JP2005186165A - Dry type polishing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a dry type polishing apparatus having a function of cooling a polishing surface of a polishing grinding wheel and a surface to be polished of a work piece in polishing. <P>SOLUTION: This dry type polishing apparatus includes: a chuck table holding a workpiece; and a polishing means for polishing the workpiece held on the chuck table, and the polishing means includes: a mounter provided on the lower end of a rotating spindle; and a polishing tool fitted to the lower surface of the mounter. The polishing tool includes: a wheel base fitted to the lower surface of the mounter; and a polishing grinding wheel mounted on the lower surface of the wheel base. A communicating passage is provided in the axial direction on the central parts of the wheel base and the polishing grinding wheel to be communicated with the polishing surface of the polishing grinding wheel. The wheel base is provided with a plurality of blowing blades extending radially and a blowing passage formed between the two or more blowing blades to communicate with the communicating passage and open to the outer periphery. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a dry polishing apparatus for polishing a workpiece such as a semiconductor wafer.

  In a semiconductor device manufacturing process, a large number of rectangular areas are defined by planned cutting lines called streets arranged in a lattice pattern on the surface of a substantially wafer-shaped semiconductor wafer, and a semiconductor circuit is formed in each of the rectangular areas. . Individual semiconductor chips are formed by separating the semiconductor wafer formed with such a large number of semiconductor circuits along the streets. In order to reduce the size and weight of the semiconductor chip, the semiconductor wafer is usually ground to the predetermined thickness by cutting the semiconductor wafer along the streets and separating the individual rectangular regions. Forming. The grinding of the back surface of a semiconductor wafer is usually performed by pressing a grinding wheel formed by fixing diamond abrasive grains with an appropriate bond such as a resin bond against the back surface of the semiconductor wafer while rotating at high speed. When the back surface of the semiconductor wafer is ground by such a grinding method, a so-called processing strain is generated on the back surface of the semiconductor wafer, thereby considerably reducing the bending strength of the individually divided semiconductor chips. As a countermeasure for removing the processing strain generated on the back surface of the ground semiconductor wafer, a wet etching method in which the back surface of the ground semiconductor wafer is chemically etched using an etching solution containing nitric acid and hydrofluoric acid, A dry etching method using an etching gas is used.

  However, the wet etching method, the dry etching method, and the polishing method described above have poor productivity and waste liquid causes environmental pollution. In order to solve such problems, a felt grindstone in which abrasive grains such as zirconia oxide are dispersed in the felt and fixed with an appropriate bond agent is used as a polishing tool for removing the distortion by polishing the back surface of the ground semiconductor wafer. What has been proposed. (For example, refer to Patent Document 1.)

JP-A-2002-283243

  Thus, since the polishing by the polishing tool disclosed in the above publication is dry, the surface to be polished, which is the back surface of the semiconductor wafer, generates heat of 80 degrees or more. As a result, there is a problem that the protective tape attached to the surface of the semiconductor wafer melts and contaminates the circuit formed on the surface of the semiconductor wafer. Therefore, it is necessary to keep the polishing pressure low so that the surface to be polished of the semiconductor wafer does not exceed 80 degrees, and there is a problem that productivity is deteriorated.

  The present invention has been made in view of the above-described facts, and its main technical problem is to provide a dry polishing apparatus having a function of cooling the polishing surface of the polishing wheel and the surface to be polished of the workpiece during polishing. is there.

In order to solve the main technical problem, according to the present invention, a chuck table for holding a workpiece and a polishing means for polishing the workpiece held on the chuck table are provided, and the polishing means rotates. In a dry polishing apparatus comprising a mounter provided at a lower end of a spindle and a polishing tool attached to the lower surface of the mounter,
The polishing tool includes a wheel base attached to the lower surface of the mounter, and a polishing grindstone attached to the lower surface of the wheel base,
The wheel base and the central portion of the grinding wheel are provided with communication passages that are formed in the axial direction and communicate with the polishing surface of the grinding wheel. The wheel base includes a plurality of radially extending air blowing blades and the plurality of air blowing blades. A blower passage that is formed between the blower blades and communicates with the communication passage and opens to the outer periphery is provided.
A dry polishing apparatus is provided.

According to the invention, there is provided a chuck table for holding a workpiece and a polishing means for polishing the workpiece held on the chuck table, and the polishing means is provided at the lower end of the rotary spindle. In a dry polishing apparatus comprising a mounter, and a polishing tool comprising a wheel base attached to the lower surface of the mounter and a polishing grindstone mounted on the lower surface of the wheel base,
A communication passage that penetrates in the axial direction is provided at the center of the wheel base and the grinding wheel,
The lower surface of the mounter is provided with a plurality of blower blades that extend radially and a blower passage that is formed between the plurality of blower blades and communicates with the communication passage and opens to the outer periphery.
A dry polishing apparatus is provided.

  The polishing surface of the polishing grindstone is preferably formed with a blowing groove that communicates with the communication path and reaches the outer peripheral edge, and the wheel base and the polishing grindstone have a plurality of passages that communicate the polishing surface of the polishing grindstone and the air passage. It is desirable that a communication hole is provided.

  In the polishing apparatus according to the present invention, the blowing blades provided on the wheel base are rotated with the rotation of the polishing tool, so that the air in the communication path provided in the polishing grindstone and the wheel base is discharged through the blowing path. For this reason, since air is sucked into the communication path from the polishing surface side of the polishing wheel, the polishing surface of the polishing wheel and the polishing surface of the workpiece held on the chuck table are cooled.

  DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of a dry polishing apparatus constructed according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a perspective view of a dry polishing apparatus constructed according to the present invention.
The illustrated dry polishing apparatus is provided with an apparatus housing generally indicated by numeral 2. This device housing 2 has a rectangular parallelepiped main portion 21 that extends long and an upright wall 22 that is provided at the rear end portion (upper right end in FIG. 1) of the main portion 21 and extends substantially vertically upward. ing. A pair of guide rails 221 and 221 extending in the vertical direction are provided on the front surface of the upright wall 22. The pair of guide rails 221 and 221 is mounted with a polishing unit 3 as a polishing means so as to be movable in the vertical direction.

  The polishing unit 3 includes a moving base 31 and a spindle unit 32 attached to the moving base 31. The movable base 31 is provided with a pair of legs 311 and 311 extending in the vertical direction on both sides of the rear surface. The pair of legs 311 and 311 is slidably engaged with the pair of guide rails 221 and 221. Guided grooves 312 and 312 are formed. As described above, a support portion 313 protruding forward is provided on the front surface of the movable base 31 slidably mounted on the pair of guide rails 221 and 221 provided on the upright wall 22. The spindle unit 32 is attached to the support portion 313.

  The spindle unit 32 includes a spindle housing 33 mounted on the support portion 313, a rotating spindle 34 rotatably disposed on the spindle housing 33, and a servo motor as a driving unit for driving the rotating spindle 34 to rotate. 35. The lower end of the rotating spindle 34 protrudes downward beyond the lower end of the spindle housing 33, and a disc-shaped mounter 4 is provided at the lower end. A polishing tool 5 is mounted on the lower surface of the mounter 4. The mounter 4 and the polishing tool 5 will be described in detail later.

  The dry polishing apparatus in the illustrated embodiment includes a polishing unit feed mechanism that moves the polishing unit 3 in the vertical direction (a direction perpendicular to a holding surface of a chuck table described later) along the pair of guide rails 221 and 221. 6 is provided. The polishing unit feed mechanism 6 includes a male screw rod 61 disposed on the front side of the upright wall 22 and extending substantially vertically. The male threaded rod 61 is rotatably supported by bearing members 62 and 63 whose upper end and lower end are attached to the upright wall 22. The upper bearing member 62 is provided with a pulse motor 64 as a drive source for rotationally driving the male screw rod 61, and the output shaft of the pulse motor 64 is connected to the male screw rod 61 by transmission. A connecting portion (not shown) that protrudes rearward from the center portion in the width direction is also formed on the rear surface of the movable base 31, and a through female screw hole that extends in the vertical direction is formed in the connecting portion, The male screw rod 61 is screwed into the female screw hole. Therefore, when the pulse motor 64 rotates in the forward direction, the moving base 31, that is, the polishing unit 3 is lowered or moved forward, and when the pulse motor 64 rotates in the reverse direction, the moving base 31, that is, the polishing unit 3 is raised or moved backward.

  Continuing the description with reference to FIG. 1, the chuck table mechanism 7 is disposed in the main portion 21 of the housing 2. The chuck table mechanism 7 includes a chuck table 71 that holds a workpiece, and the chuck table 71 is an arrow in the front-rear direction (a direction perpendicular to the front surface of the upright wall 22) on the main portion 21 of the housing 2. It is disposed on a support base (not shown) that is slidably mounted on a pair of guide rails (not shown) extending in the direction indicated by 23a and 23b. The chuck table 71 is made of an appropriate porous material such as porous ceramics, and is connected to suction means (not shown). Accordingly, by selectively communicating the chuck table 71 with a suction means (not shown), for example, a semiconductor wafer as a workpiece placed on the upper surface, that is, the placement surface, is sucked and held. The chuck table 71 is rotated by a servo motor (not shown). The chuck table 71 configured as described above is polished by a chuck table moving mechanism (not shown) facing the workpiece mounting area 24 shown in FIG. 1 and the polishing surface (lower surface) of the polishing tool 5 constituting the spindle unit 32. It can be moved to and from area 25. The illustrated chuck table mechanism 7 includes a cover member 72 having a hole through which the chuck table 71 is inserted, and bellows means 73 and 74 having a reverse channel shape in cross section on both sides in the moving direction of the cover member 72. Has been. The bellows means 73 and 74 can be formed from any suitable material such as campus cloth. The front end of the bellows means 73 is fixed to the front wall of the main portion 21, and the rear end is fixed to the front end surface of the cover member 72 of the chuck table mechanism 7. The front end of the bellows means 74 is fixed to the rear end surface of the cover member 72 of the chuck table mechanism 7, and the rear end is fixed to the front surface of the upright wall 22 of the apparatus housing 2. When the chuck table mechanism 7 is moved in the direction indicated by the arrow 23a, the bellows means 73 is expanded and the bellows means 74 is contracted, and when the chuck table mechanism 7 is moved in the direction indicated by the arrow 23b, the bellows means. 73 is contracted and the bellows means 74 is extended.

  Next, the mounter 4 and the polishing tool 5 will be described with reference to FIGS. The mounter 4 shown in FIGS. 2 and 3 includes a plurality (four in the illustrated embodiment) of bolt insertion holes 41 penetrating in the axial direction at intervals in the circumferential direction. A polishing tool 5 shown in FIG. 2 includes a wheel base 50 and a polishing grindstone 55. In the embodiment shown in FIG. 2, the wheel base 50 has a circular support member 51 on which a polishing grindstone 55 is mounted on the lower surface, and a circular mounting member 52 for mounting the support member 51 on the lower surface of the mounter 4. It is made up of.

  The polishing grindstone 55 is obtained by dispersing abrasive grains such as zirconia oxide on a flexible member such as felt and fixing it with an appropriate bond agent. In the illustrated embodiment, a circular felt grindstone that uses felt as the flexible member is used. ing. The thus configured polishing grindstone 55 is joined to the lower surface of the support member 51 with an appropriate adhesive such as an epoxy resin adhesive. As shown in FIG. 4, the polishing grindstone 55 is provided with a communication passage 551 penetrating in the axial direction at the center, and a plurality of communication holes 552 penetrating in the axial direction between the communication passage 551 and the outer peripheral edge. Is provided. Further, a blow groove 554 that communicates with the communication path 551 and reaches the outer peripheral edge is formed on the polishing surface 553 of the polishing grindstone 55.

  As shown in FIG. 2, the support member 51 constituting the wheel base 50 is provided with a communication passage 511 penetrating in the axial direction at the center. The communication path 511 provided in the support member 51 is configured to communicate with the communication path 551 provided in the polishing grindstone 55. Therefore, the upper surface of the support member 51 and the polishing surface 553 of the polishing grindstone 55 are communicated with each other through the communication paths 511 and 551. On the upper surface of the support member 51, a plurality (four in the illustrated embodiment) of blowing blades 512 extending radially are provided curved in a predetermined direction as illustrated. Therefore, the air passage 513 that communicates with the communication passage 511 and opens to the outer periphery is formed between the plurality of air blowing blades 512. The support member 51 is provided with a plurality of communication holes 514 penetrating in the axial direction between the communication path 511 and the outer peripheral edge. The plurality of communication holes 514 provided in the support member 51 are configured to communicate with the plurality of communication holes 552 provided in the polishing grindstone 55. Accordingly, the air passage 513 formed in the support member 51 and the polishing surface 553 of the polishing grindstone 55 are communicated with each other through the communication holes 514 and 552. The plurality of blower blades 512 are provided with a plurality of screw holes 515 formed in the axial direction from the upper surface.

  As shown in FIG. 2, the mounting member 52 constituting the wheel base 50 includes a plurality of (four in the illustrated embodiment) formed in the axial direction at positions corresponding to the bolt insertion holes 41 provided in the mounter 4. ) Screw holes 521 are provided. Further, the mounting member 52 is provided with a plurality of bolt insertion holes 522 penetrating in the axial direction at positions corresponding to the plurality of screw holes 515 provided in the plurality of blower blades 512 of the support member 51.

  In the support member 51 and the mounting member 52 configured as described above, the tightening bolts 56 are respectively inserted into the plurality of bolt insertion holes 522 formed in the mounting member 52, and the tightening bolts 56 are inserted into the plurality of support members 51. 3 are coupled to each other by being screwed into a plurality of screw holes 515 provided in the blower blades 512, and constitute a wheel base 50 as shown in FIG. 3, and a polishing grindstone 55 is mounted on the lower surface of the support member 51. A polishing tool 5 is configured. In the wheel base 50 thus configured, that is, the polishing tool 5, the mounting member 52 is attached to the lower surface of the mounter 4. That is, the fastening bolts 57 are respectively inserted into the plurality of bolt insertion holes 41 provided in the mounter 4, and the fastening bolts 57 are screwed into the plurality of screw holes 521 provided in the mounting member 52 of the wheel base 50. As a result, the wheel base 50, that is, the polishing tool 5 is attached to the lower surface of the mounter 4.

The dry polishing apparatus in the illustrated embodiment is configured as described above, and the operation thereof will be described below with reference to FIGS. 1 and 5.
In order to polish a workpiece using the grinding apparatus shown in FIG. 1, first, for example, a semiconductor wafer 10 as a workpiece is placed on a chuck table 71 positioned in the workpiece placement area 24 shown in FIG. Place. At this time, the protective tape 11 is stuck on the surface (surface on which the circuit is formed) of the semiconductor wafer 10, and the protective tape 11 is placed on the chuck table 71. Therefore, the semiconductor wafer 10 is placed on the chuck table 71 with the back surface facing up. The wafer 10 placed on the chuck table 71 in this way is sucked and held on the chuck table 71 by suction means (not shown).

  When the wafer 10 is sucked and held on the chuck table 71, a chuck table moving mechanism (not shown) is operated to move the chuck table 71 in the direction indicated by the arrow 23a, and the wafer 10 held on the chuck table 71 is moved to the grinding wheel. Positioned in the polishing zone 25 below 55. In this state, the wafer 10 held on the chuck table 71 is positioned at a position where the polishing grindstone 55 passes through the center (P) as shown in FIG. When the wafer 10 is positioned in the polishing area 25 in this way, the chuck table 71 is driven by a servo motor (not shown) to rotate at 100 to 300 rpm, and the servo motor 35 of the polishing unit 3 is driven to polish. The tool 5 is rotated at 3000 to 6000 rpm, and the pulse motor 64 of the polishing unit feed mechanism 6 is driven to rotate forward to lower the polishing unit 3 so that the lower surface, which is the polishing surface 553 of the polishing grindstone 55, is on the chuck table 71. It is made to act on the upper surface (back surface) of the wafer 10 held on the surface. Then, the polishing grindstone 55 is lowered by a predetermined amount, and the wafer 10 is polished to a predetermined thickness.

  At the time of the polishing, the blower blades 512 provided on the support member 52 are rotated in the direction indicated by the arrow as the polishing tool 5 rotates as shown in FIG. As a result, the air in the communication passages 551 and 511 provided in the polishing grindstone 55 and the support member 51 is discharged through the air passage 513. For this reason, since air is sucked into the communication path 551 from the polishing surface 553 side of the polishing grindstone 55, the polishing surface 553 of the polishing grindstone 55 and the surface to be polished of the semiconductor wafer 10 held on the chuck table 71 are cooled. . Therefore, melting of the protective tape 11 adhered to the surface of the semiconductor wafer 10 can be suppressed, contamination of the circuit formed on the surface of the semiconductor wafer 10 can be prevented, and the polishing pressure can be increased. Can be improved. In the illustrated embodiment, since a plurality of blowing grooves 554 communicating with the communication path 551 are formed on the polishing surface 553 of the polishing grindstone 55, air is effectively sucked through the blowing grooves 554. The cooling of the polishing surface 553 of the polishing wheel 55 and the surface to be polished of the semiconductor wafer 10 is effective. Further, in the illustrated embodiment, the polishing grindstone 55 and the support member 51 are provided with a plurality of communication holes 552 and 514 that communicate with each other and open to the polishing surface 553 (lower surface) and the air passage 513. Since air is sucked from the polishing surface 553 side of the grindstone 55 through the plurality of communication holes 552 and 514 to the air passage 513 side, cooling of the polishing surface 553 of the polishing grindstone 55 and the polished surface of the semiconductor wafer 10 is more effective. Become. When the blower blades 523 provided on the support member 52 are curved as shown in FIG. 2, the air flowing through the polishing tool 5 when the polishing tool 5 is rotated in the direction indicated by the arrow in FIG. Flows through the polishing surface 553, the communication passages 551, 511, and the air passage 513 as described above, but when the polishing tool 5 is rotated in the direction opposite to the arrow in FIG. 5, air is sucked into the air passage 513 and the communication passage 511. , 551 are ejected to the polishing surface 553, and the polishing surface 553 and the semiconductor wafer 10 can be cooled.

Next, another embodiment of the polishing tool will be described with reference to FIG. In FIG. 6, the same members and the same components as those in the embodiment shown in FIGS. 1 to 5 are designated by the same reference numerals, and the description thereof is omitted.
The polishing tool 5a shown in FIG. 6 is configured such that the wheel base 50a is configured only by the support member 51a, and the support member 51a having the polishing grindstone 55 mounted on the lower surface thereof is directly attached to the lower surface of the mounter 4. In order to directly attach the support member 51a to the mounter 4 in this way, a plurality of (not shown) are provided at positions corresponding to the bolt insertion holes 41 provided in the mounter 4 between the plurality of blower blades 512 on the upper surface of the support member 51a. Four bosses 516 are provided in the embodiment, and screw holes 517 are formed in the plurality of bosses 516, respectively. In the polishing tool 5a configured in this way, the fastening bolts 57 are respectively inserted into the plurality of bolt insertion holes 41 provided in the mounter 4, and the fastening bolts 57 are screwed on the bosses 516 of the support member 51a. By screwing into the hole 517, the wheel base 50 a composed of the support member 51 a, that is, the polishing tool 5 a is attached to the lower surface of the mounter 4. The polishing tool 5a configured in this manner also rotates at the time of polishing, whereby the plurality of blower blades 512 are rotated, and the air in the communication passages 551 and 511 provided in the support member 51a as the polishing grindstone 55 and the wheel base 50a Since the air is discharged through the air passage 513, the same effects as those of the embodiment shown in FIGS. 1 to 5 can be obtained. The support member 51a is provided with a plurality of communication holes 514 that communicate with a plurality of communication holes 552 provided in the polishing grindstone 55, as in the embodiment shown in FIGS.

Next, other embodiments of the polishing tool and the mounter will be described with reference to FIGS. 7 and 8, the same members and the same components as those in the embodiments shown in FIGS. 1 to 5 and 6 are given the same reference numerals, and descriptions thereof are omitted.
In the embodiment shown in FIG. 7 and FIG. 8, a plurality (four in the illustrated embodiment) of blowing blades 42 extending radially are provided on the lower surface of the mounter 4 b, and a blowing passage 43 is formed between the plurality of blowing blades 42. It is a thing. In the mounter 4b, a plurality of (four in the illustrated embodiment) bosses 44 are provided between the plurality of blower blades 42 on the lower surface, and a bolt is inserted from the upper surface of the mounter 4b to the lower surface of the boss 44. A hole 45 is formed. On the other hand, the polishing tool 5b shown in FIGS. 7 and 8 is configured such that the wheel base 50b is configured only by the support member 51b, and the support member 51b having the lower surface mounted with the polishing grindstone 55 is directly attached to the mounter 4b. It is. For this reason, a plurality of (four in the illustrated embodiment) screw holes 518 are formed in the support member 51b as the wheel base 50b at positions corresponding to the bolt insertion holes 45 formed in the mounter 4b. . The mounter 4b and the polishing tool 5b configured as described above insert the tightening bolt 57 into the bolt insertion hole 45 formed in the mounter 4b, and insert the tightening bolt 57 into the screw hole 518 formed in the support member 51b. By screwing, the wheel base 50b made of the support member 51b, that is, the polishing tool 5b is attached to the lower surface of the mounter 4b. The mounter 4b and the polishing tool 5b configured in this manner are rotated at the time of polishing, whereby the plurality of blower blades 42 provided in the mounter 4b are rotated, and the communication path 551 and the support member 51b provided in the polishing grindstone 55 are rotated. Since the air in the communication passage 511 provided in the air is exhausted through the air passage 43, the same effect as the embodiment shown in FIGS. 1 to 5 and FIG. 6 can be obtained. The support member 51b is provided with a plurality of communication holes 514 communicating with the plurality of communication holes 552 provided in the polishing grindstone 55 as in the embodiment shown in FIGS. 1 to 5 and FIG. . In the embodiment shown in FIGS. 7 and 8, since the blower blade 42 and the air passage 43 are provided in the mounter 4b, it is only necessary to form the screw hole screw hole 518 in the support member 51b of the polishing tool 5b. Therefore, the structure of the support member 51b constituting the consumable polishing tool, that is, the wheel base 50b can be simplified, and it is inexpensive and economical.

The perspective view of the dry-type polishing apparatus comprised by this invention. The perspective view which decomposes | disassembles and shows one Embodiment of the mounter and polishing tool which comprise the grinding | polishing unit with which the dry-type grinding | polishing apparatus shown in FIG. 1 is equipped. The perspective view which shows the state which assembled the structural member of the polishing tool shown in FIG. The perspective view which looked at the grinding wheel with which the lower surface mounting | wearing of the supporting member which comprises the grinding | polishing tool in FIG. 2 was seen from the lower surface side. Explanatory drawing which shows the state which grind | polishes a workpiece with the mounter and grinding | polishing tool which are shown in FIG. 2 and FIG. The perspective view which decomposes | disassembles and shows each embodiment of the mounter and polishing tool which comprise the grinding | polishing unit with which the dry-type grinding | polishing apparatus shown in FIG. 1 is equipped. The perspective view which decomposes | disassembles and shows each component further in another embodiment of the mounter and polishing tool which comprise the grinding | polishing unit with which the dry-type grinding | polishing apparatus shown in FIG. 1 is equipped. The perspective view which looked at the mounter shown in FIG. 7 from the lower surface side.

Explanation of symbols

2: Device housing 3: Polishing unit 31: Moving base 32: Spindle unit 33: Spindle housing 34: Rotating spindle 35: Servo motor 4: Mounter 4b: Mounter 41: Bolt insertion hole 42: Blower blade 43: Blower passage 45: Bolt insertion hole 5: Polishing tool 5a: Polishing tool 5b: Polishing tool 50: Wheel base 51: Support member 51a: Support member 51b: Support member 511: Communication passage 512: Blower blade 513: Air supply passage 514: Communication hole 52: Installation Member 521: Screw hole 522: Bolt insertion hole 55: Polishing grindstone 551: Communication passage 552: Communication hole 554: Blower groove 56: Clamping bolt 57: Clamping bolt 6: Polishing unit feed mechanism 7: Chuck table mechanism 71: Chuck Table 72: Cover member

Claims (6)

A chuck table for holding the workpiece; and a polishing means for polishing the workpiece held on the chuck table; the mounter provided at the lower end of the rotary spindle; and a lower surface of the mounter. In a dry polishing apparatus comprising a polishing tool to be attached,
The polishing tool includes a wheel base attached to the lower surface of the mounter, and a polishing grindstone attached to the lower surface of the wheel base,
The wheel base and the central portion of the grinding wheel are provided with communication passages that are formed in the axial direction and communicate with the polishing surface of the grinding wheel. The wheel base includes a plurality of radially extending air blowing blades and the plurality of air blowing blades. A blower passage that is formed between the blower blades and communicates with the communication passage and opens to the outer periphery is provided.
A dry polishing apparatus characterized by that.   The dry polishing apparatus according to claim 1, wherein an air blowing groove communicating with the communication path and reaching an outer peripheral edge is formed on a polishing surface of the polishing grindstone.   3. The dry polishing apparatus according to claim 1, wherein the wheel base and the polishing grindstone are provided with a plurality of communication holes that communicate the polishing surface of the polishing grindstone with the air passage. A chuck table for holding the workpiece; and a polishing means for polishing the workpiece held on the chuck table; the mounter provided at the lower end of the rotary spindle; and a lower surface of the mounter. In a dry polishing apparatus comprising a wheel base to be attached and a polishing tool comprising a polishing grindstone mounted on the lower surface of the wheel base,
A communication passage that penetrates in the axial direction is provided at the center of the wheel base and the grinding wheel,
The lower surface of the mounter is provided with a plurality of blower blades that extend radially and a blower passage that is formed between the plurality of blower blades and communicates with the communication passage and opens to the outer periphery.
A dry polishing apparatus characterized by that.   The dry polishing apparatus according to claim 4, wherein an air blowing groove that communicates with the communication path and reaches an outer peripheral edge is formed on a polishing surface of the polishing grindstone.   The dry polishing apparatus according to claim 4 or 5, wherein the wheel base and the polishing grindstone are provided with a plurality of communication holes for communicating the polishing surface of the polishing grindstone with the air passage.

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