JP5842920B2 - Grinding / polishing processing system and grinding / polishing method for hard and brittle materials - Google Patents

Description

The present invention relates to grinding and polishing using a hard and brittle material for manufacturing a wafer by slicing as a workpiece. In particular, the present invention relates to a grinding / polishing system and a grinding / polishing method for a hard and brittle material that removes strain and microcracks in the surface layer of a workpiece.

  Impurities generated by melting and heating are attached or distorted on the surface layer portion of the ingot of the material for manufacturing the wafer, and the surface layer portion of the block formed by cutting the ingot Distortion and microcracks have occurred. For this reason, in the next process, when the final product wafer is sliced, product defects may occur due to cracks or chips. Therefore, the grinding process for removing the distortion of the surface layer of the block to adjust the outer dimensions of the wafer to the standard, the removal of microcracks in the surface part of the ingot or block, and the miniaturization of the surface roughness are performed. Therefore, it is necessary to perform polishing to reduce cracks and chips when the ingot or block is sliced.

A wafer used for a semiconductor substrate or the like is obtained through the following steps A, B, and C.
Step A: A step of forming an ingot by molding a material as a raw material by a pulling method (CZ method), a Bernoulli method, a hydrothermal growth method, or the like.
Step B: A step of forming the block by cutting the ingot to an appropriate size with a band saw or a wire saw, if necessary, and adjusting the shape as necessary.
Step C: Step of slicing the block to obtain a wafer.

Taking a silicon wafer as an example, a method for manufacturing a prismatic silicon block will be described. For the production of silicon blocks,
The molten raw material is poured into a mold, and the surface layer portion (six sides) of the silicon ingot formed into a cubic shape is cut and removed by a band saw or a wire saw, and then the cross-section is cut into a quadrangle and intersected at right angles with each other, A silicon block whose crystal structure is a polycrystal with its four corners forming a minute plane (chamfered portion),
After cutting the top part and tail part of the silicon ingot manufactured in a cylindrical shape by the pulling method (CZ method) or Bernoulli method, the four side parts parallel to the column axis and perpendicular to each other on the body surface layer part, A square columnar silicon block in which a crystal structure in which a minute circular arc surface which is a part of the cylindrical surface layer portion is left at a position (ridge) where the four side surface portions intersect and a four-corner portion is formed is a single crystal; There are types.
Both of the surface layers of the silicon block are distorted and microcracked during the cutting process. For this reason, a defective product due to cracking or chipping occurs when slicing is performed to form a wafer in the next process. Therefore, it is necessary to remove the microcracks and refine the surface roughness by polishing before slicing.

  The prismatic silicon block has a size of a square having a cross section of 125 mm × 125 mm (name: 5 inches), a square of 156 mm × 156 mm (name: 6 inches), and a square of 210 mm × 210 mm (name: 8 inches). There are types, and the length in the column axis direction is arbitrarily set between 150 and 600 mm.

  Moreover, there exists a column shape as another shape of a block. As an example of manufacturing a wafer from a cylindrical block, a method of manufacturing a sapphire wafer from a sapphire ingot (ingot) will be described. The sapphire ingot is obtained by forming sapphire or the like into a columnar shape by a pulling method (CZ method) or Bernoulli method. A sapphire wafer is obtained by slicing the ingot. The surface layer portion of the sapphire ingot has adhesion, unevenness, and distortion of impurities such as molten residue generated during heating and melting. When these are removed and the outer diameter is ground to a desired dimension, microcracks are generated in the surface layer. Therefore, in the same way as the silicon block described above, in order to reduce the incidence of defective products due to wafer cracks / chips in the next process, polishing is performed before slicing to remove microcracks and reduce surface roughness. It is necessary to make it finer.

  The size of the sapphire ingot made of the single crystal is generally 2 to 6 inches (51 to 154 mm) in diameter and 50 to 300 mm in length.

  In addition, as an example of manufacturing a wafer from an irregularly shaped block, a method of manufacturing a quartz wafer from a quartz Lambert will be described. Quartz lumbar is obtained by growing a crystal by a hydrothermal growth method or the like to obtain an artificial quartz, and then grinding the surface (lumbard processing) in order to clarify the axial direction of the artificial quartz. Thereafter, a step of thinly slicing the artificial quartz subjected to lumbar processing at a predetermined angle in accordance with frequency characteristics, a step of pasting sliced artificial quartz crystals (for example, 50 to 70 pieces) with wax or the like to form a lump, A crystal wafer can be obtained through a step for adjusting the outer shape of the lump as a wafer and a step for removing the wax and the like. As shown in FIG. 20, the crystal lumbard may not be horizontal at both end faces.

  In the surface layer portion of the quartz lumbar, there are microcracks generated when grinding from the artificial quartz. As in the case of slicing silicon blocks and sapphire ingots, in order to reduce the incidence of defective products due to wafer cracking and chipping during slicing, polishing is performed before slicing and microcracking is performed. It is necessary to remove and refine the surface roughness.

  A description will be given of the prior art in which the occurrence rate of defective products due to cracks and chips generated by slicing for removing the surface layer distortion and microcracks is reduced.

Japanese Patent No. 3649393 discloses surface processing of a polycrystalline silicon block formed by cutting a cubic polycrystalline silicon ingot into a prismatic shape. Before slicing the silicon block into a silicon wafer, the side surface of the silicon block is polished with a resin brush or the like mechanically mixed with abrasive grains so that the surface roughness Ry is 8 μm or less. It is described that the unevenness is flattened.
However, there is no description of surface layer distortion or microcracks generated when the silicon ingot is cut, and removal thereof.

  In Japanese Patent No. 4133935, a silicon ingot cut into a predetermined length using a band saw is ground into a cylindrical shape using a cylindrical grinder to remove the undulation, and then the body surface layer portion is removed. These four sides are cut and removed using a band saw to form a quadrangular columnar silicon block having four side portions, and the surface roughness Ry before flattening the four side portions of the silicon block is X μm (in the example, Ry10 When the polishing amount is flattened to 5 × X μm or more (in the example, the polishing amount is 100 μm), the surface roughness is refined (in the example, to Ry 3 to 4 μm). It is described that microcracks can be removed, and the crack defect reduction ratio when the silicon block is sliced into a silicon wafer has been improved by 6 times or more. .

  In JP-A-2005-255463, in order to obtain a wafer having a desired outer diameter by slicing a single crystal sapphire ingot, the outer periphery of the single crystal sapphire ingot is cylindrically ground using a cylindrical grinding device. Processing to prepare the outer diameter dimensions is described. The grinding process causes processing distortion and microcracks in the outer periphery of the single crystal sapphire ingot. Therefore, before slicing the single crystal sapphire ingot, the outer periphery of the single crystal sapphire ingot is chemically polished. It is described that the processing strain and microcracks are removed.

As described above, there is a method using a band saw or a wire saw as a method for cutting a hard and brittle material for a wafer, and a wire saw that cuts with a plurality of wires is preferably used.
The conventional wire saw cutting method is generally a free abrasive grain method in which the wire is contacted and rotated while spraying abrasive grains on the cutting portion by the jet pressure of pressurized water. A new wire saw with a fixed length has been developed, and the cutting time can be greatly reduced.

  In order to compare and confirm the cutting ability of the new wire saw with the conventional wire saw, the inventors have made 5 polycrystalline silicon ingots as shown in FIG. A 6-inch square (size on one side: 156.0 mm) and a block having a length of 300 mm were cut. The time required for cutting was 8 Hr or more in the conventional wire saw, but the new wire saw can be completed in about 3 Hr, and it was confirmed that the cutting time can be greatly shortened.

  The reason why the cutting time can be shortened is estimated as follows. That is, in the conventional loose abrasive type wire saw, when the wire is rotated at a high speed during the cutting process, the abrasive grains are scattered and the cutting efficiency is lowered. In the new wire saw, since the abrasive grains are fixed to the wire, the abrasive grains are not scattered with the rotation of the wire and can be cut efficiently.

  However, when the polycrystalline silicon ingot is cut with the new wire saw, the four blocks of A located at the four corners shown in FIG. 15 and the three blocks of B × 4 = 12 located between A are cut. The center of the side part facing the outside of the previous silicon ingot (two faces in the block A and one face in the block B) is cut in a state of swelling outward as shown in FIG. In the single crystal silicon ingot, each is cut independently as shown in FIG. 17, so that the center of the four side surfaces of the single crystal silicon block is cut in a state where it bulges outward as shown in FIG. A new problem arises that the cross-sectional dimensions do not fall within the specified dimensional tolerances. Therefore, there is a need for a grinding device that removes strain on the side of the silicon block and fits within a specified dimensional tolerance.

  In addition, the silicon block cut and formed from the silicon ingot has a surface roughness of about Ry 10 to 20 μm (JISB0601: 1994) on the side surface portion and corner surface portion in the cutting process, and a depth from the surface layer surface. However, microcracks of 80 to 100 μm are generated. When such a block is sliced into a thickness of about several tens of μm to about 100 μm to form a wafer, the wafer may be cracked or chipped due to the block surface roughness and microcracks. Therefore, there is a demand for a polishing apparatus that removes microcracks and makes the surface roughness several μm or less before slicing.

There is also a need for a grinding / polishing system and a grinding / polishing method that efficiently perform the steps of the grinding device and the polishing device.

Disclosure of the invention

  The present invention solves the above-mentioned requirements, and grinds the side surface and the corner of a block (for example, a silicon block) formed by cutting an ingot into a quadrangular prism shape to process a cross-sectional dimension to a desired dimension, Alternatively, the distortion and impurities generated by melting and heating the outer periphery of an ingot (for example, a single crystal sapphire ingot) formed into a cylindrical shape by cutting the top portion and tail portion of an ingot having a substantially circular cross-sectional shape are removed. A grinding device for grinding the cross-sectional dimension to a desired size, or a grinding device for grinding side surfaces and corners of an irregularly shaped block (for example, quartz lambard), and a surface layer portion of the workpiece after finishing the grinding Grinding / polishing processing system for hard and brittle materials, a grinding / polishing processing system, and a grinding / polishing processing method, in which a microcrack removal and a polishing apparatus for miniaturizing the surface roughness are arranged in parallel And to provide grinding and polishing system of the hard brittle material pillar shape with improved working efficiency by a control means for controlling the location and the polishing apparatus, and a grinding and polishing process.

  In order to achieve the above object, a grinding / polishing system for hard and brittle materials according to a first aspect of the present invention is for manufacturing a wafer by slicing as shown in FIGS. 1, 2 and 5, for example. A grinding / polishing system for grinding and polishing a columnar workpiece made of a hard and brittle material: a surface layer portion of a workpiece (W) is ground with a constant cutting amount, and the workpiece (W) A grinding apparatus (1) for removing impurities in a surface layer portion and distortion in a column axis direction and making a cross-sectional dimension a desired dimension, and having a measuring means (18) for measuring a dimension of a workpiece (W) Polishing the surface layer of the workpiece (W) with a constant pressing force to remove microcracks in the surface layer of the workpiece (W) and miniaturizing the surface roughness Polishing apparatus (2) for measuring the dimension of the workpiece (W) A polishing apparatus (2) having a measuring means (18) for measuring; a dimension of the workpiece (W) measured by the measuring means (18) is calculated, and the grinding apparatus (1) is operated according to the result of the calculation. Control means for outputting an operation signal and an operation signal of the polishing apparatus (2).

  According to the first aspect, a constant cutting amount (scientific term: belonging to “fixed cutting”) is set for the workpiece, the distortion of the workpiece is cut to adjust the shape, and the cross-sectional dimension is set. Polishing to grind the surface layer of the workpiece by setting a grinding device that grinds the workpiece to the desired tolerance and a cutting amount (a scientific term: belonging to “constant pressure cutting”) with a constant pressing force on the workpiece Equipment, the cross-sectional dimensions and cross-sectional shape can be processed within the desired tolerances, and microcracks in the surface layer part can be accurately removed, and the surface roughness can be refined. A grinding / polishing system is provided. In addition, the dimensions of the workpiece are measured by the measuring means provided in the grinding apparatus or polishing apparatus, the measurement result is calculated by the control means, and the operation signal of the grinding apparatus or polishing apparatus is output. Accurate grinding / polishing can be performed.

  In the grinding / polishing system according to the second aspect of the present invention, as shown in FIG. 21, for example, the surface layer portion of the workpiece (W) is ground with a constant cutting amount, and the surface layer portion of the workpiece is processed. Grinding means (14) for removing the impurities and the distortion in the column axis direction and making the cross-sectional dimension a desired dimension; polishing the surface layer portion of the workpiece after the grinding with a constant pressing force, (20) polishing means for removing microcracks in the surface layer portion of the product and miniaturizing the surface roughness; (20); calculating the dimension of the workpiece measured by the measuring means, and depending on the result of the calculation, the grinding And at least one grinding / polishing apparatus comprising: an operation signal of the means and a control means for outputting an operation signal of the polishing means.

  In the grinding / polishing system according to the third aspect of the present invention, in the grinding / polishing system according to the second aspect, for example, as shown in FIGS. 1 and 2, the surface layer portion of the workpiece (W) is provided. A grinding apparatus (1) for grinding with a constant depth of cut to remove impurities in the surface layer portion of the workpiece (W) and distortion in the direction of the column axis and to obtain a desired sectional dimension. A grinding device (1) having a measuring means (18) for measuring a dimension of (W) and a surface layer portion of the workpiece (W) after the grinding are polished with a constant pressing force, and the workpiece ( A polishing apparatus (2) for removing microcracks in the surface layer portion of W) and miniaturizing the surface roughness, and having a measuring means (18) for measuring the dimensions of the workpiece (2) (2) And / or).

  According to the second and third aspects, a fixed cutting amount (scientific term: belonging to “fixed cutting”) is set for the workpiece, the distortion of the workpiece is scraped off and the shape is adjusted, Polishing the surface layer of the workpiece by setting the grinding means to grind the cross-sectional dimensions within the desired tolerance and the cutting amount (a scientific term: belonging to “constant pressure cutting”) with a certain pressing force on the workpiece A polishing means capable of processing the cross-sectional dimensions and cross-sectional shape within desired tolerances, accurately removing microcracks in the surface layer portion, and miniaturizing the surface roughness. A system for grinding and polishing brittle materials is provided. Also, the measurement means provided in the grinding / polishing apparatus measures the dimensions of the workpiece, the measurement result is calculated by the control means, and the operation signal of the grinding means or polishing means is output, so that it is based on the measured dimensions. Accurate grinding and polishing can be performed.

  According to the third aspect, the grinding / polishing device and the grinding device or the polishing device can be combined in accordance with the shape of the workpiece and the processing purpose.

  In the grinding / polishing system according to the fourth aspect of the present invention, in the grinding / polishing system according to the first or third aspect, for example, as shown in FIGS. The apparatus (1) has a base (11) on which the work piece (W) can be moved in the vertical direction with its column axis placed horizontally, and a work piece ( W) is moved forward and backward in a direction perpendicular to the column axis of the workpiece (W) to position the workpiece (W) at the center of the base (11) and the shaft core is processed. It has a clamp shaft (13) that holds both ends of the workpiece (W) as the direction of the column axis of the workpiece (W), and the clamp shaft (13) centers the workpiece (W) on its axis. A rotatable gripping means (12) and an abrasive layer (15a) in which abrasive grains are bonded to each other are fixed to a disk-like or annular base plate (15b). A grindstone in which the ground body (15) is fixed to a rotating disk (16), the grindstone is detachably connected to a rotation drive source, and the abrasive grain layer (15a) is attached to the workpiece (W ) And the grinding means (14) that is pressed and rotated, and either one of the gripping means (12) and the grinding means (14) is at least the workpiece (W) in the column axis direction of the workpiece (W). And a moving means (19) for moving a distance corresponding to the length of.

  In the grinding / polishing system according to the fifth aspect of the present invention, in the grinding / polishing system according to the first or third aspect, for example, as shown in FIG. 1, FIG. 6, FIG. 7, FIG. The grinding device (1) has a base (11) on which the work piece (W) is placed horizontally with its column axis being movable, and a work placed on the base (11). A pressing tool (34) for positioning the workpiece (W) at the center of the base (11) by moving the workpiece (W) back and forth in a direction perpendicular to the column axis of the workpiece (W) and the shaft core. It has a clamp shaft (13) that holds both ends of the workpiece (W) as the direction of the column axis of the workpiece (W), and the clamp shaft (13) centers the workpiece (W) on its axis. And a grinding body (15) in which a gripping means (12) that is rotatable and an abrasive layer (15a) in which abrasive grains are bonded to each other are formed in a disc shape or an annular shape. Is a grindstone fixed to a rotating disk (16), the grindstone being detachably connected to a rotation drive source, and rotating the abrasive grain layer (15a) against the workpiece (W). The grinding means (14) and any one of the gripping means (12) and the grinding means (14) correspond to at least the length of the workpiece (W) in the column axis direction of the workpiece (W). Moving means (19) for moving the distance.

  According to the fourth and fifth aspects, the workpiece is gripped by the gripping means, moved by the moving means, ground by the grinding means, and the workpiece is rotated by the clamp shaft of the gripping means. Since grinding can be performed, impurities in the surface layer portion of the workpiece and distortion in the column axis direction can be accurately removed. Further, since the workpiece gripped by the gripping means by the moving means or the grindstone as the rotating grinding means moves a distance corresponding to the length of the workpiece, it can be ground over the entire length of the workpiece. .

  In the grinding / polishing system according to the sixth aspect of the present invention, in the grinding / polishing system according to the first or third aspect, for example, as shown in FIG. 2, FIG. 6, FIG. 7 and FIG. The apparatus (2) has a base (11) on which the work piece (W) can be moved in the vertical direction with its column axis placed horizontally, and a work piece ( W) is moved forward and backward in a direction perpendicular to the column axis of the workpiece (W) to position the workpiece (W) at the center of the base (11) and the shaft core is processed. A clamp shaft (13) that grips both ends of the workpiece (W) as the direction of the column axis of the workpiece (W), and the clamp shaft (13) centers the workpiece (W) on its axis. A rotating gripping means (12) and a rotating disc (22), and a bristles (21) containing abrasive grains on a disc-shaped surface are bundled A polishing means (20), which is an arranged polishing brush, wherein the polishing brush is detachably connected to a rotation drive source, and the brush bristle material (21) is pressed against the workpiece (W) to rotate. And moving means (19) for moving one of the gripping means (12) and the polishing means (20) at least a distance corresponding to the length of the work piece (W) in the column axis direction of the work piece (W). And).

  According to the sixth aspect, the workpiece is gripped by the gripping means, moved by the moving means, polished by the polishing means, and the workpiece is rotated by the clamp shaft of the gripping means and polished. Therefore, it is possible to accurately perform a polishing process that removes microcracks from the workpiece and refines the surface roughness. In addition, since the workpiece gripped by the gripping means by the moving means or the polishing brush as the rotating polishing means moves a distance corresponding to the length of the workpiece, the workpiece can be polished over the entire length of the workpiece. it can.

  In a grinding / polishing system according to a seventh aspect of the present invention, in the grinding / polishing system according to the second invention, for example, as shown in FIG. (W) A base (11) that can be moved in the vertical direction with its column axis placed horizontally, and a direction in which the work piece placed on the base is orthogonal to the column axis of the work piece And a clamp (13) for gripping both ends of the work piece with the pressing tool (34) for positioning the work piece at the center of the base and the axis as the column axis of the work piece. ), And the clamp shaft can rotate the work piece around its axis, and the gripping means (12), the grinding means (14), or the polishing means (20) One of the distances in the column axis direction of the workpiece is at least a distance corresponding to the length of the workpiece. Moving means (19) for moving the abrasive; the grinding means (14) joins the abrasive grains together to form a disc-like abrasive layer (15 a) on a disc-like or annular base plate (15 b). A grindstone in which a ground body (15) that has been secured is secured to a rotating disk (16), the grindstone being detachably connected to a rotational drive source, and the abrasive layer (15a) is attached to the workpiece ( W) is pressed and rotated, and the polishing means (20) is arranged by bundling a brush bristle material containing abrasive grains on a disk-shaped surface, and presses the brush bristle against the workpiece. And a polishing disc that is detachably held, and the brush polishing is rotated.

  In the grinding / polishing system according to the eighth aspect of the present invention, in the grinding / polishing system according to the second invention, for example, as shown in FIG. W) is a base (11) that can be moved in the vertical direction with its column axis placed horizontally, and the workpiece placed on the base in a direction perpendicular to the column axis of the workpiece. A pressing tool (34) for moving the workpiece forward and backward to position the workpiece at the center of the base and a clamp shaft (13) for gripping both ends of the workpiece with the shaft core as the column axis direction of the workpiece. A gripping means (12) in which the clamp shaft can rotate the workpiece around its axis, and either the gripping means (12), the grinding means (14) or the polishing means (20) One of the distances in the column axis direction of the workpiece is at least a distance corresponding to the length of the workpiece. A moving means (19) for moving the grinding body (14), and the grinding means (14) forms a grinding body (15) in which the abrasive grain layer (15a) in which the abrasive grains are bonded to each other is formed in a disc shape or an annular shape. The grindstone is fixed to the rotary drive source so as to be detachable, and the grindstone layer (15a) is pressed against the workpiece (W) to rotate, and is a polishing means. (20) has a rotating disc in which a brush bristle material containing abrasive grains is bundled and arranged on a disk-shaped surface, and the brush bristle member is pressed against the workpiece to rotate. The brush polishing is rotated, and the brush polishing is rotated.

  According to the seventh and eighth aspects, the workpiece is gripped by the gripping means, moved by the moving means, ground by the grinding means, the ground workpiece is polished by the polishing means, and Since the workpiece can be rotated and polished by the clamp shaft of the gripping means, impurities on the surface layer of the workpiece and distortion in the column axis direction can be accurately removed, and microcracks in the workpiece can be removed. It is possible to accurately perform a polishing process for reducing the surface roughness. In addition, the workpiece gripped by the gripping means by the moving means, or the grindstone as the rotating grinding means and the polishing brush as the rotating polishing means move a distance corresponding to the length of the workpiece. It can be polished over the entire length of the workpiece.

  In the grinding / polishing system according to the ninth aspect of the present invention, in the grinding / polishing system according to any of the fourth, fifth, seventh, and eighth aspects, the grain size of the abrasive grains of the grinding means is set as follows: F90 to F220 (JISR6001: 1998) for rough grinding, or # 240 to # 500 (JISR6001: 1998) for precision grinding.

  According to the ninth aspect, the particle size of the abrasive grains of the grinding means is F90 to F220 (JISR6001: 1998) for rough grinding, or # 240 to # 500 (JISR6001: 1998) for precision grinding. Rough grinding or precision grinding can be performed efficiently.

  In the grinding / polishing system according to the tenth aspect of the present invention, in the grinding / polishing system according to the sixth to eighth aspects, for example, as shown in FIG. ) Is characterized by having two or more types of abrasive grains.

  In the grinding / polishing system according to the eleventh aspect of the present invention, in the grinding / polishing system according to the tenth aspect, the grain size of the abrasive grains is # 240 to # 500 (JIS R6001: 1998) for rough polishing, or # 800 to # 1200 (JIS R6001: 1998) for precision polishing.

  In the grinding / polishing system according to the twelfth aspect of the present invention, in the grinding / polishing system according to the tenth aspect, for example, as shown in FIG. 12, the polishing means contains coarse abrasive grains. The brush bristle material (36) is arranged near the rotation center of the rotating disk, and the brush bristle material (35) containing fine abrasive grains is arranged with the brush bristle material (36) containing coarse abrasive grains. It is characterized by being arranged around the perimeter.

  According to the tenth to twelfth aspects, since the abrasive grains contained in the brush bristle material of the polishing means have two or more types of grain sizes, rough polishing and precision polishing of the workpiece can be performed with one polishing apparatus. This can be done and the equipment cost can be reduced. In particular, a brush bristle material containing abrasive grains having a coarse particle size is arranged in a portion close to the rotation center of the rotating disk, and a brush bristle material containing abrasive grains having a fine grain size is provided. It is desirable to arrange around the arrangement. Furthermore, the grain size of the abrasive grains contained in the brush bristle material for rough polishing is set to # 240- # 500 in the fine powder category defined in JIS R6001: 1998, and the fine grain size contained in the brush bristle material for precision polishing is used. It is desirable to set the grain size to # 800 to # 1200 in the fine powder category. The high polishing ability of the polishing brush for rough polishing accurately removes microcracks existing on the surface layer of the workpiece, and the surface roughness of the surface layer roughened by rough polishing by the polishing brush for precision polishing is reduced. It is possible to prevent cracking or chipping that occurs when the wafer is refined and sliced into a wafer in a subsequent process.

  In the grinding / polishing system according to the thirteenth aspect of the present invention, in the grinding / polishing system according to any one of the first and third aspects, the grinding means of the grinding apparatus and the polishing means of the polishing apparatus are interchangeable. The grinding device can be replaced with a polishing device, or the polishing device can be replaced with a grinding device by exchanging the grinding device and the polishing device.

  According to the thirteenth aspect, the grinding means of the grinding apparatus and the polishing means of the polishing apparatus can be interchanged, and the grinding apparatus is replaced with the polishing apparatus by replacing the grinding means and the polishing means, or the polishing apparatus is the grinding apparatus. In other words, by making the specifications of the mounting portions of the grinding means and the polishing means common, the main body of the grinding apparatus and the polishing apparatus (portions excluding the grinding means and the polishing means) have the same specifications. Therefore, the manufacturing cost of the apparatus main body can be reduced.

  In the grinding / polishing system according to the fourteenth aspect of the present invention, in the grinding / polishing system according to the second aspect, the grinding means and the polishing means of the grinding / polishing apparatus are interchangeable. Features.

  According to the fourteenth aspect, the grinding means and the polishing means can be interchanged by making the use of the attachment portions of the grinding means and the polishing means in common. For example, in the case shown in FIG. 21, a polishing apparatus can be obtained by replacing the polishing means with a grinding means. Moreover, it can be set as a grinding device by replacing | exchanging a grinding means with a grinding | polishing means. Further, for example, as shown in FIG. 23, in the case of a grinding / polishing apparatus in which a pair of grinding means and two pairs of grinding means are connected, by replacing the grinding means at the center in the left-right direction of the figure with a grinding means, Polishing can be performed after two-stage grinding.

  In the grinding / polishing system according to the fifteenth aspect of the present invention, the workpiece before grinding / polishing is ground / polished in the grinding / polishing system according to the first aspect, for example, as shown in FIG. A carry-in device (3) for carrying into the processing system, a carry-out device (4) for carrying out the workpiece after grinding / polishing from the grinding / polishing system, a carry-in device (3), a grinding device (1), An operating arm (51) for moving the workpiece between the polishing device (2) and the unloading device (4) and a grip attached to the tip of the operating arm (51) to rotate the workpiece to a predetermined angle A transfer device (5) having a section (52).

In the grinding / polishing system according to the sixteenth aspect of the present invention, in the grinding / polishing system according to the second or third aspect, for example, as shown in FIG. A carry-in device (3) for carrying W) into the grinding / polishing system, and a carry-out device (4) for carrying out the workpiece that has been ground / polished from the grinding / polishing system;
Actuating arm (51) for moving the workpiece between the carry-in device (3), grinding / polishing device (6) or grinding device (1) or polishing device (2), carry-out device (4), and the operation A transfer device (5) attached to the tip of the arm (51) and having a gripping part (52) for rotating the workpiece to a predetermined angle.

  According to the fifteenth and sixteenth aspects, the workpiece is transferred by the transfer device to the carry-in device, the grinding / polishing device, the grinding device, the polishing device, and the carry-out device. The unpolished workpiece can be easily carried out to the carry-out device after the grinding and polishing processes are completed by the grinding device and the polishing device. In addition, since the workpiece can be rotated by the grip portion of the transfer device, the side surface processed by the grinding device or the polishing device can be changed.

  In the grinding / polishing system according to the seventeenth aspect of the present invention, in the grinding / polishing system according to the first or second aspect, the grinding means or the measuring means provided in the polishing apparatus comprises a workpiece. A pair of reference surfaces formed with a known reference interval dimension in the horizontal direction perpendicular to the column axis, and a pair of reference surfaces formed with a known reference interval dimension in the vertical direction perpendicular to the column axis. A reference block having a horizontal direction, a measuring tool for measuring the distance between the reference surface on both sides of the reference block and the grinding / polishing part on both sides of the workpiece, and a vertical direction as the measurement direction. And a measuring tool for measuring the height position of the grinding / polishing portion on the upper surface of the block and the upper surface of the workpiece.

  According to the seventeenth aspect, the measuring means measures the height position of the reference block, the measuring tool that measures the horizontal dimension of the reference block and the workpiece, and the upper surface of the reference block and the workpiece. The workpiece can be gripped by the gripping means with the column axis of the workpiece aligned with the axis of the clamp shaft.

  In the grinding / polishing system according to the eighteenth aspect of the present invention, in the grinding / polishing system according to the seventeenth aspect, the control means is a pair of reference blocks provided in the gripping means of the grinding apparatus and the polishing apparatus. A function for calculating the base point position where the cutting amount of each means of the grinding device and the polishing device is zero by bringing the tips of the grinding device and the polishing device into contact with the reference surface, and a measuring device of the grinding device and the polishing device. A function to measure the difference between the reference surface on both sides of the reference block and the machined part on both sides of the workpiece by the provided measuring tool, and to calculate the cross-sectional dimensions before and after machining of the machined part of the workpiece; The grinding device and the polishing device each have a function of performing arithmetic processing for centering and gripping the workpiece, initial setting items input before the start of processing, and the grinding device and the polishing device, respectively. And a measurement signal measurement device outputs the measurement means and processing, characterized by comprising a function of outputting an operation signal to the means of the grinding apparatus and polishing apparatus.

  In a grinding / polishing system according to a nineteenth aspect of the present invention, in the grinding / polishing system according to the second aspect, the control means is a pair of reference blocks provided in the gripping means of the grinding / polishing apparatus. A function of calculating a base point position where the cutting amount of the grinding means or the polishing means becomes zero by bringing each tip of the grinding means or the polishing means into contact with a reference surface; and a measuring means of the grinding / polishing apparatus The difference between the reference surface on both sides of the reference block and the processed part on both sides of the workpiece is measured by a measuring tool provided on the workpiece, and the cross-sectional dimensions of the processed part of the workpiece before and after processing are calculated. Functions, a function for the grinding / polishing apparatus to perform arithmetic processing for centering and gripping the workpiece, initial setting items input before the start of processing, and measurement output by the measuring tool of the measuring means Signal Calculation processing, characterized by comprising a function of outputting an operation signal to the grinding means and the polishing means.

  According to the eighteenth and nineteenth aspects, the control means is provided with each function for automating the grinding / polishing processing system, so that grinding and polishing of the processed portion of the workpiece can be accurately performed and labor saving can be achieved. Can be achieved.

  The grinding / polishing system according to the twentieth aspect of the present invention is the grinding / polishing system according to the eighteenth or nineteenth aspect, wherein the workpiece has a prismatic shape and is subjected to grinding / polishing. The tolerance of the cross-sectional dimension of the workpiece is ± 0.5 mm, and the tolerance of the cross-sectional shape at the corner where the two side surfaces of the workpiece intersect each other is ± 0.1 degrees.

  According to the twentieth aspect, for example, in a quadrangular columnar silicon block, the cross-sectional dimensions of the silicon block are 125 mm × 125 mm (name: 5 inches), 156 mm × 156 mm (name: 6 inches), 210 mm × 210 mm (name: 8 inches). The required tolerance is ± 0.5 mm, and the required tolerance of the cross-sectional shape of the corner where the two side surfaces of the silicon block cross each other is 90 ° ± 0.1 °. Therefore, grinding and polishing can be performed based on cross-sectional dimension tolerance and cross-sectional shape tolerance.

  The grinding / polishing system according to the twenty-first aspect of the present invention is the grinding / polishing system according to the eighteenth or nineteenth aspect, wherein the workpiece has a cylindrical shape and is subjected to grinding / polishing. The tolerance of the cross-sectional dimension of the workpiece is ± 0.5 mm.

  According to the twenty-first aspect, for example, in a cylindrical single crystal sapphire ingot, the cross-sectional dimension is 2 to 6 inches (51 to 154 mm), and the required tolerance is ± 0.5 mm. Can be ground and polished based on

  In the grinding / polishing method according to the twenty-second aspect of the present invention, the workpiece is ground by the grinding apparatus using the grinding / polishing system according to the first to third aspects, and then polished by the polishing apparatus. It is characterized by processing.

  According to the twenty-second aspect, a constant depth of cut is set for the work piece, the distortion of the work piece is removed to adjust the shape, and the grinding device for grinding the cross-sectional dimension within a desired tolerance; Grinding and polishing is performed using a polishing device that polishes the surface layer of the workpiece by setting a cutting amount with a constant pressing force on the workpiece, so that the cross-sectional dimensions and cross-sectional shape are processed within the desired tolerances. Thus, a method for grinding and polishing a hard and brittle material capable of accurately removing microcracks in the surface layer portion and miniaturizing the surface roughness is provided. In addition, the dimensions of the workpiece are measured by the measuring means provided in the grinding apparatus or polishing apparatus, the measurement result is calculated by the control means, and the operation signal of the grinding apparatus or polishing apparatus is output. Accurate grinding / polishing can be performed.

  According to the present invention, a grinding device that sets a fixed depth of cut for a work piece of a hard and brittle material, trims the distortion of the work piece to adjust the shape, and grinds a cross-sectional dimension within a desired tolerance ( A grinding device in the case of a grinding / polishing device) and a polishing device that polishes the surface layer portion of the work piece by setting a cutting amount with a constant pressing force on the work piece (a polishing means in the case of a grinding / polishing device) ), The cross-sectional dimensions and cross-sectional shape can be processed within the desired tolerances, and the microcracks in the surface layer can be accurately removed to reduce the surface roughness. it can. Thereby, in the next process, it is possible to reduce the occurrence rate of defective products due to cracks / chips generated when slicing the wafer.

This application is based on Japanese Patent Application No. 2011-201809 filed on September 15, 2011 in Japan, the contents of which form part of the present application.
The present invention will also be more fully understood from the following detailed description. However, the detailed description and specific examples are preferred embodiments of the present invention and are described for illustrative purposes only. This is because various changes and modifications will be apparent to those skilled in the art from this detailed description.
The applicant does not intend to contribute any of the described embodiments to the public, and the disclosed modifications and alternatives that may not be included in the scope of the claims are equivalent. It is part of the invention under discussion.
In this specification or in the claims, the use of nouns and similar directives should be interpreted to include both the singular and the plural unless specifically stated otherwise or clearly denied by context. The use of any examples or exemplary terms provided herein (eg, “etc.”) is merely intended to facilitate the description of the invention and is not specifically recited in the claims. As long as it does not limit the scope of the present invention.

FIG. 1 is a plan view of a grinding apparatus for processing a prismatic workpiece according to the present invention.
FIG. 2 is a plan view of a polishing apparatus for processing a prismatic workpiece according to the present invention.
FIG. 3 is a plan view of a grinding apparatus for processing a cylindrical workpiece according to the present invention.
FIG. 4 is a plan view of a polishing apparatus for processing a cylindrical workpiece according to the present invention.
[FIG. 5] A grinding device and a polishing device for processing prismatic and cylindrical workpieces according to the present invention, a transfer device for setting a workpiece on each of the devices, a workpiece carry-in device, and It is a top view which shows the Example of 1st Embodiment which has arrange | positioned the carrying-out apparatus.
FIG. 6 is a front view showing the arrangement of gripping means and moving means by placing a workpiece on a base located at the operation start position of the grinding apparatus and polishing apparatus of the present invention.
FIG. 7 is a side view showing a state in which a workpiece is placed on the base of the grinding apparatus and polishing apparatus of the present invention and the pressing tool of the workpiece is released.
FIG. 8 is a side view showing the arrangement of the measuring tool of the measuring means with the workpiece placed on the base of the grinding apparatus and polishing apparatus of the present invention.
FIG. 9 is a front view of a cup-type grindstone according to the grinding means of the present invention. 9A is a partial cross-sectional view seen from the front, and FIG. 9B is an AA arrow view (bottom view).
FIG. 10 is a front view of a cup-type grindstone according to the grinding means of the present invention. FIG. 10A is a partial cross-sectional view seen from the front, and FIG. 10B is an AA arrow view (bottom view).
FIG. 11 is a front view of a segment-type polishing brush provided with a brush bristle material with coarse abrasive grains and a fine brush bristle member on one rotating disk according to the polishing means of the present invention.
FIG. 12 is a bottom view of FIG.
FIG. 13 is a perspective view showing a roll-type grindstone of grinding means for grinding a cylindrical workpiece according to the present invention.
FIG. 14 is a perspective view showing a roll-type polishing brush of polishing means for polishing a cylindrical workpiece according to the present invention.
FIG. 15 is a perspective view when a polycrystalline silicon ingot is cut with a wire saw to form silicon blocks (A), (B), and (C).
FIG. 16 is a perspective view of polycrystalline silicon blocks (A), (B), and (C) formed in FIG.
[FIG. 17] It is explanatory drawing which looked at the state which cut | disconnects a single crystal silicon ingot with a wire saw from the plane.
FIG. 18 is a perspective view of a single crystal silicon block formed in FIG.
FIG. 19 is a perspective view showing a single crystal sapphire ingot formed into a columnar shape by cutting a top portion and a tail portion.
FIG. 20 is an explanatory diagram for explaining the shape of a quartz lumbard.
FIG. 21 is a plan view of a grinding / polishing apparatus for processing a prismatic workpiece according to the present invention.
FIG. 22 is a plan view of a grinding / polishing apparatus for processing a cylindrical workpiece according to the present invention.
FIG. 23 is a plan view of a modified example of a grinding / polishing apparatus for processing a prismatic workpiece according to the present invention.
[FIG. 24] A grinding device and a polishing device for processing prismatic and cylindrical workpieces according to the present invention, a transfer device for setting a workpiece in each of the devices, a workpiece carry-in device, and It is a top view which shows the Example of 2nd Embodiment which has arrange | positioned the carrying-out apparatus.

BEST MODE FOR CARRYING OUT THE INVENTION

  Embodiments of the present invention will be described below with reference to the drawings. In the drawings, the same or corresponding elements are denoted by the same reference numerals, and redundant description is omitted.

  A first embodiment of a grinding / polishing system will be described. The grinding / polishing system grinds the surface layer portion of the work piece (W) made of a hard and brittle material, removes impurities in the surface layer portion of the work piece (W) and distortion in the column axis direction and reduces the cross-sectional dimension. Grinding device (1) to make a desired dimension and the surface layer portion of the workpiece (W) after the grinding process are polished to remove microcracks in the surface layer portion of the workpiece (W) Processing based on polishing apparatus (2) for reducing surface roughness, initial setting items input before starting processing, measurement signal of grinding apparatus (1), and measurement signal of polishing apparatus (2) And a control means for outputting an operation signal of the grinding device (1) and an operation signal of the polishing device (2) based on the result of the arithmetic processing.

  Here, the hard and brittle material refers to a material such as glass, ceramics, quartz, quartz, etc. that has high hardness and is hard but is weak against impact and is brittle.

[Grinding equipment]
FIG. 1 shows a grinding apparatus (1) for grinding a prismatic workpiece (W) according to the present invention. The grinding apparatus (1) includes a gripping means (12) for gripping the workpiece (W), and a grinding means A (14) for grinding the side surface portion (F) and the corner portion (C) of the workpiece (W). ), A reference block (K) that forms a reference surface, a measuring means (18) that measures a cross-sectional dimension of the workpiece (W), and the gripping means (12) that grips the workpiece (W). A moving means (19) for moving and moving the workpiece (W) between the measuring means (18) and the grinding means A (14) is provided.
The moving means (19) measures the workpiece (W) by moving the gripping means (12) holding the workpiece (W) between the measuring means (18) and the grinding means A (14). Alternatively, the workpiece (W) is ground. However, the gripping means (12) that grips the work piece (W) is fixed, and the measurement means (18) and the grinding means A (14) are moved at the position of the work piece (W). W) may be measured and ground.

  The workpiece (W) placed on the grinding apparatus (1) is measured for cross-sectional dimensions by the measuring means (18) before starting the grinding process. The cross-sectional dimension of the workpiece (W) was added to the grinding allowance, the polishing allowance, and the cross-sectional dimension after grinding / polishing, which have been input to the control means in advance as initial setting items. If it is smaller than the size, the grinding process of the grinding device (1) is stopped by the arithmetic processing of the control means. The workpiece (W) can be returned to the remelting step after the gripping state of the gripping means (12) is released. The workpiece (W) melted in the remelting step is re-formed into a cylindrical shape when the raw material is, for example, single crystal silicon or sapphire, and into a cubic shape when polycrystalline silicon is used. Molded again.

  When the shape of the workpiece (W) is a prismatic shape, the grinding device (1) can place the workpiece (W) so that its column axis is horizontal and move up and down in the vertical direction. The workpiece (W) placed on the platform (11) is moved forward and backward in a direction perpendicular to the column axis of the workpiece (W) (the workpiece (W)). A pressing tool (34) for positioning W) at the center of the base (11) (see FIG. 7) and both ends of the workpiece (W) with the axis as the direction of the column axis of the workpiece (W) A clamp shaft (13) is provided for gripping. The clamp shaft (13) grips the workpiece (W). When the base (11) is lowered, the clamp shaft (13) grips the workpiece (W) around its axis. As shown in FIG. 6, the gripping means (12) enables the workpiece (W) to be “intermittently rotated” or “continuously rotated”.

The gripping means (12) grips the workpiece (W) so as to be capable of “intermittent rotation”. When the shape of the portion to be ground / polished of the workpiece (W) is a flat surface, 1. “Intermittent rotation” of the clamp shaft (13) of the gripping means (12) gripping the workpiece (W) for positioning on both sides in the Y direction shown in FIG. It means to make it.
The operation and processing sequence of “intermittent rotation” will be described by taking an example of grinding / polishing of a rectangular column-shaped polycrystalline silicon block whose processing surfaces are both flat. For example, the first set of opposing side surface portions (F) ( 16) is positioned on both sides in the Y direction shown in FIGS. 1 and 2, and then rotated by 90 degrees to process the second set of side portions (F) and finish processing of the four side portions (F). Then, the first set of corners (C) (see FIG. 16) facing each other by rotating 45 degrees is positioned on both sides in the Y direction shown in FIGS. The corner (C) is processed, and the grinding / polishing process is completed.

  The gripping means (12) grips the workpiece (W) so that it can be “continuously rotated” means that the section of the workpiece (W) to be ground and polished has an arc shape, for example, a single cylindrical shape. As shown in FIGS. 3 and 4, when the body portion (B) of the crystal sapphire ingot is ground and polished, or when the quadrangular portion (C) of the square columnar single crystal silicon block is ground and polished. In addition, the grinding means (20) or the polishing means (30) is arranged on one side, and the clamp shaft (13) that grips the workpiece (W) is "continuously rotated" at a rotational speed set separately. This refers to grinding and polishing.

  The clamp shaft (13) of the gripping means (12) provided in the grinding device (1) or the polishing device (2) grips both end faces of the work piece (W) and the work piece (W ) Is measured and stored in the control means, and the measurement result is an operation signal for controlling the movement distance of the moving means (19) to be described later after being processed. . The clamp shaft (13) of the gripping means (12) that grips the workpiece (W) by the operation of the moving means (19) by the operation signal causes the measuring means (18) and the grinding means (1), or It is moved between the measuring means (18) and the polishing means (2) to measure the cross-sectional dimension of the workpiece (W) and perform grinding or polishing. The measuring means (18) and the grinding means (1), or the measuring means (18) and the polishing means (2) may move between the clamp shafts (13).

  As shown in FIG. 9, the grinding means A (14) includes a grinding body (15) in which an abrasive layer A (15a) in which abrasive grains are bonded to each other is fixed to a disk-like or annular base plate (15b). Was a cup-type grindstone fixed to the rotating disk (16). The grinding means A (14) is detachably connected to a rotational drive source via a rotating shaft (17), and the abrasive grain layer A (15a) faces the processing portion of the workpiece (W). It is made to contact, press and rotate. Note that the base plate (15b) does not have to be a flat surface, and for example, the position where the abrasive layer A (15a) is fixed can be a convex shape. Moreover, as shown in FIG. 10, the grinding means A (14) may adhere the abrasive layer A (15a) to the rotating disk (16). At this time, the means for fixing the abrasive layer A (15a) to the rotating disk (16) may be either fixed with a bolt or the like, or molded integrally with the rotating disk (16).

  The grinding device (1) is preferably provided with a pair of grinding means A (14) (grinding stones) facing each other so that the abrasive layer A (15a) is in surface contact with both sides of the workpiece (W). The grinding means A (14) is detachably provided in the grinding device (1).

  The grinding device (1) includes a measuring means (18) for measuring a cross-sectional dimension of a reference block in which a pair of reference surfaces are formed in a horizontal direction and a vertical direction perpendicular to a column axis, and a cross-sectional dimension of a workpiece (W). Is provided. In the grinding apparatus (1), the distance between the gripping means (12) and the grinding means A (14) is at least equivalent to the length of the workpiece (W) in the column axis direction of the workpiece (W). The moving means (19) which moves is provided.

  The grinding apparatus (1), as the grinding means A (14), combines abrasive grains on a disk-shaped surface to integrally form an abrasive grain layer A (15a), and the abrasive grain layer A (15a) is applied to the covered layer. Since the grindstone is brought into surface contact with the processed portion of the workpiece (W) and pressed to rotate, it can be ground with a constant cutting depth.

FIG. 3 shows a grinding apparatus (1) for grinding a cylindrical workpiece (W) according to the present invention. The grinding device (1) includes a gripping means (12) for gripping the workpiece (W), a grinding means B (24) for grinding the body (B) of the workpiece (W), and a reference surface. The workpiece is moved by moving the reference block (K) to be formed, the measuring means (18) for measuring the cross-sectional dimension of the workpiece (W), and the gripping means (12) for gripping the workpiece (W). A moving means (19) for moving the object (W) between the measuring means (18) and the grinding means B (24) is provided.
The transfer means (19) fixes the gripping means (12) that grips the workpiece (W) in the same manner as described above, and connects the measuring means (18) and the grinding means B (24) to the workpiece (W). The workpiece (W) may be measured and ground by moving at the position.

  When the workpiece (W) is cylindrical, the gripping means (12) of the grinding device (1) grips the workpiece (W) so that it can be “continuously rotated” about its axis.

  Further, as shown in FIG. 13, the grinding means B (24) includes an abrasive layer B (25) in which abrasive grains are bonded to a cylindrical body surface, and a rotating cylinder (27) provided with a rotating shaft (27). A roll type grindstone fixed to the surface of No. 26) was used. In the grinding means B (24), the rotary shaft (27) at the axis of the rotary cylinder (26) is detachably connected to a rotational drive source, and the abrasive layer B (25) is attached to the grinding means B (25). The processed portion of the workpiece (W) is rotated in contact with the workpiece in parallel with the axis of the workpiece (W). A cup-type grindstone that is less expensive than a roll-type grindstone can also be used.

  Further, the grinding apparatus (1) has a pair of grinding means B (24) (grinding stone) in which the abrasive grain layer B (25) is parallel to and opposed to the axis of the workpiece (W). Is preferred. The grinding means B (24) is detachably provided in the grinding device (1).

  By making the grinding means A (14) and the grinding means B (24) of the grinding apparatus (1) a rigid grindstone, the distortion of the workpiece (W) is removed, the shape is adjusted, and the external dimensions are desired. The ability to grind to within tolerances will be excellent. Therefore, it is possible to accurately remove impurities and external distortion of the surface layer portion of the prismatic and cylindrical workpiece (W).

  Further, the grindstones of the grinding means A (14) and the grinding means B (24) of the grinding apparatus (1) are set to the grain sizes of the abrasive grains constituting the abrasive layer A (15a) and the abrasive grain layer B (25). Abrasive grains fixed to the brush bristle material A (21) and the brush bristle material B (31) of the grinding device A (20) and the grinding device B (30) of the grinding device (2). It is good also considering the particle size of two or more types.

  The abrasive grain size of the grinding means A (14) or grinding means B (24) comprising the grinding wheel of the grinding apparatus (1) is set to coarse grinding: F90 to F220 (JIS R6001: 1998) and precision grinding: # The grain size of the polishing means A (20) or the polishing means B (30) comprising the polishing brush of the polishing apparatus (2) is set to 240 to # 500 (JIS R6001: 1998). 500 (JIS R6001: 1998) and precision polishing: # 800 to # 1200 (JIS R6001: 1998).

  The particle size of the abrasive grains of the grinding means A (14) or the grinding means B (24) was set to two groups of coarse powder classification F90 to F220 and fine powder classification # 240 to # 500 defined in JIS R6001: 1998. The reason is as follows. If the cross-sectional dimension of the workpiece (W) cut in the previous process or the squareness of the corner (C) of the workpiece (W) is out of the tolerance, the sectional dimension or the sectional shape is the tolerance. In order to make it inside, it is made into the coarse grain division of F90-F220 so that cutting efficiency can be improved and grinding can be performed. In order to prevent the occurrence of chipping and to grind parts that are prone to cracking and chipping, called chipping (such as corners of a polycrystalline silicon block), fine powder classification of # 240 to # 500 It is good to select and use.

[Polishing equipment]
FIG. 2 shows a polishing apparatus (2) for polishing a prismatic workpiece (W) according to the present invention. The polishing apparatus (2) polishes the gripping means (12) for gripping the workpiece (W) that has finished the grinding process, and the side surface portion (F) and the corner portion (C) of the workpiece (W). Polishing means A (20) for processing to remove microcracks and miniaturizing the surface roughness, reference block (K) for forming a reference surface, and measuring means for measuring the cross-sectional dimension of the workpiece (W) ( 18) and moving means for moving the workpiece (W) between the measuring means (18) and the polishing means A (20) by moving the gripping means (12) for gripping the workpiece (W). (19).
The moving means (19) fixes the gripping means (12) that grips the workpiece (W) in the same manner as the moving means (19) of the grinding apparatus (1), and measures the measuring means (18) and the polishing means A. (20) may be moved at the position of the workpiece (W) to measure and grind the workpiece (W).

  The polishing apparatus (2) has a base (11) on which the workpiece (W) is placed so that its column axis is horizontal and can be moved up and down in the vertical direction, and the base (11). Pressing to position the workpiece (W) at the center of the base (11) by moving the placed workpiece (W) forward and backward in a direction perpendicular to the column axis of the workpiece (W) A clamp shaft (13) is provided for gripping both ends of the workpiece (W) with the tool (34) and the axis as the direction of the column axis of the workpiece (W). The clamp shaft (13) grips the workpiece (W). When the base (11) is lowered, the clamp shaft (13) grips the workpiece (W) around its axis. The gripping means (12) grips the workpiece (W) so that it can be “intermittently rotated” or “continuously rotated”.

The gripping means (12) grips the workpiece (W) so as to be capable of “intermittent rotation”. When the shape of the portion to be ground / polished of the workpiece (W) is a flat surface, 1. “Intermittent rotation” of the clamp shaft (13) of the gripping means (12) gripping the workpiece (W) for positioning on both sides in the Y direction shown in FIG. It means to make it.
The operation and processing sequence of “intermittent rotation” will be described by taking an example of grinding / polishing of a rectangular column-shaped polycrystalline silicon block whose processing surfaces are both flat. For example, the first set of opposing side surface portions (F) ( 16) is positioned on both sides in the Y direction shown in FIGS. 1 and 2, and then rotated by 90 degrees to process the second set of side portions (F) and finish processing of the four side portions (F). Then, the first set of corners (C) (see FIG. 16) facing each other by rotating 45 degrees is positioned on both sides in the Y direction shown in FIGS. The corner (C) is processed, and the grinding / polishing process is completed.

  The gripping means (12) grips the workpiece (W) so that it can be “continuously rotated” means that the section of the workpiece (W) to be ground and polished has an arc shape, for example, a single cylindrical shape. As shown in FIGS. 3 and 4, when the body portion (B) of the crystal sapphire ingot is ground and polished, or when the quadrangular portion (C) of the square columnar single crystal silicon block is ground and polished. In addition, the grinding means (20) or the polishing means (30) is arranged on one side, and the clamp shaft (13) that grips the workpiece (W) is "continuously rotated" at a rotational speed set separately. This refers to grinding and polishing.

  The clamp shaft (13) of the gripping means (12) provided in the grinding device (1) or the polishing device (2) grips both end faces of the work piece (W) and the work piece (W ) Is measured and stored in the control means, and the measurement result is an operation signal for controlling the movement distance of the moving means (19) to be described later after being processed. . The clamp shaft (13) of the gripping means (12) that grips the workpiece (W) by the operation of the moving means (19) by the operation signal causes the measuring means (18) and the grinding means (1), or It is moved between the measuring means (18) and the polishing means (2) to measure the cross-sectional dimension of the workpiece (W) and perform grinding or polishing. The measuring means (18) and the grinding means (1), or the measuring means (18) and the polishing means (2) may move between the clamp shafts (13).

  As shown in FIGS. 11 and 12, the polishing means A (20) includes a rotating disk (22) and a rotating shaft (23) connected to a rotation driving source for rotating the rotating disk (22). And it was set as the polishing brush which bundled and arranged the brush bristle material A (21) containing the abrasive grain on the disk-shaped surface. The polishing means A (20) is detachably connected to a rotational drive source, and presses the bristles of the brush bristle material A (21) in surface contact with the processed part of the workpiece (W). To be rotated.

  As the polishing brush employed in the polishing means A (14), the brush bristle material A (21) is consumed by bundling the brush bristle material A (21) mixed with abrasive grains so that it can be attached to and detached from the rotating disk (22). In this case, there is a segment-type polishing brush in which only the brush bristle material A (21) needs to be replaced. Alternatively, a cup-type polishing brush may be used in which the brush bristle material is fixedly attached to the rotating disk and is exchanged integrally with the rotating disk when the brush bristle material is consumed. In this embodiment, a segment type is used.

  The polishing apparatus (2) includes a pair of polishing means A (20) (polishing brush) opposed so that the bristle portion of the brush bristle material A (21) is in surface contact with both sides of the workpiece (W). It is preferable to have. The polishing means A (20) is detachably provided in the polishing apparatus (2).

  Further, the abrasive grain fixed to the brush bristle material A (21) of the grinding means A (20) of the grinding device (2) has two or more types of grain size, and the brush grain material A (35 having a coarse grain size). ) Is disposed on the inner ring portion close to the rotation center of the rotating disk (22), and the brush bristle material A (36) having a fine grain size of the abrasive grains is disposed on the outer ring portion far from the rotation center of the rotating disk (22). Also good.

  In the polishing means A (20) of the polishing apparatus (2), the grain size of the abrasive grains to be fixed is, for example, for rough polishing for the purpose of removing microcracks and for precision polishing for the purpose of reducing the surface roughness. In the conventional polishing apparatus, it was necessary to install two apparatuses for rough polishing and precision polishing separately. As a polishing brush for polishing the prismatic workpiece (W), it is possible to provide the polishing means A (20) having both functions of rough polishing and precision polishing with a single polishing brush. A single polishing apparatus (2) can perform rough polishing and precision polishing of the prismatic workpiece (W), thereby reducing equipment costs.

  The polishing apparatus (2) is a measuring means (18) for measuring the cross-sectional dimension of the reference block in which a pair of reference surfaces are formed in the horizontal direction and the vertical direction perpendicular to the column axis and the cross-sectional dimension of the workpiece (W). Is provided. The polishing apparatus (2) has a distance corresponding to at least the length of the workpiece (W) in the column axis direction of the workpiece (W) with respect to either the gripping means (12) or the polishing means A (20). The moving means (19) which moves is provided.

  The polishing apparatus (2) bundles and arranges the brush bristle material A (21) containing abrasive grains, and brings the bristle portion of the brush bristle material A (21) into surface contact with the processed part of the workpiece (W). Since it is pressed and rotated, it can be polished with a cutting amount with a constant pressing force.

FIG. 4 shows a polishing apparatus (2) for polishing a cylindrical workpiece (W) according to the present invention. The polishing apparatus (2) polishes the gripping means (12) for gripping the workpiece (W) that has been subjected to the grinding process, and the body portion (B) of the workpiece (W), thereby performing microcracking. Polishing means B (30) for removing and refining the surface roughness, reference block (K) for forming a reference surface, measuring means (18) for measuring the cross-sectional dimension of the work piece (W), and work piece Moving means (19) for moving the workpiece (W) between the measuring means (18) and the polishing means B (30) by moving the gripping means (12) for gripping the object (W); Prepare.
The transfer means (19) fixes the holding means (12) holding the work piece (W) in the same manner as described above, and the measuring means (18) and the polishing means B (30) are connected to the work piece (W). The workpiece (W) may be measured and ground by moving it at a position.

  When the workpiece (W) is cylindrical, the gripping means (12) of the polishing apparatus (2) grips the workpiece (W) so that it can be “continuously rotated” about its axis.

  In addition, the gripping means (12) of the polishing apparatus (2) can "continuously rotate" the workpiece (W) around its axis, similarly to the gripping means (12) of the grinding apparatus (1). Grip to.

  Further, as shown in FIG. 14, the polishing means B (30) has a brush bristle material B (31 containing abrasive grains on the surface of the cylindrical body of the rotary cylinder (32) provided with the rotation shaft (33). ) Was used. By using the roll-type polishing brush as the polishing means B (30), the polishing efficiency can be improved (the polishing time can be shortened). In the polishing means B (30), the rotary shaft (33) at the axis of the rotary cylinder (32) is detachably connected to a rotational drive source, and the bristles of the brush bristle material B (31) The part is brought into line contact with the processed part of the workpiece (W) in parallel with the axis of the workpiece (W) and pressed to rotate. A segment-type or cup-type polishing brush that is less expensive than a roll-type polishing brush can also be used.

  The polishing apparatus (2) arranges a brush bristle material B (31) containing abrasive grains on the surface of a cylindrical body, and the bristle portion of the brush bristle material B (31) is the workpiece (W). Since the processed portion is pressed and contacted in parallel with the axis of the workpiece, it is rotated, so that it can be polished with a cutting depth with a constant pressing force.

  Since the polishing means A (20) and the polishing means B (30) of the polishing apparatus (2) are used as polishing brushes, the bristle tips of the brush bristle material A (21) or the brush bristle material B (31) at the time of polishing processing The surface of the workpiece (W) is rotated in contact with the processing surface of the workpiece (W) while the periphery of the workpiece is pressed to polish the surface layer portion of the workpiece (W) around several tens to 100 μm. Therefore, the microcracking of the prismatic and columnar workpieces (W) can be removed and the polishing process can be accurately performed to reduce the surface roughness.

  Further, the abrasive grain fixed to the brush bristle material B (31) of the grinding means B (30) of the grinding device (2) has two or more kinds of grain sizes, and the brush bristle material B (37 with coarse grain size). ) Is arranged on the side of the rotary cylinder (32) where the workpiece (W) starts to be pressed and the brush bristle material B (38) having a fine grain size is used as the workpiece of the rotary cylinder (32). You may arrange | position on the side which complete | finishes pressing contact with (W) and leaves | separates.

  In the roll type polishing brush for polishing the cylindrical workpiece (W), it is possible to provide the polishing means B (30) having both the functions of rough polishing and precision polishing with a single polishing brush. Therefore, it is possible to perform rough polishing processing and precision polishing processing of the cylindrical workpiece (W) with a single polishing apparatus (2), and to reduce the equipment cost.

  In addition, the fine particle classification # 240 to # 500 defined in JIS R6001: 1998 is used as the polishing brush for rough polishing, and the fine particle classification # of the fine powder classification is used for the polishing means A (20) or the polishing means B (30). The reason why the two types of polishing brushes for precision polishing are used as 800 to # 1200 is as follows. Microcracks present in the surface layer portion of the workpiece (W) are accurately removed by the high polishing ability of the polishing brush for rough polishing. For precision polishing to reduce the surface roughness of the surface layer roughened by rough polishing with the polishing brush for precision polishing, and to eliminate the cracks and chips generated when the wafer is sliced in the subsequent process. It is preferable to polish with a polishing brush.

  Also, a mounting portion for the grinding means A (14) and the polishing means A (20) or the grinding means B (24) and the polishing means B (30) that are detachable from the grinding apparatus (1) and the polishing apparatus (2). Since the grinding device (1) main body and the polishing apparatus (2) main body can have the same specification, the manufacturing cost of the apparatus main body can be reduced.

[Processing by grinding / polishing system]
5 shows three grinding apparatuses (1) shown in FIG. 1, one polishing apparatus (2) shown in FIG. 2, one grinding apparatus (1) shown in FIG. 3, and FIG. One polishing device (2), an unprocessed workpiece (W) loading device (3), a processed workpiece (W) unloading device (4), and the loading device (3) , An operating arm (51) that pivots between the grinding device (1), the polishing device (2), and the unloading device (4), and a workpiece (W) attached to the tip of the operating arm (51). It is a layout drawing which shows arrangement | positioning with the transfer apparatus (5) which has the holding part (52) made to hold. The control means (not shown) performs arithmetic processing based on the initial setting items that have been input before the start of machining and the measurement signals transmitted from the measurement means (18) provided in the grinding device (1) and the polishing device (2). A function of outputting an operation signal to each means of the grinding device (1) and polishing device (2), and a function of controlling the turning operation of the transfer device (5) and the gripping operation for gripping the workpiece (W). Is provided. Further, the control means functions to control the order in which the transfer device (5) swivels between the carry-in device (3), the grinding device (1), the polishing device (2), and the carry-out device (4). May be provided.

  If comprised in this way, based on the turning operation | movement order to the carrying-in apparatus (3), the grinding apparatus (1), the grinding | polishing apparatus (2), and the carrying-out apparatus (4) input beforehand by the control means, a transfer apparatus (5 ) Grips the workpiece (W), and the operating arm (51) turns. Therefore, the unground and polished workpiece (W) waiting on the carry-in device (3) is ground and polished by the grinding device (1) and the polishing device (2). 4) can be carried out fully automatically.

  Further, since the gripping part (52) of the transfer device (5) is rotatable to a predetermined angle, the grinding device (1) and the polishing device (2) for processing the prismatic workpiece (W). The “intermittent rotation” rotating mechanism provided on the clamp shaft (13) of the gripping means (12) may be eliminated, and the workpiece (W) may be “intermittently rotated” by the gripping portion (52).

[Grinding / Polishing]
Examples of the initial setting items that are input to the control unit according to the first aspect before the start of machining include the following items.
1. 1. A known reference interval dimension formed by a pair of two reference surfaces of a reference block (K) described later. Workpiece (W) type and shape information (number of prisms or cylinder)
3. 3. Grinding and polishing allowance for the surface layer of the workpiece (W) 4. Final cross-sectional dimensions and tolerances of workpiece (W) after grinding and polishing. Grinding means A (14) (described later) of the grinding apparatus (1) and polishing means A (20) (described later) of the polishing apparatus (2) when processing a prismatic workpiece (W). External dimensions, abrasive grain size, rotational speed, and gripping means (12) and grinding means A (14) of the grinding apparatus (1) and gripping means (12) and polishing means A (20) of the polishing apparatus (2) 5. Moving speed for moving either one by moving means (19) (to be described later) Grinding means B (24) (described later) of the grinding apparatus (1) and polishing means B (30) (described later) of the polishing apparatus (2) when processing the cylindrical workpiece (W). External dimensions, abrasive grain size, rotational speed, and gripping means (12) and grinding means B (24) of grinding device (1) and gripping means (12) and polishing means B (30) of polishing device (2) 6. Moving speed for moving either one by moving means (19) The shape of the processed part of the work piece (W) is a case where an arc-shaped or cylindrical work piece (W) such as a corner part of a single crystal silicon block or a body part of a single crystal sapphire ingot is processed. Rotational speed of the required gripping means (12) of the grinding device (1) and the polishing device (2)

The moving speed of the workpiece (W) in the grinding and polishing processes needs to be set in a range in which no grinding trace or polishing trace remains, and the workpiece (W) has a prismatic shape, for example, a large number. When processing the side surface portion (F) and the corner portion (C) of the crystalline silicon block and the side surface portion (F) of the single crystal silicon block, it is set to 10 to 40 mm / second, and the workpiece (W) is cylindrical. For example, when processing the body part (B) of the single crystal sapphire ingot and the corner part (C) of the single crystal silicon block (W), the speed is set to 10 mm / second or less.
The setting of the moving speed is related to the setting conditions of the grain size, depth of cut, and rotational speed of the abrasive grains for grinding / polishing, for example, if the grain size of the abrasive grains is coarse, set in the slow region of the above range, If the grain size is small, it is necessary to set the area within the above range.

  The workpiece (W) is shaped by removing a distortion of the workpiece (W) by setting a constant cutting amount in the grinding means A (14) or grinding means B (24) of the grinding device (1) with respect to the workpiece (W). And the function of grinding the cross-sectional dimension within a desired tolerance, and the pressing means A (20) or the polishing means B (30) of the polishing apparatus (2) with respect to the work piece (W). Since it has the function of polishing the surface layer of the workpiece (W) around several tens of μm to 100 μm by setting the depth of cut by pressure, the cross-sectional dimensions and cross-sectional shape can be processed within the desired tolerances. The microcracks in the surface layer portion can be accurately removed, and the surface roughness can be made finer.

The cross-sectional dimension measured by the measuring means (18) of the grinding apparatus (1) before the start of grinding is arithmetically processed by the control means, and the workpiece (W) input to the control means in advance as an initial setting item. Since the grinding work and / or the polishing work and the final cross-sectional dimension after the grinding / polishing work are smaller than the total cross-sectional dimension, the grinding work and / or the polishing work cannot be performed. The grinding process (1) is stopped and the gripping means (12) is placed on the base (11).
The workpiece (W) whose grinding / polishing processing has been stopped is re-melted (not shown) when the operating arm (51) of the transfer device (5) is rotated and operated to be held by the holding portion (52). It will be returned to the process.

  The measuring means (18) provided in the grinding device (1) or the polishing device (2) is parallel to the column axis of the workpiece (W) on one of the clamp shafts (13) of the gripping means (12). A reference block (K) is formed which has a pair of horizontal reference surfaces and a pair of vertical reference surfaces with a known reference interval dimension. The measurement means (18) further sets the measurement direction to a direction orthogonal to the column axis direction of the workpiece (W), and performs vertical grinding / polishing of the reference block (K) and the workpiece (W). The measuring tool A (18A) that measures the interval dimension (cross-sectional dimension) of the polishing portion, and the measurement direction is the vertical direction orthogonal to the measuring tool A (18A), and the upper surface of the reference block (K) A measuring tool B (18B) for measuring the height position of the grinding / polishing portion on the upper surface of the reference surface and the workpiece (W).

Using the above configuration, the measurement means (18) performs measurement as follows.
<1> For the measurement of the cross-sectional dimension of the reference block (K) in the horizontal direction perpendicular to the column axis (using the vertical reference plane), the reference interval dimension is controlled in advance as an initial setting item before processing starts. Is input. The distance between the reference surfaces of the reference block (K) is measured by the measuring tool A (18A) and transmitted to the control means. The measurement signal is arithmetically processed, and the measurement signal of the measuring tool A (18A) with respect to the reference dimension (cross-sectional dimension) of the reference block (K) is set.
<2> For the measurement of the cross-sectional dimension of the workpiece (W), the actual dimension between the horizontal processing parts perpendicular to the column axis, which is the cross-sectional dimension of the workpiece (W), is measured by the measuring tool A (18A). Is actually measured and the measurement signal is transmitted to the control means. The measurement signal of the workpiece (W) is calculated based on the measurement signal of the reference dimension of the measuring tool A (18A) set in <1>, and the actual dimension of the cross section of the workpiece (W) is calculated. Can be measured.
<3> Regarding the setting of the base point position where the cutting depth of the grinding means A (14) or grinding means B (24) and the grinding means A (20) or grinding means B (30) is “zero”, the grinding means A (14) or the tip of the grinding means B (24) and the polishing means A (20) or the polishing means B (30) are brought into contact with the reference surface of the reference block (K), and the signal of the contact position is sent to the control means. Sent. The base point position where the cutting amount of the grinding means A (14) or grinding means B (24) and polishing means A (20) or polishing means B (30) is “zero” is calculated and stored in the control means.
<4> Regarding the setting of the cutting amount of the grinding means A (14) or grinding means B (24) and the polishing means A (20) or polishing means B (30), the above <1>, <2> and <3> The calculation results of <1>, <2>, and <3>, which are automatically measured and automatically set, are based on the cross-sectional dimensions after grinding / polishing that have been input to the control means in advance as initial setting items before the start of machining. In addition, the cutting amount of the grinding means A (14) or the grinding means B (24) and the grinding means A (20) or the grinding means B (30) is automatically set by further arithmetic processing.
The “cutting amount” is a feed amount neglecting deformation in a means that deforms during processing, such as a polishing brush, and is used separately from the “cutting allowance” that is actually ground or polished.

In addition, the initial setting items input to the control means and the calculation process of the measurement signal transmitted from the measurement means (18), and the control process transmits the calculation signal to the grinding apparatus (1) or the polishing apparatus (2). Supplementary explanation will be given on the operation signal.
For example, the workpiece (W) of the gripping means (12) is used as an operation signal determined by the type of workpiece (W) in the initial setting items and its shape information (the number of prisms or a cylinder). There is an actuation signal that determines "intermittent rotation" or "continuous rotation" of the clamp shaft (13) to be gripped. From the control means, the base (11), the gripping means (12), the grinding means A (14) or the grinding means B (24), the measuring means (18), the moving means (19) constituting the grinding apparatus (1), or Base (11), gripping means (12), polishing means A (20) or polishing means B (30), measuring means (18), moving means (19) constituting the polishing apparatus (2)
There is a signal transmitted to the device to operate each of the means.
Further, preparation of the external dimensions after grinding / polishing of the workpiece (W) and removal of microcracks based on the arithmetic processing of <1>, <2>, <3>, and <4> relating to the measurement of the measuring means (18). There is also an activation signal for adjusting the surface roughness.

  Further, a horizontal reference plane perpendicular to the column axis of the reference block (K) measured by the measuring tool A (18A) and a direction orthogonal to the column axis direction of the workpiece (W) (FIGS. 1 to 4). The pressing tool (34) is positioned on both sides (FIGS. 1 to 4, 7) of the workpiece (W) based on the distance dimension (cross-sectional dimension) between the processing parts on both sides in the Y direction shown in FIGS. The workpiece (W) is moved back and forth in the Y direction shown in FIG. 8 to set the workpiece (W) at the center position in the Y direction shown in FIGS. 1 to 4, 7 and 8 of the base (11). Can do. Based on the reference surface of the upper surface of the reference block (K) measured by the measuring tool B (18B) and the height position in the vertical direction (Z direction shown in FIGS. 6 and 8) of the processed portion of the workpiece (W). Then, the base (11) moves up and down, and the column axis of the workpiece (W) is ground by means of grinding means A (14) or polishing means A (20), grinding means B (24) or polishing means B. It can be set at the center position in the Z direction (see FIGS. 6 and 8) of (30).

  A horizontal direction (Y direction shown in FIGS. 1 to 4, 7, and 8) perpendicular to a column axis direction of the workpiece (W) placed on the base (11) and a vertical direction (FIGS. 6 and 6). 8 in the Z direction) so that the clamp shaft (13) of the gripping means (12) can accurately grip the center positions of both end faces of the workpiece (W). Therefore, when the shape of the workpiece (W) to be ground and polished is a cylindrical shape (in the case of a single crystal sapphire ingot) or an arc shape (in the corner portion of a single crystal silicon block), the clamp of the gripping means (12) The shaft (13) can be processed accurately by "intermittent rotation" or "continuous rotation" about the axis.

  The measuring instrument A (18A) and the measuring instrument B (18B) of the measuring means (18) include a contact method in which measurement is performed by directly contacting a measurement site, and a non-contact method in which measurement is performed by emitting laser light. Either of the formulas may be used.

Moreover, the said control means is good to have the following function. That is,
1. The grinding means A (14) and the polishing means A (20) or the grinding means B (14) and the polishing means are provided on the reference surfaces on both sides of the reference block (K) provided in the gripping means of the grinding apparatus and the polishing apparatus. 1. A function of computing the base point position where the cutting amount of each means of the grinding device and the polishing device is “zero” by bringing the tips of B (30) into contact with each other. The measuring tool A (18A) provided in the measuring means of the grinding apparatus and the polishing apparatus measures the difference between the reference surfaces on both sides of the reference block (K) and the processing parts on both sides of the workpiece (W). 2. A function of calculating the cross-sectional dimensions before and after processing of the processed portion of the workpiece (W). The workpiece (W) placed on the base (11) provided in the grinding device (1) and the polishing device (2) is pressed by the pressing tool (34) from both horizontal directions, and the workpiece After positioning at the center position in the horizontal direction orthogonal to the column axis of (W), by the measuring tool B (18B) of the measuring means (18) provided in the grinding device (1) and the polishing device (2), respectively. By the measurement, the vertical position of the base (11) is adjusted, and the workpiece to be gripped by the clamp shaft (13) of the gripping means (12) provided in the grinding device (1) and the polishing device (2), respectively. 3. A function of performing a centering calculation process for matching the clamp positions of both end faces of the workpiece (W) with the axis of the workpiece (W). The initial setting items input before the start of processing, and the measuring tool A (18A) and measuring tool B (18B) of the measuring means (18) provided in the grinding device (1) and the polishing device (2), respectively, are output. A function that performs arithmetic processing based on the measurement signal and outputs an operation signal to each means of the grinding device (1) and the polishing device (2).

  Since the control means is equipped with various functions for automating the grinding / polishing system of hard and brittle materials, it is possible to accurately grind and polish the processed part of the workpiece (W) and to save labor. it can.

  Further, the tolerance of the cross-sectional dimension of the prismatic workpiece (W) to be ground and polished is ± 0.5 mm, and the corner (C) where the two side surfaces (F) of the workpiece (W) intersect each other ) Of the cross-sectional shape is preferably ± 0.1 degrees.

  For example, there are three types of cross-sectional dimensions of a square pillar-shaped silicon block before the start of processing: 125 mm × 125 mm (name: 5 inches), 156 mm × 156 mm (name: 6 inches), 210 mm × 210 mm (name: 8 inches) . The required tolerance is ± 0.5 mm, and the required tolerance of the cross-sectional shape of the corner (C) where the two side surfaces (F) of the silicon block (W) cross each other is 90 ° ± 0.1 °. It is. Therefore, grinding / polishing is accurately performed based on cross-sectional dimension tolerance and cross-sectional shape tolerance.

  Moreover, the tolerance of the cross-sectional dimension of the cylindrical workpiece (W) to be ground and polished may be ± 0.5 mm.

For example, the cross-sectional dimension of the cylindrical single crystal sapphire ingot before the start of processing is 2 to 6 inches (51 to 154 mm) in diameter. The required tolerance is ± 0.5 mm. Therefore, grinding and polishing are accurately performed based on cross-sectional dimension tolerance.
Using the grinding / polishing system described so far, after grinding by the grinding means A (14), the grinding means A (20) is then ground to grind and polish hard brittle materials. I do.
Alternatively, after grinding by the grinding means B (24), polishing is performed by the polishing means B (30).

  A grindstone for coarse grinding consisting of F90 to F220 (JIS R6001: 1998) and a grain size of abrasive grains of # 240 to # 500 Using a grinding wheel for precision grinding consisting of JIS R6001: 1998), rough polishing consisting of # 240 to # 500 (JIS R6001: 1998) with a grain size of polishing means A (20) or polishing means B (30) of the polishing apparatus And a polishing brush for precision polishing consisting of # 800 to # 1200 (JIS R6001: 1998), and a grinding allowance is obtained by grinding means A (14) or grinding means B (24). Is 20 μm to 700 μm and the surface roughness is Ry 2.0 to 10.0 μm (JISB0601: 1994), and then polishing means A (20) or polishing means B 30) by the machining allowance 75μm or more, the surface roughness Ry1.1μm (JISB0601: 1994) may be performed ground and polished in the following.

In addition, the processing steps of the prismatic workpiece (W) formed with the side surface portion (F) and the corner portion (C), which are grinding / polishing processing portions, may be performed in any of the following orders.
1. Grinding of the side surface (F), grinding of the corner (C), rough polishing of the side surface (F), precision polishing of the side surface (F),
2. Grinding of the side surface (F), rough polishing of the side surface (F), precision polishing of the side surface (F), grinding of the corner (C),
3. Rough grinding of side surface (F), precision grinding of side surface (F), grinding of corner (C), rough polishing of side surface (F), precision polishing of side surface (F)

Moreover, you may perform the process of the to-be-processed object (W) formed in the trunk | drum body (B) whose shape of a grinding / polishing process part is a column shape in any of the following order.
1. Grinding, rough polishing, precision polishing,
2. Rough grinding, precision grinding, rough polishing, precision polishing

  After setting the initial setting items in the control means (not shown) as described above, the machining start switch is turned on to start cutting / polishing. The workpiece (W) conveyed on the carry-in device (3) is gripped by the gripping part (52) of the revolving transfer device (5). As shown in FIG. 6, the workpiece (W) is placed on the base (11) of the grinding apparatus (1) that performs the processing first. The measuring means (18) measures the upper surface of the workpiece (W), and the vertical position of the column axis of the workpiece (W) matches the vertical position of the axis of the clamp shaft (13) of the gripping means (12). Thus, it is vertically moved by the base (11). As shown in FIG. 7, the pressing tool (14) advances from both sides in the horizontal direction (Y direction), and the workpiece (W) is positioned at the center thereof. Next, one of the clamp shafts (13) of the gripping means (12) moves forward in the X direction shown in FIG. 1 and is gripped by the clamp shafts (13) (13). The base (11) is shrunk downward.

  The gripping means (12) shown in FIG. 6 is moved between the grinding means A (14) and (14) by the operation of the moving means (19). The tip of the abrasive layer A (15a) of the grinding means A (14) (14) comes into contact with the vertical reference surface of the reference block (K) provided on the gripping means (12), and the grinding means A ( The base point position where the cutting depth of the abrasive layer A (15a) of 14) is “zero” is stored in the control means.

  As described above, the type of the workpiece (W) is common to the prismatic workpiece (W) (for example, polycrystalline or single crystal silicon block) or the cylindrical workpiece (W) (for example, single crystal sapphire ingot). In the following, a grinding apparatus (1) equipped with a prismatic grinding means A (14) and a prismatic polishing means A when the polycrystalline silicon block is a workpiece (W). The details of the operation will be described by taking as an example a facility in which the carry-in device (3), the carry-out device (4) and the transfer device (5) are arranged in the polishing device (2) to which (20) is attached.

The gripping means (12) is moved to the measuring means (18) by the operation of the moving means (19), and as shown in FIG. 8 (Y direction), a first set facing both sides of the polycrystalline silicon block (W). The cross-sectional dimension of the side surface portion (F) is measured by the measuring tool A (18A). The measurement result is transmitted to the control means.
The measurement result transmitted to the control means is processed into actual dimensions in the control means, and the cutting means of the grinding means A (14) is cut based on the actual dimensions and the "cross-sectional dimensions after grinding" set in advance. The amount is set automatically.

  The first set of both side surfaces (F) and (F) of the polycrystalline silicon block (W), whose cross-sectional dimensions are measured and the cutting depth of the grinding means A (14) is set, are ground by the operation of the moving means (19). It is moved between means A (14) and (14) and is ground. It is confirmed by the measuring tool A (18A) (18A) that the cross-sectional dimension between the side surface portions (F) and (F) is within the tolerance. When the grinding of the first set of both side surfaces (F) and (F) is completed, the clamp shafts (13) and (13) of the gripping means (12) are rotated 90 degrees by the rotation mechanism, and the second set of both side surfaces ( F) (F) is ground in the same manner as the first set of both side surfaces (F) and (F). When it is confirmed that the cross-sectional dimension is within the tolerance, the grinding of the four side surfaces (F) is completed.

  The polycrystalline silicon block (W) that has finished the grinding of the four side surfaces (F) returns to the operation start position shown in FIG. 6 while being held by the clamp shafts (13) and (13) of the holding means (12). Thus, the gripping state of the clamp shafts (13) and (13) is released and placed on the base (11). The polycrystalline silicon block (W) is rotated by the operating arm (51) of the transfer device (5) and is held by the holding portion (52), so that the corner portion (C), which is the next processing step, is held. It is mounted on the base (11) of the grinding apparatus (1) for grinding. The corner portion (C) is ground by the same operation sequence as that of the grinding device (1) for grinding the side surface portion (F).

  The polycrystalline silicon block (W) that has finished grinding of the four corners (C) is shown in FIG. 6 in a state of being gripped by the clamp shafts (13) and (13) of the gripping means (12) in the same manner as described above. Returning to the operation start position, the gripping state of the clamp shafts (13) and (13) is released, and the clamp shafts (13) and (13) are placed on the base (11). The operating arm (51) of the transfer device (5) is turned to hold the polycrystalline silicon block (W) by the holding portion (52), and the base of the polishing device (2) which is the next processing step. It is mounted on a stand (11). The four side portions (F) are polished by the same operation sequence as that of the grinding device (1). Thereby, all the grinding / polishing processes are completed.

  After all the grinding and polishing processes are completed, the polycrystalline silicon block (W) placed on the base (11) of the polishing apparatus (2) is moved to the operating arm (51) of the transfer apparatus (5). ) Turns and is gripped by the gripping part (52), transferred to the carry-out device (4) and carried out.

  Next, grinding is performed by the grinding means A (14) or grinding means B (24) of the present invention, and the cross-sectional dimensions are ground within the tolerance of the processing dimensions, and the polishing means A (20) or the polishing means B (30). The above-mentioned polycrystalline silicon block (W), single crystal silicon block (W), or single crystal sapphire ingot (W) whose surface roughness has been reduced by removing microcracks on the surface layer is sliced with a wire saw An embodiment formed on a wafer will now be described. In the example, the rate of occurrence of defective products due to cracks or chipping of the wafer could be reduced.

  As shown in FIG. 15, the workpiece (W) to be processed in Example 1 is perpendicular to the four side surfaces (F) cut by using a new wire saw made of a single abrasive ingot from a single silicon ingot. This is a quadrangular prism-shaped polycrystalline silicon block (W) composed of four rectangular portions (C). As shown in FIG. 15, the polycrystalline silicon block (W) was formed by cutting 5 rows × 5 rows = 25 in total. The polycrystalline silicon block A (W) located at the four corners was extracted and prepared. In the crystalline silicon block A (W), bulges were formed on the two side surfaces (F) as shown in FIG.

  The grinding means A (14) of the grinding apparatus (1) employs a cup-type grindstone shown in FIGS. From Table 3, diamond abrasive grains corresponding to F100 (JIS R6001: 1998) with high grinding ability were selected as the grain sizes of the abrasive grains forming the abrasive layer A (15a). The outer dimensions of the abrasive layer A (15a) were 250 mm in diameter and 8 mm in width.

  The initial setting items shown in Tables 1 and 2 were input to the control means before starting the machining. The rectangular columnar polycrystalline silicon block (W), which is the workpiece (W), is placed on the base (11) of the grinding apparatus (1), and the processing start switch of the grinding apparatus (1) is turned on. It was.

  The square pillar-shaped polycrystalline silicon placed on the base (11) by the pressing tools (34) (34) of the grinding device (1) operating inside each other in the Y direction shown in FIGS. In the block (W), the column axis is set at the center position in the Y direction. Next, both ends of the polycrystalline silicon block (W) were gripped by the operation of the clamp shafts (13) and (13) of the gripping means (12). The moving means (19) is operated in the X direction shown in FIG. 1 to move the reference block (K) provided on the clamp shaft (13) to the position of the measuring tool A (18A). The cross-sectional dimension of the reference block (K) was measured, and the output signal was transmitted to the control means. The output signal obtained by measuring the cross-sectional dimension of the reference block (K) was stored in the control means as corresponding to the cross-sectional dimension (100 mm) of the reference surface input before the start of processing.

  By the next operation of the moving means (19), the polycrystalline silicon block A (W) held by the clamp shaft (13) of the holding means (12) was moved to the position of the measuring tool A (18A). As shown in FIG. 8 (Y direction), the measuring tool A (18A) has a distance between a set of two side face portions (F) of the polycrystalline silicon block A (W) of 3 vertical positions × 3 horizontal positions. Measurements were made at a total of 18 locations, including 9 locations (total 9 locations) and another set of two side surface portions (F). As a result, the distance between the two side surfaces was 156.9 to 157.6 mm (average: 157.1 mm). The surface roughness was Ry 21 to 27 μm (average: 24 μm), and the length was 499.6 mm.

The average cross-sectional dimension of the polycrystalline silicon block A (W) prepared as the workpiece (W) was +1.1 mm with respect to 156 mm × 156 mm of 6 inches. Therefore, since it is necessary to cut one side = 0.55 mm, the cutting depth was set to 0.7 mm. The rotation speed was converted to a reference peripheral speed of 30 to 40 m / sec for grinding and was set to 2700 min ⁻¹ . After the polycrystalline silicon block A (W) is passed through the grinding means A (14) at a speed of 20 mm / second to grind the two side surfaces (F), the clamp shaft (13) of the gripping means (12) is attached. The other two side surface portions (F) were ground in the same manner as described above, and the grinding of the four side surface portions (F) was completed.

  After finishing the grinding of the four side surfaces (F), the clamp shaft (13) of the gripping means (12) gripping the polycrystalline silicon block A (W) is rotated by 45 degrees, and the first set The two corners (C) were positioned to face the grinding means (3) on both sides.

  In the grinding of the corner (C), the grain size of the grinding means A (14) and the moving speed of the polycrystalline silicon block A (W) should be the same as those during the grinding of the side surface (F). As a result of grinding, a crack called chipping was found at the joint with the side surface (F). Therefore, the grinding means A (14) was changed to a grindstone in which the grain size of the abrasive grains was reduced to # 500 (JIS R6001: 1998), and the moving speed of the polycrystalline silicon block A (W) was changed to 30 mm / second for grinding. . As a result, the amount of grinding was reduced, but a C-plane having no chipping as described above could be formed.

  Therefore, the grinding of the other two corners (C) obtained by rotating the clamp shaft (13) of the gripping means (12) by 90 degrees also sets the grain size of the abrasive grains of the grinding means A (14) to # 500. In the same manner, grinding was performed on the four corners (C). As a result, the total of 18 dimensions between the two side surfaces (F) where the four side surfaces (F) face each other is 156.1 to 156.6 mm (average: 156.2 mm), and the four side surfaces (F) are cut. The cost (= result calculated by measurement value / 2) was 390 to 480 μm (average: 430 μm), and the surface roughness was Ry 5 to 8 μm (average: 7 μm).

As a result of confirming the “maximum cutting allowance and its cutting amount” per grinding in grinding of the grindstone used in this example, the maximum cutting allowance was 700 μm, and the cutting amount at that time was 1.0 mm. Since the one-side machining allowance (550 μm) of the grinding process in this example is within the range of the maximum machining allowance (700 μm), the cutting amount of the grindstone can be set to 0.55 mm and finished once. .
Regarding the relationship between the “cutting allowance and the cutting amount”, it is possible to set “cutting allowance = 70% or more of the cutting amount” in one grinding process as a guide from the above results, which was used in this example. When using a grindstone and performing a grinding process of 1.1 mm, for example, with a one-side machining allowance of 1.0 mm or more, after performing the first grinding process (cut amount: 1.0 mm, machining allowance: 700 μm) A second grinding process (incision amount: 0.57 mm, machining allowance: 400 μm) may be performed.

  After cutting the polycrystalline silicon block A (W) after the grinding (before polishing) and observing the inside, there was a microcrack at a depth of 70 to 90 μm from the surface. For reference, as a result of slicing the polycrystalline silicon block A (W) after grinding (before polishing) into a 200 μm-thick wafer using a wire saw, the occurrence rate of cracks and chips is 3 8%.

  The polishing means A (20) of the polishing apparatus (2) used for the next processing includes the brush hair material A (35) for rough polishing and the brush hair material A (for precision polishing) (see FIG. 11 and FIG. 12). A segment-type polishing brush was used in which the attachment base of 36) was bundled with each metal tube and made removable on the same rotating disk (22).

  The brush bristle material A (35) for rough polishing of the polishing brush is obtained by selecting and fixing diamond abrasive grains corresponding to # 240 (JIS R6001: 1998) shown in Table 4. Nine bundles of brush bristle material A (35) in which the mounting base was bundled with a metal tube to a thickness of φ23 mm were prepared. The brush bristle material A (35) bundle was detachably attached by being evenly arranged on the circumference of the center diameter of 210 mm of the rotating disk (22). For the brush bristle material A (36) for precision polishing, diamond abrasive grains equivalent to # 800 (JIS R6001: 1998) shown in Table 4 are selected and fixed, and the mounting base is 23 mm in diameter with a metal tube. Bundled in thickness. 24 brush bristle materials A (36) bundles were prepared. The brush bristle material A (36) bundle was evenly arranged on the circumference of the center diameter of 280 mm of the rotating disk (22) and was detachably attached.

The processing conditions of the polishing means A (20) are as follows: the depth of cut is 0.5 mm, the rotational speed is 1400 min ⁻¹ converted from the reference peripheral speed of polishing processing of 10 to 20 m / sec, and the polycrystalline silicon block A to be polished The moving speed of (W) was 20 mm / sec. The rough polishing and precision polishing of the four side surfaces (F) were simultaneously performed, and the polishing was completed in one step.

  As a result of finishing the polishing process, the total of 18 dimensions between the two side surface portions (F) of the four side surface portions (F) facing each other was 155.9 to 156.4 mm (average: 156.1 mm). . The machining allowance was 91 to 97 μm (average: 95 μm), and the surface roughness was Ry 0.9 to 1.1 μm (average: 1.0 μm).

As a result of confirming the “maximum cutting allowance that can be cut without breaking the bristle material A (21) and its cutting amount” in one polishing process of the polishing brush used in this example, the maximum cutting allowance is The depth of cut was 1.0 mm. Since the one-side cutting allowance (100 μm) of the polishing process in the present embodiment is within the range of the maximum cutting allowance (174 μm), the cutting amount of the polishing brush is set to 0.5 mm and the polishing process is finished once. I was able to.
In addition, about the relationship between the “cutting allowance and the cutting amount” in the polishing process, 15 to 25% of one cutting allowance = cutting amount is set as a guide from the above result.

  The processing results obtained by subjecting the polycrystalline silicon block A (W) of Example 1 described above to grinding, rough polishing and precision polishing are summarized in Table 5.

  When the polycrystalline silicon block A (W) having been subjected to the grinding and polishing was sliced with a wire saw to form a silicon wafer, the incidence of defective products due to cracks, chips, etc. was 1.2%. As described above, it was 3 to 4% after the grinding process, but as shown in Table 5, the polishing allowance was average: 95 μm and the surface roughness was Ry average: 1.0 μm. The incidence was greatly reduced.

  The workpiece (W) used in Example 2 is a single crystal silicon block (W) obtained by cutting and forming a cylindrical single crystal silicon ingot manufactured by a pulling method, as shown in FIGS. . The upper and lower ends of the single crystal silicon ingot were cut and removed, and the nominal length was 300 mm (in the height direction in FIG. 18), and the measured length was 259.0 to 301.0 mm. An ingot was prepared. The ingot was vertically set in a 5 × 5 array on a fixing jig as shown in FIG.

  The 25 single crystal silicon ingots were cut and formed by using the same fixed-abrasive-type new wire saw as in Example 1 to cut the four side surfaces (F), each of which has a substantially right angle. A silicon block (W) was prepared. A part of the body part of each single crystal silicon ingot was left as a square part (C) having an arc width of about 25 mm. One piece was randomly extracted from the single crystal silicon block to obtain a workpiece (W).

  As shown in FIG. 18, the single crystal silicon block (W) has a quadrangular prism shape including four side surfaces (F) and arcuate four corners (C). As a result of performing a total of 18 measurements between the two side surface portions (F) facing each other in the same manner as in Example 1, it was 125.4 to 126.0 mm (average: 125.7 mm), and the length was 300.8 mm. The surface roughness was Ry 22 to 28 μm (average: 25 μm).

  The specifications of the grinding means A (14) and the polishing means A (20) are as shown in Table 2 above, and the grain size of the cup-type grindstone used for the grinding means A (14) is selected from Table 3. Example 1 was the same as Example 1 except that F180 was changed. The reason why the grain size of the abrasive grains of the grinding means A (14) is changed to F180 is as follows. The average cross-sectional dimension of the single-crystal silicon block (W) to be ground and polished (nominal: 5 inches) is +0.7 mm with respect to 125 mm × 125 mm, and its cutting allowance (one side) = 0.35 mm, which is small as a cutting allowance . Therefore, F180 (JIS R6001: 1998) having a finer particle size than F100 shown in Table 3 used in Example 1 is used.

The grinding is carried out by holding the prepared single crystal silicon block (W) with the clamp shaft (13) and passing the two side surfaces (F) between the grinding means A (14) opposed to both sides. As with the polycrystalline silicon block (W) of Example 1, grinding of the four side surfaces (F) was completed.
Next, as shown in Table 1, while continuously rotating the single crystal silicon block (W) at the rotational speed (87 min ⁻¹ ) of the clamp shaft (13) input and set in advance to the control means, the crystalline silicon block (W ) Was passed through the grinding means A (14) at a low speed of 2 mm / sec to complete the grinding of the corner (C).

  As a result, the total of 18 dimensions between the two side surfaces (F) of the four side surfaces (F) facing each other is 125.3 to 126.1 mm (average: 125.4 mm). The machining allowance was 283 to 350 μm (average: 316 μm), and the surface roughness of the four side surfaces (F) and the four corners (C) was Ry 4 to 6 μm (average: 5 μm).

  In the next polishing process, the brush bristle material A (35) for rough polishing and the brush bristle material A (36) for precision polishing are rotated on a rotating disk (22 while the single crystal silicon block (W) is continuously rotated by the gripping means. The polishing means A (20) composed of a pair of polishing brushes integrated with each other) is passed through the moving means (19) at a low speed of 2 mm / sec to complete the polishing of the corner (C). . Thereafter, the polishing of the four side surface portions (F) was performed by passing the polishing means A (20) between the polishing means A (20) at a moving speed of 20 mm / sec in the same manner as in Example 1. . As described above, all grinding and polishing processes were completed.

  As a result of measuring a total of 18 positions between the two side surface portions (F) facing each other of the four side surface portions (F) after finishing the polishing, the cross-sectional dimension is 124.7 to 125.4 mm (average: 125.2 mm). there were. Further, the machining allowance was 86 to 100 μm (average: 93 μm), and the surface roughness was Ry 0.8 to 1.0 μm (average: 0.9 μm).

  Table 6 summarizes the cross-sectional external dimensions and surface roughness after finishing the grinding and polishing of the single crystal silicon block (W) of Example 2 described above.

  In addition, the single crystal silicon block (W) after the completion of the grinding process and the polishing process was sliced with a wire saw to form a silicon wafer, and the occurrence rate of defective products due to cracks or chipping of the silicon wafer was examined. As a result, like the polycrystalline silicon block (W) of Example 1, the polishing allowance was 86 to 100 μm by polishing after grinding, and the surface roughness was Ry average: 0.9 μm. It was possible to reduce the incidence of defective products due to cracks / chips to 1.0% or less.

  The workpiece (W) used in Example 3 is a cylindrical single crystal sapphire ingot shown in FIG. The cross-sectional dimension was 4 inches (diameter: 100 ± 0.5 mm), and it was manufactured by a pulling method. The body portion (B) of the single crystal sapphire ingot (W) is formed with unevenness due to adhesion of impurities generated by melting and heating during production. The top part and the tail part were cut and removed, and the length (in the height direction in FIG. 19) was cut into a range of 200 mm and a measured length of 200 ± 1.0 mm.

    The specifications of the grinding means B (24) of the grinding apparatus (1) and the polishing means B (30) of the polishing apparatus (2) are as shown in Table 7 below.

A roll-type grindstone shown in FIG. 13 was adopted as the grinding means B (24). As the abrasive grains, diamond abrasive grains corresponding to the grain size of F100 (JIS R6001: 1998) whose grinding ability is higher than that in Table 3 were used. The outer dimensions of the abrasive layer B (25) were set to an outer diameter of 200 mm and a length of 100 mm. The roll-type grindstone was rotated with the depth of cut set to 1.5 mm and the rotational speed (converted from the reference peripheral speed of grinding: 15 to 30 m / sec) to 2200 min ⁻¹ . A single crystal sapphire ingot (W), which is a workpiece, is clamped by a clamp shaft (13) of a gripping means (12) that grips both ends of the column shaft core in a direction opposite to the rotational direction of the roll type grindstone. It was continuously rotated at a rotation speed of 153 min ⁻¹ (shown in Table 1: converted from a reference peripheral speed of a cylindrical workpiece (W) of 0.5 to 1.1 m / sec).
Next, while rotating the single crystal sapphire ingot (W), the moving means (19) is operated to move the single crystal sapphire ingot (W) in the direction of the column axis at a low speed of 2 mm / second and rotate. The grinding means B (24) is passed, and grinding of the body part (B) is completed.

  The diameter dimension of the trunk | drum (B) of the said single crystal sapphire ingot (W) which finished the grinding process was measured at six places along the column axial center of this trunk | drum (B). The clamp shaft (13) of the gripping means (12) that grips the single crystal sapphire ingot (W) is rotated 90 degrees, and its diameter dimension is measured at six locations in the same manner as described above. Was measured. As a result, it was 100.3-101.1 mm (average: 100.7 mm). Moreover, the surface roughness was Ry 5-7 micrometers (average: 6 micrometers). Note that the cutting of the single crystal sapphire ingot (W) included removal of impurities adhering to the body part (B), and therefore no cutting allowance measurement was recorded.

  The polishing means B (30) of the next polishing apparatus (2) is provided with a brush member B (37) for rough polishing on one end side of the rotating cylinder (32) shown in FIG. A roller-type polishing brush in which both rough polishing and precision polishing are integrally formed on a single rotating cylinder (32) having a length of 400 mm, in which the brush bristle material B (38) for polishing is disposed, is employed. .

The abrasive grains used for the polishing means B (30) are diamond abrasive grains equivalent to # 240 (JIS R6001: 1998) shown in Table 4 for the rough bristle brush bristle material B (37), Diamond brush grains corresponding to # 800 (JIS R6001: 1998) were used for the brush hair material B (38) for precision polishing.
Further, the outer dimensions of the brush bristle material B (37) for rough polishing and the brush bristle material B (38) for precise polishing are (diameter of hair tip) φ150 mm × (axial center direction of the rotating cylinder (32)) The length was 200 mm. The roll type polishing brush was rotated by setting the depth of cut to 0.5 mm and the rotation speed (converted from the reference peripheral speed of polishing: 10 to 20 m / second) to 2000 min ⁻¹ . The single crystal sapphire ingot (W) is 153 min ^{−1 in} the direction opposite to the rotation direction of the roll type polishing brush by the clamp shaft (13) of the gripping means (12) gripping both ends of the column axis. It was continuously rotated at a rotation speed (converted from a reference peripheral speed of 0.5 to 1.1 m / sec of the cylindrical workpiece (W) shown in Table 1).
Next, the single crystal sapphire ingot (W) gripped and rotated by the clamp shafts (13) and (13) of the gripping means (12) by the operation of the moving means (19) is moved 2 mm in the column axis direction. It was moved at a low speed of / sec and passed through the rotating polishing means B (30) to complete the polishing of the body part (B).

  The diameter dimension of the body part (B) of the single crystal sapphire ingot (W) after the polishing process was measured, and the diameter dimension along the column axis of the body part (B) was measured at six locations. The clamp shaft (13) of the gripping means (12) that grips both ends of the column axis of the single crystal sapphire ingot (W) is rotated by 90 degrees, and its diameter dimension is measured at six points as described above. A total of 12 diameter dimensions were measured. As a result, it was 100.2 to 100.9 mm (average: 100.6 mm). The cutting allowance was 94 to 102 μm (average: 98 μm), and the surface roughness was Ry 5 to 7 μm (average: 6 μm).

  Table 8 summarizes the cross-sectional outer dimensions and the surface roughness of the single crystal sapphire ingot (W) used in Example 3 described above after grinding and polishing.

  In addition, as a result of examining the occurrence rate of defective products due to cracks, chips, etc., when a single crystal sapphire ingot (W) that has been completely ground and polished is sliced with a wire saw into a wafer, 1.0% The following can be reduced. The same effect as the silicon block (W) used in Example 1 and Example 2 could be obtained by polishing with a polishing margin of 94 to 102 μm and a surface roughness of Ry average: 1.0 μm. .

(Example of change)
When the surface of the workpiece (W) gripped by the gripping means (12) is not horizontal like the crystal Lambert shown in FIG. 20, the workpiece (W) is placed at the tip of the gripping means (12). A clamping assisting member (not shown) matched to the shape of the tip may be connected, and the workpiece (W) may be gripped via the clamping assisting member.

  When the work surface of the work piece (W) has an irregular shape (irregular shape) as shown in FIG. 20, for example, the “work piece (W) shape”, “finished target shape”, etc. are initially set. The setting item may be set to perform grinding / polishing.

  Although the present invention has been described with respect to grinding and polishing of polycrystalline and single crystal silicon blocks and single crystal sapphire ingots, it is not limited thereto. For example, silicon wafers used for various semiconductor substrates such as crystal solar cell panels, crystal wafers used for electronic devices such as crystal resonators, quartz wafers used for electronic devices and optical substrates, sapphire wafers used for LED substrates, etc. Gallium arsenide wafers, gallium phosphide wafers, gallium nitride wafers, silicon carbide single crystal wafers used for power devices, lithium tantalate wafers and lithium niobate wafers used for SAW filters, indium phosphide used for ultrafast semiconductor devices It can also be suitably used for grinding / polishing of ingots and blocks in the production of wafers and wafers of general hard and brittle materials. The raw material of the workpiece is not limited to the above, but also other hard and brittle materials, and the shape is not only a prismatic and cylindrical shape, but also a complicated shape (irregular shape) such as a quartz lambard ) Columnar bodies (see FIG. 20) in general.

  According to the grinding apparatus or the grinding method of the present invention, the cross-sectional dimensions and squareness or square or cylindrical ingot of a prismatic block that is a workpiece (W) formed by cutting an ingot made of a hard and brittle material with a wire saw or the like. Even when the cross-sectional dimension is out of the tolerance range, the surface layer impurities and strain of the workpiece (W) are reduced by the grinding function using the grinding means A (14) or the grinding means B (24) as a grindstone. By removing, the cross-sectional dimension can be within a tolerance of ± 0.5 mm. Furthermore, the squareness of the corner portion (C) formed by intersecting the side surface portions (F) when the shape of the workpiece (W) is a prismatic shape can be within a tolerance of ± 0.1 degrees. . Further, by the polishing function using the polishing means A (20) or the polishing means B (30) in the subsequent process as a polishing brush, microcracks on the surface layer of the workpiece (W) after the grinding process are removed, The surface roughness can be made Ry 1.1 μm (JISB0601: 1994) or less. Therefore, in the next process, when the workpiece (W) is sliced into a wafer having a thickness of several hundreds μm using a wire saw or the like, a defective product due to cracks / chips generated during the slicing process will be described. The occurrence rate can be reduced.

  Further, by making the specifications of the mounting portions of the grinding means A (14) or the grinding means B (24) and the polishing means A (20) or the polishing means B (30) common, the grinding device (1) and the polishing are performed. The main body of apparatus (2) can be made into the same specification. Therefore, the manufacturing cost of the apparatus main body can be reduced. Further, the clamp shaft (13) of the gripping means (12) for gripping the workpiece (W) attached to the grinding device (1) and the polishing device (2) can be “intermittently rotated” or “continuously rotated”. Therefore, it is possible to facilitate grinding / polishing of the workpiece (W) having a prismatic or cylindrical shape.

  Further, a transfer device (5) for placing a workpiece (W) on and taking out the workpiece (W) on each of the carry-in device (3), grinding device (1), polishing device (2), and carry-out device (4). And each process of the transfer device (5), the grinding device (1), and the polishing device (2) is automated by the control means. Therefore, improvement of processing accuracy, labor saving, and mass production can be achieved.

  Grinding means that grinds the surface layer of the workpiece with a constant depth of cut, removes impurities in the surface layer of the workpiece and distortion in the column axis direction, and sets the cross-sectional dimension to a desired dimension, and finishes the grinding A polishing and polishing apparatus (6) comprising: polishing means for polishing a surface layer portion of the work piece with a constant pressing force, removing microcracks in the surface layer portion of the work piece, and reducing the surface roughness. A grinding / polishing system provided with a second embodiment will be described. Here, only differences from the first embodiment will be described.

FIG. 21 shows a grinding / polishing apparatus (6) for grinding and polishing a prismatic workpiece (W) according to the present invention. The grinding / polishing apparatus (6) includes a gripping means (12) for gripping the workpiece (W), and a grinding means A for grinding the side surface portion (F) and the corner portion (C) of the workpiece (W). (14), polishing means A (20) for polishing the side surface portion (F) and corner portion (C) of the workpiece (W) after grinding, and a reference block (K) for forming a reference surface And measuring means (18) for measuring the cross-sectional dimension of the workpiece (W), and measuring means for measuring the workpiece (W) by moving the gripping means (12) for gripping the workpiece (W). (18) and moving means (19) for moving between the grinding means A (14).
The moving means (19) moves the gripping means (12) gripping the workpiece (W) between the measuring means (18), the grinding means A (14), and the polishing means A (20). The workpiece (W) is measured, or the workpiece (W) is ground and polished. However, the gripping means (12) that grips the workpiece (W) is fixed, and the measuring means (18), the grinding means A (14), and the polishing means A (20) are placed at the position of the workpiece (W). The workpiece (W) may be moved to perform measurement, grinding and polishing.

  As the grinding means A (14), a cup-type grindstone was used as in the first embodiment. The polishing means B (20) was a segment type polishing brush, as in the first embodiment.

FIG. 22 shows a grinding / polishing apparatus (6) for grinding and polishing a cylindrical workpiece (W) according to the present invention. The grinding / polishing apparatus (6) includes a gripping means (12) for gripping the workpiece (W), a grinding means B (24) for grinding the body part (B) of the workpiece (W), and a grinding Polishing means B (30) for polishing the body portion (B) of the processed workpiece (W), a reference block (K) for forming a reference plane, and a cross-sectional dimension of the processed workpiece (W). The measuring means (18) for measuring and the gripping means (12) for gripping the workpiece (W) are moved to move the workpiece (W) between the measuring means (18) and the grinding means B (24). And a moving means (19) for moving to.
The transfer means (19) fixes the grip means (12) that grips the workpiece (W) in the same manner as described above, and measures the measurement means (18), the grinding means B (24), and the polishing means B (30). May be moved at the position of the workpiece (W) to measure, grind and polish the workpiece (W).

  As the grinding means B (24), a roll-type grindstone was used as in the first embodiment. The polishing means B (30) was a roll-type polishing brush as in the first embodiment. It is also possible to use a cup-type grindstone that is less expensive than a roll-type grindstone, or a cup-type or segment-type polishing brush that is less expensive than a roll-type polishing brush.

  The grinding / polishing apparatus (6) for grinding and polishing the prismatic and cylindrical workpieces (W) both shows the workpiece (W) fixed to the supporting means 12 from the left in the figure to the right. Processing is performed in the order of grinding and polishing.

A plurality of grinding means A (14) and polishing means A (20) may be connected. For example, in FIG. 23, two pairs of polishing means A (20) are connected to one pair of grinding means A (14). In this case, the abrasive grains contained in the brush bristle material A (21) of the polishing means A (20) arranged on the left side of the figure are coarsened, and the polishing means A (20 arranged on the right side of the figure). ) Of the brush bristle material A (21), the two-stage polishing can be performed after the grinding by the grinding means A (14). In addition, if the unevenness generated by the grinding process is too large and it is difficult to smooth the unevenness with the processing capability of the polishing means A (20), etc. The particle sizes of the abrasive grains contained in the brush bristle material A (21) of the means A (20) can be made substantially the same.
Although not shown, in the grinding / polishing apparatus (6) for grinding and polishing the cylindrical workpiece (W), at least either of the grinding means B (20) and the polishing means B (20) is similarly used. A plurality of these can be connected.

  The specifications of the mounting portions of the grinding means A (14) and the polishing means B (20) or the grinding means B (24) and the polishing means B (30) that are detachable from the grinding / polishing apparatus (6) are made common. So that you can exchange them. Thus, for example, in the case of a grinding / polishing apparatus (6) as shown in FIGS. 21 and 22, a grinding apparatus (1) provided with two pairs of grinding means A (14) (grinding means B (24)), Or it can be set as the polisher (2) provided with two pairs of grinding | polishing means A (20) (polishing means B (30)). By making the grain size of the abrasive grains constituting each abrasive grain layer or the grain size of the abrasive grains contained in each brush bristle material substantially the same, the processing time can be shortened. Further, by making the grain size of the abrasive grains on the left side of the figure coarse and making the grain size of the abrasive grains on the right side of the figure fine, two-stage grinding or polishing can be performed. For example, in the case of a grinding / polishing apparatus (6) as shown in FIG. 23, a grinding apparatus (1) provided with three pairs of grinding means A (14) (grinding means B (24)), or two pairs of grinding means (14). A polishing apparatus (2) provided with polishing means A (20) (polishing means B (30)) can be obtained. Alternatively, by changing the polishing means A (20) (polishing means B (30)) located in the center in the left-right direction in the figure to the grinding means (14) (grinding means B (24)), two-stage grinding is performed. After performing, polishing processing can be performed.

  24 shows a grinding apparatus (1) shown in FIG. 1, a polishing apparatus (2) shown in FIG. 2, a grinding / polishing apparatus (6) shown in FIG. 21, and a grinding / polishing apparatus (6) shown in FIG. An unprocessed workpiece (W) loading device (3), a processed workpiece (W) unloading device (4), the loading device (3), a grinding device (1), and a polishing device. An operating arm (51) that swings between the devices (2) and the unloading device (4), and a gripping part that is attached to the tip of the operating arm (51) and grips the workpiece (W) ( 52) is a layout diagram showing the layout with the transfer device (5). The control means (not shown) includes initial setting items that have been input before the start of processing, and measurement data transmitted from the measurement means (18) provided in the grinding device (1), polishing device (2), and grinding / polishing device (6). A function of outputting an operation signal to each means of the grinding device (1), polishing device (2) and grinding / polishing device (6) by performing arithmetic processing based on the signal, and turning operation of the transfer device (5) And a function of controlling a gripping operation for gripping the workpiece (W).

  The combination of the grinding device (1), the grinding device (2), and the grinding / polishing device (6) can be appropriately selected according to the properties of the workpiece (W) and the required processing accuracy. For example, in FIG. 24A, two grinding / polishing apparatuses (6) shown in FIG. 21 are arranged, and processing of the side surface portion F and processing of the corner portion C are performed in processing of the prismatic workpiece (W). Each was performed with one grinding / processing apparatus (6). As an example where the demand for the surface roughness of the corner C is not high, in FIG. 24B, one grinding / polishing device (6) shown in FIG. 21 and one grinding device (1) shown in FIG. Then, after processing the side surface portion F with the grinding / polishing device (6), the corner portion C was ground with the grinding device (1). In addition, as an example in which the required processing cannot be performed in the grinding / polishing apparatus (6) that needs to transfer the workpiece (W) at the same speed in the corner processing, FIG. As shown, after each of the grinding / polishing apparatus (6), the grinding apparatus (1), and the polishing apparatus (2) are arranged and the side surface portion F is processed by the grinding / polishing apparatus (6), The corner C was processed in the order of grinding by the grinding device (1) and polishing by the polishing device (2).

  The operation method (grip method, measurement method, intermittent rotation or continuous rotation, processing method, etc.) of the workpiece (W) by the grinding / polishing device (6) not specifically described is the grinding device (1) and the polishing device. It is the same as (2), and refer to the above for the specific operation and operation method.

The main symbols used in this specification and the drawings are summarized below.
DESCRIPTION OF SYMBOLS 1 Grinding apparatus 2 Polishing apparatus 3 Carry-in apparatus 4 Carry-out apparatus 5 Transfer apparatus 6 Grinding / polishing apparatus 11 Base 12 Gripping means 13 Clamp shaft 14 Grinding means A
15 Grinding body A
15a Abrasive layer A
15b Base plate 16 Rotating disc 17 Rotating shaft 18 Measuring means 18A Measuring tool A
18B Measuring tool B
19 Moving means 20 Polishing means A
21 Brush hair material A
22 Rotating disc 23 Rotating shaft 24 Grinding means B
25 Abrasive layer B
26 Rotating cylinder 27 Rotating shaft 30 Polishing means B
31 Brush hair material B
32 Rotating cylinder 33 Rotating shaft 34 Pressing tool 51 Actuating arm 52 Gripping part W Work piece F Side face part C Corner part B Body part

Claims (13)

A grinding and polishing system for grinding and polishing a columnar workpiece made of a hard and brittle material for manufacturing a wafer by slicing:
A grinding apparatus that grinds a surface layer portion of a workpiece with a constant cutting amount, removes impurities in the surface layer portion of the workpiece and distortion in a column axis direction, and makes a cross-sectional dimension a desired dimension. A grinding device having measuring means for measuring the dimensions of the object;
A polishing apparatus for polishing a surface layer portion of a workpiece after the grinding with a constant pressing force, removing microcracks in the surface layer portion of the workpiece, and reducing the surface roughness. A polishing apparatus having measuring means for measuring the dimensions of
The dimensions of the workpiece measured by the measuring means provided in the grinding apparatus and the measuring means provided in the polishing apparatus are calculated, and according to the result of the calculation, the operation signal of the grinding apparatus and the polishing apparatus Control means for outputting an actuation signal;
A carry-in device for carrying a workpiece before grinding / polishing into the grinding / polishing system;
An unloading device for unloading the workpiece that has been ground and polished from the grinding and polishing system;
A working arm that moves the workpiece between the carry-in device, grinding device, polishing device, and carry-out device, and a predetermined side that is attached to the tip of the working arm so that the side on which the workpiece is machined can be changed. A transfer device having a gripper rotating at an angle of
Grinding and polishing system equipped with A grinding and polishing system for grinding and polishing a columnar workpiece made of a hard and brittle material for manufacturing a wafer by slicing:
Measuring means provided in a grinding / polishing apparatus for measuring the dimensions of the workpiece;
Grinding means for grinding a surface layer portion of the work piece with a constant cutting amount, removing impurities in the surface layer portion of the work piece and distortion in a column axis direction, and making a cross-sectional dimension a desired dimension;
Polishing means for polishing the surface layer portion of the workpiece after grinding with a constant pressing force to remove microcracks in the surface layer portion of the workpiece and miniaturizing the surface roughness;
Control means for calculating a dimension of the workpiece measured by the measuring means and outputting an operation signal of the grinding means and an operation signal of the polishing means according to the result of the calculation;
Comprising at least one grinding / polishing apparatus comprising:
A carry-in device for carrying a workpiece before grinding / polishing into the grinding / polishing system;
An unloading device for unloading the workpiece that has been ground and polished from the grinding and polishing system;
An operating arm that moves the workpiece between the carry-in device, the grinding / polishing device, the grinding device or the polishing device, and the carry-out device, and a side surface that is attached to the tip of the working arm and that processes the workpiece. A transfer device having a gripper that rotates at a predetermined angle so that it can be changed ;
A grinding / polishing system comprising: A grinding and polishing system for grinding and polishing a columnar workpiece made of a hard and brittle material for manufacturing a wafer by slicing:
A grinding apparatus that grinds a surface layer portion of a workpiece with a constant cutting amount, removes impurities in the surface layer portion of the workpiece and distortion in a column axis direction, and makes a cross-sectional dimension a desired dimension. A grinding apparatus having a measuring means provided in a grinding apparatus for measuring a dimension of a workpiece, and a surface layer portion of the workpiece after the grinding is polished with a constant pressing force, and a microcrack in the surface layer portion of the workpiece A polishing apparatus that removes the surface roughness and refines the surface roughness, and has at least one of a polishing apparatus having a measuring means provided in the polishing apparatus that measures the dimension of the workpiece;
The grinding / polishing system according to claim 2, comprising: The grinding device is
A base on which the work piece is placed horizontally with its column axis horizontally movable;
A workpiece placed on the base is moved forward and backward in a direction perpendicular to the column axis of the workpiece to position the workpiece at the center of the base and a shaft core is processed. Gripping means for gripping both ends of the workpiece as the direction of the column axis of the workpiece, the clamping shaft being capable of rotating the workpiece about its axis;
An abrasive layer formed by bonding abrasive grains having a grain size of F90 to F220 (JISR6001: 1998) for coarse grinding or # 240 to # 500 (JISR6001: 1998) for precision grinding is disc-shaped or annular. A grindstone fixed to a base plate, a grindstone fixed to a rotating disk, or a grindstone in which the abrasive grain layer is formed in a disk shape or an annular shape, and a grindstone fixed to a rotating disk, A grinding wheel is detachably connected to a rotational drive source, and the grinding means presses the abrasive layer against the workpiece to rotate.
Moving means for moving one of the gripping means and the grinding means in the column axis direction of the workpiece at least a distance corresponding to the length of the workpiece;
The grinding / polishing system according to claim 1, further comprising: The polishing apparatus is
A base on which the work piece is placed horizontally with its column axis horizontally movable;
A workpiece placed on the base is moved forward and backward in a direction perpendicular to the column axis of the workpiece to position the workpiece at the center of the base and a shaft core is processed. A clamping shaft that grips both ends of the workpiece as the direction of the column axis of the workpiece, and the clamping shaft is capable of rotating the workpiece around its axis,
A polishing brush having a rotating disk and arranged by bundling a brush bristle material containing abrasive grains on a disk-like surface, wherein the polishing brush is detachably connected to a rotating mechanism, and the brush bristle material is attached to the covered brush material. Polishing means pressed against the workpiece and rotated;
Moving means for moving one of the gripping means and the polishing means in the column axis direction of the workpiece at least a distance corresponding to the length of the workpiece;
A grinding / polishing system for hard and brittle materials according to claim 1 or 3. The grinding and polishing apparatus is
A base on which the work piece is placed horizontally with its column axis horizontally movable;
A workpiece placed on the base is moved forward and backward in a direction perpendicular to the column axis of the workpiece to position the workpiece at the center of the base and a shaft core is processed. A clamping shaft that grips both ends of the workpiece as the direction of the column axis of the workpiece, and the clamping shaft is capable of rotating the workpiece around its axis,
Moving means for moving one of the gripping means, the grinding means, and the polishing means in the column axis direction of the workpiece at least by a distance corresponding to the length of the workpiece;
The grinding means combines abrasive grains having a grain size of F90 to F220 (JISR6001: 1998) for rough grinding or # 240 to # 500 (JISR6001: 1998) for precision grinding to form an abrasive layer. A grindstone in which a grinding body fixed to a disk-shaped or annular base plate is fixed to a rotating disk, or a grinding body in which the abrasive grain layer is formed in a disk shape or an annular shape is fixed to a rotating disk. The grindstone is detachably connected to a rotational drive source, and the abrasive layer is pressed against the workpiece to rotate,
The polishing means has a rotating disk in which a brush bristle material containing abrasive grains is bundled and arranged on a disk-shaped surface, and the brush bristle material is pressed against the workpiece to rotate, and is detachable. A polishing brush held on the brush, and the brush polishing is rotated.
The grinding / polishing system for hard and brittle materials according to claim 2. The particle size of the abrasive grains contained in the brush bristle material of the polishing means is two or more, and the particle size is # 240 to # 500 (JISR6001: 1998) for rough polishing, or # 800 to ## for precision polishing. 1200 (JIS R6001: 1998), a brush bristle material containing abrasive grains having a coarse particle size is disposed near the rotation center of the rotating disk, and a brush bristle material containing abrasive grains having a fine particle size is used for the abrasive grains having a coarse particle size. Arranged around the area where the brush bristle material containing is disposed;
The grinding / polishing system for hard and brittle materials according to claim 5 or 6. The grinding apparatus includes an abrasive layer in which abrasive grains having a particle size of F90 to F220 (JISR6001: 1998) for rough grinding or # 240 to # 500 (JISR6001: 1998) for precision grinding are combined. A grindstone in which a grinding body fixed to a disk-like or annular base plate is fixed to a rotating disk, or a grinding stone in which the abrasive layer formed in the disk shape or annular shape is fixed to a rotating disk. The grindstone is detachably connected to a rotational drive source, and includes grinding means for rotating the abrasive grain layer against the workpiece,
The polishing apparatus is a polishing brush having a rotating disk and arranged by bundling a brush bristle material containing abrasive grains on a disk-shaped surface, the polishing brush being detachably connected to a rotating mechanism, and the brush A polishing means is provided to press and rotate the hair material against the workpiece,
The grinding means of the grinding apparatus and the polishing means of the polishing apparatus can be interchanged. By exchanging the grinding means and the polishing means, the grinding apparatus can be used as a polishing apparatus, or the polishing apparatus can be used as a grinding apparatus. Is characterized by:
A grinding / polishing system for hard and brittle materials according to claim 1 or 3. The grinding means and the polishing means of the grinding / polishing apparatus can be interchanged;
The grinding / polishing system for hard and brittle materials according to claim 2. Measuring means provided in the grinding apparatus or polishing apparatus,
A pair of reference surfaces formed with a known reference interval dimension in a horizontal direction perpendicular to the column axis of the workpiece, and formed with a known reference interval dimension in a vertical direction perpendicular to the column axis. A reference block having a pair of reference surfaces;
A measuring tool that measures the distance between the reference surfaces on both sides of the reference block and the grinding / polishing parts on both sides of the workpiece, with the measurement direction as the horizontal direction,
A measuring tool for measuring the height position of the grinding / polishing portion on the reference surface on the upper surface of the reference block and the upper surface of the workpiece, wherein the measuring direction is the vertical direction;
A grinding / polishing system for hard and brittle materials according to claim 1 or 2. The control means is
The tip of each of the grinding means and the polishing means is brought into contact with a pair of reference surfaces of a reference block provided in the gripping means of the grinding apparatus and the polishing apparatus, and the cutting amount of each means of the grinding apparatus and the polishing apparatus is made A function to calculate the base point position where is zero,
The difference between the reference surfaces on both sides of the reference block and the processed parts on both sides of the workpiece is measured by a measuring tool provided in the measuring means of the grinding apparatus and the polishing apparatus, and before processing the processed part of the workpiece. And the function of calculating the cross-sectional dimension after processing,
A function of performing arithmetic processing for the grinding device and the polishing device to center and grip the workpiece;
An initial setting item input before the start of processing and a measurement signal output from a measuring tool of a measuring unit provided in each of the grinding apparatus and the polishing apparatus are subjected to arithmetic processing, and each means of the grinding apparatus and the polishing apparatus is processed. A function to output an operation signal;
The grinding / polishing system for hard and brittle materials according to claim 10. The control means is
The tip of the grinding means or the polishing means is brought into contact with a pair of reference surfaces of a reference block provided in the gripping means of the grinding / polishing apparatus, so that the cutting amount of the grinding means or the polishing means becomes zero. A function to calculate the base point position;
The difference between the reference surface on both sides of the reference block and the processing part on both sides of the workpiece is measured by a measuring tool provided in the measuring means of the grinding / polishing apparatus, and before and after the processing of the processing part of the workpiece The ability to compute the subsequent cross-sectional dimensions;
A function for the grinding / polishing apparatus to perform arithmetic processing for centering and gripping the workpiece;
A function of performing an arithmetic processing on the initial setting items input before the start of processing and a measurement signal output by the measuring tool of the measuring unit, and outputting an operation signal to the grinding unit and the polishing unit;
The grinding / polishing system for hard and brittle materials according to claim 2. Using the grinding / polishing system for hard and brittle materials according to any one of claims 1 to 3,
A grinding / polishing method for a hard and brittle material, characterized in that the grinding process is performed by the grinding apparatus or the grinding means and then the grinding process is performed by the polishing apparatus or the grinding means.

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