201210743 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種對由硬脆材料構成之圓柱狀被加工 物之外周面的表層部（以下，只要無特別說明，僅記作「表 層部」）進行研磨之研磨裝置。 【先前技術】 於作為本發明之研磨對象之硬脆材料之圓柱狀構件 中，有例如藉由線鋸進行切片加工而成為用以獲得矽晶圓 之材料之矽塊，該矽塊係藉由帶鋸或線鋸將素材由單晶或 ^ sa所構成之矽晶錠切斷而形成為圓柱形狀者，但在關於 上述切斷後之外形尺寸之要求精度較高的情形時，要對其 表層面進行研削處理。 藉由直拉單晶製造法（Czochralski method : CZ法）等 所獲付之單晶矽塊、或者藉由鑄造法等所獲得之多晶矽塊 係於後、’·貝步驟中利用線鑛進行切片加工而製造石夕晶圓者， T若表層部存在微裂痕或微小凹凸’則於切片加工時所製 过之石夕晶圓容易產生裂痕、碎片’因此於專利文獻.i及專 文獻2中，揭示出藉由對矽塊之表層部進行研磨去除而 去除存在於上述表層部之微小凹& (及微裂痕），從而謀 求提高矽晶圓之產品良率。尤其，於專利文獻1中，揭示 出藉由對自表面起50〜100 _以上、2〇〇⑽以下之矽 "表曰。卩進行研磨去除，而將研磨前之10〜20 "m之表 +键度Ry平坦化成3〜4 " m 〇又’作為石夕塊之研磨裝 置，於專利文獻3中有揭示。[Technical Field] The present invention relates to a surface layer portion of a peripheral surface of a cylindrical workpiece which is made of a hard and brittle material (hereinafter, unless otherwise specified, it is simply referred to as a "surface layer portion". ") Grinding device for grinding. [Prior Art] Among the cylindrical members which are hard and brittle materials to be polished of the present invention, there are, for example, slicing by a wire saw to form a crucible for obtaining a material of a crucible wafer by A band saw or a wire saw cuts a material from a single crystal or a sa-shaped ingot to form a cylindrical shape. However, in the case where the required dimensional accuracy is high after the cutting, the table is to be The level is processed. A single crystal block obtained by a Czochralski method (CZ method) or the like, or a polycrystalline block obtained by a casting method or the like is used in a post-section, using a line ore to slice When processing and manufacturing Shixi wafers, if there are micro-cracks or micro-convexities in the surface layer, the wafers produced during the slicing process are prone to cracks and fragments. Therefore, in Patent Document i and Special Document 2 It is revealed that the surface defects of the tantalum block are removed by polishing and removing the micro-concave & (and micro-cracks) present in the surface layer portion, thereby improving the yield of the wafer. In particular, Patent Document 1 discloses a 矽 " expression of 50 100 100 _ or more and 2 〇〇 (10) or less from the surface.卩 Grinding and removing, and polishing the 10 to 20 "m table + bond degree Ry before polishing to 3 to 4 " m 〇 again as a grinding device of the stone block, disclosed in Patent Document 3.
S 3 201210743 專利文獻1 :日本特開2005-347712號公報 專利文獻2 :日本特開2〇〇2_252188號公報 專利文獻3 :日本特開2〇〇9 233794號公報 【發明内容】 專利文獻1至專利文獻3之任一者皆係對於四角柱狀 構件之矽塊之表層部的研磨方法及研磨裝置之揭示，關於 進行本案發明欲實施之圓柱構件之表層部的研磨加工之裝 置並未揭示。 本發明之目的在於提供一種滿足上述要求事項，业丑 可利用1台裝置對作為被加工物之圓柱狀矽塊等硬脆材料 之表層部進行研磨加工的研磨裝置及其研磨方法。 第1發明之研磨裝置，係對圓柱狀被加工物之外周面 之表層部進行研磨，其特徵在於，具備：夾鉗手段，連結 於被加工物之旋轉手段，並夾持該被加工物之兩端面；研 磨手奴，其前端接觸被加工物之外周面並旋轉同時進行研 磨加工；移動手&，使該研磨手段㈣該被加工物在與該 被加工物之大致圓形之剖面方向正交之長邊方向移動；高 度位置檢測手段，檢測研磨加工完成品及研磨加工前之被 加工物之高度位置；以及控制手段，供輸入該高度位置及 加工條件，並對此進行運算來進行研磨加工；該運算係該 研磨加工完成品之高度位置與該研磨前之被加工物之高产 位置之差之運算、或藉由輸人之加卫條件設定其 ： 件之運算、或該等之組合中之任一者^ ” 第2發明使用如下之技術手段，該技術手段如第 201210743 明之圓柱狀構件之研磨裝置，其中，該研磨手段係研磨刷， 該研磨刷係將含有研磨纟 < 毛材於該研磨㈣之底部以環狀 植設複數根之構造。 第3發明使用如下之技術手段，該技術手段如第！發 明之圓柱狀構件之研磨裝置，其中，該研磨手段係研磨刷， 該研磨刷具有將捆束有4數根含有研磨粒《毛材之研磨具 之基部於研磨具安裝板植設複數根之構造。 第4發明使用如下之技術手段，該技術手段如第】發 明之圓柱狀構件之研磨裝置，其中，該研磨手段係研磨刷， 該研磨刷具有將含有研磨粒之彈性體於該研磨刷之底部以 環狀配置之構造。 第5發明使用如下之技術手段，該技術手段如第2至 第4發明中之任一者之圓柱狀構件之研磨裝置，其中，該 研磨手段係沿圓柱狀被加工物之軸芯連設配置有複數個。 第6發明使用如下之技術手段，該技術手段如第2至 第4發明中之任一者之圓柱狀構件之研磨裝置，其中，該 研磨手段係由配置在被加工物之圓形剖面之相同面内之第 1研磨手段與第2研磨手段構成，第1研磨手段與第2研磨 手段之軸芯係酉己置成與被加工物之半徑彳向一致，第1研 磨手段之轴芯與第2研磨手段之轴芯係配置成在被加工物 之剖面中心交又以構成既定角度0。 第7發明使用如下之技術手段，該技術手段如第6發 明之圓柱狀構件之研磨裝置，其中，該第i研磨手段與第2 研磨手段係分別沿圓柱狀被加工物之轴芯連設配置有複數Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. 2-252188. Patent Document 3 discloses a polishing method for a surface portion of a square columnar member and a polishing apparatus. The apparatus for polishing the surface layer portion of the cylindrical member to be carried out by the present invention is not disclosed. It is an object of the present invention to provide a polishing apparatus and a polishing method for polishing a surface layer portion of a hard and brittle material such as a cylindrical crucible as a workpiece by one apparatus. In the polishing apparatus according to the first aspect of the invention, the surface layer portion of the outer peripheral surface of the cylindrical workpiece is polished, and the knuckle means is provided to be coupled to the rotating means of the workpiece and to hold the workpiece. Two end faces; the grinding hand slave, the front end of which contacts the outer peripheral surface of the workpiece and rotates while grinding; moving the hand & the grinding means (4) the workpiece in a substantially circular cross-section with the workpiece The orthogonal direction moves in the longitudinal direction; the height position detecting means detects the height position of the finished workpiece and the workpiece before the grinding processing; and the control means for inputting the height position and the processing condition, and calculating the same Grinding processing; the calculation is the calculation of the difference between the height position of the finished product and the high-yield position of the workpiece before the polishing, or the calculation of the component by the input conditions of the input, or the like Any one of the combinations ^" The second invention uses the following technical means, such as the grinding device of the cylindrical member described in Japanese Patent No. 201210743, wherein The method is a polishing brush, and the polishing brush has a structure in which a plurality of base materials are arranged in a ring shape at the bottom of the polishing (4). The third invention uses the following technical means, such as the invention: A polishing apparatus for a columnar member, wherein the polishing means is a polishing brush having a structure in which a plurality of bases of a polishing tool having a plurality of abrasive grains "abrasive material" are bundled on a polishing tool mounting plate. According to a fourth aspect of the present invention, there is provided a polishing apparatus for a cylindrical member according to the invention, wherein the polishing means is an abrasive brush having an elastic body containing abrasive grains at a bottom of the polishing brush The fifth aspect of the invention is directed to a polishing apparatus for a cylindrical member according to any one of the second to fourth inventions, wherein the polishing means is processed in a cylindrical shape. The sixth embodiment of the present invention uses a plurality of the above-mentioned technical means, such as the polishing device for the cylindrical member of any one of the second to fourth inventions. The polishing means is composed of a first polishing means and a second polishing means disposed in the same plane of the circular cross section of the workpiece, and the first polishing means and the axis of the second polishing means are formed. The axial direction of the workpiece is aligned, and the axial core of the first polishing means and the axial core of the second polishing means are disposed so as to intersect at the center of the cross-section of the workpiece to form a predetermined angle of 0. The seventh invention uses the following technical means In the polishing apparatus for a cylindrical member according to the sixth aspect of the invention, the i-th polishing means and the second polishing means are respectively disposed along the axis of the cylindrical workpiece.
S 5 201210743 個。 第8、第9發明使用如下之技術手段，該技術手段如第 5或第7發明之圓柱狀構件之研磨裝置，其中，該研磨手段 所使用之毛材或彈性體中所混合之研磨粒之粒度為Η如〜 # 2000，選擇兩種以上具有該粒度不同之毛材或彈性體之 研磨手段，且以研磨粒之粒度由「粗」到「細」之順序進 盯研磨加工之方式，將研磨粒之粒度不同之研磨手段沿圓 柱狀被加工物之軸芯連設。 第10、第11發明使用如下之技術手段，該技術手段如 第5或第7發明之圓柱狀構件之研磨裝置，其中，該研磨 手段所使用之毛材或彈性體中所混合之研磨粒之粒度為 F180 # 2000，且將具有該粒度大致相同之毛材或彈性體 之研磨手段沿圓柱狀被加工物之軸芯連設。 第12發明之圓柱狀構件，係被第丨發明之圓柱狀構件 之研磨裝置研磨加工，其特徵在於：存在於自被加工物之 表層起100 /zm以下之微裂痕被去除，且研磨加工面之表 面粗缝度Ry為3 // m以下。 第13發b月使用如下之技術手段，該技術手段如第 發明之圓柱狀構件’其中’該圓柱狀構件切塊或陶竟。 第14發明之圓柱狀構件之研磨方法，係藉由第（發明 之圓柱狀構件之研磨裝置對圓柱狀構件進行研磨加工，其 特徵在於： 藉由該旋轉手段使該失鉗手段所失持之被加工物旋 轉，且 6 201210743 使該研磨手段之前端接觸該被加工物之外周面並旋 轉， 且使該研磨手段相對該被加工物移動。 第1 5、第16發明使用如下之技術手段，該技術手段係 一種藉由第5或第7發明之圓柱狀構件之研磨裝置對圓柱 狀構件進行研磨加工之方法’該研磨手段所使用之毛材或 彈性體中所混合之研磨粒之粒度為F18〇〜# 2〇〇〇，選擇兩 種以上具有該粒度不同之毛材或彈性體之研磨手段，且以 研磨粒之粒度由「粗」到「細」之順序進行研磨加工之方 式’將研磨粒之粒度不同之研磨手段沿圓柱狀被加工物之 軸芯連設來進行研磨。 第17、第18發明使用如下之技術手段，該技術手 一種藉由第5或第7發明之圓柱狀構件之研磨裝置對圓柱 =構件進订研磨加卫之方法’該研磨手段所使用之毛材或 彈性體中所混合之研磨粒之粒度& f18〇〜#2()()g，將具有 忒粒度大致相同之毛材或彈性體之研磨手段沿圓柱狀被加 工物之軸芯連設來進行研磨。 該研磨手段與圓柱狀被加工物之外周面接觸，並且利 :二轉手段使被加工物進行旋轉，藉此可對該被加工物之 物：：：仃研磨加工。X，由夾鉗手段所夾持之該被加工 =❹上《轉手段（以τ，記作旋轉手段（被加工物 之表圓周方向進行旋轉’故可均勾地對該被加工物 磨手I;目對：研磨加工。進而’於該研磨加工時，使該研 相對该被加工物在被加工物之長邊方向'即與大致 201210743 圓开y之。丨面正交之方向上移動，藉此可均勻地對整個該被 加工物進行研磨加工。所謂大致圓形，不僅包含圓形，亦 包含橢圓等因該被加工物（圓柱狀構件）之製程中之變形 等所產生之稍許非圓形之狀態。 又，藉由高度位置檢測手段於研磨開始前檢測利用研 磨手段對研磨加工完成品之標準片（以下，記作「母工件 (master w0rk)」）開始進行研磨加工之高度位置並儲存 後檢測被加工物之咼度位置，並藉由控制手段運算對上 述母工件檢測出之兩度位置與對被加工物檢測出之高度位 置的差分’根據運算結果修正上述研磨手段之前端與被加 工物之距離，藉此可對複數個被加工物連續進行研磨加 工。再者，第1發明中記載之「輸入」，亦包含手動（作 業者）輸人（儲存）至控制手段之資訊 '自動輸人（儲存） 至控制手段之資訊、以及根據手動或/及自動輸入（儲存） 之資訊進行運算後所輸入（儲存）之資訊中的任一者。 」吏用以3有研磨粒之毛材構成上述研磨手段之研 磨刷，藉此可確保穿公夕m命 、 雄保充刀之研磨力，且可抑制因研磨而對被 加工物&成之知傷。此方法與例如以研磨石等進行研磨 其他研磨方法相比，由於主从 由於毛材具有柔軟性，因此可抑制因 研磨而對被加工物造成之招值 物&成之知傷，又，由於毛材中含有研磨 粒，因此可充分確保研磨力。 又府藉由任意地設定植設有將複數根上述毛材 成之研磨具之研磨具安裝板的位 而 ^ ^ 直、上〒方向)，可調替 自研磨手段之底部露出之毛 π整 Α何之長度。即，配合毛材之磨 201210743 耗而使研磨具安裝板之位置向下方移動，冑此可使露出之 毛材之長度始終保持一定。 又，由於研磨加工時與被加工物接觸者為彈性體，因 此可減少由被加工物與該研磨刷接觸所造成之損傷。 又，上述毛材中所混合之研磨粒之粒度為f 1 8〇〜# 〇〇〇 ( JIS R6001 . 1998 )，1個研磨手段係混合有大致相 同之粒徑之研磨刷。即，越是具備該粒度較大之毛材或彈 性體之研磨手段’其研磨能力越高，可確實地去除存在於 被加工物之表層部之微裂痕；越是具備該粒度較小之毛材 或彈性體之研磨手段，越可對該表層部進行微細研磨而去 除凹凸。 又，將研磨手段沿圓柱狀被加工物之軸芯連設配置複 數個’藉此可對應於被加卫物之種類或目的而適當選擇研 磨手段進行加工。#，選擇兩種以上具有該粒度不同之毛 材或彈性體之研磨手段，並以該研磨手段所具備之毛材或 彈性體中所含有之上述粒度由「粗」&「細」之順序通過 上述被加工物而進行加工之方式連設，藉此能夠以一次研 磨加工去除被加工物表層部之微裂痕及凹凸。又，在無需 如上所述ώ粗」到「細」之奢階段加工，可藉由1個階S 5 201210743. The eighth and ninth inventions use the above-mentioned technical means, such as the polishing apparatus of the cylindrical member of the fifth or seventh invention, wherein the abrasive material or the elastomer used in the polishing means is mixed with the abrasive grains. The particle size is, for example, ~ #2000, two or more kinds of grinding means having the same size or the elastic material of the particle size are selected, and the grinding particle size is changed from "thick" to "fine" in the order of grinding. Grinding means having different particle sizes of the abrasive grains are connected along the axis of the cylindrical workpiece. The tenth and eleventh inventions use the above-mentioned technical means, such as the grinding apparatus of the cylindrical member of the 5th or 7th invention, wherein the abrasive material mixed with the abrasive material or the elastomer is used. The particle size is F180 #2000, and the grinding means having the hair material or the elastic body having the same particle size is connected along the axis of the cylindrical workpiece. The cylindrical member according to the twelfth aspect of the invention is the same as the polishing apparatus of the cylindrical member according to the second aspect of the invention, characterized in that the micro-cracks present at 100 / zm or less from the surface layer of the workpiece are removed, and the machined surface is polished. The surface roughness Ry is 3 // m or less. In the thirteenth month, the following technical means is used, such as the cylindrical member of the first invention, wherein the cylindrical member is cut or tiled. A method of polishing a cylindrical member according to a fourteenth aspect of the present invention, wherein the cylindrical member is polished by the polishing apparatus for a cylindrical member according to the invention, characterized in that the lost-clamp means is lost by the rotating means The workpiece is rotated, and 6 201210743 causes the front end of the polishing means to contact the outer peripheral surface of the workpiece and rotates, and the polishing means is moved relative to the workpiece. The fifth and sixteenth inventions use the following technical means, The technical means is a method of grinding a cylindrical member by a polishing apparatus for a cylindrical member according to the fifth or seventh invention. The particle size of the abrasive grains mixed in the wool or elastomer used in the polishing means is F18〇~# 2〇〇〇, select two or more kinds of grinding means with different sizes of wool or elastomer, and grind the grinding grain size from "thick" to "fine" in the order of ' Grinding means having different particle sizes of the abrasive grains are ground along the axis of the cylindrical workpiece. The seventeenth and eighteenth inventions use the following technical means. The method of grinding and arranging a cylindrical member according to the grinding device of the cylindrical member of the fifth or seventh invention, 'the particle size of the abrasive grains mixed in the raw material or the elastic body used in the polishing means & f18〇~ #2()()g, a polishing means having a base material or an elastomer having substantially the same particle size is connected to the axis of the cylindrical workpiece to be polished. The polishing means and the outer periphery of the cylindrical workpiece Contact, and profit: the two-rotation means rotates the workpiece, whereby the object to be processed can be::: 仃 grinding processing. X, the workpiece is clamped by the clamp means = 《 Means (indicated by τ, which is referred to as a rotating means (rotation in the circumferential direction of the workpiece), so that the workpiece can be ground by hand; the object is: grinding, and further, during the polishing process, The workpiece is moved in the longitudinal direction of the workpiece, that is, approximately 201210743, and is moved in the direction orthogonal to the surface of the workpiece. This allows the entire workpiece to be uniformly polished. Round, not only round, but also oval A slightly non-circular state due to deformation or the like in the process of the workpiece (cylindrical member). Further, the height position detecting means detects the standard piece of the finished product by the grinding means before the start of the polishing. (hereinafter, referred to as "master w0rk"), the height position of the polishing process is started and stored, and the position of the workpiece is detected, and the position of the second workpiece detected by the parent workpiece is calculated by a control means. The difference "the height position detected by the workpiece" is corrected based on the calculation result, and the distance between the front end of the polishing means and the workpiece is corrected, whereby a plurality of workpieces can be continuously polished. Further, the first invention describes The "input" also includes the information of the manual (operator) input (storage) to the control means 'automatic input (storage) to the control means, and based on the manual or / and automatic input (storage) information Any of the information entered (stored) afterwards.研磨 研磨 研磨 吏 吏 吏 吏 吏 吏 吏 吏 吏 吏 吏 吏 吏 吏 吏 吏 吏 吏 吏 吏 吏 吏 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨Zhishou. Since this method is more flexible than the other polishing method, for example, grinding with a grinding stone or the like, since the main material is soft, it is possible to suppress the damage caused by the polishing to the workpiece. Since the abrasive material contains abrasive grains, the grinding force can be sufficiently ensured. The arbitrarily set the position of the polishing tool mounting plate in which the plurality of the above-mentioned hair materials are formed by arbitrarily setting the position of the grinding tool mounting plate, and the Φ whole is exposed from the bottom of the grinding means. What is the length? That is, the position of the polishing tool mounting plate is moved downward in accordance with the abrasion of the material of the material 201210743, so that the length of the exposed wool material is always kept constant. Further, since the person who is in contact with the workpiece during the polishing process is an elastic body, the damage caused by the contact between the workpiece and the polishing brush can be reduced. Further, the particle size of the abrasive grains mixed in the above-mentioned wool material is f 1 8 〇 to # 〇〇〇 (JIS R6001. 1998), and one polishing means is a polishing brush in which substantially the same particle diameter is mixed. In other words, the higher the polishing ability of the polishing material having the larger particle size or the elastic material, the more the microcracks present in the surface layer portion of the workpiece can be reliably removed; The polishing means of the material or the elastomer can finely grind the surface layer portion to remove irregularities. Further, the polishing means is disposed in a plurality of positions along the axis of the cylindrical workpiece, whereby the grinding means can be appropriately selected in accordance with the type or purpose of the object to be cured. #,Selecting two or more types of polishing means having a hair material or an elastomer having different particle sizes, and the above-mentioned particle size contained in the wool or elastomer provided in the polishing means is in the order of "rough" & "fine" By connecting the workpiece to the workpiece, the micro-cracks and irregularities in the surface layer portion of the workpiece can be removed by one-time polishing. In addition, it is possible to process in the extravagant stage of the "thin" to "fine" as described above.
例如，被加工物W 段之加工獲得所要求之表面的情形時 之表面之微裂痕微小，表面粗糙度相對於要求值無較大差 別之情形時僅進行「細」加工），使連設之兩個以上研磨 手段所具備之毛材或彈性體中所含有之上述研磨粒之粒度 於任-研磨手段中皆大致相同，藉此可縮短加卫時間。 201210743 又於由被加工物之圓形剖面之同一面内所配置之第1 研磨，段與第2研磨手段構成的研磨手段中，帛i研磨手 多又與第2研磨手段之軸芯係以於被加工物之半徑方向上一 致之方式而配置’帛i研磨手段之軸芯與第2研磨手段之 軸^構成既^度Θ之方式配置成於被加卫物之剖面中 心交叉’藉此可縮短加工時間。 、又’將上述第1研磨手段與第2研。磨手段分別沿圓柱 狀被加卫物之軸芯連設而配置複數個，藉此可對應於被加 工物之種類或目的而縮短上述加工時間。 又，精由使用上述研磨裝置，可獲得自表層起ι〇〇 β m之微裂痕得以去除、且表面粗糖度々為3 ρ以下之圓 柱狀構件。作為上述圓柱狀構件，可較佳地使用錢或陶 究之類的硬脆材料。 k貝他万式】 /吏用圖式對本發明之第1實施形態之研磨裝置之構成 内谷及作動的詳細情況進行說明。苐1實施形態之研磨裝 置係具備2個以上（3個）研磨粗趟度不同之研磨手段的圓 柱狀構件用之研磨裝置。 圖1係表不研磨裝置之前視圖’該研磨裝置 止於圖中右端之研磨開始前位置之研磨單元1;以及二 以一點鏈線表示之被加I物w之圖中左右之夾鉗手段5;、 該夾財段5具備：握持部6A，其配置於被加卫物w之左 側’且女裝於藉由夾鉗 之夾鉗勒12A之前端， 之乳缸驅動而滑動之基準側 之則鳊，以及握持部6B，其配置於被加工物 201210743 W之右側’且安裝於從動側之夾钳轴12B之前端。圖1係 表不將握持冑6A、6B >別配置於後退之位£，且未夹持被 物W之開放狀態。±述研磨單元上係纟分別連結於旋 轉手(研磨手段用）2a t 3個研磨手段2、及用以於研磨 開：前檢測被加工物~之加工面（外周面）P之高度位置 的冋度位置檢測手段3所構成。再者，藉由將該研磨手段2 相對被加工物W進行移送之移送手段（未圖示），於進行 研磨：將研磨單元自圖1中之左側向右側移送，故上述研 自右側起依序作為粗研磨用研磨手段、中研磨用 研磨手"k、精研磨用研磨手段而連設。即，研磨手段所具 備,毛材中所含有之研磨粒之粒度自右側起依序為由「粗」 到細」。又，上述高度位置檢測手段3係設置於上述粗 研磨用之研磨手段2之右側。 上述3個研磨手段2中之粗研磨用研磨手段2係研磨 能力較大，並以削除存在於表層部之大部分微裂痕為目的 而叹置者，中研磨用研磨手段2係以去除藉由帶鋸或線鋸 切斷時所產生之表面之凹凸、以及使因上述粗研磨而粗糙 之表面微細化為目的而設置者，精研磨用研磨手段2係以 表面粗糙度之最終調整為目的而設置者。再者，若於上述 中研磨之階段已完成表面之凹凸去除及表面粗糙度之微細 化調整，則亦可連設2個研磨手段2而不使用精研磨用研 磨手段2。 為了於被加工物W之加工前，藉由高度位置檢測手段 3设定研磨手段2開始進行研磨加工之高度位置，而使用母 201210743 工件。 件之2設定上述高度位置，首先以夹鉗手段5夾持母工 將母工:°於藉由失钳手段5夾持母卫件時，較佳為例如 行：件載置於具…狀之槽之基台（未圖示）上來進 太#由將母工件設置於該槽上’可使該母工件之圖 基台=向之中心始終為大致相同位置1而更佳為該 :啁敕丰用以對上述圖中上下方向之設置位置進行微調整 上^ 未圖示）。將母卫件載置於該基台上，並使 6A及Γ手段5之夾鉗軸以及12B分別前進來使握持部 實施"B夾持母工件之兩端部。其後，卸除該基台。於本 中’具有”狀之槽之基台之設置及卸除係藉由 〇於圖中上下移動而進行。（參照圖4) 夹钳手段5係藉由旋轉手與r 疋得千奴（被加工物用）（未圖示） ㈣轉’即以夹龃軸12A及12B之車由芯為中心而旋轉，因 此必需以使自母卫杜夕β 7 ,For example, when the W segment of the workpiece is processed to obtain the desired surface, the micro cracks on the surface are small, and when the surface roughness is not greatly different from the required value, only the "fine" processing is performed, so that the connection is made. The particle size of the above-mentioned abrasive grains contained in the hair material or the elastic body provided in the two or more polishing means is substantially the same in any of the grinding means, whereby the curing time can be shortened. 201210743 Further, in the polishing means including the first polishing step and the second polishing means disposed on the same surface of the circular cross section of the workpiece, the 帛i polishing hand and the axis of the second polishing means are In the radial direction of the workpiece, the axis of the 帛i polishing means and the axis of the second polishing means are arranged so as to be intersected at the center of the section of the object to be reinforced. Can reduce processing time. Further, the first polishing means and the second research were carried out. The plurality of grinding means are arranged along the axis of the cylindrical shaped object to be arranged, whereby the processing time can be shortened in accordance with the type or purpose of the workpiece to be processed. Further, by using the above-mentioned polishing apparatus, it is possible to obtain a cylindrical member in which microcracks of ι〇〇β m are removed from the surface layer and the surface roughness 々 is 3 ρ or less. As the above cylindrical member, a hard and brittle material such as money or ceramics can be preferably used. K-metawan type] The details of the inner valley and the operation of the polishing apparatus according to the first embodiment of the present invention will be described with reference to the drawings. The polishing apparatus according to the first embodiment is a polishing apparatus for a cylindrical member having two or more (three) polishing means having different polishing roughness. Figure 1 is a front view of the non-polishing device. The grinding device 1 is stopped at the position before the start of the grinding at the right end of the drawing; and the clamping means 5 of the left and right sides of the figure shown by the dotted line. ; The clip section 5 is provided with: a grip portion 6A disposed on the left side of the reinforced object w and a base side that is worn by the nipple of the tongs 12A by the gripper Then, the grip portion 6B is disposed on the right side of the workpiece 201210743 W and attached to the front end of the clamp shaft 12B on the driven side. Fig. 1 shows that the grips A 6A, 6B > are not disposed in the retreat position, and the open state of the object W is not clamped. ± The polishing unit is connected to the rotating hand (for polishing means) 2a t 3 polishing means 2, and the height position of the processing surface (outer peripheral surface) P for detecting the workpiece to be polished before opening The twist position detecting means 3 is constituted. Further, by the transfer means (not shown) for transferring the polishing means 2 to the workpiece W, polishing is performed: the polishing unit is transferred from the left side to the right side in Fig. 1, so that the research proceeds from the right side. The order is connected as a polishing means for rough grinding, a polishing hand for medium polishing, and a polishing means for polishing. That is, the polishing means is provided, and the particle size of the abrasive grains contained in the wool material is "thick" to fine in order from the right side. Further, the height position detecting means 3 is provided on the right side of the polishing means 2 for rough grinding. Among the above-mentioned three polishing means 2, the polishing means 2 for rough polishing has a large polishing ability, and is sighed for the purpose of removing most of the microcracks present in the surface layer portion, and the polishing means 2 for polishing is used for removal. In order to reduce the surface unevenness generated by the band saw or the wire saw, and to refine the surface roughened by the rough grinding, the polishing means 2 for polishing is mainly used for the final adjustment of the surface roughness. Setter. Further, if the unevenness of the surface and the fine adjustment of the surface roughness are completed at the stage of the above-mentioned polishing, two polishing means 2 may be connected instead of the polishing means 2 for polishing. In order to process the workpiece W, the height position detecting means 3 sets the height position of the polishing means 2 to start the polishing process, and the mother 201210743 workpiece is used. The second position is set to 2, and the mother worker is first clamped by the clamp means 5: when the female guard is clamped by the tongs means 5, it is preferably, for example, a row: the member is placed in a shape of The base of the groove (not shown) is fed up to the sun. The parent piece is placed on the groove. The base of the mother workpiece can be made to be substantially the same position 1 to the center of the groove. More preferably:敕 用以 is used to fine-tune the setting position in the up and down direction in the above figure (not shown). The female guard member is placed on the base, and the clamping shafts and 12B of the 6A and the jaw means 5 are respectively advanced to cause the grip portion to "hold" both ends of the female workpiece. Thereafter, the base is removed. The setting and removal of the abutment of the groove having the 'having shape' in this embodiment is performed by moving up and down in the figure. (Refer to FIG. 4) The clamp means 5 is obtained by rotating the hand and r. (When the workpiece is used) (not shown) (4) Turning, that is, the car with the clamp shafts 12A and 12B is rotated about the core, so it is necessary to make the self-supporting Du Fu β 7 .
^ 觀察之夾钳轴12A及12B :别端的㈣部6Α“Β之軸芯與母工件之軸芯一致之方 工2仃定中心調整…面藉由上述調整手段進行該調整 :面夹持母工件。使用以上述方式設置於加工位置之母工 由上述高度位置檢測手段3測定該母卫件之外周面 置後，將該母工件自夾甜…上卸除。於本實 %形態中，以夾鉗手段5水 又5夾持母工件後，藉由研磨單元1 ::備之高度位置檢測手段3測定母工件之外周面高度位 置I，其後使該母工件旋轉（例如刚度），並測定旋轉 之狀〜、下之向度位置Η2。計算Η4Η2之差，在ηαη2 12 201210743 並非大致相同之情形時，使上述基台上升後使失鉗軸丨2a 及12B分別後退以解除對母工件之爽持。根據上述運算社 果而調整（升高、或降低）述基台之高度位置（用於： 母工件藉由夹鉗手& 5 |夾持之上下方向停止位置）後， 再次利用夹钳手段5线母工件，並測^被线之母工件 之^及Η”若仏與Η:成為大致相同，則母工件之定中心 步驟完成。（參照圖5 ) 母工件之定中心步驟完成後，研磨單元丨向圖丨中之 右方向移動。然後，使上述基台上升，使上述灸钳軸Μ 及12B分別後退以解除對母工件之灸持，並且將母工件載 置於基口之V子狀之槽上。其後，將母工件與被加工物^ 進行交換，與母工件之情形同樣地執行定“㈣。於上 述定中二步驟完成後，使該研磨單元向圖i中之左側移動。 再者，藉由上述母工件之宗中、、半 干义疋中〜步驟而將母工件之外周面 南度位置Η儲存於控制手段中，藉由上述被加工物W之定 :心步驟而將被加工物w之外周面高度位置h儲存於控制 手段中。 根據預先輸入至控制手段之加工條件（研磨手段2之 :轉速度、被加工物W之旋轉速度、研磨單元丄之移送速 對於被加工物|之加工面p之）切入量、以及上 述外周面咼度位置H、h)谁耔遥曾* )進仃運异處理，使研磨單元1於 上下方向，即研.磨單& & Λ τ u • r研鹿早70與加工面P之距離方向上移動。 根據上述加工條件，使磨 上述控制手段13而以規定之:二“、被加工物w藉由 規疋之紋轉逮度進行旋轉。其後，同 s 13 201210743 樣地使研磨單元1藉由上述控制手 利亍奴1 3而以規定之移動速 度向圖1中之右側移動。藉由該移動，使被加工物W之被 加工面P與正在旋轉之研磨手段2之前端部接觸來進行研 磨加工。如上所述，研磨手段2 思于杈2係自圖1之右向左依序按 由「粗」Μ「細」之順序排列，故藉由該移動而進行「粗 研磨」…研磨」—「精研磨」。於研磨單元移動至規 定之位置（最右端）後，上述基台上升，錢，夾鉗手段 12Α及12Β後退，解除對該被加工物w之爽持，取出該被 加工物W，藉此完成研磨加工。 在對複數個被加工物W進行加工之情形時，於上述基 台上重新設置被加工物W之後’同樣地經過被加工物之夾 持步驟、被加工物之定中心步驟來進行研磨加工。即，藉 由最初測定母X件之高度位置’可於其後進行複數個被二 工物W之研磨加工。（參照圖6、圖7 ) 於本實施形態中，將研磨單元1向圖中橫方向移送， 但亦可移送被加X物w’且亦可料研料元丨與被加工 物w兩者。 於本實施形態中，將加工條件手動輸入至控制手段 :旦亦根據手動輸入之加工條件與自動輸入（儲存）之 周面南度位置’而利用控制手段對未輸人之加卫條件進 行運算後實施研磨加工。例如’可藉由輸人研磨手段之前 端:目對於被加工物之加工面p之切入量（以下，僅記：「切 入量」）及研磨手段2之旋轉速度，㈣用控制手段⑴十 算被加工物W之移動速度，亦可根據其他加工條件或高度 201210743 置而利用控制手段13計算切入量。而且，可根據該等運 算結果而進行研磨加工。 所輸入之加工條件並不限於本實施形態之項目。例 如’亦可輸入研磨手段2之種類、被加工物之狀態，且亦 可根據該等而將控制手段13之運算加以組合。 圖2 ( A )及（b )表示作為上述研磨手段2之研磨刷 之—例，該例係將混合有研磨粒之由尼龍等合成樹脂所構 成之毛材10a捆束而製成研磨具1〇，並將該研磨具1〇裝卸 自如地安裝於使該研磨具1〇之基部連結於旋轉手段（研磨 具用）2a以進行水平旋轉之研磨具安裝板11上，研磨具10 之下鳊針對被加工物w之加工面p而接觸旋轉並進行石 磨，於研磨具10磨耗後，可將該研磨具1〇自研磨具安身 板11上卸除並更換成新的研磨具1㈧再者，作為研磨手老 2之研磨刷並不限於圖2所示者，亦可為將由混合有研磨来 毛材10a所構成之研磨具1〇直接安裝於研磨具安裝板1 上並固定，於該研磨具1〇磨耗後，與研磨具安裝板u _ 併進行更換者，亦可不使用研磨具1〇，而是將含有研磨相 ^由尼龍等合成樹脂所構成之毛#心以環狀植設於研磨 手段2之底部（參照圖3(A))。又，例如，於陶竟等之 研磨加工、或者於加工時研磨手段2接觸到呈大致9〇。角度 :柱狀體之角部之情形等因研磨手段2與被加工物 觸而產生碎片（碎们已成為問題之情㈣，亦可將含有 =粒之由合成樹脂所構成之彈性體⑽以環狀配置於研 磨手段之底部（參照圖3(b))。該情形之彈性體⑽可^ Observed clamp shafts 12A and 12B: (4) at the other end 6" "The axis of the Β 一致 与 与 母 母 母 仃 仃 仃 仃 仃 调整 调整 调整 调整 调整 调整 调整 调整 调整 调整 调整 调整 调整 调整 调整 调整 调整 : : : : : The workpiece is placed on the outer peripheral surface of the female guard by the height position detecting means 3, and then the female workpiece is removed from the clip. In the present embodiment, After the female workpiece is clamped by the clamp means 5, the female workpiece is measured by the grinding unit 1 and the height position detecting means 3, and the height position I of the outer peripheral surface of the female workpiece is measured, and then the female workpiece is rotated (for example, the rigidity). And measuring the rotation shape ~, the lower direction position Η2. Calculate the difference between Η4Η2, when ηαη2 12 201210743 is not substantially the same, the above-mentioned base is raised, then the clamp-off axes 2a and 12B are respectively retracted to release the mother The workpiece is held up. According to the above calculation results, the height position of the base is adjusted (raised or lowered) (for: the female workpiece is clamped by the clamp hand & 5 | gripping the upper and lower stop positions) Using the clamp method again, the 5-wire female workpiece, ^ ^ And [eta] is measured mother line of the workpiece "and if Fo Η: substantially the same, the centering of the workpiece mother steps. (Refer to Figure 5) After the centering step of the master workpiece is completed, the grinding unit 丨 moves to the right in the figure. Then, the base is raised, the moxibustion forceps shafts 12 and 12B are respectively retracted to release the moxibustion of the female workpiece, and the female workpiece is placed on the V-shaped groove of the base. Thereafter, the mother workpiece and the workpiece are exchanged, and "(4) is executed in the same manner as in the case of the mother workpiece. After the completion of the above two steps, the polishing unit is moved to the left in Fig. i. The outer circumferential surface of the female workpiece is stored in the control means by the middle and the half of the mother workpiece, and is processed by the predetermined step of the workpiece W: the heart step The circumferential height position h of the object w is stored in the control means. According to the processing conditions previously input to the control means (the rotational speed, the rotational speed of the workpiece W, and the transfer speed of the polishing unit), the workpiece is processed. The cutting amount of the machined surface p, and the position of the outer peripheral surface of the above-mentioned outer peripheral surface H, h) who has been arrogant *), the grinding unit 1 is in the up and down direction, that is, grinding. Grinding && Λ τ u • r Yanlu early 70 moves in the distance direction from the machined surface P. According to the above processing conditions, the above-mentioned control means 13 is ground and specified: "", the workpiece w is caught by the ruled pattern The rotation is performed. Thereafter, the polishing unit 1 is moved to the right side in Fig. 1 at a predetermined moving speed by the above-described control hand slave 1 3 as in s 13 201210743. By this movement, the machined surface P of the workpiece W is brought into contact with the end portion of the polishing means 2 that is being rotated, and the grinding process is performed. As described above, the polishing means 2 is based on the order of "thickness" and "thin" from the right to the left of Fig. 1, so that "grinding" is performed by the movement. Fine grinding." After the polishing unit has moved to the predetermined position (the rightmost end), the base is raised, and the gripping means 12 and 12 are retracted, the holding of the workpiece w is released, and the workpiece W is taken out. Grinding processing. In the case where a plurality of workpieces W are processed, the workpiece W is newly placed on the base, and the polishing process is performed by the step of holding the workpiece and the centering step of the workpiece. Namely, a plurality of workpieces W can be polished by the first measurement of the height position of the mother X. (Refer to Fig. 6 and Fig. 7) In the present embodiment, the polishing unit 1 is transferred in the horizontal direction in the drawing, but the X material added w' may be transferred, and both the material and the workpiece w may be transferred. . In the present embodiment, the machining condition is manually input to the control means: the control condition is also used to calculate the unassisted reinforcement condition according to the manual input processing condition and the automatic input (storage) circumferential surface south position ' After that, the grinding process is performed. For example, 'the front end of the grinding means can be used: the amount of cut into the machined surface p of the workpiece (hereinafter, only "cut amount") and the rotational speed of the grinding means 2, (4) by means of control means (1) The moving speed of the workpiece W can also be calculated by the control means 13 based on other processing conditions or heights 201210743. Moreover, the grinding process can be performed based on the results of the calculations. The processing conditions to be input are not limited to the items of the embodiment. For example, the type of the polishing means 2 and the state of the workpiece can be input, and the calculation of the control means 13 can be combined based on these. 2(A) and (b) show an example of a polishing brush as the polishing means 2, which is obtained by bundling a hair material 10a made of a synthetic resin such as nylon mixed with abrasive grains to form a polishing tool 1 Then, the polishing tool 1 is detachably attached to the polishing tool mounting plate 11 that connects the base of the polishing tool 1 to the rotating means (for the polishing tool) 2a to perform horizontal rotation, and the polishing tool 10 is lowered. After the grinding tool 10 is worn, the grinding tool 10 can be removed from the grinding tool body 11 and replaced with a new grinding tool 1 (8). The polishing brush as the polishing hand 2 is not limited to the one shown in FIG. 2, and the polishing tool 1 including the ground material 10a mixed with the polishing material may be directly attached to the polishing tool mounting plate 1 and fixed thereto. After the grinding tool has been worn, it can be replaced with the polishing tool mounting plate u _, or the polishing machine can be used without ringing. At the bottom of the polishing means 2 (see Fig. 3 (A)). Further, for example, the grinding process is performed by Yu Tao or the like, or the polishing means 2 is brought into contact at substantially 9 inches during processing. Angle: in the case of the corner portion of the columnar body or the like due to the contact between the polishing means 2 and the workpiece (the broken pieces have become a problem (4), and the elastic body (10) composed of the synthetic resin containing the ? The ring is disposed at the bottom of the polishing means (see Fig. 3(b)). In this case, the elastic body (10) can be
S 15 201210743 為例如硬度較為柔軟之樹脂之塊體、或内部具有許多氣 之以聚氨酯或氨酯為首之樹脂之塊體、或者使纖維狀之 性體相互纏繞而成者。於硬度較為柔軟之樹脂之塊體中， 樹脂自身係作為緩衝材而發揮作用。於具有氣泡之樹脂之 正體中β #之氣泡係作為緩衝材而發揮作用。於含有 磨粒並相互纏繞而成之彈性體中，由於該彈性體相互纏 繞，因此於該等之集合體之内部包含空氣，該空氣層係作 為緩衝材而發揮作用。在任—情形時，為了使該彈性體10b 於接觸到被加工物時保持適度之彈力，皆要適當選擇合成 樹脂之種類及研磨粒之含有率等。（參照圖3。圖3 (A) 及圖3(B)皆為上圖表示正面，下圖表示底面。） 再者，上述毛材或彈性體中所混合之研磨粒之粒度較 理心的疋選自F180〜# 2000 (研磨粒之粒度之定義係基於 JIS規格R600 1 : 1 998 )之範圍。 評價試驗 以下，對如下之評價試驗之結果進行描述，即，將被 加工物W設為圓柱狀之單晶石夕塊⑷75麵χ5〇〇咖），使 用本發明之研磨裝置，對上述被加工物貿之表層部進行加 工來去除存在於其表層部之微裂痕及其表面之凹巴並使表 面粗糙度微細化後，評價研磨效果，於藉由線鋸對該矽塊 進行切片加工而形成矽晶圓時，可降低由該矽晶圓之裂 痕、碎片等所導致之不良品之發生率。 於研磨加工前之上述被加工物w之表層部中，存在深 度為80〜〜m之微裂痕’且其表面粗糙度（Ry)為 9 16 201210743 〜11 em(Ry之定義係基於JIS規格Β〇6〇ι:ΐ994)，於 藉由線錯對該發塊進行切斷（切片加工）而形心晶圓時'， 由裂痕、碎片等所導致之不良品之發生率為卜6%。 對使用第！實施形態中記載之研磨裝置對作為上述被 加工物（W)之石夕塊進行研磨加工來去除微裂痕及凹凸，且 使表面粗糙度D、化之後’可降低於^㈣對該梦塊進 行切片加工而形成矽晶圓時由裂痕、碎片等所導致之不良 品之發生率的結果進行描述。 如表1戶斤示設定本評價試驗之加工條#，將其輸入至 控制手段U後，對3條單晶錢進行加卫。將其結果示於 表2。如此’藉由使用第i實施形態之研磨裝置進行加工， 可大幅縮小存在於單晶矽塊表層部之微裂痕之深度及外周 面之凹凸，其結果如表2所示，微裂痕之最大深度為Ο.?〜 0-9 " m，表面粗糙度係平面部Ry為〇 7〜丨〇 (平均：^ 為〇·”，從而實現了微裂痕及凹凸之去除以及表面粗糖度y 之微小化。而且’可使於將3個上述矽塊—併藉由線鋸進 行切片加工而形成矽晶圓時由裂痕、碎片等所導致之不良 品之發生率降低2%。微裂痕之最大深度為3 〇以爪以下: 較理想的是2.3 p以下。當上述最大深度為3〇心以 上時，上述不良品之發生率會增大。又，若上述最大深度 為2.3 以下，則對在切片加工成數十以功之厚度而^ 成矽晶圓時由裂痕、碎片等所導致之不良品之發生率造成 的影響較少。本評價試驗中，上述最大深度為〇9以其 大幅低於對上述不良品之發生率造成影響 、 心·J β τη 〇S 15 201210743 is, for example, a block of a resin having a relatively soft hardness, a block of a resin having a plurality of gases such as polyurethane or urethane, or a fiber-like body intertwined with each other. In the block of the resin having a relatively soft hardness, the resin itself functions as a cushioning material. The bubble of β# in the body of the bubble-containing resin functions as a cushioning material. In the elastomer containing the abrasive grains and intertwined with each other, since the elastic bodies are entangled with each other, air is contained inside the aggregates, and the air layer functions as a cushioning material. In the case of the case, in order to maintain an appropriate elastic force when the elastic body 10b is in contact with the workpiece, the type of the synthetic resin, the content of the abrasive grains, and the like are appropriately selected. (Refer to Fig. 3. Fig. 3 (A) and Fig. 3 (B) are both the upper side and the lower side. The lower side shows the bottom surface.) Furthermore, the grain size of the abrasive grains mixed in the above-mentioned wool or elastomer is more rational.疋 is selected from the range of F180~# 2000 (the definition of the particle size of the abrasive particles is based on JIS specification R600 1 : 1 998 ). Evaluation Test Hereinafter, the result of the evaluation test will be described, that is, the workpiece W is a cylindrical single crystal block (4) 75 χ 〇〇 〇〇 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The surface layer of the trade is processed to remove the micro-cracks on the surface layer and the surface of the surface, and the surface roughness is refined. The grinding effect is evaluated and the chip is processed by wire sawing. When the wafer is waferd, the incidence of defective products caused by cracks, chips, and the like of the wafer can be reduced. In the surface layer portion of the workpiece w before the polishing process, there is a micro crack in the depth of 80 to 〜m and the surface roughness (Ry) is 9 16 201210743 ～11 em (the definition of Ry is based on the JIS specification Β 〇6〇ι:ΐ994), when the wafer is cut (sliced) by a line error and the wafer is shaped, the incidence of defective products caused by cracks, fragments, etc. is 6%. For the use of the first! In the polishing apparatus according to the embodiment, the stone block as the workpiece (W) is polished to remove microcracks and irregularities, and after the surface roughness D is reduced, the film can be lowered to (4). The results of the incidence of defective products caused by cracks, chips, and the like when the wafer is formed by slicing are described. As shown in Table 1, the processing strip # of this evaluation test is set, and after inputting it to the control means U, three single crystal money are added. The results are shown in Table 2. By using the polishing apparatus of the first embodiment, the depth of the microcracks present in the surface layer portion of the single crystal block and the unevenness of the outer peripheral surface can be greatly reduced. As a result, the maximum depth of the microcracks is shown in Table 2. Ο.?~ 0-9 " m, the surface roughness Ry is 〇7~丨〇 (average: ^ is 〇·), thereby achieving the removal of micro-cracks and irregularities and the small surface roughness y Moreover, it is possible to reduce the incidence of defective products caused by cracks, fragments, etc. by 2% of the above-mentioned slabs and to form a ruthenium wafer by a wire saw, and the incidence of defective products is reduced by 2%. It is 3 〇 below the claw: It is preferably 2.3 p or less. When the maximum depth is 3 〇 or more, the incidence of the above-mentioned defective product increases. Further, if the maximum depth is 2.3 or less, the pair is sliced. It is processed into a thickness of several tens of centimeters, and the effect of defective products caused by cracks, fragments, etc. is less affected when the wafer is formed into a wafer. In the evaluation test, the maximum depth is 〇9, which is substantially lower than Affect the incidence of the above-mentioned defective products Heart · J β τη billion
S 17 201210743 [表i] 項目 條件 研磨手段（研磨刷）之研磨粒之粒度 粗研磨用：#240 中研磨用：#500 精研磨用：#800 研磨手段（研磨刷）之旋轉速度（r.p.m) 1,700 被加工物之旋轉速度（r.p.m) 100 研磨單元之移送速度（mm/sec) 3 切入量（mm) 粗研磨用：1 中研磨用：1.0 精研磨用：1.0 [表2] 項目 結果 加工前 加工後 微裂痕之最大深度（/zm) 80 〜100 0.7 〜0_9 表面粗縫度Ry ( #m) 9〜11 0.7 〜1.0 不良品之發生率（％) 5〜6 3〜4 其次，對第2實施形態之研磨裝置進行說明。第2實 施形態之研磨裝置成為在如下之情形時所使用之裝置構 成，即無需如由「粗」到「細」之多階段加工，可藉由1 個階段之加工獲得所要求之表面。再者，此處僅對與第1 實施形態不同之點進行說明。 例如，於被加工物W之表面之研磨處理前的微裂痕微 小，且研磨處理前之表面粗糙度相對於要求值無較大差別 之情形時，研磨手段10 (研磨刷）可僅利用上述「中研磨 用研磨手段」或者「精研磨用研磨手段」進行加工。於此 情形時，可僅設置1個具備含有與研磨目的相符之粒度之 18 201210743 研磨粒的毛材或彈性體之研磨手段1 〇來進行加工β 又，使第1實施形態中之3個研磨手段2所具備之毛 #或彈性體中所含有之粒度大致相同，藉此可縮短加工時 間。 其次，一面參照圖8及圖9，一面對第3實施形態之研 磨裝置進行說明。第3實施形態之研磨裝置成為以縮短加 工時間為目的而配置有研磨手段2之裝置構成。再者，此 處僅對與第1實施形態不同之點進行說明。 於第3實施形態之研磨裝置中，於被加工物w之同— 剖面（圓形）之面内，配置有第1研磨手段21a與第2研磨 手段22a。第1研磨手段21a與第2研磨手段22a之軸芯係 以於被加工物W之半徑方向上一致之方式而配置，為使第 1研磨手段21a與第2研磨手段22a不相互干擾，將第 磨手段2 1 a之軸芯與第2研磨手段22a之軸芯以構成規定之 角度0之方式配置成於被加工物W之剖面中心處交又（來 照圖8)。該角度0只要使第i研磨手段2丨a與第2研磨手 段22a不會相互干擾，則可任意設定，亦可將角度0設定為 180。，以將第丨研磨手段2la之軸芯與第2研磨手段22& 之軸芯配置成完全一致並對向。 藉由形成此種構成，被加工物w —面於圓周方向上旋 轉一面受到研磨加工，故被加工物之加工面於第丨研磨手 段2U與第2研磨手段22a之2個部位同時受到研磨，因此 可縮短加工時間。 又’於第3實施形態之研磨裝置中，亦與帛【實施形 £ 19 201210743 癌之研磨裝置同樣地’如圖9 (圖9之右侧圖係自正面觀察 被加工物W之圖’左側圖係自左側面觀察被加工物w之圖） 所示’可將第1研磨手段21a與第2研磨手段22a於被加工 物W之長度方向上配置2個或3個（圖9表示配置3個之 狀態）。 於該情形時’沿被加工物W之長度方向自左側起依序 配置有第1行之第1研磨手段21a與第2研磨手段22a、第 2行之第1研磨手段2 lb與第2研磨手段22b、以及第3行 之第1研磨手段21c與第2研磨手段22c。 此時’使研磨手段21a與22a、研磨手段21b與22b、 研磨手段21c與22c所具備之毛材或彈性體中所含有之研磨 粒之粒度分別大致相同，即，具有大致相同之研磨力。 又，與第2實施形態同樣地’於可藉由1個具有研磨 力之研磨手段進行加工時’可使所有研磨手段所具備之毛 材或彈性體中所含有之研磨粒之粒度大致相同。 又’已對上述第3實施形態之研磨裝置中，於被加工 物W之圓周方向上設置第1研磨手段2la與第2研磨手段 22a该2個研磨手段之構成進行了說明，但並不限定於此， 在各研磨手段不會相互干擾之限度内，亦可根據設置空間 或作為目標之加工時間等而配置任意個數之研磨手段。 如上述般’於本實施形態及評價試驗中列舉研削矽塊 之情形為例進行了說明，但本發明並不限定於矽塊，例如 對於陶兗等所有硬脆材料亦可較佳地使用。 再者’於本說明書中’所謂研磨粒之「粒度大致相同」， 20 201210743 ;:’ϋ曰除「粒度相同」之研磨粒外，亦包含「可獲得 同專研磨效果之粒度」之研磨粒。 【圖式簡單說明】 ® 1係表不本發明之研磨裝置之整體之說明圖。 ®係表示本發明之研磨手段之一例之說明圖。圖2 (A )係自正面觀察之部分切開剖面圖，目2 ( Β )係仰視 圖。 圖3係表不本發明之研磨手段之另一例之說明圖。圖3 (A )係將毛材植設於底部之示意圖，圖3 ( β)係將彈性 體設置於底部之示意圖。 圖4係用以說明本發明之第1實施形態之流程圖。 圖5係用以說明本發明之第丨實施形態之流程圖。 圖6係用以說明本發明之第丨實施形態之流程圖。 圖7係用以說明本發明之第i實施形態之流程圖。 圖8係表示本發明之第3實施形態之說明圖。 圖9係表示本發明之第3實施形態之說明圖。 【主要元件符號說明】 1 研磨單元 2 研磨手段 2a 旋轉手段（研磨具用） 3 高度位置檢測手段 5 失鉗手段 6A 握持部（基準位置側） .握持部（從動側） 21 201210743 10 研磨具 10a 毛材 10b 彈性體 11 研磨具安裝板 12A 夾钳軸（基準位置側） 12B 夾鉗軸（從動側） 13 控制手段 14A 旋轉手段（被加工物用） (基準位置側） 14B 旋轉手段（被加工物用） (從動側） W 被加工物 P 力σ工面 22S 17 201210743 [Table i] Item condition Grinding means (abrasive brush) Particle size coarse grinding: #240 Medium grinding: #500 Fine grinding: #800 Grinding means (grinding brush) rotation speed (rpm) 1,700 Rotation speed (rpm) of the workpiece 100 Transfer rate of the grinding unit (mm/sec) 3 Cutting amount (mm) For coarse grinding: 1 For grinding: 1.0 For fine grinding: 1.0 [Table 2] Before the result of the project Maximum depth of microcrack after processing (/zm) 80 〜100 0.7 〜0_9 Surface roughness Ry ( #m) 9~11 0.7 〜1.0 The incidence of defective products (%) 5~6 3~4 Second, the first 2 Description of the polishing apparatus of the embodiment. The polishing apparatus of the second embodiment is constructed by using a device in a case where it is not necessary to perform multi-stage processing from "thick" to "fine", and the desired surface can be obtained by one-stage processing. Here, only differences from the first embodiment will be described. For example, when the microcracks before the polishing treatment on the surface of the workpiece W are minute and the surface roughness before the polishing treatment is not greatly different from the required value, the polishing means 10 (abrasive brush) can use only the above-mentioned " It is processed by a polishing method for polishing or a polishing method for polishing. In this case, only one polishing material 1 having a material of 18 201210743 abrasive grains having a particle size corresponding to the purpose of polishing may be provided, and the processing may be performed, and the polishing may be performed in the first embodiment. The size of the hair # or the elastomer contained in the means 2 is substantially the same, whereby the processing time can be shortened. Next, a polishing apparatus according to a third embodiment will be described with reference to Figs. 8 and 9 . The polishing apparatus of the third embodiment has a configuration in which the polishing means 2 is disposed for the purpose of shortening the processing time. Here, only differences from the first embodiment will be described. In the polishing apparatus of the third embodiment, the first polishing means 21a and the second polishing means 22a are disposed in the same cross section (circular shape) as the workpiece w. The axis of the first polishing means 21a and the second polishing means 22a are arranged so as to coincide with each other in the radial direction of the workpiece W, so that the first polishing means 21a and the second polishing means 22a do not interfere with each other. The shaft core of the grinding means 2 1 a and the shaft core of the second grinding means 22 a are disposed so as to form a predetermined angle 0 so as to be placed at the center of the section of the workpiece W (see Fig. 8). The angle 0 can be arbitrarily set as long as the i-th polishing means 2a and the second polishing means 22a do not interfere with each other, and the angle 0 can be set to 180. The axis of the second polishing means 21a and the axis of the second polishing means 22& are arranged to be completely aligned with each other. By forming such a configuration, the workpiece w is polished in the circumferential direction, and the processed surface of the workpiece is simultaneously polished at both the second polishing means 2U and the second polishing means 22a. Therefore, the processing time can be shortened. Further, in the polishing apparatus according to the third embodiment, the same as the polishing apparatus of the third embodiment of the invention, as shown in Fig. 9 (the right side view of Fig. 9 is the view of the workpiece W from the front side) In the drawing, the first polishing means 21a and the second polishing means 22a are arranged in the longitudinal direction of the workpiece W in two or three (FIG. 9 shows the arrangement 3). State). In this case, the first polishing means 21a and the second polishing means 22a in the first row and the first polishing means 2 lb and the second polishing in the second row are arranged in this order from the left along the longitudinal direction of the workpiece W. The means 22b and the first polishing means 21c and the second polishing means 22c in the third row. At this time, the particle sizes of the polishing grains contained in the polishing means 21a and 22a, the polishing means 21b and 22b, and the polishing means 21c and 22c are substantially the same, i.e., have substantially the same polishing force. Further, in the same manner as in the second embodiment, when the processing can be performed by one polishing means having a polishing force, the particle size of the abrasive grains contained in the base material or the elastic body of all the polishing means can be made substantially the same. In the polishing apparatus according to the third embodiment, the first polishing means 21a and the second polishing means 22a are provided in the circumferential direction of the workpiece W, and the two polishing means are described. However, the present invention is not limited thereto. Here, in the limit that the respective polishing means do not interfere with each other, an arbitrary number of polishing means may be disposed depending on the installation space, the target processing time, and the like. As described above, in the present embodiment and the evaluation test, the case of grinding the block is described as an example. However, the present invention is not limited to the block, and for example, all hard and brittle materials such as ceramics can be preferably used. In addition, 'in this specification', the so-called abrasive grains have the same particle size, 20 201210743 ;: 'In addition to the "particles of the same particle size", the abrasive grains of "the same grain size can be obtained" . BRIEF DESCRIPTION OF THE DRAWINGS ® 1 is an explanatory view of the entire polishing apparatus of the present invention. ® is an explanatory view showing an example of the polishing means of the present invention. Fig. 2 (A) is a partially cutaway cross-sectional view from the front, and the head 2 ( Β ) is a bottom view. Fig. 3 is an explanatory view showing another example of the polishing means of the present invention. Fig. 3 (A) is a schematic view showing the arrangement of the hair material at the bottom, and Fig. 3 (β) is a schematic view showing the elastic body at the bottom. Fig. 4 is a flow chart for explaining the first embodiment of the present invention. Figure 5 is a flow chart for explaining the third embodiment of the present invention. Figure 6 is a flow chart for explaining the third embodiment of the present invention. Fig. 7 is a flow chart for explaining the i-th embodiment of the present invention. Fig. 8 is an explanatory view showing a third embodiment of the present invention. Fig. 9 is an explanatory view showing a third embodiment of the present invention. [Description of main component symbols] 1 Polishing unit 2 Polishing means 2a Rotating means (for polishing tools) 3 Height position detecting means 5 Loss-clamping means 6A Grip portion (reference position side). Grip portion (driven side) 21 201210743 10 Grinding tool 10a Wool material 10b Elastomer 11 Grinding tool mounting plate 12A Clamping shaft (reference position side) 12B Clamping shaft (driven side) 13 Control means 14A Rotating means (for workpiece) (reference position side) 14B Rotation Means (for workpieces) (driven side) W workpiece P force σ working surface 22