TWI403686B - - Google Patents

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Publication number
TWI403686B
TWI403686B TW100104986A TW100104986A TWI403686B TW I403686 B TWI403686 B TW I403686B TW 100104986 A TW100104986 A TW 100104986A TW 100104986 A TW100104986 A TW 100104986A TW I403686 B TWI403686 B TW I403686B
Authority
TW
Taiwan
Prior art keywords
heat dissipation
dissipation fin
heat
assemblies
contact surface
Prior art date
Application number
TW100104986A
Other languages
English (en)
Chinese (zh)
Other versions
TW201233971A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW100104986A priority Critical patent/TW201233971A/zh
Publication of TW201233971A publication Critical patent/TW201233971A/zh
Application granted granted Critical
Publication of TWI403686B publication Critical patent/TWI403686B/zh

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  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW100104986A 2011-02-15 2011-02-15 Heat dissipation device and manufacture method thereof TW201233971A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW100104986A TW201233971A (en) 2011-02-15 2011-02-15 Heat dissipation device and manufacture method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW100104986A TW201233971A (en) 2011-02-15 2011-02-15 Heat dissipation device and manufacture method thereof

Publications (2)

Publication Number Publication Date
TW201233971A TW201233971A (en) 2012-08-16
TWI403686B true TWI403686B (enrdf_load_stackoverflow) 2013-08-01

Family

ID=47070032

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100104986A TW201233971A (en) 2011-02-15 2011-02-15 Heat dissipation device and manufacture method thereof

Country Status (1)

Country Link
TW (1) TW201233971A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106852073B (zh) * 2017-01-13 2019-06-07 奇鋐科技股份有限公司 散热模组
CN116713706A (zh) * 2023-05-31 2023-09-08 深圳市鸿慷电子有限公司 一种鳍片式散热器加工方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM337778U (en) * 2007-09-28 2008-08-01 Asia Vital Components Co Ltd Heat dissipation module
CN101528019A (zh) * 2008-03-07 2009-09-09 富准精密工业(深圳)有限公司 散热装置
TWM368122U (en) * 2009-03-17 2009-11-01 Jia-Ting Wan Heat fin with improved heat dissipation for computer and electronic device
JP2010153443A (ja) * 2008-12-24 2010-07-08 Fujitsu Ltd 冷却装置、冷却装置の製造方法及び電子機器
US7779897B2 (en) * 2007-07-02 2010-08-24 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with heat pipes
TWM397509U (en) * 2010-09-07 2011-02-01 Asia Vital Components Co Ltd Heat sink structure

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7779897B2 (en) * 2007-07-02 2010-08-24 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with heat pipes
TWM337778U (en) * 2007-09-28 2008-08-01 Asia Vital Components Co Ltd Heat dissipation module
CN101528019A (zh) * 2008-03-07 2009-09-09 富准精密工业(深圳)有限公司 散热装置
JP2010153443A (ja) * 2008-12-24 2010-07-08 Fujitsu Ltd 冷却装置、冷却装置の製造方法及び電子機器
TWM368122U (en) * 2009-03-17 2009-11-01 Jia-Ting Wan Heat fin with improved heat dissipation for computer and electronic device
TWM397509U (en) * 2010-09-07 2011-02-01 Asia Vital Components Co Ltd Heat sink structure

Also Published As

Publication number Publication date
TW201233971A (en) 2012-08-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees