CN112207668A - Chip angle grinding device for manufacturing semiconductor device and using method thereof - Google Patents
Chip angle grinding device for manufacturing semiconductor device and using method thereof Download PDFInfo
- Publication number
- CN112207668A CN112207668A CN202011027399.4A CN202011027399A CN112207668A CN 112207668 A CN112207668 A CN 112207668A CN 202011027399 A CN202011027399 A CN 202011027399A CN 112207668 A CN112207668 A CN 112207668A
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- China
- Prior art keywords
- chip
- rack
- grinding
- shaft
- chuck
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
- B24B55/03—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant designed as a complete equipment for feeding or clarifying coolant
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
The invention discloses a chip angle grinding device for manufacturing a semiconductor device and a using method thereof. According to the invention, through the arrangement of movable grinding, the chips can be continuously dismounted and mounted for angle grinding processing, so that the production efficiency is improved; the uniformity of the circumferential grinding angle of the chip is ensured by the arrangement of rotary movement; through the setting of tooth meshing rotation, guaranteed rotatory even and stable of chip.
Description
Technical Field
The invention relates to the technical field of semiconductor device manufacturing, in particular to a chip angle grinding device for semiconductor device manufacturing and a using method thereof.
Background
The patent with the publication number of CN201841449U discloses a silicon controlled chip angle grinder, wherein an output shaft of a motor is in transmission connection with a belt pulley through a transmission device, and the belt pulley is in transmission connection with 2 or more than 2 grinding disks; an output shaft of the motor is connected with a cross rod through a crank connecting rod mechanism, 2 or more than 2 push-pull rods are symmetrically arranged on the cross rod, a chuck for clamping a chip is arranged at the end of each push-pull rod, the chuck is arranged corresponding to the grinding disc, the crank connecting rod mechanism comprises an eccentric moment disc, a rocker arm is connected with the eccentric moment disc through a connecting rod, the upper end of the rocker arm is provided with the cross rod, the cross rod is provided with the push-pull rod, the belt disc is an N-groove belt disc, N is more than or equal to 2, a speed changer is arranged on an output shaft of the motor, the crank connecting rod mechanism is connected with the output shaft of the motor through the speed changer, the belt disc is connected with the output shaft of the motor through the speed changer, M belts are arranged in; the M belts, wherein M is greater than or equal to 2. The chip angle grinder is commonly used at present and has the following problems: 1. the chips cannot be continuously disassembled and assembled for angle grinding processing, so that the production efficiency is reduced; 2. the chip can not rotate and move, so that the uniformity of the circumferential grinding angle of the chip is ensured; 3. the rotation of the chip can not be realized through tooth meshing, so that the uniformity and the stability of the rotation of the chip are ensured.
Disclosure of Invention
The present invention is directed to a chip angle grinder for manufacturing a semiconductor device and a method for using the same.
The invention realizes the purpose through the following technical scheme:
a chip angle grinding device for manufacturing a semiconductor device comprises a rack device for supporting, wherein a clamping device for fixing a chip is installed on the rack device, a driving device for driving the chip to move is arranged behind the clamping device, a grinding device for grinding the chip angle is arranged below the clamping device, and a transfusion device for conveying grinding liquid is installed at the bottom of the rack device; the rack device comprises a rack body, wherein a track groove is formed in the front of the rack body, a rack is arranged in front of the track groove, a through groove is formed in the bottom of the rack body, and 2 fixing plates are symmetrically arranged at the top of the rack body; the clamping device comprises a sliding block, a supporting shaft is arranged in the middle of the sliding block, a gear is arranged in front of the supporting shaft, a chuck is arranged behind the supporting shaft, 2 hand grooves are symmetrically arranged on the chuck, and a chip body is arranged in the chuck; the driving device comprises 2 first shaft rollers which are symmetrically arranged, a conveying belt is arranged between the first shaft rollers, and a first motor is arranged on the first shaft rollers; the grinding device comprises a supporting plate, wherein 2 second shaft rollers are symmetrically arranged on the supporting plate, a grinding belt is installed between the second shaft rollers, and a second motor is installed below the second shaft rollers.
Preferably: the infusion device comprises a liquid storage tank, a diaphragm pump is mounted at the back of the liquid storage tank, a transverse pipe is arranged above the diaphragm pump, a plurality of spray heads are uniformly distributed below the transverse pipe, a rigid straight pipe is mounted between the diaphragm pump and the transverse pipe, and a sealing plug is arranged on one side of the diaphragm pump.
According to the arrangement, the diaphragm pump extracts the grinding fluid in the liquid storage tank, and the grinding fluid is conveyed to the transverse pipe through the hard straight pipe and is sprayed out from the spray head.
Preferably: the infusion device comprises a liquid storage tank, a diaphragm pump is mounted at the back of the liquid storage tank, a transverse pipe is arranged above the diaphragm pump, a plurality of spray heads are uniformly distributed below the transverse pipe, and a flexible rubber pipe is mounted between the diaphragm pump and the transverse pipe.
So set up, the diaphragm pump extracts the grinding fluid in the liquid storage tank to pass through flexible glue pipe is transported to violently manage, follow the shower nozzle blowout.
Preferably: the rack is connected with the rack body through bolts, and the fixed plate is welded with the rack body.
So set up, bolted connection is convenient for the dismouting with trading the rack, the welding has guaranteed the fixed plate is firm reliable.
Preferably: the slider with frame body sliding connection, the back shaft with the slider bearing is connected, the gear with back shaft bolted connection, the chuck with the back shaft welding is in the same place, the chip body with the chuck plug is connected.
With the arrangement, the sliding connection is convenient for the sliding block to flexibly move, the bearing connection ensures that the supporting shaft is flexibly rotated, the bolt connection is convenient for dismounting the gear for maintenance, the welding ensures that the chuck is stable and reliable, and the plug connection is convenient for dismounting and replacing the chip body.
Preferably: the first motor is connected with the frame body through bolts, and the first shaft roller is connected with the frame body through bearings.
So set up, bolted connection is convenient for dismouting maintenance first motor, bearing connection has guaranteed first roller is nimble rotatory.
Preferably: the backup pad with frame body bolted connection, the second motor with backup pad bolted connection, the second axis roller with the backup pad bearing is connected.
So set up, bolted connection is convenient for the dismouting the backup pad with the second motor is maintained, and the bearing is connected and has been guaranteed the flexible rotation of second arbor roller.
Preferably: the liquid storage tank with the frame body bolted connection, violently manage with fixed plate bolted connection, the shower nozzle with violently manage sealed threaded connection, hard straight tube respectively with the diaphragm pump with violently manage sealed threaded connection, the sealing plug with the liquid storage tank plug is connected.
So set up, be convenient for plug the sealing plug discharge the grinding fluid of liquid reserve tank.
Preferably: the liquid reserve tank with frame body bolted connection, violently manage with fixed plate bolted connection, the shower nozzle with violently manage sealed threaded connection, the flexible glue pipe respectively with the diaphragm pump with violently manage the clamp connection.
So set up, be convenient for plug the flexible glue pipe discharge the grinding fluid of liquid reserve tank.
The invention also provides a use method of the chip angle grinding device manufactured by the semiconductor device, which comprises the following steps:
a. inserting the chip body into the chuck, inserting the slider into the rail groove of the frame body, and engaging the gear with the rack;
b. the first motor drives the first shaft roller to rotate to drive the conveying belt to move, the conveying belt presses the chip body to move along the track groove under the fixation of the chuck and the support of the sliding block, and meanwhile, the gear drives the chuck and the chip body to rotate and advance through the support shaft under the meshing of the rack;
c. the supporting plate supports the second motor to drive the second shaft roller to rotate so as to drive the grinding belt penetrating through the through groove to move reversely, the circumferential corners of the chip bodies which move in a rotating mode are ground for forming, and the former chip body is inserted into the second chuck to install the rack body while the former chip body is subjected to corner grinding, so that continuous processing is guaranteed;
d. the infusion device sprays the grinding fluid on the chip body from the upper part of the rack body, and the grinding fluid flows back to the infusion device through the through groove at the bottom of the rack body to form circulation.
Compared with the prior art, the invention has the following beneficial effects:
1. by the arrangement of movable grinding, the chips can be continuously disassembled and assembled for angle grinding, so that the production efficiency is improved;
2. the uniformity of the circumferential grinding angle of the chip is ensured by the arrangement of rotary movement;
3. through the setting of tooth meshing rotation, guaranteed rotatory even and stable of chip.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a die angle grinder for manufacturing a semiconductor device according to the present invention;
FIG. 2 is a right side view of a die angle grinder assembly for semiconductor device fabrication in accordance with the present invention;
FIG. 3 is a schematic view of a frame assembly of a die angle grinder assembly for semiconductor device fabrication according to the present invention;
FIG. 4 is a schematic view of a clamping device of a chip angle grinder for manufacturing a semiconductor device according to the present invention;
FIG. 5 is a schematic view of a driving apparatus of a die angle grinder for manufacturing a semiconductor device according to the present invention;
FIG. 6 is a schematic view of a grinding apparatus of a die angle grinder for manufacturing a semiconductor device according to the present invention;
FIG. 7 is a rear perspective view of a fluid infusion device according to embodiment 1 of the apparatus for grinding a chip corner in semiconductor device fabrication of the present invention;
FIG. 8 is a rear perspective view of a liquid feeding device according to embodiment 2 of the present invention.
The reference numerals are explained below:
1. a rack device; 101. a frame body; 102. a track groove; 103. a through groove; 104. a rack; 105. a fixing plate; 2. a clamping device; 201. a slider; 202. a support shaft; 203. a gear; 204. a chuck; 205. a hand groove; 206. a chip body; 3. a drive device; 301. a first motor; 302. a first beam barrel; 303. a conveyor belt; 4. a grinding device; 401. a support plate; 402. a second motor; 403. a second shaft roller; 404. grinding the belt; 5. a fluid infusion device; 501. a liquid storage tank; 502. a diaphragm pump; 503. a hard straight pipe; 504. a transverse tube; 505. a spray head; 506. a sealing plug; 507. a soft rubber tube.
Detailed Description
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.
The invention will be further described with reference to the accompanying drawings in which:
example 1
As shown in fig. 1-7, a chip angle grinding device for manufacturing a semiconductor device comprises a frame device 1 for supporting, a clamping device 2 for fixing a chip is mounted on the frame device 1, a driving device 3 for driving the chip to move is arranged behind the clamping device 2, a grinding device 4 for grinding the chip is arranged below the clamping device 2, and a liquid conveying device 5 for conveying grinding liquid is mounted at the bottom of the frame device 1; the rack device 1 comprises a rack body 101, wherein a track groove 102 is arranged in front of the rack body 101, a rack 104 is arranged in front of the track groove 102, a through groove 103 is arranged at the bottom of the rack body 101, and 2 fixing plates 105 are symmetrically arranged at the top of the rack body 101; the clamping device 2 comprises a sliding block 201, a supporting shaft 202 is arranged in the middle of the sliding block 201, a gear 203 is arranged in front of the supporting shaft 202, a chuck 204 is arranged behind the supporting shaft 202, 2 hand grooves 205 are symmetrically arranged on the chuck 204, and a chip body 206 is arranged in the chuck 204; the driving device 3 comprises 2 first shaft rollers 302 which are symmetrically arranged, a conveying belt 303 is arranged between the first shaft rollers 302, and a first motor 301 is arranged on the first shaft rollers 302; the grinding device 4 comprises a supporting plate 401, 2 second shaft rollers 403 are symmetrically arranged on the supporting plate 401, a grinding belt 404 is arranged between the second shaft rollers 403, and a second motor 402 is arranged below the second shaft rollers 403.
Preferably: the transfusion device 5 comprises a liquid storage tank 501, a diaphragm pump 502 is arranged behind the liquid storage tank 501, a transverse pipe 504 is arranged above the diaphragm pump 502, a plurality of spray heads 505 are uniformly distributed below the transverse pipe 504, a hard straight pipe 503 is arranged between the diaphragm pump 502 and the transverse pipe 504, and a sealing plug 506 is arranged on one side of the diaphragm pump 502; the rack 104 is connected with the frame body 101 through bolts, and the fixing plate 105 is welded with the frame body 101; the sliding block 201 is connected with the frame body 101 in a sliding mode, the supporting shaft 202 is connected with the sliding block 201 in a bearing mode, the gear 203 is connected with the supporting shaft 202 through a bolt, the chuck 204 is welded with the supporting shaft 202, and the chip body 206 is connected with the chuck 204 in a plugging mode; the first motor 301 is connected with the frame body 101 through bolts, and the first shaft roller 302 is connected with the frame body 101 through bearings; the supporting plate 401 is connected with the frame body 101 through bolts, the second motor 402 is connected with the supporting plate 401 through bolts, and the second shaft roller 403 is connected with the supporting plate 401 through bearings; liquid storage tank 501 and rack body 101 bolted connection, violently manage 504 and fixed plate 105 bolted connection, shower nozzle 505 and violently manage 504 sealed threaded connection, hard straight pipe 503 respectively with diaphragm pump 502 with violently manage 504 sealed threaded connection, sealing plug 506 and liquid storage tank 501 plug connection.
Example 2
As shown in fig. 8, embodiment 2 differs from embodiment 1 in that: the transfusion device 5 comprises a liquid storage tank 501, a diaphragm pump 502 is arranged behind the liquid storage tank 501, a transverse pipe 504 is arranged above the diaphragm pump 502, a plurality of spray heads 505 are uniformly distributed below the transverse pipe 504, and a flexible rubber pipe 507 is arranged between the diaphragm pump 502 and the transverse pipe 504; liquid reserve tank 501 and rack body 101 bolted connection, violently manage 504 and fixed plate 105 bolted connection, shower nozzle 505 and violently manage 504 sealed threaded connection, flexible glue pipe 507 respectively with diaphragm pump 502 with violently manage 504 clamp connection.
The invention also provides a use method of the chip angle grinding device manufactured by the semiconductor device, which comprises the following steps:
a. inserting the chip body 206 into the chuck 204, inserting the slider 201 into the rail groove 102 of the housing body 101, and engaging the gear 203 with the rack 104;
b. the first motor 301 drives the first shaft roller 302 to rotate to drive the conveying belt 303 to move, the conveying belt 303 presses the chip body 206 to move along the track groove 102 under the fixing of the chuck 204 and the supporting of the sliding block 201, and simultaneously the gear 203 drives the chuck 204 and the chip body 206 to rotationally advance through the supporting shaft 202 under the meshing of the rack 104;
c. the supporting plate 401 supports the second motor 402 to drive the second shaft roller 403 to rotate and drive the grinding belt 404 penetrating through the through groove 103 to move reversely, the peripheral corners of the chip bodies 206 which move in a grinding and rotating mode are ground and formed, and when the former chip body 206 is subjected to corner grinding, the latter chip body 206 is inserted into the upper machine frame body 101 arranged in the second chuck 204, so that continuous processing is guaranteed;
d. the infusion device 5 sprays the grinding fluid on the chip body 206 from the upper part of the frame body 101, and the grinding fluid flows back to the infusion device 5 through the through groove 103 at the bottom of the frame body 101 to form circulation.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed.
Claims (10)
1. A chip angle grinding device for manufacturing a semiconductor device is characterized in that: the grinding device comprises a rack device for supporting, wherein a clamping device for fixing a chip is arranged on the rack device, a driving device for driving the chip to move is arranged behind the clamping device, a grinding device for grinding the chip is arranged below the clamping device, and a transfusion device for conveying grinding liquid is arranged at the bottom of the rack device;
the rack device comprises a rack body, wherein a track groove is formed in the front of the rack body, a rack is arranged in front of the track groove, a through groove is formed in the bottom of the rack body, and 2 fixing plates are symmetrically arranged at the top of the rack body;
the clamping device comprises a sliding block, a supporting shaft is arranged in the middle of the sliding block, a gear is arranged in front of the supporting shaft, a chuck is arranged behind the supporting shaft, 2 hand grooves are symmetrically arranged on the chuck, and a chip body is arranged in the chuck;
the driving device comprises 2 first shaft rollers which are symmetrically arranged, a conveying belt is arranged between the first shaft rollers, and a first motor is arranged on the first shaft rollers;
the grinding device comprises a supporting plate, wherein 2 second shaft rollers are symmetrically arranged on the supporting plate, a grinding belt is installed between the second shaft rollers, and a second motor is installed below the second shaft rollers.
2. The apparatus of claim 1, wherein: the infusion device comprises a liquid storage tank, a diaphragm pump is mounted at the back of the liquid storage tank, a transverse pipe is arranged above the diaphragm pump, a plurality of spray heads are uniformly distributed below the transverse pipe, a rigid straight pipe is mounted between the diaphragm pump and the transverse pipe, and a sealing plug is arranged on one side of the diaphragm pump.
3. The apparatus of claim 1, wherein: the infusion device comprises a liquid storage tank, a diaphragm pump is mounted at the back of the liquid storage tank, a transverse pipe is arranged above the diaphragm pump, a plurality of spray heads are uniformly distributed below the transverse pipe, and a flexible rubber pipe is mounted between the diaphragm pump and the transverse pipe.
4. The apparatus of claim 1, wherein: the rack is connected with the rack body through bolts, and the fixed plate is welded with the rack body.
5. The apparatus of claim 1, wherein: the slider with frame body sliding connection, the back shaft with the slider bearing is connected, the gear with back shaft bolted connection, the chuck with the back shaft welding is in the same place, the chip body with the chuck plug is connected.
6. The apparatus of claim 1, wherein: the first motor is connected with the frame body through bolts, and the first shaft roller is connected with the frame body through bearings.
7. The apparatus of claim 1, wherein: the backup pad with frame body bolted connection, the second motor with backup pad bolted connection, the second axis roller with the backup pad bearing is connected.
8. The apparatus of claim 2, wherein: the liquid storage tank with the frame body bolted connection, violently manage with fixed plate bolted connection, the shower nozzle with violently manage sealed threaded connection, hard straight tube respectively with the diaphragm pump with violently manage sealed threaded connection, the sealing plug with the liquid storage tank plug is connected.
9. The apparatus of claim 3, wherein: the liquid reserve tank with frame body bolted connection, violently manage with fixed plate bolted connection, the shower nozzle with violently manage sealed threaded connection, the flexible glue pipe respectively with the diaphragm pump with violently manage the clamp connection.
10. The use method of the chip angle grinding device manufactured by the semiconductor device according to any one of claims 1 to 9, characterized in that the specific use method comprises the following steps:
a. inserting the chip body into the chuck, inserting the slider into the rail groove of the frame body, and engaging the gear with the rack;
b. the first motor drives the first shaft roller to rotate to drive the conveying belt to move, the conveying belt presses the chip body to move along the track groove under the fixation of the chuck and the support of the sliding block, and meanwhile, the gear drives the chuck and the chip body to rotate and advance through the support shaft under the meshing of the rack;
c. the supporting plate supports the second motor to drive the second shaft roller to rotate so as to drive the grinding belt penetrating through the through groove to move reversely, the circumferential corners of the chip bodies which move in a rotating mode are ground for forming, and the former chip body is inserted into the second chuck to install the rack body while the former chip body is subjected to corner grinding, so that continuous processing is guaranteed;
the infusion device sprays the grinding fluid on the chip body from the upper part of the rack body, and the grinding fluid flows back to the infusion device through the through groove at the bottom of the rack body to form circulation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011027399.4A CN112207668A (en) | 2020-09-26 | 2020-09-26 | Chip angle grinding device for manufacturing semiconductor device and using method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011027399.4A CN112207668A (en) | 2020-09-26 | 2020-09-26 | Chip angle grinding device for manufacturing semiconductor device and using method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112207668A true CN112207668A (en) | 2021-01-12 |
Family
ID=74051172
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011027399.4A Withdrawn CN112207668A (en) | 2020-09-26 | 2020-09-26 | Chip angle grinding device for manufacturing semiconductor device and using method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112207668A (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60242954A (en) * | 1984-05-17 | 1985-12-02 | Matsushita Electric Ind Co Ltd | Bevelling method |
| CN1923462A (en) * | 2006-09-15 | 2007-03-07 | 清华大学 | Glass angle lap machine |
| CN201841449U (en) * | 2010-11-13 | 2011-05-25 | 襄樊市仪骏波微电子设备有限公司 | Angle grinder for silicon controlled chips |
| CN103561908A (en) * | 2011-09-15 | 2014-02-05 | 新东工业株式会社 | System for grinding/polishing hard and brittle materials, and grinding/polishing method |
| CN205309945U (en) * | 2015-12-31 | 2016-06-15 | 西南交通大学 | Mechanical product abrasive machining processing system |
| CN108311957A (en) * | 2016-06-07 | 2018-07-24 | 嘉兴福可吉精密机械有限公司 | The outer ring grinding attachment of hub bearing |
| CN208100057U (en) * | 2018-05-02 | 2018-11-16 | 上海日进机床有限公司 | Silicon rod processing machine |
| CN108818206A (en) * | 2018-08-28 | 2018-11-16 | 青岛蓝光晶科新材料有限公司 | A kind of silicon target facing attachment |
| CN110328612A (en) * | 2019-08-19 | 2019-10-15 | 丹阳河工工具有限公司 | A kind of screw tap grinding attachment |
| CN209902851U (en) * | 2019-04-26 | 2020-01-07 | 抚顺高科电瓷电气制造有限公司 | Porcelain piece rotating chamfering machine convenient to fix |
-
2020
- 2020-09-26 CN CN202011027399.4A patent/CN112207668A/en not_active Withdrawn
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60242954A (en) * | 1984-05-17 | 1985-12-02 | Matsushita Electric Ind Co Ltd | Bevelling method |
| CN1923462A (en) * | 2006-09-15 | 2007-03-07 | 清华大学 | Glass angle lap machine |
| CN201841449U (en) * | 2010-11-13 | 2011-05-25 | 襄樊市仪骏波微电子设备有限公司 | Angle grinder for silicon controlled chips |
| CN103561908A (en) * | 2011-09-15 | 2014-02-05 | 新东工业株式会社 | System for grinding/polishing hard and brittle materials, and grinding/polishing method |
| CN205309945U (en) * | 2015-12-31 | 2016-06-15 | 西南交通大学 | Mechanical product abrasive machining processing system |
| CN108311957A (en) * | 2016-06-07 | 2018-07-24 | 嘉兴福可吉精密机械有限公司 | The outer ring grinding attachment of hub bearing |
| CN208100057U (en) * | 2018-05-02 | 2018-11-16 | 上海日进机床有限公司 | Silicon rod processing machine |
| CN108818206A (en) * | 2018-08-28 | 2018-11-16 | 青岛蓝光晶科新材料有限公司 | A kind of silicon target facing attachment |
| CN209902851U (en) * | 2019-04-26 | 2020-01-07 | 抚顺高科电瓷电气制造有限公司 | Porcelain piece rotating chamfering machine convenient to fix |
| CN110328612A (en) * | 2019-08-19 | 2019-10-15 | 丹阳河工工具有限公司 | A kind of screw tap grinding attachment |
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Application publication date: 20210112 |