TW201230168A - Apparatus for attaching and detaching support of thin substrate and detaching method using the same - Google Patents
Apparatus for attaching and detaching support of thin substrate and detaching method using the same Download PDFInfo
- Publication number
- TW201230168A TW201230168A TW100124105A TW100124105A TW201230168A TW 201230168 A TW201230168 A TW 201230168A TW 100124105 A TW100124105 A TW 100124105A TW 100124105 A TW100124105 A TW 100124105A TW 201230168 A TW201230168 A TW 201230168A
- Authority
- TW
- Taiwan
- Prior art keywords
- thin substrate
- vacuum
- chuck
- vacuum chuck
- substrate
- Prior art date
Links
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020100137732A KR101175918B1 (ko) | 2010-12-29 | 2010-12-29 | 박형 기판용 지지체 탈부착 설비 및 그에 의한 탈착 방법 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW201230168A true TW201230168A (en) | 2012-07-16 |
Family
ID=46678484
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW100124105A TW201230168A (en) | 2010-12-29 | 2011-07-07 | Apparatus for attaching and detaching support of thin substrate and detaching method using the same |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2012142549A (ko) |
KR (1) | KR101175918B1 (ko) |
TW (1) | TW201230168A (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20230017084A1 (en) * | 2019-12-17 | 2023-01-19 | Kulicke & Soffa Netherlands B.V. | Adhesive tapes for receiving discrete components |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2690862B2 (ja) * | 1994-07-29 | 1997-12-17 | シーケーディ株式会社 | 真空チャック装置からのワークの取り外し方法及びワークの取り外し装置 |
KR100674033B1 (ko) * | 2004-01-30 | 2007-01-26 | 엘지전자 주식회사 | 증착 장치 |
JP4797027B2 (ja) * | 2008-01-18 | 2011-10-19 | 信越ポリマー株式会社 | 基板体の貼着装置及び基板体の取り扱い方法 |
-
2010
- 2010-12-29 KR KR1020100137732A patent/KR101175918B1/ko not_active IP Right Cessation
-
2011
- 2011-07-07 TW TW100124105A patent/TW201230168A/zh unknown
- 2011-07-28 JP JP2011165264A patent/JP2012142549A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
JP2012142549A (ja) | 2012-07-26 |
KR101175918B1 (ko) | 2012-08-22 |
KR20120075851A (ko) | 2012-07-09 |
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