TW201233971A - Heat dissipation device and manufacture method thereof - Google Patents

Heat dissipation device and manufacture method thereof Download PDF

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Publication number
TW201233971A
TW201233971A TW100104986A TW100104986A TW201233971A TW 201233971 A TW201233971 A TW 201233971A TW 100104986 A TW100104986 A TW 100104986A TW 100104986 A TW100104986 A TW 100104986A TW 201233971 A TW201233971 A TW 201233971A
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Taiwan
Prior art keywords
heat
heat dissipation
heat sink
fin
group
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TW100104986A
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Chinese (zh)
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TWI403686B (en
Inventor
Liang-Jun Lu
Feng-Zhi Lian
Rong-Bin Lin
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Liang-Jun Lu
Feng-Zhi Lian
Rong-Bin Lin
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Priority to TW100104986A priority Critical patent/TW201233971A/en
Publication of TW201233971A publication Critical patent/TW201233971A/en
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Abstract

The present invention provides a method for manufacturing heat dissipation device, which comprises the following steps: providing a plurality of heat dissipation fin assemblies and a heat pipe, each heat dissipation fin having a joint surface, the heat pipe comprising a contact surface; carrying out anodizing treatment on the plurality of heat dissipation fin assemblies; carrying out surface roughening treatment on the joint surface of each heat dissipation fin assembly; spraying a metal substance to the contact surface, stacking the plurality of heat dissipation assemblies to interpose the heat pipe with the joint surface of each heat dissipation assembly engaging the contact surface; and applying solder paste to weld the heat dissipation fin assembly. With the above manufacture method, the purposes of increasing heat conduction rate, showing color variation, and causing no thermal resistance can be achieved. The present invention also relates to a heat dissipation device manufactured by the above method.

Description

201233971 、發明說明: 【發明所屬之技術領域】 本發明係關於一種散熱器及其製造方法,尤指 一種可提高熱傳導速率且可具有顏色之變化而不會 產生熱阻之散熱器及其製造方法者。 【先前技術】201233971, the invention relates to: a heat sink and a method for manufacturing the same, and more particularly to a heat sink capable of improving heat transfer rate and having color change without generating heat resistance and manufacturing method thereof By. [Prior Art]

於目前電子裝置中,對於許多發熱源(例如晶 片、中央處理器等)皆會組設有所謂之散熱裝置,且 散熱裝置具有多種形式,例如散熱鰭片組、熱管、 散熱風扇、及前述各元件之搭配組合等。 以上述散熱鰭片組為例,其係由複數片散熱鰭 片排列組合而成,且其係可搭配熱管(例如銅管、銘 管…)使用,亦可搭配散熱風扇使用,甚至可同時搭 配熱管與散熱風扇一起使用,藉以提高散熱效率。 傳統以散熱鰭片組搭配熱管結合而成之散熱器 是採用多組相同或不同顏色(例如以表面陽極處理形 成不同顏色)的散熱鰭片組由上往下衝壓結合而成, 或者是由多組相同或不同顏色的散熱鰭片組由左至 右排列並由上往下衝壓結合而成。然而,此種製造 方法並無法讓散熱鰭片組完全接觸熱管,即衝壓方 式所產生的散熱鰭片孔洞與熱管之間總有縫隙存 在,而此缝隙相對會影響熱傳導速率,亦即會影響 散熱效率。 再者,若以焊接方式結合散熱鰭片組與熱管 201233971 時,傳統之焊接方法係先將散熱鰭片組鍍鎳之 予以焊接。然而,散熱鰭片組在鍍鎳之後會產 層鎳膜,其雖可使由鋁製成之散熱鰭片組與例 管之熱管彼此焊接,但如果使鎳膜進行表面陽 理(抗氧化表面處理)時,散熱鰭片組與熱管就無 此焊接。【發明内容】 本發明之散熱器之製造方法包括下列步驟 提供複數個散熱鰭片組及一熱管,且每一 韓片組包括一接合面,熱管包括一接觸面; 對複數個散熱鰭片組進行表面陽極處理; 對每一散熱鰭片組之接合面進行表面粗 理; 喷塗一金屬物質至熱管之接觸面; 疊置複數個散熱鰭片組使其夾合熱管,並 一散熱鰭片組之接合面對應接觸於熱管之接觸 以及 以錫膏焊接複數個散熱鰭片組。 因此,藉由上述製造方法,可達到提高熱 速率且可具有顏色之變化而不會產生熱阻之目丨 本發明亦有關於一種散熱器,其係以上述 造方法製成,且此散熱器包括一熱管、至少一 散熱鰭片組以及至少一第二散熱鰭片組。 其中,熱管包括一接觸面,至少一第一散 後再 生一 如銅 極處 法彼 散熱 化處 使每 面; 傳導 勺。 之製 第一 熱鰭 4 201233971 片組包括一第一接合面,至少一第二散熱鰭片組包 括一第二接合面,且至少一第一散熱鰭片組與至少 一第二散熱鰭片組係彼此疊置並夾合熱管,而第一 接合面與第二接合面係分別對應接觸於接觸面。 【實施方式】 請同時參閱圖1及圖2,其中之圖1係為本發明 第一較佳具體實施例之分解圖,圖2係為本發明第 一較佳具體實施例之立體圖。In the current electronic device, a plurality of heat sources (such as a wafer, a central processing unit, etc.) are provided with a so-called heat sink, and the heat sink has various forms, such as a heat sink fin group, a heat pipe, a heat sink fan, and the foregoing Combination of components, etc. Taking the above-mentioned heat sink fin group as an example, it is composed of a plurality of heat sink fins arranged in a row, and the system can be used with a heat pipe (for example, a copper pipe, a Ming pipe...), or can be used with a cooling fan, or even can be matched at the same time. The heat pipe is used together with the cooling fan to improve heat dissipation efficiency. Conventionally, a heat sink in which a heat sink fin group is combined with a heat pipe is formed by combining a plurality of sets of heat sink fins of the same or different colors (for example, forming a different color by surface anodization) from top to bottom, or by multiple Groups of fins of the same or different colors are arranged from left to right and punched from top to bottom. However, this manufacturing method does not allow the heat sink fin group to completely contact the heat pipe, that is, there is always a gap between the heat sink fin hole and the heat pipe generated by the punching method, and the gap relatively affects the heat conduction rate, that is, the heat dissipation is affected. effectiveness. Furthermore, if the heat sink fin group and the heat pipe 201233971 are combined by welding, the conventional soldering method firstly solders the heat sink fin group to nickel. However, the heat-dissipating fin group will produce a nickel film after nickel plating, which can weld the heat-dissipating fin group made of aluminum and the heat pipe of the tube to each other, but if the nickel film is subjected to surface aiki (anti-oxidation surface) When the process is performed, the heat sink fin group and the heat pipe are not welded. SUMMARY OF THE INVENTION A method for manufacturing a heat sink according to the present invention includes the following steps: providing a plurality of heat sink fin sets and a heat pipe, and each of the Korean chip sets includes a joint surface, the heat pipe includes a contact surface; and the plurality of heat sink fin sets Performing surface anodization; roughening the surface of each heat sink fin set; spraying a metal material to the contact surface of the heat pipe; stacking a plurality of heat sink fin sets to sandwich the heat pipe, and a heat sink fin The joint faces of the set correspond to the contact with the heat pipe and the plurality of heat sink fin sets are soldered with solder paste. Therefore, by the above manufacturing method, it is possible to achieve a heat rate increase and a change in color without causing thermal resistance. The present invention also relates to a heat sink which is produced by the above-described manufacturing method, and the heat sink The utility model comprises a heat pipe, at least one heat dissipation fin set and at least one second heat dissipation fin set. Wherein, the heat pipe comprises a contact surface, and at least one of the first holes is regenerated, such as a copper pole, and a heat dissipation portion is provided for each side; a conductive spoon. The first heat fin 4 201233971 includes a first bonding surface, the at least one second heat dissipation fin group includes a second bonding surface, and at least one first heat dissipation fin group and at least one second heat dissipation fin group The heat pipes are stacked on each other and sandwiched, and the first joint surface and the second joint surface are respectively in contact with the contact faces. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a first preferred embodiment of the present invention, and FIG. 2 is a perspective view of a first preferred embodiment of the present invention.

於圖式中顯示有一散熱器1,且此散熱器1包括 一熱管11、一第一散熱鰭片組1 2以及一第二散熱鰭 片組13。 圖式中之熱管11包括一接觸面111,第一散熱 鰭片組1 2包括一第一接合面1 2 1,第二散熱鰭片組 13包括一第二接合面131,且第一散熱鰭片組12與 第二散熱鰭片組1 3係彼此疊置並夾合熱管1 1,同 時,第一散熱鰭片組1 2之第一接合面1 2 1與第二散 熱鰭片組1 3之第二接合面1 3 1係分別對應接觸於熱 管1 1之接觸面1 11。 請同時參閱圖1至圖3,其中之圖3係為本發明 第一較佳具體實施例之流程圖。 上述之散熱器1係以下列方法製造而成。 首先,提供一熱管11、一第一散熱鰭片組12及 一第二散熱鰭片組13,且熱管11包括一接觸面111, 5 201233971 第一散熱鰭片組1 2包括一第一接合面1 2 1,第二散 熱鰭片組13包括一第二接合面131(S1)。 之後,對第一散熱鰭片組1 2及第二散熱鰭片組 1 3進行表面陽極處理(S2),此時,可對第一散熱鰭 片組1 2及第二散熱鰭片組1 3進行有顏色之表面陽 極處理,使得第一散熱鰭片組1 2及第二散熱鰭片組 1 3具有不同之顏色變化。當然,第一散熱鰭片組1 2 及/或第二散熱鰭片組1 3亦可以原本之顏色(即原本 材質之顏色)進行表面陽極處理。 然後,再對第一散熱鰭片組1 2之第一接合面1 2 1 與第二散熱鰭片組1 3之第二接合面1 3 1進行表面粗 化處理(S3)。另外,喷塗一金屬物質2(例如銅、錫等) 至熱管11之接觸面111(S4)。(於圖1中,金屬物質 2係以示意方式表示。) 於上述步驟完成後,疊置第一散熱鰭片組12與 第二散熱鰭片組1 3,使第一散熱鰭片組1 2與第二散 熱鰭片組1 3夾合熱管1 1,並使第一散熱鰭片組1 2 之第一接合面121與第二散熱鰭片組13之第二接合 面13 1分別對應接觸於熱管1 1之接觸面1 1 1(S5)。 最後,再以錫膏3焊接第一散熱鰭片組12與第 二散熱鰭片組13(S6)。(於圖2中,錫膏3亦以示意 方式表示。) 如上所述,藉由上述步驟即可製造出可提高熱 傳導速率且可具有顏色之變化而不會產生熱阻之散 6 201233971A heat sink 1 is shown in the drawings, and the heat sink 1 includes a heat pipe 11, a first heat sink fin set 12 and a second heat sink fin set 13. The heat pipe 11 in the drawing includes a contact surface 111, the first heat dissipation fin group 12 includes a first joint surface 112, and the second heat dissipation fin group 13 includes a second joint surface 131, and the first heat sink fin The chip set 12 and the second heat sink fin set 13 are stacked on each other and sandwich the heat pipe 1 1. Meanwhile, the first joint face 1 1 1 of the first heat sink fin set 1 2 and the second heat sink fin set 13 The second joint surface 1 3 1 corresponds to the contact surface 1 11 of the heat pipe 11 respectively. Please refer to FIG. 1 to FIG. 3, which is a flow chart of a first preferred embodiment of the present invention. The above-described heat sink 1 is manufactured by the following method. First, a heat pipe 11, a first heat sink fin set 12 and a second heat sink fin set 13 are provided, and the heat pipe 11 includes a contact surface 111, 5 201233971 The first heat sink fin set 1 2 includes a first joint surface 1 2 1, the second heat dissipation fin group 13 includes a second joint surface 131 (S1). After that, the first heat dissipation fin group 12 and the second heat dissipation fin group 13 are subjected to surface anodization (S2). At this time, the first heat dissipation fin group 1 2 and the second heat dissipation fin group 1 3 can be The colored surface anodization is performed such that the first fin group 12 and the second fin group 13 have different color variations. Of course, the first heat dissipation fin group 12 and/or the second heat dissipation fin group 13 can also be surface anodized in the original color (ie, the color of the original material). Then, the first bonding surface 1 2 1 of the first heat radiation fin group 1 2 and the second bonding surface 1 3 1 of the second heat radiation fin group 1 3 are subjected to surface roughening treatment (S3). Further, a metal substance 2 (for example, copper, tin, etc.) is sprayed onto the contact surface 111 of the heat pipe 11 (S4). (In FIG. 1, the metal material 2 is shown in a schematic manner.) After the above steps are completed, the first heat dissipation fin group 12 and the second heat radiation fin group 13 are stacked to make the first heat dissipation fin group 1 2 The heat pipe 1 is sandwiched with the second heat dissipation fin set 13 and the first joint surface 121 of the first heat radiation fin set 1 2 and the second joint surface 13 1 of the second heat radiation fin set 13 are respectively contacted with each other. The contact surface of the heat pipe 1 1 is 1 1 1 (S5). Finally, the first heat radiation fin group 12 and the second heat radiation fin group 13 are welded by the solder paste 3 (S6). (In Fig. 2, the solder paste 3 is also shown in a schematic manner.) As described above, by the above steps, it is possible to produce a dispersion which can increase the heat conduction rate and which can have a color change without causing thermal resistance. 6 201233971

… ’上述之製造方法可以增加敎管華如 銅"管··.)與韓片組第…、官川例如 熱鰭片組13^細& 放熱鰭片組〗2、第二散 )互相接觸面(接觸而 121、第-1锥觸面】】1、第一接合面 弟一接合面131)的熱傳導 的變化,不僅是^ ^導速羊,同時對於顏色 色,且P田 排列的,鳍片組可變化顏 邑,且採用水平排 ! 者,因A ” m 也可以變化顏色。再 四為疋採用焊接方式,— 11 ^ # * ,θ 於貫際作業上可將熱管 二散熱韓片組13)可呈有不^政熱韓片組12、第 * 不同顏色而可焊接組合起 ’且:面陽極處理是材料本身在表面填補產生顏 色’不會因膜厚而對散熱器1表面產生熱阻。 另欲說明’上述部分步驟之間並無先後順序之 限制,可視實際製程需要而變動,例如步㈣ 於步驟S2與S3之前。 再請回參圖1,於設計上可使第一散熱鳍片会旦 12凸設有一個(或以上之)第一翼片122,且第—翼片 1 22係鄰接於第一接合面丨2丨。同樣的,第二散熱鰭 片組13可凸設有一個(或以上之)第二翼片132,且 第二翼片132係鄰接於第二接合面ι31。 因此,藉由第一翼片122與第二翼片U2之設 計,且藉由第一翼片122鄰接於第—接合面121與 第二翼片132鄰接於第二接合面131之設計,可增 加第一散熱鰭片組12及第二散熱鰭片組〖3與熱管 7 201233971 11之接觸面積’如此可更加提高散熱效率。 當然’於設計上可使第一翼片122與第二翼片 1 32彼此相鄰接。此外’單獨使第—散熱鰭片組j 2 或單獨使第二散熱鰭片組1 3具有翼片之設計亦可。 請參閱圖4,其係為本發明第二較佳具體實施例 之立體圖。 於本實施例中,其主要結構皆與上述第一較佳 具體實施例相同,唯差別在於散熱器4包括四個散 熱縛片組41與三個熱管42,且每一散熱鰭片組4 1 係彼此疊置並將每一熱管42夾合。 換言之’散熱器之熱管與散熱鰭片組的數量可 視實際需要而改變,且同樣藉由上述製造方法進行 製造’而如此之結構設計同樣玎達成上述第一較佳 具體實施例所述之各種功效。... 'The above-mentioned manufacturing method can increase the number of the tube, such as the copper "tube··.) and the Korean film group..., Guanchuan, for example, the hot fin group 13^fine & the heat-emitting fin group〗 2, the second dispersion) The change in heat conduction between the mutual contact faces (contact 121, the -1 cone contact surface) 1, the first joint face, and the joint face 131) is not only the speed guiding sheep, but also the color color and the P field arrangement. The fin group can be changed, and the horizontal row is used! Because A ′ m can also change the color. Then the fourth is the welding method, — 11 ^ # * , θ can be used in the continuous operation. The heat-dissipating Korean film group 13) can be formed without the hot Korean film group 12, the * different colors can be welded together 'and: the surface anode treatment is the material itself to fill the surface to produce color' will not heat due to the film thickness There is no thermal resistance on the surface of the device 1. It is to be noted that there is no limitation between the above steps, which can be changed according to the actual process requirements, for example, step (4) before steps S2 and S3. Please refer back to Figure 1 for design. The first fins may be convexly provided with one (or more) first fins 122, The first fins 1 22 are adjacent to the first joint surface 丨 2 丨. Similarly, the second fin group 13 may have one (or more) second fins 132 and the second fins 132 Adjacent to the second joint surface ι 31. Therefore, by the design of the first fin 122 and the second fin U2, and adjacent to the first joint 122 and the second flap 132 by the first fin 122 The design of the two bonding surfaces 131 can increase the contact area between the first heat dissipation fin group 12 and the second heat dissipation fin group 〖3 and the heat pipe 7 201233971 11 so that the heat dissipation efficiency can be further improved. Of course, the first design can make the first The fins 122 and the second fins 1 32 are adjacent to each other. Further, the design of the first fins j 2 or the fins 13 may be provided with fins alone. It is a perspective view of a second preferred embodiment of the present invention. In this embodiment, the main structure is the same as the first preferred embodiment described above, except that the heat sink 4 includes four heat dissipation tab groups. 41 and three heat pipes 42 , and each heat sink fin set 4 1 is superposed on each other and each heat pipe 42 In other words, the number of the heat pipe and the heat sink fin group of the heat sink may be changed according to actual needs, and is also manufactured by the above manufacturing method, and the structural design is also achieved as described in the first preferred embodiment. Various effects.

8 201233971 【圖式簡單說明】 圖1係為本發明第一較佳具體實施例之分解圖。 圖2係為本發明第一較佳具體實施例之立體圖。 圖3係為本發明第一較佳具體實施例之流程圖。 圖4係為本發明第二較佳具體實施例之立體圖。 【主要元件符號說明】8 201233971 BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an exploded view of a first preferred embodiment of the present invention. Figure 2 is a perspective view of a first preferred embodiment of the present invention. 3 is a flow chart of a first preferred embodiment of the present invention. Figure 4 is a perspective view of a second preferred embodiment of the present invention. [Main component symbol description]

1 散熱器 11 孰管 <、、、 & 111 接觸面 12 第一散熱鰭片 組 121 第一接合面 122 第一翼片 13 第二散熱鰭片 組 13 1 第二接合面 132 第二翼片 2 金屬物質 3 錫膏 4 散熱器 41 散熱鰭片組 42 轨管 *、、、 & S 1 〜S6 步驟1 heat sink 11 manifold <,, & 111 contact surface 12 first heat sink fin set 121 first joint surface 122 first fin 13 second heat sink fin set 13 1 second joint surface 132 second wing Sheet 2 Metallic material 3 Solder paste 4 Heat sink 41 Heat sink fin group 42 Rail tube *, , , & S 1 ~ S6 Step

Claims (1)

201233971 七、申請專利範圍: 1 · 一種散熱器之製造方法,包括下列步驟: 提供複數個散熱鰭片組及一熱管,且每一散 熱韓片組包括一接合面,該熱管包括一接觸面; 對該複數個散熱鰭片組進行表面陽極處理; 對每一散熱鰭片組之該接合面進行表面粗化 處理; 喷塗一金屬物質至該熱管之該接觸面;201233971 VII. Patent application scope: 1 . A method for manufacturing a heat sink, comprising the steps of: providing a plurality of heat dissipation fin groups and a heat pipe, and each heat dissipation Korean film group comprises a joint surface, the heat pipe comprising a contact surface; Performing surface anodization on the plurality of heat dissipation fin sets; performing surface roughening treatment on the joint surface of each heat dissipation fin group; spraying a metal material to the contact surface of the heat pipe; 疊置該複數個散熱\韓片組使其夾合該熱管, 並使每一散熱鰭片組之該接合面對應接觸於該熱 管之該接觸面;以及 以錫膏焊接該複數個散熱鰭片組。 2.如申請專利範圍第1項所述之散熱器之製造方 法,其中係對該複數個散熱鰭片組進行有顏色之表 面陽極處理。 3. 如申請專利範圍第1項所述之散熱器之製造方 法,其中該金屬物質係為銅。 4. 一種散熱器,係以如申請專利範圍第1項所述之散 熱器之製造方法製成,且該散熱器包括: 一熱管,包括一接觸面; 至少一第一散熱韓片組,包括一第一接合 面;以及 至少一第二散熱鰭片組,包括一第二接合面; 其中,該至少一第一散熱鰭片組與該至少一 10 201233971 第二散熱鰭片組係彼此疊置並夾合該熱管,且該 第一接合面與該第二接合面係分別對應接觸於 該接觸面。 5.如申請專利範圍第4項所述之散熱器,其中該至少 一第一散熱鰭片組凸設有至少一第一翼片。 6.如申請專利範圍第5項所述之散熱器,其中該至少 一第一翼片係鄰接於該第一接合面。Stacking the plurality of heat dissipation/Korean groups to sandwich the heat pipe, and contacting the bonding surface of each heat dissipation fin group with the contact surface of the heat pipe; and soldering the plurality of heat dissipation fins with solder paste group. 2. The method of manufacturing a heat sink according to claim 1, wherein the plurality of heat sink fin sets are subjected to a colored surface anodization. 3. The method of manufacturing a heat sink according to claim 1, wherein the metal material is copper. A heat sink manufactured by the method of manufacturing a heat sink according to claim 1, wherein the heat sink comprises: a heat pipe including a contact surface; at least one first heat sink group, including a first bonding surface; and at least one second heat dissipation fin group, including a second bonding surface; wherein the at least one first heat dissipation fin group and the at least one 10 201233971 second heat dissipation fin group are overlapped with each other And the heat pipe is clamped, and the first joint surface and the second joint surface respectively contact the contact surface. 5. The heat sink of claim 4, wherein the at least one first fin group is convexly provided with at least one first fin. 6. The heat sink of claim 5, wherein the at least one first fin is adjacent to the first joint. 7.如申請專利範圍第4項所述之散熱器,其中該至少 一第二散熱鰭片組凸設有至少一第二翼片。 8.如申請專利範圍第7項所述之散熱器,其中該至少 一第二翼片係鄰接於該第二接合面。7. The heat sink of claim 4, wherein the at least one second heat sink fin group is convexly provided with at least one second fin. 8. The heat sink of claim 7, wherein the at least one second fin is adjacent to the second joint. 1111
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CN106852073A (en) * 2017-01-13 2017-06-13 奇鋐科技股份有限公司 Heat radiation module
CN116713706A (en) * 2023-05-31 2023-09-08 深圳市鸿慷电子有限公司 Fin type radiator processing method

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US7779897B2 (en) * 2007-07-02 2010-08-24 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with heat pipes
TWM337778U (en) * 2007-09-28 2008-08-01 Asia Vital Components Co Ltd Heat dissipation module
CN101528019A (en) * 2008-03-07 2009-09-09 富准精密工业(深圳)有限公司 Heat radiating device
JP2010153443A (en) * 2008-12-24 2010-07-08 Fujitsu Ltd Cooling device, cooling-device manufacturing method, and electronic apparatus
TWM368122U (en) * 2009-03-17 2009-11-01 Jia-Ting Wan Heat fin with improved heat dissipation for computer and electronic device
TWM397509U (en) * 2010-09-07 2011-02-01 Asia Vital Components Co Ltd Heat sink structure

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106852073A (en) * 2017-01-13 2017-06-13 奇鋐科技股份有限公司 Heat radiation module
CN116713706A (en) * 2023-05-31 2023-09-08 深圳市鸿慷电子有限公司 Fin type radiator processing method

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