TWM414546U - Heat dissipation structure of light emitting diode - Google Patents

Heat dissipation structure of light emitting diode Download PDF

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Publication number
TWM414546U
TWM414546U TW99223488U TW99223488U TWM414546U TW M414546 U TWM414546 U TW M414546U TW 99223488 U TW99223488 U TW 99223488U TW 99223488 U TW99223488 U TW 99223488U TW M414546 U TWM414546 U TW M414546U
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Taiwan
Prior art keywords
light
heat dissipation
heat
emitting diode
dissipation structure
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TW99223488U
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Chinese (zh)
Inventor
Tzu-Fa Wu
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Tzu-Fa Wu
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Priority to TW99223488U priority Critical patent/TWM414546U/en
Publication of TWM414546U publication Critical patent/TWM414546U/en

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Description

M414546 '【新型所屬之技術領域】 -本創作為提供一種 有效擴散熱能,提升導鼓::、,°構尤心一種倉丨 散熱結構。 彳導熱效果的發光二極心 術 技 前 先 按,節約能源已是 的目標,然,電(熱)M414546 '[New Technology Field] - This creation provides an effective diffusion of thermal energy and enhances the guide drum::,, ° is a kind of squat heat dissipation structure.发光 彳 彳 彳 彳 彳 先 先 先 先 先 先 先 先 先 先 按 按 按 按 按 按 按 按 按 按 按 节约 节约

自然及地球暖化的主要 的消耗係為目前環保纽 由節約節能減碳來達到 有能源中最大耗量的其 品、照明設備、居家電 能來驅動以達到運作使 論白天或黑夜都必須透 處於明亮的狀態,尤其 可或缺,由於人類必須 環境,更且光的變化, 為此大量的使用照明設 所使用的照明設備其所 使用壽命短,也因此促 的誕生,如發光二極體 使用壽命長、耗電量小 此漸漸取代以往的照明 各國多年來所極力提倡 能早已成為人類破壞大 首因;如何減少電熱能 織共同追求之目標,藉 環保之目的;電能是所 中之一種,凡舉民生用 器用品等等均須透過電 用,特舉照明方面,盔 過照明設備讓周遭環境 是夜晚照明設備更是不 依賴光才能看見周遭的 亦是人類的一種藝術, 備是無法避免的,以往 耗的電能相當驚人,且 使相關的節能燈具陸續 (LED)其優點在於 、照明度佳等優勢,因 設備’但現今,L E D M414546 在發光時所產生的高溫尚未被克服,此種產生 的熱能不僅會影響到裝載的裝置、電路,亦同 時縮減L E D原本的使用壽命。The main consumption system of natural and global warming is that the current environmental protection is saved by energy saving and carbon reduction to achieve the maximum consumption of energy, lighting equipment, home electric energy to drive to achieve operation, day or night must be transparent In a bright state, especially indispensable, because human beings must have an environment, and light changes, the lighting equipment used for a large number of lighting installations has a short service life, and thus is born, such as a light-emitting diode. Long service life and low power consumption have gradually replaced the previous lighting countries. Many years of efforts have been strongly advocated to become a major cause of human destruction; how to reduce the goal of electric heating and weaving together, for the purpose of environmental protection; electric energy is one of the All kinds of articles for the use of the people's livelihood must be used for electricity. In terms of special lighting, helmets and lighting equipment make the surrounding environment a nighttime lighting device. It is also an art that is not dependent on light to see the surroundings. It is also impossible to Avoided, the power consumption in the past is quite amazing, and the related energy-saving lamps (LED) have the advantages of good illumination, etc. Advantages, due to equipment 'but nowadays, the high temperature generated by L E D M414546 when it is illuminated has not been overcome. This generated thermal energy not only affects the loading device and circuit, but also reduces the original service life of L E D.

目前一般基板多係為印刷電路板(p C B )_,印刷電路板之材料特性並不利於發光二極 肢元件與散熱座之間得熱傳導,因此當運作一 段時間之後,由於發光二極體元件的發熱源面 積均只有LED元件本身及接腳,因此其發熱 面積都不大,所以會發生嚴重聚熱之現象,有 鑒於此,前述結構不但無法保持發光二極體元 件之照度,更會因此降低發光二極體元件之使 用壽命,進而無法達到真正解決快速導熱及散 熱的目的。 是以,要如何解決上述習用之問題與缺 失,即為本創作之創作人與從事此行業之相關 薇商所亟欲研究改善之方向所在者。 【新型内容】 故’本創作之創作人有鑑於上述缺失,乃 搜集相關資料,經由多方評估及考量’並以從 事於此行業累積之多年經驗,經由不斷試作及 修改,始設計出此種能有效擴散熱能,提升導 熱效果的新型專利者。 本創作之主要目的在於:藉由各傳導層能 將各LED發光件的熱能擴散於整面傳導層, M414546 進而達到對L E D元件快速散熱之功效, 、持L E D元件照度之穩定,發揮省電效率,/ 及延長LED元件之使用壽命。 以 為達上述目的,本創作係一種發光二極 之散熱結構’其主要由散熱基座及複數傳 組成,其中散熱基座係界定有一導熱介面,層 於導熱介面上分佈貼設有各傳導層,於各傳並 層上另設有多個LED發光件。 '導 方式】 達成上述目的及 段及構造,茲繪 明其特徵與功能 參閱第一圖及第 施例之立體示意 楚看出本創作係 此散熱結構1其 )及複數傳導層] 界定有一導熱介 2上分佈貼設有 金、銀、銅或鎳 上另設有多個L 光件2所界定之 之該傳導層1 2 元件2 〇 2及二 【實施 為 技術手 詳加說 請 較佳實 中可清 結構, 資*或鋁 1 0係 面1 0 層可為 層1 2 E D發 於不同 led 功效,本創作所採用之 圖就本創作較佳實施例 如下,俾利完全了解。 二圖所示,係為本創作 圖及剖面示意圖,由圖 一種發光二極體之散熱 主要由散熱基座i 0 (陶 -2組成,其中散熱基座 面1〇2,並於導熱介 各傳導層12,此傳導 等相關材料,於各傳導 ED發光件2。而各l 發熱源2 〇係分別接觸 ,而此發熱源2 0係為 連接該LED發光件2 5 M414546At present, the general substrate is mostly a printed circuit board (p CB ) _, the material characteristics of the printed circuit board are not conducive to the heat conduction between the light-emitting diode component and the heat sink, so after operating for a period of time, due to the light-emitting diode component The heat source area is only the LED element itself and the pin, so the heat generation area is not large, so there is a phenomenon of severe heat accumulation. In view of this, the above structure can not only maintain the illumination of the LED component, but also The service life of the light-emitting diode component is reduced, and thus the purpose of realizing rapid heat conduction and heat dissipation cannot be achieved. Therefore, how to solve the problems and shortcomings of the above-mentioned practices, that is, the creators of the creation and the related companies in the industry who want to study the direction of improvement. [New content] Therefore, the creators of this creation, in view of the above-mentioned deficiencies, are collecting relevant information, and through multiple assessments and considerations, and through years of experience in the industry, through continuous trial and modification, they have designed this energy. A new patent that effectively diffuses heat and enhances thermal conductivity. The main purpose of this creation is to diffuse the thermal energy of each LED light-emitting component to the entire surface conduction layer by using each conductive layer, and M414546 can achieve the effect of rapidly dissipating heat of the LED component, and maintain the illumination of the LED component to achieve power saving efficiency. , / and extend the life of LED components. In order to achieve the above objectives, the present invention is a heat-emitting structure of a light-emitting diode, which is mainly composed of a heat-dissipating pedestal and a plurality of transmissions, wherein the heat-dissipating base defines a heat-conducting interface, and the layers are disposed on the heat-conducting interface and each conductive layer is disposed. A plurality of LED illuminating members are further disposed on each of the layers. 'Guidelines】 To achieve the above objectives, paragraphs and structures, the characteristics and functions of which are drawn. Referring to the three-dimensional diagram of the first figure and the first example, it is seen that the heat dissipation structure 1 and the plurality of conductive layers define a heat conduction. The conductive layer 1 2 element 2 〇 2 and 2 defined by a plurality of L-light members 2 on the gold, silver, copper or nickel is distributed on the medium 2 (implemented as a technical hand In the real clearing structure, the capital* or aluminum 10 0 layer 10 layer can be layer 1 2 ED issued in different LED effects, the map used in this creation is better implemented in this creation, for example, the full understanding of the profit. The two figures show the creation diagram and the cross-section diagram. The heat dissipation of a light-emitting diode is mainly composed of the heat-dissipating base i 0 (Tao-2, wherein the heat-dissipating base surface is 1〇2, and The conductive layer 12, the conductive and other related materials, each conducts the ED light-emitting member 2. The heat-generating source 2 is respectively in contact with each other, and the heat-generating source 20 is connected to the LED light-emitting member 2 5 M414546

之導接腳2 供遮罩各L 错由上 之使用作動 三圖及第四 佳實施例之 示意圖,由 2 的 L E D 接抵貼於不 具備導電及 2 0 2受到 電能後,L 所產生的熱 導接腳2 〇 時透過其他 水平方式向 另外,當散 運用傳導層 陶瓷本身橫 由各傳導層 擴散於整面 導佳的優點 速散熱之功 之穩定,發 2 0 2之使 0 4。另於 E D發光件 述之結構、 情形說明如 圖所示,係 示意圖及L 圖中可清楚 元件2 0 2 同的傳導層 導熱之功效 導接腳2 〇 E D元件2 能會直接傳 4在接收電 的傳導層1 外擴散的方 熱基座1 0 1 2作為擴 向傳熱較差 1 2能將各 傳導層1 2 ’進而達到 效,以保持 揮省電效率 用壽命。 散熱基座1 2之罩體1 組成設計, 下,請同時 為本創作佈 E D發光件 看出,將L 及導接腳2 1 2 ,由於 ,因此,當 4接收由傳 0 2則會被 導至傳導層 能時所產生 2導出,利 式’能提升 係以陶瓷作 散熱能的方 的問題,如 L E D發光 ’並利用陶 對L E D元 L E D元件 ,以及延長 〇上裝設一 4。 茲就本創作 配合參閱第 設傳導層較 之散熱裝態 E D發光件 0 4分別連 傳導層1 2 L E D元件 導層1 2的 激發,此時 1 2 ,而各 的熱,亦同 用能將熱以 散熱速度, 為基材時, 式更能彌補 此一來,藉 件2的熱能 資*直向熱傳 件2 〇 2快 2 〇 2照度 L E D元件 6The guiding pin 2 is provided for the masking of each L. The three-figure diagram of the fourth embodiment and the fourth preferred embodiment are provided by the LED of 2, which is attached to the LED, which is not electrically conductive and is subjected to electrical energy, and is generated by L. When the thermal conduction pin 2 〇 is passed through other horizontal modes to the other, when the diffusion of the conductive layer ceramic itself is spread by the respective conductive layers, the diffusion of the whole surface is good, and the stability of the heat dissipation is stabilized, and the voltage of 0 2 is made. In addition, the structure and situation description of the ED illuminating device are as shown in the figure. The schematic diagram and the L diagram show that the component 2 0 2 has the same conduction layer heat conduction function. The ED component 2 can directly transmit 4 to receive. The electrically conductive layer 1 which is externally diffused by the electrically conductive layer 1 as a diffusion heat transfer is poor, and the conductive layer 1 2 ' can be further effective to maintain the life of the power saving efficiency. The heat sink base 1 2 cover body 1 is composed of the design, the bottom, please also see the ED light piece for the creation cloth, the L and the guide pin 2 1 2 , because, when the 4 reception is transmitted by 0 2 will be Leading to the conduction layer can produce 2 leads, the Lee type can enhance the problem of using ceramics as heat dissipation, such as LED lighting, and use ceramics to LED element LED components, and extend the 〇 on the installation of a 4. For the purpose of this creation, the first conductive layer is connected to the heat-dissipating ED light-emitting member 0 4 and the conductive layer 1 2 LED element conductive layer 12 is respectively excited. At this time, the heat is also used together. When the heat is used as the substrate, the formula can make up for this. The heat energy of the borrowing member is * directly to the heat transfer member 2 〇 2 fast 2 〇 2 illuminance LED component 6

μ上尸;r述惶马本創作 M414546 請參閱第五圖所示’係為本創作 '層另一較佳實施例之示意圖,各傳導 -會依照散熱結構1 a的運用型態,並 層1 2 a的佈設位置及數量,而各l 件2 a的佈設方式及導熱結構均與前 於此不再贅述,惟’傳導層1 2 a的 並不會影響到散熱結果,運用此散熱 大幅提升整體的散熱效果,並改善陶 直向傳熱的問題。 已,非因此即侷限本創作之專利範 運用本創作說明書及圖式内容所為 及等效結構變化’均應同理包含^ 利範圍内,合予陳明。 综上所述,本創作之發光二極 構於使用時,為確實能達到其功效 本創作誠為一實用性優異之創作, 專利之申請要# ’爰依法提出申請 ::賜准本創# ’以保障創作人之 倘惫鈞局審委右# h μ 毋安有任何稽疑,請 不,創作人定去過六& a 1 田竭力配合,實感德 佈設傳導 層1 2 a 改變傳導 E D發光 述相同, 陳列方式 結構確實 瓷本身以 只施例而 ,故舉凡 簡易修飾 創作之專 之散熱結 目的,故 符合新型 盼審委 到作, 函指 7 M414546 立 之 例 施 實 佳 較 作 創 明本 說為 單係 簡 式圖 圖一 t第 意 示 第 圖 圖 三 第 圖 四 第 圖 五 第 之 態 施 意 例 裝 實 示 施 熱 佳 面 實散較 剖 佳之一 之 較件另 例 層光層 施 導發導 實傳D傳 佳設 E 設 較 佈 L 佈。 作 作 作 作圖 本 本圖本圖本示 。為。為意為意為之 圖係圖係示係示係例 【主要元件符號說明】 散熱結構 ......1、1 a 散熱基座 ......10 導熱介面 ......102 傳導層 ......1 2、1 2 a 罩 體 ...1 4 L E D 發 光件... ...2 2 發 孰 源 ...2 0 L E D 元 件 ... ...2 0 2 導 接 腳 ...2 0 4μ上上尸;r述惶马本创作 M414546 Please refer to the schematic diagram of another preferred embodiment of the 'system-based creation' layer shown in the fifth figure, each conduction - according to the application type of the heat dissipation structure 1 a, layer The layout position and quantity of 1 2 a, and the layout and heat conduction structure of each piece 2 a are not repeated here, but the 'conducting layer 1 2 a does not affect the heat dissipation result. Improve the overall heat dissipation and improve the problem of straight heat transfer. Therefore, it is not the case that the patents of this creation are limited to the use of this creation specification and the contents of the drawings and the equivalent structural changes shall be included in the scope of the same. In summary, the creation of the luminous dipole in use, in order to achieve its effectiveness, the creation of this creation is a practical and excellent creation, the application of the patent to # '爰 apply in accordance with the law:: grant the permission to create # 'In order to protect the creators of the squad, the auditor's committee right #h μ 毋安 has any doubts, please no, the creator has been to six & a 1 field to work hard, the real sense of Debuy conductive layer 1 2 a change conduction The ED illuminate is the same. The structure of the display method is really only for the case of porcelain. Therefore, it is suitable for the heat-dissipation of the simple creation. Therefore, it conforms to the new expectation of the commission, and the letter refers to the example of 7 M414546. Chuangming is said to be a simple diagram of a single system. The first picture is shown in the figure. The figure is shown in Figure 3. The figure is shown in Figure 5. The example of the application is shown in the example. The layer of light layer is guided and transmitted, and the transmission of D is set to be better than that of the cloth. Working as a picture This picture shows the picture. for. In order to mean the diagram, the system is shown as a system. [Main component symbol description] Heat dissipation structure... 1, 1 a Heat sink base... 10 Thermal interface... .102 Conductive layer...1 2,1 2 a hood...1 4 LED illuminating parts... 2 2 孰源...2 0 LED elements... 2 0 2 lead pin...2 0 4

Claims (1)

M414546 六、申請專利範圍: '1、一種發光二極體之散熱結構,係包括: - 一散熱基座,該散熱基座係界定有一導熱 介面;及 複數傳導層,各該傳導層係分佈貼設於該 導熱介面,而各該傳導層係設有多個L E D發光件。 2、 如申請專利範圍第1項所述之發光二極體 之散熱結構,其中該L ED發光件所界定 之發熱源係別接觸於不同之該傳導層。 3、 如申請專利範圍第2項所述之發光二極體 之散熱結構,其中該發熱源係為L E D元 件及二連接該L E D發光件之導接腳。 4、 如申請專利範圍第1項所述之發光二極體 之散熱結構,其中該散熱基座係為陶瓷或 鋁其中之一者。 5、 如申請專利範圍第1項所述之發光二極體 之散熱結構,更包括一結合於該散熱基座 上、且供遮罩各該L E D發光件之罩體。 6、 如申請專利範圍第1項所述之發光二極體 之散熱結構,其中各該傳導層係為金、銀、 銅或鎳等相關材料。 9M414546 VI. Patent application scope: '1. A heat dissipation structure of a light-emitting diode includes: - a heat dissipation base defining a heat conduction interface; and a plurality of conductive layers, each of which is distributed The heat conducting interface is disposed on the conductive layer, and each of the conductive layers is provided with a plurality of LED light emitting members. 2. The heat dissipation structure of the light-emitting diode according to claim 1, wherein the heat source defined by the L ED light-emitting member is in contact with a different one of the conductive layers. 3. The heat dissipation structure of the light-emitting diode according to claim 2, wherein the heat source is an L E D element and two lead pins connected to the L E D light-emitting member. 4. The heat dissipation structure of the light-emitting diode according to claim 1, wherein the heat dissipation base is one of ceramic or aluminum. 5. The heat dissipation structure of the light-emitting diode according to claim 1, further comprising a cover body coupled to the heat dissipation base and covering the L E D light-emitting members. 6. The heat dissipation structure of the light-emitting diode according to claim 1, wherein each of the conductive layers is a related material such as gold, silver, copper or nickel. 9
TW99223488U 2010-12-03 2010-12-03 Heat dissipation structure of light emitting diode TWM414546U (en)

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