201233501 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種玻璃基板之端面之研磨方法及研磨裝 【先前技術】 平板玻璃或液晶面板等玻璃基板藉由研磨裝置對四周之 端面進行研磨及倒角（以下，將研磨及倒角統稱為研磨加 工）。於該研磨加工中，將旋轉之磨石抵壓於作為研磨對 象之玻璃基板之端面’移動磨石或玻璃基板而對玻璃基板 周邊之端面進行研磨加工。又，研磨加工過程中，為了冷 卻而自喷嘴向加工部供給冷卻劑（c〇〇lant)(例如，參照專利 文獻1)。 先前技術文獻 專利文獻 專利文獻1:日本專利特開2007-30051號公報 【發明内容】 發明所欲解決之問題 近年來，玻璃基板之厚度變得越來越薄，故而變成玻璃 " 反之端面谷易晃動而不穩定因此易於產生玻璃基板之端 , 面之不良狀況（例如碎裂（微小裂痕）、缺口、研磨灼痕或斷 裂）之狀況。該傾向於為h2 mm以下厚度之玻璃基板之情 ;夺尤其顯著。然而’於先前之研磨方法中，並未對適於 如此厚度之薄玻璃基板之研磨加工之研磨條件（例如，供 σ冷郃劑之位置及入射角度)進行規定，因此難以防止上 •59909.doc 201233501 述研磨加工時之玻璃基板之端面之不良狀況的產生β 本發明係應對上述情況而完成者，其目的在於提供一種 即便於作為研磨對象物之玻璃基板較薄之情形時，亦可抑 制玻璃基板之端面之不良狀況產生，從而穩定地對玻璃基 板之端面進行研磨的研磨方法及研磨裝置。 解決問題之技術手段 本發明之研磨方法係使用包含對玻璃基板之端面進行研 磨加工之磨石、及供給使上述玻璃基板之研磨加工部冷卻 之冷卻劑之喷嘴的研磨裝置者；且包括如下步驟：使直徑 d之磨石旋轉驅動，而對厚度為12 mm以下之上述玻璃基 板之端面進行研磨加工；及於上述研磨加工過程中，於上 述玻璃基板之兩側，相對於上述玻璃基板之各主表面以 θι、Θ2之入射角度，且朝向上述玻璃基板向上述磨石前進 之前進方向，向與上述磨石之研磨位置相距距離乂之位置 供給冷卻劑；上述θ〗、Θ2、x/d之值分別為15〜6〇。、 15〜60°、0.04-0.05之範圍内。 於本發明之研磨方法中，較佳為上述喷嘴之供給口之内 徑八自上述喷嘴之供給口分別供給之上述冷卻劑之流量 R、及上述玻璃基板之研磨加工速度v與上述磨石之周速 度v之比V/v分別為2.5〜3.2 mm、1〇〜2〇 L/分、〇 〇〇i2〜〇 〇ι 之範圍内。 於本發明之研磨方法中，較佳兔4二a l t ^ 11主馬進而包括根據上述磨石 之磨損量’以使上述x/d之值蠻兔Λ ^ 1且父马0.04〜〇,〇5之範圍内之方 式調整供給上述冷卻劑之位置之步驟。201233501 VI. Description of the Invention: [Technical Field] The present invention relates to a method for polishing an end surface of a glass substrate and a polishing apparatus. [Prior Art] A glass substrate such as a flat glass or a liquid crystal panel is ground by a polishing device for the peripheral end faces. And chamfering (hereinafter, grinding and chamfering are collectively referred to as grinding). In this polishing process, the rotating grindstone is pressed against the end surface of the glass substrate as the polishing object to move the grindstone or the glass substrate, and the end surface of the periphery of the glass substrate is polished. Further, during the polishing process, a coolant is supplied from the nozzle to the processing portion for cooling (for example, see Patent Document 1). PRIOR ART DOCUMENT PATENT DOCUMENT Patent Document 1: Japanese Patent Laid-Open Publication No. 2007-30051 SUMMARY OF THE INVENTION Problems to be Solved by the Invention In recent years, the thickness of a glass substrate has become thinner and thinner, and thus has become a glass " It is easy to shake and unstable, so it is easy to produce the condition of the end of the glass substrate, such as chipping (small cracks), notches, grinding marks or breaks. This tends to be a glass substrate having a thickness of less than h2 mm; However, in the previous grinding method, the grinding conditions suitable for the grinding process of a thin glass substrate having such a thickness (for example, the position and incident angle of the σ cold buffering agent) are not specified, so it is difficult to prevent the upper 59909. Doc 201233501 The occurrence of a defect in the end surface of the glass substrate during the polishing process. The present invention has been made in view of the above circumstances, and it is an object of the invention to provide a method for suppressing the case where the glass substrate to be polished is thin. A polishing method and a polishing apparatus for stably preventing the end surface of the glass substrate from being generated by the end surface of the glass substrate. Means for Solving the Problems The polishing method of the present invention uses a polishing apparatus including a grindstone for polishing an end surface of a glass substrate and a nozzle for supplying a coolant for cooling the polished portion of the glass substrate; and includes the following steps : grinding the end face of the glass substrate having a thickness of 12 mm or less, and grinding the end surface of the glass substrate having a thickness of 12 mm or less; and in the polishing process, on both sides of the glass substrate, with respect to each of the glass substrates The main surface is supplied with a coolant at an incident angle of θι and Θ2, and is advanced toward the glass substrate in a forward direction toward the grinding stone, and is supplied to the position at a distance 乂 from the polishing position of the grindstone; the above θ, Θ2, x/d The values are 15~6〇. , in the range of 15~60°, 0.04-0.05. In the polishing method of the present invention, preferably, the inner diameter of the supply port of the nozzle is supplied from the supply port of the nozzle to the flow rate R of the coolant, and the polishing speed v of the glass substrate and the grindstone. The ratio of the peripheral speed v is V/v in the range of 2.5 to 3.2 mm, 1 〇 to 2 〇 L/min, and 〇〇〇i2 to 〇〇ι, respectively. In the grinding method of the present invention, it is preferred that the rabbit 4 alt ^ 11 main horse further includes a wear amount according to the above-mentioned grindstone so that the value of the above x/d is quite Λ ^ 1 and the parent horse is 0.04 〇 〇, 〇 5 The step of supplying the above-described coolant is adjusted in a manner within the range.
S 159909.doc 201233501 於本發明之研磨方法中，較佳為進而包括根據上述磨石 之磨損量’以使上述V/v變為0.0012〜〇〇1之範圍内之方式 進行調整之步驟。 本發明之研磨裝置係對玻璃基板之端面進行研磨加工 者且包括.直徑d之磨石，其受到旋轉驅動而對厚度為 1.2 mm以下之玻璃基板之端面進行研磨加工；及第丨、第2 喷嘴，其配置在上述玻璃基板之兩側，相對於上述玻璃基 板之各主表面以θι、Θ2之入射角度，且朝向上述玻璃基板 向上述磨石前進之前進方向，向與上述磨石之研磨位置相 距距離X之位置供給冷卻劑；上述θι、h、x/d之值各自為 15〜60°、15〜60。、0.04〜〇·〇5之範圍内。 發明之效果 根據本發明，可提供一種如下所述之研磨方法及研磨裝 置：於研磨加工過程中，於玻璃基板之兩側，相對於玻璃 基板之各主表面分別以15〜6〇。之入射角度，且朝向玻璃基 板向磨石前進之前進方向，向與磨石之研磨位置相距磨石 之直徑之0.04(4%)〜〇.05(5%)之範圍内的位置供給冷卻劑， 故而即便於作為研磨對象物之玻璃基板較薄之情形時，亦 可抑制玻璃基板之端面之不良狀況產生，從而穩定地對玻 璃基板之端面進行研磨。 【實施方式】 (實施形態） 以下，一面參照圖式一面對本實施形態詳細地進行說 明。 159909.doc 201233501 (研磨裝置1) 圖1係實施形態之研磨裝置丨之構成圖，圖1(a)為侧視 圖，圖1(b)為俯視圖。圖2係研磨機構1〇〇及冷卻劑供給機 構200之詳細構成圖，圖2(>)為俯視圖，圖2(b)為側視圖。 圖3係磨石1〇1之放大側視圖。圖4係研磨機構1〇〇所具備之 框體104之立體圖。圖5係框體1〇4之側視圖。圖6係端面清 洗機構500之側視圖。 於圖2中，為了可容易地視認框體j 〇4内部之構成，而以 鏈線表示框體104。又，於圖5中，以鏈線表示磨石1〇1。 以下，參照圖1〜圖6，對研磨裝置！之各構成進行說明。另 外’於圖1〜圖5中，省略了研磨機構ι〇〇及控制器6〇〇之支 柱之圖示。 如圖1(a)及圖1(b)所示，研磨裝置丨包括：研磨機構 1〇〇，其對主要面向FPD(Flat Panel Display，平板顯示器） 4電子機器之玻璃基板（以下，稱為工件w)之端面進行研 磨及倒角；冷卻劑供給機構200，其向研磨機構1〇〇所具備 之磨石101之研磨部附近供給冷卻劑（co〇lant);搬送機構 3〇〇 ’其保持工件W，並使工件W之端面沿研磨機構} 00移 動；抽吸機構400，其經由導管L與研磨機構1〇〇連接，並 吸入研磨機構1 〇〇中已使用之冷卻劑；端面清洗機構5〇〇， 其清洗已由研磨機構1 〇〇研磨及倒角之工件W之端面；以 及控制器600，其對研磨裝置1整體進行控制。 若工件W之厚度較薄（尤其是1.2 mm以下），則易於產生 工件W之端面之不良狀況（例如碎裂（微小裂痕）、缺口、研 159909.doc 201233501 磨灼痕或斷裂），故而於本實施形態中，設定對厚度為1.2 mm以下之工件w進行處理。又，於以下之說明中，將研 磨及倒角統稱為研磨加工。 (研磨機構100) -如圖2(a)及圖2(b)所示，研磨機構10〇包括：磨石1(Π， .其對工件w之端面進行研磨加工；馬達1〇2，其旋轉驅動 該磨石101 ;整流板103 ’其對自冷卻劑供給機構2〇〇向磨 石101供給後之已使用過之冷卻劑進行整流’並將已使用 過之冷卻劑向導管L抽吸導引；以及框體丨〇4，其收納磨石 101及整流板103等。 磨石101安裝於進行旋轉驅動之馬達1〇2上，且以磨石 101之中心Ρ!為中心沿圖2(a)之箭頭α之方向（繞逆時針）旋 轉驅動。又，如圖3所示，於磨石1〇1之側面令央形成有槽 101a ’藉由沿圖2(a)之箭頭β之方向（自右向左）使工件貿之 端面沿該槽1 〇 1 a移動，可對工件W之端面進行研磨加工。 馬達102根據來自控制器600之控制，沿圖2(a)之繞逆時 針之方向旋轉驅動磨石1 〇 1 e此時，磨石1 〇丨之轉數根據工 件W之進給速度（以下’稱為加工速度v)而控制。具體而 - s ’以加工速度V及磨石1〇1之周速度v之比v/v變為 • 0·0012〜〇·〇!之範圍内（0.0012SV/VS0.01)之方式控制磨石 101之轉數。另外’周速度v係磨石1 〇 1與使工件％之板厚 為1/2之面相接觸之位置P2(以下，稱為研磨位置處之磨 石101之周速度。 若加工速度V與周速度v之比V/v未達〇.〇〇 12，則冷卻劑 159909.doc 201233501 無法穿過因磨石101之旋轉而產生之空氣層到達工件W ’ 從而無法使研磨部分冷卻。其結果，有產生灼痕等不良狀 況、無法進行研磨加工之虞◊又，若加工速度¥與周速度v 之比V/v超過0·01，則因接近於工件W之研磨加工之極限速 度故對工件W之端面進行研磨加工本身就很困難。 整流板103沿磨石101配置於磨石1〇1之右側（參照圖 2(a))，對已使用過之冷卻劑進行整流並向導管l抽吸導 引。藉由包含該整流板103，可對已使用過之冷卻劑進行 整流並效率良好地將其抽吸導引至導管L之吸入口。從 而’可有效地防止冷卻劑於框體1〇4内飛散。於圖2(a)中， 將導管L·安裝於框體1 〇4之上側，但亦可將導管[安裝於框 體104之右側。 導管L之吸入風量較佳設定為4〇〜60 m/分之範圍内。若 吸入風量未達40 m/分則有無法充分地吸入冷卻劑之虞。 又’若吸入風量超過60 m/分則有框體1〇4内之負壓（壓力低 於大氣壓之狀態）增大而對框體1〇4之強度造成影響之虞。 又’因需要提高下述抽吸機構400所具備之栗之抽吸能力 故設備成本會增大。再者，亦可於導管L上設置吸入風量 調節用之調整板。 如圖4所示，於框體1〇4上，設置有導入工件w之開口 104a °進而’為了防止冷卻劑向框體丨〇4外飛散，於該開 口 104a之上下，設置有自框體1〇4朝向外側延伸之2個凸緣 (邊詹）104b、1 〇4c。當自導管L吸入冷卻劑時，亦吸入框 體104内之空氣故而框體104内變為負壓。從而，如圖$所 159909.doc 201233501 不，出現沿箭頭方向自框體104外向框體104内之氣流。該 氣流頂回欲向框體1〇4外飛散之冷卻劑，故而藉由設置該 凸緣104b、l〇4c可有效地防止冷卻劑向框體1〇4外飛散。 (冷卻劑供給機構2〇〇) 冷卻劑供給機構200包括：歧管201，其將由未圖示之泵 輸出之冷卻劑均等地分流；進退移動機構2〇2，其沿圖2(a) 之箭頭γ之方向（上下方向）進退驅動該歧管2〇1 ;及喷嘴 203a、203b，其於工件w之兩侧，相對於工件w之各主表 面呂丨、S2以θ!、Θ2之入射角度而配置，將經歧管201分流之 冷卻劑向研磨部附近供給。 喷嘴203a、203b經由歧管201供給由泵輸出之冷卻劑。 如圖2(a)及圖2(b)所示，自喷嘴203a、203b，向相對於磨 石101之工件W之研磨位置p2，面向圖2(a)之紙面為左側， 即’朝向工件W之前進方向而與研磨位置p2相距距離乂之 位置P3(以下’稱為供給位置p3)供給冷卻劑。 該供給位置P3以磨石1〇1之直徑d及研磨位置匕與供給位 置之距離X之比χ/d變為〇.〇4(4%)~0.〇5(5%)之範圍内 (0·04(4%)^χ/ίϊ$0.05(5%))之方式進行調整。 由於磨石101旋轉而於磨石1〇1之四周出現與磨石1〇1一 併旋轉之空氣層。受到該空氣層與工件之阻擾，即便將冷 卻劑向研磨位置Ρ2供給亦無法使冷卻劑抵達研磨位置ρ2。 因此’藉由加工速度V與周速度ν之比ν/ν為0.0012以上， 且將冷卻劑供給至供給位置ρ3而非研磨位置ρ2，可向研磨 加工部供給冷卻劑。 159909.doc 201233501 因此’於本實施形態中，向磨石1〇1之直徑d及研磨位置 P2與供給位置P3之距離X之比x/d為0.04(4%)〜0.05(5%)之範 圍内（0.04(4%) Sx/dg 〇·〇5(5%))之供給位置P3供給冷卻 劑。若x/d之值未達0 〇4(4%)，則實際上冷卻劑所抵達之位 置自研磨位置P2沿與工件前進方向相反之方向偏離故而無 法使研磨部冷卻。又，若x/d之值超過〇 〇5 mm(5%)，則冷 卻劑所抵達之位置自研磨位置！>2沿工件前進方向偏離故而 無法使研磨部冷卻。 再者’於圖2(b)中，將喷嘴203a、203b之冷卻劑之供給 位置設定為相同位置，但亦可設定為使噴嘴2〇3a、2〇儿之 冷卻之供給位置彼此偏離。從而藉由使喷嘴2〇3a、 之冷卻劑之供給位置偏離，可抑制自喷嘴2〇3a供給之冷卻 齊J與自喷嘴203b供給之冷卻劑彼此干涉而使得冷卻劑不向 研磨加工部供給之狀況。其中，於此情形時，亦應注意之 點在於使喷嘴203a、203b之冷卻劑之供給位置調整為滿足 0.04(4o/o)$x/dS0.05(5o/〇)。 進而，亦必須注意供給冷卻劑之喷嘴2〇3a、2〇儿之入射 角度H2。根據冷卻劑之人射角度不同，會有無法將冷 部劑供給至磨石1G1對卫件w之研磨位置p2之虞^尤該冷 部劑之入射角度而言，存在水平方向（參照圖柳)之入射 角度θ〗、θ2、及相對於工件W之端面(研磨面)為垂直方向 ( >照圖2(a))之入射角度Θ,，士、甘+ ΛIn the polishing method of the present invention, it is preferable to further include a step of adjusting the amount of wear of the grindstone so that the V/v becomes in the range of 0.0012 to 〇〇1. The polishing apparatus of the present invention is a grinding machine for an end surface of a glass substrate, and includes a grinding stone having a diameter d, which is rotationally driven to polish an end surface of a glass substrate having a thickness of 1.2 mm or less; and a second and a second a nozzle disposed on both sides of the glass substrate, and having an incident angle of θι and Θ2 with respect to each main surface of the glass substrate, and advancing toward the grindstone toward the glass substrate, and grinding toward the grindstone The coolant is supplied at a position separated by a distance X; the values of θι, h, and x/d are each 15 to 60° and 15 to 60. , within the range of 0.04~〇·〇5. EFFECTS OF THE INVENTION According to the present invention, there can be provided a polishing method and a polishing apparatus which are 15 to 6 inches on each side of a glass substrate on both sides of a glass substrate during the polishing process. The incident angle is supplied to the glass substrate in a forward direction toward the grindstone, and is supplied to the coolant at a position within a range of 0.04 (4%) to 〇.05 (5%) of the diameter of the grindstone from the grinding position of the grindstone. Therefore, even when the glass substrate as the object to be polished is thin, the occurrence of defects in the end faces of the glass substrate can be suppressed, and the end faces of the glass substrate can be stably polished. [Embodiment] (Embodiment) Hereinafter, the present embodiment will be described in detail with reference to the drawings. 159909.doc 201233501 (Polishing apparatus 1) Fig. 1 is a configuration diagram of a polishing apparatus 实施 according to an embodiment, Fig. 1(a) is a side view, and Fig. 1(b) is a plan view. Fig. 2 is a detailed configuration diagram of the polishing mechanism 1A and the coolant supply mechanism 200, Fig. 2 (>) is a plan view, and Fig. 2(b) is a side view. Figure 3 is an enlarged side view of the grindstone 1〇1. Fig. 4 is a perspective view of the housing 104 provided in the polishing mechanism 1A. Figure 5 is a side view of the frame 1〇4. Figure 6 is a side elevational view of the end face cleaning mechanism 500. In Fig. 2, the frame 104 is indicated by a chain line in order to easily recognize the inside of the frame j 〇4. Further, in Fig. 5, the grindstone 1〇1 is indicated by a chain line. Hereinafter, the polishing apparatus will be described with reference to Figs. 1 to 6! Each configuration will be described. In addition, in Figs. 1 to 5, the illustration of the polishing mechanism ι and the support column of the controller 6 is omitted. As shown in Fig. 1 (a) and Fig. 1 (b), the polishing apparatus 丨 includes a polishing mechanism 1 对 which faces a glass substrate mainly facing an FPD (Flat Panel Display) 4 electronic device (hereinafter, referred to as The end surface of the workpiece w) is polished and chamfered; and the coolant supply mechanism 200 supplies a coolant to the vicinity of the polishing portion of the grindstone 101 provided in the polishing mechanism 1; the conveying mechanism 3' Holding the workpiece W and moving the end surface of the workpiece W along the grinding mechanism 00; the suction mechanism 400 is connected to the grinding mechanism 1 through the conduit L, and sucks the coolant used in the grinding mechanism 1 ;; The mechanism 5 〇〇 cleans the end surface of the workpiece W which has been ground and chamfered by the grinding mechanism 1; and the controller 600 controls the entire polishing apparatus 1 . If the thickness of the workpiece W is thin (especially 1.2 mm or less), it is easy to cause a defect in the end surface of the workpiece W (for example, cracking (small cracks), notches, grinding, 159909.doc 201233501 grinding marks or fractures), and thus In the present embodiment, the workpiece w having a thickness of 1.2 mm or less is set to be processed. Further, in the following description, the grinding and chamfering are collectively referred to as grinding processing. (grinding mechanism 100) - as shown in Fig. 2 (a) and Fig. 2 (b), the grinding mechanism 10 includes: a grinding stone 1 (Π, which grinds the end surface of the workpiece w; a motor 1〇2, which Rotating the grindstone 101; the rectifying plate 103' rectifies the used coolant supplied from the coolant supply mechanism 2 to the grindstone 101, and sucks the used coolant to the conduit L And a frame body 4, which accommodates the grindstone 101, the rectifying plate 103, etc. The grindstone 101 is mounted on the motor 1〇2 that is rotationally driven, and is centered on the center of the grindstone 101. (a) The direction of the arrow α (rotation counterclockwise) is rotationally driven. Further, as shown in Fig. 3, the groove 101a is formed on the side of the grindstone 1〇1 by the arrow β along Fig. 2(a) The direction (from right to left) moves the end face of the workpiece along the groove 1 〇 1 a, and the end surface of the workpiece W can be ground. The motor 102 is wound along the control unit 600 according to the control from the controller 600. Rotating the grindstone 1 in the counterclockwise direction 〇1 e At this time, the number of revolutions of the grindstone 1 is controlled according to the feed speed of the workpiece W (hereinafter referred to as the machining speed v). Specifically, s 'controls the grinding by the ratio v/v of the processing speed V and the peripheral speed v of the grindstone 1〇1 in the range of 0·0012~〇·〇! (0.0012SV/VS0.01) The number of revolutions of the stone 101. The circumferential speed v is the position P2 at which the grindstone 1 〇1 is in contact with the surface having a thickness of 1/2 of the workpiece % (hereinafter referred to as the peripheral speed of the grindstone 101 at the polishing position). If the ratio V/v of the processing speed V to the peripheral speed v is less than 〇.〇〇12, the coolant 159909.doc 201233501 cannot pass through the air layer generated by the rotation of the grindstone 101 to reach the workpiece W', so that the grinding cannot be performed. As a result, there is a problem that a burnt mark or the like is not generated, and the grinding process cannot be performed. If the ratio V/v of the processing speed ¥ to the peripheral speed v exceeds 0·01, the grinding process is close to the workpiece W. The ultimate speed is difficult to grind the end surface of the workpiece W. The rectifying plate 103 is disposed along the grindstone 101 to the right side of the grindstone 1 (refer to Fig. 2 (a)), and the used coolant is applied. Rectifying and pumping guidance to the conduit 1. By including the rectifying plate 103, the used coolant can be rectified and efficiently The suction is preferably guided to the suction port of the duct L. Thus, the coolant can be effectively prevented from scattering in the frame 1〇4. In Fig. 2(a), the duct L· is attached to the frame 1 〇 4, the upper side, but the catheter can also be mounted on the right side of the frame 104. The suction air volume of the duct L is preferably set within the range of 4 〇 to 60 m / min. If the suction air volume is less than 40 m / min, there is no After the coolant is sufficiently sucked in. If the suction air volume exceeds 60 m/min, the negative pressure (the pressure is lower than the atmospheric pressure) in the frame 1〇4 increases, which affects the strength of the frame 1〇4. After that. Further, the equipment cost increases due to the need to increase the suction capacity of the pump provided in the suction mechanism 400 described below. Further, an adjustment plate for adjusting the suction air volume may be provided on the duct L. As shown in FIG. 4, an opening 104a for introducing the workpiece w is provided on the frame 1〇4, and in order to prevent the coolant from scattering outside the frame 丨〇4, a self-frame is provided above the opening 104a. 1〇4 2 flanges (edges) 104b, 1〇4c extending toward the outside. When the coolant is sucked from the duct L, the air in the casing 104 is also sucked, so that the inside of the casing 104 becomes a negative pressure. Thus, as shown in Fig. 159909.doc 201233501, the airflow from the outer casing 104 to the casing 104 in the direction of the arrow appears. Since the airflow is turned back to the coolant to be scattered outside the casing 1?4, the provision of the flanges 104b, 104c can effectively prevent the coolant from scattering outside the casing 1?4. (Cool Supply Mechanism 2〇〇) The coolant supply mechanism 200 includes a manifold 201 that equally divides the coolant output by the pump (not shown); the advance and retreat moving mechanism 2〇2, which is along the line of FIG. 2(a) The direction of the arrow γ (up and down direction) advances and retreats to drive the manifold 2〇1; and the nozzles 203a and 203b are incident on both sides of the workpiece w with respect to the main surfaces of the workpiece w, 丨, and S2 with θ!, Θ2 Arranged at an angle, the coolant branched through the manifold 201 is supplied to the vicinity of the polishing portion. The nozzles 203a, 203b supply the coolant outputted by the pump via the manifold 201. As shown in Fig. 2 (a) and Fig. 2 (b), from the nozzles 203a, 203b to the polishing position p2 of the workpiece W with respect to the grindstone 101, the paper surface facing the Fig. 2 (a) is left, that is, 'toward the workpiece The coolant is supplied to the position P3 (hereinafter referred to as the supply position p3) at a distance 乂 from the polishing position p2 in the forward direction. The supply position P3 is in the range of the diameter d of the grindstone 1〇1 and the distance X between the grinding position 匕 and the supply position 〇/d becomes 〇.〇4(4%)~0.〇5(5%) (0·04(4%)^χ/ίϊ$0.05(5%)) is adjusted. As the grindstone 101 rotates, an air layer that rotates together with the grindstone 1〇1 appears around the grindstone 1〇1. Due to the interference of the air layer and the workpiece, even if the coolant is supplied to the polishing position Ρ2, the coolant cannot reach the polishing position ρ2. Therefore, by supplying the coolant to the supply position ρ3 instead of the polishing position ρ2 by the ratio ν/ν of the processing speed V to the peripheral speed ν of 0.0012 or more, the coolant can be supplied to the polishing portion. 159909.doc 201233501 Therefore, in the present embodiment, the ratio x/d to the diameter d of the grindstone 1〇1 and the distance X between the polishing position P2 and the supply position P3 is 0.04 (4%) to 0.05 (5%). The supply position P3 is supplied to the coolant in the range (0.04 (4%) Sx/dg 〇·〇5 (5%)). If the value of x/d is less than 0 〇 4 (4%), the position at which the coolant reaches is actually deviated from the polishing position P2 in the direction opposite to the advancement direction of the workpiece, so that the polishing portion cannot be cooled. Also, if the value of x/d exceeds 〇 〇 5 mm (5%), the position where the coolant reaches is from the grinding position! > 2 is displaced in the direction in which the workpiece advances, so that the polishing portion cannot be cooled. Further, in Fig. 2(b), the supply positions of the coolants of the nozzles 203a and 203b are set to the same position, but the supply positions for cooling the nozzles 2?3a and 2b may be set to be shifted from each other. Therefore, by shifting the supply position of the coolant of the nozzle 2〇3a, it is possible to suppress the cooling supply J supplied from the nozzle 2〇3a and the coolant supplied from the nozzle 203b from interfering with each other so that the coolant is not supplied to the polishing processing portion. situation. In this case, it should also be noted that the supply position of the coolant of the nozzles 203a, 203b is adjusted to satisfy 0.04 (4o/o) $ x / dS 0.05 (5 o / 〇). Further, it is also necessary to pay attention to the incident angle H2 of the nozzles 2〇3a and 2供给 to which the coolant is supplied. Depending on the angle of incidence of the coolant, there is a possibility that the cold portion agent cannot be supplied to the grinding position p2 of the grindstone 1G1 for the guard w. In particular, the incident angle of the cold portion agent exists in the horizontal direction (refer to Fig. The incident angles θ, θ2, and the end surface (polishing surface) of the workpiece W are perpendicular to the incident angle & ( > according to Fig. 2 (a)), 士,甘+Λ
Ml八耵冉度h尤其重要的是相對於磨石ι〇ι 之侧面為水平方向之入射角度θι、h。 具體而言，喷嘴203a、2〇3b I入射角度θ,、θ2(參照圖 159909.doc 201233501 2(b))較佳設定為15。〜60。之範圍内（15〇$θι、心$6〇。）。入 射角度0丨係圖2(b)所示之輔助線Ll相對於辅助線^之角 度，入射角度Θ2係圖2(b)所示之輔助線L2相對於輔助線L3 之角度。另外，設定以辅助線L3為基準上側、下側均為正 (plus)。此處，辅助線L3為研磨位置I處之磨石1〇丨之切 線’辅助線L2為通過喷嘴2〇3b之供給口之中心之線，輔助 線L丨為通過嗔嘴203 a之供給口之中心之線。 當喷嘴203a、203b之入射角度θι、Θ2未達15。時，有冷卻 劑於工件w上流動但冷卻劑未順利地向磨石1〇1與工件评相 接觸之研磨位置Ρ2供給’而產生灼痕等不良狀況之虞。 又，當喷嘴203a、203b之入射角度θ丨、ι超過6〇。時，有冷 卻劑變為衝擊工件W之狀態’工件W之端面振動而不穩定 (劇烈晃動），從而產生碎裂（微小裂痕）或缺口、斷裂等不 良狀況之虞。 又，噴嘴203a、203b共同之入射角度Θ3較佳設定為15〇〜 30。之範圍内（15。$03$3〇。）。入射角度I為圖2(a)所示之辅 助線U與輔助線L5之角度。此處，輔助線Ls為通過噴嘴 203a之供給口之中心之線’輔助線L4為磨石1〇1之研磨位 置P2處之切線。 進而，自噴嘴2〇3a、203b供給之冷卻劑之流量r較佳為 分別設定為10〜20 L(升）/分（10 L/分SRS20 L/分）。由於磨 石101旋轉而於磨石101之四周出現與磨石101—併旋轉之 空氣層。因此，若冷卻劑流量R未達1 0 L/分，則冷卻劑無 法衝破該空氣層，從而冷卻劑不會順利地抵達供給位置 159909.doc 201233501 p3。其結果，無法使研磨部冷卻，而產生灼痕等不良狀 況。又’若冷卻劑流量R超過20 L/分，則彳冷卻劑雖可衝 破上述空氣層，但冷卻劑之流速變得過快，從而供給至供 給位置P3之冷卻劑不會到達研磨位置P2之虞。 八 又，喷嘴2〇3a、203b之供、給口之内徑嫌佳為分別設定 為2.5 _〜3.2 _之範圍内（2 5職^$3 2 _)。若喷嘴 2〇3a、2G3b之供給口之内徑未達2 5賴，則所供給之冷卻 劑徑變細，難以維#向供給位置p3之冷卻劑供給。又，若 喷嘴_、之供給σ之内徑超過3,2 _，則_供給 之冷卻劑《粗，故難以維持冷卻舰達供給位置I之狀 態，因流速變低，故難以衝破磨石1〇1之周圍所產生之空 氣層。 再者，喷嘴203a、203b之内部加工成螺旋狀以使所供給 之冷卻劑不會擴散。又，喷嘴2〇3a、2〇3b之供給口之内徑 ^更佳為配合工件W之厚度而進行變更’例如，若工件评之 厚度為0·7 mm則將内徑^設定為3 〇 mm，若工件w之厚度 為0.4 mm則將内徑卢設定為2.8 mm。 進退移動機構202包括：鋪設之兩條並列導軌2〇私、 204b ;設置於歧管201之下面且滑動自由地卡合於導軌 204a 204b之4個滑件（未圖示）；沿導軌2〇4a、204b而設 置，並且以於固定位置上自由旋轉之方式進行支承之外螺 紋205 ;可逆驅動該外螺紋2〇5之馬達2〇6 ;及安裝於歧管 201之下面，且與外螺紋2〇5螺合之内螺紋（未圖示）。藉由 可逆運轉馬達206，外螺紋2〇5進行正轉、逆轉驅動，且歧 159909.doc -12- 201233501 管201及設置於歧管201上之喷嘴203a、203b沿導轨2〇4a、 204b進退移動。 進退移動機構202之馬達206藉由控制器600而控制，根 據磨石1 〇 1之磨損狀態使設置有嗔嘴203a、203b之歧管201 於圖2(a)之上下方向上移動。即’為了將冷卻劑向研磨位 置P2供給，必須將冷卻劑向供給位置P3供給，但若磨石 101由於使用而不斷磨損’則磨石1 〇 1之直徑d變化，故而 必須使歧管201之位置亦於圖2(a)之上方向上以磨石丨〇丨之 直徑d因磨石101之磨損而變化（減少）之量進行移動。 因此’於本實施形態中，如上所述，藉由進退移動機構 2〇2，使歧管201之位置即噴嘴203a、203b之位置根據磨石 101之磨損狀態而變化。根據本實施形態，例如，當磨石 101之直徑d因磨損而變短0.1 mm時，控制器6〇〇驅動馬達 206使歧管201之位置於圖2(a)之上方向上移動，以使x/d之 值變為0.04〜0.05之範圍内》 再者’磨石101之磨彳貝狀態’例如’亦可藉由游標卡尺 專測出磨石101之槽l〇la之深度而求出磨損量，亦可由研 磨前與研磨後之工件W之寬度之差求出。 (搬送機構300) 搬送機構300包含進退移動機構301及設置於該進退移動 機構301上向圖1(a)之左右方向移動之移動體s。進退移動 機構301包括：鋪設之兩條並列導軌302a、302b ;設置於 移動體S之下面且滑動自由地卡合於導軌3〇2a、3 02b之4個 滑件3〇3&〜303€1;沿導軌3〇2&、30213而設置，並且以於起 159909.doc •13- 201233501 始位置上自由旋轉之方式進行支承之外螺紋3 〇4，·可逆驅 動該外螺紋304之馬達305 ;及安裝於移動體3之下面，且 與外螺紋304螺合之内螺紋306 ;藉由馬達3〇5之可逆運行 而正轉、逆轉驅動外螺紋3從而移動體s進退移動。 再者，移動體S只要能進退移動即可，例如，亦可於移 動體S上設置馬達及藉由該馬達而可逆驅動之小齒輪使 該小齒輪咬合於沿導軌302a、3〇2b配設之支架而使J動體 S進退移動。 *於移動體S上’設置有用以保持工件w之保持機構3〇7， 藉由該保持機構307裝卸自由地保持工件w。保持機構3〇7 例如為中空之抽吸箱’ #由設置於頂壁之複數個小孔則 而抽吸保持載置於該抽吸箱之頂壁之工件w。另外，亦可 設置複數個吸盤來替代小孔咖，使其進行抽吸保持。 (抽吸機構400) 泵，其經由導管L抽吸已使用過之冷 ’其配置於該泵之前面。由導管L吸 抽吸機構400包括： 卻劑；及氣液分離器 入之冷卻劑藉由氣液分離器盥空 哪ω /、工孔为離而再利用或銷毀 (端面清洗機構5〇〇) 端面清洗機構5〇〇藉由將清洗水供給至已由研磨機構1〇〇 研磨加玉之卫件W之端面，除去含有因研磨加工而產生並 附著於工件W之端面及端面附近之玻璃屑之冷卻劑，清洗 工件W之端面。如圖6所示，端面清洗機構則包括：供給 清洗水之喷嘴5〇la、501b ’及防止清洗水之飛散之框體 502。嗔嘴5()la、分別配置於工㈣之上下，並朝向 I59909.doc 201233501 工件w之端面供給清洗水。此時，為了防止所除去之玻璃 屑殘留於工件W之各主表面Si、32上，清洗水自工件，之 内側朝向外侧供給。再者，與研磨機構1 〇〇之框體丨〇4同樣 地’於框體502上，設置有導入工件w之開口 502a。 . (控制器600) 控制器6〇〇對研磨裝置1整體進行控制。具體而言，對可 逆驅動進退移動機構301之外螺紋304之馬達305、旋轉驅 動磨石101之馬達1〇2、.可逆驅動進退移動機構2〇2之外螺 紋205之馬達206、及保持機構3〇7等進行控制。 (研磨方法） 其夂’參照圖1〜圖6 ’對使用本實施形態之研磨裝置1之 研磨方法進行說明。另外，以下所說明之動作藉由控制器 600而控制》 首先，藉由未圖示之移載機將工件w載置於保持機構 307上。於載置時，進行工件w之校直。若工件w受到載 置，則藉由小孔3 0 7 a而抽吸保持工件w。 若工件w受到抽吸保持’則藉由進退移動機構3〇1之馬 達3 05，移動體S以特定之速度自圖丨（勾及圖i(b)之右向左 • 驅動。再者，亦可不將該移動體S之速度設置為固定，而 -.是先加速驅動，然後於研磨機構100之近前降下速度。 隨者移動體S之前進’工件臂之端面得到研磨加工。該 研磨加工過程中，以加工速度V及周速度v之比V/v變= 0.0012〜〇.〇1之知圍内之方式控制磨石ι〇ι之轉數。又冷 卻劑自圖2⑷及圖2(b)所示之入射角度θι〜θ3分別調整: 159909.doc -15- 201233501 π膏之範圍内、15。膏之範圍内、15。〜3Q。之範圍内之 喷嘴 203a、203b，u in w 八，Λ 乂 10 L"刀〜20 L/分之範圍内之流量向供 給位置P3供給。 ’、 於使磨石1G1與卫件界相接觸之研磨位置&冷卻之後， 向供給位置P3供給之冷卻劑在整流板⑻上進行整流 由導管L吸入。此時導管L之吸入風量為4〇〜6〇 ^分之範圍 内。 若工件W之端面受到研磨力d，則清洗水藉由端面清洗 機構500供給至工件w之端面，而清洗工件w之端面。藉由 該清洗’而除去含有於研磨加工時產生並附著於工件w之 端面及端面附近之玻璃屑之冷卻劑。 右對工件w之整個端面之研磨加工及清洗結束，則藉由 上述移載機研將磨加工後之工件w自保持機構307移去， 將新的研磨加工前之工件W載置於保持機構3〇7上。其 後，對該新工件w之端面實施研磨加工。 如上所述，根據本實施形態之研磨裝置丨，並非將供給 冷卻劑之位置設定為研磨位置？2，而是設定為朝向工件W 之前進方向與研磨位置P2隔開距離乂之供給位置，該供 給位置P3以磨石101之直徑d及研磨位置P2與供給位置k 距離X之比x/d變為0.04(4%)〜〇·〇5(5%)之範圍内（〇 〇4(4〇/。）各 x/d$0.05(5%))之方式進行調整。 進而，因將喷嘴203a、203b之入射角度θι、θ2設定為 1 5〇〜60。之範圍内（i5。㉛$ 6〇。）故冷卻劑效率良好地供給 至研磨位置P2。因此，即便工件w之厚度為12 mm以下， 159909.doc •16- 201233501 亦可有效地抑制卫件w之端面之不良狀況（例如碎裂（微小 裂痕)、缺口、研磨灼痕或斷裂)之產生。X，因可穩定地 對工：w進行研磨加工，故可提高研磨加卫之速度且可提 南每單位時間之處理數量。 又，以研磨加工過程中之加工速度V及周速度v之比v/v 變為0.0012〜0.01之範圍内（0.0012S V/vSO.oi)之方式對磨 石101之轉數進行控制，並且將自喷嘴203a、203b供給之 冷卻劑之流量R分別設定為1〇〜2〇 L(升）/分（1〇 L/分 刀）進而，因將喷嘴203 a、203b之供給口之内徑多分別 設定為2.5 mm〜3.2 mm之範圍内（2 5 mm‘卢2瓜瓜），故 可進而抑制工件W之端面之不良狀況之產生。 又，因藉由整流板1 03對已使用過之冷卻劑進行整流並 將其抽吸導引至導管L之位置，且於框體1〇4上設置有凸緣 l〇4b及凸緣104c ’故可有效地防止冷卻劑向框體1〇4外飛 散。 (其他實施形態） 再者，於上述實施形態（參照圖1(a)及圖l(b))中，構成為 藉由進退移動機構301移動工件W而對工件w之端面進行研 磨加工’但亦可構成為於研磨機構100中包括進退移動機 構301 ’使研磨機構100沿工件w之端面移動而對工件|之 Λϊό面進行研磨加工。 實施例 其次’對實施形態之研磨裝置之具體實施例與比較例、 及其檢測結果進行記錄。於以下之實施例及比較例中，使 159909.doc -17· 201233501 用厚度為0.7 mm之無鹼玻璃（旭硝子公司製造，ANl 00)作 為工件W，使用對金剛石粉末與結合劑構成金屬粉末之混 合粉末進行加壓燒結所得之金屬結合劑金剛石磨石 (#450~#600)作為磨石101。又，於藉由金屬結合劑金剛石 磨石進行研磨後，藉由樹脂結合劑磨石（#200〜#1000)進行 研磨處理。 又，於本次之實施例及比較例中變更以下之6個參數而 .對上述工件W進行研磨加工。另外，各參數之意義如下所 述。 x/d :磨石101之直徑d及研磨位置P2與供給位置P3之距離X 之比。 Θ!:喷嘴203a之入射角度。 θ2 :喷嘴203b之入射角度。 V/v:加工速度V及周速度v之比。 R:自各喷嘴203a、203b供給之冷卻劑之流量。 0 :各嗜嘴203a、203b之供給口之内徑。 (實施例1) 於實施例1中，將x/d設定為0.05(5%)，Θ!設定為22.5。， θ2設定為22.5。，V/v設定為0.005，R設定為15 L/分，#設定 為2.8 mm，使用上述金屬結合劑金剛石磨石對工件W之端 面進行研磨加工。其後，以相同之條件藉由樹脂結合劑磨 石進行精加工之研磨加工。 (實施例2) 於實施例2中，將x/d設定為0.04(4%)，Θ!設定為45°，θ2 159909.doc -18- 201233501 =⑴。’v/v設定為咖，R設定為心分， =一使用上述金屬結合劑金剛石磨石對工件w之端 石進：力磨加工。其後’以相同之條件藉由樹脂結合劑磨 竹倩加工之研磨加工。 (比較例1) 於比較m中，將x/d設定為0.04(4%)，θι設定為7〇。，0 =為d V/v設㈣鳥，似為15L/分 、.2咖，使用上述金屬結合劑金剛石磨石對工件w 進行研磨加工。並德 而 、 工相同之條件藉由樹脂 、、σ 〇劑磨石進行精加工之研磨加工。 (比較例2) 於比較例2中，將x/d設定為〇.〇2(2%)，^設定為η 5。’ =定為22.5。’ V/v蚊為G Gn，R較為9 $ u分飧 疋為3.3 mm，使用上述金屬結合劑金剛石磨石對工件％之 :面進行研磨加h其後，以相同之條件藉由樹脂結合劑 磨石進行精加工之研磨加工。 (檢測結果） 表1係將實施例卜2及比較例i、2之研磨加工條件（x/d、 θι、θ2 ' V/v、R、^)以及研磨加卫結果製成表格所得者。 工件W之端面係將藉由CCD(charge_c〇upled device，電荷 耦。裝置）相機而拍攝之圖像放大至約20倍而進行目測確 認。檢測結果將於工件W之全周之端面上，確認無不良狀 况（碎裂（微小裂痕）、缺口、研磨灼痕、斷裂）之情形設定 為「I(very Good)」，確認有未達0_2 mm之碎裂（微小裂=良） 159909.doc -19· 201233501 之情形設定為「2(Go〇d)」， 小裂痕）或其他不良狀況（缺 確認有〇.2 mm以上之碎裂（微 口、研磨灼痕或斷裂）之情形設 定為「3(Bad)」而進行評價 [表1] X 實施例1 實施例2 ------- 比較例1 _比較例2 2% — —_12·5 度 0.011 9.5 L/分 5% 4% 〜—--- 4% —^__ 22.5 度 45度 7〇i -h 22.5 唐 22.5 度 45ji V/v 0.005 0.005 0.005 R 15 L/分 25 L/分 15 L/^~~ —Φ 2.8 mm 2.0 mm 3.2 mm 結果 1 2 3 llllri 3 (實施例1之結果） 關於研磨加工條件x/d、θι、θ2、V/v、R、0之值分別為 0-04(4%)〜〇.〇5(5%)、15。〜6〇。、15。〜6〇。、2 5〜3 2 瓜爪 1〇〜20 L/分、0.0012〜〇.〇1之範圍内之實施例i，對放大後 之圖像進行確認，結果發現確認無不良狀況（碎裂（微小裂 痕）、缺口、研磨灼痕、斷裂結果「丨」）。 (實施例2之結果） 關於研磨加工條件x/d、θι、02、V/v、r、#中x/d、I、 02之值分別為〇.〇4(4%)〜〇.〇5(5%)、15。〜6〇。、15。〜6〇。之範 圍内，且V/V、R、0之值中至少一者不在25〜32 mm、 10〜20 L/分、0.0012〜0.01之範圍内之實施例2,對放大後 之圖像進行確認，結果發現確認有未達〇·2 mm之碎裂（微 小裂痕），但確認無0.2 mm以上之碎裂（微小裂痕）及其他不 良狀況（結果「2」）。 159909.doc -20- 201233501 (比較例1之結果） 關於研磨加工條件x/d、Qi、、v/v、R、0中x/d、、 02之值申至少一者分別不在0.04(4%)〜0.05(5%)、 15〜60 、15。〜6〇。之範圍内且v/v、r、多之值為2 5〜3 2 mm、10〜20 L/分、0.0012〜〇.〇1之範圍内之比較例1，對放 大後之圖像進行確認，結果發現確認有0.2 mm以上之碎裂 (微小裂痕）或其他不良狀況（缺口、研磨灼痕或斷裂）（結果 「3」）。 (比較例2之結果） 關於研磨加工條件x/d、h、θ2、V/v、R、#中x/d、Θ!、 ㊀2之值中至少—者分別不在0.04(4%)〜0.〇5(5%)、15。〜 15 6〇之範圍内，且乂〜、尺、多之值不在2.5〜3.2 mm 1〇〜2〇 L/分、〇 〇〇12〜〇 〇1之範圍内之比較例2，對放 大後之圖像進行確認，結果發現確認有G.2 mm以上之碎裂 (微】裂痕）或其他不I狀況（缺口、研磨灼痕或斷裂）（結果 「3」）。 士上所述’自表i所示之結果可知：當研磨加工條件 d h θ2 ' V/v、r、$之值分別為 〇 〇4(4%卜〇 〇5⑽）、 156〇/15〜6〇C>、2.5~3.2mm、l〇〜20L">、〇.0〇12〜 0.01之範圍㈣’於研磨後之工件w上確認無不良狀況（碎 裂（微小裂痕）、缺口、研磨灼痕、斷裂），即便於工件^ 厚度缚達G·7職之情形時，亦可有效地抑制工件诃之端面 上不良狀況之產生。 又’即便於研磨加工條件V~、IW之值中至少一者不 159909.doc -21- 201233501 在2.5〜3.2111111、10〜201^分、0.0012〜0.01之範圍内之情形 時，只要研磨加工條件x/d、0丨、Θ2之值分別為〇 〇4(4%)〜 〇·〇5(5%)、15°〜60°、15°〜60°之範圍内’則可確認儘管於 研磨後之工件W上確認有未達02 mm之碎裂（微小裂痕）但 產品方面並不存在問題。 本發明詳細地並且參照特定之實施態樣進行了說明，但 對於本領域技術人員而言，明確的是只要未脫離本發明之 範圍與精神，便可添加各種修正或變更。 本申明案係基於2010年12月1日申請之日本專利申請案 2010-268055者，且其内容作為參照引用於此。 產業上之可利用性 本發明之研磨方法及研磨裝置可用於玻璃基板之端面之 研磨加工，尤其是，適合於FPD(Flat Panel Display)用玻璃 之端面之研磨加工。適於本發明之研磨方法及研磨裝置之 玻璃基板之厚度較佳為3 mm左右，進而玻璃基板之大小較 佳為650 mm(縱）x750 mm(橫）以上，更佳為1500 mm (縱）xl800 mm(橫）以上，尤佳為 2200 mm(縱）x3500 mm (橫）以上。 【圖式簡單說明】 圖1(a)、圖1(b)係實施形態之研磨裝置之構成圖。 圖2(a)、圖2(b)係研磨機構之詳細構成圖。 圖3係磨石之放大側視圖。 圖4係框體之立體圖。 圖5係框體之側視圖。It is particularly important that the Ml octave h is the incident angle θι, h in the horizontal direction with respect to the side of the grindstone ι〇ι. Specifically, the incident angles θ, θ2 of the nozzles 203a and 2〇3b I (see Fig. 159909.doc 201233501 2(b)) are preferably set to 15. ~60. Within the range (15〇$θι, heart $6〇). The incident angle 0 is the angle of the auxiliary line L1 shown in Fig. 2(b) with respect to the auxiliary line ^, and the incident angle Θ2 is the angle of the auxiliary line L2 shown in Fig. 2(b) with respect to the auxiliary line L3. Further, the upper side and the lower side of the auxiliary line L3 are set to be plus. Here, the auxiliary line L3 is the tangent of the grindstone 1 at the grinding position I, the auxiliary line L2 is the line passing through the center of the supply port of the nozzle 2〇3b, and the auxiliary line L丨 is the supply port through the nozzle 203a. The center of the line. When the incident angles θι and Θ2 of the nozzles 203a, 203b are less than 15. At this time, there is a problem that a coolant flows on the workpiece w, but the coolant is not smoothly supplied to the polishing position Ρ2 where the grindstone 1〇1 is in contact with the workpiece, and a problem such as a burn mark is generated. Further, the incident angles θ 丨 and ι of the nozzles 203a and 203b exceed 6 〇. In the case where the coolant becomes the state of impacting the workpiece W, the end face of the workpiece W vibrates and is unstable (severe sway), thereby causing defects such as chipping (small cracks), notches, cracks, and the like. Further, the incident angle Θ3 common to the nozzles 203a and 203b is preferably set to 15 〇 30 30. Within the range (15. $03$3〇.). The incident angle I is the angle of the auxiliary line U and the auxiliary line L5 shown in Fig. 2(a). Here, the auxiliary line Ls is a line passing through the center of the supply port of the nozzle 203a. The auxiliary line L4 is a tangent at the grinding position P2 of the grindstone 1〇1. Further, the flow rate r of the coolant supplied from the nozzles 2A, 3a, and 203b is preferably set to 10 to 20 L (liter) / minute (10 L / minute SRS20 L / minute), respectively. As the grindstone 101 rotates, an air layer that rotates with the grindstone 101 and appears around the grindstone 101. Therefore, if the coolant flow rate R is less than 10 L/min, the coolant cannot break through the air layer, so that the coolant does not smoothly reach the supply position 159909.doc 201233501 p3. As a result, the polishing portion cannot be cooled, and defects such as burn marks are generated. Further, if the coolant flow rate R exceeds 20 L/min, the helium coolant can break through the air layer, but the flow rate of the coolant becomes too fast, so that the coolant supplied to the supply position P3 does not reach the polishing position P2. Hey. Eighth, the inner diameters of the supply and supply ports of the nozzles 2〇3a and 203b are preferably set to be within the range of 2.5 _~3.2 _ (2 5 jobs ^$3 2 _). When the inner diameter of the supply ports of the nozzles 2?3a and 2G3b is less than 25 Å, the supplied coolant diameter becomes fine, and it is difficult to supply the coolant to the supply position p3. Further, if the inner diameter of the supply σ of the nozzle _ exceeds 3,2 _, the coolant supplied is thick, so it is difficult to maintain the state of the cooling ship supply position I, and the flow velocity becomes low, so that it is difficult to break the grindstone 1 The layer of air produced around 〇1. Further, the inside of the nozzles 203a, 203b is processed in a spiral shape so that the supplied coolant does not spread. Further, the inner diameter of the supply ports of the nozzles 2〇3a and 2〇3b is preferably changed in accordance with the thickness of the workpiece W. For example, if the thickness of the workpiece is 0·7 mm, the inner diameter ^ is set to 3 〇. Mm, if the thickness of the workpiece w is 0.4 mm, the inner diameter is set to 2.8 mm. The advance and retreat moving mechanism 202 includes: two parallel rails 2, which are laid, 204b; four sliders (not shown) disposed under the manifold 201 and slidably engaged with the rails 204a to 204b; along the rails 2〇 4a, 204b are provided, and the external thread 205 is supported in a freely rotating position at a fixed position; the motor 2〇6 of the external thread 2〇5 is reversibly driven; and is mounted under the manifold 201 and externally threaded 2〇5 internal thread (not shown). By reversing the motor 206, the external thread 2〇5 performs forward rotation and reverse rotation driving, and the manifold 159909.doc -12-201233501 tube 201 and the nozzles 203a, 203b disposed on the manifold 201 are along the guide rails 2〇4a, 204b. Move forward and backward. The motor 206 of the advancing and retracting movement mechanism 202 is controlled by the controller 600 to move the manifold 201 provided with the dies 203a, 203b upward and downward in the upper and lower sides of Fig. 2(a) according to the wear state of the grindstone 1 〇 1. That is, in order to supply the coolant to the polishing position P2, it is necessary to supply the coolant to the supply position P3. However, if the grindstone 101 is continuously worn due to use, the diameter d of the grindstone 1 〇1 changes, so the manifold 201 must be made. The position is also moved in the direction above the plane of Fig. 2(a) such that the diameter d of the grindstone is changed (decreased) by the wear of the grindstone 101. Therefore, in the present embodiment, as described above, the position of the manifold 201, that is, the positions of the nozzles 203a and 203b, changes depending on the wear state of the grindstone 101 by the advance/retract movement mechanism 2〇2. According to the present embodiment, for example, when the diameter d of the grindstone 101 is shortened by 0.1 mm due to wear, the controller 6 drives the motor 206 to move the position of the manifold 201 in the direction of FIG. 2(a) to The value of x/d is changed to be in the range of 0.04 to 0.05. Further, the state of the rubble of the grindstone 101, for example, can also be obtained by measuring the depth of the groove l〇la of the grindstone 101 by a vernier caliper. The amount of wear can also be determined from the difference between the width of the workpiece W before and after the polishing. (Transport Mechanism 300) The transport mechanism 300 includes an advancing and retracting moving mechanism 301 and a moving body s provided on the advancing and retracting moving mechanism 301 to move in the left-right direction of Fig. 1(a). The advance and retreat moving mechanism 301 includes: two parallel rails 302a, 302b laid; four sliders 3〇3&~303€1 disposed under the moving body S and slidably engaged with the rails 3〇2a, 302b ; is disposed along the guide rails 3〇2&, 30213, and supports the external thread 3〇4 in a freely rotating manner from the initial position of 159909.doc •13-201233501, and the motor 305 that reversibly drives the external thread 304; And the internal thread 306 which is mounted under the moving body 3 and screwed with the external thread 304; the forward rotation of the motor 3〇5 is reversed and the external thread 3 is reversely driven to move the moving body s forward and backward. Further, the moving body S may be moved forward and backward. For example, a motor and a pinion gear reversibly driven by the motor may be provided on the moving body S to engage the pinion gears along the guide rails 302a and 3〇2b. The bracket moves the J-moving body S forward and backward. * A holding mechanism 3〇7 for holding the workpiece w is provided on the moving body S, and the workpiece w is detachably held by the holding mechanism 307. The holding mechanism 3〇7 is, for example, a hollow suction box. # A plurality of small holes provided in the top wall are used to suck and hold the workpiece w placed on the top wall of the suction box. In addition, a plurality of suction cups may be provided instead of the small hole coffee for suction holding. (Suction mechanism 400) A pump that draws the used cold through the conduit L, which is disposed in front of the pump. The suction and suction mechanism 400 of the conduit L includes: a detergent; and the coolant into which the gas-liquid separator is detached by the gas-liquid separator, and the working hole is reused or destroyed (the end cleaning mechanism 5〇〇) The end surface cleaning mechanism 5 供给 removes the end surface and the end surface of the workpiece W which is generated by the polishing process and is attached to the end surface of the workpiece W by the cleaning water supplied to the end surface of the garnish W which has been polished by the polishing mechanism 1 The coolant of the crumb is used to clean the end face of the workpiece W. As shown in Fig. 6, the end face cleaning mechanism includes nozzles 5a, 501b' for supplying washing water and a frame 502 for preventing scattering of washing water. The nozzles 5()la are respectively disposed above the work (4), and the washing water is supplied toward the end face of the workpiece #59909.doc 201233501. At this time, in order to prevent the removed glass swarf from remaining on the main surfaces Si, 32 of the workpiece W, the washing water is supplied from the inside to the outside of the workpiece. Further, in the same manner as the frame body 4 of the polishing mechanism 1, the opening 502a into which the workpiece w is introduced is provided on the frame 502. (Controller 600) The controller 6〇〇 controls the entire polishing apparatus 1. Specifically, the motor 305 that reversibly drives the external thread 304 of the advancing and retracting movement mechanism 301, the motor that rotates the grindstone 101, the motor 206 that reversibly drives the advancing and retracting movement mechanism 2〇2, and the retaining mechanism 3〇7, etc. are controlled. (Polishing method) The polishing method using the polishing apparatus 1 of the present embodiment will be described with reference to Figs. 1 to 6'. Further, the operation described below is controlled by the controller 600. First, the workpiece w is placed on the holding mechanism 307 by a transfer machine (not shown). At the time of mounting, the alignment of the workpiece w is performed. If the workpiece w is placed, the workpiece w is sucked and held by the small hole 3 0 7 a. If the workpiece w is sucked and held, the moving body S is driven at a specific speed by the motor 3 05 of the moving and retracting mechanism 3〇1 (hook and right to the left of the figure i(b). Alternatively, the speed of the moving body S may not be set to be fixed, and the driving speed is first accelerated, and then the speed is lowered in front of the grinding mechanism 100. The moving body S is advanced into the end surface of the workpiece arm to be ground. In the process, the ratio of the processing speed V and the peripheral speed v V/v is changed to 0.0012~〇.〇1 is controlled within the range of the grinding stone ι〇ι. The coolant is from Fig. 2(4) and Fig. 2 ( b) The incident angles θι to θ3 are adjusted respectively: 159909.doc -15- 201233501 Within the range of π paste, 15. Within the range of the paste, 15 to 3Q, the nozzles 203a, 203b, u in w八 Λ L 10 L"The flow rate in the range of 20 L/min is supplied to the supply position P3. ', After the grinding position & the cooling stone 1G1 is in contact with the guard boundary, it is supplied to the supply position P3. The coolant is rectified on the rectifying plate (8) and sucked by the pipe L. At this time, the suction air volume of the pipe L is 4〇~6〇 If the end surface of the workpiece W is subjected to the polishing force d, the cleaning water is supplied to the end surface of the workpiece w by the end surface cleaning mechanism 500, and the end surface of the workpiece w is cleaned. The cleaning is removed by the cleaning process. The coolant that generates and adheres to the glass swarf near the end surface and the end surface of the workpiece w. When the right end of the workpiece w is polished and cleaned, the workpiece w is self-retained by the transfer machine. The mechanism 307 is removed, and the new workpiece W before the grinding process is placed on the holding mechanism 3〇7. Thereafter, the end surface of the new workpiece w is subjected to grinding processing. As described above, the polishing apparatus according to the embodiment 丨The position at which the coolant is supplied is not set to the polishing position ? 2, but is set to a supply position which is spaced apart from the polishing position P2 by the forward direction of the workpiece W, and the supply position P3 is the diameter d of the grindstone 101 and the grinding The ratio x/d of the distance X between the position P2 and the supply position k becomes 0.04 (4%) to 〇·〇5 (5%) (〇〇4 (4〇/.) each x/d$0.05 (5%) In the way of adjustment), further, the nozzles 203a, 203b are inserted The angles θι and θ2 are set in the range of 1 5 〇 to 60. (i5. 31$6 〇.) Therefore, the coolant is efficiently supplied to the polishing position P2. Therefore, even if the thickness of the workpiece w is 12 mm or less, 159909. Doc •16- 201233501 can also effectively suppress the occurrence of defects (such as chipping (small cracks), notches, grinding marks or breaks) on the end face of the guard w. X, because it can grind stably: w Processing, so it can increase the speed of grinding and maintenance, and can handle the number of processing per unit time in the south. Further, the number of revolutions of the grindstone 101 is controlled in such a manner that the ratio v/v of the processing speed V and the peripheral speed v during the grinding process becomes 0.0012 to 0.01 (0.0012 SV/vSO.oi), and The flow rate R of the coolant supplied from the nozzles 203a and 203b is set to 1 〇 2 〇 L (liter) / minute (1 〇 L / minute knife), respectively, and the inner diameter of the supply port of the nozzles 203 a, 203b is increased. It is set to a range of 2.5 mm to 3.2 mm (25 mm '2 guaguas), so that the occurrence of defects in the end faces of the workpiece W can be suppressed. Moreover, since the used coolant is rectified by the rectifying plate 103 and sucked to the position of the duct L, and the flange 1b and the flange 104c are provided on the frame 1〇4. 'It is therefore effective to prevent the coolant from scattering outside the frame 1〇4. (Other Embodiments) Further, in the above-described embodiment (see FIGS. 1(a) and 1(b)), the end surface of the workpiece w is polished by moving the workpiece W by the advance/retract movement mechanism 301. Alternatively, the polishing mechanism 100 may include an advance/retract movement mechanism 301' to move the polishing mechanism 100 along the end surface of the workpiece w to polish the surface of the workpiece. EXAMPLES Next, specific examples and comparative examples of the polishing apparatus of the embodiment and their detection results were recorded. In the following examples and comparative examples, 159909.doc -17· 201233501 was used as the workpiece W with an alkali-free glass (ANl 00, manufactured by Asahi Glass Co., Ltd.) having a thickness of 0.7 mm, and a metal powder was used for the diamond powder and the binder. The metal binder diamond grindstone (#450~#600) obtained by pressure sintering of the mixed powder was used as the grindstone 101. Further, after being ground by a metal bond diamond grindstone, it was subjected to a rubbing treatment by a resin bond grindstone (#200 to #1000). Moreover, in the present embodiment and the comparative example, the following six parameters were changed, and the workpiece W was subjected to polishing processing. In addition, the meaning of each parameter is as follows. x/d: ratio of the diameter d of the grindstone 101 and the distance X between the grinding position P2 and the supply position P3. Θ!: Angle of incidence of the nozzle 203a. Θ2 : incident angle of the nozzle 203b. V/v: ratio of processing speed V to circumferential speed v. R: flow rate of the coolant supplied from each of the nozzles 203a, 203b. 0 : inner diameter of the supply port of each of the mouthpieces 203a, 203b. (Example 1) In Example 1, x/d was set to 0.05 (5%), and Θ! was set to 22.5. , θ2 is set to 22.5. V/v was set to 0.005, R was set to 15 L/min, and # was set to 2.8 mm, and the end face of the workpiece W was ground using the above-described metal bond diamond grindstone. Thereafter, the polishing process was performed by the resin bond grinding stone under the same conditions. (Embodiment 2) In Embodiment 2, x/d is set to 0.04 (4%), Θ! is set to 45°, and θ2 159909.doc -18-201233501 = (1). 'v/v is set to coffee, R is set to centimeter, = one uses the above-mentioned metal bond diamond grindstone to the end of the workpiece w. Stone: Force grinding. Thereafter, the grinding process was carried out by the resin bonding agent under the same conditions. (Comparative Example 1) In the comparison m, x/d was set to 0.04 (4%), and θι was set to 7 〇. , 0 = set for d V / v (four) bird, like 15L / min, . 2 coffee, using the above metal bond diamond grinding stone to grind the workpiece w. And the conditions of the same work and the same conditions are refined by the resin and σ 〇 grindstone. (Comparative Example 2) In Comparative Example 2, x/d was set to 〇.〇2 (2%), and ^ was set to η 5. '= is set at 22.5. 'V/v mosquito is G Gn, R is 9 $ u till 3.3 mm, using the above-mentioned metal bond diamond grindstone to grind the workpiece: the surface is ground and h, then combined by resin under the same conditions Grinding of the grinding stone for finishing. (Test Results) Table 1 shows the results of the polishing processing conditions (x/d, θι, θ2 'V/v, R, ^) of Example 2 and Comparative Examples i and 2, and the results of the polishing and curing. The end face of the workpiece W was visually confirmed by magnifying an image taken by a CCD (charge-coupled device) camera to about 20 times. The test results will be set to "I (very Good)" on the end face of the entire circumference of the workpiece W to confirm that there are no defects (fragmentation (small cracks), notches, grinding marks, breaks). Fragmentation of 0_2 mm (microcracking = good) 159909.doc -19· 201233501 The situation is set to "2 (Go〇d)", small cracks) or other unfavorable conditions (missing is confirmed to be more than 2 mm. (Microport, grinding burn marks or breakage) was set to "3 (Bad)" and evaluated [Table 1] X Example 1 Example 2 ------- Comparative Example 1 - Comparative Example 2 2% — —_········· 25 L/min 15 L/^~~ —Φ 2.8 mm 2.0 mm 3.2 mm Result 1 2 3 llllri 3 (Results of Example 1) Regarding the grinding processing conditions x/d, θι, θ2, V/v, R, 0 The values are 0-04 (4%)~〇.〇5(5%), 15.~6〇., 15.~6〇., 2 5~3 2 melon claws 1〇~20 L/min, Example i in the range of 0.0012~〇.〇1, confirming the enlarged image, knot It was found that no defects (fragmentation (micro cracks), notches, grinding marks, and fracture results "丨") were confirmed. (Results of Example 2) Regarding polishing processing conditions x/d, θι, 02, V/v, r The values of x, d, I, and 02 are #〇4〇4(4%)~〇.〇5(5%), 15.~6〇.,15.~6〇, respectively, and In the second embodiment, at least one of the values of V/V, R, and 0 is not in the range of 25 to 32 mm, 10 to 20 L/min, and 0.0012 to 0.01, and the enlarged image is confirmed. Fragmentation (small cracks) of less than 2 mm, but no cracks (micro-cracks) of 0.2 mm or more and other adverse conditions (result "2") were confirmed. 159909.doc -20- 201233501 (Comparative Example 1) RESULTS) Regarding the values of x/d, 02 in the grinding processing conditions x/d, Qi, v/v, R, 0, at least one of them is not 0.04 (4%) to 0.05 (5%), 15 to 60, respectively. , in the range of 15. to 6 〇, and the values of v/v, r, and more are 2 5 to 3 2 mm, 10 to 20 L/min, and 0.0012 to 〇. The enlarged image was confirmed, and it was found that there was a crack of 0.2 mm or more ( Small cracks) or other undesirable situation (the gap, grinding burn marks or broken) (the result of "3"). (Results of Comparative Example 2) At least the values of x/d, Θ!, and 2 in the polishing processing conditions x/d, h, θ2, V/v, R, # are not 0.04 (4%) to 0, respectively. .〇5 (5%), 15. In the range of ~ 15 6〇, and the value of 乂~, 尺, and 多 is not in the range of 2.5~3.2 mm 1〇~2〇L/min, 〇〇〇12~〇〇1, after zooming in When the image was confirmed, it was found that there was a crack (micro) crack of G. 2 mm or more or other non-I condition (notch, scratch or break) (result "3"). According to the results shown in Table i, when the grinding processing conditions dh θ2 ' V / v, r, $ are 〇〇 4 (4% divination 5 (10)), 156 〇 / 15 ~ 6 〇C>, 2.5~3.2mm, l〇~20L">, 〇.0〇12~0.01 range (4) 'There is no defect in the workpiece w after grinding (fragmentation (micro crack), notch, grinding Burn marks and breaks can effectively suppress the occurrence of defects on the end faces of the workpieces even when the thickness of the workpiece is limited to the G·7 position. Further, even if at least one of the values of the grinding processing conditions V~ and IW is not 159909.doc -21-201233501 in the range of 2.5 to 3.2111111, 10 to 201 minutes, or 0.0012 to 0.01, as long as the grinding processing conditions are satisfied The values of x/d, 0丨, and Θ2 are 〇〇4 (4%)~〇·〇5 (5%), 15°~60°, and 15°~60°, respectively. After the workpiece W, it was confirmed that there was a crack (micro crack) of less than 02 mm, but there was no problem in terms of the product. The present invention has been described in detail with reference to the specific embodiments thereof, and it is to be understood by those skilled in the art that various modifications and changes can be made without departing from the scope and spirit of the invention. The present application is based on Japanese Patent Application No. 2010-268055, filed on Dec. Industrial Applicability The polishing method and polishing apparatus of the present invention can be used for the polishing of the end faces of glass substrates, and in particular, for the polishing of the end faces of glass for FPD (Flat Panel Display). The thickness of the glass substrate suitable for the polishing method and the polishing apparatus of the present invention is preferably about 3 mm, and the size of the glass substrate is preferably 650 mm (vertical) x 750 mm (horizontal) or more, more preferably 1500 mm (longitudinal). Xl800 mm (horizontal) or more, especially 2200 mm (vertical) x 3500 mm (horizontal) or more. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 (a) and Fig. 1 (b) are configuration diagrams of a polishing apparatus according to an embodiment. 2(a) and 2(b) are detailed structural views of the polishing mechanism. Figure 3 is an enlarged side view of the grindstone. Figure 4 is a perspective view of the frame. Figure 5 is a side view of the frame.
159909.doc 201233501 圖6係端面清洗機構之側視圖。 【主要元件符號說明】 1 研磨裝置 100 研磨機構 101 磨石 101a 槽 102 馬達 103 整流板 104 框體 104a 開口 104b 、 104c 凸緣 200 冷卻劑供給機構 201 歧管 202 進退移動機構 203a、203b 喷嘴（供給口） 204a、204b 導轨 205 外螺紋 206 馬達 300 搬送機構 301 進退移動機構 302a、302b 導執 303a〜303d 滑件 304 外螺紋 305 馬達 •23- 159909.doc 201233501 306 内螺紋 307 保持機構 307a 小孔 400 抽吸機構 500 端面清洗機構 ， 501a ' 501b 喷嘴 502 框體 502a 開口 600 控制器159909.doc 201233501 Figure 6 is a side view of the end face cleaning mechanism. [Main component symbol description] 1 polishing device 100 polishing mechanism 101 grindstone 101a slot 102 motor 103 rectifying plate 104 frame 104a opening 104b, 104c flange 200 coolant supply mechanism 201 manifold 202 advancing and retracting moving mechanism 203a, 203b nozzle (supply Port) 204a, 204b Rail 205 External thread 206 Motor 300 Transfer mechanism 301 Advance and retract movement mechanism 302a, 302b Guide 303a to 303d Slider 304 External thread 305 Motor • 23- 159909.doc 201233501 306 Internal thread 307 Holding mechanism 307a Small hole 400 suction mechanism 500 end face cleaning mechanism, 501a ' 501b nozzle 502 frame 502a opening 600 controller
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