Correct grinding based on the size measured, attrition process can be carried out.
In the grinding of the 2nd mode, attrition process system of the present invention, the most as shown in figure 21, have at least one with
On grinding, lapping device, this grinding, lapping device have: grinding unit (14), this grinding unit (14) is with certain incision
The skin section of amount grinding machined object (W), removes impurity and the axial deformation of post of the skin section of this machined object, and will
Sectional dimension is formed as desired size；Grinding unit and (20), this grinding unit is ground by pressure with certain with (20)
Terminate the skin section of the machined object after above-mentioned grinding, remove the micro-crack of the skin section of this machined object and to refine surface thick
Rugosity；And control unit, the size of this control unit machined object to being measured by above-mentioned measuring unit carries out computing, and
Result according to above-mentioned computing exports working signal and the working signal of above-mentioned grinding unit of above-mentioned grinding unit.
In the grinding of the 3rd mode, attrition process system of the present invention, in the grinding of the 2nd mode, attrition process system
On the basis of, the most as shown in Figure 1 and Figure 2, there is at least one of following grinding attachment (1) and lapping device (2), grinding
Device (1), with the skin section of certain approach grinding machined object (W), removes the impurity of the skin section of this machined object (W)
Deformation axial with post, and sectional dimension is formed as desired size, grinding attachment (1) has measurement machined object
(W) measuring unit (18) of size, lapping device (2) grinds the machined object after terminating above-mentioned grinding with certain by pressure
(W) skin section, removes the micro-crack of the skin section of this machined object (W), and refines surface roughness, lapping device (2)
There is the measuring unit (18) of the size of measurement machined object (W).
According to the 2nd and the 3rd mode, set certain approach (scientific terms: belong to owing to having relative to machined object
In " size Control incision ") deformation of machined object of pruning carrys out flat form and sectional dimension is ground to desired tolerance
Interior grinding unit and as pressure produced by the approach (scientific terms: belong to " pressure certain relative to machined object setting
Control incision ") and grinding unit that the skin section of machined object is ground, therefore providing can be by sectional dimension and cross section
Shape be machined in desired tolerance and can remove definitely the micro-crack of skin section, refinement surface roughness the most crisp
The property grinding of material, attrition process system.Further, since the measuring unit being used in grinding attachment or lapping device setting measures quilt
The size of machining object, is carried out computing by control unit and exports the work letter of grinding unit or grinding unit this measurement result
Number, therefore, it is possible to carry out correct grinding based on the size measured, attrition process.
According to the 3rd mode, it is possible to according to shape, processing purpose combination grinding, lapping device and the grinding dress of machined object
Put or lapping device.
In the grinding of the 4th mode, attrition process system of the present invention, grinding, grinding in the 1st or the 3rd mode add
On the basis of work system, such as shown in Fig. 1, Fig. 6, Fig. 7 and Fig. 9, grinding attachment (1) has: base station (11), this base station
(11) in the way of the axis of a cylinder by machined object (W) is in level, this machined object (W) is loaded, and can be vertically
Mobile；Holding unit (12), this holding unit (12) has: make to be placed in the machined object (W) of base station (11) along with processed
Retreat the mobile and pressing utensil at center that machined object (W) is positioned base station (11) in the orthogonal direction of the axis of a cylinder of thing (W)
(34)；And in the way of the direction of the axis of a cylinder becoming machined object (W) by axle center, hold the clamp shaft at the two ends of machined object (W)
(13), clamp shaft (13) makes machined object (W) can pivot about with above-mentioned axle center；Grinding unit (14), this grinding
Unit (14) is to make the abrasive grain layer (15a) being bonded to each other by abrasive particle be fixed on discoid or circular base plate (15b)
Grinding body (15) is fixed on the grinding stone of rotating disk (16), and above-mentioned grinding stone is linked to rotary driving source in the way of handling freely, makes
State abrasive grain layer (15a) to press on above-mentioned machined object (W) and rotate；And mobile unit (19), this mobile unit (19)
Make either party of holding unit (12) and grinding unit (14) move along the axis of a cylinder direction of machined object (W) at least with added
The length of work thing (W) suitable huge from.
In the grinding of the 5th mode, grinding system of the present invention, in grinding, the attrition process system of the 1st or the 3rd mode
On the basis of system, such as shown in Fig. 1, Fig. 6, Fig. 7, Fig. 9 and Figure 10, grinding attachment (1) has: base station (11), this base station
(11) in the way of the axis of a cylinder by machined object (W) is in level, this machined object (W) is loaded, and can be vertically
Mobile；Holding unit (12), this holding unit (12) has: make to be placed in the machined object (W) of base station (11) along with processed
Retreat the mobile and pressing utensil at center that machined object (W) is positioned base station (11) in the orthogonal direction of the axis of a cylinder of thing (W)
(34)；And in the way of the direction of the axis of a cylinder becoming machined object (W) by axle center, hold the clamp shaft at the two ends of machined object (W)
(13), clamp shaft (13) makes machined object (W) can pivot about with above-mentioned axle center；Grinding unit (14), this grinding
Unit (14) is to make the abrasive grain layer (15a) being bonded to each other by abrasive particle be formed as discoid or circular grinding body (15)
Being fixed on the grinding stone of rotating disk (16), above-mentioned grinding stone is linked to rotary driving source in the way of handling freely, makes above-mentioned abrasive grain layer
(15a) press on above-mentioned machined object (W) and rotate；Mobile unit (19), this mobile unit (19) makes holding unit
(12) and either party of grinding unit (14) move along the axis of a cylinder direction of machined object (W) at least with machined object (W)
Length suitable huge from.
According to the 4th and the 5th mode, owing to holding unit can be utilized to hold machined object, utilize mobile unit make by
Machining object moves, and utilizes grinding unit grinding machined object, and utilize the clamp shaft of holding unit to make machined object rotate and
Carry out grinding, therefore, it is possible to remove impurity and the axial deformation of post of the skin section of machined object definitely.Further, since it is sharp
The grinding unit of machined object or the rotation held by holding unit that is grinding stone is made to move and machined object by mobile unit
The distance that length is suitable, therefore, it is possible to carry out the grinding throughout total length to machined object.
In the grinding of the 6th mode, attrition process system of the present invention, grinding, grinding in the 1st or the 3rd mode add
On the basis of work system, such as shown in Fig. 2, Fig. 6, Fig. 7 and Figure 11, lapping device (2) has: base station (11), this base station
(11) in the way of the axis of a cylinder by machined object (W) is in level, this machined object (W) is loaded, and can be vertically
Mobile；Holding unit (12), this holding unit (12) has: make to be placed in the machined object (W) of base station (11) along with processed
Retreat the mobile and pressing utensil at center that machined object (W) is positioned base station (11) in the orthogonal direction of the axis of a cylinder of thing (W)
(34)；And in the way of the direction of the axis of a cylinder becoming machined object (W) by axle center, hold the clamp shaft at the two ends of machined object (W)
(13), clamp shaft (13) makes machined object (W) can rotate centered by above-mentioned axle center；Grinding unit (20), this grinding unit
(20) it is to there is rotating disk (22) and tie up the abrasive brush of the configuration bristle material (21) containing abrasive particle on discoid surface, above-mentioned
Abrasive brush is linked to rotating mechanism in the way of handling freely, makes above-mentioned bristle material (21) press on machined object (W) and enter
Row rotates；And mobile unit (19), this mobile unit (19) makes holding unit (12) and any the one of grinding unit (20)
Side moves at least suitable with the length of machined object (W) distance along the axis of a cylinder direction of machined object (W).
According to the 6th mode, owing to holding unit can be utilized to hold machined object, mobile unit is utilized to make machined object move
Dynamic, utilize grinding unit to grind machined object, and utilize the clamp shaft of holding unit to make machined object rotate and be ground,
Therefore, it is possible to carry out definitely removing the micro-crack of machined object and refining the attrition process of surface roughness.Further, since it is sharp
Make the grinding unit of machined object or the rotation held by holding unit by mobile unit that is abrasive brush moves and machined object
The suitable distance of length, therefore, it is possible to machined object is carried out the grinding throughout total length.
In the grinding of the 7th mode, attrition process system of the present invention, in the grinding of the 2nd invention, attrition process system
On the basis of, such as shown in Figure 21, grinding, lapping device (6) have: base station (11), and this base station (11) is so that above-mentioned machined object
(W) axis of a cylinder is in the mode of level and loads this machined object (W), and can move in the vertical direction；Holding unit
(12), this holding unit (12) has: make to be placed in the machined object of this base station along the side orthogonal with the axis of a cylinder of this machined object
Pressing utensil (34) to the center moving and being positioned by this machined object above-mentioned base station of retreating；And become with axle center and to be added
The mode in the direction of the axis of a cylinder of work thing holds the clamp shaft (13) at the two ends of this machined object, and above-mentioned clamp shaft makes machined object energy
Enough rotations centered by its axle center；And mobile unit (19), this mobile unit (19) makes holding unit (12) or grinding list
Either party of unit (14) or grinding unit (20) move along the axis of a cylinder direction of above-mentioned machined object at least with this machined object
The distance that length is suitable, grinding unit (14) is to make to be bonded to each other abrasive particle and be formed as discoid abrasive grain layer (15a) and fix
Grinding body (15) in discoid or circular base plate (15b) is fixed on the grinding stone of rotating disk (16), and above-mentioned grinding stone is with handling certainly
As mode be linked to rotary driving source, make above-mentioned abrasive grain layer (15a) press on above-mentioned machined object (W) and rotate, grind
Mill unit (20) possesses abrasive brush, and makes this abrasive brush rotate, and this abrasive brush is detachably kept, and has and justifying
The surface of plate-like is tied up the configuration bristle material containing abrasive particle and makes this bristle material press on above-mentioned machined object and revolve
The rotating disk turned.
In the grinding of the 8th mode, attrition process system of the present invention, in the grinding of the 2nd invention, attrition process system
On the basis of, the most as shown in figure 21, grinding, lapping device (6) have: base station (11), and this base station (11) is with above-mentioned machined object
(W) axis of a cylinder is in the mode of level and loads this machined object (W), and can move in the vertical direction；Holding unit
(12), this holding unit (12) has: make to be placed in the machined object of this base station along the side orthogonal with the axis of a cylinder of this machined object
Pressing utensil (34) to the center moving and being positioned by this machined object above-mentioned base station of retreating；And become with axle center and to be added
The mode in the direction of the axis of a cylinder of work thing holds the clamp shaft (13) at the two ends of this machined object, and above-mentioned clamp shaft makes machined object energy
Enough rotations centered by its axle center；And mobile unit (19), this mobile unit (19) makes above-mentioned holding unit (12) or mill
Cut unit (14) or grinding unit (20) either party move at least processed with this along the axis of a cylinder direction of above-mentioned machined object
The distance that the length of thing is suitable, grinding unit (14) is to make the abrasive grain layer (15a) being bonded to each other by abrasive particle be formed as disk
Shape or circular grinding body (15) are fixed on the grinding stone of rotating disk (16), and above-mentioned grinding stone is linked to rotation in the way of handling freely
Turning driving source, make above-mentioned abrasive grain layer (15a) press on above-mentioned machined object (W) and rotate, grinding unit (20) possesses and grinds
Polish-brush, and make this abrasive brush rotate, this abrasive brush is detachably kept, and has to tie up on discoid surface and join
Put the bristle material containing abrasive particle, and make this bristle material press on above-mentioned machined object and carry out the rotating disk rotated.
According to the 7th and the 8th mode, it is possible to utilize holding unit to hold machined object, utilize mobile unit to make processed
Thing moves, and utilizes grinding unit grinding thing, utilizes grinding unit to grind the machined object after being ground, and utilizes holding
The clamp shaft of unit makes machined object rotate and be ground, therefore, it is possible to remove the impurity of the skin section of machined object definitely
Deformation axial with post, and can carry out definitely removing the micro-crack of machined object and refining the grinding of surface roughness
Processing.Further, since utilize mobile unit to make grinding unit that is the grinding stone of machined object or the rotation held by holding unit
And grinding unit that is the abrasive brush rotated moves the distance suitable with the length of machined object, therefore, it is possible to machined object
Carry out the grinding throughout total length.
In the grinding of the 9th mode, attrition process system of the present invention, it is characterised in that in the 4th, the 5th, the 7th, the 8th
The grinding of either type, on the basis of attrition process system, the granularity of the abrasive particle of grinding unit corase grind cut with in for F90～
F220 (JISR6001:1998), or be #240～#500 (JISR6001:1998) in fine ginding.
According to the 9th mode, due to by the granularity of the abrasive particle of grinding unit corase grind cut with in be formed as F90～F220
(JISR6001:1998), or in fine ginding, #240～#500 (JISR6001:1998) is formed as, therefore, it is possible to efficiently
Ground carries out corase grind and cuts or fine ginding.
In the grinding of the 10th mode, attrition process system of the present invention, it is characterised in that at the mill of the 6th～the 8th mode
Cut, on the basis of attrition process system, the most as shown in figure 12, by the abrasive particle contained by the bristle material (35,36) of grinding unit
Granularity be formed as two or more.
In the grinding of the 11st mode, attrition process system of the present invention, it is characterised in that the 10th mode grinding,
On the basis of attrition process system, the granularity of abrasive particle is #240～#500 (JISR6001:1998) in rough lapping, or
Smooth grinding is #800～#1200 (JISR6001:1998).
In the grinding of the 12nd mode, attrition process system of the present invention, it is characterised in that the 10th mode grinding,
On the basis of attrition process system, the most as shown in figure 12, in grinding unit, by the bristle material of the abrasive particle containing coarse size
(36) be disposed in proximity to the part of the center of rotation of rotating disk, the bristle material (35) of the abrasive particle containing fine size is arranged in containing
Around the position that the bristle material (36) of the abrasive particle of coarse size is configured.
According to the 10th～the 12nd mode, owing to the granularity of the abrasive particle contained by the bristle material of grinding unit is formed as two kinds
Above, therefore, it is possible to machined object is carried out rough lapping with 1 lapping device and process with smooth grinding, it is possible to realize cost of equipment
Reduce.In particular it is preferred that the part of the center of rotation for the bristle material of the abrasive particle containing coarse size being disposed in proximity to rotating disk,
The bristle material of the abrasive particle containing fine size is arranged in the week of the position that the bristle material of the abrasive particle containing coarse size is configured
Enclose.And then, it is preferably as rough lapping with the granularity of the abrasive particle contained by bristle material being formed as rule in JISR6001:1998
#240～#500 of fixed micro-bits classification, is formed as with by the granularity of the abrasive particle of the fine size contained by bristle material as smooth grinding
#800～#1200 of micro-bits classification.The high grainding capacity utilizing the abrasive brush of rough lapping remove definitely be present in processed
The micro-crack of the skin section of thing, utilizes the abrasive brush refinement of smooth grinding to become the table of coarse skin section in rough lapping is processed
Surface roughness such that it is able to the crackle produced when preventing carrying out slice processing in rear operation and form wafer or gap.
In the grinding of the 13rd mode, attrition process system of the present invention, it is characterised in that appointing in the 1st or the 3rd
On the basis of the grinding of mode of meaning, attrition process system, the grinding unit of grinding attachment and the grinding unit energy of lapping device
Enough replacements, by replacing grinding unit and grinding unit, it is possible to grinding attachment is formed as lapping device, or by lapping device
Be formed as grinding attachment.
According to the 13rd mode, the grinding unit of grinding attachment can be replaced with the grinding unit of lapping device, by replacing
Grinding unit and grinding unit, it is possible to grinding attachment is formed as lapping device, or lapping device is formed as grinding attachment,
Therefore by making grinding unit common with the specification of the installation portion of grinding unit, it is possible to by the main body of grinding attachment Yu lapping device
(part in addition to grinding unit, grinding unit) is formed as same size, therefore, it is possible to reduce the manufacturing cost of apparatus main body.
In the grinding of the 14th mode, attrition process system of the present invention, it is characterised in that the 2nd mode grinding, grind
On the basis of mill system of processing, above-mentioned grinding, the above-mentioned grinding unit of lapping device can be replaced with above-mentioned grinding unit.
According to the 14th mode, by making grinding unit common with the use of the installation portion of grinding unit, it is possible to replace grinding
Unit and grinding unit.Such as in the case of shown in Figure 21, by grinding unit is changed with grinding unit, it is possible to formed and grind
Mill apparatus.It addition, by grinding unit is changed with grinding unit, it is possible to form grinding attachment.And then the most as shown in figure 23,
When for connect 1 to grinding unit and the grinding of 2 pairs of grinding units, lapping device in the case of, by by this figure left and right directions
The grinding unit of central authorities is replaced by grinding unit, can carry out attrition process after the grinding carrying out 2 stages.
In the grinding of the 15th mode, attrition process system of the present invention, in grinding, the attrition process system of the 1st mode
On the basis of, such as it is shown in figure 5, possess: move into device (3), this moves into device (3) by being added before grinding, attrition process
Work thing is moved into grinding, attrition process system；Conveyance device (4), after this conveyance device (4) will terminate grinding, attrition process
Machined object takes out of from grinding, attrition process system；And shifting apparatus (5), this shifting apparatus (5) has is moving into device
(3), move the working arm (51) of machined object between grinding attachment (1), lapping device (2), conveyance device (4) and be installed on
The front end of working arm (51) and the handle part (52) of angle that machined object is rotated to regulation.
The present invention the 16th the grinding of mode, in attrition process system, in grinding, the grinding of the 2nd or the 3rd mode
On the basis of system of processing, the most as shown in figure 22, possessing: move into device (3), this moves into device (3) by grinding, attrition process
Front machined object (W) is moved into above-mentioned grinding, attrition process system；Conveyance device (4), end is ground by this conveyance device (4)
Cut, machined object after attrition process takes out of from above-mentioned grinding, attrition process system；And shifting apparatus (5), this shifting apparatus
(5) have and above-mentioned moving into device (3), grinding, lapping device (6) or grinding attachment (1) or lapping device (2), taking out of dress
Put the working arm (51) of mobile above-mentioned machined object between (4) and be installed on the front end of this working arm (51) and added above-mentioned
Work thing rotates the handle part (52) of the angle to regulation.
According to the 15th and the 16th mode, owing to utilizing shifting apparatus to moving into device, grinding, lapping device, grinding dress
Put, lapping device, conveyance device transfer machined object, therefore standby on device do not carry out grinding, attrition process moving into
Machined object easily can be removed to conveyance device after attrition process being terminated grinding by grinding attachment and lapping device
Go out.Further, since the handle part of shifting apparatus can be utilized to make machined object rotate, therefore, it is possible to change by grinding attachment or grind
Mill apparatus processing side so that be processed.
In the grinding of the 17th mode, attrition process system of the present invention, it is characterised in that in the 1st or the 2nd mode
On the basis of grinding, attrition process system, the measuring unit being arranged at above-mentioned grinding attachment or lapping device includes: reference block,
This reference block has and separates known base interval size in the horizontal direction vertical with the axis of a cylinder of machined object and formed
A pair datum level and separate known base interval size in the vertical vertical with above-mentioned axis of a cylinder and formed a pair
Datum level；Measurement direction is set to horizontal direction, and the both sides of the datum level of the both sides of measuring basis block and machined object
Grinding, the measuring appliance of the size of space in attrition process portion；And measurement direction is set to vertical, and measuring basis block
The datum level of upper surface and the grinding of the upper surface of machined object, the measuring appliance of height and position in attrition process portion.
According to the 17th mode, owing to measuring unit has: the horizontal direction of reference block, measuring basis block and machined object
The measuring appliance of the height and position of the upper surface of the measuring appliance of size and measuring basis block and machined object, therefore can make
The axis of a cylinder of machined object and the axle center of clamp shaft are as one man held machined object by holding unit.
In the grinding of the 18th mode, attrition process system of the present invention, it is characterised in that the 17th mode grinding,
On the basis of attrition process system, control unit has a following function: make each front end of grinding unit and grinding unit with
Grinding attachment contacts, to grinding attachment and lapping device with a pair datum level of the reference block that the holding unit of lapping device is arranged
The base position that approach is zero of each unit carry out the function of calculation process；Utilize in grinding attachment and the survey of lapping device
The datum level of the both sides of the measuring appliance measuring basis block that amount unit is arranged and the difference of the processing department of the both sides of machined object, to quilt
Sectional dimension before the processing of the processing department of machining object and after processing carries out the function of calculation process；Carry out for making grinding fill
Put the function of hold machined object with lapping device calculation process with feeling relieved；And initially setting input before processing starts
Determine project and the measurement signal of the measuring appliance output of measuring unit that is respectively provided with at grinding attachment and lapping device is carried out
Calculation process, and to the function of each unit output services signal of grinding attachment and lapping device.
In the grinding of the 19th mode, grinding system of the present invention, it is characterised in that grinding, grinding in the 2nd mode add
On the basis of work system, above-mentioned control unit has following function: make each front end of above-mentioned grinding unit or above-mentioned grinding unit
A pair datum level of reference block arranged with the holding unit at above-mentioned grinding, lapping device contacts, to above-mentioned grinding unit or
The approach of above-mentioned grinding unit be zero base position carry out the function of calculation process；Utilize at above-mentioned grinding, lapping device
The measuring appliance that arranges of measuring unit measure the processing department of both sides of datum level and machined object of both sides of said reference block
Difference, the sectional dimension before the processing of the processing department of machined object and after processing is carried out the function of calculation process；Use
In making above-mentioned grinding, holding to lapping device centering the function of calculation process of above-mentioned machined object；And start in processing
The measurement signal of the initial setting item of front input and the measuring appliance output of above-mentioned measuring unit carries out calculation process, and
To above-mentioned grinding unit and the function of above-mentioned grinding unit output services signal.
According to the 18th and the 19th mode, it is provided for making grinding, attrition process system automation in a control unit
Each function, therefore, it is possible to carry out grinding and the attrition process of the processing department of machined object definitely, and realizes Labor-saving.
In the grinding of the 20th mode, attrition process system of the present invention, it is characterised in that in the 18th or the 19th mode
Grinding, on the basis of attrition process system, machined object be shaped as prism-shaped, grinding, being added of attrition process will be carried out
The tolerance settings of the sectional dimension of work thing is ± 0.5mm, by the cross section in the corner that the 2 of this machined object side surface part intersect each other
The tolerance settings of shape is ± 0.1 degree.
According to the 20th mode, such as in the silico briquette of quadrangular shape, the sectional dimension of silico briquette has 125mm × 125mm (name
Claim: 5 inches), 156mm × 156mm (title: 6 inches), 210mm × 210mm (title: 8 inches) these 3 kinds, each required
Tolerance is ± 0.5mm, and the tolerance of the cross sectional shape in the corner that 2 side surface part of the silico briquette of further requirement intersect each other is 90 degree
± 0.1 degree, therefore, it is possible to carry out tolerance based on sectional dimension and the grinding of tolerance of cross sectional shape, attrition process.
In the grinding of the 21st mode, attrition process system of the present invention, it is characterised in that in the 18th or the 19th mode
Grinding, in attrition process system, being shaped as of machined object is cylindric, will carry out the machined object of grinding, attrition process
The tolerance settings of sectional dimension is ± 0.5mm.
According to the 21st mode, such as in columned monocrystalline sapphire ingot, sectional dimension be 2～6 inches (51～
154mm), it is desirable to tolerance be ± 0.5mm, therefore, it is possible to carry out the grinding of tolerance based on sectional dimension, attrition process.
The present invention the 22nd the grinding of mode, in grinding method, it is characterised in that use the 1st～the 3rd mode
Grinding, attrition process system, after utilizing grinding attachment that machined object is carried out grinding, utilize lapping device to grind
Mill processing.
According to the mode of the 22nd, owing to using the change of machined object of pruning relative to the certain approach of machined object setting
Sectional dimension is also ground to the grinding attachment in desired tolerance and sets one relative to machined object by shape and flat form
Fixed approach as produced by pressure and the lapping device that is ground the skin section of machined object carry out grinding, grind and add
Work, therefore provides in sectional dimension and cross sectional shape can being machined to desired tolerance and can remove top layer definitely
The micro-crack in portion, refines the grinding of hard brittle material of surface roughness, grinding method.Further, since utilize in grinding
The measuring unit that device or lapping device are arranged measures the size of machined object, and by control unit, measurement result is carried out computing
And export the working signal of grinding attachment or lapping device, therefore, it is possible to carry out correct grinding based on the size measured,
Attrition process.
According to the present invention, due to use relative to the machined object of hard brittle material set certain approach prune by
The deformation of machining object and flat form and sectional dimension is ground in desired tolerance grinding attachment (when grinding,
For grinding unit in the case of lapping device), relative to machined object set certain approach as produced by pressure and right
The lapping device (when being grinding unit in the case of grinding, lapping device) that the skin section of machined object is ground grinds
Cut, attrition process, therefore, it is possible to sectional dimension and cross sectional shape be machined in desired tolerance, and remove table definitely
The micro-crack in layer portion, refines surface roughness.Thus, in operation subsequently, it is possible to reduce and wafer slice is being added product in man-hour
The incidence rate of the faulty goods that the crackle of life, gap are caused.
This application is based on the Japanese Patent Application 2011-201809 filed an application in Japan for 15th JIUYUE in 2011, in it
Hold the part forming the application as present context.
Additionally, pass through further detail below, it should the present invention can be more fully understood from.But, describe in detail with
And specific embodiment is the preferred embodiment of the present invention, it is only for the purpose that illustrates and record.This is
Because according to this detailed description, those skilled in the art understand that various change, change.
Applicant is not intended to be dedicated to any one in described embodiment the public, disclosed change, replaces
Scheme for the scope being not included in claim on literal in scheme is also under the jurisdiction of the present invention under the viewpoint of the theory of identity
A part.
In the record of this specification or claims, for noun and the use of same deictic word, as long as
The most specially illustrate or based on context relation is negated clearly, then should be construed to include odd number and plural number both sides.?
It is right that the use of the arbitrary examples of the offer in this specification or exemplary term (such as " etc. ") is the most only intended to be easy to
The present invention illustrates, as long as being the most specially recorded in claims, does not applies to limit to the scope of the present invention.
Accompanying drawing explanation
The top view of the grinding attachment that the machined object to prism-shaped that Fig. 1 is involved in the present invention is processed.
The top view of the lapping device that the machined object to prism-shaped that Fig. 2 is involved in the present invention is processed.
Fig. 3 is the top view to the grinding attachment that columned machined object is processed involved in the present invention.
Fig. 4 is the top view to the lapping device that columned machined object is processed involved in the present invention.
Fig. 5 is to represent involved in the present invention to be configured with the mill being processed prism-shaped and columned machined object
Turning device and lapping device, above-mentioned each device set the shifting apparatus of machined object, machined object move into device and
The top view of the embodiment of the 1st embodiment of conveyance device.
Fig. 6 is that the base station mounting in the work starting position of the grinding attachment and lapping device being positioned at the present invention is processed
The front view of the configuration of thing, expression holding unit and mobile unit.
Fig. 7 is the base station mounting machined object of the grinding attachment in the present invention and lapping device, represents this machined object
The side view of state that is released from of pressing utensil.
Fig. 8 is the base station mounting machined object of the grinding attachment in the present invention and lapping device, represents measuring unit
The side view of the configuration of measuring appliance.
Fig. 9 is the front view of the cup-shaped grinding stone of the grinding unit of the present invention.Fig. 9 (A) is the partial cutaway observed from front
View, Fig. 9 (B) is A-A direction view (upward view).
Figure 10 is the front view of the cup-shaped grinding stone of the grinding unit of the present invention.Figure 10 (A) is the local observed from front
Sectional view, Figure 10 (B) is A-A direction view (upward view).
Figure 11 is to arrange the bristle material of coarse size of abrasive particle and thin brush at a rotating disk of the grinding unit of the present invention
The front view of the fan-shaped abrasive brush of batt material.
Figure 12 is the upward view of Figure 11.
Figure 13 is the roll forming representing the involved in the present invention grinding unit that columned machined object carries out grinding
The axonometric chart of grinding stone.
Figure 14 is the abrasive brush of the roll forming to the grinding unit that columned machined object is ground representing the present invention
Axonometric chart.
Axonometric chart when Figure 15 is to cut off polycrystal silicon ingot with wire saw and form silico briquette (A) (B) (C).
Figure 16 is the axonometric chart of the polysilicon block (A) (B) (C) formed in fig .15.
Figure 17 is the explanatory diagram of the state cutting off monocrystal silicon from viewed in plan wire saw.
Figure 18 is the axonometric chart of the monocrystalline silico briquette formed in fig. 17.
Figure 19 is to represent that cut-out top and afterbody are formed as the axonometric chart of columned monocrystalline sapphire ingot.
Figure 20 is the explanatory diagram for illustrating the shape of crystal crystal.
Figure 21 be the present invention involved the machined object of prism-shaped is processed grinding, the vertical view of lapping device
Figure.
Figure 22 is the involved in the present invention grinding being processed columned machined object, the vertical view of lapping device
Figure.
Grinding that the machined object to prism-shaped that Figure 23 is involved in the present invention is processed, the modification of lapping device
Top view.
Figure 24 is to represent that prism-shaped and columned machined object are processed by involved in the present invention being configured with
Grinding attachment and lapping device, above-mentioned each device set the shifting apparatus of machined object, machined object move into device with
And the top view of the embodiment of the 2nd embodiment of conveyance device.
Detailed description of the invention
Hereinafter, referring to the drawings the mode of the enforcement of the present invention is illustrated.Additionally, in the various figures, to mutually the same or
The key element mark same reference numerals that person is suitable, and the repetitive description thereof will be omitted.
1st embodiment of grinding, attrition process system is illustrated.Grinding, attrition process system possess: grinding fills
Putting (1), the skin section of its machined object (W) to being made up of hard brittle material carries out grinding, removes the table of this machined object (W)
The impurity in layer portion and the axial deformation of post and sectional dimension is formed as desired size；Lapping device (2), it is to knot
The concavo-convex of skin section of the machined object (W) after Shu Shangshu grinding is ground, and removes the skin section of this machined object (W)
Micro-crack and refine surface roughness；And control unit, it is based on the initial setting item of input before processing starts
And the above-mentioned measurement signal of grinding attachment (1) and the measurement signal of above-mentioned lapping device (2) carry out calculation process, and based on
The result of this calculation process exports working signal and the working signal of lapping device (2) of above-mentioned grinding attachment (1).
Here, hard brittle material to refer to have hardness as glass, pottery, crystal, quartz etc. extremely hard but do not tolerate
The material of the relatively fragility matter of impact.
[grinding attachment]
Fig. 1 illustrates that the machined object to prism-shaped (W) involved in the present invention carries out the grinding attachment (1) of grinding.Grinding
Device (1) has: hold the holding unit (12) of machined object (W)；Side surface part (F) and corner (C) to machined object (W)
Carry out the grinding unit A (14) of grinding；Form the reference block (K) of datum level；Measure the sectional dimension of machined object (W)
Measuring unit (18)；Above-mentioned machined object (W) is also being measured list by the mobile above-mentioned holding unit (12) holding machined object (W)
The mobile unit (19) of movement between unit (18) and grinding unit A (14).
Above-mentioned mobile unit (19) makes the holding unit (12) of holding machined object (W) at measuring unit (18) and grinding list
Move between unit A (14) thus measure machined object (W) or machined object (W) is carried out grinding.But it is also possible to it is solid
Surely hold the holding unit (12) of machined object (W), make measuring unit (18) and grinding unit A (14) mobile to machined object
(W) position and then carry out the measurement to this machined object (W) and grinding.
The machined object (W) being placed in grinding attachment (1) is measured cross section by measuring unit (18) before grinding starts
Size.This machined object (W) sectional dimension less than as initial setting item in advance to control unit input processed
The size that sectional dimension after grinding allowance, lapping allowance and the grinding of thing (W), attrition process is added and obtains
In the case of, then the grinding of grinding attachment (1) is stopped by the calculation process of above-mentioned control unit.This machined object (W) energy
Enough after the gripping state of holding unit (12) is released from, return remelted operation.This melted in remelted operation is processed
Thing (W), is again cylindrically shaped shape when its raw material for example, monocrystal silicon or sapphire, is polysilicon at its raw material
When be again configured to cubic shaped.
When above-mentioned machined object (W) be shaped as prism-shaped in the case of, above-mentioned grinding attachment (1) has: with processed
The axis of a cylinder of thing (W) is in the base that this machined object (W) is loaded and can descend movement in the vertical direction by the mode of level
Platform (11)；Make the machined object (W) being placed in this base station (11) retreat along the direction orthogonal with the axis of a cylinder of this machined object (W) to move
Dynamic and this machined object (W) is positioned the pressing utensil (34) (with reference to Fig. 7) at center of above-mentioned base station (11)；And with axle center
The mode in the direction becoming the axis of a cylinder of machined object (W) holds the clamp shaft (13) at the two ends of this machined object (W).This clamp shaft
(13) machined object (W) is held.When above-mentioned base station (11) declines, machined object (W) with its axle center is by above-mentioned clamp shaft (13)
Center holds.Holding unit (12) can make as shown in Figure 6 machined object (W) " intermittent rotary " or " continuously rotate ".
Machined object (W) is referred to can carry out holding in the way of " intermittent rotary " by holding unit (12): processed
The grinding of thing (W), grinding position be shaped as plane in the case of, in order to by this machined surface in the Y-direction shown in Fig. 1, Fig. 2
Both sides carry out being positioned such that the clamp shaft (13) of the holding unit (12) holding this machined object (W) enters centered by its axle center
Row " intermittent rotary ".
To " intermittent rotary " as a example by machined surface all grindings of polysilicon block of quadrangular shape as plane, attrition process
Work illustrates with processing sequence, makes the side surface part (F) (with reference to Figure 16) of opposed the 1st group be positioned at the Y side shown in Fig. 1, Fig. 2
To both sides and be processed, the side surface part (F) of the 2nd group is processed thus terminating 4 side surface part (F) by 90-degree rotation subsequently
Processing, then rotate 45 degree of corners (C) (with reference to Figure 16) making opposed the 1st group and be positioned at the both sides of the Y-direction shown in Fig. 1, Fig. 2
And be processed, the corner (C) of the 2nd group is processed by 90-degree rotation subsequently, thus terminates grinding, attrition process.
Machined object (W) is referred to by holding unit (12) can hold in the way of " rotating continuously ": as machined object (W)
Grinding, the cross sectional shape at position of grinding is arc-shaped, such as carries out the main part (B) of columned monocrystalline sapphire ingot
In the case of grinding, attrition process, or 4 corners (C) of the monocrystalline silico briquette of quadrangular shape are carried out grinding, attrition process
In the case of, as shown in Figure 3, Figure 4, at side configuration grinding unit (20) or grinding unit (30), make this machined object of holding (W)
The rotary speed " continuously rotate " that sets with other input of clamp shaft (13), thus carry out grinding, attrition process.
It addition, the clamp shaft (13) of the holding unit (12) arranged at above-mentioned grinding attachment (1) or lapping device (2) also has
The both ends of the surface having holding machined object (W) the size of the length direction measuring this machined object (W) and then to be stored in control single
The function of unit, its measurement result is become the work letter of the displacement controlling mobile unit described later (19) after calculation process
Number.Utilize the work of above-mentioned mobile unit (19) based on this working signal, make the holding unit of the above-mentioned machined object of holding (W)
(12) clamp shaft (13) moves between measuring unit (18) and grinding unit (1) or measuring unit (18) and grinding unit (2)
Dynamic, this machined object (W) is implemented measurement and grinding or the attrition process of sectional dimension.In addition it is also possible to be configured to survey
Measure unit (18) and grinding unit (1) or measuring unit (18) and grinding unit (2) moves between clamp shaft (13).
As it is shown in figure 9, grinding unit A (14) is the abrasive grain layer A (15a) being bonded to each other by abrasive particle is fixed in disk
The grinding body (15) of shape or circular base plate (15b) is fixed on the cup-shaped grinding stone of rotating disk (16).Above-mentioned grinding unit A (14)
Link with rotary driving source in the way of handling freely via rotary shaft (17), make the side that above-mentioned abrasive grain layer A (15a) contacts with face
Formula presses on the processing department of above-mentioned machined object (W) and rotates.Additionally, base plate (15b) may not be plane, such as may be used
Being that the position of fixing above-mentioned abrasive grain layer A (15a) is formed as convex form.It addition, as shown in Figure 10, grinding unit A (14) is also
Abrasive grain layer A (15a) can be fixed on rotating disk (16).Now, abrasive grain layer A (15a) is made to be fixed on the method for rotating disk (16) permissible
It is fixed with bolt etc., it is also possible to one-body molded with rotating disk (16).
Grinding attachment (1) is preferably configured with a pair grinding unit A (14) (grinding stone), this pair grinding unit A (14) with
The mode that abrasive grain layer A (15a) contacts with the two sides of machined object (W) is opposed.Grinding unit A (14) is detachably arranged
In grinding attachment (1).
Grinding attachment (1) has measurement and forms a pair benchmark respectively along the horizontal direction vertical with axis of a cylinder and vertical direction
The measuring unit (18) of the sectional dimension of the sectional dimension of the reference block in face and machined object (W).Grinding attachment (1) has to be made
Either party of above-mentioned holding unit (12) and grinding unit A (14) move along the axis of a cylinder direction of machined object (W) at least with quilt
The mobile unit (19) of the distance that the length of machining object (W) is suitable.
Grinding attachment (1), has grinding stone as grinding unit A (14), and this grinding stone makes abrasive particle each other on discoid surface
In conjunction with and be integrally formed abrasive grain layer A (15a), and make this abrasive grain layer A (15a) by face contact in the way of press on above-mentioned machined object
(W) processing department and rotate, therefore, it is possible to carry out grinding with certain approach.
Fig. 3 illustrates the involved in the present invention grinding attachment (1) that columned machined object (W) carries out grinding.Grinding
Device (1) has: hold the holding unit (12) of machined object (W)；The main part (B) of machined object (W) is carried out grinding add
The grinding unit B (24) of work；Form the reference block (K) of datum level；The measurement that the sectional dimension of machined object (W) is measured
Unit (18)；And move the above-mentioned holding unit (12) of holding machined object (W) so that above-mentioned machined object (W) is being measured
The mobile unit (19) of movement between unit (18) and grinding unit B (24).
Above-mentioned transfer unit (19) is same as described above, can be fixed by the holding unit (12) holding machined object (W), make
Measuring unit (18) moves in the position of machined object (W) with grinding unit B (24), thus surveys this machined object (W)
Amount and grinding.
In the case of machined object (W) is columned, the holding unit (12) of grinding attachment (1) is by machined object (W)
Hold in the mode that " can rotate continuously " centered by its axle center.
It addition, as shown in figure 13, grinding unit B (24) uses and is combined into cylindric body surfaces each other by abrasive particle
Abrasive grain layer B (25) be fixed on the grinding stone of roll forming on surface of the rotating cylinder (26) with rotary shaft (27).At above-mentioned grinding list
In unit B (24), it is in the above-mentioned rotary shaft (27) in axle center of above-mentioned rotating cylinder (26) by detachably with rotary driving source even
Knot, make above-mentioned abrasive grain layer B (25) by with the axis parallel and linear contact lay of this machined object (W) in the way of press on above-mentioned processed
The processing department of thing (W) also rotates.Further, it is also possible to use the cup-shaped grinding stone that price is cheaper than the grinding stone of roll forming.
Make above-mentioned abrasive grain layer B (25) at the both sides of machined object (W) and its axle it addition, grinding attachment (1) preferably has
The heart is parallel and opposed pairs grinding unit B (24) (grinding stone).Grinding unit B (24) is detachably arranged at grinding dress
Put (1).
By the grinding unit A (14) and grinding unit B (24) of above-mentioned grinding attachment (1) are formed as having rigidity
Grinding stone so that overall dimensions is also ground in desired tolerance by the deformation of its machined object of pruning (W) etc. and flat form
Ability become excellent.Therefore, can carry out definitely prism-shaped and columned machined object (W) skin section impurity with
The removing of shape deformation.
It addition, for the grinding unit A (14) of above-mentioned grinding attachment (1) and the grinding stone of grinding unit B (24), can be by
The granularity of the abrasive particle constituting its abrasive grain layer A (15a) and abrasive grain layer B (25) is formed as a kind or two or more, and will be above-mentioned
The bristle material A (21) and bristle material B (31) of the grinding unit A (20) and grinding unit B (30) of lapping device (2) is solid
The granularity of fixed abrasive particle is formed as two or more.
Can also be by the above-mentioned grinding unit A (14) being made up of grinding stone of grinding attachment (1) or grinding unit B (24)
The granularity of abrasive particle corase grind cut with in be formed as F90～F220 (JISR6001:1998), fine ginding is formed as #240
～#500 (JISR6001:1998), and by the above-mentioned grinding unit A (20) being made up of abrasive brush of lapping device (2) or grind
The granularity of the abrasive particle of mill unit B (30) is formed as #240～#500 (JISR6001:1998) in rough lapping, uses at smooth grinding
In be formed as #800～#1200 (JISR6001:1998).
Why the granularity of grinding unit A (14) or the abrasive particle of grinding unit B (24) is set as JISR6001:1998
F90～F220 of the thick bits classification of defined and #240～#500 these 2 groups of micro-bits classification is because of following reason.When in front work
The situation that the perpendicularity in the sectional dimension of the machined object (W) cut off in sequence or the corner (C) of machined object (W) is in outside tolerance
Under, for making its sectional dimension or cross sectional shape fall in tolerance, carry out the coarse grain classification of F90～F220, in order to improve cutting effect
Rate and then carry out grinding.For easily producing the position (polysilicon block of be referred to as the bursting apart crackle of (tipping), gap
Corner etc.) grinding, be preferably selected use #240～#500 micro-bits classification, so as to prevent above-mentioned burst apart send out
Give birth to and carry out grinding.
[lapping device]
Fig. 2 illustrates the lapping device (2) that the machined object to prism-shaped (W) involved in the present invention is ground.Grind
Device (2) has: hold the holding unit (12) of the machined object (W) terminating above-mentioned grinding；To above-mentioned machined object (W)
Side surface part (F) and corner (C) be ground processing and remove micro-crack and refine the grinding unit A of surface roughness
(20)；Form the reference block (K) of datum level；The measuring unit (18) that the sectional dimension of machined object (W) is measured；Mobile
Hold the above-mentioned holding unit (12) of machined object (W) so that above-mentioned machined object (W) is single with grinding in measuring unit (18)
The mobile unit (19) of movement between unit A (20).
Above-mentioned mobile unit (19) is identical with the mobile unit of above-mentioned grinding attachment (1) (19), can fix holding and be added
The holding unit (12) of work thing (W), makes the mobile position to machined object (W) of measuring unit (18) and grinding unit A (20) enter
And this machined object (W) is measured and grinding.
Above-mentioned lapping device (2) has: to this machined object (W) in the way of the axis of a cylinder of machined object (W) is in level
Carry out loading and can descending in the vertical direction the base station (11) of movement；Make to be placed in machined object (W) edge of this base station (11)
Retreat mobile and this machined object (W) be positioned above-mentioned base station (11) in the direction orthogonal with the axis of a cylinder of this machined object (W)
The pressing utensil (34) at center；And hold this machined object in the way of the direction of the axis of a cylinder becoming machined object (W) by axle center
(W) clamp shaft (13) at two ends.This clamp shaft (13) holds machined object (W).When above-mentioned base station (11) declines, above-mentioned folder
Machined object (W) is held centered by its axle center by mandrel (13).Holding unit (12) by machined object (W) with can " intermittently
Rotate " or the mode of " continuously rotate " hold.
Machined object (W) is referred to by holding unit (12) can hold in the way of " intermittent rotary ": as machined object (W)
Grinding, grinding position be shaped as plane in the case of, in order to by its machined surface in two of the Y-direction shown in Fig. 1, Fig. 2
Side positions, and makes the clamp shaft (13) of the holding unit (12) of this machined object of holding (W) carry out " interval rotation centered by its axle center
Turn ".
To " intermittent rotary " as a example by machined surface all grindings of polysilicon block of quadrangular shape as plane, attrition process
Work illustrates with processing sequence, makes the side surface part (F) (with reference to Figure 16) of opposed the 1st group be positioned at the Y side shown in Fig. 1, Fig. 2
To both sides and be processed, the side surface part (F) of the 2nd group is processed by 90-degree rotation subsequently, thus terminates 4 side surface part
(F) processing, then rotate 45 degree of corners (C) (with reference to Figure 16) making opposed the 1st group and be positioned at the Y-direction shown in Fig. 1, Fig. 2
Both sides are also processed, and 90-degree rotation rotates and is processed the corner (C) of the 2nd group subsequently, thus terminate grinding, grind and add
Work.
Machined object (W) is referred to by holding unit (12) can hold in the way of " rotating continuously ": as machined object (W)
Grinding, the cross sectional shape at position of grinding is arc-shaped, such as carries out the main part (B) of columned monocrystalline sapphire ingot
In the case of grinding, attrition process, or 4 corners (C) of the monocrystalline silico briquette of quadrangular shape are carried out grinding, attrition process
In the case of, as shown in Figure 3, Figure 4, at side configuration grinding unit (20) or grinding unit (30), make this machined object of holding (W)
The rotary speed " continuously rotate " that sets with other input of clamp shaft (13), thus carry out grinding, attrition process.
It addition, the clamp shaft (13) of the holding unit (12) arranged at above-mentioned grinding attachment (1) or lapping device (2) also has
The both ends of the surface having holding machined object (W) the size of the length direction measuring this machined object (W) and then to be stored in control single
The function of unit, its measurement result is become the work letter of the displacement controlling mobile unit described later (19) after calculation process
Number.Utilize the work of above-mentioned mobile unit (19) based on this working signal, make the holding unit of the above-mentioned machined object of holding (W)
(12) clamp shaft (13) is between measuring unit (18) and grinding unit (1) or measuring unit (18) and grinding unit (2)
Mobile, this machined object (W) is implemented measurement and grinding or the attrition process of sectional dimension.In addition it is also possible to be configured to
Measuring unit (18) and grinding unit (1) or measuring unit (18) and grinding unit (2) move between clamp shaft (13).
As shown in figs. 11 and 12, grinding unit A (20) is abrasive brush, and this abrasive brush has rotating disk (22) and links
In rotary driving source and be used for the rotary shaft (23) making this rotating disk (22) rotate, and tie up configuration on discoid surface and contain
The bristle material A (21) of abrasive particle.Above-mentioned grinding unit A (20) links with rotary driving source in the way of handling freely, and makes
The tippy tea portion stating bristle material A (21) presses on the processing department of above-mentioned machined object (W) in the way of the contact of face and rotates.
As the abrasive brush used in grinding unit A (14), there is following fan-shaped abrasive brush, it is tied up and is mixed with mill
Grain bristle material A (21) and can load and unload relative to rotating disk (22), only need to change bristle when this bristle material A (21) exhausts
Materials A (21) just may be used.Alternatively, it is also possible to use bristle material is fixedly installed in rotating disk and when bristle material exhausts and rotating disk
The cup-shaped abrasive brush that one is changed.Use sector in the present embodiment.
Lapping device (2) preferably has a pair grinding unit A (20) (abrasive brush), this pair grinding unit A (20) with
The tippy tea portion of above-mentioned bristle material A (21) is opposed with the mode that the two sides of machined object (W) contact.Grinding unit A (20) quilt
Detachably it is arranged at lapping device (2).
Furthermore it is possible to the abrasive particle of the bristle material A (21) of the grinding unit A (20) of above-mentioned lapping device (2) will be fixed on
Granularity be formed as two or more, the bristle material A (35) of the coarse size of this abrasive particle is configured at the rotation close to rotating disk (22)
The inner ring portion at center, and the bristle material A (36) of the fine size of above-mentioned abrasive particle is disposed substantially away from the rotation of rotating disk (22)
The outer ring portion of the heart.
In the grinding unit A (20) of lapping device (2), the granularity of fixing abrasive particle is formed as such as to remove fine fisssure
For the purpose of stricture of vagina rough lapping with and for the purpose of refining its surface roughness smooth grinding both, on the other hand, grind conventional
In mill apparatus, need to be divided into rough lapping device and the device of smooth grinding to arrange 2 table apparatus.As the quilt to prism-shaped
The abrasive brush that machining object (W) is ground, it is provided that there is by an abrasive brush rough lapping and use and two of smooth grinding
The grinding unit A (20) of function, adds therefore, it is possible to the machined object (W) of prism-shaped is carried out rough lapping with 1 lapping device (2)
Work and smooth grinding processing, it is possible to realize the minimizing of cost of equipment.
Lapping device (2) has measurement and forms a pair base in the horizontal direction vertical with axis of a cylinder and vertical direction respectively
The measuring unit (18) of the sectional dimension of the sectional dimension of the reference block in quasi-face and machined object (W).Lapping device (2) has
Make either party of above-mentioned holding unit (12) and grinding unit A (20) move along the axis of a cylinder direction of machined object (W) at least with
The mobile unit (19) of the distance that the length of machined object (W) is suitable.
Lapping device (2) is tied up the configuration bristle material A (21) containing abrasive particle and makes the tippy tea portion of this bristle material A (21)
In the way of the contact of face, press on the processing department of machined object (W) and rotate, therefore, it is possible to produced by pressure with certain
Raw approach is ground.
Fig. 4 illustrates the involved in the present invention lapping device (2) being ground columned machined object (W).Grind
Device (2) has: hold the holding unit (12) of the machined object (W) finishing above-mentioned grinding；To this machined object (W)
Main part (B) be ground processing and remove micro-crack and refine the grinding unit B (30) of surface roughness；Form datum level
Reference block (K)；The measuring unit (18) that the sectional dimension of machined object (W) is measured；Mobile holding machined object (W)
Above-mentioned holding unit (12) and make above-mentioned machined object (W) movement between measuring unit (18) and grinding unit B (30)
Mobile unit (19).
Above-mentioned transfer unit (19) is same as described above can also fix the holding unit (12) holding machined object (W), makes
Measuring unit (18) position to machined object (W) mobile with grinding unit B (30), thus this machined object (W) is surveyed
Amount and grinding.
It addition, in the case of machined object (W) is columned, the holding unit (12) of lapping device (2) is by processed
Thing (W) holds as " rotating continuously " centered by its axle center.
It addition, the holding unit (12) of above-mentioned lapping device (2) is identical with the holding unit of grinding attachment (1) (12), will
Machined object (W) holds as " rotating continuously " centered by its axle center.
It addition, as shown in figure 14, grinding unit B (30) uses the cylindrical shape at the rotating cylinder (32) with rotary shaft (33)
The surface configuration of main body contain the abrasive brush of roll forming of bristle material B (31) of abrasive particle.By grinding unit B (30) is formed
Abrasive brush for roll forming, it is possible to increase grinding efficiency (shortening milling time).In above-mentioned grinding unit B (30), it is in above-mentioned
The above-mentioned rotary shaft (33) in the axle center of rotating cylinder (32) is detachably linked with rotary driving source, makes above-mentioned bristle material B
(31) tippy tea portion is to press on above-mentioned machined object (W) in the way of the axis parallel and linear contact lay of this machined object (W)
Processing department also rotates.Further, it is also possible to use the sector or cup-shaped abrasive brush that price is cheaper than the abrasive brush of roll forming.
Lapping device (2) contains the bristle material B (31), this bristle material B of abrasive particle in cylindric body surfaces configuration
(31) tippy tea portion is relative to processing department and its axis parallel ground face contact of above-mentioned machined object (W) and rotates, because of
This can be ground with certain approach as produced by pressure.
By the grinding unit A (20) and grinding unit B (30) of above-mentioned lapping device (2) are formed as abrasive brush, from
And there is following ability: when attrition process, the tippy tea portion periphery of above-mentioned bristle material A (21) or bristle material B (31) is with quilt
The state contacts of the machined surface pressing on machined object (W) rotates, and the skin section of machined object (W) is ground several 10 μm～100 μ
About m.Therefore, it is possible to carry out definitely removing prism-shaped and the micro-crack of columned machined object (W) and refining surface
The attrition process of roughness.
Furthermore it is also possible to the mill of the bristle material B (31) of the grinding unit B (30) of above-mentioned lapping device (2) will be fixed on
The granularity of grain is formed as two or more, and the bristle material B (37) of the coarse size of this abrasive particle is arranged in the beginning of rotating cylinder (32)
With the side of machined object (W) face contact, and the bristle material B (38) of the fine size of above-mentioned abrasive particle is arranged in rotating cylinder
(32) side that end separates with machined object (W) face contact.
In the abrasive brush to the roll forming that columned machined object (W) is ground, it is provided that by a grinding
Brushing tool have rough lapping with and the grinding unit B (30) of smooth grinding the two function, therefore, it is possible to 1 lapping device (2)
Columned machined object (W) is carried out rough lapping processing and smooth grinding processing, it is possible to realize the minimizing of cost of equipment.
It addition, why using the granularity of above-mentioned grinding unit A (20) or the abrasive particle of grinding unit B (30) as rough lapping
Abrasive brush be set as #240～#500 of thick bits classification of JISR6001:1998 defined and grinding as smooth grinding
Polish-brush is set as that #800～the #1200 both of micro-bits classification is because of following reason.Utilize the abrasive brush of above-mentioned rough lapping
High grainding capacity removes the micro-crack of the skin section being present in machined object (W) definitely.Grinding by above-mentioned smooth grinding
Brush the surface roughness to becoming coarse skin section because of rough lapping processing to refine, carry out in rear operation to eliminate
Slice processing and the crackle that produces when forming wafer or gap, the abrasive brush preferably by smooth grinding is ground processing.
It addition, by make relative to grinding attachment (1) and lapping device (2) load and unload grinding unit A (14) freely with
And grinding unit A (20) or grinding unit B (24) and grinding unit B (30), the specification of installation portion common, it is possible to by above-mentioned
Grinding attachment (1) main body and lapping device (2) main body are formed as identical specification, therefore, it is possible to the manufacture of cutting device main body
Cost.
[based on grinding, the processing of attrition process system]
Fig. 5 is to represent 1 shown in 1 lapping device (2), Fig. 3 shown in 3 shown in Fig. 1 grinding attachment (1), Fig. 2
1 lapping device (2) shown in grinding attachment (1), Fig. 4, unprocessed machined object (W) move into device (3), processing after
The conveyance device (4) of machined object (W), have and above-mentioned moving into device (3), grinding attachment (1), lapping device (2), taking out of dress
The working arm (51) putting rotary work between each device of (4) and the front end being installed on this working arm (51) and hold machined object
(W) the configuration figure of the configuration of the shifting apparatus (5) of handle part (52).Not shown control unit has: before starting with processing
Input complete initial setting item and send from the measuring unit (18) arranged at grinding attachment (1), lapping device (2)
Measure and carry out calculation process based on signal and to this grinding attachment (1), each unit output services signal of lapping device (2)
The function of the holding work of function, the rotary work controlling above-mentioned shifting apparatus (5) and holding machined object (W).On it addition,
State control unit can also have control this shifting apparatus (5) move into device (3), grinding attachment (1), lapping device above-mentioned
(2), the function of the order of rotary work between conveyance device (4).
So constitute, then move into device (3), grinding attachment (1), lapping device based on the court pre-entered to control unit
(2), the rotary work of conveyance device (4) order, the handle part (62) of shifting apparatus (5) can hold machined object (W) and make work
Make arm (51) and carry out rotary work.Therefore, the upper standby not yet grinding of device (3), the machined object (W) of attrition process are being moved into
Can terminate the grinding that carried out by grinding attachment (1) and lapping device (2) and attrition process and fully automatically to taking out of dress
Put (4) to take out of.
It addition, the handle part (52) of shifting apparatus (5) can rotate the angle to regulation, therefore without to prism-shaped
The clamp shaft (13) of the holding unit (12) of the grinding attachment (1) that machined object (W) is processed and lapping device (2) is arranged
The rotating mechanism of " intermittent rotary ", it is also possible to made machined object (W) carry out " intermittent rotary " by handle part (52).
[grinding, attrition process]
In the control unit described in above-mentioned 1st mode, the example of the initial setting item of input before starting as processing
Son is containing following project.
1. the known base interval size formed by a pair 2 datum levels of reference block described later (K)
2. the kind of machined object (W) and shape information (the rib number of prism or cylinder) thereof
3. the grinding allowance of the skin section of machined object (W) and lapping allowance
4. the final sectional dimension after the grinding of machined object (W), attrition process and tolerance thereof
5. in the case of the machined object (W) of prism-shaped is processed, (described later) grinding of grinding attachment (1)
The overall dimensions of (described later) grinding unit A (20) of unit A (14) and lapping device (2), the granularity of abrasive particle, rotary speed with
And make the holding unit (12) of grinding attachment (1) and the holding unit (12) of grinding unit A (14) and lapping device (2) and grinding
Either party of unit A (20) is by the translational speed of (described later) mobile unit (19) movement
6. in the case of columned machined object (W) is processed, (described later) grinding of grinding attachment (1)
The overall dimensions of (described later) grinding unit B (30) of unit B (24) and lapping device (2), the granularity of abrasive particle, rotary speed with
And make the holding unit (12) of grinding attachment (1) and the holding unit (12) of grinding unit B (24) and lapping device (2) and grinding
Either party of unit B (30) is by the translational speed of mobile unit (19) movement
7. when the corner being shaped as monocrystalline silico briquette or the main part of monocrystalline sapphire ingot of the processing department to machined object (W)
Etc, arc-shaped or columned machined object (W) be processed in the case of required grinding attachment (1) and lapping device
(2) rotary speed of holding unit (12)
The translational speed of the machined object (W) in above-mentioned grinding and attrition process needs to be set in not remain grinding
Cutter trade or the scope of attrition process vestige, when being prism-shaped, such as polysilicon block side surface part to machined object (W)
(F), when the side surface part (F) with corner (C) and monocrystalline silico briquette is processed, it was set as 10～40mm/ seconds, when to machined object (W)
When being processed for the corner (C) of columned, the main part (B) of such as monocrystalline sapphire ingot and above-mentioned monocrystalline silico briquette (W), if
It is set to the 10mm/ second below.
The setting of above-mentioned translational speed and grinding, the granularity of abrasive particle of attrition process, approach, the setting bar of rotary speed
Part is relevant, if the granularity of such as abrasive particle is thick, then needs to be set to the slow region of above-mentioned scope, if the granularity of abrasive particle
Tiny, then need to be set to the fast region of above-mentioned scope.
Owing to having relative to machined object (W) at the grinding unit A (14) of above-mentioned grinding attachment (1) or grinding unit
B (24) sets certain approach and to the deformation of machined object of pruning (W) and flat form and is ground to be wished by sectional dimension
Function in the tolerance hoped, and or grind at the grinding unit A (20) of above-mentioned lapping device (2) relative to machined object (W)
Unit B (30) sets, by certain approach by pressure generation, the skin section of above-mentioned machined object (W) is ground to several 10 μ
The function of about m～100 μm, therefore, it is possible to be machined to sectional dimension and cross sectional shape in desired tolerance, it is possible to definite
Ground removes the micro-crack of skin section, and refines surface roughness.
It addition, before grinding starts, the measuring unit (18) of grinding attachment (1) sectional dimension measured is by controlling list
Unit carries out calculation process, when the grinding less than the machined object (W) inputted to control unit in advance as initial setting item
In the case of the total size of the final sectional dimension after allowance and lapping allowance and grinding, attrition process, it is impossible to
Carry out grinding and/or attrition process, therefore can stop the grinding of grinding attachment (1) and by this machined object
(W) it is positioned on base station (11) by holding unit (12).
Have ceased the machined object (W) rotation by the working arm (51) of above-mentioned shifting apparatus (5) of grinding, attrition process
Turn, work and held by handle part (52), be back to not shown remelted operation.
The measuring unit (18) arranged at above-mentioned grinding attachment (1) or lapping device (2) clamping in holding unit (12)
One side of axle (13) has reference block (K), and this benchmark fast (K) separates known base interval size and formed and machined object (W)
A pair datum level of the parallel level of axis of a cylinder and a pair datum level vertical with the axis of a cylinder of machined object (W).Measuring unit
(18) also have: be set to the direction orthogonal with the axis of a cylinder direction of machined object (W) by measuring direction, measure said reference block (K)
Vertical datum level and the vertical grinding of machined object (W), the survey of the size of space (sectional dimension) in attrition process portion
Measuring device tool A (18A)；It is set to the vertical direction orthogonal with above-mentioned measuring appliance A (18A) by measuring direction, measures said reference block
(K) datum level of upper surface and the grinding of upper surface of machined object (W), the measuring device of height and position in attrition process portion
Tool B (18B).
Use said structure, measuring unit (18) measure as follows.
<1>for the sectional dimension of (using vertical datum level) reference block (K) of the horizontal direction vertical with axis of a cylinder
Measuring, starting previous crops in processing is that base interval size is pre-entered to control unit by initial setting item.By above-mentioned measurement
Carry out actual measurement between the utensil A (18A) datum level to this reference block (K) and send to control unit.Measure signal by computing
Processing, setting measurement utensil A (18A) is for the measurement signal of the reference dimension (sectional dimension) of said reference block (K).
<2>for the measurement of sectional dimension of machined object (W), by measuring appliance A (18A) actual measure above-mentioned processed
This measurement signal is also sent by actual size between the sectional dimension of thing (W) that is the processing department of the horizontal direction vertical with axis of a cylinder
To control unit.The reference dimension measuring the signal measuring appliance A (18A) to set in above-mentioned<1>of this machined object (W)
Measurement signal based on by calculation process such that it is able to measure the actual size in cross section of machined object (W).
<3>for grinding unit A (14) or grinding unit B (24) and grinding unit A (20) or grinding unit B
(30) approach is the setting of the base position of " zero ", makes above-mentioned grinding unit A (14) or grinding unit B (24) and grinds
Mill unit A (20) or the leading section of grinding unit B (30) contact, by the letter of this contact position with the datum level of reference block (K)
Number send to control unit.Above-mentioned grinding unit A (14) or grinding unit B (24) and grinding unit A (20) or grind
The base position that approach is " zero " of unit B (30) is stored in control unit after calculation process.
<4>for grinding unit A (14) or grinding unit B (24) and grinding unit A (20) or grinding unit B
(30) setting of approach, above-mentioned<1><2><3>are automatically measured and automatically set, and are somebody's turn to do the calculation process of<1><2><3>
Result is initial setting item by cross section after the grinding, attrition process of control unit input in advance to start previous crops in processing
A size of basis, by further calculation process, thus grinding unit A (14) or grinding unit B (24) and grinding unit A
Or the approach of grinding unit B (30) is automatically set (20).
Wherein, " approach " refers to: ignore the especially feeding of the deformation of the unit of work in-process deformation as abrasive brush
Amount, it is distinguished with actual " chipping allowance " carrying out grinding or grinding and uses.
It addition, measure signal for the initial setting item inputted to control unit, from what measuring unit (18) sent
Calculation process and utilize the work that this calculation process sends to grinding attachment (1) or lapping device (2) from above-mentioned control unit
Signal remarks additionally.
In above-mentioned initial setting item by the kind of machined object (W) and shape information thereof (the rib number of prism or
Cylinder) working signal that determines such as exists the clamp shaft (13) of the holding machined object (W) determining holding unit (12)
" intermittent rotary " or " continuously rotate " working signal.Exist and send to following each unit from control unit and make each unit work
The signal made, it may be assumed that
Constitute the base station (11) of grinding attachment (1), holding unit (12), grinding unit A (14) or grinding unit B
(24), measuring unit (18), mobile unit (19) or
Constitute lapping device (2) base station (11), holding unit (12), grinding unit A (20) or grinding unit B (30),
Measuring unit (18), mobile unit (19).
And then, exist based on the calculation process measuring relevant above-mentioned<1><2><3><4>to measuring unit (18), enter
The modulation of the overall dimensions after the grinding of row machined object (W), attrition process removes and the tune of surface roughness with micro-crack
Whole working signal.
It addition, the base of the horizontal direction vertical with axis of a cylinder based on the reference block (K) measured by measuring appliance A (18A)
The both sides in quasi-face and the direction (Y-direction Fig. 1～Fig. 4, Fig. 7, Fig. 8 shown in) orthogonal with the axis of a cylinder direction of machined object (W)
The size of space (sectional dimension) of processing department, above-mentioned pressing utensil (34) along above-mentioned machined object (W) both sides (Fig. 1～Fig. 4,
Y-direction shown in Fig. 7, Fig. 8) retreat and move such that it is able to above-mentioned machined object (W) is positioned Fig. 1～the figure of base station (11)
4, the center of the Y-direction shown in Fig. 7, Fig. 8.Upper surface based on the reference block (K) measured by measuring appliance B (18B)
Datum level and the height and position of vertical direction (Z-direction shown in Fig. 6 and Fig. 8) of processing department of machined object (W), on
State base station (11) to move up and down such that it is able to the axis of a cylinder heart of above-mentioned machined object (W) is set in grinding unit A (14) or grinds
Grind the center of the Z-direction (with reference to Fig. 6 and Fig. 8) of unit A (20), grinding unit B (24) or grinding unit B (30).
Carry out being placed in the horizontal direction orthogonal with axis of a cylinder direction (Fig. 1～Fig. 4, the figure of the machined object (W) of base station (11)
7, the Y-direction shown in Fig. 8) and the centering of vertical direction (Z-direction shown in Fig. 6 and Fig. 8), thus the folder of holding unit (12)
Mandrel (13) can hold the center of the both ends of the surface of machined object (W) definitely.Therefore, when wanting grinding, attrition process
Being shaped as of machined object (W) cylindric (situation of monocrystalline sapphire ingot) or the situation of arc-shaped (corner of monocrystalline silico briquette)
Under, can make the clamp shaft (13) of holding unit (12) carry out centered by its axle center " intermittent rotary " or " continuously rotate ", from
And be processed definitely.
In the mensuration mode of the measuring appliance A (18A) and measuring appliance B (18B) of above-mentioned measuring unit (18), permissible
Use directly contact, with the position of measurement, the contact measured and lase measures contactless in
Any of which.
It addition, above-mentioned control unit is preferably provided with following function.That is,
1. make that grinding unit A (14) and grinding unit A (20) or grinding unit B (14) and grinding unit B's (30) is each
The datum level of vertical both sides of the reference block (K) that front end in contact is arranged at the holding unit of grinding attachment and lapping device, right
The base position that approach is " zero " of each unit of above-mentioned grinding attachment and lapping device carries out the function of calculation process
2. the measuring appliance A (18A) utilizing the measuring unit setting at grinding attachment and lapping device measures said reference
The difference of the processing department of the both sides of the datum level of the vertical both sides of block (K) and machined object (W), and then to machined object (W)
Sectional dimension before the processing of processing department and after processing carries out the function of calculation process
3. the base station (11) utilizing pressing utensil (34) will be placed at grinding attachment (1) and lapping device (2) to arrange
Machined object (W) carries out pressing from its level two direction and is positioned the horizontal direction orthogonal with the axis of a cylinder of this machined object (W)
Center, followed by the measurement of the measuring unit (18) being respectively provided with at above-mentioned grinding attachment (1) and lapping device (2)
The measurement that utensil B (18B) is carried out, adjusts the upper-lower position of above-mentioned base station (11), carries out making at above-mentioned grinding attachment (1) and grinding
The clamping of the both ends of the surface of the machined object (W) that the clamp shaft (13) of the holding unit (12) that mill apparatus (2) is respectively provided with is held
The function of the calculation process of the centering that position is consistent with the axle center of above-mentioned machined object (W)
4. utilize the above-mentioned initial setting item of input before processing starts and at grinding attachment (1) and lapping device (2)
The measurement signal that the measuring appliance A (18A) and measuring appliance B (18B) of the measuring unit (18) being respectively provided with export is transported
Calculation processes, to the function of each unit output services signal of above-mentioned grinding attachment (1) and lapping device (2)
Owing to being provided with each merit for making the grinding of hard brittle material, attrition process system automation in control unit
Can, therefore, it is possible to the processing department to machined object (W) carries out grinding and attrition process definitely, and it is capable of laborsaving
Change.
It is further preferred to the tolerance of the sectional dimension of the machined object (W) of the prism-shaped carrying out grinding, attrition process is formed
For ± 0.5mm, the tolerance of the cross sectional shape in the corner (C) 2 side surface part (F) of this machined object (W) intersected each other is formed
For ± 0.1 degree.
Such as, there is 125mm × 125mm (title: 5 English in the sectional dimension of the silico briquette of the quadrangular shape before processing starts
Very little), 156mm × 156mm (title: 6 inches), 210mm × 210mm (title: 8 inches) these three kind.The tolerance required is
± 0.5mm, and then the tolerance of the cross sectional shape in corner (C) that 2 side surface part (F) of silico briquette (W) required intersect each other is 90
Spend ± 0.1 degree.Therefore, it is possible to the tolerance of tolerance based on sectional dimension and cross sectional shape carries out grinding definitely, grinding adds
Work.
It is further preferred to the tolerance of the sectional dimension of the columned machined object (W) carrying out grinding, attrition process is formed
For ± 0.5mm.
Such as, processing start before columned monocrystalline sapphire ingot a diameter of 2～6 inches of sectional dimension (51～
154mm).The tolerance required is ± 0.5mm.Therefore, it is possible to tolerance based on sectional dimension carries out grinding definitely, grinding adds
Work.
Use the grinding of explanation so far, attrition process system, after being carried out grinding by grinding unit A (14),
Utilize above-mentioned grinding unit A (20) to be ground processing, thus carry out the grinding of hard brittle material, attrition process.
Or, after being carried out grinding by grinding unit B (24), above-mentioned grinding unit B (30) it is ground processing.
The grinding unit A (14) or grinding unit B (24) of grinding attachment, using by the granularity of abrasive particle is F90～F220
(JISR6001:1998) grinding stone that the corase grind constituted is cut and be #240～#500 (JISR6001:1998) by the granularity of abrasive particle
The grinding stone of the fine ginding constituted, the grinding unit A (20) or grinding unit B (30) of lapping device have by the granularity of abrasive particle
The abrasive brush of the rough lapping constituted for #240～#500 (JISR6001:1998) and be #800～#1200 by the granularity of abrasive particle
(JISR6001:1998) abrasive brush of the smooth grinding constituted, it is possible to use grinding unit A (14) or grinding unit B (24)
Chipping allowance is formed as 20 μm～700 μm, and surface roughness is formed as Ry2.0～10.0 μm (JISB0601:1994), subsequently
Utilizing grinding unit A (20) or grinding unit B (30) that chipping allowance is formed as more than 75 μm, surface roughness is formed as
Ry1.1 μm (JISB0601:1994) below, thus carries out grinding, attrition process.
It addition, form the machined object (W) of the prism-shaped as grinding, the side surface part (F) in attrition process portion and corner (C)
Manufacturing procedure can carry out according to following random order.
1. the grinding of side surface part (F), the grinding of corner (C), the rough lapping processing of side surface part (F), side surface part
(F) smooth grinding processing,
2. the grinding of side surface part (F), the rough lapping processing of side surface part (F), the smooth grinding processing of side surface part (F), angle
The grinding in portion (C),
3. the thick grinding of side surface part (F), the fine ginding processing of side surface part (F), the grinding of corner (C), side
The rough lapping processing in portion (F), the smooth grinding processing of side surface part (F)
It addition, by grinding, attrition process portion be shaped as adding of machined object (W) that columned main part (B) formed
Work operation can be carried out according to following random order.
1. grinding, rough lapping processing, smooth grinding processing,
2. thick grinding, fine ginding processing, rough lapping processing, smooth grinding processing
In not shown control unit after initial setting item set as above, connect processing and start switch, start
Carry out cutting, attrition process.The machined object (W) being transported to move on device (3) is by the holding of the shifting apparatus (5) rotated
Portion (52) holds.As shown in Figure 6, machined object (W) is arranged on the base station (11) of the grinding attachment (1) being initially processed
On.The upper surface of machined object (W) is measured by measuring unit (18), so that the upright position of the axis of a cylinder of machined object (W) and handle
The mode that the upright position in the axle center holding the clamp shaft (13) of unit (12) is consistent is vertically moved by base station (11).Such as Fig. 7
Shown in, pressing utensil (14) is advanced respectively from the both sides (Y-direction) of horizontal direction and positions machined object (W) at its center.Connect
Getting off, a side of the clamp shaft (13) of holding unit (12) advances along the X-direction shown in Fig. 1, thus by this clamp shaft (13)
(13) hold.Base station (11) is made a concession downwards.
Holding unit (12) shown in Fig. 6 is moved to grinding unit A (14) (14) by the work of mobile unit (19)
Between.The front end of the abrasive grain layer A (15a) of grinding unit A (14) (14) be arranged at this holding unit (12) reference block (K) hang down
Nogata to datum level contact, the base position that approach is " zero " of the abrasive grain layer A (15a) of this grinding unit A (14) is deposited
It is stored in control unit.
Above, machined object (W) the machined object that kind is prism-shaped (W) (such as polycrystalline or monocrystalline silico briquette) or
Person is all to carry out identical action, below with polysilicon in the case of columned machined object (W) (such as monocrystalline sapphire ingot)
Block as time machined object (W), be provided with prism-shaped grinding unit A (14) grinding attachment (1) with rib is installed
Device (3), conveyance device (4), the setting of shifting apparatus (5) are moved in lapping device (2) configuration of the grinding unit A (20) of column
As a example by Bei, the details of its work is illustrated.
Above-mentioned holding unit (12) is moved to measuring unit (18) by the work of mobile unit (19), such as Fig. 8 (Y side
To) shown in, utilize the cross section of the side surface part (F) that measuring appliance A (18A) measures opposed in the both sides of polysilicon block (W) the 1st group
Size.Its measurement result is sent to control unit.
The measurement result sending extremely above-mentioned control unit is become actual size by calculation process, with this reality in control unit
Size and automatically set the incision of grinding unit A (14) based on pre-entering " sectional dimension after grinding " of setting
Amount.
Measure sectional dimension and set the 1st group of above-mentioned polysilicon block (W) of approach of grinding unit A (14) two
Side surface part (F) (F) is moved by the work of mobile unit (19) between grinding unit A (14) (14), and then is ground and adds
Work.Sectional dimension between these both sides face (F) (F) is confirmed whether in tolerance by measuring appliance A (18A) (18A).At the 1st group
Both sides face (F) (F) grinding terminate after, the clamp shaft (13) (13) of holding unit (12) is revolved by rotating mechanism
It turn 90 degrees, and then both sides face (F) (F) of the 2nd group are identical with the both sides of above-mentioned 1st group face (F) (F), are ground processing.When
After confirming that sectional dimension is in tolerance, terminate the grinding of 4 side surface part (F).
Finish the polysilicon block (W) of grinding of 4 side surface part (F) by the clamp shaft (13) of holding unit (12)
(13) it is back to the work starting position shown in Fig. 6 under the state held, and then releases the gripping state of clamp shaft (13) (13)
Polysilicon block (W) is placed on base station (11).This polysilicon block (W) is by the working arm (51) of above-mentioned shifting apparatus (5)
Rotate and held by handle part (52) and be placed in the grinding dress of the grinding in the corner (C) as next manufacturing procedure
Put on the base station (11) of (1).Utilize the work identical with the grinding attachment (1) that above-mentioned side surface part (F) carries out grinding suitable
4 corners (C) are carried out grinding by sequence.
The polysilicon block (W) of the grinding finishing 4 corners (C) is same as described above, by holding unit (12)
It is back to the work starting position shown in Fig. 6 under the state that clamp shaft (13) (13) holds, and then releases clamp shaft (13) (13)
Gripping state polysilicon block (W) is placed on base station (11).The working arm (51) of above-mentioned shifting apparatus (5) rotates, should
Polysilicon block (W) is held in handle part (52), and is placed in the base station (11) of lapping device (2) as next manufacturing procedure
On.Utilize the job order identical with above-mentioned grinding attachment (1), 4 side surface part (F) are ground processing.Thus, all
Grinding, attrition process terminates.
Whole grinding, attrition process terminate, and are placed in the above-mentioned polysilicon block on the base station (11) of lapping device (2)
(W) by rotation and the holding of this handle part (52) of the working arm (51) of above-mentioned shifting apparatus (5), by transfer in taking out of dress
Put (4) and take out of.
It follows that will cut for the grinding unit A (14) or grinding unit B (24) that utilize the present invention being carried out grinding
In the tolerance of face size grinding extremely above-mentioned processing dimension, and grinding unit A (20) or grinding unit B (30) is utilized to remove
The micro-crack of its skin section and the refinement above-mentioned polysilicon block (W) of surface roughness, monocrystalline silico briquette (W) or monocrystalline sapphire ingot
(W) carry out slice processing by wire saw and form the embodiment of wafer and be described.In an embodiment, it is possible to reduce because of this crystalline substance
The crackle of sheet, gap etc. and the incidence rate of faulty goods that produces.
Embodiment 1
In the present embodiment 1, the machined object (W) of processing is as shown in figure 15, for using the new steel as bonded-abrasive mode
4 side surface part (F) that silk saw is cut out by a silicon ingot are many with the quadrangular shape that 4 corners (C) of rectangular shaped are constituted
Crystal silicon block (W).As shown in figure 15, this polysilicon block (W) is cut is formed as 5 row × 5 row=meter 25 pieces.Leave and take and be positioned at more than 4 jiaos
Crystal silicon block A (W) is as preparation.As shown in figure 16,2 side surface part (F) in crystallization silico briquette A (W) are formed and heave.
The grinding unit A (14) of grinding attachment (1) uses the cup-shaped grinding stone shown in Fig. 9 and Figure 10.From table 3,
As the granularity of the abrasive particle forming abrasive grain layer A (15a), select the F100 (JISR6001:1998) high with grinding capacity suitable
Diamond abrasive grain.The overall dimensions of abrasive grain layer A (15a) is formed as diameter 250mm, width is 8mm.
[table 1]
[table 2]
Initial setting item shown in above-mentioned table 1, table 2 is started the input of forward direction control unit in processing.Will be as being added
The polysilicon block (W) of the above-mentioned quadrangular shape of work thing (W) is placed on the base station (11) of grinding attachment (1), connects this grinding dress
The processing putting (1) starts switch.
The pressing utensil (34) (34) of grinding attachment (1) is in the inner side inter-working of the Y-direction shown in Fig. 1, Fig. 7, mounting
The axis of a cylinder heart of the polysilicon block (W) of the above-mentioned quadrangular shape on base station (11) is set at the center of Y-direction.Connect down
Coming, the two ends of above-mentioned polysilicon block (W) are held by the work of the clamp shaft (13) (13) of holding unit (12).Mobile single
Unit (19) works towards the X-direction shown in Fig. 1, makes the reference block (K) being arranged on clamp shaft (13) mobile to measuring appliance A (18A)
Position.Sectional dimension and its output signal of measuring this reference block (K) are sent to control unit.Measure reference block (K)
The output signal of sectional dimension is by as the information suitable with the sectional dimension (100mm) of the datum level of input before processing starts
It is stored in control unit.
Mobile unit (19) work subsequently is utilized to make the polysilicon block A held by the clamp shaft (13) of holding unit (12)
(W) move to measuring appliance A (18A) position.This measuring appliance A (18A) as shown in Fig. 8 (Y-direction) by polysilicon block A (W)
Distance between 2 side surface part (F) of opposed 1 group is vertical 3 positions of 3 position × horizontal strokes (9 positions altogether) and other 1 group
2 side surface part (F) between 9 positions amount to 18 positions measure.Its result, the distance between 2 side surface part is
156.9～157.6mm is (average: 157.1mm).It addition, surface roughness is Ry21～27 μm (average: 24 μm), a length of
499.6mm。
The mean cross-sectional dimension of the above-mentioned polysilicon block A (W) prepared as machined object (W) is for relative to title: 6
156mm × the 156mm of inch is plus 1.1mm.Accordingly, it would be desirable to carry out the cutting of one side=0.55mm, thus approach is set as
0.7mm.Converted rotary speed by the 30～40m/ seconds of benchmark circular velocity of grinding and draw 2700min-1.Make above-mentioned polycrystalline
After silico briquette A (W) carries out grinding by this grinding unit A (14) to 2 side surface part (F) with the speed of 20mm/ second, make holding list
Clamp shaft (13) 90-degree rotation of unit (12), and other 2 side surface part (F) of grinding in the same manner as described above, thus terminate 4 sides
The grinding in portion (F).
[table 3]
After the grinding terminating 4 above-mentioned side surface part (F), make the holding unit of holding this polysilicon block A (W)
(12) clamp shaft (13) rotates 45 degree, makes 2 corners (C) of the 1st group be positioned at the position that the grinding unit (3) with both sides is opposed
Put.
In the grinding of above-mentioned corner (C), as granularity and the polysilicon block A (W) of the abrasive particle of grinding unit A (14)
In the case of translational speed carries out grinding with the condition identical with during the grinding of above-mentioned side surface part (F), find with side surface part (F)
Junction produce and be referred to as the crackle that bursts apart.Therefore, the granularity refinement of abrasive particle by above-mentioned grinding unit A (14) it is changed to
For the grinding stone of #500 (JISR6001:1998) and the translational speed of polysilicon block A (W) is changed to the 30mm/ second carries out grinding.
Its result, approach tails off but can not produce and above-mentioned forms C face with bursting apart.
Therefore, to the grinding making other 2 corners (C) after clamp shaft (13) 90-degree rotation of above-mentioned holding unit (12)
Also the granularity of the abrasive particle of grinding unit A (14) is set to #500, carries out grinding in the same manner as described above, thus carry out 4 corners (C)
Grinding.Its result, the size amounting to 18 positions between 2 side surface part (F) that 4 side surface part (F) are mutually opposing is
156.1～156.6mm (average: 156.2mm), the chipping allowance of 4 side surface part (F) (=measured value/2 and calculate result)
Being 390～480 μm (average: 430 μm), surface roughness is Ry5～8 μm (average: 7 μm).
For each in the grinding of the grinding stone used in the present embodiment, " maximum chipping allowance is cut with it
Amount " confirm, result show that maximum chipping allowance is 700 μm, and approach now is 1.0mm.Due in the present embodiment
The unilateral chipping allowance (550 μm) of grinding in the range of above-mentioned maximum chipping allowance (700 μm), therefore cutting grinding stone
Enter amount and be set as that 0.55mm can terminate for 1 time.
For the relation of " chipping allowance and approach ", by above-mentioned result by the " chipping allowance in the grinding of 1 time
More than the 70% of=approach " it is set as standard, therefore when using the grinding stone used in the present embodiment to carry out unilateral chipping allowance
In the case of the grinding of the such as 1.1mm of more than 1.0mm, if carry out the 1st time grinding (approach:
1.0mm, chipping allowance: 700 μm) after, carry out secondary grinding (approach: 0.57mm, chipping allowance: 400 μm) just
Can.
Polysilicon block A (W) (before attrition process) observe inside after cutting off above-mentioned grinding, result must come from surface
Act the micro-crack of the degree of depth producing 70～90 μm.It addition, as reference, (grinding adds by after above-mentioned grinding to use wire saw
Before work) this polysilicon block A (W) slice processing become the wafer-like of thickness 200 μm, result draws its incidence rate such as crackle, gap
It is 3.8%.
As the grinding unit A (20) of the lapping device (2) used in processing at the next one, use Figure 11 and Figure 12 institute
Show such by each gold of the installation base portion of the bristle material A (35) of rough lapping and the bristle material A (36) of smooth grinding
Belong to pipe and tie up and be detachably installed on the fan-shaped abrasive brush of identical rotating disk (22).
The bristle material A (35) of the rough lapping of this abrasive brush selects and #240 (JISR6001:1998) phase shown in table 4
When diamond abrasive grain as the granularity of abrasive particle and fixed.Prepare 9 and this installation base portion metal tube is bundled into φ
Bristle material A (35) bundle of the thickness of 23mm.This bristle material A (35) bundle is arranged in equably the central diameter of rotating disk (22)
Install on the circumference of 210mm and in the way of handling freely.The bristle material A (36) of smooth grinding selects and shown in table 4
Diamond abrasive grain suitable for #800 (JISR6001:1998) as the granularity of abrasive particle and fixed, and by this installation base portion
The thickness of φ 23mm it is bundled into metal tube.Prepare 24 bristle material A (36) bundles.This bristle material A (36) is restrainted equably
Install on the circumference of central diameter 280mm being arranged in rotating disk (22) and in the way of handling freely.
[table 4]
For the processing conditions of above-mentioned grinding unit A (20), approach is set to 0.5mm, rotary speed is added by grinding
10～the 20m/ seconds of benchmark circular velocity of work carry out converting and being set to 1400min-1, by the translational speed of the polysilicon block A (W) of grinding
It is set to the 20mm/ second.The rough lapping processing simultaneously carrying out 4 side surface part (F) is processed with smooth grinding, terminates to grind mushroom by 1 operation and adds
Work.
Terminating above-mentioned attrition process, result draws being total between mutually opposing 2 side surface part (F) of 4 side surface part (F)
It is (average: 156.1mm) that the size at 18 positions of meter is 155.9～156.4mm.It addition, chipping allowance be 91～97 μm (average:
95 μm), surface roughness is Ry0.9～1.1 μm (average: 1.0 μm).
For in 1 attrition process of the above-mentioned abrasive brush used in the present embodiment, " bristle material A can be carried out
(21) without losing maximum chipping allowance and its approach of ground grinding " confirm, result show that maximum chipping allowance is 174 μ
M, approach now is 1.0mm.Owing to the unilateral chipping allowance (100 μm) of the attrition process of the present embodiment is cut in above-mentioned maximum
Cut in the range of surplus (174 μm), therefore the approach of abrasive brush is set as that 0.5mm can just terminate attrition process 1 time.
Additionally, the relation of " chipping allowance and the approach " for attrition process, according to above-mentioned result by the cutting of 1 time
The 15 of surplus=approach～25% are set to standard.
Above, collect explanation embodiment 1 polysilicon block A (W) is implemented grinding, rough lapping processing and lappingout
The processing result of mill processing, and be shown in Table 5.
[table 5]
The polysilicon block A (W) finishing above-mentioned grinding and attrition process carried out slice processing and shape with wire saw
Crackle, the incidence rate of the produced faulty goods such as gap when becoming silicon chip are 1.2%.It is 3 after grinding as mentioned above
～4%, on the other hand, as shown in table 5, by chipping allowance is formed as average: 95 μm, surface roughness is formed as Ry and puts down
Equal: the attrition process of 1.0 μm, it is possible to the incidence rate of this faulty goods is greatly decreased.
Embodiment 2
The machined object (W) used in the present embodiment 2 is as shown in Figure 17 and Figure 18, for producing by crystal pulling method
Columned monocrystal silicon cut off formed monocrystalline silico briquette (W).Cut off the upper and lower end parts removing above-mentioned monocrystal silicon, prepare
25 Name Length: 300mm (short transverse in Figure 18), the length of actual measurement cut into the scope of 299.0～301.0mm
Ingot.This ingot is vertically set in stationary fixture with the arrangement of 5 row × 5 row as shown in figure 17.
For above-mentioned 25 monocrystal silicons, use the new wire saw of the bonded-abrasive mode identical with above-described embodiment 1, cut
Disconnected formation 4 side surface part (F) in approximate right angle respectively, thus prepare 25 monocrystalline silico briquettes (W).Additionally, make each monocrystal silicon
A part for the main part of ingot is about the form residual of 4 corners (C) of 25mm with circular arc width.From this monocrystalline silico briquette directly
Take out 1 as machined object (W).
The shape of monocrystalline silico briquette (W) is be made up of 4 corners (C) of 4 side surface part (F) Yu arc-shaped as shown in figure 18
Quadrangular shape.Identical with above-described embodiment 1, carry out the measurement between opposed 2 side surface part (F), result at altogether 18 positions
(average: 125.7mm), a length of 300.8mm, surface roughness is Ry22～28 μm are (average: 25 to draw 125.4～126.0mm
μm)。
For grinding unit A (14) and the specification of grinding unit A (20), as shown in Table 2 above, except selecting from table 3
The granularity of the abrasive particle of the cup-shaped grinding stone used in the grinding unit A (14) is also changed to beyond F180, with above-described embodiment 1 phase
With.By as follows for reason that the granularity of the abrasive particle of above-mentioned grinding unit A (14) is changed to F180.Grinding, the monocrystal silicon of attrition process
The mean cross-sectional dimension of block (W) is plus 0.7mm, its chipping allowance (unilateral) relative to (title: 5 inches) 125mm × 125mm
=0.35mm, on the low side as chipping allowance.Therefore, select than thin for the F100 grain shown in the table 3 used at above-described embodiment 1
The F180 (JISR6001:1998) of degree.
For grinding, hold ready monocrystalline silico briquette (W) with clamp shaft (13) so that it is 2 side surface part (F) are passed through
Between the grinding unit A (14) that both sides are opposed, so with 4 side surface part of the polysilicon block of above-described embodiment 1 (W) identical end
(F) grinding.
It follows that as shown in table 1, to pre-enter the rotary speed of the clamp shaft (13) of setting to control unit
(87min-1) make monocrystalline silico briquette (W) rotate continuously, and make this crystallization silico briquette (W) pass through grinding unit with the low velocity of 2mm/ second
A (14), thus terminate the grinding of 4 corners (C).
Its result, the size amounting to 18 positions between mutually opposing 2 side surface part (F) of 4 side surface part (F) is
125.3～126.1mm (average: 125.4mm), the chipping allowance of 4 side surface part (F) is 283～350 μm (average: 316 μm), 4
Individual side surface part (F) is Ry4 with the surface roughness of 4 corners (C)～6 μm (average: 5 μm).
For ensuing attrition process, utilize holding unit to make monocrystalline silico briquette (W) rotate continuously, and utilize mobile single
Unit (19) with the low velocity of 2mm/ second by the bristle material A (36) by the bristle material A (35) of rough lapping with smooth grinding
Between the grinding unit A (20) that a pair abrasive brush being integrated relative to rotating disk (22) is constituted, thus terminate 4 corners (C)
Attrition process.Subsequently, for the attrition process of 4 side surface part (F), identical with above-described embodiment 1, utilize mobile unit (19) with
The translational speed of 20mm/ second is by being thus ground processing between grinding unit A (20).As it has been described above, terminate whole mills
Cut, attrition process.
To amounting to 18 between mutually opposing 2 side surface part (F) of 4 side surface part (F) finishing above-mentioned attrition process
Individual position measures, and it is (average: 125.2mm) that result show that sectional dimension is 124.7～125.4mm.It addition, chipping allowance is
86～100 μm (average: 93 μm), surface roughness is Ry0.8～1.0 μm (average: 0.9 μm).
Collect the cross section after the grinding of the monocrystalline silico briquette (W) finishing embodiments illustrated above 2 and attrition process
Overall dimensions and surface roughness are also shown in Table 6.
[table 6]
It addition, cut into slices to all finishing the above-mentioned grinding monocrystalline silico briquette (W) with attrition process with wire saw
Process and form silicon chip, the incidence rate because of the faulty goods of the generation such as crackle, gap of this silicon chip is investigated.Its result,
Identical with the polysilicon block of above-described embodiment 1 (W), utilize the attrition process after grinding its grind is formed as 86～
100 μm, it is average that surface roughness is formed as Ry: 0.9 μm, it is possible to the faulty goods that produces because of crackle, gap etc.
Incidence rate reduces to less than 1.0%.
Embodiment 3
The machined object (W) used in the present embodiment 3 is the columned monocrystalline sapphire ingot shown in Figure 19.By cutting
Face a size of title: the crystal pulling method manufacture of 4 inches (diameter: 100 ± 0.5mm) draws.Main body at this monocrystalline sapphire ingot (W)
Portion (B) is attached with the impurity produced because melted heating when manufacturing waits thus is formed concavo-convex.Cut off and remove its top and afterbody,
And length (short transverse in Figure 19) cut into title: 200mm, the scope of measured length 200 ± 1.0mm and add so that
With.
The grinding unit B (24) of grinding attachment (1) and the specification such as table 7 below of the grinding unit B (30) of lapping device (2)
Shown in.
[table 7]
The roll forming grinding stone shown in Figure 13 is used at grinding unit B (24).Its abrasive particle uses higher than above-mentioned table 3 with grinding capacity
The suitable diamond abrasive grain of the granularity of F100 (JISR6001:1998).Outside the overall dimensions of this abrasive grain layer B (25) is formed as
Shape 200mm × length 100mm.Approach is set as 1.Smm, rotary speed (by the benchmark circular velocity of grinding: 15～
The 30m/ second converts) it is set as 2200min-1, make above-mentioned roll forming grinding stone rotate.Using the monocrystalline sapphire ingot (W) as machined object
Utilize the clamp shaft (13) of holding unit (12) at the two ends holding its axis of a cylinder heart with 153min-1Rotary speed (by table 1 institute
Show: the 0.5～1.1m/ second of benchmark circular velocity of columned machined object (W) converts) towards the rotation side's phase with above-mentioned roll forming grinding stone
Anti-direction rotates continuously.
It follows that make monocrystalline sapphire ingot (W) rotate, and utilize the work of mobile unit (19) along monocrystalline sapphire ingot
(W) axis of a cylinder direction is moved with 2mm/ second low velocity, and by the grinding unit B (24) rotated, the grinding terminating main part (B) adds
Work.
Along the axis of a cylinder heart of this main part (B) at 6 positions to the above-mentioned monocrystalline sapphire ingot (W) finishing grinding
The diameter dimension of main part (B) measures.Make the clamp shaft (13) of the holding unit (12) of this monocrystalline sapphire ingot (W) of holding
90-degree rotation also measures its diameter dimension as described above at 6 positions, thus enters the diameter dimension at altogether 12 positions
Row is measured.It is (average: 100.7mm) that its result is 100.3～101.1mm.It addition, its surface roughness is Ry5～7 μm (average:
6μm).Additionally, the machining of monocrystalline sapphire ingot (W) includes the removing to the impurity being attached to main part (B), do not enter
The mensuration record of row chipping allowance.
Grinding unit B (30) as lapping device (2) subsequently uses the abrasive brush of roll forming, and it is in the rotation shown in Figure 14
The bristle material B (37) of the one end side configuration rough lapping of rotating cylinder (32), at the bristle of side, the other end configuration smooth grinding
Material B (38), thus on a rotating cylinder (32) of a length of 400mm, form double with smooth grinding of rough lapping
Side.
The particle diameter of the abrasive particle used in above-mentioned grinding unit B (30), in the bristle material B (37) of above-mentioned rough lapping
For with suitable for #240 (JISR6001:1998) diamond abrasive grain shown in table 4, at the bristle material B of above-mentioned smooth grinding
(38) it is the diamond abrasive grain suitable with #800 (JISR6001:1998) in.
It addition, by the bristle material B (37) of above-mentioned rough lapping and the bristle material B (38) of smooth grinding respective outside
Shape is dimensioned so as to (diameter of tippy tea) φ 150mm × (length of the axis direction of rotating cylinder (32)) 200mm.Approach is set
Be set to 0.5mm, rotary speed (by the benchmark circular velocity of attrition process: 10～20m/ seconds converted) is set as 2000min-1, thus
Above-mentioned roll forming abrasive brush is made to rotate.Make above-mentioned monocrystalline sapphire ingot (W) by holding the holding unit (12) at the two ends of the axis of a cylinder heart
Clamp shaft (13) towards the direction contrary with the direction of rotation of above-mentioned roll forming abrasive brush with 153min-1Rotary speed (by table 1 institute
0.5～the 1.1m/ second of benchmark circular velocity of the columned machined object (W) shown converts) rotate continuously.
It follows that utilize the work of mobile unit (19), make by the clamp shaft (13) (13) of above-mentioned holding unit (12)
The monocrystalline sapphire ingot (W) held and rotate moves along its axis of a cylinder direction with the low velocity of 2mm/ second, by the grinding unit B rotated
(30), so terminate main part (B) attrition process.
For the diameter dimension of the main part (B) of the above-mentioned monocrystalline sapphire ingot (W) after end attrition process, in 6 portions
The diameter dimension of the axis of a cylinder heart along this main part (B) is measured in position.Make the two ends of the axis of a cylinder heart of this monocrystalline sapphire ingot (W) of holding
Its diameter dimension is also surveyed by clamp shaft (13) 90-degree rotation of the holding unit (12) in portion in the same manner as described above at 6 positions
Amount, thus measure the diameter dimension amounting to 12 positions.It is (average: 100.6mm) that its result is 100.2～100.9mm.It addition,
Its chipping allowance is 94～102 μm (average: 98 μm), and surface roughness is Ry5～7 μm (average: 6 μm).
It is summarised in embodiments illustrated above 3 grinding and the attrition process of the monocrystalline sapphire ingot (W) used
Cross-sectional shape size after end and surface roughness are also shown in table 8.
[table 8]
It addition, for the wire saw monocrystalline sapphire ingot (W) to all finishing above-mentioned grinding and attrition process
The incidence rate of the faulty goods produced because of crackle, gap etc. when carrying out slice processing and form wafer is investigated, result
Draw and can reduce to less than 1.0%.Utilizing grind is that 94～102 μm, surface roughness are average for Ry: grinding of 1.0 μm
Mill processing, it is possible to obtain the effect identical with the silico briquette (W) used in above-described embodiment 1, embodiment 2.
(modification)
Crystal crystal as shown in figure 20 is such, is not water in the face of the machined object (W) held by holding unit (12)
In the case of Ping, the folder that the shape of the front end with above-mentioned machined object (W) is coincide can be linked in the front end of holding unit (12)
Hold accessory (not shown), hold machined object (W) by this clamping accessory.
In the case of the machined surface of machined object (W) is the irregular shape shown in Figure 20, for example, it is possible to just
Beginning setting item sets " shape of machined object (W) ", " polish target shape " etc., carries out grinding, attrition process.
To polycrystalline and monocrystalline silico briquette and the grinding of monocrystalline sapphire ingot, grind relevant invention and be illustrated, but
The invention is not limited in this.Such as, for the silicon used in the various semiconductor substrates such as system of crystallization solar battery panel
Sheet, in the electronic components such as quartz crystal use crystal wafer, in electronic component, optical substrate use quartz wafer,
The sapphire wafer that uses in LED-baseplate etc., gallium arsenide wafer, gallium phosphide crystal, gallium nitride wafer, in driving equipment etc.
Use silicon carbide single crystal wafer, in SAW filter use lithium tantalate wafer, lithium niobate crystal chip, at Speed Semiconductor
Ingot in the manufacture of the wafer of all hard brittle materials such as the inp wafer used in element and the grinding of block, attrition process
Can apply well.The raw material of this machined object is not limited to above-mentioned material, it is also possible to other hard brittle materials
For object, for shape, more than prism-shaped and cylindric, can be to include shape complicated as crystal crystal
All columns of the column (with reference to Figure 20) of (irregularly shaped) are object.
Grinding attachment according to the present invention or method for grinding, even if utilizing wire saw etc. to cut off by hard brittle material structure
The ingot that becomes and be formed as cutting of the sectional dimension of the block of the prism-shaped of machined object (W) and perpendicularity or columned ingot
Face size falls the situation outside the margin of tolerance, it is also possible to utilizes and above-mentioned grinding unit A (14) or grinding unit B (24) is formed
Impurity and the deformation on the top layer of this machined object (W) is removed, so that sectional dimension falls at ± 0.5mm for the grinding function of grinding stone
Tolerance in.And then can make machined object (W) be shaped as the corner that the side surface part (F) in the case of prism-shaped intersects to form
(C) perpendicularity falls in the tolerance of ± 0.1 degree.It addition, utilize operation subsequently by above-mentioned grinding unit A (20) or grind
Unit B (30) is formed as the grinding function of abrasive brush, it is possible to removing finishes the above-mentioned machined object (W) of above-mentioned grinding
The micro-crack on top layer, is formed as Ry1.1 μm (JISB0601:1994) below by surface roughness.Therefore, in operation subsequently
In, when using wire saw etc. that this machined object (W) is carried out slice processing and to be machined to the wafer of the thickness of hundreds of μm, it is possible to
Reduce the crackle because producing, gap and the incidence rate of faulty goods that causes when above-mentioned slice processing.
It addition, make above-mentioned grinding unit A (14) or grinding unit B (24) and grinding unit A (20) or grind single
The specification of the installation portion of unit B (30) is common, it is possible to form the main body of above-mentioned grinding attachment (1) and lapping device (2)
For same size.Therefore, it is possible to the manufacturing cost of cutting device main body.And then, it is installed on above-mentioned grinding attachment (1) and grinds
The clamp shaft (13) of the holding unit (12) of the holding machined object (W) of device (2) can carry out " intermittent rotary " or " continuously
Rotate ".Therefore, it is possible to easily to being shaped as prism-shaped or columned machined object (W) carries out grinding, attrition process.
It addition, possess at the above-mentioned each dress moving into device (3), grinding attachment (1), lapping device (2), conveyance device (4)
Put mounting and take out the shifting apparatus (5) of machined object (W), utilizing control unit to make this shifting apparatus (5) and grinding attachment
And each process automation of lapping device (2) (1).Therefore, it is possible to realize raising and Labor-saving and the volume production of machining accuracy
Change.
Using having following grinding, the grinding of lapping device (6), attrition process system are said as the 2nd embodiment
Bright, wherein, this grinding, lapping device (6) have: grinding unit, and it is with the skin section of certain approach grinding machined object,
Remove impurity and the axial deformation of post of the skin section of this machined object and sectional dimension is formed as desired size；
Grinding unit, it, with certain skin section grinding the machined object finishing above-mentioned grinding by pressure, removes this machined object
The micro-crack of skin section and refine surface roughness.Only the difference from the 1st embodiment is illustrated at this.
Figure 21 illustrates that the machined object (W) to prism-shaped involved in the present invention carries out grinding and the grinding of grinding, grinds
Mill apparatus (6).Grinding, lapping device (6) possess: hold the holding unit (12) of machined object (W)；To machined object (W)
Side surface part (F) and corner (C) carry out the grinding unit A (14) of grinding；To the machined object (W) after end grinding
Side surface part (F) and corner (C) be ground processing grinding unit A (20)；Form the reference block (K) of datum level；To quilt
The measuring unit (18) that the sectional dimension of machining object (W) measures；And move the above-mentioned holding list holding machined object (W)
Unit (12) and make the mobile unit (19) of above-mentioned machined object (W) movement between measuring unit (18) and grinding unit A (14).
Above-mentioned mobile unit (19) makes the holding unit (12) of holding machined object (W) at measuring unit (18) and grinding list
Move between unit A (14) and grinding unit A (20) thus machined object (W) is measured or machined object (W) is entered
Row grinding and attrition process.But it is also possible to the fixing holding unit (12) holding machined object (W), and make measurement
Unit (18) position to machined object (W) mobile with grinding unit A (14) and grinding unit A (20), thus carries out this
The measurement of machined object (W) and grinding and attrition process.
The grinding stone that grinding unit A (14) is cup-shaped with the 1st identical use of embodiment.It addition, grinding unit B (20) and the 1st
Embodiment is identical uses fan-shaped abrasive brush.
Figure 22 illustrates and involved in the present invention columned machined object (W) carries out grinding and the grinding of grinding, grinds
Mill apparatus (6).Grinding, lapping device (6) possess: hold the holding unit (12) of machined object (W)；To machined object (W)
Main part (B) carries out the grinding unit B (24) of grinding；Main part (B) to the machined object (W) after end grinding
It is ground the grinding unit B (30) of processing；Form the reference block (K) of datum level；The sectional dimension of machined object (W) is carried out
The measuring unit (18) measured；And move the above-mentioned holding unit (12) of holding machined object (W) and make above-mentioned machined object
(W) mobile unit (19) of movement between measuring unit (18) and grinding unit B (24).
Above-mentioned transfer unit (19) can also the holding unit (12) of fixing holding machined object (W) same as described above, and
Make the mobile position to machined object (W) of measuring unit (18) and grinding unit B (24) and grinding unit B (30), thus enter
The measurement of this machined object of row (W) and grinding and attrition process.
The grinding stone of grinding unit B (24) and the 1st embodiment identical use roll forming.It addition, grinding unit B (30) and the 1st
The abrasive brush of embodiment identical use roll forming.Further, it is also possible to use the cup-shaped grinding stone that price is cheaper than the grinding stone of roll forming
Or the cup-shaped or fan-shaped abrasive brush that price is cheaper than the abrasive brush of roll forming.
Prism-shaped and columned machined object (W) are carried out grinding and the grinding of grinding, lapping device (6) the most logical
Cross to make to be fixed on and support machined object (W) left from figure of unit 12 and relatively transfer towards right, according to grinding, grinding suitable
Sequence is processed.
Furthermore it is also possible to by grinding unit A (14) and grinding unit A (20) at least any one carries out multiple company
Connect.Such as, in fig 23,2 pairs of grinding unit A (20) are made to be connected to 1 pair of grinding unit A (14).In this case, by slightly
Change the granularity of the abrasive particle contained by bristle material A (21) of the grinding unit A (20) being arranged in this figure left, and refinement is arranged in this
The granularity of the abrasive particle contained by bristle material A (21) of the grinding unit A (20) of figure right, it is possible to entered at grinding unit A (14)
After the grinding of row, carry out the attrition process in 2 stages.It addition, concavo-convex excessive when produce in grinding, rely on
The working ability of grinding unit A (20) be difficult to smooth this concavo-convex in the case of wait and be intended to improve the situation of ability of attrition process
Under, the granularity that can make the abrasive particle contained by bristle material A (21) of whole grinding unit A (20) is roughly the same.
It addition, in columned machined object (W) is carried out grinding and the grinding of grinding, lapping device (6), it is possible to
With equally by grinding unit B (20) and grinding unit B (20) at least any one carries out multiple connection, this is not given figure
Show.
By making the grinding unit A (14) and the grinding unit B (20) that freely load and unload relative to grinding, lapping device (6)
Or grinding unit B (24) and grinding unit B (30), the specification of installation portion common, it is possible to they are replaced.
Thus, in the case of for example, Figure 21 and grinding as shown in Figure 22, lapping device (6), it is possible to formed and have 2 to mill
Cut the grinding attachment (1) of unit A (14) (grinding unit B (24)) or there are 2 pairs of grinding unit A (20) (grinding unit B (30))
Lapping device (2).By making the abrasive particle contained by the granularity of the abrasive particle of the respective abrasive grain layer of composition or respective bristle material
Granularity roughly the same, it is possible to shorten process time.It addition, by the granularity of the abrasive particle that is roughened this figure left and to refine this figure right
The granularity of the abrasive particle of side, it is possible to carry out grinding or the attrition process in 2 stages.It addition, as a example by as shown in figure 23 that
In the case of the grinding of sample, lapping device (6), it is possible to form the mill with 3 pairs of grinding unit A (14) (grinding unit B (24))
Turning device (1) or there is the lapping device (2) of 2 pairs of grinding unit A (20) (grinding unit B (30)).Or by will be located in this
The grinding unit A (20) (grinding unit B (30)) of the central authorities of figure left and right directions is changed to grinding unit (14) (grinding unit B
(24)), it is possible to after the grinding carrying out 2 stages, it is ground processing.
Figure 24 is to represent the grinding shown in the lapping device (2) shown in the grinding attachment (1) shown in Fig. 1, Fig. 2, Figure 21, grind
Grinding shown in mill apparatus (6), Figure 22, lapping device (6), unprocessed machined object (W) move into device (3), processing after
The conveyance device (4) of machined object (W) and have above-mentioned move into device (3), grinding attachment (1), lapping device (2),
Carry out the working arm (51) of rotary work between each device of conveyance device (4) and be installed on front end and the holding of this working arm (51)
The configuration figure of the configuration of the shifting apparatus (5) of the handle part (52) of machined object (W).Not shown control unit has following merit
Can: with processing start before input complete initial setting item and by grinding attachment (1), lapping device (2), grinding,
Calculation process is carried out based on the measurement signal that the measuring unit (18) that lapping device (6) is arranged sends, and to this grinding attachment
(1), the function of each device output services signal of lapping device (2), grinding, lapping device (6)；And control above-mentioned transfer dress
Put the rotary work of (5) and hold the function holding work of machined object (W).
Grinding attachment (1), grinding attachment (2), grinding, lapping device (6) combination can be according to the property of machined object (W)
Shape and the machining accuracy of requirement and properly select.Such as in Figure 24 (A), configure the grinding shown in 2 Figure 21, grind dress
Put (6), in the processing of the machined object (W) of prism-shaped, carry out adding of side surface part F respectively with 1 grinding, processing unit (plant) (6)
Work and the processing of corner C.As the less demanding example of the surface roughness of corner C, in Figure 24 (B), each configuration 1 respectively
Grinding shown in platform Figure 21, lapping device (6) and the grinding attachment (1) shown in Fig. 1, carried out utilizing grinding, lapping device (6)
After the processing of side surface part F, grinding attachment (1) is utilized to carry out the grinding of corner C.It addition, in the processing in corner, as
Need to transfer the example of the processing that cannot be carried out requirement in machined object (W) grinding, lapping device (6) with identical speed, as
Shown in Figure 24 (C), 1 grinding of each configuration respectively, lapping device (6) and grinding attachment (1) and lapping device (2), utilizing mill
Cut, after side surface part F is processed by lapping device (6), according to the grinding carried out by grinding attachment (1) with by lapping device
(2) order diagonal section C of the attrition process carried out is processed.
Record especially based on grinding, the machined object (W) of lapping device (6) method of operation (holding method,
Measuring method, intermittent rotary or continuous rotation, processing method etc.) identical with grinding attachment (1) and lapping device (2), tool
The action of body and method of operation refer to narration above.
The main reference used in this specification and accompanying drawing is concluded as follows.
1: grinding attachment；2: lapping device；3: move into device；4: conveyance device；5: shifting apparatus；6: grinding, grinding dress
Put；11: base station；12: holding unit；13: clamp shaft；14: grinding unit A；15: grinding body A；15a: abrasive grain layer A；15b: the end
Plate；16: rotating disk；17: rotary shaft；18: measuring unit；18A: measuring appliance A；18B: measuring appliance B；19: mobile unit；20:
Grinding unit A；21: bristle material A；22: rotating disk；23: rotary shaft；24: grinding unit B；25: abrasive grain layer B；26: rotating cylinder；
27: rotary shaft；30: grinding unit B；31: bristle material B；32: rotating cylinder；33: rotary shaft；34: pressing utensil；51: work
Arm；52: handle part；W: machined object；F: side surface part；C: corner；B: main part.
Claims (26)
1. grinding, an attrition process system, to the post being made up of hard brittle material for being manufactured wafer by slice processing
The machined object of shape carries out grinding and grinding,
Described grinding, attrition process system are characterised by,
Described grinding, attrition process system possess:
Grinding attachment, this grinding attachment, with the skin section of certain approach grinding machined object, removes the table of this machined object
The impurity in layer portion and the axial deformation of post, and sectional dimension is formed as desired size, this grinding attachment has survey
The measuring unit of the size of amount machined object；
Lapping device, this lapping device, with certain skin section grinding the described machined object after terminating grinding by pressure, removes
Removing the micro-crack of the skin section of this machined object and refine surface roughness, this lapping device has the chi measuring machined object
Very little measuring unit；
Control unit, the size of this control unit machined object to being measured by described measuring unit carries out computing, and according to
The result of described computing exports working signal and the working signal of described lapping device of described grinding attachment；
Moving into device, this is moved into device and is removed to described grinding, attrition process system by the machined object before grinding, attrition process
Enter；
Conveyance device, this conveyance device will terminate the machined object after grinding, attrition process from described grinding, attrition process system
Take out of；And
Shifting apparatus, this shifting apparatus have described move into device, described grinding attachment, described lapping device, described in take out of
Move the working arm of described machined object between device and be installed on the front end of this working arm and described machined object is rotated
Handle part to the angle of regulation.
2. grinding, an attrition process system, to the post being made up of hard brittle material for being manufactured wafer by slice processing
The machined object of shape carries out grinding and grinding,
Described grinding, attrition process system are characterised by,
Described grinding, attrition process system have at least more than one grinding, lapping device,
This grinding, lapping device possess:
Measuring unit, this measuring unit measures the size of machined object；
Grinding unit, this grinding unit, with the skin section of certain approach grinding machined object, removes the table of this machined object
The impurity in layer portion and the axial deformation of post, and sectional dimension is formed as desired size；
Grinding unit, this grinding unit, with certain skin section grinding the described machined object after terminating grinding by pressure, removes
Remove the micro-crack of the skin section of this machined object and refine surface roughness；
Control unit, the size of this control unit machined object to being measured by described measuring unit carries out computing, and according to
The result of described computing exports working signal and the working signal of described grinding unit of described grinding unit；
Moving into device, this is moved into device and is removed to described grinding, attrition process system by the machined object before grinding, attrition process
Enter；
Conveyance device, this conveyance device will terminate the machined object after grinding, attrition process from described grinding, attrition process system
Take out of；And
Shifting apparatus, this shifting apparatus have described move into device, described grinding, lapping device or described grinding attachment or
Move the working arm of described machined object between described lapping device, described conveyance device and be installed on the front end of this working arm
And described machined object is rotated the handle part to the angle specified.
Grinding the most according to claim 2, attrition process system, to for by slice processing manufacture wafer by the most crisp
Property the machined object of column that constitutes of material carry out grinding and grinding, wherein,
Described grinding, attrition process system have at least one of following grinding attachment and lapping device,
This grinding attachment, with the skin section of certain approach grinding machined object, removes the impurity of the skin section of this machined object
Deformation axial with post, and sectional dimension is formed as desired size, this grinding attachment has measures machined object
The measuring unit of size,
This lapping device, with certain skin section grinding the described machined object after terminating grinding by pressure, removes this processed
The micro-crack of the skin section of thing and refine surface roughness, this lapping device has the measurement list of the size measuring machined object
Unit.
4. according to the grinding described in claim 1 or 3, attrition process system, it is characterised in that
Described grinding attachment has:
Base station, described machined object is loaded in the way of the axis of a cylinder of described machined object is in level by this base station, and energy
Enough move in the vertical direction；
Holding unit, this holding unit has: make to be placed in the machined object of this base station along orthogonal with the axis of a cylinder of this machined object
Direction retreat the mobile and pressing utensil at this machined object is positioned described base station center；And become with axle center and to be added
The mode in the direction of the axis of a cylinder of work thing holds the clamp shaft at the two ends of this machined object, described clamp shaft enable machined object with
Described axle center pivots about；
Grinding unit, this grinding unit is to make the abrasive grain layer being bonded to each other by abrasive particle be fixed on the discoid or circular end
The grinding body of plate is fixed on the grinding stone of rotating disk, or it is solid to make to be formed as described abrasive grain layer discoid or circular grinding body
Due to the grinding stone of rotating disk, described grinding stone is linked to rotary driving source in the way of handling freely, makes described abrasive grain layer press on institute
State machined object and rotate；And
Mobile unit, this mobile unit makes either party of described holding unit and described grinding unit along described machined object
Axis of a cylinder direction move at least suitable with the length of this machined object distance.
5. according to the grinding described in claim 1 or 3, attrition process system, it is characterised in that
Described lapping device has:
Base station, described machined object is loaded in the way of the axis of a cylinder of described machined object is in level by this base station, and energy
Enough move in the vertical direction；
Holding unit, this holding unit has: make to be placed in the machined object of this base station along orthogonal with the axis of a cylinder of this machined object
Direction retreat the mobile and pressing utensil at this machined object is positioned described base station center；And become with axle center and to be added
The mode in the direction of the axis of a cylinder of work thing holds the clamp shaft at the two ends of this machined object, described clamp shaft enable machined object with
Described axle center pivots about；
Grinding unit, this grinding unit is to have rotating disk and tie up the configuration bristle material containing abrasive particle on discoid surface
Abrasive brush, described abrasive brush is linked to rotating mechanism in the way of handling freely, makes described bristle material press on described being added
Work thing and rotate；And
Mobile unit, this mobile unit makes either party of described holding unit and described grinding unit along described machined object
Axis of a cylinder direction move at least suitable with the length of this machined object distance.
Grinding the most according to claim 2, attrition process system, it is characterised in that
Described grinding, lapping device possess:
Base station, described machined object is loaded in the way of the axis of a cylinder of described machined object is in level by this base station, and energy
Enough move in the vertical direction；
Holding unit, this holding unit has: make to be placed in the machined object of this base station along orthogonal with the axis of a cylinder of this machined object
Direction retreat the mobile and pressing utensil at this machined object is positioned described base station center；And become with axle center and to be added
The mode in the direction of the axis of a cylinder of work thing holds the clamp shaft at the two ends of this machined object, described clamp shaft enable machined object with
Described axle center pivots about；And
Mobile unit, this mobile unit makes either party of described holding unit or described grinding unit or described grinding unit
At least suitable with the length of this machined object distance is moved in axis of a cylinder direction along described machined object,
Described grinding unit is the mill making the abrasive grain layer being bonded to each other by abrasive particle be fixed on discoid or circular base plate
Cut body and be fixed on the grinding stone of rotating disk, or make to be formed as described abrasive grain layer discoid or circular grinding body and be fixed on and turn
The grinding stone of dish, described grinding stone is linked to rotary driving source in the way of handling freely, makes described abrasive grain layer press on described being added
Work thing and rotate,
Described grinding unit possesses abrasive brush, and makes this abrasive brush rotate, and this abrasive brush is detachably kept, and tool
Have tie up the configuration bristle material containing abrasive particle on discoid surface and make this bristle material press on described machined object and
Carry out the rotating disk rotated.
Grinding the most according to claim 4, attrition process system, it is characterised in that
The granularity of the abrasive particle of described grinding unit is F90～F220 of regulation in JISR6001:1998 in corase grind is cut and used, or
Fine ginding is #240～#500 of regulation in JISR6001:1998.
Grinding the most according to claim 6, attrition process system, it is characterised in that
The granularity of the abrasive particle of described grinding unit is F90～F220 of regulation in JISR6001:1998 in corase grind is cut and used, or
Fine ginding is #240～#500 of regulation in JISR6001:1998.
Grinding the most according to claim 5, attrition process system, it is characterised in that
The granularity of the abrasive particle contained by the bristle material of described grinding unit is two or more.
Grinding the most according to claim 6, attrition process system, it is characterised in that
The granularity of the abrasive particle contained by the bristle material of described grinding unit is two or more.
11. grindings according to claim 9, attrition process system, it is characterised in that
The granularity of the abrasive particle of described grinding unit is #240～#500 of regulation in JISR6001:1998 in rough lapping, or
Person is #800～#1200 of regulation in JISR6001:1998 in smooth grinding.
12. grindings according to claim 10, attrition process system, it is characterised in that
The granularity of the abrasive particle of described grinding unit is #240～#500 of regulation in JISR6001:1998 in rough lapping, or
Person is #800～#1200 of regulation in JISR6001:1998 in smooth grinding.
13. grindings according to claim 9, attrition process system, it is characterised in that
In described grinding unit, the bristle material of the abrasive particle containing coarse size is disposed in proximity to the portion of the center of rotation of rotating disk
Point, the bristle material of the abrasive particle containing fine size is arranged in the position that the bristle material of the described abrasive particle containing coarse size is configured
Put around.
14. grindings according to claim 10, attrition process system, it is characterised in that
In described grinding unit, the bristle material of the abrasive particle containing coarse size is disposed in proximity to the portion of the center of rotation of rotating disk
Point, the bristle material of the abrasive particle containing fine size is arranged in the position that the bristle material of the described abrasive particle containing coarse size is configured
Put around.
15. according to the grinding described in claim 1 or 3, attrition process system, it is characterised in that
The grinding unit of the grinding unit of described grinding attachment and described lapping device can be replaced, by replace grinding unit with
Grinding unit, it is possible to grinding attachment is formed as lapping device, or lapping device is formed as grinding attachment.
16. grindings according to claim 2, attrition process system, it is characterised in that
Described grinding, the described grinding unit of lapping device can be replaced with described grinding unit.
17. grindings according to claim 1, attrition process system, it is characterised in that
The measuring unit being arranged at described grinding attachment or described lapping device includes:
Reference block, this reference block has and separates between known benchmark in the horizontal direction vertical with the axis of a cylinder of described machined object
A pair datum level being formed every size and separate known base interval chi in the vertical vertical with described axis of a cylinder
Very little and a pair datum level being formed；
Measurement direction is set to described horizontal direction, and measures the datum level of the both sides of described reference block and the two of machined object
The grinding of side, the measuring appliance of the size of space in attrition process portion；And
Measurement direction is set to described vertical, and measures the datum level of the upper surface of described reference block and machined object
The grinding of upper surface, the measuring appliance of height and position in attrition process portion.
18. grindings according to claim 2, attrition process system, it is characterised in that
Be arranged at described grinding, the measuring unit of lapping device includes:
Reference block, this reference block has and separates between known benchmark in the horizontal direction vertical with the axis of a cylinder of described machined object
A pair datum level being formed every size and separate known base interval chi in the vertical vertical with described axis of a cylinder
Very little and a pair datum level being formed；
Measurement direction is set to described horizontal direction, and measures the datum level of the both sides of described reference block and the two of machined object
The grinding of side, the measuring appliance of the size of space in attrition process portion；And
Measurement direction is set to described vertical, and measures the datum level of the upper surface of described reference block and machined object
The grinding of upper surface, the measuring appliance of height and position in attrition process portion.
19. grindings according to claim 17, attrition process system, it is characterised in that
Described control unit has a following function:
Make each front end of grinding unit that described grinding attachment had and the grinding unit that described lapping device is had with
A pair datum level at described grinding attachment with the reference block of the holding unit setting of described lapping device contacts, to described grinding
The approach of each unit of device and described lapping device be zero base position carry out the function of calculation process；
Described reference block measured by the measuring appliance utilizing the measuring unit setting at described grinding attachment and described lapping device
The difference of the processing department of the datum level of both sides and the both sides of machined object, to before the processing of the processing department of machined object and after processing
Sectional dimension carry out the function of calculation process；
Carry out the merit of calculation process for holding described machined object with making described grinding attachment and the centering of described lapping device
Energy；And
To the initial setting item inputted before processing starts and it is respectively provided with at described grinding attachment and described lapping device
The measurement signal of measuring appliance output of measuring unit carry out calculation process, and to described grinding attachment and described lapping device
The function of each unit output services signal.
20. grindings according to claim 2, attrition process system, it is characterised in that
Described control unit has a following function:
Make each front end and the holding unit setting at described grinding, lapping device of described grinding unit or described grinding unit
A pair datum level contact of reference block, is carried out the base position that approach is zero of described grinding unit or described grinding unit
The function of calculation process；
Utilization is at the benchmark of the both sides of the measuring appliance described reference block of measurement of the measuring unit setting of described grinding, lapping device
The difference of the processing department of the both sides of face and machined object, to the sectional dimension before the processing of the processing department of machined object and after processing
Carry out the function of calculation process；
Carry out for making described grinding, holding to lapping device centering the function of calculation process of described machined object；And
The measurement signal that the initial setting item of input before processing starts and the measuring appliance of described measuring unit are exported
Carry out calculation process, and to described grinding unit and the function of described grinding unit output services signal.
21. grindings according to claim 19, attrition process system, it is characterised in that
Described machined object be shaped as prism-shaped,
By carrying out the tolerance settings of the sectional dimension of the machined object of grinding, attrition process for ± 0.5mm, by this machined object
The tolerance settings of the cross sectional shape in the corner that 2 side surface part intersect each other is ± 0.1 degree.
22. grindings according to claim 20, attrition process system, it is characterised in that
Described machined object be shaped as prism-shaped,
By carrying out the tolerance settings of the sectional dimension of the machined object of grinding, attrition process for ± 0.5mm, by this machined object
The tolerance settings of the cross sectional shape in the corner that 2 side surface part intersect each other is ± 0.1 degree.
23. grindings according to claim 19, attrition process system, it is characterised in that
Being shaped as of described machined object is cylindric,
It is ± 0.5mm by the tolerance settings carrying out the sectional dimension of the machined object of grinding, attrition process.
24. grindings according to claim 20, attrition process system, it is characterised in that
Being shaped as of described machined object is cylindric,
It is ± 0.5mm by the tolerance settings carrying out the sectional dimension of the machined object of grinding, attrition process.
The grinding of 25. 1 kinds of hard brittle materials, Ginding process, it is characterised in that
Use the grinding described in described claim 1, attrition process system, carry out grinding utilizing described grinding attachment
After, utilize described lapping device to be ground processing.
The grinding of 26. 1 kinds of hard brittle materials, Ginding process, it is characterised in that
Use the grinding described in described Claims 2 or 3, attrition process system, add utilizing described grinding unit to carry out grinding
After work, described grinding unit is utilized to be ground processing.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011-201809 | 2011-09-15 | ||
| JP2011201809 | 2011-09-15 | ||
| PCT/JP2011/075979 WO2013038573A1 (en) | 2011-09-15 | 2011-11-10 | System for grinding/polishing hard and brittle materials, and grinding/polishing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103561908A CN103561908A (en) | 2014-02-05 |
| CN103561908B true CN103561908B (en) | 2016-09-28 |
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| CN201180071168.6A Active CN103561908B (en) | 2011-09-15 | 2011-11-10 | The grinding of hard brittle material, attrition process system and grinding, Ginding process |
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| Country | Link |
|---|---|
| JP (1) | JP5842920B2 (en) |
| KR (1) | KR20140062431A (en) |
| CN (1) | CN103561908B (en) |
| TW (1) | TWI564948B (en) |
| WO (1) | WO2013038573A1 (en) |
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| KR20150073214A (en) * | 2013-10-02 | 2015-06-30 | 엔지케이 인슐레이터 엘티디 | Method for producing polished article |
| CN103567840B (en) * | 2013-11-13 | 2016-08-31 | 佛山市博科数控机械有限公司 | A kind of mechanical arm multi-station belt sander |
| CN105538103B (en) * | 2015-12-04 | 2017-12-22 | 无锡普瑞明思机械制造有限公司 | A kind of hand-held polishing machine of handware |
| US10350722B2 (en) | 2016-02-05 | 2019-07-16 | Toshiba Kikai Kabushiki Kaisha | Polishing apparatus |
| US10363647B2 (en) | 2016-02-05 | 2019-07-30 | Toshiba Kikai Kabushiki Kaisha | Grinding tool |
| JP6976745B2 (en) * | 2017-06-30 | 2021-12-08 | 株式会社ディスコ | Wafer generator |
| JP6482618B2 (en) * | 2017-08-22 | 2019-03-13 | Ｔｏｗａ株式会社 | Processing apparatus and processing method |
| JP6926828B2 (en) * | 2017-08-28 | 2021-08-25 | 村田機械株式会社 | Deburring device |
| WO2019102629A1 (en) * | 2017-11-23 | 2019-05-31 | 新東工業株式会社 | Polygonal column member machining device and machining method |
| CN108527144B (en) * | 2018-03-28 | 2019-11-15 | 昆山国显光电有限公司 | Substrate grinding device and its grinding method |
| CN110480466A (en) * | 2018-05-15 | 2019-11-22 | 浙江永耀机械科技有限公司 | Single travelling is without cambered surface crystal roller polished machine |
| WO2020056538A1 (en) * | 2018-09-17 | 2020-03-26 | 苏州迈创信息技术有限公司 | Automatic grinder |
| CN109648466B (en) * | 2018-12-28 | 2023-10-10 | 芯思杰技术(深圳)股份有限公司 | Chip wax sealing device |
| CN110561264B (en) * | 2019-10-10 | 2020-08-25 | 温州冲亚电子科技有限公司 | Crystal bar outer diameter grinding equipment for semiconductor components and parts |
| CN112207668A (en) * | 2020-09-26 | 2021-01-12 | 郑州竹蜻蜓电子科技有限公司 | Chip angle grinding device for manufacturing semiconductor device and using method thereof |
| CN113319669B (en) * | 2021-06-24 | 2022-04-08 | 福州天瑞线锯科技有限公司 | Polishing method and system for grinding surface of material rod |
| CN117681107A (en) * | 2024-02-01 | 2024-03-12 | 山东豪迈机械制造有限公司 | Air balance excircle polishing machine |
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- 2011-11-10 JP JP2013533455A patent/JP5842920B2/en active Active
- 2011-11-10 CN CN201180071168.6A patent/CN103561908B/en active Active
- 2011-11-10 KR KR1020137031519A patent/KR20140062431A/en not_active Application Discontinuation
- 2011-11-10 TW TW100141025A patent/TWI564948B/en active
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Also Published As
| Publication number | Publication date |
|---|---|
| TW201312644A (en) | 2013-03-16 |
| JP5842920B2 (en) | 2016-01-13 |
| WO2013038573A1 (en) | 2013-03-21 |
| CN103561908A (en) | 2014-02-05 |
| KR20140062431A (en) | 2014-05-23 |
| TWI564948B (en) | 2017-01-01 |
| JPWO2013038573A1 (en) | 2015-03-23 |
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