M416107 五、新型說明： 【新型所屬之技術領域】 [0001] 本創作係與LED散熱基板有關，特別有關於一種用於結合 背光模組之LED散熱基板結構。 【先前技術】 [0002] 發光二極體（LED)元件由於電量少、體積小及使用壽命 長，目前已廣泛地使用於各種照明燈具上，如家電用品 之指示燈、顯示器之背光源、廣告顯示幕及汽車車燈等 應用。另一方面，隨著高功率LED的發展及所伴隨的散熱 問題，現今的LED基板大多為散熱基板，以達到使用上的 散熱需求。 [0003] 傳統上，LED作為顯示器背光源時，其係將多個LED元件 組裝在一散熱基板上而形成一LED光源模組，此光源模組 再組合一背光模組，藉以完成該顯示器背光源。 [0004] 惟，習知的顯示器背光源組設時，需先將該LED光源模組 結合在一承載板，接著再將該背光模組組設在該承載板 上，以接收並反射該LED光源模組所發出的光。由於此組 設方式不但繁瑣耗時，且需另備承載板，故導致工時、 人力、及材料等成本上的增加。 [0005] 有鑑於此，本創作人為改善並解決上述之缺失，乃特潛 心研究並配合學理之運用，終於提出一種設計合理且有 效改善上述缺失之本創作。 【新型内容】M416107 V. New Description: [New Technology Field] [0001] This creation is related to LED heat sink substrate, especially for LED heat sink substrate structure used in combination with backlight module. [Prior Art] [0002] Light-emitting diode (LED) components have been widely used in various lighting fixtures due to their low power, small size and long service life, such as indicator lights for home appliances, backlights for displays, Advertising display screens and car lights and other applications. On the other hand, with the development of high-power LEDs and the accompanying heat dissipation problems, most of today's LED substrates are heat-dissipating substrates to meet the heat dissipation requirements of use. [0003] Traditionally, when LED is used as a backlight of a display, a plurality of LED components are assembled on a heat dissipation substrate to form an LED light source module, and the light source module is combined with a backlight module to complete the backlight of the display. source. [0004] However, when a conventional display backlight is assembled, the LED light source module is first coupled to a carrier board, and then the backlight module is assembled on the carrier board to receive and reflect the LED. The light emitted by the light source module. Since this assembly method is not only cumbersome and time consuming, but also requires a separate carrier board, the cost of working hours, manpower, and materials is increased. [0005] In view of this, in order to improve and solve the above-mentioned shortcomings, the present creator has devoted himself to research and cooperates with the application of the theory, and finally proposes a creation that is reasonable in design and effective in improving the above-mentioned defects. [New content]
[0006] 本創作之一目的，在於提供一種用於結合背光模組之LED 表單编號A0101 第3頁/共17頁 [0007] 散熱基板，以簡化LED散熱基板與LED光源模組及背光模 的組設方式，達到降低工時、人力及材料成本之功效》 為了達成上述之目的，本創作係為一種用於結合背光模 組之LED散熱基板’以結合LED光源模組及背光模組， LED散熱基板包括一金屬基層 '一絕緣層、及一線路層， 金屬基層包含用以承載LED光源模組的第一區塊及用以承 載背光模組的第二區塊，絕緣層塗佈在第一區塊上，線 路層壓合在絕緣層表面，線路層係電性連接Led光源模組 〇 [0008] 相較於習知技術，本創作之LED散熱基板結合LED光源模 組及者光模組時，由於LED散熱基板的金屬基層包含承載 LED光源模組的第一區塊及承載背光模組的第二區塊，故 可省卻習知技術所需設置的承載板元件；再者，本創作 之LED散熱基板係直接用以結合led光源模組及背光模組 ，相較於習知技術須將LED光源模組和背光模組分別組設 在承載板的組設方式，本創作之LED散熱基板可簡化LED 散熱基板結合LED光源模組及背光模組的組設，達到降低 工時、人力及材料成本之功效。 【實施方式】 [0009] 有關本創作之詳細說明及技術内容，配合圖式說明如下 ，然而所附圊式僅提供參考與說明用，並非用來對本創 作加以限制者。 請參照第一圖及第二圖，係分別為本創作之LED散熱基板 與LED光源模組結合的立體外觀示意圖及其結合背光模組 表單編號A0101 第4頁/共17頁 [0010] M4.16107 的側視圖；本創作之LED散熱基板1係用以結合一LED光源 模組2及一背光模組3，該LED散熱基板1包括一金屬基層 10、一絕緣層20、及一線路層30。該LED光源模組2係包 含多數個LED2a，該些LED2a係分別銲接在該線路層3〇上 。該背光模組3則是設置在該LED光源模組2的一側邊，用 以接收並反射該LED光源模組2所發出的光；於本實施例 中’該散熱基板1係加以彎折，以令該LED光源模組2及該 背光模組3呈垂直設置。 • [0011]請續參照第三圖至第五圖，係分別為本創作之LED散熱基 板的立體外觀示意圖、剖視圖及切割示意圖；本實施例 中，散熱基板la係包含有複數片散熱基板丨，各該散熱基 板1包括一金屬基層10、一絕緣層2〇、及一線路層3〇。 [0012] 該金屬基層1〇係為一金屬基板，該金屬基層1〇可為一鋁 基板（鋁合金基板）或一銅基板，且該金屬基層1〇包含用 以承載該LED光源模組2的—第一區塊^及用以承載該背 光模組3的一第二區塊12。此外，由於該背光模組3的體 ® 積大於該LED光源模組2的體積，故該第二區塊12的面積 係大於該第一區塊11的面積。 [0013] 該絕緣層20係由導熱絕緣材料所構成，其係塗佈在該第 一區塊11上。再者’該線路層3〇係壓合在該絕緣層2〇表 面，該線路層30係用以安置該LED光源模組。該線路層3〇 為一銅箔層，該銅箔層係蝕刻製作有電路，以電性連接 該LED光源模組2 » [〇〇14]於本實施例中，散熱基板la的金屬基層l〇a係包含有複數 表單編號A0101 第5頁/共17頁 M416107 第一區塊11及複數第二區塊12，且該些第一區塊11及該 些第二區塊12係為交錯設置。對該LED散熱基板la進行切 割作業後，該第一區塊11及該第二區塊12之間會留有一 間隙100，以將該LED散熱基板la分割成數片LED散熱基 板1。 [0015] 請另參照第六圖及第七圖，係分別為本創作之LED散熱基 板另一實施例的立體外觀示意圖及剖視圖；本實施例中 ，散熱基板la’係包含有複數片散熱基板1’ ，各該散熱 基板1包括一金屬基層10、一絕緣層20、及一線路層30。 另外，LED光源模組2包含多數個LED2a，該些LED2a係分 別銲接在該線路層30上。同樣地，散熱基板la’之金屬 基層10a’係包含有複數第一區塊11及複數第二區塊12, 對該LED散熱基板la’進行切割作業後，會將該LED散熱 基板la’分割成數片LED散熱基板Γ 。 [0016] 本實施例與第一實施例不同之處在於該線路層30係形成 在該絕緣層20及該金屬基層10的第二區塊12上，亦即， 該線路層30係全面性地壓合在該金屬基層10上。 [0017] 以上所述僅為本創作之較佳實施例，非用以限定本創作 之專利範圍，其他運用本創作之專利精神之等效變化， 均應俱屬本創作之專利範圍。 【圖式簡單說明】 [0018] 第一圖係本創作之LED散熱基板與LED光源模組結合的立 體外觀示意圖； [0019] 第二圖係本創作之LED散熱基板結合背光模組的側視圖； 表單编號A0101 第6頁/共17頁 M4.16107 [0020] 第三圖係本創作之LED散熱基板的立體外觀示意圖； [0021] 第四圖係本創作之LED散熱基板的剖視圖； [0022] 第五圖係本創作之LED散熱基板的切割示意圖； [0023] 第六圖係本創作之LED散熱基板另一實施例的立體外觀示 意圖； [0024] 第七圖係本創作之LED散熱基板另一實施例的剖視圖。 【主要元件符號說明】 [0025] 1、Γ LED散熱基板 [0026] 2 LED光源模組 [0027] 2aLED [0028] 3背光模組 [0029] 10金屬基層 [0030] 100間隙 [0031] 11第一區塊 [0032] 12第二區塊 [0033] 20絕緣層 [0034] 30線路層 [0035] 1 a散熱基板 [0036] 1 0a金屬基層 [0037] la’散熱基板 表單編號A0101[0006] One of the purposes of the present invention is to provide an LED substrate number A0101 for combining a backlight module, page 3 of 17 [0007], a heat dissipation substrate, to simplify the LED heat dissipation substrate, the LED light source module, and the backlight module. In order to achieve the above objectives, the present invention is an LED heat dissipation substrate for combining a backlight module to combine an LED light source module and a backlight module. The LED heat dissipation substrate comprises a metal base layer 'an insulating layer and a circuit layer. The metal base layer comprises a first block for carrying the LED light source module and a second block for carrying the backlight module, and the insulating layer is coated on the In the first block, the line is laminated on the surface of the insulating layer, and the circuit layer is electrically connected to the Led light source module. [0008] Compared with the prior art, the LED heat dissipation substrate of the present invention is combined with the LED light source module and the light. In the module, since the metal base layer of the LED heat dissipation substrate comprises the first block carrying the LED light source module and the second block carrying the backlight module, the carrier board components required by the conventional technology can be omitted; L of this creation The ED heat dissipation substrate is directly used for combining the LED light source module and the backlight module, and the LED light source module and the backlight module are respectively set in the assembly mode of the carrier board compared with the prior art, and the LED heat dissipation substrate of the present invention is created. The LED heat dissipation substrate can be simplified in combination with the LED light source module and the backlight module to reduce the labor, manpower and material cost. [Embodiment] [0009] The detailed description and technical contents of the present invention are described below with reference to the drawings, but the accompanying drawings are only for reference and explanation, and are not intended to limit the present invention. Please refer to the first figure and the second figure, which are respectively a schematic diagram of the stereoscopic appearance of the LED heat-dissipating substrate and the LED light source module, and the combination of the backlight module form number A0101, page 4 / 17 pages [0010] M4. A side view of the 16107; the LED heat dissipation substrate 1 of the present invention is used to combine an LED light source module 2 and a backlight module 3, the LED heat dissipation substrate 1 includes a metal base layer 10, an insulation layer 20, and a circuit layer 30. . The LED light source module 2 includes a plurality of LEDs 2a, which are respectively soldered on the circuit layer 3A. The backlight module 3 is disposed on one side of the LED light source module 2 for receiving and reflecting the light emitted by the LED light source module 2; in the embodiment, the heat dissipation substrate 1 is bent The LED light source module 2 and the backlight module 3 are arranged vertically. [0011] Please continue to refer to the third to fifth figures, which are respectively a schematic perspective view, a cross-sectional view and a cutting schematic view of the LED heat dissipation substrate of the present invention. In this embodiment, the heat dissipation substrate la includes a plurality of heat dissipation substrates. Each of the heat dissipation substrates 1 includes a metal base layer 10, an insulation layer 2, and a circuit layer 3A. [0012] The metal substrate 1 is a metal substrate, and the metal substrate 1 can be an aluminum substrate (aluminum alloy substrate) or a copper substrate, and the metal substrate 1 includes a LED light source module 2 a first block ^ and a second block 12 for carrying the backlight module 3. In addition, since the volume of the backlight module 3 is larger than the volume of the LED light source module 2, the area of the second block 12 is larger than the area of the first block 11. [0013] The insulating layer 20 is composed of a thermally conductive insulating material which is coated on the first block 11. Furthermore, the circuit layer 3 is laminated on the surface of the insulating layer 2, and the circuit layer 30 is used to house the LED light source module. The circuit layer 3 is a copper foil layer, and the copper foil layer is etched to form a circuit for electrically connecting the LED light source module 2 » [〇〇14] in the embodiment, the metal base layer of the heat dissipation substrate 1a The 〇a system includes a plurality of form numbers A0101, a fifth page, a total of 17 pages, M416107, a first block 11 and a plurality of second blocks 12, and the first blocks 11 and the second blocks 12 are interlaced. . After the LED heat dissipation substrate 1a is cut, a gap 100 is left between the first block 11 and the second block 12 to divide the LED heat dissipation substrate 1a into a plurality of LED heat dissipation substrates 1. [0015] Please refer to FIG. 6 and FIG. 7 respectively, which are schematic perspective views and cross-sectional views of another embodiment of the LED heat dissipation substrate of the present invention. In this embodiment, the heat dissipation substrate la' includes a plurality of heat dissipation substrates. 1', each of the heat dissipation substrates 1 includes a metal base layer 10, an insulation layer 20, and a circuit layer 30. In addition, the LED light source module 2 includes a plurality of LEDs 2a which are soldered to the wiring layer 30, respectively. Similarly, the metal base layer 10a' of the heat dissipation substrate la' includes a plurality of first blocks 11 and a plurality of second blocks 12. After the LED heat dissipation substrate la' is cut, the LED heat dissipation substrate la' is divided. A number of LED heat sink substrates Γ. [0016] This embodiment is different from the first embodiment in that the circuit layer 30 is formed on the insulating layer 20 and the second block 12 of the metal base layer 10, that is, the circuit layer 30 is comprehensively Pressed on the metal base layer 10. The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the patent of the present invention, and other equivalent variations of the patent spirit of the present invention are all within the scope of the patent. [0018] The first figure is a three-dimensional appearance diagram of the LED heat dissipation substrate and the LED light source module of the present invention; [0019] The second figure is a side view of the LED heat dissipation substrate combined with the backlight module of the present invention Form No. A0101 Page 6 of 17 M4.16107 [0020] The third figure is a schematic perspective view of the LED heat sink substrate of the present invention; [0021] The fourth figure is a cross-sectional view of the LED heat sink substrate of the present invention; The fifth figure is a schematic diagram of the cutting of the LED heat dissipation substrate of the present invention; [0023] The sixth figure is a schematic perspective view of another embodiment of the LED heat dissipation substrate of the present invention; [0024] The seventh figure is the LED heat dissipation of the present invention A cross-sectional view of another embodiment of the substrate. [Main component symbol description] [0025] 1. Γ LED heat dissipation substrate [0026] 2 LED light source module [0027] 2aLED [0028] 3 backlight module [0029] 10 metal base layer [0030] 100 gap [0031] 11 One block [0032] 12 second block [0033] 20 insulating layer [0034] 30 circuit layer [0035] 1 a heat sink substrate [0036] 10a metal base layer [0037] la' heat sink substrate form number A0101
第7頁/共17頁 M416107 [0038] 10a’金屬基層 表單編號A0101 第8頁/共17頁Page 7 of 17 M416107 [0038] 10a' Metal Base Form No. A0101 Page 8 of 17