JPH0811056A - Circumference polishing method for plate body and its device - Google Patents

Circumference polishing method for plate body and its device

Info

Publication number
JPH0811056A
JPH0811056A JP14944494A JP14944494A JPH0811056A JP H0811056 A JPH0811056 A JP H0811056A JP 14944494 A JP14944494 A JP 14944494A JP 14944494 A JP14944494 A JP 14944494A JP H0811056 A JPH0811056 A JP H0811056A
Authority
JP
Japan
Prior art keywords
grinding
plate
peripheral edge
plate body
ground
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14944494A
Other languages
Japanese (ja)
Inventor
Masashi Kudo
雅司 工藤
Masaru Ichimura
勝 市村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AGC Inc
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Priority to JP14944494A priority Critical patent/JPH0811056A/en
Publication of JPH0811056A publication Critical patent/JPH0811056A/en
Pending legal-status Critical Current

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  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)

Abstract

PURPOSE:To transparentize a circumferential face of a plate body after grinding as well as the surface of the plate body by spraying high pressure water to the circumferential edge of the plate body after grinding so as to eliminate ground dust from the circumferential edge of the plate body. CONSTITUTION:While a chamfering grinding wheel 12 is rotated, a grinding part 12A in the chamfering grinding wheel 12 is brought into contact with a grinding circumference 16C in a plate body (glass plate) 16 to which cutting water is fed from water spraying ports 36A, 36A..., and the grinding circumference 16C is ground. Although, during this grinding, cut dust inlaidly adheres to a ground circumferential edge 16B of the plate body 16, atomized high pressure spray water 32 is sprayed to the ground circumferential edge 16B in the plate body 16. As a result, cut dust inlaidly adhering to the ground circumferential edge 16B in the plate body 16 is eliminated. In this way, the ground circumference face 16B in the plate body 16 can be transparentized as well as the surface of the plate body (glass body) 16.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は砥石の研削面を板状体の
周縁に当接して板状体の周縁を研削する板状体の周縁研
削方法及びその装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plate edge grinding method and apparatus for abutting the grinding surface of a grindstone against the edge of a plate to grind the edge of the plate.

【0002】[0002]

【従来の技術】一般に、ガラス板等の板状体の面取砥石
は円盤状に形成され、その周面部に研削部が形成されて
いる。研削部はボンド剤にダイヤモンド砥粒が埋設され
て形成され、ボンド剤から突出しているダイヤモンド砥
粒でガラス板等の周縁を研削する。研削は砥石をガラス
板の周縁に当接させて、砥石を自転すると共にガラス板
の周縁に沿って移動して行われる。そして、研削完了後
ガラス板をブラシで洗って、ガラス板に付着したガラス
粉(切粉)を除去する。
2. Description of the Related Art Generally, a chamfering grindstone of a plate-like body such as a glass plate is formed in a disk shape, and a grinding portion is formed on a peripheral surface portion thereof. The grinding portion is formed by embedding diamond abrasive grains in a bond agent, and the periphery of a glass plate or the like is ground by the diamond abrasive grains protruding from the bond agent. Grinding is performed by bringing the grindstone into contact with the peripheral edge of the glass plate, rotating the grindstone, and moving along the peripheral edge of the glass plate. After the grinding is completed, the glass plate is washed with a brush to remove the glass powder (cutting powder) attached to the glass plate.

【0003】[0003]

【発明が解決しようとする課題】しかしながら、砥石で
研削されたガラス板の研削面には切粉が埋め込まれたよ
うに付着し、ブラシで洗ってもガラス板の研削面から切
粉を除去することができないという問題がある。本発明
はこのような事情に鑑みてなされたもので、ガラス板の
研削面から切粉を除去して、ガラス板の研削面をガラス
板の表面と同様に透明にすることができる板状体の周縁
研削方法及びその装置を提供することを目的とする。
However, the chips adhere to the ground surface of the glass plate ground with a grindstone as if they were embedded therein, and the chips are removed from the ground surface of the glass plate even if washed with a brush. There is a problem that you can not. The present invention has been made in view of the above circumstances, and is a plate-like body capable of removing chips from the ground surface of a glass plate to make the ground surface of the glass plate as transparent as the surface of the glass plate. It is an object of the present invention to provide a peripheral edge grinding method and apparatus therefor.

【0004】[0004]

【課題を解決する為の手段】本発明は、回転砥石の研削
面を板状体の周縁に当接して前記板状体の周縁を研削す
る板状体の周縁研削方法において、研削後の板状体の周
縁に高圧水を吹き付けて前記板状体の周縁から研削屑を
除去することを特徴とする板状体の周縁研削方法、及
び、その方法を実施する装置である。
According to the present invention, there is provided a method for grinding a peripheral edge of a plate-shaped body by abutting a grinding surface of a rotary grindstone to a peripheral edge of the plate-shaped body, the plate after being ground. A method for grinding a peripheral edge of a plate-shaped body, which comprises removing high-pressure water to the peripheral edge of the plate-shaped body to remove grinding debris from the peripheral edge of the plate-shaped body, and an apparatus for carrying out the method.

【0005】また、本発明は、前記高圧水を前記板状体
の研削位置に吹き付けることを特徴とする板状体の周縁
研削方法、及び、その方法を実施する装置である。
Further, the present invention is a method for grinding a peripheral edge of a plate-like body, characterized by spraying the high-pressure water onto a grinding position of the plate-like body, and an apparatus for carrying out the method.

【0006】[0006]

【作用】本発明によれば、回転砥石の研削面を板状体の
周縁に当接して板状体の周縁を研削する板状体の周縁研
削装置において、砥石の進行方向の後方に高圧洗浄手段
を配設し、この高圧洗浄手段で研削後の板状体の周面に
高圧水を吹き付ける。従って、研削後の板状体の周面に
埋め込まれたように付着した切削屑が周縁から除去され
る。
According to the present invention, in the plate edge grinding device for abutting the grinding surface of the rotary grindstone to the edge of the plate to grind the edge of the plate, high-pressure washing is performed in the backward direction of the wheel. Means is provided, and high-pressure water is sprayed on the peripheral surface of the plate-like body after grinding by this high-pressure cleaning means. Therefore, the cutting chips attached so as to be embedded in the peripheral surface of the plate body after grinding are removed from the peripheral edge.

【0007】また、本発明によれば、高圧水を板状体の
研削位置に吹き付けることにより板状体の周縁に付着し
た切削屑を周縁から除去するとともに、回転砥石の研削
面に付着した切削屑を研削面から除去することができ
る。さらに、高圧水を板状体の研削位置に吹き付けるこ
とにより回転砥石の研削部や板状体の被研削部を冷却す
ることができる。
Further, according to the present invention, high-pressure water is sprayed to the grinding position of the plate-like body to remove the cutting chips adhering to the peripheral edge of the plate-like body from the peripheral edge, and the cutting adhered to the grinding surface of the rotary grindstone. Debris can be removed from the grinding surface. Further, by spraying high-pressure water to the grinding position of the plate-shaped body, the grinding portion of the rotary grindstone and the ground portion of the plate-shaped body can be cooled.

【0008】[0008]

【実施例】【Example】

実施例1 以下添付図面に従って本発明に係る板状体の周縁研削方
法及びその装置の好ましい実施例について説明する。図
1に示す板状体の周縁研削装置10は面取砥石12及び
高圧洗浄手段14を備えている。面取砥石12は円盤状
に形成され、その外周に研削部12Aが形成されてい
る。研削部12Aはボンド剤にダイヤモンド砥粒が埋設
されて形成され、ボンド剤から突出しているダイヤモン
ド砥粒でガラス板16の周縁16Aを研削する。すなわ
ち、周縁16Aの研削は面取砥石12をガラス板16の
周縁16Aに当接させて、面取砥石12を反時計回り方
向に自転すると共にガラス板16の周縁16Aに沿って
左方向に移動して行われる。
Embodiment 1 Hereinafter, preferred embodiments of a method for grinding a peripheral edge of a plate-like body and an apparatus therefor according to the present invention will be described with reference to the accompanying drawings. The plate-shaped peripheral edge grinding apparatus 10 shown in FIG. 1 includes a chamfering grindstone 12 and a high-pressure cleaning means 14. The chamfering grindstone 12 is formed in a disk shape, and a grinding portion 12A is formed on the outer periphery thereof. The grinding portion 12A is formed by embedding diamond abrasive grains in a bond agent, and grinds the peripheral edge 16A of the glass plate 16 with the diamond abrasive grains protruding from the bond agent. That is, in the grinding of the peripheral edge 16A, the chamfering grindstone 12 is brought into contact with the peripheral edge 16A of the glass plate 16, the chamfering grindstone 12 is rotated counterclockwise and moved leftward along the peripheral edge 16A of the glass plate 16. Done.

【0009】高圧洗浄手段14は高圧水発生部20及び
高圧スプレーノズル22を有している。高圧水発生部2
0はホース24を介して高圧スプレーノズル22に連通
されている。高圧スプレーノズル22は面取砥石12の
進行方向に対して後方に配置され、高圧スプレーノズル
22はノズル口がガラス板16の研削後の周縁16Bに
高圧水を吹き付ける位置に位置決めされている。
The high-pressure cleaning means 14 has a high-pressure water generator 20 and a high-pressure spray nozzle 22. High-pressure water generator 2
0 is connected to the high-pressure spray nozzle 22 via a hose 24. The high-pressure spray nozzle 22 is arranged rearward with respect to the traveling direction of the chamfering grindstone 12, and the high-pressure spray nozzle 22 is positioned such that the nozzle mouth blows high-pressure water onto the peripheral edge 16B of the glass plate 16 after grinding.

【0010】また、高圧水発生部20はホース26を介
して給水タンク28内に連通され、給水タンク28内に
は供給水28Aが充填されている。さらに、ホース26
には電磁バルブ30が設けられている。高圧水発生部2
0は、給水タンク28内から供給された供給水28Aを
高圧噴射することができ、高圧噴射の最大圧力及び最大
流量はそれぞれ70kgf/cm2 及び10l/min
に設定されている。
The high-pressure water generator 20 is communicated with a water supply tank 28 via a hose 26, and the water supply tank 28 is filled with supply water 28A. In addition, the hose 26
An electromagnetic valve 30 is provided in the. High-pressure water generator 2
0 is capable of high-pressure injection of the supply water 28A supplied from the water supply tank 28, and the maximum pressure and the maximum flow rate of the high-pressure injection are 70 kgf / cm 2 and 10 l / min, respectively.
Is set to

【0011】電磁バルブ30は流路の開閉制御が可能で
あり、電磁バルブ30を開放して高圧水発生部20を作
動すると、給水タンク28内の水28Aは高圧水発生部
20に供給され、高圧水発生部20から高圧噴射され
る。高圧水発生部20から高圧噴射された水はホース2
4を介して高圧スプレーノズル22まで導かれ、高圧ス
プレーノズル22のノズル口から高圧スプレー水32が
噴霧状に噴射される。
The electromagnetic valve 30 can control the opening and closing of the flow path. When the electromagnetic valve 30 is opened to operate the high-pressure water generator 20, the water 28A in the water supply tank 28 is supplied to the high-pressure water generator 20. High-pressure water is injected from the high-pressure water generator 20. The water injected from the high-pressure water generator 20 under high pressure is hose 2
The high-pressure spray nozzle 22 is led to the high-pressure spray nozzle 22 through the nozzle 4, and the high-pressure spray water 32 is sprayed from the nozzle opening of the high-pressure spray nozzle 22.

【0012】これにより、噴霧状の高圧スプレー水32
がガラス板16の研削後の周縁16Bに吹き付けられ、
周縁16Bに埋め込まれたように付着した切粉等が周縁
16Bから除去される。なお、面取砥石12の研削部1
2Aで研削するガラス板16の研削周縁16Cには散水
手段36が配設され、散水手段36の散水口36A、3
6A…から、ガラス板16の研削周縁16Cに切削水が
供給される。
As a result, the atomized high-pressure spray water 32
Is sprayed onto the peripheral edge 16B of the glass plate 16 after grinding,
Cutting chips and the like that are attached so as to be embedded in the peripheral edge 16B are removed from the peripheral edge 16B. In addition, the grinding portion 1 of the chamfering grindstone 12
A sprinkling means 36 is provided on the grinding peripheral edge 16C of the glass plate 16 to be ground by 2A, and sprinkling openings 36A, 3A of the sprinkling means 36,
Cutting water is supplied to the grinding peripheral edge 16C of the glass plate 16 from 6A.

【0013】この散水口36A、36A…から供給され
る切削水は、圧力及び流量がそれぞれ1kgf/cm2
〜4kgf/cm2 及び50l/min以下に設定され
ている。そして、切削水がガラス板16の研削周縁16
Cに供給されることにより、ガラス板16や面取砥石1
2の研削部12Aが冷却される。前記の如く構成された
板状体の周縁研削装置の作用について説明する。先ず、
電磁バルブ30を開放した状態で高圧水発生部20を作
動して給水タンク28内の供給水28Aを高圧水発生部
20に供給して高圧水発生部20から高圧噴射する。高
圧水発生部20から高圧噴射された供給水28Aはホー
ス24を介して高圧スプレーノズル22まで導かれ、高
圧スプレーノズル22のノズル口から噴霧状に噴射され
る。これにより、噴霧状の高圧スプレー水32がガラス
板16の研削後の周縁16Bに吹き付けられる。同時
に、散水手段36の散水口36A、36A…からガラス
板16の研削周縁16Cに切削水が供給される。
The cutting water supplied from the water spray ports 36A, 36A ... Has a pressure and a flow rate of 1 kgf / cm 2, respectively.
It is set to 4 kgf / cm 2 and 50 l / min or less. Then, the cutting water is applied to the grinding edge 16 of the glass plate 16.
By being supplied to C, the glass plate 16 and the chamfering grindstone 1
The second grinding portion 12A is cooled. The operation of the plate-shaped body peripheral edge grinding device configured as described above will be described. First,
The high-pressure water generation unit 20 is operated with the electromagnetic valve 30 opened to supply the supply water 28A in the water supply tank 28 to the high-pressure water generation unit 20 and high-pressure water generation unit 20 ejects the high-pressure water. The supply water 28 </ b> A that is high-pressure jetted from the high-pressure water generator 20 is guided to the high-pressure spray nozzle 22 via the hose 24, and is sprayed from the nozzle opening of the high-pressure spray nozzle 22. As a result, the atomized high-pressure spray water 32 is sprayed onto the peripheral edge 16B of the glass plate 16 after grinding. At the same time, cutting water is supplied to the grinding peripheral edge 16C of the glass plate 16 from the water sprinkling ports 36A, 36A ... Of the water sprinkling means 36.

【0014】次に、面取砥石12を回転した状態で、散
水口36A、36A…から切削水が供給されているガラ
ス板16の研削周縁16Cに、面取砥石12の研削部1
2Aを当接して研削周縁16Cを研削する。この研削で
ガラス板16の研削後の周縁16Bに切粉が埋め込まれ
たように付着するが、ガラス板16の研削後の周縁16
Bには噴霧状の高圧スプレー水32が吹き付けられてい
るので、周縁16Bに付着した切粉が除去される。これ
により、ガラス板16の研削後の周面16Bをガラス板
16の表面と同様に透明にすることができる。
Next, while the chamfering grindstone 12 is rotated, the grinding portion 1 of the chamfering grindstone 12 is attached to the grinding peripheral edge 16C of the glass plate 16 to which cutting water is supplied from the water sprinkling ports 36A, 36A.
2A is brought into contact to grind the grinding peripheral edge 16C. By this grinding, the cutting chips adhere to the peripheral edge 16B of the glass plate 16 after being ground, but the peripheral edges 16B of the glass plate 16 after grinding are attached.
Since B is sprayed with the high-pressure spray water 32 in a spray form, the chips adhering to the peripheral edge 16B are removed. As a result, the peripheral surface 16B of the glass plate 16 after grinding can be made transparent like the surface of the glass plate 16.

【0015】実施例2 前記実施例1では、高圧スプレーノズル22でガラス板
16の研削後の周縁16Bに高圧水を吹き付ける場合に
ついて説明したが、これに限らず、図3に示すように高
圧スプレーノズル22でガラス板16の被研削面16C
に高圧水を吹き付けてもよい。尚、図3おいて図1上の
実施例1と同一類似部材については同一符号を付して説
明を省略する。
Second Embodiment In the first embodiment, the case where the high pressure spray nozzle 22 sprays the high pressure water on the peripheral edge 16B of the glass plate 16 after grinding has been described, but the present invention is not limited to this, and as shown in FIG. The surface 22C to be ground of the glass plate 16 with the nozzle 22
High-pressure water may be sprayed on. In FIG. 3, the same members as those of the first embodiment shown in FIG. 1 are designated by the same reference numerals and the description thereof will be omitted.

【0016】このように、高圧スプレーノズル22でガ
ラス板16の被研削面16Cに高圧水を吹き付けること
により、板ガラス16の周縁16Bに付着した切粉を周
縁16Bから除去するとともに、面取砥石12の研削部
12Aに付着した切粉を研削部12Aから除去すること
ができる。また、高圧水をガラス板16の被研削面16
Cに吹き付けることにより面取砥石12の研削部12A
やガラス板16の被研削面16cを冷却することができ
る。
As described above, the high pressure spray nozzle 22 blows high pressure water onto the surface 16C to be ground of the glass plate 16 to remove the chips adhering to the peripheral edge 16B of the plate glass 16 from the peripheral edge 16B, and at the same time, the chamfering grindstone 12 The chips adhering to the grinding section 12A can be removed from the grinding section 12A. In addition, the high pressure water is applied to the surface 16 to be ground of the glass plate 16.
Grinding part 12A of chamfering grindstone 12 by spraying on C
The surface to be ground 16c of the glass plate 16 can be cooled.

【0017】実施例3 実施例1、2では高圧スプレーノズル22を面取砥石1
2の後方に配設した場合について説明したが、これに限
らず、図4に示すように新たな高圧スプレーノズル40
を面取砥石12の前方に配設してもよい。図4に示すよ
うに、高圧スプレーノズル40はノズル口42がガラス
板16の被研削面16Cの近傍に向けて配設されてい
る。なお、図4上で面取砥石12は反時計回り方向に自
転しながら左方向に移動する。
Embodiment 3 In Embodiments 1 and 2, the high pressure spray nozzle 22 is replaced with the chamfering grindstone 1.
Although the case where the high pressure spray nozzle 40 is provided behind the second high pressure spray nozzle 40 is not limited to this, as shown in FIG.
May be arranged in front of the chamfering grindstone 12. As shown in FIG. 4, the high-pressure spray nozzle 40 has a nozzle opening 42 arranged near the surface to be ground 16C of the glass plate 16. In FIG. 4, the chamfering grindstone 12 moves leftward while rotating in the counterclockwise direction.

【0018】従って、高圧スプレーノズル40のノズル
口42から噴射された高圧水44は、面取砥石12の研
削部12Aとガラス板16の被研削面16Bとの隙間に
吹き付けられる。これにより、面取砥石12の研削部1
2Aでガラス板16の被研削面16Bを研削する場合の
熱を吸収することができるので、面取砥石12の焼けつ
きやガラス板16のチッピング等を防止することができ
る。また、実施例2と同様に面取砥石12の研削部12
Aに高圧水44が吹き付けられるので、被研削面16B
の切粉等が除去されて面取砥石12の研削部12Aの目
詰まりを防止することができる。尚、図4おいて図1上
の実施例1と同一類似部材については同一符号を付して
説明を省略する。
Therefore, the high-pressure water 44 sprayed from the nozzle port 42 of the high-pressure spray nozzle 40 is sprayed on the gap between the grinding portion 12A of the chamfering grindstone 12 and the surface 16B to be ground of the glass plate 16. Thereby, the grinding portion 1 of the chamfering grindstone 12
Since the heat generated when the surface 16B to be ground of the glass plate 16 is ground by 2A can be absorbed, burn-in of the chamfering grindstone 12 and chipping of the glass plate 16 can be prevented. Further, similarly to the second embodiment, the grinding portion 12 of the chamfering grindstone 12 is
Since high-pressure water 44 is sprayed on A, the surface to be ground 16B
It is possible to prevent clogging of the grinding portion 12A of the chamfering grindstone 12 by removing the chips and the like. In FIG. 4, the same members as those of the first embodiment shown in FIG. 1 are designated by the same reference numerals and the description thereof will be omitted.

【0019】前記実施例1、2、3では被加工材として
ガラス板16について説明したが、これに限らず、セラ
ミック、シリコン等の硬脆材料やアルミ板、金属板、プ
ラスチック板等にも使用することができる。また、噴射
する高圧水の最大圧力の設定を70Kgf/cm2 とし
ているが、本発明において好適に被研削面の切粉等の除
去や研削部の目詰まりを防止する水圧としては、70K
gf/cm2 以上であるため、最大圧力の設定も70K
gf/cm2 以上とすることが好ましい。この時に噴射
される水の流量は、10l/minが好ましい。
In the first, second and third embodiments, the glass plate 16 has been described as the material to be processed, but it is not limited to this, and it is also used for hard and brittle materials such as ceramics and silicon, aluminum plates, metal plates, plastic plates and the like. can do. Further, the maximum pressure of the high-pressure water to be sprayed is set to 70 Kgf / cm 2 , but in the present invention, the water pressure for preventing the removal of chips and the like from the surface to be ground and the clogging of the grinding portion is preferably 70 Kgf / cm 2.
Since it is more than gf / cm 2 , the maximum pressure can be set to 70K.
It is preferably set to gf / cm 2 or more. The flow rate of water injected at this time is preferably 10 l / min.

【0020】[0020]

【発明の効果】以上説明したように、本発明に係る板状
体の周縁研削方法及びその装置によれば、回転砥石の研
削面を板状体の周縁に当接して板状体の周縁を研削する
板状体の周縁研削装置において、砥石の進行方向の後方
に高圧洗浄手段を配設し、この高圧洗浄手段で研削後の
板状体の周面に高圧水を吹き付ける。従って、研削後の
板状体の周面に埋め込まれたように付着した切削屑が周
縁から除去されるので、研削後の板状体の周面を板状体
の表面と同様に透明にすることができる。
As described above, according to the peripheral edge grinding method for a plate-like body and the apparatus therefor according to the present invention, the grinding surface of the rotary grindstone is brought into contact with the peripheral edge of the plate-like body so that the peripheral edge of the plate-like body is abutted. In a peripheral edge grinding device for a plate-shaped body to be ground, a high-pressure cleaning means is arranged behind the advancing direction of a grindstone, and the high-pressure cleaning means sprays high-pressure water onto the peripheral surface of the plate-shaped body after grinding. Therefore, since the cutting chips attached to the peripheral surface of the plate body after grinding are removed from the peripheral edge, the peripheral surface of the plate body after grinding is made transparent like the surface of the plate body. be able to.

【0021】また、本発明によれば、高圧水を板状体の
研削位置に吹き付けることにより板状体の周縁に付着し
た切削屑を周縁から除去するとともに、回転砥石の研削
面に付着した切削屑を研削面から除去することができ
る。さらに、高圧水を板状体の研削位置に吹き付けるこ
とにより回転砥石の研削部や板状体の被研削部を冷却す
ることができる。
Further, according to the present invention, by blowing high-pressure water to the grinding position of the plate-like body, the cutting debris adhering to the peripheral edge of the plate-like body is removed from the peripheral edge and the cutting adhering to the grinding surface of the rotary grindstone. Debris can be removed from the grinding surface. Further, by spraying high-pressure water to the grinding position of the plate-shaped body, the grinding portion of the rotary grindstone and the ground portion of the plate-shaped body can be cooled.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明に係る板状体の周縁研削装置の実施例1
を示す全体図
FIG. 1 is a first embodiment of a peripheral edge grinding device for a plate-like body according to the present invention.
Overall view showing

【図2】本発明に係る板状体の周縁研削装置の実施例1
を示す斜視図
FIG. 2 is a first embodiment of a plate-shaped body peripheral edge grinding apparatus according to the present invention.
Perspective view showing

【図3】本発明に係る板状体の周縁研削装置の実施例2
を説明する説明図
FIG. 3 is a second embodiment of the peripheral edge grinding device for a plate-like body according to the present invention.
Explanatory diagram explaining

【図4】本発明に係る板状体の周縁研削装置の実施例3
を説明する説明図
FIG. 4 is a third embodiment of a plate-shaped body peripheral edge grinding apparatus according to the present invention.
Explanatory diagram explaining

【符号の説明】[Explanation of symbols]

10…板状体の周縁研削装置 12…面取砥石(砥石) 12A…研削部(研削面) 14…高圧洗浄手段 16…ガラス板(板状体) 16A…周縁 16B…研削後の周縁 16C…研削周縁 DESCRIPTION OF SYMBOLS 10 ... Edge grinding device of plate-like object 12 ... Chamfering grindstone (grinding wheel) 12A ... Grinding part (grinding surface) 14 ... High-pressure cleaning means 16 ... Glass plate (plate-like object) 16A ... Edge 16B ... Edge 16C after grinding ... Grinding edge

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 回転砥石の研削面を板状体の周縁に当接
して前記板状体の周縁を研削する板状体の周縁研削方法
において、 研削後の板状体の周縁に高圧水を吹き付けて前記板状体
の周縁から研削屑を除去することを特徴とする板状体の
周縁研削方法。
1. A method for grinding a peripheral edge of a plate-shaped body by abutting a grinding surface of a rotary grindstone to a peripheral edge of the plate-shaped body, wherein high-pressure water is applied to the peripheral edge of the plate-shaped body after grinding. A method for grinding a peripheral edge of a plate-like body, which comprises spraying to remove grinding debris from the peripheral edge of the plate-like body.
【請求項2】 前記高圧水を前記板状体の研削位置に吹
き付けることを特徴とする請求項1の板状体の周縁研削
方法。
2. The method for grinding a peripheral edge of a plate-like body according to claim 1, wherein the high-pressure water is sprayed onto a grinding position of the plate-like body.
【請求項3】 回転砥石の研削面を板状体の周縁に当接
して前記板状体の周縁を研削する板状体の周縁研削装置
において、 研削後の板状体の周縁に高圧水を吹き付ける高圧洗浄手
段を備えたことを特徴とする板状体の周縁研削装置。
3. A plate-shaped body peripheral grinding device for abutting a grinding surface of a rotary grindstone to a peripheral edge of the plate-shaped body to grind the peripheral edge of the plate-shaped body with high-pressure water applied to the peripheral edge of the plate-shaped body after grinding. A peripheral edge grinding device for a plate-shaped body, comprising a high-pressure cleaning means for spraying.
【請求項4】 前記高圧洗浄手段は、前記高圧水を前記
板状体の研削位置に吹き付けることができる位置に設け
られていることを特徴とする請求項3の板状体の周縁研
削装置。
4. The peripheral edge grinding device for a plate-shaped body according to claim 3, wherein the high-pressure cleaning means is provided at a position where the high-pressure water can be sprayed onto the grinding position of the plate-shaped body.
JP14944494A 1994-06-30 1994-06-30 Circumference polishing method for plate body and its device Pending JPH0811056A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14944494A JPH0811056A (en) 1994-06-30 1994-06-30 Circumference polishing method for plate body and its device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14944494A JPH0811056A (en) 1994-06-30 1994-06-30 Circumference polishing method for plate body and its device

Publications (1)

Publication Number Publication Date
JPH0811056A true JPH0811056A (en) 1996-01-16

Family

ID=15475257

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14944494A Pending JPH0811056A (en) 1994-06-30 1994-06-30 Circumference polishing method for plate body and its device

Country Status (1)

Country Link
JP (1) JPH0811056A (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100458537B1 (en) * 2001-12-26 2004-12-03 김현택 Apparatus for chamfering glass of flat panel display
JP2009172749A (en) * 2007-12-25 2009-08-06 Nippon Electric Glass Co Ltd End face grinding device for glass plate and method therefor
WO2012073626A1 (en) * 2010-12-01 2012-06-07 旭硝子株式会社 Grinding method and grinding device
CN102873609A (en) * 2012-10-09 2013-01-16 深圳市华星光电技术有限公司 Dust preventing method of glass substrate edger
CN103567872A (en) * 2013-11-17 2014-02-12 张齐栋 Method for assembling bow-shaped nozzle for flat grinder grinding wheel
CN103639902A (en) * 2013-11-17 2014-03-19 董朝新 Application method of splitter plate type arch-shaped spray nozzle for grinding wheel of surface grinding machine
CN105290911A (en) * 2015-10-21 2016-02-03 佛山市南海区豪特玻璃机械有限公司 Novel 360-degree glass rotary table
JP2016083738A (en) * 2014-10-28 2016-05-19 日本電気硝子株式会社 Grinding method of plate glass
JP2016198862A (en) * 2015-04-13 2016-12-01 AvanStrate株式会社 Manufacturing method of glass substrate
CN108637875A (en) * 2018-05-30 2018-10-12 马鞍山松鹤信息科技有限公司 A kind of novel polishing machine and application method
CN109732447A (en) * 2019-02-26 2019-05-10 南通市众惠模具有限公司 A kind of Precision Aluminum equipments machining die equipped with rotating mechanism
WO2019104640A1 (en) * 2017-11-30 2019-06-06 陈金泉 Wet-type dust removal grinding wheel machine
CN110695804A (en) * 2019-11-18 2020-01-17 福州高新区磊莎玻璃有限公司 Multidirectional glass edge grinding device

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100458537B1 (en) * 2001-12-26 2004-12-03 김현택 Apparatus for chamfering glass of flat panel display
JP2009172749A (en) * 2007-12-25 2009-08-06 Nippon Electric Glass Co Ltd End face grinding device for glass plate and method therefor
WO2012073626A1 (en) * 2010-12-01 2012-06-07 旭硝子株式会社 Grinding method and grinding device
WO2014056253A1 (en) * 2012-10-09 2014-04-17 深圳市华星光电技术有限公司 Dust prevention method of glass substrate edge finishing machine
CN102873609A (en) * 2012-10-09 2013-01-16 深圳市华星光电技术有限公司 Dust preventing method of glass substrate edger
CN103567872A (en) * 2013-11-17 2014-02-12 张齐栋 Method for assembling bow-shaped nozzle for flat grinder grinding wheel
CN103639902A (en) * 2013-11-17 2014-03-19 董朝新 Application method of splitter plate type arch-shaped spray nozzle for grinding wheel of surface grinding machine
JP2016083738A (en) * 2014-10-28 2016-05-19 日本電気硝子株式会社 Grinding method of plate glass
JP2016198862A (en) * 2015-04-13 2016-12-01 AvanStrate株式会社 Manufacturing method of glass substrate
CN105290911A (en) * 2015-10-21 2016-02-03 佛山市南海区豪特玻璃机械有限公司 Novel 360-degree glass rotary table
WO2019104640A1 (en) * 2017-11-30 2019-06-06 陈金泉 Wet-type dust removal grinding wheel machine
CN108637875A (en) * 2018-05-30 2018-10-12 马鞍山松鹤信息科技有限公司 A kind of novel polishing machine and application method
CN109732447A (en) * 2019-02-26 2019-05-10 南通市众惠模具有限公司 A kind of Precision Aluminum equipments machining die equipped with rotating mechanism
CN110695804A (en) * 2019-11-18 2020-01-17 福州高新区磊莎玻璃有限公司 Multidirectional glass edge grinding device
CN110695804B (en) * 2019-11-18 2020-06-12 福州高新区磊莎玻璃有限公司 Multidirectional glass edge grinding device

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