TW201241955A - Apparatus and a method for direct wafer bonding - Google Patents

Apparatus and a method for direct wafer bonding Download PDF

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Publication number
TW201241955A
TW201241955A TW101106300A TW101106300A TW201241955A TW 201241955 A TW201241955 A TW 201241955A TW 101106300 A TW101106300 A TW 101106300A TW 101106300 A TW101106300 A TW 101106300A TW 201241955 A TW201241955 A TW 201241955A
Authority
TW
Taiwan
Prior art keywords
wafer
chuck
wafers
bonding
pusher
Prior art date
Application number
TW101106300A
Other languages
English (en)
Chinese (zh)
Inventor
Marcel Broekaart
Arnaud Castex
Original Assignee
Soitec Silicon On Insulator
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Soitec Silicon On Insulator filed Critical Soitec Silicon On Insulator
Publication of TW201241955A publication Critical patent/TW201241955A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
TW101106300A 2011-02-24 2012-02-24 Apparatus and a method for direct wafer bonding TW201241955A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1151493A FR2972078A1 (fr) 2011-02-24 2011-02-24 Appareil et procédé de collage par adhésion moléculaire

Publications (1)

Publication Number Publication Date
TW201241955A true TW201241955A (en) 2012-10-16

Family

ID=44176605

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101106300A TW201241955A (en) 2011-02-24 2012-02-24 Apparatus and a method for direct wafer bonding

Country Status (3)

Country Link
FR (1) FR2972078A1 (fr)
TW (1) TW201241955A (fr)
WO (1) WO2012113799A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112038219A (zh) * 2019-06-03 2020-12-04 台湾积体电路制造股份有限公司 晶圆结合的方法及晶圆结合设备
TWI732700B (zh) * 2020-10-16 2021-07-01 天虹科技股份有限公司 鍵合機台的對準機構及對準方法
TWI792447B (zh) * 2021-07-26 2023-02-11 天虹科技股份有限公司 鍵合機的對準機構及對準方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6372310B2 (ja) * 2014-10-30 2018-08-15 株式会社デンソー 化学気相成長装置に用いられるサセプタおよびそれを備えた化学気相成長装置
US9640418B2 (en) 2015-05-15 2017-05-02 Suss Microtec Lithography Gmbh Apparatus, system, and method for handling aligned wafer pairs
US11183401B2 (en) 2015-05-15 2021-11-23 Suss Microtec Lithography Gmbh System and related techniques for handling aligned substrate pairs
RU2745297C1 (ru) * 2020-08-05 2021-03-23 Обществом с ограниченной ответственностью "Маппер" Устройство для ручного выравнивания кремниевых пластин перед их временным сращиванием
US11961753B2 (en) * 2021-12-10 2024-04-16 Sky Tech Inc. Substrate-bonding device

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6245143A (ja) * 1985-08-23 1987-02-27 Canon Inc 円板物体の位置決め装置
JP3052116B2 (ja) * 1994-10-26 2000-06-12 東京エレクトロン株式会社 熱処理装置
JPH1174164A (ja) * 1997-08-27 1999-03-16 Canon Inc 基板処理装置、基板支持装置及び基板処理方法並びに基板の製造方法
FR2848336B1 (fr) * 2002-12-09 2005-10-28 Commissariat Energie Atomique Procede de realisation d'une structure contrainte destinee a etre dissociee
WO2007047536A2 (fr) * 2005-10-14 2007-04-26 Silicon Genesis Corporation Procede et appareil pour outil de liaison de plaquettes dite « flag-less »
US7612895B2 (en) * 2007-05-18 2009-11-03 Suss Microtec Inc Apparatus and method for in-situ monitoring of wafer bonding time
FR2947380B1 (fr) * 2009-06-26 2012-12-14 Soitec Silicon Insulator Technologies Procede de collage par adhesion moleculaire.

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112038219A (zh) * 2019-06-03 2020-12-04 台湾积体电路制造股份有限公司 晶圆结合的方法及晶圆结合设备
TWI714306B (zh) * 2019-06-03 2020-12-21 台灣積體電路製造股份有限公司 晶圓結合的方法及晶圓結合設備
TWI732700B (zh) * 2020-10-16 2021-07-01 天虹科技股份有限公司 鍵合機台的對準機構及對準方法
TWI792447B (zh) * 2021-07-26 2023-02-11 天虹科技股份有限公司 鍵合機的對準機構及對準方法

Also Published As

Publication number Publication date
FR2972078A1 (fr) 2012-08-31
WO2012113799A1 (fr) 2012-08-30

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