M263627 八、新型說明： 【新型所屬之技術領域】 本創作係與LED燈源模組有關，特別是關於一種具降 溫效果之LED燈源模組。 【先前技術】 15 發光一極體(Light Emitting Diode，LED)具有照明壽命 長、省電、環保、高反應速度、高色溫及演色性佳等優點， 目月ίι已廣泛應用在各種不同領域，例如顯示看板、交通號 誌、’或是室内照明用的燈源模組，而一般的燈源模組包含 有一面板以及一電路裝置，面板上設有複數個LED，電路 裝置則電性連接於面板，具有供應電源以及控制LED之功 能’使燈源模組可藉以提供照明的工作；而由於LED元件 的較佳工作魏溫度麵是在55。c〜65。d，為了避 免_在運作時會因為溫度過高導致產生亮度降低、波長 改k ’或τζ包覆於LED外周的環氧細旨因膨㈣拉扯接線 位移’進而形成線路之開路失效料缺點，因此，通常都 面板設於—散熱件(細㈣表面，藉由散熱件 傳¥出LED所產生的熱量，用以達到降溫的效果。 然而，當上述燈源模組在進行照明工作時，電路 ^身亦β會產生熱量，而電路裝置所產生的熱量會透過輕 ，’或疋直接傳導到面板以及賴件， ^ =的散触果受鄉響，LED的溫度統崎熱而' = 至較佳工條_，減少發級率，且容易造成失效的情形: -4- M263627 C新型内容】 甘目士本幻作之主要目的乃在於提供一種LED燈源模 、、且、、具有健之降溫縣，可料LED讀 避免led因高溫而失效。 尤>文手 5…為達成_目的，本㈣所提供鱗溫絲之LED燈 源模組，包含有··一面板，具有複數個發光二極體；一散 熱件’具有-頂面及-底面；該面板係設於該散熱件之頂 面，一電路裝置，設於該散熱件之底面；以及一隔熱件， n又於α亥電路裝置與该散熱件之間，用以阻絕該電路裝置所 ίο產生的熱量傳導至該散熱件；藉此，本創作可具有較佳之 降溫效果，提高LED元件的發光效率，避免LED因高溫而 失效，增長使用壽命。 【實施方式】 15 以下，茲配合圖示舉一較佳實施例，對本創作之結構 及功效作詳細說明，其中所用圖示之簡要說明如下： 第一圖係本創作一較佳實施例之立體組合圖； 第二圖係本創作一較佳實施例之正視圖； 第三圖為本創作一較佳實施例之溫度測量示意圖，其 2〇中顯示未放置隔熱件的狀態； 第四圖為本創作一較佳實施例之溫度測量示意圖，其 中顯示放置隔熱件後的狀態； 第五圖係類同於第二圖，為本創作一較佳實施例之另 一實施態樣；以及 -5- M263627 第六圖係類同於第五圖，為本創作一較佳實施例之又 一實施態樣。 請參閱第一及第二圖所示，係為本創作一較佳實施例 具降溫效果之LED燈源模組，包含有一面板(1〇)、一散熱 5件(20)、一電路裝置(30)，以及一隔熱件(4〇);其中： 該面板(10)具有一板狀基部(12)，以及焊設於基部(12) 之複數個發光二極體(Light Emitting Diode，LED)(14);各發 光二極體(14)係呈等間距地分佈於基部(12)。 該散熱件(20)係為鋁擠型製品或可為其它加工型式的 散熱鰭片，具有一頂面(21)、一底面(22)，以及二分別自底 面(22)二側向下延伸出之橫栅式鰭片組(23)(Fin Type);各鰭 片組(23)係用以增加散熱件(2〇)與空氣之接觸面積，提高散 熱效率；面板(10)係設於散熱件(2〇)之頂面(21)，可經由散 熱件(20)將各發光二極體〇4)運作時所產生的熱量傳導至 15空氣中。 該電路裝置⑽具有複數個電子元件(31)，係藉由複數 個固定，(32)設於散熱件(2G)之底面(a)與二_片組⑽之 1使每電子元件(31)朝向該散熱件(2〇)之底面，並且電 20 jf〇)係電性連接於面板⑽，用以供應電源以及控制 各發光二極體(14)之運作。 件(4〇)係以石綿材質、聚苯乙烯或聚氨基甲酸乙 a〇4W/mk ^ 夕 真塞於電路裝置(30)與散埶件(2〇)之底 間，可用跟撕_物㈣組H底導面= -6- M263627 熱件(20)以及面板(10)。 經由上述結構，當電路裝置(3〇)所供應的電源驅使面板 (10)之發光二極體(14)發亮時，各發光二極體(14)所產生的 熱量可藉由散熱件(20)之二鰭片組(23)傳導發散於空氣 5中，使發光二極體(14)之溫度降低，而電路裝置(30)之每一 電子7G件(31)運作時所產生的熱量，則會在骑的過程中受 到隔熱件(40)阻絕而無法往上傳導至散熱件(2〇)，散熱件 即可有效地傳導發光二極體(1句的熱量，而不會受到電路裝 置(30)所產生的熱量影響，導致散熱效果之降低。 1〇 在本創作實施的過程中，如第三及第四圖所示，係為 針對面板(1G)溫度所進行的對照量測狀態圖，主要利用線徑 為〇.25mmT-type的熱電耦以耐烊膠帶貼覆在面板(ι〇)上^ 9個量測點進行溫度場量測；第三财顯示出未放置隔埶件 (4〇)時，各量測點所測量的溫度約為⑼。c〜71。c， 15 為63 C〜64。C，二者相差約3。c〜7。c , =有效地降低面板⑽溫度，使各發光：極师)都 佳工作溫度環境下運作。 取 M263627 路裝熱量對於吨⑽)的影響。 於隔熱件(40，，)之斷面係呈门ί之又一只施態樣，其特點在 散熱細”)之底面，以“ = 全地阻隔電路裝置(3〇，，)所吝斗μ )之間，藉以更為元 藉此，本創作即可利導至散熱件(20，，）。 有較祛之窿、、w处里J ^用隔熱件的設計，使LED面板具 因古、、西而生=，、LED元件的發光效率，避免LED 因冋/皿而失效，使用壽命增長。 創作之隔熱件材質亦可利用其他材質取代， 住整;電i::木而隔熱件的尺寸亦不限定於必須覆蓋 住，體電路裝置，亦可只覆蓋於電路裝置中會發執的電子 元件1例ΐ變壓11或是電感等元件，藉以阻隔該等會發熱 的兀件或谷易發熱之區域做阻絕熱#的1作’·散献件之鰭 15 片組亦可改以針式(Pin Type)或X型等其他形狀，同樣可達 到本創作之目的’ * led燈源模組的擺放方式並不受限於 朝向上方。 ' 紅上所述，本創作係將面板與電路裝置間設置隔熱 件’也可將電路裝置反置，而可達顺LED面板具有較佳 之降溫效果，且提高LED元件的發光效率，避免led因高 溫而失效，增長使用壽命。 20 M263627 f圖式簡單說明】 f 一圖係本創作—難實關之賴組合圖； 第二圖係本創作一較佳實施例之正視圖； 第二圖為本創作一較佳實施例之溫度測量示意圖，其 中暴員示未放置隔熱件的狀態； 第四圖為本創作一較佳實施例之溫度測量示意圖，其 中黑員示放置隔熱件後的狀態； 第五圖係類同於第二圖，為本創作一較佳實施例之另 〜實施態樣；以及 第六圖係類同於第五圖，為本創作一較佳實施例之又 〜實施態樣。 【主要元件符號說明】 10面板 12基部 Η發光二極體 20散熱件 21頂面 22底面 23鰭片組 30電路裝置 31電子元件 32固定柱 40隔熱件 -9-M263627 8. Description of the new type: [Technical field to which the new type belongs] This creation is related to the LED light source module, especially an LED light source module with a cooling effect. [Previous technology] 15 Light Emitting Diode (LED) has the advantages of long lighting life, power saving, environmental protection, high response speed, high color temperature and good color rendering. It has been widely used in various fields. For example, display boards, traffic signs, or light source modules for indoor lighting. The general light source module includes a panel and a circuit device. The panel is provided with a plurality of LEDs, and the circuit device is electrically connected to The panel has the functions of supplying power and controlling LEDs, so that the light source module can provide lighting work; and because the preferred operating temperature of the LED element is 55. c ~ 65. d. In order to avoid the shortcomings of the open circuit failure material caused by the decrease in brightness due to excessive temperature during operation, the wavelength change k 'or τζ coating on the outer periphery of the LED due to expansion and pulling the wiring displacement, Therefore, the panel is usually provided on a heat sink (a thin surface, and the heat generated by the LED is transmitted by the heat sink to achieve a cooling effect. However, when the above light source module is performing lighting work, the circuit ^ The body also generates heat, and the heat generated by the circuit device will be directly transmitted to the panel and the parts through light, ^ = the scattered fruit is affected by the village, the temperature of the LED is hot and the temperature is equal to = Better conditions _, reduce the rate of grade, and easily cause failure: -4- M263627 C new content] The main purpose of Ganmu Shifang's fantasy is to provide an LED light source mode, and In the cooling temperature county, the LED reading can be expected to avoid the failure of the LED due to high temperature. Especially > Manuscript 5 ... In order to achieve the _ goal, the LED lamp source module of the scale warm wire provided by this company, including a panel, has a plurality of Light-emitting diodes; a heat sink 'having- The top surface and the bottom surface; the panel is provided on the top surface of the heat sink, a circuit device is provided on the bottom surface of the heat sink; and a heat insulation member, n is in turn between the alpha-hai circuit device and the heat sink, It is used to prevent the heat generated by the circuit device from being conducted to the heat sink; thereby, this creation can have a better cooling effect, improve the luminous efficiency of the LED element, avoid the failure of the LED due to high temperature, and increase the service life. [15] The following is a detailed description of the structure and effects of this creation in conjunction with the illustration. A brief description of the illustrations used is as follows: The first figure is a three-dimensional combination diagram of a preferred embodiment of this creation; The second picture is a front view of a preferred embodiment of the present invention; the third picture is a schematic diagram of the temperature measurement of a preferred embodiment of the present invention, and the state where no heat insulation member is placed is shown in 20; the fourth picture is the present invention A temperature measurement schematic diagram of a preferred embodiment, which shows the state after the heat insulator is placed; the fifth diagram is similar to the second diagram, and is another implementation aspect of creating a preferred embodiment; and -5- M263627 The sixth picture is similar to the fifth picture, and is another implementation form of a preferred embodiment of the present invention. Please refer to the first and second figures, which show a cooling effect of the preferred embodiment of the present invention. The LED light source module includes a panel (10), a heat sink (20), a circuit device (30), and a heat insulation member (40); wherein: the panel (10) has a plate shape The base (12) and a plurality of light emitting diodes (LEDs) (14) welded to the base (12); each light emitting diode (14) is distributed at an equal interval on the base (12) The heat sink (20) is an extruded aluminum product or other processing type heat sink fins, and has a top surface (21), a bottom surface (22), and two downwards from the bottom surface (22) and two sides respectively. Extending horizontal grid fin groups (23) (Fin Type); each fin group (23) is used to increase the contact area of the heat sink (20) with the air to improve heat dissipation efficiency; the panel (10) is designed On the top surface (21) of the heat sink (20), the heat generated during the operation of each light emitting diode (04) can be conducted to 15 air through the heat sink (20). The circuit device (1) has a plurality of electronic components (31), which are fixed by a plurality of (32) provided on the bottom surface (a) of the heat sink (2G) and one of the two-piece group (1) so that each electronic component (31) The bottom surface of the heat sink (20) is electrically connected to the panel ⑽ for supplying power and controlling the operation of each light emitting diode (14). The piece (40) is made of asbestos material, polystyrene, or polyurethane a04W / mk ^ It is inserted between the circuit device (30) and the loose piece (20), and can be used to tear Group B bottom guide surface = -6- M263627 hot parts (20) and panel (10). Through the above structure, when the light emitting diode (14) of the panel (10) is driven by the power supplied by the circuit device (30), the heat generated by each light emitting diode (14) can be transmitted through the heat sink ( 20) The second fin group (23) conducts and dissipates in the air 5 to reduce the temperature of the light emitting diode (14), and the heat generated when each electronic 7G piece (31) of the circuit device (30) operates , It will be blocked by the heat insulator (40) during the riding process and cannot be conducted upward to the heat sink (20). The heat sink can effectively conduct the heat of the light emitting diode (1 sentence without being affected by the heat) The thermal effect generated by the circuit device (30) results in a reduction in the heat dissipation effect. 10 In the process of this creative implementation, as shown in the third and fourth figures, it is a comparison of the temperature of the panel (1G). The measurement state diagram mainly uses a thermocouple with a wire diameter of 0.25mmT-type to cover the panel (ι〇) with anti-tape tape ^ 9 measurement points for temperature field measurement; the third asset shows that no spacers are placed For the file (40), the temperature measured by each measuring point is about ⑼.c ~ 71.c, 15 is 63 C ~ 64.C, the difference between the two is about 3.c ~ 7.c, = Effectively reduce the temperature of the panel ，, so that each luminous: polarizer) operating under the optimal operating temperature environment. Take the effect of M263627 road heat installed on tonnage). On the bottom surface of the heat insulator (40 ,,), there is another appearance of the door, which is characterized by the fine heat dissipation "), with" = all-ground blocking circuit device (3〇 ,,) " Dou), so that this creation can be guided to the heat sink (20 ,,). The design of the heat-insulating element is used to make the LED panel have ancient and western appearance, and the luminous efficiency of the LED element can avoid the failure of the LED due to the dysfunction. increase. The material of the insulation material for the creation can also be replaced by other materials, and the entire insulation is not limited to the size of the insulation material, which must be covered. The body circuit device can also be covered only in the circuit device. 1 electronic component, such as transformer 11 or inductor, so as to block these heat-generating components or areas that are easy to generate heat to do heat insulation # 1 work '· 15 pieces of fins for loose parts can also be changed With other shapes such as pin type or X type, the purpose of this creation can also be achieved. * The placement of the led light source module is not limited to facing upward. 'As mentioned above, this creation is to install a heat insulator between the panel and the circuit device.' The circuit device can also be placed upside down, and the Goshun LED panel has a better cooling effect, and improves the luminous efficiency of the LED elements, avoiding leds. Failure due to high temperature, increasing service life. 20 M263627 f Schematic illustration] f A picture is a combination diagram of this creation—difficult to practice; the second picture is a front view of a preferred embodiment of the creation; the second picture is a preferred embodiment of the creation Schematic diagram of temperature measurement, where the violent person shows the state where no heat insulator is placed; the fourth diagram is a schematic diagram of the temperature measurement of a preferred embodiment of the creation, where the black member shows the state after placing the heat insulator; the fifth picture is similar In the second figure, another embodiment of a preferred embodiment of the present invention is shown in the same way; and the sixth diagram is similar to the fifth embodiment in the second embodiment of the present invention. [Description of main component symbols] 10 panel 12 base Η light emitting diode 20 heat sink 21 top surface 22 bottom surface 23 fin group 30 circuit device 31 electronic component 32 fixing post 40 heat insulation member -9-