JP2007048780A - Wafer chamfering device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wafer chamfering device with which an original target of coolant liquid is achieved for cooling a wafer and a grinding stone and for removing/cleaning grinding waste, and coolant liquid can efficiently be supplied. <P>SOLUTION: The wafer chamfering device 10 is provided with coolant nozzles 71A and 71B supplying coolant liquid 91A to the inner surface of the wafer W. Supplied coolant liquid 91A is made to spread to an outer periphery from the inner surface on a wafer surface. During chamfering work by helical grinding using the formed grinding stone, or chamfering work of a notch N, coolant liquid 91A can efficiently be supplied to a work point. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a wafer chamfering apparatus, and more particularly to a wafer chamfering apparatus provided with a coolant nozzle capable of efficiently supplying a coolant liquid.

  A wafer made of silicon or the like as a material for a semiconductor device or the like is sliced thinly from an ingot state with a slicing machine, a wire saw, or the like, and then the periphery is chamfered to prevent cracking or chipping of the peripheral edge portion. The chamfering of the wafer is performed by bringing the wafer close to the grindstone rotated at high speed while grinding the periphery of the wafer with the grindstone.

  A coolant is supplied to the grinding section for the purpose of cooling the wafer and the grindstone and removing and cleaning the grinding debris. If this coolant liquid is not supplied effectively and efficiently, the processing quality deteriorates due to a decrease in processing accuracy due to a rise in the temperature of the wafer and the grindstone and clogging of the grindstone, and a deterioration in the surface roughness of the processing surface.

  However, in most conventional wafer chamfering apparatuses, a large amount of coolant is sprayed toward the vicinity of the processing point of the wafer (see, for example, Patent Document 1).

In the wafer chamfering apparatus described in Patent Document 1, as shown in FIG. 9, the coolant nozzles 130 and 130 that inject the coolant liquid from both sides in the tangential direction of the wafer W toward the processing point are relative to the wafer W. It is provided in a fixed state.
Japanese Patent No. 2980237

  By the way, in the chamfering of the wafer W, a general-purpose grindstone having a groove corresponding to the final chamfered shape is often used. In addition, a method called helical grinding in which the rotation axis of the general-purpose grindstone is inclined in the outer peripheral tangential direction of the wafer W is used, and the effect of greatly reducing the surface roughness of the chamfered surface is exhibited.

  However, in the case of chamfering with a general-purpose grindstone or chamfering with helical grinding using a general-purpose grindstone, the coolant is difficult to reach the processing point because of the long contact length, and the conventional technology as described in Patent Document 1 described above. This coolant liquid supply method is insufficient to achieve the effect of the coolant liquid, that is, the cooling of the wafer W and the grindstone and the removal cleaning of the grinding debris.

  In the case of a single crystal material such as a semiconductor wafer, a notch is often formed on the outer periphery of the wafer as a reference for indicating the crystal orientation. There was a problem that it was difficult.

  The present invention has been made in view of such circumstances, and enables efficient supply of coolant liquid that can sufficiently achieve the original purpose of coolant liquid, that is, cooling of wafers and grindstones, and removal and cleaning of grinding debris. An object of the present invention is to provide a wafer chamfering apparatus.

  In order to achieve the above object, the invention according to claim 1 is directed to a wafer chamfering apparatus that grinds the outer periphery of a rotating wafer with a rotating grindstone and chamfers the outer peripheral edge portion of the wafer. A coolant nozzle for supplying a coolant liquid is provided on the inner surface of the wafer so that the supplied coolant liquid spreads from the inner surface to the outer periphery on the wafer surface and reaches a grinding position. There is provided a wafer chamfering apparatus characterized by the above.

  According to the first aspect of the present invention, the coolant liquid is supplied to the inner surface of the wafer and spreads from the inner surface to the outer periphery by the spray force and the centrifugal force to reach the grinding position. Even in the case of chamfering by helical grinding used or in the case of chamfering of the notch portion, the coolant liquid can be efficiently supplied to the processing point, and the processing quality can be improved.

  According to a second aspect of the present invention, in the first aspect of the invention, the coolant nozzle is fixedly installed relative to the chamfered wafer. According to the invention of claim 2, since the coolant nozzle is installed relatively fixed to the wafer, it can be applied at the time of grinding all the grindstones, and the number of coolant nozzles can be reduced. Therefore, complication of the apparatus can be prevented.

According to a third aspect of the present invention, in the first or second aspect of the present invention, the coolant nozzle is provided on each of upper and lower surfaces of the chamfered wafer.
According to the invention of claim 2, since the coolant nozzles are provided on both the upper and lower surfaces of the wafer, the coolant liquid can be efficiently supplied to the processing point from both surfaces of the wafer.

  The invention according to claim 4 is a wafer chamfering device for grinding the outer periphery of a rotating wafer with a rotating grindstone and chamfering the outer peripheral edge portion of the wafer, and is fixed and installed relative to the grindstone. There is provided a wafer chamfering apparatus comprising a coolant nozzle for supplying a coolant liquid simultaneously to a processing surface and an end surface of the grindstone and a base metal surface of the grindstone.

  According to the invention of claim 4, since the coolant nozzle for supplying the coolant liquid to the processing surface, the end surface of the grindstone and the base metal surface of the grindstone is fixed relative to the grindstone at the same time. Regardless of the temperature of the entire grindstone can be kept constant, the grinding scrap removal and cleaning effect is great.

  According to a fifth aspect of the present invention, in the fourth aspect of the invention, the coolant nozzle has an injection port formed so as to spread the coolant liquid thinner than a grindstone width.

  According to the invention of claim 5, since the nozzle of the coolant nozzle is formed so as to spread the coolant liquid thinly beyond the width of the grindstone, the entire grindstone including the grindstone base metal is cooled and It can be cleaned and consumes less coolant.

  According to a sixth aspect of the invention, in the fourth or fifth aspect of the invention, during the rotation of the grindstone, the coolant liquid is constantly supplied from the coolant nozzle except when the wafer is attached or detached. .

  According to the sixth aspect of the present invention, the coolant liquid is constantly supplied to the wheel width or more except when the wafer is attached / detached. Therefore, the effect of preventing adhesion and removal of grinding debris is great, and the temperature of the wheel is prevented from rising and constant. Can be kept at a temperature of

  The invention according to claim 7 is a grinding wheel with a plurality of chamfering grooves formed in a wafer chamfering apparatus for grinding the outer periphery of a rotating wafer with a rotating grindstone and chamfering the outer peripheral edge portion of the wafer, A coolant nozzle that is fixed relative to the grinding wheel and supplies a coolant liquid intensively to a grinding point by the grinding wheel, and is provided only when grinding with the grinding wheel. The wafer chamfering apparatus is characterized in that the coolant liquid is supplied from the outside and the supply of the coolant liquid is stopped except during grinding by the grinding wheel.

  According to the invention of claim 7, since the coolant nozzle that supplies the coolant liquid intensively to the grinding point of the grinding wheel in which a plurality of chamfering grooves are formed is provided, for example, the coolant liquid is difficult to reach. The coolant liquid can be efficiently supplied to the grinding point of the notch portion. Further, since the supply of the coolant liquid is stopped except during grinding, the consumption amount of the coolant liquid can be saved.

  The invention according to an eighth aspect is the invention according to the seventh aspect, wherein the coolant nozzle is fixedly installed with respect to the grinding wheel and is used for processing among a plurality of grooves of the grinding wheel. It is characterized in that the position can be adjusted according to the position of the groove.

  According to the invention of claim 8, since the coolant nozzle is provided relatively fixed to the grinding wheel, the coolant liquid can be supplied to the grinding wheel regardless of the movement of the grinding wheel. Moreover, since the coolant nozzle is provided so that the position can be adjusted according to the position of the groove to be processed among the plurality of grooves of the grinding wheel, the coolant liquid can be efficiently supplied to the grinding point.

  The invention according to claim 9 is characterized in that, in the invention according to claim 8, the coolant nozzle is provided outside the processing chamber for chamfering so that the position can be adjusted according to the position of the groove. To do.

  According to the invention of claim 9, since the coolant nozzle is provided so that the position of the coolant nozzle can be adjusted outside the chamfering processing chamber, it is easy to adjust the position according to the position of the groove used for processing among the plurality of grooves of the grinding wheel. Can be done.

  According to a tenth aspect of the present invention, in the ninth aspect of the present invention, an alignment mark is provided for aligning the coolant nozzle with a position of the groove for the processing, and the alignment mark is provided outside the processing chamber. It is characterized by that.

  According to the invention of claim 10, since the alignment mark for adjusting the coolant nozzle to the position of the groove to be used for the processing is provided outside the processing chamber, the groove to be used for processing is changed among the plurality of grooves of the grinding wheel. When doing so, the position adjustment according to the position of the groove can be performed very easily.

  The invention according to claim 11 is a wafer chamfering apparatus for grinding an outer periphery of a rotating wafer with a rotating grindstone and chamfering an outer peripheral edge portion of the wafer, and a notch grinding grindstone for chamfering a notch portion of the wafer; There is provided a wafer chamfering apparatus including a coolant nozzle for supplying a coolant liquid in parallel with a straight portion of a notch portion.

  According to the eleventh aspect of the invention, since the coolant nozzle for supplying the coolant liquid is provided in parallel to the straight portion of the notch portion of the wafer, the coolant liquid can be used even in the case of chamfering using a general-purpose grindstone. Therefore, it is possible to efficiently supply the coolant liquid to the grinding point of the notch portion that is difficult to reach, and to improve the machining quality.

  As described above, according to the wafer chamfering apparatus of the present invention, it is possible to efficiently supply the coolant liquid, and it is possible to sufficiently achieve the original purpose of the coolant liquid, that is, the cooling of the wafer and the grindstone and the removal cleaning of the grinding dust. .

  Hereinafter, preferred embodiments of a wafer chamfering apparatus according to the present invention will be described in detail with reference to the accompanying drawings. In each figure, the same number or symbol is attached to the same member.

  FIG. 1 is a front view showing a main part of the wafer chamfering apparatus. The wafer chamfering apparatus 10 includes a wafer feeding unit 20, a grindstone rotating unit 50, a wafer supply / storage unit (not shown), a wafer cleaning / drying unit, a wafer transfer unit, and a controller for controlling operations of each part of the chamfering device. .

  The wafer feeding unit 20 includes an X-axis base 21, two X-axis guide rails 22, 22, four X-axis linear guides 23, 23,..., A ball screw and a stepping motor mounted on the main body base 11. It has an X table 24 that is moved in the X direction in the figure by the X axis driving means 25.

  The X table 24 is moved in the Y direction in the figure by Y axis driving means comprising two Y axis guide rails 26, 26, four Y axis linear guides 27, 27,..., A ball screw and a stepping motor (not shown). A Y table 28 is incorporated.

  The Y table 28 is guided by two Z-axis guide rails 29 and 29 and four Z-axis linear guides (not shown), and is moved in the Z direction in the figure by a Z-axis driving means 30 comprising a ball screw and a stepping motor. Z table 31 is incorporated.

  The Z table 31 incorporates a θ-axis motor 32 and a θ spindle 33, and a wafer table 34 is attached to the θ spindle 33. The wafer table 34 is centered on the wafer table rotation axis CW in the θ direction in the figure. It is rotated. The upper surface of the wafer table 34 is a suction surface that communicates with a vacuum source (not shown), and a wafer W to be chamfered is placed and sucked and fixed.

  A truing grindstone 41 used for truing a grindstone for chamfering the periphery of the wafer W is attached to the lower portion of the wafer table 34 concentrically with the wafer table rotation axis CW.

  By this wafer feeding unit 20, the wafer W and the truing grindstone 41 are rotated in the θ direction in the drawing and moved in the X, Y, and Z directions.

  The grindstone rotating unit 50 is mounted with an outer peripheral grindstone 52, and is mounted on an outer grindstone spindle 51 that is driven to rotate about an axis CH by an outer grindstone motor (not shown), and a turntable 53 disposed above the outer peripheral grindstone 52. The outer peripheral fine spindle 54 and the outer peripheral fine spindle motor 56, the notch rough spindle 60 and the notch coarse motor 62, the notch fine spindle 57 and the notch fine motor 59 are provided.

  An outer peripheral fine grinding wheel 55 which is a chamfering grindstone for finishing and grinding the outer periphery of the wafer W is attached to the outer peripheral fine spindle 54, a notch rough grinding wheel 61 is provided on the notch rough grinding spindle 60, and a notch fine grinding spindle 57 is provided on the notch fine grinding spindle 57. A notch fine grinding wheel 58, which is a chamfering grindstone for finish grinding the notch portion, is attached.

  The outer peripheral fine grinding wheel 55, the notch fine grinding wheel 58, and the notch coarse grinding wheel 61 are positioned at the processing positions by the rotation of the turntable 53.

  FIG. 2 shows the configuration of the outer peripheral processing grindstone 52. The outer peripheral processing grindstone 52 has a three-stage configuration. The lowermost portion is a master grindstone 52A having a master groove 52a that forms the outer peripheral shape of the truing grindstone 41, and the intermediate portion is formed with a peripheral rough grinding groove 52b of the wafer W. The outer peripheral rough grinding wheel 52B is formed, and the orientation flat and orientation flat corner fine grinding groove 52d of the wafer W is formed at the top, and the orientation flat and orientation flat corner grinding wheel 52D which is a chamfering grind that finish-grinds the orientation flat and orientation flat corner. It has become.

  In FIG. 2, one groove is described for each grindstone in order to simplify the description. However, in order to deal with deformation of the groove shape due to wear, a plurality of grindstones are actually provided for each grindstone. Grooves are formed.

  In the present embodiment, the truing grindstone 41 is a disc-shaped GC grindstone having the same diameter and the same thickness as the wafer W to be processed, and the grindstone has a particle size of # 320.

  The master grindstone 52A was a diamond bonded metal bond grindstone with a diameter of 202 mm and had a particle size of # 600. The outer peripheral rough grinding wheel 52B is a diamond bonded metal bond grindstone having a diameter of 202 mm and a particle size of # 800. Further, the orientation flat and orientation flat corner grinding wheel 52D is a resin bond grinding wheel of diamond abrasive grains having a diameter of 202 mm, and has a grain size of # 3000.

  The peripheral grinding wheel 55 is a resin bond grindstone of diamond abrasive grains having a diameter of 50 mm, and has a particle size of # 3000. Further, the notch rough grinding wheel 61 has a small diameter of 1.8 mm to 2.4 mm, and a resin bond grindstone of a diamond abrasive grain size # 800 is used. The notch fine grinding wheel 58 has a diameter of 1.8 mm to 2.4 mm. A resin bond grindstone of diamond abrasive grains, grain size # 4000 is used.

  The outer peripheral grinding wheel spindle 51 is a built-in motor driven spindle using a ball bearing and is rotated at a rotational speed of 8,000 rpm. Further, the outer peripheral precision spindle 54 is a built-in motor driven spindle using an air bearing and is rotated at a rotational speed of 35,000 rpm.

  The notch rough spindle 60 is an air turbine driven spindle using an air bearing and is rotated at a rotational speed of 80,000 rpm. The notch precision spindle 57 is a built-in motor driven spindle using an air bearing and has a rotational speed of 150, Rotated at 000 rpm.

  FIG. 3 shows a state in which the outer periphery of the wafer W is finished and chamfered by helical grinding in which the axis of the outer periphery fine spindle 54 is inclined in the tangential direction of the outer periphery of the wafer with respect to the wafer table rotation axis CW. Thus, by performing helical grinding using a grooved grindstone for grinding, the movement direction of the abrasive grains intersects the movement direction of the outer periphery of the wafer, so that the roughness of the grinding surface is extremely improved. However, in this case, since the contact length with the wafer W becomes long, it is necessary to devise how to supply the coolant.

  As described above, an optimum coolant liquid supply method is required for each grindstone in accordance with its function, and the shape and arrangement of the coolant nozzle for that purpose occupy an important point in chamfering. Below, the various coolant nozzles provided in the wafer chamfering apparatus 10 of the present invention will be described.

  FIG. 4 is a plan view showing a state in which the outer periphery of the wafer W is chamfered and ground with the outer periphery processing grindstone 52. The wafer chamfering apparatus 10 is provided with coolant nozzles 71 </ b> A and 71 </ b> B in the vicinity of the wafer table 34. The coolant nozzle 71 </ b> A supplies the coolant 91 </ b> A to the inside of the upper surface of the wafer W. The supplied coolant liquid 91 </ b> A spreads from the upper surface inner side to the outer periphery of the wafer W by the injection force and the centrifugal force, and reaches the grinding point by the outer peripheral processing grindstone 52.

  Further, the coolant nozzle 71B supplies a coolant liquid (not shown) to the inside of the lower surface of the wafer W. The supplied coolant liquid also spreads from the lower surface inner side of the wafer W toward the outer periphery due to the injection force and the centrifugal force, and reaches the grinding point by the outer peripheral processing grindstone 52. The coolant nozzles 71 </ b> A and 71 </ b> B may be provided relatively fixed with respect to the outer peripheral processing grindstone 52, but it is more preferable to provide the coolant nozzles 71 </ b> A and 71 </ b> B relatively fixed with respect to the wafer W.

When the coolant nozzles 71A, 71B are fixed relative to the wafer W,
Not only the outer peripheral processing grindstone 52 but also all the grindstones can be used for grinding, and the number of coolant nozzles can be reduced. Therefore, the apparatus can be prevented from becoming complicated.

  Since the coolant nozzles 71A and 71B are arranged so as to be able to supply the coolant liquid as described above, the coolant liquid can be efficiently supplied to the processing point, and the processing quality can be improved.

  FIG. 5 shows a coolant nozzle 71 </ b> D provided at a position slightly away from the outer peripheral processing grindstone 52. The coolant nozzle 71D is provided so as to be relatively fixed with respect to the outer peripheral processing grindstone 52, and as shown in the enlarged perspective view in FIG. 5, the tip of the coolant nozzle 71D is formed flat, and has a slender cross section. A mouth 71d is formed. The coolant 91D supplied from the elongate cross-section injection port 71d is enlarged thinly and supplied to the processing surface, end surface, and base metal 52C of the outer peripheral processing grindstone 52.

  The coolant 91D is supplied at all times except when the wafer W is attached to or detached from the wafer table 34, thereby preventing the adhesion of grinding dust and improving the cleaning effect of removing the grinding dust and increasing the temperature of the outer peripheral processing grindstone 52. It is preferable to suppress this.

  As described above, the coolant nozzle 71D is provided relatively fixed to the grindstone, and the coolant 91D is efficiently supplied to the entire outer peripheral processing grindstone 52. Therefore, the outer peripheral processing grindstone 52 can be moved relative to the wafer W. Regardless of this, the temperature of the entire grindstone can be kept constant, and the grinding waste removal and cleaning effect is also great.

  Note that the coolant nozzle for supplying the coolant liquid to the grinding point of the outer peripheral grinding wheel 52 is not shown in the figure, but the following coolant having an injection port in the vicinity of the machining point is separate from the coolant nozzle 71D described above. A nozzle 71C is provided.

  In the above-described embodiment, the example in which the coolant nozzle 71D is applied to the outer peripheral processing grindstone 52 has been described. However, the outer peripheral processing grindstone 52 is not limited to the outer peripheral processing grindstone 55, the notch rough grinding grindstone 61, and the notch fine grinding. Even if it is applied to the grindstone 58, the effect is great.

  FIG. 6 shows a coolant nozzle 71 </ b> C adapted to the notch fine grinding wheel 58. The coolant nozzle 71 </ b> C is provided so as to be relatively fixed with respect to the notch fine grinding wheel 58, and is arranged so as to supply the coolant 91 </ b> C intensively to the grinding point of the notch fine grinding wheel 58. Note that the coolant 91C is supplied only during grinding by the notch precision grinding wheel 58, thereby reducing the consumption of the coolant 91C.

  Further, a plurality of grooves 58a, 58a,... Matched to the chamfered shape are formed in the notch precision grinding wheel 58, and the coolant nozzle 71C has a position of the groove 58a used for grinding among the plurality of grooves 58a, 58a,. It is attached so that the position can be adjusted in the vertical direction to match.

  The wafer W attracted and fixed to the wafer table 34 is chamfered in the processing chamber 40 covered with the side cover 42 and the upper surface cover 43, but the position adjustment mechanism 80 of the coolant nozzle 71 </ b> C is located outside the processing chamber 40. The vertical position adjustment for adjusting the coolant nozzle 71 </ b> C to the position of the groove 58 a of the notch precision grinding wheel 58 can be performed outside the processing chamber 40.

  As shown in FIG. 6, the coolant nozzle 71 </ b> C is connected to the pipe 72 by the position adjustment mechanism 80, and can be easily aligned by the alignment mark 85 of the position adjustment mechanism 80 during the position adjustment.

  The alignment mark 85 includes a scale 85b provided on the fixed-side guide base 81 and a triangular mark 85a provided on the moving side. By aligning the apex of the triangular mark 85a with a predetermined position of the scale 85b, The tip of the coolant nozzle 71 </ b> C is adapted to fit the corresponding groove 58 a of the notch fine grinding wheel 58.

  FIG. 7 is a plan view showing details of the position adjustment mechanism 80. The position adjustment mechanism 80 includes a fixed-side guide base 81, a nozzle holder 82 that holds the coolant nozzle 71C, a fastening plate 83, a clamp screw member 84, and the above-mentioned alignment mark 85.

  The guide base 81 is formed with dovetail guide ants 81a. The nozzle holder 82 is provided with a notch for forming an inclined surface 82a on one surface, and an inclined surface 82b is formed on the other surface side edge portion. The fastening plate 83 has a concave cross section having inclined surfaces 83a and 83b, and the nozzle holder 82 is formed by screwing the male screw portion of the clamp screw member 84 into the female screw portion formed in the nozzle holder 82 as shown in FIG. Attached to.

  A dovetail groove for guiding the dovetail groove is formed by the inclined surface 82a of the nozzle holder 82 and the inclined surface 83a of the fastening plate 83, and the nozzle holder 82 is perpendicular to the paper surface of FIG. To be guided to.

  When the clamp screw member 84 is tightened, the inclined surface 83 b of the fastening plate 83 and the inclined surface 82 b of the nozzle holder 82 are in contact with each other, and the inclined surface 83 a of the fastening plate 83 and the inclined surface 82 a of the nozzle holder 82 are The nozzle holder 82 is fixed in contact with 81a. Further, when the clamp screw member 84 is loosened, the nozzle holder 82 can be moved.

A scale plate 87 describing a scale 85b is attached to the guide base 81 on the fixed side,
A display plate 86 with a triangular mark 85a is attached to the moving-side fastening plate 83.
When adjusting the position of the coolant nozzle 71C, the clamp screw member 84 is loosened and the nozzle holder 82 is moved, the triangular mark 85a is aligned with the corresponding scale 85b, and the clamp screw member 84 is tightened and clamped.

  Since the coolant nozzle 71C is attached by such a mechanism, the vertical direction according to the position of the groove 58a used for grinding out of the plurality of grooves 58a, 58a,... The position can be adjusted easily.

  In FIG. 6, the description of the coolant nozzle 71D for supplying the coolant 91D to the entire notch precision grinding wheel 58 is omitted. Further, in this embodiment, the example in which the coolant nozzle 71C is applied to the notch fine grinding wheel 58 has been described. However, the embodiment is not limited to the notch fine grinding wheel 58, but the notch coarse grinding wheel 61, the outer peripheral processing grindstone 52, and the outer peripheral fine grinding. Even if it is applied to the grindstone 55, the effect is great.

As shown in FIG. 8, when chamfering the notch portion N of the wafer W, one coolant is parallel to the straight portion N1 of the notch portion N with respect to the notch fine grinding wheel 58 rotating in the direction of the arrow in the figure. By providing the nozzle 71C and supplying the coolant liquid 91C in parallel with the straight line portion N1,
The coolant 91 </ b> C is more suitable not only when chamfering the straight portion N <b> 1 but also when chamfering the straight portion N <b> 2, because the coolant 91 </ b> C easily reaches the grinding point of the notch fine grinding wheel 58.

In addition, one coolant nozzle 71C is provided in parallel to the straight portions N1 and N2 of the notch portion N, and the notch portion N is chamfered while supplying the coolant 91C from both coolant nozzles 71C and 71C. Also good.

  In this case as well, it is preferable to supply the coolant 91C only during grinding with the notch precision grinding wheel 58, so that the consumption of the coolant 91C can be reduced.

  As described above, since various coolant nozzles are appropriately arranged in the wafer chamfering apparatus 10 of the present invention, the coolant liquid can effectively reach the grinding processing point, and the chamfering processing quality of the wafer W can be improved. The service life of the grindstone can be extended.

  In the above-described embodiment of the wafer chamfering apparatus, the description has been given only in the form in which various coolant nozzles are applied in accordance with the specific grindstone. However, the present invention is not limited to this and is not limited to the grindstone provided for the explanation. It can be applied to other grindstones. For example, the coolant nozzles 71A and 71B shown in FIG. 4 act on all the grindstones to supply the coolant liquid 91A, and the coolant nozzles shown in FIG. 6 installed relatively fixed to all the grindstones, respectively. Ideally, 71C and the coolant nozzle 71D shown in FIG. 5 are provided. However, depending on the type of the bond material or base metal of the grindstone, it may be possible to omit one or two types of coolant nozzle installation and coolant liquid supply.

The front view showing the wafer chamfering apparatus which concerns on embodiment of this invention Explanatory drawing showing the configuration of the outer peripheral grinding wheel Perspective view explaining helical grinding 1 is a conceptual diagram illustrating a coolant nozzle according to an embodiment of the present invention. FIG. 2 is a conceptual diagram illustrating a coolant nozzle according to an embodiment of the present invention. Conceptual diagram 3 for explaining the coolant nozzle according to the embodiment of the present invention. Plan view showing details of position adjustment mechanism 4 is a conceptual diagram illustrating a coolant nozzle according to an embodiment of the present invention. Conceptual diagram explaining a conventional coolant nozzle

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Wafer chamfering apparatus, 52 ... Peripheral processing grindstone (grinding stone), 52C ... Base metal, 55 ... Peripheral precision grinding wheel (grinding stone), 58 ... Notch fine grinding grindstone (grinding stone, notch grinding grindstone), 58a ... Groove, 71A 71B / 71C / 71D ... Coolant nozzle, 71d ... Jet, 85 ... Align mark, 91A / 91C / 91D ... Coolant liquid, N ... Notch part, N1 / N2 ... Linear part, W ... Wafer

Claims (11)

In a wafer chamfering apparatus that grinds the outer periphery of a rotating wafer with a rotating grindstone and chamfers the outer peripheral edge portion of the wafer,
A coolant nozzle that supplies a coolant liquid, and supplies the coolant liquid to the inside of the surface of the wafer so that the supplied coolant spreads from the inside to the outside of the wafer and reaches the grinding position. A wafer chamfering apparatus characterized by comprising:   The wafer chamfering apparatus according to claim 1, wherein the coolant nozzle is fixed and installed relative to the wafer to be chamfered.   The wafer chamfering apparatus according to claim 1, wherein the coolant nozzle is provided on each of upper and lower surfaces of the wafer to be chamfered. In a wafer chamfering apparatus that grinds the outer periphery of a rotating wafer with a rotating grindstone and chamfers the outer peripheral edge portion of the wafer,
A wafer chamfering apparatus, wherein a coolant nozzle is provided that is fixed relative to the grindstone and supplies coolant liquid simultaneously to a processing surface, an end surface of the grindstone, and a base metal surface of the grindstone. The coolant nozzle is
The wafer chamfering apparatus according to claim 4, further comprising an injection port formed so as to spread the coolant liquid thinner than a grindstone width.   6. The wafer chamfering apparatus according to claim 4, wherein during the rotation of the grindstone, the coolant liquid is constantly supplied from the coolant nozzle except when the wafer is attached and detached. In a wafer chamfering apparatus that grinds the outer periphery of a rotating wafer with a rotating grindstone and chamfers the outer peripheral edge portion of the wafer,
A grinding wheel formed with a plurality of chamfering grooves,
A coolant nozzle that is fixed and installed relative to the grinding wheel, and that supplies a coolant liquid intensively to a grinding point by the grinding wheel; and
A wafer chamfering apparatus, wherein a coolant liquid is supplied from the coolant nozzle only during grinding with the grinding wheel, and supply of the coolant liquid is stopped except during grinding with the grinding wheel. The coolant nozzle is
8. The apparatus according to claim 7, wherein the position is relatively fixed with respect to the grinding wheel, and the position of the plurality of grooves of the grinding wheel is adjustable in accordance with a position of a groove to be processed. The wafer chamfering apparatus according to 1. The coolant nozzle is
The wafer chamfering apparatus according to claim 8, wherein the wafer chamfering apparatus is provided outside the processing chamber for chamfering so as to be capable of adjusting a position according to the position of the groove.   The wafer chamfering apparatus according to claim 9, wherein an alignment mark for aligning the coolant nozzle with a position of a groove for the processing is provided, and the alignment mark is provided outside the processing chamber. In a wafer chamfering apparatus that grinds the outer periphery of a rotating wafer with a rotating grindstone and chamfers the outer peripheral edge portion of the wafer,
A notch grinding wheel for chamfering the notch portion of the wafer;
A wafer chamfering apparatus, comprising: a coolant nozzle that supplies a coolant liquid in parallel to the straight portion of the notch portion.

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