JP2010173002A - Cutting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cutting device for restraining occurrence of a chip on both sides of a cutting groove. <P>SOLUTION: The cutting device includes a chuck table holding a workpiece, a cutting means to which a cutting blade for cutting the workpiece held by the chuck table is attached to rotate freely, a cut-feeding means relatively cut-feeding the chuck table and the cutting means, and a cutting fluid supply means supplying cutting fluid to a contact range between the cutting blade and the workpiece. The cutting fluid supply means includes a cylindrical shaped cutting fluid injection nozzle and a cutting fluid supply part supplying the cutting fluid to the cutting fluid injection nozzle, and a plurality of grooves extending in an injection direction are formed on an inner wall of the cylindrical shaped cutting fluid injection nozzle. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention generally relates to a cutting device, and more particularly to the shape of a cutting water jet nozzle that supplies cutting water to a cutting blade of the cutting device.

  A semiconductor wafer in which a number of devices such as IC and LSI are formed on the surface, and each device is partitioned by a line to be divided (street), the back surface is ground by a grinding machine and processed to a predetermined thickness. A dividing line is cut by a cutting device (dicing device) to be divided into individual devices, and the divided devices are used for electric devices such as mobile phones and personal computers.

  The cutting device includes a chuck table for holding a wafer, a cutting means on which a cutting blade for cutting the wafer held on the chuck table is rotatably mounted, and a relative cutting feed between the chuck table and the cutting means. And a cutting water supply means for supplying cutting water to a contact area between the cutting blade and the wafer, and the wafer can be divided into individual devices with high accuracy (for example, JP (See Sho 58-45919).

  The cutting water supply means includes a cylindrical cutting water injection nozzle and a cutting water supply unit that supplies high-pressure cutting water to the cutting water injection nozzle. The cutting water spray nozzle is adjusted so that cutting water is sprayed toward the contact area between the cutting edge of the cutting blade and the wafer.

JP 58-45919 A

  However, in the conventional cutting water spray nozzle, although the cutting water is sufficiently supplied to the contact area between the cutting blade of the cutting blade and the wafer, chipping occurs on both sides of the cutting groove, thereby degrading the quality of the device. At the same time, there is a problem of reducing the bending strength. One possible reason is that the cutting water sprayed from the cutting water spray nozzle is scattered and the cutting resistance increases.

  This invention is made | formed in view of such a point, The place made into the objective is providing the cutting device provided with the cutting water injection nozzle which does not generate | occur | produce a chip | tip on both sides of a cutting groove.

  According to the present invention, the chuck table for holding the workpiece, the cutting means on which the cutting blade for cutting the workpiece held on the chuck table is rotatably mounted, the chuck table and the cutting means are provided. A cutting apparatus comprising: a cutting feed means for relatively cutting feed; and a cutting water supply means for supplying cutting water to a contact area between the cutting blade and a workpiece, the cutting water supply means having a cylindrical shape And a cutting water supply part for supplying cutting water to the cutting water injection nozzle, and a plurality of grooves extending in the injection direction are formed on the inner wall of the cylindrical cutting water injection nozzle. A cutting device is provided.

  Preferably, the plurality of grooves formed on the inner wall of the cylindrical cutting water spray nozzle are formed in a spiral shape. Or the some groove | channel formed in the inner wall of a cylindrical cutting water injection nozzle is formed in the triangular peak and valley, and the ridgeline is formed linearly.

  According to the present invention, since the plurality of grooves are formed in the inner wall of the cutting water jet nozzle constituting the cutting water supply means so as to extend in the jetting direction, the cutting water and the inner wall of the cutting water jet nozzle are caused by the riblet effect. The frictional resistance between the cutting grooves is reduced, cutting water is accurately supplied to the contact area between the cutting edge of the cutting blade and the work piece, and the cutting resistance (load current) is reduced. Can be suppressed.

  In addition, when a plurality of grooves are formed in a spiral shape, a gyro effect is generated in the cutting water, so that the cutting water is not scattered and scattered, and the cutting blade is more accurately cut into the contact area with the workpiece. Water can be supplied.

It is an external appearance perspective view of a cutting device. It is a perspective view which shows the wafer integrated with the flame | frame. It is a perspective view which shows a mode that the wafer supported by the flame | frame is cutting, supplying cutting water. 4A is a front view showing the cutting water injection nozzle and the cutting water nozzle attached to the blade cover, and FIG. 4B is a right side view of FIG. 4A in which the cutting water nozzle is omitted. FIG. 5A is a longitudinal sectional view of the cutting water jet nozzle according to the first embodiment of the present invention, and FIG. 5B is a transverse sectional view thereof. FIG. 6A is a longitudinal sectional view of a cutting water injection nozzle according to a second embodiment of the present invention, and FIG. 6B is a transverse sectional view thereof.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 shows an external perspective view of a cutting apparatus 2 that can dicate a semiconductor wafer and divide it into individual chips (devices).

  On the front side of the cutting device 2, there is provided operating means 4 for an operator to input instructions to the device such as machining conditions. In the upper part of the apparatus, there is provided a display means 6 such as a CRT for displaying a guidance screen for an operator and an image taken by an imaging means described later.

  As shown in FIG. 2, on the surface of the wafer W to be diced, the first street S1 and the second street S2 are formed orthogonally, and the first street S1 and the second street S2 A plurality of devices D are partitioned and formed on the wafer W.

  The back surface of the wafer W is attached to a dicing tape T that is an adhesive tape, and the outer peripheral portion of the dicing tape T is attached to an annular frame F. As a result, the wafer W is supported by the frame F via the dicing tape T, and a plurality of wafers (for example, 25 sheets) are accommodated in the wafer cassette 8 shown in FIG. The wafer cassette 8 is placed on a cassette elevator 9 that can move up and down.

  Behind the wafer cassette 8, a loading / unloading means 10 for unloading the wafer W before cutting from the wafer cassette 8 and loading the wafer after cutting into the wafer cassette 8 is disposed. Between the wafer cassette 8 and the loading / unloading means 10, a temporary placement area 12, which is an area on which a wafer to be carried in / out, is temporarily placed, is provided. Positioning means 14 for positioning at a certain position is provided.

  In the vicinity of the temporary placement area 12, transport means 16 having a turning arm that sucks and transports the frame F integrated with the wafer W is disposed, and the wafer W carried to the temporary placement area 12 is It is attracted by the transport means 16 and transported onto the chuck table 18 and is sucked by the chuck table 18, and is held on the chuck table 18 by fixing the frame F by a plurality of fixing means 19.

  The chuck table 18 is configured to be rotatable and reciprocally movable in the X-axis direction. Above the movement path of the chuck table 18 in the X-axis direction, an alignment unit 20 that detects a street to be cut of the wafer W is provided. It is arranged.

  The alignment unit 20 includes an imaging unit 22 that images the surface of the wafer W, and can detect a street to be cut by a process such as pattern matching based on an image acquired by imaging. The image acquired by the imaging unit 22 is displayed on the display unit 6.

  On the left side of the alignment means 20, a cutting means 24 for cutting the wafer W held on the chuck table 18 is disposed. The cutting means 24 is configured integrally with the alignment means 20, and both move together in the Y-axis direction and the Z-axis direction.

  The cutting means 24 is configured by attaching a cutting blade 28 to the tip of a rotatable spindle 26 and is movable in the Y-axis direction and the Z-axis direction. The cutting blade 28 is located on the extended line of the imaging means 22 in the X-axis direction.

  Referring to FIG. 3, there is shown a perspective view of a state in which the wafer W supported by the frame F is cut along the street by the cutting means 24. Reference numeral 25 denotes a spindle housing of the cutting means 24, in which a spindle 26 that is rotationally driven by a servo motor (not shown) is rotatably accommodated. The cutting blade 28 is an electroformed blade, and has a cutting edge 28a formed by dispersing diamond abrasive grains in a nickel base material on the outer peripheral portion thereof.

  Reference numeral 30 denotes a blade cover that covers the cutting blade 28, and a cutting water nozzle (not shown) that extends along the side surface of the cutting blade 28 and cutting that sprays the cutting water onto the contact area between the cutting blade 28 a of the cutting blade 28 and the wafer W. A water injection nozzle 36 is attached.

  The cutting water from the cutting water supply unit 34 is supplied to a cutting water nozzle (not shown) through the pipe 32 and supplied to the cutting water injection nozzle 36 through the pipe 38. The cutting water is pressurized to about 0.3 Mpa by the cutting water supply unit 34 and is injected from the cutting water injection nozzle 36 at a flow rate of 1.6 to 2.0 liters per minute.

  Reference numeral 40 denotes a detachable cover, which is detachably attached to the blade cover 30 with screws 42. The detachable cover 40 has a cutting water nozzle 44 extending along the side surface of the cutting blade 28, and the cutting water is supplied to the cutting water nozzle 44 through a pipe 46.

  Reference numeral 50 denotes a blade detection block incorporating a blade sensor that detects chipping or wear of the cutting blade 28 a of the cutting blade 28, and is detachably attached to the blade cover 30 by screws 52. The blade detection block 50 has an adjustment screw 54 for adjusting the position of the blade sensor.

  As shown in FIG. 4, the cutting water pressurized to about 0.3 Mpa from the cutting water injection nozzle 36 at a flow rate of 1.6 to 2.0 liters per minute, the cutting blade 28 a of the cutting blade 28, the wafer W, Sprayed into the cutting area. The cutting water injection nozzle 36 has an inner diameter of about 1.0 to 1.5 mm, and a plurality of spiral grooves 58 having a depth of about 0.1 to 0.2 mm are formed on its inner wall as shown in FIG. Is formed.

  In the cutting apparatus 2 configured as described above, alignment between the streets S1 and S2 to be cut and the cutting blade 28 is performed by a well-known technique such as pattern matching.

  After alignment, the street to be cut and the cutting blade 28 are aligned, the chuck table 18 is moved in the X-axis direction indicated by arrow X in FIG. 3, and the cutting blade 28 is rotated at high speed in the direction of arrow A. When the cutting means 24 is lowered while being moved, the aligned street is cut.

  At the time of this cutting, the cutting water pressurized to about 0.3 Mpa from the cutting water injection nozzle 36 is applied to the contact area between the cutting blade 28a of the cutting blade 28 and the wafer W at a flow rate of 1.6 to 2.0 liters per minute. In addition to spraying, cutting is performed while supplying cutting water from the cutting water nozzle 44 toward the cutting blade 28.

  The cutting water jet nozzle 36 of the present embodiment has a spiral groove 58 formed on the inner wall thereof, so that the gyro effect is generated in the cutting water, and the cutting water is not scattered and scattered, so that the cutting water can be cut more accurately. It is supplied to the contact area between the cutting edge 28 a of the blade 28 and the wafer W. As a result, the load current value of the servo motor that conventionally drives the spindle 26 was 1350 mA at the time of cutting, but was reduced to 1200 mA in the embodiment of the present invention.

  This is because the frictional resistance between the cutting water and the inner wall of the cutting water jet nozzle 36 is reduced by the riblet effect of the groove 58 formed spirally on the inner wall of the cutting water jet nozzle 36, and as a result, the cutting edge 28 a of the cutting blade 28. It is considered that the cutting resistance (load current value) was reduced because the cutting water was accurately supplied to the contact area between the wafer and the wafer W.

  By performing cutting while indexing the cutting means 24 in the Y-axis direction by the street pitch stored in the memory, all the streets S1 in the same direction are cut. Furthermore, when the chuck table 18 is rotated 90 degrees and then the same cutting as described above is performed, all the streets S2 are also cut and divided into individual devices D.

  Referring to FIG. 6A, there is shown a longitudinal sectional view of a cutting water jet nozzle 36A according to the second embodiment of the present invention. FIG. 6B is a cross-sectional view of the cutting water injection nozzle 36A. The cutting water spray nozzle 36A of the present embodiment has a plurality of triangular grooves 60 extending in the spray direction on the inner wall thereof.

  Similarly to the first embodiment, the cutting water jet nozzle 36A of the present embodiment has an inner diameter of about 1.0 to 1.5 mm, and the depth of the groove 60 is about 0.05 to 0.1 mm. preferable. The ridge line 62 of the mountain that defines the groove 60 extends linearly in the injection direction.

  Even when the cutting water injection nozzle 36A of the present embodiment is used, the frictional resistance between the cutting water and the inner wall of the cutting water injection nozzle 36A is reduced by the riblet effect, and the cutting blade 28a of the cutting blade 28, the wafer W, As a result, the cutting resistance (load current) can be reduced and chipping generated on both sides of the cutting groove can be reduced.

2 Cutting device 18 Chuck table 24 Cutting means 26 Spindle 28 Cutting blade 34 Cutting water supply unit 36 Cutting water injection nozzle 58 Spiral groove 60 Linear groove

Claims (3)

A chuck table for holding a workpiece, a cutting means on which a cutting blade for cutting the workpiece held on the chuck table is rotatably mounted, and the chuck table and the cutting means are relatively cut and fed. A cutting apparatus comprising: a cutting feed means for cutting; and a cutting water supply means for supplying cutting water to a contact area between the cutting blade and the workpiece,
The cutting water supply means includes a cylindrical cutting water injection nozzle, and a cutting water supply unit that supplies cutting water to the cutting water injection nozzle.
A cutting apparatus characterized in that a plurality of grooves extending in an injection direction are formed on an inner wall of the cylindrical cutting water injection nozzle.   The cutting device according to claim 1, wherein the plurality of grooves formed on the inner wall of the cylindrical cutting water spray nozzle are formed in a spiral shape.   The cutting device according to claim 1, wherein the plurality of grooves formed on the inner wall of the cylindrical cutting water jet nozzle are formed in triangular peaks and valleys and the ridge lines are formed in a straight line.

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