JPH1190797A - Grinding wheel polishing method for cylindrical body - Google Patents
Grinding wheel polishing method for cylindrical bodyInfo
- Publication number
- JPH1190797A JPH1190797A JP26922597A JP26922597A JPH1190797A JP H1190797 A JPH1190797 A JP H1190797A JP 26922597 A JP26922597 A JP 26922597A JP 26922597 A JP26922597 A JP 26922597A JP H1190797 A JPH1190797 A JP H1190797A
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- cylindrical body
- cylindrical
- diameter value
- diameter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本願発明は、円筒研磨する前
の円筒体の円筒精度が低くても、また円筒研磨精度が低
い円筒研磨装置を用いても、円筒体を全長にわたり均一
な直径となるように極めて高い円筒研磨精度が短時間に
得られる円筒体の砥石研磨方法に関する。The present invention relates to a cylindrical body having a uniform diameter over its entire length even if the cylindrical body has a low cylindrical precision before the cylindrical body is polished, or even if a cylindrical polishing apparatus having a low cylindrical polishing precision is used. As described above, the present invention relates to a method for polishing a grindstone of a cylindrical body, which can obtain extremely high cylindrical polishing accuracy in a short time.
【0002】[0002]
【従来の技術】被製版ロールの中程の直径が両端部の直
径よりも大きいか小さいと、印刷不良になるので、被製
版ロールは極めて高い円筒精度が要求される。また、鋼
板圧延用の圧延ロールは板厚を均一に出すために更に高
い円筒精度が要求される。しかるに、砥石研磨装置で円
筒体の円筒研磨を行うと、研磨砥石の表面が漸次に崩壊
していくので、その分について補正をかけて円筒研磨を
行うことで円筒精度を出すようになっている。2. Description of the Related Art If the middle diameter of a plate making roll is larger or smaller than the diameters of both ends, printing will be poor, and the plate making roll is required to have extremely high cylindrical accuracy. Further, a rolling roll for rolling a steel sheet is required to have higher cylindrical accuracy in order to obtain a uniform thickness. However, when the cylindrical grinding of the cylindrical body is performed with the grinding wheel polishing device, the surface of the grinding wheel gradually collapses, so that the cylindrical grinding is performed by correcting the amount and performing the cylindrical grinding. .
【0003】[0003]
【発明が解決しようとする課題】しかし、円筒研磨する
前の円筒体の円筒精度が低い場合、上記従来の補正をか
けた円筒研磨を行っても円筒精度が高くなるとは限らな
い。高い円筒精度を有する砥石研磨装置で補正をかけて
大きな研磨代をとって一回で円筒体の一端から他端まで
円筒研磨すると、円筒研磨する前の円筒体の円筒精度が
そのまま反映した円筒研磨精度しか得られない。円筒研
磨する前の円筒体の円筒精度が低くても、高い円筒精度
を得るには、極めて高い円筒精度を有する砥石研磨装置
を使用しかつ研磨砥石の表面が漸次に崩壊していく分に
ついて補正をかけて極めて微小な研磨代となるように円
筒研磨を行うことを何回も反復して円筒体の中程と両端
部の直径の差を解消していく必要があった。そして、円
筒研磨後は円筒体を取外し測定器に載置して円筒精度を
測定する必要があり、もしも、円筒精度が出ていないと
きは、円筒体を再び精密円筒研磨して再び円筒精度を測
定することを反復していたので、大変煩雑であるととも
に時間がかかっていた。また、円筒研磨を反復すると、
円筒体の直径が小さくなり過ぎる惧れがあった。However, when the cylindrical precision of the cylindrical body before the cylindrical polishing is low, the cylindrical precision with the above-mentioned conventional correction does not always increase the cylindrical precision. When the cylinder is polished from one end to the other end of the cylinder at one time with a large grinding allowance by making corrections with a grinding stone polishing device with high cylindrical accuracy, the cylindrical polishing that reflects the cylindrical accuracy of the cylindrical body before cylindrical polishing is reflected as it is Only accuracy can be obtained. Even if the cylindrical body of the cylindrical body before polishing is low, in order to obtain high cylindrical precision, use a grindstone polishing device with extremely high cylindrical precision and compensate for the amount by which the surface of the grinding wheel gradually collapses It was necessary to eliminate the difference between the diameters of the middle and both ends of the cylindrical body by repeating the process of polishing the cylinder so as to obtain a very small polishing allowance. Then, after cylindrical polishing, it is necessary to remove the cylindrical body and place it on a measuring instrument to measure the cylindrical precision.If the cylindrical precision is not obtained, the cylindrical body is again precision cylindrically polished and the cylindrical precision is again measured. Since the measurement was repeated, it was very complicated and time-consuming. Also, when cylindrical polishing is repeated,
There was a fear that the diameter of the cylindrical body became too small.
【0004】本発明は、上述した点に鑑み案出したもの
で、研磨前最小直径値よりも大きい研磨前直径値に対し
て該研磨前直径値と研磨前最小直径値の差に比例した往
復回数の研磨を行うことにより、短時間の超軽研磨加工
で円筒体を均一な直径に精密研磨することができ、しか
も均一な直径に研磨してから円筒体の一端から他端まで
連続する研磨を行う回数が一回で済み、研磨後に円筒精
度を測定する必要がない円筒体の砥石研磨方法を提供す
ることを目的としている。The present invention has been made in view of the above points, and has been made in consideration of a reciprocating motion proportional to the difference between the pre-polishing diameter value and the pre-polishing minimum diameter value for a pre-polishing diameter value larger than the pre-polishing minimum diameter value. By performing the polishing several times, the cylindrical body can be precisely polished to a uniform diameter by a short ultra-light polishing process, and furthermore, polished to a uniform diameter and then continuously polished from one end to the other end of the cylindrical body The object of the present invention is to provide a method for polishing a grindstone of a cylindrical body, which does not need to be performed once, and does not need to measure cylindrical accuracy after polishing.
【0005】[0005]
【課題を解決するための手段】本願発明は、円筒体の一
端から他端まで一定ピッチ毎に計測した各区間の計測直
径値の最小位について、研磨砥石を円筒体に密着し研磨
圧力を一定に保って一方向へ移動するときの一回研磨寸
法の四倍となるように近似する値に補正した各区間の研
磨前直径値とし、研磨砥石を円筒体に密着し研磨圧力を
一定に保って往復移動を繰り返しつつ研磨することによ
り、研磨前最小直径値よりも大きな研磨代部分がなくな
るまで円筒体を均一な直径値となるように研磨する円筒
体研磨方法であって、研磨前最小直径値よりも大きな研
磨代部分の区間を研磨前直径値に比例した回数だけ研磨
移動し、その際直径値が等しい研磨代部分が連続して存
在する区間を往復研磨し、研磨代部分が離れている区間
へ移動するときは研磨砥石と円筒体の密着を離さないで
研磨圧力を実質的に零にして移動することを特徴とする
円筒体の研磨方法を提供するものである。SUMMARY OF THE INVENTION According to the present invention, a polishing wheel is brought into close contact with a cylindrical body and a polishing pressure is maintained at a minimum value of a measured diameter value of each section measured at a constant pitch from one end to the other end of the cylindrical body. The diameter before polishing was corrected to a value approximating to be four times as large as the single polishing dimension when moving in one direction while keeping the polishing wheel in close contact with the cylinder, and the polishing pressure was kept constant. A cylindrical body polishing method of polishing the cylindrical body to have a uniform diameter value until there is no polishing margin larger than the minimum diameter value before polishing by polishing while repeating reciprocating movement, the minimum diameter before polishing. Polishing movement of the section of the polishing allowance portion larger than the value is repeated by the number of times proportional to the diameter value before polishing, and at that time, the section where the polishing allowance portion having the same diameter value is continuously present is reciprocally polished, and the polishing allowance portion is separated. When moving to a section where There is provided a method of polishing a cylindrical body, characterized in that to move in the substantially zero polishing pressure keep an adhesion of grinding grindstone and the cylindrical body.
【0006】[0006]
【発明の実施の形態】先ず、本願発明の円筒体の砥石研
磨方法を実施するための円筒研磨装置を図1を参照して
簡単に説明する。円筒体Wは、図示しないモータにより
回転されるチャックコーン21aと図示しない直動装置
のブラケットに枢支されたチャックコーン21bにより
両端チャックされ回転されるようになっている。符号2
2はXテーブルでありX方向(円筒体Wの円筒面に平
行)に移動自在である。符号23はX−Yテーブルであ
り、Xテーブル22に搭載されていてX方向に移動自在
であるとともにXテーブル22に取り付けられたY方向
移動装置24によりY方向(円筒体Wの円筒軸と直角方
向)に移動自在である。符号25は可動ブラケットであ
りX−Yテーブル22に設けられたシリンダ装置26、
26のピストン26a、26aによって支持されY方向
に移動自在である。符号27は研磨砥石であり、シャフ
ト28がX−Yテーブル23に設けられた軸受29によ
って枢支されかつX−Yテーブル23に設けられたモー
タ30により高速回転されるようになっている。符号3
1は高圧空気発生用ブロアーであり、Xテーブル22に
搭載されていて高圧空気をシリンダ装置26、26に供
給する。図示しないコントローラは、シリンダ装置2
6、26に付設されている図示しない圧力センサの信号
を入力することにより、研磨砥石27を円筒体Wに押圧
する研磨圧力がコントローラに指示した研磨データに一
致するようにシリンダ圧力を自由に調整できる。従っ
て、この円筒研磨装置は、研磨砥石27を円筒体Wに近
接してから円筒体Wを回転し図示しない電磁三方弁を切
り換えてシリンダ装置26、26を伸長作動すると、研
磨砥石27を円筒体Wに密着して一定圧力で研磨するこ
とができ、Xテーブル22を移動すれば円筒研磨するこ
とができ、さらにシリンダ装置26、26を伸長作動状
態から前記の電磁三方弁を切り換えて伸長作動のシリン
ダ室を大気に連通させる別の図示しない電磁二方弁を閉
じると、ピストンが後退従って、研磨砥石27を円筒体
Wに密着したままに保持することができ、さらに、前記
電磁三方弁と電磁二方弁を同時に切り換えると再び伸長
作動のシリンダ室に高圧空気を供給することができ再び
研磨砥石27で円筒体Wを一定圧力で研磨することがで
きる。DESCRIPTION OF THE PREFERRED EMBODIMENTS First, a cylindrical polishing apparatus for carrying out a method for polishing a grindstone of a cylindrical body according to the present invention will be briefly described with reference to FIG. Both ends of the cylindrical body W are chucked and rotated by a chuck cone 21a rotated by a motor (not shown) and a chuck cone 21b pivotally supported by a bracket of a linear motion device (not shown). Sign 2
An X table 2 is movable in the X direction (parallel to the cylindrical surface of the cylindrical body W). Reference numeral 23 denotes an XY table, which is mounted on the X table 22 and is movable in the X direction, and is moved in the Y direction (at right angles to the cylindrical axis of the cylindrical body W) by a Y direction moving device 24 attached to the X table 22. Direction). Reference numeral 25 denotes a movable bracket, a cylinder device 26 provided on the XY table 22,
It is supported by the 26 pistons 26a, 26a and is movable in the Y direction. Reference numeral 27 denotes a grinding wheel, and a shaft 28 is pivotally supported by a bearing 29 provided on the XY table 23 and is rotated at a high speed by a motor 30 provided on the XY table 23. Code 3
Reference numeral 1 denotes a blower for generating high-pressure air, which is mounted on the X table 22 and supplies high-pressure air to the cylinder devices 26, 26. The controller not shown is a cylinder device 2
By inputting a signal from a pressure sensor (not shown) attached to each of the cylinders 6 and 26, the cylinder pressure can be freely adjusted so that the polishing pressure for pressing the grinding wheel 27 against the cylindrical body W matches the polishing data instructed by the controller. it can. Therefore, this cylindrical polishing apparatus rotates the cylindrical body W after bringing the grinding wheel 27 close to the cylindrical body W and switches the electromagnetic three-way valve (not shown) to extend the cylinder devices 26, 26. Polishing can be performed at a constant pressure in close contact with W, cylindrical polishing can be performed by moving the X table 22, and further, the cylinder devices 26, 26 can be switched from the extending operation state to the electromagnetic three-way valve to perform the extension operation. When another electromagnetic two-way valve (not shown) for communicating the cylinder chamber with the atmosphere is closed, the piston retreats, so that the grinding wheel 27 can be kept in close contact with the cylindrical body W. When the two-way valve is switched at the same time, high-pressure air can be supplied to the cylinder chamber in the extension operation again, and the cylindrical body W can be polished again with the polishing grindstone 27 at a constant pressure.
【0007】次に、本願発明の第一の実施の態様にかか
る円筒体の砥石研磨方法を図2(a)、図2(b)を参
照して説明する。図2(a)は、チャックコーン21a
とチャックコーン21bにより両端チャックされ回転さ
れる円筒体Wを研磨砥石27で研磨する所を示すもの
で、図中の数値は、円筒体Wの一定ピッチ毎に各区間の
計測直径値を補正した研磨前直径値を示す。図2(a)
は、円筒体Wの一端から10mm離れた位置の直径を計
測し、次いで30mmピッチで直径を計測し、最後の計
測箇所から円筒体Wの他端まで10mm離れている所を
示す。直径計測は、小数点第三位まで計測して小数点第
三位を四捨五入した。研磨砥石27は、円筒体Wに密着
し研磨圧力を一定に保って一方向へ移動するときの一回
の研磨寸法が2.5ミクロンとなるように、研磨圧力が
調整されて研磨を行えるようになっており、研磨砥石2
7が一往復研磨すると円筒体Wは直径が10ミクロン小
さくなるように研磨される。従って、各区間の研磨前直
径値の最小位は、小数点第二位であるので研磨砥石の一
回の研磨寸法が2.5ミクロンであるから該一回の研磨
寸法の四倍となるように値に補正されている。図2
(b)は、円筒体の各区間の研磨前直径値をブロック積
みの棒グラフで示しかつブロックを取り除く順序を矢印
と番号で示すことにより研磨砥石の移動を説明するもの
である。図中、左の数値は直径値であり、一目盛りは半
径値長さで計算して5ミクロンとなる。従って、一つの
ブロックの高さは5ミクロンである。研磨砥石の一回の
研磨寸法が2.5ミクロンであるので、研磨砥石を一往
復することにより一つのブロックを取り除くことができ
る。以下に、ブロックを取り除く順序の説明を通して、
直径が最終的に均一になることを概念的に説明する。ブ
ロックが積まれたものであるならば、下段のブロックを
取り除くとその上に積まれているブロックは一段下が
る。実際の研磨は内部から先に行うことはできない。し
かし、ある区間の研磨を最上段のブロックに対する研磨
ではなく下段のブロックに対する研磨に相当するものと
概念的に決めて直径を小さく研磨していく考えることが
できる。しかして、研磨砥石27を円筒体Wに密着し一
回の研磨寸法が2.5ミクロンとなるように研磨圧力を
一定に保って図2(b)中の矢印に付けた符号1から符
号18に示す順序で往復移動を繰り返しつつ研磨するこ
とにより、一往復研磨したブロックを取り除いていく
と、円筒体全長を研磨前最小直径値よりも一往復研磨し
た小さい均一径に研磨することができる。図2(b)中
の矢印に付けた符号1から18に示す移動の順序は以下
の規則に従っている。研磨前最小直径値よりも大きな研
磨代部分に相当するブロックは、図2(b)中の矢印に
付けた符号1、2、4、6、8、10、12、14、1
6の順序で往復研磨を完了した順に取り除くことができ
る。図2(b)中の点線矢印に付けた符号3、5、7、
9、11、13、15、17は、研磨代部分が離れてい
る区間へ移動するときに研磨砥石27と円筒体Wの密着
を離さないで研磨圧力を実質的に零にして移動すること
を示している。従って、ブロックが研磨前直径値に比例
して積まれているので、各区間の研磨前最小直径値より
も大きな研磨代部分に相当するブロックは、積まれてい
るブロックの数だけ研磨移動を往復したときに全部取り
除くことができる。図2(b)中の例えば符号1の往復
研磨を行うことで概念的に同じ段のブロックの取り除く
ことは、各区間の研磨代部分が連続して存在するときは
その連続する区間を往復研磨することを意味している。
また、図2(b)中の例えば符号2の往復研磨を行って
概念的に同じ段のブロックの取り除くように連続する区
間を往復研磨すると、符号4の往復区間のブロックと符
号6の往復区間のブロックとに別れて残る。そこで、研
磨砥石は、符号3の矢印区間を研磨圧力を零にして円筒
体Wに密着して状態で研磨を行わないで移動して符号4
の往復研磨を行って符号4の矢印区間のブロックを取り
除き、次いで、符号3の矢印区間を研磨圧力を零にして
円筒体Wに密着して状態で研磨を行わないで移動して符
号6の往復研磨を行って符号6の矢印区間のブロックを
取り除くようにする。さらに、図2(b)中の符号16
の往復研磨を行うと、研磨前最小直径値に等しい均一な
直径値に研磨したことになる。この実施の形態では、符
号17の矢印区間を研磨圧力を零にして円筒体Wに密着
して状態で研磨を行わないで移動して引き続いて、符号
18の往復研磨を行って円筒体の全長を研磨前最小直径
値よりも一往復研磨した小さい均一径とする。実際の研
磨は内部から先に行うことは不可能であるが、上記のブ
ロックを取り除く順序で説明したように砥石研磨の移動
を行うと、円筒体の直径が小さくなる状態が、あたかも
下段のブロックを取り除くと上段のブロックが一段落
ち、かつブロックが取り除かれる順番に対応するように
概念的に把握することができ、結果として、必要最小限
の砥石研磨の移動により、円筒体の全長を研磨前最小直
径値よりも一往復研磨した小さい均一径となるように精
密研磨することができる。図2(b)中の符号18の研
磨を行うことは、本願発明の必須要件ではない。その理
由は、符号17の研磨を終了した時点で均一径となるか
らである。また、符号18の研磨を行うことを必須要件
とすれば、符号16の研磨を終了した時点で円筒体を取
外し別の研磨装置に取り付けて符号18の研磨を行うこ
とが考えられるからである。なお、符号18の復方向の
研磨の砥石の回転及び円筒体の回転をそれ以前の回転に
対して反対回転とすると、研磨目を消すことができる。Next, a method for polishing a grindstone of a cylindrical body according to the first embodiment of the present invention will be described with reference to FIGS. 2 (a) and 2 (b). FIG. 2A shows the chuck cone 21a.
The figure shows that the cylindrical body W, which is chucked at both ends by the chuck cone 21b and is rotated, is polished by the polishing grindstone 27, and the numerical value in the figure is obtained by correcting the measured diameter value of each section at a constant pitch of the cylindrical body W. Shows the diameter value before polishing. FIG. 2 (a)
Indicates the diameter at a position 10 mm away from one end of the cylindrical body W, then measures the diameter at a 30 mm pitch, and indicates a place 10 mm away from the last measurement point to the other end of the cylindrical body W. The diameter was measured to the third decimal place and rounded to the third decimal place. The polishing grindstone 27 is adjusted so that the polishing pressure is adjusted so that a single polishing dimension when moving in one direction while keeping the polishing pressure constant while being in close contact with the cylindrical body W is 2.5 microns. And the grinding wheel 2
When the cylinder 7 is polished once, the cylindrical body W is polished so that the diameter becomes smaller by 10 microns. Therefore, since the minimum value of the diameter before polishing in each section is the second decimal place, the polishing size of a single grinding wheel is 2.5 microns, so that the polishing size is four times as large as the single polishing size. Value has been corrected. FIG.
(B) illustrates the movement of the grinding wheel by indicating the diameter value of each section of the cylindrical body before polishing by a bar graph of block stacking and the order of removing the blocks by arrows and numbers. In the figure, the numerical value on the left is the diameter value, and one division is 5 microns calculated by the radius value length. Therefore, the height of one block is 5 microns. Since the polishing size of the polishing wheel at one time is 2.5 microns, one block can be removed by making one round trip of the polishing wheel. Below, through the explanation of the order of removing blocks,
The concept that the diameter finally becomes uniform will be described conceptually. If the blocks are stacked, removing the lower block will lower the blocks stacked on it by one step. Actual polishing cannot be performed first from the inside. However, it can be considered that the polishing in a certain section is conceptually determined to be not the polishing of the uppermost block but the polishing of the lower block, and the polishing is performed with a smaller diameter. Then, the polishing wheel 27 is brought into close contact with the cylindrical body W, and the polishing pressure is kept constant so that the polishing size at one time becomes 2.5 μm, and reference numerals 1 to 18 attached to the arrows in FIG. By repeating the reciprocating movement in the order shown in (1) and removing the block that has been polished once, the entire length of the cylindrical body can be polished to a small uniform diameter that is polished once more than the minimum diameter value before polishing. The order of movement indicated by reference numerals 1 to 18 attached to the arrows in FIG. 2B conforms to the following rules. Blocks corresponding to a polishing margin portion larger than the minimum diameter value before polishing are indicated by reference numerals 1, 2, 4, 6, 8, 10, 12, 14, 1 attached to arrows in FIG.
6 can be removed in the order in which the reciprocating polishing is completed. Reference numerals 3, 5, 7, and 4 attached to dotted arrows in FIG.
9, 11, 13, 15, and 17 indicate that the polishing pressure is substantially reduced to zero without moving the grinding wheel 27 and the cylindrical body W in close contact with each other when moving to a section where the polishing allowance portion is away. Is shown. Therefore, since the blocks are stacked in proportion to the diameter value before polishing, the blocks corresponding to the polishing allowance portion larger than the minimum diameter value before polishing in each section reciprocate the polishing movement by the number of the stacked blocks. You can remove them all when you do. By performing reciprocating polishing of, for example, reference numeral 1 in FIG. 2B, conceptually removing blocks at the same stage means that if the polishing allowance portion of each section exists continuously, the continuous section is reciprocally polished. It means to do.
In addition, for example, by performing reciprocating polishing of reference numeral 2 in FIG. 2B and reciprocating polishing of a continuous section so as to conceptually remove blocks of the same stage, a block of a reciprocating section of reference numeral 4 and a reciprocating section of a reference numeral 6 are obtained. It will be separated into blocks. Therefore, the grinding wheel is moved in the direction indicated by the reference numeral 3 with the polishing pressure set to zero and the cylindrical member W in contact with the cylindrical body W without being polished.
Then, the block in the arrow section of the reference numeral 4 is removed by performing reciprocating polishing, and then the arrow section of the reference numeral 3 is moved to the cylindrical body W in a state in which the polishing pressure is set to zero and the polishing is performed in a state in which the block is in close contact with the cylindrical body W without polishing. Reciprocating polishing is performed to remove the block in the section indicated by the arrow 6. Further, reference numeral 16 in FIG.
When the reciprocating polishing is performed, the polishing is performed to a uniform diameter value equal to the minimum diameter value before polishing. In this embodiment, the section indicated by the reference numeral 17 is moved to the direction indicated by the arrow 17 without polishing while the polishing pressure is set to zero, and the cylinder 18 is reciprocally polished. Is smaller than the minimum diameter value before polishing by one reciprocating polishing to a small uniform diameter. It is impossible to perform actual polishing first from the inside, but as described in the order of removing the blocks above, moving the grinding wheel polishing, the state where the diameter of the cylindrical body becomes smaller, as if the lower block By removing the upper block, the upper block can be dropped one step, and it can be conceptually grasped so as to correspond to the order in which the blocks are removed.As a result, the necessary minimum grinding wheel movement moves the entire length of the cylindrical body before polishing. Precision polishing can be performed so as to have a uniform diameter smaller than the minimum diameter by one round trip. The polishing of reference numeral 18 in FIG. 2B is not an essential requirement of the present invention. The reason is that the diameter becomes uniform when the polishing of reference numeral 17 is completed. In addition, if the polishing of the reference numeral 18 is an essential requirement, the polishing of the reference numeral 18 may be performed by removing the cylindrical body and attaching the cylindrical body to another polishing apparatus when the polishing of the reference numeral 16 is completed. In addition, if the rotation of the grindstone and the rotation of the cylindrical body for polishing in the backward direction indicated by reference numeral 18 are made to be opposite rotations to the previous rotation, the polishing eye can be eliminated.
【0008】図3は、研磨砥石の別の移動順序を示す図
である。この実施の態様は、大きい直径値に対応してい
る上段に積まれているブロックから研磨する移動順序と
なっている。符号2と4と6と7の往復研磨の順序とス
トロークの大小は、研磨順の関係が図2の関係と逆転し
ている。同様に、符号9と11と13と15と17の往
復研磨の順序とストロークの大小の関係が図2の関係と
逆転している。符号13と19の往復研磨はストローク
の大小と研磨順の関係が逆転している。このことは、本
願発明の円筒体の砥石研磨方法における研磨砥石の移動
順序の決定に幅があることを示している。すなわち、下
側のブロックに相当する研磨が上側のブロックに相当す
る研磨よりも先に行われることは必須要件ではない。研
磨砥石の移動順序の決定について必須要件は以下の通り
である。 研磨前最小直径値よりも大きな研磨代部分について、
研磨前直径値に比例した往復回数だけ研磨すること。 その際、同一直径値の研磨代部分が複数区間の連続し
て存在するときはその連続する区間を往復研磨するこ
と。 研磨代部分が離れている区間へ移動するときは研磨砥
石と円筒体の密着を離さないで研磨圧力を実質的に零に
して移動する。なお、符号19の復方向の研磨の砥石の
回転及び円筒体の回転をそれ以前の回転に対して反対回
転とすると、研磨目を消すことができる。FIG. 3 is a diagram showing another moving order of the grinding wheel. In this embodiment, the moving order is such that the polishing is performed from the upper stacked block corresponding to the large diameter value. The order of the reciprocating polishing and the magnitude of the stroke of the symbols 2, 4, 6 and 7 are such that the relationship of the polishing order is opposite to the relationship of FIG. 2. Similarly, the relationship between the order of the reciprocating polishing and the magnitude of the stroke of the symbols 9, 11, 13, 15 and 17 is opposite to the relationship of FIG. 2. In the reciprocating polishing of reference numerals 13 and 19, the relationship between the magnitude of the stroke and the polishing order is reversed. This indicates that the moving order of the polishing grindstones in the method for polishing a cylindrical grindstone of the present invention has a wide range. That is, it is not an essential requirement that the polishing corresponding to the lower block be performed before the polishing corresponding to the upper block. The essential requirements for determining the order of movement of the grinding wheels are as follows. For the polishing allowance part larger than the minimum diameter value before polishing,
Polish the number of reciprocations in proportion to the diameter value before polishing. At this time, when a polishing margin portion having the same diameter value exists continuously in a plurality of sections, reciprocating polishing is performed on the continuous section. When moving to a section where the polishing allowance portion is separated, the polishing pressure is substantially reduced to zero without moving the polishing wheel and the cylindrical body in close contact with each other. In addition, if the rotation of the grindstone and the rotation of the cylindrical body in the backward direction of the reference numeral 19 are made to be opposite rotations to the previous rotation, the polishing eye can be eliminated.
【0009】[0009]
【発明の効果】以上説明してきたように、本願発明の円
筒体の砥石研磨方法によれば、 円筒研磨する前の円筒体の円筒精度が低くても、短時
間の軽研磨加工で円筒体を全長にわたり均一な直径に精
密研磨することができる。 研磨回数を直径の大きさに比例させかつ圧力を一定に
保って研磨するので、研磨装置の研磨砥石を円筒体に沿
って移動する直動精度が低くても円筒体を全長にわたり
均一な直径に研磨することができ、円筒研磨精度が低い
研磨装置をソフト面から円筒研磨精度が極めて高くなる
ように改善できる。 圧力を一定に保って研磨するので、研磨砥石の表面が
漸次に崩壊していく分について補正をかける必要はな
い。 円筒体全長を研磨して取り外して計測し直径の大きい
ところを検出し再び研磨装置にチャックして研磨するこ
とを何回も繰り返す従来の円筒体研磨方法に比べ、はる
かに短時間に高精密な円筒体研磨ができる。 研磨中に研磨砥石が減った分の微小寸法を検出して随
時補正を加える従来の円筒体研磨方法に比べて、高精密
な円筒体研磨ができる。 円筒体の一端から他端まで連続する円筒研磨を行わな
いで往復研磨を反復して移動していくだけで円筒体を全
長にわたり均一な直径に研磨することができ、円筒体の
一端から他端まで連続する円筒研磨は一回で足りる。円
筒体の直径が小さくなり過ぎる惧れがない。従って、被
製版ロールのバラードメッキの厚みを従来よりも小さく
することができ、経済的である。 円筒精度の測定作業は円筒研磨前の一回で足り、円筒
研磨後に円筒体を取外し測定器に載置して円筒精度を測
定する必要はない。As described above, according to the method for polishing a grindstone of a cylindrical body of the present invention, even if the cylindrical precision of the cylindrical body before the cylindrical polishing is low, the cylindrical body can be lightly polished in a short time. Precision polishing to a uniform diameter over the entire length. Since the number of polishings is proportional to the diameter and the polishing is performed with the pressure kept constant, the cylindrical body is made to have a uniform diameter over the entire length even when the linear motion accuracy of moving the grinding wheel of the polishing device along the cylindrical body is low. Polishing can be performed and a polishing apparatus having a low cylindrical polishing accuracy can be improved from a soft surface to a very high cylindrical polishing accuracy. Since the polishing is performed while keeping the pressure constant, it is not necessary to make correction for the gradual collapse of the surface of the grinding wheel. Polishing and removing the entire length of the cylindrical body, measuring it, detecting the place with a large diameter, chucking the polishing device again and polishing many times, compared to the conventional cylindrical body polishing method that repeats many times Polishing cylindrical body. As compared with the conventional cylindrical body polishing method in which a minute dimension corresponding to the decrease of the grinding wheel during polishing is detected and correction is performed as needed, highly accurate cylindrical body polishing can be performed. The cylindrical body can be polished to a uniform diameter over the entire length just by moving repeatedly and reciprocating polishing without performing continuous cylindrical polishing from one end to the other end of the cylindrical body, and from one end to the other end of the cylindrical body One continuous cylindrical polishing is sufficient. There is no fear that the diameter of the cylinder becomes too small. Therefore, the thickness of the ballad plating of the plate making roll can be made smaller than before, which is economical. It is sufficient to measure the cylinder accuracy only once before polishing the cylinder, and it is not necessary to remove the cylinder after the cylinder polishing and place it on a measuring instrument to measure the cylinder accuracy.
【図1】本願発明の円筒体の砥石研磨方法を実施するた
めの円筒研磨装置の概略正面図。FIG. 1 is a schematic front view of a cylindrical polishing apparatus for carrying out a method for polishing a grindstone of a cylindrical body according to the present invention.
【図2】本願発明の第一の実施の態様にかかる円筒体の
砥石研磨方法を説明するための図である。(a)は、円
筒体を研磨砥石で研磨するに際して、円筒体の一定ピッ
チ毎の研磨前直径値を示す。(b)は、円筒体の各区間
の研磨前直径値をブロック積みの棒グラフで示しかつブ
ロックを取り除く順序を矢印と番号で示すことにより研
磨砥石の移動を説明するための図である。FIG. 2 is a view for explaining a method for polishing a grindstone of a cylindrical body according to the first embodiment of the present invention. (A) shows the pre-polishing diameter value for each constant pitch of the cylindrical body when the cylindrical body is polished with a polishing grindstone. (B) is a diagram for explaining the movement of the polishing grindstone by indicating the pre-polishing diameter value of each section of the cylindrical body by a bar graph of a block stack and indicating the order of removing the blocks by arrows and numbers.
【図3】本願発明の第二の実施の態様にかかる円筒体の
砥石研磨方法を説明するための図であって、円筒体の各
区間の研磨前直径値をブロック積みの棒グラフで示しか
つブロックを取り除く順序を矢印と番号で示すことによ
り研磨砥石の移動を説明するための図である。FIG. 3 is a diagram for explaining a grinding wheel polishing method for a cylindrical body according to a second embodiment of the present invention, wherein a diameter value before polishing of each section of the cylindrical body is shown by a bar graph of block stacking and a block diagram. FIG. 4 is a diagram for explaining the movement of the polishing grindstone by indicating the order of removing the grinding wheels by arrows and numbers.
W ・・・円筒体 27 ・・・研磨砥石 W: Cylindrical body 27: Polishing whetstone
Claims (1)
に計測した各区間の計測直径値の最小位について、研磨
砥石を円筒体に密着し研磨圧力を一定に保って一方向へ
移動するときの一回研磨寸法の四倍となるように近似す
る値に補正した各区間の研磨前直径値とし、研磨砥石を
円筒体に密着し研磨圧力を一定に保って往復移動を繰り
返しつつ研磨することにより、研磨前最小直径値よりも
大きな研磨代部分がなくなるまで円筒体を均一な直径値
となるように研磨する円筒体研磨方法であって、 研磨前最小直径値よりも大きな研磨代部分の区間を研磨
前直径値に比例した回数だけ研磨移動し、その際直径値
が等しい研磨代部分が連続して存在する区間を往復研磨
し、研磨代部分が離れている区間へ移動するときは研磨
砥石と円筒体の密着を離さないで研磨圧力を実質的に零
にして移動することを特徴とする円筒体の研磨方法。1. A polishing whetstone is brought into close contact with a cylindrical body and moves in one direction while maintaining a constant polishing pressure for a minimum value of a measured diameter value of each section measured at a constant pitch from one end to the other end of the cylindrical body. The diameter before polishing of each section was corrected to a value approximating to be four times the single polishing dimension at the time, and the polishing wheel was brought into close contact with the cylindrical body, and the polishing was repeated while repeating the reciprocating movement while keeping the polishing pressure constant. By this, a cylindrical body polishing method of polishing the cylindrical body so as to have a uniform diameter value until there is no polishing margin portion larger than the minimum diameter value before polishing, wherein the polishing margin portion larger than the minimum diameter value before polishing. The section is polished and moved by the number of times proportional to the pre-polishing diameter value.At this time, the section where the polishing allowance portion having the same diameter value is continuously present is reciprocally polished. Release the close contact between the whetstone and cylinder The polishing method of the cylindrical body, characterized in that to move in the substantially zero polishing pressure is not.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26922597A JPH1190797A (en) | 1997-09-16 | 1997-09-16 | Grinding wheel polishing method for cylindrical body |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26922597A JPH1190797A (en) | 1997-09-16 | 1997-09-16 | Grinding wheel polishing method for cylindrical body |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH1190797A true JPH1190797A (en) | 1999-04-06 |
Family
ID=17469413
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP26922597A Pending JPH1190797A (en) | 1997-09-16 | 1997-09-16 | Grinding wheel polishing method for cylindrical body |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH1190797A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011199096A (en) * | 2010-03-23 | 2011-10-06 | Disco Corp | Method of grinding wafer |
JP2011224739A (en) * | 2010-04-21 | 2011-11-10 | Lasertec Corp | Defect correcting apparatus and defect correcting method |
-
1997
- 1997-09-16 JP JP26922597A patent/JPH1190797A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011199096A (en) * | 2010-03-23 | 2011-10-06 | Disco Corp | Method of grinding wafer |
JP2011224739A (en) * | 2010-04-21 | 2011-11-10 | Lasertec Corp | Defect correcting apparatus and defect correcting method |
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