JPH11114800A - Method for specular-polishing cylindrical body - Google Patents

Method for specular-polishing cylindrical body

Info

Publication number
JPH11114800A
JPH11114800A JP30484597A JP30484597A JPH11114800A JP H11114800 A JPH11114800 A JP H11114800A JP 30484597 A JP30484597 A JP 30484597A JP 30484597 A JP30484597 A JP 30484597A JP H11114800 A JPH11114800 A JP H11114800A
Authority
JP
Japan
Prior art keywords
cylindrical body
polishing
grindstone
pva
mirror
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP30484597A
Other languages
Japanese (ja)
Other versions
JP3936448B2 (en
Inventor
Etsuji Yamagami
悦二 山上
Mori Shigeta
核 重田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
THINK LAB KK
Think Laboratory Co Ltd
Original Assignee
THINK LAB KK
Think Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by THINK LAB KK, Think Laboratory Co Ltd filed Critical THINK LAB KK
Priority to JP30484597A priority Critical patent/JP3936448B2/en
Publication of JPH11114800A publication Critical patent/JPH11114800A/en
Application granted granted Critical
Publication of JP3936448B2 publication Critical patent/JP3936448B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a method for specular-polishing a cylindrical body by a grinding wheel, capable of performing quick and high-precise specular polishing by grinding of the grinding wheel not by buffing. SOLUTION: In a method for specular-polishing a cylindrical body W, both ends of the cylindrical body W are chucked and rotated, the cylindrical body W is pressed by the grinding wheel end surface of a PVA grinding wheel 27b capable of being freely rotated, lubricating liquid is supplied to the pressing part, the PVA grinding wheel 27b is rotated with the rotation of the cylindrical body W, the PVA grinding wheel 27b is moved, and therefore, the minute relative speed is generated on the linear contact parts of the cylindrical body W and the PVA grinding wheel 27b, and the cylindrical body W is specular- polished.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本願発明は、円筒研磨する前
の円筒体の円筒精度が低くても、また円筒研磨精度が低
い円筒研磨装置を用いても、円筒体を全長にわたり均一
な直径となるように極めて高い円筒研磨精度が短時間に
得られ、さらにバフ研磨によらないで砥石研磨によって
迅速かつ高精度な鏡面研磨が行える研磨砥石による円筒
体の鏡面研磨方法に関する。
The present invention relates to a cylindrical body having a uniform diameter over its entire length even if the cylindrical body has a low cylindrical precision before the cylindrical body is polished, or even if a cylindrical polishing apparatus having a low cylindrical polishing precision is used. As described above, the present invention relates to a method for mirror-polishing a cylindrical body using a polishing grindstone, which can achieve extremely high cylindrical polishing precision in a short time and can perform quick and high-precision mirror-polishing by grindstone polishing without buffing.

【0002】[0002]

【従来の技術】従来、被製版ロールの中程の直径が両端
部の直径よりも大きいか小さいと、印刷が行われないの
で、被製版ロールは極めて高い円筒精度が要求される。
また、圧延ロールは更に高い円筒精度が要求される。し
かるに、砥石研磨装置で円筒体の円筒研磨を行うと、研
磨砥石の表面が漸次に崩壊していくので、その分につい
て補正をかけて円筒研磨を行うことで円筒精度を出すよ
うになっている。さらに、被製版ロールと圧延ロールの
いずれも鏡面研磨が施される必要がある。従来、200
0番〜3000番位の目が細かい炭化珪素製の研磨砥石
で円筒体を研磨しても鏡面研磨することは不可能であっ
た。従来において、移動可能かつ回転不能な平滑な研磨
砥石を回転される円筒体に押しつけると鏡面になること
が知られているが、これは、研磨砥石の目が直ぐに埋ま
ってしまうことから、円筒体の表面を研磨しているので
なく目が埋まった砥石をこすりつけて光沢をだしている
ものであり、均一な鏡面研磨が不可能であった。従来、
円筒体の鏡面研磨は、もっぱらバフ研磨により行われて
いた。詳述すると、800番位の目が粗い炭化珪素製の
研磨砥石で円筒研磨してから2000番〜3000番位
の目の細かい炭化珪素製の研磨砥石で精密円筒研磨して
からバフ研磨により鏡面研磨していた。
2. Description of the Related Art Conventionally, printing is not performed if the diameter of the middle of the plate making roll is larger or smaller than the diameter of both ends, so that the plate making roll requires extremely high cylindrical accuracy.
Further, the rolling roll is required to have higher cylindrical accuracy. However, when the cylindrical grinding of the cylindrical body is performed with the grinding wheel polishing device, the surface of the grinding wheel gradually collapses, so that the cylindrical grinding is performed by correcting the amount and performing the cylindrical grinding. . Further, both the plate making roll and the rolling roll need to be mirror-polished. Conventionally, 200
Even if the cylindrical body was polished with a fine grinding wheel made of silicon carbide of the 0th to 3000th ranks, it was impossible to perform mirror polishing. Conventionally, it has been known that pressing a movable and non-rotatable smooth polishing grindstone against a rotating cylinder results in a mirror surface, but this is because the eyes of the polishing grindstone are immediately buried. The surface was not polished, but rubbed with a grindstone with buried eyes to give a gloss, and uniform mirror polishing was impossible. Conventionally,
The mirror polishing of the cylindrical body has been performed exclusively by buffing. More specifically, the cylindrical surface is polished with a coarse grinding wheel made of silicon carbide at the 800th rank, and then the cylindrical surface is finely polished with the fine grinding wheel made of silicon carbide at the 2000th to 3000th ranks, and then the mirror surface is polished by buffing. Had been polished.

【0003】[0003]

【発明が解決しようとする課題】上記のように、円筒研
磨する前の円筒体の円筒精度が低い場合、上記従来の補
正をかけた円筒研磨を行っても円筒精度が高くなるとは
限らない。高い円筒精度を有する砥石研磨装置で補正を
かけて大きな研磨代をとって一回で円筒体の一端から他
端まで円筒研磨すると、円筒研磨する前の円筒体の円筒
精度がそのまま反映した円筒研磨精度しか得られない。
円筒研磨する前の円筒体の円筒精度が低くても、高い円
筒精度を得るには、極めて高い円筒精度を有する砥石研
磨装置を使用しかつ研磨砥石の表面が漸次に崩壊してい
く分について補正をかけて極めて微小な研磨代となるよ
うに円筒研磨を行うことを何回も反復して円筒体の中程
と両端部の直径の差を解消していく必要があった。そし
て、円筒研磨後は円筒体を取外し測定器に載置して円筒
精度を測定する必要があり、もしも、円筒精度が出てい
ないときは、円筒体を再び精密円筒研磨して再び円筒精
度を測定することを反復していたので、大変煩雑である
とともに時間がかかっていた。また、円筒研磨を反復す
ると、円筒体の直径が小さくなり過ぎる惧れがあった。
バフ研磨により円筒体を鏡面研磨すると、塵埃、騒音の
解消が問題となり、鏡面研磨に要する時間も長く、かつ
熟練が必要であった。
As described above, when the cylindrical accuracy of the cylindrical body before the cylindrical polishing is low, even if the conventional cylindrical polishing with the correction is performed, the cylindrical accuracy does not always become high. When the cylinder is polished from one end to the other end of the cylinder at one time with a large grinding allowance by making corrections with a grinding stone polishing device with high cylindrical accuracy, the cylindrical polishing that reflects the cylindrical accuracy of the cylindrical body before cylindrical polishing is reflected as it is Only accuracy can be obtained.
Even if the cylindrical body of the cylindrical body before polishing is low, in order to obtain high cylindrical precision, use a grindstone polishing device with extremely high cylindrical precision and compensate for the amount by which the surface of the grinding wheel gradually collapses It was necessary to eliminate the difference between the diameters of the middle and both ends of the cylindrical body by repeating the process of polishing the cylinder so as to obtain a very small polishing allowance. Then, after cylindrical polishing, it is necessary to remove the cylindrical body and place it on a measuring instrument to measure the cylindrical precision.If the cylindrical precision is not obtained, the cylindrical body is again precision cylindrically polished and the cylindrical precision is again measured. Since the measurement was repeated, it was very complicated and time-consuming. Also, when the cylindrical polishing is repeated, the diameter of the cylindrical body may be too small.
If the cylindrical body is mirror-polished by buffing, there is a problem in eliminating dust and noise, and the time required for mirror-polishing is long, and skill is required.

【0004】本発明は、上述した点に鑑み案出したもの
で、円筒研磨する前の円筒体の円筒精度が低くても、ま
た円筒研磨精度が低い円筒研磨装置を用いても、円筒体
を全長にわたり均一な直径となるように極めて高い円筒
研磨精度が短時間に得られ、さらにバフ研磨によらない
で砥石研磨によって迅速かつ高精度な鏡面研磨が行える
研磨砥石による円筒体の鏡面研磨方法を提供することを
目的としている。
[0004] The present invention has been made in view of the above-mentioned point. Even if the cylindrical precision of the cylindrical body before the cylindrical polishing is low, or if a cylindrical polishing apparatus having a low cylindrical polishing precision is used, the cylindrical body can be formed. An extremely high cylindrical polishing accuracy can be obtained in a short time so that a uniform diameter can be obtained over the entire length. It is intended to provide.

【0005】[0005]

【課題を解決するための手段】本願発明は、円筒体を両
端チャックして回転し、該円筒体をフリー回転自在なP
VA砥石の砥石端面で押圧しかつ押圧箇所に潤滑液をか
けつつ円筒体の回転にPVA砥石を連れ回りさせPVA
砥石を移動することにより、円筒体とPVA砥石の線接
触箇所に微小な相対速度を生じさせて円筒体を鏡面研磨
することを特徴とする円筒体の鏡面研磨方法を提供する
ものである。また本願発明は、円筒体を両端チャックし
て回転し、該円筒体にフリー回転自在なPVA砥石で押
圧しかつ潤滑液をかけつつ移動して仕上げ研磨を行い、
次いで、円筒体を仕上げ研磨時の回転数よりも大きな回
転数で回転し該円筒体に前記PVA砥石を前記研磨時の
駆動源との接続を解いてフリー回転自在として前記研磨
圧力の数倍の一定圧で押圧しかつ押圧箇所に潤滑液をか
けて円筒体の回転にPVA砥石を移動することにより、
円筒体とPVA砥石の線接触箇所に微小な相対速度を生
じさせて円筒体を鏡面研磨することを特徴とする円筒体
の鏡面研磨方法を提供するものである。さらに本願発明
は、円筒体を両端チャックして回転し、該円筒体に回転
駆動される粗研磨砥石の端面を押圧し潤滑液をかけつつ
移動して全長が均一径となるように研磨し、次いで、円
筒体を逆回転して粗研磨砥石により円筒体に付いたピッ
チ縞を除去する研磨を行い、次いで、円筒体に回転駆動
されるPVA砥石で押圧しかつ潤滑液をかけつつ移動し
て仕上げ研磨を行い、次いで、円筒体を仕上げ研磨時の
回転数よりも大きな回転数で回転しフリー回転自在とし
た前記PVA砥石を前記研磨圧力の数倍の一定圧で押圧
しかつ潤滑液をかけて円筒体の回転にPVA砥石を移動
することにより、円筒体とPVA砥石の線接触箇所に微
小な相対速度を生じさせて円筒体を鏡面研磨することを
特徴とする円筒体の鏡面研磨方法を提供するものであ
る。
According to the present invention, a cylindrical body is chucked at both ends and rotated, and the cylindrical body is freely rotatable.
The PVA grindstone is rotated by rotating the cylindrical body while pressing the VA grindstone at the grindstone end face and applying a lubricating liquid to the pressed portion, and PVA is applied.
It is an object of the present invention to provide a method for mirror-polishing a cylindrical body, wherein the cylindrical body is mirror-polished by moving a grindstone to generate a minute relative velocity at a line contact point between the cylindrical body and a PVA grindstone. Further, the present invention, the cylindrical body is chucked at both ends and rotated, the cylindrical body is pressed with a freely rotatable PVA grindstone and moved while applying a lubricating liquid to perform finish polishing,
Next, the cylindrical body is rotated at a rotational speed larger than the rotational speed at the time of finish polishing, and the PVA grindstone is disconnected from the cylindrical body with a driving source at the time of the polishing so that the cylindrical body is freely rotatable. By pressing at a constant pressure and applying lubricating liquid to the pressed point and moving the PVA grinding wheel to rotate the cylinder,
An object of the present invention is to provide a method for mirror-polishing a cylindrical body, wherein a small relative velocity is generated at a line contact point between the cylindrical body and a PVA grindstone to mirror-polish the cylindrical body. Further, the invention of the present application, the cylindrical body is chucked at both ends and rotated, pressed while pressing the end face of the coarse grinding wheel that is rotationally driven to the cylindrical body and applying a lubricating liquid, and polished so that the entire length becomes a uniform diameter, Next, the cylindrical body is rotated in the reverse direction to remove pitch streaks attached to the cylindrical body by the coarse polishing grindstone, and then moved while pressing the cylindrical body with a rotationally driven PVA grindstone and applying a lubricating liquid. Finish polishing is performed, and then the cylindrical body is rotated at a rotation speed higher than the rotation speed at the time of the finish polishing, and the PVA grindstone which is freely rotatable is pressed at a constant pressure several times the polishing pressure and lubricating liquid is applied. Moving the PVA grindstone to the rotation of the cylindrical body so as to generate a minute relative velocity at a line contact point between the cylindrical body and the PVA grindstone to mirror-polish the cylindrical body. To provide.

【0006】[0006]

【発明の実施の形態】先ず、本願発明の円筒体の鏡面研
磨方法を実施するための円筒研磨装置を図1及び図2を
参照して簡単に説明する。この円筒研磨装置は、ツーヘ
ッド型研磨装置である。図1及び図2において、円筒体
Wは、図示しないモータにより回転されるチャックコー
ン21aと図示しない直動装置のブラケットに枢支され
たチャックコーン21bにより両端チャックされ回転さ
れるようになっている。符号22はXテーブルでありX
方向(円筒体Wの円筒面に平行)に移動自在である。符
号23a,23bはX−Yテーブルであり、Xテーブル
22に搭載されていてXテーブル22と一体にX方向に
移動自在であるとともにXテーブル22に取り付けられ
たY方向移動装置24a,24bによりY方向(円筒体
Wの円筒軸と直角方向)に移動自在である。符号25
a,25bは可動ブラケットでありX−Yテーブル22
に設けられたシリンダ装置26a,26a、26b,2
6bのピストンによって支持されY方向に移動自在であ
る。符号27aは目の粗さが800番の炭化珪素製の研
磨砥石であり、シャフト28aがX−Yテーブル23a
に設けられた軸受29aによって枢支されかつX−Yテ
ーブル23に設けられたモータ30aにより高速回転さ
れるようになっており、また符号27bは目の粗さが6
000番のPVA研磨砥石(通称、スポンジ砥石とい
う。炭化珪素に接着剤としてPVA(ポリビニールアル
コール)とフェノールを添加し焼結してなる。)であ
り、シャフト28bがX−Yテーブル23bに設けられ
た軸受29bによって枢支されかつX−Yテーブル23
bに設けられたモータ30bにより高速回転されるよう
になっている。符号31は高圧空気発生用ブロアーであ
り、Xテーブル22に搭載されていて高圧空気をシリン
ダ装置26a,26a、26b,26bに供給する。図
示しないコントローラは、シリンダ装置26a,26
a、26b,26bに付設されている図示しない圧力セ
ンサの信号を入力することにより、研磨砥石27を円筒
体Wに押圧する研磨圧力がコントローラに指示した研磨
データに一致するようにシリンダ圧力を自由に調整でき
る。従って、この円筒研磨装置は、研磨砥石27aまた
は27bを円筒体Wに近接してから円筒体Wを回転しシ
リンダ装置26a,26aまたは26b,26bを伸長
作動すると、研磨砥石27aまたは27bを円筒体Wに
密着して一定圧力で研磨することができ、Xテーブル2
2を移動すれば円筒研磨ができる。
DESCRIPTION OF THE PREFERRED EMBODIMENTS First, a cylindrical polishing apparatus for carrying out a mirror polishing method for a cylindrical body according to the present invention will be briefly described with reference to FIGS. This cylindrical polishing apparatus is a two-head type polishing apparatus. 1 and 2, a cylindrical body W is chucked and rotated by a chuck cone 21a rotated by a motor (not shown) and a chuck cone 21b pivotally supported by a bracket of a linear motion device (not shown). . Reference numeral 22 denotes an X table.
It is movable in the direction (parallel to the cylindrical surface of the cylindrical body W). Reference numerals 23a and 23b denote XY tables which are mounted on the X table 22 and are movable together with the X table 22 in the X direction, and are Y-movable by Y direction moving devices 24a and 24b attached to the X table 22. In the direction (perpendicular to the cylinder axis of the cylinder W). Symbol 25
Reference numerals a and 25b denote movable brackets, which are XY tables 22.
Cylinder devices 26a, 26a, 26b, 2 provided in
6b and is movable in the Y direction. Reference numeral 27a denotes a polishing wheel made of silicon carbide having a coarseness of 800, and the shaft 28a is connected to the XY table 23a.
Are rotated by a motor 30a provided on the XY table 23 at a high speed.
No. 000 PVA polishing grindstone (commonly called a sponge grindstone, which is obtained by adding PVA (polyvinyl alcohol) and phenol as an adhesive to silicon carbide and sintering), and a shaft 28b is provided on an XY table 23b. XY table 23 pivoted by a mounted bearing 29b
b is rotated at a high speed by a motor 30b provided at the position b. Reference numeral 31 denotes a high-pressure air generating blower which is mounted on the X table 22 and supplies high-pressure air to the cylinder devices 26a, 26a, 26b, 26b. Controllers not shown are cylinder devices 26a, 26
By inputting a signal from a pressure sensor (not shown) attached to a, 26b, 26b, the cylinder pressure is freely adjusted so that the polishing pressure for pressing the polishing grindstone 27 against the cylindrical body W matches the polishing data instructed by the controller. Can be adjusted. Therefore, when the cylindrical grinding device rotates the cylindrical body W after the grinding wheel 27a or 27b approaches the cylindrical body W to extend the cylinder device 26a, 26a or 26b, 26b, the grinding wheel 27a or 27b is moved to the cylindrical body. It can be polished at a constant pressure in close contact with W.
By moving 2, cylinder polishing can be performed.

【0007】次に、本願発明の実施の形態にかかる円筒
体の鏡面研磨方法を説明する。この円筒体の鏡面研磨方
法は、図1に示すように、円筒体Wを両端チャックして
回転し、該円筒体Wに回転駆動される例えば800番の
炭化珪素製の研磨砥石27aの端面を押圧し潤滑液をか
けつつ図2(a),(b)に示す移動順序で移動して全
長が均一径となるように研磨し、次いで、円筒体Wを逆
回転して研磨砥石27aにより円筒体Wに付いたピッチ
縞を除去する研磨を行い、次いで、図3に示すように、
円筒体Wに回転駆動される例えば2000番から600
0番のPVA砥石27bで押圧しかつ潤滑液をかけつつ
移動して仕上げ研磨を行い、次いで、円筒体Wを仕上げ
研磨時の回転数よりも2から3倍大きな回転数で回転し
モータ30bを駆動停止してフリー回転自在としたPV
A砥石27bを前記研磨圧力の2から3倍の一定圧で押
圧することにより、PVA砥石27bを円筒体Wの回転
に連れ回り回転させ、もって、図4に示すように、PV
A砥石27bにおいて回転半径に比例した速度分布を得
るようにして、これにより、図5に示すように、PVA
砥石27bの線接触箇所において円筒体Wに対する微小
な相対速度を得て、そうして、円筒体WとPVA砥石2
7bの接触箇所に潤滑液をかけつつPVA砥石27bを
移動することにより円筒体Wを鏡面研磨するものであ
る。
Next, a method for mirror-polishing a cylindrical body according to an embodiment of the present invention will be described. As shown in FIG. 1, the mirror polishing method of the cylindrical body is performed by chucking and rotating the cylindrical body W at both ends and rotating the cylindrical body W by rotating the end face of an 800-inch silicon carbide polishing grindstone 27a. 2 (a) and 2 (b) while pressing and applying a lubricating liquid to polish so that the entire length becomes a uniform diameter. Then, the cylindrical body W is rotated in the reverse direction to rotate the cylindrical body W by the polishing grindstone 27a. Polishing is performed to remove the pitch stripes attached to the body W, and then, as shown in FIG.
For example, from No. 2000 to 600 driven to rotate by the cylindrical body W
Pressing with a No. 0 PVA grindstone 27b and moving while applying a lubricating liquid to perform finish polishing, and then rotating the cylindrical body W at a rotation speed two to three times larger than the rotation speed at the time of the finish polishing, and turning the motor 30b on PV that can be freely rotated by stopping the drive
By pressing the A grindstone 27b at a constant pressure of 2 to 3 times the polishing pressure, the PVA grindstone 27b is rotated along with the rotation of the cylindrical body W, and as shown in FIG.
A speed distribution proportional to the radius of rotation is obtained in the A grinding wheel 27b, and as a result, as shown in FIG.
At the line contact point of the grinding wheel 27b, a minute relative speed with respect to the cylindrical body W is obtained, so that the cylindrical body W and the PVA grinding wheel 2 are obtained.
The cylindrical body W is mirror-polished by moving the PVA grindstone 27b while applying the lubricating liquid to the contact portion of the cylindrical body W.

【0008】次に、図2(a)、図2(b)を参照して
円筒体の全長が均一径となるように研磨する移動順序を
説明する。図2(a)は、チャックコーン21aとチャ
ックコーン21bにより両端チャックされ回転される円
筒体Wを研磨砥石27aで研磨する所を示すもので、図
中の数値は、円筒体Wの一定ピッチ毎に各区間の計測直
径値を補正した研磨前直径値を示す。図2(a)は、円
筒体Wの一端から10mm離れた位置の直径を計測し、
次いで30mmピッチで直径を計測し、最後の計測箇所
から円筒体Wの他端まで10mm離れている所を示す。
直径計測は、小数点第三位まで計測して小数点第三位を
四捨五入した。研磨砥石27aは、円筒体Wに密着し研
磨圧力を一定に保って一方向へ移動するときの一回の研
磨寸法が2.5ミクロンとなるように、研磨圧力が調整
されて研磨を行えるようになっており、研磨砥石27a
が一往復研磨すると円筒体Wは直径が10ミクロン小さ
くなるように研磨される。従って、各区間の研磨前直径
値の最小位は、小数点第二位であるので研磨砥石の一回
の研磨寸法が2.5ミクロンであるから該一回の研磨寸
法の四倍となるように値に補正されている。図2(b)
は、円筒体の各区間の研磨前直径値をブロック積みの棒
グラフで示しかつブロックを取り除く順序を矢印と番号
で示すことにより研磨砥石の移動を説明するものであ
る。図中、左の数値は直径値であり、一目盛りは5ミク
ロンである。従って、一つのブロックの高さは5ミクロ
ンある。研磨砥石の一回の研磨寸法が2.5ミクロンで
あるので、研磨砥石を一往復することにより一つのブロ
ックを取り除くことができる。以下に、ブロックを取り
除く順序の説明を通して、直径が最終的に均一になるこ
とを概念的に説明する。ブロックが積まれたものである
ならば、下段のブロックを取り除くとその上に積まれて
いるブロックは一段下がる。実際の研磨は内部から先に
行うことはできない。しかし、ある区間の研磨を最上段
のブロックに対する研磨ではなく下段のブロックに対す
る研磨に相当するものと概念的に決めて直径を小さく研
磨していく考えることができる。しかして、研磨砥石2
7aを円筒体Wに密着し一回の研磨寸法が2.5ミクロ
ンとなるように研磨圧力を一定に保って図2(b)中の
矢印に付けた符号1から符号18に示す順序で往復移動
を繰り返しつつ研磨することにより、一往復研磨したブ
ロックを取り除いていくと、円筒体全長を研磨前最小直
径値よりも一往復研磨した小さい均一径に研磨すること
ができる。図2(b)中の1から18に示す往復移動の
順序は以下の規則に従っている。研磨前最小直径値より
も大きな研磨代部分に相当するブロックは、図2(b)
中の矢印に付けた符号1、2、4、6、8、10、1
2、14、16の順序で往復研磨を完了した順に取り除
く。従って、ブロックが研磨前直径値に比例して積まれ
ているので、各区間の研磨前最小直径値よりも大きな研
磨代部分に相当するブロックは、積まれているブロック
の数だけ研磨移動を往復したときに全部取り除くことが
できる。図2(b)中の例えば符号1の往復研磨を行う
ことで概念的に同じ段のブロックの取り除くことは、各
区間の研磨代部分が連続して存在するときはその連続す
る区間を往復研磨することを意味している。また、図2
(b)中の例えば符号2の往復研磨を行って概念的に同
じ段のブロックの取り除くように連続する区間を往復研
磨すると、符号4の往復区間のブロックと符号6の往復
区間のブロックとに別れる。そこで、研磨砥石は、符号
3の矢印区間のブロックの符号3の方向に研磨して符号
4の往復研磨を行って符号4の矢印区間のブロックを取
り除き、次いで、符号5の矢印区間のブロックの符号5
の方向に研磨して符号6の往復研磨を行って符号6の矢
印区間のブロックを取り除くようにして、研磨砥石の研
磨圧力を零にしたりさらに研磨砥石を円筒体から離した
りしない。すなわち、往復研磨を少なくとも一回行って
なお存在する研磨代部分が離れるときは、既に研磨前最
小直径値に研磨した区間を円筒体の一端から他端に向か
って研磨移動する。さらに、図2(b)中の符号16の
往復研磨を行うと、研磨前最小直径値よりも大きな研磨
代部分がなくなるまで研磨したことになるので、引き続
いて、符号17の方向に既に研磨前最小直径値に研磨し
た区間を研磨する。もって、円筒体の全長を研磨前最小
直径値よりも一方向に一回研磨した小さい均一径となる
ように断続して研磨したことになる。そこで、最後に、
円筒体の他端から一端に向かって図2(b)中の符号1
8の復動研磨を行う。これによって、円筒体の全長を研
磨前最小直径値よりも一往復研磨した小さい均一径とな
るように研磨したことになる。実際の研磨は内部から先
に行うことは不可能であるが、上記のブロックを取り除
く順序で説明するように砥石研磨の移動を行うと、円筒
体の直径が小さくなる状態が、り、あたかも下段のブロ
ックを取り除くと上段のブロックが一段落ち、かつブロ
ックが取り除かれる順番に対応するように概念的に把握
することができ、結果として、必要最小限の砥石研磨の
移動により、円筒体の全長を研磨前最小直径値よりも一
往復研磨した小さい均一径となるように精密研磨するこ
とができる。なお、図2(b)中の符号18の研磨を行
うことは、本願発明の必須要件ではない。その理由は、
符号17の研磨を終了した時点で均一径となるからであ
る。また、符号18の研磨を行うことを必須要件とすれ
ば、符号17の研磨を終了した時点で円筒体を取外し別
の研磨装置に取り付けて符号18の研磨を行うことが考
えられるからである。
Next, a description will be given of a moving order for polishing so that the entire length of the cylindrical body has a uniform diameter with reference to FIGS. 2 (a) and 2 (b). FIG. 2A shows a state where a cylindrical body W which is chucked and rotated by the chuck cone 21a and the chuck cone 21b and is rotated is polished with a polishing grindstone 27a. Fig. 7 shows the diameter value before polishing obtained by correcting the measured diameter value in each section. FIG. 2A measures the diameter at a position 10 mm away from one end of the cylindrical body W,
Next, the diameter is measured at a pitch of 30 mm, and a position 10 mm away from the last measurement point to the other end of the cylindrical body W is shown.
The diameter was measured to the third decimal place and rounded to the third decimal place. The polishing grindstone 27a is adjusted in such a manner that the polishing pressure is adjusted so that a single polishing dimension when moving in one direction while keeping the polishing pressure constant and in close contact with the cylindrical body W is 2.5 microns so that polishing can be performed. And the grinding wheel 27a
Is polished once, the cylindrical body W is polished so that the diameter is reduced by 10 microns. Therefore, since the minimum value of the diameter before polishing in each section is the second decimal place, the polishing size of a single grinding wheel is 2.5 microns, so that the polishing size is four times as large as the single polishing size. Value has been corrected. FIG. 2 (b)
Describes the movement of the grinding wheel by indicating the pre-polishing diameter value of each section of the cylindrical body by a bar graph of block stacking and the order of removing the blocks by arrows and numbers. In the figure, the numerical value on the left is the diameter value, and one division is 5 microns. Therefore, the height of one block is 5 microns. Since the polishing size of the polishing wheel at one time is 2.5 microns, one block can be removed by making one round trip of the polishing wheel. Hereinafter, it will be conceptually described that the diameter is finally uniform through the description of the order of removing the blocks. If the blocks are stacked, removing the lower block will lower the blocks stacked on it by one step. Actual polishing cannot be performed first from the inside. However, it can be considered that the polishing in a certain section is conceptually determined to be not the polishing of the uppermost block but the polishing of the lower block, and the polishing is performed with a smaller diameter. And the grinding wheel 2
7a is brought into close contact with the cylindrical body W, and the polishing pressure is kept constant so that the polishing size at one time is 2.5 μm, and reciprocation is performed in the order shown by the reference numerals 1 to 18 attached to the arrows in FIG. By removing the blocks that have been polished one round trip by repeating the movement and polishing, the entire length of the cylindrical body can be polished to a uniform diameter smaller by one round trip than the minimum diameter value before polishing. The order of the reciprocating movements indicated by 1 to 18 in FIG. 2B follows the following rules. The block corresponding to the polishing margin portion larger than the minimum diameter value before polishing is shown in FIG.
1, 2, 4, 6, 8, 10, 1 attached to the arrow in the middle
The reciprocating polishing is removed in the order of 2, 14, and 16 in the order of completion. Therefore, since the blocks are stacked in proportion to the diameter value before polishing, the blocks corresponding to the polishing allowance portion larger than the minimum diameter value before polishing in each section reciprocate the polishing movement by the number of the stacked blocks. You can remove them all when you do. By performing reciprocating polishing of, for example, reference numeral 1 in FIG. 2B, conceptually removing blocks at the same stage means that if the polishing allowance portion of each section exists continuously, the continuous section is reciprocally polished. It means to do. FIG.
For example, when a continuous section is reciprocally polished so as to remove a block of the same stage conceptually by performing reciprocating polishing of reference numeral 2 in (b), a block of a reciprocating section of reference numeral 4 and a block of a reciprocating section of reference numeral 6 are obtained. break up. Therefore, the grinding wheel is polished in the direction of the reference numeral 3 of the block of the arrow section of the reference numeral 3 to perform reciprocating polishing of the reference numeral 4 to remove the block of the arrow section of the reference number 4, and then to remove the block of the arrow section of the reference number 5. Code 5
Then, the reciprocating polishing of reference numeral 6 is performed to remove the block in the section indicated by the reference numeral 6 so that the polishing pressure of the polishing wheel is not reduced to zero and the polishing wheel is not separated from the cylindrical body. That is, when at least once the reciprocating polishing is performed and the remaining polishing allowance is separated, the section already polished to the minimum diameter value before polishing is polished and moved from one end of the cylindrical body to the other end. Further, when the reciprocating polishing indicated by reference numeral 16 in FIG. 2B is performed, the polishing is performed until there is no polishing margin larger than the minimum diameter value before polishing. The section polished to the minimum diameter value is polished. Thus, the entire length of the cylindrical body is intermittently polished so as to have a small uniform diameter obtained by polishing once in one direction from the minimum diameter value before polishing. So, finally,
Reference numeral 1 in FIG. 2B from the other end of the cylindrical body toward one end.
8 is performed. As a result, the entire length of the cylindrical body is polished so as to have a uniform diameter smaller than the minimum diameter value before polishing by one round trip. Although actual polishing cannot be performed first from the inside, moving the grindstone as described in the order of removing the blocks described above may reduce the diameter of the cylindrical body, as if in the lower stage. When the block is removed, the upper block drops one step, and it can be conceptually grasped so as to correspond to the order in which the blocks are removed.As a result, the necessary minimum grinding wheel movement moves the entire length of the cylindrical body. Precise polishing can be performed so as to have a uniform diameter smaller by one round trip than the minimum diameter value before polishing. The polishing of reference numeral 18 in FIG. 2B is not an essential requirement of the present invention. The reason is,
This is because the diameter becomes uniform when the polishing of reference numeral 17 is completed. Further, if the polishing of the reference numeral 18 is an essential requirement, it is possible to remove the cylindrical body and attach it to another polishing apparatus to perform the polishing of the reference numeral 18 when the polishing of the reference numeral 17 is completed.

【0009】図6は、研磨砥石の別の移動順序を示す図
である。この移動順序によれば、研磨開始位置及び研磨
終了位置が円筒体の中程になっている。符号1と3の往
復研磨と符号13と19の往復研磨はストロークの大小
と研磨順の関係が逆転している。このことは、本願発明
の円筒体の砥石研磨方法における研磨砥石の移動順序の
決定に幅があることを示している。すなわち、下側のブ
ロックに相当する研磨が上側のブロックに相当する研磨
よりも先に行われることは必須要件ではない。
FIG. 6 is a view showing another moving order of the grinding wheel. According to this moving order, the polishing start position and the polishing end position are in the middle of the cylindrical body. The relationship between the magnitude of the stroke and the order of polishing is reversed between the reciprocating polishing of reference numerals 1 and 3 and the reciprocal polishing of reference numerals 13 and 19. This indicates that the moving order of the polishing grindstones in the method for polishing a cylindrical grindstone of the present invention has a wide range. That is, it is not an essential requirement that the polishing corresponding to the lower block be performed before the polishing corresponding to the upper block.

【0010】[0010]

【発明の効果】以上説明してきたように、本願第一及び
第二の発明の円筒体の鏡面研磨方法によれば、 1)鏡面研磨した粉が研磨砥石の目を潰すことがなく、砥
石研磨により円筒体の鏡面研磨ができる。従って、例え
ば800番の砥石で研磨してから例えば3000番から
6000番のPVA砥石で研磨して、その後そのPVA
砥石で鏡面研磨ができる。本願発明は、例えば3000
番から6000番のPVA砥石を円筒体に強く押しつけ
て連れ回り回転させることにより微小な相対回転速度を
得てこの微小な相対回転速度が円筒体に対して方向性が
ない微小な研磨効果を果巣古都により鏡面研磨ができ。
これに対して、3000番から6000番のPVA砥石
を駆動回転して回転駆動される円筒体に押しつけて移動
してもけっして鏡面研磨が実現できない。 2)砥石研磨により円筒体の鏡面研磨ができるので、バフ
研磨に比べて短時間に精密な研磨ができる。 3)砥石研磨により円筒体の鏡面研磨ができるので、熟練
を要することなく自動研磨ができる。 4)バフ研磨は騒音・塵埃が発生し研磨時間が長くかかる
欠点があるが、本願の発明の円筒体の鏡面研磨方法によ
れば、このような欠点が解消される。本願第三の発明の
円筒体の鏡面研磨方法によれば、上記効果に加えて以下
の効果を有する。 5)円筒研磨する前の円筒体の円筒精度が低くても、短時
間の軽研磨加工で円筒体を全長にわたり均一な直径に精
密研磨することができる。 6)研磨回数を直径の大きさに比例させかつ圧力を一定に
保って研磨するので、研磨装置の研磨砥石を円筒体に沿
って移動する直動精度が低くても円筒体を全長にわたり
均一な直径に研磨することができ、円筒研磨精度が低い
研磨装置をソフト面から円筒研磨精度が極めて高くなる
ように改善できる。 7)圧力を一定に保って研磨するので、研磨砥石の表面が
漸次に崩壊していく分について補正をかける必要はな
い。 8)円筒体全長を研磨して取り外して計測し直径の大きい
ところを検出し再び研磨装置にチャックして研磨するこ
とを何回も繰り返す従来の円筒体研磨方法に比べ、はる
かに短時間に高精密な円筒体研磨ができる。 9)研磨中に研磨砥石が減った分の微小寸法を検出して随
時補正を加える従来の円筒体研磨方法に比べて、高精密
な円筒体研磨ができる。 10)円筒体の一端から他端まで連続する円筒研磨を行わ
ないで往復研磨を反復して移動していくだけで円筒体を
全長にわたり均一な直径に研磨することができ、円筒体
の一端から他端まで連続する円筒研磨は一回で足りる。
円筒体の直径が小さくなり過ぎる惧れがない。従って、
被製版ロールのバラードメッキの厚みを従来よりも小さ
くすることができ、経済的である。 11)円筒精度の測定作業は円筒研磨前の一回で足り、円
筒研磨後に円筒体を取外し測定器に載置して円筒精度を
測定する必要はない。
As described above, according to the method for mirror-polishing a cylindrical body of the first and second aspects of the present invention, 1) the mirror-polished powder does not crush the eyes of the grinding wheel, and the grinding wheel is polished. Thus, mirror polishing of the cylindrical body can be performed. Therefore, for example, after polishing with a grinding wheel of No. 800, for example, polishing with a PVA grinding wheel of No. 3000 to No. 6000, and thereafter, the PVA
Mirror polishing is possible with a whetstone. The present invention is, for example, 3000
A small relative rotation speed is obtained by strongly pressing the PVA grinding wheel from No. 6000 to No. 6000 against the cylindrical body and rotating the same, and this minute relative rotational speed achieves a minute polishing effect with no directivity to the cylindrical body. The mirror surface can be polished by Suekoto.
On the other hand, even if the PVA grindstones of No. 3000 to No. 6000 are driven to rotate and pressed against the rotatably driven cylindrical body, mirror polishing cannot be realized. 2) Mirror polishing of the cylindrical body can be performed by whetstone polishing, so that precise polishing can be performed in a shorter time than buff polishing. 3) Since mirror polishing of the cylindrical body can be performed by grinding stone, automatic polishing can be performed without skill. 4) The buff polishing has a disadvantage that noise and dust are generated and the polishing time is long. However, according to the mirror polishing method for a cylindrical body of the present invention, such a defect is solved. According to the cylindrical body mirror polishing method of the third invention of the present application, the following effects are obtained in addition to the above effects. 5) Even if the cylindrical accuracy of the cylindrical body before the cylindrical polishing is low, the cylindrical body can be precisely polished to a uniform diameter over the entire length by light polishing in a short time. 6) Since the number of times of polishing is proportional to the diameter and the pressure is kept constant, the polishing is performed uniformly along the entire length of the cylindrical body even if the linear motion accuracy of moving the grinding wheel of the polishing apparatus along the cylindrical body is low. A polishing apparatus which can be polished to a diameter and has a low cylindrical polishing accuracy can be improved from a soft surface to a very high cylindrical polishing accuracy. 7) Since the polishing is performed while keeping the pressure constant, there is no need to make corrections for the gradual collapse of the surface of the grinding wheel. 8) Compared with the conventional cylindrical body polishing method, which repeatedly repeats the process of polishing and removing the entire length of the cylindrical body, measuring the location where the diameter is large, chucking the polishing device again, and polishing many times, it is much faster. Precise cylindrical body polishing is possible. 9) Compared with the conventional cylindrical body polishing method that detects the minute size of the reduced grinding wheel during polishing and makes corrections as needed, the cylinder body can be polished with higher precision. 10) The cylindrical body can be polished to a uniform diameter over the entire length simply by moving reciprocatingly and polishing repeatedly without performing cylindrical polishing continuously from one end to the other end of the cylindrical body. One round of cylindrical polishing to the end is sufficient.
There is no fear that the diameter of the cylinder becomes too small. Therefore,
The thickness of the ballad plating of the plate making roll can be made smaller than before, which is economical. 11) It is sufficient to measure the cylinder accuracy only once before polishing the cylinder. It is not necessary to remove the cylinder after the cylinder polishing and place it on a measuring instrument to measure the cylinder accuracy.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本願発明の円筒体の鏡面研磨方法を実施するた
めの円筒研磨装置の概略正面図であって、円筒体の鏡面
研磨方法の構成要素である円筒体の全長を均一径に研磨
する状態を示す。
FIG. 1 is a schematic front view of a cylindrical polishing apparatus for carrying out a mirror polishing method of a cylindrical body according to the present invention, and polishes the entire length of a cylindrical body which is a component of the mirror polishing method of a cylindrical body to a uniform diameter. Indicates the status.

【図2】本願発明の第一の実施の形態にかかる円筒体の
鏡面研磨方法の構成要素の円筒体の全長を均一径に研磨
するための移動順序を説明するための図である。(a)
は、円筒体を研磨砥石で研磨するに際して、円筒体の一
定ピッチ毎の研磨前直径値を示す。(b)は、円筒体の
各区間の研磨前直径値をブロック積みの棒グラフで示し
かつブロックを取り除く順序を矢印と番号で示すことに
より研磨砥石の移動を説明するための図である。
FIG. 2 is a view for explaining a moving order for polishing the entire length of the cylindrical body to a uniform diameter as a component of the method for mirror-polishing a cylindrical body according to the first embodiment of the present invention. (A)
Indicates the diameter value before polishing at a constant pitch of the cylindrical body when the cylindrical body is polished with a polishing grindstone. (B) is a diagram for explaining the movement of the polishing grindstone by indicating the pre-polishing diameter value of each section of the cylindrical body by a bar graph of a block stack and indicating the order of removing the blocks by arrows and numbers.

【図3】本願発明の円筒体の鏡面研磨方法を実施するた
めの円筒研磨装置の概略正面図であって、円筒体を鏡面
研磨する状態を示す。
FIG. 3 is a schematic front view of a cylindrical polishing apparatus for carrying out the mirror polishing method for a cylindrical body according to the present invention, showing a state where the cylindrical body is mirror-polished.

【図4】本願発明の円筒体の鏡面研磨方法を説明するた
めの図であって、円筒体に研磨砥石を接触させたときの
線接触箇所の速度分布を示す図。
FIG. 4 is a view for explaining a mirror polishing method for a cylindrical body according to the present invention, and is a view showing a velocity distribution at a line contact point when a grinding wheel is brought into contact with the cylindrical body.

【図5】本願発明の円筒体の鏡面研磨方法を説明するた
めの図であって、円筒体に研磨砥石を接触させたときの
線接触箇所の中点の速度が円筒体の速度に等しいと見な
したときの相対速度分布を示す図。
FIG. 5 is a view for explaining the mirror polishing method of the cylindrical body according to the present invention, wherein the speed of the midpoint of the line contact point when the grinding wheel is brought into contact with the cylindrical body is equal to the speed of the cylindrical body. The figure which shows the relative velocity distribution when it considers.

【図6】本願発明の第二の実施の態様にかかる円筒体の
砥石研磨方法を説明するための図であって、円筒体の各
区間の研磨前直径値をブロック積みの棒グラフで示しか
つブロックを取り除く順序を矢印と番号で示すことによ
り研磨砥石の移動を説明するための図である。
FIG. 6 is a view for explaining a method for polishing a grindstone of a cylindrical body according to a second embodiment of the present invention, in which the diameter value before polishing of each section of the cylindrical body is shown by a bar graph of block stacking and FIG. 4 is a diagram for explaining the movement of the polishing grindstone by indicating the order of removing the grinding wheels by arrows and numbers.

【符号の説明】[Explanation of symbols]

W ・・・円筒体 27a ・・・研磨砥石 27b ・・・PVA砥石 W: Cylindrical body 27a: Polishing whetstone 27b: PVA whetstone

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 円筒体を両端チャックして回転し、該円
筒体をフリー回転自在なPVA砥石の砥石端面で押圧し
かつ押圧箇所に潤滑液をかけつつ円筒体の回転にPVA
砥石を連れ回りさせPVA砥石を移動することにより、
円筒体とPVA砥石の線接触箇所に微小な相対速度を生
じさせて円筒体を鏡面研磨することを特徴とする円筒体
の鏡面研磨方法。
1. A cylindrical body is chucked at both ends and rotated, and the cylindrical body is pressed by a grinding wheel end face of a free rotatable PVA grindstone, and PVA is applied to the rotation of the cylindrical body while applying a lubricating liquid to a pressed portion.
By moving the grindstone and moving the PVA grindstone,
A mirror-polishing method for a cylindrical body, wherein a fine relative velocity is generated at a line contact point between the cylindrical body and a PVA grindstone to mirror-polish the cylindrical body.
【請求項2】 円筒体を両端チャックして回転し、該円
筒体にフリー回転自在なPVA砥石で押圧しかつ潤滑液
をかけつつ移動して仕上げ研磨を行い、次いで、円筒体
を仕上げ研磨時の回転数よりも大きな回転数で回転し該
円筒体に前記PVA砥石を前記研磨時の駆動源との接続
を解いてフリー回転自在として前記研磨圧力の数倍の一
定圧で押圧しかつ押圧箇所に潤滑液をかけて円筒体の回
転にPVA砥石を移動することにより、円筒体とPVA
砥石の線接触箇所に微小な相対速度を生じさせて円筒体
を鏡面研磨することを特徴とする円筒体の鏡面研磨方
法。
2. The cylindrical body is chucked at both ends and rotated, and the cylindrical body is pressed with a freely rotatable PVA grindstone and moved while applying a lubricating liquid to perform finish polishing. The PVA grindstone is rotated at a rotational speed greater than the rotational speed of the cylindrical body by disconnecting the PVA grindstone from a driving source at the time of the polishing so as to be freely rotatable, and is pressed at a constant pressure several times the polishing pressure and pressed. The PVA grindstone is moved to rotate the cylindrical body by applying a lubricating liquid to the cylindrical body, so that the cylindrical body and the PVA are rotated.
A mirror polishing method for a cylindrical body, comprising: mirror-polishing a cylindrical body by generating a minute relative velocity at a line contact point of a grindstone.
【請求項3】 円筒体を両端チャックして回転し、該円
筒体に回転駆動される粗研磨砥石の端面を押圧し潤滑液
をかけつつ移動して全長が均一径となるように研磨し、
次いで、円筒体を逆回転して粗研磨砥石により円筒体に
付いたピッチ縞を除去する研磨を行い、次いで、円筒体
に回転駆動されるPVA砥石で押圧しかつ潤滑液をかけ
つつ移動して仕上げ研磨を行い、次いで、円筒体を仕上
げ研磨時の回転数よりも大きな回転数で回転しフリー回
転自在とした前記PVA砥石を前記研磨圧力の数倍の一
定圧で押圧しかつ潤滑液をかけて円筒体の回転にPVA
砥石を移動することにより、円筒体とPVA砥石の線接
触箇所に微小な相対速度を生じさせて円筒体を鏡面研磨
することを特徴とする円筒体の鏡面研磨方法。
3. A cylindrical body is chucked at both ends and rotated, and is pressed while pressing an end surface of a rough polishing grindstone which is rotationally driven on the cylindrical body, and is moved while applying a lubricating liquid to polish the entire length to have a uniform diameter.
Next, the cylindrical body is rotated in the reverse direction to remove pitch streaks attached to the cylindrical body by the coarse polishing grindstone, and then moved while pressing the cylindrical body with a rotationally driven PVA grindstone and applying a lubricating liquid. Finish polishing is performed, and then the cylindrical body is rotated at a rotation speed higher than the rotation speed at the time of the finish polishing, and the PVA grindstone which is freely rotatable is pressed at a constant pressure several times the polishing pressure and lubricating liquid is applied. PVA to rotate cylindrical body
A mirror polishing method for a cylindrical body, characterized in that a mirror body is mirror-polished by moving a grindstone to generate a minute relative velocity at a line contact point between the cylindrical body and a PVA grindstone.
JP30484597A 1997-10-20 1997-10-20 Mirror polishing method for cylindrical body Expired - Lifetime JP3936448B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP30484597A JP3936448B2 (en) 1997-10-20 1997-10-20 Mirror polishing method for cylindrical body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30484597A JP3936448B2 (en) 1997-10-20 1997-10-20 Mirror polishing method for cylindrical body

Publications (2)

Publication Number Publication Date
JPH11114800A true JPH11114800A (en) 1999-04-27
JP3936448B2 JP3936448B2 (en) 2007-06-27

Family

ID=17937969

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30484597A Expired - Lifetime JP3936448B2 (en) 1997-10-20 1997-10-20 Mirror polishing method for cylindrical body

Country Status (1)

Country Link
JP (1) JP3936448B2 (en)

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JP2001187440A (en) * 2000-01-05 2001-07-10 Think Laboratory Co Ltd Gravure printing plate making method
JP2001187441A (en) * 2000-01-05 2001-07-10 Think Laboratory Co Ltd Gravure printing plate making method
CN101972982A (en) * 2010-09-01 2011-02-16 新东工业株式会社 Cylindrical component grinding device and grinding method thereof
CN102164710A (en) * 2009-10-30 2011-08-24 新东工业株式会社 Polishing device for polygonal column member, and method for polishing same
CN102652049A (en) * 2010-11-18 2012-08-29 新东工业株式会社 Polishing device for cylindrical members, cylindrical members, and polishing method for cylindrical members

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001013287A (en) * 1999-06-30 2001-01-19 Toshiba Corp Grinder of pipe for reactor
JP2001187440A (en) * 2000-01-05 2001-07-10 Think Laboratory Co Ltd Gravure printing plate making method
JP2001187441A (en) * 2000-01-05 2001-07-10 Think Laboratory Co Ltd Gravure printing plate making method
CN102164710A (en) * 2009-10-30 2011-08-24 新东工业株式会社 Polishing device for polygonal column member, and method for polishing same
CN101972982A (en) * 2010-09-01 2011-02-16 新东工业株式会社 Cylindrical component grinding device and grinding method thereof
WO2012029194A1 (en) * 2010-09-01 2012-03-08 新東工業株式会社 Polishing device for columnar member and polishing method therefor
KR20130092375A (en) * 2010-09-01 2013-08-20 신토고교 가부시키가이샤 Polishing device for columnar member and polishing method therefor
JP5565417B2 (en) * 2010-09-01 2014-08-06 新東工業株式会社 Cylindrical member polishing equipment
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CN102652049A (en) * 2010-11-18 2012-08-29 新东工业株式会社 Polishing device for cylindrical members, cylindrical members, and polishing method for cylindrical members
KR20130121662A (en) * 2010-11-18 2013-11-06 신토고교 가부시키가이샤 Polishing device for columnar member, columnar member and polishing method therefor
CN102652049B (en) * 2010-11-18 2016-04-13 新东工业株式会社 The Ginding process of the lapping device of columnar component, columnar component and columnar component

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