TWI403686B - - Google Patents

Info

Publication number
TWI403686B
TWI403686B TW100104986A TW100104986A TWI403686B TW I403686 B TWI403686 B TW I403686B TW 100104986 A TW100104986 A TW 100104986A TW 100104986 A TW100104986 A TW 100104986A TW I403686 B TWI403686 B TW I403686B
Authority
TW
Taiwan
Prior art keywords
heat dissipation
dissipation fin
heat
assemblies
contact surface
Prior art date
Application number
TW100104986A
Other languages
Chinese (zh)
Other versions
TW201233971A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW100104986A priority Critical patent/TW201233971A/en
Publication of TW201233971A publication Critical patent/TW201233971A/en
Application granted granted Critical
Publication of TWI403686B publication Critical patent/TWI403686B/zh

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The present invention provides a method for manufacturing heat dissipation device, which comprises the following steps: providing a plurality of heat dissipation fin assemblies and a heat pipe, each heat dissipation fin having a joint surface, the heat pipe comprising a contact surface; carrying out anodizing treatment on the plurality of heat dissipation fin assemblies; carrying out surface roughening treatment on the joint surface of each heat dissipation fin assembly; spraying a metal substance to the contact surface, stacking the plurality of heat dissipation assemblies to interpose the heat pipe with the joint surface of each heat dissipation assembly engaging the contact surface; and applying solder paste to weld the heat dissipation fin assembly. With the above manufacture method, the purposes of increasing heat conduction rate, showing color variation, and causing no thermal resistance can be achieved. The present invention also relates to a heat dissipation device manufactured by the above method.
TW100104986A 2011-02-15 2011-02-15 Heat dissipation device and manufacture method thereof TW201233971A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW100104986A TW201233971A (en) 2011-02-15 2011-02-15 Heat dissipation device and manufacture method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW100104986A TW201233971A (en) 2011-02-15 2011-02-15 Heat dissipation device and manufacture method thereof

Publications (2)

Publication Number Publication Date
TW201233971A TW201233971A (en) 2012-08-16
TWI403686B true TWI403686B (en) 2013-08-01

Family

ID=47070032

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100104986A TW201233971A (en) 2011-02-15 2011-02-15 Heat dissipation device and manufacture method thereof

Country Status (1)

Country Link
TW (1) TW201233971A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106852073B (en) * 2017-01-13 2019-06-07 奇鋐科技股份有限公司 Heat radiation module
CN116713706A (en) * 2023-05-31 2023-09-08 深圳市鸿慷电子有限公司 Fin type radiator processing method

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM337778U (en) * 2007-09-28 2008-08-01 Asia Vital Components Co Ltd Heat dissipation module
CN101528019A (en) * 2008-03-07 2009-09-09 富准精密工业(深圳)有限公司 Heat radiating device
TWM368122U (en) * 2009-03-17 2009-11-01 Jia-Ting Wan Heat fin with improved heat dissipation for computer and electronic device
JP2010153443A (en) * 2008-12-24 2010-07-08 Fujitsu Ltd Cooling device, cooling-device manufacturing method, and electronic apparatus
US7779897B2 (en) * 2007-07-02 2010-08-24 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with heat pipes
TWM397509U (en) * 2010-09-07 2011-02-01 Asia Vital Components Co Ltd Heat sink structure

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7779897B2 (en) * 2007-07-02 2010-08-24 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with heat pipes
TWM337778U (en) * 2007-09-28 2008-08-01 Asia Vital Components Co Ltd Heat dissipation module
CN101528019A (en) * 2008-03-07 2009-09-09 富准精密工业(深圳)有限公司 Heat radiating device
JP2010153443A (en) * 2008-12-24 2010-07-08 Fujitsu Ltd Cooling device, cooling-device manufacturing method, and electronic apparatus
TWM368122U (en) * 2009-03-17 2009-11-01 Jia-Ting Wan Heat fin with improved heat dissipation for computer and electronic device
TWM397509U (en) * 2010-09-07 2011-02-01 Asia Vital Components Co Ltd Heat sink structure

Also Published As

Publication number Publication date
TW201233971A (en) 2012-08-16

Similar Documents

Publication Publication Date Title
AU2012333908A8 (en) Manufacturing process of high-power LED radiating structure
EP2816593A4 (en) Solder joint structure, power module, heat-sink-attached substrate for power module, method for producing said substrate, and paste for forming solder underlayer
EP2808410A4 (en) Aluminum alloy for heat exchanger fin and manufacturing method therefor, as well as heat exchanger using said aluminum alloy
EP3018708A4 (en) Method of manufacturing heat conductive sheet, heat conductive sheet, and heat dissipation member
EP2811513A4 (en) Substrate for power modules, substrate with heat sink for power modules, power module, method for producing substrate for power modules, and paste for bonding copper member
MX2013007639A (en) Process for manufacturing heat sink structure for high-power led.
WO2013003020A3 (en) Integral thermoelectric generator for wireless devices
BR112015023837A2 (en) composition for application to a metal substrate, article and method for manufacturing a coated article
EP2833398A4 (en) Substrate for power module, substrate for power module with heat sink, power module, and method for manufacturing substrate for power module
EP2816047A4 (en) Fluorine-containing ether compound, fluorine-containing ether composition and coating fluid, and substrate having surface-treated layer and method for producing said substrate
EP2814056A4 (en) Semiconductor device, method for attaching heat dissipating member to semiconductor device, and method for manufacturing semiconductor device
EP2816046A4 (en) Fluorine-containing ether compound, fluorine-containing ether composition and coating fluid, and substrate having surface-treated layer and method for producing said substrate
EP2816045A4 (en) Fluorine-containing ether compound, fluorine-containing ether composition and coating fluid, and substrate having surface-treated layer and method for producing said substrate
WO2012148218A3 (en) Horizontal thermoelectric tape and method for manufacturing same
BR112015023836A2 (en) composition for application to a metallic substrate, coated article and method for manufacturing a coated article
EP3239363A4 (en) Fe-ni alloy metal foil having excellent heat resilience and method for manufacturing same
BR112015023290A2 (en) thermal spray powder, method of manufacturing a thermal spray powder, thermal spray coating formed of a thermal spray powder, and method of forming a thermal spray coating on a substrate
EP2835433A4 (en) Cu-mg-p-based copper alloy plate having excellent fatigue resistance, and method for manufacturing same
EP2840596A4 (en) Solder bump and forming method therefor, and substrate having solder bump and manufacturing method for substrate having solder bump
WO2012158125A8 (en) Method of improving electrical conductivity of pedot:pss
EP2719987A4 (en) Heat exchange member, manufacturing method therefor, and heat exchanger
EP3196930A4 (en) Assembly, power-module substrate provided with heat sink, heat sink, method for manufacturing assembly, method for manufacturing power-module substrate provided with heat sink, and method for manufacturing heat sink
EP2735391A4 (en) Composite material for heat dissipating substrate, and method for manufacturing composite material for heat dissipating substrate
EP3084332A4 (en) Tubing for heat exchange, and a method for improving heat exchange
IN2014CN02438A (en)

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees