MX2013007639A - Process for manufacturing heat sink structure for high-power led. - Google Patents

Process for manufacturing heat sink structure for high-power led.

Info

Publication number
MX2013007639A
MX2013007639A MX2013007639A MX2013007639A MX2013007639A MX 2013007639 A MX2013007639 A MX 2013007639A MX 2013007639 A MX2013007639 A MX 2013007639A MX 2013007639 A MX2013007639 A MX 2013007639A MX 2013007639 A MX2013007639 A MX 2013007639A
Authority
MX
Mexico
Prior art keywords
heat
column
positioning hole
fixing holes
pcb
Prior art date
Application number
MX2013007639A
Other languages
Spanish (es)
Inventor
Xiaofeng Bi
Original Assignee
Dongguan Kingsun Optoelect Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongguan Kingsun Optoelect Co filed Critical Dongguan Kingsun Optoelect Co
Publication of MX2013007639A publication Critical patent/MX2013007639A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0075—Processes relating to semiconductor body packages relating to heat extraction or cooling elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10242—Metallic cylinders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10401—Eyelets, i.e. rings inserted into a hole through a circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Abstract

A process for manufacturing a heat sink structure for a high-power LED, comprising the following steps: forming a first positioning hole and first fixing holes through a PCB; forming a second positioning hole and second fixing holes through a heat-conductive plate; passing fixed columns though the first fixing holes and the second fixing holes, and fixedly connecting the PCB and the heat-conductive plate such that the two form an integral whole; passing a heat-conductive column through the first positioning hole and the second positioning hole, such that the upper end of said column extends beyond the PCB; placing said integral whole on a stamping apparatus for stamping, modifying the length of the extended end of said column. The process allows for an enlarged heat-conductive column cross-section, an interference fit between the column and positioning holes, and an enlarged LED substrate contact area, which facilitates heat conduction.
MX2013007639A 2011-11-09 2012-08-30 Process for manufacturing heat sink structure for high-power led. MX2013007639A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN2011103514802A CN102403419B (en) 2011-11-09 2011-11-09 Manufacturing technology of high-power LED radiating structure
PCT/CN2012/080773 WO2013067842A1 (en) 2011-11-09 2012-08-30 Process for manufacturing heat sink structure for high-power led

Publications (1)

Publication Number Publication Date
MX2013007639A true MX2013007639A (en) 2014-03-05

Family

ID=45885422

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2013007639A MX2013007639A (en) 2011-11-09 2012-08-30 Process for manufacturing heat sink structure for high-power led.

Country Status (12)

Country Link
US (1) US8757473B2 (en)
EP (1) EP2642532A4 (en)
JP (1) JP5585924B2 (en)
KR (1) KR101507668B1 (en)
CN (1) CN102403419B (en)
AU (1) AU2012333910B2 (en)
BR (1) BR112013015298A2 (en)
CA (1) CA2818087C (en)
CL (1) CL2013002184A1 (en)
MX (1) MX2013007639A (en)
MY (1) MY167526A (en)
WO (1) WO2013067842A1 (en)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102403419B (en) * 2011-11-09 2013-08-21 东莞勤上光电股份有限公司 Manufacturing technology of high-power LED radiating structure
CN103594614A (en) * 2012-08-15 2014-02-19 品元企业股份有限公司 Chip (wafer) heat radiation double metal post used for light source
DE102012219879A1 (en) * 2012-10-30 2014-04-30 Osram Gmbh Method for manufacturing a LED module with heat sink
CN103872029A (en) * 2012-12-14 2014-06-18 鸿富锦精密工业（深圳）有限公司 Light emitting diode module
CN104393162A (en) * 2014-11-05 2015-03-04 共青城超群科技股份有限公司 Copper column type substrate-encapsulated LED
KR101716955B1 (en) * 2015-05-14 2017-03-15 최훈 Heat Radiating Apparatus of the LED Lighting Fixture using a Polymers
KR101716954B1 (en) * 2015-05-14 2017-03-15 최훈 Heat Radiating Apparatus of the LED Lighting Fixture using a Methanol
CN105042366A (en) * 2015-07-10 2015-11-11 黄新 Three-dimensional power source of bulb lamp and LED filament bulb lamp
US9997428B2 (en) * 2015-07-14 2018-06-12 Avago Technologies General Ip (Singapore) Pte. Ltd. Via structures for thermal dissipation
US10129972B2 (en) 2015-10-30 2018-11-13 Avago Technologies International Sales Pte. Limited Frame elements for package structures comprising printed circuit boards (PCBs)
KR101695129B1 (en) * 2016-04-05 2017-01-10 (주)성진하이텍 Led lighting apparatus having heat sink structure
KR101671144B1 (en) * 2016-04-14 2016-11-03 주식회사 비츠로 LED lighting device having radiant heat fin with Graphite
TWI644410B (en) * 2018-01-30 2018-12-11 絡達科技股份有限公司 Pad structure, semiconductor die using the same and manufacturing method thereof
JP6663545B1 (en) * 2018-03-30 2020-03-11 株式会社メイコー Press apparatus and method for manufacturing circuit board
CN108389885B (en) * 2018-04-13 2021-05-18 业成科技（成都）有限公司 Heat dissipation structure, electronic device using same and display device
US10987831B2 (en) * 2019-05-24 2021-04-27 The Boeing Company Dies for forming a part and associated systems and methods
US10986722B1 (en) * 2019-11-15 2021-04-20 Goodrich Corporation High performance heat sink for double sided printed circuit boards
US11089671B2 (en) * 2019-11-26 2021-08-10 Eridan Communications, Inc. Integrated circuit / printed circuit board assembly and method of manufacture
CN111836461B (en) * 2020-07-21 2022-09-02 深圳市诚之益电路有限公司 Heat dissipation type circuit board and preparation method thereof
CN113068309B (en) * 2021-04-12 2022-05-27 景旺电子科技(龙川)有限公司 Manufacturing method of heat dissipation circuit board
WO2022222038A1 (en) * 2021-04-20 2022-10-27 金钊 Landscape lamp
KR102622451B1 (en) * 2023-08-10 2024-01-05 박은홍 LED lighting apparatus

Family Cites Families (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2618569B1 (en) * 1987-07-24 1989-12-22 Warszawski Bernard TECHNIQUE FOR MANUFACTURING A DEVICE FOR MODULATING LIGHT
JPH088373A (en) * 1994-06-23 1996-01-12 Toshiba Corp Heat sink
EP1085537A3 (en) * 1999-09-14 2001-04-11 Mannesmann VDO Aktiengesellschaft Planar transformer, manufacturing process of its winding and compact electrical device comprising such a planar transformer
JP2001352167A (en) * 2000-06-09 2001-12-21 Mitsui High Tec Inc Method for manufacturing circuit board
US6542366B2 (en) * 2000-12-28 2003-04-01 Gateway, Inc. Circuit board support
JP2003163378A (en) * 2001-11-26 2003-06-06 Citizen Electronics Co Ltd Surface mount light emitting diode and its manufacturing method
TW558804B (en) * 2002-04-16 2003-10-21 Yuan Lin Flexible light emitting device and the manufacturing method thereof
JP2004253508A (en) * 2003-02-19 2004-09-09 Fujitsu Ten Ltd Fixing structure and fixing method of large-size surface mounting component
US6860652B2 (en) * 2003-05-23 2005-03-01 Intel Corporation Package for housing an optoelectronic assembly
JP4252486B2 (en) * 2004-04-13 2009-04-08 三菱電機株式会社 Electric power steering device
KR100604469B1 (en) * 2004-08-25 2006-07-25 박병재 light emitting device and package structure and method of manufacturing thereof
US7285802B2 (en) * 2004-12-21 2007-10-23 3M Innovative Properties Company Illumination assembly and method of making same
JP4610414B2 (en) * 2005-03-22 2011-01-12 京セラ株式会社 Electronic component storage package, electronic device, and electronic device mounting structure
EP1966833A1 (en) * 2005-12-19 2008-09-10 Showa Denko K.K. Flip-chip type semiconductor light-emitting device, method for manufacturing flip-chip type semiconductor light-emitting device, printed circuit board for flip-chip type semiconductor light-emitting device, mounting structure for flip-chip type semiconductor light-emitting device-and light-emitting diode lamp
KR101305884B1 (en) * 2006-01-06 2013-09-06 엘지이노텍 주식회사 Light emitting diode package, manufacturing method thereof and Back light unit having the same
US20070235739A1 (en) * 2006-03-31 2007-10-11 Edison Opto Corporation Structure of heat dissipation of implant type light emitting diode package and method for manufacturing the same
WO2007119571A1 (en) * 2006-04-17 2007-10-25 Dowa Electronics Materials Co., Ltd. Solder layer, substrate for device junction utilizing the same, and process for manufacturing the substrate
WO2007129231A1 (en) * 2006-05-08 2007-11-15 Koninklijke Philips Electronics, N.V. Thermal surface mounting of multiple leds onto a heatsink
JP5245276B2 (en) * 2007-04-11 2013-07-24 日本電気株式会社 Electronic component mounting structure and mounting method thereof
TW200845877A (en) * 2007-05-07 2008-11-16 Tysun Inc Heat-dissipating substrates of composite structure
JP5018250B2 (en) * 2007-06-04 2012-09-05 富士電機株式会社 Semiconductor device and manufacturing method thereof
KR20070091590A (en) * 2007-08-13 2007-09-11 이영섭 Turbo arair cooling apparatus high efficiency
EP2180595A4 (en) * 2007-09-21 2010-09-08 Nec Corp High output power amplifier, wireless transmitter, wireless transmitting and receiving device, and high output power amplifier mounting method
CN201112413Y (en) * 2007-09-21 2008-09-10 万喜红 High power LED package structure
CN201093439Y (en) * 2007-10-09 2008-07-30 黄凯杰 LED heat sinking base plate
WO2009081723A1 (en) * 2007-12-20 2009-07-02 Fuji Electric Device Technology Co., Ltd. Semiconductor device and method for manufacturing the same
KR100993902B1 (en) 2008-01-31 2010-11-11 알티전자 주식회사 Light emitting diode package
CN201170529Y (en) * 2008-02-20 2008-12-24 丽鸿科技股份有限公司 LED module group
TW201006001A (en) * 2008-07-29 2010-02-01 wei-hong Luo A packaging structure of a LED and its method
JP5375041B2 (en) * 2008-11-13 2013-12-25 日亜化学工業株式会社 Light emitting device and manufacturing method thereof
JP5151933B2 (en) * 2008-11-27 2013-02-27 株式会社Ｉｈｉ Heat sink for electronic equipment
CN201369322Y (en) * 2008-12-12 2009-12-23 康佳集团股份有限公司 Heat abstractor for LED module
CN101465399B (en) * 2008-12-30 2010-06-02 吉林大学 LED chip base using diamond film as heat sink material and preparation method
JP2010177404A (en) * 2009-01-29 2010-08-12 Shihen Tech Corp Cooling structure for light-emitting device
US7898077B2 (en) * 2009-02-12 2011-03-01 Honeywell International Inc. Adjustable threaded cores for LED thermal management
CN101871627A (en) * 2009-04-24 2010-10-27 戴建国 High-efficiency heat radiating LED (light emitting diode) lamp and manufacture method thereof
WO2011126726A1 (en) * 2010-03-29 2011-10-13 Semprius, Inc. Electrically bonded arrays of transfer printed active components
WO2011137355A1 (en) * 2010-04-30 2011-11-03 Uniflux Led, Inc. A cooling structure for led lamps
CN201739805U (en) * 2010-05-11 2011-02-09 广州市花都区旺通五金电器厂 Novel efficient radiating LED lamp
CN201758485U (en) * 2010-05-12 2011-03-09 珠海市荣盈电子科技有限公司 High-thermal conductivity circuit board made by using hot-press method
EP2515352B1 (en) * 2010-06-04 2018-12-05 Foshan Nationstar Optoelectronics Co., Ltd A manufacture method for a surface mounted power led support
EP2596527B1 (en) * 2010-07-22 2019-05-15 Ferro Corporation Method of hermetically sealing an active layer and corresponding photovoltaic device
US8591262B2 (en) * 2010-09-03 2013-11-26 Pulse Electronics, Inc. Substrate inductive devices and methods
US8632221B2 (en) * 2011-11-01 2014-01-21 Taiwan Semiconductor Manufacturing Company, Ltd. LED module and method of bonding thereof
CN102403419B (en) * 2011-11-09 2013-08-21 东莞勤上光电股份有限公司 Manufacturing technology of high-power LED radiating structure

Also Published As

Publication number Publication date
JP2014506014A (en) 2014-03-06
CL2013002184A1 (en) 2014-06-27
BR112013015298A2 (en) 2016-09-20
US20130248584A1 (en) 2013-09-26
US8757473B2 (en) 2014-06-24
KR101507668B1 (en) 2015-03-31
CN102403419A (en) 2012-04-04
WO2013067842A1 (en) 2013-05-16
EP2642532A1 (en) 2013-09-25
AU2012333910A1 (en) 2013-06-06
JP5585924B2 (en) 2014-09-10
CN102403419B (en) 2013-08-21
KR20130079617A (en) 2013-07-10
CA2818087A1 (en) 2013-05-16
CA2818087C (en) 2016-03-15
AU2012333910B2 (en) 2014-05-08
EP2642532A4 (en) 2014-06-25
MY167526A (en) 2018-09-05

Similar Documents

Publication Publication Date Title
MX2013007639A (en) Process for manufacturing heat sink structure for high-power led.
AU2012333908A8 (en) Manufacturing process of high-power LED radiating structure
IN2014CN03370A (en)
EP2833398A4 (en) Substrate for power module, substrate for power module with heat sink, power module, and method for manufacturing substrate for power module
UA111632C2 (en) DEVICES FOR FORMATION OF AEROSOL WITH HEATER ASSEMBLY
EP2911192A4 (en) Substrate for power module with heat sink, power module with heat sink, and method for producing substrate for power module with heat sink
EP2811513A4 (en) Substrate for power modules, substrate with heat sink for power modules, power module, method for producing substrate for power modules, and paste for bonding copper member
EP2120263A4 (en) Heat dissipating structure base board, module using heat dissipating structure base board, and method for manufacturing heat dissipating structure base board
GB2488982B (en) Heat sink assembly for opto-electronic components and a method for producing the same LED heatsink
EP2259308A4 (en) Substrate for power module with heat sink and method for producing the same, power module with heat sink, and substrate for power module
EP2743978A4 (en) Substrate for power module, substrate for power module with heat sink, power module, and method for manufacturing substrate for power module
WO2010150971A3 (en) Apparatus for coupling a module circuit board and a frame together, and backlight using same
HK1163349A1 (en) Semiconductor light emitting device and method for manufacturing same
TW200739935A (en) Semiconductor light emitting device and method of fabricating the same
EP2833400A4 (en) Power module substrate with heat sink, and method for producing power module substrate with heat sink
EP2515622A3 (en) Light emitting device array
WO2014031849A3 (en) Micro-channel heat sink for led headlamp
TW201612461A (en) Heat dispersion structure and manufacturing method thereof
WO2013111037A3 (en) Led module and luminaire comprising said module
EP3321339A4 (en) Thermally conductive composition, semiconductor device, process for producing semiconductor device, and method for bonding heat sink plate
WO2014191893A3 (en) Electrical machine
EP3269491A4 (en) Manufacturing method for junction, manufacturing method for substrate for power module with heat sink, and manufacturing method for heat sink
EP2674971A4 (en) Method for manufacturing heat dissipating plate for semiconductor module, said heat dissipating plate, and semiconductor module using said heat dissipating plate
TW201614876A (en) Light emitting device and method for manufacturing light emitting device
EP2672512A3 (en) Cold plate assembly incorporating thermal heat spreader

Legal Events

Date Code Title Description
FG Grant or registration