M310580 八、新型說明： 【新型所屬之技術領域】 本創作是一種散熱型電路板， 一 佳散熱效能之電路板構造者。、疋一可以對電子元件提供較 【先前技術】 1包括細⑽）丨侧树㈣子線路外，又 件在工作中會釋出 疋虹作*度，如H有輕地提彳i£散| H、_^ -工作Μ甘m 蛛纟、賴’將鱗這些電子元件的 所屬系统的運作;為了解決散熱問題’-般的方 特3=树上加設散熱片，利用散熱片高效率熱傳導的材料 面積較大的散離部位，#:、! 吸收後，再分散傳遞到 此、、、片σ雜使熱源猶集中而達到適度降溫的效果。 妙^所述’可以意會到散熱片的面積會直接影響到散熱的效率， u、、片的面積與散_效果成正本，但基於電路板上不只包含單一電 Τ兀件’在有限的空間區隔下，多數傳統的散熱片多以直立方式來擴 Ζ熱的面積，再予以貼近於待散熱物⑷件；惟類似以上碰 立式的散熱片、或散熱模组，在實際的赫上常遇到—些難題。 ⑽細辨效朗私二峨卿，咖赶較傳統 γ ^原’而且又非常地省電，所以目前被應用於大型顯示看板 s、丁…、月等一似物叩，作為其主要的發光源。由於這些物品的容積 5 M310580 較大，所以對於這種高功率LED在工作中所釋出的高溫，可以利用其較 寬廣的雜加以吸收’或者__的讀積散絲縣解決其散熱 的問題。惟，對-些小型化的科_品，例如筆記型電腦的面板，個 人行動化數位助理⑽）、或手機之彩色螢幕的使用需求，由於其可 以提供的散熱空間有限，而且這些LED都是以群組的型式建立，所以完 全無法與前述的大型直立式散熱片或其它散熱模組加以匹配，由於2 種高功率LED啦生·朗題難轉_決，也就是這些小型化產= 1未能加以廣泛應用的最主要原因，如此對於生產業者及消費者都是一 大損失。 、 疋 緣是，創作人先前以中華民國公告第M25號「散熱型電路板之 構造」之專利技術加以突破，使這種處於電路板的單一元件也可以透 過與散熱板的直接接觸而增加散熱的效能。 如第-圖所示’係上揭專利先前技術的代表圖，其中該電路板⑽ 除穿孔ου外係完全覆蓋在散触(2_表面⑵)上，_被散熱的 物件可以透過板⑽的穿孔⑴）直接自散熱板⑽的接觸部(即 得到散熱支援，卻有礙於該散熱板⑽娜三度雜⑽方向）擴充， 使這種設計的_麵受到再者，將電職⑽直接交疊於散 熱板⑽表面，其厚度自朗加而不利於小型化，都是這項設計美中 不足的缺憾。 ' 【新型内容】 為能夠改善先前技術所描述的缺陷，本創作特別設計一種更進步 6 M310580 ===路板，除能夠支援工作中電子元件的散熱效能外，更兼顧 ^糊嶋，_度地縮減 以利於小型化的設計，為本創作之主要目的。 ，作目的，本創作藉由—規劃有預定電路之電路板 i面所喊，射，該散熱板 邻之穿$ 9 X %板/、有一面積大於散熱板接觸 路板可以穿過該接觸部而嵌入於散熱板的凹槽内， 反黏ί ’猎此’預定被散熱之物件可置於散_之接觸部， ::作==路板上默的f路配接成導通狀態’使該被麟物 散熱板所支援的散熱效能，以維持其工作的 知疋度亚延長所使用的壽命；更甚者，由於電路板被後入於散執板中， 使可以細減攻種結構之散熱型電路板的體積，以利於小型化的設計與 應用、。再者，由於電路板未完全覆蓋該散熱板，使顯露於外部的散熱 1 其Γ度空’ζ軸方向)擴充，以匹配其實 減1^化，更因此而增加散細效能，而得到最理想的設計。 至於本創作的詳細技義容及錄實施例，誠合圖式說明如後。 【實施方式】 如第二圖_露者，本創作之散_電路板主魏由-規劃有預 定電路⑽之電路板⑶及—熱解鱗佳之散敵(4，__斤 組成，其+，該散熱板表©設有—預定面積之接觸部⑽，在該接觸 部⑽的外緣與散熱板的邊界之間具有—環繞該接觸部⑽的凹槽 7 M310580 (41)，此凹槽(41)的底面經喷砂處理具一粗化層； 該電路板⑶上與前揭先前技術相同，具有一面積A於散熱板接觸 .部(40)之穿孔(此穿孔位置請參考第一圖編為„之件號），使該電路板 < (3)可以穿過該接觸部（40)而嵌入於散熱板的凹槽(41)内，藉凹槽底面 - 的粗化層與電路板(3)黏合； ’ 藉此"亥預疋被政熱之物件（5 ’例如圖示之發光二極體）即置於散 熱板⑷之接觸部(40)，物件⑸之電源接腳(5〇)可與電路板⑶上預定 •的電路(30)配接成導通狀態，使該被散熱物件(5)在工作中可以直接獲 得散熱板⑷所支援的㈣魏，轉持紅作的敎度並延長所使^ 的哥命。 .^上述中’由於電路板⑶被嵌入於散熱板⑷中，使可以縮減類似 廷種結構之散熱型電路板的體積，朗於小魏的設計與應用。再者， 如第三圖所示，秘電路板⑶未完全覆魏散熱板⑷，使顯露於外 T的散熱板(42)可以適度朝其第三度空間（即z軸方向）擴充，以匹配其 _貫際應用的狀態及造型變化(例如篏燈），更可以因為散熱體積的增加 而強化其散熱的效能，而得到最佳化的設計。 、，练上所’本創作確實改善了先前技術所無法解決的問題，而更 增進其實_功效與價值，應已符合新型專利之要件，爰依法提出專 ,利申請。惟，以上所述僅為本創作之較佳實施方式，自不能以此限定 ，本創作之翻顧。舉凡關技術機巾具魏常知識者援依本創作 之精神所作之等效修飾或變化，皆仍涵蓋於後附之中請專利範圍内。 【圖式簡單說明】 8 M310580 第一圖，為創作人先前申請公告第M254889號專利之代表圖。 第二圖’為本創作之散熱型電路板的主要結構圖。 第三圖，本創作之另一較佳實施例圖。 【主要元件符號說明】 (3)電路板 (3 0)電路板規劃預定的電路 _ (4)散熱板 (40) 散熱板之接觸部 (41) 凹槽 (42) 電路板未覆盍之散熱板區塊 (5)被散熱物件(發光二極體） (50)被散熱物件之電源接腳M310580 VIII. New Description: [New Technology Field] This creation is a heat-dissipating circuit board, a circuit board builder with good heat dissipation performance. The first one can provide electronic components with more than [previous technology] 1 including fine (10)) side tree (4) sub-line, and the piece will release the 疋 作 工作| H, _^ - Work Μ m m 纟 赖 赖 赖 赖 赖 将 将 鳞 鳞 这些 这些 这些 这些 这些 这些 这些 这些 这些 这些 这些 这些 这些 这些 这些 这些 这些 这些 这些 这些 这些 这些 这些 这些 这些 这些 这些 这些 这些 这些 这些 这些 这些 这些The heat-transfer material has a large area of scattered parts, #:,! After absorption, it is dispersed and transmitted to this, and the σ is mixed so that the heat source is concentrated to achieve a moderate cooling effect. Miao ^ said 'can be expected to the area of the heat sink will directly affect the efficiency of heat dissipation, u, the area of the film and the dispersion of the effect is the original, but based on the circuit board not only contains a single electric piece 'in limited Under the space division, most of the traditional heat sinks expand the hot area in an upright manner, and then close to the heat sink (4); but similar to the above-mentioned vertical heat sink, or heat sink module, in actual I often encounter some problems. (10) Finely distinguishing the effect of the two private sects, the coffee is more traditional than the traditional γ ^ original 'and very power-saving, so it is currently used in large display billboards s, Ding ..., month, etc., as its main light source. Since the volume of these items is large, M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M . However, the use of some miniaturized products, such as notebook panels, personal mobile digital assistants (10), or mobile color screens, because of the limited space available for cooling, and these LEDs are It is built in the group type, so it can't match the large vertical heat sink or other heat dissipation module mentioned above. Because of the two kinds of high-power LEDs, it is difficult to turn around, that is, these small-scale production = 1 The main reason for not being widely used is a big loss for both producers and consumers. The creator, the creator previously made a breakthrough in the patented technology of the Republic of China Announcement No. M25 "Structure of the heat-dissipating circuit board", so that the single component in the circuit board can also increase the heat dissipation through direct contact with the heat sink. Performance. As shown in the figure, the representative figure of the prior art is disclosed in which the circuit board (10) is completely covered on the ground contact (2_surface (2)) except for the perforation, and the object to be dissipated through the plate (10) The perforation (1)) directly extends from the contact portion of the heat dissipation plate (10) (that is, the heat dissipation support is obtained, but it hinders the expansion of the heat dissipation plate (10) and the third (10) direction of the heat dissipation plate, so that the design of the _ surface is further, and the electric service (10) is directly Overlapped on the surface of the heat sink (10), its thickness from Langka is not conducive to miniaturization, which is the shortcoming of this design. ' [New content] In order to improve the defects described in the prior art, this creation specifically designed a more advanced 6 M310580 === road board, in addition to supporting the heat dissipation performance of the electronic components in the work, but also pay more attention to the paste, _ degrees The reduction of the ground to facilitate the miniaturization of the design is the main purpose of the creation. For the purpose, the creation is made by arranging the i-plane of the circuit board with the predetermined circuit, and the heat sink is adjacent to the $9 X% plate/, and an area larger than the heat sink contact plate can pass through the contact portion. And embedded in the groove of the heat sink, the object that is scheduled to be dissipated by the heat can be placed in the contact portion of the scatter, and the ========================================================== The heat dissipation performance supported by the lining heat sink is used to maintain the working knowledge, and the life span is extended. Moreover, since the circuit board is inserted into the scatter board, the structure can be reduced. The size of the heat-dissipating circuit board is advantageous for miniaturization design and application. Moreover, since the circuit board does not completely cover the heat dissipation plate, the heat dissipation 1 exposed to the outside is expanded, and the width of the heat dissipation 1 is expanded to match the actual reduction, thereby increasing the dispersion performance and obtaining the most The ideal design. As for the detailed technical meaning and recording examples of this creation, the description of the plan is as follows. [Embodiment] As shown in the second figure _ dew, the creation of the _ _ board of the main Wei Wei - planning the circuit board (3) of the predetermined circuit (10) and - the hot solution of the scale of the enemy (4, __ kg composed, its + The heat sink table is provided with a contact portion (10) of a predetermined area, and between the outer edge of the contact portion (10) and the boundary of the heat dissipation plate, there is a groove 7 M310580 (41) surrounding the contact portion (10), the groove The bottom surface of (41) is sandblasted to have a roughened layer; the circuit board (3) is the same as the prior art, and has a perforation of an area A in the contact portion of the heat sink (refer to the first position of the perforation) The figure is edited as the part number, so that the circuit board < (3) can be inserted into the groove (41) of the heat dissipation plate through the contact portion (40), by the rough surface of the groove bottom surface The circuit board (3) is bonded; 'by this" is the object of the political heat (5', for example, the light-emitting diode shown in the figure), which is placed at the contact portion (40) of the heat sink (4), and the power supply of the object (5) The foot (5〇) can be connected to the predetermined circuit (30) on the circuit board (3) to be in a conducting state, so that the heat-dissipated object (5) can be directly supported by the heat sink (4) during operation. (4) Wei, transfer the redness of the work and extend the life of the ^. ^ ^ In the above 'because the circuit board (3) is embedded in the heat sink (4), so that the heat-dissipating circuit board similar to the structure of the structure can be reduced The volume is far from the design and application of Xiaowei. Furthermore, as shown in the third figure, the secret circuit board (3) does not completely cover the Wei heat plate (4), so that the heat sink (42) exposed to the outer T can be moderately directed to the third. The degree space (ie, the z-axis direction) is expanded to match the state of its application and the shape change (such as a xenon lamp), and the heat dissipation efficiency can be enhanced by the increase in the heat dissipation volume to obtain an optimized design. The practice of this practice has indeed improved the problems that the prior art could not solve, and the actual effect of _ efficacy and value should have met the requirements of the new patent, and the application was made according to law. However, the above mentioned only For the better implementation of this creation, it is not possible to limit this, and the creation of this creation. The equivalent modification or change of the technical machine towel with Wei Chang knowledge in the spirit of this creation is still covered. Attached to the scope of the patent. The simple description of the figure] 8 M310580 The first picture is the representative figure of the patent application No. M254889 previously filed by the creator. The second picture is the main structure diagram of the heat-dissipating circuit board of the creation. The third picture, another of the creation BRIEF DESCRIPTION OF THE PREFERRED EMBODIMENT [Description of main component symbols] (3) Circuit board (30) Circuit board planning predetermined circuit _ (4) Heat sink (40) Heat sink contact (41) Groove (42) The heat sink plate block (5) that is not covered by the circuit board is the heat sink object (light emitting diode) (50) is the power pin of the heat sink object