TW201233971A - Heat dissipation device and manufacture method thereof - Google Patents

Heat dissipation device and manufacture method thereof Download PDF

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Publication number
TW201233971A
TW201233971A TW100104986A TW100104986A TW201233971A TW 201233971 A TW201233971 A TW 201233971A TW 100104986 A TW100104986 A TW 100104986A TW 100104986 A TW100104986 A TW 100104986A TW 201233971 A TW201233971 A TW 201233971A
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TW
Taiwan
Prior art keywords
heat
heat dissipation
heat sink
fin
group
Prior art date
Application number
TW100104986A
Other languages
English (en)
Chinese (zh)
Other versions
TWI403686B (enrdf_load_stackoverflow
Inventor
Liang-Jun Lu
Feng-Zhi Lian
Rong-Bin Lin
Original Assignee
Liang-Jun Lu
Feng-Zhi Lian
Rong-Bin Lin
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Liang-Jun Lu, Feng-Zhi Lian, Rong-Bin Lin filed Critical Liang-Jun Lu
Priority to TW100104986A priority Critical patent/TW201233971A/zh
Publication of TW201233971A publication Critical patent/TW201233971A/zh
Application granted granted Critical
Publication of TWI403686B publication Critical patent/TWI403686B/zh

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  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW100104986A 2011-02-15 2011-02-15 Heat dissipation device and manufacture method thereof TW201233971A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW100104986A TW201233971A (en) 2011-02-15 2011-02-15 Heat dissipation device and manufacture method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW100104986A TW201233971A (en) 2011-02-15 2011-02-15 Heat dissipation device and manufacture method thereof

Publications (2)

Publication Number Publication Date
TW201233971A true TW201233971A (en) 2012-08-16
TWI403686B TWI403686B (enrdf_load_stackoverflow) 2013-08-01

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Family Applications (1)

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TW100104986A TW201233971A (en) 2011-02-15 2011-02-15 Heat dissipation device and manufacture method thereof

Country Status (1)

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TW (1) TW201233971A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106852073A (zh) * 2017-01-13 2017-06-13 奇鋐科技股份有限公司 散热模组
CN116713706A (zh) * 2023-05-31 2023-09-08 深圳市鸿慷电子有限公司 一种鳍片式散热器加工方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7779897B2 (en) * 2007-07-02 2010-08-24 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with heat pipes
TWM337778U (en) * 2007-09-28 2008-08-01 Asia Vital Components Co Ltd Heat dissipation module
CN101528019A (zh) * 2008-03-07 2009-09-09 富准精密工业(深圳)有限公司 散热装置
JP2010153443A (ja) * 2008-12-24 2010-07-08 Fujitsu Ltd 冷却装置、冷却装置の製造方法及び電子機器
TWM368122U (en) * 2009-03-17 2009-11-01 Jia-Ting Wan Heat fin with improved heat dissipation for computer and electronic device
TWM397509U (en) * 2010-09-07 2011-02-01 Asia Vital Components Co Ltd Heat sink structure

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106852073A (zh) * 2017-01-13 2017-06-13 奇鋐科技股份有限公司 散热模组
CN116713706A (zh) * 2023-05-31 2023-09-08 深圳市鸿慷电子有限公司 一种鳍片式散热器加工方法

Also Published As

Publication number Publication date
TWI403686B (enrdf_load_stackoverflow) 2013-08-01

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