TW201237604A - Heat sink - Google Patents

Heat sink Download PDF

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Publication number
TW201237604A
TW201237604A TW100108700A TW100108700A TW201237604A TW 201237604 A TW201237604 A TW 201237604A TW 100108700 A TW100108700 A TW 100108700A TW 100108700 A TW100108700 A TW 100108700A TW 201237604 A TW201237604 A TW 201237604A
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TW
Taiwan
Prior art keywords
heat
receiving portion
base
connecting portion
receiving
Prior art date
Application number
TW100108700A
Other languages
Chinese (zh)
Inventor
Liang Du
jin-biao Ji
Zhi-Jiang Yao
Li-Fu Xu
Original Assignee
Hon Hai Prec Ind Co Ltd
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Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Publication of TW201237604A publication Critical patent/TW201237604A/en

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heat sink includes a base configured to contact a heating element, a plurality of parallel fins disposed on the base, a first heat pipe and a second heat pipe. The first heat pipe includes a first receiving portion, a first heating dissipating portion, and a first connecting portion. The second heat pipe includes a second receiving portion, a second heating dissipating portion, and a second connecting portion. The first and second receiving portions touch an upper surface of the base. The first and second heating dissipating portions extend through the fins and touch the fins. The first and second heating dissipating portions extend through the fins along an opposite direction.

Description

201237604 六、發明說明： 【發明所屬之技術領域】 尤指—種優化導熱管排布的散 [0001] 本發明涉及一種散熱器 熱器。 【先前技術】 [0002] 現在電腦的運行速度越來越快，由於 ㈡仏電腦的運行速度主 要取決於中央處㈣，因此中央處理器的運行速度也越 來越快’但是對於中央處理H這1的積體電路電子元 件來說，運行速度職’其單位_產生的熱量就越多 ，若不及時排出，就會引起其溫度升高，導致其運行不 穩定。業界均在中央處理器表面安震—散熱器輔助其散 熱，隨著處理器不斷推出，亭所配用的f散熱器也在不斷 改良。 [0003] 由於散熱需求的不斷提高’散熱器的競積也越做越大， 在中央處理與記憶體插槽尤間的空間有限的情況下，讓 散熱器的設計變得越來越捉襟見肘，特別是散熱器上的 導熱管排布，很容易干涉到其他的電子元件。 【發明内容】 [0004] 鑒於以上内容’有必要提供一種優化導熱管排布的散熱 [0005] —種散熱器，包括一用於抵接發熱元件的底座、一設於 所述底座上表面上的籍片組、一第一導熱管及一第二導 熱管，所述第〆導熱管包括一第一接收部、一第一散熱 部和一用於連接所述第一接收部和所述第一散熱部的第 一連接部，所述第二導熱管包括一第二接收部、一第二 1002014736-0 100108700 表單編號A0101 第3頁/共13頁 201237604 散熱部和一用於連接所述第二接收部和所述第二散熱部 的第二連接部，所述第一接收部和所述第二接收部與所 述底座的上表面接觸，用於接收來自所述底座傳導的熱 量，所述第一散熱部和所述第二散熱部穿過所述鰭片組 並與所述鰭片組接觸，用於將熱量傳導給所述鰭片組， 所述第一散熱部和所述第二散熱部相向穿過所述鰭片組 〇 [0006] 與習知技術相比，在上述散熱器中，藉由熱管相向穿過 鰭片組的排布方式，在散熱器的鰭片組的體積大小一定 的條件下減小了散熱器佔據的空間，並且可有效地避免 散熱器與其他電子元件（尤其是記憶體插槽）發生干涉 〇 【實施方式】 [0007] 請參閱圖1及圖2，在本發明的一較佳實施方式中，一種 散熱器，包括一用於抵接發熱元件的底座10、一設於所 述底座上表面上的鰭片組20、一第一導熱管30及一第二 導熱管40。 [0008] 所述第一導熱管30包括一第一接收部301、一第一散熱部 302和一用於連接所述第一接收部301和所述第一散熱部 302的第一連接部303，所述第一接收部301與所述底座 10的上表面接觸，用於接收來自所述底座10傳導的熱量 ，所述第一散熱部302穿過所述鰭片組20並與所述鰭片組 20接觸，用於將熱量傳導給所述鰭片組20。所述第一導 熱管30整體上呈C形，所述第一連接部303與所述第一接 收部301的連接部分以及所述第一連接部303與所述第一 100108700 表單編號A0101 第4頁/共13頁 1002014736-0 201237604 [0009] Ο 〇 [0010] [0011] 100108700 •、°卩302的連接部分均呈弧形。所述第—連接部303與 此第—接收部301的連接部分陷入所述鰭片組2〇中。所 ^iju 、 導熱管30的第一接收部3〇1、第一散熱部3〇2和第 連接部303均處於一第一平面中。 '第—導熱管4〇包括一第二接收部401、一第二散熱部 4 0 2 ^0 °用於連接所述第二接收部401和所述第二散熱部 的第一連接部403，所述第二接收部401與所述底座 的上表面接觸，用於接收來自所述底座10傳導的熱量 ，所述第二散熱部402穿過所述鰭片組20並與所述鰭片組 接觸，用於將熱量傳導給所述鰭片組2〇0所述第二導 ’、、、s 40整體上呈[形，所述第二連接部4〇3與所述第二接 收401的連接部分以及所述第二連接部403與所述第二 散熱部402的連接部分均呈弧形。所述第二連接部4〇3與 所述第二接收部4〇1的連接部分陷入所藥鰭片組20中。所 述第二導熱管40的第二接收部4〇1、第二散熱部4〇2和第 —連接部4 0 3均處於一第二平面.中.。 所述底座10的下表面可與—電腦主機板上的待散熱元件 (如中央處理器）相接觸，接收待散熱元件產生的熱量 。所述底座10的上表面設有—第一四槽101和一第二凹槽 1〇2，所述第一凹槽101和所述第二凹槽1〇2均呈u形。 所述縛片組20的每相鄰兩鰭片間設有導風面2〇ι，所述導 風面與所述底座10的上表面垂直。所述鰭片組2〇上設有 一第一通孔202和一第二通孔2〇3，所述第一通孔2〇2從 與所述鰭片組20的鰭片垂直的方向貫穿所述鰭片組2〇， 所述第二通孔203從與所述鰭片組2〇的鰭片垂直的方向貫 表單編號A0101 第5頁/共13頁 1002014736-0 201237604 穿所述鰭片組20。所述第一通孔202與所述第二通孔203 之間的水準距離大於所述底座10上表面上的第一凹槽101 與第二凹槽102之間的水準距離。所述第一通孔202的孔 徑與所述第一導熱管30的孔徑大致相當，所述第二通孔 203的孔徑與所述第二導熱管40的孔徑大致相當。所述鰭 片組20的下表面設有一第一頂凹槽204和一第二頂凹槽 205，所述第一頂凹槽204和所述第二頂凹槽205均呈U形 ，並與所述底座10上表面上的第一凹槽101和第二凹槽 102分別相對應。 [0012] 請參閱圖3，組裝所述散熱器時，將所述鰭片組20固定在 所述底座10的上表面，所述鍺片組20的第一頂凹槽204與 所述底座10的第一凹槽101相對應，所述鰭片組20的第二 頂凹槽205與所述底座10的第二凹槽102相對應。 [0013] 將所述第一導熱管30的第一接收部301水準地容置於所述 第一凹槽101中，並與所述第一凹槽101充分接觸，所述 第二導熱管40的第二接收部401水準地容置於所述第二凹 槽102中，並與所述第二凹槽102充分接觸。將所述第一 導熱管30的第一散熱部302穿過所述鰭片組20上的第一通 孔202，並與所述第一通孔202充分接觸，所述第二導熱 管40的第二散熱部402穿過所述鰭片組20上的第二通孔 203，並與所述第二通孔203充分接觸。此時，所述第一 導熱管30的第一連接部303和所述第二導熱管40的第二連 接部403分別位於所述鰭片組20的相對兩側，並且緊貼所 述鰭片組20，所述第一導熱管30的第一散熱部302和所述 第二導熱管40的第二散熱部402相向穿過所述鰭片組20。 100108700 表單編號A0101 第6頁/共13頁 1002014736-0 201237604 所述第一散熱部和所述第二散熱部的延伸方向均與所述 鰭片組的鰭片垂直。所述第一導熱管30所在的第一平面 與所述第二導熱管40所在的第二平面相交，形成一個夾 角。 [0014] 綜上所述，本發明係合乎發明專利申請條件，爰依法提 出專利申請。惟，以上所述僅為本發明之較佳實施例， 舉凡熟悉本案技藝之人士其所爰依本案之創作精神所作 之等效修飾或變化，皆應涵蓋於以下之申請專利範圍内 〇 ❹ 【圖式簡單說明】 [0015] 圖1為本發明一較佳實施方式中的散熱器的立體分解圖。 [0016] 圖2為圖1所示的散熱器的另一視角的立體分解圖。 [0017] 圖3為本發明一較佳實施方式中的散熱器的組裝圖。 【主要元件符號說明】 [0018] 底座：10 ◎ [0019]第一凹槽：101 [0020] 第二凹槽：102 [0021] 鰭片組：20 [0022] 導風面：201 [0023] 第一通孔：202 [0024] 第二通孔：203 [0025] 第一頂凹槽：204 100108700 表單編號A0101 第7頁/共13頁 1002014736-0 201237604 [0026] 第二頂凹槽：2 0 5 [0027] 第一導熱管：30 [0028] 第一接收部：3 0 1 [0029] 第一散熱部：302 [0030] 第一連接部：303 [0031] 第二導熱管：40 [0032] 第二接收部：401 [0033] 第二散熱部：402 [0034] 第二連接部：403 100108700 表單編號A0101 第8頁/共13頁 1002014736-0201237604 VI. Description of the invention: [Technical field to which the invention pertains] In particular, the invention relates to a heat sink for optimizing heat transfer tube arrangement. [0001] The present invention relates to a heat sink heat exchanger. [Prior Art] [0002] Now the computer is running faster and faster, because (2) the running speed of the computer depends mainly on the central office (four), so the central processor runs faster and faster 'but for the central processing H In the case of an integrated circuit electronic component, the more heat generated by the operating unit's unit's unit, the higher the temperature will be caused if it is not discharged in time, resulting in unstable operation. The industry is on the surface of the central processor - the heat sink assists its heat dissipation. As the processor continues to be introduced, the f-heat sink used in the pavilion is also constantly improving. [0003] As the demand for heat dissipation continues to increase, the competition for heat sinks is getting bigger and bigger. In the case where the space between the central processing and the memory slots is limited, the design of the heat sink is becoming more and more stretched. In particular, the heat pipe on the heat sink is arranged to easily interfere with other electronic components. SUMMARY OF THE INVENTION [0004] In view of the above, it is necessary to provide a heat dissipation for optimizing the arrangement of the heat pipe. [0005] A heat sink includes a base for abutting the heat generating component, and one of the upper surfaces of the base. a first heat pipe and a second heat pipe, the second heat pipe includes a first receiving portion, a first heat radiating portion, and a first receiving portion and the first a first connecting portion of the heat dissipating portion, the second heat conducting tube includes a second receiving portion, a second 1002014736-0 100108700, a form number A0101, a third page, a total of 13 pages, a 201237604 heat sink portion, and a connection portion a second connecting portion of the receiving portion and the second heat dissipating portion, the first receiving portion and the second receiving portion are in contact with an upper surface of the base for receiving heat conducted from the base, The first heat dissipating portion and the second heat dissipating portion pass through the fin group and are in contact with the fin group for conducting heat to the fin group, the first heat dissipating portion and the first Two heat dissipating portions face each other through the fin group [0006] and conventional techniques Compared with the above, in the above heat sink, by the arrangement of the heat pipes facing each other through the fin group, the space occupied by the heat sink is reduced under the condition that the volume of the fin group of the heat sink is constant, and can be effectively To avoid interference between the heat sink and other electronic components (especially the memory socket) [Embodiment] [0007] Referring to FIG. 1 and FIG. 2, in a preferred embodiment of the present invention, a heat sink includes A base 10 for abutting the heating element, a fin set 20 disposed on the upper surface of the base, a first heat transfer tube 30 and a second heat transfer tube 40. The first heat pipe 30 includes a first receiving portion 301, a first heat radiating portion 302, and a first connecting portion 303 for connecting the first receiving portion 301 and the first heat radiating portion 302. The first receiving portion 301 is in contact with an upper surface of the base 10 for receiving heat conducted from the base 10, and the first heat radiating portion 302 passes through the fin group 20 and the fin The set of sheets 20 is in contact for conducting heat to the set of fins 20. The first heat transfer pipe 30 is C-shaped as a whole, the connecting portion of the first connecting portion 303 and the first receiving portion 301, and the first connecting portion 303 and the first 100108700 form number A0101 are 4th. Page / Total 13 pages 1002014736-0 201237604 [0009] Ο 〇 [0010] [0011] 100108700 • The connection portions of °卩 302 are all curved. The connecting portion of the first connecting portion 303 and the first receiving portion 301 is caught in the fin group 2''. The first receiving portion 3〇1, the first heat radiating portion 3〇2, and the first connecting portion 303 of the heat pipe 30 are all in a first plane. The first heat conducting tube 4 includes a second receiving portion 401 and a second heat radiating portion 4 0 2 ^0 ° for connecting the second receiving portion 401 and the first connecting portion 403 of the second heat radiating portion. The second receiving portion 401 is in contact with an upper surface of the base for receiving heat conducted from the base 10, and the second heat radiating portion 402 passes through the fin group 20 and the fin group Contact, for conducting heat to the fin group 2〇0, the second guide ',, s 40 is generally [shaped, the second connecting portion 4〇3 and the second receiving 401 The connecting portion and the connecting portion of the second connecting portion 403 and the second heat radiating portion 402 are both curved. The connecting portion of the second connecting portion 4?3 and the second receiving portion 4?1 is caught in the medicine fin group 20. The second receiving portion 4〇1, the second heat dissipating portion 4〇2, and the first connecting portion 420 of the second heat transfer tube 40 are all in a second plane. The lower surface of the base 10 can be in contact with a component to be cooled (such as a central processing unit) on the computer motherboard to receive heat generated by the component to be cooled. The upper surface of the base 10 is provided with a first four groove 101 and a second groove 1〇2, and the first groove 101 and the second groove 1〇2 are both u-shaped. An air guiding surface 2〇 is disposed between each adjacent two fins of the tab group 20, and the air guiding surface is perpendicular to the upper surface of the base 10. The fin group 2 is provided with a first through hole 202 and a second through hole 2〇3, and the first through hole 2〇2 penetrates from a direction perpendicular to the fin of the fin group 20. The fin group 2〇, the second through hole 203 is formed in a direction perpendicular to the fin of the fin group 2A. Form No. A0101 Page 5/13 pages 1002014736-0 201237604 20. A level distance between the first through hole 202 and the second through hole 203 is greater than a level distance between the first groove 101 and the second groove 102 on the upper surface of the base 10. The aperture of the first through hole 202 is substantially equivalent to the aperture of the first heat conduction tube 30, and the aperture of the second through hole 203 is substantially equivalent to the aperture of the second heat conduction tube 40. The lower surface of the fin set 20 is provided with a first top recess 204 and a second top recess 205, and the first top recess 204 and the second top recess 205 are both U-shaped and The first groove 101 and the second groove 102 on the upper surface of the base 10 respectively correspond to each other. [0012] Referring to FIG. 3, when the heat sink is assembled, the fin set 20 is fixed on the upper surface of the base 10, and the first top recess 204 of the cymbal group 20 and the base 10 are The first recess 101 corresponds to the second recess 205 of the fin set 20 corresponding to the second recess 102 of the base 10. [0013] The first receiving portion 301 of the first heat pipe 30 is horizontally received in the first groove 101 and is in full contact with the first groove 101, and the second heat pipe 40 is The second receiving portion 401 is horizontally received in the second recess 102 and is in full contact with the second recess 102. Passing the first heat dissipation portion 302 of the first heat transfer tube 30 through the first through hole 202 on the fin set 20 and in sufficient contact with the first through hole 202, the second heat transfer tube 40 The second heat dissipation portion 402 passes through the second through hole 203 on the fin group 20 and is in full contact with the second through hole 203. At this time, the first connecting portion 303 of the first heat transfer tube 30 and the second connecting portion 403 of the second heat transfer tube 40 are respectively located on opposite sides of the fin group 20, and are in close contact with the fin In the group 20 , the first heat dissipation portion 302 of the first heat pipe 30 and the second heat dissipation portion 402 of the second heat pipe 40 face the fin group 20 . 100108700 Form No. A0101 Page 6 of 13 1002014736-0 201237604 The first heat dissipating portion and the second heat dissipating portion extend in a direction perpendicular to the fins of the fin group. The first plane where the first heat pipe 30 is located intersects the second plane where the second heat pipe 40 is located to form an angle. [0014] In summary, the present invention is in accordance with the conditions of the invention patent application, and the patent application is filed according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art to the spirit of the present invention should be included in the following patent claims. BRIEF DESCRIPTION OF THE DRAWINGS [0015] FIG. 1 is an exploded perspective view of a heat sink according to a preferred embodiment of the present invention. 2 is an exploded perspective view of another perspective view of the heat sink shown in FIG. 1. 3 is an assembled view of a heat sink according to a preferred embodiment of the present invention. [Main component symbol description] [0018] Base: 10 ◎ [0019] First groove: 101 [0020] Second groove: 102 [0021] Fin set: 20 [0022] Wind guiding surface: 201 [0023] First through hole: 202 [0024] Second through hole: 203 [0025] First top groove: 204 100108700 Form number A0101 Page 7 / Total 13 pages 1002014736-0 201237604 [0026] Second top groove: 2 0 5 [0027] First heat pipe: 30 [0028] First receiving portion: 3 0 1 [0029] First heat sink portion: 302 [0030] First connecting portion: 303 [0031] Second heat pipe: 40 [ 0032] Second receiving portion: 401 [0033] Second heat dissipating portion: 402 [0034] Second connecting portion: 403 100108700 Form No. A0101 Page 8 / Total 13 pages 1002014736-0

Claims (1)

201237604 七、申請專利範圍： 1 . 一種散熱器，包括一用於抵接發熱元件的底座、一設於所 述底座上表面上的鰭片組、一第一導熱管及一第二導熱管 ，所述第一導熱管包括一第一接收部、一第一散熱部和一 用於連接所述第一接收部和所述第一散熱部的第一連接部 ，所述第二導熱管包括一第二接收部、一第二散熱部和一 用於連接所述第二接收部和所述第二散熱部的第二連接部 ，所述第一接收部和所述第二接收部與所述底座的上表面 接觸，用於接收來自所述底座傳導的熱量，所述第一散熱 部和所述第二散熱部穿過所述鰭片組並與所述鰭片組接觸 ，用於將熱量傳導給所述鰭片組，所述第一散熱部和所述 第二散熱部相向穿過所述鰭片組。 2.如申請專利範圍第1項所述之散熱器，其中所述第一連接 部和所述第二連接部分別位於所述鰭片組的相對兩侧。 3 .如申請專利範圍第1項所述之散熱器，其中所述第一導熱 管的第一接收部、第一散熱部和第一連接部均處於一第一 平面中，所述第二導熱管的第二接收部、第二散熱部和第 ❹ 二連接部均處於一第二平面中，所述第一平面與所述第二 平面相交。 4. 如申請專利範圍第1項所述之散熱器，其中所述第一散熱 部和所述第二散熱部的延伸方向均與所述鰭片組的鰭片垂 直。 5. 如申請專利範圍第1項所述之散熱器，其中所述第一導熱 管的第一連接部和所述第二導熱管的第二連接部均緊貼所 述鰭片組。 100108700 表單編號A0101 第9頁/共13頁 1002014736-0 201237604 .如申料舰_丨_狀散_，其t :::上則，所述第-連接部與所述第-接收：： 妾。p刀以及所述第—連接部與所述第 均呈弧形。 …、相連接部分 =申請專利範圍第！項所述之散熱器，其中所述第 官整體上呈C形，所述第二連接部與所述第二接收連 ^部分以及所述第二連接部與所述第二域部的連接部 均呈弧形。 如申請專利範圍第1項所述之散熱器，其中所述底座上 2面設有-第-凹槽和-第二凹槽，所述 第一凹槽均呈ϋ形’所述第一導熱管的第一接收部容置於 2第一凹槽中，所述第二導熱管的第二接收部容置於所 述第二凹槽中。 ，. 如申請專利範圍第8項所述之散熱器，其中所述轉片組的 下表面設有-第-頂凹槽和一第二頂凹槽，所述第一頂凹 =和所述第二頂凹槽均呈_，並與麵述第—凹槽和所述 第一凹槽分別相對應β ίο f’、 ^申請專利範圍们項所述之散熱器，其中所述韓片组的 母相鄰兩轉片間設有導風面，所述導風面與所述底座的上 表面垂直。 100108700 表單編號A0101 第10頁/共13頁 1002014736-0201237604 VII. Patent application scope: 1. A heat sink comprising a base for abutting a heating element, a fin set disposed on an upper surface of the base, a first heat pipe and a second heat pipe; The first heat pipe includes a first receiving portion, a first heat radiating portion, and a first connecting portion for connecting the first receiving portion and the first heat radiating portion, and the second heat pipe includes a first a second receiving portion, a second heat dissipating portion, and a second connecting portion for connecting the second receiving portion and the second heat dissipating portion, the first receiving portion and the second receiving portion and the Contacting an upper surface of the base for receiving heat conducted from the base, the first heat dissipation portion and the second heat dissipation portion passing through the fin group and contacting the fin group for transferring heat Conducted to the set of fins, the first heat dissipation portion and the second heat dissipation portion are opposed to each other through the fin group. 2. The heat sink of claim 1, wherein the first connecting portion and the second connecting portion are respectively located on opposite sides of the fin set. 3. The heat sink of claim 1, wherein the first receiving portion, the first heat dissipating portion and the first connecting portion of the first heat pipe are both in a first plane, the second heat conduction The second receiving portion, the second heat dissipating portion and the second connecting portion of the tube are each in a second plane, the first plane intersecting the second plane. 4. The heat sink of claim 1, wherein the first heat dissipating portion and the second heat dissipating portion extend in a direction perpendicular to the fins of the fin set. 5. The heat sink of claim 1, wherein the first connection portion of the first heat pipe and the second connection portion of the second heat pipe are in close contact with the fin group. 100108700 Form No. A0101 Page 9 of 13 1002014736-0 201237604. As for the claim ship _丨_状散_, its t :::, the first connection and the first-receive:: 妾. The p-blade and the first connecting portion and the first portion are both curved. ..., connected parts = the scope of patent application! The heat sink of the item, wherein the first official is C-shaped as a whole, the second connecting portion and the second receiving portion and the connecting portion of the second connecting portion and the second domain portion They are all curved. The heat sink of claim 1, wherein the base has two sides--a groove and a second groove, and the first groove has a shape of the first heat conduction. The first receiving portion of the tube is received in the first groove, and the second receiving portion of the second heat pipe is received in the second groove. The heat sink of claim 8, wherein the lower surface of the rotor set is provided with a first top recess and a second top recess, the first recess = and The second top recesses are both _, and correspond to the surface-shaped recesses and the first recesses respectively, respectively, the heat sinks described in the patent scope, wherein the Korean group An air guiding surface is disposed between the adjacent two rotating pieces of the mother, and the air guiding surface is perpendicular to the upper surface of the base. 100108700 Form No. A0101 Page 10 of 13 1002014736-0
TW100108700A 2011-03-11 2011-03-15 Heat sink TW201237604A (en)

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Publication number Priority date Publication date Assignee Title
CN102921829B (en) * 2012-11-22 2015-04-15 秦大庆 Connection method for radiating fins and heat pipe
CN105307448B (en) * 2014-05-28 2018-01-23 东莞永腾电子制品有限公司 Radiator
CN109425246A (en) * 2017-08-25 2019-03-05 珠海格力电器股份有限公司 A kind of radiator, outdoor unit and air conditioner
CN109341374B (en) * 2018-11-14 2024-04-09 苏州永腾电子制品有限公司 High-efficiency radiator

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CN2389343Y (en) * 1999-08-24 2000-07-26 超众科技股份有限公司 Heat-pipe fin integrated radiator
CN2478166Y (en) * 2001-04-16 2002-02-20 鼎沛股份有限公司 Radiator structure
US6958915B2 (en) * 2003-10-07 2005-10-25 Hon Hai Precision Ind. Co., Ltd. Heat dissipating device for electronic component
TWI338214B (en) * 2007-08-10 2011-03-01 Asustek Comp Inc Heat-dissipation module and detachable expansion card using the same
TW200825356A (en) * 2008-02-04 2008-06-16 chong-xian Huang Improvement on heat exchanger having a heat pipe
CN101646330B (en) * 2008-08-07 2013-06-05 富准精密工业(深圳)有限公司 Cooling device

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