TW201236138A - Light emitting diode (LED) arrays including direct die attach and related assemblies - Google Patents
Light emitting diode (LED) arrays including direct die attach and related assembliesInfo
- Publication number
- TW201236138A TW201236138A TW101104797A TW101104797A TW201236138A TW 201236138 A TW201236138 A TW 201236138A TW 101104797 A TW101104797 A TW 101104797A TW 101104797 A TW101104797 A TW 101104797A TW 201236138 A TW201236138 A TW 201236138A
- Authority
- TW
- Taiwan
- Prior art keywords
- light emitting
- emitting diode
- diode die
- electrically conductive
- conductive pads
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/027,006 US9754926B2 (en) | 2011-01-31 | 2011-02-14 | Light emitting diode (LED) arrays including direct die attach and related assemblies |
Publications (1)
Publication Number | Publication Date |
---|---|
TW201236138A true TW201236138A (en) | 2012-09-01 |
Family
ID=46672891
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101104797A TW201236138A (en) | 2011-02-14 | 2012-02-14 | Light emitting diode (LED) arrays including direct die attach and related assemblies |
Country Status (4)
Country | Link |
---|---|
US (1) | US9754926B2 (zh) |
CN (1) | CN103443939A (zh) |
TW (1) | TW201236138A (zh) |
WO (1) | WO2012112379A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI667786B (zh) * | 2018-05-31 | 2019-08-01 | 友達光電股份有限公司 | 發光二極體顯示器及其製造方法 |
Families Citing this family (55)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9172012B2 (en) | 2007-10-31 | 2015-10-27 | Cree, Inc. | Multi-chip light emitter packages and related methods |
US9082921B2 (en) | 2007-10-31 | 2015-07-14 | Cree, Inc. | Multi-die LED package |
US9666762B2 (en) | 2007-10-31 | 2017-05-30 | Cree, Inc. | Multi-chip light emitter packages and related methods |
US10008637B2 (en) | 2011-12-06 | 2018-06-26 | Cree, Inc. | Light emitter devices and methods with reduced dimensions and improved light output |
US10267506B2 (en) | 2010-11-22 | 2019-04-23 | Cree, Inc. | Solid state lighting apparatuses with non-uniformly spaced emitters for improved heat distribution, system having the same, and methods having the same |
US20150062915A1 (en) | 2013-09-05 | 2015-03-05 | Cree, Inc. | Light emitting diode devices and methods with reflective material for increased light output |
US9401103B2 (en) * | 2011-02-04 | 2016-07-26 | Cree, Inc. | LED-array light source with aspect ratio greater than 1 |
DE102011013370A1 (de) * | 2011-03-09 | 2012-09-13 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauteil |
US10686107B2 (en) | 2011-07-21 | 2020-06-16 | Cree, Inc. | Light emitter devices and components with improved chemical resistance and related methods |
TW201312807A (zh) | 2011-07-21 | 2013-03-16 | Cree Inc | 光發射器元件封裝與部件及改良化學抵抗性的方法與相關方法 |
US10211380B2 (en) | 2011-07-21 | 2019-02-19 | Cree, Inc. | Light emitting devices and components having improved chemical resistance and related methods |
US8742671B2 (en) | 2011-07-28 | 2014-06-03 | Cree, Inc. | Solid state lighting apparatus and methods using integrated driver circuitry |
US10043960B2 (en) * | 2011-11-15 | 2018-08-07 | Cree, Inc. | Light emitting diode (LED) packages and related methods |
US9496466B2 (en) | 2011-12-06 | 2016-11-15 | Cree, Inc. | Light emitter devices and methods, utilizing light emitting diodes (LEDs), for improved light extraction |
US20140339566A1 (en) * | 2011-12-14 | 2014-11-20 | Seoul Viosys Co., Ltd. | Semiconductor device and method of fabricating the same |
US9209358B2 (en) | 2011-12-14 | 2015-12-08 | Seoul Viosys Co., Ltd. | Semiconductor device and method of fabricating the same |
US9806246B2 (en) | 2012-02-07 | 2017-10-31 | Cree, Inc. | Ceramic-based light emitting diode (LED) devices, components, and methods |
US9343441B2 (en) | 2012-02-13 | 2016-05-17 | Cree, Inc. | Light emitter devices having improved light output and related methods |
US9240530B2 (en) | 2012-02-13 | 2016-01-19 | Cree, Inc. | Light emitter devices having improved chemical and physical resistance and related methods |
US11160148B2 (en) | 2017-06-13 | 2021-10-26 | Ideal Industries Lighting Llc | Adaptive area lamp |
US11792898B2 (en) | 2012-07-01 | 2023-10-17 | Ideal Industries Lighting Llc | Enhanced fixtures for area lighting |
US8765500B2 (en) * | 2012-08-24 | 2014-07-01 | Tsmc Solid State Lighting Ltd. | Method and apparatus for fabricating phosphor-coated LED dies |
KR101973613B1 (ko) * | 2012-09-13 | 2019-04-29 | 엘지이노텍 주식회사 | 발광 소자 및 이를 구비한 조명 시스템 |
WO2014041463A2 (en) * | 2012-09-17 | 2014-03-20 | Koninklijke Philips N.V. | Light emitting device including shaped substrate |
US10439107B2 (en) | 2013-02-05 | 2019-10-08 | Cree, Inc. | Chip with integrated phosphor |
US9318674B2 (en) * | 2013-02-05 | 2016-04-19 | Cree, Inc. | Submount-free light emitting diode (LED) components and methods of fabricating same |
US9431590B2 (en) | 2013-03-15 | 2016-08-30 | Cree, Inc. | Ceramic based light emitting diode (LED) devices and methods |
TWM458672U (zh) * | 2013-04-10 | 2013-08-01 | Genesis Photonics Inc | 光源模組 |
US9219202B2 (en) | 2013-04-19 | 2015-12-22 | Cree, Inc. | Semiconductor light emitting devices including red phosphors that exhibit good color rendering properties and related red phosphors |
TWM461876U (zh) * | 2013-05-17 | 2013-09-11 | Genesis Photonics Inc | 覆晶式發光二極體單元 |
CN103400833A (zh) * | 2013-07-29 | 2013-11-20 | 深圳市天电光电科技有限公司 | Led模组及其制造方法 |
US10074781B2 (en) | 2013-08-29 | 2018-09-11 | Cree, Inc. | Semiconductor light emitting devices including multiple red phosphors that exhibit good color rendering properties with increased brightness |
DE102014100772B4 (de) * | 2014-01-23 | 2022-11-03 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung von optoelektronischen Halbleiterbauelementen und optoelektronisches Halbleiterbauelement |
JP6277875B2 (ja) * | 2014-06-12 | 2018-02-14 | 豊田合成株式会社 | 発光装置及びその製造方法 |
TWI641285B (zh) * | 2014-07-14 | 2018-11-11 | 新世紀光電股份有限公司 | 發光模組與發光單元的製作方法 |
JP2016048718A (ja) * | 2014-08-27 | 2016-04-07 | 豊田合成株式会社 | 発光装置 |
US10622522B2 (en) * | 2014-09-05 | 2020-04-14 | Theodore Lowes | LED packages with chips having insulated surfaces |
US9826581B2 (en) | 2014-12-05 | 2017-11-21 | Cree, Inc. | Voltage configurable solid state lighting apparatuses, systems, and related methods |
US10431568B2 (en) | 2014-12-18 | 2019-10-01 | Cree, Inc. | Light emitting diodes, components and related methods |
US10192854B2 (en) * | 2016-06-24 | 2019-01-29 | Cree, Inc. | Light emitter components and related methods |
DE102015109413A1 (de) * | 2015-06-12 | 2016-12-15 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung von optoelektronischen Konversions-Halbleiterchips und Verbund von Konversions-Halbleiterchips |
GB2541970B (en) * | 2015-09-02 | 2020-08-19 | Facebook Tech Llc | Display manufacture |
TWI552385B (zh) * | 2015-09-04 | 2016-10-01 | 錼創科技股份有限公司 | 發光元件 |
US10170455B2 (en) | 2015-09-04 | 2019-01-01 | PlayNitride Inc. | Light emitting device with buffer pads |
KR102409966B1 (ko) * | 2015-09-17 | 2022-06-16 | 삼성전자주식회사 | 광원 모듈의 제조방법 |
DE102016105777A1 (de) * | 2016-03-30 | 2017-10-05 | Osram Opto Semiconductors Gmbh | Bauelement |
US10529696B2 (en) | 2016-04-12 | 2020-01-07 | Cree, Inc. | High density pixelated LED and devices and methods thereof |
WO2019028314A1 (en) | 2017-08-03 | 2019-02-07 | Cree, Inc. | HIGH DENSITY PIXELIZED LED CHIPS AND NETWORK DEVICES AND METHODS OF MANUFACTURE |
US10734363B2 (en) | 2017-08-03 | 2020-08-04 | Cree, Inc. | High density pixelated-LED chips and chip array devices |
KR101980548B1 (ko) * | 2017-11-09 | 2019-05-21 | 엘지전자 주식회사 | 차량용 램프 및 차량 |
TWI672830B (zh) * | 2018-01-25 | 2019-09-21 | 致伸科技股份有限公司 | 光源模組 |
US10529773B2 (en) | 2018-02-14 | 2020-01-07 | Cree, Inc. | Solid state lighting devices with opposing emission directions |
US10903265B2 (en) | 2018-12-21 | 2021-01-26 | Cree, Inc. | Pixelated-LED chips and chip array devices, and fabrication methods |
WO2021087109A1 (en) | 2019-10-29 | 2021-05-06 | Cree, Inc. | Texturing for high density pixelated-led chips |
US11437548B2 (en) | 2020-10-23 | 2022-09-06 | Creeled, Inc. | Pixelated-LED chips with inter-pixel underfill materials, and fabrication methods |
Family Cites Families (85)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4916464A (en) * | 1987-04-22 | 1990-04-10 | Oki Electric Industry Co., Ltd. | Light emitting diode array print head having no bonding wire connections |
US4918497A (en) | 1988-12-14 | 1990-04-17 | Cree Research, Inc. | Blue light emitting diode formed in silicon carbide |
US5027168A (en) | 1988-12-14 | 1991-06-25 | Cree Research, Inc. | Blue light emitting diode formed in silicon carbide |
US4966862A (en) | 1989-08-28 | 1990-10-30 | Cree Research, Inc. | Method of production of light emitting diodes |
US5210051A (en) | 1990-03-27 | 1993-05-11 | Cree Research, Inc. | High efficiency light emitting diodes from bipolar gallium nitride |
US5309001A (en) * | 1991-11-25 | 1994-05-03 | Sharp Kabushiki Kaisha | Light-emitting diode having a surface electrode of a tree-like form |
US5337179A (en) | 1992-07-27 | 1994-08-09 | Hodges Marvin P | Flexible controllable optical surface and method of making the same |
US5416342A (en) | 1993-06-23 | 1995-05-16 | Cree Research, Inc. | Blue light-emitting diode with high external quantum efficiency |
US5338944A (en) | 1993-09-22 | 1994-08-16 | Cree Research, Inc. | Blue light-emitting diode with degenerate junction structure |
US5393993A (en) | 1993-12-13 | 1995-02-28 | Cree Research, Inc. | Buffer structure between silicon carbide and gallium nitride and resulting semiconductor devices |
JPH07254732A (ja) | 1994-03-15 | 1995-10-03 | Toshiba Corp | 半導体発光装置 |
US5604135A (en) | 1994-08-12 | 1997-02-18 | Cree Research, Inc. | Method of forming green light emitting diode in silicon carbide |
US5523589A (en) | 1994-09-20 | 1996-06-04 | Cree Research, Inc. | Vertical geometry light emitting diode with group III nitride active layer and extended lifetime |
US5631190A (en) | 1994-10-07 | 1997-05-20 | Cree Research, Inc. | Method for producing high efficiency light-emitting diodes and resulting diode structures |
US5739554A (en) | 1995-05-08 | 1998-04-14 | Cree Research, Inc. | Double heterojunction light emitting diode with gallium nitride active layer |
US6201262B1 (en) | 1997-10-07 | 2001-03-13 | Cree, Inc. | Group III nitride photonic devices on silicon carbide substrates with conductive buffer interlay structure |
US6614056B1 (en) * | 1999-12-01 | 2003-09-02 | Cree Lighting Company | Scalable led with improved current spreading structures |
US6791119B2 (en) | 2001-02-01 | 2004-09-14 | Cree, Inc. | Light emitting diodes including modifications for light extraction |
US6958497B2 (en) | 2001-05-30 | 2005-10-25 | Cree, Inc. | Group III nitride based light emitting diode structures with a quantum well and superlattice, group III nitride based quantum well structures and group III nitride based superlattice structures |
US7858403B2 (en) | 2001-10-31 | 2010-12-28 | Cree, Inc. | Methods and systems for fabricating broad spectrum light emitting devices |
US7072096B2 (en) | 2001-12-14 | 2006-07-04 | Digital Optics International, Corporation | Uniform illumination system |
ATE543221T1 (de) | 2002-09-19 | 2012-02-15 | Cree Inc | Leuchtstoffbeschichtete leuchtdioden mit verjüngten seitenwänden und herstellungsverfahren dafür |
US6871982B2 (en) | 2003-01-24 | 2005-03-29 | Digital Optics International Corporation | High-density illumination system |
US20040188696A1 (en) | 2003-03-28 | 2004-09-30 | Gelcore, Llc | LED power package |
US7108386B2 (en) | 2003-05-12 | 2006-09-19 | Illumitech Inc. | High-brightness LED-phosphor coupling |
WO2005027576A2 (en) | 2003-09-08 | 2005-03-24 | Nanocrystal Lighting Corporation | Light efficient packaging configurations for led lamps using high refractive index encapsulants |
US7262467B2 (en) * | 2003-09-10 | 2007-08-28 | Ixys Corporation | Over charge protection device |
WO2005031882A1 (ja) | 2003-09-30 | 2005-04-07 | Kabushiki Kaisha Toshiba | 発光装置 |
US20080035947A1 (en) | 2003-12-09 | 2008-02-14 | Weaver Jr Stanton Earl | Surface Mount Light Emitting Chip Package |
TWI227570B (en) | 2003-12-11 | 2005-02-01 | South Epitaxy Corp | Light-emitting diode packaging structure |
KR100634502B1 (ko) | 2004-02-13 | 2006-10-13 | 삼성에스디아이 주식회사 | 양극과 음극사이에 바이패스 트랜지스터가 구비된유기발광소자 및 그 제조 방법 |
JP4330476B2 (ja) * | 2004-03-29 | 2009-09-16 | スタンレー電気株式会社 | 半導体発光素子 |
US7326583B2 (en) | 2004-03-31 | 2008-02-05 | Cree, Inc. | Methods for packaging of a semiconductor light emitting device |
US7285801B2 (en) | 2004-04-02 | 2007-10-23 | Lumination, Llc | LED with series-connected monolithically integrated mesas |
TWI244226B (en) | 2004-11-05 | 2005-11-21 | Chen Jen Shian | Manufacturing method of flip-chip light-emitting device |
US7795623B2 (en) | 2004-06-30 | 2010-09-14 | Cree, Inc. | Light emitting devices having current reducing structures and methods of forming light emitting devices having current reducing structures |
US7476337B2 (en) | 2004-07-28 | 2009-01-13 | Dowa Electronics Materials Co., Ltd. | Phosphor and manufacturing method for the same, and light source |
US7081667B2 (en) * | 2004-09-24 | 2006-07-25 | Gelcore, Llc | Power LED package |
US20060097385A1 (en) | 2004-10-25 | 2006-05-11 | Negley Gerald H | Solid metal block semiconductor light emitting device mounting substrates and packages including cavities and heat sinks, and methods of packaging same |
US7772609B2 (en) | 2004-10-29 | 2010-08-10 | Ledengin, Inc. (Cayman) | LED package with structure and materials for high heat dissipation |
TWI285968B (en) * | 2004-12-01 | 2007-08-21 | Chiu-Chung Yang | Chip with high efficient heat dissipation and brightness |
US20060124953A1 (en) | 2004-12-14 | 2006-06-15 | Negley Gerald H | Semiconductor light emitting device mounting substrates and packages including cavities and cover plates, and methods of packaging same |
US7821023B2 (en) | 2005-01-10 | 2010-10-26 | Cree, Inc. | Solid state lighting component |
US9793247B2 (en) * | 2005-01-10 | 2017-10-17 | Cree, Inc. | Solid state lighting component |
US9070850B2 (en) | 2007-10-31 | 2015-06-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
US7221044B2 (en) | 2005-01-21 | 2007-05-22 | Ac Led Lighting, L.L.C. | Heterogeneous integrated high voltage DC/AC light emitter |
KR100631969B1 (ko) * | 2005-02-28 | 2006-10-11 | 삼성전기주식회사 | 질화물 반도체 발광소자 |
US7411225B2 (en) | 2005-03-21 | 2008-08-12 | Lg Electronics Inc. | Light source apparatus |
US7646035B2 (en) | 2006-05-31 | 2010-01-12 | Cree, Inc. | Packaged light emitting devices including multiple index lenses and multiple index lenses for packaged light emitting devices |
US7745985B2 (en) * | 2005-11-04 | 2010-06-29 | Panasonic Corporation | Light-emitting module, and display unit and lighting unit using the same |
US7442564B2 (en) | 2006-01-19 | 2008-10-28 | Cree, Inc. | Dispensed electrical interconnections |
US7521728B2 (en) | 2006-01-20 | 2009-04-21 | Cree, Inc. | Packages for semiconductor light emitting devices utilizing dispensed reflectors and methods of forming the same |
US7852009B2 (en) | 2006-01-25 | 2010-12-14 | Cree, Inc. | Lighting device circuit with series-connected solid state light emitters and current regulator |
US7737634B2 (en) | 2006-03-06 | 2010-06-15 | Avago Technologies General Ip (Singapore) Pte. Ltd. | LED devices having improved containment for liquid encapsulant |
US8062925B2 (en) | 2006-05-16 | 2011-11-22 | Koninklijke Philips Electronics N.V. | Process for preparing a semiconductor light-emitting device for mounting |
JP5351034B2 (ja) | 2006-10-12 | 2013-11-27 | クリー インコーポレイテッド | 照明装置、および、その製造方法 |
US9441793B2 (en) | 2006-12-01 | 2016-09-13 | Cree, Inc. | High efficiency lighting device including one or more solid state light emitters, and method of lighting |
DE102007008524A1 (de) * | 2007-02-21 | 2008-08-28 | Osram Opto Semiconductors Gmbh | Strahlung emittierender Chip mit mindestens einem Halbleiterkörper |
US7638814B2 (en) | 2007-06-19 | 2009-12-29 | Philips Lumileds Lighting Company, Llc | Solderless integrated package connector and heat sink for LED |
DE102007029369A1 (de) | 2007-06-26 | 2009-01-02 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements |
US8368100B2 (en) * | 2007-11-14 | 2013-02-05 | Cree, Inc. | Semiconductor light emitting diodes having reflective structures and methods of fabricating same |
JP5340583B2 (ja) | 2007-11-26 | 2013-11-13 | スタンレー電気株式会社 | 半導体発光装置 |
US8000129B2 (en) | 2007-12-19 | 2011-08-16 | Contour Semiconductor, Inc. | Field-emitter-based memory array with phase-change storage devices |
US7717591B2 (en) | 2007-12-27 | 2010-05-18 | Lumination Llc | Incorporating reflective layers into LED systems and/or components |
US8878219B2 (en) | 2008-01-11 | 2014-11-04 | Cree, Inc. | Flip-chip phosphor coating method and devices fabricated utilizing method |
US8940561B2 (en) | 2008-01-15 | 2015-01-27 | Cree, Inc. | Systems and methods for application of optical materials to optical elements |
JPWO2009107535A1 (ja) | 2008-02-25 | 2011-06-30 | 株式会社東芝 | 白色ledランプ、バックライト、発光装置、表示装置および照明装置 |
KR100988041B1 (ko) * | 2008-05-15 | 2010-10-18 | 주식회사 에피밸리 | 반도체 발광소자 |
US9147812B2 (en) | 2008-06-24 | 2015-09-29 | Cree, Inc. | Methods of assembly for a semiconductor light emitting device package |
US7800125B2 (en) | 2008-07-09 | 2010-09-21 | Himax Display, Inc. | Light-emitting diode package |
US8022626B2 (en) | 2008-09-16 | 2011-09-20 | Osram Sylvania Inc. | Lighting module |
US7854365B2 (en) | 2008-10-27 | 2010-12-21 | Asm Assembly Automation Ltd | Direct die attach utilizing heated bond head |
JP2010114144A (ja) | 2008-11-04 | 2010-05-20 | Fdk Module System Technology Corp | Led実装基板、および照明装置 |
US8062916B2 (en) | 2008-11-06 | 2011-11-22 | Koninklijke Philips Electronics N.V. | Series connected flip chip LEDs with growth substrate removed |
JP4808244B2 (ja) | 2008-12-09 | 2011-11-02 | スタンレー電気株式会社 | 半導体発光装置およびその製造方法 |
TW201034256A (en) * | 2008-12-11 | 2010-09-16 | Illumitex Inc | Systems and methods for packaging light-emitting diode devices |
US8039862B2 (en) | 2009-03-10 | 2011-10-18 | Nepes Led Corporation | White light emitting diode package having enhanced white lighting efficiency and method of making the same |
US8168998B2 (en) | 2009-06-09 | 2012-05-01 | Koninklijke Philips Electronics N.V. | LED with remote phosphor layer and reflective submount |
US8384114B2 (en) | 2009-06-27 | 2013-02-26 | Cooledge Lighting Inc. | High efficiency LEDs and LED lamps |
US20110018013A1 (en) | 2009-07-21 | 2011-01-27 | Koninklijke Philips Electronics N.V. | Thin-film flip-chip series connected leds |
TWI384654B (zh) * | 2009-07-31 | 2013-02-01 | Univ Nat Taiwan Science Tech | 色溫可調之白光發光裝置 |
TW201115716A (en) | 2009-10-30 | 2011-05-01 | Paragon Sc Lighting Tech Co | LED package structure for generating similar-circle light-emitting effect by single wire or dual wire bonding method alternatively |
JP5659519B2 (ja) | 2009-11-19 | 2015-01-28 | 豊田合成株式会社 | 発光装置、発光装置の製造方法、発光装置の実装方法及び光源装置 |
US8492777B2 (en) | 2010-04-09 | 2013-07-23 | Everlight Electronics Co., Ltd. | Light emitting diode package, lighting device and light emitting diode package substrate |
US8530909B2 (en) | 2010-12-27 | 2013-09-10 | Micron Technology, Inc. | Array assemblies with high voltage solid state lighting dies |
-
2011
- 2011-02-14 US US13/027,006 patent/US9754926B2/en active Active
-
2012
- 2012-02-10 WO PCT/US2012/024580 patent/WO2012112379A1/en active Application Filing
- 2012-02-10 CN CN2012800147486A patent/CN103443939A/zh active Pending
- 2012-02-14 TW TW101104797A patent/TW201236138A/zh unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI667786B (zh) * | 2018-05-31 | 2019-08-01 | 友達光電股份有限公司 | 發光二極體顯示器及其製造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN103443939A (zh) | 2013-12-11 |
US9754926B2 (en) | 2017-09-05 |
US20120193649A1 (en) | 2012-08-02 |
WO2012112379A1 (en) | 2012-08-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW201236138A (en) | Light emitting diode (LED) arrays including direct die attach and related assemblies | |
WO2011083923A3 (en) | Light emitting diode having electrode pads | |
EP2360744A3 (en) | Light emitting diode and method of manufacturing the same | |
WO2012026695A3 (en) | Light emitting diode with improved luminous efficiency | |
WO2011160051A3 (en) | Nanowire led structure and method for manufacturing the same | |
EP4220743A3 (en) | Light emitting diode | |
WO2008057491A3 (en) | Transparent electrode for led array | |
EP2362450A3 (en) | Light emitting diode, light emitting diode package, method of manufacturing light emitting diode and illumination system | |
WO2011145850A3 (en) | High efficiency light emitting diode and method of fabricating the same | |
EP2787542A3 (en) | Light emitting diode | |
TWI411143B (en) | Led package structure with a plurality of standby pads for increasing wire-bonding yield and method for manufacturing the same | |
WO2012061183A3 (en) | Flexible led device for thermal management and method of making | |
EP2360748A3 (en) | Light emitting device and light emitting device package | |
TW200735322A (en) | High power light emitting device assembly with ESD preotection ability and the method of manufacturing the same | |
TW201130172A (en) | Light emitting device | |
EP2657967A3 (en) | Light emitting module | |
EP2378572A3 (en) | Electrode configuration for a light emitting device | |
EP2378571A3 (en) | Light emitting device, light emitting device package, and lighting system | |
EP2701211A3 (en) | Light emitting device | |
WO2013015551A3 (ko) | 반도체 발광부 연결체 | |
TW200943601A (en) | Organic luminous diode, contact arrangement and method for the production of an organic luminous diode | |
EP2280431A3 (en) | Light emitting device | |
EP2562814A3 (en) | Light emitting device and light emitting device package | |
WO2013083528A3 (de) | Halbleiterleuchte | |
GB2532869A (en) | Semiconductor die and package jigsaw submount |