200923508 九、發明說明： 【發明所屬之技術領域】 本發明係有關發光模組及其成型方式，尤針 晶顯不裝置當中的發光模組結構加以改良，十： 有較佳散熱功效，以及具有較佳光源投射=果 的液B曰顯示裝置及其發光模組結構。 果 【先前技術】 一般液晶顯示裝置（Liquid c LCD)基本上係由如第—_ a sPlay, , , f 圖所不的液晶面板總成10、以 及發光模、组20兩個主要部份所組成；|中，液 總成10及發光模組2〇係被定置在由1框 32所組成的框架3〇$中；液晶面板總成1〇則係』 有一面板11以及光學膜片12或導光板等。 括 至於’發光模組2G則係以複數個舖設在下框 上的發光二極體23做树光元件，使發光二極體 的光線能夠在光學膜片12的光學機制作訂 投射於面板11上。 J的 然而，整體發光模組20之製 四圖所示，先提供一基材伙m女弟—圖及弟 路板)，其基材22上;1有22 路板她^ 而將複數發光二極體23 ’ 光二極體23與該線路 土材22上，且各發 ^ i77 ^ Γ # i77 ^ ^ V成電性連接，再將基材22由 裁切線C裁切成預定形狀大小 材24，ϋ將該金屬板材％ 另卜亚k供一金屬板 板材24配合液晶顯示裝置之框架 200923508 結構體彎折成型，如圖所示係彎折成c型結構，最後 再利用雙面膠25將基材22與金屬板材24相互黏貼固 定，以構成一發光模組2 0。 惟，上述製造方法所形成之發光模組，各發光二 極體所產生之熱源雖然可藉由金屬板材散去，但該發 熱源（發光二極體23)與金屬板材24間非直接接觸， 其間還存在著有基材22以及雙面膠25，其散熱效果 不佳，導致整體液晶顯示裝置的溫度過熱，進而影響 液晶顯示裝置之使用壽命；且基材22與金屬板材24 間之貼附動作一般多係利用人工完成，不僅耗費人 力，且該發光模組體積較小需要較長之加工時間才得 以完成。 【發明内容】 有鑑於此，本發明即針對液晶顯示裝置當中的發 光模組結構加以改良，旨在提供一種具有較佳散熱效 能，以及可成型較佳光源投射效果的液晶顯示裝覃及 其發光模組結構以及成型方式。 為達上揭目的，本發明所揭示的發光模組係包含 有載板以及設於載板上之發光二極體，該載板係設有 一可撓性底層，該底層上方依序設有導熱絕緣層以及 導電層，而該導電層係設有複數線路，該發光二極體 則與線路形成電性連接，其載板係可藉由衝折成型方 式，使載板形成不同形狀。 6 200923508 本發明之功效之一，在於整體液晶顯示裝置可以 透過載板的導熱絕緣層將發光二極體所產生熱源釋放 傳導至框架釋放，因此具有較佳的散熱效能。 本發明之功效之二，在於可以利用軟性的載板配 合液晶顯示裝置的框架等結構體一體衝折成型，可有 效簡化製程。 【實施方式】 本發明之特點，可參閱本案圖式及實施例之詳細 說明而獲得清楚地暸解。 本發明「發光模組、發光模組之成型方式及其應 用」，其中該發光模組40係包括有：載板41及至少一 發光二極體42，如第四圖所示，該載板41係由一可 撓性底層411為基材，而為一軟性的載板結構，並且 在可撓性底層411上依序設有導熱絕緣層412以及導 電層413，各發光二極體42即建構在載板41的導電 層413上，且該載板41係由一體衝折成不同形狀，例 如可形成至少二個幾何面，如第五圖所示之實施例 中，係形成有三個平面A卜A2、A3,且各平面A卜A2、 A3間係設有摺疊線B，使各平面Al、A2、A3非位於同 一平面（係略呈匚型），而各發光二極體42係設於平面 A2上。 於實施時，可撓性底層411係可以由銘、銅、鐵、 不銹鋼等金屬材料所製成的軟性結構體，該可撓性底 7 200923508 層411之厚度係小於ο 2_ ; 以全面或局部鋪蓋於導熱絕 Μ層川係了 ± Ah ίώ A 1 A ' θ 412上，其具有以銅 為主的線路414，並且在線路41 料所構成的絕緣部415，間5又有由、、、&緣材 3先二極體42定置，菸夹-極體42之導線421則配合 版^疋置毛先一 /Ml卢、接績至導電層413的線路 414處’亚與線路414形成带从、圭 電層仍與電源導通。％性連接，使能夠透過導 ，導緣層412以為導熱膠或導熱膠片， 5亥¥—係可為又面#，由導熱絕緣層412構成導電 層413與可撓性底層411相結合；甚至於可以如第六 圖所不’進-步在載板41相對於可撓性底層4ΐι的下 方鋪设-焊料層416,方便整體 相關的結_上。 她，、且直接黏者在 =整體發光模組40之成型方式，可如第七_ 示’其至少包含有下列步驟： 一步驟801、提供—載板4卜請同時參閱第四圖所 π ’該載板41係設有一可撓性底層⑴，該底層⑴ 上方依序設有導熱絕緣層412以及導電層4i3，曰 導電層413係設有複數線路414。 以 步驟802、於該载板41的導電層413上設置至 -發光二極體42，並使該發光二極體4 形成電性連接。 步驟803、進行衝折成型，如第八圖所示，铺 板41上係形成有複數摺疊線B及裁切線c，其中該摺 200923508 豐線(數量為N)與裁切線(數量為M 糊，其令Y係為欲成型幾何面之數1_係，(_ 如圓所示之實施例中，若欲使成列方式， 個平面（亦即卜3) 後之载板形成有3 發光模叙，利裁切後M =之载板41欲成型有3個 ㈣=6條ΤΙ 切線c，並可2一?後間係搭配有-條裁 上J猎由一次衝折加工，同丰 進行切斷，而由各摺二由5亥裁切線C 41形成：個平面A j β進仃料動作，使該载板 … Α2、Α3’而各平面m、A3 係略呈匸型，如第五圖所示。 虽然，亦可視所f衝折成型使該餘Μ :=如第九圖所示’故該載板41上可形成有複數 车刀' _，％同時參閱第十圖所示，以進行衝折成型 時，可同時由該裁切線C進行切斷，並進行f折動，乍， 而使該載板41形成一弧面結體。 #而本梦明之發光模組可應用於液晶顯示裝置中， 如第十-圖所示’本發明之液晶顯示裝置係在一框架 5〇内部建構有—液晶面板總成6G以及-發光模組 4〇，該液晶顯示裝置的框架5()係包括有—上框51及 下框52’而且液晶顯示裝置的光源係相對來自液晶面 板總成60的背面；據以，整體發光模組20即可如圖 所示’直接將載板41衝折成與框架50相對應之外型， 其中该發光模組40係建構於該下框52上，使發光模 200923508 組40配合下框52彎折配置，可形成如圖所示之匚型 結構體，並設於液晶面板總成60側邊，該液晶面板總 成60可包含有一平板型導光板61，或如第十二圖所 示，該載板41係形成弧型結構體，亦或者可如第十三 圖所示，該載板41係形成多邊型結構體，且該液晶面 板總成60可包含有一楔型導光板62，除了可以符合 不同光源方向的設計需求之外，更可以藉此獲致較佳 的光源投射效果。 本發明相較於習有係具有下列優點： 1、 本發明之發光模組成型較為簡便，僅需一次衝 折加工即可形成不同形狀之發光模組，以有效簡化製 程。 2、 可依照不同形狀之結構體，將發光模組配合該 結構體彎折配置，以獲致較佳的光源投射效果。 3、 整體發光模組裝設於液晶顯示裝置之框架上於 實際運作時，係可以透過載板的導熱絕緣層將發光二 極體所產生熱源釋放傳導至可撓性底層，並可由下框 等框架結構體釋放，因此具有較佳的散熱效能。 本發明之技術内容及技術特點巳揭示如上，然而 熟悉本項技術之人士仍可能基於本發明之揭示而作各 種不背離本案發明精神之替換及修飾。因此，本發明 之保護範圍應不限於實施例所揭示者，而應包括各種 不背離本發明之替換及修飾，並為以下之申請專利範 圍所涵蓋。 10 200923508 【圖式簡單說明】 第一圖係為一習用液晶顯示裝置之結構示意圖。 第二圖習有發光模組成型之結構示意圖。 第三圖習有發光模組之結構分解圖。 第四圖本發明第一實施例之發光模組結構示意圖。 第五圖本發明第一實施例之發光模組結構立體圖。 第六圖本發明第二實施例之發光模組結構示意圖。 第七圖本發明發光模組之成型方式流程圖。 第八圖本發明第一實施例之載板未成型結構示意圖。 第九圖本發明第二實施例之發光模組結構立體圖。 第十圖本發明第二實施例之載板未成型結構示意圖。 第十一圖本發明第一實施例之發光模組裝設於液晶顯 示裝置結構示意圖。 第十二圖本發明第二實施例之發光模組裝設於液晶顯 示裝置結構示意圖。 第十三圖本發明第三實施例之發光模組裝設於液晶顯 示裝置結構示意圖。 【主要元件代表符號說明】 液晶面板總成10 面板11 光學膜片12 發光模組20 200923508 基材22 發光二極體23 金屬板材24 雙面膠25 框架30 上框31 下框32 發光模組40 載板41 底層411 導熱絕緣層412 導電層413 線路414 絕緣部415 焊料層416 發光二極體42 導線421 框架50 上框51 下框52 液晶面板總成6 0 平板型導光板61 楔型導光板62 12200923508 IX. Description of the invention: [Technical field of the invention] The invention relates to a light-emitting module and a molding method thereof, and the structure of the light-emitting module in the special needle-shaped display device is improved, ten: having better heat dissipation effect, and having The preferred light source projection = fruit liquid B 曰 display device and its light emitting module structure. [Prior Art] A liquid crystal display device (Liquid c LCD) is basically composed of a liquid crystal panel assembly 10 such as the first--a sPlay, , , f, and two main parts of the light-emitting mode and the group 20. In the composition; |, the liquid assembly 10 and the light-emitting module 2 are fixed in a frame 3 frame composed of a frame 32; the liquid crystal panel assembly 1 is a panel 11 and an optical film 12 or Light guide plate, etc. In the case of the 'light-emitting module 2G, a plurality of light-emitting diodes 23 laid on the lower frame are used as the tree-lighting elements, so that the light of the light-emitting diodes can be projected on the panel 11 by the optical device of the optical film 12. . However, in the four diagrams of the overall illumination module 20, a substrate mate m-picture and brother board is provided first, on the substrate 22; 1 has 22 boards, and the plurality of illuminates The diode 23' photodiode 23 is electrically connected to the line earth material 22, and each of the wires is electrically connected to the substrate, and the substrate 22 is cut into a predetermined shape and material by the cutting line C. 24, the metal sheet% is further provided for a sheet metal plate 24 with the frame of the liquid crystal display device 200923508. The structure is bent and formed, as shown in the figure, which is bent into a c-type structure, and finally the double-sided tape is used. The substrate 22 and the metal plate 24 are adhered to each other to form a light-emitting module 20 . However, in the light-emitting module formed by the above manufacturing method, although the heat source generated by each of the light-emitting diodes can be dissipated by the metal plate, the heat source (light-emitting diode 23) and the metal plate 24 are not in direct contact with each other. There is also a substrate 22 and a double-sided tape 25, which have poor heat dissipation effect, resulting in overheating of the temperature of the entire liquid crystal display device, thereby affecting the service life of the liquid crystal display device; and attaching between the substrate 22 and the metal plate 24 The actions are generally performed manually, which is not only labor-intensive, but also requires a relatively long processing time to complete the light-emitting module. SUMMARY OF THE INVENTION In view of the above, the present invention is directed to improving the structure of a light-emitting module in a liquid crystal display device, and aims to provide a liquid crystal display device having better heat dissipation performance and capable of forming a better light source projection effect and illumination thereof. Module structure and molding method. In order to achieve the above, the light-emitting module disclosed in the present invention comprises a carrier board and a light-emitting diode disposed on the carrier board, wherein the carrier board is provided with a flexible bottom layer, and the bottom layer is sequentially provided with heat conduction. The insulating layer and the conductive layer are provided with a plurality of lines, and the light-emitting diodes are electrically connected to the circuit, and the carrier plate can be formed into a different shape by a punch forming method. 6 200923508 One of the effects of the present invention is that the integral liquid crystal display device can transmit the heat source generated by the light emitting diode to the frame through the thermal conductive insulating layer of the carrier, thereby having better heat dissipation performance. The second effect of the present invention is that the flexible carrier plate can be integrally formed by a structure such as a frame of a liquid crystal display device, and the process can be simplified. [Embodiment] The features of the present invention can be clearly understood by referring to the drawings and the detailed description of the embodiments. The illuminating module 40 includes: a carrier board 41 and at least one illuminating diode 42 as shown in the fourth figure, the carrier board 41 is a flexible carrier layer 411 as a substrate, and is a flexible carrier structure, and a thermally conductive insulating layer 412 and a conductive layer 413 are sequentially disposed on the flexible substrate 411, and each of the LEDs 42 is It is constructed on the conductive layer 413 of the carrier board 41, and the carrier board 41 is integrally folded into different shapes, for example, at least two geometric planes can be formed. In the embodiment shown in the fifth figure, three planes are formed. Ab A2, A3, and each plane A A2, A3 is provided with a folding line B, so that the planes A1, A2, A3 are not in the same plane (slightly 匚 type), and each of the light-emitting diodes 42 Set on plane A2. In the implementation, the flexible bottom layer 411 is a soft structure made of a metal material such as Ming, copper, iron, stainless steel, etc., the thickness of the flexible bottom 7 200923508 layer 411 is less than ο 2 _; Covered on the heat-dissipating layer of the system, ± Ah ώ ώ A 1 A ' θ 412, which has a copper-based line 414, and the insulating portion 415 formed by the line 41 has a & rim material 3 first diode 42 is fixed, the wire 421 of the cigarette holder-pole body 42 is matched with the 疋 先 先 / / Ml Lu, the connection to the conductive layer 413 line 414 'Asia and line 414 formation With the slave, the power layer is still connected to the power supply. The % connection is such that the conductive layer 412 is formed by the thermal conductive insulating layer 412 and the flexible bottom layer 411 is even if the conductive layer or the thermal conductive film is formed by the conductive layer 412; The solder layer 416 can be laid down below the carrier layer 41 relative to the flexible substrate 4 如 as shown in the sixth figure to facilitate the overall associated junction. She, and directly adhered to = the overall light-emitting module 40 molding method, as shown in the seventh _ shows that it at least includes the following steps: a step 801, provide - carrier board 4 please also refer to the fourth figure π The carrier board 41 is provided with a flexible bottom layer (1). The bottom layer (1) is provided with a heat conductive insulating layer 412 and a conductive layer 4i3, and the conductive layer 413 is provided with a plurality of lines 414. In step 802, the light-emitting diode 42 is disposed on the conductive layer 413 of the carrier 41, and the light-emitting diode 4 is electrically connected. Step 803, performing a punch forming, as shown in the eighth figure, the plurality of folding lines B and the cutting line c are formed on the laying plate 41, wherein the folding line 200923508 is a high line (the number is N) and the cutting line (the quantity is M paste, Let Y be the number 1_ system of the geometric surface to be formed. (_ In the embodiment shown by the circle, if the column is to be arranged, the carrier plate after the plane (ie, 3) is formed with 3 illuminating modes. After the cutting, M = the carrier plate 41 is to be formed with 3 (four) = 6 ΤΙ tangential c, and 2 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Cut off, and each fold is formed by the 5H cutting line C 41: the plane A j β enters the dip action, so that the carrier plate Α 2, Α 3 ′ and the planes m and A3 are slightly 匸 type, as in the first The figure is shown in Fig. 5. Although it can be seen from the f-folding to make the embers: = as shown in the ninth figure, the multi-turning tool '_ can be formed on the carrier plate 41, as shown in the tenth figure. When performing the punch forming, the cutting line C can be cut at the same time, and f-folding and twisting can be performed to form the arcuate body of the carrier plate 41. #明明明的发光模块 can be applied. In liquid crystal In the display device, as shown in the tenth-figure, the liquid crystal display device of the present invention is constructed with a liquid crystal panel assembly 6G and a light-emitting module 4A inside a frame 5, and the frame 5 of the liquid crystal display device () The light source of the liquid crystal display device is opposite to the back surface of the liquid crystal panel assembly 60; accordingly, the overall light emitting module 20 can directly rush the carrier plate 41 as shown in the figure. The light-emitting module 40 is constructed on the lower frame 52 so that the light-emitting module 200923508 40 is bent and arranged with the lower frame 52 to form a 匚-shaped structure as shown in the figure. The liquid crystal panel assembly 60 may include a flat-type light guide plate 61, or as shown in the twelfth figure, the carrier plate 41 is formed into an arc-shaped structure, or As shown in FIG. 13 , the carrier board 41 forms a polygonal structure, and the liquid crystal panel assembly 60 can include a wedge-shaped light guide plate 62, which can meet the design requirements of different light source directions. Thereby obtaining a better light source projection effect. Compared with Xiyou, it has the following advantages: 1. The light-emitting module of the invention is simple to form, and only needs one punching process to form different shapes of light-emitting modules, so as to simplify the process effectively. 2. Structure according to different shapes Body, the light-emitting module is flexed with the structure to obtain a better light source projection effect. 3. The overall light-emitting module is assembled on the frame of the liquid crystal display device, and can be transmitted through the heat conduction of the carrier plate during actual operation. The insulating layer releases the heat source generated by the light emitting diode to the flexible bottom layer, and can be released by the frame structure such as the lower frame, thereby having better heat dissipation performance. The technical content and technical features of the present invention are disclosed above, but are familiar with The person skilled in the art may still make various substitutions and modifications without departing from the spirit of the invention. Therefore, the scope of the invention should be construed as not limited by the scope of the invention, and the invention should be 10 200923508 [Simple description of the drawing] The first figure is a schematic structural view of a conventional liquid crystal display device. The second figure has a schematic diagram of the structure of the light-emitting module. The third figure has a structural exploded view of the light-emitting module. FIG. 4 is a schematic structural view of a light emitting module according to a first embodiment of the present invention. Fig. 5 is a perspective view showing the structure of a light-emitting module according to a first embodiment of the present invention. Figure 6 is a schematic view showing the structure of a light-emitting module according to a second embodiment of the present invention. Figure 7 is a flow chart showing the molding method of the light-emitting module of the present invention. Figure 8 is a schematic view showing the unformed structure of the carrier sheet of the first embodiment of the present invention. Figure 9 is a perspective view showing the structure of a light-emitting module according to a second embodiment of the present invention. Figure 11 is a schematic view showing the unformed structure of the carrier of the second embodiment of the present invention. Fig. 11 is a schematic view showing the structure of a liquid crystal display device in which the light-emitting mold according to the first embodiment of the present invention is assembled. Fig. 12 is a schematic view showing the structure of a liquid crystal display device in which the light-emitting module of the second embodiment of the present invention is assembled. Fig. 13 is a schematic view showing the structure of a liquid crystal display device in which the light-emitting module of the third embodiment of the present invention is assembled. [Description of main component symbols] LCD panel assembly 10 Panel 11 Optical diaphragm 12 Light module 20 200923508 Substrate 22 Light-emitting diode 23 Metal sheet 24 Double-sided tape 25 Frame 30 Upper frame 31 Lower frame 32 Light-emitting module 40 Carrier plate 41 bottom layer 411 thermal conductive layer 412 conductive layer 413 line 414 insulating portion 415 solder layer 416 light emitting diode 42 wire 421 frame 50 upper frame 51 lower frame 52 liquid crystal panel assembly 60 0 flat light guide plate 61 wedge type light guide plate 62 12