CN108527144B - Substrate grinding device and its grinding method - Google Patents
Substrate grinding device and its grinding method Download PDFInfo
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- CN108527144B CN108527144B CN201810263023.XA CN201810263023A CN108527144B CN 108527144 B CN108527144 B CN 108527144B CN 201810263023 A CN201810263023 A CN 201810263023A CN 108527144 B CN108527144 B CN 108527144B
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- grinding
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/006—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the speed
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
The present invention relates to a kind of substrate grinding devices.The device includes grind section and control unit；Grind section includes multiple grinding heads, there is each grinding head different default grinding altitude ranges to be ground with the protrusion to corresponding height, the grinding precision of higher-height grinding head is ground lower than the grinding precision for grinding a lower height of grinding head, and the grinding rate for grinding higher-height grinding head is greater than the grinding rate for grinding a lower height of grinding head；Control unit is connect with grind section, and control unit is used to receive protrusion real-time height during the grinding process, and highly controlling corresponding grinding head in real time and grind to protrusion according to protrusion.The invention further relates to a kind of control methods, this method comprises: receiving the real-time height of protrusion；Determine default grinding altitude range corresponding to real-time height；And corresponding grinding head is controlled according to default grinding altitude range, protrusion is started to grind.Aforesaid substrate grinding device and its control method, grinding efficiency is higher, and grinding effect is good.
Description
Technical field
The present invention relates to display panel recovery technique field, in particular to a kind of substrate grinding device and its grinding method.
Background technique
Field of flexible display is joined in by a spotlight of the Flexible Displays as AMOLED, more and more manufacturers.Flexible panel
Manufacture craft is relatively complicated, and in the manufacturing process of flexible panel, the surface of flexible panel can generate some foreign matter protrusions.
In order to avoid these protrusion further critical disadvantage is caused in follow-up process, generally use at present grinding recovery technique to protrusion into
Row grinding makes to grind rear projection height within the scope of preset standard.
Existing grinding technique first measures height of projection, then is ground, and carries out elevation carrection after grinding again.If after grinding
Height of projection within the scope of preset standard, then stop grinding.If height of projection still exceeds preset standard range, continue
Grinding.This grinding technique will repeatedly be ground, and grinding efficiency is low, and grinding precision is low, and grinding effect is bad.
Summary of the invention
Based on this, it is necessary to it is low for above-mentioned traditional grinding technique grinding efficiency, and grinding precision is low, grinding effect is not
Good problem provides a kind of substrate grinding device and its grinding method.
A kind of substrate grinding device, the protrusion on grinding base plate, the substrate grinding device includes grind section and control
Portion processed；The grind section includes multiple grinding heads, and each grinding head has different default grinding altitude ranges to corresponding
The protrusion of height is ground, and grinds the grinding precision of the higher-height grinding head lower than grinding a lower height of described grind
The grinding precision of bistrique, and the grinding rate for grinding the higher-height grinding head is greater than a lower height of grinding of grinding
The grinding rate of head；The control unit is connect with the grind section, and the control unit is for receiving the protrusion in process of lapping
In real-time height, and according to it is described protrusion it is real-time height control accordingly the grinding head protrusion is ground.
The grinding size for grinding higher-height grinding head in each grinding head in one of the embodiments, which is greater than, grinds
Grind the grinding size of a lower height of grinding head.
The shape of the grinding head is hemispherical in one of the embodiments, and the spherical surface of the grinding head is described in
Protrusion.
Substrate grinding device further includes measurement portion in one of the embodiments, and the measurement portion is described convex for measuring
The height risen, and outputting measurement value；The control unit is connect with the measurement portion, and the control unit receives the measured value, institute
It states control unit and controls the real-time height that the measurement portion carries out real-time measurement acquisition protrusion to the height of the protrusion.
Substrate grinding device further includes moving portion in one of the embodiments, and the moving portion and the grind section connect
It connects, the moving portion drives the grind section to be moved to grinding head position corresponding with the protrusion；The control unit with
The moving portion connection, the shifting for highly controlling the moving portion in real time for the protrusion that the control unit is measured according to the measurement portion
It is dynamic.
The control unit is currently ground for judging whether the real-time height of the protrusion belongs in one of the embodiments,
The default grinding altitude range of bistrique；The control unit belongs to the default grinding height model of current grinding head in the real-time height
It when enclosing, controls current grinding head and continues to grind, and be not belonging to the default grinding height model of current grinding head in the real-time height
It when enclosing, controls current grinding head and stops grinding, and controlling, there is the grinding head of corresponding default grinding altitude range to start to be ground
Mill.
Substrate grinding device further includes acquiring unit in one of the embodiments, and the acquiring unit is for obtaining institute
State the location information of the protrusion on substrate；The control unit is connect with the acquiring unit, and the control unit is according to the position
What information controlled the moving portion is moved to protrusion to be ground.
A kind of substrate grinding method grinds the protrusion on substrate for controlling the grind section including multiple grinding heads
There is different default grinding altitude ranges to be ground with the protrusion to corresponding height for mill, each grinding head, grinding height
The grinding precision of higher grinding head is ground higher-height described lower than the grinding precision for grinding a lower height of grinding head
The grinding rate of grinding head is greater than the grinding rate for grinding a lower height of grinding head；The method includes the steps:
Receive the real-time height of the protrusion；
Determine default grinding altitude range corresponding to the real-time height；And
Corresponding grinding head is controlled according to the default grinding altitude range to grind the protrusion.
It is described in one of the embodiments, that corresponding grinding head is controlled to described according to the default grinding altitude range
After the step of protrusion is ground further include:
Judge whether the real-time height of the protrusion belongs to the default grinding altitude range of current grinding head；
When the real-time height belongs to the default grinding altitude range of current grinding head, controls current grinding head and continue to grind
Mill；
When the real-time height is not belonging to the default grinding altitude range of current grinding head, controls current grinding head and stop
Grinding, and controlling, there is the grinding head of corresponding default grinding altitude range to start to be ground.
In one of the embodiments, after the step of real-time height for receiving the protrusion, described in the determination
Before the step of default grinding altitude range corresponding to real-time height, further includes:
Judge whether the real-time height is greater than preset standard value；
When the real-time height is less than or equal to the preset standard value, controls the grind section and be moved to next protrusion
Place；
When the real-time height be greater than the preset standard value, then execute pre- corresponding to the determination real-time height
If the step of grinding altitude range and its subsequent step.
Aforesaid substrate grinding device and grinding method grind the grinding precision of higher-height grinding head lower than grinding height
The grinding precision of lower grinding head, and the grinding rate for grinding higher-height grinding head is greater than a lower height of grinding of grinding
The grinding rate of head.Control unit is used to receive the real-time height of protrusion during the grinding process, and is controlled according to the real-time height of protrusion
Corresponding grinding head is made to grind protrusion.When protrusion is not ground, the height of raised opposing substrate is larger, only needs at this time
Guarantee that, to raised faster grinding, therefore, control unit controls the higher-height grinding head of grinding first and grinds to protrusion
Mill, grinding rate is larger, very fast to the grinding of protrusion.When protrusion is ground to certain height, because protruding apex is connected to each other
Nearly substrate needs to guarantee at this time the grinding precision of protrusion, and to guarantee the grinding effect of protrusion, therefore, control unit controls the grinding
Head stops grinding.Then, control unit control grinds a lower height of grinding head and continues to grind to protrusion, grinding precision compared with
It is high.In this way, substrate grinding device can switch between each grinding head according to the real-time height of protrusion, protrusion is carried out
From slow grinding is ground to fastly, from rough lapping to fine gtinding, that is, guarantees grinding rate, in turn ensure grinding precision, grinding efficiency
Higher, grinding effect is good.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the substrate grinding device of one embodiment of the invention；
Fig. 2 is the schematic diagram of the grind section of the substrate grinding device of an embodiment；
Fig. 3 is the flow diagram of the substrate grinding method in an embodiment；
Fig. 4 is the flow diagram of the substrate grinding method of another embodiment.
Specific embodiment
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, with reference to the accompanying drawing to the present invention
Specific embodiment be described in detail.
For display panel during manufacture, substrate surface can creating pockets of air, surface particles or other foreign matter shapes
At bump defects.In order to avoid protrusion causes further critical disadvantage, such as bubble to go out in high temperature process in follow-up process
The case where now exploding, generally use at present grinding recovery technique protrusion is ground, make grind rear projection height be less than or
Equal to preset standard value, even if the protrusion after grinding is in receivable altitude range.One kind is provided in the embodiment of the present invention
Substrate grinding device can grind the protrusion on the substrate in display panel manufacturing process, to ensure that substrate can accord with
Close production requirement.
A kind of substrate grinding device 100, the protrusion on grinding base plate.Fig. 1 is the substrate grinding device of the present embodiment
100 structural schematic diagram, substrate grinding device 100 include grind section 110 and control unit 120.Fig. 2 is the grind section of an embodiment
110 schematic diagram.Grind section 110 includes multiple grinding heads 111, and each grinding head 111 has different default grinding altitude ranges
It is ground with the protrusion to corresponding height.The grinding precision for grinding higher-height grinding head 111 is lower lower than grinding height
Grinding head 111 grinding precision, and the grinding rate for grinding higher-height grinding head 111 is higher than and grinds a lower height of grind
The grinding rate of bistrique 111.The height of protrusion is the top of protrusion to the distance of substrate, and grinding highly refers to that grinding head 111 can
The height of the protrusion of grinding.Default grinding altitude range refers to that the height value for the protrusion that grinding head 111 can be ground can be default
In range, i.e., each grinding head 111 can grind the protrusion of the different height in default grinding altitude range.
Control unit 120 is connect with grind section 110, and control unit 120 is used to receive the real-time height of protrusion during the grinding process,
And highly controlling corresponding grinding head in real time protrusion ground according to protrusion.When protrusion starts grinding, the opposite base of protrusion
The height of plate is larger, and control unit 120 controls the higher-height 111 pairs of protrusions of grinding head of grinding first and grinds.When protrusion is ground
Height is milled to when being not belonging to the default grinding altitude range of current grinding head 111, it is larger that control unit 120 controls current grinding height
Grinding head 111 stop grinding, and control the lesser grinding head of grinding height 111 (namely with the height pair of working as front projection
The grinding head for the default grinding altitude range answered) protrusion is continued to grind.
Aforesaid substrate grinding device 100, due to grinding the grinding precision of higher-height grinding head 111 lower than grinding height
The grinding precision of lower grinding head 111, and the grinding rate for grinding higher-height grinding head 111 is lower greater than grinding height
Grinding head 111 grinding rate.Control unit 120 is used to receive the real-time height of protrusion during the grinding process, and according to protrusion
Highly control 111 pairs of protrusions of corresponding grinding head in real time and grind.When protrusion is not ground, the height of raised opposing substrate
It is larger, only need to guarantee that therefore, it is higher-height that control unit 120 controls grinding first to raised faster grinding at this time
111 pairs of protrusions of grinding head are ground, and grinding rate is larger, very fast to the grinding of protrusion.When protrusion is ground to certain height
When, because protruding apex is relatively close to substrate, need to guarantee the grinding precision of protrusion at this time, to guarantee the grinding effect of protrusion,
Therefore, control unit 120 controls the grinding head 111 and stops grinding.Then, a lower height of grinding head is ground in the control of control unit 120
111 pairs of protrusions continue to grind, and grinding precision is higher.In this way, substrate grinding device 100 can be according to the real-time height of protrusion
Degree, switches between each grinding head 111, carries out from slow grinding is ground to fastly, from rough lapping to fine gtinding, i.e., to protrusion
Guarantee grinding rate, in turn ensures grinding precision, grinding efficiency is higher, and grinding effect is good.
It should be noted that under normal circumstances, when grinding to protrusion, grinding head 111 is not direct contact projection,
But lapping tape is set between grinding head 111 and protrusion, and lapping tape is wrapped on grinding head 111 and is ground to protrusion
Mill.
As shown in Fig. 2, the grinding size for grinding higher-height grinding head 111 is greater than grinding height in each grinding head 111
The grinding size of lower grinding head 111.The grinding size for grinding higher-height grinding head 111 is larger, the grinding to protrusion
For rough lapping, grinding rate is very fast.The grinding size for grinding a lower height of grinding head 111 is smaller, is ground to essence to protrusion
Fine lapping, grinding precision are higher.In this way, the different designs of the grinding size by grinding head 111, can be realized and carry out to protrusion
From being ground to slow grinding fastly, from rough lapping to fine gtinding.The design of grinding head 111 is easy, and is easily worked.In an embodiment
In, grinding size can be characterized by grinding head and the size of the contact area of protrusion.In the present embodiment, grinding head is half
Spherical shape, therefore grinding size can also be characterized by the spherical radius size of grinding head.Specifically, as shown in Fig. 2, grinding head
111 shape is hemispherical, and towards protrusion, the big grinding head 111 of grinding height is relatively large in diameter the spherical surface of grinding head, is ground convex
The fast speed risen.The diameter of the small grinding head 111 of grinding height is smaller, and grinding that can be finer is raised.In this way, hemispherical
111 pairs of raised grindings of grinding head it is more uniform.
Grind section 110 further includes support rod 112, and the quantity of support rod 112 is equal with the quantity of grinding head 111.One branch
Strut 112 is connect with a grinding head 111, and support rod 112 is used to support grinding head 111.Due to the bigger grinding of grinding size
First 111 grinding height is higher, therefore the distance of bigger 111 opposing substrate of grinding head of grinding size is bigger, therefore support rod 112
Length is shorter.Since the grinding height of the smaller grinding head 111 of grinding size is lower, therefore the grinding head 111 that grinding size is bigger
The distance of opposing substrate is smaller, therefore the length of support rod 112 is bigger.It is ground in this way, can be arranged by the length of support rod 112
First 111 grinding height, it is simple and easy.Further, all grind sections 110 are arranged in parallel in a row.In this way, when needing to switch
When grinding head, it is only necessary to grind section is translated, it is easy to operate.
Substrate grinding device 100 further includes measurement portion 130, and measurement portion 130 is used to measure the height of protrusion, and exports measurement
Value.In this way, substrate grinding device 100 is integrated with the measurement function to protrusion, and it is convenient to the measurement of protrusion, fast, without borrowing
Help external equipment highly being detected in real time and be input to control unit 120 to protrusion.Further, measurement portion 130 can answer
With the height of range sensor measurement protrusion.In this way, more accurate to the measurement of the height of protrusion.Control unit 120 and measurement portion
130 connections, control unit 120 receive measured value, control unit 120 control 130 pairs of measurement portion raised height carry out real-time measurements with
Obtain the real-time height of protrusion.While control unit 120 controls the height of 130 real-time measurement of measurement portion protrusion, measurement portion is received
130 feedback, so that control unit 120 can control grinding head 111 according to the height for the protrusion that measurement portion 130 is fed back,
It is ground to switch 111 pairs of protrusions of suitable grinding head in time.Specifically, control unit 120 judges the real-time height of protrusion
Whether the default grinding altitude range of current grinding head 111 is belonged to.Control unit 120 is highly belonging to current grinding head 111 in real time
Default grinding altitude range when, control current grinding head 111 and continue to grind.And it is highly being not belonging to current grinding head in real time
It when 111 default grinding altitude range, controls current grinding head 111 and stops grinding, and control to have and correspond to default grinding height
The grinding head 111 of range starts to be ground.Also, control unit 120 may determine that protrusion according to the measured value of measurement portion 130
Whether grinding finishes.
Substrate grinding device 100 further includes that moving portion (not shown), moving portion and grind section 110 and control unit 120 are distinguished
Connection.The measured value for the height of projection that control unit 120 is fed back according to measurement portion 130 judges whether the grinding of protrusion finishes.If
When control unit 120 judges to show that the grinding of protrusion finishes, control unit 120 controls moving portion and shifts to next high spot, realizes and moves
The automatic control in dynamic portion.Control unit 120 controls the movement of moving portion according to the location information of protrusion.The blindness of moving portion is avoided to move
It is dynamic, improve the mobile accuracy rate of moving portion.
Further, moving portion driving grind section 110 moves between different protrusions, so that 110 pairs of differences of grind section
Protrusion ground, all protrusions on repairing substrate.On the one hand the manual movement of grind section 110 is avoided, so that grinding
110 conveniently moving of portion；On the other hand, grind section 110 can be made quickly and accurately to be moved to target high spot, improve work effect
Rate.
Substrate grinding device 100 further includes acquiring unit (not shown), and acquiring unit is used to obtain the protrusion on substrate
Location information, acquiring unit are connect with control unit 120, so that control unit is according to the movement of location information control moving portion.Specifically
Ground may have multiple protrusions on substrate, and acquiring unit obtains the location information of all protrusions on substrate in advance, and will be raised
Location information be stored in the memory of control unit 120, so as to control unit 120 according to protrusion location information adjust accordingly
The position of grind section 110, so that grind section 110 is corresponding with the position of protrusion to be ground.In this way, can efficiently to substrate into
Row grinding is repaired.
Referring to figure 3., Fig. 3 is the flow diagram of the substrate grinding method of an embodiment.As shown in figure 3, a kind of substrate
Grinding method is applied to substrate grinding device 100, is executed by the control unit 120 in substrate grinding device 100.The grinding side
Method grinds the protrusion on substrate for controlling grinding head 111, and each grinding head 111 has different default grinding height models
Enclose and ground with the protrusion to corresponding height, grind the grinding precision of higher-height grinding head 111 lower than grinding height compared with
The grinding precision of low grinding head 111, and the grinding rate for grinding higher-height grinding head 111 is a lower height of greater than grinding
The grinding rate of grinding head 111.
The method comprising the steps of S110 receives the real-time height of protrusion.
In this way, height may fall into the pre- of the same grinding head 111 to raised difference in real time in the process of lapping of protrusion
If grinding altitude range, it is also possible to the default grinding altitude range of different grinding heads 111 is respectively fallen in, therefore, according to protrusion
Height, control unit 120 can select corresponding grinding head 111 in time in real time.It should be noted that in 110 pairs of protrusions of grind section
The whole process ground, control unit can continue to receive the real-time height of protrusion.
Step S120 determines default grinding altitude range corresponding to real-time height.
Control unit 120 determines grinding head 111 corresponding with the real-time height according to real-time height
Step S130 controls corresponding grinding head according to default grinding altitude range and grinds to protrusion.Control unit 120
According to real-time height determination and control the 111 pairs of protrusion grindings of corresponding grinding head.
Using aforesaid substrate grinding method, according to the real-time height of the protrusion, if the height of the protrusion falls into grinding height
The default grinding altitude range of higher grinding head 111 is spent, then the default grinding biggish grinding of altitude range of the selection of control unit 120
First 111 carry out rough lapping, and grinding is very fast.If the height of the protrusion falls into grinding, a lower height of the default of grinding head 111 is ground
Grind altitude range, then the default grinding altitude range of the selection of control unit 120 is lesser carries out more fine grinding, grinding precision compared with
It is high.Also, grind section, in the process of lapping to protrusion, control unit can continuously receive the real-time height of protrusion, in this way, control
Portion can be ground according to 111 pairs of protrusions of grinding head of the real-time height selection format of protrusion.I.e. control unit 120 can basis
The real-time height of protrusion, switches between each grinding head 111, carries out protrusion from slow grinding is ground to fastly, from rough lapping
To fine gtinding, i.e. guarantee grinding rate, grinding precision is in turn ensured, grinding efficiency is higher, and grinding effect is good.
As shown in figure 3, in one embodiment, after step s 130 further include:
Step S140, judges whether the real-time height of protrusion belongs to the default grinding altitude range of current grinding head.
Step S150 controls current grinding head when highly belonging to the default grinding altitude range of current grinding head in real time
Continue to grind.
Step S160 controls current grinding when being highly not belonging to the default grinding altitude range of current grinding head in real time
Head stops grinding, and controlling, there is the grinding head of corresponding default grinding altitude range to start to be ground.
Specifically, in this way, 130 pairs of raised height of measurement portion are surveyed in real time while 110 pairs of protrusion grindings of grind section
Amount, the preset height range of control unit 120 relatively more real-time height and the grinding head 111 for grinding the protrusion.If protrusion
Height still belongs to the default grinding altitude range of the grinding head 111 in real time, illustrates that the grinding head 111 can also be to the protrusion
It is ground.If the monitor value of protrusion is not belonging to the default grinding altitude range of the grinding head 111, illustrate current grinding head
111 cannot grind protrusion, and at this moment, control grinding head 111 stops grinding to control unit 120 in time, and control unit 120 and
When corresponding with the height of projection grinding head 111 of switching, the case where executing invalid grinding so as to avoid grinding head 111, further
Improve the grinding efficiency to protrusion.Also, control unit 120 can switch 111 pairs of protrusions of next grinding head in time and grind,
It improves efficiency.
Fig. 4 is the flow diagram of the substrate grinding method of another embodiment.The step of receiving the real-time height of protrusion is (i.e.
Step S110) after, determine the step of default grinding altitude range corresponding to real-time height (i.e. step S120) before, also wrap
It includes:
Step S10 judges whether height is greater than preset standard value in real time.
When real-time height is less than or equal to preset standard value, S20 is thened follow the steps, control grind section is moved to next convex
At rising.
Highly it is greater than preset standard value when real-time, then executes and determine default grinding altitude range corresponding to real-time height
Step and its subsequent step, i.e. execution step S120 and its subsequent step.
Specifically, preset standard value is the maximum height value of acceptable protrusion on substrate.Control unit 120 receives protrusion
Highly, by the real-time height compared with preset standard value, and judge whether the real-time height is greater than preset standard value.If the survey
Magnitude is greater than preset standard value, illustrates that the protrusion is repaired.If the measured value is not more than preset standard value, this is convex
It rises within the acceptable range, grind section 110 is moved to next high spot by control unit 120, in this way, substrate grinding can be improved
The grinding efficiency of device 100.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (10)
1. a kind of substrate grinding device, the protrusion on grinding base plate, which is characterized in that the substrate grinding device includes grinding
Mill portion and control unit；The grind section includes multiple grinding heads, and each grinding head has different default grinding altitude ranges
It is ground with the protrusion to corresponding height, the grinding precision for grinding the higher-height grinding head is lower lower than grinding height
The grinding head grinding precision, and the grinding rate for grinding the higher-height grinding head be greater than grind it is a lower height of
The grinding rate of the grinding head；The control unit is connect with the grind section, and the control unit exists for receiving the protrusion
Real-time height in process of lapping, and according to the real-time height of the protrusion control the corresponding grinding head to it is described it is raised into
Row grinding.
2. substrate grinding device according to claim 1, which is characterized in that ground in each grinding head higher-height
The grinding size of grinding head is greater than the grinding size for grinding a lower height of grinding head.
3. substrate grinding device according to claim 2, which is characterized in that the shape of the grinding head is hemispherical, institute
The spherical surface of grinding head is stated towards the protrusion.
4. substrate grinding device according to claim 1, which is characterized in that further include measurement portion, the measurement portion is used for
Measure the height of the protrusion, and outputting measurement value；The control unit is connect with the measurement portion, described in the control unit reception
Measured value, the control unit control the measurement portion and carry out real-time measurement to the height of the protrusion to obtain the real-time height of protrusion
Degree.
5. substrate grinding device according to claim 4, which is characterized in that the control unit is used to judge the protrusion
Whether height belongs to the default grinding altitude range of current grinding head in real time；The control unit belongs to currently in the real-time height
It when the default grinding altitude range of grinding head, controls current grinding head and continues to grind, and be not belonging to currently in the real-time height
It when the default grinding altitude range of grinding head, controls current grinding head and stops grinding, and control to have and correspond to default grinding height
The grinding head of range starts to be ground.
6. substrate grinding device according to claim 4, which is characterized in that it further include moving portion, the moving portion and institute
Grind section connection is stated, the moving portion drives the grind section to be moved to grinding head position corresponding with the protrusion；Institute
It states control unit to connect with the moving portion, the control unit is according to the raised real-time height control that the measurement portion measures
The movement of moving portion.
7. substrate grinding device according to claim 6, which is characterized in that it further include acquiring unit, the acquiring unit
For obtaining the location information of the protrusion on the substrate；The control unit is connect with the acquiring unit, the control unit root
The moving portion, which is controlled, according to the location information is moved to protrusion to be ground.
8. a kind of substrate grinding method grinds the protrusion on substrate for controlling the grind section including multiple grinding heads,
There is each grinding head different default grinding altitude ranges to be ground with the protrusion to corresponding height, and grinding height is higher
Grinding head grinding precision lower than the grinding precision for grinding a lower height of grinding head, and grind the higher-height grinding
The grinding rate of head is greater than the grinding rate for grinding a lower height of grinding head；It is characterized in that, the method includes steps
It is rapid:
Receive the real-time height of the protrusion；
Determine default grinding altitude range corresponding to the real-time height；And
Corresponding grinding head is controlled according to the default grinding altitude range to grind the protrusion.
9. control method according to claim 8, which is characterized in that described to be controlled according to the default grinding altitude range
After the step of corresponding grinding head grinds the protrusion further include:
Judge whether the real-time height of the protrusion belongs to the default grinding altitude range of current grinding head；
When the real-time height belongs to the default grinding altitude range of current grinding head, controls current grinding head and continue to grind；
When the real-time height is not belonging to the default grinding altitude range of current grinding head, controls current grinding head stopping and grind
Mill, and controlling, there is the grinding head of corresponding default grinding altitude range to start to be ground.
10. control method according to claim 9, which is characterized in that the step of the real-time height for receiving the protrusion
After rapid, default grinding altitude range corresponding to the determination real-time height the step of before, further includes:
Judge whether the real-time height is greater than preset standard value；
When the real-time height is less than or equal to the preset standard value, controls the grind section and be moved to next high spot；
When the real-time height be greater than the preset standard value, then execute default corresponding to the determination real-time height grind
The step of grinding altitude range and its subsequent step.
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| WO2013038573A1 (en) * | 2011-09-15 | 2013-03-21 | 新東工業株式会社 | System for grinding/polishing hard and brittle materials, and grinding/polishing method |
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