M368122 五、新型說明： 【新型所屬之技術領域】 一種通用於電腦、電子類之散熱鰭片的散熱改良，暨散熱結構改 良；係加工噴塗於該散熱鰭片即通用於電腦之中央^理器（即PC CPU)之散熱极組及電腦顯不卡（即PC GC)及電腦記憶卡（即pc MCIA)等通用之散熱鰭片及發光二極體（即LED)常用之散熱鰭 片、不限任何形狀及尺寸大小之含鋁基材鰭片的散熱改良，暨加 上喷附塗抹導熱層之散熱鰭片；將該散熱鰭片加工塗一導&層 後’於$妾觸一熱源處背後附近，將此散熱鰭片緊貼，以進行&熱 者;，而該導熱層即熱傳導散熱塗層係呈現一連續狀，預先喷塗 附，著地裡圍於該散熱本體即，，散熱鰭片”之，’全面内外四周圍 表面積上；以於接觸一熱源附近接觸點後，將該熱源之熱 食匕’藉由該導熱層幫助’快速地由散熱本體之内部，而傳導至散 熱本體之外圍，至其極大的散熱表面積與外界空氣接觸，而自然 散熱’能導熱又散熱；上述之導熱層，係將以石墨、碳等單一 礦石或石材混合成原料’也可將以鈦、鎳、錳、銅、鶴、 銅加巧等單一金屬或多種金屬混合成原料，也可以碳加鎢或碳加 ，或石厌加錄或碳加銅等具高熱傳導、高散熱效率之石材與金屬先 後相應用，藉由鍍膜機器以鍍膜技術，前後雙重應用，;|吏其熔 後二喷塗着附於該散熱本體暨散熱鰭片上，而形成如“類似鑽 ^=y(Diamond-Like Carbon )，，者’本構想採自然原理之散 ’大多通用於 製成，只能吸 【先前技術】目前應用於電腦、電子類的散熱改良 散熱鰭片，習之舊有產品現通常採用係為鋁金^成分 熱無法全面導熱及散熱，而顯然有改進之必要。 3 M368122 本案創作人有鑑於此， 熱改良。 乃予以研究創新，在此加工塗以助散 lifSL·補充M368122 V. New description: [New technical field] A heat dissipation improvement of the heat sink fins used in computers and electronics, and improvement of the heat dissipation structure; processing and spraying on the heat dissipation fins is the central processing device for computers. (ie PC CPU) heat sinks and computer graphics cards (ie PC GC) and computer memory cards (ie PC MCIA) and other common heat sink fins and light-emitting diodes (ie LED) commonly used heat sink fins, no Limiting the heat dissipation of aluminum-containing substrate fins of any shape and size, together with the heat-dissipating fins coated with the heat-conducting layer; processing the heat-dissipating fins with a layer of < In the vicinity of the back, the heat-dissipating fins are closely attached to perform the heat; and the heat-conducting layer, that is, the heat-conducting heat-dissipating coating, is in a continuous shape, and is sprayed in advance, and the grounding body surrounds the heat-dissipating body, that is, , the heat sink fins, 'on the inner and outer four surrounding surface area; in order to contact the contact point near a heat source, the heat source of the hot food 匕' by the heat conductive layer helps 'quickly radiate from the inside of the heat body, and conduct To the periphery of the heat sink body, Its extremely large heat-dissipating surface area is in contact with the outside air, while the natural heat-dissipation can conduct heat and dissipate heat; the above-mentioned heat-conducting layer will be mixed with single ore or stone such as graphite or carbon to form raw materials. It can also be made of titanium, nickel, manganese and copper. , crane, copper and other single metal or a variety of metals mixed into raw materials, can also be carbon plus tungsten or carbon plus, or stone or add carbon or copper with high heat conduction, high heat dissipation efficiency of stone and metal application, By coating machine with coating technology, both front and back applications; | 吏 熔 熔 熔 熔 喷涂 喷涂 附 附 附 附 附 附 附 附 附 附 附 附 附 附 附 附 附 D D D D D D D D D D D D D D D D D D D D 'This concept adopts the principle of natural dispersion', which is mostly used for making, can only be sucked [previous technology] is currently applied to computer and electronic heat-dissipating improved heat-dissipating fins, and the old products are usually used as aluminum-gold Heat can't fully heat and dissipate heat, and obviously there is a need for improvement. 3 M368122 The creator of this case has made heat improvement in view of this. It is to be researched and innovated, and processed in this way to help disperse lifSL·Supplement
片緊貼’以進行散熱者；上述喷塗於該散熱本體暨散熱鰭片的全 面内外四周圍表面上’附著地框圍有—連續環狀之導熱層，即熱 傳導散熱塗層’藉由該導熱層接觸熱源後，將該熱源之熱能，由 散熱本體之内部表面因有喷塗導熱層，能快速地傳遞至散熱本體 之全面表面積，直接與外界空氣接觸，而進行自然散熱者；上述 之導熱層，係將以石墨、碳等單一礦石或多種石材混合成原料， 也可將以鈦、鎳、錳、銅、鎢、銅加鎳等單一金屬或多種金屬混 合成原料’也可以碳加鎢或碳加鈦或碳加鎳或碳加銅等具高熱傳 導、南散熱效率之石材與金屬先後相應用，藉由鐘膜機器以鏟膜 技術，前後雙重應用，使其熔解後，喷塗着附於該散熱本體暨散 熱鰭片上，而形成如”類似鑽石碳薄膜，，（Diamond_LikeCarb〇n) 者。上述喷塗之鑛膜技術，係可以物理蒸鍍或化學蒸鍍或濺鍍 法或電鍍法等方法或可前後雙重應用，本法皆不予自限。 本新型之可取實施例，可由以下之說明及所附之各圖式，得以明 【實施方式】 請參閱第一至六圖所示’本新型係有關於 一種通用於電腦、電子類之散熱鰭片的散熱改良，即散熱結構改 4 M368122 f S^4.n2 1 修正 補充 良；係包括：散熱本體⑽暨為·材所製成之憾 以及喷塗導熱層⑽：係加工喷塗於該散熱鰭片（43)即通用 腦之中央處理器的散熱模組及電腦顯示卡及電腦記憶卡等通用之 散熱鰭片及發光二極體常狀散細㈣散熱改良，暨加上 塗抹導熱層⑽之散熱鰭片（43);將該散熱鰭片加玉會塗一導熱 層（20)後’於接觸一熱源(30)處背後附近，將此散熱縛片（43)^ 貼’以進行餘者；上述倾於該散穌體錄熱則的全面内 外四周圍表面上，附著地框圍有一連續環狀之導熱層；以及 導熱層（20) ’該導熱層（20)係呈現一連續狀，附著地框圍於該散 熱本體(10a)之全部内外表面四周圍，當該導熱層⑽)接觸1孰源 (30)後’便可以將該熱源（30)之熱能，快速地由 ^ 表面’傳遞至散熱本體⑽之各各部位，以藉由極大的二』面 積與外界空氣接觸而進行自然散熱者。 上述之導熱層（20)，係可以將石墨、碳等單一礦石或多種石 材此合成原料’也可以鈦、鎳、鐘、銅、鶴、銅加鎳等單一金屬 或多種金屬混合成原料，也可以碳加鎢或碳加鈦或碳加鎳或碳加 銅之石材與多金屬先後相應用，藉由鍍膜機器以鍍膜技術，使熔 解後，喷塗着附於該散熱本體（l〇a)上，而形成如類似鑽石碳薄 膜（Diamond- Like Carbon)者。 上述該散熱本體暨通用於電腦、電子類之散熱鰭片的散熱改良， 本新型所揭示於如（第四至第六圖及第十至十二圖）之散熱結構 改良，其結構特徵乃在於：該散熱本體(1〇)暨散熱鰭片（43)及喷 塗導熱層（20)，係呈現一連續環狀，附著在散熱本體（1〇a)之全 部外圍表面四周，當導熱層（2〇)跨置於該熱源(3〇)上時，便可以 5 M368122 透過該導熱層（20)快速地由散熱本體（i〇a)暨散熱鰭 ⑼年V1曰f止補无 片飞43)的四 — 周圍，傳遞至散熱本體暨散熱鰭片（43)之各各部位，以藉由極大 的散熱表面積與外界空氣接觸而進行自然散熱者。 〔先前技術習知之散熱構件，係自熱源處，逐漸向外擴散傳 遞，因此熱能集中於趨近熱源處之鋁製鰭片而久久不易導散〕. 而本新型之散熱本體（l〇a)可以快速地受熱後，將熱能傳導至外 界’達到快速散熱的目的。The film is closely attached to the heat sink; the above-mentioned sprayed on the entire inner and outer peripheral surfaces of the heat dissipation body and the heat dissipation fins is 'attached to the frame--a continuous annular heat conduction layer, that is, a heat conduction heat dissipation coating' After the heat conducting layer contacts the heat source, the heat energy of the heat source can be quickly transmitted to the entire surface area of the heat dissipating body by the sprayed heat conducting layer on the inner surface of the heat dissipating body, and directly contacts the outside air to perform natural heat dissipating; The heat conducting layer is a mixture of a single ore or a plurality of stones such as graphite or carbon, or a single metal or a plurality of metals such as titanium, nickel, manganese, copper, tungsten, copper and nickel may be mixed into a raw material. Tungsten or carbon plus titanium or carbon plus nickel or carbon plus copper and other high heat conduction, south heat dissipation efficiency of stone and metal have been applied successively, by the clock film machine with the shovel film technology, before and after the dual application, after melting, spraying Attached to the heat-dissipating body and the heat-dissipating fins to form a diamond-like carbon film, (Diamond_LikeCarb〇n). The above-mentioned spray film technology can be physically vaporized or chemically The method of plating or sputtering or electroplating may be applied before and after, and this method is not limited. The preferred embodiments of the present invention can be exemplified by the following description and the accompanying drawings. Refer to the first to sixth figures. 'This new type is about a heat dissipation improvement of the heat sink fins commonly used in computers and electronics. That is, the heat dissipation structure is changed to 4 M368122 f S^4.n2 1 The body (10) and the material made of the material and the sprayed heat-conducting layer (10): the heat-dissipating module and the computer display card and the computer memory card processed by the central processing unit of the heat-dissipating fin (43) The common heat sink fins and the light-emitting diodes are often thinned (4) heat-dissipating, and the heat-dissipating fins (43) coated with the heat-conducting layer (10); the heat-dissipating fins and jade will be coated with a heat-conducting layer (20) In the vicinity of the back of the contact with a heat source (30), the heat-dissipating tabs (43) are attached to the left to carry out the remaining; the above-mentioned four inner peripheral surfaces of the entire inner and outer surfaces of the heat-collecting body are attached to the surrounding frame. a continuous annular heat conducting layer; and a thermally conductive layer (20) 'the thermal conduction (20) is in a continuous shape, and is attached around the entire inner and outer surfaces of the heat dissipating body (10a). When the heat conducting layer (10) is in contact with the source (30), the heat source (30) can be used. The heat energy is quickly transferred from the surface to the various parts of the heat dissipating body (10) to naturally dissipate heat by contact with the outside air by the extremely large area. The above heat conducting layer (20) can be graphite, Single ore or a variety of stone materials such as carbon can also be mixed with a single metal or a plurality of metals such as titanium, nickel, bell, copper, crane, copper and nickel, or carbon or tungsten plus carbon or nickel or carbon or The carbon-copper stone and the multi-metal are applied successively, and after being melted by the coating machine, the coating is attached to the heat-dissipating body (l〇a) to form a diamond-like carbon film (Diamond-Like). Carbon). The heat dissipating body is generally used for heat dissipation improvement of computer and electronic heat sink fins, and the heat dissipation structure of the present invention disclosed in (fourth to sixth and tenth to twelfth drawings) is improved in structure. The heat dissipating body (1〇) and the heat dissipating fins (43) and the sprayed heat conducting layer (20) are formed in a continuous ring shape and attached to all peripheral surfaces of the heat dissipating body (1〇a), when the heat conducting layer ( 2〇) When it is placed on the heat source (3〇), the 5 M368122 can be quickly passed through the heat-conducting layer (20). The heat-dissipating body (i〇a) and the heat-dissipating fin (9) are replaced by the V1曰f. The four surrounding areas are transmitted to the respective parts of the heat dissipating body and the heat dissipating fins (43) to be naturally dissipated by contact with the outside air by the extremely large heat dissipating surface area. [The heat-dissipating members of the prior art are gradually diffused and diffused from the heat source, so the heat energy is concentrated on the aluminum fins that are close to the heat source and is not easily dissipated for a long time.] The heat-dissipating body of the present invention (l〇a) After being heated quickly, the heat can be conducted to the outside world to achieve rapid heat dissipation.
【圖式簡單說明】 第一圖：係習之通用之散熱鰭片的立體示意圖局部剖面圖 -尚未喷塗前。 第二圖：係習之通用之散熱鳍片的立體示意圖立體正面圖 -尚未喷塗前。[Simple description of the diagram] The first picture: a partial cross-sectional view of the heat dissipation fins of the general purpose of the study - before spraying. Figure 2: Stereoscopic front view of the heat sink fins of the general purpose - before spraying.
第二圖：係習之通用之散熱鰭片的立體示意圖立體反面囷 '尚未喷塗前。 第四圖：係本新型之散熱本體實施立體 ^圃 局部剖面圖-已喷塗導熱層。 第五圖·係本新型之另一實施示意圖-立體正面圖。 第六圖.係本新型之另一實施示意圖-立體反面圖。 第七圖：係習之通用之散熱鰭片的立體示意圖局部剖面圖 ''尚未喷塗前。 第八圖·係習之通用之散熱鰭片的立體示意圖 M儿體正面圖 6 修正 補充 ι·ιι — I ·η-·-—· -— M368122 ' ~尚未噴塗前。 第九圖：係習之通用之散熱鰭片的立體示意圖立體反面圖 ~尚未噴塗前。 ^十圖：係本新型之散熱本體實施立體示意圖 局部剖面圖-已喷塗導熱層。 第十一圖：係本新型之另一實施示意圖-立體正面圖。 第十二圖：係本新型之另一實施示意圖_立體反面圖。 【主要元件符號說明】 (1〇)散熱本體—尚未喷塗前 〇〇a)散熱本體-已噴塗導熱層 (30)熱源 （43)散熱鰭片 (20)導熱層 申請專利範圍： 银通用於電腦、電子類之散熱鰭片的散熱改良，其散熱本體 基材所製成之散鋪片，錢健導歸；係加工喷塗 心铸片即通用於電腦之中央處理器的散熱模組及電腦顯 韓Μ地憶卡等通用之散熱鰭片及發光二極體常用之散熱 鰭κ a政II改良暨加上喷附塗抹導熱層之散熱鰭片；將該散熱 靖Η ^喷塗—導熱層後，於接觸—熱源處背後附近，將此散熱 續片緊貼，以進行散熱者。 7The second picture: the stereoscopic schematic of the heat sink fins of the general purpose of the study. The fourth picture: the three-dimensional implementation of the heat dissipation body of the present invention. ^ Partial sectional view - the thermal conductive layer has been sprayed. Fig. 5 is a schematic view showing another embodiment of the present invention - a front view. Fig. 6 is a schematic view showing another embodiment of the present invention - a stereo reverse view. Figure 7: A partial cross-sectional view of a schematic view of a general-purpose heat sink fin. Figure 8: Stereoscopic view of the general heat sink fins of the M. Front view of the M body. 6 Correction Supplement ι·ιι — I ·η-·-—· - M368122 ' ~ Before spraying. The ninth picture: The stereoscopic view of the heat sink fins of the general purpose of the study is ~ before the spray. ^10图: This is a three-dimensional schematic diagram of the new heat dissipation body. Partial sectional view - sprayed thermal layer. Figure 11 is a schematic view of another embodiment of the present invention - a stereo front view. Twelfth figure: is another schematic diagram of the implementation of the present invention _ three-dimensional reverse view. [Main component symbol description] (1〇) heat dissipation body—not before spraying 〇〇 a) heat dissipation body - sprayed heat conduction layer (30) heat source (43) heat dissipation fin (20) heat conduction layer Patent application range: Yintong is used for The heat dissipation of the heat sink fins of computers and electronics, the scattered tiles made of the heat-dissipating body substrate, Qian Jiangui; the processing of the heart-casting chip is the heat-dissipating module of the central processing unit of the computer and Computer display Han Μ 忆 忆 等 通用 通用 通用 通用 通用 通用 通用 通用 通用 通用 通用 通用 通用 通用 通用 通用 通用 通用 通用 政 政 政 政 政 政 政 政 政 政 政 政 政 政 政 政 政 政 政 政 政 政 政 政After the layer, near the back of the contact-heat source, the heat sink is closely attached to the heat sink. 7