KR20130092375A - Polishing device for columnar member and polishing method therefor - Google Patents

Abstract

The present invention provides a low cost polishing device having a high polishing ability to remove microcracks present in a cylindrical surface layer made of a hard brittle material, and a fine polishing ability to refine surface roughness by removing surface irregularities. A clamping means connected to the rotating means of the workpiece and clamping both end faces of the workpiece, polishing means for polishing while the tip of the polishing tool contacts and rotates the machining surface, and the polishing means with respect to the workpiece. Moving means for relatively moving in the longitudinal direction orthogonal to the cross-sectional direction of the workpiece, height position detecting means for storing the height position of the workpiece surface detected before polishing, and the position detecting means The control means which computes the stored height position and the cutting amount of the front-end | tip of the said grinding | polishing means to perform grinding | polishing process is provided.

Description

Polishing device for a cylindrical member and its polishing method {POLISHING DEVICE FOR COLUMNAR MEMBER AND POLISHING METHOD THEREFOR}

TECHNICAL FIELD This invention relates to the grinding | polishing apparatus which grinds the surface layer part (henceforth only a "surface layer part") of the outer peripheral surface of the cylindrical shaped workpiece which consists of a hard brittle material.

The cylindrical member of the hard brittle material to be polished of the present invention includes, for example, a silicon block made of a material for slicing with a wire saw to obtain a silicon wafer, wherein the silicon block has a single crystal material. Alternatively, the silicon ingot made of polycrystal is cut by a band saw or file saw and formed into a cylindrical shape. When the required precision with respect to the external dimension after the cutting is high, the surface layer surface is ground.

The single crystal silicon block obtained by the Czochralski method (CZ method) or the like, or the polycrystalline silicon block obtained by the casting method or the like is sliced by a file saw in a subsequent step to produce a silicon wafer, and microcracks and minute unevenness exist at the surface layer. Since the cracks and defects of the silicon wafers produced during the slicing of the lower surface are liable to occur, Patent Literature 1 and Patent Literature 2 remove the micro-unevenness (and microcracks) present in the surface layer by polishing and removing the surface layer portion of the silicon block. In order to improve the production yield of a silicon wafer, it is disclosed. In particular, in patent document 1, planarizing the surface roughness Ry 10-20 micrometers before grinding | polishing to 3-4 micrometers by grinding | polishing removal of the surface layer part of the silicon block 50-50 micrometers or more and 200 micrometers or less from the surface is disclosed. . Moreover, patent document 3 is disclosed as a grinding | polishing apparatus of a silicon block.

Japanese Laid-Open Patent Publication No. 2005-347712 Japanese Laid-Open Patent Publication No. 2002-252188 Japanese Laid-Open Patent Publication No. 2009-233794

Patent Documents 1 to 3 each disclose a method for polishing a surface layer portion and a polishing apparatus of a silicon block of a quadrilateral columnar member, and the apparatus for performing polishing processing on the surface layer portion of a cylindrical member to be performed by the present invention. It is not disclosed.

An object of the present invention is to provide a polishing apparatus and a polishing method for satisfying the above requirements and enabling polishing of the surface layer portion of a hard material such as a cylindrical silicon block, which is a workpiece, by one apparatus. .

In a first aspect of the present invention, a polishing apparatus for polishing a surface layer portion of an outer circumferential surface of a cylindrical workpiece, which is connected to a rotating means of the workpiece, and sandwiches both end faces of the workpiece. The clamp means, the polishing means for polishing while the tip of the polishing means contacts and rotates on the outer circumferential surface of the workpiece, and the polishing means with respect to the workpiece is orthogonal to the substantially circular cross-sectional direction of the workpiece. Moving means for relatively moving in the longitudinal direction, height position detecting means for detecting the height position of the finished product and the workpiece before polishing, and the height position and the processing condition are input, and control for performing the polishing operation by calculating this Means for calculating the difference between the height position of the polished finished product and the height position of the workpiece before polishing; Is a calculation for setting other processing conditions from the input processing conditions, or a combination thereof.

In the second invention, in the polishing apparatus of the cylindrical member according to the first invention, the polishing means is a polishing brush, and in the polishing brush, a base material containing abrasive grains is the bottom of the polishing brush. The technical means of having the structure planted in plural in ring shape at the part is used.

In the third invention, in the polishing apparatus of the cylindrical member according to the first invention, the polishing means is a polishing brush, and the polishing brush is a base portion of a polishing tool in which a plurality of base materials containing abrasive grains are bundled. ) Has a structure in which a plurality of plates are planted on a plate with a polishing tool.

In a fourth aspect of the invention, in the polishing apparatus of the cylindrical member according to the first invention, the polishing means is a polishing brush, and the polishing brush has an elastic body containing abrasive grains arranged in a ring shape at the bottom of the polishing brush. It uses the technical means of having a structure.

In 5th invention, in the grinding | polishing apparatus of the cylindrical member as described in any one of 2nd-4th invention, the said grinding | polishing means is attached in multiple numbers along the axial center of a cylindrical workpiece. It is arrange | positioned, and the technical means called.

In the sixth invention, in the polishing apparatus of the cylindrical member according to any one of the second to fourth inventions, the polishing means includes first polishing means and second polishing means disposed in the same plane of the circular cross section of the workpiece. The shaft centers of the first polishing means and the second polishing means are arranged so as to coincide with the radial direction of the workpiece, and the shaft center of the first polishing means and the second polishing means have a predetermined angle θ. The technical means of arranging in the cross section at the center of the cross section of the workpiece is used.

In the seventh invention, in the polishing apparatus of the cylindrical member according to the sixth invention, a plurality of the first polishing means and the second polishing means are arranged in succession along the axis of the cylindrical workpiece. Use technical means.

In 8th and 9th invention, in the grinding | polishing apparatus of the cylindrical member as described in 5th or 7th invention, the particle size of the abrasive grain mixed with the base material or elastic body used for the said grinding | polishing means is F180- # 2000, The Two or more types of polishing means having a base material or an elastic body having different particle sizes are selected, and the polishing means having different particle sizes of the abrasive grains is formed so that the abrasive grains are polished in the order of "large" to "small". The technical means of being provided in series along the axis of a workpiece is used.

In 10th and 11th invention, in the grinding | polishing apparatus of the cylindrical member as described in 5th or 7th invention, the particle size of the abrasive grain mixed with the base material or elastic body used for the said grinding | polishing means is F180- # 2000, and the particle size is approximately The technical means that the grinding | polishing means which has the same base material or an elastic body is provided in series along the axial center of a cylindrical workpiece is used.

In the twelfth invention, in the cylindrical member polished by the polishing apparatus of the cylindrical member according to the first invention, micro cracks existing at 100 µm or less from the surface layer of the workpiece are removed and further polished. The technical means that the surface roughness Ry of a process surface becomes 3 micrometers or less is used.

In the thirteenth invention, in the cylindrical member according to the twelfth invention, the technical means that the cylindrical member is a silicon block or ceramic is used.

In the 14th invention, as a method of grinding a cylindrical member by the polishing device of the cylindrical member according to the first invention, the workpiece to be held by the clamp means is rotated by the rotating means,

Contacting and rotating the tip of the polishing means to the outer peripheral surface of the workpiece,

Moreover, the technical means of performing a grinding | polishing process by moving the said grinding | polishing means relative to the to-be-processed object is used.

In the fifteenth and sixteenth inventions, a method of grinding a cylindrical member by the polishing apparatus of the cylindrical member according to the fifth or seventh invention, wherein the grain size of the abrasive grains mixed with the base material or elastic body used in the polishing means is F180. 2 or more types of grinding | polishing means which has a base material or an elastic body from which the particle size differs, and whose abrasive grains differ in the particle size of an abrasive grain are grind | polished in order of the particle size of an abrasive grain from "big" to "small". In order to use this technique, the technical means of grinding and arranging in series along the axis of the cylindrical workpiece is used.

In the seventeenth and eighteenth inventions, a method of grinding a cylindrical member by the polishing apparatus of the cylindrical member according to the fifth or seventh invention, wherein the grain size of the abrasive grains mixed with the base material or elastic body used in the polishing means is F180. The technical means of grinding | polishing means which is-# 2000 and which has the base material or elastic body of substantially the same particle size is installed and polished continuously along the axis of a cylindrical workpiece.

The polishing means can polish the surface layer portion of the workpiece by contacting the outer circumferential surface of the cylindrical workpiece and simultaneously rotating the workpiece by the rotating means. Further, the workpiece to be clamped to the clamp means is rotated in the circumferential direction by the rotation means (hereinafter referred to as the rotation means (for the workpiece)), so that the surface layer portion of the workpiece can be uniformly polished. Moreover, during this polishing, the entire workpiece can be uniformly polished by moving the polishing means in the longitudinal direction of the workpiece relative to the workpiece, that is, orthogonal to the substantially circular cross section. . The substantially circular includes not only a circular shape but also a slightly non-circular state generated by distortion in the manufacturing process of the workpiece (cylindrical member), such as an ellipse or the like.

Before the start of polishing, the standard piece of the polished finished product (hereinafter referred to as " masterwork ") is detected and stored by the height position detecting means for the height position at which the polishing processing is started by the polishing means. The height position of the workpiece is detected, and the difference between the height position detected by the masterwork and the height position detected by the workpiece is calculated by the control means, and the tip of the polishing means and the workpiece are calculated based on the calculation result. By correcting the distance, polishing of a plurality of workpieces can be performed continuously. For reference, the "input" described in the first invention is information input (memory) to the control means manually (worker), information automatically input (memory) to the control means, manually or / and automatically input (memory) It includes all the information inputted (memorized) after calculating based on the information.

In addition, by using the polishing brush composed of the base material containing abrasive grains as the polishing means, sufficient polishing force can be secured, and damage to the workpiece can be suppressed by polishing. This is because, for example, the base material is more flexible than other polishing methods such as polishing with abrasive stones, so that damage caused by polishing can be suppressed on the workpiece, and since abrasive grains are contained in the base material, the polishing force is sufficient. It can be secured.

Moreover, the length of the base material exposed from the bottom part of a grinding | polishing means can be adjusted by arbitrarily setting the position (up-down direction) of the plate with a grinding | polishing tool with the grinding | polishing tool which bundled the said base material. That is, by moving the position of the plate with the polishing tool downward in accordance with the wear of the base material, the length of the exposed base material can be kept constant at all times.

In addition, since the contact with the workpiece during polishing is an elastic body, damage caused by contact of the workpiece with the polishing brush can be reduced.

In addition, the grain size of the abrasive grains mixed with the said base material is F180- # 2000 (JIS R6001: 1998), and one grinding | polishing means is a grinding | polishing brush in which substantially the same particle diameter is mixed. That is, the polishing means having a larger base material or elastic body has a higher polishing ability, so that micro cracks present in the surface layer portion of the workpiece can be precisely removed, and the polishing means having a base material or elastic body having a smaller particle size, The surface layer portion may be finely polished to remove unevenness.

Further, by arranging and arranging a plurality of polishing means along the axis of the cylindrical workpiece, the polishing means can be appropriately selected and processed according to the type and purpose of the workpiece. That is, two or more types of grinding | polishing means which has the base material or elastic body from which the particle size differs are selected, and the said particle size contained in the base material or elastic body with which the said grinding | polishing means is equipped in order from "big" to "small." By providing the workpiece successively so as to pass through the workpiece, microcracks and unevenness of the surface layer portion of the workpiece can be removed by one polishing process. In addition, as described above, when the surface required by one step of processing is obtained without requiring multistage processing such as "large" to "small" (for example, the surface of the workpiece W) In the case where the microcracks are minute and the surface roughness does not have a large difference compared to the required value, only the small ones are processed), and the particle size of the abrasive grains contained in the base material or elastic body provided by two or more polishing means successively provided is Processing time can be shortened by making it substantially the same for all the grinding | polishing means.

Further, in the polishing means composed of the first polishing means and the second polishing means arranged in the same plane of the circular cross section of the workpiece, the axis of the first polishing means and the second polishing means is arranged so as to coincide with the plate diameter direction of the workpiece. The machining time can be shortened by arranging the axis of the first polishing means and the axis of the second polishing means to intersect at the center of the end face of the workpiece so as to form a predetermined angle θ.

In addition, by arranging and arranging the said 1st grinding | polishing means and the 2nd grinding | polishing means along the axial center of a cylindrical workpiece, respectively, the processing time mentioned above according to the kind and objective of a to-be-processed object can be shortened.

In addition, by using the polishing apparatus, a 100 micrometer micro crack is removed from the surface layer and a cylindrical member having a surface roughness Ry of 3 micrometers or less can be obtained. As the cylindrical member, a hard brittle material such as a silicon block or a ceramic can be preferably used.

BRIEF DESCRIPTION OF THE DRAWINGS It is explanatory drawing which shows the whole of the grinding | polishing apparatus of this invention.
2: is explanatory drawing which shows an example of the grinding | polishing means of this invention, FIG. 2 (A) is a partial notch sectional view seen from the front, FIG. 2 (B) is a bottom view.
Fig. 3 is an explanatory view showing another example of the polishing means of the present invention. Fig. 3A is a schematic diagram in which a base material is planted at the bottom, and Fig. 3B is an elastic body planted at the bottom. It is a schematic diagram.
4 is a flowchart for explaining the first embodiment of the present invention.
It is a flowchart for demonstrating 1st Embodiment in this invention.
It is a flowchart for demonstrating 1st Embodiment in this invention.
It is a flowchart for demonstrating 1st Embodiment in this invention.
It is explanatory drawing which shows 3rd Embodiment in this invention.
It is explanatory drawing which shows 3rd Embodiment in this invention.

Details of the configuration and operation of the polishing apparatus according to the first embodiment of the present invention will be described with reference to the drawings. The polishing apparatus according to the first embodiment is a polishing apparatus for a cylindrical member provided with two or more (three) polishing means having different polishing roughnesses.

FIG. 1 is a clamp unit 5 arranged left and right in a drawing of a polishing unit 1 stopped at a position before the start of polishing at the right end in the drawing and a work W shown by a dashed-dotted line. It is arranged on the left side of the workpiece W, and is disposed on the right side of the workpiece W and the gripping portion 6A attached to the tip of the reference side clamp shaft 12A sliding by the cylinder drive of the clamp means 5. The front view of the grinding | polishing apparatus provided with the holding part 6B attached to the front-end | tip of the driven side clamp shaft 12B is shown. In FIG. 1, the holding parts 6A and 6B are arrange | positioned in the retreat position, respectively, and the open state which does not clamp the to-be-processed object W is shown. The polishing unit 1 includes three polishing means 2 each connected to a rotating means 2a (for polishing means), and the height position of the processing surface P (outer peripheral surface) of the workpiece W before polishing start. It consists of the height position detection means 3 for detection. For reference, the polishing unit is conveyed from the left side to the right side in FIG. 1 when performing the polishing by a conveying means (not shown) which conveys the polishing means 2 relative to the workpiece W. The grinding | polishing means 2 is provided in series from the right side as rough polishing, medium polishing, and finish polishing. That is, the particle size of the abrasive grains contained in the base material with which the grinding | polishing means is equipped becomes "large thing" → "small thing" in order from the right side. The height position detecting means 3 is provided on the right side of the rough polishing means 2 for roughing.

The above-described rough polishing means 2 in the three polishing means 2 is provided for the purpose of increasing the polishing capability and removing almost all of the micro cracks present in the surface layer portion. The polishing means 2 is provided for the purpose of removing unevenness of the surface generated when cutting with a band saw or file saw and miniaturizing the surface roughened by the rough polishing. It is installed for the final adjustment of illuminance. For reference, if the removal of the surface irregularities and the refinement of the surface roughness are completed in the medium polishing step, the polishing means 2 for finishing polishing may not be used, and the polishing means 2 may be used as two stations. .

Prior to the processing of the workpiece W, a masterwork is used to set the height position at which the height position detecting means 3 starts the polishing process of the polishing means 2.

In order to set the height position, both ends of the masterwork are first clamped by the clamp means 5. When clamping the master work by the clamping means 5, it is preferable to carry out mounting on the base (not shown) which has a V-shaped groove, for example. By providing the masterwork in the groove, the center in the left and right directions in the drawing of the masterwork can always be approximately the same position. Moreover, it is more preferable that the said base has adjustment means (not shown) for fine-adjusting the installation position of the up-down direction in the figure. The master work is placed on the base, and the clamp shafts 12A and 12B of the clamp means 5 are respectively advanced so that the grip portions 6A and 6B hold both ends of the master work. Thereafter, the base is separated. In this embodiment, installation and removal of the base having a V-shaped groove are performed by moving the base up and down in the figure. (See FIG. 4).

The clamp means 5 is rotated by a rotating means (for a workpiece, not shown), that is, rotates around the axis centers of the clamp shafts 12A and 12B, so that the clamp shaft 12A as viewed from the cross-sectional side of the masterwork. And centering of the gripping portions 6A and 6B at the tip of 12B) and the axis of the masterwork should be adjusted. This adjustment is carried out by the said adjustment means, and a master work is clamped. In this way, after the height position of the outer circumferential surface of the master work is measured by the height position detecting means 3 using the master work provided at the machining position, the master work is separated from the clamp means 5. In this embodiment, the master work measuring the outer circumferential surface height position (H ₁₎ of the master workpiece, by a height position detecting means (3) which is provided on and then clamped by clamping means (5), the polishing unit 1 and thereafter rotating the master work (e. g., 180) to, and measure the height position of the rotation in a state (H _2). When the difference between H ₁ and H ₂ is calculated and H ₁ and H ₂ are not substantially the same, after raising the base, the clamp shafts 12A and 12B are retracted, respectively, to release the master support. Based on the calculation result, the height position of the base (up and down stop position for supporting the master work by the clamp means 5) is adjusted (raised or lowered), and then the master work is fitted by the clamp means 5 again. In support, H ₁ and H ₂ of the fitted masterwork are measured. When H ₁ and H ₂ are approximately equal, the centering process of the masterwork is completed (see FIG. 5).

After the centering process of the masterwork is completed, the polishing unit 1 moves in the right direction in FIG. 1. Then, while raising the base, the clamp shafts 12A and 12B are retracted to release the master support, and the master work is placed on the V-shaped grooves of the base. Thereafter, the master work is exchanged with the workpiece W to perform a centering process as in the master work. When the centering process is complete, the polishing unit is moved to the left side in FIG. For reference, the outer circumferential surface height position H of the workpiece W by the centering process of the master work, and the outer circumferential surface height position h of the workpiece W by the centering process of the workpiece W are respectively provided to the control means. I remember.

Processing conditions input to the control means in advance (rotational speed of the polishing means 2, rotational speed of the workpiece W, feed rate of the polishing unit 1, (processing surface P of the workpiece W) ) The arithmetic processing is performed based on the cutting amount and the outer circumferential surface height positions H and h to move the polishing unit 1 in the vertical direction, that is, in the distance direction between the polishing unit and the processing surface P. FIG.

Based on the processing conditions, the polishing means 2 and the workpiece W are rotated by the control means 13 at a predetermined rotational speed. Thereafter, the polishing unit 1 is similarly moved by the control means 13 to the right in FIG. 1 at a predetermined movement speed. By this movement, the to-be-processed part P of the to-be-processed object W and the rotating part of the grinding | polishing means 2 which rotate are contacted, and polishing process is performed. As described above, the polishing means 2 is arranged in the order of "large" to "small" in order from the right side to the left side in FIG. → "Medium polishing" → "Finish polishing" is performed. After the polishing unit is moved to the predetermined position (rightmost end), the base is raised, after which the clamp means 12A and 12B retreat, and the fitting support of the workpiece W is released to thereby release the workpiece. Polishing is completed by taking out (W).

In the case of processing the plurality of workpieces W, after the new workpiece W is installed on the base, the workpiece is subjected to a polishing process through a clamp stroke of the workpiece and a centering stroke of the workpiece. That is, by first measuring the height position of the master work, the plurality of workpieces W can be polished afterwards (see Figs. 6 and 7).

In the present embodiment, the polishing unit 1 is transferred in the lateral direction in the drawing, but the workpiece W may be transferred, or both the polishing unit 1 and the workpiece W may be transferred.

In the present embodiment, the machining conditions are manually input to the control means, but from the manually input machining conditions and the automatically entered (remembered) outer peripheral surface height position, the machining conditions not inputted are calculated by the control means to perform polishing processing. You may do it. For example, the workpiece W is moved by inputting a cutting amount (hereinafter referred to simply as "cutting amount") of the tip of the polishing means with respect to the processing surface P of the workpiece and the rotational speed of the polishing means 2. The speed may be calculated by the control means 13, or the cutting amount may be calculated by the control means 13 from other processing conditions or height positions. And polishing process can be performed based on these calculation results.

The processing conditions to input are not limited to the item of this embodiment. For example, the kind of the grinding | polishing means 2 and the state of a to-be-processed object may be input, and the calculation by the control means 13 may be combined based on these.

2 (A) and (B) show an example of the polishing brush 1 which is the polishing means 2, and binds a base material 10a made of synthetic resin such as nylon mixed with abrasive grains to polish the polishing tool. (10), the base portion of the polishing tool 10 is detachably attached to the polishing tool attachment plate 11 which is connected to the rotating means 2a (for the polishing tool) so as to rotate horizontally. Polishing is carried out by contact rotation of the working surface P of the blade), and when the polishing tool 10 wears, the polishing tool 10 can be detached from the plate attached with the polishing tool 11 and replaced with a new polishing tool 10. It is. For reference, the polishing brush serving as the polishing means 2 is not limited to that shown in FIG. 2, and directly attaches the polishing tool 10 made of the base material 10a mixed with the abrasive grains to the polishing tool attachment plate 11. When the polishing tool 10 is worn out, the polishing tool 10 may be replaced with the plate 11 with the polishing tool, and may be made of synthetic resin such as nylon containing abrasive grains without using the polishing tool 10. You may plant the base material 10a in the ring shape at the bottom of the grinding | polishing means 2 (refer FIG. 3 (A)). Further, for example, the polishing means 2 and the workpiece (such as a case where the polishing means 2 comes into contact with a corner of a columnar body having an angle of approximately 90 ° at the time of polishing, such as ceramic or the like) When it is a problem that defects (chipping) occur due to the contact of W, an elastic body 10b made of synthetic resin containing abrasive grains may be arranged in a ring shape at the bottom of the polishing means (Fig. 3 (B)). In this case, the elastic body 10b may be, for example, a bulk body of a resin having a relatively soft hardness, a bulk body of a resin based on polyurethane or urethane having a large number of bubbles therein, or a fiber-like elastic body. do. In the bulk body of resin whose hardness is comparatively soft, resin itself acts as a buffer material. In the bulk body of resin which has a bubble, an internal bubble acts as a buffer material. In the elastic bodies containing abrasive grains and being woven together, the elastic bodies are woven so that air is contained within these assemblies, and this air layer acts as a cushioning material. In any case, the type of the synthetic resin, the content of the abrasive grains, and the like are appropriately selected so that the elastic body 10b maintains an appropriate elastic force when the elastic body 10b comes in contact with the workpiece. (See Fig. 3. Fig. 3A and Fig. 3). In (B), the upper drawing shows the front and the lower drawing shows the bottom.)

For reference, the grain size of the abrasive grains mixed in the base material or the elastic body is preferably selected from the range of F180 to # 2000 (the definition of the grain size according to JIS standard R6001: 1998).

Evaluation test

Below, the workpiece W is made into a cylindrical single crystal silicon block (Φ 175 mm x 500 mm), and the surface layer portion of the workpiece W is processed using the polishing apparatus of the present invention, which is present in the surface layer portion. The microcracks and the surface irregularities are removed and the surface roughness is refined to evaluate the polishing effect, and when the silicon block is formed by slicing the silicon block into a silicon wafer to form a silicon wafer, the incidence rate of defective products due to cracks and defects of the silicon wafer, The evaluation test result which could be reduced is demonstrated.

In the surface layer portion of the workpiece W before polishing, microcracks having a depth of 80 to 100 µm exist and the surface roughness Ry is 9 to 11 µm (a definition of Ry according to JIS standard B0601: 1994). The incidence of defective products due to cracks and defects when the silicon block was cut (sliced) into a silicon wafer by a file saw was 5 to 6%.

After the silicon block, which is the workpiece W, is polished using the polishing apparatus according to the first embodiment, the microcracks and the unevenness are removed and the surface roughness is micronized. The result which reduced the incidence rate of the defective product by the crack and the defect at the time of forming is demonstrated.

The processing conditions in this evaluation test were set as shown in Table 1, input to the control means 13, and three single crystal silicon blocks were processed. The results are shown in Table 2. As described above, by performing the machining using the polishing apparatus of the first embodiment, the depth of the microcracks present in the surface layer portion of the single crystal silicon block and the unevenness of the outer circumferential surface thereof can be greatly reduced. As shown, the maximum depth of the microcracks was 0.7-0.9 占 퐉 and the surface roughness Ry0.7-1.0 (mean: Ry0.9) of the flat portion, which was able to reduce the microcracks and the unevenness and the surface roughness. In addition, when all three silicon blocks were sliced with a string saw, the incidence of defective products due to cracks and defects when the silicon wafers were formed could be reduced by 2%. The maximum depth of the microcracks is preferably 3.0 μm or less, preferably 2.3 μm or less. When the said maximum depth is 3.0 micrometers or more, the incidence rate of the said inferior goods will increase. Moreover, when the said maximum depth is 2.3 micrometers or less, there is little influence on the incidence rate of the defective product by a crack, a defect, etc., when slice-processing to the thickness of several tens of micrometers and making it into a silicon wafer. In this evaluation test, the said maximum depth was 0.9 micrometer, and was able to fall significantly below 2.3 micrometers which affects the incidence rate of the said inferior goods.

[Table 1]

[Table 2]

Next, the polishing apparatus which concerns on 2nd Embodiment is demonstrated. In the grinding | polishing apparatus which concerns on 2nd Embodiment, it is an apparatus structure used when the surface requested | required by the process of one step is obtained, without requiring multistage processing of "big thing" → "small thing." For reference, only the points different from the first embodiment will be described here.

For example, when the microcracks before the grinding | polishing process of the surface of the to-be-processed object W are minute, and the surface roughness before a grinding | polishing process does not have a big difference compared with a required value, the grinding | polishing means 10 (abrasive brush) is mentioned above. Processing can be performed only by "medium polishing" or "finishing polishing". In such a case, only one grinding | polishing means 10 provided with the base material or elastic body containing the abrasive grain of the particle size suitable for a grinding | polishing objective is provided, and a process is performed.

Moreover, processing time can be shortened by making the particle size contained in the base material or elastic body with which the tri-polishing means 2 in 1st Embodiment is made substantially the same.

Next, the grinding | polishing apparatus concerning 3rd Embodiment is demonstrated, referring FIG. 8 and FIG. In the grinding | polishing apparatus which concerns on 3rd Embodiment, it is the apparatus structure which arrange | positioned the grinding | polishing means 2 so that processing time may be shortened. For reference, only the points different from the first embodiment will be described here.

In the polishing apparatus according to the third embodiment, the first polishing means 21a and the second polishing means 22a are disposed in the surface of the same cross section (circular) of the workpiece W. FIG.

The shaft center of the 1st grinding | polishing means 21a and the 2nd grinding | polishing means 22a is arrange | positioned so that it may correspond to the radial direction of the to-be-processed object W, and the 1st grinding | polishing means 21a and the 2nd grinding means 22a are In order not to interfere with each other, the shaft center of the first polishing means 21a and the shaft center of the second polishing means 22a are arranged to intersect at the cross-sectional center of the workpiece W so as to constitute a predetermined angle θ. (See FIG. 8) The angle θ can be arbitrarily set as long as the first polishing means 21a and the second polishing means 22a do not interfere with each other, but the angle θ is set to 180 °. It can also be set so that the shaft center of the 1st grinding | polishing means 21a and the shaft center of the 2nd grinding | polishing means 22a may mutually match and oppose.

In this configuration, since the workpiece W is polished while rotating in the circumferential direction, the workpiece surface is polished simultaneously in two parts of the first polishing means 21a and the second polishing means 22a, thereby processing The time is shortened.

In addition, also in the polishing apparatus according to the third embodiment, similarly to the polishing apparatus according to the first embodiment, FIG. 9 (the right view in FIG. 9 is a view when the workpiece W is seen from the front, and the left view is As shown in FIG. 9, the first polishing means 21a and the second polishing means 22a are arranged in the longitudinal direction of the workpiece W in the longitudinal direction of the work W. As shown in FIG. Alternatively, it may be arranged in three stations (FIG. 9 shows the state of the three stations arrangement).

In this case, the first polishing means 21a and the second polishing means 22a and the first polishing means 21b of the second row and the first row means in the order from the left along the longitudinal direction of the workpiece W The second polishing means 22b and the first polishing means 21c and the second polishing means 22c in the third row are arranged.

In that case, the particle size of the abrasive grain contained in the base material or elastic body with which each grinding | polishing means is equipped is the same as the grinding | polishing means 21a and 22a, the grinding | polishing means 21b and 22b, and the grinding | polishing means 21c and 22c, respectively, Have approximately the same abrasive force.

In addition, similarly to the second embodiment, when it is possible to process by polishing means having one polishing force, the particle size of the abrasive grains contained in the base material or elastic body provided in the entire polishing means can be made substantially the same.

In addition, in the polishing apparatus according to the third embodiment described above, a configuration in which two polishing means of the first polishing means 21a and the second polishing means 22a are provided in the circumferential direction of the workpiece W will be described. However, the present invention is not limited thereto, and as long as the polishing means do not interfere with each other, any number of polishing means may be arranged in accordance with the installation space, the target machining time, and the like.

As mentioned above, although this case and the evaluation test demonstrated the case which grinds a silicon block as an example, this invention is not limited to a cylinder block, For example, it can use suitably for all hard brittle materials, such as a ceramic. .

For reference, in this specification, the "particle size is substantially the same" of an abrasive grain is a concept including the abrasive grain of "the particle size from which an equivalent grinding | polishing effect is obtained" in addition to the abrasive grain of "the same particle size."

1: polishing unit
2: polishing means
2a: rotating means (for polishing tools)
3: height position detecting means
5: clamp means
6A: Holding part (reference position side)
6B: Holding part (following side)
10: polishing tool
10a: base material
10b: elastic body
11: plate with polishing tool
12A: Clamp shaft (reference position side)
12B: Clamp Shaft (Following Side)
13 control means
14A: Rotating means (for workpiece) (reference position side)
14B: Rotating means (for workpiece) (following side)
W: Workpiece
P: machining surface

Claims (18)

A polishing apparatus for polishing a surface layer portion of an outer circumferential surface of a cylindrical workpiece.
A clamp means connected to the rotating means of the workpiece, the clamp means for fitting and supporting both end faces of the workpiece;
Polishing means for performing polishing while the tip of the polishing means is in contact rotation with the outer circumferential surface of the workpiece;
Moving means for moving said polishing means relative to said workpiece in a longitudinal direction orthogonal to a substantially circular cross-sectional direction of said workpiece;
Height position detecting means for detecting the height position of the finished workpiece and the workpiece before polishing;
The height position and the processing conditions are input, and it is provided with a control means for calculating the polishing operation,
The calculation may be any one of a calculation of a difference between the height position of the polished finished product and the height position of the workpiece before polishing, or an operation for setting different processing conditions from the input processing conditions, or a combination thereof. Polishing apparatus of a cylindrical member characterized by the above-mentioned. The method of claim 1,
The polishing means is a polishing brush, and the polishing brush has a structure in which a plurality of base materials containing abrasive grains are planted in a ring shape at the bottom of the polishing brush. Polishing apparatus for a cylindrical member. The method of claim 1,
The polishing means is a polishing brush, wherein the polishing brush has a structure in which a plurality of base portions of a polishing tool, in which a plurality of base materials containing abrasive grains are bundled, are planted and installed in a plate with a polishing tool. Polishing device for the member. The method of claim 1,
The polishing means is a polishing brush, and the polishing brush has a structure in which an elastic body containing abrasive grains is arranged in a ring shape at the bottom of the polishing brush. 5. The method according to any one of claims 2 to 4,
The polishing device is a polishing apparatus for a cylindrical member, characterized in that a plurality of the polishing means are arranged in succession along the axis of the cylindrical workpiece. 5. The method according to any one of claims 2 to 4,
The said polishing means consists of a 1st grinding means and a 2nd grinding means arrange | positioned in the same surface of the circular cross section of a to-be-processed object, and the axial center of a 1st grinding means and a 2nd grinding means is arrange | positioned so that it may correspond to the radial direction of a workpiece. The axial center of the first polishing means and the axial center of the second polishing means are arranged so as to intersect at the center of the cross section of the workpiece so as to form a predetermined angle θ. . The method according to claim 6,
The said 1st grinding | polishing means and the 2nd grinding | polishing means are arrange | positioned and arrange | positioned each along the axis center of the cylindrical workpiece, respectively, and are arrange | positioned, The grinding | polishing apparatus of the cylindrical member characterized by the above-mentioned. The method of claim 5, wherein
The grinding | polishing means of which the particle size of the abrasive grain mixed with the base material or elastic body used for the said grinding | polishing means is F180- # 2000, and two or more types of grinding | polishing means which have a base material or elastic body from which the particle size differs are selected, A polishing apparatus for a cylindrical member, wherein the abrasive grains are provided along the axis of the cylindrical workpiece to be polished in the order of "large" to "small". The method of claim 7, wherein
The grain size of the abrasive grain mixed with the base material or elastic body used for the said grinding | polishing means is F180- # 2000, 2 or more types of grinding | polishing means which has the base material or elastic body from which the particle size differs, and the grinding means from which the grain size of an abrasive grain differs A polishing apparatus for a cylindrical member, wherein the particle size of the cylindrical member is arranged along the axis of the cylindrical workpiece so as to be polished in the order of "large" to "small". The method of claim 5, wherein
The particle size of the abrasive grain mixed with the base material or elastic body used for the said grinding | polishing means is F180- # 2000, and the grinding | polishing means which has a base material or elastic body with substantially the same particle size is provided in series along the axis of a cylindrical workpiece. A polishing apparatus for a cylindrical member characterized by the above-mentioned. The method of claim 7, wherein
The particle size of the abrasive grain mixed with the base material or elastic body used for the said grinding | polishing means is F180- # 2000, and the grinding | polishing means which has a base material or elastic body with substantially the same particle size is provided in series along the axis of a cylindrical workpiece. A polishing apparatus for a cylindrical member characterized by the above-mentioned. By the polishing apparatus of the cylindrical member of Claim 1, the micro crack which exists in 100 micrometers or less from the surface layer of a to-be-processed object is removed, and surface roughness Ry of a grinding | polishing process surface is 3 micrometers or less The cylindrical member characterized by the above-mentioned. 13. The method of claim 12,
The cylindrical member is a cylindrical member, characterized in that the silicon block or ceramic. In the polishing device for a cylindrical member according to claim 1, the workpiece to be clamped to the clamp means is rotated by the rotating means,
Contacting and rotating the tip of the polishing means to the outer peripheral surface of the workpiece,
And polishing the cylindrical member by moving the polishing means relative to the workpiece. The polishing apparatus of the cylindrical member of Claim 5 WHEREIN: The particle size of the abrasive grain mixed with the base material or elastic body used for the said grinding | polishing means is F180- # 2000, and two kinds of grinding | polishing means which has a base material or an elastic body from which the particle size differs is carried out. The above-mentioned selection is carried out, and polishing means having different particle sizes of abrasive grains is installed and polished in series along the axis of the cylindrical workpiece so that the abrasive grains are polished in the order of "large" to "small". Polishing method of the cylindrical member to be. The polishing apparatus of the cylindrical member of Claim 7 WHEREIN: The particle size of the abrasive grain mixed with the base material or elastic body used for the said grinding | polishing means is F180- # 2000, and two kinds of grinding | polishing means which has a base material or an elastic body from which the particle size differs is carried out. The above-mentioned selection is carried out, and polishing means having different particle sizes of abrasive grains is installed and polished in series along the axis of the cylindrical workpiece so that the abrasive grains are polished in the order of "large" to "small". Polishing method of the cylindrical member to be. In the polishing apparatus of the cylindrical member of Claim 5, the abrasive grain mixed with the base material or elastic body used for the said grinding | polishing means is F180- # 2000, The polishing means which has a base material or elastic body whose particle size is about the same, A method of polishing a cylindrical member, wherein the cylindrical member is continuously polished by being installed along an axis of the workpiece. The polishing apparatus of the cylindrical member of Claim 7 WHEREIN: The grinding | polishing means of the abrasive grain mixed with the base material or elastic body used for the said grinding | polishing means is F180- # 2000, and the base material or elastic body whose particle size is about the same, A method of polishing a cylindrical member, wherein the cylindrical member is continuously polished by being installed along an axis of the workpiece.

Images