US20120227938A1

US20120227938A1 - Heat sink apparatus

Info

Publication number: US20120227938A1
Application number: US13/284,984
Authority: US
Inventors: Liang Du; Jin-Biao Ji; Zhi-Jiang Yao; Li-Fu Xu
Original assignee: Hongfujin Precision Industry Wuhan Co Ltd; Hon Hai Precision Industry Co Ltd
Current assignee: Hongfujin Precision Industry Wuhan Co Ltd; Hon Hai Precision Industry Co Ltd
Priority date: 2011-03-11
Filing date: 2011-10-31
Publication date: 2012-09-13
Also published as: TW201237604A; CN102681634A

Abstract

A heat sink apparatus includes a fin module, a base, a first heat pipe, and a second heat pipe. The base includes an upper surface and a lower surface. The first heat pipe includes a first connection portion having a first end and a second end. The first end is connected to a first receiving portion. The second end is connected to a first body. The first receiving portion is in contact with the upper surface. The first body extends through the fin module in a first direction. The second heat pipe includes a second connection portion having a first end connected to a second receiving portion and a second end connected to a second body. The second receiving portion is in contact with the upper surface. The second body extends through the fin module in a second direction substantially opposite to the first direction.

Description

BACKGROUND

1. Technical Field
The disclosure generally relates to a heat sink apparatus with heat pipes.
2. Description of Related Art
Electronic components in computers, such as central processing units (CPUs), may generate a lot of heat during normal operations. Excess heat may deteriorate the operational stability of the electronic components and may damage the electronic components. Thus, excess heat must be removed quickly to maintain an acceptable operating temperature of the CPUs and other electronic components in the computers. One known method for removing heat from the CPU is by mounting a heat sink apparatus on the CPU. Such heat sink apparatus may include a heat sink and a plurality of heat pipes mounted on the heat sink. However, the heat pipes may easily come into contact other electronic elements in the computer which may cause undesirable effects on the other electronic elements.
Thus, there is room for improvement within the art.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an exploded, isometric view of an embodiment of a heat sink apparatus according to present disclosure.

FIG. 2 is another view of the heat sink apparatus of FIG. 1.

FIG. 3 is an assembled view of FIG. 1.

DETAILED DESCRIPTION

The disclosure is illustrated by way of example and not by way of limitation in the figures of the accompanying drawings in which like references indicate similar elements. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
Referring to FIGS. 1 and 2, one embodiment of a heat sink is shown. The heat sink may include a base 10, a fin module 20, a first heat pipe 30, and a second heat pipe 40.
The first heat pipe 30 may include a first receiving portion 301, a first body 302, and a first connecting portion 303. The first connection portion 303 has a first end connected to the first receiving portion 301, and a second end connected to the first body 302. The first receiving portion 301 is in contact with an upper surface of the base 10 to carry the excess heat away from a heat generating element. The first body 302 extends through the fin module 20 to deliver the excess heat to the fin module 20 for dispersion. The first receiving portion 301, the first body 302, and the first connecting portion 303 may be on a first plane. The first heat pipe 30 may has a U-shaped cross-section, taken along the first plane.
The second heat pipe 40 may include a second receiving portion 401, a second body 402, and a second connecting portion 403. The second connection portion 403 has a first end connected to the second receiving portion 401, and a second end connected to the second body 402. The second receiving portion 401 is in contact with the upper surface of the base 10 to carry the excess heat away from a heat generating element. The second body 402 extends though the fin module 20 to deliver the excess heat to the fin module 20 for dispersion. The second receiving portion 401, the second body 402, and the second connecting portion 403 may be on a second plane. The second heat pipe 40 may has a U-shaped cross-section, taken along the second plane.
A lower surface of the base 10 may be used for contacting the heat generating element, such as a CPU. The upper surface of the base 10 may comprises a first slot 101 and a second slot 102. The first slot 101 and the second slot 102 may have U-shaped cross-sections, taken along a plane substantially perpendicular to the upper surface of the base 10. The first slot 101 may be substantially parallel to the second slot 102.
The fin module 20 includes a plurality of fins 201. Each of the plurality of fins 201 is substantially perpendicular to the base 10. The fin module 20 may further comprise a first through hole 202 and a second through hole 203. A distance, measured on a plane perpendicular to the upper surface of the base 10, between the first through hole 202 and the second through hole 203 is greater than that between the first slot 101 and the second slot 102. The fin module 20 may further comprise a first association slot 204 and a second association slot 205, wherein the first association slot 204 and the second association slot 205 are relatively located to match the first slot 101 and the second slot 102, respectively. The first association slot 204 and the second association slot 205 may have U-shaped cross-sections, taken along a plane substantially perpendicular to the upper surface of the base 10.
Referring to FIG. 3, in assembly, the fin module 20 is placed on the base 10 with the first association slot 204 and the second association slot 205 aligned with the first slot 101 and the second slot 102, respectively. The first slot 101 and the first association slot 204 form a first space 103. The second slot 102 and the second association slot 205 form a second space 104. The first receiving portion 301 of the first heat pipe 30 is inserted into the first space 103, and the first body 302 is inserted into the first through hole 202 in a first direction. The second receiving portion 401 of the second heat pipe 40 is inserted into the second space 104, and the second body 402 is inserted into the second through hole 203 in a second direction. The first direction is substantially opposite to the second direction. An angle between the first plane of the first heat pipe 30 and the second plane of the second heat pipe 40 may be less than 90 degrees. The first connecting portion 303 of the first heat pipe 30 and the second connecting portion 403 are disposed on opposite side walls of the fin module 20. The first body 302 and the second body 402 are substantially perpendicular to the plurality of fins 201.
It is to be understood, however, that even though numerous characteristics and advantages have been set forth in the foregoing description of embodiments, together with details of the structures and functions of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in the matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims

1. A heat sink apparatus, comprising:

a fin module, the fin module comprises a plurality of fins;

a base, the base comprises an upper surface and a lower surface, the lower surface is adapted to be in contact with a heat generating element;

a first heat pipe, the first heat pipe comprises a first connection portion having a first end and a second end, the first end is connected to a first receiving portion, the second end is connected to a first body, and wherein the first receiving portion is in contact with the upper surface of the base, the first body extends through the fin module in a first direction for delivering heat generated by the heat generating element to the plurality of fins; and

a second heat pipe, the second heat pipe comprises a second connection portion having a first end and a second end, the first end of the second connection portion is connected to a second receiving portion, the second end of the second connection portion is connected to a second body, and wherein the second receiving portion is in contact with the upper surface of the base, the second body extends through the fin module in a second direction substantially opposite to the first direction for delivering heat generated by the heat generating element to the plurality of fins.

2. The heat sink apparatus of claim 1, wherein the first connecting portion and the second connecting portion are placed on opposite side walls which are outside of the fin module.

3. The heat sink apparatus of claim 2, wherein a distance, measured on a plane perpendicular to the upper surface of the base, between the first body and the second body is greater than a distance, measured on the plane, between the first receiving portion and the second receiving portion.

4. The heat sink apparatus of claim 1, wherein the first receiving portion, the first connecting portion, and the first body are on a first plane.

5. The heat sink apparatus of claim 4, wherein the second receiving portion, the second connecting portion, and the second body are on a second plane; and an angle less than 90 degrees is defined between the first plane and the second plane.

6. The heat sink apparatus of claim 5, wherein the second heat pipe has a U-shaped cross-section, taken along the second plane.

7. The heat sink apparatus of claim 1, wherein the base defines a first slot recessed from the upper surface of the base; the fin module defines a first association slot recessed from a surface of the fin module, wherein the first slot and the first association slot form a first space, and the first receiving portion is received in the first space.

8. The heat sink apparatus of claim 7, wherein the base defines a second slot recessed from the upper surface of the base, the second slot is substantially parallel to the first slot;

the fin module defines a second association slot recessed from the surface of the fin module, wherein the second slot and the second association slot form a second space, and the second receiving portion is received in the second space.

9. The heat sink apparatus of claim 1, wherein each of the plurality of fins is substantially perpendicular to the base.

10. A heat sink apparatus, comprising:

a fin module, the fin module comprising a plurality of fins, the plurality of fins are substantially parallel to each other;

a base, the base is adapted to be in contact with a heat generating element, the base is substantially perpendicular to the plurality of fins;

a first heat pipe, the first heat pipe comprises a first connection portion having a first end and a second end, the first end is connected to a first receiving portion, the second end is connected to a first body, and wherein the first receiving portion is in contact between the fin module and the base, the first body extends through the fin module in a first direction substantially perpendicular to the plurality of fins for delivering heat generated by the heat generating element to the plurality of fins; and

a second heat pipe, the second heat pipe comprises a second connection portion having a first end and a second end, the first end of the second connection portion is connected to a second receiving portion, the second end of the second connection portion is connected to a second body, and wherein the second receiving portion is in contact between the fin module and the base, the second body extends through the fin module in a second direction substantially opposite to the first direction to deliver heat generated by the heat generating element to the plurality of fins.

11. The heat sink apparatus of claim 10, wherein the first connecting portion and the second connecting portion are placed on opposite side walls which are outside of the fin module.

12. The heat sink apparatus of claim 11, wherein a distance, measured on a plane perpendicular to the upper surface of the base, between the first body and the second body is greater than a distance, measured on the plane, between the first receiving portion and the second receiving portion.

13. The heat sink apparatus of claim 10, wherein the first receiving portion, the first connecting portion, and the first body are on a first plane.

14. The heat sink apparatus of claim 13, wherein the second receiving portion, the second connecting portion, and the second body are on a second plane; and an angle less than 90 degrees is defined between the first plane and the second plane.

15. The heat sink apparatus of claim 14, wherein the second heat pipe has a U-shaped cross-section, taken along the second plane.

16. The heat sink apparatus of claim 10, wherein the base defines a first slot recessed from the base; the fin module defines a first association slot recessed from the fin module communicating with the first slot, wherein the first slot and the first association slot form a first space; and the first receiving portion is received in the first space.

17. The heat sink apparatus of claim 16, wherein the base defines a second slot recessed from the base, the second slot is substantially parallel to the first slot; the fin module defines a second association slot recessed from the fin module communicating with the second slot, the second slot and the second association slot form a second space; and the second receiving portion is received in the second space.

18. The heat sink apparatus of claim 10, wherein each of the plurality of fins is substantially perpendicular to the base.