M310581 八、新型說明： 【新型所屬之技術領域】 本創作是一種散熱型電路板，特別是一種可以對電子元件提供較 佳散熱效能之電路板構造者。 【先前技術】M310581 VIII. New Description: [New Technology Field] This creation is a heat-dissipating circuit board, especially a circuit board builder that can provide better heat dissipation performance for electronic components. [Prior Art]
在傳統的印刷電路板（PCB)上，除規劃有既定的電子線路外，又 包括許多插接於電路板上的電子元件，這些電子元件在工作中會釋出 一定的工作溫度，如果沒有適當地提供散熱，將影響這些電子元件的 工作效率，甚至破壞所屬系統的運作；為了解決散熱問題，一般的方 法是在這些電子元件上加設散熱片，利用散熱片高效率熱傳導的材料 特性（例如鋁材），將元件所釋出的溫度加以吸收後，再分散傳遞到 面積較大的散熱片各部位，使熱源不致集中而達到適度降溫的效果。 從上所述，可以意會到散熱片的面積會直接影響到散熱的效率， 散熱片的面積與散熱的效果成正本，但基於電路板上不只包含單一售 子元件，在有闕空_隔下，多數傳統的散刻纽直立方式來擔 充散熱的面積，再予⑽近於待散熱物（元）件；惟類似以上這種太 型直立式的散熱片、或散熱模組，在實際的應用上常遇到—些難題。 舉例而言，-種具高辨效能的發光二極體⑽），射以產生較傳統 ^數倍的絲，而且又非常地省電，所以目前觀祕大_示看板 或展示照咖嫩’物糊細。㈣錄品的容積 M310581 杈大’所以對於$種南功率LED在工作中所釋出的高溫，可以利用其較 見廣輕間加以吸收’或者湘前述的大體積散齡置來解決其散熱 的問題。惟，對-些小型化的科技產品，例如筆記型電腦的面板，個 人行動化數位助理（PDA)、或手機之彩色螢幕的使用需求，由於其可 以提供的散熱空間有限，而且這些LED都是以群組的型式建立，所以完 全無法與前述的大型直立式散熱片或其它散讎組加以匹配，由於這 ,種高功率LED所產生的散熱問題難以得到解決，也就是這些小型化產品 鲁未能加以廣泛應用的最主要原因，如此對於生產業者及消費者都是一 大損失。 緣是，創作人先前以中華民國公告第M254889號「散熱型電路板之 構造」之專利技術加以突破，使這種處於電路板的單—元件也可以透 過與政熱板的直接接觸而增加散熱的效能。 惟，上述這個先前技術在散熱型電路板成型後，其主司散熱的銘 板與被散熱物件在組裝時，由於絲面*吃錫，所以製程巾預先以導 鲁熱膠塗伽絲面軒_合，舰的是1導歸介於被散熱物件 與銘板之間，孩影響熱源的料，^且製程不利自統，成為此設 計唯一美中不足之處。 【新型内容】 為能夠進一步改善先前技術中所描述的缺陷，本創作特別提供一 種散熱型電路板之改良構造，除能夠支援工作中電子元件的散熱效能 外，更兼顧到適於與被散熱物件構成組裝，利於大量生產，且熱傳導 M310581 效能更佳之改良設計者，此亦為本創作之主要目的。 為實現上述之創作目的，本創作藉由係由一規劃有預定電路之電 路板及一熱傳導效率佳之鋁板所組成，其中，該鋁板表面界定有一接 觸區，其他區塊以喷砂處理為一粗化層，該電路板具有一面積相當於 鋁板接觸區之穿孔，以該穿孔對應於鋁板的接觸區，透過鋁板的粗化 層與電路板膠合，此外，該鋁板的接觸區表面電鍍一可吃錫之金屬層， 藉該金屬層直接上錫貧與被散熱物件一起過錫爐使鋁板與被散熱物件 充分接合。 馨 至於本創作的詳細技術内容及較佳實施例，茲配合圖式說明如後。 【實施方式】 如第一、二圖所揭露者，本創作之散熱型電路板主要係藉由一規 劃有預定電路(101)之電路板（10)及一熱傳導效率佳之鋁板(20)所組 成，其中，該鋁板(20)表面界定有一接觸區（211)，接觸區（211)表面 電鍍一可吃錫之金屬層（212)，例如鋅，其他區塊以噴砂處理為一粗化 •層（21)，該電路板（1〇)具有一面積相當於鋁板接觸區（211)之穿孔 (11)，電路板(10)以該穿孔（H)對應於鋁板(2〇)的接觸區（211)，透過 銘板(20)的粗化層（21)與電路板(1〇)膠合而成為一散熱型電路板； 藉上述，以第二圖所示之發光二極體(30)當作被散熱物件為例， 組裝時，只要在前述鋁板之金屬層（212)上錫膏便可與該被散熱物件 (30)—起過錫爐使其充分接合，如此不僅可以加速製程，亦不會影響 熱源傳導的效率，實為一具新穎性及進步性之新型創作。 綜上所述，本創作確實改善了先前技術所無法解決的問題，而更 M310581 增進其實賴功效與舰，應已符合新型專利之要件，爰依法提出專 利申請。惟，以上所述僅為本創作之較佳實施方#，自不能以此限定 本創作之權植®。舉凡所屬技術領域巾财通常知識者援依本創作 之精神所作之等效修飾_化，皆仍涵蓋於後附之中請專繼圍内。 【圖式簡單說明】 第一圖，為本創作之散熱型電路板的分解圖。 >第二圖，為本創作之主要結構示意圖。 【主要元件符號說明】 (10) 電路板 (101)電路板規劃之預定電路 (11) 穿孔 (20) 紹板 (21) 粗化層 > (211)接觸區 (212)可吃錫之金屬層 (30)被散熱物件(發光二極體）On a conventional printed circuit board (PCB), in addition to planning a predetermined electronic circuit, it also includes a number of electronic components that are plugged into the circuit board. These electronic components will release a certain operating temperature during operation, if not properly Providing heat dissipation will affect the working efficiency of these electronic components and even destroy the operation of the system. In order to solve the heat dissipation problem, the general method is to add heat sinks to these electronic components, and to utilize the material properties of the heat sink with high efficiency heat conduction (for example) Aluminum), after the temperature released by the component is absorbed, it is dispersed and transmitted to various parts of the heat sink with a large area, so that the heat source is not concentrated and the effect of moderate temperature drop is achieved. From the above, it can be expected that the area of the heat sink directly affects the efficiency of heat dissipation. The area of the heat sink and the heat dissipation effect are original, but based on the circuit board, not only a single sale component but also a hollowed out Under the circumstance, most traditional slanted erect erecting methods are used to charge the heat-dissipating area, and (10) close to the heat-dissipating material (meta); but similar to the above-mentioned sturdy vertical heat sink or heat-dissipating module, in practice The application often encounters some problems. For example, a kind of high-efficiency light-emitting diode (10) is used to produce a wire that is more than a multiple of the conventional one, and it is very power-saving, so the current view of the big _ show kanban or display photo The substance is fine. (4) The volume of the recorded product M310581 is large. Therefore, for the high temperature released by the seed power LED in the work, it can be absorbed by the wider light and lighter. problem. However, the need to use some of the miniaturized technology products, such as notebook panels, personal mobile digital assistants (PDAs), or color screens for mobile phones, is limited by the space available for cooling, and these LEDs are It is built in the group type, so it can't be matched with the large vertical heat sink or other dimming group mentioned above. Because of this, the heat dissipation problem caused by the high-power LED is difficult to solve, that is, these miniaturized products Lu Wei The main reason why it can be widely used is a big loss for producers and consumers. The reason is that the creator previously made a breakthrough in the patented technology of the Republic of China Announcement No. M254889 "Structure of Heat Dissipating Circuit Board", so that the single component in the circuit board can also increase heat dissipation through direct contact with the hot plate. Performance. However, the above-mentioned prior art is formed after the heat-dissipating circuit board is formed, and the heat-dissipating nameplate and the heat-dissipating object of the main body are assembled, because the silk surface* eats tin, the process towel is coated with the galvanized surface in advance. The ship's 1 is between the heat-dissipating object and the nameplate. The child affects the heat source, and the process is unfavorable. It is the only flaw in this design. [New content] In order to further improve the defects described in the prior art, the present invention provides an improved structure of a heat-dissipating circuit board, which not only supports the heat-dissipating performance of electronic components in operation, but also takes into consideration the objects suitable for heat dissipation. This is the main purpose of the creation of the improved design that constitutes the assembly, which is conducive to mass production and the heat conduction M310581 is better. In order to achieve the above-mentioned creative purposes, the present invention consists of a circuit board planned with a predetermined circuit and an aluminum plate with good heat conduction efficiency, wherein the surface of the aluminum plate defines a contact area, and other blocks are sandblasted for a thick The circuit board has a perforation corresponding to the contact area of the aluminum plate, and the perforation corresponds to the contact area of the aluminum plate, and the roughened layer of the aluminum plate is glued to the circuit board, and further, the surface of the contact area of the aluminum plate is plated and eatable. The metal layer of tin, through which the metal layer is directly tinned and the heat-dissipated object passes through the tin furnace to fully engage the aluminum plate with the heat-dissipated object. As for the detailed technical content and preferred embodiment of the present creation, the following description is in conjunction with the drawings. [Embodiment] As disclosed in the first and second figures, the heat-dissipating circuit board of the present invention is mainly composed of a circuit board (10) planned with a predetermined circuit (101) and an aluminum plate (20) with good heat conduction efficiency. Wherein, the surface of the aluminum plate (20) defines a contact region (211), and the surface of the contact region (211) is plated with a tin-plated metal layer (212), such as zinc, and other blocks are sandblasted to a rough layer. (21), the circuit board (1) has a perforation (11) corresponding to an area (211) of the aluminum plate, and the circuit board (10) corresponds to the contact area of the aluminum plate (2) with the perforation (H) ( 211), a roughened layer (21) of the nameplate (20) is glued to the circuit board (1〇) to form a heat dissipation type circuit board; by the above, the light emitting diode (30) shown in the second figure is used as For example, when the heat dissipating object is assembled, the solder paste on the metal layer (212) of the aluminum plate can be fully bonded to the heat sink object (30), so that the process can be accelerated or not. It will affect the efficiency of heat source conduction, and it is a new creation with novelty and progress. In summary, this creation has indeed improved the problems that the prior art cannot solve, and the M310581 enhances the effectiveness and the ship, and should have met the requirements of the new patent, and filed a patent application according to law. However, the above description is only the preferred implementation of this creation #, and it is not possible to limit the creation of this creation. The equivalent modifications made by the general knowledge of the technical field in the technical field of the technical field are still covered in the attached section. [Simple description of the diagram] The first figure is an exploded view of the heat-dissipating circuit board of the creation. > The second picture is the main structure diagram of the creation. [Major component symbol description] (10) Circuit board (101) Circuit board planning predetermined circuit (11) Perforation (20) Plate (21) Coarse layer> (211) Contact area (212) can eat tin metal Layer (30) is cooled by the object (light emitting diode)