TW201243500A - Negative photosensitive resin composition and coating film - Google Patents
Negative photosensitive resin composition and coating film Download PDFInfo
- Publication number
- TW201243500A TW201243500A TW101108292A TW101108292A TW201243500A TW 201243500 A TW201243500 A TW 201243500A TW 101108292 A TW101108292 A TW 101108292A TW 101108292 A TW101108292 A TW 101108292A TW 201243500 A TW201243500 A TW 201243500A
- Authority
- TW
- Taiwan
- Prior art keywords
- resin composition
- photosensitive resin
- compound
- negative photosensitive
- group
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
- H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
- H10K71/233—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers by photolithographic etching
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials For Photolithography (AREA)
- Optical Filters (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011079394A JP2014122926A (ja) | 2011-03-31 | 2011-03-31 | ネガ型用感光性組成物および塗膜 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW201243500A true TW201243500A (en) | 2012-11-01 |
Family
ID=46930502
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101108292A TW201243500A (en) | 2011-03-31 | 2012-03-12 | Negative photosensitive resin composition and coating film |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2014122926A (ja) |
TW (1) | TW201243500A (ja) |
WO (1) | WO2012132755A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI632423B (zh) * | 2012-11-26 | 2018-08-11 | Sumitomo Chemical Company, Limited | 感光性樹脂組成物 |
TWI701509B (zh) * | 2015-09-30 | 2020-08-11 | 日商東麗股份有限公司 | 負型感光性樹脂組成物、硬化膜、具備硬化膜之元件及顯示裝置、以及其製造方法 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103890128B (zh) * | 2011-10-21 | 2016-06-29 | 旭硝子株式会社 | 拒墨剂的制造方法、负型感光性树脂组合物、分隔壁以及光学元件 |
CN104781074B (zh) | 2012-10-31 | 2017-02-15 | 旭硝子株式会社 | 负型感光性树脂组合物、树脂固化膜、分隔壁以及光学元件 |
CN106462069B (zh) * | 2014-04-25 | 2019-10-18 | Agc株式会社 | 负型感光性树脂组合物、分隔壁及光学元件 |
US11086219B2 (en) | 2016-03-30 | 2021-08-10 | Toray Industries, Inc. | Negative-type photosensitive resin composition, cured film, display device that includes the cured film, and production method therefor |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4466183B2 (ja) * | 2004-04-27 | 2010-05-26 | 旭硝子株式会社 | 感光性樹脂組成物及びその塗膜硬化物 |
WO2009141924A1 (ja) * | 2008-05-23 | 2009-11-26 | 三菱化学株式会社 | 着色硬化性樹脂組成物、カラーフィルタ、液晶表示装置及び有機elディスプレイ |
JP5073556B2 (ja) * | 2008-03-31 | 2012-11-14 | 富士フイルム株式会社 | 感光性樹脂組成物、遮光性カラーフィルター及びその製造方法、並びに固体撮像素子 |
KR101269299B1 (ko) * | 2008-08-01 | 2013-05-29 | 아사히 가라스 가부시키가이샤 | 네거티브형 감광성 조성물, 그것을 사용한 광학 소자용 격벽 및 그 격벽을 갖는 광학 소자 |
-
2011
- 2011-03-31 JP JP2011079394A patent/JP2014122926A/ja not_active Withdrawn
-
2012
- 2012-03-01 WO PCT/JP2012/055280 patent/WO2012132755A1/ja active Application Filing
- 2012-03-12 TW TW101108292A patent/TW201243500A/zh unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI632423B (zh) * | 2012-11-26 | 2018-08-11 | Sumitomo Chemical Company, Limited | 感光性樹脂組成物 |
TWI701509B (zh) * | 2015-09-30 | 2020-08-11 | 日商東麗股份有限公司 | 負型感光性樹脂組成物、硬化膜、具備硬化膜之元件及顯示裝置、以及其製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2014122926A (ja) | 2014-07-03 |
WO2012132755A1 (ja) | 2012-10-04 |
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