TW201230675A - Quartz crystal vibrating piece, quartz crystal device, and manufacturing method of quartz crystal vibrating piece - Google Patents

Quartz crystal vibrating piece, quartz crystal device, and manufacturing method of quartz crystal vibrating piece Download PDF

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Publication number
TW201230675A
TW201230675A TW100149387A TW100149387A TW201230675A TW 201230675 A TW201230675 A TW 201230675A TW 100149387 A TW100149387 A TW 100149387A TW 100149387 A TW100149387 A TW 100149387A TW 201230675 A TW201230675 A TW 201230675A
Authority
TW
Taiwan
Prior art keywords
quartz crystal
axis
quartz
groove
vibrating portion
Prior art date
Application number
TW100149387A
Other languages
English (en)
Chinese (zh)
Inventor
Shuichi Mizusawa
Takehiro Takahashi
Kunio Morita
Masakazu Harada
Original Assignee
Nihon Dempa Kogyo Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Dempa Kogyo Co filed Critical Nihon Dempa Kogyo Co
Publication of TW201230675A publication Critical patent/TW201230675A/zh

Links

Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02Details
    • H03H9/05Holders or supports
    • H03H9/10Mounting in enclosures
    • H03H9/1007Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1035Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by two sealing substrates sandwiching the piezoelectric layer of the BAW device
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H03H3/04Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/19Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
TW100149387A 2011-01-05 2011-12-29 Quartz crystal vibrating piece, quartz crystal device, and manufacturing method of quartz crystal vibrating piece TW201230675A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011000630 2011-01-05
JP2011128193A JP2012156978A (ja) 2011-01-05 2011-06-08 Atカットの水晶振動片、水晶デバイス及び水晶振動片の製造方法

Publications (1)

Publication Number Publication Date
TW201230675A true TW201230675A (en) 2012-07-16

Family

ID=46380135

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100149387A TW201230675A (en) 2011-01-05 2011-12-29 Quartz crystal vibrating piece, quartz crystal device, and manufacturing method of quartz crystal vibrating piece

Country Status (4)

Country Link
US (1) US8779652B2 (enExample)
JP (1) JP2012156978A (enExample)
CN (1) CN102594281A (enExample)
TW (1) TW201230675A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI878710B (zh) * 2022-07-06 2025-04-01 大陸商成都泰美克晶體技術有限公司 石英諧振器晶片的制作方法及石英諧振器晶片

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5325151B2 (ja) * 2010-03-31 2013-10-23 日本電波工業株式会社 水晶デバイス、及びその製造方法
JP5492697B2 (ja) * 2010-08-04 2014-05-14 日本電波工業株式会社 Atカット水晶デバイス及びatカット水晶デバイスの製造方法
JP2012060628A (ja) * 2010-08-07 2012-03-22 Nippon Dempa Kogyo Co Ltd 圧電デバイス及びその製造方法
US20130043770A1 (en) * 2011-08-17 2013-02-21 Nihon Dempa Kogyo Co., Ltd. Piezoelectric vibrating piece and piezoelectric device
WO2016121182A1 (ja) * 2015-01-29 2016-08-04 株式会社大真空 水晶振動板、及び水晶振動デバイス
CN113472310B (zh) 2015-10-08 2025-03-11 株式会社村田制作所 水晶振动元件、以及具备该水晶振动元件的水晶振子
CN109328432B (zh) * 2016-06-23 2022-04-26 株式会社村田制作所 水晶振动片和水晶振子
WO2025234414A1 (ja) * 2024-05-10 2025-11-13 京セラ株式会社 圧電振動素子及び圧電デバイス
WO2025234415A1 (ja) * 2024-05-10 2025-11-13 京セラ株式会社 圧電振動素子及び圧電デバイス

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4069773B2 (ja) * 2003-03-19 2008-04-02 セイコーエプソン株式会社 圧電振動片、圧電振動子および圧電デバイス
JP4600140B2 (ja) * 2005-05-09 2010-12-15 セイコーエプソン株式会社 圧電振動片の製造方法
JP2007288331A (ja) 2006-04-13 2007-11-01 Epson Toyocom Corp 圧電振動片の製造方法、及び圧電振動片、並びに圧電振動子
JP4967707B2 (ja) * 2006-05-01 2012-07-04 セイコーエプソン株式会社 圧電振動子およびその製造方法
JP4305542B2 (ja) * 2006-08-09 2009-07-29 エプソントヨコム株式会社 Atカット水晶振動片及びその製造方法
JP5041145B2 (ja) * 2007-09-07 2012-10-03 セイコーエプソン株式会社 圧電デバイス
JP4647671B2 (ja) * 2008-01-15 2011-03-09 日本電波工業株式会社 水晶デバイス及び水晶デバイスの製造方法
JP5129005B2 (ja) * 2008-04-17 2013-01-23 日本電波工業株式会社 圧電振動子及び圧電素子の製造方法並びに圧電振動子の製造方法
JP4714770B2 (ja) * 2008-10-06 2011-06-29 日本電波工業株式会社 音叉型圧電振動片及び音叉型圧電振動片の製造方法
JP2010171572A (ja) * 2009-01-21 2010-08-05 Nippon Dempa Kogyo Co Ltd 表面実装用の水晶発振器

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI878710B (zh) * 2022-07-06 2025-04-01 大陸商成都泰美克晶體技術有限公司 石英諧振器晶片的制作方法及石英諧振器晶片

Also Published As

Publication number Publication date
JP2012156978A (ja) 2012-08-16
US8779652B2 (en) 2014-07-15
US20120169182A1 (en) 2012-07-05
CN102594281A (zh) 2012-07-18

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